Temperature adjustment device and temperature adjustment method

Abstract

To easily determine in a short time whether or not a relation between a real temperature of an object and a detected temperature value is proper.SOLUTION: A temperature adjusting device comprises: a thermal processing unit which is provided so as to adjust a temperature of an object; a power supply circuit 412 which supplies power to the thermal processing unit based on a power manipulated variable; a temperature sensor Se which detects the temperature of the object; a conversion unit which converts an output value of the temperature sensor Se into a detected temperature value; a storage unit 440 for storing a power manipulated variable, which should be given to the power supply circuit 412 in a case where the detected temperature value is in a proper state at the time of initial setting, as a proper power manipulated variable; a power control unit for controlling a power manipulated variable in such a manner that the detected temperature value corresponding to the temperature sensor Se is coincident with a target temperature value during a temperature adjusting operation and giving the proper power manipulated variable stored in the storage unit 440 to the power supply circuit in a detected temperature deviation determination; and a determination unit 460 for determining whether or not the detected temperature value obtained by the conversion unit is in an improper state in the detected temperature deviation determination.SELECTED DRAWING: Figure 17

Description

[Technical Field]

[0001] The present invention relates to a temperature adjustment device and a temperature adjustment method. [Background technology]

[0002] For example, heat treatment apparatuses are used to perform heat treatment on substrates such as semiconductor substrates (semiconductor wafers). In the heat treatment apparatus, the temperature of the substrate is adjusted to a preset value. For example, the heat treatment apparatus described in Patent Document 1 includes a heat treatment plate on which the substrate is placed. The heat treatment plate includes a temperature sensor and a heater. The heater is controlled based on a detection signal from the temperature sensor, thereby controlling the temperature of the heat treatment plate to a set temperature. Patent Document 2 describes a substrate heat treatment apparatus having a heating plate divided into multiple regions. In this substrate heat treatment apparatus, the temperature of each region of the heating plate is controlled individually. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2020-181948 [Patent Document 2] Japanese Patent Application Laid-Open No. 2013-162097 Summary of the Invention [Problem to be solved by the invention]

[0004] When the temperatures of multiple regions of a heat-treating plate are individually controlled, a heater and a temperature sensor are provided in each region. In this case, the heater in each region is controlled based on the temperature detected by the temperature sensor. Typically, the relationship between the temperature detected by the temperature sensor and the actual temperature of the heat-treating plate varies from region to region. Therefore, when installing the heat-treating device, the actual temperature of each region on the upper surface of the heat-treating plate is measured using a separately prepared temperature-measuring substrate, and the detected temperature of each temperature sensor in each region is corrected so that the temperatures of the multiple regions of the heat-treating plate are uniform. Here, the temperature-measuring substrate is a substrate equipped with multiple temperature sensors.

[0005] However, due to deterioration of the temperature sensors in each region or changes in the wiring resistance of the sensors during maintenance, the relationship between the temperature detected by the temperature sensors and the temperature of the heat-treating plate may change in some regions. In such cases, the temperature of the entire top surface of the heat-treating plate may not be uniform. Therefore, it is necessary to periodically check whether the temperature of the heat-treating plate is uniform.

[0006] Typically, the temperature of multiple regions of the heat-treating plate is measured periodically using a temperature measurement substrate, but it is necessary to periodically check whether the temperature of the heat-treating plate is uniform using the temperature measurement substrate.

[0007] Even in heat treatment equipment with a heat treatment plate that is not divided into multiple regions, the relationship between the temperature detected by the temperature sensor and the temperature of the heat treatment plate can change due to deterioration of the temperature sensor over time or changes in the wiring resistance of the sensor during maintenance. This can cause the temperature detected by the temperature sensor to differ from the actual temperature of the heat treatment plate. Therefore, it is necessary to periodically check the relationship between the actual temperature of the heat treatment plate and the temperature detected by the temperature sensor using a temperature measurement board.

[0008] An object of the present invention is to provide a temperature adjustment device and a temperature adjustment method that can easily determine in a short time whether the relationship between the actual temperature of an object and a detected temperature value is appropriate. [Means for solving the problem]

[0009] (1) A temperature adjustment device according to one aspect of the present invention is a temperature adjustment device that adjusts the temperature of an object, and includes a heat processing unit configured to adjust the temperature of the object, a power supply circuit that supplies power to the heat processing unit based on a power manipulation amount, a temperature sensor that detects the temperature of the object, a conversion unit that converts the output value of the temperature sensor into a detected temperature value, a memory unit that stores, at initial setting, the power manipulation amount to be applied to the power supply circuit when the detected temperature value obtained by the conversion unit is in an appropriate state as an appropriate power manipulation amount, a power control unit that, during temperature adjustment operation, controls the power manipulation amount so that the detected temperature value corresponding to the temperature sensor matches a target temperature value, and, when a detected temperature deviation is determined, provides the appropriate power manipulation amount stored in the memory unit to the power supply circuit, and, when a detected temperature deviation is determined, a judgment unit that determines whether the detected temperature value obtained by the conversion unit is in an inappropriate state.

[0010] In the temperature control device, the relationship between the output value of the temperature sensor and the detected temperature value is adjusted in advance during initial setup, and an appropriate power manipulation amount, which is the power manipulation amount for obtaining an appropriate detected temperature value, is stored in a memory unit during initial setup.

[0011] During temperature adjustment operation, the manipulated power amount is controlled so that the detected temperature value matches the target temperature value. After initial setting, the relationship between the temperature sensor output value and the detected temperature value may change due to changes in the temperature sensor characteristics or wiring resistance. In this case, a deviation occurs in the relationship between the actual temperature of the object and the detected temperature value. This causes the detected temperature value to become inappropriate. Therefore, it is necessary to determine whether the detected temperature value is inappropriate.

[0012] According to the above configuration, when a detected temperature deviation is determined, the appropriate power manipulation amount stored in the memory unit at the time of initial setup is applied to the power supply circuit. In this case, power corresponding to the appropriate power manipulation amount is supplied to the thermal processing unit. As a result, the actual temperature of the object at the time of the detected temperature deviation determination becomes equal to the actual temperature of the object at the time of initial setup. Therefore, it is possible to easily determine whether the detected temperature value at the time of the detected temperature deviation determination is in an inappropriate state. As a result, it is possible to easily determine in a short time whether the relationship between the actual temperature of the object and the detected temperature value is appropriate.

[0013] (2) The temperature adjustment device further includes a heat treatment plate having a processing surface on which a substrate as an object is placed, the processing surface of the heat treatment plate having a plurality of regions, a plurality of heat treatment sections provided corresponding to the plurality of regions of the processing surface, the power supply circuit configured to supply power to each of the plurality of heat treatment sections based on a plurality of power control amounts corresponding to the plurality of regions, a plurality of temperature sensors provided corresponding to the plurality of regions, the conversion unit configured to convert the output values of the plurality of temperature sensors into a plurality of detected temperature values, respectively, the memory unit configured to store a plurality of appropriate power control amounts corresponding to the plurality of regions at the time of initial setting, the power control unit configured to control each of the plurality of power control amounts during the temperature adjustment operation so that the plurality of detected temperature values corresponding to the plurality of temperature sensors respectively match the target temperature value, and configured to provide the plurality of appropriate power control amounts stored in the memory unit to the power supply circuit at the time of determining the detected temperature deviation, and the determination unit configured to determine whether at least one of the plurality of detected temperature values obtained by the conversion unit is in an inappropriate state at the time of determining the detected temperature deviation.

[0014] In this case, the processing surface of the heat-treating plate has multiple regions, and multiple heat processing units and multiple temperature sensors are provided corresponding to the multiple regions. During initial setup, the relationships between the output values of the multiple temperature sensors and the multiple detected temperature values are adjusted in advance. Furthermore, during initial setup, multiple optimal power control amounts, which are power control amounts for obtaining the multiple detected temperature values in optimal states, are stored in a memory unit.

[0015] During the temperature adjustment operation, multiple power manipulation amounts are controlled so that multiple detected temperature values corresponding to multiple regions of the heat treatment plate coincide with the target temperature value. During the detected temperature deviation determination, multiple appropriate power manipulation amounts stored in the memory unit at the time of initial setup are applied to the power supply circuit. In this case, power corresponding to the multiple appropriate power manipulation amounts is supplied to each of the multiple heat treatment units of the heat treatment plate. This ensures that the actual temperatures of the multiple regions of the heat treatment plate at the time of determining the detected temperature deviation are equal to the actual temperatures of the multiple regions of the heat treatment plate at the time of initial setup. Therefore, it is possible to quickly and easily determine whether the detected temperature value corresponding to at least one region is in an inappropriate state.

[0016] (3) In the temperature control device, at the time of initial setting, when the actual temperatures of multiple regions of the heat treatment plate are equal, multiple appropriate power operation amounts are set so that the multiple detected temperature values corresponding to the multiple regions are identical, and when determining the detected temperature deviation, the judgment unit may determine whether at least one of the multiple detected temperature values obtained by the conversion unit is in an inappropriate state based on whether the difference between the maximum detected temperature value and the minimum detected temperature value obtained by the conversion unit is greater than a predetermined allowable temperature deviation amount.

[0017] In this case, even if the power supplied to each heat treatment unit differs between the time of initial setup and the time of determining the detected temperature deviation due to temporal fluctuations in the voltage applied to the heat treatment unit in each region, it is possible to determine whether at least one of the multiple detected temperature values is in an inappropriate state.

[0018] (4) At the time of initial setting, the memory unit stores the detected temperature value of the appropriate state when the appropriate power operation amount is given to the power supply circuit as the appropriate detected temperature value, and at the time of determining the detected temperature deviation, the judgment unit may determine whether the detected temperature value obtained by the conversion unit is in an inappropriate state for each region based on each of the multiple detected temperature values obtained by the conversion unit and the corresponding appropriate detected temperature value.

[0019] In this case, if there is no or small fluctuation in the voltage applied to each thermal processing unit, the power supplied to each thermal processing unit during the detected temperature deviation determination is equal to the power supplied to each thermal processing unit during the initial setting. Therefore, by comparing the detected temperature value of each region obtained during the detected temperature deviation determination with the corresponding appropriate detected temperature value, it is possible to determine whether each detected temperature value is in an inappropriate state. This makes it possible to identify which detected temperature value corresponds to which region.

[0020] (5) The temperature adjustment device further includes a voltage value acquisition unit that acquires the value of the voltage applied to the heat treatment unit by the power supply circuit, and a correction unit that corrects the detected temperature value obtained by the conversion unit, and the memory unit stores the voltage value acquired by the voltage value acquisition unit as a reference voltage value at the time of initial setup, and the correction unit corrects the detected temperature value obtained by the conversion unit at the time of determining the detected temperature deviation to the detected temperature value that would be obtained if the reference voltage value stored in the memory unit were applied to the heat treatment unit, based on the relationship between the value of the voltage applied to the heat treatment unit and the detected temperature value obtained by the conversion unit, and the judgment unit may judge whether the detected temperature value obtained by the conversion unit at the time of determining the detected temperature deviation is in an inappropriate state based on the detected temperature value corrected by the correction unit and the appropriate detected temperature value stored in the memory unit.

[0021] In this case, even if the voltage value applied during the detection temperature deviation determination differs from the reference voltage value applied during the initial setting, the detection temperature value of each region obtained during the detection temperature deviation determination is corrected to correspond to the reference voltage value based on the relationship between the voltage value and the detection temperature value. Therefore, by comparing the corrected detection temperature value of each region with the corresponding appropriate detection temperature value during the detection temperature deviation determination, it is possible to determine whether each detection temperature value is in an inappropriate state. As a result, even if the voltage applied to the thermal processing unit of each region fluctuates over time, it is possible to identify which detection temperature value corresponds to the inappropriate state.

[0022] (6) The temperature adjustment device may further include a notification unit that issues an alarm when the determination unit determines that the detected temperature value obtained by the conversion unit is in an inappropriate state during the detection temperature deviation determination.

[0023] In this case, the user can immediately recognize the need to perform the initial settings again.

[0024] (7) A temperature adjustment method for adjusting the temperature of an object using a temperature adjustment device, comprising: The temperature adjustment device includes a heat treatment section configured to adjust the temperature of an object, a power supply circuit configured to supply power to the heat treatment section based on a power manipulation amount, a temperature sensor configured to detect the temperature of the object, and a conversion section configured to convert an output value of the temperature sensor into a detected temperature value; The temperature adjustment method may include a step of storing, at the time of initial setting, the power manipulation amount to be applied to the power supply circuit when the detected temperature value obtained by the conversion unit is in an appropriate state as an appropriate power manipulation amount; a step of controlling, during temperature adjustment operation, the power manipulation amount so that the detected temperature value corresponding to the temperature sensor matches the target temperature value; a step of applying the stored appropriate power manipulation amount to the power supply circuit when determining a deviation in the detected temperature; and a step of determining, when determining a deviation in the detected temperature, whether the detected temperature value obtained by the conversion unit is in an inappropriate state.

[0025] According to this temperature adjustment method, when a detected temperature deviation is determined, the appropriate power manipulation amount stored in the memory unit at the time of initialization is applied to the power supply circuit. In this case, power corresponding to the appropriate power manipulation amount is supplied to the thermal processing unit. As a result, the actual temperature of the object at the time of determining the detected temperature deviation becomes equal to the actual temperature of the object at the time of initialization. Therefore, it is possible to easily determine whether the detected temperature value at the time of determining the detected temperature deviation is in an inappropriate state. As a result, it is possible to easily determine in a short time whether the relationship between the actual temperature of the object and the detected temperature value is appropriate. [Effects of the Invention]

[0026] According to the present invention, it is possible to easily determine in a short time whether the relationship between the actual temperature of an object and the detected temperature value is appropriate. [Brief explanation of the drawings]

[0027] [Figure 1] 1 is a schematic side view showing a configuration of a heat treatment apparatus according to an embodiment; [Figure 2] FIG. 2 is a schematic plan view of the heat treatment plate of FIG. 1. [Figure 3] FIG. 10 is a diagram illustrating an example of the relationship between actual temperatures, detected temperature values, and power manipulation amounts in a plurality of regions at the time of initial setting. [Figure 4] 10 is a diagram illustrating an example of the relationship between actual temperatures, detected temperature values, and power manipulation amounts in a plurality of regions when a detected temperature deviation is determined. FIG. [Figure 5] 10 is a diagram showing another example of the relationship between the actual temperatures, detected temperature values, and power manipulation amounts in a plurality of regions when a detected temperature deviation is determined. FIG. [Figure 6] 10A and 10B are diagrams illustrating an example of changes in detected temperature values due to changes in voltages applied to each heater. [Figure 7] 10A and 10B are diagrams illustrating an example of changes in detected temperature values due to changes in voltages applied to each heater. [Figure 8] 10A and 10B are diagrams illustrating an example of changes in detected temperature values due to changes in voltages applied to each heater. [Figure 9] 10A and 10B are diagrams illustrating an example of changes in detected temperature values due to changes in voltages applied to each heater. [Figure 10] 10A and 10B are diagrams illustrating an example of changes in detected temperature values due to changes in voltages applied to each heater. [Figure 11] 10A and 10B are diagrams illustrating an example of changes in detected temperature values due to changes in voltages applied to each heater. [Figure 12] 10A and 10B are diagrams illustrating an example of changes in detected temperature values due to changes in voltages applied to each heater. [Figure 13] 10 is a diagram showing the relationship between the amount of detected temperature deviation when a detected temperature deviation occurs in one region and the amount of change in detected temperature values in a plurality of regions. FIG. [Figure 14]10 is a diagram showing the relationship between the amount of detected temperature deviation when a detected temperature deviation occurs in one region and the amount of change in detected temperature values in a plurality of regions. FIG. [Figure 15] 10 is a diagram showing the relationship between the amount of detected temperature deviation when a detected temperature deviation occurs in one region and the amount of change in detected temperature values in a plurality of regions. FIG. [Figure 16] 10 is a diagram showing the relationship between the detected temperature deviation amount in each region and the variation in the detected temperature value in each region. FIG. [Figure 17] 2 is a block diagram showing the functional configuration of a control unit in FIG. 1. FIG. [Figure 18] 18 is a flowchart showing an example of a control operation of the control unit in FIG. 17. [Figure 19] 10A and 10B are diagrams illustrating an example of changes in detected temperature values due to fluctuations in voltage applied to a heater. [Figure 20] FIG. 20 is a diagram showing the correlation between the voltage applied to the heater and the detected temperature value. [Figure 21] FIG. 10 is a block diagram showing the functional configuration of a control unit of a heat treatment apparatus according to another embodiment. [Figure 22] FIG. 10 is a block diagram showing the functional configuration of a control unit of a heat treatment apparatus according to yet another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0028] A temperature adjustment device and a temperature adjustment method according to an embodiment of the present invention will be described in detail below with reference to the drawings. In the following description, a heat treatment device for heat treatment of a substrate will be described as an example of a temperature adjustment device. In this case, the substrate is the object of temperature adjustment. The substrate may be a semiconductor substrate (semiconductor wafer), a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell.

[0029] (1) Configuration of heat treatment equipment Fig. 1 is a schematic side view showing the configuration of a heat-treating apparatus according to one embodiment. Fig. 2 is a schematic plan view of the heat-treating plate of Fig. 1. As shown in Fig. 1, the heat-treating apparatus 100 includes a heat-treating plate 10, a temperature sensor group 20, a heater group 30, a control unit 40, a display unit 50, and a power supply circuit PG. In this embodiment, the heat-treating apparatus 100 is a heating apparatus, and the heat-treating plate 10 is a heating plate.

[0030] The heat-treating plate 10 is a metal heat-transfer plate having a flat, cylindrical shape and a flat upper surface. The upper surface of the heat-treating plate 10 is configured so that a substrate W to be heat-treated can be placed on it. The upper surface of the heat-treating plate 10 is provided with a plurality of proximity balls and the like that support the lower surface of the substrate W. In this embodiment, the upper surface of the heat-treating plate 10 is the processing surface. In FIG. 1, the substrate W placed on the heat-treating plate 10 is indicated by a dashed line.

[0031] The heat-treating plate 10 includes a temperature sensor group 20 and a heater group 30. The temperature sensor group 20 includes a plurality of temperature sensors Se shown in Fig. 2. The heater group 30 includes a plurality of heaters He shown in Fig. 2. The heaters He are, for example, mica heaters or Peltier elements.

[0032] The control unit 40 controls the heater group 30 based on the temperature detected by the temperature sensor group 20. Specifically, the control unit 40 applies a voltage supplied from the power supply circuit PG to the heater group 30 based on the temperature detected by the temperature sensor group 20. Here, in the control unit 40, in order to perform PID (proportional-integral-derivative) control of the power supplied to the heater He in each region, the power manipulation amount is controlled based on the difference between a detected temperature value (described later) and a preset temperature (hereinafter referred to as a target temperature value). In this embodiment, the power manipulation amount is a duty ratio.

[0033] As a result, the temperature of the processing surface of the heat-treating plate 10 is maintained at the target temperature. In this state, the substrate W is subjected to heat treatment. This operation will be referred to as the temperature adjustment operation hereinafter. The control unit 40 includes, for example, a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and a storage device. The display unit 50 includes, for example, a liquid crystal display device or an organic electroluminescence display device, and is used to display various images.

[0034] As shown in Fig. 2, the heat treatment plate 10 is divided into multiple regions Z1 to Z6 in a plan view. Region Z1 is arranged in a circular shape in the center of the heat treatment plate 10. Region Z2 is arranged in an annular shape surrounding region Z1. Regions Z3 to Z6 are each arranged in a partial annular shape surrounding region Z2.

[0035] Each of the multiple zones Z1 to Z6 is provided with multiple temperature sensors Se and heaters He. The multiple temperature sensors Se provided in the multiple zones Z1 to Z6 constitute the temperature sensor group 20 in FIG. 1. The multiple heaters He provided in the multiple zones Z1 to Z6 constitute the heater group 30 in FIG. 1. In this embodiment, the multiple heaters He are controlled so that the temperature of the processing surface of the heat-treating plate 10 becomes equal to the target temperature value. Hereinafter, the actual temperature of the processing surface of the heat-treating plate 10 will be referred to as the actual temperature.

[0036] The output values of the temperature sensors Se in the multiple regions Z1 to Z6 are converted into temperature values. The output value of each temperature sensor Se is, for example, a voltage value. The relationship between the output value of each temperature sensor Se and the temperature value is known. The output value of each temperature sensor Se may or may not be proportional to the temperature value. The temperature value of each region obtained by the temperature conversion unit 420 (see FIG. 17), which will be described later, is called the detected temperature value. In this embodiment, the average value of the multiple temperature values corresponding to the output values of the multiple temperature sensors Se in each of the regions Z1 to Z6 is used as the detected temperature value for that region Z1 to Z6. In this embodiment, the control unit 40 duty-controls the power supplied to the heater He in each region so that the detected temperature value in each of the multiple regions Z1 to Z6 becomes equal to the target temperature value.

[0037] In each of the zones Z1-Z6 of the heat-treating plate 10, the actual temperature of the processing surface of the heat-treating plate 10 is not necessarily equal to the temperature of the portion of the heat-treating plate 10 where the temperature sensors Se are located. Even if the actual temperatures of the processing surfaces of the zones Z1-Z6 of the heat-treating plate 10 are the same, the temperatures of the portions of the heat-treating plate 10 where the temperature sensors Se are located are not necessarily the same. Furthermore, the characteristics of the temperature sensors Se in the zones Z1-Z6 are not necessarily the same. Therefore, even if the actual temperatures of the processing surfaces of the zones Z1-Z6 of the heat-treating plate 10 are the same, the output values of the temperature sensors Se in the zones Z1-Z6 may differ. In other words, even if the output values of the temperature sensors Se in the zones Z1-Z6 are the same, the actual temperatures of the processing surfaces of the zones Z1-Z6 of the heat-treating plate 10 are not necessarily the same.

[0038] Therefore, when converting the output value of each temperature sensor Se into a detected temperature value, the relationship between the output value of each temperature sensor Se and the detected temperature value is adjusted for each temperature sensor Se. For example, if the output value of the temperature sensor Se is proportional to the temperature value, the conversion formula for converting the output value Vs [mV] of the temperature sensor Se into the detected temperature value Td [°C] is Td = kVs + OF, where k is a conversion coefficient and OF is an offset value.

[0039] As described above, the output values of the temperature sensors Se in the regions Z1-Z6 may differ even though the actual temperatures of the regions Z1-Z6 are the same. In such cases, the offset values OF used to convert the output values of the temperature sensors Se into detected temperature values are adjusted in advance so that the detected temperature values in the regions Z1-Z6 are the same when the actual temperatures of the regions Z1-Z6 of the heat-treating plate 10 are the same. As a result, when the actual temperature of the processing surface of the heat-treating plate 10 is uniform, the detected temperature values corresponding to the regions Z1-Z6 will be the same.

[0040] Hereinafter, the process of setting the manipulated power amount for each of the multiple zones Z1 to Z6 of the heat-treating plate 10 so that the actual temperatures of the processing surfaces of the zones are equal, and adjusting the offset value OF for each zone so that the actual temperatures of the processing surfaces of the zones are equal to the detected temperature values, will be referred to as "initial setting." In this embodiment, the initial setting is performed using a temperature measurement substrate (hereinafter referred to as a temperature measurement wafer) during the manufacture or installation of the heat-treating apparatus 100. Immediately after the initial setting, the detected temperature values in each zone correspond to the actual temperatures of the processing surfaces of the heat-treating plate 10. Hereinafter, the detected temperature values in each zone immediately after the initial setting will be referred to as "optimal state temperature values."

[0041] However, due to deterioration of the temperature sensor Se in each region over time or changes in the wiring resistance of the temperature sensor Se during maintenance, the relationship between the output value of the temperature sensor Se in one region and the detected temperature value may change. This causes the detected temperature value in that region to deviate from the appropriate state temperature value. Hereinafter, the deviation amount of the detected temperature value from the appropriate state temperature value in each region (the difference between the detected temperature value and the appropriate state temperature value) will be referred to as the detected temperature deviation amount.

[0042] If the detected temperature deviation exceeds a predetermined allowable temperature deviation range, the actual temperatures of some of the regions Z1-Z6 may differ from the actual temperatures of the other regions even if the heaters He are controlled so that the detected temperatures of the regions Z1-Z6 are equal. In this case, the actual temperatures of the processing surface of the heat-treating plate 10 become non-uniform. In this embodiment, as described below, it is possible to perform a detected temperature deviation determination to determine whether an unacceptable deviation occurs in the detected temperature values in any of the regions.

[0043] (2) Initial setting and detection temperature deviation judgment Here, an example of the initial setting of the heat treatment apparatus 100 and the determination of the deviation in the detected temperature will be described. Fig. 3 is a diagram showing an example of the relationship between the actual temperature, the detected temperature value, and the power manipulated variable in a plurality of regions at the time of the initial setting. The vertical axis of Fig. 3 represents the temperature and the power manipulated variable, and the horizontal axis represents the regions Z1 to Z6.

[0044] As shown in Fig. 3, during initial setup, the power control amounts for the zones Z1 to Z6 are set so that the actual temperatures Rt1 to Rt6 of the zones Z1 to Z6 detected by the temperature measurement wafer coincide with a fixed temperature value (hereinafter referred to as the set temperature value Tt0). Hereinafter, the set power control amounts are referred to as appropriate power control amounts P1 to P6. During initial setup, the offset values OF for each zone are adjusted so that the detected temperature values Dt1 to Dt6 in the zones Z1 to Z6 coincide with the actual temperatures Rt1 to Rt6 of the processing surface of the heat-treating plate 10. The detected temperature values Dt1 to Dt6 in Fig. 3 are appropriate state temperature values.

[0045] As shown in Fig. 2, the zones Z3 to Z6 within the heat treatment plate 10 are evenly arranged to surround the zones Z1 and Z2. Therefore, the power control amounts of the zones Z3 to Z6 are almost the same or similar. Zone Z2 is adjacent to zone Z1 and zones Z3 to Z6. In this case, due to the influence of the temperatures of the adjacent zones Z1, Z3 to Z6, the appropriate power control amount P2 of zone Z2 is lower than the other appropriate power control amounts P1, P3 to P6. In this example, the appropriate power control amount P1 of zone Z1 is higher than the other appropriate power control amounts P2 to P6.

[0046] As described above, the relationship between the output value and the detected temperature value of the temperature sensor Se in any of the regions may change due to changes in the temperature sensor Se over time or changes in the wiring resistance of the temperature sensor Se during maintenance. In this case, the relationship between the actual temperatures Rt1 to Rt6 and the detected temperature values Dt1 to Dt6 changes. In this example, the detected temperature values Dt1 to Dt6 deviate from the actual temperatures Rt1 to Rt6. Therefore, in the heat treatment apparatus 100 of this embodiment, a detected temperature deviation determination is performed.

[0047] Fig. 4 is a diagram showing an example of the relationship between the actual temperatures, detected temperature values, and power manipulation amounts in multiple regions when a detected temperature deviation is determined. Fig. 5 is a diagram showing another example of the relationship between the actual temperatures, detected temperature values, and power manipulation amounts in multiple regions when a detected temperature deviation is determined. The vertical axes of Figs. 4 and 5 represent temperature and power manipulation amounts, and the horizontal axes represent regions Z1 to Z6. Note that a temperature measurement substrate is not used when a detected temperature deviation is determined. Therefore, the actual temperatures Rt1 to Rt6 in Fig. 4 are not detected.

[0048] For example, the voltage supplied from a power supply circuit in a semiconductor factory or the like can fluctuate by approximately ±10%. Therefore, the voltage supplied from the power supply circuit PG can fluctuate when determining the deviation in the detected temperature. In this case, the voltage applied to the heaters He in multiple regions Z1 to Z6 fluctuates. As a result, the voltage applied to the heaters He in each region during initial setup can differ from the voltage applied to the heaters He in each region when determining the deviation in the detected temperature.

[0049] 4 and 5, when the detected temperature deviation is determined, even if the same appropriate power control amounts P1 to P6 as those at the time of initial setting are applied, the actual temperatures Rt1 to Rt6 may deviate from the set temperature value Tt0 to the temperature value Tt1. As a result, the detected temperature values Dt1 to Dt6 deviate in the same way as the actual temperatures Rt1 to Rt6. In the example of FIGS. 4 and 5, the deviation from the set temperature value Tt0 to the temperature value Tt1 is ΔDt.

[0050] In the example of FIG. 4, there is a slight variation among the detected temperature values Dt1 to Dt6 in the multiple regions Z1 to Z6. The variation among the detected temperature values Dt1 to Dt6 in FIG. 4 is within the allowable temperature deviation range. On the other hand, in the example of FIG. 5, there is a large variation between the detected temperature value Dt3 in the region Z3 and the detected temperature value Dt4 in the region Z4. The variation between the detected temperature value Dt3 in the region Z3 and the detected temperature value Dt4 in the region Z4 in FIG. 5 is not allowable. In this example, the difference between the maximum detected temperature value Dt3 and the minimum detected temperature value Dt4 among the detected temperature values Dt1 to Dt6 is ΔR. In this embodiment, the variation among the multiple detected temperature values refers to the difference between the maximum detected temperature value and the minimum detected temperature value.

[0051] In this embodiment, multiple appropriate power manipulation amounts P1-P6 are stored during initial setup, and the stored multiple appropriate power manipulation amounts P1-P6 are set during the detected temperature deviation determination. In this state, it is determined whether the variation in the detected temperature values Dt1-Dt6 of the multiple regions Z1-Z6 is greater than a predetermined allowable temperature deviation. If the variation in the detected temperature values of the multiple regions Z1-Z6 is equal to or less than the allowable temperature deviation, the detected temperature values of the multiple regions Z1-Z6 are determined to be in an appropriate state. If the variation in the detected temperature values of the multiple regions Z1-Z6 is greater than the allowable temperature deviation, at least one of the detected temperature values of the multiple regions Z1-Z6 is determined to be in an inappropriate state. Here, we will explain the variation in the detected temperature value due to fluctuations in the voltage applied to each heater He. FIGS. 6 to 12 are diagrams showing examples of changes in the detected temperature value due to changes in the voltage applied to each heater He. The left vertical axis in FIGS. 6 to 12 represents the detected temperature value, and the right vertical axis represents the power manipulation amount. The horizontal axis in FIGS. 6 to 12 represents time.

[0052] 6 to 12, a constant appropriate power control amount P1 to P6 is set for each of the multiple zones Z1 to Z6. In this state, if the voltage applied to each heater He from the power supply circuit PG fluctuates, the power supplied to each heater He will fluctuate. As a result, even if the appropriate power control amounts P1 to P6 do not change, the detected temperature values Dt1 to Dt6 of the multiple zones Z1 to Z6 will fluctuate.

[0053] Fig. 6 shows the change over time in detected temperature values Dt1 to Dt6 in multiple regions Z1 to Z6 when there is no difference in detected temperature in any of the regions Z1 to Z6. In the example of Fig. 6, the detected temperature values Dt1 to Dt6 change in almost the same manner.

[0054] 7 and 8 show the changes over time in detected temperature values Dt1 to Dt6 in multiple regions Z1 to Z6 when a detected temperature deviation of +0.5 degrees and -0.5 degrees occurs in region Z1. The detected temperature values Dt1 to Dt6 in Figures 7 and 8 are obtained by intentionally changing the offset value OF set in region Z1 by +0.5 degrees and -0.5 degrees, respectively.

[0055] In the example of Fig. 7, the detected temperature value Dt1 in region Z1 changes while remaining 0.5 degrees higher than the detected temperature values Dt2 to Dt6 in the other regions Z2 to Z6. In the example of Fig. 8, the detected temperature value Dt1 in region Z1 changes while remaining 0.5 degrees lower than the detected temperature values Dt2 to Dt6 in the other regions Z2 to Z6.

[0056] Figures 9 and 10 show the changes over time in detected temperature values Dt1 to Dt6 in multiple regions Z1 to Z6 when detected temperature deviations of +0.5 degrees and -0.5 degrees occur in region Z2. Figures 11 and 12 show the changes over time in detected temperature values Dt1 to Dt6 in multiple regions Z1 to Z6 when detected temperature deviations of +0.5 degrees and -0.5 degrees occur in region Z3.

[0057] In this way, the detected temperature value in the region where the detected temperature deviation occurs deviates from the detected temperature value in the region where the detected temperature deviation does not occur. Therefore, even if the voltage applied to the temperature sensor Se in each region fluctuates, it is possible to determine whether at least one of the detected temperature values Dt1-Dt6 in the multiple regions Z1-Z6 is in an improper state based on the variation in the detected temperature values Dt1-Dt6 in the multiple regions Z1-Z6.

[0058] 13 to 15 are diagrams showing the relationship between the amount of detected temperature deviation when a detected temperature deviation occurs in one region and the amount of change in the detected temperature values in multiple regions Z1 to Z6. In Figures 13 to 15, the vertical axis represents the amount of change in the detected temperature values in multiple regions Z1 to Z6, and the horizontal axis represents the amount of detected temperature deviation in one region.

[0059] Fig. 13 shows a case where a deviation in detected temperature occurs in region Z1. Fig. 14 shows a case where a deviation in detected temperature occurs in region Z2. Fig. 15 shows a case where a deviation in detected temperature occurs in region Z3. The relationships in Figs. 13 to 15 are obtained by changing the offset value OF set in regions Z1 to Z3 from -0.5 [deg] to +0.5 [deg].

[0060] In this embodiment, when the detected temperature deviation is determined, the appropriate power control amounts P1 to P6 are set for the multiple zones Z1 to Z6, which are the same as those set at the initial setting. As a result, the actual temperatures of the processing surfaces of the multiple zones Z1 to Z6 of the heat-treating plate 10 are uniform. Therefore, the actual temperatures of the processing surfaces of each zone are not affected by the actual temperatures of the processing surfaces of other zones. Therefore, even if a detected temperature deviation occurs in some zones, the actual temperatures of all zones Z1 to Z6 are uniform. If the actual temperatures of some zones differ from the actual temperatures of other zones, the actual temperatures of some zones will affect the actual temperatures of the other zones. As a result, the detected temperature values of each zone will change due to the influence of the actual temperatures of the other zones. In contrast, in this embodiment, when the detected temperature deviation is determined, the detected temperature values of the multiple zones Z1 to Z6 are obtained when the actual temperatures of the multiple zones Z1 to Z6 are uniform.

[0061] In the example of Fig. 13, as shown by the solid line, even if a deviation in the detected temperature occurs in region Z1, the detected temperature values in the other regions Z2 to Z6 do not change. Similarly, in the example of Fig. 14, as shown by the dashed line, even if a deviation in the detected temperature occurs in region Z2, the detected temperature values in the other regions Z1, Z3 to Z6 do not change. Furthermore, in the example of Fig. 15, as shown by the thick dashed line, even if a deviation in the detected temperature occurs in region Z3, the detected temperature values in the other regions Z1, Z2, Z4 to Z6 do not change.

[0062] FIG. 16 is a diagram showing the relationship between the detected temperature deviation amount in each region and the variation in the detected temperature values in each region. The vertical axis of FIG. 16 shows the variation in the detected temperature values, and the horizontal axis shows the detected temperature deviation amount in each region. The variation in the detected temperature values is approximately proportional to the absolute value of the detected temperature deviation amount for each region. Therefore, by setting an allowable temperature deviation amount as a threshold value for the variation in the detected temperature values, it is possible to determine whether any of the detected temperature values in multiple regions Z1 to Z6 is in an inappropriate state. Hereinafter, this operation will be referred to as the detected temperature deviation determination operation.

[0063] (3) Functional Configuration of the Control Unit 40 Fig. 17 is a block diagram showing the functional configuration of control unit 40 in Fig. 1. As shown in Fig. 17, control unit 40 includes a heater control unit 410, a temperature conversion unit 420, a detected temperature value acquisition unit 430, a storage unit 440, a detected temperature deviation amount calculation unit 450, a determination unit 460, a display control unit 470, and an operation start instruction unit 480. Heater control unit 410 includes a power control unit 411 and a power supply circuit 412.

[0064] In this embodiment, a control program is stored in a ROM or storage device included in the control unit 40. The control program includes an initial setting program for controlling the operation at the time of initial setting, a temperature control program for controlling the temperature adjustment operation, and a detected temperature deviation determination program for controlling the detected temperature deviation determination operation. Each of the components (411, 420 to 480) of the control unit 40, except for the power supply circuit 412, is realized by executing a computer program, such as a control program, stored in the ROM or storage device on the RAM. Some or all of the components (411, 420 to 480) of the control unit 40 may be configured by hardware, such as electronic circuits.

[0065] The power control unit 411 provides the power manipulation amount for each region to the power supply circuit 412. In this embodiment, the power supply circuit 412 applies a voltage supplied from the power supply circuit PG to the heater He in each region. The power supply circuit 412 performs duty control of the power supplied to the heater He based on the power manipulation amount provided by the power control unit 411. This controls the power supplied to the heater He in each region. During temperature adjustment operation, the power control unit 411 adjusts the power manipulation amount in PID control so that the detected temperature value for each region acquired by a detected temperature value acquisition unit 430 (described later) becomes equal to the target temperature value.

[0066] The temperature conversion unit 420 stores the relationship between the output values of the temperature sensors Se in the multiple areas Z1 to Z6 and the detected temperature values in the form of a table or as a function. The temperature conversion unit 420 converts the output values of the temperature sensors Se in the multiple areas Z1 to Z6 into detected temperature values based on the relationship between the output values of the temperature sensors Se in the multiple areas Z1 to Z6 and the detected temperature values.

[0067] Detected temperature value acquisition unit 430 acquires detected temperature values for multiple zones Z1 to Z6 obtained by temperature conversion unit 420. Power control unit 411 controls the power manipulation amounts for each of multiple zones Z1 to Z6 during temperature adjustment operation so that the detected temperature values for multiple zones Z1 to Z6 acquired by detected temperature value acquisition unit 430 become equal to the target temperature values. During detected temperature deviation determination operation, power control unit 411 provides power supply circuit 412 with appropriate power manipulation amounts for multiple zones Z1 to Z6 stored during initial setup (described later).

[0068] The storage unit 440 stores the appropriate power manipulation amount obtained at the time of initial setup, and also stores the detected temperature value acquired by the detected temperature value acquisition unit 430 at the time of initial setup as the appropriate state temperature value. In this embodiment, the storage unit 440 does not have to store the appropriate state temperature value acquired at the time of initial setup. The detected temperature deviation calculation unit 450 calculates the variation in the detected temperature values in the regions Z1 to Z6 acquired by the detected temperature value acquisition unit 430 at the time of detecting the deviation in the detected temperature.

[0069] The determination unit 460 determines whether the variation in the detected temperature values in the regions Z1 to Z6 is greater than a predetermined allowable temperature deviation amount. If the determination unit 460 determines that the variation in the detected temperature values in the regions Z1 to Z6 is greater than the predetermined allowable temperature deviation amount, the display control unit 470 displays a warning on the display unit 50. The operation start instruction unit 480 instructs the power control unit 411 to start the initial setting operation, the temperature adjustment operation, and the detected temperature deviation determination operation.

[0070] (4) Detection temperature deviation judgment operation An example of the control operation of control unit 40 will now be described. FIG. 18 is a flowchart showing an example of the control operation of control unit 40 of FIG. 17. First, operation start instruction unit 480 instructs power control unit 411 to start an initial setting operation based on an operator's operation or an external command signal. This causes power control unit 411 to start the initial setting operation (step S1). The initial setting sets appropriate power manipulation amounts for multiple zones Z1 to Z6. Also, appropriate state temperature values for multiple zones Z1 to Z6 are obtained. Storage unit 440 stores the appropriate power manipulation amounts set at the time of initial setting and the detected temperature values acquired by detected temperature value acquisition unit 430 at the time of initial setting (step S2).

[0071] After the initial setting, the operation start instruction unit 480 instructs the power control unit 411 to start the temperature adjustment operation based on the operation of the user or an external command signal, and the power control unit 411 then performs the temperature adjustment operation (step S3).

[0072] Thereafter, the operation start instruction unit 480 determines whether or not an instruction to start the detected temperature deviation determination operation has been issued based on the user's operation or an external command signal (step S4). If an instruction to start the temperature deviation determination operation has not been issued, the temperature adjustment operation of step S3 is performed based on the user's operation or an external command signal.

[0073] When an instruction to start the detected temperature deviation determination operation is issued in step S4, the power control unit 411 acquires the appropriate power manipulation amounts for each of the regions Z1 to Z6 at the time of initial setting stored in the storage unit 440 (step S5). The power control unit 411 provides the acquired appropriate power manipulation amounts for each of the regions Z1 to Z6 to the power supply circuit 412 (step S6). As a result, power based on the appropriate power manipulation amounts for each of the regions Z1 to Z6 is supplied to the heaters He in each of the regions Z1 to Z6 by the power supply circuit 412. At this time, the temperature conversion unit 420 converts the output values of the temperature sensors Se in the regions Z1 to Z6 into detected temperature values. The detected temperature value acquisition unit 430 acquires the detected temperature values for each of the regions Z1 to Z6 obtained by the temperature conversion unit 420 (step S7).

[0074] The detected temperature deviation calculation unit 450 calculates the variation in the detected temperature values from the detected temperature values in the regions Z1 to Z6 acquired by the detected temperature value acquisition unit 430 (step S8). In this embodiment, the difference between the maximum detected temperature value and the minimum detected temperature value is calculated as the variation in the multiple detected temperature values.

[0075] The determination unit 460 determines whether the variation in the detected temperature values calculated by the detected temperature deviation calculation unit 450 is greater than a predetermined allowable temperature deviation (step S9). If the variation in the detected temperature values is equal to or less than the allowable temperature deviation, the determination unit 460 returns to step S3. If the variation in the detected temperature values is greater than the allowable temperature deviation, the display control unit 470 causes the display unit 50 to display a warning (step S10). In this case, the user performs initial setup using a temperature measurement wafer.

[0076] (5) Effects of the embodiment In the heat treatment apparatus 100 according to this embodiment, when the detected temperature deviation is determined, the power supply circuit 412 is supplied with a plurality of appropriate power manipulation amounts stored in the memory unit 440 at the time of initial setup. In this case, power corresponding to the plurality of appropriate power manipulation amounts is supplied to each of the heaters He of the heat treatment plate. As a result, the actual temperatures of the zones Z1 to Z6 of the heat treatment plate 10 at the time of determining the detected temperature deviation are equal to the actual temperatures of the zones Z1 to Z6 of the heat treatment plate 10 at the time of initial setup. Therefore, it is possible to easily determine in a short time whether the detected temperature value corresponding to at least one of the zones Z1 to Z6 is in an inappropriate state.

[0077] According to the detected temperature deviation determination operation of this embodiment, when the detected temperature values of the multiple regions Z1 to Z6 are in an appropriate state, there is no need to readjust the offset value using a temperature measurement wafer. The user readjusts the offset value using a temperature measurement wafer only when the detected temperature value corresponding to at least one region is in an inappropriate state. Therefore, the user does not need to periodically adjust the offset value using a temperature measurement wafer.

[0078] Furthermore, when determining the detected temperature deviation, the determination unit 460 determines whether the detected temperature value corresponding to at least one region is in an improper state based on whether the difference between the maximum and minimum detected temperature values obtained by the temperature conversion unit 420 is greater than a predetermined allowable temperature deviation amount. This makes it possible to determine whether at least one of the multiple detected temperature values is in an improper state even if the power supplied to each heater He in regions Z1 to Z6 differs between the initial setting and the detected temperature deviation determination due to temporal fluctuations in the voltage applied to the heater He in each region.

[0079] Furthermore, if the variation in the detected temperature value is greater than the allowable temperature deviation amount, a warning is displayed on the display unit 50. Therefore, the user can immediately recognize the need to perform the initial settings again.

[0080] (6) Other embodiments (6-a) In the detected temperature deviation determination operation of the above embodiment, it is determined whether any of the detected temperature values is in an inappropriate state based on the variation in the detected temperature values in the regions Z1 to Z6, but the present invention is not limited to this.

[0081] FIG. 19 is a diagram showing an example of changes in the detected temperature value due to fluctuations in the voltage applied to the heater He. FIG. 20 is a diagram showing the correlation between the voltage applied to the heater He and the detected temperature value. In FIG. 19, the left vertical axis represents the detected temperature value, the right vertical axis represents voltage, and the horizontal axis represents time. Fluctuations in the voltage applied to the heater He cause fluctuations in the actual temperature of the heat-treating plate 10. Therefore, as shown in FIG. 19, the detected temperature value fluctuates based on fluctuations in the voltage applied to the heater He.

[0082] The vertical axis of FIG. 20 is the detected temperature value, and the horizontal axis is the square of the voltage applied to the heater He. For example, at the time of initial setting, the fluctuating voltage and detected temperature value are acquired, and as shown in FIG. 20, multiple points VDP determined by the square of each voltage and the detected temperature value are plotted. In the example of FIG. 20, the plotted points VDP are used to determine the determination coefficient (R 2 ) was calculated, and the calculated coefficient of determination (R 2 ) is used to calculate the regression line RL. Hereinafter, the function represented by the regression line RL will be referred to as the database function.

[0083] Here, if the voltage applied to the heater He fluctuates, the value of the voltage applied to the heater He at the time of initial setup (hereinafter referred to as the reference voltage value) may differ from the value of the voltage applied to the heater He at the time of the detected temperature deviation determination. Therefore, even if no detected temperature deviation occurs, the detected temperature value at the time of initial setup (the temperature value in the appropriate state) and the detected temperature value at the time of the detected temperature deviation determination may differ. In the above embodiment, whether or not at least one detected temperature value is in the inappropriate state is determined based on the variation in the multiple detected temperature values obtained at the time of the detected temperature deviation determination. However, it becomes difficult to identify the detected temperature value that is in the inappropriate state among the detected temperature values at the time of the detected temperature deviation determination in the regions Z1 to Z6.

[0084] Therefore, in another embodiment, the database function is calculated in advance, and the detected temperature value of each region during the detected temperature deviation determination is corrected to the detected temperature value that would be obtained when the reference voltage value is applied, based on the database function and the voltage value applied to the heater He in each region. This makes it possible to determine whether the detected temperature value for each region during the detected temperature deviation determination is in an inappropriate state based on the appropriate state temperature value and the corrected detected temperature value. In this case, if the absolute value of the difference between the appropriate state temperature value and the corrected detected temperature value for each region is less than or equal to a predetermined tolerance, the detected temperature value for that region is determined to be in an appropriate state. Furthermore, if the absolute value of the difference between the appropriate state temperature value and the corrected detected temperature value for that region is greater than the predetermined tolerance, the detected temperature value for that region is determined to be in an inappropriate state.

[0085] Fig. 21 is a block diagram showing the functional configuration of a control unit 40 of a heat treatment apparatus 100 according to another embodiment. The configuration of the control unit 40 in Fig. 21 differs from the configuration of the control unit 40 in Fig. 17 in the following points. The control unit 40 in Fig. 21 further includes a detected temperature value correction unit 490. The heater control unit 410 of the control unit 40 in Fig. 21 further includes a voltage value acquisition unit 413. The voltage value acquisition unit 413 acquires the value of the voltage applied to each heater He by the power supply circuit 412 during initial setup and when detecting a deviation in the detected temperature.

[0086] The storage unit 440 stores the voltage value acquired by the voltage value acquisition unit 413 at the time of initial setting as a reference voltage value, and also stores the detected temperature values of the multiple regions Z1 to Z6 acquired at the time of initial setting as appropriate state temperature values.

[0087] The detected temperature value correcting unit 490 calculates a database function based on the reference voltage value and the appropriate state temperature value stored in the storage unit 440. Furthermore, when determining the detected temperature deviation, the detected temperature value correcting unit 490 corrects the detected temperature values in the regions Z1 to Z6 to the detected temperature values that would be obtained when the reference voltage value is applied, based on the voltage acquired by the voltage value acquiring unit 413 and the database function.

[0088] The determination unit 460 determines whether the absolute value of the difference between the appropriate state temperature value and the corrected detected temperature value for each region is greater than a predetermined allowable value. If the absolute value of the difference between the appropriate state temperature value and the corrected detected temperature value for at least one region is greater than the allowable value, the determination unit 460 determines that the detected temperature value for that region is in an inappropriate state. In this case, the display control unit 470 causes the display unit 50 to display a warning indicating that at least one detected temperature value is in an inappropriate state. The display control unit 470 also causes the display unit 50 to display information identifying the detected temperature value and region that are in an inappropriate state.

[0089] In this way, even if the voltage value applied during the detection temperature deviation determination differs from the reference voltage value applied during initial setup, the detection temperature values in regions Z1 to Z6 obtained during the detection temperature deviation determination are corrected to correspond to the reference voltage value based on the relationship (database function) between the voltage value and the detection temperature value. Therefore, by comparing the corrected detection temperature values in regions Z1 to Z6 with the corresponding appropriate detection temperature values during the detection temperature deviation determination, it is possible to determine whether each detection temperature value is in an inappropriate state. As a result, even if the voltage applied to the heater He in regions Z1 to Z6 fluctuates over time, it is possible to identify which region the detection temperature value corresponds to as being in an inappropriate state.

[0090] (6-b) FIG. 22 is a block diagram showing the functional configuration of a control unit 40 of a heat treatment apparatus 100 according to yet another embodiment. The control unit 40 of FIG. 22 is provided with a constant voltage circuit LV that outputs the voltage supplied from the power supply circuit PG as a constant voltage. In this case, even if the voltage supplied from the power supply circuit PG fluctuates, the constant voltage circuit LV supplies a constant voltage to the power supply circuit 412, so that a constant voltage is applied to the multiple heaters He. Therefore, by comparing the detected temperature values in regions Z1 to Z6 obtained during the detected temperature deviation determination with the corresponding appropriate detected temperature values, it is possible to determine whether each detected temperature value is in an inappropriate state. This makes it possible to identify which region the detected temperature value corresponds to.

[0091] (6-c) In the above embodiment, the heat-treating plate 10 is divided into multiple zones Z1 to Z6 in a plan view, and each zone Z1 to Z6 is provided with multiple temperature sensors Se and heaters He. However, the present invention is not limited to this. The heat-treating plate 10 may have a single zone, or a single zone may be provided with a temperature sensor Se and a heater He. In this case, for example, the inappropriate detected temperature value of a single zone may be determined based on the detected temperature value in the appropriate state at the initial setting and the detected temperature value at the time of temperature deviation determination.

[0092] (6-d) In the above embodiment, the display control unit 470 causes the display unit 50 to display a warning indicating that any of the detected temperature values in the regions Z1 to Z6 is in an inappropriate state based on the determination result of the determination unit 460, but the present invention is not limited to this. The warning indicating that any of the detected temperature values is in an inappropriate state may be notified to the user by lighting a lamp or the like, or the warning may be notified to the user by sound.

[0093] (6-e) In the detected temperature deviation determination operation of the above embodiment, whether any of the detected temperature values in the plurality of regions Z1 to Z6 is in an inappropriate state is determined by determining whether the variation in the detected temperature values in the regions Z1 to Z6 is greater than a predetermined allowable temperature deviation amount, but the present invention is not limited to this. When the fluctuation in the voltage applied to each heater He is small or the voltage does not fluctuate, whether any of the detected temperature values in the plurality of regions Z1 to Z6 is in an inappropriate state may be determined based on the detected temperature values in the regions Z1 to Z6 and the appropriate detected temperature values in the regions Z1 to Z6. For example, whether any of the detected temperature values in the plurality of regions Z1 to Z6 is in an inappropriate state may be determined based on whether the difference between the detected temperature values in the regions Z1 to Z6 and the appropriate detected temperature values in the regions Z1 to Z6 is greater than a predetermined allowable value.

[0094] (6-f) In the above embodiment, a heat treatment device that heats a substrate is described as an example of a temperature adjustment device, but the present invention is not limited to this. The temperature adjustment device may be a heat treatment device (cooling plate) that cools a substrate, a temperature-controlled water circulation unit, an air conditioning unit, or other temperature control device.

[0095] (7) Correspondence between each component of the claims and each part of the embodiment The following describes an example of the correspondence between each component of the claims and each element of the embodiment. In the above embodiment, the heat treatment device 100 is an example of a temperature adjustment device, the heater He is an example of a heat treatment unit, the temperature conversion unit 420 is an example of a conversion unit, the detected temperature value correction unit 490 is an example of a correction unit, and the display unit 50 is an example of a notification unit. [Explanation of symbols]

[0096] 10...heat treatment plate, 20...temperature sensor group, 30...heater group, 40...control unit, 50...display unit, 100...heat treatment apparatus, 410...heater control unit, 411...power control unit, 412...power supply circuit, 413...voltage value acquisition unit, 420...temperature conversion unit, 430...detected temperature value acquisition unit, 440...memory unit, 450...detected temperature deviation amount calculation unit, 460...judgment unit, 470...display control unit, 480...operation start instruction unit, 490...detected temperature value correction unit, Dt1 to Dt6...detected temperature value, He...heater, LV...constant voltage circuit, OF...offset value, P1 to P6...appropriate power operation amount, PG...power supply circuit, RL...regression line, Rt1 to Rt6...actual temperature, Se...temperature sensor, Td...detected temperature value, Tt0...set temperature value, Tt1...temperature value, W...substrate, Z1 to Z6...area

Claims

1. A temperature adjustment device for adjusting the temperature of an object, a heat treatment plate having a treatment surface on which the substrate as the object is placed; The treatment surface of the heat treatment plate has a plurality of regions, a plurality of heat treatment units provided corresponding to the plurality of regions of the treatment surface, respectively, to adjust the temperature of the object; a power supply circuit configured to supply power to each of the plurality of thermal processing sections based on a plurality of power control amounts corresponding to the plurality of regions; a plurality of temperature sensors provided in the plurality of regions, respectively, to detect the temperature of the object; a conversion unit that converts output values of the plurality of temperature sensors into a plurality of detected temperature values, respectively; a storage unit configured to store, as a plurality of appropriate power control amounts, a plurality of power control amounts corresponding to the plurality of regions to be applied to the power supply circuit when the plurality of detected temperature values obtained by the conversion unit are in an appropriate state at the time of initial setting; a power control unit that controls the plurality of power manipulation amounts so that a plurality of detected temperature values corresponding to the plurality of temperature sensors respectively coincide with a target temperature value during a temperature adjustment operation, and that applies the plurality of appropriate power manipulation amounts stored in the storage unit to the power supply circuit when a detected temperature deviation is determined; a determination unit that determines whether at least one of the plurality of detected temperature values obtained by the conversion unit is in an improper state based on whether a difference between a maximum detected temperature value and a minimum detected temperature value obtained by the conversion unit is greater than a predetermined allowable temperature deviation amount when determining the detected temperature deviation, a temperature control device in which, when the actual temperatures of the regions of the heat treatment plate are equal during the initial setting, the plurality of appropriate power control amounts are set so that the plurality of detected temperature values corresponding to the plurality of regions are equal.

2. The temperature control device according to claim 1, further comprising an alarm unit that issues an alarm when the judgment unit determines that at least one of the plurality of detected temperature values obtained by the conversion unit is in the inappropriate state during the detected temperature deviation determination.

3. A temperature adjustment method for adjusting the temperature of an object using a temperature adjustment device, comprising: The temperature adjustment device is a heat treatment plate having a treatment surface on which the substrate as the object is placed; The treatment surface of the heat treatment plate has a plurality of regions, a plurality of heat treatment units provided corresponding to the plurality of regions of the treatment surface, respectively, to adjust the temperature of the object; a power supply circuit configured to supply power to each of the plurality of thermal processing sections based on a plurality of power control amounts corresponding to the plurality of regions; a plurality of temperature sensors provided in the plurality of regions, respectively, to detect the temperature of the object; a conversion unit that converts output values of the plurality of temperature sensors into a plurality of detected temperature values, The temperature adjustment method includes: storing, as a plurality of appropriate power control amounts, a plurality of power control amounts that correspond to the plurality of regions to be applied to the power supply circuit when the plurality of detected temperature values obtained by the conversion unit are in an appropriate state at the time of initial setting; controlling the plurality of power manipulation amounts so that a plurality of detected temperature values corresponding to the plurality of temperature sensors respectively coincide with a target temperature value during a temperature adjustment operation; a step of applying the plurality of stored appropriate power control amounts to the power supply circuit when a deviation in the detected temperature is determined; and determining whether at least one of the plurality of detected temperature values obtained by the conversion unit is in an improper state based on whether a difference between a maximum detected temperature value and a minimum detected temperature value obtained by the conversion unit is greater than a predetermined allowable temperature deviation amount when determining the detected temperature deviation, The temperature adjustment method, wherein the storing step includes setting the plurality of appropriate power control amounts so that the plurality of detected temperature values corresponding to the plurality of regions are identical when the actual temperatures of the plurality of regions of the heat treatment plate are equal at the time of the initial setting.

Images