Semiconductor manufacturing apparatus and semiconductor device manufacturing method

Abstract

To provide a semiconductor manufacturing device in which a projection unit can be easily changed in accordance with a variety type.SOLUTION: A semiconductor manufacturing device comprises: a projection unit that projects a die from a lower side of a dicing tape; and a collet that sucks the die. The projection unit comprises: a first unit that includes a plurality of square-like blocks contacted to the dicing tape; a second unit that includes a plurality of blocks for independently transmitting a vertical motion to each of the plurality of blocks; and a third unit that includes a plurality of driving output parts that independently applies the vertical motion to each of the plurality of blocks of the second unit. The first unit is mounted onto the second unit. Each of the second unit and the third unit are a common part in regardless of a type, and the first unit can be replaced in the type.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to semiconductor manufacturing equipment and is applicable to, for example, a die bonder equipped with a push-up unit. [Background technology]

[0002] Generally, in a die bonder that mounts a semiconductor chip called a die onto the surface of, for example, a wiring board or a lead frame (hereinafter collectively referred to as a substrate), the following operation (task) is repeatedly performed: the die is transported onto the substrate using a suction nozzle such as a collet, a pressing force is applied, and the bonding is performed by heating the bonding material.

[0003] Die bonding processes using semiconductor manufacturing equipment such as die bonders include a peeling process in which dies separated from a semiconductor wafer (hereinafter referred to as "wafer") are peeled off. In this peeling process, a push-up unit pushes up the dies from the backside of the dicing tape, and the dies are peeled off one by one from the dicing tape held in the die supply unit, and then transported onto the substrate using a suction nozzle such as a collet.

[0004] For example, according to JP 2012-4393 A (Patent Document 1), when a die to be peeled out of multiple dies attached to a dicing tape is pushed up and peeled off from the dicing tape, the dicing tape at a predetermined part of the periphery of the die is pushed up to form a peeling starting point, and then the dicing tape at parts other than the predetermined part is pushed up to peel the die off from the dicing tape. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-4393 Summary of the Invention [Problem to be solved by the invention]

[0006] When picking up dies from a wafer, it is necessary to set a jig that matches the type (e.g., die size). However, adjustments when changing types are complicated and time-consuming. In the case of multi-stage push-ups such as those described in Patent Document 1, the pickup operation is pre-configured to match the operating specifications, so the push-up unit cannot be changed later. An object of the present disclosure is to provide a semiconductor manufacturing apparatus in which the push-up unit can be easily changed according to the product type. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0007] A brief summary of representative aspects of this disclosure is as follows. That is, the semiconductor manufacturing equipment includes a push-up unit that pushes up the die from below the dicing tape and a collet that suctions the die. The push-up unit includes a first unit having a plurality of square blocks that contact the dicing tape, a second unit having a plurality of blocks that independently transmit vertical motion to each of the plurality of blocks, and a third unit having a plurality of drive output parts that independently impart vertical motion to each of the plurality of blocks of the second unit. The first unit is mounted on the second unit. The second unit and the third unit are common parts regardless of the product type, and the first unit is replaceable for each product type. [Effects of the Invention]

[0008] According to the semiconductor manufacturing apparatus, the push-up unit can be easily changed to suit the product type. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a conceptual diagram of a die bonder according to an embodiment, viewed from above; [Figure 2] FIG. 2 is a diagram illustrating the operation of the pickup head and the bonding head as viewed from the direction of arrow A in FIG. 1. [Figure 3] FIG. 2 is a perspective view showing the appearance of the die supply unit of FIG. 1. [Figure 4] 2 is a schematic cross-sectional view showing the main part of the die supply section of FIG. [Figure 5] FIG. 1 is a perspective view of an external appearance of a push-up unit according to an embodiment; [Figure 6A] Top view of part of the first unit in Figure 5 [Figure 6B] Top view of part of the second unit of Figure 5 [Figure 6C] Top view of part of the third unit in Figure 5 [Figure 7] Vertical cross section of the thrust-up unit in Figure 5 [Figure 8] Vertical cross section of the thrust-up unit in Figure 5 [Figure 9] FIG. 10 is a diagram showing the configuration of a push-up unit and a collet part of a pickup head according to an embodiment. [Figure 10] 1 is a flowchart illustrating a pick-up operation of a die bonder according to an embodiment of the present invention; [Figure 11] 1 is a flowchart illustrating a method for manufacturing a semiconductor device according to an embodiment of the present invention; [Figure 12A] FIG. 10 is an external perspective view of a push-up unit according to a modified example; [Figure 12B] FIG. 10 is an external perspective view of a push-up unit according to a modified example; [Figure 13] FIG. 12B is a longitudinal cross-sectional view of the first unit of FIG. [Figure 14A] FIG. 12B is a longitudinal cross-sectional view of a portion of the thrust unit of FIG. 12A. [Figure 14B] FIG. 14B is a longitudinal cross-sectional view of a part of the push-up unit of FIG. 14A with the first unit removed; [Figure 15] FIG. 10 is an external perspective view of a push-up unit according to a second modification; [Figure 16] Longitudinal cross section of the third unit in Figure 15 [Figure 17] Top view of part of the third unit of Figure 16 [Figure 18] FIG. 16 is a top view of a portion of a modified example of the third unit of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, examples and modifications will be described with reference to the drawings. However, in the following description, the same components will be assigned the same reference numerals, and repeated description may be omitted. Note that, to clarify the description, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment, but these are merely examples and do not limit the interpretation of the present invention. [Example]

[0011] Fig. 1 is a top view showing an outline of a die bonder according to an embodiment of the present invention, and Fig. 2 is a diagram illustrating the operation of a pickup head and a bonding head when viewed from the direction of arrow A in Fig. 1.

[0012] The die bonder 10 broadly comprises a die supply unit 1, a pickup unit 2, an intermediate stage unit 3, a bonding unit 4, a transport unit 5, a substrate supply unit 6, a substrate unloading unit 7, and a control unit 8 that monitors and controls the operation of each unit.

[0013] First, the die supply unit 1 supplies a die D to be mounted on the substrate P. The die supply unit 1 has a wafer holder 12 that holds a wafer 11, and a push-up unit 13, shown by a dotted line, that pushes up the die D from the wafer 11. The die supply unit 1 moves in the X and Y directions by a driving means (not shown), and moves the die D to be picked up to the position of the push-up unit 13.

[0014] The pickup unit 2 has a pickup head 21 that picks up the die D, a pickup head Y drive unit 23 that moves the pickup head 21 in the Y direction, and various drive units (not shown) that raise and lower, rotate, and move the collet 22 in the X direction. The pickup head 21 has a collet 22 (see also FIG. 2) that suction-holds the pushed-up die D at its tip, picks up the die D from the die supply unit 1, and places it on the intermediate stage 31. The pickup head 21 has various drive units (not shown) that raise and lower, rotate, and move the collet 22 in the X direction.

[0015] The intermediate stage unit 3 has an intermediate stage 31 on which the die D is temporarily placed, and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31.

[0016] The bonding unit 4 picks up a die D from the intermediate stage 31 and bonds it onto the substrate P that is being transported thereto, or bonds it by stacking it on top of a die that has already been bonded onto the substrate P. The bonding unit 4 has a bonding head 41 that is equipped with a collet 42 (see also FIG. 2) that suction-holds the die D at its tip, similar to the pickup head 21, a Y drive unit 43 that moves the bonding head 41 in the Y direction, and a substrate recognition camera 44 that captures an image of a position recognition mark (not shown) on the substrate P and recognizes the bonding position. With this configuration, the bonding head 41 corrects the pickup position and posture based on the imaging data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and bonds the die D to the substrate P based on the imaging data of the substrate recognition camera 44.

[0017] The transport section 5 comprises a substrate transport pallet 51 on which one or more substrates P (four in FIG. 1) are placed, and pallet rails 52 along which the substrate transport pallet 51 moves, and has first and second transport sections that are provided in parallel and have the same structure. The substrate transport pallet 51 moves by driving nuts (not shown) provided on the substrate transport pallet 51 with ball screws (not shown) provided along the pallet rails 52. With this configuration, substrate transport pallet 51 places substrate P in substrate supply section 6, moves along pallet rails 52 to the bonding position, and after bonding, moves to substrate unloading section 7 and hands over substrate P to substrate unloading section 7. The first and second transport sections are driven independently of each other, and while a die D is being bonded to substrate P placed on one substrate transport pallet 51, the other substrate transport pallet 51 unloads substrate P, returns to substrate supply section 6, and makes preparations such as placing a new substrate P on it.

[0018] The control unit 8 includes a memory that stores a program (software) that monitors and controls the operation of each part of the die bonder 10, and a central processing unit (CPU) that executes the program stored in the memory.

[0019] Next, the configuration of the die supply unit 1 will be described with reference to Figures 3 and 4. Figure 3 is a perspective view showing the appearance of the die supply unit. Figure 4 is a schematic cross-sectional view showing the main parts of the die supply unit.

[0020] The die supply unit 1 includes a wafer holder 12 that moves horizontally (in the X and Y directions) and a push-up unit 13 that moves vertically. The wafer holder 12 includes an expand ring 15 that holds a wafer ring 14, and a support ring 17 that horizontally positions a dicing tape 16 that is held by the wafer ring 14 and has multiple dies D adhered to it. The push-up unit 13 is disposed inside the support ring 17.

[0021] When the die D is pushed up, the die supply unit 1 lowers the expand ring 15 holding the wafer ring 14. As a result, the dicing tape 16 held by the wafer ring 14 is stretched, widening the gap between the dies D. The push-up unit 13 then pushes up the dies D from below, improving the die D pickup. As wafers become thinner, the adhesive that bonds the dies to the substrate changes from a liquid state to a film state, and a film-like adhesive material called a die attach film (DAF) 18 is applied between the wafer 11 and the dicing tape 16. For wafers 11 that have a die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling process, the wafer 11 and the die attach film 18 are peeled off from the dicing tape 16. Hereinafter, the peeling process will be described ignoring the existence of the die attach film 18.

[0022] Next, the push-up unit 13 will be described with reference to Figures 5, 6A to 6D, 7, and 8. Figure 5 is an external perspective view of the push-up unit according to the embodiment. Figure 6A is a top view of a portion of the first unit in Figure 5. Figure 6B is a top view of a portion of the second unit in Figure 5. Figure 6C is a top view of a portion of the third unit in Figure 5. Figure 7 is a vertical cross-sectional view of the push-up unit in Figure 5. Figure 8 is a vertical cross-sectional view of the push-up unit in Figure 5.

[0023] The push-up unit 13 includes a first unit 13a, a second unit 13b to which the first unit 13a is attached, and a third unit 13c to which the second unit 13b is attached. The second unit 13b and the third unit 13c are common parts regardless of the type of product, while the first unit 13a is a part that can be replaced for each type of product.

[0024] The first unit 13a has a block portion 13a1 with blocks A1 to A6, a dome head 13a2 with multiple suction holes, suction holes 13a3, and a dome suction hole 13a4. The first unit 13a converts the up and down movement of the concentric blocks B1 to B6 of the second unit 13b into the up and down movement of six concentric square blocks A1 to A6. The six blocks A1 to A6 can move up and down independently. The planar shape of the concentric square blocks A1 to A6 is configured to match the shape of the die D. If the die size is small, the number of concentric square blocks can be less than six. In this case, for example, the output portion of the third unit and the concentric blocks of the second unit will not be used. This is possible because the multiple output portions of the third unit and the concentric blocks of the second unit move up and down independently of each other (they do not move up and down).

[0025] The second unit 13b has cylindrical blocks B1 to B6 and an outer peripheral portion 13b2, and converts the up and down movement of output portions C1 to C6 arranged on the circumference of the first unit 13a into the up and down movement of six concentric blocks B1 to B6. The six blocks B1 to B6 can move up and down independently.

[0026] The third unit 13c has a central portion 13c0 and six peripheral portions 13c1 to 13c6. The central portion 13c0 has six output portions C1 to C6 that are arranged at equal intervals on the circumference of the top surface and move up and down independently. The peripheral portions 13c1 to 13c6 can drive the output portions C1 to C6 independently of each other. The peripheral portions 13c1 to 13c6 are equipped with motors M1 to M6, respectively, and the central portion 13c0 is equipped with plunger mechanisms P1 to P6 that convert the rotation of the motors into up and down movement using cams or links. The plunger mechanisms P1 to P6 provide up and down movement to the output portions C1 to C6. Note that motors M2 and M5 and plunger mechanisms P2 and P5 are not shown.

[0027] Next, the relationship between the push-up unit and the collet will be described with reference to Fig. 9. Fig. 9 is a diagram showing the configuration of the push-up unit and the collet part of the pickup head according to the embodiment.

[0028] As shown in FIG. 9, the collet part 20 has a collet 22, a collet holder 23 that holds the collet 22, and suction holes 22v and 23v that are provided in each of the collet holders 23 and that are used to suck the die D.

[0029] The first unit 13a has a dome head 13a2 on the periphery of its upper surface. The dome head 13a2 has multiple suction holes HL and a cavity CV. The suction holes 13a3 suck the die Dd around the die D picked up by the collet 22 through the dicing tape 16. While only one row of suction holes HL is shown around the block portion 13a1 in FIG. 9, multiple rows are provided to stably hold the die Dd that is not the target for pick-up. The suction holes 13a4 of the dome suction suck the die D picked up by the collet 22 through the gaps A1v, A2v, A3v, A4v, and A5v between the concentric rectangular blocks A1 to A6 and the cavity within the dome of the first unit 13a. The suction holes 13a3 and 13a4 can be performed independently.

[0030] The push-up unit 13 of this embodiment can be applied to various dies by changing the shape and number of blocks of the first unit. For example, when there are six blocks, it can be applied to dies with a die size of 20 mm or less. By increasing the number of output parts of the third unit, the number of concentric blocks of the second unit, and the number of concentric square blocks of the first unit, it can also be applied to dies with a die size larger than 20 mm.

[0031] Next, the pick-up operation by the push-up unit 13 having the above-described configuration will be described with reference to Fig. 10. Fig. 10 is a flowchart showing the process flow of the pick-up operation.

[0032] Step S1: Control unit 8 moves wafer holder 12 so that die D to be picked up is positioned directly above push-up unit 13, and moves push-up unit 13 so that the top surface of the third unit contacts the back surface of dicing tape 16. At this time, as shown in Figure 9, control unit 8 causes blocks A1 to A6 of block section 13a1 to form the same plane as the surface of dome head 13a2, and suctions dicing tape 16 using suction holes HL of dome head 13a2 and gaps A1v, A2v, A3v, A4v, and A5v between the blocks.

[0033] Step 2: The control unit 8 lowers the collet unit 20, positions it above the die D to be picked up, and sucks the die D by the suction holes 22v and 23v.

[0034] Step 3: The control unit 8 sequentially raises the blocks of the block unit 13a1 from the outside to perform the peeling operation. That is, the control unit 8 drives the plunger mechanism P6 with the motor M6, raising only the outermost block A6 by several tens to several hundreds of micrometers and stopping it. As a result, a raised portion of the dicing tape 16 is formed around the block A6, creating a minute space, i.e., a peeling starting point, between the dicing tape 16 and the die attach film 18. This space significantly reduces the anchor effect, i.e., the stress on the die D, ensuring reliable peeling operations. Next, the control unit 8 drives the plunger mechanism P5 with the motor M5, raising only the second outermost block A5 higher than the block A6 and stopping it. Next, the control unit 8 drives the plunger mechanism P4 with the motor M4, raising only the third outermost block A4 higher than the block A5 and stopping it. Next, the control unit 8 drives the plunger mechanism P3 with the motor M3, raising only the fourth outermost block A3 higher than the block A4 and stopping it. Next, the control unit 8 drives the plunger mechanism P2 with the motor M2, and raises only the fifth outermost block A2 higher than the block A3 and stops it. Finally, the control unit 8 drives the plunger mechanism P1 with the motor M1, and raises only the innermost block A1 higher than the block A2 and stops it.

[0035] Step S4: The control unit 8 raises the collet. In the final state of step S3, the contact area between the dicing tape 16 and the die D becomes an area that can be peeled off by raising the collet 22, and the die D can be peeled off by raising the collet 22.

[0036] Step S5: The control unit 8 adjusts the blocks A1 to A6 of the block portion 13a1 so that they are flush with the surface of the dome head 13a2, and stops suction of the dicing tape 16 by the suction holes HL of the dome head 13a2 and the gaps A1v, A2v, A3v, A4v, and A5v between the blocks. The control unit 8 moves the push-up unit 13 so that the top surface of the first unit is separated from the back surface of the dicing tape 16.

[0037] The control unit 8 repeats steps S1 to S5 to pick up non-defective dies on the wafer 11.

[0038] Next, a method for manufacturing a semiconductor device using the die bonder according to the embodiment will be described with reference to Fig. 11. Fig. 11 is a flowchart showing the method for manufacturing a semiconductor device.

[0039] Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D separated from the wafer 11 is attached is stored in a wafer cassette (not shown), and is then carried into the die bonder 10. The control unit 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply unit 1. The control unit 8 also prepares the substrate P and carries it into the die bonder 10. The control unit 8 places the substrate P on the substrate transport pallet 51 in the substrate supply unit 6.

[0040] Step S12: The control unit 8 picks up the dies divided in steps S1 to S5 from the wafer.

[0041] Step S13: The control unit 8 mounts the picked-up die on the substrate P or stacks it on top of an already bonded die. The control unit 8 places the die D picked up from the wafer 11 on the intermediate stage 31, and the bonding head 41 picks up the die D again from the intermediate stage 31 and bonds it to the transported substrate P.

[0042] Step S14: The control unit 8 causes the substrate unloading unit 7 to take out the substrate P to which the die D is bonded from the substrate transport pallet 51. The substrate P is unloaded from the die bonder 10.

[0043] <Variation 1> Next, Modified Example 1 of the push-up unit will be described with reference to Figures 12A, 12B, 13, 14A, and 14B. Figure 12A is an external perspective view of the push-up unit according to Modified Example 1. Figure 12B is an external perspective view of the push-up unit according to Modified Example 1. Figure 13 is a vertical cross-sectional view of the first unit of Figure 12A. Figure 14A is a vertical cross-sectional view of a portion of the first unit and second unit of the push-up unit of Figure 12A. Figure 14B is a vertical cross-sectional view of the state in which the first unit of Figure 12A has been removed.

[0044] The push-up unit 13A includes a first unit 13Aa and a second unit 13Ab to which the first unit 13Aa is attached. The second unit 13Ab is a common part regardless of the type of product, and the first unit 13Aa is a part that can be replaced for each type of product.

[0045] The first unit 13Aa differs from the first unit 13a of the embodiment in the number of blocks, but is otherwise similar to the first unit 13a. The first unit 13Aa includes a block portion 13Aa1 having blocks AA1 to AA4, a dome head 13Aa2 having a plurality of suction holes, suction holes 13a3, dome suction holes 13a4, and members aA1 to aA4 that transmit the up and down movement of the concentric blocks BA1 to BA4 of the second unit 13Ab to the four concentric square blocks A1 to A4.

[0046] The second unit 13Ab includes an outer peripheral portion 13Ab1, a member 13Ab2 that covers the outer peripheral portion 13Ab1 to mount the first unit 13Aa, a member 12Ab3 that locks (fixes) the member 13Ab2 to the outer peripheral portion 13Ab1, coaxial cylindrical (pipe-shaped) blocks BA1 to BA4, and drivers CA1 to CA4 that drive the blocks BA1 to BA4, respectively. Releasing the lock on the member 12Ab3 allows the member 13Ab2 to move upward, making it possible to attach and detach the first unit 13Aa to and from the second unit 13Ab. The drivers CA1 to CA4 are arranged vertically in the order of CA1, CA2, CA3, and CA4 from top to bottom. Each of the four drivers CA1 to CA4 can independently drive the four blocks BA1 to BA4 vertically, allowing the four blocks AA1 to AA4 to move vertically independently. Since the drive units CA1 to CA4 are arranged in the vertical direction, the horizontal size can be made smaller than that of the embodiment.

[0047] The pickup operation by the push-up unit 13A is similar to the operation by the push-up unit 13 of the embodiment shown in Fig. 10. The method for manufacturing a semiconductor device using a die bonder equipped with the push-up unit 13A is similar to the method for manufacturing a semiconductor device of the embodiment shown in Fig. 11.

[0048] <Variation 2> Next, a second modification of the push-up unit will be described with reference to Figures 15 to 17. Figure 15 is an external perspective view of the push-up unit according to the second modification. Figure 16 is a vertical cross-sectional view of the third unit in Figure 15. Figure 17 is a top view of a portion of the third unit in Figure 16.

[0049] The push-up unit 13B includes a first unit 13Ba, a second unit 13Bb to which the first unit 13Ba is attached, and a third unit 13Bc to which the second unit 13Bb is attached. The second unit 13Bb and the third unit 13Bc are common parts regardless of the type of product, while the first unit 13Ba is a part that can be replaced for each type of product.

[0050] The first unit 13Ba has a similar structure to the first unit 13a but a different number of blocks, and includes a maximum of 12 blocks. The second unit 13Bb has a similar structure to the second unit 13b but a different number of blocks, and includes a maximum of 12 blocks.

[0051] The third unit 13Bc has a central portion 13Bc0 and twelve peripheral portions 13c1 to 13c6 and 13d1 to 13d6. The central portion 13Bc0 has six output portions C1 to C6 that are arranged at equal intervals on the outer circumference of the top surface and move up and down independently, and six output portions D1 to D6 that are arranged at equal intervals on the inner circumference and move up and down independently. The peripheral portions 13c1 to 13c6 are arranged above the peripheral portions 13d1 to 13d6. The peripheral portions 13c1 to 13c6 and 13d1 to 13d6 can drive the output portions C1 to C6 and D1 to D6 independently of each other. The peripheral portions 13c1-13c6 and 13d1-13d6 are equipped with motors M1-M6 and Md1-Md6, respectively, and the central portion 13Bc0 is equipped with plunger mechanisms P1-P6 and Pd1-Pd6 that convert the rotation of the motors into up and down motion using cams or links. The plunger mechanisms P1-P6 and Pd1-Pd6 provide up and down motion to the output portions C1-C6 and D1-D6. Note that the motors M1, M2, M4, M5, Md1, Md2, Md4, and Md5 and the plunger mechanisms P1, P2, P4, P5, Pd1, Pd2, Pd4, and Pd5 are not shown in the figure.

[0052] By stacking third units vertically and increasing the number of output units, it is possible to operate even more blocks. The third unit placed in the upper tier requires space for the output unit as well as for the plunger shaft of the lower unit. In Variation 2, the cam or link positions of the plunger mechanism that converts the rotation of the motor of the upper and lower third units into vertical movement are offset on the inner and outer peripheries of the concentric circles. However, as shown in Figure 18, the upper and lower third units can be offset in angle (180° / number of installation points, e.g., 30° for a 6-output third unit) to secure space for the plunger output shaft to penetrate. This allows a two-tier stack to accommodate approximately 12 output points. Alternatively, the upper unit's output units can be reduced by one to three to secure more space.

[0053] In the embodiment, the third unit has six operating points on the circumference that move the motor up and down using cams or links. Within the second unit, the six operating points on the circumference are expanded into six concentric operating circles. In the first unit, the concentric operating circles are connected to each component of the corner block of the die size. In variant 1, the second unit has four operating points arranged vertically that are expanded into four concentric operating circles. In the first unit, the concentric operating circles are connected to each component of the corner block of the die size. In variant 2, a maximum of 12 operating points are arranged in the third unit. By disassembling into a maximum of 12 stages, 6 stages, or 4 stages and pushing up, components and processes can be shared for multiple sizes of dies.

[0054] Furthermore, in the embodiment and modified examples, by realizing a thrust stroke in which each stage is not affected by (does not interfere with) each other, it is possible to provide a thrust mechanism that can be freely set in either the thrust direction or the retraction direction depending on the programming. In other words, since each stage is independent and does not interfere with each other, the design is easy. In addition, the thrust height, up / down timing, etc. can be freely selected.

[0055] Because the concentric structure on the top surface of the push-up jig can be shared, changing the product type based on die size can be completed by replacing the product type changeover part (first unit). This makes it easy to design the product type changeover part. The product type changeover part can be designed quickly, making it possible to reduce delivery time and costs. This also promotes the sharing of parts. It also reduces the time required for product type changeover.

[0056] The invention made by the inventor has been specifically described above based on examples and modifications, but it goes without saying that the present invention is not limited to the above examples and modifications, and can be modified in various ways.

[0057] For example, in the embodiment, the up and down movement of the plunger mechanism is performed using a motor, but instead of using a motor, the back and forth movement of a shaft such as an air cylinder may be converted into up and down movement using a plane cam.

[0058] Furthermore, when a large output or stroke is required, the size of the cam or link that rotates the motor becomes larger and cannot be accommodated in the designated space. In this case, the output section per stage of the third unit can be reduced and the difference can be compensated for by stacking more.

[0059] Furthermore, the plunger mechanism that raises the block of the second unit from the output part of the third unit may have a structure in which a wire-like core moves back and forth within a flexible guide, like a camera shutter release. In this case, the plunger cam drive parts, such as the motor and air cylinder, can be installed in a separate location, improving the degree of freedom in placement.

[0060] Although the number of blocks in the first unit is 12, 6, or 4 in the above examples, it may be 3 or more. Although the number of blocks in the second unit is 12, 6, or 4 in the above examples, it may be the same as the number of blocks in the first unit. Although the number of drive output parts in the third unit is 12 or 6 in the above examples, it may be the same as the number of blocks in the second unit.

[0061] Furthermore, the first unit has been described as having a plurality of concentric rectangular blocks, but the first unit may also be configured by arranging rectangular blocks in parallel.

[0062] In addition, although the die to be picked up and the peripheral die are attracted / released at the same time in the embodiment, the die to be picked up and the peripheral die may be attracted / released at different times, which allows for more reliable separation.

[0063] In addition, in the embodiment, the blocks of each stage are pushed up in sequence, but since each stage is independent and can perform separate operations, operations in both the pushing up and pulling down directions may be mixed.

[0064] In the embodiment, an example has been described in which a block is used in the first unit to push up the die, but a pin (needle) may be used instead of the block.

[0065] Furthermore, in the embodiment, an example in which a die attach film is used has been described, but it is also possible to provide a preform portion on the substrate to which an adhesive is applied, and not use a die attach film.

[0066] In addition, in the embodiment, a die bonder is described in which a die is picked up from a die supply unit by a pickup head and placed on an intermediate stage, and the die placed on the intermediate stage is bonded to a substrate by a bonding head, but this is not limited to this and the present invention can be applied to semiconductor manufacturing equipment that picks up a die from a die supply unit. For example, the present invention can be applied to a die bonder that does not have an intermediate stage and a pickup head and that bonds dies from a die supply unit to a substrate with a bonding head. It is also applicable to a flip chip bonder that does not have an intermediate stage, picks up a die from a die supply unit, rotates the die pickup head upward, and delivers the die to the bonding head, which then bonds the die to a substrate. The present invention can also be applied to a die sorter that does not have an intermediate stage or a bonding head and that places dies picked up by a pick-up head from a die supply unit onto a tray or the like. [Explanation of symbols]

[0067] 1: Die supply section 11: Wafer 13: Push-up unit 13a: 1st unit 13a1: Block section 13a2: Adsorption part 13a3: Suction part 13a4: Suction part A1 to A6: Concentric square blocks 13b: 2nd unit B1~B6: Concentric blocks 13c: Third Unit 13c0: Central part 13c1~13c6: Periphery C1~C6: Output section 16: Dicing tape 2: Pickup section 21: Pickup head 3: Intermediate stage 31: Intermediate Stage 4: Bonding section 41: Bonding head 7: Control unit 10: Die bonder D: Die P: Substrate

Claims

1. A push-up unit that pushes up the die from under the dicing tape, a collet that adsorbs the die; Equipped with The thrust unit is a first unit having a first plurality of rectangular blocks that contact the dicing tape; a second unit having a second plurality of blocks that independently transmit vertical movement to each of the first plurality of blocks; a third unit having a plurality of drive output parts that independently apply vertical movement to each of the second plurality of blocks of the second unit; Equipped with the first unit is mounted on the second unit; The semiconductor manufacturing apparatus has the second unit and the third unit which are common parts regardless of the type of product, and the first unit which is replaceable for each type of product.

2. 2. The semiconductor manufacturing apparatus of claim 1, The first unit converts the vertical movement of the second plurality of blocks into the vertical movement of the first plurality of blocks.

3. 2. The semiconductor manufacturing apparatus of claim 1, The first unit further comprises: a first suction unit that suctions peripheral dies on the outer side of the die to the outer side of the first plurality of blocks; a second suction portion formed by gaps between the first plurality of blocks that suction the die; A semiconductor manufacturing device comprising:

4. 4. The semiconductor manufacturing apparatus according to claim 3, The semiconductor manufacturing apparatus is capable of setting suction timings for the first suction unit and the second suction unit independently.

5. 5. The semiconductor manufacturing apparatus according to claim 4, The semiconductor manufacturing device, wherein the number of the first plurality of blocks in the first unit is three or more.

6. 2. The semiconductor manufacturing apparatus of claim 1, The semiconductor manufacturing device has the first plurality of blocks arranged concentrically.

7. 2. The semiconductor manufacturing apparatus of claim 1, The semiconductor manufacturing device further includes a die attach film between the die and the dicing tape.

8. 2. The semiconductor manufacturing apparatus of claim 1, A semiconductor manufacturing device including a pickup head to which the collet is attached.

9. The semiconductor manufacturing apparatus of claim 8, further comprising: an intermediate stage on which a die to be picked up by the pickup head is placed; a bonding head for bonding a die placed on the intermediate stage onto a substrate or onto an already bonded die; A semiconductor manufacturing device comprising:

10. A method for manufacturing a semiconductor device using the semiconductor manufacturing apparatus according to any one of claims 1 to 9, A method for manufacturing a semiconductor device, comprising a pick-up step of pushing up the die with the push-up unit and picking up the die with the collet.

11. 11. The method of manufacturing a semiconductor device according to claim 10, further comprising: A method for manufacturing a semiconductor device, comprising a bonding step of bonding the die onto a substrate or onto an already bonded die.

12. 12. The method of manufacturing a semiconductor device according to claim 11, the pick-up step further includes a step of placing the picked-up die on an intermediate stage, The method for manufacturing a semiconductor device further comprises the step of picking up the die from the intermediate stage.

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