Substrate processing method and substrate processing apparatus

Abstract

To provide a substrate processing method and a substrate processing device, capable of accurately processing a substrate.SOLUTION: A substrate processing method includes: a setting step of setting the aperture of a flow rate adjustment section 215 to an initial aperture, based on aperture information showing the relationship between the initial aperture of the flow rate adjustment section 215 and the target flow rate of a processing liquid LQ; a changing step of changing the aperture from the initial aperture to the target aperture such that detection results of a flow meter 212 become the target flow rate; a first determination step of determining whether the change from the initial aperture to the target aperture is either a change in a positive direction showing that the target aperture is greater than the initial aperture or a change in a negative direction showing that the target aperture is less than the initial aperture; and a second determination step of determining whether an abnormality occurs in a substrate processing device 100A, based on a plurality of determination results obtained by performing each of the setting step, the changing step and the first determination step multiple times.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate processing method and a substrate processing apparatus. [Background technology]

[0002] In the manufacturing process of semiconductor devices, various processes are performed on semiconductor wafers using substrate processing equipment. For example, an etching apparatus is known as a substrate processing equipment that adjusts the thickness of a film to be processed included in a semiconductor wafer to a target thickness (see, for example, Patent Document 1). For example, the etching apparatus supplies an etching solution from a supply pipe toward the semiconductor wafer to etch the semiconductor wafer.

[0003] Furthermore, the amount of discharge of a processing liquid such as an etching liquid needs to be changed depending on the type of processing, and therefore, an adjustment valve for adjusting the flow rate of the processing liquid is provided in the supply pipe. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-85174 Summary of the Invention [Problem to be solved by the invention]

[0005] In a substrate processing apparatus, a flow meter is disposed in a supply pipe. The flow meter detects the flow rate of a processing liquid in the supply pipe. When the substrate processing apparatus is used for a long period of time, the flow rate of the processing liquid in the supply pipe may differ from the detection result of the flow meter. As a result, substrates may be processed in a state where the flow rate of the processing liquid in the supply pipe differs from the detection result of the flow meter. Therefore, substrates may not be processed accurately.

[0006] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing method and a substrate processing apparatus that can process substrates with high precision. [Means for solving the problem]

[0007] A substrate processing method according to the present invention is carried out in a substrate processing apparatus. The substrate processing apparatus includes a processing tank, a flow rate adjuster, and a flow meter. The processing tank stores a processing liquid and processes substrates with the processing liquid. The flow rate adjuster adjusts the flow rate of the processing liquid in a pipe connected to the processing tank by adjusting an opening degree. The flow meter detects the flow rate of the processing liquid in the pipe. The substrate processing method includes a setting process for setting the opening of the flow rate adjustment unit to an initial opening based on opening information indicating a relationship between the initial opening of the flow rate adjustment unit and a target flow rate of the processing liquid; a change process for changing the initial opening to a target opening so that the detection result of the flow meter becomes the target flow rate; a first determination process for determining whether the change from the initial opening to the target opening is a change in a positive direction indicating that the target opening is greater than the initial opening, or a change in a negative direction indicating that the target opening is smaller than the initial opening; and a second determination process for determining whether an abnormality has occurred in the substrate processing apparatus based on multiple determination results obtained by performing the setting process, the change process, and the first determination process multiple times, respectively.

[0008] In one embodiment, in the second judgment process, whether an abnormality has occurred in the substrate processing apparatus is determined by determining whether an abnormality condition is met based on the multiple judgment results, and the abnormality condition indicates that the positive direction change has occurred consecutively a first predetermined number of times or more, or that the negative direction change has occurred consecutively a first predetermined number of times or more.

[0009] In one embodiment, in the second judgment process, whether an abnormality has occurred in the substrate processing apparatus is determined by determining whether an abnormality condition is met based on the multiple judgment results, and the abnormality condition indicates that there have been changes in the positive direction a second predetermined number of times or more in a predetermined period of time, or that there have been changes in the negative direction a second predetermined number of times or more in the predetermined period of time.

[0010] In one embodiment, the substrate is processed based on each of a plurality of recipes, and in the second judgment step, it is determined whether or not an abnormality has occurred in the substrate processing apparatus based on the plurality of judgment results executed using the same recipe among the plurality of recipes.

[0011] The substrate processing apparatus of the present invention includes a processing tank that stores a processing liquid and processes substrates with the processing liquid, a flow rate adjustment unit that adjusts the flow rate of the processing liquid in a pipe connected to the processing tank by adjusting its opening, a flow meter that detects the flow rate of the processing liquid in the pipe, a setting unit that sets the opening of the flow rate adjustment unit to an initial opening based on opening information that indicates the relationship between the initial opening of the flow rate adjustment unit and a target flow rate of the processing liquid, a change unit that changes the initial opening to a target opening so that the detection result of the flow meter becomes the target flow rate, a first judgment unit that determines whether the change from the initial opening to the target opening is a change in a positive direction indicating that the target opening is greater than the initial opening, or a change in a negative direction indicating that the target opening is smaller than the initial opening, and a second judgment unit that determines whether an abnormality has occurred in the substrate processing apparatus based on multiple judgment results determined by the first judgment unit.

[0012] In one embodiment, the system includes a plurality of the pipes, a plurality of the flow rate control units, and a plurality of the flow meters, the same or different types of processing liquid flowing through the plurality of pipes, and the second determination unit determines whether an abnormality has occurred in each of the plurality of flow meters. [Effects of the Invention]

[0013] According to the substrate processing method and substrate processing apparatus of the present invention, the substrate can be processed with high precision. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a schematic perspective view showing a substrate processing apparatus according to a first embodiment of the present invention. [Figure 2] 1 is a schematic cross-sectional view showing a substrate processing apparatus according to a first embodiment. [Figure 3] FIG. 2 is a block diagram showing a control device according to the first embodiment. [Figure 4] FIG. 2 is a view for explaining the substrate processing performed by the substrate processing apparatus according to the first embodiment. [Figure 5] 4 is a flowchart showing a process performed by a control device included in the substrate processing apparatus of the first embodiment. [Figure 6] FIG. 10 is a view for explaining a substrate processing performed by a substrate processing apparatus according to a second embodiment of the present invention. [Figure 7] FIG. 10 is a view for explaining a substrate processing performed by a substrate processing apparatus according to a third embodiment of the present invention. [Figure 8] FIG. 10 is a schematic cross-sectional view showing a substrate processing apparatus according to a fourth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In the embodiment of the present invention, the X-axis, Y-axis, and Z-axis are mutually orthogonal, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0016] <Embodiment 1> A substrate processing apparatus 100A and a substrate processing method according to a first embodiment of the present invention will be described with reference to Fig. 1. First, the substrate processing apparatus 100A will be described with reference to Fig. 1. Fig. 1 is a schematic perspective view showing the substrate processing apparatus 100A. Specifically, Fig. 1(a) and Fig. 1(b) are schematic perspective views of the substrate processing apparatus 100A before and after a substrate W is loaded into a processing bath 110.

[0017] 1(a) and 1(b), the substrate processing apparatus 100A processes a plurality of substrates W collectively with the processing liquid LQ. Alternatively, the substrate processing apparatus 100A may process a predetermined number of substrates W at a time with the processing liquid LQ. The predetermined number is an integer equal to or greater than 1.

[0018] The substrate W is thin and plate-shaped. Typically, the substrate W is thin and approximately disk-shaped. Examples of the substrate W include semiconductor wafers, substrates for liquid crystal displays, substrates for plasma displays, substrates for field emission displays (FEDs), substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0019] The processing liquid LQ is used to perform at least one of etching, surface treatment, property imparting, treatment film formation, and at least partial film removal and cleaning on the substrates W. For example, the substrate processing apparatus 100A performs etching of a silicon oxide film (SiO film) and a silicon nitride film (SiN film) on the surface of the substrate W made of a silicon substrate on which a pattern is to be formed. In such an etching process, either the silicon oxide film or the silicon nitride film is removed from the surface of the substrate W.

[0020] The processing liquid LQ is, for example, a chemical liquid. The processing liquid includes an etching liquid, a rinse liquid, SC1, and SC2. The etching liquid etches the substrate W. The etching liquid is, for example, hydrofluoric nitric acid (a mixture of hydrofluoric acid (HF) and nitric acid (HNO3)), hydrofluoric acid, buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), or phosphoric acid (H3PO4). The rinse liquid rinses the substrate W. Specifically, the rinse liquid is used to wash away the etching liquid remaining on the substrate W. The rinse liquid is, for example, deionized water, carbonated water, electrolytic ionized water, hydrogen water, ozone water, or hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm). SC1 and SC2 each clean the substrate W. SC1 is, for example, a mixture containing NH4OH and HO2. The processing liquid is not particularly limited, but in the following, in the first embodiment, a case where the processing liquid LQ is an etching liquid will be described.

[0021] Specifically, the substrate processing apparatus 100A includes a processing bath 110 and a substrate holder 120.

[0022] The processing tank 110 stores the processing liquid LQ. Specifically, the processing tank 110 has a double tank structure including an inner tank 112 and an outer tank 114. The inner tank 112 and the outer tank 114 each have an upper opening that opens upward. The inner tank 112 stores the processing liquid LQ and is configured to be able to accommodate a plurality of substrates W. The outer tank 114 is provided on the outer peripheral surface of the upper opening of the inner tank 112.

[0023] The substrate holding part 120 holds a plurality of substrates W. The plurality of substrates W are arranged in a line along a first direction D10 (Y direction). In other words, the first direction D10 indicates the arrangement direction of the plurality of substrates W. The first direction D10 is approximately parallel to the horizontal direction. Furthermore, each of the plurality of substrates W is approximately parallel to a second direction D20. The second direction D20 is approximately perpendicular to the first direction D10 and approximately parallel to the horizontal direction.

[0024] Specifically, the substrate holding unit 120 includes a lifter. The substrate holding unit 120 moves vertically upward or vertically downward while holding a plurality of substrates W. As the substrate holding unit 120 moves vertically downward, the plurality of substrates W held by the substrate holding unit 120 are immersed in the processing liquid LQ stored in the inner bath 112.

[0025] 1(a), the substrate holding unit 120 is located above the inner bath 112 of the processing bath 110. The substrate holding unit 120 descends vertically downward (in the Z direction) while holding multiple substrates W. As a result, the multiple substrates W are loaded into the processing bath 110.

[0026] 1(b), when the substrate holding part 120 descends to the processing tank 110, the plurality of substrates W are immersed in the processing liquid LQ in the processing tank 110. In the first embodiment, the substrate holding part 120 immerses the plurality of substrates W, which are aligned at a predetermined interval, in the processing liquid LQ stored in the processing tank 110.

[0027] In detail, the substrate holding unit 120 further includes a main body plate 122 and holding rods 124. The main body plate 122 is a plate extending in the vertical direction (Z direction). The holding rods 124 extend in the horizontal direction (Y direction) from one main surface of the main body plate 122. In the example of FIGS. 1(a) and 1(b), three holding rods 124 extend in the horizontal direction from one main surface of the main body plate 122. The multiple substrates W are aligned at a predetermined interval, and are held in an upright position (vertical position) by the multiple holding rods 124 abutting the lower edge of each substrate W.

[0028] The substrate holding part 120 may further include a lifting unit 126. The lifting unit 126 raises and lowers the main body plate 122 between a processing position (position shown in FIG. 1(b)) where the plurality of substrates W held by the substrate holding part 120 are located in the inner bath 112, and a retracted position (position shown in FIG. 1(a)) where the plurality of substrates W held by the substrate holding part 120 are located above the inner bath 112. Therefore, when the lifting unit 126 moves the main body plate 122 to the processing position, the plurality of substrates W held by the holding rods 124 are immersed in the processing liquid LQ.

[0029] Next, the substrate processing apparatus 100A will be described in detail with reference to Fig. 2. Fig. 2 is a schematic cross-sectional view showing the substrate processing apparatus 100A according to the first embodiment. Note that open valves are shown in white, and closed valves are shown in black. As shown in Fig. 2, the substrate processing apparatus 100A further includes a first supply unit 210, a plurality of circulating processing liquid supply members 130, a diluting liquid supply unit 700, and a control device 200.

[0030] The multiple circulating treatment liquid supply members 130 supply the treatment liquid LQ to the inner tank 112 of the treatment tank 110. The multiple circulating treatment liquid supply members 130 are arranged inside the inner tank 112 of the treatment tank 110, at the bottom of the inner tank 112. Each of the multiple circulating treatment liquid supply members 130 has a substantially cylindrical shape. Each of the multiple circulating treatment liquid supply members 130 is, for example, a pipe.

[0031] Specifically, each of the multiple circulating treatment liquid supply members 130 has multiple treatment liquid discharge holes P. In FIG. 2, only one treatment liquid discharge hole P is shown for each circulating treatment liquid supply member 130. Each of the multiple circulating treatment liquid supply members 130 supplies the treatment liquid LQ to the inner tank 112 through the multiple treatment liquid discharge holes P.

[0032] The diluent supply unit 700 supplies the diluent to the processing tank 110 via a plurality of circulating processing liquid supply members 130. The diluent is, for example, DIW (Deionized Water).

[0033] The first supply unit 210 includes a first pipe 211, a first flow meter 212, a first adjustment valve 215, a first on-off valve 216, and an on-off valve 217. The first flow meter 212, the first adjustment valve 215, the first on-off valve 216, and the on-off valve 217 are arranged in this order on the first pipe 211, either upstream or downstream of the first pipe 211. The first adjustment valve 215 is an example of a "flow rate adjustment unit."

[0034] The first pipe 211 supplies the processing liquid LQ to the processing tank 110 via a plurality of circulating processing liquid supply members 130. More specifically, the processing liquid LQ is supplied from the tank 218 to the processing tank 110 via the first pipe 211. The processing liquid LQ is, for example, hydrofluoric acid (HF). The first pipe 211 is a tubular member through which the processing liquid LQ flows.

[0035] The first on-off valve 216 opens and closes the first pipe 211. That is, the first on-off valve 216 switches between supplying and stopping the supply of the processing liquid LQ from the first pipe 211 to the processing tank 110.

[0036] The on-off valve 217 opens and closes the first pipe 211. That is, the on-off valve 217 switches between supplying and stopping the supply of the processing liquid LQ from the first pipe 211 to the processing tank 110.

[0037] The first adjustment valve 215 adjusts the flow rate of the processing liquid LQ flowing through the first pipe 211. The "flow rate" indicates, for example, the flow rate of the processing liquid LQ passing through a unit area per unit time. The first adjustment valve 215 adjusts the opening degree to adjust the flow rate of the processing liquid LQ in the first pipe 211.

[0038] The first adjusting valve 215 is, for example, a motor needle valve. Specifically, the first adjusting valve 215 includes a valve body (not shown) having a valve seat provided therein, a needle that opens and closes the valve seat, and a motor (not shown) that moves the needle between an open position and a closed position. The opening degree of the first adjusting valve 215 is adjusted by the control device 200. Specifically, the opening degree of the first adjusting valve 215 is adjusted by the number of drive pulses input to the motor to move the needle from its home position.

[0039] The first flow meter 212 detects the flow rate of the treatment liquid LQ flowing through the first piping 211. The first flow meter 212 is, for example, a positive displacement flow meter, a differential pressure flow meter, a vortex flow meter, a hot wire mass flow meter, a steam flow meter, a mass flow meter, an ultrasonic flow meter, or an electromagnetic flow meter. The first flow meter 212 outputs a signal indicating the flow rate to the control device 200. The signal indicating the flow rate is an example of a "detection result" and indicates the flow rate of the treatment liquid LQ flowing through the first piping 211. Hereinafter, the signal indicating the flow rate will be referred to as a "first flow rate signal FA."

[0040] Next, the control device 200 will be described with reference to Figures 3 and 4. Figure 3 is a block diagram showing the control device 200 according to the first embodiment. Figure 4 is a diagram for explaining the substrate processing performed by the substrate processing apparatus 100A according to the first embodiment. "Substrate processing" refers to sequentially processing a predetermined number of substrates W with the processing liquid LQ.

[0041] 3, the control device 200 controls the operations of the various parts of the substrate processing apparatus 100 A. Specifically, the control device 200 includes a control unit 201 and a storage unit 202.

[0042] The storage unit 202 includes a main storage device. The main storage device is, for example, a semiconductor memory. The storage unit 202 may further include an auxiliary storage device. The auxiliary storage device includes, for example, at least one of a semiconductor memory and a hard disk drive. The storage unit 202 may also include removable media.

[0043] The storage unit 202 stores data and computer programs. The data includes data DA indicating substrate processing to be performed by the substrate processing apparatus 100A. As shown in FIG. 4, the substrate W is processed based on each of a plurality of recipes. The data DA indicating the substrate processing includes information indicating a plurality of recipes RAA. Specifically, the data DA indicating the substrate processing includes information indicating a first recipe RAA1, information indicating a second recipe RAA2, and information indicating a third recipe RAA3. The first recipe RAA1, the second recipe RAA2, and the third recipe RAA3 are the same recipe. The first recipe RAA1, the second recipe RAA2, and the third recipe RAA3 are executed in this order.

[0044] Each of the information indicating the first recipe RAA1, the information indicating the second recipe RAA2, and the information indicating the third recipe RAA3 includes information indicating a plurality of recipe steps. In other words, each of the plurality of recipes RAA defines the processing content and processing procedure for the substrate W.

[0045] Specifically, each of the multiple recipes RAA includes recipe step 1st, recipe step N, and recipe step N+1. Recipe step 1st, recipe step N, and recipe step N+1 are executed in this order. Recipe step 1st, recipe step N, and recipe step N+1 each indicate different processing content. Recipe step N includes information indicating a target flow rate SAA of the processing liquid LQ.

[0046] 4 shows the detection results of the first flow meter 212, the open / close states of the first on-off valve 216 and the on-off valve 217, the process contents of the recipe steps, and the state of the opening degree of the first adjusting valve 215. In the detection results of the first flow meter 212, the horizontal axis indicates time, and the vertical axis indicates the flow rate of the processing liquid LQ. In the open / close states of the first on-off valve 216 and the on-off valve 217, the horizontal axis indicates time, and the vertical axis indicates either the open state or the closed state. In the process contents of the recipe steps, the horizontal axis indicates time, and the vertical axis indicates the process contents of the recipe steps. In the state of the opening degree of the first adjusting valve 215, the horizontal axis indicates time, and the vertical axis indicates the opening degree of the first adjusting valve 215.

[0047] The memory unit 202 also stores a first table TA. The first table TA is an example of "opening information." The first table TA indicates the relationship between the initial opening XAA of the first adjustment valve 215 and the target flow rate SAA of the processing liquid LQ. The initial opening XAA indicates the magnitude of the opening of the first adjustment valve 215. Specifically, the initial opening XAA includes information indicating the number of drive pulses from the origin position of the needle so that the flow rate of the processing liquid LQ flowing through the first piping 211 becomes the target flow rate SAA. In more detail, the number of drive pulses from the origin position of the needle is taught to the memory unit 202.

[0048] The control unit 201 includes a processor. The control unit 201 includes, for example, a central processing unit (CPU) or a micro processing unit (MPU). Alternatively, the control unit 201 may include a general-purpose computing device.

[0049] The control unit 201 processes the substrate W with the processing liquid LQ based on the first table TA and the computer program and data stored in the storage unit 202. Specifically, the control unit 201 includes a setting unit 2011, a changing unit 2012, a first determination unit 2013, and a second determination unit 2014.

[0050] The setting unit 2011 sets the opening of the first adjusting valve 215 to an initial opening XAA based on the first table TA. Specifically, the setting unit 2011 outputs an opening signal to the first adjusting valve 215. The opening signal indicates the number of drive pulses from the origin position of the needle. More specifically, when the processing liquid LQ is to be supplied to the processing tank 110 at a target flow rate SAA, the setting unit 2011 outputs the number of drive pulses based on the first table TA to the first adjusting valve 215.

[0051] Furthermore, the setting unit 2011 outputs an opening / closing signal to the first opening / closing valve 216 and the opening / closing valve 217. The opening / closing signal indicates either an open state or a closed state of the first pipe 121. In detail, the setting unit 2011 outputs an opening / closing signal indicating an open state to the first opening / closing valve 216 and the opening / closing valve 217, causing the first opening / closing valve 216 and the opening / closing valve 217 to open the first pipe 211. On the other hand, the setting unit 2011 outputs an opening / closing signal indicating a closed state to the first opening / closing valve 216 and the opening / closing valve 217, causing the first opening / closing valve 216 and the opening / closing valve 217 to close the first pipe 211. Specifically, the setting unit 2011 outputs an opening / closing signal indicating an open state to the first opening / closing valve 216 and the opening / closing valve 217 at times T1, T3, and T5. Furthermore, at times T2, T4, and T6, the setting unit 2011 outputs an open / close signal indicating a closed state to the first open / close valve 216 and the open / close valve 217.

[0052] The change unit 2012 changes the opening of the first adjustment valve 215 from the initial opening XAA to the target opening YAA so that the detection result of the first flow meter 212 becomes the target flow rate SAA. Specifically, the change unit 2012 receives a first flow rate signal FA from the first flow meter 212. When the flow rate indicated by the first flow rate signal FA is less than the target flow rate SAA, the change unit 2012 outputs an opening signal indicating an opening greater than the initial opening XAA to the first adjustment valve 215. As a result, the flow rate of the treatment liquid LQ flowing through the first piping 211 becomes the target flow rate SAA. On the other hand, when the flow rate indicated by the first flow rate signal FA is greater than the target flow rate SAA, the change unit 2012 outputs an opening signal indicating an opening smaller than the initial opening XAA to the first adjustment valve 215. As a result, the flow rate of the treatment liquid LQ flowing through the first piping 211 becomes the target flow rate SAA.

[0053] The change unit 2012 is also capable of feedback-controlling the opening of the first adjusting valve 215. More specifically, the feedback control includes proportional control, integral control, and differential control based on the first flow rate signal FA. The change unit 2012 executes proportional control, integral control, and differential control based on the flow rate indicated by the first flow rate signal FA, and outputs an opening signal indicating the opening obtained by executing the proportional control, integral control, and differential control to the first adjusting valve 215. The feedback control is, for example, PID control.

[0054] The first determination unit 2013 determines whether the change from the initial opening XAA to the target opening YAA is a positive change or a negative change. A positive change indicates that the target opening YAA is greater than the initial opening XAA. A negative change indicates that the target opening YAA is smaller than the initial opening XAA.

[0055] The second determination unit 2014 determines whether an abnormality has occurred in the substrate processing apparatus 100A based on the multiple determination results determined by the first determination unit 2013. In other words, the second determination unit 2014 determines whether an abnormality has occurred in the substrate processing apparatus 100A based on multiple determination results obtained by performing a setting process, a changing process, and a first determination process (described later) multiple times. In detail, the second determination unit 2014 determines whether an abnormality condition is met based on the multiple determination results, thereby determining whether an abnormality condition has occurred in the substrate processing apparatus 100A. The abnormality condition indicates that a first predetermined number of consecutive positive direction changes or a first predetermined number of consecutive negative direction changes is met. The first predetermined number of times is two or more, for example, three times.

[0056] For example, if the change from the initial opening XAA to the target opening YAA when the first recipe RAA1 is executed is a positive change, if the change from the initial opening XAA to the target opening YAA when the second recipe RAA2 is executed is a positive change, and if the change from the initial opening XAA to the target opening YAA when the third recipe RAA3 is executed is a positive change, the second determination unit 2014 determines that the abnormality condition is satisfied. As a result, it can be recognized that the origin of the first flow meter 212 has shifted or the state of the first supply unit 210 has become unbalanced due to long-term use of the substrate processing apparatus 100A. Therefore, it is possible to adjust the origin of the first flow meter 212 or check the state of the first supply unit 210 at an appropriate time.

[0057] On the other hand, if the change from the initial opening XAA to the target opening YAA when the first recipe RAA1 is executed is a positive change, if the change from the initial opening XAA to the target opening YAA when the second recipe RAA2 is executed is a positive change, and if the change from the initial opening XAA to the target opening YAA when the third recipe RAA3 is executed is a negative change, the second determination unit 2014 determines that the abnormality condition is not satisfied. As a result, it can be recognized that the origin of the first flow meter 212 is not shifted and the state of the first supply unit 210 is not unbalanced.

[0058] The first embodiment of the present invention has been described above. According to the first embodiment, it is determined whether or not an abnormality has occurred in the substrate processing apparatus 100A based on a plurality of determination results. As a result, it is possible to recognize a deviation in the detection result of the first flow meter 212. Therefore, it is possible to recognize that the origin of the first flow meter 212 has shifted or the state of the first supply unit 210 has become unbalanced due to long-term use of the substrate processing apparatus 100A. As a result, it is possible to prevent the substrate W from being processed in a state where the flow rate of the processing liquid LQ in the first pipe 211 and the detection result of the first flow meter 212 are different.

[0059] The abnormal condition indicates that the positive direction change has occurred a first predetermined number of times or more in succession, or that the negative direction change has occurred a first predetermined number of times or more in succession. As a result, it is easy to recognize that the deviation in the detection result of the first flow meter 212 is biased.

[0060] Next, the substrate processing method of embodiment 1 will be described with reference to Fig. 5. The substrate processing method of embodiment 1 is performed by the substrate processing apparatus 100A described with reference to Figs. 1 to 4. Fig. 5 is a flowchart showing processing by the control device 200 provided in the substrate processing apparatus 100A of embodiment 1.

[0061] First, in step S101, the setting unit 2011 outputs an open / close signal indicating a closed state to the first open / close valve 216 and the open / close valve 217, thereby closing the first pipe 211.

[0062] Next, in step S102, the setting unit 2011 sets the opening degree of the first adjusting valve 215 to the closing angle.

[0063] Next, in step S103, the setting unit 2011 sets the opening degree of the first adjusting valve 215 to the initial opening degree XAA based on the first table TA. Step S103 corresponds to an example of the "setting step" of the present invention.

[0064] Next, in step S104, the setting unit 2011 outputs an open / close signal indicating an open state to the first open / close valve 216 and the open / close valve 217, thereby opening the first pipe 211.

[0065] Next, in step S105, the change unit 2012 receives the first flow rate signal FA from the first flow meter 212.

[0066] Next, in step S106, the change unit 2012 changes the opening of the first adjusting valve 215 from the initial opening XAA to the target opening YAA so that the detection result of the first flow meter 212 becomes the target flow rate SAA. Step S106 corresponds to an example of the "changing step" of the present invention.

[0067] Next, in step S107, the first determination unit 2013 determines whether the change from the initial opening XAA to the target opening YAA is a change in the positive direction or a change in the negative direction. Step S107 corresponds to an example of the "first determination step" of the present invention.

[0068] Next, in step S108, the second determination unit 2014 determines whether or not the abnormal condition is satisfied based on the multiple determination results determined by the first determination unit 2013. Step S108 corresponds to an example of the "second determination step" of the present invention. If the second determination unit 2014 determines in step S108 that the abnormal condition is not satisfied, the process returns to step S101.

[0069] On the other hand, if the second determination unit 2014 determines in step S108 that the abnormal condition is satisfied, the process proceeds to step S109.

[0070] Next, in step S109, the second judging unit 2014 issues an alert indicating that an abnormality has occurred in the substrate processing apparatus 100A, and the process ends.

[0071] The first embodiment of the present invention has been described above. According to the first embodiment, it is determined whether or not the abnormality condition is met based on a plurality of determination results. As a result, it is possible to recognize a deviation in the detection result of the first flow meter 212. Therefore, it is possible to recognize that the origin of the first flow meter 212 has shifted or the state of the first supply unit 210 has become unbalanced due to long-term use of the substrate processing apparatus 100A. As a result, it is possible to prevent the substrate W from being processed in a state where the flow rate of the processing liquid LQ in the first pipe 211 and the detection result of the first flow meter 212 are different.

[0072] The substrate processing apparatus 100A according to the first embodiment will be described in more detail with reference to Fig. 2. The substrate processing apparatus 100A further includes a drainage section 170 and a circulation section 140.

[0073] The drainage unit 170 discharges the processing liquid LQ from the processing tank 110. Specifically, the drainage unit 170 includes a drainage pipe 170a and a valve 170b. The drainage pipe 170a is connected to the bottom wall of the inner tank 112 of the processing tank 110. A valve 170b is disposed on the drainage pipe 170a. When the valve 170b opens, the processing liquid LQ stored in the inner tank 112 is discharged to the outside through the drainage pipe 170a. The discharged processing liquid LQ is sent to a wastewater treatment device (not shown) and treated.

[0074] The circulation unit 140 includes a pipe 141, a pump 142, a heater 143, a filter 144, an adjustment valve 145, and a valve 146. The pump 142, the heater 143, the filter 144, the adjustment valve 145, and the valve 146 are arranged in this order from the upstream to the downstream of the pipe 141.

[0075] The pipe 141 guides the processing liquid LQ, which is delivered from the processing tank 110, back to the processing tank 110. Specifically, the upstream end of the pipe 141 is connected to the outer tank 114. Therefore, the pipe 141 guides the processing liquid LQ from the outer tank 114 to the circulating processing liquid supply member 130. The downstream end of the pipe 141 is connected to the circulating processing liquid supply member 130. Specifically, the downstream end of the pipe 141 is connected to the discharge unit 131.

[0076] The pump 142 sends the processing liquid LQ from the pipe 141 to the discharge part 131. Therefore, the discharge part 131 discharges the processing liquid LQ supplied from the pipe 141. The filter 144 filters the processing liquid LQ flowing through the pipe 141.

[0077] The heater 143 heats the temperature of the processing liquid LQ flowing through the pipe 141. In other words, the heater 143 adjusts the temperature of the processing liquid LQ. The adjustment valve 145 adjusts the opening of the pipe 141 to adjust the flow rate of the processing liquid LQ supplied to the discharge part 131. The valve 146 opens and closes the pipe 141.

[0078] [Embodiment 2] A second embodiment of the present invention will be described with reference to Fig. 6. However, differences from the first embodiment will be described, and a description of the same aspects as in the first embodiment will be omitted. The second embodiment differs from the first embodiment in that the abnormal condition indicates that there have been a second predetermined number of positive direction changes in a predetermined period of time or more, or that there have been a second predetermined number of negative direction changes in a predetermined period of time.

[0079] FIG. 6 is a diagram illustrating substrate processing performed by the substrate processing apparatus 100A according to the second embodiment. As shown in FIG. 6, a substrate W is processed based on each of a plurality of recipes. The data DB indicating the substrate processing includes information indicating a plurality of recipes RBB. Specifically, the data DB indicating the substrate processing includes information indicating a first recipe RBB1, information indicating a second recipe RBB2, information indicating a third recipe RBB3, and information indicating a fourth recipe RBB4. The first recipe RBB1, the second recipe RBB2, the third recipe RBB3, and the fourth recipe RBB4 are the same recipe. The first recipe RBB1, the second recipe RBB2, the third recipe RBB3, and the fourth recipe RBB4 are executed in this order.

[0080] Each of the information indicating the first recipe RBB1, the information indicating the second recipe RBB2, the information indicating the third recipe RBB3, and the information indicating the fourth recipe RBB4 includes information indicating a plurality of recipe steps. At times T1, T3, T5, and T7, the setting unit 2011 outputs opening / closing signals indicating an open state to the first opening / closing valve 216 and the opening / closing valve 217. At times T2, T4, T6, and T8, the setting unit 2011 outputs opening / closing signals indicating a closed state to the first opening / closing valve 216 and the opening / closing valve 217.

[0081] The second determination section 2014 determines whether or not the abnormality condition is satisfied based on the multiple determination results obtained by the first determination section 2013. In other words, the second determination section 2014 determines whether or not an abnormality has occurred in the substrate processing apparatus 100A based on multiple determination results obtained by performing the setting step, the changing step, and the first determination step multiple times.

[0082] Specifically, the abnormal condition indicates that there have been a second predetermined number of positive changes or more in a predetermined period of time, or that there have been a second predetermined number of negative changes or more in a predetermined period of time. The predetermined period is, for example, a period during which the recipe is executed four times. The second predetermined number of times is, for example, three times.

[0083] For example, when the first recipe RBB1 is executed, the change from the initial opening XAA to the target opening YAA is a positive change; when the second recipe RBB2 is executed, the change from the initial opening XAA to the target opening YAA is a positive change; when the third recipe RBB3 is executed, the change from the initial opening XAA to the target opening YAA is a negative change; and when the fourth recipe RBB4 is executed, the change from the initial opening XAA to the target opening YAA is a positive change, the second determination unit 2014 determines that the abnormality condition is satisfied. As a result, it can be recognized that the origin of the first flow meter 212 has shifted or the state of the first supply unit 210 has become unbalanced due to long-term use of the substrate processing apparatus 100A. Therefore, the origin of the first flow meter 212 can be adjusted or the state of the first supply unit 210 can be checked at an appropriate time.

[0084] On the other hand, if the change from the initial opening XAA to the target opening YAA when the first recipe RBB1 is executed is a positive change, if the change from the initial opening XAA to the target opening YAA when the second recipe RBB2 is executed is a positive change, if the change from the initial opening XAA to the target opening YAA when the third recipe RBB3 is executed is a negative change, or if the change from the initial opening XAA to the target opening YAA when the fourth recipe RBB4 is executed is a negative change, the second determination unit 2014 determines that the abnormality condition is not satisfied. As a result, it can be recognized that the origin of the first flow meter 212 is not shifted or the state of the first supply unit 210 is not unbalanced.

[0085] The second embodiment of the present invention has been described above. According to the second embodiment, it is determined whether or not an abnormality condition is met based on a plurality of determination results. As a result, it is possible to recognize a deviation in the detection result of the first flow meter 212. Therefore, it is possible to recognize that the origin of the first flow meter 212 has shifted or the state of the first supply unit 210 has become unbalanced due to long-term use of the substrate processing apparatus 100A. As a result, it is possible to prevent the substrate W from being processed in a state where the flow rate of the processing liquid LQ in the first pipe 211 and the detection result of the first flow meter 212 are different.

[0086] The abnormal condition indicates that there have been a second predetermined number of positive changes or more in a predetermined period, or that there have been a second predetermined number of negative changes or more in a predetermined period, so that it is easy to recognize that the deviation in the detection result of the first flow meter 212 is biased.

[0087] [Embodiment 3] A third embodiment of the present invention will be described with reference to Fig. 7. However, differences from the first embodiment will be described, and a description of the same matters as in the first embodiment will be omitted. The third embodiment differs from the first embodiment in that the first recipe RCC1 and the third recipe RCC3 are different recipes.

[0088] 7 is a diagram illustrating substrate processing performed by the substrate processing apparatus 100A according to the third embodiment. As shown in FIG. 7, a substrate W is processed based on each of a plurality of recipes. The data DC indicating the substrate processing includes information indicating a plurality of recipes RCC. Specifically, the data DC indicating the substrate processing includes information indicating a first recipe RCC1, information indicating a second recipe RCC2, information indicating a third recipe RCC3, and information indicating a fourth recipe RCC4. The first recipe RCC1, the second recipe RCC2, the third recipe RCC3, and the fourth recipe RCC4 are executed in this order.

[0089] The information indicating the first recipe RCC1, the information indicating the second recipe RCC2, the information indicating the third recipe RCC3, and the information indicating the fourth recipe RCC4 each include information indicating a plurality of recipe steps. Recipe step N of each of the information indicating the first recipe RCC1, the information indicating the second recipe RCC2, and the information indicating the fourth recipe RCC4 includes information indicating a target flow rate SAA of the processing liquid LQ. Recipe step N of the information indicating the third recipe RCC3 includes information indicating a target flow rate SCC of the processing liquid LQ.

[0090] The second determination unit 2014 determines whether the abnormal condition is satisfied based on multiple determination results determined by the first determination unit 2013. In other words, the second determination unit 2014 determines whether the abnormal condition is satisfied based on multiple determination results obtained by performing the setting process, the changing process, and the first determination process multiple times. Specifically, the abnormal condition indicates that a positive change has occurred a first predetermined number of times or more, or that a negative change has occurred a first predetermined number of times or more. In the third embodiment, the second determination unit 2014 determines whether the abnormal condition is satisfied based on multiple determination results executed for the same recipe among multiple recipes. In more detail, because the third recipe RCC3 is different from recipes other than the third recipe RCC3, the determination result for the third recipe RCC3 is excluded.

[0091] For example, if the change from the initial opening XAA to the target opening YAA when the first recipe RCC1 is executed is a positive change, if the change from the initial opening XAA to the target opening YAA when the second recipe RCC2 is executed is a positive change, and if the change from the initial opening XAA to the target opening YAA when the fourth recipe RCC4 is executed is a positive change, the second determination unit 2014 determines that the abnormality condition is met. As a result, even if different recipes are executed, it is possible to recognize that the origin of the first flow meter 212 has shifted or the state of the first supply unit 210 has become unbalanced. Therefore, it is possible to adjust the origin of the first flow meter 212 or check the state of the first supply unit 210 at an appropriate time.

[0092] [Embodiment 4] Next, a fourth embodiment of the present invention will be described with reference to Fig. 8. Fig. 8 is a schematic cross-sectional view showing a substrate processing apparatus 100A according to the first embodiment. However, differences from the first embodiment will be described, and a description of the same aspects as the first embodiment will be omitted. The fourth embodiment differs from the first embodiment in that it further includes a plurality of supply units.

[0093] 8, the substrate processing apparatus 100A further includes a second supply unit 310, a third supply unit 410, a fourth supply unit 510, and a fifth supply unit 610. The second supply unit 310, the third supply unit 410, the fourth supply unit 510, and the fifth supply unit 610 each have the same configuration as the first supply unit 210.

[0094] The second supply unit 310 includes a second pipe 311, a second flow meter 312, a second adjustment valve 315, a second on-off valve 316, and an on-off valve 317. The third supply unit 410 includes a third pipe 411, a third flow meter 412, a third adjustment valve 415, a third on-off valve 416, and an on-off valve 417. The fourth supply unit 510 includes a fourth pipe 511, a fourth flow meter 512, a fourth adjustment valve 515, a fourth on-off valve 516, and an on-off valve 517. The fifth supply unit 610 includes a fifth pipe 611, a fifth flow meter 612, a fifth adjustment valve 615, a fifth on-off valve 616, and an on-off valve 617. Each of the second adjusting valve 315, the third adjusting valve 415, the fourth adjusting valve 515, and the fifth adjusting valve 615 is an example of a "flow rate adjusting section."

[0095] The same or different types of processing liquid LQ flow through the first pipe 211, the second pipe 311, the third pipe 411, the fourth pipe 511, and the fifth pipe 611. For example, hydrofluoric acid (HF) flows as the processing liquid LQ through the first pipe 211. Hydrochloric acid (HCl) flows as the processing liquid LQ through the second pipe 311. Hydrogen peroxide (H2O2) flows as the processing liquid LQ through the third pipe 411. H2O2 flows as the processing liquid LQ through the fourth pipe 511. Trimethyl-2-hydroxyethylammonium hydroxide (TMY) flows as the processing liquid LQ through the fifth pipe 611.

[0096] The storage unit 202 further stores a second table, a third table, a fourth table, and a fifth table. Each of the second table, the third table, the fourth table, and the fifth table is an example of "opening information." The second table shows the relationship between the initial opening XAA of the second adjustment valve 315 and the target flow rate SAA of the processing liquid LQ. The third table shows the relationship between the initial opening XAA of the third adjustment valve 415 and the target flow rate SAA of the processing liquid LQ. The fourth table shows the relationship between the initial opening XAA of the fourth adjustment valve 515 and the target flow rate SAA of the processing liquid LQ. The fifth table shows the relationship between the initial opening XAA of the fifth adjustment valve 615 and the target flow rate SAA of the processing liquid LQ.

[0097] The second determination unit 2014 determines whether the abnormal condition is satisfied for each of the first flow meter 212, the second flow meter 312, the third flow meter 412, the fourth flow meter 512, and the fifth flow meter 612. Specifically, the second determination unit 2014 determines whether the abnormal condition is satisfied for the first flow meter 212 based on a plurality of determination results obtained by executing the setting step, the changing step, and the first determination step a plurality of times in the first supply unit 210. The second determination unit 2014 also determines whether the abnormal condition is satisfied for the second flow meter 312 based on a plurality of determination results obtained by executing the setting step, the changing step, and the first determination step a plurality of times in the third supply unit 410. The second determination unit 2014 also determines whether the abnormal condition is satisfied for the third flow meter 412 based on a plurality of determination results obtained by executing the setting step, the changing step, and the first determination step a plurality of times in the third supply unit 410. The second determination unit 2014 determines whether or not the abnormal condition of the fourth flow meter 512 is satisfied based on a plurality of determination results obtained by executing the setting step, the changing step, and the determination step a plurality of times in the fourth supply unit 510. The second determination unit 2014 determines whether or not the abnormal condition of the fifth flow meter 612 is satisfied based on a plurality of determination results obtained by executing the setting step, the changing step, and the first determination step a plurality of times in the fifth supply unit 610.

[0098] The fourth embodiment of the present invention has been described above. According to the fourth embodiment, it is determined whether the first flow meter 212, the second flow meter 312, the third flow meter 412, the fourth flow meter 512, and the fifth flow meter 612 each satisfy an abnormality condition. As a result, it is possible to recognize that the origins of the first flow meter 212, the second flow meter 312, the third flow meter 412, the fourth flow meter 512, and the fifth flow meter 612 are shifted or in a different state. This allows for appropriate inspection.

[0099] The embodiments of the present invention have been described above with reference to the drawings (FIGS. 1 to 8). However, the present invention is not limited to the above embodiments and can be embodied in various forms without departing from the spirit of the present invention. Furthermore, the components disclosed in the above embodiments can be modified as appropriate. For example, some of the components shown in one embodiment may be added to the components of another embodiment, or some of the components shown in one embodiment may be deleted from the embodiment.

[0100] The drawings mainly show each component in a schematic manner to facilitate understanding of the invention, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of creating the drawings. Furthermore, the configuration of each component shown in the above embodiment is merely an example and is not particularly limited, and it goes without saying that various modifications are possible within a range that does not substantially deviate from the effects of the present invention.

[0101] (1) In the third embodiment, the first recipe RCC1 and the third recipe RCC3 are different recipes, and therefore the determination result of the third recipe RCC3 is excluded. However, this is not particularly limited. The determination result of the third recipe RCC3 may be added. For example, if the change from the initial opening XAA to the target opening YAA when the first recipe RCC1 is executed is a change in the positive direction, the change from the initial opening XAA to the target opening YAA when the second recipe RCC2 is executed is a change in the positive direction, and the change from the initial opening XAA to the target opening YAA when the third recipe RCC3 is executed is a change in the positive direction, the second determination unit 2014 determines that the abnormality condition is satisfied.

[0102] (2) In the first determination step, it was determined whether the change from the initial opening XAA to the target opening YAA was a positive change indicating that the target opening YAA was greater than the initial opening XAA, or a negative change indicating that the target opening YAA was smaller than the initial opening XAA. However, this is not particularly limited. A positive change may indicate that the target opening YAA is greater than the initial opening XAA by a predetermined value or more, and a negative change may indicate that the target opening YAA is smaller than the initial opening XAA by a predetermined value or more. [Industrial Applicability]

[0103] The present invention is useful in the field of substrate processing. [Explanation of symbols]

[0104] 100A: Substrate processing equipment 110: Treatment tank 211: First piping 212: 1st flow meter 215: First adjusting valve (flow rate adjusting part) LQ: Processing liquid

Claims

1. a processing tank for storing a processing liquid and processing a substrate with the processing liquid; a flow rate adjusting unit that adjusts the flow rate of the processing liquid in a pipe connected to the processing tank by adjusting an opening degree; a flow meter that detects the flow rate of the treatment liquid in the pipe; A substrate processing method performed in a substrate processing apparatus comprising: a setting step of setting the opening of the flow rate adjusting unit to the initial opening based on opening information indicating a relationship between the initial opening of the flow rate adjusting unit and the target flow rate of the treatment liquid; a changing step of changing the initial opening to a target opening so that the detection result of the flow meter becomes the target flow rate; a first determination step of determining whether the change from the initial opening to the target opening is a positive change indicating that the target opening is larger than the initial opening, or a negative change indicating that the target opening is smaller than the initial opening; a second determination step of determining whether or not an abnormality has occurred in the substrate processing apparatus based on a plurality of determination results obtained by performing the setting step, the changing step, and the first determination step a plurality of times; A substrate processing method comprising:

2. In the second determination step, it is determined whether an abnormality condition is satisfied based on the plurality of determination results, thereby determining whether an abnormality has occurred in the substrate processing apparatus; 2. The substrate processing method according to claim 1, wherein the abnormal condition indicates that the change in the positive direction has occurred consecutively a first predetermined number of times or more, or that the change in the negative direction has occurred consecutively a first predetermined number of times or more.

3. In the second determination step, it is determined whether an abnormality condition is satisfied based on the plurality of determination results, thereby determining whether an abnormality has occurred in the substrate processing apparatus; 2. The substrate processing method of claim 1, wherein the abnormal condition indicates that there have been changes in the positive direction a second predetermined number of times or more in a predetermined period of time, or that there have been changes in the negative direction a second predetermined number of times or more in the predetermined period of time.

4. processing the substrate according to each of a plurality of recipes; 4. The substrate processing method according to claim 1, wherein in the second determination step, it is determined whether or not an abnormality has occurred in the substrate processing apparatus based on the plurality of determination results executed using the same recipe among the plurality of recipes.

5. a processing tank for storing a processing liquid and processing a substrate with the processing liquid; a flow rate adjusting unit that adjusts the flow rate of the processing liquid in a pipe connected to the processing tank by adjusting an opening degree; a flow meter that detects the flow rate of the treatment liquid in the pipe; a setting unit that sets the opening of the flow rate adjusting unit to the initial opening based on opening information indicating a relationship between the initial opening of the flow rate adjusting unit and a target flow rate of the treatment liquid; a change unit that changes the initial opening to a target opening so that the detection result of the flow meter becomes the target flow rate; a first determination unit that determines whether the change from the initial opening to the target opening is a change in a positive direction indicating that the target opening is larger than the initial opening, or a change in a negative direction indicating that the target opening is smaller than the initial opening; a second determination unit that determines whether or not an abnormality has occurred in the substrate processing apparatus based on a plurality of determination results determined by the first determination unit; A substrate processing apparatus comprising:

6. A plurality of the pipes; A plurality of the flow rate adjusting units; A plurality of said flow meters; Equipped with The same or different types of treatment liquids flow through the plurality of pipes, The substrate processing apparatus according to claim 5 , wherein the second determination unit determines whether or not an abnormality has occurred in each of the plurality of flow meters.

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