Cushioning materials, packaging materials, and packaging items

Abstract

To provide a buffer material for absorbing shock applied to electronic equipment.SOLUTION: A buffer material buffers an external force applied to electronic equipment stored in a packaging box capable of storing the electronic equipment, and comprises a first holding material including a first plate facing the electronic equipment when the buffer material and the electronic equipment are stored in the packaging box, and a second plate facing inner wall faces when the buffer material and the electronic equipment are stored in the packaging box, and a first buffer block provided between the first plate and the second plate.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a cushioning material, a packaging material, and a packaged product. [Background technology]

[0002] There is known a cushioning material that is housed in a packaging box capable of housing an electronic device and that cushions external forces applied to the electronic device. For example, Patent Document 1 discloses a technology for cushioning external forces applied to an electronic device using a cushioning material that includes two plate-shaped members. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-131268 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional technology, the space between the two plate-like members is hollow, which means that when an external force is applied to the cushioning material, the two plate-like members come into contact with each other, making it impossible to cushion the external force. [Means for solving the problem]

[0005] In order to solve the above problems, the cushioning material of the present invention is a cushioning material that is housed in a packaging box that can house an electronic device and cushions external forces applied to the electronic device housed in the packaging box, and is characterized by comprising a first retaining material including a first plate that faces the electronic device when the cushioning material and the electronic device are housed in the packaging box, and a second plate that faces the inner wall surface of the packaging box when the cushioning material and the electronic device are housed in the packaging box, and a first cushioning block provided between the first plate and the second plate.

[0006] In addition, the packaging material of the present invention comprises a packaging box capable of containing an electronic device, and a cushioning material contained in the packaging box and cushioning external forces applied to the electronic device contained in the packaging box, wherein the cushioning material comprises a first retaining material including a first plate that faces the electronic device when the cushioning material and the electronic device are contained in the packaging box, and a second plate that faces the inner wall surface of the packaging box when the cushioning material and the electronic device are contained in the packaging box, and a first cushioning block provided between the first plate and the second plate.

[0007] In addition, the packaging product of the present invention comprises an electronic device, a packaging box capable of housing the electronic device, and a cushioning material housed in the packaging box and cushioning external forces applied to the electronic device housed in the packaging box, wherein the cushioning material comprises a first retaining material including a first plate that faces the electronic device when the cushioning material and the electronic device are housed in the packaging box, and a second plate that faces the inner wall surface of the packaging box when the cushioning material and the electronic device are housed in the packaging box, and a first cushioning block provided between the first plate and the second plate. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is an exploded perspective view showing an example of the configuration of a packaging material 1 according to an embodiment of the present invention. [Figure 2] 1 is a perspective view showing an example of the structure of a cushioning material S. FIG. [Figure 3] FIG. 10 is a plan view showing an example of the shape of a flat plate member HH. [Figure 4] 2 is a cross-sectional view showing an example of the structure of the cushioning material S. FIG. [Figure 5] FIG. 10 is a cross-sectional view showing an example of the structure of a buffer material SW according to a reference example. [Figure 6] FIG. 10 is an exploded perspective view showing an example of the configuration of a cushioning material SA according to Modification 1 of the present invention. [Figure 7] FIG. 2 is a perspective view showing an example of the configuration of a buffer material SA. [Figure 8] FIG. 10 is an exploded perspective view showing an example of the configuration of a buffer material SB according to a second modified example of the present invention. [Figure 9] It is a perspective view showing an example of the configuration of the cushioning material SB. [Figure 10] It is an exploded perspective view showing an example of the configuration of the packaging material <1>C according to Modification 3 of the present invention. [Figure 11] It is a plan view showing an example of the shape of the flat plate member <HHC>. [Figure 12] It is an exploded perspective view showing an example of the configuration of the packaging material <1>D according to Modification 4 of the present invention. [Figure 13] It is a plan view showing an example of the shape of the flat plate member <HHD>. **[Embodiments for Carrying Out the Invention]**

[0009] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, in each figure, the dimensions and scales of each part are appropriately different from the actual ones. Further, since the embodiments described below are preferred specific examples of the present invention, various technically preferable limitations are imposed. However, the scope of the present invention is not limited to these embodiments unless there is a description specifically limiting the present invention in the following description.

[0010] <<A. Embodiment>> Hereinafter, an example of the configuration of the packaging material <1> according to the present embodiment will be described while referring to FIGS. 1 to 4.

[0011] <<1. Regarding the Packaged Product>> FIG. 1 is an exploded perspective view showing an example of the configuration of the packaging material <1>.

[0012] As illustrated in FIG. 1, the packaging material <1> houses the electronic device <100>. Specifically, the packaging material <1> includes a packaging box <2> capable of housing the electronic device <100>, and a plurality of cushioning materials <S> for cushioning an external force applied to the electronic device <100> housed in the packaging box <2>. Here, the electronic device <100> is, for example, a printing device such as an inkjet printer. However, in the present embodiment, as the electronic device <100>, devices other than printing devices such as a television, a refrigerator, a washing machine, a microwave oven, or a personal computer may be adopted. In the following description, the packaging material 1 and the electronic device 100 housed in the packaging material 1 may be referred to as a "packaged item."

[0013] 1, in this embodiment, it is assumed that the packaging material 1 has eight cushioning materials S-1 to S-8. In this embodiment, the electronic device 100 and the eight cushioning materials S-1 to S-8 are housed in the packaging box 2 by being inserted into the packaging box 2 through an opening 20 that the packaging box 2 has.

[0014] For ease of explanation, a packaging box coordinate system ΣW fixed to the packaging box 2 will be introduced below. The packaging box coordinate system ΣW is a three-axis coordinate system having a Zw axis extending in the +Zw direction, which is the direction from the bottom surface of the packaging box 2 toward the opening 20, an Xw axis extending in the +Xw direction perpendicular to the +Zw direction, and a Yw axis extending in the +Yw direction perpendicular to the +Zw direction and the +Xw direction. Hereinafter, the direction opposite to the +Xw direction will be referred to as the -Xw direction, the direction opposite to the +Yw direction will be referred to as the -Yw direction, and the direction opposite to the +Zw direction will be referred to as the -Zw direction.

[0015] In the following, we will introduce a buffer coordinate system ΣS fixed to the buffer S. The buffer coordinate system ΣS is a three-axis coordinate system having a Zs axis extending in the +Zs direction, an Xs axis extending in the +Xs direction perpendicular to the +Zs direction, and a Ys axis extending in the +Ys direction perpendicular to the +Zs and +Xs directions. In the following, the direction opposite to the +Xs direction will be referred to as the -Xs direction, the direction opposite to the +Ys direction will be referred to as the -Ys direction, and the direction opposite to the +Zs direction will be referred to as the -Zs direction.

[0016] 1, when the electronic device 100 and eight cushioning materials S-1 to S-8 are housed in the packaging box 2, the cushioning material S-1 is a cushioning material S that holds the lower end of the electronic device 100 in the -Zw direction of the electronic device 100, and in the -Xw direction and -Yw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-1 fixed to the cushioning material S-1 is set so that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the -Yw direction, and the +Ys direction coincides with the -Xw direction.

[0017] When the electronic device 100 and eight cushioning materials S-1 to S-8 are housed in the packaging box 2, the cushioning material S-2 is a cushioning material S that holds the lower end of the electronic device 100 in the -Zw direction of the electronic device 100, and in the -Xw direction and +Yw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-2 fixed to the cushioning material S-2 is set so that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the -Xw direction, and the +Ys direction coincides with the +Yw direction.

[0018] When the electronic device 100 and eight cushioning materials S-1 to S-8 are housed in the packaging box 2, the cushioning material S-3 is a cushioning material S that holds the lower end of the electronic device 100 in the -Zw direction of the electronic device 100, and in the +Xw direction and +Yw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-3 fixed to the cushioning material S-3 is set so that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the +Yw direction, and the +Ys direction coincides with the +Xw direction.

[0019] When the electronic device 100 and eight cushioning materials S-1 to S-8 are housed in the packaging box 2, the cushioning material S-4 is a cushioning material S that holds the lower end of the electronic device 100 in the -Zw direction of the electronic device 100, and in the +Xw direction and -Yw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-4 fixed to the cushioning material S-4 is set so that the +Zs direction coincides with the -Zw direction, the +Xs direction coincides with the +Xw direction, and the +Ys direction coincides with the -Yw direction.

[0020] When the electronic device 100 and eight cushioning materials S-1 to S-8 are housed in the packaging box 2, the cushioning material S-5 is a cushioning material S that holds the upper end of the electronic device 100 in the +Zw direction of the electronic device 100, and in the -Xw direction and +Yw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-5 fixed to the cushioning material S-5 is set so that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the +Yw direction, and the +Ys direction coincides with the -Xw direction.

[0021] When the electronic device 100 and eight cushioning materials S-1 to S-8 are housed in the packaging box 2, the cushioning material S-6 is a cushioning material S that holds the upper end of the electronic device 100 in the +Zw direction of the electronic device 100, and in the -Xw and -Yw directions of the electronic device 100. Here, the cushioning material coordinate system ΣS-6 fixed to the cushioning material S-6 is set so that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the -Xw direction, and the +Ys direction coincides with the -Yw direction.

[0022] When the electronic device 100 and eight cushioning materials S-1 to S-8 are housed in the packaging box 2, the cushioning material S-7 is a cushioning material S that holds the upper end of the electronic device 100 in the +Zw direction of the electronic device 100, and in the +Xw direction and -Yw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-7 fixed to the cushioning material S-7 is set so that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the -Yw direction, and the +Ys direction coincides with the +Xw direction.

[0023] When the electronic device 100 and eight cushioning materials S-1 to S-8 are housed in the packaging box 2, the cushioning material S-8 is a cushioning material S that holds the upper end of the electronic device 100 in the +Zw direction of the electronic device 100, as well as in the +Xw direction and +Yw direction of the electronic device 100. Here, the cushioning material coordinate system ΣS-8 fixed to the cushioning material S-8 is set so that the +Zs direction coincides with the +Zw direction, the +Xs direction coincides with the +Xw direction, and the +Ys direction coincides with the +Yw direction.

[0024] <<2. About cushioning materials>> FIG. 2 is a perspective view showing an example of the configuration of the cushioning material S. As shown in FIG.

[0025] 2, the cushioning material S includes a plurality of cushioning blocks R for cushioning external forces applied to the electronic device 100, and a plurality of holding materials H for holding the cushioning blocks R. In this embodiment, it is assumed as an example that the cushioning material S includes three holding materials H1 to H3.

[0026] The retaining material H1 comprises a retaining plate P1 arranged so that the +Zs direction is the normal direction, a retaining plate P2 which forms part of the +Zs side of the cushioning material S and is arranged on the +Zs side of the retaining plate P1 so that the +Zs direction is the normal direction, and a connecting plate Ps1 which connects the retaining plate P1 and the retaining plate P2. The retaining material H2 comprises a retaining plate P3 arranged so that the +Xs direction is the normal direction, a retaining plate P4 which forms part of the +Xs side of the cushioning material S and is arranged on the +Xs side of the retaining plate P3 so that the +Xs direction is the normal direction, and a connecting plate Ps2 which connects the retaining plate P3 and the retaining plate P4. The retaining material H3 comprises a retaining plate P5 arranged so that the +Ys direction is the normal direction, a retaining plate P6 which forms part of the +Ys side of the cushioning material S and is arranged on the +Ys side of the retaining plate P5 so that the +Ys direction is the normal direction, and a connecting plate Ps3 which connects the retaining plate P5 and the retaining plate P6.

[0027] Hereinafter, the holding plates P1 to P6 and the connecting plates Ps1 to Ps3 may be collectively referred to as holding plates P. In this embodiment, it is assumed, as an example, that each of the multiple holding plates P that make up the holding material H is made of cardboard.

[0028] As illustrated in Figure 2, in this embodiment, it is assumed that the buffer material S comprises three buffer blocks R1 to R3: buffer block R1 held by holding material H1, buffer block R2 held by holding material H2, and buffer block R3 held by holding material H3.

[0029] The buffer block R1 is held by a holding material H1 between the holding plates P1 and P2. In this embodiment, as an example, it is assumed that the end of the buffer block R1 on the -Zs side is adhered to the holding plate P1 with an adhesive, and the end of the buffer block R1 on the +Zs side is adhered to the holding plate P2 with an adhesive, so that the buffer block R1 is held by the holding material H1. The buffer block R2 is held by a holding material H2 between the holding plates P3 and P4. In this embodiment, as an example, it is assumed that the end of the buffer block R2 on the -Xs side is adhered to the holding plate P3 with an adhesive, and the end of the buffer block R2 on the +Xs side is adhered to the holding plate P4 with an adhesive, so that the buffer block R2 is held by the holding material H2. The buffer block R3 is held by a holding material H3 between the holding plates P5 and P6. In this embodiment, as an example, it is assumed that the end of the buffer block R3 on the -Ys side is adhered to the holding plate P5 with an adhesive, and the end of the buffer block R3 on the +Ys side is adhered to the holding plate P6 with an adhesive, so that the buffer block R3 is held by the holding material H3.

[0030] In this embodiment, it is assumed that the buffer block R is made of a material having lower elasticity than polystyrene foam. In addition, in this embodiment, as an example, a case is assumed in which an object such as paper or clothing containing various fibers such as animal fibers, plant fibers, or chemical fibers is decomposed to obtain the fibers contained in the object, and the obtained fibers are processed to form the buffer block R. More specifically, in this embodiment, a case is assumed in which paper is decomposed to obtain the fibers contained in the paper, and the obtained fibers are solidified to form the buffer block R. As described above, in this embodiment, the buffer block R is formed by obtaining fibers from an object containing fibers, such as paper or clothing. In other words, in this embodiment, when an object containing fibers, such as paper or clothing, is discarded, the buffer block R can be formed by reusing the object. Therefore, according to this embodiment, it is possible to reduce the environmental impact associated with the manufacturing and disposal of the buffer block R.

[0031] In this embodiment, the holding plates P1, P3, and P5 face the electronic device 100 when the cushioning material S and the electronic device 100 are housed in the packaging box 2. Holes AN are formed in the holding plates P1, P3, and P5 at positions that correspond to corners of the electronic device 100 when the cushioning material S and the electronic device 100 are housed in the packaging box 2. The holding plates P2, P4, and P6 face the inner wall surface of the packaging box 2 when the cushioning material S and the electronic device 100 are housed in the packaging box 2.

[0032] In this embodiment, the retaining material H1 is an example of a "first retaining material," and the retaining material H2 is an example of a "second retaining material." In addition, in this embodiment, the retaining plate P1 is an example of a "first plate," the retaining plate P2 is an example of a "second plate," the retaining plate P3 is an example of a "third plate," and the retaining plate P4 is an example of a "fourth plate." In addition, in this embodiment, the buffer block R1 is an example of a "first buffer block," and the buffer block R2 is an example of a "second buffer block." In addition, in this embodiment, the +Zs direction is an example of a "first direction," and the +Xs direction is an example of a "second direction."

[0033] FIG. 3 is a plan view showing an example of the shape of the flat plate member HH.

[0034] In this embodiment, it is assumed, as an example, that the holding materials H1 to H3 provided with the cushioning material S are formed by bending one flat plate member HH illustrated in Fig. 3 along the folding lines θ11 to θ32 illustrated in Fig. 3. As described above, in this embodiment, it is assumed, as an example, that the flat plate member HH is made of cardboard.

[0035] As illustrated in Fig. 3, the flat plate member HH includes a connecting plate Pc12 in addition to the holding plates P1 to P6 and connecting plates Ps1 to Ps3 described in Fig. 2. Note that Fig. 3 illustrates, as an example, a case in which the buffer material coordinate system ΣS is a coordinate system fixed to the holding plate P2, and the holding materials H1 to H3 are unfolded in a state in which the buffer material coordinate system ΣS is fixed to the holding plate P2, thereby obtaining the flat plate member HH.

[0036] As described above, the holding member H1 includes a holding plate P1, a holding plate P2, and a connecting plate Ps1. The holding member H1 also includes a connecting plate Pc12. As illustrated in Fig. 3, the holding plate P2 and the connecting plate Ps1 are connected via a bent line θ11, the connecting plate Ps1 and the holding plate P1 are connected via a bent line θ12, and the holding plate P1 and the connecting plate Pc12 are connected via a bent line θ13.

[0037] As described above, the holding member H2 includes the holding plate P3, the holding plate P4, and the connecting plate Ps2. As illustrated in Fig. 3, the holding plate P3 and the connecting plate Ps2 are connected via a bent line θ21, and the connecting plate Ps2 and the holding plate P4 are connected via a bent line θ22.

[0038] As described above, the holding member H3 includes the holding plate P5, the holding plate P6, and the connecting plate Ps3. As illustrated in Fig. 3, the holding plate P5 and the connecting plate Ps3 are connected via the bent line θ32, and the connecting plate Ps3 and the holding plate P6 are connected via the bent line θ31.

[0039] In this embodiment, the fold line θ13 is a mountain fold line, and the fold lines other than the fold line θ13 are valley fold lines. Here, the valley fold line is a fold line for bending the plate members on both ends of the fold line in the +Zs direction, which is the front side in Fig. 3, around the fold line when forming the holding members H1 to H3 from the flat plate member HH. Also, the mountain fold line is a fold line for bending the plate members on both ends of the fold line in the -Zs direction, which is the back side in Fig. 3, around the fold line when forming the holding members H1 to H3 from the flat plate member HH.

[0040] 3, an arc-shaped recess OB1 is formed in retaining plate P1, a protrusion TK1 is formed in retaining plate P2, a recess OB3 is formed in connecting plate Pc12, and an opening KK2 is formed on the folded line θ12 which is the boundary between retaining plate P1 and connecting plate Ps1. Furthermore, an arc-shaped recess OB2 is formed in retaining plate P3, a protrusion TK2 is formed in retaining plate P4, and an opening KK3 is formed on the folded line θ21 which is the boundary between retaining plate P3 and connecting plate Ps2. Furthermore, an arc-shaped recess OB3 is formed in retaining plate P5, a protrusion TK3 is formed in retaining plate P6, and an opening KK1 is formed on the folded line θ32 which is the boundary between retaining plate P5 and connecting plate Ps3.

[0041] Then, the flat plate member HH is bent in a mountain fold along the fold line θ13, and also bent in a valley fold along the fold lines θ11, θ12, θ14, θ21 to θ23, θ31, and θ32 other than the fold line θ13, so that the protrusion TK1 is fitted into the opening KK1, the protrusion TK2 is fitted into the opening KK2, and the protrusion TK3 is fitted into the opening KK3 and the recess OB3. Furthermore, by bending the flat plate member HH along the fold lines θ11 to θ32, a hole AN is formed by the recesses OB1 to OB3.

[0042] When bending the flat plate member HH along the fold lines θ11 to θ32, one end of the buffer block R1 is adhered to the region Ar1 of the holding plate P1 and the other end of the buffer block R1 is adhered to the region Ar2 of the holding plate P2, thereby holding the buffer block R1 with the holding material H1. When bending the flat plate member HH along the fold lines θ11 to θ32, one end of the buffer block R2 is adhered to the region Ar3 of the holding plate P3 and the other end of the buffer block R2 is adhered to the region Ar4 of the holding plate P4, thereby holding the buffer block R2 with the holding material H2. When bending the flat plate member HH along the fold lines θ11 to θ32, one end of the buffer block R3 is adhered to the region Ar5 of the holding plate P5 and the other end of the buffer block R3 is adhered to the region Ar6 of the holding plate P6, thereby holding the buffer block R3 with the holding material H3.

[0043] FIG. 4 is a cross-sectional view showing an example of a cross section of the buffer material S in FIG. 2 when the buffer material S is cut along a plane perpendicular to the +Ys direction and passing through the buffer blocks R1 and R2.

[0044] As illustrated in Figure 4, the cushioning material S of this embodiment has the -Zs side end of the buffer block R1 adhered to a retaining plate P1, the +Zs side end of the buffer block R1 adhered to a retaining plate P2, and the retaining plates P1 and P2 connected by a connecting plate Ps1.

[0045] In order to explain one of the effects of this embodiment, the buffer material SW provided in the packaging material 1W according to the reference example will be considered below.

[0046] 5 is a cross-sectional view showing an example of a cross section of a cushioning material SW included in a packaging material 1W according to a reference example. The packaging material 1W differs from the packaging material 1 according to the embodiment in that it includes a plurality of cushioning materials SW instead of a plurality of cushioning materials S.

[0047] 5, the cushioning material SW according to the reference example differs from the cushioning material S according to the embodiment in that the holding material H1 does not include the holding plate P2 and the connecting plate Ps1, and the holding material H2 does not include the holding plate P4 and the connecting plate Ps2. That is, in the packaging material 1W according to the reference example, the end on the -Zs side of the buffer block R1 is adhered to the holding plate P1, and the end on the +Zs side of the buffer block R1 is in contact with the inner wall surface of the packaging box 2.

[0048] For example, when an external force is applied to the buffer block R1 provided in the buffer material SW according to the reference example via the packaging box 2 or the electronic device 100, one end of the buffer block R1 may be displaced. For example, when an external force is applied to the buffer block R1 included in the buffer material SW according to the reference example via the packaging box 2 or the electronic device 100, displacing one end of the buffer block R1, the other end of the buffer block R1 may be unable to follow the displacement of the other end of the buffer block R1. If the other end of the buffer block R1 is unable to follow the displacement of the other end of the buffer block R1, the one end of the buffer block R1 will be positioned on the +Xs or -Xs side of the other end. Therefore, when an external force is applied to the buffer block R1 included in the buffer material SW according to the reference example via the packaging box 2 or the electronic device 100, the buffer block R1 may peel off from the holding plate P1 or the packaging box 2. Similarly, in the buffer material SW according to the reference example, buffer blocks R other than the buffer block R1 may peel off from the packaging box 2 or the holding material H due to an external force applied via the packaging box 2 or the electronic device 100, just like the buffer block R1.

[0049] In contrast, in the cushioning material S of this embodiment, as described above, one end of the cushioning block R1 is adhered to the retaining plate P1, the other end of the cushioning block R1 is adhered to the retaining plate P2, and the retaining plates P1 and P2 are connected by the connecting plate Ps1. Therefore, according to the present embodiment, even if an external force is applied to the buffer block R1 via the packaging box 2 or the electronic device 100, causing one end of the buffer block R1 to be displaced, the other end of the buffer block R1 is displaced following the displacement of the one end of the buffer block R1 via the holding plate P1, the connecting plate Ps1, and the holding plate P2. Therefore, according to the present embodiment, compared to the reference example, it is possible to reduce the possibility that the buffer block R1 will peel off from the holding plate P1 or the holding plate P2 to which the buffer block R1 is connected due to an external force applied to the packaging box 2 or the electronic device 100. Similarly, according to the present embodiment, it is possible to reduce the possibility that the buffer blocks R other than the buffer block R1 will peel off from the holding material H to which the buffer block R is connected due to an external force applied to the packaging box 2 or the electronic device 100, compared to the reference example.

[0050] Furthermore, according to the present embodiment, a buffer block R1 is provided between the holding plate P1 and the holding plate P2. Therefore, according to the present embodiment, it is possible to more reliably buffer external forces applied to the electronic device 100 compared to an embodiment in which the buffer block R1 is not provided between the holding plate P1 and the holding plate P2. That is, according to the present embodiment, a buffer block R is provided between the multiple holding plates P of the holding material H. Therefore, according to the present embodiment, it is possible to more reliably buffer external forces applied to the electronic device 100 compared to an embodiment in which the buffer block R is not provided between the multiple holding plates P of the holding material H.

[0051] Furthermore, according to this embodiment, when the packaging material 1 is viewed in the -Zs direction, the connection plate Ps1 is provided in a region different from the region where the electronic device 100 and the packaging box 2 overlap. More specifically, according to this embodiment, when the packaging material 1 is viewed in the -Zs direction, the connection plate Ps1 is provided on the +Xs side of the electronic device 100. Therefore, according to this embodiment, the external force applied to the electronic device 100 can be buffered by the buffering block R1, and it is possible to suppress the influence of the connection plate Ps1 on the buffering of the external force applied to the electronic device 100. Therefore, according to this embodiment, in order to achieve effective buffering of the external force by the buffering material S, it is only necessary to consider the buffering of the external force applied to the electronic device 100 by the buffering block R1. This simplifies the design of the buffering material S compared to an embodiment in which the external force applied to the electronic device 100 is buffered by both the connection plate Ps1 and the buffering block R1. Similarly, according to this embodiment, the connection plate Ps2 is provided on the +Ys side of the electronic device 100, and the connection plate Ps3 is provided on the +Zs side of the electronic device 100, making it easier to design the cushioning material S compared to an embodiment in which the external force applied to the electronic device 100 is cushioned by both the connection plate Ps and the cushioning block R.

[0052] <<3. Conclusion of the First Embodiment>> As described above, the cushioning material S of this embodiment is a cushioning material S that is housed in a packaging box 2 that can house an electronic device 100, and cushions external forces applied to the electronic device 100 housed in the packaging box 2, and is characterized by comprising: a holding material H1 that includes a holding plate P1 that faces the electronic device 100 when the cushioning material S and the electronic device 100 are housed in the packaging box 2, and a holding plate P2 that faces the inner wall surface of the packaging box 2 when the cushioning material S and the electronic device 100 are housed in the packaging box 2; and a cushioning block R1 that is provided between the holding plate P1 and the holding plate P2.

[0053] Therefore, according to this embodiment, it is possible to more reliably buffer the external force applied to the electronic device 100 compared to an embodiment in which the buffer block R1 is not provided between the holding plates P1 and P2.

[0054] Furthermore, the cushioning material S of this embodiment is characterized in that it comprises a holding material H2 including a holding plate P3 that faces the electronic device 100 when the cushioning material S and the electronic device 100 are contained in the packaging box 2, and a holding plate P4 that faces the inner wall surface of the packaging box 2 when the cushioning material S and the electronic device 100 are contained in the packaging box 2, and a buffer block R2 provided between the holding plate P3 and the holding plate P4, wherein the buffer block R1 extends in the +Zs direction from the holding plate P1 toward the holding plate P2, and the buffer block R2 extends in the +Xs direction from the holding plate P3 toward the holding plate P4, and the holding material H1 and the holding material H2 are composed of a single flat plate member HH.

[0055] Therefore, according to this embodiment, it is possible to simplify the management of parts required for manufacturing the cushioning material S, compared to when the cushioning material S is made up of multiple components. Furthermore, according to this embodiment, it is possible to simplify the management of waste generated when the cushioning material S is discarded, compared to when the cushioning material S is made up of multiple components.

[0056] Further, in the buffer material S according to the present embodiment, in the holding plates P1 and P3, when the buffer material S and the electronic device 100 are accommodated in the packing box 2, a hole portion AN is formed at a position corresponding to one of the plurality of corner portions of the electronic device 100. More specifically, in the buffer material S according to the present embodiment, when the buffer material S and the electronic device 100 are accommodated in the packing box 2, a concave portion OB1 is provided in the holding plate P1 and a concave portion OB2 is provided in the holding plate P3 so that the hole portion AN is formed at a position corresponding to one of the plurality of corner portions of the electronic device 100.

[0057] Therefore, according to the present embodiment, it is possible to reduce the possibility that the buffer material S is damaged due to the pressure applied to the buffer material S from the corner portion of the electronic device 100 as compared with a mode in which the hole portion AN is not provided in the buffer material S. Further, according to the present embodiment, as compared with a mode in which the hole portion AN is not provided in the buffer material S, due to the displacement of the holding plate P1 in the +Zs direction or the -Zs direction caused by the pressure applied to the holding plate P1 from the electronic device 100 or the buffer block R1, it is possible to reduce the possibility of damage to the holding plate P1 or the holding plate P3 at the contact portion between the holding plate P1 and the holding plate P3. Further, according to the present embodiment, as compared with a mode in which the hole portion AN is not provided in the buffer material S, due to the displacement of the holding plate P3 in the +Xs direction or the -Xs direction caused by the pressure applied to the holding plate P3 from the electronic device 100 or the buffer block R2, it is possible to reduce the possibility of damage to the holding plate P1 or the holding plate P3 at the contact portion between the holding plate P1 and the holding plate P3.

[0058] <<B. Modified Example>> Each of the above embodiments can be variously modified. Specific modified modes are exemplified below. Two or more modes arbitrarily selected from the following examples can be appropriately combined within a range not conflicting with each other. In the modified examples exemplified below, for elements whose actions and functions are equivalent to those of the embodiment, the reference numerals referred to in the above description are reused and the detailed description of each is appropriately omitted.

[0059] <<Modified Example 1>> In the above-described embodiment, the buffer block R is fixed to the holding material H using an adhesive, but the present invention is not limited to this. The buffer block R may be fixed to the holding material H without using an adhesive.

[0060] FIG. 6 is an exploded perspective view showing an example of the configuration of the cushioning material SA according to this modified example.

[0061] The cushioning material SA differs from the cushioning material S according to the embodiment in that it includes a plurality of holding materials HA instead of a plurality of holding materials H, and a plurality of buffer blocks RA instead of a plurality of buffer blocks R. More specifically, the cushioning material SA differs from the cushioning material S according to the embodiment in that it includes three holding materials HA1 to HA3 instead of three holding materials H1 to H3, and three buffer blocks RA1 to RA3 instead of three buffer blocks R1 to R3.

[0062] The holding material HA differs from the holding material H according to the embodiment in that the holding material HA has two placement plates BB between two holding plates P. Here, the placement plates BB are provided with openings HK for inserting the ends of the buffer blocks RA. One end of the buffer block RA is inserted into an opening HK provided in one of the two placement plates BB arranged between the two holding plates P of the holding material HA, and the other end of the buffer block RA is inserted into an opening HK provided in the other placement plate BB. As a result, the buffer block RA is fixed between the two holding plates P of the holding material HA by frictional forces generated between the opening HK provided in one of the two placement plates BB arranged between the two holding plates P of the holding material HA and one end of the buffer block RA, and frictional forces generated between the opening HK provided in the other placement plate BB and the other end of the buffer block RA.

[0063] For example, as illustrated in FIG. 6 , the holding member HA1 includes a placement plate BB1, one end of which is connected to the holding plate P1 and disposed between the holding plate P1 and the holding plate P2, and a placement plate BB2, one end of which is connected to the holding plate P2 and disposed between the holding plate P1 and the holding plate P2, between the placement plate BB1 ​​and the holding plate P2. The placement plate BB1 ​​has an opening HK1 through which one end of the buffer block RA1 is inserted. The placement plate BB2 has an opening HK2 through which the other end of the buffer block RA1 is inserted. One end of the buffer block RA1 is inserted into the opening HK1, and the other end of the buffer block RA1 is inserted into the opening HK2. Thus, the buffer block RA1 is fixed between the holding plate P1 and the holding plate P2 by the placement plate BB1 ​​and the placement plate BB2.

[0064] The buffer block RA is composed of multiple buffer sheets SS stacked in a direction from one end of the buffer block RA to the other end. Therefore, by placing the buffer block RA between the two holding plates P of the holding material HA, it becomes possible to effectively absorb external forces acting on the holding material HA between the two holding plates P of the holding material HA.

[0065] 7, the buffer block RA1 is made up of multiple buffer sheets SS stacked in the +Zs direction from the holding plate P1 to the holding plate P2. This allows the holding material HA1 to effectively buffer the external force applied to the holding material HA1 in the +Zs direction and the external force applied to the holding material HA1 in the -Zs direction.

[0066] As described above, according to this modification, the buffer block RA is attached to the holding material HA without using adhesive. Therefore, according to this modification, it is possible to reduce the effort required to remove the buffer block RA from the holding material HA when disassembling the buffer material SA, compared to an embodiment in which the buffer block RA is attached to the holding material HA with adhesive. Furthermore, according to this modification, it is easier to completely remove the buffer block RA from the holding material HA when disassembling the buffer material SA, compared to an embodiment in which the buffer block RA is attached to the holding material HA with adhesive, so it is possible to increase the recyclability of the buffer material SA.

[0067] In the cushioning material SA according to this modification, the cushioning block RA1 is characterized by including a plurality of cushioning sheets SS stacked along the +Zs direction from the holding plate P1 toward the holding plate P2.

[0068] Therefore, according to this modified example, it is possible to more effectively cushion external forces in the +Zs or -Zs direction applied to the retaining plate P1 or the retaining plate P2 compared to an embodiment in which the cushioning material SA does not have the cushioning block RA1.

[0069] In addition, in the buffer material SA of this modified example, the holding material HA1 has one end connected to the holding plate P1, a positioning plate BB1 ​​arranged between the holding plate P1 and the holding plate P2, and one end connected to the holding plate P2, a positioning plate BB2 arranged between the holding plate P1 and the holding plate P2, and the buffer block RA1 has one end inserted into an opening HK1 provided in the positioning plate BB1 ​​and the other end inserted into an opening HK2 provided in the positioning plate BB2.

[0070] Therefore, according to this modified example, the frictional force generated between one end of the buffer block RA1 and the opening HK1, and the frictional force generated between the other end of the buffer block RA1 and the opening HK2, allow the buffer block RA1 to be fixed between the holding plates P1 and P2 of the holding material HA1.

[0071] In this modified example, the buffer block RA is made up of a plurality of buffer sheets SS stacked in a direction from one of the two holding plates P that hold the buffer block RA to the other, but the present invention is not limited to this embodiment. The buffer block RA may also be made up of a plurality of buffer sheets SS stacked in a direction that intersects with the direction from one of the two holding plates P that hold the buffer block RA to the other.

[0072] In addition, in this modified example, the buffer block RA is attached to the holding material HA by frictional force without using adhesive, but the present invention is not limited to this. For example, the buffer block RA may be attached to the holding material HA more firmly by using adhesive in addition to frictional force.

[0073] <<Variation 2>> In the above-described embodiment and variant 1, the case where the multiple holding members H of the cushioning material S are formed from a single flat plate member HH has been exemplified, but the present invention is not limited to this aspect. The cushioning material S may be formed from multiple members.

[0074] Fig. 8 is an exploded perspective view showing an example of the configuration of the cushioning material SB included in the packaging material according to this modified example. Fig. 9 is a perspective view showing an example of the configuration of the cushioning material SB included in the packaging material according to this modified example.

[0075] 8, in this modified example, the buffer material SB is composed of three holding materials HB1 to HB3. In this modified example, the holding material HB1 is connected to the holding materials HB2 and HB3, the holding material HB2 is connected to the holding materials HB1 and HB3, and the holding material HB3 is connected to the holding materials HB1 and HB2. Hereinafter, the holding materials HB1 to HB3 may be collectively referred to as the holding material HB.

[0076] The holding material HB1 includes a holding plate P1, a holding plate P2, a connection protrusion member ST1, and a connection opening member SK1, and holds the buffer block R1. Hereinafter, the component of the holding material HB1 that holds the buffer block R1 will be referred to as the holding portion BH1, and the component that connects the holding material HB1 to the holding material HB2 and the holding material HB3 will be referred to as the connecting portion BS1. The holding portion BH1 is a portion of the holding plate P1 and the holding plate P2 that extends in the +Xs direction. In this modification, one end of the buffer block R1 is adhered with an adhesive to the portion of the holding plate P1 that corresponds to the holding portion BH1, and the other end is adhered with an adhesive to the portion of the holding plate P2 that corresponds to the holding portion BH1. The connection portion BS1 includes portions of the holding plate P1 and the holding plate P2 extending in the +Ys direction, a connection protrusion member ST1, and a connection opening member SK1. The connection protrusion member ST1 is a flat plate-like member having one end that is a portion of the holding plate P2 included in the connection portion BS1 and is connected to the holding plate P2 at an end of the holding plate P2 in the +Ys direction, and extending in the -Zs direction. The connection opening member SK1 is a flat plate-like member having an opening, and one end that is a portion of the holding plate P2 included in the connection portion BS1 and is connected to the holding plate P2 at an end of the holding plate P2 in the +Xs direction, and extending in the -Zs direction.

[0077] In this modified example, the holding portion BH1 is an example of a "first holding portion," the connection portion BS1 is an example of a "first connection portion," the +Zs direction is an example of a "first direction," the +Xs direction is an example of a "second direction," and the +Ys direction is an example of a "third direction."

[0078] The holding material HB2 includes a holding plate P3, a holding plate P4, a connection protrusion member ST2, and a connection opening member SK2, and holds the buffer block R2. Hereinafter, the component of the holding material HB2 that holds the buffer block R2 will be referred to as the holding portion BH2, and the component that connects the holding material HB2 to the holding material HB1 and the holding material HB3 will be referred to as the connecting portion BS2. The holding portion BH2 is a portion of the holding plate P3 and the holding plate P4 that extends in the +Ys direction. In this modification, one end of the buffer block R2 is adhered with an adhesive to the portion of the holding plate P3 that corresponds to the holding portion BH2, and the other end is adhered with an adhesive to the portion of the holding plate P4 that corresponds to the holding portion BH2. The connection portion BS2 includes portions of the holding plate P3 and the holding plate P4 extending in the +Zs direction, a connection protrusion member ST2, and a connection opening member SK2. The connection protrusion member ST2 is a flat plate-like member having one end that is a portion of the holding plate P4 included in the connection portion BS2 and is connected to the holding plate P4 at an end of the holding plate P4 in the +Zs direction, and extending in the -Xs direction. The connection opening member SK2 is a flat plate-like member having an opening, and one end that is a portion of the holding plate P4 included in the connection portion BS2 and is connected to the holding plate P4 at an end of the holding plate P4 in the +Ys direction, and extending in the -Xs direction.

[0079] In this modification, the holding portion BH2 is an example of a "second holding portion," and the connecting portion BS2 is an example of a "second connecting portion."

[0080] The holding material HB3 includes a holding plate P5, a holding plate P6, a connection protrusion member ST3, and a connection opening member SK3, and holds the buffer block R3. Hereinafter, the component of the holding material HB3 that holds the buffer block R3 will be referred to as the holding portion BH3, and the component that connects the holding material HB3 to the holding material HB1 and the holding portion BH2 will be referred to as the connecting portion BS3. The holding portion BH3 is a portion of the holding plate P5 and the holding plate P6 that extends in the +Zs direction. In this modification, one end of the buffer block R3 is adhered with an adhesive to a portion of the holding plate P5 that corresponds to the holding portion BH3, and the other end is adhered with an adhesive to a portion of the holding plate P6 that corresponds to the holding portion BH3. The connection portion BS3 includes portions of the holding plate P5 and the holding plate P6 extending in the +Xs direction, a connection protrusion member ST3, and a connection opening member SK3. The connection protrusion member ST3 is a flat plate-like member having one end that is included in the connection portion BS3 of the holding plate P6 and is connected to the holding plate P6 at an end of the holding plate P6 in the +Xs direction, and extending in the -Ys direction. The connection opening member SK3 is a flat plate-like member having an opening formed therein, and one end that is included in the connection portion BS3 of the holding plate P6 and is connected to the holding plate P6 at an end of the holding plate P6 in the +Zs direction, and extending in the -Ys direction.

[0081] In this modification, the holding portion BH3 is an example of a "third holding portion," and the connecting portion BS3 is an example of a "third connecting portion."

[0082] In this modified example, the connection protrusion member ST1 is inserted into an opening provided in the connection opening material SK3, the connection protrusion member ST2 is inserted into an opening provided in the connection opening material SK1, and the connection protrusion member ST3 is inserted into an opening provided in the connection opening material SK2, thereby connecting the retaining material HB1, the retaining material HB2, and the retaining material HB3 to each other and forming the cushioning material SB as shown in Figure 9.

[0083] In this modification, the buffer block R is connected to the holding portion BH with adhesive, but the present invention is not limited to this. For example, in this modification, the holding portion BH may include two positioning plates BB with openings HK, as shown in Figures 6 and 7, and the buffer block R may be held by the holding portion BH by inserting both ends into the two openings HK corresponding to the two positioning plates BB. In this case, the buffer block R may be fixed to the holding portion BH without using adhesive.

[0084] As described above, the cushioning material SB according to this modification includes a holding material HB1 including a holding plate P1 that faces the electronic device 100 when the cushioning material SB and the electronic device 100 are housed in the packaging box 2, and a holding plate P2 that faces the inner wall surface of the packaging box 2 when the cushioning material SB and the electronic device 100 are housed in the packaging box 2, a buffer block R1 provided between the holding plate P1 and the holding plate P2, a holding plate P3 that faces the electronic device 100 when the cushioning material SB and the electronic device 100 are housed in the packaging box 2, and a holding plate P4 that faces the inner wall surface of the packaging box 2 when the cushioning material SB and the electronic device 100 are housed in the packaging box 2. The device comprises a holding material HB2 and a buffer block R2 arranged between holding plates P3 and P4, wherein the holding material HB1 holds the buffer block R1 between holding plates P1 and P2 and comprises a holding portion BH1 extending in the +Xs direction and a connecting portion BS1 extending in the +Ys direction, and the holding material HB2 comprises a holding portion BH2 holding the buffer block R2 between holding plates P3 and P4 and a holding portion BH2 connected to holding portion BH1, wherein the buffer block R2 extends in the +Xs direction, the holding portion BH2 extends in the +Ys direction, and the connecting portion BS2 extends in the +Zs direction.

[0085] Therefore, according to this modification, it is possible to buffer the external force applied from the +Zs direction and the external force applied from the +Xs direction.

[0086] In addition, the cushioning material SB of this modified example comprises a holding material HB3 including a holding plate P5 that faces the electronic device 100 when the cushioning material SB and the electronic device 100 are contained in the packaging box 2, and a holding plate P6 that faces the inner wall surface of the packaging box 2 when the cushioning material SB and the electronic device 100 are contained in the packaging box 2, and a cushioning block R3 provided between the holding plate P5 and the holding plate P6, and the holding material HB3 comprises a holding portion BH3 that holds the cushioning block R3 between the holding plate P5 and the holding plate P6, and a connection portion BS3 that is connected to the connection portion BS1 and the connection portion BS2, and the cushioning block R3 extends in the +Ys direction, the holding portion BH3 extends in the +Zs direction, and the connection portion BS3 extends in the +Xs direction.

[0087] Therefore, according to this modified example, it is possible to buffer the external force applied from the +Zs direction, the external force applied from the +Xs direction, and the external force applied from the +Ys direction.

[0088] <<Variation 3>> In the above-described embodiment and modified examples 1 and 2, the packaging material includes eight cushioning materials, but the present invention is not limited to this. For example, the packaging material may include fewer than eight cushioning materials.

[0089] FIG. 10 is an exploded perspective view showing an example of the configuration of a packaging material 1C according to this modified example.

[0090] 10, packaging material 1C according to this modification differs from packaging material 1 according to the embodiment in that it includes four cushioning materials SC instead of eight cushioning materials S. Specifically, packaging material 1C differs from packaging material 1 according to the embodiment in that it includes four cushioning materials SC-1 to SC-4 instead of eight cushioning materials S-1 to S-8.

[0091] Cushioning material SC-1 includes cushioning material S-1, cushioning material S-2, and connecting material CN-1 that connects cushioning material S-1 and cushioning material S-2. Cushioning material SC-2 includes cushioning material S-3, cushioning material S-4, and connecting material CN-2 that connects cushioning material S-3 and cushioning material S-4. Cushioning material SC-3 includes cushioning material S-5, cushioning material S-6, and connecting material CN-3 that connects cushioning material S-5 and cushioning material S-6. Cushioning material SC-4 includes cushioning material S-7, cushioning material S-8, and connecting material CN-4 that connects cushioning material S-7 and cushioning material S-8.

[0092] Hereinafter, connecting material CN-1, connecting material CN-2, connecting material CN-3, and connecting material CN-4 may be collectively referred to as connecting material CN. Also, below, cushioning material S-1, cushioning material S-3, cushioning material S-5, and cushioning material S-7 may be collectively referred to as cushioning material SP, and cushioning material S-2, cushioning material S-4, cushioning material S-6, and cushioning material S-8 may be collectively referred to as cushioning material SQ. That is, in this modified example, cushioning material SC includes cushioning material SP, cushioning material SQ, and connecting material CN that connects cushioning material SP and cushioning material SQ. Note that in this modified example, as an example, it is assumed that cushioning material SC is formed from a single flat plate member HHC.

[0093] FIG. 11 is a plan view showing an example of the shape of the flat plate member HHC.

[0094] As illustrated in FIG. 11, the flat plate member HHC includes the flat plate member HH shown in FIG. 3, a flat plate member HHy obtained by inverting the flat plate member HH so that the +Ys direction and the -Ys direction are opposite, and a connecting flat plate member CNT1 that connects the flat plate member HH and the flat plate member HHy. The flat plate member HHC is then bent along the dotted lines and the dash-dotted lines to form a buffer material SC. Specifically, the flat plate member HH is bent along the dotted lines and the dash-dotted lines to form a buffer material SP. The flat plate member HHy is bent along the dotted lines and the dash-dotted lines to form a buffer material SQ. The connecting flat plate member CNT1 is bent along the dotted lines to form a connecting material CN. In FIG. 11, similar to FIG. 3, dotted lines indicate valley folds and dash-dotted lines indicate mountain folds. Furthermore, Figure 11 shows an example in which the buffer material coordinate system ΣS is a coordinate system fixed to the holding plate P2 of the buffer material SP, and a flat plate member HHC is obtained by unfolding the buffer material SP, the buffer material SQ, and the connecting material CN while the buffer material coordinate system ΣS is fixed to the holding plate P2 of the buffer material SP.

[0095] In the following, the retaining material H1 provided on the cushioning material SP will be referred to as retaining material H1-P, the retaining material H2 provided on the cushioning material SP will be referred to as retaining material H2-P, the retaining plate P1 provided on the retaining material H1-P will be referred to as retaining plate P1-P, the retaining plate P2 provided on the retaining material H1-P will be referred to as retaining plate P2-P, the retaining plate P3 provided on the retaining material H2-P will be referred to as retaining plate P3-P, the retaining plate P4 provided on the retaining material H2-P will be referred to as retaining plate P4-P, the buffer block R1 provided between the retaining plate P1-P and the retaining plate P2-P will be referred to as buffer block R1-P, and the buffer block R2 provided between the retaining plate P3-P and the retaining plate P4-P will be referred to as buffer block R2-P. Furthermore, in the following, the retaining material H1 provided by the buffer material SQ will be referred to as retaining material H1-Q, the retaining material H2 provided by the buffer material SQ will be referred to as retaining material H2-Q, the retaining plate P1 provided by the retaining material H1-Q will be referred to as retaining plate P1-Q, the retaining plate P2 provided by the retaining material H1-Q will be referred to as retaining plate P2-Q, the retaining plate P3 provided by the retaining material H2-Q will be referred to as retaining plate P3-Q, the retaining plate P4 provided by the retaining material H2-Q will be referred to as retaining plate P4-Q, the buffer block R1 provided between the retaining plate P1-Q and the retaining plate P2-Q will be referred to as buffer block R1-Q, and the buffer block R2 provided between the retaining plate P3-Q and the retaining plate P4-Q will be referred to as buffer block R2-Q.

[0096] As described above, the cushioning material SC according to this modification is a cushioning material SC that is housed in a packaging box 2 that can house an electronic device 100, and that cushions external forces acting on the electronic device 100 housed in the packaging box 2, and includes a holding material H1-P that includes a holding plate P1-P that faces the electronic device 100 when the cushioning material SC and the electronic device 100 are housed in the packaging box 2, and a holding plate P2-P that faces the inner wall surface of the packaging box 2 when the cushioning material SC and the electronic device 100 are housed in the packaging box 2, a buffer block R1-P provided between the holding plate P1-P and the holding plate P2-P, and a cushioning material SC and an electronic device 100 that are housed in the packaging box 2. a holding material H2-P including a holding plate P3-P that faces the electronic device 100 when the electronic device is housed in the packaging box 2, and a holding plate P4-P that faces the inner wall surface of the packaging box 2 when the cushioning material SC and the electronic device 100 are housed in the packaging box 2; a buffer block R2-P provided between the holding plate P3-P and the holding plate P4-P; a holding material H1-Q including a holding plate P1-Q that faces the electronic device 100 when the cushioning material SC and the electronic device 100 are housed in the packaging box 2, and a holding plate P2-Q that faces the inner wall surface of the packaging box 2 when the cushioning material SC and the electronic device 100 are housed in the packaging box 2; a holding material H2-Q including a buffer block R1-Q provided between P and the holding plate P2-P, a holding plate P3-Q that faces the electronic device 100 when the buffer material SC and the electronic device 100 are housed in the packaging box 2, and a holding plate P4-Q that faces the inner wall surface of the packaging box 2 when the buffer material SC and the electronic device 100 are housed in the packaging box 2, and a buffer block R2-Q provided between the holding plate P3-Q and the holding plate P4-Q, wherein the buffer block R1-P extends in the +Zs direction from the holding plate P1-P toward the holding plate P2-P, and the buffer block R2-P extends in the +Zs direction from the holding plate P3-P toward the holding plate the buffer block R1-Q extends in the +Zs direction from the holding plate P1-Q toward the holding plate P2-Q, and the buffer block R2-Q extends in the +Ys direction from the holding plate P3-Q toward the holding plate P4-Q; the holding material H1-P, the holding material H2-P, the holding material H1-Q, and the holding material H2-Q are composed of a single flat plate member HHC; and when the buffer material SC and the electronic device 100 are accommodated in the packaging box 2, the holding material H1-P and the holding material H2-P are arranged as a buffer material SP at a position corresponding to one of a plurality of corners of the electronic device 100;The holding material H1-Q and the holding material H2-Q are characterized in that, when the cushioning material SC and the electronic device 100 are housed in the packaging box 2, they are arranged as cushioning material SQ at positions corresponding to other corners of the electronic device 100.

[0097] Therefore, according to this modification, it is possible to buffer external forces applied from the +Zs direction, the +Xs direction, and the +Ys direction. Therefore, in this modification, in order to buffer external forces from all directions, it is sufficient for the packaging material 1C to include at least four buffer materials SC. Also, in this modification, in order to buffer external forces from the -Zw direction, it is sufficient for the packaging material 1C to include at least two buffer materials SC.

[0098] In this modified example, retaining material H1-P is an example of a "first retaining material," retaining material H2-P is an example of a "second retaining material," retaining material H1-Q is an example of a "third retaining material," retaining material H2-Q is an example of a "fourth retaining material," retaining plate P1-P is an example of a "first plate," retaining plate P2-P is an example of a "second plate," retaining plate P3-P is an example of a "third plate," retaining plate P4-P is an example of a "fourth plate," retaining plate P1-Q is an example of a "fifth plate," retaining plate P2-Q is an example of a "sixth plate," retaining plate P3-Q is an example of a "seventh plate," and retaining plate P4-Q is an example of an "eighth plate." Furthermore, in this modified example, the +Zs direction is an example of the "first direction," the +Xs direction is an example of the "second direction," the +Zs direction is an example of the "third direction," and the +Ys direction is an example of the "fourth direction."

[0099] <<Variation 4>> In the above-described third modification, among the multiple cushioning materials SC included in packaging material 1C, cushioning material SC-1 is formed from a material different from the material used to form cushioning material SC-2, but the present invention is not limited to this embodiment. Of the multiple cushioning materials SC included in packaging material 1C, cushioning materials SC-1 and SC-2 may be formed from a single flat plate member. Similarly, of the multiple cushioning materials SC included in packaging material 1C, cushioning materials SC-3 and SC-4 may be formed from a single flat plate member.

[0100] FIG. 12 is an exploded perspective view showing an example of the configuration of a packaging material 1D according to this modified example.

[0101] 12, packaging material 1D according to this modification differs from packaging material 1C according to modification 3 in that it includes two cushioning materials SD instead of four cushioning materials SC. Specifically, packaging material 1D differs from packaging material 1C according to modification 3 in that it includes two cushioning materials SD-1 to SD-2 instead of four cushioning materials SC-1 to SC-4.

[0102] Of these, cushioning material SD-1 comprises cushioning material S-1, cushioning material S-2, cushioning material S-3, cushioning material S-4, connecting material CN-12 connecting cushioning material S-1 and cushioning material S-2, connecting material CN-23 connecting cushioning material S-2 and cushioning material S-3, connecting material CN-34 connecting cushioning material S-3 and cushioning material S-4, and connecting material CN-41 connecting cushioning material S-4 and cushioning material S-1. In addition, cushioning material SD-2 includes cushioning material S-5, cushioning material S-6, cushioning material S-7, cushioning material S-8, connecting material CN-56 connecting cushioning material S-5 and cushioning material S-6, connecting material CN-67 connecting cushioning material S-6 and cushioning material S-7, connecting material CN-78 connecting cushioning material S-7 and cushioning material S-8, and connecting material CN-85 connecting cushioning material S-8 and cushioning material S-5.

[0103] Hereinafter, cushioning materials S-1 and S-5 may be collectively referred to as cushioning material S-F1, cushioning materials S-2 and S-6 may be collectively referred to as cushioning material S-F2, cushioning materials S-3 and S-7 may be collectively referred to as cushioning material S-F3, and cushioning materials S-4 and S-8 may be collectively referred to as cushioning material S-F4. Also, below, connecting materials CN-12 and CN-56 may be collectively referred to as connecting material CN-F12, connecting materials CN-23 and CN-67 may be collectively referred to as connecting material CN-F23, connecting materials CN-34 and CN-78 may be collectively referred to as connecting material CN-F34, and connecting materials CN-41 and CN-85 may be collectively referred to as connecting material CN-F41.

[0104] That is, in this modified example, the cushioning material SD includes cushioning material S-F1, cushioning material S-F2, cushioning material S-F3, cushioning material S-F4, connecting material CN-F12 that connects cushioning material S-F1 and cushioning material S-F2, connecting material CN-F23 that connects cushioning material S-F2 and cushioning material S-F3, connecting material CN-F34 that connects cushioning material S-F3 and cushioning material S-F4, and connecting material CN-F41 that connects cushioning material S-F4 and cushioning material S-F1. Note that in this modified example, as an example, it is assumed that the cushioning material SD is formed from a single flat plate member HHD.

[0105] FIG. 13 is a plan view showing an example of the shape of the flat plate member HHD.

[0106] 13, the flat plate member HHD includes a flat plate member HH1, a flat plate member HH2, a flat plate member HH3, and a flat plate member HH4. Here, the flat plate members HH1 and HH3 have the same shape as the flat plate member HH shown in Fig. 3. Furthermore, the flat plate members HH2 and HH4 have the same shape as the flat plate member HHy shown in Fig. 11. The flat plate member HHD also includes a connecting flat plate member CNT12 that connects the flat plate member HH1 and the flat plate member HH2, a connecting flat plate member CNT23 that connects the flat plate member HH2 and the flat plate member HH3, a connecting flat plate member CNT41 that connects the flat plate member HH4 and the flat plate member HH1, a connecting flat plate member CNT341 that is connected to the flat plate member HH3, and a connecting flat plate member CNT342 that connects the connecting flat plate member CNT341 and the flat plate member HH4.

[0107] Then, the flat plate member HHD is bent along the dotted lines and the dashed dotted lines to form the cushioning material SD. Specifically, the buffer material S-F1 is formed by bending the flat plate member HH1 along the dotted line and the dashed-dotted line. The buffer material S-F2 is formed by bending the flat plate member HH2 along the dotted line and the dashed-dotted line. The buffer material S-F3 is formed by bending the flat plate member HH3 along the dotted line and the dashed-dotted line. The buffer material S-F4 is formed by bending the flat plate member HH4 along the dotted line and the dashed-dotted line. The connecting member CN-F12 is formed by bending the connecting plate member CNT12 along the dotted line. The connecting member CN-F23 is formed by bending the connecting plate member CNT23 along the dotted line. The connecting member CN-F41 is formed by bending the connecting plate member CNT41 along the dotted line. Furthermore, a connecting material CN-F34 is formed by connecting a member obtained by bending connecting flat plate member CNT341 along the dotted line with a member obtained by bending connecting flat plate member CNT342 along the dotted line. In FIG. 13, similar to FIG. 3, dotted lines indicate valley folds and dashed lines indicate mountain folds. In addition, FIG. 13 illustrates an example in which the buffer coordinate system ΣS is a coordinate system fixed to the holding plate P2 of the buffer material S-F1, and a flat plate member HHD is obtained by unfolding the buffer materials S-F1 to S-F4, connecting flat plate member CNT12, connecting flat plate member CNT23, connecting flat plate member CNT41, connecting flat plate member CNT341, and connecting flat plate member CNT342 while the buffer coordinate system ΣS is fixed to the holding plate P2 of the buffer material S-F1.

[0108] As described above, according to this modification, the cushioning material SD can buffer external forces applied from the +Zs direction, the +Xs direction, the -Xs direction, the +Ys direction, and the -Ys direction. Therefore, in this modification, to buffer external forces from all directions, the packaging material 1D only needs to include at least two cushioning materials SD. Furthermore, in this modification, to buffer external forces from the -Zw direction, the packaging material 1D only needs to include at least one cushioning material SD.

[0109] <<Variation 5>> In the above-described embodiment and modified examples 1 to 4, the Xw-axis, Yw-axis, and Zw-axis of the packing box coordinate system ΣW are perpendicular to each other, but the present invention is not limited to this. The Xw-axis, Yw-axis, and Zw-axis of the packing box coordinate system ΣW may extend in different directions. In the above-described embodiment and modifications 1 to 4, the Xs-axis, Ys-axis, and Zs-axis of the buffer material coordinate system ΣS are perpendicular to one another, but the present invention is not limited to this. The Xs-axis, Ys-axis, and Zs-axis of the buffer material coordinate system ΣS may extend in different directions.

[0110] <<Variation 6>> In the above-described embodiment and variations 1 to 5, the packaging material has 24 buffer blocks, but the present invention is not limited to this. The packaging material according to the present invention may have 1 to 23 buffer blocks, or 25 or more buffer blocks. [Explanation of symbols]

[0111] 1...packaging material, 2...packaging box, 100...electronic device, H...retaining material, H1...retaining material, H2...retaining material, H3...retaining material, P...retaining plate, P1...retaining plate, P2...retaining plate, P3...retaining plate, R...buffer block, R1...buffer block, R2...buffer block, R3...buffer block, S...buffer material.

Claims

1. A cushioning material that is housed in a packaging box capable of housing an electronic device and that buffers external forces applied to the electronic device housed in the packaging box, a first plate that faces the electronic device when the cushioning material and the electronic device are housed in the packaging box; and a first retaining material including a second plate that faces an inner wall surface of the packaging box when the cushioning material and the electronic device are housed in the packaging box; a first buffer block provided between the first plate and the second plate; Equipped with The first holding material is a first arrangement plate having one end connected to the first plate and disposed between the first plate and the second plate; a second arrangement plate having one end connected to the second plate and disposed between the first plate and the second plate; Equipped with The first buffer block is One end is inserted into a first opening provided in the first arrangement plate, The other end is inserted into a second opening provided in the second arrangement plate. A cushioning material characterized by:

2. The first buffer block is a plurality of buffer sheets stacked along a first direction from the first plate toward the second plate; The cushioning material according to claim 1 .

3. A cushioning material that is housed in a packaging box capable of housing an electronic device and that buffers external forces applied to the electronic device housed in the packaging box, a first plate that faces the electronic device when the cushioning material and the electronic device are housed in the packaging box; and a first retaining material including a second plate that faces an inner wall surface of the packaging box when the cushioning material and the electronic device are housed in the packaging box; a first buffer block provided between the first plate and the second plate; a third plate that faces the electronic device when the cushioning material and the electronic device are housed in the packaging box; and a second holding material including a fourth plate that faces an inner wall surface of the packaging box when the cushioning material and the electronic device are housed in the packaging box; a second buffer block provided between the third plate and the fourth plate; Equipped with The first holding material is The first buffer block is held between the first plate and the second plate; a first holding portion extending in a second direction intersecting a first direction from the first plate toward the second plate; a first connection portion extending in a third direction intersecting the first direction and the second direction; Equipped with The second holding material is a second holding portion that holds the second buffer block between the third plate and the fourth plate; a second connection portion connected to the first connection portion; Equipped with the second buffer block extends in the second direction from the third plate toward the fourth plate, the second holding portion extends in the third direction, The second connection portion extends in the first direction. A cushioning material characterized by:

4. a fifth plate that faces the electronic device when the cushioning material and the electronic device are housed in the packaging box; and a third holding material including a sixth plate that faces an inner wall surface of the packaging box when the cushioning material and the electronic device are housed in the packaging box; a third buffer block provided between the fifth plate and the sixth plate; Equipped with The third holding material is a third holding portion that holds the third buffer block between the fifth plate and the sixth plate; a third connection portion connected to the first connection portion and the second connection portion; Equipped with the third buffer block extends in the third direction from the fifth plate toward the sixth plate, the third holding portion extends in the first direction; The third connection portion extends in the second direction. The cushioning material according to claim 3 .

5. a third plate that faces the electronic device when the cushioning material and the electronic device are housed in the packaging box; and a second holding material including a fourth plate that faces an inner wall surface of the packaging box when the cushioning material and the electronic device are housed in the packaging box; a second buffer block provided between the third plate and the fourth plate; Equipped with the first buffer block extends in a first direction from the first plate toward the second plate; the second buffer block extends from the third plate toward the fourth plate in a second direction intersecting the first direction; The first holding material and the second holding material are each composed of a single flat plate member. The cushioning material according to claim 1 or 2, characterized in that

6. The first plate and the third plate have When the cushioning material and the electronic device are housed in the packaging box, a hole is formed at a position corresponding to one of a plurality of corners of the electronic device; The cushioning material according to claim 5 .

7. a fifth plate that faces the electronic device when the cushioning material and the electronic device are housed in the packaging box; and a third holding material including a sixth plate that faces an inner wall surface of the packaging box when the cushioning material and the electronic device are housed in the packaging box; a third buffer block provided between the fifth plate and the sixth plate; a seventh plate that faces the electronic device when the cushioning material and the electronic device are housed in the packaging box; and a fourth holding material including an eighth plate that faces an inner wall surface of the packaging box when the cushioning material and the electronic device are housed in the packaging box; a fourth buffer block provided between the seventh plate and the eighth plate; Equipped with the third buffer block extends in a third direction from the fifth plate toward the sixth plate, the fourth buffer block extends from the seventh plate toward the eighth plate in a fourth direction intersecting the third direction, The first holding material, the second holding material, the third holding material, and the fourth holding material are The flat plate member is configured as the single flat plate member, The first holding material and the second holding material are When the cushioning material and the electronic device are housed in the packaging box, the electronic device is provided with a plurality of corners, and the corners are arranged at a position corresponding to one of the plurality of corners of the electronic device; The third holding material and the fourth holding material are When the cushioning material and the electronic device are housed in the packaging box, and arranged at a position corresponding to another corner among the plurality of corners. The cushioning material according to claim 5 or 6, characterized in that

8. a packaging box capable of accommodating electronic devices; The cushioning material according to any one of claims 1 to 7; A packaging material comprising:

9. Electronic devices and a packaging box capable of housing the electronic device; The cushioning material according to any one of claims 1 to 7; A package comprising:

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