Component mounting system and component mounting method

Abstract

To provide a component mounting system capable of achieving an increase in productivity.SOLUTION: A component mounting system 100 includes: a tape feeder 5 which feeds a plurality of components P stored in a carrier tape 15; a component mounting device M which sucks one component P disposed in a component suction position by being fed by the tape feeder 5 and mounts the component P on a substrate 3; a number acquisition section 65 which, when a seam where a carrier tape 15 and a carrier tape 15A are joined is detected, acquires a remaining number which is the number of components P that are stored between the seam and the component suction position in the carrier tape 15; and a suction number determination section 66 which determines a suction number based on the remaining number acquired by the number acquisition section 65, the suction number being the number of the components P that are continuously sucked by the component mounting device M and held together.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting system that mounts components on a substrate. [Background technology]

[0002] The head of the component mounting device picks up components supplied from the tape feeder, moves to the board, and mounts the components on the board. The tape feeder pulls out a carrier tape wound on a reel from the reel and supplies the components stored on the carrier tape to the component mounting device. Specifically, the tape feeder supplies multiple components to the component mounting device by repeatedly feeding the carrier tape at a certain pitch.

[0003] When the carrier tape is pulled out by the tape feeder and the number of components stored on the carrier tape decreases, the leading edge of a new carrier tape is spliced to the trailing edge of the carrier tape. In other words, the carrier tape is spliced. This splicing is also called tape splicing.

[0004] When splicing a carrier tape, a carrier tape transfer occurs. During this transfer, the carrier tape from which components are picked up by suction is switched from the existing carrier tape to a new carrier tape. When this carrier tape transfer occurs, the transfer must be reflected in the trace information. The trace information is, for example, information that indicates the correspondence between each mounting point on the board and the component mounted at that mounting point or the carrier tape from which the component was picked up.

[0005] The electronic component mounting device of Patent Document 1 holds the trace information as component use history data, and when a carrier tape change occurs, the tape switching history information is reflected in the component use history data. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent No. 4458015 Publication Summary of the Invention [Problem to be solved by the invention]

[0007] However, the electronic component mounting apparatus of Patent Document 1 has a problem in that it is difficult to improve productivity.

[0008] Therefore, the present disclosure provides a component mounting system and the like that can improve productivity. [Means for solving the problem]

[0009] A component mounting system according to one embodiment of the present disclosure includes a tape feeder that supplies a plurality of components stored on a first carrier tape; a component mounting device that picks up components placed at a component suction position by the tape feeder and mounts them on a board; a number acquisition unit that, when a seam where the first carrier tape and a second carrier tape are joined is detected, acquires a remaining number that is the number of components stored on the first carrier tape between the seam and the component suction position; and an suction number determination unit that determines a suction number that is the number of components that are successively picked up and held together by the component mounting device based on the remaining number acquired by the number acquisition unit.

[0010] These comprehensive or specific aspects may be realized as a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM (Compact Disc Read-Only Memory), or may be realized as any combination of the system, the method, the integrated circuit, the computer program, and the recording medium. The recording medium may also be a non-transitory recording medium. [Effects of the Invention]

[0011] The component mounting system of the present disclosure can improve productivity.

[0012] Further advantages and effects of one aspect of the present disclosure will become apparent from the specification and drawings. Such advantages and / or effects are provided by some embodiments and features described in the specification and drawings, but not all of them necessarily need to be provided to obtain one or more identical features. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a plan view of a component mounting system according to an embodiment. [Figure 2] FIG. 2 is a diagram partially showing an example of a cross section taken along line II-II in FIG. [Figure 3] FIG. 3 is a diagram illustrating a tape feeder according to an embodiment. [Figure 4] FIG. 4 is a diagram showing an example of tape splicing according to the embodiment. [Figure 5] FIG. 5 is an enlarged view of the downstream portion of the tape feeder in the embodiment. [Figure 6] FIG. 6 is a diagram for explaining the timing of data switching in the embodiment. [Figure 7] FIG. 7 is a block diagram showing an example of the functional configuration of each of the tape feeder and the component mounting device according to the embodiment. [Figure 8] FIG. 8 is a diagram for explaining the suction of components by the head in the embodiment. [Figure 9] FIG. 9 is a sequence diagram showing an example of the processing operations of the tape feeder and the component mounting device according to the embodiment. [Figure 10] FIG. 10 is a flowchart showing an example of the processing operation of the tape feeder in the embodiment. [Figure 11] FIG. 11 is a flowchart showing an example of the processing operation of the component mounting apparatus according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0014] (Findings that formed the basis of this disclosure) The present inventors have found that the electronic component mounting device of Patent Document 1 described in the "Background Art" section has the following problems.

[0015] The electronic component mounting device of Patent Document 1 determines whether a seam in the carrier tape has been detected each time a component is mounted on a board. If a seam is detected, the electronic component mounting device creates tape switching history information indicating a change in carrier tape and reflects this information in the component usage history data.

[0016] Therefore, the electronic component mounting device of Patent Document 1 does not take into consideration the operation of a head successively picking up and holding multiple components supplied from a single tape feeder, and then moving the head to mount the components on a board. Therefore, the electronic component mounting device of Patent Document 1 cannot prioritize the pick-up speed of multiple components, making it difficult to improve productivity.

[0017] In order to solve such problems, a component mounting system according to one embodiment of the present disclosure includes: a tape feeder that supplies a plurality of components stored on a first carrier tape; a component mounting device that picks up components placed at a component suction position by the tape feeder and mounts them on a board; a number acquisition unit that, when a seam where the first carrier tape and a second carrier tape are joined is detected, acquires a remaining number that is the number of components stored on the first carrier tape between the seam and the component suction position; and an absorption number determination unit that determines an absorption number that is the number of components that are successively picked up and held together by the component mounting device based on the remaining number acquired by the number acquisition unit.

[0018] As a result, when a seam is detected, the remaining number of components on the first carrier tape is acquired, and the pickup number, which is the number of components to be continuously picked up and held together by the component mounting device, is determined based on the remaining number. Therefore, the pickup number can be limited to or less than the remaining number. As a result, carrier tape transfers can be prevented while multiple components are continuously picked up by the component mounting device. Note that carrier tape transfer refers to the transfer of the carrier tape used to mount components by the component mounting device, i.e., the carrier tape from which components are removed by pickup, from the first carrier tape to the second carrier tape. Therefore, the component mounting device and tape feeder do not need to monitor or manage carrier tape transfers while the pickup number of components is continuously picked up, and can increase the pickup speed of those components. As a result, the productivity of mounted boards produced by mounting multiple components on boards can be improved.

[0019] Furthermore, the component mounting system may further include a data switching unit that switches the carrier tape currently being used for mounting, as indicated in the tape management data stored in the memory unit, from the first carrier tape to the second carrier tape, when the number of components to be picked up determined by the number of components to be picked up by the component mounting device is equal to the remaining number and the number of components to be picked up has been picked up by the component mounting device.

[0020] As a result, when all components stored on the first carrier tape have been removed by the component mounting device, i.e., when the component mounting device has used up all the components on the first carrier tape, the carrier tape indicated in the tape management data is switched. In other words, data switching is executed. Therefore, the carrier tape indicated in this tape management data can be properly synchronized with the carrier tape currently being used for mounting. As a result, by using this tape management data, trace information can be properly generated that associates each mounting point on the board with the component mounted at that mounting point or the carrier tape from which the component was removed. In other words, accurate traceability can be ensured.

[0021] The component mounting device may also successively pick up and hold together the number of components supplied by the tape feeder, the number of components being determined by the number of components determining unit, and mount the number of components on the board.

[0022] This allows the determined number of components to be picked up to be mounted on the board in succession and quickly.

[0023] Furthermore, the number acquisition unit may further acquire a specified number of components to be picked up by the component mounting device per turn, and the pickup number determination unit may determine the pickup number per turn based on the remaining number and the specified number, and one turn may represent one processing operation in which a head of the component mounting device repeatedly performs processing operations including pickup, recognition, and mounting of one or more components while moving between the tape feeder and the board.

[0024] As a result, even if the specified number is greater than the remaining number, the number of objects to be picked up can be limited to be equal to or less than the remaining number.

[0025] Furthermore, when the specified number is greater than the remaining number, the adsorption number determination unit may determine the remaining number as the adsorption number.

[0026] As a result, if the specified number is greater than the remaining number, the number of pick-ups is limited to the remaining number, so the number of pick-ups is not reduced too much, and the occurrence of carrier tape transfer during one turn can be suppressed, thereby further improving productivity.

[0027] Furthermore, when the specified number is equal to or smaller than the remaining number, the adsorption number determination unit may determine the specified number as the adsorption number.

[0028] As a result, when the specified number is equal to or less than the remaining number, the specified number of components are continuously picked up and held together by the component mounting device without any restriction on the number of components that can be picked up. Therefore, component mounting work can be carried out in a planned manner.

[0029] The data switching unit may switch the carrier tape indicated in the tape management data while the component mounting device is recognizing and mounting the one or more components.

[0030] This allows data switching, which is switching of the carrier tape indicated in the tape management data, and component recognition and component mounting to be performed in parallel, thereby reducing the time required for one turn compared to when each process is performed in the order of data switching, component recognition, and component mounting, and further improving productivity.

[0031] The component mounting system may further include a remaining quantity determination unit that determines the remaining quantity, wherein the quantity acquisition unit obtains the remaining quantity determined by the remaining quantity determination unit, and the remaining quantity determination unit determines the remaining quantity in the turn following the one turn by subtracting the number of components supplied from the tape feeder in the one turn from the remaining quantity.

[0032] This allows the remaining number to be managed appropriately in each turn.

[0033] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0034] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, component placement and connection configurations, steps, and step order shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not described in the independent claims that represent the highest concepts are described as optional components.

[0035] In addition, each drawing is a schematic diagram and is not necessarily an exact illustration. In addition, the same components are denoted by the same reference numerals in each drawing.

[0036] (Embodiment) [Component Mounting System] FIG. 1 is a plan view of a component mounting system according to the present embodiment. That is, FIG. 1 shows the internal configuration of the component mounting system as viewed from above. In this disclosure, the vertical direction is referred to as the Z-axis direction or up-down direction, one direction on a plane perpendicular to the vertical direction is referred to as the Y-axis direction or depth direction, and a direction perpendicular to the Y-axis direction on that perpendicular plane is referred to as the X-axis direction, left-right direction, or lateral direction. In this disclosure, the positive side of the Z-axis direction is upward or up, and the negative side of the Z-axis direction is downward or down. In this disclosure, the positive side of the Y-axis direction is the depth side or back, and the negative side of the Y-axis direction is the front side or near side. In this disclosure, the positive side of the X-axis direction is the right side or right, and the negative side of the X-axis direction is the left side or left.

[0037] Component mounting system 100 in this embodiment includes component mounting apparatus M and two component supply units 4. Component mounting apparatus M includes base 1, board transport mechanism 2, Y-axis tables 6A and 6B, X-axis tables 7A and 7B, two heads 64, two board recognition cameras 9, two component recognition cameras 10, and two nozzle holders 11.

[0038] The base 1 is a platform on which the substrate transport mechanism 2, Y-axis tables 6A and 6B, X-axis tables 7A and 7B, two component recognition cameras 10, and two nozzle holders 11 are arranged.

[0039] The board transport mechanism 2 has two rails along the X-axis direction and is disposed in the center of the base 1 in the Y-axis direction. The board transport mechanism 2 transports the board 3 carried in from the upstream side (for example, the negative side in the X-axis direction), and positions and holds the board 3 on a mounting stage, which is a position for performing component mounting work.

[0040] The two component supply units 4 are arranged on either side of the board transport mechanism 2 in the Y-axis direction. In the component supply unit 4, multiple tape feeders 5 are arranged in parallel along the X-axis direction. The tape feeders 5, also referred to simply as feeders, supply components. Specifically, the tape feeders 5 supply components by pitch-feeding a carrier tape containing the components in the tape feed direction.

[0041] The Y-axis tables 6A and 6B are disposed on both ends in the X-axis direction (the left and right ends in the example shown in FIG. 1) on the upper surface of the base 1 so as to extend along the Y-axis direction.

[0042] X-axis tables 7A and 7B are mounted on Y-axis tables 6A and 6B along the X-axis so as to be movable in the Y-axis direction. For example, X-axis table 7A moves horizontally in the Y-axis direction by being driven by the drive mechanism of Y-axis table 6A, and X-axis table 7B moves horizontally in the Y-axis direction by being driven by the drive mechanism of Y-axis table 6B.

[0043] Head 64 is mounted on each of X-axis tables 7A and 7B so as to be movable in the X-axis direction. Therefore, head 64 moves in the X-axis and Y-axis directions by Y-axis tables 6A and 6B and X-axis tables 7A and 7B. Head 64 is detachably equipped with multiple nozzles that can pick up and hold components and move up and down. By moving in the X-axis and Y-axis directions, head 64 picks up components supplied from component supply unit 4 with the nozzles and mounts the components at mounting points on board 3 that has been positioned by board transport mechanism 2.

[0044] Each of the two board recognition cameras 9 is attached to a head 64 corresponding to that board recognition camera 9. The board recognition camera 9 moves together with the head 64 onto the board 3 positioned by the board transport mechanism 2, and captures an image of the board 3 in order to recognize the position, type, etc. of the board 3.

[0045] The two component recognition cameras 10 are disposed on the base 1 so as to sandwich the board transport mechanism 2 in the Y-axis direction. Each of the two component recognition cameras 10 captures an image of the component from the negative side in the Z-axis direction when the head 64 corresponding to that component recognition camera 10 moves over that component recognition camera 10 with the component picked up. Recognition processing is performed on the image obtained by this capture, and the position and type of the component picked up and held by the head 64 are identified.

[0046] The two nozzle holders 11, like the two component recognition cameras 10, are arranged on the base 1 so as to sandwich the board transport mechanism 2 in the Y-axis direction. These nozzle holders 11 are also called nozzle changers, and at least one nozzle is mounted on each nozzle holder 11. The at least one nozzle mounted on each nozzle holder 11 is used to replace the nozzle attached to the head 64.

[0047] FIG. 2 is a diagram partially showing an example of a cross section taken along line II-II in FIG.

[0048] As shown in FIG. 2, the component supply unit 4 includes a feeder base 4a, a plurality of tape feeders 5 attached to the feeder base 4a, and a carriage 12 supporting the feeder base 4a.

[0049] The carriage 12 is configured to be detachable from the base 1. The carriage 12 also has a plurality of reel holding units 13 for holding tape reels 14 on which carrier tape 15 is wound. The reel holding units 13 have holding rollers for rotatably holding the tape reels 14. The carrier tape 15 pulled out from the tape reels 14 held by the reel holding units 13 is attached to the tape feeder 5. As a result, when the tape feeder 5 performs pitch feeding of the carrier tape 15, the carrier tape 15 is sequentially pulled out from the tape reel 14 as the tape reel 14 rotates. Note that in this embodiment, the operation of the tape feeder 5 pulling out the carrier tape 15 from the tape reel 14 and feeding it downstream (for example, the positive side in the Y-axis direction) is also referred to as tape feeding. Tape feeding in which the carrier tape is fed downstream by a predetermined length is also referred to as pitch feeding. Pitch feeding is also referred to as feeding.

[0050] 2, a plurality of nozzles 64a are attached to the head 64 mounted on the X-axis table 7A or 7B. These nozzles 64a pick up components supplied from the tape feeder 5. The head 64 then moves above the board 3 with the nozzles 64a holding the components by suction, and lowers the nozzles 64a to mount the components held by the nozzles 64a onto the board 3. The components may be any electronic components that can be mounted on the board 3.

[0051] Fig. 3 is a diagram for explaining the tape feeder 5. Specifically, Fig. 3 shows the tape feeder 5, the feeder base 4a, and the nozzle 64a as viewed from the positive side in the X-axis direction.

[0052] As shown in Fig. 3, the tape feeder 5 includes a frame member 5a, a tape recovery unit 5c, an upper guide unit 18, a rotation drive mechanism 20, and a sprocket 21. The frame member 5a is attached to the feeder base 4a. The frame member 5a also has a tape running path 5b along which the carrier tape 15 runs. The carrier tape 15 pulled out from the tape reel 14 is introduced from the rear end of the frame member 5a (for example, the end on the negative side in the Y-axis direction) and fed downstream (for example, the positive side in the Y-axis direction) along the upper surface of the tape running path 5b.

[0053] The carrier tape 15 also has a base tape 16 and a top tape 17 attached to the upper surface of the base tape 16. A plurality of component pockets 16a are formed on the base tape 16 at a fixed pitch. Components P are housed in these component pockets 16a. The components P are, for example, chip-type electronic components. The upper surfaces of these component pockets 16a are covered with the top tape 17.

[0054] The rotation drive mechanism 20 drives the sprocket 21. The sprocket 21 is disposed above the downstream end of the frame member 5a. The sprocket 21 is rotated by the rotation drive mechanism 20, and feeds the carrier tape 15 downstream.

[0055] The upper guide portion 18 covers the upper surface of the downstream portion of the frame member 5a from above the carrier tape 15 and guides the feeding of the carrier tape 15. The upper guide portion 18 is provided with a suction opening 18a. The suction opening 18a is provided at a position where the component P is sucked by the nozzle 64a, i.e., at a component suction position.

[0056] As the carrier tape 15 travels below the upper guide portion 18, the top tape 17 is peeled off by the peeling portion of the upper guide portion 18 and folded back upstream (e.g., to the negative side in the Y-axis direction). As the top tape 17 is peeled off, the component pocket 16a of the carrier tape 15 is exposed from the suction opening 18a of the upper guide portion 18. The nozzle 64a picks up the component P from the component pocket 16a. The tape recovery portion 5c is a box for recovering the folded back top tape 17.

[0057] Here, for example, in a component supply operation in which components P are continuously supplied while the carrier tape 15 is being fed, the carrier tape 15 wound around the tape reel 14 is consumed. At this time, tape splicing is performed. That is, the leading end of a carrier tape 15A to be newly loaded is spliced to the trailing end of the carrier tape 15 already loaded on the tape feeder 5 via a splice portion J.

[0058] FIG. 4 is a diagram showing an example of tape splicing.

[0059] As shown in Figure 4(a), in tape splicing, the tail end of carrier tape 15 already loaded on tape feeder 5 is joined to the head end of carrier tape 15A to be newly loaded via a butt line E. The butt line E is also called a joint.

[0060] 4(a) and 4(b), the base tape 16 has the above-mentioned multiple component pockets 16a formed in an array along the longitudinal direction of the base tape 16. Furthermore, at one end of the shorter side of the base tape 16, multiple feed holes 16b for feeding the carrier tape 15 or 15A by a sprocket 21 are formed in an array along the longitudinal direction of the base tape 16. The above-mentioned top tape 17 is attached to the base tape 16 in a manner that blocks the openings of the multiple component pockets 16a without blocking the multiple feed holes 16b of the base tape 16.

[0061] Tape splicing is performed using a dedicated jig, and the two carrier tapes 15 and 15A are aligned so that the pitch pa between two component pockets 16a across the butt line E is equal to the predetermined pitch pb on the base tape 16. Two splice tapes 28 and two splice tapes 29 are then attached to the tail end of the carrier tape 15 and the head end of the carrier tape 15A, straddling the butt line E. The two splice tapes 28 are attached to positions corresponding to the component pockets 16a on the base tape 16, sandwiching the tail end of the carrier tape 15 and the head end of the carrier tape 15A from above and below. The two splice tapes 29 are attached to positions corresponding to the feed holes 16b on the base tape 16, sandwiching the tail end of the carrier tape 15 and the head end of the carrier tape 15A from above and below. The splice tape 29 is also provided with a slit 29a along the longitudinal direction of the splice tape 29 so as not to interfere with tape feeding by the sprocket 21. Note that while Fig. 4(a) shows the state in which the top tape 17 has been peeled off from the base tape 16, in tape splicing, the splice tape 28 is attached from above the top tape 17. As a result, as shown in Fig. 4(b), the carrier tape 15 and the carrier tape 15A are joined at a joint J to form a single continuous carrier tape.

[0062] In (a) of Figure 4, components P are stored in all component pockets 16a, but the component pockets 16a at the end of carrier tape 15 and the beginning of carrier tape 15A do not necessarily have to store components P.

[0063] Fig. 5 is an enlarged view of the downstream portion of tape feeder 5. Specifically, Fig. 5(a) shows the downstream portion of tape feeder 5 as viewed from the positive side in the Z-axis direction, and Fig. 5(b) shows the downstream portion of tape feeder 5 as viewed from the positive side in the X-axis direction.

[0064] 5(a), the upper guide portion 18 has a first opening 18b formed upstream of the suction opening 18a (e.g., on the negative side in the Y-axis direction) and a second opening 18c formed downstream of the suction opening 18a (e.g., on the positive side in the Y-axis direction). The component pocket 16a is exposed through the suction opening 18a.

[0065] 5(b), the sprocket 21 is provided with a plurality of feed pins 21a. These feed pins 21a engage with the peripheries of the feed holes 16b in the carrier tape 15 downstream of the suction openings 18a. As the feed pins 21a engage with the peripheries of the feed holes 16b in this manner and the sprocket 21 rotates, the carrier tape 15 is fed downstream. For example, tape feeding is performed by repeating one or more pitch feeds, and in each pitch feed, the carrier tape 15 is fed downstream by the pitch between adjacent component pockets 16a in the base tape 16 (i.e., pitch pb).

[0066] When the feed pins 21a of the sprocket 21 are fitted from below into the feed holes 16b covered by the splice tape 29, the feed pins 21a protrude upward through the slits 29a of the splice tape 29. This allows the carrier tapes 15 and 15A to be fed without floating above the sprocket 21. The upper guide portion 18 is also formed with the second openings 18c described above. Therefore, the feed pins 21a protruding upward from the feed holes 16b and the slits 29a of the splice tape 29 are exposed from the second openings 18c without interfering with the upper guide portion 18.

[0067] As shown in FIG. 5(b), the tape feeder 5 also includes a sensor 54 and a seam detection unit 53. The first opening 18b is used to detect the seam J of the carrier tapes 15 and 15A. The sensor 54 is a reflective optical sensor that is inserted from below into a position in the frame member 5a that corresponds to the first opening 18b. The sensor 54 emits light, detects reflected light, and outputs a detection signal based on the detection result to the seam detection unit 53. The seam detection unit 53 detects the seam J based on the detection signal from the sensor 54.

[0068] That is, when a portion of the carrier tape 15 other than the seam portion J passes above the sensor 54, if the sprocket holes 16b are positioned between the sensor 54 and the first opening 18b, the light emitted upward from the sensor 54 passes through the sprocket holes 16b and the first opening 18b. Therefore, at this timing, the sensor 54 does not detect reflected light and outputs a detection signal indicating that the sprocket holes 16b have been detected to the seam detection unit 53. When the seam detection unit 53 receives detection signals indicating that the sprocket holes 16b have been detected at a period corresponding to the pitch of the plurality of sprocket holes 16b, it determines that there is no seam portion J above the sensor 54.

[0069] On the other hand, as shown in FIG. 5B, when the seam J of the carrier tape 15 passes above the sensor 54, the splice tape 29 of the seam J is positioned above the sensor 54. Therefore, light emitted upward from the sensor 54 when the splice tape 29 is positioned between the sensor 54 and the first opening 18b is reflected by the splice tape 29 without passing through the sprocket holes 16b and the first opening 18b. As a result, at this timing, the sensor 54 detects the reflected light and does not output a detection signal indicating that the sprocket holes 16b have been detected to the seam detection unit 53. If the seam detection unit 53 does not receive a detection signal indicating that the sprocket holes 16b have been detected for a predetermined period of time, it determines that the seam J is present above the sensor 54. In other words, the seam detection unit 53 detects the seam J. In addition, the seam detection unit 53 may detect the seam (i.e., the butt line E) based on the length of the carrier tape 15 that has been fed from the timing when the state in which the detection signal is not received begins.

[0070] [Data switching timing] FIG. 6 is a diagram for explaining the timing of data switching in this embodiment.

[0071] The component mounting device M repeatedly executes processing operations including component pickup, component recognition, and component mounting. This series of processing operations including component pickup, component recognition, and component mounting is also called a turn. In component pickup, the head 64 of the component mounting device M successively picks up and holds one or more components P supplied from the tape feeder 5. In component recognition, the head 64 passes above the component recognition camera 10 while moving from the tape feeder 5 to the board 3. At this time, the component recognition camera 10 captures images of the components P picked up by each of one or more nozzles 64a of the head 64. The components P are recognized based on the captured images of the components P. In component mounting, the head 64 moves above the board 3 and mounts the components P picked up by each of the one or more nozzles 64a on the board 3. In other words, one turn is one processing operation in which the head 64 of the component mounting device M moves between the tape feeder 5 and the substrate 3 and repeatedly performs processing operations including suction, recognition, and mounting of one or more components P.

[0072] Here, the number of components P successively picked up from tape feeder 5 by head 64 in each turn is predetermined as a specified number based on, for example, production data. However, in this embodiment, the pick-up number, which is the number of components P picked up by head 64 in one turn, may be limited to less than the specified number. That is, in this embodiment, when a seam is detected by seam detection unit 53 and the specified number in one turn is greater than the remaining number of components P included in existing carrier tape 15, the pick-up number in that turn is limited to the remaining number.

[0073] Furthermore, in that turn, each of the component mounting device M and the tape feeder 5 executes data switching when component recognition and component mounting are performed after component pickup. Data switching is a process of switching the identification information of the carrier tape indicated in the tape management data stored in each of the first memory 56 of the tape feeder 5 and the second memory 62 of the component mounting device M. Specifically, in data switching, the identification information of the existing carrier tape is rewritten with the identification information of the new carrier tape.

[0074] In this way, the component mounting device M and tape feeder 5 in this embodiment switch the carrier tape indicated in the tape management data while the component mounting device M recognizes and mounts one or more components P. In other words, data switching, which is switching the carrier tape indicated in the tape management data, and component recognition and component mounting are performed in parallel. Therefore, compared to a case where each process is performed in the order of data switching, component recognition, and component mounting, for example, the time required for one turn can be shortened, and the productivity of mounted boards produced by mounting multiple components P on boards 3 can be improved.

[0075] [Function Configuration] FIG. 7 is a block diagram showing an example of the functional configuration of each of the tape feeder 5 and the component mounting device M.

[0076] As described above, tape feeder 5 supplies a plurality of components P stored in each of carrier tapes 15 and 15A. Carrier tape 15 is an example of a first carrier tape in this embodiment, and carrier tape 15A is an example of a second carrier tape in this embodiment. Such tape feeder 5 includes a remaining number identifying unit 51, a first data switching unit 52, a seam detection unit 53, a sensor 54, a first control unit 55, a first memory 56, a first communication unit 57, and a feed mechanism unit 58. First control unit 55 controls each of the above-mentioned components included in tape feeder 5 except for first control unit 55. As described above, sensor 54 is a reflective optical sensor. Seam detection unit 53 detects the seam between carrier tape 15 and carrier tape 15A based on a detection signal from sensor 54.

[0077] The feed mechanism 58 includes the above-mentioned rotation drive mechanism 20 and sprocket 21, and feeds the carrier tapes 15 and 15A under the control of the first control unit 55.

[0078] The remaining number determination unit 51 determines the remaining number of components P contained in the carrier tape 15 based on the results of tape feeding by the feed mechanism unit 58 and the results of seam detection by the seam detection unit 53. The remaining number of components P is the number of components P present from the component suction position to the seam on the carrier tape 15. The component suction position is the position of the suction opening 18a of the upper guide unit 18.

[0079] The first communication unit 57 transmits a communication signal indicating the remaining number of components P identified by the remaining number identification unit 51 to the component mounting device M. This communication by the first communication unit 57 may be performed wirelessly or via a wire. Furthermore, the wireless communication may be performed using Wi-Fi (registered trademark), Bluetooth (registered trademark), ZigBee (registered trademark), or a specified low-power radio.

[0080] The first memory 56 is a recording medium that stores the tape management data. The tape management data indicates the identification information of the existing carrier tape carrying the component P currently being supplied to the component suction position by the feed mechanism 58. Furthermore, when tape splicing is performed, the tape management data indicates not only the identification information of the existing carrier tape but also the identification information of the new carrier tape spliced to the existing carrier tape. Specifically, the identification information of the existing carrier tape is the identification information of carrier tape 15, and the identification information of the new carrier tape is the identification information of carrier tape 15A. The first memory 56 may be, for example, a hard disk drive, a random access memory (RAM), a read-only memory (ROM), or a semiconductor memory. Furthermore, the first memory 56 may be either volatile or nonvolatile.

[0081] The first data switching unit 52 executes the above-described data switching when the remaining quantity of the component P identified by the remaining quantity identifying unit 51 becomes 0. In this data switching, the first data switching unit 52 switches the identification information of the carrier tape indicated in the tape management data in the first memory 56. That is, the first data switching unit 52 rewrites the identification information of the carrier tape 15 indicated as the identification information of the existing carrier tape to the identification information of the carrier tape 15A, and deletes the identification information of the carrier tape 15.

[0082] As described above, the component mounting apparatus M picks up the components P placed at the component suction position by supply from the tape feeder 5 and mounts them on the board 3. Such a component mounting apparatus M includes a second control unit 61, a second memory 62, a second communication unit 63, a head 64, a number acquisition unit 65, a pickup number determination unit 66, and a second data switching unit 67. The second control unit 61 controls each of the above-mentioned components included in the component mounting apparatus M except for the second control unit 61.

[0083] The second memory 62, like the first memory 56, is a recording medium that stores the tape management data described above. The second memory 62 is, for example, a hard disk drive, RAM, ROM, or semiconductor memory. The second memory 62 may be volatile or non-volatile. The tape management data stored in the first memory 56 of the tape feeder 5 and the second memory 62 of the component mounting device M is reflected in the trace information. The trace information is, for example, information that indicates the correspondence between each mounting point on the board 3 and the component P mounted at that mounting point or the carrier tape from which the component P was removed.

[0084] The second communication unit 63 communicates with the first communication unit 57 of the tape feeder 5. For example, the second communication unit 63 receives a communication signal indicating the remaining number of components P from the first communication unit 57. Then, the second communication unit 63 outputs the communication signal to the number acquisition unit 65.

[0085] The number obtaining unit 65 obtains a communication signal from the second communication unit 63. That is, the number obtaining unit 65 obtains the remaining number of components P identified by the remaining number identifying unit 51 of the tape feeder 5. In other words, when a seam where the existing carrier tape 15 and the new carrier tape 15A are joined is detected, the number obtaining unit 65 obtains the remaining number, which is the number of components P stored between the seam on the existing carrier tape 15 and the component suction position. Furthermore, each time one turn is sequentially performed, the number obtaining unit 65 obtains the specified number of components P to be picked up by the head 64 of the component mounting device M per turn.

[0086] The suction number determination unit 66 determines the suction number, which is the number of components P that are successively picked up and held together by the head 64 of the component mounting device M, based on the remaining number acquired by the number acquisition unit 65. More specifically, the suction number determination unit 66 determines the suction number per turn based on the remaining number and a specified number.

[0087] The head 64 successively picks up and holds together the components P, the number of which is determined by the pick-up number determining unit 66 and is supplied by the tape feeder 5, and mounts the components P of that number on the board 3.

[0088] The second data switching unit 67 performs data switching in the same manner as the first data switching unit 52. Specifically, when the number of components P to be picked up determined by the pickup number determination unit 66 is equal to the remaining number and that number of components P have been picked up by the head 64 of the component mounting device M, the second data switching unit 67 performs data switching on the tape management data stored in the second memory 62. In this data switching, the second data switching unit 67 switches the carrier tape currently being used for mounting, which is indicated in the tape management data, from carrier tape 15 to carrier tape 15A. In other words, the second data switching unit 67 rewrites the identification information of carrier tape 15, which is indicated as the identification information of the existing carrier tape, to the identification information of carrier tape 15A, and deletes the identification information of carrier tape 15.

[0089] [Processing Operation] FIG. 8 is a diagram for explaining the suction of the component P by the head 64. As shown in FIG.

[0090] 8(a), when component suction for one turn is being performed, seam detection unit 53 detects seam J (i.e., a seam) based on a detection signal from sensor 54. During that turn, even after seam J is detected, if the head 64 has not yet picked up the specified number of components P for that turn, the head 64 continues to pick up components P. That is, feed mechanism unit 58 of tape feeder 5 feeds carrier tape 15, and head 64 picks up components P that are arranged so as to be exposed through suction opening 18a of tape feeder 5 as a result of this tape feeding. Then, when component suction for that turn is completed, head 64 moves for component recognition and component mounting.

[0091] The remaining number determination unit 51 of the tape feeder 5 determines the remaining number of components P as shown in (b) of Figure 8 before the next turn of component suction begins, and notifies the head 64 of the remaining number via the first communication unit 57.

[0092] When component pickup for the next turn begins, the pickup number determination unit 66 of the component mounting device M determines the number of components P to be picked up based on the remaining number of components P and the specified number for the next turn. If the specified number is greater than the remaining number, the pickup number determination unit 66 determines the remaining number as the pickup number. On the other hand, if the specified number is equal to or less than the remaining number, the pickup number determination unit 66 determines the specified number as the pickup number. In the example shown in FIG. 8(b), for example, the specified number "5" is greater than the remaining number "3," so the pickup number determination unit 66 determines that the remaining number "3" will be picked up. As a result, as shown in FIG. 8(c), the head 64 consecutively picks up and holds only the components P with a pickup number of "3." In other words, when the head 64 picks up components P in one turn, the carrier tapes 15 and 15A are not transferred.

[0093] As described above, in this embodiment, when the specified number is greater than the remaining number, the number of components P to be picked up is limited to the remaining number. This prevents the number of components P from being too small, thereby preventing carrier tape transfers during one turn. As a result, the productivity of mounted boards can be improved. In other words, the component mounting device M and tape feeder 5 do not need to monitor or manage carrier tape transfers while the specified number of components P are being picked up consecutively, and the pickup speed of these components P can be increased. Furthermore, in this embodiment, when the specified number is equal to or less than the remaining number, the number of components P to be picked up is not limited, and the specified number of components P are picked up consecutively by the head 64 of the component mounting device M and held together. This allows the component mounting work of the components P to be performed in a planned manner.

[0094] FIG. 9 is a sequence diagram showing an example of the processing operations of the tape feeder 5 and the component mounting device M.

[0095] In the first turn, the tape feeder 5 continuously performs a predetermined number of feeds, i.e., pitch feeds (step S11), and the component mounting device M continuously picks up and holds together the predetermined number of components P (step S12). Then, the component mounting device M performs component recognition and component mounting for the predetermined number of components P (step S13).

[0096] In the second turn, the tape feeder 5 detects the joint J while continuously feeding the specified number of components (step S21), and the component mounting device M continuously picks up and holds the specified number of components P together (step S22).Then, the component mounting device M performs component recognition and component mounting for the specified number of components P (step S23).

[0097] In the third turn, the tape feeder 5 identifies the remaining number of components P and notifies the component mounting device M (step S31), and the component mounting device M acquires the notified remaining number (step S32). Here, for example, the specified number for the third turn is equal to or less than the remaining number. In this case, the component mounting device M determines that even if the specified number of components P are picked up in the third turn, a carrier tape transfer will not occur (step S33). Therefore, for example, the pickup number determination unit 66 of the component mounting device M instructs the tape feeder 5 to feed the specified number of components P via the second communication unit 63. Then, the tape feeder 5 continuously feeds the specified number of components P (step S34), and the component mounting device M continuously picks up and holds the specified number of components P (step S35). Next, the component mounting device M performs component recognition and component mounting for the specified number of components P (step S36).

[0098] In the fourth turn, the tape feeder 5 identifies the remaining number of components P and notifies the component mounting device M (step S41), and the component mounting device M acquires the notified remaining number (step S42). At this time, the remaining number identification unit 51 of the tape feeder 5 identifies the remaining number of components P in the fourth turn by subtracting the number of times the components were fed in step S34 (i.e., the specified number) from the remaining number identified in step S31 of the third turn.

[0099] Here, for example, the specified number for the fourth turn is greater than the remaining number. In this case, the component mounting device M determines that a carrier tape transfer will occur if the specified number of components P are picked up in the fourth turn (step S43). Therefore, for example, the pickup number determination unit 66 of the component mounting device M instructs the tape feeder 5 to feed the remaining number of components P via the second communication unit 63. The tape feeder 5 continuously feeds the remaining number of components P (step S44), and the component mounting device M continuously picks up only the remaining number of components P and holds them together (step S45). Next, the first data switching unit 52 of the tape feeder 5 performs data switching (step S46), and the component mounting device M performs data switching using the second data switching unit 67 while performing component recognition and component mounting for the remaining number of components P (step S47).

[0100] FIG. 10 is a flowchart showing an example of the processing operation of the tape feeder 5.

[0101] The feed mechanism 58 of the tape feeder 5 feeds (i.e., pitch feeds) the carrier tape 15 once (step S101). Next, the first control unit 55 determines whether the seam detection unit 53 has detected the seam J or whether the seam J has already been detected in the previous turn (step S102). If it is determined that the seam J has been detected or has already been detected (Yes in step S102), the first control unit 55 further determines whether one turn of feeding has been completed (step S103). If the first control unit 55 determines that one turn of feeding has been completed (Yes in step S103), the remaining number determination unit 51 determines the remaining number of components P from the seam in the carrier tape 15 to the component suction position (step S104).

[0102] For example, when the seam detection unit 53 detects the seam J, the remaining number determination unit 51 determines the number of components P stored between the seam in the carrier tape 15 and the component suction position as the initial value of the remaining number. This initial value may be predetermined for the carrier tape 15. Next, the remaining number determination unit 51 determines the number of times feeding has occurred from the time the seam J is detected until one turn of feeding is completed, i.e., the number of components P supplied from the tape feeder 5. The remaining number determination unit 51 then subtracts the number of supplied components P from the initial value to determine the remaining number of components P at the time one turn of feeding is completed.

[0103] Furthermore, if the seam J has already been detected in the previous turn, the remaining number determination unit 51 determines the remaining number in the current turn by subtracting the number of components P supplied from the tape feeder 5 in the current turn from the remaining number determined in the previous turn. For example, if the current turn is the fourth turn in FIG. 9, the previous turn is the third turn in FIG. 9.

[0104] On the other hand, when the first control unit 55 determines that one turn of feeding has not been completed (No in step S103), it causes the feed mechanism unit 58 to repeatedly execute the process of step S101.

[0105] After the process of step S104, the first data switching unit 52 determines whether the remaining number of the component P identified in step S104 is 0 (step S105). If the first data switching unit 52 determines that the remaining number is 0 (Yes in step S105), it executes data switching (step S107). Furthermore, the first control unit 55 clears the detection result of the seam J by the seam detection unit 53 (step S108). Then, the first control unit 55 determines whether the component supply operation of the component P by the tape feeder 5 is to be terminated (step S109). If the first control unit 55 determines that the component supply operation of the component P is to be terminated (Yes in step S109), the first control unit 55 terminates the component supply operation of the component P. On the other hand, if the first control unit 55 determines that the component supply operation is not to be terminated (No in step S109), it causes the feed mechanism unit 58 to repeatedly execute the process of step S101.

[0106] Furthermore, in step S105, if the first data switching unit 52 determines that the remaining number is not 0 (No in step S105), similarly to step S109, the first control unit 55 determines whether or not to terminate the component supply operation of the component P by the tape feeder 5 (step S106). Here, if the first control unit 55 determines that the component supply operation of the component P should be terminated (Yes in step S106), the first control unit 55 terminates the component supply operation of the component P. On the other hand, if the first control unit 55 determines that the component supply operation should not be terminated (No in step S106), the remaining number specifying unit 51 notifies the component mounting device M of the remaining number via the first communication unit 57 (step S110). That is, the first communication unit 57 transmits a communication signal indicating the remaining number specified by the remaining number specifying unit 51 to the second communication unit 63 of the component mounting device M. Then, the first control unit 55 causes the feed mechanism unit 58 to repeatedly execute the process of step S101.

[0107] FIG. 11 is a flowchart showing an example of the processing operation of the component mounting apparatus M.

[0108] The number acquisition unit 65 of the component mounting device M acquires a specified number for one turn from, for example, production data generated by a management device for managing the component mounting system 100 (step S201). Then, the second control unit 61 determines whether the number acquisition unit 65 has acquired the remaining number of components P from the first communication unit 57 of the tape feeder 5 via the second communication unit 63 (step S202). If the second control unit 61 determines that the number acquisition unit 65 has acquired the remaining number (Yes in step S202), the pickup number determination unit 66 determines whether the specified number is greater than the remaining number (Yes in step S203). Here, if the pickup number determination unit 66 determines that the specified number is greater than the remaining number (Yes in step S203), that is, if it determines that carrier tape transfer will occur if the specified number of pickups is performed, it determines the remaining number as the pickup number (step S204).

[0109] As a result, the second control unit 61 limits the number of components P picked up by the head 64 to the remaining number, and causes the head 64 to pick up the remaining number of components P supplied from the tape feeder 5 (step S205). Then, the second control unit 61 causes the head 64 and the component recognition camera 10 to perform component recognition for the remaining number of components P picked up by the head 64 (step S207), and causes the head 64 to mount the remaining number of components P (step S208). The second control unit 61 causes the second data switching unit 67 to perform data switching while the component recognition in step S207 and the component mounting in step S208 are being performed (step S206). For example, the second data switching unit 67 performs data switching between component recognition and component mounting. As such, in this embodiment, the second data switching unit 67 switches the carrier tape indicated in the tape management data while the head 64 of the component mounting device M is recognizing and mounting one or more components P.

[0110] Furthermore, in step S202, if the second control unit 61 determines that the number acquiring unit 65 has not acquired the remaining number (No in step S202), the adsorption number determining unit 66 determines the specified number as the adsorption number (step S209). Alternatively, in step S203, if the adsorption number determining unit 66 determines that the specified number is equal to or less than the remaining number (No in step S203), that is, if it determines that carrier tape transfer will not occur with the specified number of adsorptions, the adsorption number determining unit 66 determines the specified number as the adsorption number (step S209).

[0111] As a result, the second control unit 61 causes the head 64 to pick up a specified number of components P supplied from the tape feeder 5 without limiting the number of components P that can be picked up by the head 64 (step S210). Then, the second control unit 61 causes the head 64 and the component recognition camera 10 to perform component recognition for the specified number of components P picked up by the head 64 (step S211), and causes the head 64 to mount the specified number of components P (step S212).

[0112] After steps S206, S208, and S212, the second control unit 61 determines whether or not to end the component mounting work of the components P on the board 3 (step S213). If the second control unit 61 determines that the component mounting work should be ended (Yes in step S213), the second control unit 61 ends the component mounting work. On the other hand, if the second control unit 61 determines that the component mounting work should not be ended (No in step S213), the second control unit 61 causes the number obtaining unit 65 to repeatedly execute the process of step S201.

[0113] [Effects, etc.] As described above, in this embodiment, when a seam is detected, the remaining number of components P on the carrier tape 15 is acquired, and the pickup number, which is the number of components P to be consecutively picked up and held together by the component mounting device M, is determined based on the remaining number. Therefore, the pickup number can be limited to or less than the remaining number. As a result, carrier tape transfers can be prevented while multiple components P are consecutively picked up by the component mounting device M. For example, while multiple components P are consecutively picked up by the head 64 of the component mounting device M in one turn, the carrier tape from which the components P are taken out can be prevented from transferring from the carrier tape 15 to the carrier tape 15A. Therefore, the component mounting device M and the tape feeder 5 do not need to monitor or manage carrier tape transfers while the specified number of components P are consecutively picked up, and the pickup speed of the components P can be increased. As a result, the productivity of mounted boards produced by mounting multiple components P on the board 3 can be improved.

[0114] Furthermore, in this embodiment, when all components P stored on the carrier tape 15 have been removed by the component mounting device M, i.e., when all components P on the carrier tape 15 have been used up, the carrier tape indicated in the tape management data is switched. In other words, data switching is executed. Therefore, the carrier tape indicated in this tape management data can be properly synchronized with the carrier tape currently being used for mounting. As a result, by using this tape management data, it is possible to properly generate trace information that associates each mounting point on the board 3 with the component P mounted at that mounting point or the carrier tape from which that component P was removed. In other words, accurate traceability can be ensured.

[0115] Furthermore, in this embodiment, the head 64 of the component mounting device M successively picks up and holds together the components P of the number determined by the pickup number determination unit 66, which are supplied by the tape feeder 5, and mounts the number of components P on the board 3. This allows the determined number of components P to be quickly mounted successively on the board 3.

[0116] In this embodiment, the number obtaining unit 65 obtains the specified number of components P to be picked up by the component mounting device M per turn. Then, the pickup number determining unit 66 determines the pickup number per turn based on the remaining number and the specified number. This makes it possible to limit the pickup number to be equal to or less than the remaining number, even if the specified number is greater than the remaining number.

[0117] In this embodiment, when the specified number is greater than the remaining number, the suction number determination unit 66 determines the remaining number as the suction number. As a result, when the specified number is greater than the remaining number, the suction number is limited to the remaining number, so that the suction number is not set too low and the occurrence of carrier tape transfer during one turn can be suppressed. As a result, productivity can be further improved.

[0118] Furthermore, in this embodiment, when the specified number is equal to or less than the remaining number, the pickup number determination unit 66 determines the specified number as the pickup number. As a result, when the specified number is equal to or less than the remaining number, the pickup number is not limited, and the specified number of components P are continuously picked up and held together by the component mounting device M. Therefore, the component mounting work of the components P can be carried out in a planned manner.

[0119] Furthermore, in this embodiment, the second data switching unit 67 switches the carrier tape indicated in the tape management data while the component mounting device M is recognizing and mounting one or more components P. This allows data switching, which is switching the carrier tape indicated in the tape management data, and component recognition and component mounting to be performed in parallel. Therefore, compared to a case where each process is performed in the order of data switching, component recognition, and component mounting, for example, the time required for one turn can be shortened, thereby further improving productivity.

[0120] Furthermore, in this embodiment, remaining quantity specifying unit 51 specifies the remaining quantity for the turn following the one turn by subtracting the number of components P supplied from tape feeder 5 in one turn from the remaining quantity. This allows the remaining quantity for each turn to be managed appropriately.

[0121] (Other forms) While the component mounting system and the component mounting method according to the present disclosure have been described above based on the above embodiment, the present disclosure is not limited to this embodiment. As long as the modifications do not deviate from the spirit of the present disclosure, various modifications conceivable by those skilled in the art to the above embodiment may also be included within the scope of the present disclosure.

[0122] For example, one or more components included in the tape feeder 5 of the above embodiment may be provided in a device other than the tape feeder 5, and one or more components included in the component mounting device M may be provided in a device other than the component mounting device M. For example, if a management device for managing the tape feeder 5 and the component mounting device M is included in the component mounting system 100, the management device may include one or more of the above-mentioned components. Specifically, the management device may include at least one of the remaining number specifying unit 51, the first data switching unit 52, the first control unit 55, the first memory 56, and the first communication unit 57. The management device may also include at least one of the second control unit 61, the second memory 62, the number obtaining unit 65, the suction number determining unit 66, and the second data switching unit 67. The management device is a computer including a processor and a memory.

[0123] In the above-described embodiments, each component may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or semiconductor memory. Here, the software that realizes the component mounting apparatus M and tape feeder 5 of the above-described embodiments is a program that causes a computer to execute each step included in the flowchart shown in FIG. 10 or 11.

[0124] The following cases are also included in this disclosure:

[0125] (1) Each of the above devices is specifically a computer system consisting of a microprocessor, ROM, RAM, hard disk unit, display unit, keyboard, mouse, etc. A computer program is stored in the RAM or hard disk unit. Each device achieves its function when the microprocessor operates in accordance with the computer program. Here, a computer program is composed of a combination of multiple instruction codes that indicate commands to a computer to achieve a predetermined function.

[0126] (2) Some or all of the components constituting each of the above devices may be configured as a single system LSI (Large Scale Integration). A system LSI is an ultra-multifunctional LSI manufactured by integrating multiple components on a single chip, and specifically, is a computer system configured to include a microprocessor, ROM, RAM, etc. A computer program is stored in the RAM. The system LSI achieves its functions when the microprocessor operates in accordance with the computer program.

[0127] (3) Some or all of the components constituting each of the above devices may be configured as an IC card or a standalone module that can be attached to each device. The IC card or module is a computer system composed of a microprocessor, ROM, RAM, etc. The IC card or module may include the above-mentioned ultra-multifunctional LSI. The IC card or module achieves its functions when the microprocessor operates according to a computer program. The IC card or module may be tamper-resistant.

[0128] (4) The present disclosure may be embodied as the methods described above, a computer program for implementing these methods on a computer, or a digital signal comprising the computer program.

[0129] The present disclosure may also be the computer program or the digital signal recorded on a computer-readable recording medium, such as a flexible disk, hard disk, CD-ROM, MO, DVD, DVD-ROM, DVD-RAM, BD (Blu-ray (registered trademark) Disc), semiconductor memory, etc. Alternatively, the present disclosure may be the digital signal recorded on such a recording medium.

[0130] Furthermore, the present disclosure may involve transmitting the computer program or the digital signal via a telecommunications line, a wireless or wired communication line, a network such as the Internet, data broadcasting, or the like.

[0131] The present disclosure may also be a computer system including a microprocessor and a memory, the memory storing the computer program, and the microprocessor operating in accordance with the computer program.

[0132] The program or the digital signal may also be implemented by another independent computer system by recording it on the recording medium and transferring it, or by transferring it via the network or the like.

[0133] (5) The above-described embodiments and other embodiments may be combined. [Industrial Applicability]

[0134] The present disclosure can be used in a component mounting system that mounts components on a substrate. [Explanation of symbols]

[0135] 1 base 2. Substrate transport mechanism 3. Circuit Board 4. Parts Supply Department 4a Feeder Base 5 Tape Feeder 5a Frame member 5b Tape running path 5c Tape collection section 6A Y-axis table 6B Y-axis table 7A X-axis table 7B X-axis table 9. Circuit board recognition camera 10 Parts Recognition Camera 11 Nozzle holder 12 carts 13 Reel holder 14 Tape reel 15 Carrier tape 15A carrier tape 16 Base Tape 16a Parts pocket 16b Sprocket holes 17 Top Tape 18 Upper guide part 18a Suction opening 18b 1st opening 18c 2nd opening 20 Rotation drive mechanism 21 sprockets 21a Feed pin 28 splice tape 29 Splice Tape 29a Slit 51 Remaining number identification part 52 First data switching unit 53 Joint detection unit 54 Sensors 55 First Control Section 56 First Memory 57 First Communications Department 58 Feed mechanism 61 Second Control Section 62 Second Memory 63 Second Communications Department 64 heads 64a nozzle 65 Quantity Acquisition Unit 66 Adsorption number determination section 67 Second data switching unit 100 Component Mounting System E Butt Wire J Seam M component mounting equipment P parts PA Pitch pb pitch

Claims

1. a tape feeder that supplies a plurality of components stored on a first carrier tape; a component mounting device that picks up components placed at component suction positions by the tape feeder and mounts them on a board; a number acquiring unit that, when a seam where the first carrier tape and the second carrier tape are joined is detected, acquires a remaining number, which is the number of components stored between the seam on the first carrier tape and the component suction position; a pickup number determination unit that determines a pickup number, which is the number of components that are successively picked up and held together by the component mounting device, based on the remaining number acquired by the number acquisition unit, Component mounting system.

2. The component mounting system further comprises: a data switching unit that switches the carrier tape currently being used for mounting, which is indicated in the tape management data stored in the storage unit, from the first carrier tape to the second carrier tape when the number of components to be picked up determined by the number of components to be picked up by the component mounting device is equal to the remaining number and the number of components to be picked up has been picked up by the component mounting device, The component mounting system according to claim 1 .

3. The component mounting device continuously picking up and holding together the number of components supplied by the tape feeder, the number of components being determined by the pickup number determination unit, and mounting the number of components on the board; The component mounting system according to claim 2 .

4. The number acquisition unit further acquiring a specified number of components to be picked up by the component mounting device per turn; The adsorption number determination unit determining the number of adsorptions per turn based on the remaining number and the specified number; The one turn refers to one processing operation when the head of the component mounting device repeatedly performs processing operations including suction, recognition, and mounting of one or more components while moving between the tape feeder and the board. The component mounting system according to claim 2 or 3.

5. The adsorption number determination unit If the specified number is greater than the remaining number, the remaining number is determined as the adsorption number. The component mounting system according to claim 4 .

6. The adsorption number determination unit If the specified number is equal to or less than the remaining number, the specified number is determined as the adsorption number.

6. The component mounting system according to claim 4 or 5.

7. The data switching unit switching the carrier tape indicated in the tape management data while the component mounting device is recognizing and mounting the one or more components; The component mounting system according to any one of claims 4 to 6.

8. The component mounting system further comprises: a remaining number specifying unit that specifies the remaining number, the number acquisition unit acquires the remaining number identified by the remaining number identification unit, The remaining number specifying unit determining the remaining number of components in a turn following the one turn by subtracting the number of components supplied from the tape feeder in the one turn from the remaining number; The component mounting system according to any one of claims 4 to 7.

9. A component mounting method executed by a computer included in a component mounting system, The component mounting system includes: a tape feeder that supplies a plurality of components stored on a first carrier tape; a component mounting device that picks up components placed at component suction positions by the supply from the tape feeder and mounts them on a board, The component mounting method includes: a first step of acquiring, when a seam where the first carrier tape and the second carrier tape are joined is detected, a remaining number which is the number of components stored between the seam on the first carrier tape and the component suction position; a second step of determining a pickup number, which is the number of components that are successively picked up and held together by the component mounting device, based on the acquired remaining number; Component mounting method.

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