Warpage correction system and manufacturing system

Abstract

To provide a warp correction system including a warp correction device independent of a processing device, the warp correction system that facilitates the transfer of formed substrates from the warp correction device to the processing device, and to provide a manufacturing system including the warp correction system.SOLUTION: The warp correction system has a warp correction device and a relay unit. The warp correction device corrects warp of a first formed substrate to produce a second formed substrate. The relay unit is located between the warp correction device and a processing device outside the warp correction device. The processing device processes the second formed substrate. The relay unit includes a first transport mechanism that receives the second formed substrate from the warp correction device and transports the second formed substrate to the processing device.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a warp correction system and a manufacturing system. [Background technology]

[0002] Japanese Patent Laid-Open Publication No. 2014-192434 (Patent Document 1) discloses a marking device that includes a droplet ejection device and a substrate warpage correction device. In this marking device, the substrate warpage correction device corrects the warpage of the substrate, and then the droplet ejection device applies marking to the substrate (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-192434 Summary of the Invention [Problem to be solved by the invention]

[0004] There are cases where a warpage correction device that corrects warpage of a shaped substrate and a processing device that processes the shaped substrate after warpage correction are not integrated. In such cases, for example, the shaped substrate after warpage correction is manually transported from the warpage correction device to the processing device. However, manual transport of the shaped substrate is not necessarily efficient. Patent Document 1 does not disclose a solution to such problems that arise when the warpage correction device is independent from the processing device.

[0005] The present invention has been made to solve such problems, and its object is to provide a warpage correction system that includes a warpage correction device that is independent of a processing device, and that allows easy transport of a molded substrate from the warpage correction device to the processing device, and a manufacturing system that includes the warpage correction system. [Means for solving the problem]

[0006] A warpage correction system according to one aspect of the present invention includes a warpage correction device and an intermediary unit. The warpage correction device corrects warpage of a first shaped substrate and produces a second shaped substrate. The intermediary unit is disposed between the warpage correction device and a processing device external to the warpage correction device. The processing device processes the second shaped substrate. The intermediary unit includes a first transport mechanism that receives the second shaped substrate from the warpage correction device and transports the second shaped substrate to the processing device.

[0007] A manufacturing system according to another aspect of the present invention includes the warp correction system and the processing device. The processing device includes a storage unit and a control unit. The storage unit stores a second shaped substrate. The second shaped substrate transported by the first transport mechanism is stored in the storage unit. The control unit determines whether or not to receive the second shaped substrate depending on the storage state of the second shaped substrate in the storage unit. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a warpage correction system including a warpage correction device independent of a processing device, which facilitates the transport of a molded substrate from the warpage correction device to the processing device, and a manufacturing system including the warpage correction system. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a front view schematically showing a manufacturing system including a warp correction system. [Figure 2] FIG. 2 is a perspective view schematically showing a warp correction device. [Figure 3] FIG. 2 is a plan view schematically showing a warp correction device. [Figure 4] FIG. 2 is a diagram schematically illustrating a cross section in a state in which the lower member and the upper member are closed. [Figure 5] FIG. 2 is a plan view schematically showing a jig. [Figure 6] FIG. 2 is a front view schematically showing the jig. [Figure 7] FIG. 7 is a diagram schematically showing a cross section taken along line VII-VII in FIG. 5. [Figure 8] FIG. 2 is a plan view schematically showing a first transport mechanism. [Figure 9] FIG. 9 is a diagram schematically showing a cross section taken along line IX-IX in FIG. 8. [Figure 10] 10 is a flowchart showing the operation of transporting the second molded substrate from the warp correction device to the cutting device. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment according to one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail below with reference to the drawings. Note that the same or corresponding parts in the drawings are designated by the same reference numerals, and their description will not be repeated. Furthermore, for ease of understanding, each drawing is drawn schematically with objects appropriately omitted or exaggerated.

[0011] [1. Configuration] <1-1. Manufacturing system configuration> 1 is a front view schematically showing a manufacturing system 1 including a warp correction system 5 according to the present embodiment. In each drawing described in this specification, the X-axis and the Y-axis each indicate a common direction.

[0012] 1, the manufacturing system 1 includes a warpage correction system 5 and a cutting device 20. In the manufacturing system 1, the warpage of the molded substrate is corrected, and the molded substrate whose warpage has been corrected is cut to manufacture a plurality of electronic components.

[0013] In a molded substrate, for example, a semiconductor chip fixed on a metal frame is resin-encapsulated. In such a molded substrate, warpage may occur due to, for example, a difference between the thermal shrinkage rate of the metal frame and the thermal shrinkage rate of the resin. In the warpage correction system 5, the warpage of the molded substrate is corrected. In this specification, the molded substrate before the warpage is corrected is also referred to as a "first molded substrate," and the molded substrate after the warpage is corrected is also referred to as a "second molded substrate."

[0014] Examples of molded substrates include substrates or lead frames to which semiconductor chips are fixed and resin-sealed, and substrates to which capacitors, resistors, etc. Examples of molded substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-leaded) package substrates.

[0015] The warpage correction system 5 includes a warpage correction device 10 and an intermediary unit 30. The warpage correction device 10 is configured to correct the warpage of a first shaped substrate S1 and manufacture a second shaped substrate S2. The intermediary unit 30 is fixed to the warpage correction device 10 and includes a first transport mechanism 300 and a jig 350. The positioning of the warpage correction device 10 with respect to the cutting device 20 is performed via the jig 350. The first transport mechanism 300 is configured to receive the second shaped substrate S2 from the warpage correction device 10 and transport the received second shaped substrate S2 to the cutting device 20.

[0016] That is, the warpage correction system 5 is configured to correct the warpage of the first shaped substrate S1 to manufacture the second shaped substrate S2, and to transport the second shaped substrate S2 to the cutting device 20. The second shaped substrate S2 transported to the cutting device 20 is stored in a magazine included in the second storage section 210 of the cutting device 20. The warpage correction device 10 and the relay section 30 will be described in detail later.

[0017] The cutting device 20 is configured to cut the second molded substrate S2 to separate the second molded substrate S2 into a plurality of electronic components. In the cutting device 20, for example, the second molded substrate S2 placed on a cutting table (not shown) is cut by a rotary blade (not shown). This produces a plurality of electronic components (cut products).

[0018] Suppose that the relay section 30 is not fixed to the warpage correction device 10. In this case, there is no mechanism for transporting the second shaped substrate S2 manufactured by the warpage correction device 10 to the cutting device 20. In such a case, for example, the second shaped substrate S2 is manually transported from the warpage correction device 10 to the cutting device 20. However, manually transporting the second shaped substrate S2 is not necessarily efficient.

[0019] In the warpage correction system 5 included in the manufacturing system 1, the first transport mechanism 300 included in the relay section 30 receives the second shaped substrate S2 from the warpage correction device 10 and transports the received second shaped substrate S2 to the cutting device 20. Therefore, according to the warpage correction system 5, the second shaped substrate S2 is transported from the warpage correction device 10 to the cutting device 20 by the first transport mechanism 300, so that even if the warpage correction device 10 is independent from the cutting device 20, the second shaped substrate S2 can be easily transported to the cutting device 20.

[0020] The warp correction device 10 includes a first control device 160. The first control device 160 includes a first communication unit 161 and a first control unit 162.

[0021] The first communication unit 161 is configured to communicate with, for example, a second communication unit 201 (described later) included in the cutting device 20 via a communication line L1. Note that the first communication unit 161 does not necessarily need to communicate with the second communication unit 201 via the communication line L1, and may communicate with the second communication unit 201 by wireless communication. Furthermore, the information communicated between the first communication unit 161 and the second communication unit 201 may include not only signals described later, but also at least some of the following: error information in the warpage correction device 10 or the cutting device 20; size information of the object (first shaped substrate S1) input to the warpage correction device 10; condition information such as the heating time and cooling time in the warpage correction device 10; size information of the object (second shaped substrate S2) input to the cutting device 20; and processing condition information such as the cutting conditions in the cutting device 20.

[0022] The first control unit 162 includes, for example, a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory). The first control unit 162 is configured to control the components in the warp correction device 10 and the relay unit 30 in accordance with information processing. The first control unit 162 controls, for example, the first conveying mechanism 300 based on information acquired by the first communication unit 161.

[0023] The cutting device 20 includes a second control device 200. The second control device 200 includes a second communication unit 201 and a second control unit 202.

[0024] The second communication unit 201 is configured to communicate with, for example, the first communication unit 161 included in the warp correction device 10 through a communication line L1. Note that the second communication unit 201 does not necessarily need to communicate with the first communication unit 161 through the communication line L1, and may communicate with the first communication unit 161 by wireless communication.

[0025] The second control unit 202 includes, for example, a CPU, a RAM, and a ROM. The second control unit 202 is configured to control each component in the cutting device 20 in accordance with information processing. The second control unit 202 controls, for example, the second communication unit 201 to transmit information to the warpage correction device 10.

[0026] When the warp correction system 5 is ready to transport the second shaped substrate S2 to the cutting device 20, a signal requesting receipt of the second shaped substrate S2 (hereinafter also referred to as a "receive request signal") is sent from the first communication unit 161 to the second communication unit 201. If there is sufficient free space in the magazine contained in the second storage unit 210, a signal indicating that the second shaped substrate S2 can be received (hereinafter "receive ready signal") is sent from the second communication unit 201 to the first communication unit 161. In response to the receive ready signal being received by the first communication unit 161, the first transport mechanism 300 transports the second shaped substrate S2 to the cutting device 20.

[0027] In this way, in the manufacturing system 1, the second shaped substrate S2 is transported from the warp correction device 10 to the cutting device 20 taking into consideration the available space in the magazine contained in the second storage section 210. Therefore, according to the manufacturing system 1, the second shaped substrate S2 can be transported from the warp correction device 10 to the cutting device 20 at an appropriate timing. The transport operation of the second shaped substrate S2 from the warp correction device 10 to the cutting device 20 will be described in detail later.

[0028] <1-2. Composition of warpage correction device> Fig. 2 is a perspective view schematically showing a warpage correction apparatus 10 according to the present embodiment. Fig. 3 is a plan view schematically showing the warpage correction apparatus 10. Referring to Figs. 2 and 3, the warpage correction apparatus 10 is configured to correct the warpage of a first molded substrate S1 and produce a second molded substrate S2.

[0029] The warpage correction device 10 includes a first storage section 100, an inlet rail section 110, a heating section 120, a cooling section 130, an outlet rail section 140, and a second transport mechanism 150. The second transport mechanism 150 includes transport mechanisms 151, 154, and 157. In this embodiment, a configuration is adopted in which a plurality of (specifically, two) first shaped substrates S1 are processed at once in each of the heating section 120 and the cooling section 130, but a configuration in which one first shaped substrate S1 or three or more first shaped substrates S1 are processed at once in each of the heating section 120 and the cooling section 130 may also be adopted. In FIG. 2, the second transport mechanism 150 is omitted.

[0030] The first storage section 100 includes, for example, a plurality of magazines 101. The magazines 101 store a plurality of first shaped substrates S1. The first shaped substrates S1 stored in the magazines 101 are supplied to the loading rail section 110.

[0031] The first shaped substrate S1 supplied to the loading rail section 110 is transported from the loading rail section 110 to the heating section 120 by the transport mechanism 151. The transport mechanism 151 includes, for example, a plurality of (e.g., two) suction sections 152. Each suction section 152 holds one first shaped substrate S1 by suctioning it. The transport mechanism 151 holds a plurality of first shaped substrates S1 by, for example, sequentially suctioning the first shaped substrates S1 that are sequentially supplied to the loading rail section 110.

[0032] The heating unit 120 includes a lower member 121 and an upper member 122. The lower member 121 and the upper member 122 each include a heater. The lower member 121 and the upper member 122 face each other in the up-down direction. A plurality of (for example, two) first molded substrates S1 are placed on the lower member 121. The lower member 121 is configured to rise and fall. When the lower member 121 rises, a part of the upper surface of the lower member 121 (specifically, the outer peripheral upper surface) comes into contact with the lower surface of the upper member 122, and the lower member 121 and the upper member 122 overlap.

[0033] FIG. 4 is a diagram schematically illustrating a cross section of the lower member 121 and the upper member 122 in a closed state. As shown in FIG. 4, each recess C1 of the lower member 121 is closed by the upper member 122, thereby forming a plurality (two) rectangular parallelepiped internal spaces V1 within the heating unit 120. Each internal space V1 is, for example, a closed space. Here, a closed space refers to a sealed space. Note that the internal space V1 does not necessarily have to be a sealed space. The internal space V1 may be, for example, a space surrounded by a recess capable of accommodating the first molded substrate S1 and a lid portion that covers at least a portion of the recess.

[0034] A first molded substrate S1 is disposed in each of the multiple internal spaces V1. In the present embodiment, the first molded substrate S1 is disposed in the internal space V1 so that the resin portion (the black portion in FIG. 4) is located on the lower side (so that the substrate portion is located on the upper side). However, the first molded substrate S1 may be disposed so that the resin portion is located on the upper side (so that the substrate portion is located on the lower side). The height H1 of each internal space V1 is, for example, longer than the thickness of the first molded substrate S1 in an unwarped state. The first molded substrate S1 does not come into contact with the upper member 122 and is not pressurized by the upper member 122, except when excessive warpage occurs. Therefore, when the lower member 121 and the upper member 122 are closed, no more force than necessary is applied to the first molded substrate S1.

[0035] With the lower member 121 and the upper member 122 closed, heaters 124 and 123 are located above and below the internal space V1, respectively. The internal space V1 is heated by the heaters 124 and 123. The first molded substrate S1 placed in the internal space V1 is also heated by the heaters 124 and 123. Through this heating, the resin portion of the first molded substrate S1 is softened.

[0036] The time for which the first shaped substrate S1 is heated in the internal space V1 is, for example, the time required for the temperature of the internal space V1 to stabilize and for the entire area of ​​the first shaped substrate S1 to be heated approximately evenly. Note that, in order to keep the internal space V1 warm, the lower member 121 and the upper member 122 are closed at all times except when the first shaped substrate S1 is carried into the heating unit 120 and when the first shaped substrate S1 is carried out from the heating unit 120.

[0037] In the warpage correction device 10, the first shaped substrate S1 is heated while being placed in the internal space V1 of the heating section 120. Therefore, the warpage correction device 10 can improve the heating efficiency of the first shaped substrate S1 compared to, for example, a case where the upper part of the heating section 120 is entirely open. Furthermore, the warpage correction device 10 does not apply more force than necessary to the first shaped substrate S1 when heating the first shaped substrate S1, thereby reducing the possibility of the first shaped substrate S1 being damaged.

[0038] Moreover, in the warp correction device 10, the internal space V1 is formed in a state in which the lower member 121 and the upper member 122 are closed. Therefore, according to the warp correction device 10, by releasing the closed state of the lower member 121 and the upper member 122, it is possible to easily place the first shaped substrate S1 in the internal space V1 and remove the first shaped substrate S1 from the internal space V1.

[0039] Furthermore, according to the warp correction device 10, the first molded substrate S1 is placed in the recess C1, so that, for example, when the lower member 121 and the upper member 122 are stacked on top of each other by raising the lower member 121, the possibility of the first molded substrate S1 being misaligned in the horizontal direction when the lower member 121 is raised or lowered can be reduced.

[0040] 2 and 3, the heated first shaped substrate S1 is transported from the heating section 120 to the cooling section 130 by the transport mechanism 154. The transport mechanism 154 does not suction the first shaped substrate S1 but mechanically holds the first shaped substrate S1. This is to prevent suction marks that may be caused by suction-holding the resin portion of the heated and softened first shaped substrate S1 from remaining.

[0041] The cooling unit 130 includes a lower member 131 and an upper member 132. The lower member 131 and the upper member 132 each include a portion of a tubular flow path (not shown) through which a low-temperature heat medium supplied from a chiller circulates. The lower member 131 and the upper member 132 face each other in the vertical direction. A plurality of (e.g., two) first shaped substrates S1 are arranged on the lower member 131. The lower member 131 is configured to rise and fall. When the lower member 131 rises, the upper surface of the first shaped substrate S1 arranged on the lower member 131 comes into contact with the lower surface of the upper member 132, and the lower member 131 and the upper member 132 overlap with the first shaped substrate S1 sandwiched therebetween. The first shaped substrate S1 is pressurized by the lower member 131 and the upper member 132 in this vertically overlapping state. The first shaped substrate S1 is cooled by the cooling section 130 while being pressed by the lower member 131 and the upper member 132. This corrects the warp of the first shaped substrate S1, and a second shaped substrate S2 is produced.

[0042] The second shaped substrate S2 manufactured through cooling by the cooling section 130 is transported from the cooling section 130 to the unloading rail section 140 by the transport mechanism 157. The transport mechanism 157 includes, for example, a plurality of (e.g., two) suction sections 158. Each suction section 158 holds the second shaped substrate S2 by suction. The transport mechanism 157 holds the plurality of second shaped substrates S2 by, for example, sequentially suctioning the second shaped substrates S2 arranged on the lower member 131 of the cooling section 130. The second shaped substrate S2 transported to the unloading rail section 140 is transported to the first transport mechanism 300 of the relay section 30.

[0043] <1-3. Relay section configuration> As described above, the relay section 30 includes the first transport mechanism 300 and the jig 350. First, the configuration of the jig 350 will be described, and then the configuration of the first transport mechanism 300 will be described.

[0044] Fig. 5 is a plan view schematically showing the jig 350. Fig. 6 is a front view schematically showing the jig 350. Fig. 7 is a view schematically showing the VII-VII cross section of Fig. 5. As described above, the warp correction device 10 is positioned relative to the cutting device 20 via the jig 350. In Figs. 6 and 7, the casters of the cutting device 20 and the legs that support the device are indicated by dotted lines.

[0045] 5, 6 and 7, the jig 350 includes a first positioning member 360, a second positioning member 370, and a shaft receiving member 380. Each of the first positioning member 360 and the second positioning member 370 is fixed to the warp correction device 10. On the other hand, the shaft receiving member 380 is fixed to the cutting device 20.

[0046] The first positioning member 360 is a lower end of the end of the warpage correction device 10 on the cutting device 20 side in the X-axis direction, and is fixed with a bolt to one end in the Y-axis direction (the front end of the warpage correction device 10). The first positioning member 360 includes a shaft 361 and an L-shaped member 362. The shaft 361 is a rod-shaped member extending in the X-axis direction. The L-shaped member 362 includes two surfaces that are perpendicular to each other, and one surface is fixed to the warpage correction device 10 with a bolt. The shaft 361 is fixed to the other surface. That is, the shaft 361 is fixed to the warpage correction device 10 via the L-shaped member 362.

[0047] The second positioning member 370 is fixed by a bolt to the lower end of the end of the warp correction device 10 on the cutting device 20 side in the X-axis direction and to the other end in the Y-axis direction (the rear end of the warp correction device 10). The second positioning member 370 includes a shaft 371, a jack bolt 372, and a plate-shaped member 373. The shaft 371 is a rod-shaped member extending in the X-axis direction. The jack bolt 372 is attached to the tip of the shaft 371 and is configured to expand and contract relative to the shaft 371 in the X-axis direction. The plate-shaped member 373 is fixed to the warp correction device 10 by a bolt, and the shaft 371 is fixed to the plate-shaped member 373. That is, each of the shaft 371 and the jack bolt 372 is fixed to the warp correction device 10 via the plate-shaped member 373.

[0048] The shaft receiving member 380 includes a fixing portion 381 and a receiving portion 382. The fixing portion 381 has a shape extending in the X-axis direction, and is fixed to the square pipe 220 of the cutting device 20 with bolts. The fixing portion 381 has three faces facing the top surface and both side surfaces of the square pipe 220 extending in the X-axis direction. The fixing portion 381 is fixed to the square pipe 220 with bolts, with the three faces facing the top surface and both side surfaces of the square pipe 220, respectively.

[0049] The receiving part 382 is fixed to the lower end of the fixed part 381. The receiving part 382 has a shape extending in the X-axis direction. A recess C2 is formed at the end of the receiving part 382 on the side of the warp correction device 10. The tip of the shaft 361 fits into the recess C2. This determines the position of the warp correction device 10 relative to the cutting device 20 in each of the X-axis direction and the Y-axis direction.

[0050] Furthermore, by adjusting the extension / contraction state of the jack bolt 372 with the tip of the shaft 361 fitted in the recess C2, the position of the warp correction device 10 in the rotation direction around the tip of the shaft 361 as the center of rotation is determined. In this manner, each of the first positioning member 360 and the second positioning member 370 is not fixed to the cutting device 20. In this embodiment, the extension / contraction state of the jack bolt 372 is adjusted so that the warp correction device 10 and the cutting device 20 are parallel to each other.

[0051] Fig. 8 is a plan view schematically showing the first transport mechanism 300. Fig. 9 is a diagram schematically showing a cross section taken along line IX-IX in Fig. 8.

[0052] 8 and 9, the first transport mechanism 300 includes a base plate 305, a pair of relay rails 310, a pusher 321, an electric actuator 320, a first sensor 340, and a second sensor 341. The base plate 305 is a plate-shaped member that extends in the X-axis direction. The pair of relay rails 310, the electric actuator 320, and the first sensor 340 are each fixed to the base plate 305.

[0053] The pair of relay rails 310 extend in the X-axis direction and are arranged on an extension line of the discharge-side rail section 140 of the warp correction device 10. The ends of the pair of relay rails 310 on the cutting device 20 side are located in the vicinity of the second storage section 210 of the cutting device 20. The second shaped substrate S2 manufactured in the warp correction device 10 is transported from the discharge-side rail section 140 to the pair of relay rails 310. The second shaped substrate S2 is transported to approximately the center in the X-axis direction of the pair of relay rails 310, for example, by a pusher (not shown) that transports the second shaped substrate S2 placed on the discharge-side rail section 140 in the X-axis direction.

[0054] The pusher 321 is configured to move in the X-axis direction and transport the second molded substrate S2 placed on the relay rail 310. The pusher 321 is attached to an electric actuator 320.

[0055] Electric actuator 320 extends in the X-axis direction and includes, for example, a ball screw, a motor that drives the ball screw, and a linear guide (all not shown). A base of pusher 321 is fixed to a moving section that moves in the X-axis direction as the ball screw is driven. That is, pusher 321 moves in the X-axis direction as the motor included in electric actuator 320 is driven. Pusher 321 transports second shaped substrate S2 and stores second shaped substrate S2 in a magazine included in second storage section 210.

[0056] The first sensor 340 is disposed, for example, near the boundary between the unloading rail section 140 and the pair of relay rails 310. The first sensor 340 is configured to detect that the second molded substrate S2 has been transferred from the warpage correction apparatus 10 to the first transport mechanism 300. A detection signal from the first sensor 340 is transmitted to the first control section 162 of the warpage correction apparatus 10.

[0057] The second sensor 341 is disposed near the end of the pair of relay rails 310 on the cutting device 20 side. The second sensor 341 is configured to detect that the second molded substrate S2 has been transferred from the first transport mechanism 300 to the second accommodation section 210 of the cutting device 20. A detection signal from the second sensor 341 is transmitted to the first control section 162 of the warpage correction device 10.

[0058] The first conveyance mechanism 300 is covered from above with a cover 330. The cover 330 is made of, for example, acrylic. In the space surrounded by the base plate 305 and the cover 330, for example, a pair of relay rails 310, a pusher 321, and an electric actuator 320 are arranged. Specifically, the relay unit 30 is arranged such that the pair of relay rails 310 of the first conveyance mechanism 300 are connected in parallel to the discharge-side rail unit 140 of the warp correction device 10 and the cutting device 20, which are arranged parallel to each other by a jig 350, and the base plate 305 is bridged over the relay unit 30 so that the pair of relay rails 310 of the first conveyance mechanism 300 are connected in parallel to the discharge-side rail unit 140 of the warp correction device 10 and are connected to a position where the second storage unit 210 of the cutting device 20 can be arranged. In this way, the first conveyance mechanism 300 is not fixed to the cutting device 20.

[0059] [2. Operation] 10 is a flowchart showing the transport operation of the second shaped substrate S2 from the warpage correction apparatus 10 to the cutting apparatus 20. The process shown in the flowchart on the left side is executed by the first control unit 162 of the warpage correction apparatus 10 after the passage of the second shaped substrate S2 is detected by the first sensor 340. The process shown in the flowchart on the right side is executed by the second control unit 202 of the cutting apparatus 20.

[0060] 10, first control unit 162 controls first communication unit 161 to transmit a receipt request signal to disconnection device 20 (step S100). First control unit 162 determines whether a receipt ready signal has been received from disconnection device 20 via first communication unit 161 (step S110). If it is determined that a receipt ready signal has not been received (NO in step S110), first control unit 162 waits until a receipt ready signal is received.

[0061] On the other hand, when it is determined that the ready-to-receive signal has been received (YES in step S110), the first control unit 162 controls the electric actuator 320 to start transporting the second shaped substrate S2 placed on the pair of relay rails 310 to the cutting device 20 (step S120). This causes the pusher 321 to start transporting the second shaped substrate S2.

[0062] The first control unit 162 determines whether or not a detection signal has been received from the second sensor 341 through the first communication unit 161 (step S130). If it is determined that a detection signal has not been received from the second sensor 341 (NO in step S130), the first control unit 162 waits until a detection signal is received from the second sensor 341.

[0063] On the other hand, when it is determined that a detection signal has been received from the second sensor 341 (YES in step S130), the first control unit 162 controls the first communication unit 161 to send a signal indicating that the transport of the second shaped substrate S2 to the cutting device 20 has been completed (hereinafter also referred to as a "transport completion signal") to the cutting device 20 (step S140). This completes the transport of the second shaped substrate S2 to the magazine included in the second storage unit 210 of the cutting device 20.

[0064] 10, the second control unit 202 determines whether or not a reception request signal has been received from the warp correction device 10 through the second communication unit 201 (step S200). If it is determined that a reception request signal has not been received (NO in step S200), the second control unit 202 waits until a reception request signal is received.

[0065] On the other hand, when it is determined that a receipt request signal has been received (YES in step S200), the second control unit 202 determines whether or not a predetermined amount of free space exists in any of the multiple magazines included in the second storage unit 210 (step S210). Note that the predetermined amount of free space is a predetermined space, and may be a space that can store one second shaped substrate S2, or a space that can store multiple second shaped substrates S2.

[0066] If it is determined that there is no predetermined free space in any of the magazines (NO in step S210), second control unit 202 waits until the predetermined free space becomes available in the magazines. In parallel with the processing shown in this flowchart, cutting device 20 removes second shaped substrate S2 from second storage unit 210 and performs processing to cut second shaped substrate S2. By removing second shaped substrate S2 from second storage unit 210, the free space in the magazine included in second storage unit 210 increases.

[0067] On the other hand, if it is determined in step S210 that a predetermined amount of free space exists in any of the magazines (YES in step S210), the second control unit 202 controls the second accommodation unit 210 so that the magazine having the predetermined amount of free space is positioned to receive the second molded substrate S2 (step S220). After that, the second control unit 202 controls the second communication unit 201 so as to transmit a ready-to-receive signal to the warp correction device 10 (step S230).

[0068] The second control unit 202 determines whether or not a transport completion signal has been received from the warp correction device 10 through the second communication unit 201 (step S240). If it is determined that a transport completion signal has not been received (NO in step S240), the second control unit 202 waits until a transport completion signal is received.

[0069] On the other hand, if it is determined that the transport completion signal has been received (YES in step S240), the process shown in this flowchart ends. This completes the transport of the second shaped substrate S2 to the magazine included in the second storage unit 210 of the cutting device 20, and the second control unit 202 can recognize that the transport of the second shaped substrate S2 has been completed.

[0070] In the warp correction system 5, when the first sensor 340 detects the receipt of the second shaped substrate S2, a receipt request signal is sent to the cutting device 20. Therefore, according to the warp correction system 5, a signal requesting receipt of the second shaped substrate S2 is sent to the cutting device 20 before the second shaped substrate S2 is transported to the cutting device 20, so that the second shaped substrate S2 can be transported according to the status of the cutting device 20.

[0071] Furthermore, in the warpage correction system 5, the first conveyance mechanism 300 conveys the second shaped substrate S2 to the cutting device 20 in response to the first communication unit 161 receiving the ready-to-receive signal from the cutting device 20. Therefore, according to the warpage correction system 5, the second shaped substrate S2 is conveyed after the ready-to-receive signal is received, so that the second shaped substrate S2 can be conveyed to the cutting device 20 at an appropriate timing.

[0072] Furthermore, in the warpage correction system 5, when the second sensor 341 detects the transport of the second shaped substrate S2, a transport completion signal is transmitted to the cutting device 20. Therefore, the warpage correction system 5 can make the cutting device 20 recognize that the transport of the second shaped substrate S2 to the cutting device 20 has been completed.

[0073] Furthermore, in the manufacturing system 1, whether or not the cutting device 20 can receive the second shaped substrate S2 is determined depending on the storage state of the second shaped substrate S2 in the second storage section 210 (the state of the empty space in the magazine). Therefore, according to the manufacturing system 1, it is possible to appropriately determine whether or not the cutting device 20 can receive the second shaped substrate S2.

[0074] [3. Features] As described above, in the warpage correction system 5, the first transport mechanism 300 included in the relay section 30 receives the second shaped substrate S2 from the warpage correction device 10 and transports the received second shaped substrate S2 to the cutting device 20. Therefore, according to the warpage correction system 5, the second shaped substrate S2 is transported from the warpage correction device 10 to the cutting device 20 by the first transport mechanism 300, so that even if the warpage correction device 10 is independent from the cutting device 20, the second shaped substrate S2 can be easily transported to the cutting device 20.

[0075] The warpage correction system 5 is an example of a "warpage correction system" in the present invention. The warpage correction device 10 is an example of a "warpage correction device" in the present invention, the relay unit 30 is an example of a "relay unit" in the present invention, and the first conveying mechanism 300 is an example of a "first conveying mechanism" in the present invention. The first control unit 162 is an example of a "first control unit" in the present invention, and the first communication unit 161 is an example of a "communication unit" in the present invention. The first sensor 340 is an example of a "first sensor" in the present invention, and the second sensor 341 is an example of a "second sensor" in the present invention. The pair of relay rails 310 is an example of a "pair of rails" in the present invention, and the pusher 321 is an example of a "conveying member" in the present invention.

[0076] The first storage section 100 is an example of the "first storage section" in the present invention, the heating section 120 is an example of the "heating section" in the present invention, and the cooling section 130 is an example of the "cooling section" in the present invention. The second conveying mechanism 150 is an example of the "second conveying mechanism" in the present invention. The second storage section 210 is an example of the "second storage section" in the present invention. The cutting device 20 is an example of the "processing device" in the present invention. The manufacturing system 1 is an example of the "manufacturing system" in the present invention.

[0077] 4. Other Embodiments The concept of the above embodiment is not limited to the embodiment described above. An example of another embodiment to which the concept of the above embodiment can be applied will be described below.

[0078] <4-1> In the above embodiment, only one first transport mechanism 300 is provided between the warpage correction device 10 and the cutting device 20. However, the number of first transport mechanisms 300 is not limited to this. For example, a plurality of first transport mechanisms 300 may be provided between the warpage correction device 10 and the cutting device 20. For example, the plurality of first transport mechanisms 300 may be arranged so as to be aligned in the Y-axis direction, or the plurality of first transport mechanisms 300 may be arranged so as to be aligned in the height direction. This makes it possible to transport a plurality of second molded substrates S2 in parallel from the warpage correction device 10 to the cutting device 20.

[0079] <4-2> In the above embodiment, the second shaped substrate S2 is transported from the warp correction device 10 to the cutting device 20. However, the destination of the second shaped substrate S2 is not limited to this. The second shaped substrate S2 may be transported, for example, to a grinder that grinds the surface of the second shaped substrate S2, or to a laser marker that marks the surface of the second shaped substrate S2. In other words, the destination of the second shaped substrate S2 may be any processing device that processes the second shaped substrate S2.

[0080] <4-3> In the above embodiment, the amount of warpage of the second shaped substrate S2 transported to the unloading rail section 140 may be measured. For example, a measuring section for measuring the warpage of the second shaped substrate S2 may be provided near the unloading rail section 140, and the amount of warpage of the second shaped substrate S2 may be measured. The measuring section may be configured, for example, with a laser displacement meter. The laser displacement meter may move along the longitudinal or lateral direction of the second shaped substrate S2 to measure the amount of warpage of the second shaped substrate S2. For example, a configuration may be adopted in which the second shaped substrate S2 is transported to the relay section 30 when the amount of warpage of the second shaped substrate S2 is equal to or less than an allowable value, and the second shaped substrate S2 is not transported to the relay section 30 when the amount of warpage of the second shaped substrate S2 exceeds the allowable value. For example, if the discharge side rail portion 140 extends to the first storage section 100 and the amount of warping of the second molded substrate S2 exceeds the allowable value, the second molded substrate S2 may be stored in a magazine included in the first storage section 100.

[0081] The above describes exemplary embodiments of the present invention. That is, the detailed description and the accompanying drawings are disclosed for the purpose of illustrative explanation. Therefore, some of the components described in the detailed description and the accompanying drawings may be non-essential components for solving the problems. Therefore, just because these non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately recognized that these non-essential components are essential.

[0082] Furthermore, the above-described embodiment is merely an example of the present invention in all respects. Various improvements and modifications can be made to the above-described embodiment within the scope of the present invention. In other words, when implementing the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0083] [Note] This specification discloses various technical ideas including at least the following techniques.

[0084] <Technology 1> (composition) a warpage correction device that corrects warpage of the first molded substrate and produces a second molded substrate; a relay unit disposed between a processing device outside the warp correction device and the warp correction device, the processing device processes the second molded substrate; The warpage correction system includes a first transport mechanism in which the relay unit receives the second shaped substrate from the warpage correction device and transports the received second shaped substrate to the processing device.

[0085] (Effects, etc.) In this warpage correction system, a first transport mechanism included in the relay unit receives the second shaped substrate from the warpage correction device and transports the received second shaped substrate to the processing device. Therefore, according to this warpage correction system, since the second shaped substrate is transported from the warpage correction device to the processing device by the first transport mechanism, the second shaped substrate can be easily transported to the processing device even if the warpage correction device is independent from the processing device.

[0086] <Technology 2> (composition) a first control unit that controls the first transport mechanism; The warp correction system according to Technology 1 further comprises a first communication unit that communicates with the processing device.

[0087] (Effects, etc.) According to this warp correction system, the first control unit and the first communication unit are used, and the second molded substrate is transported from the warp correction device to the processing device by the first transport mechanism, so that the second molded substrate can be easily transported to the processing device even if the warp correction device is independent from the processing device.

[0088] <Technology 3> (composition) the relay unit further includes a first sensor that detects that the second molded substrate has been received from the warp correction device; The warp correction system described in Technology 2, wherein the first control unit controls the first communication unit to send a signal requesting receipt of the second molded substrate to the processing device in response to the first sensor detecting receipt of the second molded substrate.

[0089] (Effects, etc.) In this warp correction system, when the first sensor detects the receipt of the second shaped substrate, a signal requesting receipt of the second shaped substrate is sent to the processing device. Therefore, according to this warp correction system, a signal requesting receipt of the second shaped substrate is sent to the processing device before the second shaped substrate is transported to the processing device, so that the transport of the second shaped substrate can be realized according to the status of the processing device.

[0090] <Technology 4> (composition) The warp correction system according to Technology 2 or Technology 3, wherein the first control unit controls the first transport mechanism to transport the second shaped substrate to the processing device in response to the first communication unit receiving a signal from the processing device indicating that the second shaped substrate is ready to be received.

[0091] (Effects, etc.) In this warp correction system, the first conveying mechanism conveys the second shaped substrate to the processing device in response to the first communication unit receiving a signal from the processing device indicating that the second shaped substrate is ready to be received. Therefore, according to this warp correction system, the second shaped substrate is conveyed after the signal indicating that the second shaped substrate is ready to be received is received, so that the second shaped substrate can be conveyed to the processing device at an appropriate timing.

[0092] <Technology 5> (composition) the relay unit further includes a second sensor that detects that the second molded substrate has been transported to the processing device; The warp correction system according to any one of Techniques 2 to 4, wherein the first control unit controls the first communication unit to transmit a signal indicating that the transport of the second shaped substrate to the processing device has been completed in response to the second sensor detecting the transport of the second shaped substrate.

[0093] (Effects, etc.) In this warp correction system, when the second sensor detects the transport of the second shaped substrate, a signal indicating that the transport of the second shaped substrate to the processing device has been completed is transmitted to the processing device. Therefore, this warp correction system allows the processing device to recognize that the transport of the second shaped substrate to the processing device has been completed.

[0094] <Technology 5-2> (composition) The first transport mechanism is a pair of rails on which the second molded substrate is placed; and a transport member that transports the second molded substrate placed on the pair of rails.

[0095] (Effects, etc.) In this warpage correction system, the second shaped substrate received from the warpage correction device is placed on a pair of rails, and the transport member transports the second shaped substrate placed on the pair of rails to the processing device. Therefore, according to this warpage correction system, the second shaped substrate is transported from the warpage correction device to the processing device by the first transport mechanism, so that even if the warpage correction device is independent from the processing device, the second shaped substrate can be easily transported to the processing device.

[0096] <Technology 6> (composition) The warp correction device is a first accommodation section that accommodates the first molded substrate; a heating unit that heats the first molded substrate; a cooling unit that cools the first shaped substrate while the first shaped substrate is being pressed; a second transport mechanism that transports the first shaped substrate supplied from the first accommodation unit to the heating unit and transports the first shaped substrate heated by the heating unit to the cooling unit, The warpage correction system according to any one of Technology 1 to Technology 5, wherein the heating unit heats the first shaped substrate while the first shaped substrate is placed in an internal space formed in the heating unit.

[0097] (Effects, etc.) In the warp correction device included in this warp correction system, the first shaped substrate is heated while being placed in the internal space of the heating unit. Therefore, with this warp correction system, the heating efficiency of the first shaped substrate can be improved compared to, for example, a case where the upper part of the heating unit is entirely open. Furthermore, with this warp correction system, no more force than necessary is applied to the first shaped substrate when heating the first shaped substrate, thereby reducing the possibility of damage to the first shaped substrate.

[0098] <Technology 7> (composition) The warpage correction system according to technique 6, wherein the height of the internal space is longer than the height of the first molded substrate in a state where no warpage occurs.

[0099] (Effects, etc.) According to this warp correction system, the vertical length of the internal space of the heating section is longer than the thickness of the first shaped substrate in an unwarped state, thereby preventing the first shaped substrate from being subjected to more force than necessary when heating the first shaped substrate.

[0100] <Technology 8> (composition) the processing device includes a second accommodation unit that accommodates the second molded substrate; The warp correction system according to any one of Techniques 1 to 7, wherein the second shaped substrate transported by the first transport mechanism is accommodated in the second accommodation unit.

[0101] (Effects, etc.) In this warp correction system, the second shaped substrate transported by the first transport mechanism is accommodated in the second accommodation unit. Therefore, according to this warp correction system, the second shaped substrate is transported from the warp correction device to the processing device by the first transport mechanism, and the second shaped substrate is accommodated in the second accommodation unit, so that even if the warp correction device is independent from the processing device, the second shaped substrate can be easily accommodated in the second accommodation unit.

[0102] <Technology 9> (composition) The warp correction system according to technology 8; The processing device is provided, The manufacturing system further includes a second control unit configured to determine whether or not the second shaped substrate can be received depending on the storage state of the second shaped substrate in the second storage unit.

[0103] (Effects, etc.) In this manufacturing system, whether the processing device can receive the second shaped substrate is determined depending on the storage state of the second shaped substrate in the second storage unit. Therefore, this manufacturing system can appropriately determine whether the processing device can receive the second shaped substrate.

[0104] <Technology 10> (composition) the processing device further includes a second communication unit that communicates with the warp correction system, The manufacturing system described in Technology 9, wherein the second control unit controls the second communication unit to send a signal indicating that the second molded substrate is ready to be received to the warp correction system when it is determined that the second molded substrate is ready to be received.

[0105] (Effects, etc.) In this manufacturing system, when it is determined that the processing device is ready to receive the second shaped substrate, a signal (receivable signal) indicating that the second shaped substrate is ready to receive is transmitted from the processing device to the warp correction system. Therefore, according to this manufacturing system, the second shaped substrate can be transported from the warp correction system to the processing device only when the processing device is ready to receive the second shaped substrate. [Explanation of symbols]

[0106] 1 Manufacturing system, 5 Warp correction system, 10 Warp correction device, 20 Cutting device, 30 Relay unit, 100 First storage unit, 101 Magazine, 110 Loading side rail unit, 120 Heating unit, 121, 131 Lower member, 122, 132 Upper member, 123, 124 Heater, 130 Cooling unit, 140 Loading side rail unit, 150 Second conveying mechanism, 151, 154, 157 Conveying mechanism, 152, 158 Suction unit, 160 First control device, 161 First communication unit, 162 First control unit, 200 Second control device, 201 Second communication unit, 202 Second control unit, 210 Second storage unit, 220 Square pipe, 300 First conveying mechanism, 305 Base plate, 310 Relay rail, 320 Electric actuator, 321 Pusher, 330 cover, 340 first sensor, 341 second sensor, 350 jig, 360 first positioning member, 361, 371 shaft, 362 L-shaped member, 370 second positioning member, 372 jack bolt, 373 plate-shaped member, 380 shaft receiving member, 381 fixing portion, 382 receiving portion, C1, C2 recess, L1 communication line, S1 first molded board, S2 second molded board, V1 internal space.

Claims

1. a warpage correction device for correcting warpage of the first molded substrate and manufacturing a second molded substrate; a relay unit disposed between a processing device outside the warp correction device and the warp correction device and fixed to the warp correction device, the processing device processes the second molded substrate; The relay unit includes a first transport mechanism that receives the second shaped substrate from the warp correction device and transports the received second shaped substrate to the processing device.

2. a first control unit that controls the first transport mechanism; The warp correction system according to claim 1 , further comprising: a first communication unit that communicates with the processing device.

3. the relay unit further includes a first sensor that detects that the second molded substrate has been received from the warp correction device; 3. The warp correction system according to claim 2, wherein the first control unit controls the first communication unit to send a signal requesting receipt of the second molded substrate to the processing device in response to the first sensor detecting receipt of the second molded substrate.

4. The warp correction system according to claim 2 or claim 3, wherein the first control unit controls the first transport mechanism to transport the second shaped substrate to the processing device in response to the first communication unit receiving a signal from the processing device indicating that the second shaped substrate is available for receipt.

5. the relay unit further includes a second sensor that detects that the second molded substrate has been transported to the processing device; The warp correction system according to claim 2 or claim 3, wherein the first control unit controls the first communication unit to send a signal to the processing device indicating that the transport of the second shaped substrate to the processing device has been completed in response to the second sensor detecting the transport of the second shaped substrate.

6. The warp correction device is a first accommodation section that accommodates the first molded substrate; a heating unit that heats the first molded substrate; a cooling unit that cools the first shaped substrate while the first shaped substrate is being pressed; a second transport mechanism that transports the first shaped substrate supplied from the first accommodation unit to the heating unit and transports the first shaped substrate heated by the heating unit to the cooling unit, 4. The warp correction system according to claim 1, wherein the heating unit heats the first shaped substrate in a state where the first shaped substrate is placed in an internal space formed in the heating unit.

7. The warp correction system according to claim 6 , wherein the height of the internal space is longer than the height of the first molded substrate in a state where no warp occurs.

8. the processing device includes a second accommodation unit that accommodates the second molded substrate; The warp correction system according to claim 1 , wherein the second shaped substrate transported by the first transport mechanism is accommodated in the second accommodation unit.

9. The warp correction system according to claim 8 ; The processing device is provided, A manufacturing system, wherein the processing device further includes a second control unit that determines whether or not the second shaped substrate can be received depending on the storage state of the second shaped substrate in the second storage unit.

10. the processing device further includes a second communication unit that communicates with the warp correction system, 10. The manufacturing system according to claim 9, wherein the second control unit controls the second communication unit to send a signal indicating that the second molded substrate can be received to the warp correction system when it is determined that the second molded substrate can be received.

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