Substrate cleaning apparatus and substrate cleaning method

Abstract

To provide a substrate cleaning device and a substrate cleaning method, capable of keeping a holding part for a substrate clean.SOLUTION: By contact of a cleaning tool with a lower surface center region of a substrate W held by a first holding part, the lower surface center region is cleaned. By contact of the cleaning tool with a lower surface outer side region of the substrate W rotated by a second holding part, the lower surface outer side region of the substrate W is cleaned. When cleaning the lower surface center region, the second holding part is rotated around a vertical axis in a state where the substrate W is not held. Alternatively, when cleaning the lower surface center region, air is jetted toward the substrate W from a first height which is separated from the substrate W by a predetermined distance by an air jetting part 53 arranged between the cleaning tool and the second holding part. When drying the lower surface center region, air is jetted toward the substrate W from a second height nearer the substrate W than the first height by the air jetting part 53.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning a substrate. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on various substrates, such as FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, and solar cell substrates. Substrate cleaning apparatuses are used to clean substrates.

[0003] For example, the substrate cleaning apparatus described in Patent Document 1 includes two suction pads that hold the peripheral edge of the back surface of the wafer, a spin chuck that holds the central part of the back surface of the wafer, and a brush that cleans the back surface of the wafer. The two suction pads hold the wafer and move laterally. In this state, the central part of the back surface of the wafer is cleaned with the brush. The spin chuck then receives the wafer from the suction pads and rotates while holding the central part of the back surface of the wafer. In this state, the peripheral part of the back surface of the wafer is cleaned with the brush. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5904169 Summary of the Invention [Problem to be solved by the invention]

[0005] In the substrate cleaning apparatus described in Patent Document 1, the backside of the wafer is dried by an air knife when the wafer is transferred to the spin chuck so that the front surface of the spin chuck and the backside of the wafer come into contact with each other in a dry state. However, it is not easy to sufficiently prevent the cleaning liquid from adhering to the surface of the spin chuck. If contaminated cleaning liquid adheres to the surface of the spin chuck, the cleanliness of the spin chuck decreases. Therefore, it is necessary to keep the spin chuck clean.

[0006] An object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method that can keep a substrate holder clean. [Means for solving the problem]

[0007] (1) A substrate cleaning apparatus according to a first aspect of the present invention comprises: a first holder having a reference position and holding a substrate so that the center of the substrate is located at the reference position; a second holder configured to be rotatable around a vertical axis and holding a central region of the underside of the substrate; a cleaning tool that comes into contact with the central region of the underside of the substrate held by the first holder to clean the central region of the underside, and that comes into contact with an outer region of the underside surrounding the central region of the underside of the substrate rotated by the second holder to clean the outer region of the underside; and a movable base on which the second holder and the cleaning tool are provided, the movable base moving in a horizontal plane so that when the substrate is transferred between the first and second holders, the second holder overlaps the reference position of the first holder in a plan view, and when the central region of the underside is cleaned, the cleaning tool overlaps the reference position of the first holder in a plan view; the second holding part and the cleaning tool move together with the movable base in a horizontal plane; The second holder rotates without holding the substrate when cleaning the central region of the lower surface.

[0008] In the substrate cleaning apparatus according to the present invention, when cleaning the central region of the underside of the substrate, the substrate is held by the first holder so that the center of the substrate is located at a reference position, and a cleaning tool is brought into contact with the central region of the underside of the substrate. The second holder rotates around a vertical axis without holding the substrate. When cleaning the outer region of the underside of the substrate, the substrate is held by the second holder at the central region of the underside and rotated around the vertical axis, and a cleaning tool is brought into contact with the outer region of the underside of the substrate.

[0009] The second holder and the cleaning tool are provided on a movable base. When transferring the substrate between the first holder and the second holder, the movable base is moved in a horizontal plane so that the second holder overlaps the reference position of the first holder in a plan view. When cleaning the central region of the lower surface, the movable base is moved in a horizontal plane so that the cleaning tool overlaps the reference position of the first holder in a plan view.

[0010] With this configuration, when cleaning the central region of the underside of the substrate, the second holder is retracted to a position where it does not overlap with the substrate. Also, even if liquid containing contaminants scattered from the substrate adheres to the second holder, the rotation of the second holder causes the liquid to be shaken off from the second holder. This allows the second holder to be kept clean.

[0011] (2) The substrate cleaning apparatus may further include a gas ejection unit disposed between the cleaning tool and the second holder and ejecting gas toward the substrate. In this case, the gas ejected from the gas ejection unit can prevent liquid containing contaminants from scattering from the substrate toward the second holder when cleaning the central region of the lower surface. The gas ejected from the gas ejection unit can also efficiently dry the central region of the lower surface. This prevents liquid from adhering to the second holder and keeps the second holder clean.

[0012] (3) The substrate cleaning apparatus may further include a linear guide extending in one direction in a horizontal plane, and the movable base may move linearly along the linear guide. In this case, the movable base can be moved in the horizontal plane with a simple configuration.

[0013] (4) The rotation speed of the second holder during cleaning of the central region of the lower surface may be 500 rpm or higher. In this case, liquid adhering to the second holder is quickly shaken off from the second holder. This allows the second holder to be kept clean more efficiently.

[0014] (5) A substrate cleaning apparatus according to a second aspect of the present invention comprises: The substrate has a reference position, and the substrate is positioned so that the center of the substrate is located at the reference position. a first holding part that holds a substrate; a second holding part that rotates the substrate around a vertical axis while holding a central region of the lower surface of the substrate; a cleaning tool that comes into contact with the central region of the lower surface of the substrate held by the first holding part to clean the central region of the lower surface, and that comes into contact with an outer region of the lower surface surrounding the central region of the lower surface of the substrate rotated by the second holding part to clean the outer region of the lower surface; and a gas jetting part that is arranged between the cleaning tool and the second holding part so as to be movable up and down, and that jets gas toward the substrate from a first height that is spaced a predetermined distance from the substrate when cleaning the central region of the lower surface, and that jets gas toward the substrate from a second height that is closer to the substrate than the first height when drying the central region of the lower surface. a movable base that is provided with a second holding unit and a cleaning tool, and that moves within a horizontal plane so that, when a substrate is transferred between the first holding unit and the second holding unit, the second holding unit overlaps with a reference position of the first holding unit in a plan view, and when a central region of the lower surface is cleaned, the cleaning tool overlaps with the reference position of the first holding unit in a plan view; Equipped with The second holding part and the cleaning tool move together with the movable base in a horizontal plane. do.

[0015] In this substrate cleaning apparatus, when cleaning the central region of the lower surface of the substrate, the cleaning tool is brought into contact with the central region of the lower surface of the substrate while the substrate is held by the first holding part. . under When cleaning the central region of the surface, a gas is ejected toward the substrate from a first height spaced a predetermined distance from the substrate by a gas ejection unit disposed between the cleaning tool and the second holder. When drying the central region of the lower surface, a gas is ejected toward the substrate from a second height closer to the substrate than the first height by the gas ejection unit.

[0016] With this configuration, when cleaning the central region of the lower surface, the gas ejected from the gas ejection unit prevents liquid containing contaminants from scattering from the substrate toward the second holding unit. Furthermore, when drying the central region of the lower surface, the gas is ejected from the gas ejection unit onto the lower surface of the substrate while the lower surface and the gas ejection unit are in close proximity, allowing the central region of the lower surface to be dried efficiently. This prevents liquid from adhering to the second holding unit. This allows the second holding unit to be kept clean.

[0017] (6) The second holder may rotate without holding a substrate when cleaning the central region of the lower surface. With this configuration, even if liquid containing contaminants scattered from the substrate adheres to the second holder, the rotation of the second holder causes the liquid to be shaken off from the second holder. This makes it possible to more reliably maintain the second holder clean.

[0018] (7) The substrate cleaning apparatus may further include a common support part that supports the cleaning tool and the gas jetting part. In this case, the cleaning tool and the gas jetting part are moved integrally according to the position of the substrate. This allows the underside of the substrate to be cleaned efficiently. Furthermore, since the gas jetting part is provided to be movable up and down, even when the cleaning tool and the gas jetting part are supported by a common support part, the gas jetting part can be brought closer to the substrate when drying the central region of the underside of the substrate than when cleaning the central region of the underside of the substrate. This allows the underside of the substrate to be dried efficiently.

[0019] (8) A substrate cleaning method according to a third aspect of the present invention includes, when cleaning a central region of the underside of the substrate, holding the substrate with a first holding part so that the center of the substrate is located at a reference position; when cleaning the central region of the underside of the substrate, rotating a second holding part around a vertical axis without holding the substrate; when cleaning the central region of the underside of the substrate, bringing a cleaning tool into contact with the central region of the underside of the substrate held by the first holding part; and when cleaning an outer region of the underside of the substrate surrounding the central region of the underside of the substrate, holding the central region of the underside of the substrate with the second holding part. the substrate is rotated around a vertical axis while holding the substrate; when cleaning the outer region of the lower surface, a cleaning tool is brought into contact with the outer region of the lower surface of the substrate rotated by the second holding part; and when transferring the substrate between the first holding part and the second holding part, the second holding part overlaps with the reference position of the first holding part in a plan view, and when cleaning the central region of the lower surface, the cleaning tool overlaps with the reference position of the first holding part in a plan view, the movable base on which the second holding part and the cleaning tool are provided is moved within a horizontal plane. and moving the movable base in the horizontal plane includes moving the second holding part and the cleaning tool together with the movable base in the horizontal plane. nothing.

[0020] According to this substrate cleaning method, when cleaning the central region of the underside of the substrate, the second holder is retracted to a position where it does not overlap with the substrate. Furthermore, even if liquid containing contaminants scattered from the substrate adheres to the second holder, the rotation of the second holder causes the liquid to be shaken off from the second holder. This allows the second holder to be kept clean.

[0021] (9) The substrate cleaning method may further include ejecting gas toward the substrate from a gas ejection unit disposed between the cleaning tool and the second holder. In this case, when cleaning the central region of the lower surface, the gas ejected from the gas ejection unit can prevent liquid containing contaminants from scattering from the substrate toward the second holder. Furthermore, the gas ejected from the gas ejection unit can efficiently dry the central region of the lower surface. This prevents liquid from adhering to the second holder, and keeps the second holder clean.

[0022] (10) Moving the movable base in a horizontal plane may include moving the movable base linearly along a linear guide extending in one direction in the horizontal plane. In this case, the movable base can be moved in the horizontal plane with a simple configuration.

[0023] (11) Rotating the second holder around the vertical axis without holding a substrate may include rotating the second holder at a rotational speed of 500 rpm or more. In this case, liquid adhering to the second holder is quickly shaken off from the second holder. This allows the second holder to be kept clean more efficiently.

[0024] (12) A substrate cleaning method according to a fourth aspect of the present invention includes the steps of: The center of the substrate is positioned at the reference position. holding a substrate; when cleaning the central region of the lower surface, bringing a cleaning tool into contact with the central region of the lower surface of the substrate held by the first holding part; when cleaning an outer region of the lower surface surrounding the central region of the lower surface of the substrate, rotating the substrate around a vertical axis while holding the central region of the lower surface of the substrate by the second holding part; when cleaning the outer region of the lower surface, bringing a cleaning tool into contact with the outer region of the lower surface of the substrate rotated by the second holding part; when cleaning the central region of the lower surface, jetting gas toward the substrate from a first height spaced a predetermined distance from the substrate by a gas jetting part arranged between the cleaning tool and the second holding part; and when drying the central region of the lower surface, jetting gas toward the substrate from a second height closer to the substrate than the first height by the gas jetting part. and moving a movable base on which the second holding unit and the cleaning tool are provided in a horizontal plane so that, when the substrate is transferred between the first holding unit and the second holding unit, the second holding unit overlaps with the reference position of the first holding unit in a plan view, and when the central region of the lower surface is cleaned, the cleaning tool overlaps with the reference position of the first holding unit in a plan view, and moving the movable base in a horizontal plane means moving the second holding unit and the cleaning tool together with the movable base in a unified manner in the horizontal plane. Includes.

[0025] According to this substrate cleaning method, when cleaning the central region of the lower surface, the gas ejected from the gas ejection unit prevents liquid containing contaminants from scattering from the substrate toward the second holder. Furthermore, when drying the central region of the lower surface, the gas is ejected from the gas ejection unit onto the lower surface of the substrate while the lower surface and the gas ejection unit are in close proximity, so the central region of the lower surface is dried efficiently. This prevents liquid from adhering to the second holder. This allows the second holder to be kept clean.

[0026] (13) The substrate cleaning method may further include rotating the second holder about a vertical axis while not holding the substrate during cleaning of the central region of the lower surface. With this configuration, even if liquid containing contaminants scattered from the substrate adheres to the second holder, the rotation of the second holder causes the liquid to be shaken off from the second holder. This makes it possible to more reliably maintain the second holder clean.

[0027] (14) The cleaning tool and the gas jetting unit may be supported by a common support. In this case, the cleaning tool and the gas jetting unit are moved integrally according to the position of the substrate. This allows the underside of the substrate to be cleaned efficiently. Furthermore, since the gas jetting unit is provided to be movable up and down, even when the cleaning tool and the gas jetting unit are supported by a common support, the gas jetting unit can be brought closer to the substrate when drying the central region of the underside of the substrate than when cleaning the central region of the underside of the substrate. This allows the underside of the substrate to be dried efficiently. [Effects of the Invention]

[0028] According to the present invention, the substrate holder can be kept clean. [Brief explanation of the drawings]

[0029] [Figure 1] 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention; [Figure 2] FIG. 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus of FIG. [Figure 3] FIG. 2 is a block diagram showing the configuration of a control system of the substrate cleaning apparatus. [Figure 4] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 5] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 6] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 7] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 8] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 9] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 10] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 11] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 12] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 13] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 14] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 15] 2 is a schematic diagram for explaining the general operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 16] 4 is a flowchart showing a substrate cleaning process performed by the control device of FIG. 3. [Figure 17] 4 is a flowchart showing a substrate cleaning process performed by the control device of FIG. 3. DETAILED DESCRIPTION OF THE INVENTION

[0030] A substrate cleaning apparatus according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, the term "substrate" refers to a semiconductor substrate, a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. The substrate used in this embodiment has at least a partially circular outer periphery. For example, the outer periphery excluding a positioning notch has a circular shape.

[0031] (1) Configuration of the substrate processing equipment FIG. 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention. FIG. 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1 of FIG. 1. In the substrate cleaning apparatus 1 according to this embodiment, mutually orthogonal X, Y, and Z directions are defined to clarify the positional relationships. In FIG. 1 and certain figures following FIG. 2, the X, Y, and Z directions are indicated by appropriate arrows. The X and Y directions are orthogonal to each other in a horizontal plane, and the Z direction corresponds to the vertical direction.

[0032] 1, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a base device 30, a delivery device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an edge cleaning device 80, and an opening / closing device 90. These components are provided in a unit housing 2. In FIG. 2, the unit housing 2 is indicated by a dotted line.

[0033] The unit housing 2 has a rectangular bottom surface 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom surface 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall 2b. This opening is an loading / unloading opening 2x for the substrate W, and is used when loading and unloading the substrate W into and from the unit housing 2. In FIG. 2, the loading / unloading opening 2x is indicated by a thick dotted line. In the following description, the direction in the Y direction from the inside of the unit housing 2 through the loading / unloading opening 2x toward the outside of the unit housing 2 (the direction from the side wall 2c toward the side wall 2b) is referred to as the front, and the opposite direction (the direction from the side wall 2b toward the side wall 2c) is referred to as the rear.

[0034] An opening / closing device 90 is provided in the portion of the side wall 2b where the loading / unloading opening 2x is formed and in the area nearby. The opening / closing device 90 includes a shutter 91 configured to be able to open and close the loading / unloading opening 2x, and a shutter driver 92 that drives the shutter 91. In FIG. 2, the shutter 91 is indicated by a thick two-dot chain line. The shutter driver 92 drives the shutter 91 to open the loading / unloading opening 2x when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1. The shutter driver 92 also drives the shutter 91 to close the loading / unloading opening 2x when the substrate W is cleaned in the substrate cleaning apparatus 1.

[0035] A pedestal device 30 is provided in the center of the bottom surface portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails and is provided to extend in the Y direction from near the side wall portion 2b to near the side wall portion 2c in a plan view. The movable pedestal 32 is provided so as to be movable in the Y direction on the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction on the linear guide 31.

[0036] The lower holding device 20 and the lower surface cleaning device 50 are provided on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 includes a suction holding unit 21 and a suction holding drive unit 22. The suction holding unit 21 is a so-called spin chuck, and has a circular suction surface that can suction-hold the lower surface of the substrate W, and is configured to be rotatable around an axis extending in the vertical direction (axis in the Z direction). In the following description, when the substrate W is suction-held by the suction holding unit 21, the region of the lower surface of the substrate W that should be suctioned by the suction surface of the suction holding unit 21 is referred to as a lower surface central region. On the other hand, the region of the lower surface of the substrate W that surrounds the lower surface central region is referred to as a lower surface outer region.

[0037] The suction hold driving unit 22 includes a motor. The motor of the suction hold driving unit 22 is provided on the movable base 32 so that the rotation shaft protrudes upward. The suction hold unit 21 is attached to the upper end of the rotation shaft of the suction hold driving unit 22. A suction path is formed on the rotation shaft of the suction hold driving unit 22 to allow the suction hold unit 21 to suction and hold the substrate W. The suction path is connected to an air suction device (not shown). The suction hold driving unit 22 rotates the suction hold unit 21 around the rotation shaft.

[0038] A delivery device 40 is further provided on the movable base 32 near the lower holding device 20. The delivery device 40 includes a plurality of (three in this example) support pins 41, a pin connecting member 42, and a pin lifting / lowering drive unit 43. The pin connecting member 42 is formed so as to surround the suction holding unit 21 in a plan view and connects the plurality of support pins 41. The plurality of support pins 41 extend upward by a certain length from the pin connecting member 42 while being connected to one another by the pin connecting member 42. The pin lifting / lowering drive unit 43 raises and lowers the pin connecting member 42 above the movable base 32. As a result, the plurality of support pins 41 rise and lower relative to the suction holding unit 21.

[0039] The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas ejection unit 53, a lifting support unit 54, a moving support unit 55, a lower surface brush rotation drive unit 55a, a lower surface brush lifting drive unit 55b, a lower surface brush moving drive unit 55c, and a gas lifting drive unit 55d. The moving support unit 55 is provided so as to be movable in the Y direction relative to the lower holding device 20 within a certain area on the movable base 32. As shown in FIG. 2, the lifting support unit 54 is provided on the moving support unit 55 so as to be able to move up and down. The lifting support unit 54 has an upper surface 54u that slopes obliquely downward in a direction away from the suction holding unit 21 (rearward in this example).

[0040] 1, the lower surface brush 51 has a circular outer shape in a plan view, and is formed to be relatively large in this embodiment. Specifically, the diameter of the lower surface brush 51 is larger than the diameter of the suction surface of the suction holding unit 21, for example, 1.3 times the diameter of the suction surface of the suction holding unit 21. The diameter of the lower surface brush 51 is also larger than 1 / 3 and smaller than 1 / 2 of the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0041] The lower surface brush 51 has a cleaning surface that can come into contact with the lower surface of the substrate W. The lower surface brush 51 is attached to the upper surface 54u of the lifting support part 54 so that the cleaning surface faces upward and so that the cleaning surface can rotate around an axis that passes through the center of the cleaning surface and extends in the vertical direction.

[0042] Each of the two liquid nozzles 52 is attached to the upper surface 54u of the lifting support part 54 so as to be located near the lower surface brush 51 and so that the liquid discharge port faces upward. A lower surface cleaning liquid supply part 56 (FIG. 3) is connected to the liquid nozzle 52. The lower surface cleaning liquid supply part 56 supplies cleaning liquid to the liquid nozzle 52. When the substrate W is cleaned by the lower surface brush 51, the liquid nozzle 52 discharges the cleaning liquid supplied from the lower surface cleaning liquid supply part 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the liquid nozzle 52.

[0043] The gas ejection part 53 is a slit-shaped gas injection nozzle having a gas ejection port extending in one direction. The gas ejection part 53 is attached to the upper surface 54u of the lift support part 54 so that it is located between the lower surface brush 51 and the suction holding part 21 in a plan view and its gas ejection port faces upward. A jet gas supply part 57 (FIG. 3) is connected to the gas ejection part 53. The jet gas supply part 57 supplies gas to the gas ejection part 53.

[0044] In this embodiment, an inert gas such as nitrogen gas is used as the gas supplied to the gas outlet unit 53. The gas supplied to the gas outlet unit 53 may be another gas such as clean dry air (CDA). The gas outlet unit 53 injects gas supplied from the gas outlet supply unit 57 onto the lower surface of the substrate W when the lower surface brush 51 cleans the substrate W and when drying the lower surface of the substrate W, which will be described later. In this case, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holder 21.

[0045] The lower surface brush rotation drive unit 55a includes a motor, and rotates the lower surface brush 51 when the lower surface brush 51 cleans the substrate W. The lower surface brush lift drive unit 55b includes a stepping motor or an air cylinder, and lifts and lowers the lift support unit 54 relative to the moving support unit 55. The lower surface brush movement drive unit 55c includes a motor, and moves the moving support unit 55 in the Y direction on the movable base 32. Here, the position of the lower holding device 20 on the movable base 32 is fixed. Therefore, when the lower surface brush movement drive unit 55c moves the moving support unit 55 in the Y direction, the moving support unit 55 moves relative to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 when it is closest to the lower holding device 20 on the movable base 32 is referred to as the approach position, and the position of the lower surface cleaning device 50 when it is farthest from the lower holding device 20 on the movable base 32 is referred to as the separated position. Gas lifting drive unit 55d includes a stepping motor or an air cylinder, and moves gas ejection unit 53 up and down on lifting support unit .

[0046] A cup device 60 is further provided in the center of the bottom surface portion 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the pedestal device 30 in a plan view and is capable of being raised and lowered. In FIG. 2, the cup 61 is indicated by a dotted line. The cup drive unit 62 moves the cup 61 between a lower cup position and an upper cup position depending on which portion of the underside of the substrate W is to be cleaned by the lower surface brush 51. The lower cup position is a height position where the upper end of the cup 61 is below the substrate W that is sucked and held by the suction holding unit 21. The upper cup position is a height position where the upper end of the cup 61 is above the suction holding unit 21.

[0047] A pair of upper holding devices 10A, 10B are provided at a height position above the cup 61 so as to face each other across the pedestal device 30 in a plan view. The upper holding devices 10A, 10B have a reference position 10R. The upper holding devices 10A, 10B hold the substrate W so that the center of the substrate W is located at the reference position 10R. Specifically, the upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck driver 13A, and an upper chuck driver 14A. The upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck driver 13B, and an upper chuck driver 14B.

[0048] The lower chucks 11A and 11B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding unit 21 in a plan view, and are provided so as to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A and 11B has two support pieces capable of supporting the peripheral portion of the lower surface of the substrate W from below the substrate W. The lower chuck driving units 13A and 13B move the lower chucks 11A and 11B so that the lower chucks 11A and 11B approach each other or move away from each other.

[0049] Like the lower chucks 11A and 11B, the upper chucks 12A and 12B are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) through the center of the suction holding unit 21 in a plan view, and are provided so as to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B has two holding pieces configured to abut against two portions of the outer peripheral edge of the substrate W and to be able to hold the outer peripheral edge of the substrate W. The upper chuck driving units 14A and 14B move the upper chucks 12A and 12B so that the upper chucks 12A and 12B approach each other or move away from each other.

[0050] 1, an upper surface cleaning device 70 is provided on one side of the cup 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotary support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0051] The rotation support shaft 71 is supported on the bottom surface portion 2a by an upper surface cleaning drive unit 74 so as to extend in the vertical direction and to be movable up and down and rotatable. As shown in Fig. 2, the arm 72 is provided at a position above the upper holding device 10B and extends horizontally from the upper end of the rotation support shaft 71. A spray nozzle 73 is attached to the tip of the arm 72.

[0052] An upper surface cleaning fluid supply unit 75 (FIG. 3) is connected to the spray nozzle 73. The upper surface cleaning fluid supply unit 75 supplies a cleaning liquid and a gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and the gas supplied from the upper surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0053] The upper surface cleaning drive unit 74 includes one or more pulse motors, air cylinders, etc., and raises and lowers the rotary support shaft 71 and rotates the rotary support shaft 71. According to the above configuration, by moving the spray nozzle 73 in an arc over the upper surface of the substrate W that is suction-held and rotated by the suction holding unit 21, it is possible to clean the entire upper surface of the substrate W.

[0054] 1, an edge cleaning device 80 is provided on the other side of cup 61 so as to be located near upper holding device 10A in a plan view. Edge cleaning device 80 includes a rotary support shaft 81, an arm 82, a bevel brush 83, and a bevel brush driving unit 84.

[0055] The rotation support shaft 81 is supported by a bevel brush drive unit 84 on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable. As shown in Fig. 2, the arm 82 is provided at a position above the upper holding device 10A and extends horizontally from the upper end of the rotation support shaft 81. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and to be rotatable around an axis extending in the vertical direction.

[0056] The upper half of the bevel brush 83 has an inverted truncated cone shape, and the lower half has a truncated cone shape. With this bevel brush 83, the outer peripheral edge of the substrate W can be cleaned at the central portion in the vertical direction of the outer peripheral surface.

[0057] The bevel brush driving unit 84 includes one or more pulse motors, air cylinders, etc., and raises and lowers the rotary support shaft 81 and rotates the rotary support shaft 81. According to the above configuration, by bringing the central portion of the outer circumferential surface of the bevel brush 83 into contact with the outer circumferential edge of the substrate W that is being sucked and held by the sucking and holding unit 21 and rotated, the entire outer circumferential edge of the substrate W can be cleaned.

[0058] Here, the bevel brush driving unit 84 further includes a motor built into the arm 82. The motor rotates the bevel brush 83 provided at the tip of the arm 82 around an axis extending in the vertical direction. Therefore, when cleaning the outer circumferential edge of the substrate W, the rotation of the bevel brush 83 improves the cleaning power of the bevel brush 83 at the outer circumferential edge of the substrate W.

[0059] Figure 3 is a block diagram showing the configuration of a control system of substrate cleaning apparatus 1. Control device 9 in Figure 3 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and a storage device. The RAM is used as a working area for the CPU. The ROM stores a system program. The storage device stores a control program.

[0060] 3, the control device 9 includes, as functional units, a chuck control unit 9A, a suction control unit 9B, a base control unit 9C, a delivery control unit 9D, a lower surface cleaning control unit 9E, a cup control unit 9F, an upper surface cleaning control unit 9G, a bevel cleaning control unit 9H, and a carry-in / carry-out control unit 91. The functional units of the control device 9 are realized by a CPU executing, on a RAM, a substrate cleaning program stored in a storage device. Some or all of the functional units of the control device 9 may be realized by hardware such as electronic circuits.

[0061] The chuck control unit 9A receives the substrate W carried into the substrate cleaning apparatus 1 and controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B to hold the substrate W at a position above the suction holding unit 21. The suction control unit 9B controls the suction holding driving unit 22 to suction-hold the substrate W by the suction holding unit 21 and rotate the suction-held substrate W.

[0062] The pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 relative to the substrate W held by the upper holding devices 10A and 10B. The delivery control unit 9D controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the suction holder 21.

[0063] The lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lift drive unit 55b, the lower surface brush movement drive unit 55c, the gas lift drive unit 55d, the lower surface cleaning liquid supply unit 56, and the jet gas supply unit 57 in order to clean the lower surface of the substrate W. The cup control unit 9F controls the cup drive unit 62 in order to use a cup 61 to catch the cleaning liquid splashed from the substrate W when the substrate W sucked and held by the suction holding unit 21 is cleaned.

[0064] The upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W sucked and held by the suction holder 21. The bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer peripheral edge of the substrate W sucked and held by the suction holder 21. The loading / unloading control unit 9I controls the shutter drive unit 92 to open and close the loading / unloading opening 2x of the unit housing 2 when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1.

[0065] (2) Outline of operation of substrate cleaning equipment 4 to 15 are schematic diagrams illustrating the overall operation of the substrate cleaning apparatus 1 of FIG. 1. In each of FIGS. 4 to 15, a plan view of the substrate cleaning apparatus 1 is shown in the upper part. The middle part shows a side view of the lower holding device 20 and its surroundings as viewed along the Y direction, and the lower part shows a side view of the lower holding device 20 and its surroundings as viewed along the X direction. The side view in the middle part corresponds to the side view taken along line AA in FIG. 1, and the side view in the lower part corresponds to the side view taken along line BB in FIG. 1. To facilitate understanding of the shapes and operating states of each component of the substrate cleaning apparatus 1, the scale of some components is different between the plan view in the upper part and the side views in the middle and lower parts. In addition, in FIGS. 4 to 15, the cup 61 is indicated by a two-dot chain line, and the outline of the substrate W is indicated by a thick dashed line.

[0066] In the initial state before the substrate W is loaded into the substrate cleaning apparatus 1, the shutter 91 of the opening / closing device 90 closes the loading / unloading opening 2x. As shown in FIG. 1 , the lower chucks 11A and 11B are maintained in a state where the distance between them is sufficiently larger than the diameter of the substrate W. The upper chucks 12A and 12B are also maintained in a state where the distance between them is sufficiently larger than the diameter of the substrate W. The movable pedestal 32 of the pedestal device 30 is disposed so that the center of the suction holding part 21 is located at the center of the cup 61 in a plan view. The lower surface cleaning device 50 is disposed at a close position on the movable pedestal 32. The lifting support part 54 of the lower surface cleaning device 50 is disposed so that the cleaning surface (upper end) of the lower surface brush 51 is located below the suction holding part 21.

[0067] In addition, in the delivery device 40, the multiple support pins 41 are positioned below the suction holding unit 21. Furthermore, in the cup device 60, the cup 61 is in the lower cup position. In the following explanation, the center position of the cup 61 in a planar view is referred to as the planar reference position rp. In addition, the position of the movable base 32 on the bottom surface portion 2a when the center of the suction holding unit 21 is at the planar reference position rp in a planar view is referred to as the first horizontal position.

[0068] A substrate W is loaded into the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading / unloading opening 2x immediately before the substrate W is loaded. Thereafter, as indicated by the thick solid arrow a1 in Fig. 4, a hand (substrate holding part) RH of a substrate transport robot (not shown) loads the substrate W through the loading / unloading opening 2x into a position approximately in the center of the unit housing 2. At this time, the substrate W held by the hand RH is positioned between the lower chuck 11A and upper chuck 12A and the lower chuck 11B and upper chuck 12B, as shown in Fig. 4.

[0069] Next, as indicated by the thick solid arrow a2 in Fig. 5, the lower chucks 11A and 11B approach each other so that the support pieces of the lower chucks 11A and 11B are positioned below the peripheral portion of the lower surface of the substrate W. In this state, the hand RH descends and exits through the loading / unloading opening 2x. As a result, multiple portions of the peripheral portion of the lower surface of the substrate W held by the hand RH are supported by the support pieces of the lower chucks 11A and 11B. After the hand RH exits, the shutter 91 closes the loading / unloading opening 2x.

[0070] 6, the upper chucks 12A and 12B move closer to each other so that the holding pieces of the upper chucks 12A and 12B come into contact with the outer peripheral edge of the substrate W. As the holding pieces of the upper chucks 12A and 12B come into contact with multiple portions of the outer peripheral edge of the substrate W, the substrate W supported by the lower chucks 11A and 11B is further held by the upper chucks 12A and 12B.

[0071] 6, the suction holding unit 21 is displaced a predetermined distance from the planar reference position rp, and the movable base 32 moves forward from the first horizontal position so that the center of the lower brush 51 is positioned at the planar reference position rp. In this case, the lower brush 51 overlaps with the reference position 10R of the upper holding devices 10A and 10B in a plan view. At this time, the position of the movable base 32 positioned on the bottom portion 2a is referred to as the second horizontal position.

[0072] Next, as indicated by a thick solid arrow a5 in Fig. 7, the lifting support 54 rises so that the cleaning surface of the lower surface brush 51 comes into contact with the central region of the lower surface of the substrate W. Furthermore, as indicated by a thick solid arrow a6 in Fig. 7, the lower surface brush 51 rotates (spins) around the central axis 51c. As a result, contaminants adhering to the central region of the lower surface of the substrate W are physically peeled off by the lower surface brush 51.

[0073] The lower part of FIG. 7 shows an enlarged side view of the portion where the lower-surface brush 51 contacts the underside of the substrate W in a bubble. As shown in the bubble, with the lower-surface brush 51 in contact with the substrate W, the liquid nozzle 52 and the gas ejection unit 53 are held in positions close to the underside of the substrate W. At this time, the liquid nozzle 52 ejects cleaning liquid toward the underside of the substrate W at a position near the lower-surface brush 51, as indicated by the outline arrow a51. As a result, the cleaning liquid supplied from the liquid nozzle 52 to the underside of the substrate W is guided to the contact portion between the lower-surface brush 51 and the substrate W, and contaminants removed from the back surface of the substrate W by the lower-surface brush 51 are washed away by the cleaning liquid. In this way, in the lower-surface cleaning device 50, the liquid nozzle 52 and the lower-surface brush 51 are attached to the lifting support unit 54. This allows the cleaning liquid to be efficiently supplied to the portion of the underside of the substrate W cleaned by the lower-surface brush 51. This reduces the amount of cleaning liquid consumed and suppresses excessive splashing of the cleaning liquid.

[0074] Here, the upper surface 54u of the lifting support member 54 is inclined obliquely downward in a direction away from the suction holder 21. In this case, when the cleaning liquid containing contaminants falls from the lower surface of the substrate W onto the lifting support member 54, the cleaning liquid received by the upper surface 54u is guided in a direction away from the suction holder 21.

[0075] Furthermore, when the lower surface brush 51 cleans the central region of the lower surface of the substrate W, the height of the upper end of the gas blowing part 53 is a predetermined distance away from the substrate W. The height of the upper end of the gas blowing part 53 at this time is referred to as the first height. The gas blowing part 53 blows gas from the first height toward the lower surface of the substrate W at a position between the lower surface brush 51 and the suction holder 21, as shown by the outline arrow a52 in the blowing bubble in FIG.

[0076] In this embodiment, the gas ejection unit 53 is attached to the lifting support unit 54 so that its gas ejection port extends in the X direction. In this case, when gas is ejected from the gas ejection unit 53 onto the underside of the substrate W, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holder 21. This prevents the cleaning liquid containing contaminants from splashing toward the suction holder 21 when the lower surface of the substrate W is cleaned by the lower surface brush 51. Therefore, when the central region of the underside of the substrate W is cleaned by the lower surface brush 51, the cleaning liquid containing contaminants is prevented from adhering to the suction holder 21, and the suction surface of the suction holder 21 is kept clean.

[0077] 7, the gas jetting part 53 jets gas obliquely upward from the gas jetting part 53 toward the lower surface brush 51 as shown by the outline arrow a52, but the present invention is not limited to this. The gas jetting part 53 may jet gas from the gas jetting part 53 toward the lower surface of the substrate W along the Z direction.

[0078] 7, when the central region of the lower surface of the substrate W is cleaned by the lower surface brush 51, the suction holder 21 rotates without holding the substrate W. The rotation speed of the suction holder 21 at this time is, for example, 500 rpm or more. In this case, even if cleaning liquid containing scattered contaminants adheres to the suction holder 21 when the central region of the lower surface of the substrate W is cleaned, the cleaning liquid is shaken off from the suction holder 21. This keeps the suction surface of the suction holder 21 clean.

[0079] 7, when cleaning of the central region of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped, and the lifting support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is spaced a predetermined distance from the substrate W. In addition, the discharge of cleaning liquid from the liquid nozzle 52 onto the substrate W is stopped, and the rotation of the suction holder 21 is stopped. Meanwhile, the spray of gas from the gas blowout part 53 onto the substrate W continues, as shown in FIG.

[0080] At this time, as indicated by the thick solid arrow a54 in Figure 8, the gas blowing unit 53 is raised by the gas lifting drive unit 55d in Figure 3. As a result, the upper end of the gas blowing unit 53 is closer to the underside of the substrate W than when cleaning the central region of the underside of the substrate W. The upper end of the gas blowing unit 53 may be positioned higher than the cleaning surface of the lower surface brush 51. The height of the upper end of the gas blowing unit 53 at this time is referred to as the second height. In this case, the gas blowing unit 53 blows gas toward the substrate W from the second height, which is closer to the underside of the substrate W than the first height. In this case, the lower surface of the substrate W and the upper end of the gas blowing unit 53 are close to each other, so that the underside of the substrate W is efficiently dried.

[0081] 8, the movable base 32 moves backward so that the suction holder 21 is located at the planar reference position rp. That is, the movable base 32 moves from the second horizontal position to the first horizontal position. In this case, the suction holder 21 overlaps with the reference position 10R of the upper holding devices 10A, 10B in plan view. At this time, gas continues to be sprayed from the gas outlet 53 onto the substrate W, so that the central region of the underside of the substrate W is gradually dried by the gas curtain.

[0082] Next, as shown by a thick solid arrow a8 in Fig. 9, the lifting support part 54 descends so that the cleaning surface of the lower surface brush 51 is positioned below the suction surface (upper end) of the suction holding part 21. Furthermore, as shown by a thick solid arrow a9 in Fig. 9, the upper chucks 12A and 12B move away from each other so that the holding pieces of the upper chucks 12A and 12B move away from the outer circumferential edge of the substrate W. At this time, the substrate W is supported by the lower chucks 11A and 11B.

[0083] 9, the pin connecting member 42 is raised so that the upper ends of the plurality of support pins 41 are positioned slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the plurality of support pins 41.

[0084] Next, the lower chucks 11A and 11B move away from each other as indicated by the thick solid arrow a11 in Fig. 10. At this time, the lower chucks 11A and 11B move to positions where they do not overlap the substrate W supported by the multiple support pins 41 in a plan view. As a result, both the upper holding devices 10A and 10B return to their initial states.

[0085] 11, the pin connecting member 42 is lowered so that the upper ends of the plurality of support pins 41 are positioned below the suction holder 21. As a result, the substrate W supported on the plurality of support pins 41 is received by the suction holder 21. In this state, the suction holder 21 suction-holds the central region of the underside of the substrate W. Simultaneously with the descent of the pin connecting member 42 or after the descent of the pin connecting member 42 is completed, the cup 61 is raised from the lower cup position to the upper cup position as shown by the thick solid arrow a13 in FIG.

[0086] 12, the suction holding part 21 rotates around the vertical axis (the axis of the rotation axis of the suction holding drive part 22), thereby rotating the substrate W suction-held by the suction holding part 21 in a horizontal position.

[0087] Next, the rotary support shaft 71 of the upper surface cleaning device 70 rotates and descends. As a result, the spray nozzle 73 moves to a position above the substrate W, as shown by a thick solid arrow a15 in FIG. 12, and descends so that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of a cleaning liquid and a gas onto the upper surface of the substrate W. The rotary support shaft 71 also rotates. As a result, the spray nozzle 73 moves to a position above the rotating substrate W, as shown by a thick solid arrow a16 in FIG. The mixed fluid is sprayed onto the entire upper surface of the substrate W, thereby cleaning the entire upper surface of the substrate W.

[0088] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotary support shaft 81 of the edge cleaning device 80 also rotates and descends. As a result, the bevel brush 83 moves to a position above the outer circumferential edge of the substrate W, as indicated by the thick solid arrow a17 in FIG. 12 . The central portion of the outer circumferential surface of the bevel brush 83 descends so as to come into contact with the outer circumferential edge of the substrate W. In this state, the bevel brush 83 rotates (spins) around its vertical axis. As a result, contaminants adhering to the outer circumferential edge of the substrate W are physically peeled off by the bevel brush 83. The contaminants peeled off from the outer circumferential edge of the substrate W are washed away by the cleaning liquid of the mixed fluid sprayed onto the substrate W from the spray nozzle 73.

[0089] Furthermore, when the upper surface of the substrate W is cleaned by the spray nozzle 73, the lifting support part 54 is raised so that the cleaning surface of the lower surface brush 51 comes into contact with the outer region of the lower surface of the substrate W. Also, as shown by the thick solid arrow a18 in Fig. 12, the lower surface brush 51 rotates (spins) around the central axis 51c. Furthermore, the liquid nozzle 52 ejects cleaning liquid toward the lower surface of the substrate W, and the gas ejection part 53 sprays gas toward the lower surface of the substrate W. This allows the lower surface brush 51 to clean the entire outer region of the lower surface of the substrate W that is being sucked and held by the suction holding part 21 and rotated.

[0090] If the lower surface brush 51 is not relatively large, the moving support part 55 may be moved back and forth between the close position and the separated position on the movable base 32, as shown by the thick solid arrow a19 in Fig. 12. Even in this case, the lower surface brush 51 can clean the entire outer region of the lower surface of the substrate W that is rotated while being sucked and held by the sucking and holding part 21.

[0091] Next, when cleaning of the upper surface, outer peripheral edge, and outer region of the lower surface of the substrate W is completed, spraying of the mixed fluid from the spray nozzle 73 onto the substrate W is stopped. Furthermore, as indicated by a thick solid arrow a20 in FIG. 13, the spray nozzle 73 moves to a position on one side of the cup 61 (initial state position). Furthermore, as indicated by a thick solid arrow a21 in FIG. 13, the bevel brush 83 moves to a position on the other side of the cup 61 (initial state position). Furthermore, rotation of the lower surface brush 51 is stopped, and the lifting support member 54 is lowered so that the cleaning surface of the lower surface brush 51 is spaced a predetermined distance from the substrate W. Furthermore, discharge of the cleaning liquid from the liquid nozzle 52 onto the substrate W and spraying of the gas from the gas ejection member 53 onto the substrate W are stopped. In this state, the suction holder 21 rotates at high speed, thereby shaking off the cleaning liquid adhering to the substrate W and drying the entire substrate W.

[0092] Next, the cup 61 descends from the upper cup position to the lower cup position as shown by a thick solid arrow a22 in Fig. 14. Furthermore, in preparation for a new substrate W being carried into the unit housing 2, the lower chucks 11A and 11B approach each other to positions where they can support the new substrate W as shown by a thick solid arrow a23 in Fig. 14.

[0093] Finally, the substrate W is unloaded from the unit housing 2 of the substrate cleaning apparatus 1. Specifically, the shutter 91 opens the loading / unloading opening 2x just before the substrate W is unloaded. Thereafter, as indicated by the thick solid arrow a24 in FIG. 15, a hand (substrate holder) RH of a substrate transport robot (not shown) enters the unit housing 2 through the loading / unloading opening 2x. Next, the hand RH receives the substrate W on the suction holder 21 and exits through the loading / unloading opening 2x. After the hand RH exits, the shutter 91 closes the loading / unloading opening 2x.

[0094] (3) Substrate cleaning process Figures 16 and 17 are flowcharts showing the substrate cleaning process performed by the control device 9 of Figure 3. The substrate cleaning process of Figures 16 and 17 is performed by the CPU of the control device 9 executing a substrate cleaning program stored in the storage device on the RAM. Below, the substrate cleaning process will be described using the control device 9 of Figure 3 and the substrate cleaning apparatus 1 of Figures 4 to 15 along with the flowcharts of Figures 16 and 17.

[0095] First, the loading / unloading control unit 9I controls the shutter driving unit 92 to load the substrate W into the unit housing 2 (FIGS. 4 and 5 and step S1). Next, the chuck control unit 9A controls the lower chuck driving units 13A and 13B and the upper chuck driving units 14A and 14B to hold the substrate W by the upper holding devices 10A and 10B (FIGS. 5 and 6 and step S2).

[0096] Next, the pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 from the first horizontal position to the second horizontal position (FIG. 6 and step S3). Thereafter, the suction control unit 9B controls the suction hold drive unit 22 to rotate the suction hold unit 21 around the axis of the rotation shaft of the suction hold drive unit 22 in a state where the suction hold unit 21 is not holding the substrate W. Ru( 7 and step S4).

[0097] Further, the lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56, and the jet gas supply unit 57 to clean the entire central region of the lower surface of the substrate W (FIG. 7 and step S5). At this time, the upper end of the gas jet unit 53 is at the first height.

[0098] Next, the lower surface cleaning control unit 9E controls the gas lifting drive unit 55d to raise the gas blowing unit 53 (FIG. 8 and step S6). In this case, the upper end of the gas blowing unit 53 is at the second height. The lower surface cleaning control unit 9E also controls the blown gas supply unit 57 to dry the substrate W (FIG. 8 and step S7). Furthermore, the pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 from the second horizontal position to the first horizontal position (FIG. 8 and step S8). In this example, steps S7 and S8 are executed substantially simultaneously. As a result, the central region of the lower surface of the substrate W is sequentially dried.

[0099] Subsequently, the chuck control unit 9A controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B, and the delivery control unit 9D controls the pin lifting and lowering driving unit 43, thereby transferring the substrate W from the upper holding devices 10A, 10B to the lower holding device 20 (FIGS. 8 to 11 and step S9). In this state, the suction control unit 9B controls the suction hold driving unit 22 to suction the central region of the lower surface of the substrate W, thereby holding the substrate W by the lower holding device 20 (FIG. 11 and step S10).

[0100] Thereafter, the upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the entire upper surface of the substrate W (FIG. 12 and step S11). In addition, the bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer peripheral edge of the substrate W (FIG. 12 and step S12). Furthermore, the lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lift-down drive unit 55b, the lower surface brush movement drive unit 55c, the lower surface cleaning liquid supply unit 56, and the jet gas supply unit 57 to clean the entire outer region of the lower surface of the substrate W (FIG. 12 and step S13).

[0101] Steps S11 to S13 are executed substantially simultaneously. When steps S11 to S13 are executed, the suction control unit 9B controls the suction hold drive unit 22 to rotate the substrate W around the axis of the rotation shaft of the suction hold drive unit 22. In addition, the cup control unit 9F controls the cup drive unit 62 to raise the cup 61 from the lower cup position to the upper cup position.

[0102] After cleaning is completed, the suction control unit 9B controls the suction holding drive unit 22 to rotate the suction holding unit 21 at high speed, thereby drying the entire substrate W (FIG. 13 and step S14). After drying, the upper holding devices 10A, 10B and the cup 61 are returned to their initial states (FIG. 14). Finally, the loading / unloading control unit 9I controls the shutter drive unit 92 to unload the substrate W from the unit housing 2 (FIG. 15 and step S15), thereby completing the substrate cleaning process.

[0103] (4) Effects In substrate cleaning apparatus 1 according to the present embodiment, when cleaning the central region of the underside of substrate W, upper holding devices 10A, 10B hold substrate W so that the center of substrate W is located at reference position 10R. In this state, lower surface brush 51 is brought into contact with the central region of the underside of substrate W. At this time, suction holder 21 is rotated around the vertical axis without holding substrate W. In addition, gas is ejected toward substrate W from a first height spaced a predetermined distance from substrate W by gas ejection unit 53 disposed between lower surface brush 51 and suction holder 21.

[0104] When drying the central region of the underside of the substrate W, gas is ejected by the gas ejection unit 53 toward the substrate W from a second height that is closer to the substrate W than the first height. When cleaning the outer region of the underside of the substrate W, the central region of the underside of the substrate W is held by the suction holding unit 21, and the substrate W is rotated about a vertical axis, while the lower surface brush 51 is brought into contact with the outer region of the underside of the substrate W. By moving the movable base 32 to the first horizontal position, the substrate W can be easily transferred between the upper holding devices 10A, 10B and the suction holding unit 21.

[0105] According to this configuration, when cleaning the central region of the lower surface, the movable base 32 moves to the second horizontal position, thereby retracting the suction holder 21 to a position where it does not overlap with the substrate W. In addition, the gas outlet 53 forms a gas curtain between the lower surface brush 51 and the suction holder 21. In this case, cleaning liquid containing contaminants is prevented from scattering from the substrate W toward the suction holder 21. In addition, when drying the central region of the lower surface, gas is ejected from the gas outlet 53 onto the underside of the substrate W while the underside of the substrate W and the gas outlet 53 are in close proximity, so that the central region of the lower surface is dried efficiently. This prevents the cleaning liquid from adhering to the suction holder 21.

[0106] Even if cleaning liquid containing contaminants scattered from the substrate W adheres to the suction holder 21, the rotation of the suction holder 21 causes the cleaning liquid to be shaken off from the suction holder 21. This makes it possible to maintain the suction holder 21 clean. Here, if the rotation speed of the suction holder 21 is 500 rpm or higher, the cleaning liquid adhering to the suction holder 21 can be shaken off in a short time.

[0107] The lower surface brush 51 and the gas blowing part 53 are supported by a common lifting support part 54. In this case, the lower surface brush 51 and the gas blowing part 53 are moved integrally according to the position of the substrate W. This allows the underside of the substrate W to be cleaned efficiently. Furthermore, because the gas blowing part 53 is provided so as to be movable up and down, even when the lower surface brush 51 and the gas blowing part 53 are supported by a common lifting support part 54, the gas blowing part 53 can be brought closer to the substrate W when drying the central region of the underside of the substrate W than when cleaning the central region of the underside of the substrate W. This allows the underside of the substrate W to be dried efficiently.

[0108] (5) Other embodiments (a) In the above embodiment, the suction holding unit 21 rotates without holding the substrate W when cleaning the central region of the underside of the substrate W. Also, gas is ejected toward the substrate W by the gas ejection unit 53 from different heights when cleaning the central region of the underside of the substrate W and when drying it. However, the embodiment is not limited to this. If either of the above two operations is performed, the other does not have to be performed.

[0109] Specifically, when the suction holder 21 is rotated without holding the substrate W when cleaning the central region of the lower surface, the gas ejection unit 53 does not need to be raised and lowered when cleaning the central region of the lower surface and when drying. Alternatively, the substrate cleaning apparatus 1 does not need to include the gas ejection unit 53. On the other hand, when the gas ejection unit 53 is raised and lowered when cleaning the central region of the lower surface and when drying, the suction holder 21 does not need to be rotated when cleaning the central region of the lower surface and when not holding the substrate W.

[0110] (b) In the above embodiment, the lower surface brush 51 may be cleaned using a brush or spray (not shown). The spray may be a two-fluid spray that supplies both liquid and gas. Also, gas may be ejected from the gas ejection unit 53 while the lower surface brush 51 is being cleaned. In this case, liquid containing contaminants is prevented from scattering from the lower surface brush 51 toward the suction and holding unit 21.

[0111] Alternatively, the suction holder 21 may be rotated without holding the substrate W, even while the lower surface brush 51 is being cleaned. In this case, even if liquid containing contaminants scattered from the lower surface brush 51 adheres to the suction holder 21, the rotation of the suction holder 21 causes the liquid to be shaken off from the suction holder 21. As a result, the suction holder 21 can be kept clean.

[0112] (c) In the above embodiment, after the central region of the underside of the substrate W is cleaned in the upper holding devices 10A, 10B, the outer region of the underside of the substrate W is cleaned in the lower holding device 20, but the embodiment is not limited to this. After the outer region of the underside of the substrate W is cleaned in the lower holding device 20, the central region of the underside of the substrate W may be cleaned in the upper holding devices 10A, 10B.

[0113] (d) In the above embodiment, the lower surface brush 51 and the gas blowing unit 53 are supported by a common lifting support unit 54, but the embodiment is not limited to this. The lower surface brush 51 and the gas blowing unit 53 may be supported by separate supports. Furthermore, the suction holding unit 21, the lower surface brush 51, and the gas blowing unit 53 are provided on the movable base 32, but the embodiment is not limited to this. The suction holding unit 21, the lower surface brush 51, and the gas blowing unit 53 do not have to be provided on the movable base 32.

[0114] (e) In the above embodiment, the movable base 32 moves linearly within a horizontal plane, but the embodiment is not limited to this. The movable base 32 may move in a curved line within a horizontal plane.

[0115] (f) In the above embodiment, the substrate cleaning apparatus 1 includes the transfer device 40 for transferring the substrate W between the upper holding devices 10A, 10B and the lower holding device 20, but the embodiment is not limited to this. If the upper holding devices 10A, 10B and the lower holding device 20 are configured to be able to directly transfer the substrate W between them, the substrate cleaning apparatus 1 does not need to include the transfer device 40.

[0116] (g) In the above embodiment, the upper surface and outer peripheral edge of the substrate W are cleaned, but the embodiment is not limited to this. The upper surface of the substrate W does not have to be cleaned. In this case, the substrate cleaning apparatus 1 does not include the upper surface cleaning apparatus 70. Similarly, the outer peripheral edge of the substrate W does not have to be cleaned. In this case, the substrate cleaning apparatus 1 does not include the edge cleaning apparatus 80.

[0117] (h) In the above embodiment, substrate cleaning apparatus 1 includes control device 9, but the embodiment is not limited to this. If substrate cleaning apparatus 1 is configured to be controllable by an external information processing device, substrate cleaning apparatus 1 does not need to include control device 9.

[0118] (6) Correspondence between each component of the claims and each part of the embodiment Below, examples of correspondence between each element of the claims and each element of the embodiments will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each element of the claims.

[0119] In the above embodiment, reference position 10R is an example of a reference position, substrate W is an example of a substrate, upper holding devices 10A and 10B and suction holding unit 21 are examples of first and second holding units, respectively, and lower surface brush 51 is an example of a cleaning tool. Movable base 32 is an example of a movable base, substrate cleaning device 1 is an example of a substrate cleaning device, linear guide 31 is an example of a linear guide, gas ejection unit 53 is an example of a gas ejection unit, and lifting support unit 54 is an example of a support unit. (6) Reference form (6-1) A substrate cleaning apparatus according to a first reference embodiment includes a first holding unit having a reference position and holding a substrate so that the center of the substrate is located at the reference position; a second holding unit configured to be rotatable around a vertical axis and holding a central region of the underside of the substrate; a cleaning tool that contacts the central region of the underside of the substrate held by the first holding unit to clean the central region of the underside, and contacts an outer region of the underside surrounding the central region of the underside of the substrate rotated by the second holding unit to clean the outer region of the underside; and a movable base on which the second holding unit and cleaning tool are provided, and which moves in a horizontal plane so that when the substrate is transferred between the first holding unit and the second holding unit, the second holding unit overlaps the reference position of the first holding unit in a planar view, and when the central region of the underside is cleaned, the cleaning tool overlaps the reference position of the first holding unit in a planar view, and the second holding unit rotates without holding a substrate when the central region of the underside is cleaned. In the substrate cleaning apparatus according to this reference embodiment, when cleaning the central region of the underside of the substrate, the substrate is held by the first holder so that the center of the substrate is located at a reference position, and a cleaning tool is brought into contact with the central region of the underside of the substrate. The second holder rotates around a vertical axis without holding the substrate. When cleaning the outer region of the underside of the substrate, the substrate is held by the second holder at the central region of the underside and rotated around the vertical axis, and a cleaning tool is brought into contact with the outer region of the underside of the substrate. The second holder and the cleaning tool are provided on a movable base. When transferring the substrate between the first holder and the second holder, the movable base is moved in a horizontal plane so that the second holder overlaps the reference position of the first holder in a plan view. When cleaning the central region of the lower surface, the movable base is moved in a horizontal plane so that the cleaning tool overlaps the reference position of the first holder in a plan view. With this configuration, when cleaning the central region of the underside of the substrate, the second holder is retracted to a position where it does not overlap with the substrate. Also, even if liquid containing contaminants scattered from the substrate adheres to the second holder, the rotation of the second holder causes the liquid to be shaken off from the second holder. This allows the second holder to be kept clean. (6-2) The substrate cleaning apparatus may further include a gas ejection unit disposed between the cleaning tool and the second holder and ejecting gas toward the substrate. In this case, the gas ejected from the gas ejection unit can prevent liquid containing contaminants from scattering from the substrate toward the second holder when cleaning the central region of the lower surface. Furthermore, the gas ejected from the gas ejection unit can efficiently dry the central region of the lower surface. This prevents liquid from adhering to the second holder and keeps the second holder clean. (6-3) The substrate cleaning apparatus may further include a linear guide extending in one direction in a horizontal plane, and the movable base may move linearly along the linear guide. In this case, the movable base can be moved in the horizontal plane with a simple configuration. (6-4) The rotation speed of the second holder when cleaning the central region of the lower surface may be 500 rpm or higher. In this case, liquid adhering to the second holder is quickly shaken off from the second holder. This makes it possible to more efficiently maintain the second holder clean. (6-5) A substrate cleaning apparatus according to a second reference embodiment includes a first holding unit that holds a substrate, a second holding unit that holds a central region of the underside of the substrate and rotates the substrate around a vertical axis, a cleaning tool that comes into contact with the central region of the underside of the substrate held by the first holding unit to clean the central region of the underside, and that comes into contact with an outer region of the underside surrounding the central region of the underside of the substrate rotated by the second holding unit to clean the outer region of the underside, and a gas ejection unit that is arranged to be movable up and down between the cleaning tool and the second holding unit, and that ejects gas toward the substrate from a first height that is spaced a predetermined distance from the substrate when cleaning the central region of the underside, and that ejects gas toward the substrate from a second height that is closer to the substrate than the first height when drying the central region of the underside. In this substrate cleaning apparatus, when cleaning the central region of the underside of the substrate, a cleaning tool is brought into contact with the central region of the underside of the substrate while the substrate is held by a first holder. When cleaning the central region of the underside, a gas jetting unit disposed between the cleaning tool and the second holder jets gas toward the substrate from a first height spaced a predetermined distance from the substrate. When drying the central region of the underside, a gas jetting unit jets gas toward the substrate from a second height closer to the substrate than the first height. With this configuration, when cleaning the central region of the lower surface, the gas ejected from the gas ejection unit prevents liquid containing contaminants from scattering from the substrate toward the second holding unit. Furthermore, when drying the central region of the lower surface, the gas is ejected from the gas ejection unit onto the lower surface of the substrate while the lower surface and the gas ejection unit are in close proximity, allowing the central region of the lower surface to be dried efficiently. This prevents liquid from adhering to the second holding unit. This allows the second holding unit to be kept clean. (6-6) The second holder may rotate without holding a substrate when cleaning the central region of the lower surface. With this configuration, even if liquid containing contaminants scattered from the substrate adheres to the second holder, the rotation of the second holder causes the liquid to be shaken off from the second holder. This makes it possible to more reliably maintain the second holder clean. (6-7) The substrate cleaning apparatus may further include a common support part that supports the cleaning tool and the gas jetting part. In this case, the cleaning tool and the gas jetting part are moved integrally according to the position of the substrate. This allows the underside of the substrate to be cleaned efficiently. Furthermore, since the gas jetting part is provided to be movable up and down, even when the cleaning tool and the gas jetting part are supported by a common support part, the gas jetting part can be brought closer to the substrate when drying the central region of the underside of the substrate than when cleaning the central region of the underside of the substrate. This allows the underside of the substrate to be dried efficiently. (6-8) A substrate cleaning method according to a third embodiment includes, when cleaning a central region of the underside of the substrate, holding the substrate with a first holding part so that the center of the substrate is positioned at a reference position; when cleaning the central region of the underside of the substrate, rotating the second holding part around a vertical axis without holding the substrate; when cleaning the central region of the underside of the substrate, bringing a cleaning tool into contact with the central region of the underside of the substrate held by the first holding part; and when cleaning an outer region of the underside of the substrate surrounding the central region of the underside of the substrate, bringing the central region of the underside of the substrate into contact with the second holding part. The method includes rotating the substrate around a vertical axis while holding the substrate; bringing a cleaning tool into contact with the outer region of the underside of the substrate rotated by the second holding part when cleaning the outer region of the underside; and moving a movable base on which the second holding part and cleaning tool are mounted in a horizontal plane so that when the substrate is transferred between the first holding part and the second holding part, the second holding part overlaps with the reference position of the first holding part in a planar view, and when cleaning the central region of the underside, the cleaning tool overlaps with the reference position of the first holding part in a planar view. According to this substrate cleaning method, when cleaning the central region of the underside of the substrate, the second holder is retracted to a position where it does not overlap with the substrate. Furthermore, even if liquid containing contaminants scattered from the substrate adheres to the second holder, the rotation of the second holder causes the liquid to be shaken off from the second holder. This allows the second holder to be kept clean. (6-9) The substrate cleaning method may further include ejecting gas toward the substrate from a gas ejection unit disposed between the cleaning tool and the second holder. In this case, when cleaning the central region of the lower surface, the gas ejected from the gas ejection unit can prevent liquid containing contaminants from scattering from the substrate toward the second holder. Furthermore, the gas ejected from the gas ejection unit can efficiently dry the central region of the lower surface. This prevents liquid from adhering to the second holder, and keeps the second holder clean. (6-10) Moving the movable base in a horizontal plane may include moving the movable base linearly along a linear guide extending in one direction in the horizontal plane. In this case, the movable base can be moved in the horizontal plane with a simple configuration. (6-11) Rotating the second holder around the vertical axis without holding a substrate may include rotating the second holder at a rotational speed of 500 rpm or more. In this case, liquid adhering to the second holder is quickly shaken off from the second holder. This allows the second holder to be kept clean more efficiently. (6-12) A substrate cleaning method according to a fourth reference embodiment includes: holding the substrate with a first holding unit when cleaning the central region of the underside of the substrate; bringing a cleaning tool into contact with the central region of the underside of the substrate held by the first holding unit when cleaning the central region of the underside of the substrate; rotating the substrate around a vertical axis while holding the central region of the underside of the substrate with a second holding unit when cleaning an outer region of the underside surrounding the central region of the underside of the substrate; bringing a cleaning tool into contact with the outer region of the underside of the substrate rotated by the second holding unit when cleaning the outer region of the underside of the substrate; spraying gas toward the substrate from a first height spaced a predetermined distance from the substrate by a gas jetting unit arranged between the cleaning tool and the second holding unit when cleaning the central region of the underside of the substrate; and spraying gas toward the substrate from a second height closer to the substrate than the first height when drying the central region of the underside of the substrate. According to this substrate cleaning method, when cleaning the central region of the lower surface, the gas ejected from the gas ejection unit prevents liquid containing contaminants from scattering from the substrate toward the second holder. Furthermore, when drying the central region of the lower surface, the gas is ejected from the gas ejection unit onto the lower surface of the substrate while the lower surface and the gas ejection unit are in close proximity, so the central region of the lower surface is dried efficiently. This prevents liquid from adhering to the second holder. This allows the second holder to be kept clean. (6-13) The substrate cleaning method may further include rotating the second holder about a vertical axis while not holding the substrate when cleaning the central region of the lower surface. With this configuration, even if liquid containing contaminants scattered from the substrate adheres to the second holder, the rotation of the second holder causes the liquid to be shaken off from the second holder. This makes it possible to more reliably maintain the second holder clean. (6-14) The cleaning tool and the gas jetting unit may be supported by a common support. In this case, the cleaning tool and the gas jetting unit are moved integrally according to the position of the substrate. This allows the underside of the substrate to be cleaned efficiently. Furthermore, since the gas jetting unit is provided to be movable up and down, even when the cleaning tool and the gas jetting unit are supported by a common support, the gas jetting unit can be brought closer to the substrate when drying the central region of the underside of the substrate than when cleaning the central region of the underside of the substrate. This allows the underside of the substrate to be dried efficiently. [Explanation of symbols]

[0120] 1...substrate cleaning device, 2...unit housing, 2a...bottom surface portion, 2b to 2e...side wall portion, 9...control device, 9A...chuck control unit, 9B...suction control unit, 9C...pedestal control unit, 9D...delivery control unit, 9E...lower surface cleaning control unit, 9F...cup control unit, 9G...upper surface cleaning control unit, 9H...bevel cleaning control unit, 9I...loading and unloading control unit, 10A, 10B...upper holding device, 10R...reference position 11A, 11B... lower chuck, 12A, 12B... upper chuck, 13A, 13A... lower chuck drive unit, 14A, 14B... upper chuck drive unit, 20... lower holding device, 21... suction holding unit, 22... suction holding drive unit, 30... base device, 31... linear guide, 32... movable base, 33... base drive unit, 40... transfer device, 41... support pin, 42... pin connecting member, 43... pin lifting / lowering Drive unit, 50... lower surface cleaning device, 51... lower surface brush, 52... liquid nozzle, 53... gas ejection unit, 54... lifting support unit, 54u... upper surface, 55... movement support unit, 55a... lower surface brush rotation drive unit, 55b... lower surface brush lifting drive unit, 55c... lower surface brush movement drive unit, 55d... gas lifting drive unit, 56... lower surface cleaning liquid supply unit, 57... ejected gas supply unit, 60... cup device, 61... cup p, 62...cup drive unit, 70...upper surface cleaning device, 71, 81...rotating support shaft, 72, 82...arm, 73...spray nozzle, 74...upper surface cleaning drive unit, 75...upper surface cleaning fluid supply unit, 80...edge cleaning device, 83...bevel brush, 84...bevel brush drive unit, 90...opening / closing device, 91...shutter, 92...shutter drive unit, RH...hand, rp...plane reference position, W...substrate

Claims

1. a first holder having a reference position and configured to hold the substrate so that the center of the substrate is positioned at the reference position; a second holding portion configured to be rotatable around a vertical axis and to hold a central region of a lower surface of the substrate; a cleaning tool that cleans the lower surface central region by contacting the lower surface central region of the substrate held by the first holding part, and cleans the lower surface outer region by contacting the lower surface outer region surrounding the lower surface central region of the substrate rotated by the second holding part; a movable base that is provided with the second holding part and the cleaning tool, and that moves within a horizontal plane so that, when the substrate is transferred between the first holding part and the second holding part, the second holding part overlaps the reference position of the first holding part in a plan view, and when the central region of the lower surface is cleaned, the cleaning tool overlaps the reference position of the first holding part in a plan view, the second holding portion and the cleaning tool move together with the movable base in a horizontal plane; The substrate cleaning apparatus, wherein the second holder rotates without holding the substrate when cleaning the central region of the lower surface.

2. The substrate cleaning apparatus according to claim 1 , further comprising a gas ejection unit disposed between the cleaning tool and the second holder and configured to eject gas toward the substrate.

3. Further provided is a linear guide extending in one direction within the horizontal plane, 3. The substrate cleaning apparatus according to claim 1, wherein the movable base moves linearly along the linear guide.

4. 4. The substrate cleaning apparatus according to claim 1, wherein the rotation speed of the second holder during cleaning of the central region of the lower surface is 500 rpm or more.

5. A first holding part having a reference position and holding the substrate so that the center of the substrate is located at the reference position; a second holding unit that holds a central region of a lower surface of the substrate and rotates the substrate around a vertical axis; a cleaning tool that cleans the lower surface central region by contacting the lower surface central region of the substrate held by the first holding part, and cleans the lower surface outer region by contacting the lower surface outer region surrounding the lower surface central region of the substrate rotated by the second holding part; a gas ejection unit that is arranged between the cleaning tool and the second holding unit so as to be movable up and down, and that ejects gas toward the substrate from a first height that is spaced a predetermined distance from the substrate when cleaning the central region of the lower surface, and that ejects gas toward the substrate from a second height that is closer to the substrate than the first height when drying the central region of the lower surface; a movable base that is provided with the second holding part and the cleaning tool, and that moves within a horizontal plane so that, when the substrate is transferred between the first holding part and the second holding part, the second holding part overlaps the reference position of the first holding part in a plan view, and when the central region of the lower surface is cleaned, the cleaning tool overlaps the reference position of the first holding part in a plan view, The substrate cleaning apparatus, wherein the second holder and the cleaning tool move integrally with the movable base in a horizontal plane.

6. The substrate cleaning apparatus according to claim 5 , wherein the second holder rotates without holding the substrate when cleaning the central region of the lower surface.

7. The substrate cleaning apparatus according to claim 5 , further comprising a common support part for supporting the cleaning tool and the gas ejection part.

8. holding the substrate by a first holding part so that the center of the substrate is positioned at a reference position when cleaning the central region of the lower surface of the substrate; rotating the second holder around a vertical axis without holding the substrate when cleaning the central region of the lower surface; bringing a cleaning tool into contact with the central region of the lower surface of the substrate held by the first holding part when cleaning the central region of the lower surface; rotating the substrate around a vertical axis while holding the lower surface central region of the substrate with the second holding part when cleaning the lower surface outer region surrounding the lower surface central region of the substrate; When cleaning the outer lower surface region, bringing the cleaning tool into contact with the outer lower surface region of the substrate rotated by the second holding part; moving a movable base on which the second holding part and the cleaning tool are provided within a horizontal plane so that, when the substrate is transferred between the first holding part and the second holding part, the second holding part overlaps the reference position of the first holding part in a plan view, and when the central region of the lower surface is cleaned, the cleaning tool overlaps the reference position of the first holding part in a plan view, A substrate cleaning method, wherein moving the movable base within a horizontal plane includes moving the second holder and the cleaning tool together with the movable base within a horizontal plane.

9. The substrate cleaning method according to claim 8 , further comprising: ejecting gas toward the substrate from a gas ejection part disposed between the cleaning tool and the second holder.

10. 10. The substrate cleaning method according to claim 8, wherein moving the movable base in a horizontal plane includes moving the movable base linearly along a linear guide extending in one direction in the horizontal plane.

11. 11. The substrate cleaning method according to claim 8, wherein rotating the second holder around a vertical axis in a state where the second holder does not hold the substrate comprises rotating the second holder at a rotational speed of 500 rpm or more.

12. holding the substrate by a first holding part so that the center of the substrate is positioned at a reference position when cleaning the central region of the lower surface of the substrate; bringing a cleaning tool into contact with the central region of the lower surface of the substrate held by the first holding part when cleaning the central region of the lower surface; rotating the substrate around a vertical axis while holding the lower surface central region of the substrate with a second holding part when cleaning the lower surface outer region surrounding the lower surface central region of the substrate; When cleaning the outer lower surface region, bringing the cleaning tool into contact with the outer lower surface region of the substrate rotated by the second holding part; when cleaning the central region of the lower surface, a gas ejection unit disposed between the cleaning tool and the second holding unit ejects gas toward the substrate from a first height spaced a predetermined distance from the substrate, and when drying the central region of the lower surface, a gas ejection unit ejects gas toward the substrate from a second height closer to the substrate than the first height; moving a movable base on which the second holding part and the cleaning tool are provided within a horizontal plane so that, when the substrate is transferred between the first holding part and the second holding part, the second holding part overlaps the reference position of the first holding part in a plan view, and when the central region of the lower surface is cleaned, the cleaning tool overlaps the reference position of the first holding part in a plan view, A substrate cleaning method, wherein moving the movable base within a horizontal plane includes moving the second holder and the cleaning tool together with the movable base within a horizontal plane.

13. The substrate cleaning method according to claim 12 , further comprising: rotating the second holder about a vertical axis in a state where the second holder does not hold the substrate when cleaning the central region of the lower surface.

14. 14. The substrate cleaning method according to claim 12, wherein the cleaning tool and the gas ejection part are supported by a common support part.

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