Substrate Processing Equipment

Abstract

To provide a substrate processing apparatus capable of suppressing a processing liquid discharged from a substrate from bouncing off a cup or the like and adhering to the substrate.SOLUTION: A substrate processing apparatus 500 includes a spin chuck 3, a first nozzle 11, a cup 41, and a first mesh member 51. The spin chuck 3 holds a substrate W and rotates it. The first nozzle 11 supplies the surface of the substrate W with a first processing fluid FL1. The cup 41 is arranged on the side of the substrate W and receives the first processing fluid FL1 discharged from the substrate W. The first mesh member 51 is arranged between the substrate W and the cup 41. The cup 41 has a side wall portion 41a extending in the vertical direction. The first mesh member 51 has a mesh structure. The first mesh member 51 is arranged along the side wall portion 41a, and can come into contact with the side wall portion 41a when the first processing fluid FL1 discharged from the substrate W hits it.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus. [Background technology]

[0002] Conventionally, substrate processing apparatuses that process the surface of a substrate such as a wafer by supplying an etching solution to the surface of the substrate are known (see, for example, Patent Document 1). Patent Document 1 describes a cleaning processing apparatus that includes a table that supports and rotates the wafer, a chemical solution supply unit that supplies a chemical solution to the upper surface of the wafer, a cup that surrounds the wafer, and a mesh member that is placed inside the cup. The mesh member is provided to prevent the chemical solution discharged from the substrate from bouncing off the cup and adhering to the wafer. The mesh member is placed about 30 mm inside (toward the table) from the inner surface of the cup. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2016-225544 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the cleaning processing apparatus of Patent Document 1, the mesh member is positioned about 30 mm inward from the inner surface of the cup, which reduces the distance between the wafer and the mesh member. Therefore, the chemical solution that bounces off the mesh member adheres to the wafer. Furthermore, some of the chemical solution that passes through the mesh member bounces off the cup, passes through the mesh member, and adheres to the wafer. In other words, it is difficult to prevent the chemical solution from adhering to the wafer in the cleaning processing apparatus of Patent Document 1.

[0005] The present invention has been made in consideration of the above-mentioned problems, and its purpose is to provide a substrate processing apparatus that can prevent processing liquid discharged from a substrate from bouncing off a cup or the like and adhering to the substrate. [Means for solving the problem]

[0006] A substrate processing apparatus according to one aspect of the present invention includes a substrate holding unit, a processing liquid supply unit, a cup, and a first mesh member. The substrate holding unit holds a substrate and rotates the substrate. The processing liquid supply unit supplies processing liquid to a surface of the substrate. The cup is disposed to the side of the substrate and receives the processing liquid discharged from the substrate. The first mesh member is disposed between the substrate and the cup. The cup has a sidewall extending in a vertical direction. The first mesh member has a mesh structure. The first mesh member is disposed along the sidewall and can come into contact with the sidewall when the processing liquid discharged from the substrate hits it.

[0007] The first mesh member may be disposed along the side wall portion with a gap therebetween, and a portion of the first mesh member that is hit by the processing liquid discharged from the substrate may be deformed and be able to directly contact the side wall portion. In one aspect of the present invention, the substrate processing apparatus may further include a second mesh member disposed between the substrate and the first mesh member and having a mesh structure.

[0008] In one aspect of the present invention, in the substrate processing apparatus, the cup may further include an inclined portion extending obliquely upward from an upper end of the sidewall portion toward above the substrate holding portion.

[0009] In one aspect of the present invention, in the substrate processing apparatus, the first mesh member may have a sidewall extension portion arranged along the sidewall portion, and an inclined extension portion arranged along the inclined portion.

[0010] In one aspect of the present invention, in the substrate processing apparatus, an upper end of the sidewall portion may be located higher than an upper surface of the substrate.

[0011] In one aspect of the present invention, in the substrate processing apparatus, the mesh member may hang down from the cup.

[0012] In one aspect of the present invention, in the substrate processing apparatus, the cup may further include a bottom surface portion extending from a lower end of the side wall portion toward the substrate holding portion, and a lower end of the mesh member may be fixed to the bottom surface portion. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide a substrate processing apparatus that can prevent processing liquid discharged from a substrate from splashing off a cup or the like and adhering to the substrate. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a schematic plan view showing a substrate processing apparatus according to an embodiment of the present invention; [Figure 2] FIG. 2 is a side view showing the inside of a processing unit according to an embodiment of the present invention. [Figure 3] FIG. 2 is a cross-sectional view showing the structure of the cup and its surroundings according to an embodiment of the present invention. [Figure 4] FIG. 3 is an enlarged cross-sectional view showing a state in which a first mesh member is in contact with a side wall portion of a cup according to an embodiment of the present invention. [Figure 5] 10 is a diagram illustrating how the treatment liquid bounces off the side wall portion when the first mesh member is arranged at a position where it does not contact the side wall portion, unlike in this embodiment. FIG. [Figure 6] FIG. 10 is an enlarged cross-sectional view showing a state in which a first mesh member is in contact with a side wall portion of a cup of a substrate processing apparatus according to a first modified example of the present invention. [Figure 7] FIG. 10 is a cross-sectional view showing a structure around a cup of a substrate processing apparatus according to a second modified example of the present invention. [Figure 8] 1(a) is a cross-sectional view showing an example of a first mesh member that does not have an inclined extending portion, and FIG. 1(b) is a cross-sectional view showing an example of a first mesh member that does not have an inclined extending portion. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, identical or corresponding parts are designated by the same reference symbols, and descriptions thereof will not be repeated. For ease of understanding, the X-axis, Y-axis, and Z-axis are appropriately illustrated in the drawings. The X-axis, Y-axis, and Z-axis are mutually orthogonal, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction. In addition, hatching indicating cross sections may be omitted in the drawings for ease of viewing. Furthermore, the radial direction relative to the rotation axis AX of the substrate W will be referred to as the "radial direction RD," the circumferential direction relative to the rotation axis AX will be referred to as the "circumferential direction CD," and the direction substantially parallel to the rotation axis AX will be referred to as the "axial direction AD."

[0016] 1 to 5, a substrate processing apparatus 500 according to one embodiment of the present invention will be described. The substrate processing apparatus 500 processes a substrate W. The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. In this embodiment, the substrate W is a semiconductor wafer. The substrate W is, for example, substantially disk-shaped.

[0017] First, a substrate processing apparatus 500 will be described with reference to FIG. 1. FIG. 1 is a schematic plan view showing a substrate processing apparatus 500 according to an embodiment of the present invention. As shown in FIG. 1, the substrate processing apparatus 500 includes an indexer unit U1, a plurality of processing units U2, a transport robot CR, an exchange part PS, and a control device U3. The control device U3 controls the indexer unit U1, the plurality of processing units U2, and the transport robot CR. The control device U3 is, for example, a computer. The indexer unit U1 includes a plurality of substrate containers C and an indexer robot IR.

[0018] Each of the substrate containers C accommodates a plurality of stacked substrates W. The indexer robot IR removes an unprocessed substrate W from one of the plurality of substrate containers C and transfers the substrate W to the transfer part PS. The substrate W removed from the substrate container C is then placed in the transfer part PS. The transport robot CR receives the unprocessed substrate W from the transfer part PS and loads the substrate W into one of the plurality of processing units U2.

[0019] The processing unit U2 processes unprocessed substrates W. The processing unit U2 is a single-substrate processing unit that processes substrates W one by one.

[0020] After processing by the processing unit U2, the transport robot CR removes the processed substrate W from the processing unit U2 and transfers the substrate W to the transfer part PS. The substrate W processed by the processing unit U2 is then placed on the transfer part PS. The indexer robot IR receives the processed substrate W from the transfer part PS and stores the substrate W in one of the plurality of substrate containers C.

[0021] Next, the processing unit U2 according to this embodiment will be described with reference to Fig. 2. Fig. 2 is a side view showing the inside of the processing unit U2 according to this embodiment.

[0022] 2 uses a processing fluid to process the substrate W. The processing fluid is, for example, a processing liquid or a processing gas.

[0023] The processing fluid is not particularly limited as long as it is a fluid that comes into contact with the substrate W. The processing liquid as the processing fluid is, for example, a chemical liquid or a rinse liquid.

[0024] The chemical solution may be, for example, dilute hydrofluoric acid (DHF), hydrofluoric acid (HF), hydronitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide water, organic acid (e.g., citric acid, oxalic acid), organic alkali (e.g., TMAH: tetramethylammonium hydroxide), sulfuric acid hydrogen peroxide water mixture (SPM), ammonia hydrogen peroxide water mixture (SC1), hydrochloric acid hydrogen peroxide water mixture (SC2), isopropyl alcohol (IPA), surfactant, corrosion inhibitor, or hydrophobizing agent.

[0025] The rinse liquid is, for example, deionized water, carbonated water, electrolytic ionized water, hydrogen water, ozone water, or hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm).

[0026] The processing gas as the processing fluid is, for example, a reactive gas that reacts with the substrate W or an inert gas. The reactive gas is, for example, ozone gas, fluorine gas, a gas containing hydrogen fluoride, or a gas containing IPA. The inert gas is, for example, nitrogen, helium, or argon.

[0027] As shown in FIG. 2, the processing unit U2 includes a chamber 1, a spin chuck 3, a motor housing 5, a motor 7, a first nozzle 11, a second nozzle 13, a third nozzle 15, a first fluid supply mechanism 21, a second fluid supply mechanism 23, a third fluid supply mechanism 25, a first nozzle movement unit 31, a second nozzle movement unit 33, a third nozzle movement unit 35, and a cup 41. The spin chuck 3 is an example of a "substrate holding unit" in the present invention. The first nozzle 11 is an example of a "processing liquid supply unit" in the present invention. The second nozzle 13 is an example of a "processing liquid supply unit" in the present invention.

[0028] The chamber 1 has a substantially box shape and accommodates the substrate W, the spin chuck 3, the motor housing 5, the motor 7, the first nozzle 11 to the third nozzle 15, parts of the first fluid supply mechanism 21 to the third fluid supply mechanism 25, the first nozzle movement unit 31 to the third nozzle movement unit 35, and the cup 41.

[0029] The spin chuck 3 is rotatable. The spin chuck 3 holds the substrate W horizontally and rotates about a rotation axis AX that passes vertically through the center of the substrate W. Specifically, the spin chuck 3 rotates the substrate W about the rotation axis AX while holding the substrate W horizontally within the chamber 1. The spin chuck 3 is driven to rotate by a motor 7. The spin chuck 3 is a vacuum suction type chuck. The spin chuck 3 suctions the center of the lower surface Wb of the substrate W (the surface opposite to the upper surface Wa). In this specification, the upper surface Wa and lower surface Wb of the substrate W are the surfaces of the substrate W.

[0030] The spin chuck 3 includes a spin base SB and a spin shaft SS. The spin base SB is a substantially disk-shaped member. The spin base SB has at least one suction hole (not shown). The suction hole is arranged on the upper surface of the spin base SB. A suction pump (not shown) is connected to the suction hole. The suction pump sucks air from inside the suction hole, thereby holding the substrate W on the upper surface of the spin base SB. The spin base SB has an outer diameter smaller than the outer diameter of the substrate W. When the substrate W is held on the spin base SB, the peripheral portion EG of the substrate W is arranged radially outward from the periphery of the spin base SB.

[0031] The spin shaft SS is attached to the center of the lower surface of the spin base SB. The spin shaft SS extends vertically. The spin shaft SS is connected to a motor 7. When the motor 7 is driven, the spin chuck 3 (spin shaft SS and spin base SB) rotates around the rotation axis AX. Therefore, the substrate W held by the spin chuck 3 rotates around the rotation axis AX.

[0032] The motor housing 5 is a hollow member and houses the motor 7 therein.

[0033] In this embodiment, the first nozzle 11 supplies a first processing fluid FL1 toward the peripheral edge EG of the upper surface Wa of the substrate W while the substrate W is rotating. The first processing fluid FL1 is a processing liquid. Note that in this embodiment, the first nozzle 11 supplies the processing liquid toward the peripheral edge EG of the upper surface Wa of the substrate W, but the processing liquid may also be supplied toward a portion of the upper surface Wa of the substrate W other than the peripheral edge EG (for example, the central portion).

[0034] The first fluid supply mechanism 21 supplies the first processing fluid FL1 to the first nozzle 11. The first fluid supply mechanism 21 includes a pipe 21a and a valve 21b. The pipe 21a supplies the first processing fluid FL1 to the first nozzle 11. The valve 21b switches between starting and stopping the supply of the first processing fluid FL1 to the first nozzle 11. When the valve 21b is opened, the first processing fluid FL1 is supplied to the first nozzle 11 through the pipe 21a. As a result, the first nozzle 11 ejects the first processing fluid FL1 toward the substrate W.

[0035] The first nozzle moving unit 31 moves the first nozzle 11 in a substantially vertical direction and a substantially horizontal direction. Specifically, the first nozzle moving unit 31 includes an arm 31a and a nozzle moving mechanism 31b. The arm 31a extends substantially horizontally. The first nozzle 11 is disposed at the tip of the arm 31a.

[0036] The second nozzle 13 supplies the second processing fluid FL2 toward the lower surface Wb of the substrate W while the substrate W is rotating. In this embodiment, the second processing fluid FL2 is, for example, a processing liquid. Note that the position from which the second nozzle 13 supplies the second processing fluid FL2 to the lower surface Wb of the substrate W is not particularly limited.

[0037] The second fluid supply mechanism 23 supplies the second processing fluid FL2 to the second nozzle 13. The second fluid supply mechanism 23 includes a pipe 23a and a valve 23b. The pipe 23a supplies the second processing fluid FL2 to the second nozzle 13. The valve 23b switches between starting and stopping the supply of the second processing fluid FL2 to the second nozzle 13. When the valve 23b is opened, the second processing fluid FL2 is supplied to the second nozzle 13 through the pipe 23a. As a result, the second nozzle 13 ejects the second processing fluid FL2 toward the substrate W.

[0038] The second nozzle moving unit 33 moves the second nozzle 13 in a substantially vertical direction and a substantially horizontal direction. Specifically, the second nozzle moving unit 33 includes an arm 33a and a nozzle moving mechanism 33b. The arm 33a extends substantially horizontally. The second nozzle 13 is disposed at the tip of the arm 33a.

[0039] During rotation of the substrate W, the third nozzle 15 supplies the third processing fluid FL3 toward the center of the upper surface Wa of the substrate W. In this embodiment, the third processing fluid FL3 is, for example, a processing gas.

[0040] The third fluid supply mechanism 25 supplies the third processing fluid FL3 to the third nozzle 15. The third fluid supply mechanism 25 includes a pipe 25a and a valve 25b. The pipe 25a supplies the third processing fluid FL3 to the third nozzle 15. The valve 25b switches between starting and stopping the supply of the third processing fluid FL3 to the third nozzle 15. When the valve 25b is opened, the third processing fluid FL3 is supplied to the third nozzle 15 through the pipe 25a. As a result, the third nozzle 15 ejects the third processing fluid FL3 toward the substrate W.

[0041] The third nozzle moving unit 35 moves the third nozzle 15 in a substantially vertical direction and a substantially horizontal direction. Specifically, the third nozzle moving unit 35 includes an arm 35a and a nozzle moving mechanism 35b. The arm 35a extends in a substantially horizontal direction. The third nozzle 15 is disposed at the tip of the arm 35a.

[0042] The cup 41 receives the processing liquids (here, the first processing fluid FL1 and the second processing fluid FL2) discharged from the substrate W. The cup 41 has a generally cylindrical shape. For example, the cup 41 has a generally cylindrical side wall portion 41a and an inclined portion 41b. The side wall portion 41a extends in the vertical direction. The inclined portion 41b protrudes obliquely upward from the upper end of the side wall portion 41a toward the inside in the radial direction RD. In other words, the inclined portion 41b extends obliquely upward from the upper end of the side wall portion 41a toward above the spin base SB. As such, the cup 41 has the inclined portion 41b extending obliquely upward from the upper end of the side wall portion 41a toward above the spin base SB, thereby preventing the processing fluids discharged from the substrate W from scattering within the chamber 1.

[0043] FIG. 3 is a cross-sectional view showing the structure of a cup 41 and its surroundings according to one embodiment of the present invention. As shown in FIG. 3, the cup 41 further has a bottom surface portion 41c and an inner wall portion 41d. The bottom surface portion 41c extends horizontally inward in the radial direction RD from the lower end of the side wall portion 41a. The inner wall portion 41d extends upward from the inner end of the bottom surface portion 41c in the radial direction RD. In other words, the cup 41 has the bottom surface portion 41c extending from the lower end of the side wall portion 41a toward the spin chuck 3. The side wall portion 41a, the bottom surface portion 41c, and the inner wall portion 41d form an accommodating recess 41e that accommodates a processing liquid.

[0044] Here, the substrate processing apparatus 500 includes a first mesh member 51 disposed between the substrate W and the cup 41. The first mesh member 51 is provided to prevent the processing liquid discharged from the substrate W from bouncing off the cup 41 and adhering to the substrate W. The first mesh member 51 has a mesh structure. The first mesh member 51 is preferably formed from a material that is highly resistant to chemicals and heat. The first mesh member 51 is formed, for example, from a fluorocarbon resin. In this embodiment, the first mesh member 51 is formed, for example, from PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer).

[0045] The first mesh member 51 is a sheet made of woven resin fibers. The diameter of the resin fibers constituting the first mesh member 51 is not particularly limited, but may be, for example, 30 μm or more and 300 μm or less. The mesh size (mesh size) of the first mesh member 51 is also not particularly limited, but may be, for example, 100 μm or more and 800 μm or less. The mesh size of the first mesh member 51 is preferably, for example, 500 μm or more and 800 μm or less. The thickness of the first mesh member 51 is not particularly limited, but may be, for example, 50 μm or more and 600 μm or less.

[0046] The first mesh member 51 is disposed along the side wall 41a. This prevents the distance between the substrate W and the first mesh member 51 from becoming small. This prevents the processing liquid that has bounced off the first mesh member 51 from adhering to the substrate W. Furthermore, the processing liquid discharged from the substrate W hits the first mesh member 51, allowing it to come into contact with the side wall 41a. This prevents the processing liquid that has been discharged from the substrate W from adhering to the substrate W by bouncing off the cup 41.

[0047] 4 is an enlarged cross-sectional view showing a state in which the first mesh member 51 is in contact with the side wall 41a of the cup 41 according to one embodiment of the present invention. As shown in FIG. 4, the processing liquid FL10 discharged from the substrate W hits the first mesh member 51. The first mesh member 51 is pushed by the processing liquid FL10 and deforms, absorbing the impact of the processing liquid FL10. This prevents the processing liquid FL10 from bouncing off the first mesh member 51. Furthermore, a portion 511 of the first mesh member 51 pushed by the processing liquid FL10 comes into contact with the side wall 41a of the cup 41. Some of the processing liquid FL10 passes through the mesh (network) of the first mesh member 51 but is captured in gaps formed between the first mesh member 51 and the side wall 41a. This is thought to be because the processing liquid FL10 comes into contact with the side wall 41a before leaving the first mesh member 51, and the force (energy) of the processing liquid FL10 is dispersed simultaneously to the first mesh member 51 and the side wall 41a. Unlike this embodiment, if the first mesh member 51 is arranged at a position where it does not come into contact with the side wall 41a as shown in Fig. 5, part of the processing liquid FL10 that has passed through the first mesh member 51 will bounce off the side wall 41a, pass through the first mesh member 51 in the opposite direction (to the left in Fig. 5), and adhere to the substrate W.

[0048] 3, first mesh member 51 has sidewall extension portion 51a arranged along sidewall portion 41a and inclined extension portion 51b arranged along inclined portion 41b. Therefore, first mesh member 51 can also cover the inner surface of inclined portion 41b of cup 41, and therefore processing liquid FL10 discharged from substrate W can be further prevented from bouncing off cup 41.

[0049] An upper end 51c of the inclined extending portion 51b is fixed to the inclined portion 41b. An upper end 51d of the side wall extending portion 51a is fixed to a connection portion 41f between the side wall portion 41a and the inclined portion 41b. In other words, a lower end of the inclined extending portion 51b is fixed to the connection portion 41f.

[0050] Furthermore, in this embodiment, the upper end of the side wall 41a is located higher than the upper surface Wa of the substrate W. In a configuration in which the upper end of the side wall 41a is located higher than the upper surface Wa of the substrate W, if the first mesh member 51 is not provided, the processing liquid FL10 discharged from the substrate W is likely to bounce off the side wall 41a and adhere to the substrate W. This embodiment is particularly effective because even in a configuration in which the upper end of the side wall 41a is located higher than the upper surface Wa of the substrate W, the processing liquid FL10 discharged from the substrate W can be prevented from bouncing off the side wall 41a.

[0051] In the present embodiment, the lower end 51e of the first mesh member 51 is fixed to the bottom surface portion 41c. Therefore, movement of the lower portion of the first mesh member 51 can be suppressed. Specifically, movement of the first mesh member 51 due to wind pressure during rotation of the spin base SB or wind pressure of the third processing fluid FL3 can be suppressed. Furthermore, when the cup 41 is moved up and down by a vertical movement mechanism (not shown), the first mesh member 51 can be prevented from getting caught on a member disposed inside the side wall portion 41a in the radial direction RD. Examples of the member disposed inside the side wall portion 41a in the radial direction RD include a cup separate from the cup 41 or a part of the spin base SB. The lower end 51e of the first mesh member 51 may be fixed to the lower end of the side wall portion 41a. That is, the lower end 51e of the first mesh member 51 may be fixed to a connection portion 41g between the side wall portion 41a and the bottom surface portion 41c. When the lower end 51e of the first mesh member 51 is fixed to the lower end of the side wall portion 41a, the same effect as when the lower end 51e of the first mesh member 51 is fixed to the bottom surface portion 41c can be obtained.

[0052] The method for fixing the first mesh member 51 to the cup 41 is not particularly limited. For example, the first mesh member 51 may be fixed to the cup 41 by adhesive, screws, welding, or the like. Alternatively, the first mesh member 51 may be fixed to a metal part that runs around the inside of the cup 41 in the circumferential direction CD, and the metal part may be fixed to the cup 41.

[0053] Next, the control device U3 will be described with reference to Fig. 2. The control device U3 includes a memory unit U31, a display unit U32, an operation unit U33, and a control unit U34. The memory unit U31 includes a storage device and stores data and computer programs. The storage device includes a main storage device such as a semiconductor memory and an auxiliary storage device such as a semiconductor memory and / or a hard disk drive. The storage device may also include removable media.

[0054] The display unit U32 includes, for example, a display device having a display panel, and displays, for example, operation information, setting information, and notification information of the processing unit U2.

[0055] The operation unit U33 accepts input operations by an operator. The operation unit U33 includes a plurality of buttons for setting or changing, for example, processing conditions of each processing unit U2. The operation unit U33 may include, for example, a touch panel. The display unit U32 may include, for example, a touch panel as the operation unit U33.

[0056] The control unit U34 includes a processor such as a CPU (Central Processing Unit). The processor of the control unit U34 executes a computer program stored in the storage device of the storage unit U31 to control the processing unit U2.

[0057] That is, the control unit U controls the spin chuck 3, the motor 7, the first fluid supply mechanism 21 to the third fluid supply mechanism 25, and the first nozzle moving unit 31 to the third nozzle moving unit .

[0058] For example, the control unit U34 controls the first nozzle moving unit 31 to the third nozzle moving unit 35, respectively, to control the positions of the first nozzle 11 to the third nozzle 15. Furthermore, for example, the control unit U34 controls the first fluid supply mechanism 21 to the third fluid supply mechanism 25, respectively, to control whether or not to supply the first processing fluid FL1 to the third processing fluid FL3 and the supply amounts thereof.

[0059] 6 and 7, a substrate processing apparatus 500 according to a first and second modified example of this embodiment will be described below. The following mainly focuses on the differences from the embodiment shown in FIGS.

[0060] (First Modification) A first modified example of the embodiment of the present invention will be described with reference to Fig. 6. Fig. 6 is an enlarged cross-sectional view showing a state in which a first mesh member 51 is in contact with a side wall portion 41a of a cup 41 of a substrate processing apparatus 500 according to the first modified example of the present invention. In the first modified example, an example will be described in which the substrate processing apparatus 500 further includes a second mesh member 52, unlike the embodiment shown in Figs. 1 to 5.

[0061] 6, in the first modified example, the substrate processing apparatus 500 further includes a second mesh member 52 disposed between the substrate W and the first mesh member 51. The second mesh member 52 has a mesh structure. The second mesh member 52 is formed in the same manner as the first mesh member 51.

[0062] Specifically, the second mesh member 52 is preferably made of a material that is highly resistant to chemicals and heat. The second mesh member 52 is preferably made of, for example, a fluorocarbon resin. In this embodiment, the second mesh member 52 is made of, for example, PFA (tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer).

[0063] The second mesh member 52 is a sheet made of woven resin fibers. The diameter of the resin fibers constituting the second mesh member 52 is not particularly limited, but may be, for example, 30 μm or more and 300 μm or less. The mesh size (mesh size) of the second mesh member 52 is not particularly limited, but may be, for example, 100 μm or more and 800 μm or less. The mesh size of the second mesh member 52 is preferably, for example, 500 μm or more and 800 μm or less. The thickness of the second mesh member 52 is not particularly limited, but may be, for example, 50 μm or more and 600 μm or less. The second mesh member 52 may be formed of a mesh sheet different from that of the first mesh member 51; however, in this embodiment, the second mesh member 52 is formed of the same mesh sheet as that of the first mesh member 51.

[0064] As described above, by the substrate processing apparatus 500 further including a second mesh member 52 arranged between the substrate W and the first mesh member 51, the processing liquid discharged from the substrate W can be further prevented from bouncing off the cup 41 or the like and adhering to the substrate W.

[0065] Specifically, the processing liquid FL10 discharged from the substrate W first hits the second mesh member 52. The second mesh member 52 is pushed by the processing liquid FL10 and deforms, absorbing the impact of the processing liquid FL10. Furthermore, a portion 521 of the second mesh member 52 pushed by the processing liquid FL10 pushes the first mesh member 51. The first mesh member 51 is pushed by the processing liquid FL10 and the second mesh member 52 and deforms, further absorbing the impact of the processing liquid FL10. This further prevents the processing liquid FL10 from bouncing off the second mesh member 52. Furthermore, a portion 511 of the first mesh member 51 pushed by the processing liquid FL10 and the portion 521 comes into contact with the side wall portion 41 a of the cup 41. A portion of the processing liquid FL10 passes through the meshes (network) of the first mesh member 51 and the second mesh member 52, but is captured in gaps formed between the first mesh member 51 and the side wall portion 41a and gaps formed between the second mesh member 52 and the first mesh member 51. This is thought to be because the processing liquid FL10 comes into contact with the first mesh member 51 and the side wall portion 41a before leaving the second mesh member 52, and the force (energy) of the processing liquid FL10 is dispersed simultaneously to the second mesh member 52, the first mesh member 51, and the side wall portion 41a.

[0066] The second mesh member 52 may be fixed to the cup 41 at a position different from that of the first mesh member 51, but in this embodiment, it is fixed to the same position as that of the first mesh member 51.

[0067] Furthermore, the method of fixing the second mesh member 52 to the cup 41 is not particularly limited. For example, the second mesh member 52 may be fixed to the cup 41 by adhesive, screws, welding, or the like. Alternatively, the second mesh member 52 may be fixed to a fixing part made of metal or the like that runs around the inside of the cup 41 in the circumferential direction CD, and the fixing part may be fixed to the cup 41. In this case, the second mesh member 52 may be fixed by the same fixing part as the first mesh member 51. Note that the second mesh member 52 may also be fixed by a fixing part different from that of the first mesh member 51.

[0068] The second mesh member 52 may be fixed to the first mesh member 51. The second mesh member 52 may be connected to the first mesh member 51. That is, for example, the first mesh member 51 and the second mesh member 52 may be configured by folding one mesh member into two layers (two layers).

[0069] Other structures and effects of the first modified example are similar to those of the embodiment shown in FIGS.

[0070] (Second Modification) A second modified example of the embodiment of the present invention will be described with reference to Fig. 7. Fig. 7 is a cross-sectional view showing the structure around cup 41 of substrate processing apparatus 500 according to the second modified example of the present invention. In the second modified example, unlike the embodiment and first modified example shown in Figs. 1 to 5, an example will be described in which first mesh member 51 hangs down from cup 41.

[0071] 7, in the second modified example, the first mesh member 51 hangs down from the cup 41. In other words, the lower end 51e of the side wall extension 51a of the first mesh member 51 is not fixed to the cup 41. The vertical length of the side wall extension 51a is shorter than the vertical length of the side wall 41a. The lower end 51e of the side wall extension 51a is separated from the bottom surface 41c of the cup 41.

[0072] As described above, the lower end 51e of the side wall extending portion 51a of the first mesh member 51 is not fixed to the cup 41. Therefore, the first mesh member 51 can be fixed to the cup 41 more easily than in the case where the lower end 51e of the side wall extending portion 51a is fixed to the cup 41.

[0073] The other structures and effects of the second modified example are similar to those of the embodiment shown in FIGS.

[0074] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be implemented in various forms without departing from the spirit of the present invention. Furthermore, the components disclosed in the above embodiments can be modified as appropriate. For example, some of the components shown in one embodiment may be added to the components of another embodiment, or some of the components shown in one embodiment may be deleted from the embodiment.

[0075] Furthermore, the drawings mainly show each component in a schematic manner to facilitate understanding of the invention, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of creating the drawings. Furthermore, the configuration of each component shown in the above embodiment is merely an example and is not particularly limited, and it goes without saying that various modifications are possible within a range that does not substantially deviate from the effects of the present invention.

[0076] For example, in the above embodiment, the first mesh member 51 has the inclined extending portion 51b, but the present invention is not limited to this. The first mesh member 51 does not have to have the inclined extending portion 51b, as shown in Figures 8(a) and 8(b), for example.

[0077] Furthermore, in the above-described first modified example, in the configuration in which the substrate processing apparatus 500 includes the first mesh member 51 and the second mesh member 52, an example has been shown in which the second mesh member 52 is formed from the same mesh sheet as the first mesh member 51. However, the present invention is not limited to this. The second mesh member 52 may be formed from a mesh sheet different from that of the first mesh member 51. In other words, for example, the mesh opening or thickness of the second mesh member 52 may be different from that of the first mesh member 51.

[0078] In the first modified example described above, the substrate processing apparatus 500 includes the first mesh member 51 and the second mesh member 52, and the lower ends of the first mesh member 51 and the second mesh member 52 are fixed to the cup 41. However, the present invention is not limited to this. For example, the lower ends of the first mesh member 51 and the second mesh member 52 do not have to be fixed to the cup 41. Alternatively, only the lower end of the second mesh member 52 may be fixed to the cup 41.

[0079] In the first modified example, the substrate processing apparatus 500 includes two mesh members (the first mesh member 51 and the second mesh member 52), but the present invention is not limited to this. The substrate processing apparatus 500 may include three or more mesh members.

[0080] In the above embodiment, the upper end of the side wall 41a is located above the upper surface Wa of the substrate W, but the present invention is not limited to this. For example, the upper end of the side wall 41a may be located below the upper surface Wa of the substrate W.

[0081] In the above embodiment, the first processing fluid FL1, the second processing fluid FL2, and the third processing fluid FL3 are supplied to the substrate W, but the present invention is not limited to this. For example, only one of the first processing fluid FL1 and the second processing fluid FL2 may be supplied to the substrate W.

[0082] In the above embodiment, the substrate holder (spin chuck 3) suction-holds the lower surface Wb of the substrate W, but the present invention is not limited to this. For example, the substrate holder may hold the peripheral edge of the substrate W with a plurality of pins. [Industrial Applicability]

[0083] The present invention relates to a substrate processing apparatus and has industrial applicability. [Explanation of symbols]

[0084] 3: Spin chuck (substrate holder) 11: First nozzle (processing liquid supply unit) 13: Second nozzle (processing liquid supply unit) 41: Cup 41a: Side wall part 41b: Inclined part 41c: Bottom part 51: First mesh member 51a: Side wall extension 51b: Inclined extension part 51e: Bottom end 52: Second mesh member 500: Substrate processing equipment FL1: First processing fluid (processing liquid) FL10: Processing liquid FL2: Second processing fluid (processing liquid) W: Substrate Wa:Top surface (surface) Wb: Bottom surface (front surface)

Claims

1. a substrate holder that holds a substrate and rotates the substrate; a processing liquid supply unit that supplies a processing liquid to the surface of the substrate; a cup disposed on a side of the substrate and configured to receive the processing liquid discharged from the substrate; a first mesh member disposed between the substrate and the cup; Equipped with The cup has a side wall portion extending along the up-down direction, the first mesh member has a mesh structure, the first mesh member is disposed along the side wall portion with a gap therebetween, a portion of the first mesh member that is hit by the processing liquid discharged from the substrate is deformed and is capable of directly contacting the side wall portion.

2. The substrate processing apparatus according to claim 1 , further comprising a second mesh member disposed between the substrate and the first mesh member and having a mesh structure.

3. 3. The substrate processing apparatus according to claim 1, wherein the cup further includes an inclined portion extending obliquely upward from an upper end of the side wall portion toward above the substrate holding portion.

4. The substrate processing apparatus according to claim 3 , wherein the first mesh member has a sidewall extension portion disposed along the sidewall portion and an inclined extension portion disposed along the inclined portion.

5. 5. The substrate processing apparatus according to claim 3, wherein an upper end of the side wall portion is positioned higher than an upper surface of the substrate.

6. The substrate processing apparatus of claim 1 , wherein the first mesh member hangs down from the cup.

7. the cup further has a bottom surface portion extending from a lower end of the side wall portion toward the substrate holding portion, The substrate processing apparatus according to claim 1 , wherein a lower end of the first mesh member is fixed to the bottom surface portion.

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