Processing device, conveying method, and article manufacturing method

Abstract

To provide a processing apparatus advantageous for improving throughput while suppressing cost.SOLUTION: A processing apparatus for processing a plurality of substrates transferred from an external device includes: a carry-in part for placing the substrate carried-in to the processing apparatus from the external device; a carry-out part for placing the substrate carried-out to the external device from the processing apparatus; a transfer part for transferring the substrate among the carry-in part, the carry-out part and a processing part for processing the substrate; and a control part for controlling the transfer of the substrate between the external device and the processing apparatus according to a transfer mode. When a substrate to be carried-in to the carry-in part and a substrate to be carried-out from the carry-out part exist, the transfer mode includes a carry-in priority mode prioritizing the carry-in of the substrate to the carry-in part over the carry-out of the substrate from the carry-out part.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus, a conveying method, and a method for manufacturing an article. [Background technology]

[0002] An exposure apparatus is a processing device that transfers the pattern of an original (mask or reticle) onto a substrate (such as a wafer) coated with resist (photosensitive agent) via a projection optical system during the lithography process, which is a manufacturing process for semiconductor devices and liquid crystal display devices. For example, in a lithography process, a coating process is performed before the exposure process using an exposure apparatus, in which resist is applied to the substrate (surface), and a development process is performed after the exposure process, in which the substrate (resist on which the pattern has been transferred) is developed. An example of an apparatus that performs these coating and developing processes is a coater-developer, which combines the coating function of uniformly coating resist on a substrate by rotating the substrate at high speed with the developing function.

[0003] The transport of substrates between the exposure tool and the coating / developing tool is automatically performed by a substrate transport device installed between each tool to avoid the cumbersome process of loading lots processed in each process and to improve throughput while maintaining the chemical properties of the resist. When the exposure tool and the coating / developing tool are connected in-line via the substrate transport device, a transport unit is provided in either or both of the exposure tool and the coating / developing tool to transport (hand over) substrates between the tools via the substrate transport device. To efficiently manufacture semiconductor devices with high throughput, it is necessary to efficiently transport substrates in the transport units provided in the exposure tool and the coating / developing tool.

[0004] Generally, a substrate transport device sequentially transports substrates (unexposed substrates) that have completed the coating process in a coating and developing apparatus to a transport section that is part of a transport section provided in an exposure apparatus. Meanwhile, the exposure apparatus temporarily transports substrates (exposed substrates) that have completed the exposure process to an unloading section that is part of the transport section (where the substrates wait in the unloading section) before transporting them to the coating and developing apparatus. Therefore, in the early stages of lot processing, substrate transport between the exposure apparatus and the coating and developing apparatus is mainly performed by transporting (loading) substrates from the coating and developing apparatus to the exposure apparatus. Then, as lot processing progresses, transport from the coating and developing apparatus to the exposure apparatus and transport (unloading) from the exposure apparatus to the coating and developing apparatus are performed in parallel. In this type of substrate transport (handover), the substrate transport device receives instructions such as "operation start requests" and "operation completion notifications" from the exposure apparatus and the coating and developing apparatus, and sequentially performs operations corresponding to these instructions in real time.

[0005] When the throughput of a substrate transport device is comparable to or higher than the throughput of an exposure device, the operation related to substrate transport (substrate transport operation) usually starts immediately when the exposure device requests the substrate transport device to load the substrate. On the other hand, when the throughput of a substrate transport device is lower than the throughput of an exposure device, the substrate transport operation may not start immediately even when the exposure device requests the substrate transport device to load the substrate. In such a situation, when the substrate transport device starts the operation related to substrate removal from the exposure device (substrate unloading operation), the substrate load operation cannot start until the substrate unloading operation is completed, which leads to a decrease in overall throughput.

[0006] Therefore, techniques have been proposed for suppressing a decrease in throughput with respect to the transport of substrates between an exposure apparatus and a substrate transport apparatus (see Patent Documents 1 and 2).

[0007] Patent Document 1 discloses an exposure apparatus that transmits time information, either a predicted time or a scheduled time until a substrate can be unloaded from the exposure apparatus, to a substrate transport device prior to an operation related to transporting the substrate. In a lithography system including the exposure apparatus disclosed in Patent Document 1, after the exposure apparatus requests the substrate transport device to load the substrate, the exposure apparatus can determine the timing at which the substrate will be loaded from the substrate transport device into the exposure apparatus. Therefore, with this lithography system, it is possible to wait for the operation of unloading the substrate from the exposure apparatus until the substrate has been loaded from the substrate transport device into the exposure apparatus.

[0008] Patent Document 2 discloses a substrate transport device that compares the time required to retrieve (unload) a substrate from an exposure device with the time required to supply (load) a substrate to the exposure device, and determines whether to prioritize the supply of a substrate. According to the substrate transport device disclosed in Patent Document 2, when a request for substrate supply is made by the exposure device, it is possible for the substrate transport device to prioritize the supply of a substrate over the retrieval of a substrate. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Patent No. 4915033 [Patent Document 2] Japanese Patent Application Laid-Open No. 2008-66463 Summary of the Invention [Problem to be solved by the invention]

[0010] However, the technology disclosed in Patent Document 1 requires communication (sending and receiving) of time information between the exposure apparatus and the substrate transport apparatus, which necessitates the definition of a new communication interface between the apparatuses, etc. Furthermore, the technology disclosed in Patent Document 1 requires a procedure for controlling the transport of the substrate based on the time information, which is expected to require a considerable cost in terms of both software and hardware.

[0011] On the other hand, in the technology disclosed in Patent Document 2, the decision as to whether to prioritize substrate collection or substrate supply is made on the substrate transport device side, not on the exposure apparatus side. Therefore, if you want to achieve this with the exposure apparatus alone (i.e., if you want to achieve this by updating the exposure apparatus), the technology disclosed in Patent Document 2 cannot be applied.

[0012] The present invention has been made in view of the above problems of the conventional technology, and has an exemplary object to provide a processing apparatus that is advantageous in improving throughput while suppressing costs. [Means for solving the problem]

[0013] In order to achieve the above object, one aspect of the present invention provides a processing apparatus for processing a plurality of substrates transported from an external device, the processing apparatus including: an input unit for placing a substrate to be loaded into the processing apparatus from the external device; and an output unit for placing a substrate to be loaded out of the processing apparatus to the external device; a transport unit for transporting the substrate between the input unit, the output unit, and a processing unit that processes the substrate; and a control unit for controlling the transport of the substrate between the external device and the processing apparatus in accordance with a transport mode, the transport mode including a load priority mode in which, when there are substrates to be loaded into the input unit and substrates to be unloaded from the output unit, loading of the substrate into the input unit takes priority over unloading of the substrate from the output unit. The processing device includes any one of an exposure device, an imprint device, a planarization device, and a drawing device. It is characterized by:

[0014] Further objects and other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. [Effects of the Invention]

[0015] According to the present invention, for example, it is possible to provide a processing apparatus that is advantageous in improving throughput while suppressing costs. [Brief explanation of the drawings]

[0016] [Figure 1]FIG. 1 is a schematic diagram illustrating a configuration of a lithography system. [Figure 2] FIG. 2 is a schematic diagram showing the configuration of a main body installed inside an exposure unit. [Figure 3] 1A and 1B are diagrams showing a substrate transport sequence between an exposure apparatus and a coating and developing apparatus in the prior art; [Figure 4] FIG. 1 is a diagram showing an example of a time chart when substrates are continuously processed in the prior art. [Figure 5] 5A to 5C are diagrams showing a substrate transport sequence between an exposure apparatus and a coating and developing apparatus in this embodiment. [Figure 6] 10 is a flowchart for explaining a sequential control process for carrying in and out. [Figure 7] 10 is a flowchart illustrating an example of determination of carry-in priority. [Figure 8A] 10A and 10B are diagrams for explaining an example of a specific method for determining whether the state of the first conveying device is a conveyable state. [Figure 8B] 10A and 10B are diagrams for explaining an example of a specific method for determining whether the state of the first conveying device is a conveyable state. [Figure 8C] 10A and 10B are diagrams for explaining an example of a specific method for determining whether the state of the first conveying device is a conveyable state. [Figure 8D] 10A and 10B are diagrams for explaining an example of a specific method for determining whether the state of the first conveying device is a conveyable state. [Figure 9] 10 is a flowchart illustrating an example of waiting for substrate loading. [Figure 10A] 10A and 10B are diagrams for explaining an example of a method for determining the maximum waiting time for substrate loading. [Figure 10B] 10A and 10B are diagrams for explaining an example of a method for determining the maximum waiting time for substrate loading. [Figure 11] FIG. 10 is a diagram showing an example of a time chart when substrates are continuously processed in the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0018] FIG. 1 is a schematic diagram showing the configuration of a lithography system 1 having an exposure apparatus 2 and a coating and developing apparatus 3 according to one aspect of the present invention. The lithography system 1 is employed, for example, in a lithography process, which is a manufacturing process for semiconductor devices. The exposure apparatus 2 and the coating and developing apparatus 3 are installed adjacent to each other in a clean room within a factory. The exposure apparatus 2 is a processing apparatus that processes multiple substrates transported from the coating and developing apparatus 3, which is an external apparatus. Specifically, the exposure apparatus 2 projects a pattern of an original (reticle or mask) onto a substrate (wafer) having a resist (photosensitive agent) layer formed on its surface, and performs an exposure process in which the substrate is exposed to light. The coating and developing apparatus 3 performs a coating process in which a resist is applied to the surface of the substrate as a pre-processing (pre-step) of the exposure process performed by the exposure apparatus 2, and a development process in which the substrate to which the pattern has been transferred is developed as a post-processing (post-step) of the exposure process.

[0019] The following describes the configuration of the exposure apparatus 2. The exposure apparatus 2 has a chamber 4 that houses the entire apparatus. Inside the chamber 4, an exposure section 5 that houses a main body that performs exposure processing, and a substrate transport device (hereinafter referred to as a "first transport device") 6 that transports (delivers) substrates between the exposure apparatus 2 and the coating and developing apparatus 3 are installed.

[0020] FIG. 2 is a schematic diagram showing the configuration of the main body 20 installed inside the exposure unit 5. The main body 20 employs a step-and-scan exposure method to project the pattern of the original 21 onto the substrate 22. However, the main body 20 can also employ a step-and-repeat exposure method or other exposure methods. The main body 20 includes an illumination optical system 23, an original stage 24 that holds the original 21, a projection optical system 25, and a substrate stage 26 that holds the substrate 22. In FIG. 2, the Z axis is defined as parallel to the optical axis of the projection optical system 25, the Y axis is defined as parallel to the scanning direction of the substrate 22 in a plane perpendicular to the Z axis, and the X axis is defined as parallel to the non-scanning direction perpendicular to the Y axis.

[0021] The illumination optical system 23 illuminates the original 21 with light from a light source (not shown). A pulsed light source, such as a laser, is used as the light source. Lasers that can be used as the light source include an ArF excimer laser with a wavelength of approximately 193 nm, an F2 laser with a wavelength of approximately 153 nm, and a YAG laser. The type and number of lasers are not limited. When a laser is used as the light source, the illumination optical system 23 preferably includes a shaping optical system that shapes the parallel light from the light source into a predetermined shape and an incoherent optical system that converts coherent light into incoherent light. The light source is not limited to a pulsed light source; one or more continuous light sources such as mercury lamps or xenon lamps can also be used. The illumination optical system 23 includes various optical components such as lenses, mirrors, an optical integrator, and an aperture.

[0022] The original 21 is made of, for example, quartz glass, and has a pattern (such as a circuit pattern) to be transferred to the substrate 22. The original stage 24 is a stage that can move at least in the X and Y directions while holding the original 21.

[0023] The projection optical system 25 projects the pattern of the original 21 illuminated by light from the illumination optical system 23 onto the substrate 22 at a predetermined magnification (for example, 1 / 4 or 1 / 5). The projection optical system 25 can be an optical system including only multiple refractive lens elements, or an optical system including multiple refractive lens elements and at least one concave mirror (catadioptric optical system). The projection optical system 25 can also be an optical system including multiple refractive lens elements and at least one diffractive optical element such as a kinoform, or an all-mirror optical system.

[0024] The substrate 22 is a substrate to be processed, such as a substrate made of single crystal silicon, with a resist applied to its surface. The substrate stage 26 is a stage that can move at least in the X and Y directions while holding the substrate 22. In this embodiment, the step-and-scan method is used, so the original stage 24 and the substrate stage 26 move in synchronization with each other.

[0025] The first transfer device 6 has a pre-alignment unit 30 that positions the substrate 22 prior to exposure processing, and a supply hand 31 that supplies (transports) the substrate 22 from the pre-alignment unit 30 to the substrate stage 26 of the main body 20. The first transfer device 6 also has a carrier port 32 as a location (site) for placing an open cassette that can store multiple substrates 22 when the open cassette is used to directly transport (carry) the substrates 22 into the main body 20. Note that the carrier port 32 may be configured to place a FOUP (Front Opening Unified Pod), which is a sealed carrier, instead of an open cassette.

[0026] The first transfer device 6 has a first carry-in section 33 and a first carry-out section 34 as a first transfer location (transfer section) when transferring (transferring) the substrate 22 between the exposure device 2 and the coating and developing device 3. The first transfer device 6 also has a carry-in hand 35 and a carry-out hand 36 that appropriately transfer the substrate 22 to each section constituting the first transfer device 6. The carry-in hand 35 and the carry-out hand 36 include, for example, a horizontal articulated robot (scalar robot). The first carry-in section 33 is a transfer location when transferring (transferring) the substrate 22 (unexposed substrate) from the coating and developing device 3 to the exposure device 2, but may also have the function of a pre-alignment section 30 or a process processing section that adjusts the temperature of the substrate. The first carry-out section 34 is a transfer location when transferring (transferring) the substrate 22 (exposed substrate) from the exposure device 2 to the coating and developing device 3, but may also have the function of a process processing section that performs edge exposure processing.

[0027] Furthermore, the exposure apparatus 2 has a control unit (hereinafter referred to as the "first control unit") 7, which is configured, for example, by a computer, is connected to each part of the exposure apparatus 2, and controls each part of the exposure apparatus 2 in accordance with a program stored in a storage unit. The first control unit 7 may be configured integrally inside the exposure apparatus 2, or may be configured external to the exposure apparatus 2. The first control unit 7 controls each part of the exposure apparatus 2 to perform exposure apparatus processing including various alignment processes and exposure processes. In this embodiment, the first control unit 7 also controls the transportation of substrates between the exposure apparatus 2 and the coating and developing apparatus 3 in accordance with a transport mode.

[0028] The following describes the configuration of the coating and developing apparatus 3. As shown in Fig. 1, the coating and developing apparatus 3 has a coating and developing processing section 8 installed inside a chamber 40, and a substrate transport device (hereinafter referred to as "second transport device") 9 installed inside a chamber 41 for transporting (delivering) substrates between the coating and developing apparatus 3 and the exposure apparatus 2.

[0029] The coating and developing processing unit 8 includes a coating unit 44, a heating unit 45, a developing unit 46, and a cooling unit 47 as processing units for the substrate 22. The coating unit 44 includes, for example, a spin coater, and forms a uniform resist film on the surface of the substrate 22 by rotating the substrate 22 with resist dropped onto the surface of the substrate 22.

[0030] The heating unit 45 performs a pre-bake on the substrate 22 (unexposed substrate) and a post-exposure bake on the substrate 22 (exposed substrate). Pre-bake is a heat treatment performed after a resist is applied to the surface of the substrate 22 to evaporate any remaining solvent in the resist film and strengthen adhesion between the resist film and the surface of the substrate 22. Because pre-bake is performed on the substrate 22 in an unexposed state (before exposure), it is preferably performed at a temperature that does not cause thermal decomposition of polymers or additives. In addition, pre-development bake is a heat treatment performed on the substrate 22 after exposure but before development in order to reduce deformation of the resist pattern due to the standing wave effect when exposed to light of a single wavelength. Pre-development bake also has the effect of promoting a catalytic reaction after exposure of the chemically amplified resist. Note that the baking method used in the heating unit 45 can be a resistance heating method, an infrared heating method, or the like.

[0031] The developing unit 46 develops the substrate 22 (exposed substrate). The developing unit 46 may use a spin method, a spray method, or the like for the developing process.

[0032] The cooling unit 47 includes, for example, a cooling plate that is cooled by circulating cooling water, and cools the heated substrate 22. As another cooling method in the cooling unit 47, electronic cooling using the Peltier effect can also be adopted.

[0033] Furthermore, the coating and developing processing section 8 includes a carrier port 48 as a place (site) for placing a carrier such as an open cassette or FOUP, and a transfer hand 49 for appropriately transferring the substrate 22 between the carrier and each section. The transfer hand 49 includes, for example, a scalar robot. The open cassette or FOUP is transferred within the clean room by a manual transfer vehicle (PGV: Person Guided Vehicle) and automatically transferred to the carrier port 48. Note that there is also a configuration in which the open cassette or FOUP is placed on the carrier port 48 from above within the clean room by an OHT (Over Head Transfer).

[0034] The second transport device 9 has a second carry-in section 50 and a second carry-out section 51 as second transport locations (transfer locations) when transporting (transferring) the substrate 22 between the exposure device 2 and the coating and developing device 3. The second transport device 9 also has a transport hand 52 that appropriately transports the substrate 22 between the second carry-in section 50 and the second carry-out section 51 and the first carry-in section 33 and the first carry-out section 34 installed in the first transport device 6. The transport hand 52 includes, for example, a scalar robot. The second carry-in section 50 is a transport location when transporting (carrying in) the substrate 22 (exposed substrate) from the exposure device 2 to the coating and developing processing section 8. The second carry-out section 51 is a transport location when transporting (carrying out) the substrate 22 (unexposed substrate) from the coating and developing processing section 8 to the exposure device 2.

[0035] Furthermore, the coating and developing apparatus 3 has a control unit (hereinafter referred to as "second control unit") 10, which is configured, for example, by a computer, is connected to each unit of the coating and developing apparatus 3, and controls each unit of the coating and developing apparatus 3 in accordance with a program stored in a storage unit. The second control unit 10 may be configured integrally inside the coating and developing apparatus 3, or may be configured outside the coating and developing apparatus 3.

[0036] The following describes the operation of the lithography system 1. Here, it is assumed that 25 substrates 22, which are substrates to be processed, are stored in an open cassette as one lot, and are transported to the carrier port 48 of the coating and developing processing section 8 in the coating and developing apparatus 3.

[0037] First, in the coating and developing processing section 8, the transport hand 49 retrieves the substrate 22 from an open cassette placed on the carrier port 48 and transports it to the coating section 44, which then applies resist to the substrate 22. Next, the transport hand 49 transports the substrate 22, which has been completely coated with resist, from the coating section 44 to the heating section 45, which then performs a pre-bake process on the substrate 22.

[0038] Next, the transport hand 49 transports the substrate 22 for which the pre-baking process has been completed from the heating unit 45 to the cooling unit 47, and the cooling unit 47 performs a cooling process on the substrate 22. Note that the temperature of the substrate 22 when transported (carried into) the exposure apparatus 2 is preferably set to a temperature that will not have an effect inside the chamber 4 of the exposure apparatus 2. Therefore, the cooling unit 47 may adjust the temperature of the substrate 22, for example, using the temperature of the air conditioning system of the main body 20 as a target temperature. However, if a temperature adjustment unit is provided in the first carry-in unit 33 of the first transport device 6 in the exposure apparatus 2, the temperature of the substrate 22 transported from the coating and developing apparatus 3 can be finally and precisely adjusted. Therefore, the cooling unit 47 only needs to bring the temperature of the substrate 22 close to the target temperature to some extent, and may also adjust the temperature to a temperature slightly higher than the final target temperature.

[0039] Next, the transport hand 49 transports the substrate 22, for which the cooling process has been completed, from the cooling section 47 to the second unloading section 51.

[0040] In this way, the transport hand 49 of the coating and developing processing section 8 sequentially acquires the substrates 22 stored in the open cassettes and transports them to each section of the coating and developing apparatus 3. Then, the transport hand 52 of the second transport device 9 transports the substrates 22 transported to the second unloading section 51 to the first loading section 33 of the first transport device 6 in the exposure apparatus 2.

[0041] Next, in the first transfer device 6, the first carry-in section 33 adjusts the temperature of the substrate 22 to a target temperature via the temperature adjustment section provided therein.

[0042] Next, the carry-in hand 35 transports the substrate 22, whose temperature has been adjusted, from the first carry-in section 33 to the pre-alignment section 30. In the pre-alignment section 30, the substrate 22 is placed on a pre-alignment stage and is rotated via a pre-alignment stage drive system. At this time, a detector such as a CCD sensor detects the edge of the substrate 22, and the first control section 7 calculates the notch direction, substrate center, and eccentricity of the substrate 22 based on the output from the detector. Then, the pre-alignment section 30 finally aligns the direction of the notch formed in the substrate 22 to a predetermined direction.

[0043] Next, the supply hand 31 supplies the substrate 22 for which the pre-alignment process has been completed from the pre-alignment unit 30 to the substrate stage 26 of the main body 20, and the main body 20 performs an exposure process on the substrate 22 held on the substrate stage 26.

[0044] Next, the carry-out hand 36 transports the substrate 22 for which the exposure process has been completed (exposed substrate) from the substrate stage 26 to the first carry-out section 34. Then, the transport hand 52 of the second transport device 9 transports the substrate 22 transported to the first carry-out section 34 from the first carry-out section 34 to the second carry-in section 50.

[0045] Next, the transport hand 49 of the coating and developing processing unit 8 transports the substrate 22 transported to the second loading section 50 from the second loading section 50 to the heating section 45, and the heating section 45 performs a pre-development bake process on the substrate 22.

[0046] Next, the transport hand 49 transports the substrate 22 for which the pre-development bake process has been completed from the heating unit 45 to the developing unit 46, and the developing unit 46 performs a development process on the substrate 22. Then, the transport hand 49 transports the substrate 22 for which the development process has been completed from the developing unit 46 to a predetermined slot of an open cassette placed on the carrier port 48.

[0047] The lithography system 1 performs this series of processes sequentially and continuously on all of the substrates 22 stored in the open cassette. Therefore, after each hand 35, 36, 49, and 52 completes the exposure process on the first substrate in a lot, it also performs an operation of transporting the exposed substrate from the exposure apparatus 2 to the coating and developing apparatus 3, and it becomes necessary to perform the transport operations for the unexposed substrate and the exposed substrate in parallel.

[0048] Next, a process related to the transportation of the substrate 22 in the lithography system 1, i.e., a transportation process (transport method), will be described. First, as a comparative example, a transportation process in the prior art will be described. FIG. 3 is a diagram showing a substrate transportation sequence between an exposure apparatus and a coating and developing apparatus in the prior art. Here, attention is focused on the operation of the loading hand of the first transport apparatus in the exposure apparatus and the operation of the transport hand of the second transport apparatus in the coating and developing apparatus. Furthermore, the components of the exposure apparatus and coating and developing apparatus in the prior art will be described using the same reference numerals as the components of the exposure apparatus 2 and coating and developing apparatus 3 in this embodiment.

[0049] As shown in S31, the first control unit 7 of the exposure apparatus 2 transmits a "substrate carry-in request" to the second control unit 10 of the coating and developing apparatus 3 to have the second transport device 9 in the coating and developing apparatus 3 transport the next substrate to be processed. If the coating and developing apparatus 3 cannot immediately prepare the substrate in response to the substrate carry-in request, that is, if the substrate cannot be immediately carried into the exposure apparatus 2 from the coating and developing apparatus 3, the exposure apparatus 2 enters a waiting state (substrate carry-in standby state) until the substrate is carried in from the coating and developing apparatus 3. Consider the case where, during this substrate carry-in standby state, the exposure apparatus 2 places a substrate for which exposure processing has been completed (exposed substrate) on the first unloading unit 34, as shown in S32. In this case, the first control unit 7 of the exposure apparatus 2 transmits a "substrate unloading request" to the second control unit 10 of the coating and developing apparatus 3, as shown in S33. In response to the substrate unloading request (S33) from the exposure apparatus 2, the second control unit 10 of the coating and developing apparatus 3 causes the transport hand 52 to unload the substrate placed on the first unloading unit 34, as shown in S34. During the substrate unloading process (S34) for unloading the substrate from the exposure apparatus 2 to the coating and developing apparatus 3, the substrate unloading process (S34) cannot be interrupted even if the coating and developing apparatus 3 has completed preparation of the substrate in response to the substrate load request (S31). Therefore, after the substrate unloading process (S34) is completed, the substrate load process in response to the substrate load request (S31) is started, as shown in S35. In the substrate load process, the transport hand 52 loads the substrate from the coating and developing apparatus 3 into the exposure apparatus 2 (the substrate is placed on the first load unit 33).

[0050] Fig. 4 is a diagram showing an example of a time chart when a plurality of substrates, for example, six substrates, are processed consecutively based on the transfer sequence in the conventional technology shown in Fig. 3. In Fig. 4, the flow of time is shown from left to right, and the order of the substrates to be processed is shown from top to bottom.

[0051] 4, first, the exposure apparatus 2 carries in (starts) the first substrate, as shown in S401. This corresponds to the substrate carry-in process (S35) by the transport hand 52. Next, the exposure apparatus 2 sequentially transports the first substrate to each section of the exposure apparatus 2, and as shown in S402, performs exposure apparatus processing including various alignment processes and exposure processes. Then, once the exposure apparatus processing for the first substrate (S402) is complete, the exposure apparatus 2 carries out the first substrate, as shown in S403. This corresponds to the substrate carry-out process (S34) by the transport hand 52.

[0052] In parallel with the exposure apparatus processing for the first substrate (S402), the exposure apparatus 2 carries in the second substrate as shown in S411. Once the carrying in of the second substrate (S411) is complete, the exposure apparatus 2 transports the second substrate sequentially to each section of the exposure apparatus 2, and performs exposure apparatus processing as shown in S412. Then, once the exposure apparatus processing for the second substrate (S412) is complete, the exposure apparatus 2 carries out the second substrate as shown in S413.

[0053] For the third and subsequent substrates, as shown in Figure 4, each process (substrate loading process, exposure device process, substrate unloading process) is repeated in parallel from the loading of the third substrate until the unloading of the sixth substrate (finally processed substrate) is completed.

[0054] 4, in the prior art, a substrate loading wait (wait time) shown in S424 is required before the third substrate is loaded as shown in S421. This indicates that while preparation for loading the third substrate is completed during the unloading of the first substrate (S403), the third substrate cannot be loaded (S421) until the unloading of the first substrate is completed, resulting in a substrate loading wait state. Similarly, the unloading of the third substrate as shown in S423 prevents the loading of the fifth substrate as shown in S441, and therefore a substrate loading wait as shown in S444 is required. In this way, the substrate loading wait, i.e., the need for a wait time, affects the throughput of substrate transport between the exposure tool 2 and the coating and developing tool 3.

[0055] In the example shown in Figure 4, for example, after completing the exposure device processing for the third substrate shown in S422, rather than immediately unloading the third substrate (S423), the fifth substrate is loaded first (S441), making it possible to advance subsequent processing.

[0056] Therefore, in this embodiment, before transmitting a substrate unloading request (S33) from the exposure apparatus 2 to the coating and developing apparatus 3, it is determined whether to prioritize the substrate loading process (S35) by the coating and developing apparatus 3 (transport hand 52). Then, depending on the result of this determination, the substrate transport sequence between the exposure apparatus 2 and the coating and developing apparatus 3 is changed, thereby reducing the substrate loading wait time, i.e., the waiting time (S424, S444), and improving throughput.

[0057] For example, in this embodiment, when there is a coexistence (conflict) between the need to request the coating and developing apparatus 3 to load a substrate into the first load section 33 and the need to request the coating and developing apparatus 3 to unload a substrate from the first unload section 34, the substrate load process is prioritized over the substrate unload process. Specifically, when there is a substrate to be loaded into the first load section 33 and a substrate to be unloaded from the first unload section 34, the transport mode for transporting substrates between the exposure apparatus 2 and the coating and developing apparatus 3 is changed to a load-in priority mode. The load-in priority mode is a transport mode in which loading a substrate into the first load section 33 is prioritized over unloading a substrate from the first unload section 34. Note that in this embodiment, the transport mode for transporting substrates between the exposure apparatus 2 and the coating and developing apparatus 3 includes a normal mode in addition to the load-in priority mode. The normal mode is a transport mode in which, as explained in the prior art (Figures 3 and 4), the substrate loading process is not given priority over the substrate unloading process, and once a substrate is placed on the first unloading section 34, the substrate unloading process is performed immediately.

[0058] The process relating to the transport of the substrate in this embodiment, that is, the transport process (transport method) will be described below. Fig. 5 is a diagram showing the transport sequence of the substrate between the exposure apparatus 2 and the coating and developing apparatus 3 in this embodiment.

[0059] 5, in this embodiment, during the substrate carry-in standby state, as shown in S52, when a substrate for which exposure processing has been completed (exposed substrate) is placed on the first unloader 34, a carry-in / out sequential control process shown in S5 is performed before a substrate unloading request (S33) is sent. In other words, in this embodiment (FIG. 5), compared to the prior art (FIG. 3), the process (S32) of placing the substrate on the first unloader 34 is replaced with a carry-in / out sequential control process (S5). In addition to the process (S52) of placing the substrate on the first unloader 34, the carry-in / out sequential control process includes a carry-in priority determination shown in S57 and a substrate carry-in standby process shown in S58.

[0060] In the carry-in priority determination (S57), it is determined whether the substrate carry-in process, in which a substrate is carried in from the coating and developing apparatus 3 to the exposure apparatus 2 and placed on the first carry-in unit 33, is to be given priority over the substrate carry-out process, in which a substrate placed on the first carry-out unit 34 is to be carried out from the exposure apparatus 2. In other words, it is determined whether the transport mode for transporting substrates between the exposure apparatus 2 and the coating and developing apparatus 3 is to be set to the carry-in priority mode. Here, if the substrate carry-in process is to be given priority over the substrate carry-out process, the substrate carry-in request (S33) is not immediately sent to the coating and developing apparatus 3, but rather the process waits for the start of the substrate carry-in process, i.e., the process starts a substrate carry-in standby (S58) in which the process waits for the substrate carry-in process. Then, as shown in S55, the substrate carry-in process is started during the substrate carry-in standby (S58). When the substrate carry-in process (S55) is started, a substrate carry-out request (S33) is sent to the coating and developing apparatus 3, and upon receiving the substrate carry-out request (S33), the substrate carry-out process is started as shown in S54.

[0061] FIG. 6 is a flowchart for explaining the carry-in / out sequential control process (S5). Referring to FIG. 6, in S52, a process is performed in which a substrate for which exposure processing has been completed (exposed substrate) is placed on the first unloading section 34. Once the substrate is placed on the first unloading section 34, a carry-in priority determination is performed in S57 to determine whether the substrate carry-in process is given priority over the substrate unloading process. If the substrate carry-in process is given priority over the substrate unloading process (if the carry-in mode is set to the carry-in priority mode), then in S58, a substrate carry-in standby is performed. Then, after performing the substrate carry-in standby, a substrate unloading request is transmitted in S33. On the other hand, if the substrate carry-in process is not given priority over the substrate unloading process, the substrate carry-in standby (S58) is not performed (i.e., immediately), and a substrate unloading request is transmitted in S33.

[0062] FIG. 7 is a flowchart for explaining an example of the load priority determination (S57). Referring to FIG. 7, in S571, it is determined whether the exposure apparatus 2 requires a subsequent substrate, specifically, whether there are any substrates (unloaded substrates) that have not been loaded from the coating and developing apparatus 3 into the exposure apparatus 2. For example, in a job in which 25 substrates constitute one lot, if the first five substrates have been loaded into the exposure apparatus 2, 20 substrates remain in the coating and developing apparatus 3, and therefore it is determined that there are any unloaded substrates (yes). Therefore, it is basically determined that there are any unloaded substrates until the 25th substrate, the final substrate of the lot, is loaded into the exposure apparatus 2. However, if an instruction to stop or interrupt the job is input, it is determined that there are no unloaded substrates (no), even if one lot is being processed, i.e., even if there are any unloaded substrates. In this way, if it is determined that there are any unloaded substrates, the process proceeds to S572. If it is determined that there are any unloaded substrates, the process proceeds to S574.

[0063] In S572, it is determined whether the exposure apparatus 2 is in a transportable state, specifically, whether the state of the first transport apparatus 6 is in a transportable state where a substrate to be loaded from the coating and developing apparatus 3 to the exposure apparatus 2 (first load unit 33) can be loaded. An example of a specific method for determining whether the first transport apparatus 6 is in a transportable state will be described below with reference to FIGS. 8A, 8B, 8C, and 8D. FIGS. 8A, 8B, 8C, and 8D respectively show the states of the load hand 35, the unload hand 36, the pre-alignment unit 30, and the supply hand 31 that constitute the first transport apparatus 6. Here, the states of the load hand 35, the unload hand 36, the pre-alignment unit 30, and the supply hand 31 refer to whether they are holding or placing a substrate.

[0064] For example, as shown in FIG. 8A, when none of the loading hand 35, unloading hand 36, pre-alignment section 30, and supply hand 31 constituting the first transport device 6 is holding or placing a substrate, the state of the first transport device 6 is determined to be in a transportable state (yes).

[0065] Starting from the state shown in Fig. 8A, when substrates are sequentially carried in from the coating and developing apparatus 3 to the exposure apparatus 2, the state shown in Fig. 8B is reached, for example. In the state shown in Fig. 8B, the carry-in hand 35, carry-out hand 36, pre-alignment unit 30, and supply hand 31 that make up the first transfer apparatus 6 are all holding or placing substrates, so no more substrates can be carried in to the exposure apparatus 2. Therefore, it is determined that the state of the first transfer apparatus 6 is not a transferable state (no).

[0066] 8A and 8B, for example, in the state shown in FIG. 8C, the carry-in hand 35 is not holding a substrate, so a substrate can be carried into the exposure apparatus 2. Therefore, the state of the first transport device 6 is determined to be a transportable state (Yes). Note that in the state shown in FIG. 8C, no substrate is placed on the pre-alignment unit 30, but even if a substrate is placed on the pre-alignment unit 30, the state of the first transport device 6 is determined to be a transportable state (Yes).

[0067] 8D, no substrate is placed on the pre-alignment unit 30, but the carry-in hand 35 is holding a substrate. In the exposure apparatus 2, the carry-in hand 35 is the next destination for the first carry-in unit 33, and if the carry-in hand 35 is holding a substrate, the first transport device 6 cannot transport the substrate. Therefore, it is determined that the state of the first transport device 6 is not a transportable state (no).

[0068] Therefore, in this embodiment, if the carry-in hand 35 is not holding a substrate (FIGS. 8A and 8C), the state of the first transfer device 6 is determined to be a transferable state. On the other hand, if the carry-in hand 35 is holding a substrate (FIGS. 8B and 8D), the state of the first transfer device 6 is determined to be not a transferable state. The current state of the carry-in hand 35 regarding its holding of a substrate (whether it is holding a substrate) can be obtained, for example, from the detection results of a sensor provided on the carry-in hand 35 or on the movement path of the carry-in hand 35.

[0069] In this way, if it is determined in S572 that the first transfer device 6 is in a transferable state, the process proceeds to S573, where the transfer mode for substrate transport is set to a carry-in priority mode in which substrate carry-in processing is prioritized over substrate carry-out processing. Also, if it is determined in S572 that the first transfer device 6 is not in a transferable state, the process proceeds to S574, where the transfer mode for substrate transport is set to a normal mode in which substrates are transported as in the prior art, without prioritizing substrate carry-in processing over substrate carry-out processing. In other words, in this embodiment, if there are unloaded substrates and the first transfer device 6 is in a transferable state, the substrate carry-in processing is prioritized over the substrate carry-out processing; otherwise, the substrate carry-in processing is not prioritized over the substrate carry-out processing.

[0070] 9 is a flowchart for explaining an example of substrate loading standby (S58). Referring to FIG. 9, in S581, it is determined whether a substrate has been loaded from the coating and developing apparatus 3 into the exposure apparatus 2, specifically, whether the substrate has been placed in the first load section 33. If the substrate has been placed in the first load section 33, the substrate loading standby is ended (cancelled). On the other hand, if a substrate has not been placed in the first load section 33, the process proceeds to S582.

[0071] In S582, it is determined whether the time elapsed since the start of substrate carry-in standby has exceeded the maximum standby time (a predetermined time). If the time elapsed since the start of substrate carry-in standby has exceeded the maximum standby time, the substrate carry-in standby is terminated. On the other hand, if the time elapsed since the start of substrate carry-in standby has not exceeded the maximum standby time, the process proceeds to S581, where it is determined again whether a substrate has been placed on the first carry-in section 33. In this way, the determination of whether a substrate has been placed on the first carry-in section 33 is repeated until the time elapsed since the start of substrate carry-in standby has exceeded the maximum standby time.

[0072] 10A and 10B, an example of a method for determining the maximum waiting time T in substrate loading standby (S58) will be described. Referring to FIG. 10A, graph 100 shown in the upper part is a timing chart showing the valid state of a substrate loading request (S31) by exposure apparatus 2. In graph 100, the low side indicates that the substrate loading request is not valid, and the high side indicates that the substrate loading request is valid. Graph 101 shown in the lower part is a timing chart showing the state of whether or not a substrate has been placed on first loader 33. In graph 101, the low side indicates that a substrate has not been placed on first loader 33, and the high side indicates that a substrate has been placed on first loader 33.

[0073] 10B, graph 110 shown in the upper part is a timing chart showing the valid state of a substrate carry-in request (S31) made by exposure apparatus 2, and graph 111 shown in the lower part is a timing chart showing the state of whether a substrate has been placed on first carry-in section 33. Furthermore, graph 112 shown in the middle part is a timing chart showing the valid state of a substrate unloading request (S33) made by exposure apparatus 2. In graph 112, the low side indicates that the substrate unloading request is not valid, and the high side indicates that the substrate unloading request is valid.

[0074] 10A corresponds to a case where a substrate carry-in request (S31) is sent when no substrate is placed on the first unloading unit 34. In this case, the time from when the substrate carry-in request is sent, i.e., from when the substrate carry-in request becomes valid, until the substrate is placed on the first loader 33 is set as the reference carry-in time t0 (first time). The reference carry-in time t0 is stored, for example, in a storage unit provided in the exposure apparatus 2.

[0075] 10B corresponds to a case where a substrate transport request (S31) is sent for the first time or at any timing after the start of a job, with the substrate placed on the first unloading unit 34. In this case, the time from when the substrate carry-in request is sent, i.e., from when the substrate carry-in request becomes valid, until the substrate placed on the first unloading unit 34 is unloaded and placed on the first loader 33, is defined as the unloading load time t1 (second time). The unloading load time t1 is stored, for example, in a storage unit provided in the exposure apparatus 2.

[0076] Once both the reference carry-in time t0 and the carry-in time at unloading t1 are stored (acquired), the first controller 7 of the exposure apparatus 2 sets (determines) a maximum waiting time T based on the reference carry-in time t0 and the carry-in time at unloading t1. For example, the difference (t0-t1) between the reference carry-in time t0 and the carry-in time at unloading t1 is set as the maximum waiting time T. The maximum waiting time T is stored, for example, in a memory unit that the exposure apparatus 2 has.

[0077] Once the maximum waiting time T is set, it can be expected that a substrate will be placed on the first loader 33 before the maximum waiting time T has elapsed since the start of the substrate loading standby process (S58), unless there is a significant fluctuation in the operating times of the exposure apparatus 2 and the coating and developing apparatus 3. Therefore, as is clear from a comparison of FIGS. 3 and 5, the start timing of the substrate loading process (S55) in this embodiment is earlier than the start timing of the substrate loading process (S35) in the prior art. In the exposure apparatus 2, as shown in FIG. 4, the exposure apparatus process (e.g., S442) and the substrate unloading process (e.g., S433) can be performed in parallel. Therefore, when processing multiple substrates consecutively, the throughput of the lithography system 1 (exposure apparatus 2) as a whole can be improved by the earlier start timing of the substrate being placed on the first loader 33.

[0078] Fig. 11 is a diagram showing an example of a time chart when a plurality of substrates, for example, six substrates, are continuously processed based on the transfer sequence in this embodiment shown in Fig. 5. In Fig. 11, the flow of time is shown from left to right, and the order of the substrates to be processed is shown from top to bottom.

[0079] First, the exposure apparatus 2 carries in (starts) the first substrate, as shown in S1101. Next, the exposure apparatus 2 transports the first substrate sequentially to each section of the exposure apparatus 2, and as shown in S1102, performs exposure apparatus processing including various alignment processes and exposure processes. Then, once the exposure apparatus processing for the first substrate (S1102) is complete, the exposure apparatus 2 carries out the first substrate, as shown in S1103.

[0080] As shown in S1111, when the loading of the second substrate is performed (started), the exposure device processing (S1102) for the first substrate is still being performed, so no substrate is placed (present) on the first unloading unit 34. Therefore, the time from the request for loading of the second substrate shown in S1115 (from the transmission of the substrate loading request) to the start of loading of the second substrate shown in S1111 is acquired (stored) as the reference loading time t0.

[0081] On the other hand, as shown in S1121, when the loading of the third substrate is to be performed (started), the unloading of the first substrate (S1103) has already started, so a substrate is placed (present) on the first unloading section 34. Therefore, the time from the request for loading of the third substrate shown in S1125 (from the transmission of the substrate load request) to the start of loading of the third substrate shown in S1121 is acquired (stored) as the unloading load time t1. Here, since the reference load time t0 and the unloading load time t1 have been acquired, the maximum waiting time T = t0 - t1 is set (stored).

[0082] When exposure device processing of the third substrate shown in S1122 is completed, the maximum wait time T has already been set, so substrate load standby is started as shown in S1126. As a result, load of the fifth substrate is carried out (started) as shown in S1141 before the maximum wait time T has elapsed since the start of exposure processing of the third substrate (S1122). As described above, in the prior art (FIG. 4), substrate load standby (S444) is required before load of the fifth substrate (S441). On the other hand, in this embodiment, the start of load of the fifth substrate (S1141) can be brought forward by the amount of substrate load standby (S444).

[0083] Furthermore, in this embodiment, the unloading of the third substrate shown in S1123 occurs after the loading of the fifth substrate (S1141). However, because the unloading of the third substrate (S1123) and the exposure apparatus processing of the fourth substrate shown in S1132 are performed in parallel, there is no effect on the overall throughput of the lithography system 1 (exposure apparatus 2).

[0084] Furthermore, in this embodiment, after the fifth substrate is unloaded in S1143 and after the sixth substrate is unloaded in S1153, it is determined in the determination (S571) whether or not there are any unloaded substrates, and it is determined that there are no unloaded substrates (No). Therefore, the substrate loading process does not take priority over the substrate unloading process, and there is no waiting for substrate loading as shown in S1125.

[0085] As described above, according to this embodiment, the overall throughput of the lithography system 1 (exposure apparatus 2) can be improved compared to the prior art. For example, while Fig. 11 illustrates the case where six substrates are processed continuously, the same applies to the seventh and subsequent substrates; for every two substrates, the throughput can be improved by an amount equivalent to one substrate load standby. Therefore, when one lot, i.e., 25 substrates, is processed continuously, the substrate load standby can be reduced by 11 times, improving the throughput.

[0086] In this embodiment, as shown in FIG. 11, the maximum waiting time T (unloading load time t1) is set only at the start of loading the third substrate (S1121). However, if the operating time of the coating and developing apparatus 3 fluctuates significantly, the next substrate will not necessarily be loaded before the maximum waiting time T has elapsed. In anticipation of such a case, the unloading load time t1 is also set when loading the fourth and subsequent substrates. n The maximum waiting time T may be updated for each board by acquiring the maximum waiting time T. When updating the maximum waiting time T, the immediately preceding carry-in time t n The maximum waiting time T may be updated based on the n , t n-1 , t n-2 , .... In this way, by updating the maximum waiting time T in accordance with the processing of substrates in the exposure tool 2, it is possible to increase the robustness of the coating and developing tool 3 against fluctuations in the operating time.

[0087] Furthermore, in this embodiment, the explanation has been given on the assumption that the time required for exposure apparatus processing (S1102, etc.) is constant. However, in reality, the time required for exposure apparatus processing may fluctuate due to changes in processing on a substrate-by-substrate basis, the occurrence of some kind of abnormal recovery, and so on. If, for example, the time required for exposure apparatus processing increases after setting the maximum wait time T, it is possible to shorten the maximum wait time T accordingly. On the other hand, if, for example, the time required for exposure apparatus processing decreases after setting the maximum wait time T, it is necessary to lengthen the maximum wait time T accordingly. Therefore, the maximum wait time T may be increased or decreased depending on fluctuations in the time required for exposure apparatus processing. In this way, by setting the maximum wait time T based also on the time required for processing the substrate (exposure apparatus processing) in the exposure apparatus 2, robustness to fluctuations in the time required for exposure apparatus processing can be improved.

[0088] Furthermore, in this embodiment, the determination of the carry-in priority (S57) focuses on whether the carry-in hand 35 constituting the first transfer device 6 is holding a substrate. However, whether the carry-in hand 35 is holding a substrate (whether it is in a transferable state) changes from moment to moment. For example, when the substrate carry-in standby begins, the carry-in hand 35 may hold a substrate. However, during the substrate carry-in standby period, the substrate held by the carry-in hand 35 may move to the pre-alignment unit 30. In such a case, the time (holding time) that the carry-in hand 35 constituting the first transfer device 6 has held the substrate may be acquired in advance, and then whether the carry-in hand 35 is holding the substrate may be determined. For example, the holding time of the substrate by the carry-in hand 35, i.e., the current state of the carry-in hand 35 regarding its holding of the substrate, is estimated from the motion profile of the carry-in hand 35. Then, whether the carry-in hand 35 is holding a substrate is determined based on the current state of the carry-in hand 35 regarding its holding of the substrate, which is estimated from the motion profile of the carry-in hand 35. In this way, in determining the loading priority (S57), by estimating how the current situation regarding the holding of the substrate by the loading hand 35 will change during the maximum waiting time T, it is possible to make a more rigorous determination of the loading priority.

[0089] The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as devices (semiconductor elements, magnetic storage media, liquid crystal display elements, etc.). This manufacturing method includes the steps of forming a pattern on a substrate using a lithography system 1 (exposure apparatus 2), processing the substrate on which the pattern has been formed, and manufacturing an article from the processed substrate. This manufacturing method may also include other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0090] In the above embodiments, an exposure apparatus has been described as an example of a processing apparatus for processing a substrate, but the present invention is not limited to this. For example, processing apparatuses for processing a substrate include an imprinting apparatus that uses a mold to form a pattern on the substrate with an imprint material on the substrate, and a planarizing apparatus that uses a mold having a flat surface to planarize a composition on the substrate. Processing apparatuses for processing a substrate also include a drawing apparatus that draws a pattern on a substrate using a charged particle beam (such as an electron beam or an ion beam).

[0091] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0092] 1: Lithography system 2: Exposure device 3: Coating and developing device 6: First transfer device 7: First control unit 20: Main body 33: First loading section 34: First unloading section 35: Loading hand 36: Unloading hand

Claims

1. A processing apparatus for processing a plurality of substrates transferred from an external apparatus, a transport unit including an input unit on which a substrate to be loaded into the processing device from the external device is placed, and an output unit on which a substrate to be unloaded from the processing device to the external device is placed, and which transports the substrate between the input unit, the output unit, and a processing unit that processes the substrate; a control unit that controls the transfer of the substrate between the external device and the processing device in accordance with a transfer mode, the transport mode includes a carry-in priority mode in which, when there are substrates to be carried into the carry-in unit and substrates to be carried out from the carry-out unit, carrying the substrates into the carry-in unit takes priority over carrying the substrates out of the carry-out unit; The processing apparatus includes any one of an exposure apparatus, an imprint apparatus, a planarization apparatus, and a drawing apparatus.

2. The processing apparatus according to claim 1, characterized in that the control unit determines whether to set the transport mode to an in-load priority mode before requesting the external device to load a substrate into the in-load unit or unload a substrate from the unload unit.

3. The processing apparatus according to claim 1 or 2, characterized in that the control unit determines whether to set the transport mode to an input priority mode based on whether the state of the transport unit is in a transportable state in which the transport unit can transport a substrate being loaded into the loading unit from the external device.

4. the transport unit further includes a transport hand for holding the substrate carried into the loading unit from the external device and transporting the substrate between the loading unit and the processing unit; The control unit If the transport hand is not holding a substrate, it is determined that the state of the transport unit is in the transportable state, and the transport mode is set to a carry-in priority mode; 4. The processing apparatus according to claim 3, wherein when the transport hand is holding a substrate, it is determined that the state of the transport unit is not in the transportable state, and the transport mode is not set to the load priority mode.

5. The processing apparatus according to claim 4, characterized in that the control unit determines whether the transport hand is holding a substrate based on a detection result of a current state regarding the transport hand's holding of a substrate, or based on a current state regarding the transport hand's holding of a substrate estimated from an operation profile of the transport hand.

6. In the carry-in priority mode, when a substrate is placed on the unloading unit in a state in which the external device has not completed preparation for loading the substrate after the control unit has requested the external device to load the substrate into the loading unit, the control unit waits until a predetermined time has elapsed before requesting the external device to unload the substrate from the transport unit; A processing apparatus as described in any one of claims 1 to 5, characterized in that when a substrate is transported from the external device and placed on the loading section before the predetermined time has elapsed, the control unit requests the external device to unload the substrate from the transport section after the transport section begins transporting the substrate placed on the loading section.

7. The processing apparatus according to claim 6, characterized in that in the loading priority mode, if a substrate is not loaded from the external device before the predetermined time has elapsed, the control unit requests the external device to unload the substrate from the transport unit.

8. The predetermined time is a first time period from when the control unit requests the external device to carry in a substrate to the carry-in unit in a state where no substrate is placed on the carry-out unit until the substrate is carried in from the external device and placed on the carry-in unit; a second time period from when the control unit requests the external device to carry the substrate into the carry-in unit, with the substrate placed on the carry-out unit, until the substrate placed on the carry-out unit is carried out, and the substrate is carried in from the external device and placed on the carry-in unit; 8. The processing device according to claim 6, wherein the processing device is set based on the following:

9. 9. The processing device according to claim 8, wherein the predetermined time is set to a difference between the first time and the second time.

10. 9. The processing apparatus according to claim 8, wherein the predetermined time is set based on the time required to process the substrate in the processing section.

11. 11. The processing apparatus according to claim 6, wherein the predetermined time is updated in accordance with the processing of the substrate in the processing section.

12. The processing device according to claim 1, wherein the processing device is the exposure device, 12. The processing apparatus according to claim 1, wherein the processing section includes a projection optical system for projecting a pattern of an original onto the substrate as part of the processing of the substrate.

13. A transport method for transporting a substrate between a processing apparatus including an input unit on which a substrate to be loaded from an external apparatus is placed, and an output unit on which a substrate to be loaded to the external apparatus is placed, the processing apparatus having a transport unit that transports the substrate between the input unit, the output unit, and a processing unit that processes the substrate, and the external apparatus, comprising: The processing device includes any one of an exposure device, an imprint device, a planarization device, and a drawing device, controlling the transfer of the substrate between the external device and the processing device in accordance with a transfer mode; A transport method characterized in that the transport mode includes an in-load priority mode that prioritizes loading a substrate into the in-load section over unloading a substrate from the unloading section when there is a substrate to be loaded into the in-load section and a substrate to be unloaded from the unloading section.

14. forming a pattern on a substrate using the processing apparatus according to claim 12; processing the substrate on which the pattern has been formed in the process; manufacturing an article from the processed substrate; A method for manufacturing an article, comprising:

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