Component inspection method, inspection device, and component mounting device

Abstract

To more accurately determine the quality of the flatness (coplanarity) of leads (terminals).SOLUTION: A method for inspecting the flatness of junctions 52a of a plurality of leads 52 included in a component 50 includes: a step of detecting three-dimensional coordinates of the junctions 52a of the leads 52; a step of setting a reference plane 50L formed of the least square plane based on data of the three-dimensional coordinates; and a flatness quality determination step of determining the quality of the flatness based on the reference plane 50L. The flatness quality determination step ultimately determines the quality of the flatness (S27, S29) by using both a first mode for determining the quality of the flatness based on a difference in height between the reference plane 50L and the junctions of the leads 52 (S11-S13), and a second mode for determining the quality of the flatness based on a difference in height between positions corresponding to two leads 52 on the reference plane 50L, the leads 52 being separated from each other (S15-S25).SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to an inspection method and an inspection device for components such as package components having a plurality of leads (terminals), and a component mounting device equipped with this inspection device. [Background technology]

[0002] Component mounting devices are known that mount (mount) electronic components and other components on substrates such as printed wiring boards. Electronic components include packaged components with many leads, such as small outline packages (SOPs) and quad flat packages (QFPs). In these types of packaged components (hereinafter simply referred to as components), variations in the height of the joints (the tips of the leads that are joined to the substrate) can lead to poor contact between the substrate and the leads, ultimately resulting in the production of defective substrates. Therefore, component mounting devices inspect the coplanarity of the component joints before mounting the components on the substrate, and only components with satisfactory coplanarity are mounted on the substrate.

[0003] Patent Document 1 discloses a component mounting apparatus equipped with a device for inspecting the flatness of component joints (hereinafter, sometimes simply referred to as flatness). In this component mounting apparatus, a component held by suction on a component conveyance head is imaged by a camera before being mounted on a board, and the flatness is determined based on the image. Specifically, the three-dimensional coordinates of multiple marks affixed to the underside of the component body (package) are detected. A least-squares plane is found from these three-dimensional coordinates and set as the reference plane. In other words, the underside of the component body (package) is set as the reference plane. Then, the three-dimensional coordinates of the joints of each lead are further detected, and the flatness is determined based on the difference in height of the joints relative to the reference plane. More specifically, the difference between the maximum and minimum heights of the joints from the reference plane is found, and the difference is compared with a threshold to determine the flatness. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-98404 Summary of the Invention [Problem to be solved by the invention]

[0005] The component mounting device of Patent Document 1 requires multiple marks on the underside of the component body as a prerequisite for flatness inspection, and it is difficult to inspect the flatness of components that do not have marks.

[0006] Therefore, for components that do not have marks, a least-squares plane is calculated based on the three-dimensional coordinates of the joints of each lead (i.e., the least-squares plane of the joints is calculated), and this least-squares plane is used as the reference plane to calculate the difference between the maximum and minimum values, thereby determining whether the flatness is good or bad.

[0007] However, when the least-squares plane of the joint is used as the reference plane, the following problem arises. That is, when only some of the lead joints are lifted, the difference in height between the lifted joints and the reference plane becomes significant. Therefore, in this case, it is possible to relatively accurately determine that the flatness is poor. On the other hand, when the leads are deformed such that the heights of multiple leads (joints) on both sides of the SOP change linearly from one end to the other in the lead arrangement direction, or when the heights of all leads (joints) on one side of the SOP are lifted by a certain amount relative to the leads on the other side, it is possible that the flatness will be determined to be good even if it is poor. This is because when the least-squares plane of the joint is used as the reference plane, the reference plane is tilted along the joints, so that no difference in height occurs between the joints and the reference plane, or even if a difference in height occurs, the difference in height is generally small.

[0008] The present invention has been made in consideration of the above circumstances, and aims to provide a technology that enables more accurate determination of the flatness of joints of components such as package components that have multiple leads (terminals). [Means for solving the problem]

[0009] In order to solve the above-mentioned problems, a component inspection method according to one aspect of the present invention is a method for inspecting flatness of a joint of a component having a plurality of terminals, each having a joint to be joined to a board, the method including: a position detection step of detecting the position of the joint of each of the plurality of terminals; a reference plane setting step of finding a least-squares plane of the joint from position data detected in the position detection step and setting this least-squares plane as a reference plane; and a flatness pass / fail judging step of finally judging the pass / fail of the flatness by using a first mode of judging the pass / fail of the flatness based on a difference in elevation between the reference plane and the joint of each terminal, and a second mode of judging the pass / fail of the flatness based on a difference in elevation between the joint of two predetermined terminals spaced apart from each other. and using, as the height difference of the joint portions of the two terminals spaced apart from each other in the second mode, the height difference of positions on the reference plane corresponding to the two terminals. In the above description, "combined use" means that both the first mode and the second mode are prepared so that they can be executed, and at least one of the first mode and the second mode is executed during the judgment process, and the final pass / fail judgment of flatness is made based on the result.

[0010] According to this inspection method, the first mode and the second mode are used together in the flatness determination step, which makes it possible to more accurately determine whether the flatness is good or bad. That is, the first mode is a mode in which the flatness is determined based on the difference in height between the joints and a reference plane (least-squares plane) obtained from the positions of the joints of each of the multiple terminals. Therefore, if there is floating in the joints of some of the terminals, it is possible to determine that the flatness is poor using this first mode, as in the conventional method.

[0011] On the other hand, the second mode is a mode in which the flatness is judged based on the difference in height between the joints of two terminals spaced apart from each other. For example, if terminal deformation occurs such that the height of multiple terminals (joints) changes linearly from one end to the other in the terminal arrangement direction, the difference in height between the joints of two terminals spaced apart from each other becomes significant. Therefore, the second mode, which judges the flatness based on a predetermined difference in height between the joints of two terminals spaced apart from each other, makes it possible to judge the flatness of a component with terminal deformation as described above, which is difficult to judge as defective in the first mode.

[0012] Therefore, according to the above inspection method using the first mode and the second mode in combination, it is possible to more accurately determine whether the flatness is good or bad.

[0014] Especially in the second mode Since the gradient of the reference plane is reflected in the height difference between the joints of the two terminals, it is possible to more reliably determine poor flatness when the terminals are deformed such that the height of the joint changes linearly from one end to the other in the terminal arrangement direction, or when the height of all terminals on one side are higher by a certain amount than the terminals on the other side.

[0015] In the flatness determination step, either the first mode or the second mode may be executed, and only when the flatness is determined to be good in the first mode, the other mode may be executed. This method makes it possible to efficiently determine the flatness while more accurately determining the flatness.

[0016] Furthermore, in the above inspection method, if the component is a package component having a component body that is rectangular in plan view and the plurality of terminals are arranged along opposing side surfaces of the component body, it is preferable that the second mode includes a first determination step of determining whether the flatness is good or bad based on the difference in height between the joints of two of the plurality of terminals that are spaced apart from each other in the terminal arrangement direction.

[0017] This method makes it possible to determine whether the flatness of a component is defective when the height of multiple terminals (joints) lined up on the side of the component body changes linearly from one end to the other in the terminal arrangement direction.

[0018] Furthermore, when the component is a package component as described above, it is preferable that the second mode includes a second judgment step of judging the quality of the flatness based on the difference in height between the joints of the two terminals arranged on opposite sides of the component body.

[0019] This method makes it possible to determine whether the flatness of a component is defective when the height of all terminals (joints) on one side of the component body is higher than the height of the terminals on the other side by a certain amount.

[0020] In the above-described inspection method, it is preferable that the flatness determining step determines that the flatness is good only when the flatness is determined to be good in both the first mode and the second mode. This method improves the reliability of the determination for a component whose flatness is determined to be good. Another component inspection method according to one aspect of the present invention is a method for inspecting the flatness of a component having a plurality of terminals, each having a bonding portion to be bonded to a substrate, the method including: a position detection step for detecting the position of the bonding portion of each of the plurality of terminals; a reference plane setting step for calculating a least-squares plane of the bonding portion from position data detected in the position detection step and setting this least-squares plane as a reference plane; and a flatness judgment step for finally judging the flatness by combining a first mode for judging the flatness based on the difference in elevation between the reference plane and the bonding portion of each terminal; and a second mode for judging the flatness based on the difference in elevation of the bonding portions of two predetermined terminals that are spaced apart from each other, wherein the component is a package component having a component body that is rectangular in plan view, and the plurality of terminals are arranged along opposing side surfaces of the component body, and the second mode includes a judgment step for judging the flatness based on the difference in elevation of the bonding portions of the two terminals that are arranged on opposite sides of the component body.

[0021] On the other hand, a component inspection device according to one aspect of the present invention is an inspection device that inspects flatness of a bonded portion of a component having a plurality of terminals, each having a bonded portion to be bonded to a board, and includes a position detection unit that detects the position of the bonded portion of each of the plurality of terminals, and a judgment unit that judges whether the flatness is good or bad based on position data detected by the position detection unit, wherein the judgment unit executes a reference plane setting process that finds a least-squares plane of the bonded portion based on the position data and sets this least-squares plane as a reference plane, and a flatness judgment process that finally judges whether the flatness is good or bad by using a first mode that judges whether the flatness is good or bad based on a difference in elevation between the reference plane and the bonded portion of each terminal, and a second mode that judges whether the flatness is good or bad based on a predetermined difference in elevation between the bonded portions of two terminals that are spaced apart from each other. The height difference between the joints of the two terminals spaced apart from each other in the second mode is the height difference between positions on the reference plane corresponding to the two terminals. It is characterized by the following.

[0022] This inspection device makes it possible to automate the inspection of the flatness of a component based on the inspection method described above. That is, in this inspection device, a position detection unit detects the position of the joint of each of the plurality of terminals, and based on the position data, a determination unit executes a reference plane setting process and a flatness determination process to determine whether the flatness is good or bad. In this case, the determination unit uses both the first mode and the second mode in the flatness determination process to ultimately determine whether the flatness is good or bad. Therefore, by automating the inspection method described above, it is possible to accurately determine whether the flatness is good or bad.

[0024] More specifically The judgment unit is configured to execute either the first mode or the second mode in the flatness judgment process, and to execute the other mode only if the flatness is judged to be good in the one mode.

[0025] Furthermore, when the component is a package component having a component body that is rectangular in plan view and in which the plurality of terminals are arranged along opposing side surfaces of the component body, the second mode includes a first determination step of determining whether the flatness is good or bad based on the difference in height between the joints of two of the plurality of terminals that are spaced apart from each other in the terminal arrangement direction.

[0026] Furthermore, when the component is a package component, the second mode includes a second judgment step of judging whether the flatness is good or bad based on the difference in height between the joints of the two terminals arranged on opposite sides of the component body.

[0027] Further, the determination unit is configured to finally determine that the flatness is good only when the flatness is determined to be good in both the first mode and the second mode in the flatness determination process. Another component inspection device according to one aspect of the present invention is an inspection device that inspects the flatness of a joint of a component having a plurality of terminals, each having a joint to be joined to a board, and includes a position detection unit that detects the position of the joint of each of the plurality of terminals, and a judgment unit that judges whether the flatness is good or bad based on position data detected by the position detection unit, and the judgment unit performs a reference plane setting process that finds a least-squares plane of the joint based on the position data and sets this least-squares plane as a reference plane, and judges whether the flatness is good or bad based on the height difference between the reference plane and the joint of each terminal. and a flatness determination process for finally determining whether the flatness is good or bad by combining a first mode for determining whether the flatness is good or bad, and a second mode for determining whether the flatness is good or bad based on the height difference of the joints of two predetermined terminals that are spaced apart from each other, wherein the component is a package component having a component body that is rectangular in a plan view, and the plurality of terminals are arranged along opposing side surfaces of the component body, and the second mode includes a determination step for determining whether the flatness is good or bad based on the height difference of the joints of the two terminals that are arranged on opposite sides of the component body.

[0028] Furthermore, a component mounting apparatus according to one aspect of the present invention is an apparatus that uses a movable head to pick up components from a component supply unit, transport them onto a substrate, and mounts the components on the substrate, wherein the components have a plurality of terminals, each having a joint to be joined to the substrate, and the component mounting apparatus is characterized in that it includes any of the inspection devices described above as a device for inspecting the flatness of the joints of the components picked up by the head from the component supply unit.

[0029] In this component mounting apparatus, the flatness of the joint of the component picked up by the head from the component supply unit is inspected by an inspection device. As described above, this inspection device performs a flatness determination process that uses both the first mode and the second mode to ultimately determine whether the flatness is good or bad. This makes it possible to accurately determine whether the flatness is good or bad, and ultimately to more effectively prevent components with poor flatness from being mounted on a board. [Effects of the Invention]

[0030] According to the present invention as described above, it is possible to more accurately determine whether the flatness of the joints of components such as package components having a plurality of leads (terminals) is good or bad. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is a schematic diagram showing a main body of a component mounting apparatus according to the present invention; [Figure 2] FIG. 2 is a schematic diagram of a component imaging camera. [Figure 3] FIG. 1 is a perspective view of a part (SOP). [Figure 4] FIG. 2 is a block diagram showing a control system of the component mounting apparatus. [Figure 5] 10 is a flowchart showing control of flatness inspection processing. [Figure 6] 6 is a flowchart (subroutine) of the process (flatness pass / fail determination process) of step S7 in FIG. 5. [Figure 7] FIG. 2 is an explanatory diagram of a lead of a component and a reference plane (least square plane). [Figure 8] FIG. 10 is a side view of a component in which a lead is floating. [Figure 9] FIG. 9 is a table showing the parts shown in FIG. 8 and the suitability of the determination mode. [Figure 10] FIG. 1 is a perspective view of a component (QFP). DETAILED DESCRIPTION OF THE INVENTION

[0032] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0033] [Configuration of device body 2 of component mounting device 1] Fig. 1 is a schematic diagram showing the device body 2 of a component mounting device 1 according to the present invention. In Fig. 1, directional relationships are shown using an XYZ Cartesian coordinate system. The direction perpendicular to the plane of the paper in Fig. 1 is the X direction, the left-right direction on the plane of the paper is the Y direction, and the up-down direction on the plane of the paper is the Z direction.

[0034] The component mounting apparatus 1 is an apparatus for producing component-mounted boards in which components are mounted (placed) on a board P such as a printed wiring board, and includes an apparatus main body 2 and a control unit 4 (see FIG. 4).

[0035] The device main body 2 includes a base (not shown) that is a mounting base, and a board transport mechanism 10, a component supply unit 12, a head 15, a head drive mechanism 16 (see FIG. 4), and a component imaging camera 18 that are provided on the base.

[0036] The substrate transport mechanism 10 includes, for example, a belt-type conveyor 11 extending in the X direction. The substrate P is carried in from outside the machine to a predetermined work position by the conveyor 11, and after the mounting work is completed, it is carried out from the work position to outside the machine. The conveyor 11 is provided with a clamping mechanism (not shown), and during the mounting work, the substrate P is held at the work position by this clamping mechanism.

[0037] The component supply unit 12 is disposed to the side (Y direction side) of the board transport mechanism 10. The component supply unit 12 is provided with a component supply device that supplies mounted components, and in this example, a tray feeder 13 is disposed therein. The tray feeder 13 is a component supply device that supplies components 50 placed on a tray 13a. The tray 13a is a dish-shaped component storage container that opens upward. The tray feeder 13 supplies components 50, such as so-called package components such as SOPs and QFPs, and connectors. Note that the component supply unit 12 may also be provided with component supply devices other than the tray feeder 13, such as tape feeders or stick feeders that supply small surface-mount components (chip components).

[0038] FIG. 3 is a perspective view of an SOP, which is one of the components 50 supplied by the tray feeder 13. The SOP includes a component body (package) 51 that is rectangular in plan view, and multiple leads (terminals) 52 extending from each of its side surfaces, specifically, from two long side surfaces. That is, the SOP includes lead rows (first lead row L1 and second lead row L2) on each of two opposing side surfaces of the component body 51, each row including multiple leads 52. The leads 52 are bent like cranks, and each end includes a joint 52a that is joined to the substrate P. The joint 52a is soldered to a circuit on the substrate P, thereby electrically joining the SOP to the substrate P. In the following description, unless otherwise specified, the component 50 refers to the SOP shown in FIG. 3.

[0039] The head 15 is a tool that picks up a component 50 from the component supply unit 12 (tray feeder 13), moves it to a working position, and mounts the component on the board P. A nozzle 15a is provided at the tip of the head 15. By selectively supplying negative pressure or positive pressure to this nozzle 15a, the head 15 sucks and holds the component 50 and releases the component 50 onto the board P.

[0040] The head drive mechanism 16 is a mechanism for moving the head 15 in the X, Y, Z, and R directions in the space above the component supply unit 12 and the board P at the work position. Movement in the R direction is rotation of the head 15 around a vertical axis. The head drive mechanism 16 moves the head 15 in each direction by driving a motor.

[0041] The component imaging camera 18 is disposed facing upward between the component supply unit 12 and the board transport mechanism 10. The component imaging camera 18 is an illuminated camera that captures images of the components 50 picked up from the tray feeder 13 by the head 15 from below. The component imaging camera 18 is a 3D camera that can capture three-dimensional images of the components 50, and in this example, a stereo camera such as that shown in FIG. 2 is used that captures stereo images of the components 50 from two angles.

[0042] Fig. 2 is a schematic diagram of the component imaging camera 18. As shown in Fig. 2, the component imaging camera 18 includes a first illumination unit 20, a first camera main body unit 22, a second illumination unit 24, a second camera main body unit 26, and a mirror 28.

[0043] The first illumination unit 20 and the second illumination unit 24 each include a plurality of LEDs, a refractive lens, and a diffuser. The first illumination unit 20 is disposed so as to irradiate a predetermined component imaging position PI above the component imaging camera 18 with illumination light from vertically below, and the second illumination unit 24 is disposed so as to irradiate the component imaging position PI with illumination light from diagonally below. The position of the component 50 in the Z direction is adjusted by the head 15 so that its underside, i.e., the underside of the component body 51, passes through the component imaging position PI.

[0044] Both the first camera body 22 and the second camera body 26 are line sensors in which a plurality of CCD elements or CMOS elements are arranged along the X direction. The first camera body 22 is disposed below the first illumination unit 20, and the second camera body 26 is disposed below the first camera body 22 on the opposite side of the second illumination unit 24 with the component 50 (component imaging position PI) in between.

[0045] Light irradiated from the first illumination unit 20 onto the component imaging position PI is reflected downward by the component 50 and received by the first camera main body unit 22 through a light-transmitting unit (opening) provided in the first illumination unit 20. Light irradiated from the second illumination unit 24 onto the component imaging position PI is specularly reflected in the opposite direction by the component 50, further reflected by the mirror 28, and received by the second camera main body unit 26. As the component 50 passes through the component imaging position PI in the Y direction, the first camera main body unit 22 and the second camera main body unit 26 capture full images of the component 50 at different angles. That is, the component imaging camera 18 captures an image of the component 50 taken from directly below in the vertical direction (referred to as a vertical image) and an image of the component 50 taken from diagonally below (referred to as an oblique image).

[0046] In this example, the component imaging camera 18 is provided to image the component 50 as the component 50 moves through the component imaging position PI in the Y direction, but the component imaging camera 18 may also be provided to image the component 50 as the component 50 moves in the X direction.

[0047] This component mounting apparatus 1 executes the following component mounting process. That is, when the board P is carried into the work position, the head 15 moves back and forth between the component supply unit 12 and the board P, picking up a component 50 from the tray feeder 13 (tray 13a) and transporting it onto the board P, and then mounting the component 50 at a predetermined position on the board P. At this time, the head 15 moves so that the picked component 50 passes through the component imaging position PI, and an image of the component 50 is captured by the component imaging camera 18. Based on this image, a visual inspection of the component 50 and recognition of the suction state by the head 15 are performed. A component 50 determined to be a defective component in the visual inspection is not mounted on the board P, but is released to a predetermined disposal area.

[0048] [Configuration of the control system of component mounting device 1] 4 is a block diagram showing the control system of the component mounting apparatus 1. As already described, the component mounting apparatus 1 includes the control unit 4. The control unit 4 is configured to include a CPU, ROM, RAM, peripheral circuits, etc. The control unit 4 controls the operation of each component of the apparatus main body 2 by the CPU executing a control program stored in the ROM. The control unit 4 includes, as its main functional components, a mounting control unit 30, a transport control unit 32, an image processing unit 34, and a storage unit 36, etc.

[0049] The mounting control unit 30 comprehensively controls the operation of the component mounting process by the device main body 2, and executes various arithmetic processes associated with this control. The component mounting process also includes processes such as the visual inspection of the component 50 and recognition of the suction state of the component 50, as described above. If the component 50 is the SOP shown in FIG. 3, the visual inspection includes a flatness (coplanarity) inspection of the bonding portion 52a of the component 50. This flatness inspection will be described in detail later.

[0050] The transport control unit 32 controls the transport operation of the substrate P by the substrate transport mechanism 10 (conveyor 11), i.e., the transport of the substrate P from outside the machine to the work position, the transport of the substrate P from the work position to outside the machine, the holding of the substrate P by the clamping mechanism and the release of that holding, etc.

[0051] The image processing unit 34 generates a digital image of the component 50 based on the image signal output from the component imaging camera 18. More specifically, it generates a vertical image of the component 50 based on the image signal output from the first camera main body unit 22, and generates an oblique image of the component 50 based on the image signal output from the second camera main body unit 26. The mounting control unit 30 performs processes such as visual inspection of the component 50 and recognition of the pickup state based on these images.

[0052] The storage unit 36 ​​stores various programs executed by the mounting control unit 30 and the transport control unit 32, as well as various data referenced when the programs are executed.

[0053] In this example, the component imaging camera 18 and the control unit 4 correspond to the "inspection device" of the present invention. Also, the component imaging camera 18 and the control unit 4 correspond to the "position detection unit" of the present invention, and the control unit 4 (mainly the mounting control unit 30) corresponds to the "determination unit" of the present invention.

[0054] [Flatness inspection process for part 50] In the component 50, variations in height of the bonding portions 52a may occur due to deformation of the leads 52. Large variations in height of the bonding portions 52a can lead to poor contact between the substrate P (circuit) and the bonding portions 52a, and ultimately to the production of defective substrates. Therefore, in the component mounting apparatus 1, before mounting the component 50 on the substrate P, the control unit 4 performs an inspection of the variations in height of the bonding portions 52a, that is, the flatness (coplanarity) of the bonding portions 52a, as one item of the appearance inspection.

[0055] 5 is a flowchart showing the control of the flatness inspection process. This flatness inspection process starts simultaneously with the completion of the picking operation of the component 50 by the head 15. When this flowchart starts, the mounting control unit 30 determines whether the component imaging camera 18 has captured an image of the component 50 (step S1). If the answer is Yes, the mounting control unit 30 detects the three-dimensional coordinates of the bonding portion 52a of each lead 52 from the captured image (step S3).

[0056] More specifically, first, the mounting control unit 30 detects the XY coordinates of the bonding portion 52a of each lead 52 based on a vertical image of the component 50. In this case, the XY coordinates are detected using the center of the bonding surface (the surface that abuts against the substrate P) of the bonding portion 52a as the detection point. If the bonding surface is rectangular, for example, the position where the diagonal lines of the bonding surface intersect is used as the detection point, and the XY coordinates of the detection point are detected. Hereinafter, the coordinates of the bonding portion 52a refer to the coordinates of this detection point.

[0057] Next, the mounting control unit 30 detects the XY coordinates of the joints 52a of each lead 52 based on the oblique image of the component 50, and calculates the Z coordinate of the joints 52a of each lead 52 based on the difference between the XY coordinates of the joints 52a detected based on the vertical image and the XY coordinates of the joints 52a detected based on the oblique image. Specifically, the mounting control unit 30 calculates the Z coordinate of the joints 52a of each lead 52 based on a well-known calculation formula based on the amount of deviation between the XY coordinates of the joints 52a in both images and the relative angle between the first and second camera bodies 22, 26. In this way, the three-dimensional coordinates (XYZ coordinates) of the joints 52a of each lead 52 are obtained.

[0058] Next, the mounting control unit 30 calculates a reference plane 50L from the XYZ coordinates of each joint 52a acquired in step S3 (step S5). Specifically, a least-squares plane, which is a virtual plane, is calculated from the XYZ coordinates of the joint 52a of each lead 52, and this least-squares plane is set as the reference plane 50L.

[0059] 7 is a schematic diagram showing an example of each lead 52 of a component 50 and a reference plane 50L (least-squares plane). In the figure, deformed leads 52 are shown as columns. The height of the joint 52a (joint surface) when there is no deformation is set to "0." An upwardly extending column indicates an upwardly deformed lead 52 (a lead 52 with lead lift), and a downwardly extending column indicates a downwardly deformed lead 52 (a lead 52 with lead sinking). The tip of each column is the joint 52a (joint surface).

[0060] The mounting control unit 30 executes a process of determining whether the flatness of the joint 52a is good or bad based on this reference plane 50L (step S7). Fig. 6 is a flowchart (subroutine) showing the control of the process of determining whether the flatness is good or bad.

[0061] In the flatness determination process, the mounting control unit 30 first executes a first mode consisting of the following steps S11 and S13. Specifically, the mounting control unit 30 calculates the height difference (distance in the Z direction) of the bonding portion 52a relative to the reference plane 50L for each lead 52, and calculates the difference Z1 between the maximum and minimum values, as shown in FIG. 7 (step S11). In this example, the height difference is calculated as negative (-) when the bonding portion 52a is located above the reference plane 50L, and positive (+) when the bonding portion 52a is located below the reference plane 50L, and calculates the difference Z1 between the maximum and minimum values ​​of the height difference (Z1 = |maximum value - minimum value|). In other words, the height difference Z1 between the bonding portion 52a located most negatively and the bonding portion 52a located most positively is calculated.

[0062] Then, the flatness is judged based on the height difference Z1 calculated in step S11. Specifically, it is judged whether the height difference Z1 calculated in step S11 is less than the threshold value Zt (step S13), and if the answer is No, the mounting control unit 30 judges that the flatness of the component 50 is poor (step S29), and ends the flatness judgment process.

[0063] The threshold value Zt is, for example, the maximum value of the height difference between the joints 52a of each lead 52 at which the joints 52a can come into contact with the substrate P, or a value close to the maximum value, and is set taking into account the thickness of the solder applied onto the substrate P. The threshold value Zt is stored in the storage unit 36 ​​as the various data.

[0064] If the answer to step S13 is Yes, that is, if the flatness is determined to be good in the first mode, the mounting control unit 30 further executes the second mode including the processes of steps S15 to S25 below.

[0065] In the second mode, the mounting control unit 30 calculates the height difference Z2 between positions on the reference plane 50L corresponding to two leads 52 that are spaced apart from each other in advance, and determines whether the flatness is good or bad based on this height difference Z2. In this case, the mounting control unit 30 executes the second mode for three sets of leads 52, each set consisting of two leads 52.

[0066] Specifically, first, the mounting control unit 30 calculates the height difference Z2 between the positions on the reference plane 50L corresponding to the leads 52 located at both ends of the first lead row L1, based on the following formula 1.

[0067] Z2=b(X2-X1)+c(Y2-Y1)...(1) Here, X1 and Y1 are the XY coordinates of the lead 52 located at one end of the first lead row L1, and X2 and Y2 are the XY coordinates of the lead 52 located at the other end. The reference plane 50L (least squares plane) is expressed by the plane equation aX+bY+cZ+d=0. This equation can be transformed into the equation Z=a+bX+cY for finding the height of the reference plane 50L, and the above equation 1 is based on this equation.

[0068] Then, it is determined whether the elevation difference Z2 calculated in step S15 (hereinafter referred to as elevation difference Z2a for the sake of distinction) is less than the threshold value Zt (step S17), and if the result is No, the mounting control unit 30 determines that the flatness of the component 50 is poor (step S29), and terminates the flatness pass / fail determination process.

[0069] If the answer to step S17 is Yes, that is, if the flatness is determined to be good when focusing on the leads 52 at both ends of the first lead row L1, the mounting control unit 30 then calculates the height difference Z2 (hereinafter referred to as Z2b) between positions on the reference plane 50L corresponding to the leads 52 located at both ends of the second lead row L2 (step S19). In this case, the mounting control unit 30 calculates the height difference Z2b based on the above equation 1, with the XY coordinates of the lead 52 located at one end of the second lead row L2 being (X1, Y1) and the XY coordinates of the lead 52 located at the other end being (X2, Y2).

[0070] Then, it is determined whether the height difference Z2b calculated in step S19 is less than the threshold value Zt (step S21), and if the result is No, the mounting control unit 30 determines that the flatness of the component 50 is poor (step S29) and terminates the flatness pass / fail determination process.

[0071] If the answer to step S21 is Yes, that is, if the flatness is determined to be good with respect to the leads 52 at both ends of the second lead row L2, the mounting control unit 30 further calculates a height difference Z2c between positions on the reference plane 50L corresponding to two specific (one set of) leads 52 in the first and second lead rows L1 and L2 that face each other across the component body 51 (step S23). For example, the mounting control unit 30 calculates a height difference Z2c between positions on the reference plane 50L corresponding to the first lead 52 in the first lead row L1 and the first lead 52 in the second lead row L2.

[0072] In this case, the mounting control unit 30 calculates the height difference Z2c based on the above formula 1, with the XY coordinates of the leads 52 of the first lead row L1 being (X1, Y1) and the XY coordinates of the leads 52 of the second lead row L2 being (X2, Y2).

[0073] Then, it is determined whether the height difference Z2c calculated in step S23 is less than the threshold value Zt (step S25), and if the result is No, the mounting control unit 30 determines that the flatness of the component 50 is poor (step S29) and terminates the flatness pass / fail determination process.

[0074] On the other hand, if the answer is Yes in step S25, that is, if the flatness of the two opposing leads 52 in the first lead row L1 and the second lead row L2 is determined to be good, the mounting control unit 30 ultimately determines that the flatness of the joint 52a of the component 50 is good (step S27).

[0075] When the flatness determination process (steps S11 to S29) including the first and second modes is thus completed, the mounting control unit 30 ends the flatness inspection process. If the flatness is ultimately determined to be poor in the process of step S29, the mounting control unit 30 releases the component 50 as a defective component to a predetermined disposal area. In this case, the component 50 may be returned to the component supply unit 12 or transported to a repair station. The component 50 transported to the component supply unit 12 or the repair station is reworked as necessary and then reused. In this example, the processes of steps S15, S17, S19, and S21 each correspond to the "first determination step" of the present invention, and the processes of steps S23 and S25 correspond to the "second determination step" of the present invention.

[0076] [effect] In the component mounting apparatus 1, a flatness inspection process is executed under the control of the control unit 4 to inspect the flatness of the component 50. This flatness inspection process includes a step of detecting the XYZ coordinates (position) of the bonding portion 52a for each lead 52 based on an image captured by the component imaging camera 18 (step S3 / position detection step), a step of determining a least-squares plane for each bonding portion 52a from the detected XYZ coordinate data (position data) of each bonding portion 52a and setting this least-squares plane as the reference plane 50L (step S5 / reference plane setting step), and a step of determining whether the flatness is good or bad (step S7 / flatness pass / fail determination step).

[0077] In the step of determining the flatness (step S7), a first mode (steps S11 and S13) is used to determine the flatness of each joint 52a based on the difference in height between the reference plane 50L and each joint 52a—more specifically, the difference Z1 between the maximum and minimum values ​​of the difference in height between the reference plane 50L and each joint 52a, as shown in FIG. 7—and a second mode (steps S15 to S25) is used to determine the flatness of two predetermined, spaced-apart leads 52 based on the difference in height Z2 (Z2a, Z2b, Z2c) between positions on the reference plane 50L corresponding to both leads 52 (steps S27 and S29). Therefore, the above-described configuration (inspection method) enables more accurate determination of the flatness of each joint 52a in the component 50. This point will be described in detail below.

[0078] FIG. 8 is a side view showing an example of a component 50 whose flatness should be determined to be poor. Specifically, FIG. 8(a) is a side view of the component 50 in which only some of the leads 52 in the first lead row L1 are deformed, and FIG. 8(b) is a side view of the component 50 in which the leads 52 in both lead rows L1 and L2 are similarly deformed so that the height of the joints 52a changes linearly from one end to the other in the lead arrangement direction. FIG. 8(c) is a side view of the component 50 in which all of the leads 52 in the second lead row L2 are deformed upward by a certain amount. Note that FIGS. 8(a) and 8(b) are side views of the long side (first lead row L1 side) of the component 50, and FIG. 8(c) is a side view of the short side of the component 50.

[0079] 8(a), most of the leads 52 are normal, and the reference plane 50L (least-squares plane) is a plane that is roughly aligned with the underside of the component body 51. Therefore, the difference in height between the reference plane 50L and the joints 52a of the deformed leads 52 is likely to be significant. According to the first mode, which determines whether the flatness is good or bad based on the difference in height between the reference plane 50L and the joints 52a, it is possible to determine that the flatness of the component 50 is poor. In the illustrated example, the maximum value of the difference in height is hb and the minimum value is ha. Therefore, if Z1 = (|hb - ha|) < threshold Zt, it is possible to determine that the flatness is poor.

[0080] However, in the case of a component 50 as shown in FIG. 8(b), the reference plane 50L itself is tilted along the joint 52a, so there is almost no difference in elevation between the joint 52a and the reference plane 50L, or even if there is a difference, it is generally small. Therefore, in the first mode, which determines whether the flatness is good or bad based on the difference in elevation between the joint 52a and the reference plane 50L, Z1 < the threshold Zt in many cases, making it difficult to determine that the flatness is poor. This is also true for a component 50 as shown in FIG. 8(c).

[0081] However, in the case of a component 50 as shown in Figure 8(b), a significant difference in height occurs at the joints 52a of the leads 52 located at both ends in the lead alignment direction. Similarly, in the case shown in Figure 8(c), a significant difference in height occurs at the joints 52a of two leads 52 facing each other across the component body 51. Therefore, in the second mode in which the height differences Z2a and Z2b on the reference plane 50L corresponding to the leads 52 at both ends of each of the first and second lead rows L1 and L2 are compared with a threshold value Zt, and the height difference Z2c on the reference plane 50L corresponding to each of the two leads 52 facing each other across the component body 51 is compared with a threshold value Zt, it is possible to determine that the flatness of the component 50 as shown in Figures 8(b) and 8(c) is defective.

[0082] 8(a), as described above, the reference plane 50L is likely to be a plane that substantially follows the underside of the component body 51. In this case, there are almost no height differences Z2a and Z2b between the positions on the reference plane 50L corresponding to the leads 52 at both ends of the first and second lead rows L1 and L2, and there is also little height difference Z2c between the positions on the reference plane 50L corresponding to the two leads 52 facing each other across the component body 51, or even if there is a difference, the value is relatively small. Therefore, Z2a, Z2b, and Z2c tend to be smaller than the threshold value Zt, and it is difficult to determine that the flatness of the component 50 shown in FIG. 8(a) is poor using only the second mode.

[0083] 8(a) to 8(c) and the appropriateness of the judgment modes suited to them can be said to have a complementary relationship as shown in FIG. 9. Therefore, the above-described configuration (inspection method) for judging the flatness of the component 50 by using the first mode and the second mode in combination makes it possible to more accurately judge the flatness of the bonding portion 52a. As a result, the component mounting apparatus 1 can more effectively prevent components with poor flatness from being mounted on the substrate P.

[0084] Moreover, in the flatness pass / fail determination process (step S7), as described above, the first mode is executed, and the second mode is executed only if the flatness is determined to be good in the first mode (Yes in step S13). That is, if the flatness is determined to be bad in the first mode (No in step S13), the second mode is not executed, and the flatness is ultimately determined to be bad (step S29). Therefore, the flatness pass / fail determination process can be performed efficiently while more accurately determining the flatness pass / fail.

[0085] Furthermore, in the flatness determination process (step S7), only if the flatness is determined to be good in both the first mode and the second mode (Yes in step S25), is the flatness of the part finally determined to be good (step S27). Therefore, there is also the advantage that the determination result for part 50 whose flatness is determined to be good is highly reliable.

[0086] Furthermore, in the processes of steps S15, S19, and S25 of the second mode, for two leads 52, height differences Z2a, Z2b, and Z2c at positions on the reference plane 50L corresponding to both leads 52 are calculated, and these height differences Z2a, Z2b, and Z2c are compared with the threshold value Zt, so that it is possible to more reliably determine whether the flatness of the component 50 is defective, as shown in Figures 8(b) and 8(c). That is, in the processes of steps S15, S19, and S23, it is also possible to calculate the actual height difference (i.e., the height difference in the Z coordinate) of the joint 52a of the two leads 52, and compare this height difference with the threshold value Zt.

[0087] However, this method has the following drawback. For example, in the component 50 shown in Figure 8(b), if we assume that the rightmost lead 52 in the figure is not deformed, there will be almost no height difference between the leads 52 at both ends, i.e., the joints 52a of the two leads 52 that are the subject of calculation of the height difference Z2a (Z2b). Therefore, when the actual height difference at the joints 52a is calculated and compared with the threshold value Zt, it is conceivable that the flatness will be determined to be good even if all of the leads 52 except for the leads 52 at both ends are deformed.

[0088] In contrast, according to a configuration (inspection method) in which the height difference Z2a (Z2b) between the positions on the reference plane 50L corresponding to the leads 52 at both ends is calculated and the height difference Z2a (Z2b) is compared with the threshold value Zt, the gradient of the reference plane 50L is reflected in the height difference Z2a (Z2b), and deformation (floating) of the leads 52 other than those at both ends is essentially taken into account.

[0089] Therefore, according to the above configuration (inspection method) in which the height differences Z2a, Z2b, and Z2c of the positions corresponding to the two leads 52 on the reference plane 50L are calculated and these height differences Z2a, Z2b, and Z2c are compared with the threshold value Zt, it is possible to more reliably determine whether the flatness of the component 50, as shown in Figures 8(b) and (c), is poor, compared to when determining whether the flatness is good or bad based on the actual height difference of the joint 52a.

[0090] [Modifications, etc.] The component mounting apparatus 1 described above is an example of a preferred embodiment of the present invention, and the specific component inspection method (inspection apparatus) and the specific configuration of the component mounting apparatus 1 can be changed without departing from the gist of the present invention. For example, the following configurations (methods) can also be applied.

[0091] (1) In the embodiment, the component inspection method (inspection device) of the present invention has been described using an SOP, which is a two-way lead type package component, as an example of component 50. However, the present invention is also applicable to the inspection of two-way lead type package components other than SOPs, and four-way lead type package components, such as QFPs. As shown in FIG. 10, a QFP is a component in which multiple leads 52 are arranged along each side of a component body 51 that is square in plan view. In other words, it is a component that has first to fourth lead rows L1 to L4 around the periphery of component body 51.

[0092] Even when the component 50 is a QFP, flatness inspection processing can be performed in accordance with the flowcharts shown in Figures 5 and 6. In this case, as a second mode of the flatness pass / fail determination processing (step S7), in addition to the flatness pass / fail determination processing (steps S15, S17) focusing on the leads 52 at both ends of the first lead row L1 and the flatness pass / fail determination processing (steps S19, S21) focusing on the leads 52 at both ends of the second lead row L2, a flatness pass / fail determination processing focusing on the leads 52 at both ends of the third lead row L3 and a flatness pass / fail determination processing focusing on the leads 52 at both ends of the fourth lead row L4 are executed. Furthermore, in addition to the flatness determination process (steps S23, 25) that focuses on two leads 52 of the first lead row L1 and the second lead row L2 that face each other across the component body 51, it is also possible to perform flatness determination process that focuses on two leads 52 of the third lead row L3 and the fourth lead row L4 that face each other across the component body 51.

[0093] (2) In the embodiment, in the process of determining whether the flatness of the component 50 is good (step S7), the first mode (steps S11 and S13) is first executed, and if the flatness is determined to be good in the first mode (Yes in step S13), the second mode (steps S15 to S25) is executed. However, conversely, the second mode may be executed, and if the flatness is determined to be good in the second mode, the first mode may be executed. Also, both the first mode and the second mode may be executed.

[0094] (3) In the embodiment, in the process of step S15 of the second mode, for the leads 52 located at both ends of the first lead row L1, a difference in elevation Z2a between positions on the reference plane 50L corresponding to both leads 52 is calculated (step S15), and in the process of step S19, for the leads 52 located at both ends of the second lead row L2, a difference in elevation Z2b between positions on the reference plane 50L corresponding to both leads 52 is calculated (step S19). However, the positions of the leads 52 for which the differences in elevation Z2a and Z2b are calculated are not necessarily limited to the leads 52 at both ends of the lead rows L1 and L2, as long as they are two leads 52 spaced apart from each other in the lead arrangement direction.

[0095] In the embodiment, in the processing of step S23 in the second mode, for two leads 52 in the first lead row L1 and the second lead row L2 that face each other across the component body 51, a height difference Z2c between positions on the reference plane 50L corresponding to both leads 52 is calculated (step S23). However, the two leads 52 for which the height difference Z2c is calculated are not necessarily limited to leads 52 that face each other across the component body 51. As long as the two leads 52 are arranged on opposite sides of the component body 51, the two leads 52 may be offset from each other in the lead arrangement direction.

[0096] (4) In the embodiment, a least-squares plane of the joints 52a of all leads 52 of the component 50 is calculated (step S5 in FIG. 5), and this least-squares plane is used as the reference plane 50L. Then, in steps S15, S19, and S23 of the second mode in the flatness pass / fail judgment process (FIG. 6), the elevation difference Z2 (Z2a, Z2b, Z2c) of positions corresponding to two leads 52 (joints 52a) on this reference plane 50L is calculated. However, in the processes of steps S15 and S19, a least-squares plane (least-squares line) of the joints 52a of the leads 52 may be calculated for each lead row, separately from the reference plane 50L, and the elevation difference (Z2a, Z2b) of positions corresponding to the two leads 52 on this least-squares plane (least-squares line) may be calculated.

[0097] Similarly, when the component 50 is a four-way lead type package component (QFP) shown in Figure 10, in the processing of step S23 of the second mode, a least-squares plane of the joints 52a of the leads 52 is calculated for the first lead row L1 and the second lead row L2, and the height difference (Z2c) of the positions corresponding to the two opposing leads 52 on this least-squares plane is calculated, and a least-squares plane of the joints 52a of the leads 52 is calculated for the third lead row L3 and the fourth lead row L4, and the height difference (Z2c) of the positions corresponding to the two opposing leads 52 on this least-squares plane may also be calculated.

[0098] (5) In the embodiment, a stereo camera having the configuration shown in FIG. 2 is used as the component imaging camera 18. However, the specific configuration of the component imaging camera 18 is not limited to that of the embodiment (FIG. 2) as long as it can capture vertical and oblique images of the component 50 positioned at the component imaging position PI. Essentially, it is sufficient that the first camera 22 can receive the vertical component of the illumination light reflected by the component 50 along the optical axis, and the second camera 26 can receive the specularly reflected component at a predetermined angle relative to the vertical along the optical axis. Therefore, the component mounting apparatus 18 may be configured, for example, such that a single illumination unit is provided for the first camera 22 and the second camera 26. Furthermore, the mirror 28 is a means for guiding the light specularly reflected by the component 50 to the second camera 26 positioned below the first camera 26. Therefore, if the layout allows the first camera 22 to be positioned so that it can directly receive the light specularly reflected by the component 50, the mirror 28 can be omitted.

[0099] (6) In the embodiment, the component 50 is imaged by the component imaging camera 18, which is a stereo camera, and the three-dimensional coordinates of the joints 52a of each lead 52 of the component 50 are detected from the image, but the component 50 may be imaged by a 3D camera other than a stereo camera. Also, the three-dimensional coordinates of the joints 52a may be detected by scanning the joints 52a of each lead 52 with a laser-type measuring device or the like.

[0100] (7) In the embodiment, all of the processes in steps S11 to S29 in Fig. 6 are considered to be part of the process for determining whether the flatness of the component 50 is good or bad. In other words, the processes in both the first mode and the second mode are considered to be part of the process for determining whether the flatness is good or bad. However, the processes in steps S11 and S13 may be considered to be part of the process for determining whether the flatness is good or bad, and the processes in steps S13 to S25 may be considered to be part of the process for determining whether the inclination of the lead 52 is good or bad. In other words, the first mode may be used to determine whether the flatness is good or bad, and the second mode may be used to determine whether the inclination of the lead 52 is good or bad. [Explanation of symbols]

[0101] 1. Component mounting equipment 4. Control section 10. Conveying mechanism 13 Tray Feeder 15 heads 15a nozzle 16 Head drive mechanism 18 Parts imaging camera 30 Mounting control section 50 parts 51 Part body 51 52 leads 52a Joint L1 Lead column 1 L2 Second lead column P board

Claims

1. 1. A method for inspecting flatness of joints of a component having a plurality of terminals, each of the terminals having a joint to be joined to a substrate, the method comprising: a position detection step of detecting the position of the joint portion of each of the plurality of terminals; a reference plane setting step of determining a least-squares plane of the joint from the position data detected in the position detection step and setting the least-squares plane as a reference plane; a flatness determining process for finally determining whether the flatness is good or bad by using a first mode for determining whether the flatness is good or bad based on a difference in height between the reference plane and the joint portion of each terminal, and a second mode for determining whether the flatness is good or bad based on a difference in height between the joint portions of two predetermined terminals spaced apart from each other, a component inspection method, characterized in that the height difference of the joint portions of the two spaced-apart terminals in the second mode is determined by the height difference of positions on the reference plane corresponding to the two terminals.

2. The component inspection method according to claim 1, A component inspection method characterized in that, in the flatness determination process, either the first mode or the second mode is executed, and only if the flatness is determined to be good in the one mode, the other mode is executed.

3. 3. The component inspection method according to claim 1, further comprising: the component is a package component having a component body that is rectangular in plan view, and the plurality of terminals are arranged along opposing side surfaces of the component body, The second mode includes a first determination step of determining whether the flatness is good or bad based on the difference in height between the joints of two of the plurality of terminals that are spaced apart from each other in the terminal arrangement direction.

4. 3. The component inspection method according to claim 1, further comprising: the component is a package component having a component body that is rectangular in plan view, and the plurality of terminals are arranged along opposing side surfaces of the component body, The component inspection method is characterized in that the second mode includes a second judgment step of judging whether the flatness is good or bad based on the difference in height between the joints of the two terminals arranged on opposite sides of the component body.

5. 5. The component inspection method according to claim 1, further comprising: A component inspection method characterized in that, in the flatness determination process, the flatness is finally determined to be good only if the flatness is determined to be good in both the first mode and the second mode.

6. A method for inspecting flatness of joints of a component having a plurality of terminals, each of the terminals having a joint to be joined to a substrate, comprising: a position detection step of detecting the position of the joint portion of each of the plurality of terminals; a reference plane setting step of determining a least-squares plane of the joint from the position data detected in the position detection step and setting the least-squares plane as a reference plane; a flatness determining process for finally determining whether the flatness is good or bad by using a first mode for determining whether the flatness is good or bad based on a difference in height between the reference plane and the joint portion of each terminal, and a second mode for determining whether the flatness is good or bad based on a difference in height between the joint portions of two predetermined terminals spaced apart from each other, the component is a package component having a component body that is rectangular in plan view, and the plurality of terminals are arranged along opposing side surfaces of the component body, The second mode is a component inspection method characterized in that it includes a judgment step of judging whether the flatness is good or bad based on the difference in height of the joint portions of the two terminals arranged on opposite sides of the component body.

7. 1. An inspection apparatus for inspecting flatness of a component having a plurality of terminals, each of the terminals having a bonding portion to be bonded to a substrate, comprising: a position detection unit that detects the position of the joint portion of each of the plurality of terminals; a determination unit that determines whether the flatness is good or bad based on the position data detected by the position detection unit, The determination unit a reference plane setting process for determining a least-squares plane of the joint based on the position data and setting the least-squares plane as a reference plane; a flatness determination process for finally determining whether the flatness is good or bad by using a first mode in which the flatness is determined based on a difference in height between the reference plane and the joint portion of each terminal, and a second mode in which the flatness is determined based on a difference in height between the joint portions of two predetermined terminals spaced apart from each other; a component inspection device characterized in that the height difference of the joint portions of the two spaced-apart terminals in the second mode is the height difference of positions on the reference plane corresponding to the two terminals, respectively.

8. The component inspection device according to claim 7, A part inspection device characterized in that the judgment unit executes either the first mode or the second mode in the flatness judgment process, and executes the other mode only if the flatness is judged to be good in the one mode.

9. 9. The component inspection device according to claim 7 or 8, the component is a package component having a component body that is rectangular in plan view, and the plurality of terminals are arranged along opposing side surfaces of the component body, The second mode includes a first determination step of determining whether the flatness is good or bad based on the difference in height between the joints of two of the plurality of terminals that are spaced apart in the terminal arrangement direction.

10. 9. The component inspection device according to claim 7 or 8, the component is a package component having a component body that is rectangular in plan view, and the plurality of terminals are arranged along opposing side surfaces of the component body, The second mode of the component inspection device is characterized in that it includes a second judgment step of judging whether the flatness is good or bad based on the difference in height between the joints of the two terminals arranged on opposite sides of the component body.

11. 11. The component inspection device according to claim 7, A part inspection device characterized in that, in the flatness determination process, the determination unit finally determines that the flatness is good only if the flatness is determined to be good in both the first mode and the second mode.

12. An inspection device for inspecting flatness of joints of a component having a plurality of terminals, each of the terminals having a joint to be joined to a substrate, comprising: a position detection unit that detects the position of the joint portion of each of the plurality of terminals; a determination unit that determines whether the flatness is good or bad based on the position data detected by the position detection unit, The determination unit a reference plane setting process for determining a least-squares plane of the joint based on the position data and setting the least-squares plane as a reference plane; a flatness determination process for finally determining whether the flatness is good or bad by using a first mode in which the flatness is determined based on a difference in height between the reference plane and the joint portion of each terminal, and a second mode in which the flatness is determined based on a difference in height between the joint portions of two predetermined terminals spaced apart from each other; the component is a package component having a component body that is rectangular in plan view, and the plurality of terminals are arranged along opposing side surfaces of the component body, The second mode of the component inspection device includes a determination step for determining whether the flatness is good or bad based on the difference in height between the joints of the two terminals arranged on opposite sides of the component body.

13. A component mounting apparatus that uses a movable head to pick up components from a component supply unit, transport them onto a substrate, and mount the components on the substrate, the component is a component including a plurality of terminals each having a joining portion to be joined to a substrate, The component mounting apparatus is characterized in that it is equipped with the inspection device described in any one of claims 7 to 12 as a device for inspecting the flatness of the joint of the component taken out by the head from the component supply unit.

Images