Substrate holding device

Abstract

To provide a holding device for improving the self-weight deflection of a substrate to be held.SOLUTION: A substrate holding device 1 for holding a substrate includes a substrate-supporting portion 2 that supports the substrate from the underside, a substrate pressing portion 4 that presses the substrate from the upper side, and a moving portion 5 that moves the substrate-supporting portion and the substrate pressing portion relative to each other in the direction of the thicknesses of the substrate. The substrate pressing portion presses down a portion offset outward from the part where the substrate is supported by the substrate supporting portion from the top side of the substrate.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate holding device for holding a substrate, and more particularly to a substrate holding device for holding a substrate in a predetermined orientation by clamping the substrate from both the front and back sides. [Background technology]

[0002] For example, semiconductor devices are formed by stacking multiple semiconductor device circuits (i.e., the repeating external patterns of device chips) in layers on a single semiconductor wafer, and then singulating them into individual chip components, which are then packaged and shipped individually as electronic components or incorporated into electrical products.

[0003] Before the individual chip components are separated, a single semiconductor wafer is held and repeatedly subjected to processes such as film formation, exposure and development, etching, and smoothing. During this process, an inspection image of the repeating appearance pattern of the device chips formed on the wafer is compared with a reference image to inspect the quality of each chip component (for example, Patent Document 1).

[0004] Wafers to be processed in the manufacturing process are transported from cassette carriers to processing equipment or inspection equipment by an automatic transport device called a handler, where processed and inspected substrates are dispensed and uninspected substrates are handed over.

[0005] Generally, wafers to be processed or inspected are supported entirely from the underside by a wafer holder with a flat upper surface and are held by suction or the like during processing or inspection (for example, Patent Document 2). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-155610 [Patent Document 2] Japanese Patent Application Laid-Open No. 2006-269989 Summary of the Invention [Problem to be solved by the invention]

[0007] The wafers to be processed and inspected have wiring patterns and other depositions formed on their top and bottom surfaces, and to prevent foreign matter from adhering or scratches, it is difficult to support the entire bottom surface of the wafer with a flat wafer holder. As a result, there are often only a few support points or only the outer periphery of the substrate is supported, making the substrate prone to bending under its own weight. When the substrate bends, the working distance for processing and inspection differs between the center and the outer periphery, making it difficult to perform the required processing and inspection.

[0008] Therefore, the present invention has been made in consideration of the above problems, An object of the present invention is to provide a holding device that can reduce the bending of a substrate due to its own weight. [Means for solving the problem]

[0009] In order to solve the above problems, one aspect of the present invention is to provide: A substrate holding device for holding a substrate, a substrate support portion that supports the substrate from the underside; a board pressing portion that presses the board from the upper surface side; a moving unit that moves the substrate support unit and the substrate pressing unit relatively in the thickness direction of the substrate, The substrate holder is characterized by pressing downward from the upper surface side of the substrate at a position offset outward from the portion where the substrate is supported by the substrate support portion.

[0010] With this configuration, a moment acts to lift the center of the substrate that has been bent due to its own weight. [Effects of the Invention]

[0011] This can improve the deflection of the substrate due to its own weight. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a perspective view showing an example of a substrate used in an embodiment embodying the present invention. [Figure 2] 1 is a perspective view showing the overall configuration of an example of an embodiment of the present invention; [Figure 3] 1 is a schematic diagram showing a main part of an example of an embodiment of the present invention. [Figure 4] FIG. 10 is a cross-sectional view showing a main part of a modified example of an embodiment of the present invention. [Figure 5] FIG. 10 is a cross-sectional view showing a main part of another modified example of an embodiment of the present invention. [Figure 6] FIG. 10 is a cross-sectional view showing a main part of yet another modified example of an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the three axes of a Cartesian coordinate system are designated X, Y, and Z, the horizontal direction is referred to as the X direction and the Y direction, and the direction perpendicular to the XY plane (i.e., the direction of gravity) is referred to as the Z direction. In addition, the direction against gravity in the Z direction is referred to as up, and the direction in which gravity acts is referred to as down.

[0014] FIG. 1 is a perspective view (partial cross-sectional view) showing an example of a substrate W used in an embodiment embodying the present invention. FIGS. 1(a) and 1(b) show a silicon wafer with a roughly circular outer shape, which is used in the manufacture of semiconductor devices and the like, as one type of substrate W. FIG. 1(a) shows the substrate W as viewed diagonally from above, and FIG. 1(b) shows the substrate W as viewed diagonally from below. The substrate W has flat surfaces (the so-called front and back surfaces) that are parallel to each other, with the upper surface referred to as the upper surface Wa and the lower surface referred to as the lower surface Wb. The upper surface Wa and the lower surface Wb of the substrate W are The substrate W is handled in a state where it is parallel to the horizontal direction (i.e., the thickness direction is the up-down direction). The substrate W also has an outer periphery E (i.e., outer edge, also called a side) located outside (away from the center Wc) the upper surface Wa and the lower surface Wb, and the outer periphery E is chamfered (rounded).

[0015] On the top surface Wa and bottom surface Wb of this substrate W, the areas where circuit patterns are formed and areas where functional films are deposited (generally the areas inside the outer edge and some of its periphery) are designated as contact-prohibited areas to prevent the adhesion of dirt and foreign matter, scratches, dents, etc., and direct contact and air blowing are not permitted. On the other hand, on the outer periphery E (the outer edge and its vicinity) outside the contact-prohibited areas, a contact-permitted area R is set around the entire periphery of the substrate W, allowing contact during handling.

[0016] In the contact allowance region R, an upper surface abutment region Ra is set on the upper surface Wa side of the substrate W. Meanwhile, a peripheral abutment region Rb and a temporary substrate placement abutment region Rc are set on the lower surface Wb side of the substrate W. The peripheral abutment region Rb is set on the lower surface Wb side of the substrate W. The temporary substrate placement abutment regions Rc are set in multiple locations at positions different from the peripheral abutment region Rb on the lower surface Wb side of the substrate W.

[0017] Note that these contact tolerance areas R, upper surface contact areas Ra, outer peripheral contact areas Rb, and temporary substrate placement contact areas Rc are not directly indicated on the substrate W, but are set in the handling rules, regulations, etc. (also called concepts) for the substrate W.

[0018] Fig. 2 is a perspective view showing the overall configuration of an example of an embodiment of the present invention. Figs. 2(a) and 2(b) show the components constituting the substrate holding device 1 according to the present invention and an example of their arrangement. Fig. 2(a) shows the posture when receiving (or discharging) the substrate W, and Fig. 2(b) shows how the substrate W is held in a predetermined posture.

[0019] The substrate holding device 1 holds a substrate W. Specifically, the substrate holding device 1 is configured to receive a substrate W carried by a worker or a handler (not shown) in a horizontal position, and hold the substrate W from both the front and back sides to hold it in a predetermined posture. More specifically, the substrate holding device 1 includes a substrate support unit 2, a temporary placement support unit 3, a substrate holder 4, a moving unit 5, etc.

[0020] The substrate support portion 2 supports the substrate W from the lower surface Wb side. Specifically, the substrate support part 2, also called the outer periphery support part, is configured to support the substrate W by abutting against an outer periphery abutment part Rb, which is set on the lower surface Wb side of the substrate within the contact-permitted region R. More specifically, the substrate support part 2 is composed of arc-shaped wall members 21-23 attached to the apparatus base 1f, and their upper end surfaces 21a-23a are flat horizontal surfaces. Furthermore, the substrate support part 2 has a shape (in this example, a substantially cylindrical shape) that fits the outer shape of the substrate W, and a notch (also called a gap or opening) is provided in the part where the temporary placement support part 3 moves up and down to avoid interference with each other.

[0021] The temporary placement support 3 temporarily supports the lower surface side of the substrate W, and supports a portion different from the portion supported by the substrate support 2 described later. Specifically, the temporary placement support portion 3 is configured to receive and support the substrate W by abutting it against a substrate temporary placement abutment portion Rc, which is different from the outer peripheral abutment portion Rb, which is set on the underside Wb of the substrate W and allocated to multiple locations on the substrate within the contact-permitted area R. Specifically, the temporary placement supports 3 are arranged at a plurality of locations (specifically, three locations are shown as an example) so as to surround the outer periphery E of the substrate W. More specifically, the temporary placement support unit 3 has rod-shaped support members 31 to 33, also called support pins or support claws, each having one end 31a to 33a that extends toward the center Wc of the substrate W. The outer ends of these support members 31 to 33 (i.e., the opposite ends to the one ends 31a to 33a) are attached directly or via a connecting metal fitting 50 or the like to movable parts 51 to 54 of the moving unit 5, which will be described later.

[0022] The substrate holder 4 presses down the upper surface Wa of the substrate W. Furthermore, the substrate holder 4 presses down the upper surface of the substrate W at a position offset outward from the portion of the substrate W supported by the substrate support 2. Specifically, the substrate holding portion 4 is positioned above and spaced apart from the substrate support portion 2 so as to cover at least a portion of the upper end surface 21a to 23b of the substrate support portion 2, and is configured to abut the substrate W against the upper surface abutment portion Ra on the upper surface Wa side within the contact-permitting region R, thereby holding the substrate W downward. More specifically, the substrate holder 4 has a shape in which one ends 41a to 43a of the plate-like members 41 to 43 extend toward the center Wc of the substrate W. The portions of these plate-like members 41 to 43 that come into contact with the substrate W (lower surface sides, also referred to as abutment surfaces) are not parallel to the upper surface of the substrate W, but are shaped to be inclined inward (wedge-shaped in the figure). The substrate holding portion 4 is positioned above the temporary placement support portion 3 at a predetermined distance, and the plate-like members 41 to 43 are attached directly or via connecting fittings 50 or the like to movable portions 51 to 54 of the moving portion 5 described later.

[0023] The moving section 5 moves the substrate holding section 4 and the substrate supporting section 2 relative to each other in the thickness direction of the substrate W. Specifically, the moving unit 5 moves the temporary placement support unit 3 and the substrate pressing unit 4 integrally in the thickness direction of the substrate W relative to the substrate support unit 2. More specifically, the moving part 5 is composed of an air cylinder or an electric actuator having movable parts 51 to 54 and main body parts 56 to 59, and is arranged in multiple locations (specifically, four locations are shown as an example) surrounding the substrate support part 2.

[0024] The movable portion 51 moves the support member 31 of the temporary placement support portion 3 and the plate-like member 41 of the substrate pressing portion 4 together in the up and down direction (that is, moves them up and down). Similarly, the movable part 52 moves the support member 32 of the temporary placement support part 3 and the plate-shaped member 42 of the substrate holding part 4 together in the vertical direction (i.e., moves them up and down), and the movable part 53 moves the support member 33 of the temporary placement support part 3 and the plate-shaped member 43 of the substrate holding part 4 together in the vertical direction (i.e., moves them up and down). Specifically, the movable parts 51 to 53 are made up of rod-shaped members having a predetermined length in the vertical direction, and the support member 31 of the temporary placement support part 3 and the plate-shaped member 41 of the board pressing part 4 are attached to the movable part 51. In addition, the support member 32 of the temporary placement support part 3 and the plate-shaped member 42 of the board pressing part 4 are attached to the movable parts 52 and 53 via connecting fittings 50. Furthermore, the support member 33 of the temporary placement support part 3 and the plate-like member 43 of the board pressing part 4 are attached to the movable part 54 .

[0025] The main bodies 56 to 59 move the movable parts 51 to 54 in the up and down direction (i.e., lifting and lowering motion). Specifically, the main bodies 56 to 59 are attached to the device base 1f, and are configured such that if they are air cylinders, they are connected to air pipes to be driven (i.e., lifting and lowering motion) or if they are electric actuators, they are driven by electric signals (i.e., lifting and lowering motion), and they move to the upper end side and the lower end side and then stop.

[0026] Figure 3 is a schematic diagram showing the main parts of an example of a form that embodies the present invention, and shows the transition from temporary placement of the substrate to holding (clamping) along with the positional relationships between the substrate W, the temporary placement support part 3, the substrate support part 2, and the substrate holding part 4. Figure 3(a) shows the moving part 5 in the upper state (i.e., the position where the movable parts 51 to 54 have moved to the upper end), Figure 3(c) shows the moving part 5 in the lower state (i.e., the position where the movable parts 51 to 54 have moved to the lower end), and Figure 3(b) shows the transitional state (descent) between these states.

[0027] First, when the moving part 5 is in the upper stage state, the part of the temporary placement support part 3 that abuts against the substrate temporary placement abutment part Rc of the substrate W is positioned higher than the part of the substrate support part 2 that abuts against the outer periphery abutment part Rb of the substrate W. Then, the substrate pressing part 4 is positioned further above the temporary placement support part 3, separated by a clearance required for placing or replacing the substrate W (see FIGS. 3(a) and 2(a)). As shown in FIG. 2(a), the substrate W moves in the direction indicated by the arrow M1 when being received / discharged, and the outer edge of the substrate W passes along the trajectory indicated by the two-dot chain line W". Therefore, the support members 31, 33 of the temporary placement support unit 3 and the plate-like members 41, 43 of the substrate pressing unit 4 are each arranged in a roughly U-shaped, overhanging shape so as not to interfere with each other when the substrate W passes through.

[0028] Thereafter, once the transfer of the substrate W is completed, the moving part 5 is lowered toward the lowering end. Then, as the moving part 5 is descending toward the lowering end, the outer peripheral abutment parts Rb set on the lower surface Wb of the substrate W come into contact with the upper end surfaces 21a-23a of the substrate support part 2 (see FIG. 3(b)). At this time, due to deflection by the substrate W's own weight, the inner ridges of the upper end surfaces 21a-23a of the substrate support part 2 come into contact with the lower surface Wb of the substrate W, while the area outside this inner ridge is separated from the substrate W (i.e., floating).

[0029] As the moving part 5 further descends, the support members 31 to 33 of the temporary placement support part 3 move away from the substrate temporary placement abutment portion Rc set on the lower surface Wb side of the substrate W, and the support members 31 to 33 of the temporary placement support part 3 move below the upper end surfaces 21a to 23a of the substrate support part 2.

[0030] The moving part 5 further descends toward the descending end, and one end 41a to 43a of the plate-like members 41 to 43 of the substrate holder 4 abuts against the upper surface abutment area Ra set on the upper surface Wa side of the substrate W, and the descending of the moving part 5 stops. This position is the lower state of the moving part 5 (see FIGS. 3(c) and 2(b)). At this time, the substrate W is sandwiched (i.e., held) by the substrate holder 4 and the substrate support part 2 from the front surface Wa side and the back surface Wb side. The substrate holder 4 is configured to press down on the upper surface Wa side of the substrate W at a position offset outward from the area where the substrate support part 2 supports the substrate W. Therefore, when the substrate W is placed on the substrate support part 2, the outer side of the substrate W, which has been separated from the upper end faces 21a to 23a due to deflection by its own weight, is pressed toward the upper end faces 21a to 23a by clamping the substrate W between the substrate support part 2 and the substrate pressing part 4 of the present invention, generating a moment that lifts the central part of the substrate W upward.

[0031] With this configuration, the substrate holding device 1 according to the present invention can generate a moment that lifts the central portion of the substrate W upward, thereby improving the deflection of the substrate W due to its own weight.

[0032] [Variations] 2 and 3, the configuration has been exemplified in which the one ends 31a-33a of the support members 31-33 of the temporary placement support part 3 that come into contact with the substrate temporary placement contact area Rc of the substrate W, and the one ends 41a-43a of the plate-like members 41-43 of the substrate pressing part 4 that come into contact with the upper surface contact area Ra, each extend horizontally toward the center Wc of the substrate W. On the other hand, an example has been shown in which the upper end faces 21a-23a of the wall-like members 21-21 of the substrate support part 2 that come into contact with the outer peripheral contact area Rb of the substrate W are formed as horizontal surfaces. When the contact-permitted region R includes horizontal surfaces on the upper surface Wa side and lower surface Wb side of the substrate W, the present invention can be realized with the above-mentioned configuration.

[0033] However, in realizing the present invention, the shapes and arrangements of the substrate support section 2, temporary placement support section 3, substrate holder 4, and moving section 5 are not limited to this configuration, and various modified examples can be adopted.

[0034] [About temporary support part 3] In the above description, a configuration including a temporary placement support part 3 has been exemplified as a specific example of the substrate holding device 1. With a configuration including such a temporary placement support part 3, it is not necessary to directly place the substrate W on the substrate support part 2, and therefore it is possible to transport the substrate W using a handler or the like, which is preferable. However, in order to realize the present invention, the temporary placement and support part 3 is not an essential component, and may be omitted.

[0035] [About receiving guide part 6] In realizing the present invention, the substrate holding device 1 may be configured to include a receiving guide section 6 in addition to the configuration including the temporary placement support section 3 described above.

[0036] FIG. 4 is a schematic diagram showing the main parts of a modified example of an embodiment of the present invention. 4(a) to 4(c) show specific examples of the arrangement and shape of the receiving guide portion 6. FIG.

[0037] When the substrate W is placed on the temporary placement support 3, the receiving guide section 6 guides the substrate W to a predetermined temporary placement position while abutting against part of the outer edge of the substrate W. Specifically, the receiving guide part 6 is configured such that the side (outside) of the temporary placement support part 3 is not vertical or horizontal, but is inclined or curved in a cone shape. More specifically, the receiving guide portion 6 is tapered so that it widens outward as it moves outside the temporary placement support portion 3 (away from the center Wc of the substrate) and above the upper surface of one end 31a to 33a of the support member 31 to 33 (i.e., the contact portion with the substrate W).

[0038] Therefore, when a worker, handler, or the like transfers the substrate W, even if the outer position of the substrate W is slightly misaligned in the horizontal direction, the substrate W moves downward while being guided by the receiving guide units 6 arranged in a plurality of positions surrounding the substrate W. Therefore, as the substrate W descends, any misalignment is corrected and the substrate W is positioned (also called centered) at a predetermined position before coming into contact with the temporary placement support unit 3, which is preferable because it reduces misalignment when the substrate is transferred to the substrate support unit 2.

[0039] [About Mobile Unit 5] In the above description, the moving unit 5 is configured to move the substrate holding unit 4 and the temporary placement support unit 3 (including the receiving guide unit 6, if necessary) integrally in the thickness direction of the substrate W relative to the substrate support unit 2.

[0040] With this configuration, the movable parts 51-54 of the moving part 5 can be made to perform a single stroke (downward movement in this example) to transition the state in which the substrate W is supported by the temporary placement support parts 3 to a state in which the substrate W is held between the substrate support parts 2 and the substrate presser parts 4. This is preferable because it shortens the time required for the state transition. However, the moving part 5 is not limited to this configuration, and may be configured to move the temporary placement support parts 3 and the substrate presser parts 4 separately.

[0041] In addition, in the above description, as a specific example of the arrangement of the moving unit 5, an example has been given in which the moving unit 5 is arranged in four locations so as to surround the substrate support unit 2. However, in realizing the present invention, the moving unit 5 is not limited to this arrangement, and an appropriately modified configuration may be adopted.

[0042] [Substrate support part 2] The substrate support portion 2 is not limited to the configuration in which the upper end faces 21a to 23a are flat horizontal surfaces as described above, and various modified examples can be adopted. For example, the substrate support portion 2 may be configured such that the portion that comes into contact with the lower surface of the substrate W is an inclined surface that is lower on the outside than on the inside.

[0043] Fig. 5 is a cross-sectional view showing the main part of another modified example of an embodiment of the present invention. Fig. 5(a) shows the moving part 5 in the upper position (i.e., the movable parts 51 to 54 have moved to the upper end). Fig. 5(b) shows the moving part 5 in the lower position (i.e., the movable parts 51 to 54 have moved to the lower end).

[0044] With this configuration, when the substrate W is sandwiched between the substrate support part 2 and the substrate presser 4 according to the present invention and the outer periphery W of the substrate W is pressed against the upper end faces 21a to 23a, a moment is generated that lifts the central part of the substrate W upward, but because the upper end faces 21a to 23a of the substrate support part 2 are inverted cone-shaped, a stronger moment is generated than when the upper end faces 21a to 23a are configured as horizontal surfaces. Therefore, the self-weight deflection of the substrate W can be further improved.

[0045] [About board holder 4] In the above description, a specific example of the substrate holder 4 has been shown in which the portion that comes into contact with the substrate W has a shape (wedge shape) that is inclined inward with respect to the upper surface of the substrate W. However, the substrate holder 4 is not limited to this shape, and the lower surface of a plate-like member of the same thickness may be arranged so that it is inclined inward with respect to the upper surface of the substrate W. In this way, the lower surface of the substrate holder 4 is arranged so that it is inclined inward with respect to the upper surface of the substrate W, which is preferable because it can come into contact with the outermost part of the substrate W when the moving unit 5 is in the lower position.

[0046] 6A to 6F are schematic diagrams showing the main parts of yet another modified example of an embodiment of the present invention. Each of Figs. 6A to 6F shows an example of the shape, arrangement, positional relationship, etc. of the outer periphery E of the substrate W, the substrate support part 2, and the substrate presser 4 to which the present invention can be applied. Figures 6(a) and (b) show that the outer periphery E of the substrate W to be held is chamfered, and the flat portion on the underside Wb of the substrate W (i.e., the non-chamfered surface) is supported by the entire upper end surface or the inner edge of the substrate support portion 2. The substrate holder 4 is shown pressing downward on the chamfered portion of the outer periphery on the upper surface Wa side of the substrate W. When the substrate W is held from above and below in this positional relationship, a moment is generated that lifts the central portion of the substrate W upward, thereby reducing the deflection of the substrate W due to its own weight. Figures 6(c) and (d) show that the outer periphery of the substrate W to be held has a roughly perpendicular cross-section, and the flat portion (i.e., the non-chamfered surface) on the underside Wb of the substrate W is supported by the entire upper end surface or the inner edge of the substrate support portion 2. The substrate holder 4 is shown pressing downward on the outer corners of the upper surface Wa of the substrate W. When the substrate W is held from above and below in this positional relationship, a moment is generated that lifts the central portion of the substrate W upward, thereby reducing the deflection of the substrate W due to its own weight.

[0047] 6(a) and 6(c), if the outer periphery E of the substrate W overhangs outward from the outer ridge of the substrate support part 2, when the substrate W is clamped between the substrate support part 2 and the substrate holder 4, the outer ridge of the substrate support part 2 serves as a fulcrum supporting the substrate W from the underside Wb, and a force as indicated by the dashed arrow acts. Furthermore, the substrate holder 4 can press downward at a position offset outward. Therefore, clamping the substrate W between the substrate support part 2 and the substrate holder 4 generates a moment that further lifts the center of the substrate W upward compared to when there is no overhang. This further reduces the self-weight deflection.

[0048] In the above description, the substrate holder 4 is disposed above and spaced from the substrate support 2, covering at least a portion of the upper end surfaces 21a to 23b of the substrate support 2. This configuration is preferable because it allows the substrate W to be held over a relatively wide area from the upper surface Wa and the lower surface Wb of the substrate W. However, in order to realize the present invention, it is not essential that the substrate holder 4 be disposed so as to cover at least a portion of the upper end surfaces 21a to 23b of the substrate support 2. For example, like the temporary substrate placement support 3 described above, the substrate holder 4 may be configured to press the substrate W downward from the upper surface Wa with a width (circumferential direction) that is the same as or narrower than the width of the notch in the substrate support 2.

[0049] [Substrate support part 2] The upper end surfaces 21a to 23a of the substrate support portion 2 are not limited to flat surfaces, and may be grooved or rough. Alternatively, the upper end surfaces 21a to 23a of the substrate support portion 2 may be configured with suction holders that apply negative pressure to the lower surface Wb side of the substrate W. With such a configuration, even if substrate holders cannot be arranged around the entire periphery of the substrate W, a moment can be generated from the lower surface side, thereby improving the effect of reducing the self-weight deflection of the substrate W.

[0050] [About Substrate W] In the above description, a wafer having a substantially circular outer shape has been exemplified as the substrate W to be held by the substrate holding device 1 according to the present invention. Wafers having a substantially circular outer shape tend to be larger in diameter and thinner, making them more susceptible to bending due to their own weight. Furthermore, wafers handled in the semiconductor device manufacturing process are prone to bending due to their own weight, partly because multiple layers are deposited to form electronic circuit patterns, making it difficult to hold such wafers in a predetermined position. However, holding such wafers with the substrate holding device 1 according to the present invention is preferable because it reduces the bending due to the wafer's own weight and enables the wafer to be held in a predetermined position.

[0051] However, the substrate W to be held by the substrate holding device 1 of the present invention is not limited to such a substantially circular thin wafer, but may also be a thick plate, a glass substrate or a resin substrate with a rectangular outline, etc. [Explanation of symbols]

[0052] 1 Substrate holding device 2 Substrate support 3 Temporary support 4 Board holder 5. Moving section 6 Receiving guide 21 to 23 Wall-shaped members (upper end surfaces: 21a to 23a 31-33 Support member (one end: 31a-33a) 41 to 43 Plate-shaped member (one end: 41a to 43a) 50 Connecting fittings 51~54 Movable part 56~59 Main body W wafer W”: The outer edge through which the wafer passes when being transferred. Wa top surface Wb bottom surface Wc center E Outer periphery (edge, side) R Contact tolerance area Ra Upper surface contact area (upper surface of the board, contact area with board holder 4) Rb: Outer peripheral contact area (the area on the bottom surface of the substrate that contacts the substrate support part 2) Rc: Substrate temporary placement contact portion (the lower surface of the substrate, the portion that contacts the temporary placement support portion 3) M1 Arrow (Transport direction in handler, etc.) M2 Arrow (Up / Down Direction)

Claims

1. A substrate holding device for holding a substrate, a substrate support portion that supports the substrate from the underside; a substrate pressing portion that presses the substrate from the upper surface side; a moving unit that moves the substrate support unit and the substrate pressing unit relatively in a thickness direction of the substrate, the substrate pressing portion presses the substrate downward from the upper surface side at a position offset outward from a portion where the substrate is supported by the substrate supporting portion; a temporary placement support part that temporarily supports a portion of the lower surface of the substrate that is different from the portion supported by the substrate support part; a receiving guide portion that, when the substrate is placed on the temporary placement support portion, guides the substrate to a predetermined temporary placement position while contacting a part of an outer edge of the substrate; the temporary placement support portion, the receiving guide portion, and the substrate pressing portion are integrally formed, The moving section moves the temporary placement support section, the receiving guide section, and the substrate pressing section integrally relative to the substrate support section in the thickness direction of the substrate, thereby transitioning the substrate from a state in which the substrate is supported by the temporary placement support section to a state in which the substrate is sandwiched between the substrate support section and the substrate pressing section. A substrate holding device comprising:

2. A substrate holding device for holding a substrate, a substrate support portion that supports the substrate from the underside; a substrate pressing portion that presses the substrate from the upper surface side; a moving unit that moves the substrate support unit and the substrate pressing unit relatively in a thickness direction of the substrate, the substrate pressing portion presses the substrate downward from the upper surface side at a position offset outward from a portion where the substrate is supported by the substrate supporting portion; a temporary placement support part that temporarily supports a portion of the lower surface of the substrate that is different from the portion supported by the substrate support part; a receiving guide portion that, when the substrate is placed on the temporary placement support portion, guides the substrate to a predetermined temporary placement position while contacting a part of an outer edge of the substrate; the temporary placement support portion, the receiving guide portion, and the substrate pressing portion are integrally formed, the moving section moves the temporary placement support section, the receiving guide section, and the substrate pressing section integrally relative to the substrate support section in the thickness direction of the substrate, thereby transitioning the substrate from a state in which the substrate is supported by the temporary placement support section to a state in which the substrate is sandwiched between the substrate support section and the substrate pressing section; The substrate support unit is provided with a suction holding unit that applies negative pressure to the lower surface of the substrate. A substrate holding device comprising:

3. The substrate holder has a portion that contacts the substrate and is inclined inward with respect to the upper surface of the substrate.

3. The substrate holding device according to claim 1 or 2.

4. The substrate support portion has a predetermined width along the outer periphery of the substrate, and the portion that comes into contact with the lower surface of the substrate is an inclined surface whose outer side is lower than its inner side.

4. The substrate holding device according to claim 1, wherein the substrate holding device is a substrate holding device.

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