Printed circuit board and preparation method thereof

Abstract

The invention provides a printed circuit board and a preparation method of the printed circuit board. The printed circuit board comprises a plurality of copper-clad plates and a cooling pipe, the plurality of copper-clad plates are stacked; a first groove is formed in at least one copper-clad plate, and the diameter of the first groove is matched with the outer diameter of the cooling pipe; the cooling pipe is arranged in the first groove and used for containing cooling liquid. According to the printed circuit board, the first groove is formed in the copper-clad plate, and the cooling pipe is arranged in the matched first groove, so that the cooling liquid flows in the cooling pipe to take away heat in the copper-clad plate, and the heat dissipation efficiency of the printed circuit board is effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board manufacturing, and in particular to a printed circuit board and a method for preparing the printed circuit board. Background Art

[0002] With the rapid development of electronic technology, the performance of electrical equipment continues to improve. However, this performance increase also brings with it the problem of increased heat generation, especially in power electronics, base station transmitters, supercomputers, or electrical equipment used in high-temperature environments. As a key component in electrical equipment, printed circuit boards (PCBs) carry numerous electronic components and accumulate significant heat during operation. Effective heat dissipation ensures the normal operation of electrical equipment, making PCB heat dissipation crucial.

[0003] In the prior art, a metal heat sink is usually installed on the PCB board to transfer the heat from the PCB board to the heat sink, and then dissipate the heat to the surrounding environment through natural convection or radiation; or a heat dissipation device such as a fan is used to achieve heat dissipation of the PCB board.

[0004] However, the heat dissipation methods in the prior art have technical problems of low heat dissipation efficiency and increased energy costs. Summary of the Invention

[0005] The embodiments of the present application provide a printed circuit board and a method for preparing the printed circuit board, so as to achieve the effect of reducing the heat dissipation cost and improving the heat dissipation efficiency of the PCB board.

[0006] In order to achieve the above objectives, the embodiments of the present invention adopt the following technical solutions:

[0007] One aspect of an embodiment of the present invention provides a printed circuit board, comprising a plurality of copper-clad plates and cooling tubes;

[0008] Multiple copper clad laminates are stacked;

[0009] A first groove is provided on at least one copper clad plate, and a diameter of the first groove is adapted to an outer diameter of the cooling tube;

[0010] The cooling pipe is arranged in the first groove, and the cooling pipe is used to accommodate cooling liquid.

[0011] The printed circuit board as above further includes a liquid inlet hole and a return hole, and the cooling pipe includes a cooling inlet and a cooling outlet;

[0012] The liquid inlet is connected to the cooling inlet, and the liquid inlet is used to connect to the circulation pump so that when the circulation pump is started, the coolant flows into the cooling pipe through the liquid inlet;

[0013] The reflux hole is connected to the cooling outlet, and the liquid inlet hole of the reflux hole is used to be connected to the circulation pump. When the circulation pump is started, the cooling pipe flows out of the cooling pipe through the reflux hole.

[0014] The printed circuit board as above, wherein the copper clad plate includes a plurality of side walls, and the first groove includes a first end and a second end;

[0015] On the plane where the copper clad laminate is located, the first end is arranged on one side wall of the copper clad laminate, and the second end extends to the other side wall of the copper clad laminate.

[0016] The printed circuit board as above further comprises a plurality of prepregs;

[0017] Between any two adjacent copper clad laminates, a prepreg is provided;

[0018] A second groove is provided on the prepreg adjacent to the copper clad plate provided with the first groove, and the second groove is matched with the first groove.

[0019] The printed circuit board as above, wherein a plurality of first grooves are provided on the same copper clad plate; wherein,

[0020] A cooling pipe is provided in each first groove.

[0021] In the above printed circuit board, the cooling tube is a copper tube.

[0022] In the above printed circuit board, the diameter of the first groove is 0.8 mm-1 mm, and the outer diameter of the cooling tube is 0.7 mm-0.9 mm.

[0023] An embodiment of the present invention further provides a method for preparing a printed circuit board, the method comprising:

[0024] Providing a plurality of copper-clad plates, and forming a first groove on at least one of the copper-clad plates;

[0025] A cooling pipe is placed in the first groove; the diameter of the first groove is adapted to the outer diameter of the cooling pipe;

[0026] stacking a plurality of copper clad plates;

[0027] Perform high-temperature lamination on multiple copper clad laminates.

[0028] The method for preparing the printed circuit board as described above, wherein, before placing the cooling pipe in the first groove, the method further comprises:

[0029] A prepreg is formed between any adjacent copper clad laminates;

[0030] Wherein, the prepreg adjacent to the copper clad plate having the first groove has a second groove, and the second groove is adapted to the first groove.

[0031] The method for preparing the printed circuit board as described above, wherein, before placing the cooling pipe in the first groove, the method further comprises:

[0032] Provide cooling pipes;

[0033] The cooling pipe is cleaned, deoxidized and roughened.

[0034] Embodiments of the present application provide a printed circuit board and a method for manufacturing the printed circuit board. The printed circuit board includes multiple copper-clad laminates (CCLs) and cooling tubes. The CCLs are stacked together. At least one CCL is provided with a first groove, the diameter of which matches the outer diameter of the cooling tube. The cooling tube is disposed within the first groove and is used to hold a coolant. By providing grooves in the CCLs and locating the cooling tubes within the grooves, the embodiments of the present invention allow the coolant to flow through the cooling tubes, removing heat from the CCLs, thereby effectively improving the heat dissipation efficiency of the printed circuit board.

[0035] In addition to the technical problems solved by the embodiments of the present invention described above, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions, other technical problems that can be solved by the printed circuit board and the method for preparing the printed circuit board provided by the embodiments of the present invention, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0037] Figure 1 It is a structural diagram of a printed circuit board in the prior art;

[0038] Figure 2 A schematic diagram of the structure of a printed circuit board provided in an embodiment of the present invention Figure 1 ;

[0039] Figure 3 A schematic diagram of the structure of a printed circuit board provided in an embodiment of the present invention Figure 2 ;

[0040] Figure 4 A schematic diagram of the structure of a printed circuit board provided in an embodiment of the present invention Figure 3 ;

[0041] Figure 5 A schematic flow chart of a method for preparing a printed circuit board provided in an embodiment of the present invention;

[0042] Figure 6A schematic diagram of the structure of a printed circuit board provided in an embodiment of the present invention Figure 4 ;

[0043] Figure 7 A schematic flow chart of a method for preparing a printed circuit board provided in an embodiment of the present invention;

[0044] Figure 8 A schematic diagram of the structure of a printed circuit board provided in an embodiment of the present invention Figure 5 ;

[0045] Figure 9 A schematic diagram of the structure of a printed circuit board provided in an embodiment of the present invention Figure 6 .

[0046] Description of reference numerals:

[0047] 10: copper clad laminate;

[0048] 11: circuit layer;

[0049] 12: insulation layer;

[0050] 13: heat sink;

[0051] 14: groove;

[0052] 101: first groove;

[0053] 20: cooling pipe;

[0054] 201: cooling inlet;

[0055] 202: cooling outlet;

[0056] 30: liquid inlet;

[0057] 40: reflux hole;

[0058] 50: Circulation pump;

[0059] 60: prepreg;

[0060] 601: second groove;

[0061] 70: Outer copper foil. DETAILED DESCRIPTION

[0062] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention.

[0063] In the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0064] A printed circuit board is a carrier used for electrical connections of electronic components. It forms circuit patterns by etching copper foil to achieve interconnection and signal transmission of electronic components. Currently, with the improvement of the performance of electrical equipment, the heat generated by printed circuit boards has also increased, resulting in increasingly prominent heat dissipation problems in printed circuit boards.

[0065] In related technologies, the heat dissipation efficiency of printed circuit boards is improved by increasing the heat conduction area or enhancing the convection efficiency. Figure 1 As shown, the copper clad laminate 10 includes a circuit layer 11 and an insulating layer 12, which are stacked and abutted in sequence. The insulating layer 12 is a synthetic multi-component agent. A groove 14 is provided on the surface of the heat sink 13. The heat sink 13 is a metal plate with good thermal conductivity. The copper clad laminate 10 is hollowed out, and the non-hollowed-out area of the copper clad laminate 10 is set in the groove 14 to form an embedded structure for heat dissipation. However, relying solely on the heat sink 13 for heat dissipation in a closed environment does not provide a good heat dissipation effect, which makes it difficult to meet the requirements of modern electrical appliances for efficient heat dissipation.

[0066] In view of this, embodiments of the present application provide a printed circuit board and a method for preparing the printed circuit board, wherein the printed circuit board includes multiple copper-clad laminates and cooling tubes; the multiple copper-clad laminates are stacked; at least one copper-clad laminate is provided with a first groove, the diameter of the first groove being adapted to the outer diameter of the cooling tube; the cooling tube is disposed within the first groove, and the cooling tube is used to contain a coolant. Compared to heat sinks in related technologies, the printed circuit board provided in the present application increases the heat dissipation area of the printed circuit board and enhances convection efficiency by providing a first groove in the copper-clad laminate and disposing the cooling tube within the first groove, so that the coolant contained in the cooling tube flows away heat from the copper-clad laminate, thereby effectively improving the heat dissipation efficiency of the printed circuit board.

[0067] Figure 2 This is a schematic diagram of the structure of a printed circuit board provided by an embodiment of the present invention. Figure 1 , Figure 3 This is a schematic diagram of the structure of a printed circuit board provided by an embodiment of the present invention. Figure 2 , Figure 4 This is a schematic diagram of the structure of a printed circuit board provided by an embodiment of the present invention. Figure 3 .

[0068] like Figures 2 to 4 As shown, the printed circuit board provided in an embodiment of the present invention includes multiple copper clad laminates 10 and cooling tubes 20; the multiple copper clad laminates 10 are stacked; at least one copper clad laminate 10 is provided with a first groove 101, and the diameter of the first groove 101 is adapted to the outer diameter of the cooling tube 20; the cooling tube 20 is arranged in the first groove 101, and the cooling tube 20 is used to accommodate coolant.

[0069] like Figure 2 As shown, the printed circuit board includes a plurality of copper clad laminates 10 stacked together, and at least one copper clad laminate 10 is provided with a first groove 101, wherein the first grooves 101 are opened in different heating areas on the copper clad laminate 10 according to a preset circuit to meet different heat dissipation requirements of the printed circuit board. For example, for a copper clad laminate 10 connected to a large number of electronic components or with a higher frequency of use, the number of the first grooves 101 opened can be increased in response to the heat dissipation requirements of the copper clad laminate 10 to improve the heat dissipation efficiency of the printed circuit board.

[0070] like Figure 3 As shown, in the copper clad laminate 10 provided with the first groove 101, the diameter of the first groove 101 is adapted to the outer diameter of the cooling tube 20, wherein the diameter of the first groove 101 is slightly larger than the outer diameter of the cooling tube 20, and the tolerance between the diameter of the first groove 101 and the outer diameter of the cooling tube 20 is within a preset gap range, so that the cooling tube 20 can be accurately placed in the first groove 101, thereby increasing the contact area between the first groove 101 and the cooling tube 20, thereby improving the heat dissipation efficiency of the printed circuit board.

[0071] As a feasible specific implementation, the diameter of the first groove 101 is 0.8 mm-1 mm, and the outer diameter of the cooling pipe 20 is 0.7 mm-0.9 mm.

[0072] For example, if the printed circuit board is used to dissipate heat for a CPU (central processing unit) motherboard of a high-performance computer, the diameter of the first groove 101 can be 0.8 mm, the depth can be 0.6 mm, and the outer diameter of the cooling pipe 20 can be 0.7 mm; if the printed circuit board is used to dissipate heat for an industrial automation controller, the diameter of the first groove 101 can be 1 mm, the depth can be 0.8 mm, and the outer diameter of the cooling pipe 20 can be 0.9 mm; so that the cooling pipe 20 can be disposed in the first groove 101.

[0073] The cooling tube 20 is used to contain a coolant, wherein the coolant can be selected from a liquid with high thermal conductivity, low freezing point and stable chemical properties. While improving the heat dissipation efficiency of the printed circuit board, it also ensures the stability of the printed circuit board and avoids the impact of the external environment on the printed circuit board. For example, the coolant includes ethylene glycol and propylene glycol aqueous solution.

[0074] Furthermore, the cooling tube 20 is a copper tube. Since the copper tube has good corrosion resistance and oxidation resistance, the reliability and stability of the printed circuit board can be improved.

[0075] As a feasible specific implementation, a plurality of first grooves 101 are provided on the same copper clad plate 10 ; wherein a cooling pipe 20 is provided in each first groove 101 .

[0076] Each first groove 101 is provided with a cooling pipe 20, which directly contacts the copper clad laminate 10 to conduct heat away from high-heat components on the copper clad laminate 10, thereby achieving precise heat dissipation of the printed circuit board.

[0077] like Figure 4 As shown, the first groove 101 includes a through groove and a non-through groove, wherein the through groove can penetrate multiple copper clad laminates 10 to achieve bidirectional heat dissipation between the multiple copper clad laminates 10.

[0078] like Figure 5 As shown, for non-through grooves, efficient point-to-point heat dissipation can be achieved, thereby improving the heat dissipation efficiency of the printed circuit board.

[0079] As another optional embodiment of the copper clad laminate 10, the copper clad laminate 10 includes multiple side walls, and the first groove 101 includes a first end and a second end; on the plane where the copper clad laminate 10 is located, the first end is set on one side wall of the copper clad laminate, and the second end extends to the other side wall of the copper clad laminate 10.

[0080] like Figure 6 As shown, for each copper clad laminate 10, a first groove 101 runs through both ends of the copper clad laminate 10 to form a continuous heat dissipation path, thereby achieving uniform heat conduction and avoiding the degradation of printed circuit board performance due to local overheating, which affects the normal operation and stability of the electrical appliance.

[0081] As a feasible specific embodiment, the printed circuit board also includes a liquid inlet hole 30 and a reflux hole 40, and the cooling pipe 20 includes a cooling inlet 201 and a cooling outlet 202; the liquid inlet hole 30 is connected to the cooling inlet 201, and the liquid inlet hole 30 is used to connect to the circulation pump 50, so that when the circulation pump 50 is started, the coolant flows into the cooling pipe 20 through the liquid inlet hole 30; the reflux hole 40 is connected to the cooling outlet 202, and the reflux hole 40 is used to connect to the circulation pump 50, and when the circulation pump 50 is started, the coolant flows out of the cooling pipe 20 through the reflux hole 40.

[0082] Circulation pump 50 is connected to the interior of the electrical device. When the electrical device is in operation, circulation pump 50 is started, allowing coolant to flow through liquid inlet 30 to cooling inlet 201, circulate through cooling pipe 20 to dissipate heat generated by the printed circuit board, and then flow through cooling outlet 202 to return hole 40, completing the heat dissipation process of the printed circuit board. Furthermore, when the electrical device is not in operation, circulation pump 50 is turned off to reduce heat dissipation energy consumption.

[0083] For example, if the printed circuit board is used to dissipate heat for the CPU motherboard of a high-performance computer, the circulation pump 50 is started when the computer is running, and the flow rate of the circulation pump 50 is set to 500 ml / min. After the CPU runs at full load for 2 hours, the average temperature of the computer using the printed circuit board provided by this application is 30°C lower than the average temperature of the computer not using the printed circuit board approved by this application. Therefore, the printed circuit board provided by this application adopts a coolant circulation heat dissipation mechanism, which can be quickly taken out of the printed circuit board by cooperating with the forced drive of the circulation pump 50, effectively ensuring the stable operation of the computer.

[0084] Alternatively, if the printed circuit board is used for heat dissipation of an industrial automation controller, during the operation of the controller, the speed of the circulating pump 50 is dynamically adjusted according to the feedback from the temperature sensor to achieve intelligent circulation control of the coolant. Based on the test results, it can be seen that when the ambient temperature is 50°C, the temperature of the key components on the printed circuit board provided by this application is always maintained within the safe operating range. Therefore, the printed circuit board provided by this application enables electrical equipment to maintain a lower operating temperature of the printed circuit board even when it is running under high load for a long time, thereby ensuring the stable performance of the electronic components, extending their service life, and effectively ensuring the stable operation of the computer. The printed circuit board provided by this application improves the reliability and stability of the controller.

[0085] As a feasible specific implementation method, the printed circuit board also includes multiple prepregs; a prepreg 60 is provided between any two adjacent copper clad plates 10; a second groove 601 is provided on the prepreg 60 adjacent to the copper clad plate with the first groove 101, and the second groove 601 is adapted to the first groove 101.

[0086] A prepreg 60 is placed between two adjacent copper-clad laminates 10 to achieve adhesion and insulation between the multiple copper-clad laminates 10. For example, the prepreg 60 comprises glass cloth containing resin. A second groove 601 is provided on the prepreg 60 adjacent to the copper-clad laminate with the first groove 101. The second groove 601 matches the first groove 101, effectively improving the adhesion between the copper-clad laminates 10 and allowing the copper-clad laminates 10 and the cooling tubes 20 to be tightly embedded.

[0087] Optionally, the printed circuit board further includes an outer copper foil 70 , which is located at both ends of the printed circuit board, thereby improving the anti-interference performance, structural strength and heat dissipation efficiency of the printed circuit board.

[0088] The embodiments of the present application provide a printed circuit board and a method for preparing the printed circuit board, wherein the printed circuit board includes a plurality of copper-clad laminates 10 and a cooling tube 20; the plurality of copper-clad laminates 10 are stacked; at least one copper-clad laminate 10 is provided with a first groove 101, the diameter of the first groove 101 being adapted to the outer diameter of the cooling tube 20; the cooling tube 20 is disposed within the first groove 101, and the cooling tube 20 is used to accommodate a coolant. The embodiments of the present invention provide a first groove 101 on the copper-clad laminate 10 and dispose the cooling tube 20 within the adapted first groove 101, so that the coolant flows through the cooling tube 20 and carries away the heat in the copper-clad laminate 10. Compared to traditional external heat dissipation methods, the printed circuit board of the present application achieves precise heat dissipation of locally overheated printed circuit boards, while increasing the heat dissipation area and effectively improving the heat dissipation efficiency of the printed circuit board.

[0089] Figure 7 A schematic flow chart of a method for preparing a printed circuit board provided in an embodiment of the present invention, the method comprising:

[0090] S701. Provide a plurality of copper-clad laminates, and form a first groove in at least one copper-clad laminate.

[0091] In this embodiment, if Figure 3 As shown, high-precision CNC processing equipment is used to open the first groove in the copper clad laminate according to the preset line, providing an accurate placement position for the cooling pipe, ensuring the stability of the cooling pipe and forming an effective heat conduction path, thereby improving the heat dissipation efficiency.

[0092] S702. Place a cooling pipe in the first groove; the diameter of the first groove matches the outer diameter of the cooling pipe.

[0093] In this embodiment, the cooling tubes are placed one by one in the first grooves opened in the copper clad board according to the design layout. By placing the cooling tubes in the first grooves that match the outer diameter of the cooling tubes, a close fit between the cooling tubes and the first grooves is ensured, the heat dissipation area is increased, the heat conduction efficiency is improved, and the movement of the cooling tubes during operation is avoided, thereby improving the stability of the internal structure of the printed circuit board.

[0094] Optionally, before placing the cooling pipe in the first groove, the method further includes:

[0095] A prepreg is formed between any adjacent copper clad laminates;

[0096] Wherein, the prepreg adjacent to the copper clad plate having the first groove has a second groove, and the second groove is adapted to the first groove.

[0097] In this embodiment, the prepreg has good insulation properties and can provide electrical isolation between copper-clad laminates, thereby improving the safety and reliability of the circuit board. The prepreg also has strong adhesion, which helps to fix the cooling tube and prevent delamination or falling off due to thermal expansion or mechanical stress during use, thereby improving the structural integrity and stability of the entire circuit board.

[0098] Optionally, before placing the cooling pipe in the first groove, the method further includes:

[0099] Provide cooling pipes;

[0100] The cooling pipe is cleaned, deoxidized and roughened.

[0101] In this embodiment, the cooling tube is cleaned to ensure that the surface of the cooling tube is clean, which helps to improve the adhesion and heat conduction efficiency between the cooling tube and the copper clad laminate or prepreg. The cooling tube is deoxidized to prevent corrosion of the cooling tube, improve its durability and service life, and improve the thermal conductivity of the cooling tube. The cooling tube is roughened to improve the mechanical adhesion between the cooling tube and the copper clad laminate or prepreg, ensuring the stability of the printed circuit board.

[0102] Optionally, after placing the cooling pipe in the first groove, the method further comprises:

[0103] According to the preset drawings, the corresponding circuit patterns are processed on the copper clad laminate.

[0104] In this embodiment, for example, Figure 8 As shown, the corresponding inner layer circuit pattern is processed on the copper clad laminate to form a complete circuit path, ensure the transmission of current and signals, and provide physical structural support for electronic components.

[0105] S703, stacking a plurality of copper clad laminates.

[0106] In this embodiment, if Figure 2 As shown, according to the conventional printed circuit board lamination process, multiple copper clad laminates are stacked to improve the mechanical strength of the printed circuit board, increase the complexity and functionality of the printed circuit board, and facilitate uniform heat distribution.

[0107] S704, performing high-temperature pressing on multiple copper clad laminates.

[0108] In this embodiment, multiple stacked copper clad laminates are fed into a vacuum press and pressed under preset temperature, pressure, and time parameters to firmly bond the cooling tubes and the copper clad laminates to form a high heat dissipation area, and the corresponding outer layer pattern is processed to obtain the following: Figure 9 The integrated printed circuit board shown.

[0109] Optionally, after high-temperature pressing of multiple copper-clad laminates, the integrated printed circuit board is subjected to post-processing, which includes trimming, drilling, and copper plating. Among them, trimming refers to removing excess material from the edge of the printed circuit board to ensure the accuracy of the size of the circuit board and facilitate subsequent installation and assembly; drilling refers to processing the inlet hole and return hole for the coolant, and performing a sealing test after drilling to prevent coolant leakage, thereby ensuring the reliability of the printed circuit board; copper plating refers to plating a layer of copper on the surface of the printed circuit board to improve electrical conductivity and ensure the electrical performance of the printed circuit board.

[0110] Finally, it should be noted that those skilled in the art will readily identify other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art not disclosed herein. The present invention is not limited to the precise structure described above and illustrated in the accompanying drawings, and various modifications and variations may be made without departing from the scope thereof. The scope of the present invention is limited solely by the appended claims.

Claims

1. A printed circuit board, characterized in that: including multiple copper clad plates and cooling pipes; The plurality of copper clad plates are stacked; At least one of the copper-clad plates is provided with a first groove, wherein the diameter of the first groove is adapted to the outer diameter of the cooling tube; The cooling pipe is arranged in the first groove, and the cooling pipe is used to contain cooling liquid.

2. The printed circuit board according to claim 1, wherein: It also includes a liquid inlet and a reflux hole, and the cooling pipe includes a cooling inlet and a cooling outlet; The liquid inlet is connected to the cooling inlet, and the liquid inlet is used to be connected to a circulation pump so that when the circulation pump is started, coolant flows into the cooling pipe through the liquid inlet; The reflux hole is connected to the cooling outlet. The reflux hole is used to be connected to the circulation pump. When the circulation pump is started, the coolant flows out of the cooling pipe through the reflux hole.

3. The printed circuit board according to claim 1, wherein: The copper clad plate includes a plurality of side walls, and the first groove includes a first end and a second end; On the plane where the copper clad laminate is located, the first end is arranged on one side wall of the copper clad laminate, and the second end extends to the other side wall of the copper clad laminate.

4. The printed circuit board according to any one of claims 1 to 3, characterized in that: Also included are a plurality of prepregs; The prepreg is provided between any two adjacent copper clad plates; A second groove is provided on the prepreg adjacent to the copper clad plate provided with the first groove, and the second groove is adapted to the first groove.

5. The printed circuit board according to any one of claims 1 to 3, characterized in that: On the same copper-clad plate, a plurality of the first grooves are provided; wherein, A cooling pipe is provided in each of the first grooves.

6. The printed circuit board according to any one of claims 1 to 3, characterized in that: The cooling tube is a copper tube.

7. The printed circuit board according to any one of claims 1 to 3, characterized in that: The diameter of the first groove is 0.8 mm to 1 mm, and the outer diameter of the cooling tube is 0.7 mm to 0.9 mm.

8. A method for preparing a printed circuit board, characterized in that: The method comprises: Providing a plurality of copper-clad plates, and forming a first groove on at least one of the copper-clad plates; A cooling pipe is placed in the first groove; the diameter of the first groove is adapted to the outer diameter of the cooling pipe; stacking the plurality of copper clad plates; The plurality of copper clad laminates are subjected to high-temperature pressing.

9. The method according to claim 8, characterized in that Before placing the cooling pipe in the first groove, the method further includes: forming a prepreg between any adjacent copper clad laminates; The prepreg adjacent to the copper clad plate having the first groove has a second groove, and the second groove is matched with the first groove.

10. The method according to claim 8, characterized in that Before placing the cooling pipe in the first groove, the method further includes: Provide cooling pipes; The cooling pipe is cleaned, deoxidized and roughened.

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