Substrate transport device and substrate transport method

Abstract

To provide a substrate transport device capable of suppressing positional displacement of a substrate by more surely holding the substrate, and a substrate transport method.SOLUTION: A substrate transport device comprises a substrate holding part configured to hold a substrate. The substrate holding part includes: first and second suction holes provided so as to be opened on a mounting surface; first and second projections respectively disposed inside of the first and second suction holes; and first and second support portions respectively provided in the vicinity of the first and second suction holes so as to protrude upward from the mounting surface. The first projection is configured to close the first suction hole in a state where the substrate is not held, while protruding upward from the first suction hole by being energized upward by a first elastic member. The second projection is configured to close the second suction hole in a state where the substrate is not held, while protruding upward from the second suction hole by being energized upward by a second elastic member.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a substrate transport apparatus and a substrate transport method. [Background technology]

[0002] Patent Documents 1 and 2 disclose a substrate processing system including a processing module configured to process substrates such as semiconductor wafers, a carrier configured to accommodate the substrates, and a substrate transfer device configured to be movable between the processing module and the carrier. The substrate transfer device, for example, holds the substrate taken out of the carrier with a transfer arm and transfers the substrate to the processing module or the carrier. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-224657 [Patent Document 2] Japanese Patent Application Laid-Open No. 2012-199282 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure describes a substrate transfer device and a substrate transfer method that can more reliably hold a substrate and prevent the substrate from shifting in position. [Means for solving the problem]

[0005] An example of a substrate transport device includes a substrate holder configured to hold a substrate and a base to which the substrate holder is attached so as to be horizontally movable. The substrate holder includes a mounting surface that faces the back surface of the substrate when the substrate is held thereon, first and second suction holes that open into the mounting surface, a suction channel connected to the first and second suction holes, a first protrusion disposed within the first suction hole, a second protrusion disposed within the second suction hole, a first support portion disposed near the first suction hole so as to protrude upward from the mounting surface, and a second support portion disposed near the second suction hole so as to protrude upward from the mounting surface. The first protrusion is configured to protrude upward from the first suction hole and block the first suction hole when no substrate is held thereon by being biased upward by a first elastic member. The second protrusion is configured to be biased upward by the second elastic member, thereby protruding upward from the second suction hole and blocking the second suction hole when no substrate is held thereon. [Effects of the Invention]

[0006] According to the substrate transfer device and substrate transfer method disclosed herein, it is possible to hold the substrate more reliably and prevent the substrate from shifting out of position. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view schematically illustrating an example of a substrate processing system. [Figure 2] FIG. 2 is a perspective view showing an example of a shelf unit and a carrier. [Figure 3] FIG. 3 is a perspective view showing an example of a substrate transport device. [Figure 4] FIG. 4 is a side view showing an example of a substrate transport device. [Figure 5] FIG. 5 is a perspective view showing an example of a transfer arm. [Figure 6] FIG. 6 is a cross-sectional view partially illustrating an example of a transfer arm. [Figure 7]FIG. 7 is a partial cross-sectional view of the transfer arm of FIG. 7 in a state where a substrate is being held. [Figure 8] FIG. 8 is a diagram for explaining a method for receiving and delivering a substrate at the first advanced position. [Figure 9] FIG. 9 is a diagram for explaining a method for receiving and delivering a substrate at the second advanced position. [Figure 10] FIG. 10 is a cross-sectional view partially showing another example of the transfer arm. [Figure 11] FIG. 11 is a partial cross-sectional view of the transfer arm of FIG. 10 in a state where a substrate is being held. [Figure 12] FIG. 12 is a cross-sectional view partially showing another example of the transfer arm. [Figure 13] FIG. 13 is a side view showing another example of the transfer arm. [Figure 14] FIG. 14 is a side view showing another example of the transfer arm. DETAILED DESCRIPTION OF THE INVENTION

[0008] In the following description, the same elements or elements having the same functions will be designated by the same reference numerals, and redundant explanations will be omitted. Note that in this specification, when referring to the top, bottom, right, and left of a figure, the directions of the reference numerals in the figure will be used as the reference.

[0009] [Substrate processing system] 1 and 2, a substrate processing system 1 configured to process a substrate W will be described. The substrate processing system 1 includes a loading / unloading station 2, a processing station 3, and a controller Ctr (controller). The loading / unloading station 2 and the processing station 3 may be aligned in a horizontal line, for example.

[0010] The substrate W may be disk-shaped or may be a non-circular plate-shaped such as a polygon. The substrate W may have a cutout portion cut out of a portion. The cutout portion may be, for example, a notch (a U-shaped, V-shaped groove, or the like) or a linear portion extending linearly (so-called orientation flat). The substrate W may be, for example, a semiconductor substrate (silicon wafer), a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or any other type of substrate. The diameter of the substrate W may be, for example, approximately 200 mm to 450 mm.

[0011] The loading / unloading station 2 includes a mounting section 4, a loading / unloading section 5, and a shelf unit 6. The mounting section 4 includes a plurality of mounting tables (not shown) lined up in the width direction (the vertical direction in FIG. 1). Each mounting table is configured to be able to mount a carrier 7 (storage container). The carrier 7 is configured to accommodate at least one substrate W in a sealed state. As illustrated in FIG. 2, the carrier 7 includes a pair of side walls 7b on which a plurality of support pieces 7a protruding inward are provided. Each of the plurality of support pieces 7a extends horizontally and is configured to support the peripheral edge of the substrate W from the back side of the substrate W. The carrier 7 includes an opening / closing door (not shown) for loading and unloading the substrate W.

[0012] The loading / unloading section 5 is disposed adjacent to the mounting section 4 in the direction in which the loading / unloading stations 2 and the processing stations 3 are lined up (the left-right direction in FIG. 1). The loading / unloading section 5 includes an opening / closing door (not shown) provided in correspondence with the mounting section 4. When the carrier 7 is placed on the mounting section 4, the opening / closing door of the carrier 7 and the opening / closing door of the loading / unloading section 5 are both opened, thereby connecting the interior of the carrier 7 to the interior of the loading / unloading section 5.

[0013] The loading / unloading section 5 incorporates a substrate transport device A1 and a shelf unit 6. The substrate transport device A1 is configured to remove a substrate W from a carrier 7 and transfer it to the shelf unit 6, and also to receive a substrate W from the shelf unit 6 and return it to the carrier 7. The shelf unit 6 is located near the processing station 3 and is configured to mediate the transfer of the substrate W between the loading / unloading section 5 and the processing station 3. The shelf unit 6 is configured to accommodate at least one substrate W. The shelf unit 6 may be configured similarly to the carrier 7. That is, as illustrated in FIG. 2, the shelf unit 6 may include a pair of side walls 6b on which a plurality of support pieces 6a protruding inward are provided. Each of the plurality of support pieces 6a may extend horizontally and be configured to support the peripheral edge of the substrate W from the back surface of the substrate W.

[0014] The processing station 3 includes a transport section 8 and a plurality of processing units 9. The transport section 8 extends horizontally, for example, in the direction in which the loading / unloading station 2 and the processing station 3 are lined up (the left-right direction in FIG. 1). The transport section 8 has a built-in substrate transport device A2. The substrate transport device A2 is configured to be able to move horizontally in the longitudinal direction of the transport section 8 (the left-right direction in FIG. 1), move up and down in the vertical direction, and rotate about a vertical axis. The substrate transport device A2 is configured to take out a substrate W from the shelf unit 6 and pass it to each processing unit 9, and to receive a substrate W from each processing unit 9 and return it to the shelf unit 6. The configuration of the substrate transport device A2 may be similar to that of the substrate transport device A1.

[0015] The processing units 9 are arranged on both sides of the transport section 8 so as to be aligned in a row along the longitudinal direction (left-right direction in FIG. 1) of the transport section 8. The processing units 9 are configured to perform predetermined processing on the substrates W (for example, cleaning processing of the substrates W, etching processing of a film formed on the surface of the substrates W, etc.).

[0016] The controller Ctr is configured to partially or entirely control the substrate processing system 1. The controller Ctr may read a program from a computer-readable recording medium, generate signals for operating each part of the substrate processing system 1 (such as the substrate transport devices A1 and A2 and the processing unit 9) in accordance with the program, and send the signals to each part. The recording medium may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk.

[0017] [Substrate transport device] Next, the configuration of the substrate transfer apparatus A1 will be described in more detail with reference to Figures 3 to 7. As illustrated in Figures 3 and 4, the substrate transfer apparatus A1 includes a base 10, a substrate holder 20, and multiple detectors SE. The base 10 is configured to be capable of horizontal movement in the width direction of the loading / unloading section 5 (the vertical direction in Figure 1), vertical movement in the vertical direction, and rotation around a vertical axis.

[0018] The substrate holding unit 20 is configured to hold one or more substrates W. When holding multiple substrates W, the substrate holding unit 20 is configured to hold the multiple substrates W in multiple stages in the vertical direction. The substrate holding unit 20 includes, for example, one or more movement mechanisms 21, one or more transfer arms 22, one or more valves V, and a suction pump P.

[0019] 3, the one or more moving mechanisms 21 include two moving mechanisms 21a and 21b. The moving mechanisms 21a and 21b are attached to the base 10. The moving mechanisms 21a and 21b operate independently based on signals from the controller Ctr and are configured to move horizontally along the longitudinal direction of the base 10. The moving mechanism 21a may be located above the moving mechanism 21b.

[0020] 3, the one or more transfer arms 22 include five transfer arms 22a to 22e. Transfer arm 22a is attached to moving mechanism 21a. Transfer arms 22b to 22e are attached to moving mechanism 21b so that they are lined up vertically from top to bottom in this order. Therefore, when moving mechanisms 21a and 21b move horizontally relative to the base 10 at the same time, the five transfer arms 22a to 22e also move horizontally at the same time. When only moving mechanism 21a moves horizontally relative to the base 10, transfer arm 22a moves horizontally, but transfer arms 22b to 22e do not move. When only moving mechanism 21b moves horizontally relative to the base 10, transfer arms 22b to 22e move horizontally, but transfer arm 22a does not move.

[0021] The transport arm 22 may be plate-shaped, as exemplified in FIGS. 3 to 5. The transport arm 22 may be made of, for example, a ceramic material. The transport arm 22 includes a base portion 23 and a pair of arm portions 24 and 25. The base portion 23 is rectangular and is attached to the moving mechanism 21. The pair of arm portions 24 and 25 extend from the base portion 23, branching into two. An upper surface S of the transport arm 22 is configured to face the back surface of the substrate W when the substrate W is held by the substrate holder 20. That is, the upper surface S of the transport arm 22 functions as a mounting surface on which the substrate W is placed.

[0022] A plurality of suction holes 26 are formed in the upper surface S of the transfer arm 22. In the example of FIGS. 3, 5, and 6, four suction holes 26a to 26d are formed that open in the upper surface S of the transfer arm 22. Suction hole 26a (first suction hole) is located at the tip of the arm portion 24. Suction hole 26b (second suction hole) is located in a region of the base portion 23 closer to the base end of the arm portion 24. Suction hole 26c (first suction hole) is located at the tip of the arm portion 25. Suction hole 26d (second suction hole) is located in a region of the base portion 23 closer to the base end of the arm portion 25.

[0023] A plurality of suction sections 30 are formed on the upper surface S of the transfer arm 22. In the example of FIGS. 3 to 6, four suction sections 30a to 30d are formed on the upper surface S of the transfer arm 22. The suction section 30a is attached to the suction hole 26a so as to cover it. The suction section 30b is attached to the suction hole 26b so as to cover it. The suction section 30c is attached to the suction hole 26c so as to cover it. The suction section 30d is attached to the suction hole 26d so as to cover it.

[0024] A plurality of support portions 40 are formed on the upper surface S of the transport arm 22. The support portions 40 are configured to support the substrate W by having their upper ends abut against the rear surface of the substrate W. The height positions of the upper ends of the support portions 40 are set to be higher than the suction portion 30. The support portions 40 may be, for example, protrusions extending along the width direction of the transport arm 22. The support portions 40 may be made of, for example, rubber.

[0025] In the example of FIGS. 3 to 5, four support portions 40a to 40d are formed on the upper surface S of the transfer arm 22. The support portion 40a (first support portion) is located closer to the tip end of the arm portion 24 than the suction portion 30a and in the vicinity of the suction portion 30a. The support portion 40b (second support portion) is located in a region of the base portion 23 closer to the base end of the arm portion 24 than the suction portion 30b and in the vicinity of the suction portion 30b. The support portion 40c (first support portion) is located closer to the tip end of the arm portion 25 than the suction portion 30c and in the vicinity of the suction portion 30c. The support portion 40d (second support portion) is located in a region of the base portion 23 closer to the base end of the arm portion 25 than the suction portion 30d and in the vicinity of the suction portion 30d.

[0026] A plurality of regulating pins 50 are formed on the upper surface S of the transport arm 22. The regulating pins 50 are configured to regulate the positional deviation of the substrate W held by the substrate holding part 20. In other words, even if the substrate W held by the substrate holding part 20 is misaligned, the substrate W abuts against the side surface of the regulating pins 50, preventing the substrate W from moving beyond the regulating pins 50. The height position of the upper end of the regulating pins 50 is set to be higher than the support part 40. The height position of the upper end of the regulating pins 50 may be, for example, 1.5 times or more the height of the support part 40. The regulating pins 50 may have, for example, a cylindrical shape. The regulating pins 50 may be made of, for example, rubber.

[0027] 3 to 5, two restriction pins 50a, 50b are formed on the upper surface S of the transfer arm 22. The restriction pin 50a is located in an area of the base portion 23 closer to the base end of the base portion 23 (closer to the moving mechanism 21) than the support portion 40b. The restriction pin 50b is located in an area of the base portion 23 closer to the base end of the base portion 23 (closer to the moving mechanism 21) than the support portion 40d.

[0028] A suction flow path F is formed inside the transfer arm 22, fluidly and physically connecting the plurality of suction holes 26. In the example of FIGS. 4 and 5, the suction flow path F is composed of five flow paths F1 to F5. Flow path F1 connects suction hole 26a with suction hole 26b. Flow path F2 connects suction hole 26c with suction hole 26d. Flow path F3 extends through the base portion 23 and is fluidly connected to the valve V and the suction pump P. Flow path F4 connects flow path F1 with flow path F3. Flow path F5 connects flow path F2 with flow path F3.

[0029] As illustrated in FIG. 4, the suction flow path F of the transfer arm 22a is connected to a pipe D1. A valve V (hereinafter referred to as "valve V1") is disposed in the pipe D1. The suction flow paths F of the transfer arms 22b to 22e merge into one pipe D2. A valve V (hereinafter referred to as "valve V2") is disposed in the pipe D2. The pipes D1 and D2 merge into a pipe D3. A suction pump P is disposed in the pipe D3. Therefore, when the suction pump P operates based on a signal from the controller Ctr with the valve V1 open and the valve V2 closed, a suction force is generated in each suction hole 26 of the transfer arm 22a, but no suction force is generated in each suction hole 26 of the transfer arms 22b to 22e. When the suction pump P operates based on a signal from the controller Ctr with the valve V1 closed and the valve V2 open, no suction force is generated in the suction holes 26 of the transfer arm 22a, but suction force is generated in the suction holes 26 of the transfer arms 22b to 22e. When the suction pump P operates based on a signal from the controller Ctr with the valves V1 and V2 open, suction force is generated in the suction holes 26 of the transfer arms 22a to 22e. When the suction pump P operates based on a signal from the controller Ctr with the valves V1 and V2 closed, no suction force is generated in the suction holes 26 of the transfer arms 22a to 22e.

[0030] Here, a more detailed configuration of the suction unit 30 will be described with reference to Figures 6 and 7. Figure 6 illustrates suction units 30a and 30c, but the other suction units 30b and 30d have the same configuration.

[0031] The suction unit 30 is disposed in the suction hole 26 so as to cover the suction hole 26. The suction unit 30 includes a fixing member 31, a sealing member 32 (first sealing member, second sealing member), a protrusion 33 (first protrusion, second protrusion), and an elastic member 34 (first elastic member, second elastic member).

[0032] The fixing member 31 is configured to fix the suction unit 30 to the upper surface S of the transfer arm 22. The fixing member 31 is a plate-like annular member with a through hole 31a formed in the center. The fixing member 31 is arranged relative to the suction hole 26 so that the through hole 31a and the suction hole 26 are in communication with each other. The fixing member 31 may have, for example, a circular ring shape. The fixing member 31 is fixed to the transfer arm 22 by a fastener such as a screw (not shown).

[0033] The sealing member 32 is configured to be elastically deformable and may be made of, for example, rubber. The sealing member 32 includes a main body portion 32a, an expanded diameter portion 32b, and a flange portion 32c. The main body portion 32a is tubular and is inserted into the through-hole 31a. The main body portion 32a may be cylindrical, for example.

[0034] The expanded diameter portion 32b is connected to the upper end of the main body portion 32a. The expanded diameter portion 32b is configured to expand (increase in diameter) as it extends upward. That is, the expanded diameter portion 32b protrudes upward beyond the upper surface S of the transport arm 22. When the substrate W is placed on the suction part 30, the expanded diameter portion 32b elastically deforms and comes into contact with the back surface of the substrate W (see FIG. 7).

[0035] The flange portion 32c has an annular shape, and its inner peripheral edge is connected to the lower end of the main body portion 32a. The flange portion 32c may have, for example, a circular annular shape. The flange portion 32c extends so as to expand radially outward from the main body portion 32a, and is engaged with the rear surface of the fixing member 31. Specifically, the inner peripheral edge of the fixing member 31 (around the through hole 31a) is clamped between the expanded diameter portion 32b and the flange portion 32c, thereby attaching the sealing member 32 to the through hole 31a of the fixing member 31. That is, the sealing member 32 is also arranged to correspond to the suction hole 26, just like the fixing member 31.

[0036] The protrusion 33 includes a main body 33a (first main body, second main body), a ceiling 33b, a flange 33c (first flange, second flange), and annular protrusions 33d (first annular protrusion, second annular protrusion). The main body 33a has a tubular shape and is inserted into the through-hole 31a and the suction hole 26. The main body 33a may have, for example, a cylindrical shape.

[0037] The ceiling portion 33b is plate-shaped and is provided at the upper end of the main body portion 33a so as to close the opening on the upper end side of the main body portion 33a. In other words, the main body portion 33a and the ceiling portion 33b form a cylindrical body with a bottom.

[0038] The flange portion 33c has an annular shape, and its inner peripheral edge is connected to the lower end of the main body portion 33a. The flange portion 33c may have, for example, a circular annular shape. The flange portion 33c extends radially outward from the main body portion 33a. The outer diameter of the flange portion 33c is set to be larger than the inner diameter of the main body portion 32a of the sealing member 32 and smaller than the outer diameter of the flange portion 32c of the sealing member 32.

[0039] The annular protrusion 33d is provided on the outer peripheral edge of the flange portion 33c and extends around the entire circumference of the outer peripheral edge. The annular protrusion 33d protrudes upward toward the upper end side of the main body portion 33a (toward the ceiling portion 33b).

[0040] The elastic member 34 is disposed within the main body 33a. The upper end of the elastic member 34 abuts against the ceiling 33b, and the lower end of the elastic member 34 abuts against the bottom wall of the suction hole 26 (suction flow path F). The elastic member 34 is configured to bias the protrusion 33 upward.

[0041] The elastic member 34 biases the protrusion 33 upward, causing the protrusion 33 to protrude upward from the suction hole 26. More specifically, the elastic member 34 biases the protrusion 33 upward, so that the height position of the upper end of the protrusion 33 is higher than the height position of the upper end of the flange portion 32c when no substrate is placed on the protrusion 33 (see FIG. 6).

[0042] The elastic member 34 biases the protrusion 33 upward, so that the tip of the annular protrusion 33d abuts against and is pressed against the lower surface of the flange portion 32c of the sealing member 32 when no substrate is placed on the protrusion 33 (see FIG. 6). Therefore, when no substrate is placed on the protrusion 33, the suction hole 26 is blocked by the protrusion 33.

[0043] On the other hand, when the substrate W is placed on the protrusion 33, the weight of the substrate W and the suction force generated by the suction pump P press the protrusion 33 downward against the biasing force of the elastic member 34. At this time, the tip of the annular protrusion 33d moves away from the lower surface of the flange portion 32c of the sealing member 32, the suction flow path F communicates with the outside (the space SP surrounded by the back surface of the substrate W and the expanded diameter portion 32b) through the suction hole 26, and the space SP is depressurized through the gap between the annular protrusion 33d and the flange portion 32c (see the arrow in FIG. 7).

[0044] The multiple detectors SE may include, for example, detectors SE1 to SE5 configured to detect whether or not a substrate W is placed on the transport arms 22a to 22e (see FIG. 4). The detectors SE1 to SE5 may be disposed, for example, on the sides of the transport arms 22a to 22e, respectively. The multiple detectors SE may include, for example, detector SE6 configured to detect whether or not a substrate W placed on any of the transport arms 22 is shifted forward beyond a predetermined range (see FIG. 3). The detector SE6 may be disposed, for example, near the tip of the transport arm 22.

[0045] The detection unit SE is not particularly limited as long as it can detect the presence of the substrate W, and may be, for example, a photoelectric sensor, a camera, or the like. The detection unit SE exemplified in FIGS. 3 and 4 is a photoelectric sensor. The photoelectric sensor may be configured, for example, by a light projector / receiver including a light receiving unit and a light projecting unit that irradiates light toward the light receiving unit. When the substrate W is located between the light receiving unit and the light projecting unit, the light receiving unit cannot receive light from the light projecting unit, and the presence of the substrate W is detected. The detection unit SE may output a detection signal indicating that the presence of the substrate W has been detected to the controller Ctr.

[0046] [Board transport method] A method of transferring and transporting a substrate W using the substrate transfer device A1 configured as above will be described below. The transfer and transport of the substrate W by the transfer arm 22a will be described below, but the transfer and transport of the substrate W by the other transfer arms 22b to 22d is similar, so the description thereof will be omitted.

[0047] First, referring to Fig. 8 as an example, a method for transporting a substrate W that has not been processed in a processing unit 9 from the carrier 7 to the shelf unit 6 by the transport arm 22a will be described. First, with the transport arm 22 in the retracted position retracted into the base 10 (see Figs. 3 and 4), the controller Ctr instructs the substrate transport device A1 to move so that the substrate transport device A1 is positioned in front of the carrier 7.

[0048] Next, in a state where the controller Ctr does not receive a detection signal from the detector SE1 (a state where no substrate W is present on the transport arm 22a), the controller Ctr instructs the moving mechanism 21a to advance the transport arm 22a forward relative to the base 10 so that the transport arm 22a is positioned at the first advanced position (see FIG. 8(a)). This causes the transport arm 22a to be inserted into the carrier 7. At this time, as viewed from above, the substrate W overlaps with the suction units 30a-30d and the supports 40b, 40d, but does not overlap with the supports 40a, 40c and the restriction pins 50a, 50b. In this state, the controller Ctr instructs the suction pump P and the valve V1 to open the valve V1 and operate the suction pump P. This generates a suction force in each suction hole 26 of the transport arm 22a. Before advancing the transport arm 22a forward, a sensor (not shown) or the like may be used to confirm that no substrate W is present on the transport arm 22a.

[0049] Next, the controller Ctr instructs the moving mechanism 21a to raise the transport arm 22a. As a result, the unprocessed substrate W, which has been supported in the carrier 7 by the multiple support pieces 7a, is transferred to the transport arm 22a. Specifically, as shown in FIG. 8(b), the unprocessed substrate W is placed on the suction units 30a and 30c and the support units 40b and 40d. As a result, the unprocessed substrate W presses down the protrusions 33 of the suction units 30a and 30c against the biasing force of the elastic member 34, and the space SP (see FIG. 7) communicates with the suction flow path F, creating a negative pressure. Therefore, the unprocessed substrate W is sucked by the suction units 30a and 30c through the suction holes 26. The unprocessed substrate W is placed on the suction units 30a and 30c and the support units 40b and 40d, which are at different heights, and is therefore tilted. Therefore, the unprocessed substrate W does not come into contact with the suction parts 30b and 30d located near the support parts 40b and 40d. That is, since the protrusions 33 of the suction parts 30b and 30d are not pressed down, no empty suction occurs at the suction parts 30b and 30d.

[0050] Next, the controller Ctr instructs the moving mechanism 21a to move the transport arm 22 to the retracted position. Next, in a state where the controller Ctr has not received a detection signal from the detector SE6 (a state where the substrate W on the transport arm 22a has not shifted forward more than a predetermined range), the controller Ctr instructs the substrate transport device A1 to move the substrate transport device A1 so that the substrate transport device A1 is positioned in front of the shelf unit 6.

[0051] Next, in a state where the controller Ctr receives a detection signal from the detector SE1 (a state where the substrate W is present on the transport arm 22a), the controller Ctr instructs the moving mechanism 21a to advance the transport arm 22a forward relative to the base 10 so that the transport arm 22a is positioned at the first advanced position. As a result, the transport arm 22a is inserted into the shelf unit 6.

[0052] Next, the controller Ctr instructs the suction pump P and the valve V1 to close the valve V1 and stop the suction pump P. As a result, the suction force in each suction hole 26 of the transport arm 22a disappears. In this state, the controller Ctr instructs the moving mechanism 21a to lower the transport arm 22a. As a result, the unprocessed substrate W on the transport arm 22a is transferred to the support piece 6a of the shelf unit 6. Thereafter, the controller Ctr instructs the moving mechanism 21a to move the transport arm 22 to the retracted position. As a result, the unprocessed substrate W is transported from the carrier 7 to the shelf unit 6. Note that when the transport arm 22 moves to the retracted position, the controller Ctr may also instruct the suction pump P and the valve V1 to operate the suction pump P while opening the valve V1, thereby generating a suction force in each suction hole 26 of the transport arm 22a. In this case, even if an unprocessed substrate W is left on the transport arm 22a, the unprocessed substrate W is adsorbed by the suction sections 30a, 30c through the suction holes 26, thereby preventing the unprocessed substrate W from falling from the transport arm 22a.

[0053] Next, referring to Figure 9 as an example, a method for transporting the substrate W processed in the processing unit 9 from the shelf unit 6 to the carrier 7 by the transport arm 22a will be described. First, with the transport arm 22 in a retracted position retracted into the base 10 (see Figures 3 and 4), the controller Ctr instructs the substrate transport device A1 to move so that the substrate transport device A1 is positioned in front of the shelf unit 6.

[0054] Next, in a state where the controller Ctr has not received a detection signal from the detector SE1 (a state where the substrate W is not present on the transport arm 22a), the controller Ctr instructs the moving mechanism 21a to advance the transport arm 22a forward relative to the base 10 so that the transport arm 22a is positioned at a second advanced position different from the first advanced position (see FIG. 9(a)). This causes the transport arm 22a to be inserted into the shelf unit 6. At this time, when viewed from above, the substrate W overlaps with the suction portions 30a to 30d and the supports 40a and 40c, but does not overlap with the supports 40b and 40d and the restriction pins 50a and 50b. In this state, the controller Ctr instructs the suction pump P and the valve V1 to operate the suction pump P while opening the valve V1. This generates a suction force in each suction hole 26 of the transport arm 22a. Before the transport arm 22a is advanced forward, it may be confirmed by using a sensor (not shown) or the like that the substrate W is not present on the transport arm 22a.

[0055] Next, the controller Ctr instructs the moving mechanism 21a to raise the transport arm 22a. As a result, the processed substrate W, which has been supported in the shelf unit 6 by the multiple support pieces 6a, is transferred to the transport arm 22a. Specifically, as shown in FIG. 9(b), the processed substrate W is placed on the suction units 30b and 30d and the support units 40a and 40c. As a result, the processed substrate W presses down the protrusions 33 of the suction units 30b and 30d against the biasing force of the elastic member 34, and the space SP (see FIG. 7) communicates with the suction flow path F, creating a negative pressure. Therefore, the processed substrate W is sucked by the suction units 30b and 30d through the suction holes 26. The processed substrate W is placed on the suction units 30b and 30d and the support units 40a and 40c, which are at different heights, and is therefore tilted. Therefore, the processed substrate W does not come into contact with the suction parts 30a and 30c located near the supports 40a and 40c. That is, since the protrusions 33 of the suction parts 30a and 30c are not pressed down, no empty suction occurs at the suction parts 30a and 30c.

[0056] Next, the controller Ctr instructs the moving mechanism 21a to move the transport arm 22 to the retracted position. Next, in a state where the controller Ctr has not received a detection signal from the detector SE6 (a state where the substrate W on the transport arm 22a has not shifted forward beyond a predetermined range), the controller Ctr instructs the substrate transport device A1 to move the substrate transport device A1 so that the substrate transport device A1 is positioned in front of the carrier 7.

[0057] Next, in a state where the controller Ctr receives a detection signal from the detector SE1 (a state where the substrate W is present on the transport arm 22a), the controller Ctr instructs the moving mechanism 21a to advance the transport arm 22a forward relative to the base 10 so that the transport arm 22a is positioned at the second advanced position. As a result, the transport arm 22a is inserted into the carrier 7.

[0058] Next, the controller Ctr instructs the suction pump P and the valve V1 to close the valve V1 and stop the suction pump P. As a result, the suction force in each suction hole 26 of the transport arm 22a disappears. In this state, the controller Ctr instructs the moving mechanism 21a to lower the transport arm 22a. As a result, the processed substrate W on the transport arm 22a is transferred to the support piece 6a of the carrier 7. Thereafter, the controller Ctr instructs the moving mechanism 21a to move the transport arm 22 to the retracted position. As a result, the processed substrate W is transported from the shelf unit 6 to the carrier 7. Note that when the transport arm 22 moves to the retracted position, the controller Ctr may also instruct the suction pump P and the valve V1 to operate the suction pump P while opening the valve V1, thereby generating a suction force in each suction hole 26 of the transport arm 22a. In this case, even if a processed substrate W is left on the transport arm 22a, the processed substrate W is adsorbed by the suction sections 30a, 30c through the suction holes 26, thereby preventing the processed substrate W from falling from the transport arm 22a.

[0059] [Effect] According to the above example, the substrate W is held by the substrate holding part 20 (transport arm 22) by suctioning it through the suction holes 26. Therefore, the substrate W is held more securely by the substrate holding part 20 compared to when the substrate W is simply placed on support pins or the like. This makes it possible to suppress misalignment of the substrate W with respect to the substrate holding part 20. In addition, because the substrate W can be held more securely, the movement speed of the substrate holding part 20 when transporting the substrate W can be set high. This makes it possible to improve productivity.

[0060] According to the above example, the unprocessed substrate W is held by the suction units 30a, 30c and the support units 40b, 40d. In this case, the protrusions 33 biased upward by the elastic members 34 block the suction holes 26 in the suction units 30b, 30d, preventing empty suction at the suction holes 26. This increases the suction force of the suction units 30a, 30c on the substrate W via the suction holes 26. On the other hand, the processed substrate W is held by the suction units 30b, 30d and the support units 40a, 40c. In this case, the protrusions 33 biased upward by the elastic members 34 block the suction holes 26 in the suction units 30a, 30c, preventing empty suction at the suction holes 26. This increases the suction force of the suction units 30b, 30d on the substrate W via the suction holes 26. Furthermore, the suction portions 30a, 30c (protrusions 33) and support portions 40b, 40d that come into contact with the unprocessed substrate W are separated from the suction portions 30b, 30d (protrusions 33) and support portions 40a, 40c that come into contact with the processed substrate W. In other words, the protrusions 33 and support portions 40b, 40d of the suction portions 30a, 30c that have been contaminated by contact with the unprocessed substrate W do not come into contact with the processed substrate W. Therefore, it is possible to increase the suction force for the substrate W before and after processing while maintaining the cleanliness of the processed substrate W.

[0061] According to the above example, the height position of the upper end of the support unit 40 can be set higher than the height position of the upper end of the protrusion 33 of the suction unit 30. In this case, the substrate W held by the suction units 30a, 30c and the support units 40b, 40d is less likely to come into contact with the suction units 30b, 30d. Similarly, the substrate W held by the suction units 30b, 30d and the support units 40a, 40c is less likely to come into contact with the suction units 30a, 30c. This makes it possible to more reliably maintain the cleanliness of the substrate W.

[0062] According to the above example, whether the substrate W is supported by the suction units 30a, 30c and the supports 40b, 40d, or by the suction units 30b, 30d and the supports 40a, 40c, is determined depending on the position of the substrate holding unit 20 (transport arm 22) advanced from the base 10. Therefore, by a simple method of controlling the position of the substrate holding unit 20 (transport arm 22), it is possible to determine whether the substrate W is supported by the suction units 30a, 30c and the supports 40b, 40d, or by the suction units 30b, 30d and the supports 40a, 40c.

[0063] According to the above example, when the substrate W is placed on the protrusion 33, the sealing member 32 abuts against the back surface of the substrate W, and therefore, as the suction pump P operates, the space SP surrounded by the back surface of the substrate W and the expanded diameter portion 32b is depressurized through the suction holes 26. Moreover, since the sealing member 32 is elastically deformable, it deforms in accordance with the attitude of the substrate W, thereby suppressing empty suction and effectively depressurizing the space SP. This makes it possible to further increase the suction force of the substrate W through the suction holes 26.

[0064] According to the above example, when the protrusion 33 is urged upward by the elastic member 34, the flange 33c engages with the lower surface of the flange 32c of the sealing member 32. That is, the flange 32c functions as a stopper that prevents the protrusion 33 from slipping out of the sealing member 32, and also functions as a sealing member that more reliably closes the suction hole 26. Therefore, unintentional empty suction from the suction hole 26 is further suppressed, and it is possible to further increase the suction force of the substrate W via the suction hole 26.

[0065] According to the above example, when the protrusion 33 is urged upward by the elastic member 34, the upper end of the annular protrusion 33d abuts against and is pressed against the lower surface of the flange 32c of the sealing member 32. Therefore, the contact area between the annular protrusion 33d and the lower surface of the flange 32c becomes relatively small, and a greater pressure is applied from the annular protrusion 33d to the flange 32c. Therefore, the annular protrusion 33d functions as a sealing member that more reliably closes the suction hole 26. As a result, unintentional empty suction from the suction hole 26 is further suppressed, and the suction force of the substrate W via the suction hole 26 can be further increased.

[0066] According to the above example, the substrate holder 20 includes a plurality of transfer arms 22a to 22e, so that a single substrate holder 20 can simultaneously hold and transfer a plurality of substrates W.

[0067] [Variations] The disclosure in this specification should be considered to be illustrative in all respects and not restrictive. Various omissions, substitutions, modifications, etc. may be made to the above examples without departing from the scope and spirit of the claims.

[0068] (1) As illustrated in FIG. 10 , small holes 33e (first small hole, second small hole) may be provided in the protrusion 33. The small holes 33e may be formed, for example, to penetrate the ceiling portion 33b. Furthermore, the elastic member 34 may bias the protrusion 33 upward, so that the height position of the upper end of the protrusion 33 is lower than the height position of the upper end of the flange portion 32c when no substrate is placed on the protrusion 33. In this case, when a substrate W is placed on the protrusion 33 and the suction pump P is operated, the expanded diameter portion 32b elastically deforms due to the weight of the substrate W and comes into contact with the back surface of the substrate W. The pressure in the space SP surrounded by the back surface of the substrate W and the expanded diameter portion 32b is reduced through the small holes 33e (see the arrow in FIG. 11 ). Therefore, almost no suction force acts on the protrusion 33, and the protrusion 33 moves little or not at all downward due to the biasing force of the elastic member 34.

[0069] 10, for example, when receiving the substrate W at the first advanced position, the substrate W is placed on the suction portions 30a, 30c and the support portions 40b, 40d, but does not come into contact with the suction portions 30b, 30d. At this time, small holes 33e are formed in the protrusions 33 of the suction portions 30b, 30d, so that slight dry suction occurs, but this does not have enough effect to significantly reduce the suction force of the suction portions 30a, 30c on the substrate W. Therefore, the example of FIG. 10 also provides the same effect as the example described above.

[0070] 10, when transferring the substrate W at the first advanced position, if the suction pump P is stopped, the pressure naturally escapes to the suction flow path F from the small holes 33e of the protrusions 33 of the suction units 30b and 30d. As a result, the pressure in the space SP surrounded by the back surface of the substrate W and the expanded diameter unit 32b naturally approaches atmospheric pressure. Therefore, after the suction of the substrate W stops, the substrate W can be easily removed from the substrate holder 20.

[0071] The diameter of the small holes 33e may be, for example, approximately 0.3 mm to 0.5 mm. If the diameter of the small holes 33e is 0.3 mm or more, foreign matter is less likely to become clogged in the small holes 33e. If the diameter of the small holes 33e is 0.5 mm or less, the influence of empty suction generated by the small holes 33e is reduced, and the substrate W can be more reliably sucked through the suction holes 26.

[0072] (2) As illustrated in FIG. 12 , the suction unit 30 may include a sealing member 35 instead of the fixing member 31 and the sealing member 32. The sealing member 35 is an annular member configured to be elastically deformable. The sealing member 35 may be made of rubber. The sealing member 35 may be, for example, an O-ring. The sealing member 35 may be directly attached to the upper surface S of the transfer arm 22. The diameter of the suction hole 26 may be set to be larger than the outer diameter of the main body portion 33 a and smaller than the outer diameter of the flange portion 33 c. In this case, the elastic member 34 biases the protrusion 33 upward, so that the tip of the annular protrusion 33 d abuts and is pressed against the lower surface of the periphery of the suction hole 26 when no substrate is placed on the protrusion 33.

[0073] (3) Additional regulating pins may be provided on the upper surface S of the transfer arm 22. Specifically, regulating pins may be provided in a region of the arm portion 24 closer to the tip than the support portion 40a, and in a region of the arm portion 25 closer to the tip than the support portion 40c. These additional regulating pins may be configured separately from the support portion 40. Alternatively, as illustrated in FIG. 13, they may be provided integrally with the support portions 40a and 40c. In this case, the additional regulating pins may be provided on the tip sides of the support portions 40a and 40c so as to protrude upward beyond the support portions 40a and 40c.

[0074] (4) As shown in Figure 14, the suction flow path Fa connected to each suction hole 26 of the suction units 30a and 30c and the suction flow path Fb connected to each suction hole 26 of the suction units 30b and 30d may be independent. The suction flow path Fa may be connected to a pipe D1, and a valve V1 may be provided on the pipe D1. The suction flow path Fb may be connected to a pipe D4, and a valve V3 may be provided on the pipe D4. In this case, the generation of suction force at the suction units 30a and 30c and the generation of suction force at the suction units 30b and 30d can be controlled independently. This further suppresses empty suction at the suction unit 30 where no substrate W is placed, thereby further increasing the suction force for the substrate W via the suction holes 26.

[0075] (5) Although not shown, an elastically deformable member (such as an O-ring) may be interposed between the suction unit 30 and the transport arm 22, thereby allowing the suction unit 30 to tilt with respect to the transport arm 22 while maintaining airtightness. In this case, when the suction unit 30 sucks the substrate W in an oblique position, the suction unit 30 tilts along the angle of the substrate W, thereby further increasing the suction force of the substrate W via the suction holes 26.

[0076] [Other examples] Example 1. An example of a substrate transport device includes a substrate holder configured to hold a substrate and a base to which the substrate holder is attached so as to be horizontally movable. The substrate holder includes a mounting surface that faces the back surface of the substrate when the substrate is held thereon, first and second suction holes that open into the mounting surface, a suction channel connected to the first and second suction holes, a first protrusion disposed within the first suction hole, a second protrusion disposed within the second suction hole, a first support portion disposed near the first suction hole so as to protrude upward from the mounting surface, and a second support portion disposed near the second suction hole so as to protrude upward from the mounting surface. The first protrusion is configured to protrude upward from the first suction hole and block the first suction hole when no substrate is held thereon by being biased upward by a first elastic member. The second protrusion is biased upward by the second elastic member, protruding upward from the second suction hole and blocking the second suction hole when no substrate is held therein. In this case, the substrate is held by the substrate holder by suction through the first or second suction hole. Therefore, the substrate is more securely held by the substrate holder than when the substrate is simply placed on support pins or the like. This makes it possible to suppress displacement of the substrate relative to the substrate holder. Furthermore, since the substrate can be held more securely, the movement speed of the substrate holder during substrate transport can be set higher. This improves productivity. Furthermore, according to the apparatus of Example 1, for example, the first protrusion and the second support member can hold the unprocessed substrate, and the second protrusion and the first support member can hold the processed substrate. When the unprocessed substrate is held by the first protrusion and the second support member, the second protrusion biased upward by the second elastic member blocks the second suction hole, preventing empty suction at the second suction hole. Therefore, the force of suction of the substrate through the first suction hole is increased. On the other hand, when the processed substrate is held by the second protrusion and the first support, the first protrusion, which is urged upward by the first elastic member, blocks the first suction hole, preventing empty suction at the first suction hole. Therefore, the force of suction of the substrate through the second suction hole is increased.Furthermore, the protrusions and support parts that come into contact with the substrate before processing are separated from the protrusions and support parts that come into contact with the substrate after processing. That is, the first protrusions and second support parts that become contaminated by contact with the substrate before processing do not come into contact with the substrate after processing. Therefore, it is possible to increase the suction force of the substrate before and after processing while maintaining the cleanliness of the substrate after processing.

[0077] Example 2: In the apparatus of Example 1, the height positions of the respective upper ends of the first support portion and the second support portion may be higher than the height positions of the respective upper ends of the first protrusion portion and the second protrusion portion. In this case, for example, when a substrate is held by the first protrusion portion and the second support portion, the substrate is less likely to come into contact with the second protrusion portion. Similarly, when a substrate is held by the second protrusion portion and the first support portion, the substrate is less likely to come into contact with the first protrusion portion. Therefore, it is possible to more reliably maintain the cleanliness of the substrate.

[0078] Example 3. The apparatus of Example 1 or Example 2 may further include a control unit, and the control unit may be configured to execute a process of moving the substrate holding unit relative to the base between a retracted position where the substrate holding unit is retracted into the base, a first advanced position where the substrate holding unit advances from the base and substrate transfer is performed, where the substrate is sucked by the first suction hole and supported by the second support, and a second advanced position where the substrate holding unit advances from the base and substrate transfer is performed, where the substrate is sucked by the second suction hole and supported by the first support. In this case, whether the substrate is supported by the first protrusions and second support, or the second protrusions and first support, is determined depending on the advanced position of the substrate holding unit from the base. Therefore, by simply controlling the position of the substrate holding unit, it is possible to determine whether the substrate is supported by the first protrusions and second support, or the second protrusions and first support.

[0079] Example 4: In any of the devices of Examples 1 to 3, the substrate holder may further include an elastically deformable annular first sealing member disposed corresponding to the first suction hole and protruding upward from the mounting surface, and an elastically deformable annular second sealing member disposed corresponding to the second suction hole and protruding upward from the mounting surface. In this case, when the first or second sealing member abuts against the rear surface of the substrate, the space enclosed by the rear surface of the substrate and the first or second sealing member is depressurized via the first or second suction hole. Moreover, because the first and second sealing members are elastically deformable, they deform in response to the substrate's position, suppressing vacuum and effectively depressurizing the space. This makes it possible to further increase the suction force of the substrate via the first or second suction hole.

[0080] Example 5. Another example of a substrate transport device includes a substrate holder configured to hold a substrate and a base to which the substrate holder is attached so as to be horizontally movable. The substrate holder includes a mounting surface that faces the back surface of the substrate when the substrate is held thereon, first and second suction holes that open into the mounting surface, a suction flow path connected to the first and second suction holes, a first protrusion disposed within the first suction hole, a second protrusion disposed within the second suction hole, a first elastically deformable sealing member disposed in the first suction hole and protruding from the mounting surface, and a second elastically deformable sealing member disposed in the second suction hole and protruding from the mounting surface. The first protrusion is configured to protrude upward from the first suction hole when no substrate is held thereon by being biased upward by the first elastic member, thereby blocking the first suction hole. The second protrusion is biased upward by the second elastic member, protruding upward from the second suction hole and blocking the second suction hole when no substrate is held therein. In this case, the substrate is held by the substrate holder by suction through the first or second suction hole. Therefore, the substrate is more securely held by the substrate holder than when the substrate is simply placed on support pins or the like. This makes it possible to prevent the substrate from shifting relative to the substrate holder. Furthermore, since the substrate can be held more securely, the movement speed of the substrate holder during substrate transport can be set higher. This improves productivity. Furthermore, according to the apparatus of Example 5, when the first or second sealing member abuts against the back surface of the substrate, the space enclosed by the back surface of the substrate and the first or second sealing member is depressurized through the first or second suction hole. Moreover, since the first and second sealing members are elastically deformable, they deform in response to the substrate's position, preventing vacuuming and effectively reducing the pressure in the space. Therefore, it is possible to further increase the force of suction of the substrate via the first or second suction hole.

[0081] Example 6. The apparatus of Example 5 may further include a control unit, and the control unit may be configured to execute a process of moving the substrate holder relative to the base between a retracted position where the substrate holder is retracted into the base, a first advanced position where the substrate holder advances from the base to transfer a substrate, where the substrate is sucked by the first suction hole but not by the second suction hole, and a second advanced position where the substrate holder advances from the base to transfer a substrate, where the substrate is sucked by the second suction hole but not by the first suction hole. In this case, whether the substrate is attracted to the first suction hole or the second suction hole is determined depending on the advanced position of the substrate holder from the base. Therefore, it is possible to determine whether the substrate is attracted to the first suction hole or the second suction hole by simply controlling the position of the substrate holder.

[0082] Example 7: In any of the devices of Examples 4 to 6, the first protrusion may include a columnar first main body portion inserted through the first suction hole and the first sealing member, and a first flange portion provided at the lower end of the first main body portion so as to extend radially outward from the first main body portion and having an outer diameter larger than the inner diameter of the first sealing member. The second protrusion may include a columnar second main body portion inserted through the second suction hole and the second sealing member, and a second flange portion provided at the lower end of the second main body portion so as to extend radially outward from the second main body portion and having an outer diameter larger than the inner diameter of the second sealing member. In this case, when the first protrusion is urged upward by the first elastic member, the first flange portion engages with the first sealing member. That is, the first flange portion functions as a stopper that prevents the first protrusion from slipping out of the first sealing member and also functions as a sealing member that more reliably blocks the first suction hole. The second flange portion functions in the same way. Therefore, unintentional vacuuming from the first and second suction holes is further suppressed, and the suction force of the substrate via the first or second suction hole can be further increased.

[0083] Example 8: In the device of Example 7, the outer peripheral edge of the first flange may be provided with a first annular protrusion protruding toward the upper end of the first main body, the upper end of which abuts against the lower surface of the first sealing member when no substrate is held thereon, and the outer peripheral edge of the second flange may be provided with a second annular protrusion protruding toward the upper end of the second main body, the upper end of which abuts against the lower surface of the second sealing member when no substrate is held thereon. In this case, the contact area between the first annular protrusion and the lower surface of the first sealing member is smaller than when the first flange is not provided with the first annular protrusion and the second flange abuts against the lower surface of the first sealing member. Therefore, the first annular protrusion abuts against the lower surface of the first sealing member with greater pressure. Therefore, the first annular protrusion functions as a sealing member that more reliably closes the first suction hole. The second annular protrusion functions similarly. As a result, unintentional empty suction from the first and second suction holes is further suppressed, and the suction force for the substrate via the first or second suction hole can be further increased.

[0084] Example 9 In any of the apparatuses of Examples 1 to 8, the substrate holder may be configured to be able to hold multiple substrates simultaneously. In this case, multiple substrates can be transported simultaneously by one substrate holder.

[0085] Example 10: In any of the devices of Examples 1 to 9, the first protrusion may be provided with a first small hole that fluidly connects the suction flow path to the outside, and the second protrusion may be provided with a second small hole that fluidly connects the suction flow path to the outside. In this case, when suction of the substrate via the first and second suction holes stops, the negative pressure generated in the space between the substrate and the first or second suction hole naturally escapes through the first or second small hole. Therefore, after suction of the substrate stops, the substrate can be easily removed from the substrate holder.

[0086] Example 11. An example of a substrate transport method is a method of transporting a substrate using the apparatus of any of Examples 1 to 10, including a first step of advancing the substrate holding unit relative to the base so that the substrate holding unit is located at a first advanced position, a second step of receiving the substrate at the first advanced position after the first step so that the substrate is sucked by the first suction hole but not by the second suction hole, a third step of transporting the substrate to a processing unit and processing the substrate in the processing unit after the second step, a fourth step of advancing the substrate holding unit relative to the base so that the substrate holding unit is located at the second advanced position after the second step, and a fifth step of receiving the processed substrate at the second advanced position so that the substrate is sucked by the second suction hole but not by the first suction hole. In this case, the same effects as those of Example 1 or Example 5 can be obtained. In this case, whether the substrate is attracted through the first suction hole or the second suction hole is determined depending on the position of the substrate holder from the base, so that it is possible to determine whether the substrate is attracted through the first suction hole or the second suction hole by simply controlling the position of the substrate holder. [Explanation of symbols]

[0087] 1...substrate processing system, 10...base, 20...substrate holder, 21...movement mechanism, 22...transport arm, 26...suction hole, 26a, 26c...suction hole (first suction hole), 26b, 26d...suction hole (second suction hole), 30...suction unit, 32, 35...sealing member (first sealing member, second sealing member), 33...protrusion (first protrusion, second protrusion), 33a...main body (first main body, second main body), 33c...flange unit (first flange portion, second flange portion), 33d...annular protrusion (first annular protrusion, second annular protrusion), 33e...small hole (first small hole, second small hole), 34...elastic member (first elastic member, second elastic member), 40...support portion, 40a, 40c...support portion (first support portion), 40b, 40d...support portion (second support portion), A1...substrate transport device, Ctr...controller (control unit), S...upper surface (mounting surface), W...substrate.

Claims

1. a substrate holder configured to hold a substrate; a base to which the substrate holder is attached so as to be horizontally movable; a control unit; The substrate holder includes: a mounting surface that faces the back surface of the substrate when the substrate is held; a first suction hole and a second suction hole provided so as to open to the mounting surface; a suction flow path connected to the first suction hole and the second suction hole; a first protrusion disposed within the first suction hole; a second protrusion disposed within the second suction hole; a first support portion provided so as to protrude upward from the mounting surface; a second support portion provided so as to protrude upward from the mounting surface, the first protrusion is configured to be biased upward by a first elastic member, thereby protruding upward from the first suction hole and blocking the first suction hole when the substrate is not held thereon; the second protrusion is configured to be biased upward by a second elastic member, thereby protruding upward from the second suction hole and blocking the second suction hole when the substrate is not held thereon; when the substrate is placed on a first holding position of the substrate holding portion, the substrate is held by the first protrusion and the second support portion, but is not held by the second protrusion and the first support portion; when the substrate is placed at a second holding position of the substrate holding unit that is different from the first holding position, the substrate is held by the second protrusion and the first support unit, but is not held by the first protrusion and the second support unit; A substrate transport device, wherein the height positions of the respective upper ends of the first support portion and the second support portion are higher than the height positions of the respective upper ends of the first protrusion portion and the second protrusion portion.

2. a substrate holder configured to hold a substrate; a base to which the substrate holder is attached so as to be horizontally movable; a control unit; The substrate holder includes: a mounting surface that faces the back surface of the substrate when the substrate is held; a first suction hole and a second suction hole provided so as to open to the mounting surface; a suction flow path connected to the first suction hole and the second suction hole; a first protrusion disposed within the first suction hole; a second protrusion disposed within the second suction hole; a first support portion provided so as to protrude upward from the mounting surface; a second support portion provided so as to protrude upward from the mounting surface, the first protrusion is configured to be biased upward by a first elastic member, thereby protruding upward from the first suction hole and blocking the first suction hole when the substrate is not held thereon; the second protrusion is configured to be biased upward by a second elastic member, thereby protruding upward from the second suction hole and blocking the second suction hole when the substrate is not held thereon; The control unit a retracted position in which the substrate holder is retracted into the base; a first advanced position where the substrate holding portion advances from the base portion to transfer the substrate, and the substrate is sucked by the first suction hole and supported by the second support portion; a second advanced position where the substrate holding unit advances from the base and transfers the substrate, and the substrate is sucked by the second suction hole and supported by the first support unit; and a process of moving the substrate holding unit relative to the base between the second advanced position and the second advanced position where the substrate holding unit advances from the base and transfers the substrate, and the substrate is sucked by the second suction hole and supported by the first support unit; the first support portion is located on the side of the first suction hole in the advancing direction of the substrate holding portion, The substrate transport device, wherein the second support portion is located on the side of the second suction hole in the retraction direction of the substrate holding portion.

3. The device according to claim 2 , wherein the height positions of the upper ends of the first support portion and the second support portion are higher than the height positions of the upper ends of the first protrusion portion and the second protrusion portion.

4. The substrate holder includes: an elastically deformable annular first sealing member disposed in correspondence with the first suction hole and protruding upward from the placement surface; The device according to any one of claims 1 to 3, further comprising: an elastically deformable annular second sealing member arranged corresponding to the second suction hole and protruding upward from the placement surface.

5. a substrate holder configured to hold a substrate; a base to which the substrate holder is attached so as to be horizontally movable; a control unit; The substrate holder includes: a mounting surface that faces the back surface of the substrate when the substrate is held; a first suction hole and a second suction hole provided so as to open to the mounting surface; a suction flow path connected to the first suction hole and the second suction hole; a first protrusion disposed within the first suction hole; a second protrusion disposed within the second suction hole; an elastically deformable first sealing member disposed in the first suction hole and protruding from the mounting surface; an elastically deformable second sealing member disposed in the second suction hole and protruding from the mounting surface; the first protrusion is configured to be biased upward by a first elastic member, thereby protruding upward from the first suction hole and blocking the first suction hole when the substrate is not held thereon; the second protrusion is configured to be biased upward by a second elastic member, thereby protruding upward from the second suction hole and blocking the second suction hole when the substrate is not held thereon; The control unit a retracted position in which the substrate holder is retracted into the base; a first advanced position where the substrate holder advances from the base to transfer the substrate, and where the substrate is sucked by the first suction hole but not by the second suction hole; A substrate transport device configured to perform a process of moving the substrate holding unit relative to the base between a first advanced position where the substrate holding unit advances from the base and the substrate is transferred, and a second advanced position where the substrate is sucked by the second suction hole but not by the first suction hole.

6. The first protrusion includes: a columnar first main body portion inserted through the first suction hole and the first sealing member; a first flange portion provided at a lower end of the first main body portion so as to extend radially outward from the first main body portion, the first flange portion having an outer diameter larger than an inner diameter of the first sealing member; The second protrusion includes: a columnar second main body portion inserted through the second suction hole and the second sealing member; 6. The device according to claim 4 or 5, further comprising: a second flange portion provided at a lower end of the second body portion so as to extend radially outward from the second body portion, the second flange portion having an outer diameter larger than an inner diameter of the second sealing member.

7. a first annular protrusion is provided on an outer peripheral edge of the first flange portion, the first annular protrusion protruding toward an upper end of the first main body portion; an upper end of the first annular protrusion abuts against a lower surface of the first sealing member when the substrate is not held thereon; a second annular protrusion is provided on an outer peripheral edge of the second flange portion, the second annular protrusion protruding toward an upper end of the second main body portion; The device according to claim 6 , wherein an upper end of the second annular protrusion abuts against a lower surface of the second sealing member when the substrate is not held thereon.

8. The apparatus according to any one of claims 1 to 7, wherein the substrate holder is configured to be able to hold a plurality of substrates simultaneously.

9. a first small hole that fluidly connects the suction channel to the outside is provided in the first protrusion; The device according to any one of claims 1 to 8, wherein the second protrusion is provided with a second small hole that fluidly connects the suction channel to the outside.

10. A method for transporting a substrate using the apparatus according to any one of claims 1 to 9, comprising the steps of: a first step of advancing the substrate holding portion relative to the base portion so that the substrate holding portion is located at a first advanced position; a second step of receiving the substrate at the first advanced position after the first step such that the substrate is sucked by the first suction hole and is not sucked by the second suction hole; a third step of transporting the substrate to a processing unit and processing the substrate in the processing unit after the second step; a fourth step of advancing the substrate holding portion relative to the base portion after the second step so that the substrate holding portion is located at a second advanced position; a fifth step of receiving the processed substrate at the second advance position after the fourth step so that the substrate is sucked in the second suction hole and not sucked in the first suction hole.

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