Stem for semiconductor package

Abstract

To provide a stem for a semiconductor package, which can easily arrange a heat dissipation component to a lower surface side of an eyelet.SOLUTION: A stem for a semiconductor package, includes: an eyelet in which a penetration hole penetrated from a first surface to a second surface is formed; a lead inserted into the penetration hole; and a metal base bonded to the second surface of the eyelet. The lead is bent on the second surface side of the eyelet, and projected from a side surface of the eyelet in a plan view. The metal base is arranged so as to be separated from the lead, and the lead positioned at a position overlapped with the eyelet in the plan view is arranged within a range of a thickness of the metal base in a side plan view.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a stem for a semiconductor package. [Background technology]

[0002] In a stem for a semiconductor package that mounts a light-emitting element, for example, a structure is known in which a metal block protruding from the top surface of a disk-shaped eyelet is provided, and one surface of the metal block serves as an element mounting surface for mounting the semiconductor element. The eyelet is provided with multiple through holes for inserting leads, and the leads are sealed in the through holes with a sealing part such as glass. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-235212 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-described semiconductor package stem, the leads penetrate the eyelet, protrude from the underside of the eyelet, and extend in a direction perpendicular to the underside of the eyelet. Therefore, when placing a heat dissipation component such as a heat spreader on the underside of the eyelet, it is necessary to provide holes in the heat spreader to insert the leads, which makes it difficult to place the heat dissipation component on the underside of the eyelet.

[0005] The present invention has been made in view of the above points, and an object of the present invention is to provide a stem for a semiconductor package that allows a heat dissipation component to be easily arranged on the underside of the eyelet. [Means for solving the problem]

[0006] The stem for a semiconductor package includes an eyelet having a through hole formed therein that penetrates from a first surface to a second surface, a lead inserted into the through hole, and a metal base bonded to the second surface of the eyelet, and the lead is bent on the second surface side of the eyelet so that it extends from the side of the eyelet in a plan view. including two leads protruding in the same direction the metal base is disposed at a distance from the leads; the metal base includes, in a plan view, a portion disposed between bent portions of each of the leads, The lead, which is positioned to overlap the eyelet in a plan view, is arranged within the thickness of the metal base in a side view. [Effects of the Invention]

[0007] According to the disclosed technology, it is possible to provide a stem for a semiconductor package that allows a heat dissipation component to be easily arranged on the underside of the eyelet. [Brief explanation of the drawings]

[0008] [[FIG. 1]] 1 is a perspective view illustrating a stem for a semiconductor package according to a first embodiment. FIG. [[FIG. 2]] 1A and 1B are diagrams illustrating a stem for a semiconductor package according to a first embodiment. [[FIG. 3]] FIG. 3 is a partially enlarged cross-sectional view of part B in FIG. 2(b). [[FIG. 4]] 1A to 1C are diagrams (part 1) illustrating the main steps of the manufacturing process of the stem for a semiconductor package according to the first embodiment. [[FIG. 5]] 5A to 5C are diagrams (part 2) illustrating the main steps of the manufacturing process of the stem for a semiconductor package according to the first embodiment. [[FIG. 6]] 1 is an example of a mounting form of a stem for a semiconductor package. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and redundant explanations may be omitted.

[0010] <First Embodiment> FIG. 1 is a perspective view illustrating a stem for a semiconductor package according to the first embodiment, FIG. 1(a) is a perspective view viewed from the upper surface side, and FIG. 1(b) is a perspective view viewed from the lower surface side. FIG. 2 is a view illustrating a stem for a semiconductor package according to the first embodiment, FIG. 2(a) is a plan view, and FIG. 2(b) is a cross-sectional view taken along line A-A of FIG. 2(a).

[0011] Referring to FIGS. 1 and 2, the stem 1 for a semiconductor package according to the first embodiment includes an eyelet 10, a metal block 30, a first lead 41, a second lead 42, a sealing portion 50, and a metal base 60.

[0012] The eyelet 10 is a disc-shaped member. In the present application, the disc-shaped means a member having a substantially circular planar shape and a predetermined thickness. The magnitude relationship between the diameter and the thickness is not limited. Also, those in which recesses, protrusions, through holes, etc. are partially formed are also included.

[0013] In the present application, the plan view means viewing the object from the normal direction of the upper surface 10a of the eyelet 10, and the planar shape means the shape of the object viewed from the normal direction of the upper surface 10a of the eyelet 10. In the present application, parallel, perpendicular, and right angles allow a difference within ±5 degrees. However, this is not the case when strictly described as parallel, perpendicular, and right angle.

[0014] On the side surface of the eyelet 10, for example, notches 11 and 12 that are opposing planes can be formed. The notches 11 and 12 can be used, for example, for positioning the element mounting surface when the stem 1 for a semiconductor package mounts a semiconductor element. The notches 11 and 12 may also be used for positioning in the rotational direction of the stem 1 for a semiconductor package. The notches 11 and 12 may be provided as necessary.

[0015] The diameter of the eyelet 10 is not particularly limited and can be appropriately determined according to the purpose. For example, it can be φ5.6 mm, φ9.0 mm, etc. The thickness of the eyelet 10 is not particularly limited and can be appropriately determined according to the purpose. For example, it is about 0.5 to 3 mm.

[0016] The eyelet 10 can be formed of, for example, a metal material such as iron or stainless steel. The eyelet 10 may be formed of a metal material (for example, a so-called clad material) in which a plurality of metal layers (copper layer, iron layer, etc.) are laminated. The surface of the eyelet 10 may be plated. Examples of the plating applied to the surface of the eyelet 10 include gold plating.

[0017] A through hole 10x penetrating from the upper surface 10a to the lower surface 10b is formed in the eyelet 10. One end side of the metal block 30 is inserted into the through hole 10x provided in the eyelet 10, and the other end side protrudes from the upper surface 10a of the eyelet 10. In the present embodiment, as an example, the metal block 30 includes a pedestal portion 31 and a columnar portion 32 protruding from the upper surface 31a of the pedestal portion 31. The pedestal portion 31 and the columnar portion 32 are integrally formed. The columnar portion 32 includes an element mounting surface 30r on which a semiconductor element (for example, a light emitting element such as a laser) is mounted. The element mounting surface 30r is provided so as to be perpendicular to the upper surface 10a of the eyelet 10. Note that the upper surface 31a of the pedestal portion 31 is not necessarily a flat surface.

[0018] One end side of the metal block 30 is joined to the metal base 60. In the present embodiment, as an example, the pedestal portion 31 is inserted into the through hole 10x of the eyelet 10, and the lower surface (the lower surface 30b of the metal block 30) is joined to the metal base 60. The columnar portion 32 includes a portion protruding from the upper surface 10a of the eyelet 10. Most of the columnar portion 32 protrudes from the upper surface 10a of the eyelet 10. All parts of the columnar portion 32 may protrude from the upper surface 10a of the eyelet 10, but it is preferable that the pedestal portion 31 side of the columnar portion 32 is located within the through hole 10x. The lower surface 30b of the metal block 30 is, for example, substantially flush with the lower surface 10b of the eyelet 10.

[0019] In a plan view, the outer peripheral portion of the upper surface 31a of the pedestal portion 31 is exposed around the columnar portion 32. In the outer peripheral portion of the upper surface 31a of the pedestal portion 31 that is exposed around the columnar portion 32, the width on the element mounting surface 30r side is narrower than the width on the other surface side of the columnar portion 32. In other words, in a plan view, the center of the columnar portion 32 is offset toward the first lead 41 and the second lead 42 side along the A-A line direction with respect to the center of the pedestal portion 31. In the outer peripheral portion of the upper surface 31a of the pedestal portion 31 that is exposed around the columnar portion 32, the width on the element mounting surface 30r side is, for example, about 0.05 mm, and the width on the other surface side of the columnar portion 32 is, for example, about 0.5 mm. By adopting such a shape, a sufficient area for arranging the first lead 41 and the second lead 42 on the eyelet 10 can be secured.

[0020] In a plan view, the pedestal portion 31 is substantially rectangular, but the corners at both ends of the first side on the element mounting surface 30r side (the first lead 41 and the second lead 42 side) of the pedestal portion 31 are rounded, and the corners at both ends of the second side facing the first side have a larger radius of rounding than the corners at both ends of the first side. By adopting the pedestal portion 31 with the above-described shape, it becomes easy to arrange the pedestal portion 31 along the shape of the eyelet 10.

[0021] In a plan view, the columnar portion 32 is substantially rectangular, but the corners at both ends of the first side on the element mounting surface 30r side of the columnar portion 32 are rounded, and the corners at both ends of the second side facing the first side have a similar degree of rounding to the corners at both ends of the first side. The columnar portion 32 is a portion for mounting and fixing a semiconductor element when the stem 1 for a semiconductor package is used as a semiconductor package on which the semiconductor element is mounted, and also has a function as a heat sink for dissipating heat generated from the semiconductor element. By adopting the columnar portion 32 with the above-described shape, the volume of the columnar portion 32 can be sufficiently secured, and the heat dissipation performance can be improved.

[0022] The distance between the upper surface 30a of the metal block 30 and the upper surface 10a of the inlet 10 (the protruding amount of the columnar portion 32 from the upper surface 10a of the inlet 10) is, for example, about 3 to 4 mm. For the metal block 30, a material with a higher thermal conductivity than that of the inlet 10 can be used. If the material of the inlet 10 is iron, for example, the material of the metal block 30 is copper.

[0023] FIG. 3 is a partially enlarged cross-sectional view of part B in FIG. 2(b). As shown in FIG. 3, it is preferable that a part of the element mounting surface 30r is located within the through hole 10x. Due to manufacturing reasons, the pedestal portion 31 side of the element mounting surface 30r of the metal block 30 becomes a sagging region. The sagging region has an R shape and does not become flat. By having a part of the element mounting surface 30r located within the through hole 10x, the sagging region of the element mounting surface 30r can be made to enter the through hole 10x. Preferably, the entire sagging region of the element mounting surface 30r is located within the through hole 10x. Thereby, the area of the flat region of the element mounting surface 30r of the portion protruding from the upper surface 10a of the inlet 10 can be increased. As a result, a larger element can be mounted.

[0024] Returning to the description of FIGS. 1 and 2, a through hole 10y penetrating from the upper surface 10a to the lower surface 10b is formed in the inlet 10. The first lead 41 and the second lead 42 are inserted into different through holes 10y, for example. The first lead 41 and the second lead 42 may be inserted into one through hole 10y in a state of being insulated from each other. The first lead 41 and the second lead 42 are bent on the lower surface 10b side of the inlet 10 and protrude from the side surface of the inlet 10 in a plan view. The diameters of the first lead 41 and the second lead 42 can be, for example, about 0.3 to 1 mm.

[0025] The first lead 41 has a first portion 41A penetrating through the inlet 10 and a second portion 41B continuous with the first portion 41A and parallel to the lower surface 10b of the inlet 10. Similarly, the second lead 42 has a first portion 42A penetrating through the inlet 10 and a second portion 42B continuous with the first portion 42A and parallel to the lower surface 10b of the inlet 10.

[0026] The first portion 41A of the first lead 41 is inserted into a through-hole 10y that penetrates the eyelet 10 from the upper surface 10a to the lower surface 10b so as to be perpendicular to the upper surface 10a of the eyelet 10. Similarly, the first portion 42A of the second lead 42 is inserted into a through-hole 10y that penetrates the eyelet 10 in the thickness direction so as to be perpendicular to the upper surface 10a of the eyelet 10. Inside each through-hole 10y of the eyelet 10, the peripheries of the first portion 41A of the first lead 41 and the first portion 42A of the second lead 42 are sealed by a sealing portion 50.

[0027] In the first lead 41, the angle formed by the first portion 41A and the second portion 41B is, for example, a right angle. Also, in the second lead 42, the angle formed by the first portion 42A and the second portion 42B is, for example, a right angle. The second portion 41B of the first lead 41 and the second portion 42B of the second lead 42 are, for example, parallel to each other. However, it is not limited to this, and the second portion 41B of the first lead 41 may be non-parallel to the second portion 42B of the second lead 42.

[0028] The first portion 41A of the first lead 41 is, for example, parallel to the first portion 42A of the second lead 42. A part of the first portion 41A of the first lead 41 and the first portion 42A of the second lead 42 protrudes from the upper surface 10a and the lower surface 10b of the eyelet 10. In the first portion 41A of the first lead 41 and the first portion 42A of the second lead 42, the protruding amount from the upper surface 10a of the eyelet 10 is, for example, about 1 to 3 mm. In the first portion 41A of the first lead 41 and the first portion 42A of the second lead 42, the protruding amount from the lower surface 10b of the eyelet 10 is, for example, about 0.5 to 1.5 mm.

[0029] A part of the second portion 41B of the first lead 41 and a part of the second portion 42B of the second lead 42 protrude from the side surface of the eyelet 10 in a plan view. In the second portion 41B of the first lead 41 and the second portion 42B of the second lead 42, the protruding amount from the side surface of the eyelet 10 in a plan view is, for example, about 1 to 3 mm. However, in the second portion 41B of the first lead 41 and the second portion 42B of the second lead 42, the protruding amount from the side surface of the eyelet 10 in a plan view may be appropriately changed according to the usage method. Here, the usage method refers to the case of inserting the first lead 41 and the second lead 42 into a socket, the case of soldering a wire to the first lead 41 and the second lead 42, etc.

[0030] The first lead 41 and the second lead 42 are formed of a metal such as, for example, a 50% iron-nickel alloy or kovar, and the sealing portion 50 is formed of an insulating material such as, for example, a glass material. The first lead 41 and the second lead 42 are electrically connected to, for example, a semiconductor element mounted on the stem 1 for a semiconductor package. Note that the number of leads may be increased or decreased according to the specifications of the semiconductor element to be mounted.

[0031] The metal base 60 is joined to the lower surface 10b of the eyelet 10 so as to block one end side of the through hole 10x. For example, in a plan view, the outer shape of the metal base 60 is smaller than the outer shape of the eyelet 10, and there is no portion of the metal base 60 that protrudes beyond the outer shape of the eyelet 10. The metal base 60 is arranged at a distance from the first lead 41 and the second lead 42. That is, the metal base 60 is not provided in the portion through which the first lead 41 and the second lead 42 pass. In other words, a through hole 10y through which the first lead 41 and the second lead 42 pass is not formed in the metal base 60.

[0032] The first lead 41 and the second lead 42 located at a position overlapping with the eyelet 10 in a plan view are arranged within the thickness range of the metal base 60 in a side view, that is, the first lead 41 and the second lead 42 located at a position overlapping with the eyelet 10 in a plan view are arranged on the eyelet 10 side rather than the lower surface 60b of the metal base 60 in a side view. Here, the side view means viewing the object from a direction exactly parallel to the upper surface 10a of the eyelet 10.

[0033] In addition, the first lead 41 and the second lead 42 not located at a position overlapping with the eyelet 10 in a plan view may have a portion located below the lower surface 60b of the metal base 60 in a side view. For example, a part of the portion protruding from the side surface of the eyelet 10 in a plan view of the first lead 41 and the second lead 42 may be located below the lower surface 60b of the metal base 60.

[0034] The thickness of the metal base 60 can be appropriately determined within a range thicker than the diameters of the first lead 41 and the second lead 42. For example, it can be about 0.5 to 3 mm. The thickness of the metal base 60 may be thinner or thicker than the thickness of the eyelet 10. The thermal conductivity of the metal base 60 is equal to or higher than the thermal conductivity of the eyelet 10. For example, when the material of the eyelet 10 is iron, copper having a higher thermal conductivity than the eyelet 10 can be used as the material of the metal base 60. In this case, the heat dissipation performance of the stem 1 for semiconductor packages can be improved.

[0035] When the material of the metal base 60 is copper, it is preferable not to arrange the metal base 60 on the outer peripheral portion of the lower surface 10b of the eyelet 10. In other words, the outer peripheral portion of the lower surface 10b of the eyelet 10 is preferably exposed from the metal base 60. When manufacturing a semiconductor package using the stem 1 for semiconductor packages, a cap may be welded to the outer peripheral portion of the upper surface 10a of the eyelet 10. During welding, the outer peripheral portion of the lower surface 10b of the eyelet 10 is used as a receiving portion of a jig for fixing the eyelet 10. Therefore, if soft copper exists in that region, the copper may be deformed.

[0036] However, when not using the same cap as in the prior art, the metal base 60 may be disposed on the outer peripheral portion of the lower surface 10b of the inlet 10, or the metal base 60 may protrude outside the inlet 10 in a plan view. In these cases, since the volume of the metal base increases, the heat dissipation performance can be improved.

[0037] When the material of the inlet 10 is iron, iron may be used as the material of the metal base 60. When the inlet 10 and the metal base 60 are formed of the same material in this way, the thermal expansion coefficients of the inlet 10 and the metal base 60 become the same. Therefore, deformation due to heat of the inlet 10 and the metal base 60 can be suppressed, and when a semiconductor package having a semiconductor element mounted on the semiconductor package stem 1 for the first embodiment is manufactured, the airtightness of the semiconductor package can be improved.

[0038] Note that the metal base 60 may be integrally formed with the metal block 30.

[0039] FIGS. 4 and 5 are diagrams illustrating main parts of a manufacturing process of a semiconductor package stem according to the first embodiment.

[0040] To fabricate the stem 1 for the semiconductor package, first, as shown in FIG. 4, a metal block 30 having a pedestal portion 31 and a columnar portion 32 protruding from the pedestal portion 31 is fabricated. To fabricate the metal block 30, for example, a bar-shaped material is subjected to drawing to form it into a predetermined shape, and then cut into individual pieces. Each of the individualized materials is a portion that will become the pedestal portion 31 and the columnar portion 32. Thereafter, forming is performed on each of the individualized materials using a mold. Specifically, for each of the individualized materials, the portion that will become the columnar portion 32 is pressed from the periphery with a mold, and the portion that will become the element mounting surface 30r is flattened. As a result, the pressed portion becomes smaller than the non-pressed portion. That is, the pressed portion becomes the columnar portion 32, and the non-pressed portion becomes the pedestal portion 31, forming the shape shown in FIG. 4. In a plan view, the outer peripheral portion of the pedestal portion 31 is exposed around the columnar portion 32. Here, the flatness referred to here indicates a surface with a flatness of about 0.005 mm MAX. In FIG. 4, the flat portion of the element mounting surface 30r is shown with a satin finish pattern.

[0041] Next, as shown in FIG. 5(a), an eyelet 10 having through holes 10x and 10y penetrating from the upper surface 10a to the lower surface 10b is fabricated by press working or the like. Then, a first lead 41 and a second lead 42 bent in a predetermined shape in advance are inserted into the through hole 10y, and the periphery of the first lead 41 and the second lead 42 in the through hole 10y is sealed with a sealing portion 50. Alternatively, the non-bent first lead 41 and second lead 42 may be inserted into the through hole 10y, the periphery of the first lead 41 and the second lead 42 in the through hole 10y may be sealed with the sealing portion 50, and then bent into a predetermined shape.

[0042] Next, as shown in FIG. 5(b), a metal bonding material (not shown) is placed on the upper surface 60a of a metal base 60, and the structure shown in FIG. 5(a) is further placed on the metal bonding material. Then, the pedestal portion 31 of the metal block 30 is inserted into the through hole 10x of the eyelet 10, and arranged such that at least a part of the columnar portion 32 protrudes from the upper surface 10a of the eyelet 10. The lower surface 30b of the metal block 30 is in contact with the metal bonding material.

[0043] Next, as shown in FIG. 5(c), the metal bonding material is heated to a temperature higher than its melting point to be melted and then solidified. At this time, the inlet 10 and the metal block 30 may be pressed toward the metal base 60 side. Since the metal bonding material becomes thinner approximately uniformly by melting, the lower surface 30b of the metal block 30 becomes substantially flush with the lower surface 10b of the inlet 10. Also, a part of the melted metal bonding material enters the gap due to capillary action and solidifies in a state of filling the gap. Thereby, the inlet 10, the metal base 60, and the metal block 30 are joined together.

[0044] In this way, the lower surface 30b of the metal block 30 is joined to the upper surface 60a of the metal base 60 by the metal bonding material, and the side surface 30c of the metal block 30 is joined to the inner wall surface 10c of the through hole 10x of the inlet 10 by the metal bonding material. Also, the lower surface 10b of the inlet 10 is joined to the upper surface 60a of the metal base 60 by the metal bonding material. Thus, the stem 1 for semiconductor package is completed.

[0045] Note that the manufacturing process of a semiconductor package in which a semiconductor element is mounted on the stem 1 for semiconductor package may include a step of heating to about 300°C. Therefore, as the metal bonding material for joining the inlet 10, the metal base 60, and the metal block 30, it is preferable to select a material having a melting point of 350°C or higher. As the metal bonding material, for example, a silver solder having a melting point of about 800°C can be used.

[0046] In this way, in the stem 1 for semiconductor package, the first lead 41 and the second lead 42 are bent on the lower surface 10b side of the inlet 10 and protrude from the side surface of the inlet 10 in a plan view. And the first lead 41 and the second lead 42 located at a position overlapping the inlet 10 in a plan view are arranged within the thickness range of the metal base 60 in a side view.

[0047] As a result, when arranging a heat dissipation component such as a heat spreader on the lower surface 60b of the metal base 60, it becomes unnecessary to drill holes for passing the first lead 41 and the second lead 42 through the heat spreader or the like. As a result, it becomes possible to easily arrange a heat dissipation component such as a heat spreader on the lower surface 10b side of the inlet 10. In addition, since it becomes possible to increase the contact area between the lower surface 60b of the metal base 60 and a heat dissipation component such as a heat spreader, the heat dissipation performance can be improved.

[0048] Note that the stem 1 for a semiconductor package may have one lead or three or more leads.

[0049] FIG. 6 is an example of an implementation form of the stem for a semiconductor package. The first lead 41 and the second lead 42 of the stem 1 for a semiconductor package shown in FIG. 6 are inserted into the socket 100. The socket 100 can be mounted on a wiring board, for example. By connecting the stem 1 for a semiconductor package to the socket 100, the replacement of the stem 1 for a semiconductor package becomes easy.

[0050] Further, in the stem 1 for a semiconductor package, since the first lead 41 and the second lead 42 protrude to the side surface side of the inlet 10, the tips of the first lead 41 and the second lead 42 can be visually recognized from the upper surface 10a side of the inlet 10. Therefore, it is easy to connect the first lead 41 and the second lead 42 to the socket 100 or to connect them to the wiring with solder.

[0051] Also, in the stem 1 for semiconductor packages, a metal block 30 having a pedestal portion 31 and a columnar portion 32 protruding from the pedestal portion 31 is prepared in advance, and a structure is adopted in which the pedestal portion 31 is inserted into the through hole 10x of the eyelet 10 and the columnar portion 32 protrudes from the upper surface 10a of the eyelet 10. Thereby, the stem 1 for semiconductor packages capable of sufficiently securing a flat region of the element mounting surface 30r can be realized. Further, the problem of cracks occurring in the sealing portion 50 can be solved. Further, as shown in FIG. 3, when the element mounting surface 30r is formed below the upper surface 10a of the eyelet 10, a flat region of the element mounting surface 30r can be secured more widely.

[0052] Also, in the stem 1 for semiconductor packages, a metal base 60 having a thermal conductivity equal to or higher than that of the eyelet 10 is joined to the lower surface 10b of the eyelet 10 so as to close one end side of the through hole 10x. One end side (lower surface 30b side) of the metal block 30 is inserted into the through hole 10x and joined to the metal base 60 in the through hole 10x, and the other end side (upper surface 30a side) protrudes from the upper surface 10a of the eyelet 10. Further, the lower surface 30b of the metal block 30 is substantially flush with the lower surface 10b of the eyelet 10.

[0053] With such a structure, when a semiconductor element is mounted on the element mounting surface 30r of the metal block 30, the lower surface 30b of the metal block 30 can be brought closer to the metal base 60 serving as a heat radiating portion. Further, by inserting the metal block 30 into the through hole 10x, the volume of the metal block 30 can be increased. As a result, the heat radiation performance of the stem 1 for semiconductor packages can be improved.

[0054] As described above, the preferred embodiments have been described in detail. However, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope described in the claims.

Description of Reference Numerals

[0055] 1 Stem for semiconductor package 10 Eyelet Above 10a, 30a, 60a Below 10b, 30b, 60b Inner wall surface of 10c Through holes 10x, 10y Notches 11, 12 Metal block 30 Side surface of 30c Element mounting surface of 30r Base portion 31 Columnar portion 32 First lead 41 First part 41A, 42A Second lead 42 Second part 42B, 42B Sealing portion 50 Metal base 60 Socket 100

Claims

1. An eyelet having a through-hole formed from a first surface to a second surface; A lead inserted into the through-hole; A metal base joined to the second surface of the eyelet, comprising: The lead is bent on the second surface side of the eyelet and includes two leads that project in the same direction from the side surface of the eyelet in a plan view; The metal base is disposed at a distance from the lead; The metal base includes, in a plan view, a portion disposed between the bent portions of the respective leads; A stem for a semiconductor package, wherein the lead at a position overlapping the eyelet in a plan view is disposed within the thickness range of the metal base in a side view.

2. The lead has a first portion penetrating the eyelet and a second portion continuous with the first portion and parallel to the lower surface of the eyelet. The stem for a semiconductor package according to claim 1.

3. The angle formed by the first portion and the second portion is a right angle. The stem for a semiconductor package according to claim 2.

4. Each of the leads has the first portion and the second portion, The second portions of each are parallel to each other. The stem for a semiconductor package according to claim 2 or 3.

5. The outer peripheral portion of the second surface of the eyelet is exposed from the metal base. The stem for a semiconductor package according to any one of claims 1 to 4.

6. Having a metal block with one end inserted into a second through-hole provided in the eyelet and the other end protruding from the first surface of the eyelet. The stem for a semiconductor package according to any one of claims 1 to 5.

7. One end of the metal block is joined to the metal base. The stem for a semiconductor package according to claim 6.

8. The metal block includes a pedestal portion and a columnar portion protruding from the pedestal portion, The pedestal portion is inserted into the second through-hole, and the columnar portion includes a portion protruding from the first surface, The columnar portion includes an element mounting surface for mounting a semiconductor element, In a plan view, the outer peripheral portion of the pedestal portion is exposed around the columnar portion. The stem for a semiconductor package according to claim 6 or 7.

9. A part of the element mounting surface is located within the second through-hole. The stem for a semiconductor package according to claim 8.

10. On the outer peripheral portion of the pedestal portion exposed around the columnar portion, the width on the element mounting surface side is narrower than the width on the other surface side of the columnar portion. The stem for a semiconductor package according to claim 8 or 9.

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