Cup-type chuck for substrate holding device and substrate holding device

Abstract

A cup-type chuck for a substrate holding device is disclosed. The cup-type chuck includes an inner pressure ring, a middle frame, a seal portion, an outer pressure ring, and a contact ring. The inner pressure ring is fixed to the inner peripheral surface of the middle frame. The seal portion has an outer end, a bottom, and an inner end. The outer end of the seal portion covers at least a portion of the outer peripheral surface of the middle frame. The bottom of the seal portion covers the bottom of the middle frame and is exposed to the outside of the cup-type chuck. The inner end of the seal portion covers at least a portion of the inner peripheral surface of the middle frame and is pressed between the inner pressure ring and the middle frame by the inner pressure ring. The outer pressure ring is made of an insulating material and fixed to the outer peripheral surface of the middle frame, and the outer end of the seal portion is pressed between the outer pressure ring and the middle frame by the outer pressure ring. The contact ring is located above the seal portion and is pressed between the inner pressure ring and the middle frame, with the seal ring being disposed between the inner pressure ring and the contact ring.

Description

[Technical Field]

[0001] The present invention relates to the technical field of semiconductor electroplating, and more particularly to a cup-type chuck and substrate holding device for holding a substrate during electroplating. [Background technology]

[0002] An electrolytic plating chuck, which holds a substrate, is an important part of semiconductor electrolytic plating equipment. The electrolytic plating chuck typically includes a contact ring and a seal. The seal is used to isolate the electrolytic plating solution from the contact ring to prevent poor contact between the contact ring and the seed layer, which can lead to uneven electrolytic plating. Therefore, the performance of the seal is an important factor in ensuring the normal operation of the electrolytic plating process.

[0003] Currently, there are still many problems with the long-term use of the seal of an electrolytic plating chuck. For example: 1) As shown in FIG. 18, the electrolytic plating chuck uses a full-wrap seal 23, which has a large exposed area. As a result, the outer surface 231 and bottom surface 233 of the seal 23 are easily damaged, especially the curved bottom portion 232. If the seal 23 is damaged, the electrolytic plating solution can penetrate through the seal 23 and contact the internal metal substrate 22, resulting in partial current loss. As a result, the thickness of the electrolytic plating layer on the substrate is smaller than the target value, affecting product yield. 2) The seal 23 covers the relatively hard metal substrate 22. The bottom of the metal substrate 22 is bent upward to form the support portion 221, which is only 1 mm thick and very sharp. The seal 23 covers the support portion 221 to form the seal lip portion 234. During the electrolytic plating process, the sealing lip 234 is pressed against the substrate to seal the edge and backside of the substrate. However, the sealing lip 234 easily deteriorates and cracks when subjected to long-term stress. 3) When the electrolytic plating chuck is maintained, the contact ring 25 and the sealing portion 23 must be cleaned. However, in existing electrolytic plating chucks, the inner pressure ring 24 and the contact ring 25 are directly connected, and there is no seal between them and the outer metal substrate 22. When using online spray cleaning or immersion cleaning, the cleaning solution or electrolytic plating solution penetrates the inner layer of the electrolytic plating chuck along the arrows in Figure 18, making it impossible to achieve high-speed cleaning and maintenance. Disassembly is required for maintenance. Summary of the Invention

[0004] An object of the present invention is to provide a cup-type chuck for a substrate holding device that effectively reduces the risk of damage to the seal by reducing the exposed area of ​​the seal, and improves the mounting seal performance of the contact ring, thereby enabling online cleaning of the contact ring and the seal.

[0005] In order to achieve the above object, a cup-type chuck of a substrate support device provided by the present invention includes a cup-type chuck for holding a substrate, the cup-type chuck comprising: an inner pressure ring; a middle frame having the inner pressure ring fixed to its inner circumferential surface; a seal portion having an outer end portion covering at least a portion of the outer peripheral surface of the middle frame, a bottom portion covering the bottom portion of the middle frame and exposed to the outside of the cup-type chuck, and an inner end portion covering at least a portion of the inner peripheral surface of the middle frame and pressed by the inner pressure ring between the inner pressure ring and the middle frame; an outer pressure ring made of an insulating material and fixed to an outer peripheral surface of the middle frame, wherein the outer end of the seal portion is pressed between the outer pressure ring and the middle frame via the outer pressure ring; a contact ring positioned above the seal portion and pressed between the inner pressure ring and the middle frame, with a seal ring disposed between the inner pressure ring and the contact ring.

[0006] The outer pressure ring has insulating properties and is fixed to the seal, and only the bottom of the seal is exposed, thereby reducing the exposed area of ​​the seal and the risk of damage. The seal ring is installed between the inner pressure ring and the middle frame, improving the overall sealing of the cup-type chuck and preventing the electrolytic plating solution or cleaning solution from penetrating into the inner layer of the cup-type chuck.

[0007] Preferably, in the cup-type chuck of the substrate holding device, the bottom of the middle frame forms a horizontal support portion facing inward in the radial and horizontal directions, the bottom of the seal portion covers the horizontal support portion, and an end of the horizontal support portion protrudes upward to form a seal lip portion, the number of which is one or more, and the seal lip portion is configured to come into contact with the edge of the substrate to provide a seal.

[0008] The absence of a hard support material on the inside of the seal lip prevents the hard support material from damaging the seal lip when the seal is pressed, thereby extending the seal's service life. At the same time, the radial width of the seal lip can be less than 1 mm to meet the requirements for subsequent narrower edge removal processing. When two or more seal lips are provided, a multi-stage seal can be formed between the seal and the edge of the substrate to achieve a more effective seal.

[0009] Preferably, in the cup-type chuck of the substrate support device, when the number of the seal lip portions is two or more, the heights of the two or more seal lip portions are the same.

[0010] Preferably, in the cup-type chuck of the substrate support device, when the number of the seal lip portions is two or more, at least two of the seal lip portions have different heights.

[0011] Preferably, in the cup-type chuck of the substrate support device, the height of the seal lip portion gradually increases toward the inside in the radial direction.

[0012] Preferably, in the cup-type chuck of the substrate support device, the height of the seal lip portion gradually decreases toward the inside in the radial direction.

[0013] Preferably, in the cup-type chuck of the substrate support device, the heights of the seal lip portions are alternately high and low in the radial direction.

[0014] Preferably, in the cup-type chuck of the substrate support device, when there is one seal lip portion, the radial width of the one seal lip portion is 1 mm or less, and when there are two or more seal lip portions, the total radial width of the two or more seal lip portions is 1 mm or less.

[0015] Preferably, in the cup-type chuck of the substrate support device, when there is one seal lip portion, the radial width of the one seal lip portion is 0.4 mm to 0.8 mm, and when there are two or more seal lip portions, the total radial width of the two or more seal lip portions is 0.4 mm to 0.8 mm.

[0016] Preferably, in the cup-type chuck of the substrate support device, the seal portion, which is a separate component, is detachable from the middle frame.

[0017] Preferably, in the cup-type chuck of the substrate support device, the seal portion is adhered to the middle frame by an adhesive.

[0018] Preferably, in the cup-type chuck of the substrate support device, a plurality of inner seal protrusions are formed on the contact surface between the seal portion and the middle frame, and correspondingly, a plurality of seal grooves that fit the plurality of inner seal protrusions are formed on the surface of the middle frame.

[0019] The inner seal protrusion can form a multi-stage seal between the seal portion and the middle frame, so that even if a portion of the seal portion is damaged, the multi-stage seal can reduce the diffusion of the electrolytic plating solution into the inner layer of the cup-shaped chuck, thereby reducing the impact of the electrolytic plating solution on the device corrosion.

[0020] Preferably, in the cup-type chuck of the substrate support device, a plurality of outer seal protrusions are formed on a contact surface between the seal portion and the outer pressure ring.

[0021] The outer seal protrusion can improve the seal between the outer pressure ring, the middle frame, and the seal part. Furthermore, the inner seal protrusion and the outer seal protrusion also contribute to positioning the seal part and the middle frame during assembly, making the assembly of these two parts more accurate.

[0022] Preferably, in the cup-type chuck of the substrate support device, the sealing portion is hydrophobic.

[0023] The hydrophobic treatment of the seal can reduce adhesion of liquid to the surface of the seal. The hydrophobic treatment of the seal can be performed by surface coating or sputtering of a hydrophobic material, a doped hydrophobic material, or a hydrophobic film, or by reducing the surface roughness. Preferably, the surface roughness Ra of the seal is less than 10 nm.

[0024] Preferably, in the cup-type chuck of the substrate support apparatus, the outer surface of the outer pressure ring has a block portion.

[0025] By forming a block portion on the outer surface of the outer pressure ring, the resistance to the liquid rising along the outer surface of the outer pressure ring can be increased, and the liquid can be directed to change its flow direction and be dropped obliquely downward into a liquid collection portion disposed in the electroplating chamber, thereby preventing the liquid from splashing out of the electroplating chamber and contaminating the processing environment.

[0026] Preferably, in the cup-type chuck of the substrate support device, the block portion includes at least an upper block portion and / or a lower block portion. The number of the upper block portions is one or more, and the number of the lower block portions is one or more. The upper block portion is a downwardly projecting annular protrusion formed on the upper portion of the outer pressure ring, and the lower block portion is an outwardly projecting annular protrusion formed on the middle and lower portions of the outer pressure ring.

[0027] Preferably, in the cup-type chuck of the substrate support apparatus, the surface of the outer pressure ring is hydrophobic.

[0028] The hydrophobic treatment of the outer pressure ring can reduce adhesion of liquid to the surface of the outer pressure ring. Specifically, the outer pressure ring is formed of a hydrophobic material or a doped hydrophobic material. Alternatively, a hydrophobic film is formed on the surface of the outer pressure ring. Alternatively, the surface roughness Ra of the outer pressure ring is less than 10 nm.

[0029] Preferably, in the cup-type chuck of the substrate support device, a plurality of bumps are formed on a contact surface between the outer pressure ring and the seal portion, and a plurality of bumps are formed on a contact surface between the inner pressure ring and the seal portion.

[0030] By providing bumps on the contact surfaces between the outer pressure ring and the inner pressure ring and the seal portion, the sealing performance between the members in contact with each other can be improved.

[0031] Preferably, in the cup-type chuck of the substrate support device, a plurality of bumps are provided on the bottom of the outer pressure ring.

[0032] The bumps on the bottom of the outer ring provide support during maintenance of the device, keeping the seal at a certain distance from the work surface, reducing damage or contamination of the seal.

[0033] Preferably, in the cup-type chuck of the substrate support device, the material of the inner pressure ring is a metal having electrical conductivity and corrosion resistance, and the contact ring is electrically connected to an electrolytic plating power supply via the inner pressure ring.

[0034] Preferably, in the cup-type chuck of the substrate support device, the inner pressure ring is formed of an insulating material, the middle frame is formed of a conductive metal, and the contact ring is electrically connected to an electroplating power supply via the middle frame.

[0035] By adopting a configuration in which the middle frame electrically connects the contact ring and the electrolytic plating power supply, the inner pressure ring does not need to satisfy both electrical conductivity and corrosion resistance, but only needs to satisfy corrosion resistance, i.e., the inner pressure ring can be made of an insulating material (such as PVC, PTFE, PVDF, etc.), which broadens the range of materials that can be selected for the inner pressure ring, and is advantageous for reducing the cost and realizing online cleaning of the cup-type chuck.

[0036] In the present invention, the substrate holding device also includes: the cup-shaped chuck for holding a substrate; a chuck plate that presses the backside of the substrate so that the substrate is pressed against the sealing portion of the cup-type chuck; a chuck plate driving device that drives the chuck plate so that the chuck plate contacts the back surface of the substrate or moves away from the substrate; an angle driving device for adjusting an angle of the substrate clamped between the cup-type chuck and the chuck plate; a rotation drive device for rotating the substrate held between the cup-type chuck and the chuck plate; a vertical drive device that raises or lowers the substrate held between the cup-type chuck and the chuck plate.

[0037] Preferably, in the substrate holding device, the chuck plate has a base material having a lower surface that contacts the back surface of the substrate, and a plurality of exhaust grooves formed in the lower surface of the base material, and a plurality of exhaust holes communicating with the exhaust grooves formed in the front surface of the base material.

[0038] The exhaust grooves and holes on the chuck plate facilitate separation of the chuck plate and the substrate when the substrate is removed.

[0039] Preferably, in the substrate holding device, a contact portion is formed on the lower surface of the base member so as to protrude toward the substrate so as to reduce the contact area between the chuck plate and the substrate.

[0040] The cup-type chuck of the substrate holding device of the present invention employs an insulating outer pressure ring, which is tightly fixed to a middle frame covered by a seal member, leaving only the bottom of the seal member exposed. This significantly reduces the area of ​​the seal member exposed to the electrolytic plating solution, reducing the risk of damage to the seal member and improving the reliability of the device's operation. Furthermore, a seal ring is positioned between the inner pressure ring and the contact ring, ensuring a reliable seal above and below the contact ring. During device maintenance, especially during cleaning of the contact ring and seal member, this effectively prevents processing liquid from penetrating the inner layer of the cup-type chuck, eliminating the need to disassemble each component individually for maintenance. This allows for online cleaning, improving the convenience and efficiency of device maintenance and reducing maintenance costs. [Brief explanation of the drawings]

[0041] The features and performance of the present invention are further illustrated by the following embodiments and accompanying drawings. [Figure 1] FIG. 1 shows a perspective view of a substrate holding device of the present invention. [Figure 2] FIG. 2 shows another perspective view of the substrate holding device of the present invention. [Figure 3] FIG. 3 shows a cross-sectional view of the substrate holding device of the present invention. [Figure 4] FIG. 4 shows another cross-sectional view of the substrate holding device of the present invention. [Figure 5] FIG. 5 shows an enlarged view of part A in FIG. [Figure 6] FIG. 6 shows an enlarged view of the components of FIG. [Figure 7] FIG. 7 shows a perspective view of the cup-type chuck of the present invention. [Figure 8] FIG. 8 shows an exploded view of the cup-type chuck of the present invention. [Figure 9] FIG. 9 shows a partial cross-sectional view of the middle frame of the present invention. [Figure 10]FIG. 10 shows a partial cross-sectional view of the seal of the present invention. [Figure 11] FIG. 11 shows a perspective view of the outer pressure ring of the present invention. [Figure 12] FIG. 12 shows a perspective view of the chuck plate of the present invention. [Figure 13] FIG. 13 shows another perspective view of the chuck plate of the present invention. [Figure 14] FIG. 14 shows a cross-sectional view of the chuck plate of the present invention. [Figure 15] FIG. 15 shows an enlarged view of part B in FIG. [Figure 16a] Figure 16a shows a schematic diagram of one configuration of the outer pressure ring. [Figure 16b] Figure 16b shows a schematic diagram of an alternative configuration of the outer pressure ring. [Figure 16c] FIG. 16c shows a schematic diagram of yet another form of outer pressure ring. [Figure 16d] Figure 16d shows a schematic diagram of yet another form of outer pressure ring. [Figure 17a] Figure 17a shows a partial schematic view of one configuration of the seal. [Figure 17b] Figure 17b shows a partial schematic view of an alternative form of seal. [Figure 17c] Figure 17c shows a partial schematic view of yet another form of seal. [Figure 18] FIG. 18 shows an enlarged view of the components of an existing electroplating chuck. DETAILED DESCRIPTION OF THE INVENTION

[0042] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to explain the technical contents, structural features, objects and effects of the present invention in detail, the following detailed description will be given with reference to embodiments and drawings.

[0043] 1 and 2 show a substrate holding device according to an embodiment of the present invention. The substrate holding device includes a cup-type chuck 11, a chuck plate 12, a chuck plate drive unit 13, an angular drive unit 14, a rotation drive unit 16, and a vertical drive unit. A holding space 110 for holding a substrate 10 is provided in the center of the cup-type chuck 11. The chuck plate drive unit 13 is connected to the chuck plate 12 via a universal shaft 15 and drives the chuck plate 12 to move up and down. Specifically, as shown in FIG. 3, the chuck plate 12 is raised by the chuck plate drive unit 13 to a substrate mounting / removal position away from the cup-type chuck 11. After the substrate 10 is loaded into the holding space 110 by a transfer robot, the chuck plate 12 is lowered by the chuck plate drive unit 13 to a position adjacent to the backside of the substrate 10, sandwiching the substrate 10 between the cup-type chuck 11 and the chuck plate 12, as shown in FIGS. 4 and 5. Generally, the substrate holding device is connected to a vertical drive device (not shown) via a support plate 17, and the vertical drive device raises and lowers the substrate 10 sandwiched between the cup-type chuck 11 and the chuck plate 12. The angle drive device 14 is used to adjust the angle of the substrate 10 sandwiched between the cup-type chuck 11 and the chuck plate 12 during the process of introducing an electrolytic plating solution in order to reduce the influence of air bubbles in the electrolytic plating process. The rotation drive device 16 is used to rotate the substrate 10 sandwiched between the cup-type chuck 11 and the chuck plate 12 during the electrolytic plating process. It can be seen that the rotation drive device 16 rotates the cup-type chuck 11 when the chuck plate 12 is separated from the cup-type chuck 11 by the chuck plate drive device 13 to clean the cup-type chuck 11.

[0044] 5 and 6, the cup-type chuck 11 includes an inner pressure ring 111, a middle frame 112, and an outer pressure ring 113. The inner pressure ring 111 is fixed to the inner circumferential surface of the middle frame 112. The outer pressure ring 113 is fixed to the outer circumferential surface of the middle frame 112. The outer pressure ring 113 is made of an insulating material so that it can directly contact the electrolytic plating solution during the electrolytic plating process, eliminating leakage problems. Furthermore, the outer pressure ring 113 has a certain degree of hardness so that it can support other components. Specifically, the outer pressure ring 113 can be made of PEEK, PVC, PVDF, PFA, CPVC, PE, PC, or other materials.

[0045] 9 shows a partial cross-sectional view of the middle frame 112. The middle frame 112 has a side wall 1121, the upper end of which extends radially outward to form a first mounting base 1122. The lower end of the side wall 1121 extends radially inward to form a second mounting base 1123. The end of the second mounting base 1123 extends diagonally inward to form the bottom of the middle frame 112, and the end of the bottom of the middle frame 112 extends radially and horizontally inward to form a horizontal support 1124. The second mounting base 1123, the bottom of the middle frame 112, and the horizontal support 1124 function as the head of the middle frame 112, and the surface of the head of the middle frame 112 is covered with a seal 114, as described in detail below. 5 and 6, a first step 1131 is formed at the upper end of the inner wall of the outer pressure ring 113, and a second step 1132 is formed at the lower end of the inner wall of the outer pressure ring 113. When the middle frame 112 is attached to the outer pressure ring 113, the first mounting base 1122 of the middle frame 112 is pressed against the first step 1131 of the outer pressure ring 113, and the second mounting base 1123 of the middle frame 112 is pressed against the second step 1132 of the outer pressure ring 113. As shown in FIG. 9, a plurality of first positioning grooves 1125 are formed at intervals on the upper surface of the first mounting base 1122 of the middle frame 112. The upper part of the inner pressure ring 112 has a plurality of first positioning blocks 1111 (as shown in FIG. 8). When the inner pressure ring 111 is attached to the middle frame 112, the multiple first positioning blocks 1111 of the inner pressure ring 111 are pressed into the multiple first positioning grooves 1125 of the middle frame 112, and the lower end of the inner pressure ring 111 is pressed against the second mounting base 1123 of the middle frame 112.

[0046] The outer surface of the outer pressure ring 113 is provided with block portions to prevent processing liquid such as electrolytic plating solution from splashing upward along the outer surface of the outer pressure ring 113 while the cup-shaped chuck is rotating. The block portions include at least an upper block portion and / or a lower block portion. The number of upper block portions is one or more, and the number of lower block portions is one or more. The upper block portion is a downward-facing annular protrusion formed on the upper portion of the outer pressure ring 113, and the lower block portion is an outward-facing annular protrusion formed on the middle and lower portions of the outer pressure ring 113.

[0047] As shown in FIG. 16a, the outer pressure ring 113 has a lower block portion 1133. The lower block portion 1133 is an outward annular protrusion formed on the middle and lower portions of the outer pressure ring 113. The cross-sectional shape of the lower block portion 1133 can be any shape, such as a circular arc, an elliptical arc, a parabola, or a rectangle, that can prevent liquid from being guided to rise or flow down along the outer surface of the outer pressure ring 113. In FIG. 16a, the lower block portion 1133 is located at the bottom of the outer pressure ring 113, i.e., flush with the bottom surface of the outer pressure ring 113. Of course, in other embodiments, as shown in FIG. 16b, the lower block portion 1133 is located higher than the bottom surface of the outer pressure ring 113 and is understood to be located in the middle and lower portions of the outer pressure ring 113. When the cup-shaped chuck 11 rotates, the lower block portion 1133 increases the resistance to liquid rising along the outer wall of the outer pressure ring 113. Specifically, when the liquid rotates together with the cup-shaped chuck 11, the liquid rises along the outer wall of the outer pressure ring 113 and is splashed diagonally downward toward a liquid recovery section provided in the electroplating chamber as shown by the solid arrow in FIG. 16a, instead of being splashed diagonally upward toward the outside of the electroplating chamber and contaminating the processing environment as shown by the dashed line in FIG. 16a.

[0048] In another embodiment, the outer pressure ring can have two or more lower block portions to more effectively prevent liquid from being splashed obliquely upward along the outer wall of the outer pressure ring when the cup-shaped chuck rotates. FIG. 16c shows that the lower portion of the outer pressure ring 113 has two lower block portions 1133, which are arranged one above the other along the outer surface of the outer pressure ring 113. Of course, in another embodiment, the number of lower block portions 1133 can be determined based on specific processing conditions. It can be understood that the number of lower block portions 1133 can be three, four, or more. The outward protrusion widths of the two or more lower block portions 1133 can be the same or different. For example, the outward protrusion widths of the two or more lower block portions 1133 can gradually increase or decrease from bottom to top.

[0049] FIG. 16d shows a schematic diagram of another outer pressure ring. The outer pressure ring 113 has an upper block portion 1134, which is a downward-facing annular protrusion formed on the upper portion of the outer pressure ring 113. The upper block portion 1134 is used to change the flow direction of the liquid so that when the liquid flows obliquely upward along the outer wall of the outer pressure ring 113 and passes through the upper block portion 1134, the liquid flows obliquely downward along the downward-protruding upper block portion 1134. Even if some of the liquid rises over the lower block portion 1133 and reaches the top of the outer pressure ring 113 as the cup-shaped chuck 11 rotates, it is blocked by the upper block portion 1134 formed on the upper portion of the outer pressure ring 113. Then, as shown by the solid arrows in FIG. 16d, the liquid is splashed obliquely downward by the action of centrifugal force toward a liquid recovery unit provided in the electroplating chamber, preventing the liquid from splashing outside the electroplating chamber and contaminating the processing environment. In this embodiment, the angle θ between the upper block portion 1134 and the outer peripheral surface of the outer pressure ring 113 is between 80° and 120°, preferably 90°.

[0050] In another embodiment, the number of upper block portions 1134 may be two or more (not shown), such as two, three, or four. The two or more upper block portions 1134 are arranged radially from the inside to the outside. The downward protrusion heights of the two or more upper block portions 1134 may be the same or different. For example, the downward protrusion heights of the two or more upper block portions 1134 may gradually increase or decrease from the inside to the outside.

[0051] In order to reduce adhesion of the electrolytic plating solution to the surface of the outer pressure ring 113, the surface of the outer pressure ring 113 is subjected to a hydrophobic treatment, such as reducing the surface roughness of the outer pressure ring 113. In this embodiment, the surface roughness Ra of the outer pressure ring 113 is less than 10 nm. Preferably, the surface roughness Ra of the outer pressure ring 113 is less than 2 nm, or the surface of the outer pressure ring 113 is coated or sputtered with a hydrophobic film (such as a PTFE coating), or the outer pressure ring 113 is made of a hydrophobic material or has a hydrophobic material mixed therein.

[0052] The substrate holding device further includes a seal portion 114 and a contact ring 115. The contact ring 115 generally has a mounting portion and a finger portion. The mounting portion is pressed between the inner pressure ring 111 and the middle frame 112. The contact ring 115 is attached and fixed to the cup-shaped chuck 11. The tips of the finger portions contact the edge seed layer of the substrate 10 to conduct electricity to the substrate during the electrolytic plating process. As shown in FIGS. 5 and 6 , the seal portion 114 covers the inner peripheral surface, bottom, and outer peripheral surface of the middle frame 112. The contact ring 115 and the seal ring 116 are attached to the seal portion 114 in order and pressed against the middle frame 112 by the inner pressure ring 111. The space inside the cup-shaped chuck 11 is sealed by the seal ring 116, and the seal portion 114 and the seal ring 116 also form seals at the top and bottom of the contact ring 115. This prevents the cleaning solution or immersion solution from penetrating into the cup-shaped chuck 11 during online cleaning or immersion of the cup-shaped chuck 11 after electrolytic plating, i.e., prevents the cleaning solution or immersion solution from getting between the inner pressure ring 111 and the middle frame 112. Here, the seal ring 116 may be an O-ring seal ring.

[0053] In this embodiment, the seal 114 can be integrally molded as an independent component by mold opening or injection molding and removably attached to the middle frame 112. Specifically, the seal 114 integrally covers the head of the middle frame 112. The two ends of the seal 114 are fixed to the middle frame 112 by an inner pressure ring 111 and an outer pressure ring 113. When the seal 114 wears down after multiple uses and its sealing performance deteriorates, the damaged seal can be removed by simply disassembling the cup-shaped chuck 11. The device can then be reused by replacing it with a new seal. This reduces the difficulty and cost of replacing the seal. In another embodiment, the seal 114 may be bonded to the middle frame 112 with an adhesive to ensure a stronger attachment between the seal 114 and the middle frame 112.

[0054] The seal portion 114 can be formed from fluororubber (such as perfluororubber or fluorine-containing rubber), silicone rubber, or the like, and can have a hardness range of 50 to 90 as measured with a durometer. Specifically, the seal portion 114 can be formed from different materials depending on the processing equipment. For example, when electroplating copper, semi-fluorinated rubber (such as Viton (registered trademark) fluororubber) with good sealing performance and low hardness can be used. On the other hand, perfluorinated rubber can be used in high-temperature electroplating of nickel, gold, or the like. In another embodiment, the seal portion 114 can be treated to be hydrophobic, thereby reducing adhesion of the electroplating solution to the surface of the seal portion 114. Various methods can be used to hydrophobize the seal portion 114, as follows: 1) Using a hydrophobic material (e.g., Teflon (registered trademark)) as the material forming the sealing portion 114, 2) Hydrophobically coating the surface of the sealing portion 114 (e.g., Teflon (registered trademark) coating), 3) Doping the sealing portion 114 with a hydrophobic material (e.g., Teflon (registered trademark) doping), 4) Reducing the surface roughness of the sealing portion 114, for example, making the surface roughness of the sealing portion less than 10 nm, preferably less than 2 nm.

[0055] FIG. 10 shows a partial cross-sectional view of the seal portion. The seal portion 114 has an inner end portion 1141, an outer end portion 1142, and a bottom portion 1143. Referring to FIG. 6, the inner end portion 1141 covers the inner peripheral surface of the middle frame 112 and is pressed against the upper surface of the second mounting base 1123 of the middle frame 112 by the inner pressure ring 111. The outer end portion 1142 covers the outer peripheral surface of the middle frame 112 and is fixed to the lower surface of the second mounting base 1123 of the middle frame 112 by the second step portion 1132 of the outer pressure ring 113. The bottom portion 1143 of the seal portion 114 covers the bottom of the middle frame 112 and is bent upward to cover the horizontal support portion 1124 of the middle frame 112. Referring to FIG. 10, the seal portion 114 protrudes upward at the end of the horizontal support portion 1124 to form a seal lip portion 1144. The thickness of the seal lip portion 1144 is greater than the thickness of other portions of the seal portion 114. After the substrate 10 is attached to the cup-shaped chuck 11, the chuck plate 12 presses against the backside of the substrate 10 to firmly attach the edge of the substrate 10 to the seal lip portion 1144 and seal the edge of the substrate 10 to the backside. In this embodiment, the seal lip portion 1144 does not have a metal support and the thickness of the seal lip portion 1144 is increased, thereby effectively extending the service life of the seal portion 114. Furthermore, because the seal lip portion 1144 does not have a metal support, the radial width of the seal lip portion 1144 is determined only by the width of the seal lip portion 1144 itself and can be 1 mm or less. Preferably, the radial thickness of the seal lip portion 1144 is 0.4 mm to 0.8 mm, and more preferably, the radial width of the seal lip portion 1144 is 0.8 mm. The sealing lip portion 1144 has a radial width of 1 mm or less, which allows the edge press width to be reduced when the sealing portion 114 contacts and seals with the substrate 10, thereby meeting the requirements of the subsequent narrower edge removal process.

[0056] In another embodiment, the seal portion has two or more seal lip portions. The seal lip portions have a certain degree of elasticity and are slightly deformable under the pressure of the chuck plate. Therefore, the two or more seal lip portions of the seal portion simultaneously contact and seal with the substrate, realizing a multi-stage seal between the cup-type chuck and the substrate and achieving a higher edge sealing effect. The two or more seal lip portions are distributed radially inward and outward, and the seal lip portions have the same height, or at least two seal lip portions have a height difference. Specifically, the heights of the multiple seal lip portions gradually increase radially inward, or gradually decrease radially inward, or alternate in height and low in the radial direction. Furthermore, the total radial width of the two or more seal lip portions is 1 mm or less. Preferably, the total radial width of the two or more seal lip portions is 0.4 mm to 0.8 mm.

[0057] 17a to 17c are partial schematic views of a seal portion having two seal lips, an inner seal lip portion 1144a and an outer seal lip portion 1144b, distributed radially inward and outward. Referring to FIG. 17a, the heights of the inner seal lip portion 1144a and the outer seal lip portion 1144b are the same, with a height h of 0.3 mm to 0.5 mm. Referring to FIG. 17b, the height h2 of the inner seal lip portion 1144a is higher than the height h1 of the outer seal lip portion 1144b. For example, the height h2 of the inner seal lip portion 1144a is 0.4 mm, and the height h1 of the outer seal lip portion 1144b is 0.35 mm. Referring to FIG. 17c, the height h2 of the inner seal lip portion 1144a is lower than the height h1 of the outer seal lip portion 1144b. For example, the height h2 of the inner seal lip portion 1144a is 0.35 mm, and the height h1 of the outer seal lip portion 1144b is 0.4 mm.

[0058] In Figures 17a to 17c, the sum of the radial widths of the inner seal lip portion 1144a and the outer seal lip portion 1144b is 1 mm or less. That is, a + b ≤ 1 mm. The radial width a of the inner seal lip portion 1144a and the radial width b of the outer reel lip portion 1144b may be the same or different. Preferably, the radial width a of the inner seal lip portion 1144a is smaller than the radial width b of the outer reel lip portion 1144b. Specifically, as shown in Figure 17c, the radial width b of the outer seal lip portion 1144b is 0.6 mm, and the radial width a of the inner reel lip portion 1144a is 0.2 mm.

[0059] In this embodiment, the outer pressure ring 113 is made of an insulating material, specifically, the entire sidewall and bottom of the outer pressure ring 113 are made of an insulating material. The outer pressure ring 113 is fixed and sealed to the sealing portion 114 from the outside so that the exposed area of ​​the sealing portion 114 is sufficiently reduced. Therefore, during processing, only the bottom portion 1143 is exposed to the electrolytic plating solution, effectively reducing the risk of damage to the sealing portion 114.

[0060] 10 , the contact surface of the seal portion 114 that comes into contact with the outer pressure ring 113 forms a plurality of outer seal protrusions 1146 for enhancing the seal between the seal portion 114 and the outer seal ring 113. The contact surface of the seal portion 114 that comes into contact with the middle frame 112 forms a plurality of seal protrusions 1145. When the seal portion 114 covers the middle frame 112 and is fixed by the inner pressure ring 111 and the outer pressure ring 113, the inner seal protrusions 1145 fit into the seal grooves 1128 arranged on the surface of the middle frame 112. On the one hand, the seal portion 114 and the middle frame 112 can be firmly assembled, and on the other hand, a multi-stage seal can be formed inside the seal portion 114 to enhance the sealing effect between the seal portion 114 and the middle frame 112. When the bottom 1143 of the seal portion 114 is damaged, the multiple circular inner seal protrusions 1145 can prevent the infiltrated electrolytic plating solution from diffusing inside the cup-shaped chuck 11, thereby reducing the erosion of the electrolytic plating solution into the inside of the cup-shaped chuck 11. Therefore, the substrate holding apparatus can resume normal operation by simply replacing the seal portion 114, which helps to reduce the time and cost of apparatus maintenance.

[0061] Because it is difficult to achieve a perfect seal by pressing two flat surfaces together, multiple bumps (not shown) are provided on the pressing surfaces of the inner pressure ring 111, the outer pressure ring 113, and the seal portion 114. These bumps allow the inner pressure ring 111 and the side pressure ring 113 to be completely attached to the contact surface of the seal portion 114 when fixed, thereby improving the sealing performance between these parts.

[0062] 11, the bottom of the outer pressure ring 113 has a plurality of bumps 1137. When the cup-shaped chuck 11 needs to be repaired, the bumps 1137 on the bottom of the outer pressure ring 113 can serve to support the seal 114 so that it remains suspended and does not come into contact with the maintenance workbench. This prevents the seal 114 from being damaged or its surface from being contaminated. In this embodiment, the height of the bumps 1137 on the bottom of the outer pressure ring 113 is approximately 1 mm.

[0063] In this embodiment, the inner pressure ring 111 is made of a conductive material, typically a conductive metal. The contact ring 115 is electrically connected to an electroplating power supply via the inner pressure ring 111. In another embodiment, both the inner pressure ring 111 and the middle frame 112 are made of a conductive material, typically a conductive metal, and the electroplating power supply is directly connected to the middle frame 112. The middle frame 112 is electrically connected to the contact ring 115 via the inner pressure ring 111. Because the cup-shaped chuck 11 requires maintenance after multiple processing cycles, processing solutions such as sulfuric acid, nitric acid, tin-silver plating solution, and various surfactants are often used. In this case, the inner pressure ring 111 inevitably comes into contact with the processing solutions. Therefore, the inner pressure ring 111 must be not only conductive but also corrosion-resistant. The material selection for the inner pressure ring 111 has high requirements, and metals with both conductivity and corrosion resistance, such as titanium, titanium alloys, stainless steel, and other precious metals, must be used. This increases manufacturing and maintenance costs.

[0064] In another embodiment, the middle frame 112 is preferably formed of a conductive material, typically a conductive metal, and the contact ring 115 is electrically connected to the electroplating power supply via the middle frame 112. Because the middle frame 112 is sealed by the seal portion 114 and the seal ring 116, the middle frame 112 does not come into contact with the processing solution, regardless of whether it is an electroplating process or an apparatus cleaning process, and there is no risk of erosion by the processing solution. The material of the middle frame 112 only needs to be conductive. Compared with the inner pressure ring 111 as an electrical connection part, the requirements for the material selection of the middle frame 112 are reduced, and ordinary conductive metals can be used, thereby effectively reducing manufacturing and maintenance costs. Furthermore, the inner pressure ring 111 only needs to be corrosion-resistant; instead of being limited to a corrosion-resistant conductive material, a corrosion-resistant insulating material can be used. This broadens the range of materials available for the inner pressure ring 111, reduces costs, and helps realize online cleaning of the cup-shaped chuck 11. In this embodiment, the inner pressure ring 111 can be made of PVC, PEEK, PTFE, PVDF, PP, or the like.

[0065] 7 and 8, the cup-type chuck 11 is assembled as follows.

[0066] Step 1: Cover the top of the middle frame 112 with the seal portion 114. That is, cover the second mounting base 1123, the bottom, and the horizontal support portion 1124 of the middle frame 112 with the seal portion 114.

[0067] Step 2: Assemble the middle frame 112 covered with the sealing portion 114 to the outer pressure ring 113. A plurality of positioning portions may be arranged on the contact surface between the outer pressure ring 113 and the middle frame 112. As shown in FIG. 8, the inner wall of the outer pressure ring 113 has a second positioning groove 1135, and the outer wall of the middle frame 112 has a second positioning block 1120 that fits into the second positioning groove 1135.

[0068] Step 3: Assemble the contact ring 115 to the middle frame 112, and the fingers of the contact ring 115 are used to contact the seed layer with the edge of the substrate for electrical connection. For ease of assembly, as shown in FIG. 9 , the second mounting base 1123 of the middle frame 112 is provided with a number of positioning columns 1129, and the contact ring 115 is attached to the second mounting base 1123 of the middle frame 112 along the positioning columns 1129 so as to be positioned on the seal portion 114.

[0069] Step 4: After the contact ring 115 is installed, the inner pressure ring 111 is installed on the middle frame 112 and the contact ring 115 is pressed. The first positioning block 1111 formed on the surface of the inner pressure ring 111 is placed in the first positioning groove 1125 on the top of the middle frame 112, and the seal ring 116 is installed on the underside of the inner pressure ring 111. When the inner pressure ring 111 and the middle frame 112 are fixed, the seal ring 116 is fixed between the inner pressure ring 111 and the contact ring 115.

[0070] Step 5: Insert multiple screws 117 through the first screw holes 1112 of the inner pressure ring 111 and the second screw holes 1126 of the middle frame 112 to fix the inner pressure ring 111 to the inner peripheral surface of the middle frame 112, and press the seal ring 116, contact ring 115, and the inner end 1141 of the seal portion 114 on the second mounting base 1123 of the middle frame 112 against the bottom of the inner pressure ring 111, in that order. Insert multiple screws 118 through the third screw holes 1127 of the middle frame 112 and the fourth screw hole 1136 of the outer pressure ring 113 to fix the outer pressure ring 113 to the outer peripheral surface of the middle frame 112, and press the outer end 1142 of the seal portion 114 between the outer pressure ring 113 and the middle frame 112.

[0071] 12 and 13 are perspective views of the chuck plate of this embodiment. The chuck plate 12 includes a base material 121, which has a lower surface that contacts the substrate 10. A plurality of exhaust grooves 122 are formed in the lower surface of the base material 121, and a plurality of exhaust holes 125 communicating with the exhaust grooves 122 open in the surface of the base material 121. When the chuck plate 12 is pressed against the backside of the substrate 10, the pressure on the backside of the substrate is equalized with the ambient pressure through the exhaust holes 125 formed in the surface of the chuck plate 12. This prevents a slight negative pressure from being generated between the chuck plate 12 and the substrate 10, which would otherwise cause the substrate 10 to be adsorbed to the chuck plate 12 and affect the removal operation of the substrate 10. This also facilitates separation of the substrate 10 from the chuck plate 12 after the electrolytic plating process is completed.

[0072] Referring again to FIG. 13 , the lower surface of the substrate 121 further includes a plurality of contact portions protruding toward the substrate 10. Specifically, the plurality of contact portions may be a plurality of contact bumps 123 protruding from the lower surface of the substrate 121 and a contact annular protrusion 124 formed on the lower surface of the substrate 121. As shown in FIGS. 14 and 15 , the contact bumps 123 and the contact annular protrusion 124 have the same protruding height. When the chuck plate 12 contacts the substrate 10, only the contact bumps 123 and the contact annular protrusion 124 contact the rear surface of the substrate 10, and the remaining portion of the lower surface of the substrate 121 does not contact the substrate 10. On the one hand, the contact area between the chuck plate 12 and the substrate 10 can be reduced, thereby reducing scratches and contamination on the rear surface of the substrate 10. On the other hand, the pressure on the rear surface of the substrate 10 can be made the same as the ambient pressure, making it easier to remove the substrate 10 from the chuck plate 12.

[0073] As mentioned above, the present invention has been described in detail through the above embodiments and related drawings, and those skilled in the art can implement it accordingly. The above embodiments are used only to explain the present invention and do not limit the present invention, and the scope of the present invention is defined by the claims of the present invention. Changing the number of components described herein or replacing the components described herein with equivalent components also falls within the scope of the present invention.

Claims

1. A cup-type chuck of a substrate holding device for holding a substrate, an inner pressure ring; a middle frame having the inner pressure ring fixed to its inner circumferential surface; a seal portion having an outer end portion covering at least a portion of the outer peripheral surface of the middle frame, a bottom portion covering the bottom portion of the middle frame and exposed to the outside of the cup-shaped chuck, and an inner end portion covering at least a portion of the inner peripheral surface of the middle frame and pressed by the inner pressure ring between the inner pressure ring and the middle frame; an outer pressure ring made of an insulating material and fixed to an outer peripheral surface of the middle frame, wherein the outer end of the seal portion is pressed between the outer pressure ring and the middle frame via the outer pressure ring; a contact ring positioned above the seal portion, pressed between the inner pressure ring and the middle frame, and having a seal ring disposed between the inner pressure ring and the contact ring.

2. 2. The cup-type chuck for a substrate holding device according to claim 1, wherein a bottom of the middle frame forms a horizontal support portion facing radially and horizontally inward, the bottom of the seal portion covers the horizontal support portion, an end of the horizontal support portion protrudes upward to form a seal lip portion, the number of the seal lip portions is one or more, and the seal lip portion is configured to contact and seal with the edge of the substrate.

3. 3. The cup-type chuck for a substrate holding device according to claim 2, wherein when the number of the seal lip portions is two or more, the heights of the two or more seal lip portions are the same.

4. 3. The cup-type chuck for a substrate holding device according to claim 2, wherein when the number of said seal lip portions is two or more, at least two of said seal lip portions have a difference in height.

5. 5. The cup-type chuck for a substrate holding device according to claim 4, wherein the heights of the plurality of seal lip portions gradually increase toward the inside in the radial direction.

6. 5. The cup-type chuck for a substrate holding device according to claim 4, wherein the heights of the plurality of seal lip portions gradually decrease toward the inside in the radial direction.

7. 5. The cup-type chuck for a substrate holding device according to claim 4, wherein the heights of the plurality of seal lip portions are alternately arranged in the radial direction.

8. 3. The cup-type chuck for a substrate holding device according to claim 2, characterized in that when there is only one seal lip portion, the radial width of one seal lip portion is 1 mm or less, and when there are two or more seal lip portions, the total radial width of these two or more seal lip portions is 1 mm or less.

9. 9. The cup-type chuck for a substrate holding device according to claim 8, characterized in that when there is one seal lip portion, the radial width of one seal lip portion is 0.4 mm to 0.8 mm, and when there are two or more seal lip portions, the total radial width of these two or more seal lip portions is 0.4 mm to 0.8 mm.

10. 2. The cup-type chuck of claim 1, wherein the seal portion is a separate component and is removable from the middle frame.

11. 11. The cup-type chuck for a substrate holding device according to claim 10, wherein the seal portion is adhered to the middle frame by an adhesive.

12. 2. The cup-type chuck for a substrate holding device according to claim 1, wherein a plurality of inner seal protrusions are formed on the contact surface between the seal portion and the middle frame, and a plurality of seal grooves that fit the plurality of inner seal protrusions are formed on the surface of the middle frame corresponding to the plurality of inner seal protrusions.

13. 13. The cup-type chuck of claim 12, wherein a plurality of outer seal protrusions are formed on a contact surface between the seal portion and the outer pressure ring.

14. 2. The cup-type chuck of claim 1, wherein the sealing portion is hydrophobic.

15. 2. The cup-type chuck of claim 1, wherein the outer surface of the outer pressure ring has a block portion.

16. 16. The cup-type chuck of claim 15, wherein the block portion comprises at least an upper block portion and / or a lower block portion, the number of the upper block portions being one or more, the number of the lower block portions being one or more, the upper block portion being an annular protrusion formed on the upper portion of the outer pressure ring and protruding downward, and the lower block portion being an annular protrusion formed on the middle and lower portions of the outer pressure ring and protruding outward.

17. 2. The cup-type chuck of claim 1, wherein the surface of the outer pressure ring is hydrophobic.

18. 2. The cup-type chuck of claim 1, wherein a plurality of bumps are formed on the contact surface between the outer pressure ring and the seal portion, and a plurality of bumps are formed on the contact surface between the inner pressure ring and the seal portion.

19. 2. The cup-type chuck of claim 1, wherein the outer pressure ring has a bottom surface provided with a plurality of bumps.

20. 2. The cup-type chuck of claim 1, wherein the inner pressure ring is made of a metal having electrical conductivity and corrosion resistance, and the contact ring is electrically connected to an electroplating power supply via the inner pressure ring.

21. 2. The cup-type chuck of claim 1, wherein the inner pressure ring is made of an insulating material, the middle frame is made of a conductive metal, and the contact ring is electrically connected to an electroplating power supply via the middle frame.

22. a cup-type chuck for holding the substrate according to any one of claims 1 to 21; a chuck plate that presses the back surface of the substrate so that the substrate is pressed against the seal portion of the cup-type chuck; a chuck plate driving device that drives the chuck plate so that the chuck plate contacts the back surface of the substrate or moves away from the substrate; an angle driving device for adjusting an angle of the substrate clamped between the cup-type chuck and the chuck plate; a rotation drive device for rotating the substrate held between the cup-type chuck and the chuck plate; a vertical drive device that raises or lowers the substrate held between the cup-type chuck and the chuck plate.

23. 23. The substrate holding device of claim 22, wherein the chuck plate has a base material, the base material having a lower surface that contacts the back surface of the substrate, a plurality of exhaust grooves formed on the lower surface of the base material, and a plurality of exhaust holes communicating with the plurality of exhaust grooves formed on the surface of the base material.

24. 24. The substrate holding device according to claim 23, wherein a plurality of contact portions are formed on the lower surface of the base member, the contact portions protruding toward the substrate so as to reduce a contact area between the chuck plate and the substrate.

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