Substrate processing apparatus

Abstract

To provide a technique enabling stable processing of a substrate in a configuration having a lift pin.SOLUTION: A substrate processing apparatus includes: a processing container in which a substrate is processed using a process gas; a rotary table that is rotatably provided in the processing container; and a mounting table that is rotatable relative to the rotary table at a position apart from a rotation center of the rotary table and on which the substrate is mounted. The substrate processing apparatus also includes: a lift pin for elevating the substrate by being displaced relative to the mounting table; and a housing part in which the lift pin is retracted from the mounting table and is housed in an unexposed condition. A closing structure for closing a gap between the lift pin and the housing part is provided for the lift pin and the housing part.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus. [Background technology]

[0002] Conventionally, there has been known a substrate processing apparatus that includes a turntable that is rotatable within a processing vessel and a mounting table that is rotatable relative to the turntable and on which a substrate is placed (see Patent Document 1). For example, the substrate processing apparatus supplies a processing gas into the processing vessel and performs a process of forming a film on a substrate placed on the mounting table.

[0003] This type of substrate processing apparatus includes lift pins that can be raised and lowered relative to the mounting table to receive and transfer the substrate between the transport device that transports the substrate and the mounting table. That is, the substrate processing apparatus raises the multiple lift pins from the mounting table to receive the substrate from the transport device, and then lowers the lift pins to place the substrate on the mounting table. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2021-110023 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique that allows stable processing of substrates in a configuration equipped with lift pins. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, there is provided a processing chamber for processing a substrate with a processing gas, a rotatable table provided rotatably in the processing chamber, a mounting table that is rotatable relative to the rotatable table at a position spaced apart from the center of rotation of the rotatable table and on which the substrate is placed, lift pins that displace relative to the mounting table to raise and lower the substrate, and a housing portion that houses the lift pins that are not exposed from the mounting table, wherein the lift pins and the housing portion have a closing structure that closes a gap between the lift pins and the housing portion. Moreover, the closing structure includes a flange body protruding radially outward from the outer peripheral surface of the lift pin, and a flange seat portion provided around the arrangement hole in which the lift pin is arranged in the accommodation portion and having an end surface that can be in surface contact with the lower surface of the flange body. The arrangement hole guides the lifting and lowering of the lift pin while being inclined with respect to the vertical direction so as to face the rotation center of the rotary table. A substrate processing apparatus is provided.

Advantages of the Invention

[0007] According to one aspect, in a configuration including lift pins, a substrate can be stably processed.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0009] Hereinafter, modes for carrying out the present disclosure will be described with reference to the drawings. In each drawing, the same reference numerals are assigned to the same constituent parts, and redundant descriptions may be omitted.

[0010] 〔Substrate Processing Apparatus〕 With reference to FIGS. 1 to 3, a film forming apparatus 1 for forming a film on a substrate W, which is an example of a substrate processing apparatus, will be described. FIG. 1 is a longitudinal sectional view showing a configuration example of the film forming apparatus 1 according to an embodiment. FIG. 2 is a plan view showing the configuration inside the vacuum chamber 11 of the film forming apparatus 1 in FIG. 1. In FIG. 2, for convenience of explanation, the illustration of the top plate is omitted. FIG. 3 is a perspective view showing the configuration of the rotary table 21 and the mounting table 211 of the film forming apparatus 1 in FIG. 1.

[0011] The film forming apparatus 1 includes a processing unit 10, a rotation driving device 20, a lift pin mechanism unit 30, and a control unit 90.

[0012] The processing unit 10 performs a film forming process for forming a film on the substrate W. The processing unit 10 includes a vacuum chamber 11, a gas introduction unit 12, a gas exhaust unit 13, a transfer port 14, a heating unit 15, and a cooling unit 16.

[0013] The vacuum chamber 11 is a processing chamber capable of reducing the pressure of the internal space. The vacuum chamber 11 is formed in a flat housing having a substantially circular planar shape, and can accommodate a plurality of substrates W in the internal space. The substrate W may be, for example, a semiconductor wafer. The vacuum chamber 11 includes a main body 111, a top plate 112, a side wall body 113, and a bottom plate 114 (FIG. 1). The main body 111 has a cylindrical shape. The top plate 112 is detachably disposed on the upper surface of the main body 111. The main body 111 and the top plate 112 are hermetically adhered by a seal portion 116. The side wall body 113 has a cylindrical shape and is hermetically connected to the lower surface of the main body 111. The bottom plate 114 is hermetically connected to the bottom surface of the side wall body 113.

[0014] The gas introduction section 12 includes a raw material gas nozzle 121, a reaction gas nozzle 122, and separation gas nozzles 123 and 124 (Fig. 2). The raw material gas nozzle 121, the reaction gas nozzle 122, and the separation gas nozzles 123 and 124 are arranged at intervals along the circumferential direction of the vacuum vessel 11 (the direction indicated by arrow A in Fig. 2) above the rotating table 21 described later. In the illustrated example, the separation gas nozzle 123, the raw material gas nozzle 121, the separation gas nozzle 124, and the reaction gas nozzle 122 are arranged in this order clockwise (the rotation direction of the rotating table 21) from the transfer port 14. Each of the raw material gas nozzle 121, the reaction gas nozzle 122, and the separation gas nozzles 123 and 124 has gas introduction ports 121p, 122p, 123p, and 124p (Fig. 2) for introducing various gases at the base end. The gas introduction ports 121p, 122p, 123p, and 124 are fixed to the side wall of the main body 111 and protrude outside the main body 111. The raw material gas nozzle 121, the reaction gas nozzle 122, and the separation gas nozzles 123 and 124 are inserted into the vacuum vessel 11 from the side wall of the main body 111 and extend radially inward of the main body 111. The raw material gas nozzle 121, the reaction gas nozzle 122, and the separation gas nozzles 123 and 124 are formed of, for example, quartz and are arranged parallel to the rotating table 21.

[0015] The raw material gas nozzle 121 is connected to a supply source (not shown) of the raw material gas via a pipe, a flow controller, etc. (not shown). As the raw material gas, for example, a silicon-containing gas or a metal-containing gas can be used. A plurality of discharge holes (not shown) that open toward the rotating table 21 are arranged at intervals along the axial direction of the raw material gas nozzle 121. The lower region of the raw material gas nozzle 121 becomes a raw material gas adsorption region P1 for adsorbing the raw material gas to the substrate W.

[0016] The reaction gas nozzle 122 is connected to a reaction gas supply source (not shown) via piping, a flow controller, etc. (not shown). As the reaction gas, for example, an oxidation gas or a nitriding gas can be used. The reaction gas nozzle 122 has a plurality of discharge holes (not shown) that open toward the rotary table 21, which are arranged at intervals along the axial direction of the reaction gas nozzle 122. The lower region of the reaction gas nozzle 122 becomes a reaction gas supply region P2 for oxidizing or nitriding the source gas adsorbed on the substrate W in the source gas adsorption region P1. In the present embodiment, the processing gas for processing the substrate W corresponds to the above-described source gas and reaction gas.

[0017] The separation gas nozzles 123 and 124 are both connected to a separation gas supply source (not shown) via piping, a flow control valve, etc. (not shown). As the separation gas, for example, an inert gas such as argon (Ar) gas or nitrogen (N2) gas can be used. The separation gas nozzles 123 and 124 have a plurality of discharge holes (not shown) that open toward the rotary table 21, which are arranged at intervals along the axial direction of the separation gas nozzles 123 and 124.

[0018] Also, as shown in FIG. 2, two convex portions 17 are provided in the vacuum chamber 11. The convex portions 17 are attached to the back surface of the top plate 112 so as to project toward the rotary table 21 in order to constitute a separation region D together with the separation gas nozzles 123 and 124. Each convex portion 17 has a fan-shaped planar shape with the top portion cut in an arc shape, and is arranged such that the inner arc is connected to the protruding portion 18 and the outer arc is along the side wall of the vacuum chamber 11.

[0019] The gas exhaust portion 13 includes a first exhaust port 131 and a second exhaust port 132 (FIG. 2). The first exhaust port 131 is formed at the bottom of a first exhaust region E1 that communicates with the source gas adsorption region P1. The second exhaust port 132 is formed at the bottom of a second exhaust region E2 that communicates with the reaction gas supply region P2. The first exhaust port 131 and the second exhaust port 132 are connected to an exhaust device (not shown) via an exhaust pipe (not shown).

[0020] The transfer port 14 is provided on the side wall of the main body 111 (Fig. 2). At the transfer port 14, the substrate W is transferred between the rotary table 21 inside the vacuum chamber 11 and the transfer arm 14a outside the vacuum chamber 11. The transfer port 14 is opened and closed by a gate valve (not shown).

[0021] The heating unit 15 includes a fixed shaft 151, a heater support portion 152, and a heater 153 (Fig. 1).

[0022] The fixed shaft 151 has a cylindrical shape with the center of the vacuum chamber 11 as the central axis. The fixed shaft 151 is provided inside the rotating shaft 23 of the rotation drive device 20 described later and penetrates the bottom plate 114 of the vacuum chamber 11.

[0023] The heater support portion 152 is fixed to the upper part of the fixed shaft 151 and has a disk shape. The heater support portion 152 supports the heater 153.

[0024] The heater 153 is provided on the upper surface of the heater support portion 152. The heater 153 may be provided on the main body 111 in addition to the upper surface of the heater support portion 152. When power is supplied from a power source (not shown), the heater 153 generates heat and heats the substrate W. Also, a shielding plate 156 (Fig. 4) is provided on the upper surface of the heater 153. The shielding plate 156 is disposed above the main body 111 or the heater support portion 152 and faces the main body 111 or the heater support portion 152 to prevent the heater 153 from being exposed to the processing gas.

[0025] The cooling unit 16 includes fluid flow paths 161a to 161d, chiller units 162a to 162d, inlet pipes 163a to 163d, and outlet pipes 164a to 164d. The fluid flow paths 161a to 161d are respectively formed inside the main body 111, the top plate 112, the bottom plate 114, and the heater support portion 152. The chiller units 162a to 162d output temperature-controlled fluid. The temperature-controlled fluid output from the chiller units 162a to 162d flows through the inlet pipes 163a to 163d, the fluid flow paths 161a to 161d, and the outlet pipes 164a to 164d in this order and circulates. Thereby, the temperatures of the main body 111, the top plate 112, the bottom plate 114, and the heater support portion 152 are adjusted. As the temperature-controlled fluid, for example, water or a fluorine-based fluid such as Galden (registered trademark) can be used.

[0026] The rotation drive device 20 has a rotary table 21, a housing box 22, a rotating shaft 23, a revolution motor 24, and an outer cylinder 25.

[0027] The rotary table 21 is provided inside the vacuum chamber 11 and has a rotation center at the center of the vacuum chamber 11. The rotary table 21 has, for example, a disc shape and is formed of quartz. On the upper surface of the rotary table 21, a plurality (for example, five) of mounting tables 211 are provided along the rotation direction (circumferential direction). The rotary table 21 is connected to the housing box 22 via a connection portion 214 (FIG. 3).

[0028] Each mounting table 211 has a disc shape slightly larger than the substrate W and is formed of, for example, quartz. The substrate W is placed on each mounting table 211. Each mounting table 211 is connected to a rotation motor 213 via a rotation shaft 212 and is configured to be rotatable with respect to the rotary table 21 (FIG. 1).

[0029] The rotation axis 212 connects the lower surface of the mounting table 211 and the rotation motor 213 accommodated in the accommodation box 22, and transmits the power of the rotation motor 213 to the mounting table 211. The rotation axis 212 is configured to be rotatable about the center of the mounting table 211 as the rotation center. The rotation axis 212 is provided so as to penetrate the ceiling portion 222 of the accommodation box 22 and the rotary table 21. A seal portion 263 is provided near the through portion of the ceiling portion 222 of the accommodation box 22, and the airtight state inside the accommodation box 22 is maintained. The seal portion 263 includes, for example, a magnetic fluid seal.

[0030] The rotation motor 213 rotates the mounting table 211 relative to the rotary table 21 via the rotation axis 212, thereby rotating the substrate W around the center of the substrate W. It is preferable to apply, for example, a servo motor as the rotation motor 213.

[0031] The connection portion 214 connects the lower surface of the rotary table 21 and the upper surface of the accommodation box 22 (FIG. 3). A plurality of connection portions 214 are provided along the circumferential direction of the rotary table 21.

[0032] The accommodation box 22 is provided below the rotary table 21 in the vacuum chamber 11. The accommodation box 22 is connected to the rotary table 21 via the connection portion 214 and rotates integrally with the rotary table 21. The accommodation box 22 may be configured to be movable up and down in the vacuum chamber 11 by a lifting mechanism (not shown). The accommodation box 22 has a main body portion 221 and a ceiling portion 222.

[0033] The main body portion 221 is formed in a concave shape in a longitudinal sectional view and is formed in a ring shape along the rotation direction of the rotary table 21 (FIG. 1).

[0034] The ceiling portion 222 is provided on the upper surface of the main body portion 221 so as to cover the opening of the main body portion 221. Thereby, the main body portion 221 and the ceiling portion 222 form a rotation accommodation portion 223 isolated from the inside of the vacuum chamber 11.

[0035] The rotary container 223 is formed in a rectangular shape in vertical cross section and has a ring shape along the rotation direction of the turntable 21. The rotary container 223 houses a rotation motor 213 (rotation source). A communication passage 224 that connects the rotary container 223 to the outside of the film formation apparatus 1 is formed in the main body 221. This allows air to be introduced into the rotary container 223 from the outside of the film formation apparatus 1, cooling the inside of the rotary container 223 and maintaining it at atmospheric pressure. In order to rotatably dispose the rotary container 223, the vacuum vessel 11 has a rotary source housing space 19 surrounded by a side wall body 113, a bottom plate 114, and a heating unit 15.

[0036] The rotating shaft 23 is fixed to the bottom of the accommodation box 22. The rotating shaft 23 is provided to penetrate the bottom plate 114 of the vacuum vessel 11. The rotating shaft 23 transmits the power of the revolution motor 24 to the rotary table 21 and the accommodation box 22, causing the rotary table 21 and the accommodation box 22 to rotate together. A seal portion 154 is provided between the outer wall of the fixed shaft 151 and the inner wall of the rotating shaft 23 of the rotation drive device 20. This allows the rotating shaft 23 to rotate relative to the fixed shaft 151 while maintaining an airtight state inside the vacuum vessel 11. The seal portion 154 includes, for example, a magnetic fluid seal.

[0037] An outer cylinder 25 of the rotary drive device 20 is connected to the lower surface of the center side of the bottom plate 114 of the vacuum vessel 11. The outer cylinder 25 supports the vacuum vessel 11 together with a fixed shaft 151 of the vacuum vessel 11. A seal 116 is provided between the rotary shaft 23 and the outer cylinder 25 to maintain an airtight state inside the vacuum vessel 11. The seal 116 includes, for example, a magnetic fluid seal.

[0038] A passage 231 is formed inside the rotating shaft 23. The passage 231 is connected to the communication passage 224 of the housing box 22, and functions as a fluid flow path for introducing air into the housing box 22. The passage 231 also functions as a wiring duct for introducing power lines and signal lines for driving the rotation motor 213 into the housing box 22. The passages 231 are provided in the same number as the rotation motors 213, for example.

[0039] The control unit 90 controls each part of the film forming apparatus 1. The control unit 90 may be, for example, a computer. Further, the program of the computer that operates each part of the film forming apparatus 1 is stored in a storage medium. The storage medium may be, for example, a flexible disk, a compact disk, a hard disk, a flash memory, a DVD, or the like.

[0040] 〔Lift Pin Mechanism Unit 30〕 Next, the lift pin mechanism unit 30 of the film forming apparatus 1 will be described. As shown in FIG. 1, when the transfer arm 14a carries the substrate W into and out of the mounting table 211, the lift pin mechanism unit 30 raises and lowers a plurality (three in this embodiment) of lift pins 31 to receive and transfer the substrate W with the transfer arm 14a. The film forming apparatus 1 has a lift pin mechanism unit 30 for each of a plurality (five) of mounting tables 211 provided on the rotary table 21. Each lift pin mechanism unit 30 is arranged at equal intervals along the circumferential direction of the rotary table 21. Each lift pin mechanism unit 30 includes a plurality (three) of upper lift portions 40 each having a plurality of lift pins 31, and one lower operation portion 50 that raises and lowers the plurality of lift pins 31 simultaneously, and is provided in the vacuum chamber 11.

[0041] Each upper lift portion 40 is provided in the heating portion 15 of the vacuum chamber 11. Each upper lift portion 40 is installed so as to penetrate the heater support portion 152 and the heater 153, and accommodates the lift pin 31 in a displaceable manner. The lower operation portion 50 is attached to the lower surface of the bottom plate 114 of the vacuum chamber 11. The lower operation portion 50 has a plurality (three) of plungers 51 that are displaced along the vertical direction and press the lower end portions of the respective lift pins 31. That is, the lift pin mechanism unit 30 has a two-stage structure in which, as operating members, a plurality of lift pins 31 that directly contact the substrate W and a plurality of plungers 51 that indirectly raise and lower the substrate W via the lift pins 31 are vertically separated.

[0042] The lower operation unit 50 is provided at equal intervals in the circumferential direction of the bottom plate 114 facing each mounting table 211 (five in total). In addition to each plunger 51, the lower operation unit 50 includes a housing 52 and a plunger drive unit 53. Further, the plunger drive unit 53 includes a drive source 54, a drive transmission unit 55 that transmits the operating force of the drive source 54, and a movable body 56 that supports each plunger 51 and is displaced in the housing 52 by the drive transmission unit 55.

[0043] The housing 52 is suspended from the bottom plate 114 on the side of the outer cylinder 25 and is formed in an appropriate shape (substantially cylindrical shape) capable of accommodating each component of the lower operation unit 50. The housing 52 is firmly fixed to the bottom plate 114 via appropriate fixing means such as screwing or engagement. The length of the housing 52 along the vertical direction corresponds to the total length of each plunger 51, and is set to be longer than, for example, the length of the side wall body 113 of the vacuum vessel 11 along the vertical direction.

[0044] The drive source 54 is provided at the lower end of the housing 52, operates based on the control of the control unit 90, and transmits its operating force to the drive transmission unit 55. The type of the drive source 54 is not particularly limited, and for example, a motor, a hydraulic or pneumatic cylinder mechanism, a magnetic mechanism, etc. can be applied. The drive transmission unit 55 vertically moves the movable body 56 by appropriately reducing or converting the operating force of the drive source 54. This drive transmission unit 55 is also not particularly limited, and a structure combining gears, pulleys, rails, ball screws, etc. can be applied.

[0045] The movable body 56 extends radially outward (horizontally) from the drive transmission unit 55 located at the center of the housing 52 and supports the lower end portions of the respective plungers 51. The movable body 56 moves up and down along the vertical direction by the drive transmission unit 55, and accordingly, the respective plungers 51 are integrally displaced.

[0046] Each plunger 51 is formed in an elongated solid rod shape and is fixed to the movable body 56, extending parallel to the vertical direction. At the position on the bottom plate 114 facing each plunger 51, a bottom plate side through hole 114a for passing each plunger 51 is formed. Further, at the position on the housing box 22 near the rotation shaft 23 facing each plunger 51, a box side through hole 225 penetrating the housing box 22 and passing each plunger 51 is formed.

[0047] Figure 4 is a partial cross-sectional view showing an enlarged periphery of the installation location of the lift pin mechanism portion 30 in FIG. 1. As shown in FIG. 4, each plunger 51 waits in a state where the upper end portion slightly protrudes from the bottom plate side through hole 114a in the non-operating state of the lift pin 31. Then, each plunger 51 rises together with the movable body 56 and moves within the rotation source accommodation space 19 when receiving or delivering the substrate W. Each plunger 51 passes by the side of the housing box 22 or through the box side through hole 225 and contacts each lift pin 31 of each upper lift portion 40 to push up the lift pin 31.

[0048] As described above, each upper lift portion 40 of the lift pin mechanism portion 30 is fixed at a position vertically above and spaced apart from the lower operation portion 50 (heating portion 15) and has a lift pin 31 that moves up and down by the plunger 51. Further, each upper lift portion 40 includes a housing portion 41 that accommodates the lift pin 31 so as to be movable up and down, a gas supply portion 45 capable of supplying gas via the housing portion 41, and a cylindrical member 48 disposed at the upper end portion of the housing portion 41 and displaceable simultaneously with the lift pin 31.

[0049] A plurality (three) of upper lift portions 40 are provided on the side of the rotation axis 212 and are installed along the circumferential direction of the mounting table 211. The mounting table 211 includes a plurality (three) of through holes 211a through which the lift pins 31 can pass corresponding to the arrangement positions of the respective upper lift portions 40 (see also FIG. 2). Each through hole 211a is arranged at a position a predetermined radius away from the center of the mounting table 211 and at equal intervals along the circumferential direction of the mounting table 211.

[0050] FIG. 5 is a partial cross-sectional view showing an enlarged view of the upper lift portion 40 in FIG. 1. As shown in FIG. 5, the lift pin 31 is a cylindrical (solid rod-shaped) member, and is formed longer than the thickness of the heater support portion 152 and the thickness of the heater 153. By being disposed in the accommodating portion 41, the lift pin 31 is displaceable between a lowered position LP where the lower end surface 32 protrudes below the lower surface of the heater support portion 152 and a raised position HP where the upper end surface 33 protrudes above the upper surface of the mounting table 211.

[0051] Also, in the present embodiment, the axis of each lift pin 31 is slightly inclined with respect to the axis of the plunger 51, that is, the vertical direction of the film forming apparatus 1. Each lift pin 31 is inclined such that the upper end side is closer to the rotation axis 23 (revolution axis) of the rotary table 21. Further, the axes of the lift pins 31 provided on one mounting table 211 are parallel to each other. The inclination angle θ of the axis of the lift pin 31 with respect to the vertical direction is preferably set in a range of, for example, about 1° to 5°. In the present embodiment, the inclination angle θ is 2.5°. Note that each lift pin 31 may be arranged parallel to the vertical direction.

[0052] More specifically, the lift pin 31 has, in order from the lower side to the upper side, a lower rod portion 34, a flange forming portion 35, and an upper rod portion 36. The lower rod portion 34, the flange forming portion 35, and the upper rod portion 36 are integrally formed with each other. As the material constituting the lift pin 31, it is preferable to apply a metal material or ceramics having high wear resistance. In the present embodiment, it is formed of alumina (Al2O3).

[0053] The lower end surface 32 of the lift pin 31 is formed as an arcuate spherical surface in a longitudinal sectional view. In the lift pin 31 in an inclined posture, the lower end surface 32 comes into point contact with the upper end (flat surface) of the plunger 51, so that the friction with the plunger 51 can be suppressed and the pushing force of the plunger 51 can be stably received.

[0054] The lower rod portion 34 is continuous with this lower end surface 32 and constitutes a portion that receives the upward pushing force of the plunger 51 below the flange forming portion 35. The outer diameter of the lower rod portion 34 is set to be approximately the same as the outer diameter of the plunger 51 or slightly smaller than the plunger 51.

[0055] Further, the outer peripheral surface of the lower rod portion 34 has a smooth surface 341 without irregularities in the range from the lower end surface 32 to the middle portion of the lower rod portion 34, while having an uneven surface 342 with a spiral groove 37 formed in the range from the middle portion of the lower rod portion 34 to the flange forming portion 35. The spiral groove 37 serves as a flow path for allowing the gas to flow in response to the supply of gas by the gas supply portion 45. Note that the groove 37 provided in the lift pin 31 is not limited to a spiral shape and may be, for example, linear parallel to the axis of the lift pin 31.

[0056] The lift pin 31 has a washer portion 343 attached near the lower end of the smooth surface 341 of the lower rod portion 34. The washer portion 343 is formed in a ring shape and is supported by a washer (not shown). The upper surface of the washer portion 343 is formed in a stepped shape, and the lower end of the lower coil spring 38 contacts the outer stepped surface. The upper end portion of the lower coil spring 38 is accommodated in the accommodating portion 41. Therefore, the lower coil spring 38 can elastically press the lift pin 31 with the washer portion 343 attached downward.

[0057] On the other hand, the flange forming portion 35 is provided at a substantially intermediate position in the axial direction of the lift pin 31. The flange forming portion 35 has a flange body 351 that protrudes radially outward from the central portion continuous with the lower rod portion 34 and the upper rod portion 36 and circulates in a ring shape. The flange body 351 protrudes with an outer diameter substantially the same as the outer edge of the washer portion 343 attached to the lower rod portion 34.

[0058] Further, the lower surface 351a of the flange body 351 is formed as a flat surface that can be in surface contact with the accommodating portion 41 in a state where the lift pin 31 is disposed at the lowered position LP. The surface direction of the lower surface 351a is orthogonal to the axial center of the lift pin 31. As described above, since the lift pin 31 is in an inclined posture in the accommodating portion 41, the lower surface 351a is inclined with respect to the horizontal plane (horizontal direction) so as to be lower toward the rotation axis 23 of the rotary table 21.

[0059] The upper surface 351b of the flange body 351 is formed in a stepped shape, and the lower end of the upper coil spring 39 (elastic member) is in contact with the outer stepped surface. The upper end portion of the upper coil spring 39 is accommodated in the cylindrical member 48. Thereby, the upper coil spring 39 elastically supports the cylindrical member 48.

[0060] The upper rod portion 36 of the lift pin 31 constitutes a portion that supports the substrate W above the flange forming portion 35. The upper rod portion 36 has a constant outer diameter and a smooth outer peripheral surface, and is formed thinner than the lower rod portion 34. The upper end surface 33 of the lift pin 31 continuous with the upper rod portion 36 is formed in a substantially hemispherical shape and can make point contact with the substrate W.

[0061] The upper rod portion 36 is located below the mounting table 211 in a state where the lift pin 31 is at the lowered position LP, thereby enabling the revolution and rotation of the mounting table 211. When the lift pin 31 ascends in a state where the revolution and rotation of the mounting table 211 have stopped, the upper rod portion 36 is exposed above the upper surface of the mounting table 211 through the through hole 211a of the mounting table 211.

[0062] The accommodating portion 41 of the upper lift portion 40 that accommodates the lift pin 31 includes an accommodating bracket 42 disposed so as to penetrate the heater 153, and a support bracket 43 that supports the lower portion of the accommodating bracket 42 and is fixed to the heater support portion 152.

[0063] The accommodation bracket 42 is formed in a cylindrical shape having an accommodation space 42a capable of accommodating the lift pin 31. The upper end of the accommodation bracket 42 is substantially flush with the upper surface of the heater 153. On the other hand, the lower end portion of the accommodation bracket 42 protrudes from the heater 153 and is inserted into the support bracket 43. An engagement convex portion 421 for attaching the accommodation bracket 42 to the shielding plate 156 is provided on the outer peripheral surface of the accommodation bracket 42.

[0064] The accommodation bracket 42 is located at a position radially outward from the lift pin 31 accommodated in the accommodation space 42a and is non-contact with the lift pin 31 when the lift pin 31 moves up and down. The axis of the accommodation bracket 42 is parallel to the vertical direction. Therefore, the upper lift portion 40 holds only the lift pin 31 in an inclined posture with respect to the accommodation portion 41.

[0065] The support bracket 43 is accommodated in a concave space 155 formed in the heater support portion 152 and supports the accommodation bracket 42. The support bracket 43 is formed in a block shape having an outer diameter slightly larger by one turn in the radial direction than the accommodation bracket 42, and a ring-shaped engagement concave portion 431 into which the lower end of the accommodation bracket 42 can be fitted is provided on its upper surface.

[0066] Further, the support bracket 43 has an arrangement hole 43a for arranging the lower rod portion 34 of the lift pin 31. The arrangement hole 43a extends with a constant inner diameter, and its axis is inclined with respect to the vertical direction. That is, the lift pin 31 can move up and down while maintaining an inclined posture by the lower rod portion 34 contacting the inner surface of the support bracket 43 constituting the arrangement hole 43a.

[0067] Between the engagement recess 431 and the placement hole 43a, a seat portion 432 for flange that projects short with respect to the bottom surface of the engagement recess 431 is formed. The end surface 432a of the seat portion 432 for flange can be in surface contact with the lower surface 351a of the flange main body 351 of the lift pin 31. In the present embodiment, the end surface 432a is inclined so as to gradually become lower toward the rotation axis 23 according to the inclination of the lower surface 351a of the flange main body 351. Thereby, the end surface 432a can be in close contact with the lower surface 351a of the flange main body 351 without a gap. That is, the flange main body 351 of the lift pin 31 and the support bracket 43 of the housing portion 41 constitute a closing structure 44 that closes the gap between the lift pin 31 and the housing portion 41 during the film formation process of the substrate W when the lift pin 31 is in the lowered position LP.

[0068] In addition, the support bracket 43 has a gas communication hole 43b that communicates between the outer surface of the support bracket 43 and the placement hole 43a. The gas communication hole 43b extends in the horizontal direction and constitutes a part of a gas supply portion 45 that allows gas to flow toward the placement hole 43a. Further, around the placement hole 43a on the lower surface of the support bracket 43, a spring seat 433 that houses the upper end of the lower coil spring 38 is formed.

[0069] The gas supply portion 45 regulates the flow of the processing gas toward the lower side (the housing box 22) than the upper lift portion 40 by supplying gas into the housing portion 41 when the lift pin 31 moves up and down. Examples of the gas supplied by the gas supply portion 45 include inert gases such as argon gas, nitrogen gas, and dry air.

[0070] Specifically, the gas supply unit 45 includes a gas source 46 provided outside the vacuum chamber 11, a connection pipe 47 connected to the vacuum chamber 11, and a gas passage 111a provided in the vacuum chamber 11. The connection pipe 47 is provided with an on-off valve for opening and closing the flow path of the connection pipe 47 and a mass flow controller for controlling the gas flow rate, etc. (both not shown) under the control of the control unit 90. The gas passage 111a is provided in the main body 111 and the heater support portion 152 and communicates with a gas communication hole 43b provided in the support bracket 43. The inert gas flowing through the gas passage 111a when the lift pin 31 moves up and down flows into the accommodation space 42a of the accommodation portion 41 through the spiral groove 37 of the lift pin 31.

[0071] Further, the cylindrical member 48 of the upper lift portion 40 is formed in a cylindrical shape disposed at the upper part and inside of the accommodation portion 41 and has a hole portion 48a in which the upper rod portion 36 of the lift pin 31 is disposed. For example, the cylindrical member 48 is composed of an outer cylindrical portion 49a that can be hooked on the upper end of the accommodation portion 41 and an inner cylindrical portion 49b accommodated inside the outer cylindrical portion 49a, and forms a spring seat 481 for accommodating the upper coil spring 39 between the outer cylindrical portion 49a and the inner cylindrical portion 49b.

[0072] This cylindrical member 48 is provided so as to be relatively movable with respect to the accommodation portion 41, and is pushed upward via the upper coil spring 39 when the lift pin 31 moves up, so as to move up together with the lift pin 31. The cylindrical member 48 communicates the through hole 211a of the mounting table 211 and the accommodation space 42a of the accommodation portion 41 via the hole portion 48a by contacting the lower surface of the mounting table 211 as it moves up. When the cylindrical member 48 contacts the mounting table 211, the upward movement of the cylindrical member 48 stops, while the lift pin 31 continues to move up relative to the cylindrical member 48. Thereby, the lift pin 31 is stably inserted into the through hole 211a.

[0073] 〔Operation of the film forming apparatus 1〕 The substrate processing apparatus (film forming apparatus 1) according to this embodiment is basically configured as described above, and its operation and effects will be described below. Hereinafter, the case where a film is formed on the substrate W on the mounting table 211 by atomic layer deposition (ALD) using the film forming apparatus 1 will be exemplified.

[0074] As shown in FIGS. 1 to 3, the control unit 90 of the film forming apparatus 1 controls the revolution motor 24 to rotate the rotary table 21. Thereby, the substrate W on each mounting table 211 provided along the circumferential direction of the rotary table 21 revolves. The rotation speed of the rotary table 21 is preferably set in the range of 1 to 500 rpm.

[0075] Also, the control unit 90 controls the rotation motor 213 to rotate each of the plurality of mounting tables 211 with respect to the rotary table 21. Thereby, the substrate W placed on each mounting table 211 rotates. The rotation speed of the mounting table 211 is preferably set in the range of 1 to 30 rpm.

[0076] The control unit 90 controls the processing unit 10 during the revolution and rotation of the mounting table 211 to perform a film forming process on the substrate W. For example, the control unit 90 supplies a raw material gas to the raw material gas adsorption region P1 from the raw material gas nozzle 121 and supplies a reaction gas to the reaction gas supply region P2 from the reaction gas nozzle 122 while supplying a separation gas to the separation region D from the separation gas nozzles 123 and 124. Thereby, when the substrate W placed on the mounting table 211 repeatedly passes through the raw material gas adsorption region P1 and the reaction gas supply region P2, a film by ALD is deposited on the surface of the substrate W.

[0077] During this film formation process, as shown in FIG. 5, the upper lift portion 40 of the lift pin mechanism portion 30 forms a closing structure 44 with the accommodation portion 41 by means of the lift pin 31 arranged at the lowering position LP. That is, the lower surface 351a of the flange main body 351 and the end surface 432a of the flange seat portion 432 are in surface contact, thereby closing the gap between the lift pin 31 and the accommodation portion 41. For this reason, it is possible to prevent the processing gas (raw material gas, reaction gas) from moving through the gap into the rotation source accommodation space 19 (see also FIG. 4). Therefore, during the film formation process, it is possible to effectively suppress the change in gas pressure (breathing, pulsation) caused by the processing gas flowing into the rotation source accommodation space 19. Further, the closing structure 44 can suppress the corrosion of each component (such as the rotation accommodation portion 223) by blocking the flow of the processing gas into the rotation source accommodation space 19.

[0078] Furthermore, the lift pin 31 arranged at the lowering position LP has an uneven surface 342 having a spiral groove 37 facing the inner surface of the arrangement hole 43a of the support bracket 43. For this reason, the contact area of the lift pin 31 with respect to the support bracket 43 is reduced, and it exhibits high resistance to heat and corrosion.

[0079] Before and after the film formation process, the control unit 90 operates the lift pin mechanism portion 30 to receive and deliver the substrate W to and from the transfer arm 14a. At this time, the control unit 90 stops the rotation of the mounting table 211 by stopping the rotation motor 213 for rotation and the revolution motor 24 for revolution. At the time of stopping, the control unit 90 monitors the rotation position (rotation angle) of the rotary table 21 and the rotation position (rotation angle) of the mounting table 211, and positions and stops the rotation so that the through hole 211a of the mounting table 211 faces the lift pin 31 waiting at the lowering position LP. The means for monitoring the rotation position is not particularly limited. For example, it may be provided with sensors (not shown) for detecting the positions of the rotary table 21 and the mounting table 211, and the control unit 90 may stop the rotation motor 213 for rotation and the revolution motor 24 for revolution based on the detection signals of the respective sensors. Alternatively, the film forming apparatus 1 may apply a motor capable of controlling the rotation angle, such as a stepping motor, to the rotation motor 213 for rotation and the revolution motor 24 for revolution to align the rotation position of the mounting table 211.

[0080] After the rotation of the placement table 211 stops, as shown in FIGS. 1 and 4, the control unit 90 controls the lower operation unit 50 to raise the plunger 51. As a result, the plunger 51 moves in the space inside the side wall body 113 and contacts the lower end surface 32 of the lift pin 31 protruding from the lower surface of the heater support portion 152. Further, the control unit 90 raises the lift pin 31 by pushing up the plunger 51 while reducing the lower coil spring 38. At this time, the lift pin 31 is guided by the arrangement hole 43a of the support bracket 43 and rises while inclining so that the upper end portion faces the rotation shaft 23.

[0081] FIG. 6 is a partial cross-sectional view showing the operation when the lift pin 31 in FIG. 1 is rising, (a) shows the state after the start of rising, and (b) shows the state moved to the rising position HP. As shown in FIG. 6(a), when the control unit raises and lowers the lift pin 31, it operates the gas supply unit 45 to supply an inert gas from the gas source 46 to the storage unit 41. The inert gas flows through the gas passage 111a in the vacuum container 11 and then flows out into the arrangement hole 43a through the gas communication hole 43b of the support bracket 43. Due to this inert gas, the sliding effect of the lift pin 31 is enhanced, so that the generation of particles can be suppressed and the lift pin 31 can move up and down stably.

[0082] The inert gas flowing out into the arrangement hole 43a flows along the spiral groove 37 of the lift pin 31. When the flange body 351 of the lift pin 31 floats from the support bracket 43, the inert gas flows into the storage space 42a through the groove 37. As a result, it is possible to avoid the process gas remaining above the placement table 211 from flowing into the rotation source storage space 19 through the storage space 42a. As a result, the lift pin mechanism portion 30 can suppress the corrosion of the configuration on the lower side than the upper lift portion 40. Further, since the inert gas flows into the space above the heating unit 15 and the space below the heating unit 15 via the storage unit 41, the entire inside of the vacuum container 11 is maintained at the same pressure. For this reason, the film forming apparatus 1 can suppress the movement of gas due to uneven pressure and prevent the scattering of particles.

[0083] FIG. 7 is a schematic diagram showing an example of the lifting of the substrate W by the lift pins 31 in FIG. 1. (a) shows the state before the lift pins 31 contact the substrate W, (b) shows the initial stage of the lifting of the substrate W by the lift pins 31, and (c) shows the state where the lift pins 31 have reached the lifting position HP. As shown in FIG. 7, each lift pin 31 continues to rise even after contacting the substrate W, so that the substrate W can be lifted from the mounting table 211 and delivered to the transfer arm 14a. The lift pin 31 can separate the substrate W from the outer peripheral edge of the rotary table 21 by rising obliquely toward the rotation axis 23. That is, the substrate W placed on the mounting table 211 may move toward the outer peripheral edge of the rotary table 21 due to centrifugal force when the rotary table 21 rotates. If the substrate W is lifted in the vertical direction in a state where it has moved toward the outer peripheral edge of the rotary table 21, there is a possibility that the substrate W and the outer peripheral edge may rub against each other and particles may be generated.

[0084] The lift pin mechanism portion 30 according to the present embodiment can lift the substrate W while separating it from the outer peripheral edge by inclining and lifting each lift pin 31, and can suppress the generation of particles. For example, each lift pin 31 inclined at an inclination angle θ of 1° to 5° with respect to the vertical direction can move the substrate W toward the rotation axis 23 in a range of about 0.5 mm to 3 mm along the horizontal direction from the position where it contacts the substrate W until it moves to the lifting position HP.

[0085] Further, when the substrate W is placed on the mounting table 211, the lift pin mechanism portion 30 can avoid the substrate W from descending while contacting the outer peripheral edge of the rotary table 21 by lowering the lift pins 31 obliquely, and can suppress the generation of particles. Note that the film forming apparatus 1 is not limited to a configuration in which the substrate W is placed in a space formed by the upper surface of the mounting table 211 and the inner peripheral surface of the rotary table 21, and the mounting table 211 itself may be provided with a recess (not shown) capable of accommodating the substrate W. Even in this case, the lift pin mechanism portion 30 can avoid rubbing between the inner peripheral surface of the recess and the substrate W by inclining and lifting the lift pins 31 toward the rotation axis 23.

[0086] Note that the film forming apparatus 1 according to the present embodiment is not limited to the above embodiment and can take various modifications. For example, the lift pin 31 may be provided with a flange body 351 near the lower end surface 32 in contact with the plunger 51 without the flange body 351 at the axial intermediate position. Also, for example, the upper lift portion 40 may be configured to accommodate the entire lift pin 31 in the accommodating portion 41 and cause the plunger 51 to enter the accommodating portion 41 to lift and lower the lift pin 31. Further, the lift pin mechanism portion 30 may be configured to directly lift and lower each lift pin 31 by a drive portion (not shown) provided in the heater support portion 152 without passing through the plunger 51.

[0087] The technical idea and effects of the present disclosure described in the above embodiments will be described below.

[0088] The substrate processing apparatus (film forming apparatus 1) according to the first aspect of the present invention includes a processing container (vacuum container 11) that processes a substrate W with a processing gas, a rotary table 21 rotatably provided in the processing container, a mounting table 211 that is rotatable relative to the rotary table 21 at a position separated from the rotation center of the rotary table 21 and on which the substrate W is placed, a lift pin 31 that is displaced relative to the mounting table 211 to lift and lower the substrate W, and an accommodating portion 41 that accommodates the lift pin 31 that is not exposed from the mounting table 211. The lift pin 31 and the accommodating portion 41 have a closing structure 44 that closes the gap between the lift pin 31 and the accommodating portion 41.

[0089] According to the above, since the substrate processing apparatus (film forming apparatus 1) closes the gap between the lift pin 31 and the accommodating portion 41 by the closing structure 44, when processing the substrate W with the processing gas, it is possible to prevent the processing gas on the mounting side of the substrate W from flowing downward from the accommodating portion 41 through the gap. As a result, the substrate processing apparatus can appropriately adjust the pressure in the processing container (vacuum container 11) and can perform the processing of the substrate W more stably.

[0090] Further, the blocking structure 44 includes a flange body 351 that protrudes radially outward from the outer peripheral surface of the lift pin 31, and a flange seat portion 432 that is provided around the arrangement hole 43a in which the lift pin 31 is arranged in the accommodation portion 41 and has an end surface 432a that can be in surface contact with the lower surface 351a of the flange body 351. With this flange body 351 and flange seat portion 432, the blocking structure 44 can more reliably block the movement of the processing gas.

[0091] Further, the arrangement hole 43a guides the lifting of the lift pin 31 while being inclined with respect to the vertical direction so as to face the rotation center of the rotary table 21. Thereby, the substrate processing apparatus (film forming apparatus 1) can avoid hitting and rubbing against the outer peripheral edge of the rotary table 21 when the lift pin 31 moves up and down, and can suppress the generation of particles.

[0092] Further, the lower surface 351a of the flange body 351 and the end surface 432a of the flange seat portion 432 are inclined with respect to the horizontal plane according to the inclination of the lift pin 31. Thereby, the substrate processing apparatus (film forming apparatus 1) can bring the flange body 351 and the flange seat portion 432 into good surface contact even when the lift pin 31 is inclined by the arrangement hole 43a.

[0093] Further, when the lift pin 31 moves up and down, it has a gas supply portion 45 that supplies gas to the arrangement hole 43a. Thereby, the substrate processing apparatus (film forming apparatus 1) obtains a sliding effect by the gas supplied around the lift pin 31, and the lifting and lowering of the lift pin 31 becomes more stable.

[0094] Further, a groove 37 through which gas can flow is formed on the outer peripheral surface of the lift pin 31 below the flange body 351. Thereby, when the lift pin 31 moves up and down, gas flows above the flange seat portion 432, and it is possible to prevent the remaining processing gas from flowing below the accommodation portion 41. Therefore, it is possible to suppress the corrosion of the components below the accommodation portion 41 by the processing gas.

[0095] Further, the lift pin 31 includes a flange body 351 at an axial intermediate position. Thereby, the substrate processing apparatus (film forming apparatus 1) can block the processing gas at the axial intermediate position of the lift pin 31.

[0096] Further, it has an elastic member (upper coil spring 39) having a lower end that contacts the upper surface of the flange body 351, and a cylindrical member 48 that is supported at the upper end of the elastic member and can contact the mounting table 211 as the lift pin 31 rises. Thereby, the substrate processing apparatus (film forming apparatus 1) can further suppress the inflow of the processing gas into the accommodating portion 41 by bringing the cylindrical member 48 into contact with the mounting table 211 when the lift pin 31 rises.

[0097] Further, it has a plunger 51 that is configured as a separate member from the lift pin 31 and can push out the lift pin 31 upward, and a plunger drive unit 53 that moves the plunger 51 up and down. Thereby, the substrate processing apparatus (film forming apparatus 1) can smoothly raise the lift pin 31 as the plunger 51 is pushed out.

[0098] Further, the processing container (vacuum container 11) has a rotation source (rotation motor 213) that rotates the mounting table 211, and a rotation accommodating portion 223 that accommodates the rotation source and rotates integrally with the rotation table 21. The processing container (vacuum container 11) has a rotation source accommodating space 19 for accommodating these components. The plunger 51 and the plunger drive unit 53 are provided below the rotation accommodating portion 223, and the plunger 51 is raised through the rotation source accommodating space 19 to bring the plunger 51 into contact with the lift pin 31. Thereby, the substrate processing apparatus (film forming apparatus 1) can stably rotate the rotation source and the rotation accommodating portion 223 integrally with the rotation table 21. Moreover, when the lift pin 31 moves up and down, the plunger 51 advances to the lift pin 31, enabling the lift pin 31 to operate properly.

[0099] The substrate processing apparatus according to the embodiments disclosed this time is illustrative in all respects and not restrictive. The embodiments can be modified and improved in various forms without departing from the scope and gist of the appended claims. The matters described in the above-mentioned multiple embodiments can adopt other configurations within a non-conflicting range and can also be combined within a non-conflicting range.

Explanation of Reference Numerals

[0100] 1 Film forming apparatus (substrate processing apparatus) 11 Vacuum chamber (processing chamber) 21 Rotating table 211 Mounting table 213 Rotation motor 223 Rotation housing part 31 Lift pin 351 Flange body 37 Groove 39 Upper coil spring 41 Housing part 432 Seat part for flange 43a Arrangement hole 44 Closing structure 45 Gas supply part 48 Cylindrical member 51 Plunger 53 Plunger drive part W Substrate

Claims

1. A processing container for processing a substrate with a processing gas, A rotating table rotatably provided in the processing container, A mounting table that is rotatable relative to the rotating table at a position separated from the center of rotation of the rotating table and on which a substrate is mounted, A lift pin that is displaced relative to the mounting table to raise and lower the substrate, An accommodating portion that accommodates the lift pin that is not exposed from the mounting table, and includes: The lift pin and the accommodating portion have a closing structure that closes a gap between the lift pin and the accommodating portion, The closing structure is: A flange body protruding radially outward from the outer peripheral surface of the lift pin, A flange seat portion provided around an arrangement hole in the accommodating portion where the lift pin is arranged and having an end surface that can be in surface contact with the lower surface of the flange body, The arrangement hole guides the lifting and lowering of the lift pin while being inclined with respect to the vertical direction so as to face the center of rotation of the rotating table, A substrate processing apparatus.

2. The lower surface of the flange body and the end surface of the flange seat portion are inclined with respect to the horizontal plane according to the inclination of the lift pin, The substrate processing apparatus according to claim 1.

3. Having a gas supply portion that supplies gas to the arrangement hole when the lift pin moves up and down, The substrate processing apparatus according to claim 1 or 2.

4. A groove through which the gas can flow is formed on the outer peripheral surface of the lift pin below the flange body, The substrate processing apparatus according to claim 3.

5. A processing container for processing a substrate with a processing gas, A rotating table rotatably provided in the processing container, A mounting table that is rotatable relative to the rotating table at a position separated from the center of rotation of the rotating table and on which a substrate is mounted, A lift pin that is displaced relative to the mounting table to raise and lower the substrate, An accommodating portion that accommodates the lift pin that is not exposed from the mounting table, and includes: The lift pin and the accommodating portion have a closing structure that closes a gap between the lift pin and the accommodating portion, The closing structure is: A flange body protruding radially outward from the outer peripheral surface of the lift pin, A flange seat portion provided around an arrangement hole in the accommodating portion where the lift pin is arranged and having an end surface that can be in surface contact with the lower surface of the flange body, Having a gas supply portion that supplies gas to the arrangement hole when the lift pin moves up and down, On the outer peripheral surface of the lift pin below the flange body, a groove through which the gas can flow is formed. Substrate processing apparatus. **Claim 6** The lift pin includes the flange body at an intermediate position in the axial direction. The substrate processing apparatus according to any one of claims 1 to 5. **Claim 7** An elastic member having a lower end that contacts the upper surface of the flange body, and a cylindrical member supported at the upper end of the elastic member and capable of contacting the mounting table as the lift pin ascends. The substrate processing apparatus according to claim 6. **Claim 8** A plunger configured as a separate member from the lift pin and capable of pushing the lift pin upward, and a plunger drive unit for raising and lowering the plunger. The substrate processing apparatus according to any one of claims 1 to 7. **Claim 9** The processing container has a rotation source accommodation space that houses a rotation source for rotating the mounting table and a rotation accommodation unit that houses the rotation source and rotates integrally with the rotation table. The plunger and the plunger drive unit are provided below the rotation accommodation unit, and the plunger is raised through the rotation source accommodation space to bring the plunger into contact with the lift pin. The substrate processing apparatus according to claim 8.

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