Information Exchange System

Abstract

To provide an information exchange system that enables processing information to be effectively utilized in an inspection performed by an inspection device.SOLUTION: An information exchange system includes a processing device and an inspection device between which information is exchanged. The processing device 2 comprises a chuck table 21 for holding a workpiece, cutting means 22, and processing control means 100. The inspection device 3 comprises a chuck table 32f for holding the workpiece processed by the processing device, inspection means 36, and inspection control means 200. The processing control means comprises an information storage section 110 for identifying a region in which the workpiece is to be processed using an X-coordinate and a Y-coordinate and storing processing information obtained by the processing. The inspection control means extracts processing information corresponding to the X-coordinate and the Y-coordinate of the workpiece imaged by the inspection means from the processing control means.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an information exchange system for exchanging information between a processing device and an inspection device. [Background technology]

[0002] A wafer, on whose surface multiple devices such as ICs and LSIs are formed and partitioned along planned dividing lines, is then divided into individual device chips by a dicing machine and used in electrical equipment such as mobile phones and personal computers.

[0003] The dicing device comprises at least a holding means for holding the workpiece, a cutting means for performing cutting processing on the workpiece held by the holding means, an X-axis processing feed means for relatively feeding the holding means and the cutting means in the X-axis direction, a Y-axis processing feed means for relatively feeding the holding means and the cutting means in the Y-axis direction perpendicular to the X-axis direction, and a processing control means, and can divide the wafer into individual device chips with high precision (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-50214 Summary of the Invention [Problem to be solved by the invention]

[0005] When processing wafers using the above-mentioned dicing machine, high processing accuracy is required, and it is necessary to periodically inspect whether the processing quality of the dicing machine is being maintained appropriately. The wafer is placed via adhesive tape in a frame having an opening for accommodating the wafer, and even after being divided into individual device chips, the wafer shape is maintained by the adhesive tape and the frame and is transported to an inspection process carried out in an inspection machine.

[0006] In this inspection process, the wafer divided into individual device chips, which is the object to be inspected, is imaged by an inspection means, and it is inspected to see whether chipping has occurred along the cut division lines, whether the cut grooves have been properly formed along the planned division lines, whether there is any contamination on the devices, etc.

[0007] However, although processing information including the load current value of the processing feed means, the load current value of the cutting means, the amount of cutting water, abnormal sounds, processing sequence, etc. that occurs when cutting a wafer is stored in the processing control means of the dicing device, the processing information is not sufficiently reflected in the inspection device that performs the inspection process, and there is a problem in that the processing information cannot be properly utilized in the inspection process.

[0008] The present invention has been made in consideration of the above facts, and its main technical objective is to provide an information exchange system that can effectively utilize processing information in inspections performed by inspection devices. [Means for solving the problem]

[0009] In order to solve the above-mentioned main technical problem, according to the present invention, there is provided an information exchange system for exchanging information between a processing device and an inspection device, wherein the processing device comprises at least workpiece holding means for holding a workpiece, processing means for processing the workpiece held by the workpiece holding means, X-axis processing feed means for relatively processing-feeding the workpiece holding means and the processing means in the X-axis direction, Y-axis processing feed means for relatively processing-feeding the workpiece holding means and the processing means in the Y-axis direction perpendicular to the X-axis direction, and processing control means, and the inspection device comprises inspection object holding means for holding an inspection object processed by the processing device, and inspection object holding means and an inspection control means for detecting the processed state by imaging the object to be inspected held by the inspection means, an X-axis inspection feed means for relatively feeding the object to be inspected in the X-axis direction between the object to be inspected and the inspection means, a Y-axis inspection feed means for relatively feeding the object to be inspected in the Y-axis direction perpendicular to the X-axis direction between the object to be inspected and the inspection means, and an inspection control means. The processing control means specifies an area to be processed on the object to be processed by X-coordinates and Y-coordinates, and includes an information storage unit for storing processing information obtained by processing by the X-coordinates and Y-coordinates. The inspection control means extracts processing information corresponding to the X-coordinates and Y-coordinates of the object to be inspected imaged by the inspection means from the processing control means. The inspection control means includes an image storage unit that stores an image of the object to be inspected captured by the inspection means in terms of X and Y coordinates, and the processing control means extracts an image corresponding to processing information specified by the X and Y coordinates from the image storage unit of the inspection control means. An information exchange system is provided.

[0010] Applicable The processing control means may include a processing address conversion unit that converts X and Y coordinates into addresses, and the inspection control means may include an inspection address conversion unit that converts X and Y coordinates into addresses, so that addresses can be used instead of X and Y coordinates.

[0011] The workpiece may be a wafer having a plurality of devices formed on its surface, partitioned by planned dividing lines, the wafer supported via tape on a frame having an opening for accommodating the wafer, the processing means being a cutting means equipped with a rotatable cutting blade, and the processing performed on the wafer may be cutting along the planned dividing lines. Also, X and Y coordinates may be set for each planned dividing line, or the X and Y coordinates may be converted into addresses. Furthermore, an ID may be associated with the workpiece, and information including the processing device that processed the workpiece, the date and time of processing, the processing location, the inspection device that inspected the object, the inspection date and time, and the inspection location may be identified by the ID. [Effects of the Invention]

[0012] The information exchange system of the present invention is an information exchange system for exchanging information between a processing device and an inspection device, wherein the processing device comprises at least a workpiece holding means for holding a workpiece, a processing means for processing the workpiece held by the workpiece holding means, an X-axis processing feed means for relatively processing-feeding the workpiece holding means and the processing means in an X-axis direction, a Y-axis processing feed means for relatively processing-feeding the workpiece holding means and the processing means in a Y-axis direction perpendicular to the X-axis direction, and a processing control means, and the inspection device comprises an inspection object holding means for holding an inspection object processed by the processing device, and a processing control means for controlling the inspection of the inspection object held by the inspection object holding means. The apparatus includes at least an inspection means for imaging an object to be inspected and inspecting the processed state, an X-axis inspection feed means for relatively feeding the object to be inspected in the X-axis direction between the object to be inspected and the inspection means, a Y-axis inspection feed means for relatively feeding the object to be inspected in the Y-axis direction perpendicular to the X-axis direction between the object to be inspected and the inspection means, and an inspection control means, wherein the processing control means specifies an area to be processed on the object to be processed by X-coordinates and Y-coordinates, and includes an information storage unit for storing processing information obtained by processing by X-coordinates and Y-coordinates, and the inspection control means extracts processing information corresponding to the X-coordinates and Y-coordinates of the object to be inspected imaged by the inspection means from the processing control means. The inspection control means includes an image storage unit that stores an image of the object to be inspected captured by the inspection means in terms of X and Y coordinates, and the processing control means extracts an image corresponding to processing information specified by the X and Y coordinates from the image storage unit of the inspection control means. This allows for the utilization of processing information corresponding to the area imaged by the inspection device. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view of a dicing device and an inspection device in which the information exchange system of this embodiment is implemented. [Figure 2] FIG. 2 is a perspective view of a wafer as a workpiece. [Figure 3] FIG. 2 is a perspective view showing a state in which cutting is performed in a dicing device. [Figure 4] 10 is a conceptual diagram showing an outline of processing information stored in an information storage unit of a processing control means of a dicing device. FIG. [Figure 5] FIG. 2 is a perspective view showing an aspect in which an inspection is performed in the inspection device. DETAILED DESCRIPTION OF THE INVENTION

[0014] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an information exchange system configured based on the present invention will be described in detail below with reference to the accompanying drawings.

[0015] FIG. 1 shows a dicing device 2 arranged as a processing device that constitutes the information exchange system of this embodiment, and an inspection device 3 that inspects an object processed by the dicing device 2.

[0016] The dicing device 2 shown in the upper part of Figure 1 has an approximately rectangular parallelepiped device housing 20 and is configured to include a chuck table 21 arranged as a workpiece holding means for holding a wafer 10, which is a workpiece, and cutting means 22, which is a processing means for performing cutting processing on the wafer 10 held on the chuck table 21.

[0017] Although not shown, an X-axis machining feed means is provided inside the device housing 20 for relatively machining and feeding the chuck table 21 and the cutting means 22 in the X-axis direction indicated by the arrow X in the figure, and a Y-axis machining feed means is provided for relatively machining and feeding the chuck table 21 and the cutting means 22 in the Y-axis direction indicated by the arrow Y in the figure, which is perpendicular to the X-axis direction.

[0018] Furthermore, the dicing device 2 includes a cassette 23 (shown by a two-dot chain line) for storing a plurality of wafers 10, a temporary storage table 24 for carrying out and temporarily storing the wafers 10 stored in the cassette 23, a carry-in / out means 25 for carrying out the wafers 10 to the temporary storage table 24, a transport means 26 for rotating and transporting the wafers 10 carried out to the temporary storage table 24 onto the chuck table 21, and a cleaning means 27 (details are omitted) for cleaning the wafers 10 cut by the cutting means 22. The dicing device 2 is provided with a wafer 10 conveying means 27, a cleaning conveying means 28 conveying the cut wafer 10 from the chuck table 21 to the cleaning means 27, an imaging means 29 capturing an image of the wafer 10 on the chuck table 21, a processing control means 100 for controlling each operating part of the dicing device 2, and a display means M1 having a touch panel function for displaying the processing conditions performed by the dicing device 2 and images captured by the imaging means 29 and for inputting desired processing conditions by touch operation. When the wafer 10 is conveyed out of the cassette 23 by the conveying in / out means 25, the height of the cassette 23 is adjusted as appropriate by an elevating means (not shown). In addition, although not shown, the dicing device 2 is equipped with an X-coordinate position detection sensor that identifies the position of the chuck table 21 in the X-axis direction, a Y-coordinate position detection sensor that identifies the position in the Y-axis direction, and a circumferential position sensor that identifies the angular position in the rotational direction, making it possible to accurately identify the X-coordinate and Y-coordinate of the chuck table 21 imaged by the imaging means 19, and to accurately position the cutting means 22 at the desired X-coordinate and Y-coordinate position on the wafer 10.

[0019] The cutting means 22 is provided with a cutting water supply nozzle 22a that supplies pure cutting water to the cutting area when cutting the wafer 10 held by suction on the chuck table 21. The cutting water supplied from the cutting water supply nozzle 22a is collected through an appropriate collection path, filtered by a filtration device, and reused, or discharged to the outside. The machining control means 100 shown in FIG. 1 is configured by a computer, and although it is shown outside the device housing 20 for convenience of explanation, it is actually housed inside the device housing 20. The machining control means 100 is also provided with an information storage unit 110 and a machining address conversion unit 120. The information storage unit 110 stores processing information such as the load current value when the X-axis processing feed means is operated by the electric motor when processing the wafer 10, the load current value of the electric motor that rotates the cutting blade of the cutting means 22, the amount of cutting water supplied from the cutting water supply nozzle 22a, processing sounds during cutting processing, and processing order, in association with the X-coordinate and Y-coordinate of the wafer 10 to be cut. The processing address conversion unit 120 will be described later.

[0020] The inspection device 3 shown at the bottom of Figure 1 is equipped with an inspection object holding means 32 that holds the wafer 10 that has been processed into an inspection object by the dicing device 2, which is the processing device of this embodiment, an inspection means 36 that takes an image of the wafer 10 held in the inspection object holding means 32 and inspects the wafer 10, a moving means 33 that moves the inspection object holding means 32 and the inspection means 36 relative to each other, and an inspection control means 200 that controls the inspection of the inspection object in the inspection device 3.

[0021] The specimen holding means 32 includes a rectangular X-axis movable plate 32a mounted on the base 3a so as to be movable in the X-axis direction, a rectangular Y-axis movable plate 32b mounted so as to be movable in the Y-axis direction along guide rails 32c, 32c on the X-axis movable plate 32a, a cylindrical support 32d fixed to the upper surface of the Y-axis movable plate 32b, a rectangular cover plate 32e fixed to the upper end of the support 32d, a circular chuck table 32f extending upward through an elongated hole formed in the cover plate 32e, and clamps 32g evenly arranged around the periphery of the chuck table 32f. The chuck table 32f is rotatable by a rotary drive means (not shown), and the upper surface of the chuck table 32f is made of an air-permeable porous material and is connected to a suction means (not shown) by a flow path passing through the support 32d.

[0022] The moving means 33 includes an X-axis inspection feed means 34 that relatively feeds the object holding means 32 and the inspection means 36 in the X-axis direction, and a Y-axis inspection feed means 35 that relatively feeds the object holding means 32 and the inspection means 36 in the Y-axis direction, which is perpendicular to the X-axis direction. The X-axis inspection feed means 34 includes a ball screw 342 that extends in the X-axis direction on the base 3a, and a motor 341 connected to one end of the ball screw 342. A nut portion (not shown) of the ball screw 342 is formed on the underside of the X-axis movable plate 32a. The X-axis inspection feed means 34 converts the rotational motion of the motor 341 into linear motion using the ball screw 342 and transmits it to the X-axis movable plate 32a, moving the X-axis movable plate 32a back and forth in the X-axis direction along the guide rails 3b, 3b on the base 3a. The Y-axis moving means 35 has a ball screw 352 extending in the Y-axis direction on the X-axis movable plate 32a, and a motor 351 connected to one end of the ball screw 352. A nut portion (not shown) of the ball screw 352 is formed on the lower surface of the Y-axis movable plate 32b. The Y-axis inspection feed means 35 converts the rotational motion of the motor 351 into linear motion using the ball screw 352 and transmits it to the Y-axis movable plate 32b, causing the Y-axis movable plate 32b to advance and retreat in the Y-axis direction along the guide rails 32c, 32c on the X-axis movable plate 32a.

[0023] Although not shown in the figure, the inspection device 3 is provided with an X-coordinate position detection sensor that identifies the position of the chuck table 32f in the X-axis direction, a Y-coordinate position detection sensor that identifies the position in the Y-axis direction, and a circumferential position sensor that identifies the angular position in the rotation direction, and these sensors can accurately identify the X-coordinate and Y-coordinate of a predetermined position on the wafer 10 imaged by the inspection means 36.

[0024] A vertical wall 3c extends upward from the top surface of the base 3a at the rear side of the inspection object holding means 32, and a horizontal wall 3d extends horizontally from the upper end of the vertical wall 3c. The horizontal wall 3d houses the optical system of the inspection means 36. A display means M2 is disposed above the horizontal wall 3d. The inspection control means 200 is implemented by a computer. For convenience of explanation, the inspection control means 200 is shown outside the inspection apparatus 3 in FIG. 1, but is actually housed inside the inspection apparatus 3. The X-axis inspection feed means 34, Y-axis inspection feed means 35, inspection means 36, display means M2, etc. are connected to the inspection control means 200 and controlled based on instruction signals issued by the inspection control means 200 to inspect the wafer 10, which is the workpiece. The inspection control means 200 also includes an inspection address conversion unit 210 and an image storage unit 220, which will be described later.

[0025] A communication means 5 is provided between the dicing apparatus 2 and the inspection apparatus 3 for exchanging information between the inspection control means 200 of the inspection apparatus 3 and the processing control means 100 of the dicing apparatus 2. By using the communication means 5, processing information corresponding to the X and Y coordinates of the wafer 10 imaged by the inspection means 36 can be extracted from the processing control means 100. More specifically, the communication means 5 of this embodiment can utilize, for example, the Internet. The processing information stored in the processing control means 100 of the dicing apparatus 2 is transmitted to the server 4 via an Internet communication network 52, and the processing information transmitted to the server 4 is transmitted to the inspection control means 200 of the inspection apparatus 3 via an Internet communication network 54. The means by which the inspection control means 200 extracts the processing information of the object to be inspected from the processing control means 100 is not limited thereto. For example, the means may be realized by a wired communication network directly connecting the processing control means 100 and the inspection control means 200 without the server 4, or a wireless communication network connecting the two.

[0026] The procedure for processing a workpiece in the dicing apparatus 2 described with reference to FIG. 1 will be described. FIG. 2 shows a wafer 10, which is the workpiece of this embodiment. The wafer 10 is a wafer having a surface 10a partitioned by planned division lines 14 and having a plurality of devices 12 formed thereon, and is supported via tape T on a frame F having an opening Fa for accommodating the wafer 10. In this embodiment, an ID assigned to each wafer 10 is displayed on the front surface of the frame F using a sticker or the like. The ID is, for example, ID-123456. The sticker for displaying the ID may be attached to the tape T.

[0027] A plurality of wafers 10 are accommodated in a cassette 23 shown in FIG. 1 and are loaded into the dicing apparatus 2. The wafers 10 are transferred from the cassette 23 to a temporary placement table 24 by a transfer means 25, and then transferred to and placed on the chuck table 21 by a transfer means 26, where they are held by suction. The wafer 10 held by suction on the chuck table 21 is moved by an X-axis processing feed means (not shown) and positioned directly below the imaging means 29, as shown in FIG. 2. The imaging means 29 captures an image of the front surface 10a of the wafer 10 to align the predetermined dividing lines 14 of the wafer 10 in the X-axis direction and detect the area to be machined by the cutting means 22. Here, as shown in FIG. 2, on the front surface 10a of the wafer 10, there are n horizontal dividing lines 14 along the X-axis direction and m vertical dividing lines along the Y-axis direction. Each division line 14 can be identified using the X-coordinates and Y-coordinates on the chuck table 21, which are omitted from FIG. 2 . More specifically, the first to nth division lines 14 aligned adjacently in the Y-axis direction along the X-axis direction can be identified by Y-coordinates Y1, Y2, Y3, ... Yn, and the area to be cut in the X-axis direction of each division line 14 can be identified by X-coordinates X1 to Xm. Furthermore, the first to mth division lines 14 aligned along the Y-axis direction in the drawing can be identified by X-coordinates X1, X2, X3, ... Xm, and the area to be cut in the Y-axis direction of each division line 14 can be identified by Y-coordinates Y1 to Yn. Coordinate information of these division lines 14 is stored as processing information related to the processing area in the information storage unit 110 of the processing control means 100 of the dicing apparatus 2.

[0028] The processing control means 100 of this embodiment further includes a processing address conversion unit 120 that converts the X coordinates (X1 to Xm) and Y coordinates (Y1 to Yn) for specifying the position of the planned division line 14 as the processing area into addresses. The processing address conversion unit 120 converts the X coordinates and Y coordinates specifying each of the planned division runs 14 into predetermined addresses. The addresses are letters, numbers, or combinations thereof assigned to each of the planned division lines 14. For example, the planned division line 14 specified by the Y coordinate Y1 of the planned division line 14 along the X-axis direction is converted into an address such as "horizontal number 1," the planned division line 14 specified by the Y coordinate Y2 is converted into an address such as "horizontal number 2," and the Y coordinates Y3 and onwards up to the Y coordinate Yn are sequentially converted into addresses such as "horizontal number 3" to "horizontal number n," and are stored in the information storage unit 110 of the processing control means 100. Similarly, the planned division line 14 specified by the X coordinate X1 of the planned division line 14 along the Y-axis direction is converted into an address such as "vertical number 1", the planned division line 14 specified by the X coordinate X2 is converted into an address such as "vertical number 2", and the X coordinates from X3 onwards up to X coordinate Xm are converted into addresses such as "vertical number 3" to "vertical number m", and these are stored in the information storage unit 110 of the processing control means 100. Note that the notation forms of "horizontal number n" and "vertical number m" converted as described above are not limited to these, and for example, "horizontal number n" may be converted simply to "An", and "vertical number m" may be converted simply to "Bm".

[0029] Once the area of ​​the intended dividing line 14 to be cut has been detected based on the X and Y coordinates as described above, the wafer 10 is positioned in the cutting area directly below the cutting means 22, as shown in FIG. 3. As shown in FIG. 3, the cutting means 22 includes a spindle unit 22b, which includes a rotating spindle 22c to the tip of which a cutting blade 22d is fixed, and a blade cover 22e to protect the cutting blade 22d. The cutting blade 22d is configured to be rotatable together with the rotating spindle 22c in the direction indicated by arrow R1. A cutting water supply nozzle 22a is disposed adjacent to the cutting blade 22d on the blade cover 22e, and cutting water W is introduced into the cutting position through a cutting water supply port 22f in the blade cover 22e.

[0030] Once the wafer 10 has been moved to the processing area, the cutting blade 22d is rotated in the direction indicated by R1 by an electric motor (not shown), and the cutting blade 22d is positioned on a predetermined dividing line 14 of the wafer 10. Then, cutting water W is supplied from the cutting water supply port 22f, and the cutting blade 22d is fed for cutting, and cutting is performed based on the processing sequence stored in the processing control means 100. More specifically, the X-axis processing feed means is operated to move the wafer 10 in the X-axis direction indicated by the arrow X in FIG. 3, forming a cutting groove 16. After the cutting groove 16 is formed, the Y-axis processing feed means is operated to index and feed the wafer 10 in the Y-axis direction indicated by the arrow Y in the figure by the spacing of the dividing line 14, forming a new cutting groove 16. By repeating this process, cutting grooves 16 are formed along all the dividing lines 14 along the X-axis direction, i.e., along the area specified by the Y coordinates Y1 to Yn, or by the rows 1 to n when expressed as addresses.

[0031] As described above, once the cutting grooves 16 have been formed along all of the planned dividing lines 14 along the X-axis direction, the chuck table 21 is rotated 90 degrees to position the direction perpendicular to the planned dividing lines 14 along which the cutting grooves 16 have been formed as the X-axis direction, and similarly to the above, cutting grooves 16 are formed along the planned dividing lines 14 identified by the X coordinates X1 to Xm, or by vertical numbers 1 to m when expressed as addresses, thereby completing the cutting process for all of the planned dividing lines 14 on the wafer 10.

[0032] As described above, the processing control means 100 of the dicing device 2 of this embodiment stores processing information corresponding to the processing position specified by the X coordinate and the Y coordinate. More specifically, the information storage unit 110 stores the load current value when the X-axis processing feed means is operated by the electric motor when processing the wafer 10, the load current value of the electric motor that rotates the cutting blade 22d of the cutting means 22, the amount of cutting water W supplied from the cutting water supply nozzle 22a, processing sounds during cutting processing, etc.

[0033] 4 shows a conceptual diagram of specific processing information (only a portion of which is shown) stored in the information storage unit 110. For example, the information stored is associated with an ID attached to the wafer 10, which is the workpiece, and stores processing information generated in conjunction with the cutting processing described above, along with information such as the model number of the processing device that processed the wafer 10, the processing date and time, and the processing location. In the illustrated embodiment, the load current value (I1) of the electric motor that rotates the cutting blade of the cutting means 22, the amount of cutting water (Wm) supplied from the cutting water supply nozzle 22a, and the processing sound (S) during cutting processing are shown, and this processing information is stored in correspondence with the X coordinate, Y coordinate, and address information of horizontal numbers 1 to n and vertical numbers 1 to m of the planned division line 14 on which the cut grooves 16 are formed. For example, it is possible to identify at which X-coordinate position a point P1 indicating an abnormal value of the load current value (I1) when the X-axis processing feed means is operated by an electric motor and a point P2 indicating an abnormal value of the processing sound (S) occur during cutting of the planned dividing line 14 identified by the Y-coordinate Y2 (or the second line in the drawing). Furthermore, the processing information stored in the information storage unit 110 also stores the processing order for processing the multiple planned dividing lines 14 on the wafer 10, as shown in the lower part of the drawing. The processing order can affect the processing quality, and it is possible to know in what order the planned dividing line 14 identified by the Y-coordinate Y2 (or the second line in the drawing) was processed, which is important information when a problem occurs during cutting.

[0034] As described above, the wafer 10 processed in the dicing device 2 is transported to the inspection device 3 described with reference to FIG. 1, where it is placed on the chuck table 32f of the inspection object holding means 32 and held by suction. Next, the X-axis inspection feed means 34 and the Y-axis inspection feed means 35 are operated to position the wafer 10 directly below the inspection means 36, as shown in FIG. 5. Next, the predetermined kerfs 16 of the wafer 10 are aligned in the X-axis direction, and the area to be imaged is detected by the inspection means 36. Here, as shown in FIG. 5, the surface 10a of the wafer 10 has n horizontal kerfs 16 along the X-axis direction and m vertical kerfs 16 along the Y-axis direction. Each kerf 16 can be identified using the X- and Y-coordinates on the chuck table of the inspection device 3, which are omitted from FIG. 5. More specifically, the first through nth cut grooves 16 aligned adjacently in the Y-axis direction along the X-axis direction can be identified by Y-coordinates Y1', Y2', Y3'...Yn', and the range in which the cut grooves 16 are formed in the X-axis direction can be identified by X-coordinates X1' to Xm'. Furthermore, the first through mth cut grooves 16 aligned along the Y-axis direction in the drawing can be identified by X-coordinates X1', X2', X3'...Xm', and the range in which each cut groove 16 is formed in the Y-axis direction can be identified by Y1' to Yn'. The coordinate information of these cut grooves 16 is linked to the image captured by the inspection means 36 and stored together with the image in the image storage unit 220 of the inspection control means 200 disposed in the inspection device 3. When the image is stored in the image storage unit 220, the ID information arranged on the frame F described above is also stored along with the type of inspection equipment used to inspect the wafer 10, the date and time of the inspection, the location of the inspection, etc.

[0035] The inspection device 3 of this embodiment further includes an inspection address conversion unit 210 that converts the X coordinates (X1' to Xm') and Y coordinates (Y1' to Yn') for specifying the position of the cutting groove 16 as the inspection area into addresses. The inspection address conversion unit 210 converts the X coordinates and Y coordinates for specifying each cutting groove 16 into a predetermined address. The address is a character, a number, or a combination thereof that is assigned to each cutting groove 16 itself. In principle, the conversion by the inspection address conversion unit 210 is performed according to substantially the same procedure as the conversion rule executed by the machining address conversion unit 120 of the machining control means 100 described above. For example, a cutting groove 16 in the horizontal direction along the X-axis direction, identified by a Y coordinate Y1', is converted to, for example, "horizontal number 1," a cutting groove 16 identified by a Y coordinate Y2' is converted to, for example, "horizontal number 2," and the Y coordinates Y3' and onwards up to Y coordinates Yn' are sequentially converted to, for example, "horizontal number 3" to "horizontal number n," and these are stored in the inspection address conversion unit 210 of the inspection control means 200. Similarly, a cutting groove 16 in the Y-axis direction, perpendicular to the X-axis direction, identified by an X coordinate X1' is converted to, for example, "vertical number 1," and a cutting groove 16 identified by an X coordinate X2' is converted to, for example, "vertical number 2," and the X coordinates X3' and onwards up to X coordinate Xm' are sequentially converted to, for example, "vertical number 3" to "vertical number m," and these are stored in the inspection address conversion unit 210 of the inspection control means 200. The address given to the cut groove 16 imaged by the inspection means 36 in the inspection device 3 corresponds to the address of the planned dividing line 14 converted by the processing address conversion unit 120, and this address becomes an address that identifies the same area on the wafer 10. Note that the notation format when converting the above-mentioned X coordinate and Y coordinate information into an address is not limited to "nth horizontal number" and "mth vertical number", etc., and for example, "1st horizontal number" may be converted to "A1", and "1st vertical number" may be converted to "B1", etc. Note that the notation of the address is matched to the notation of the address converted by the processing address conversion unit 120 of the processing control means 100 of the dicing device 2.

[0036] The inspection in the inspection device 3 is carried out by, for example, taking images of the cut grooves 16 with the inspection means 36 in accordance with the processing order in which the cut grooves 16 were formed by the dicing device 2 described above.

[0037] The inspection device 3 can capture an image of the kerf groove 16 of the wafer 10 using the inspection means 36 and detect chipping 18 occurring in the kerf groove 16, which is displayed on the display means M2 shown in FIG. 5. Then, processing information corresponding to the Y-coordinate Y2' and X-coordinates X5'-X6' of the area of ​​the kerf groove 16 where the chipping 18 was detected is extracted from the information storage unit 110 in the processing control means 100 of the dicing device 2 described with reference to FIG. 4. By referencing the processing information in association with the X- and Y-coordinate positions corresponding to the chipping 18, as shown in FIG. 4, an abnormal load current value, as indicated by P1 in the figure, is detected corresponding to the X- and Y-coordinates, and it is confirmed that an abnormal noise, as indicated by P2 in the figure, was generated. The processing information stored in the processing control means 100 in this manner can be used as a clue to determine the cause of the chipping 18.

[0038] Incidentally, when the wafer 10 is arranged on the frame F via the tape T as described above, even if the wafer 10 divided by the cutting process performed in the dicing apparatus 2 is transported from the dicing apparatus 2 to the inspection apparatus 3 and placed and held so that the X and Y coordinates on the chuck table 21 of the dicing apparatus 2 correspond to the X and Y coordinates on the chuck table 32 of the inspection apparatus 3, the tape T may expand or contract, causing the X and Y coordinate information of the division lines 14 identified on the chuck table 21 of the dicing apparatus 2 to not accurately match the X and Y coordinate information of the cut grooves 16 identified on the inspection apparatus 3. In particular, when the devices 12 on the wafer 10 are minute devices measuring 1 mm square or less, the division lines 14 identified by the X and Y coordinates on the dicing apparatus 2 and the cut grooves 16 identified by the X and Y coordinates on the inspection apparatus 3 may not match and may become misaligned, resulting in a problem of inappropriate information exchange. To address such problems, in this embodiment, when the wafer 10 is processed by the dicing apparatus 2 and inspected by the inspection apparatus 3, the above inspection is performed using the addresses converted by the processing address conversion unit 120 of the processing control means 100 of the dicing apparatus 2 and the inspection address conversion unit 210 of the inspection control means 200 of the inspection apparatus 3. As described above, the addresses converted by the inspection address conversion unit 210 correspond to the addresses converted by the processing address conversion unit 120 arranged in the processing control means 100 of the dicing apparatus 2. By using the addresses converted by the inspection address conversion unit 210 and the addresses converted by the processing address conversion unit 120, information can be appropriately exchanged without being affected by deviations in the X and Y coordinates, and it becomes possible to correlate and verify the area where a defect has occurred in the cut groove 16 imaged by the inspection means 36 with the processing information stored in the information storage unit 110 of the processing control means 100.

[0039] In the above-described embodiment, the wafer 10 is imaged by the inspection means 36 of the inspection apparatus 3, and processing information corresponding to the area specified by the X-coordinate, Y-coordinate, or address information is extracted from the processing control means 100 of the dicing apparatus 2. However, in the present embodiment, the inspection control means 200 is provided with an image storage unit 220 that stores the image of the wafer 10 imaged by the inspection means 36 in terms of X-coordinate and Y-coordinate, and the processing control means 100 can also use the communication means 5 to extract an image corresponding to the processing information stored in correspondence with the X-coordinate and Y-coordinate from the image storage unit 220 of the inspection control means 200. With this configuration, after the inspection by the inspection apparatus 3 is completed, if a possible cutting abnormality is found by referring to the processing information stored in the processing control means 100 of the dicing apparatus 2, an image of the position on the wafer 10 corresponding to the X-coordinate and Y-coordinate on which the possible abnormality was found can be extracted from the image storage unit 220 provided in the inspection control means 200. This makes it possible to more efficiently find an abnormality in the wafer 10 and clarify its cause. In this case, too, it is possible to specify the location of a possible abnormality or the location of an image to be extracted based on address information instead of X and Y coordinates.

[0040] Furthermore, a TEG (Test Elementary Group) that evaluates and manages the devices 12 formed on the wafer 10 may be arranged on the planned dividing line 14 of the wafer 10, and the position where the TEG is arranged may be stored in the information storage unit 110 of the processing control means 100 in correspondence with the X and Y coordinates as part of the above processing information, and may be included in the processing information extracted from the processing control means 100 during the inspection performed by the inspection device 3. [Explanation of symbols]

[0041] 2: Dicing equipment 20: Device housing 21: Chuck table 22:Cutting means 22a: Cutting water supply nozzle 22b: Spindle unit 22c: Rotating spindle 22d: Cutting blade 22e: Blade cover 22f: Cutting water supply port 23: Cassette 24: Temporary table 25: Carrying in / out means 26: Means of transport 27: Cleaning method 28: Cleaning transport means 29: Imaging means 3: Inspection equipment 3a: Base 3b: Guide rail 3c: Vertical wall section 3d: horizontal wall 32: Test object holding means 32a: X-axis movable plate 32b: Y-axis movable plate 32c: Guide rail 32d: Post 32e: Cover plate 32F: Chuck table 32g: Clamp 33: Transportation 34: X-axis inspection feed means 341: Motor 342: Ball screw 35: Y-axis inspection feed means 351: Motor 352: Ball screw 36: Inspection method 4: Server 5: Means of communication 52, 54: Internet 10: Wafer 12: Device 14: Planned division line 16: Cutting groove 18: Chipping 100: Processing control means 110: Information storage section 120: Processing address conversion section 200: Inspection control means 210: Inspection address conversion unit 220: Image storage unit

Claims

1. An information exchange system for exchanging information between a processing device and an inspection device, The processing device includes at least a workpiece holding means for holding a workpiece, a processing means for processing the workpiece held by the workpiece holding means, an X-axis processing feed means for relatively feeding the workpiece holding means and the processing means in the X-axis direction, a Y-axis processing feed means for relatively feeding the workpiece holding means and the processing means in the Y-axis direction perpendicular to the X-axis direction, and a processing control means, The inspection device comprises at least an inspection object holding means for holding an inspection object processed by the processing device, an inspection means for taking an image of the inspection object held by the inspection object holding means and inspecting the processing state, an X-axis inspection feed means for relatively inspecting the inspection object holding means and the inspection means in the X-axis direction, a Y-axis inspection feed means for relatively inspecting the inspection object holding means and the inspection means in the Y-axis direction perpendicular to the X-axis direction, and an inspection control means, The processing control means specifies an area to be processed on the workpiece by X-coordinate and Y-coordinate, and includes an information storage unit that stores processing information obtained by processing by X-coordinate and Y-coordinate, The inspection control means extracts processing information corresponding to the X coordinate and Y coordinate of the object to be inspected, the image of which has been captured by the inspection means, from the processing control means; The inspection control means includes an image storage unit that stores an image of the object to be inspected captured by the inspection means in terms of X and Y coordinates, The processing control means is an information exchange system that extracts an image corresponding to processing information specified by X and Y coordinates from the image storage unit of the inspection control means.

2. The processing control means includes a processing address conversion unit that converts X coordinates and Y coordinates into addresses, The inspection control means includes an inspection address conversion unit that converts X and Y coordinates into addresses, 2. An information exchange system according to claim 1, wherein an address is used instead of X and Y coordinates.

3. The workpiece is a wafer having a surface on which a plurality of devices are formed, the surface being partitioned by planned dividing lines, and the wafer is supported via tape on a frame having an opening for accommodating the wafer; 3. The information exchange system according to claim 1, wherein the processing means is a cutting means having a rotatable cutting blade, and the processing performed on the wafer is a cutting process for cutting the planned dividing lines.

4. An information exchange system according to any one of claims 1 to 3, wherein X and Y coordinates are set for each planned division line, or the X and Y coordinates are converted into addresses.

5. An information exchange system as described in claim 1, in which an ID is arranged in relation to the workpiece, and information including the processing device that processed the workpiece, the date and time of processing, the location of processing, the inspection device that inspected the object to be inspected, the date and time of inspection, and the location of inspection is identified by the ID.

Images