Method for fabricating non-planar arrays using a single flex-hybrid circuit card

Abstract

A method of manufacturing a printed circuit assembly includes providing a flexible hybrid circuit (18) having a base (20) and at least one side panel (24a-c). The at least one side panel (24a-c) is hingedly connected to the base (20). The method further includes disposing a support structure (12) on the flexible hybrid circuit (18). The support structure (12) includes a base disposed on the base (20) of the flexible hybrid circuit (18) and at least one side corresponding to the at least one side panel (24a-c) of the flexible hybrid circuit (18). The method further includes folding the at least one side panel (24a-c) of the flexible hybrid circuit (18) so that the at least one side panel (24a-c) is disposed flush with the at least one side of the support structure (12) to create a printed circuit assembly.

Description

[Background technology]

[0001] Due to their non-planar nature and small size, multi-directional arrays cannot be manufactured using existing design and manufacturing techniques. A typical missile system radar system, such as the radar system shown in Figure 1, is planar and includes a gimbal-mounted passive antenna. Summary of the Invention

[0002] One aspect of the present disclosure relates to a method of manufacturing a printed circuit assembly. In one embodiment, the method includes providing a flexible hybrid circuit having a base and at least one side panel, the at least one side panel being hingedly connected to the base; disposing a support structure on the flexible hybrid circuit, the support structure including a base disposed on the base of the flexible hybrid circuit and at least one side corresponding to the at least one side panel of the flexible hybrid circuit; and folding the at least one side panel of the flexible hybrid circuit such that the at least one side panel is disposed flush with the at least one side of the support structure to create a printed circuit assembly.

[0003] Embodiments of the method may further include configuring the base of the support structure to include a three-sided base, with at least one side of the support structure having three sides with the three sides together forming the shape of a triangular pyramid. The flexible hybrid circuit may include a three-sided base panel sized and shaped to receive the base of the support structure and three three-sided side panels sized and shaped to receive respective sides of the support structure. The base panel and each side panel of the flexible hybrid circuit may be fabricated from a PCB, with each side panel hinged to the base panel by the flexible hybrid circuit providing electrical and mechanical connections. Each hinge may include a thin insulating polymer film to which a conductive circuit pattern is applied, typically with a thin polymer coating to protect the conductive circuit. The method may further include securing at least the side panel of the flexible hybrid circuit to at least one side of the support structure with one or more fasteners. The support structure may include one or more components. The one or more components may include at least one waveguide and, optionally, one of a sensor, an auxiliary electronics, a gyroscope, or a cooling module. The base of the support structure may include a polygonal-sided base, and at least one side of the support structure may include a side having corresponding polygonal sides that together form the shape of a three-dimensional object. The flexible hybrid circuit may include a polygonal-sided base panel sized and shaped to receive the polygonal-sided base of the support structure, and a corresponding number of polygonal-sided side panels sized and shaped to be received on each side of the support structure. The base panel and each side panel of the flexible hybrid circuit may be fabricated from a PCB, with each side panel hinged to the base panel by the flexible hybrid circuit, which provides an electrical and mechanical connection.

[0004] Another aspect of the present disclosure relates to a printed circuit assembly comprising a flexible hybrid circuit having a base and at least one side panel, the at least one side panel being hingedly connected to the base, and a support structure on the flexible hybrid circuit. The support structure includes a base that is positioned on the base of the flexible hybrid circuit when the flexible hybrid circuit and the support structure are assembled, and at least one side surface that corresponds to the at least one side panel of the flexible hybrid circuit. The at least one side panel of the flexible hybrid circuit is configured to be folded such that the at least one side panel is positioned flush with the at least one side surface of the support structure to create the printed circuit assembly.

[0005] An embodiment of the assembly may further include configuring the base of the support structure to include a three-sided base, with at least one side of the support structure including three sides that together form a triangular pyramid shape. The flexible hybrid circuit may include a three-sided base panel sized and shaped to receive the base of the support structure and three three-sided side panels sized and shaped to receive the respective sides of the support structure. The base panel and each side panel of the flexible hybrid circuit may be fabricated from a PCB, with each side panel hinged to the base panel by the flexible hybrid circuit providing electrical and mechanical connections. Each hinge may include a thin insulating polymer film to which a conductive circuit pattern is applied, typically with a thin polymer coating to protect the conductive circuit. The support structure may include one or more components. The one or more components may include one of a sensor, an auxiliary electronics, a gyroscope, or a cooling module. The base of the support structure may include a polygonal-sided base, and at least one side of the support structure may include a side having a corresponding polygonal side that together form the shape of a three-dimensional object, and the flexible hybrid circuit includes a polygonal-sided base panel sized and shaped to receive the polygonal-sided base of the support structure, and a corresponding number of polygonal-sided side panels sized and shaped to be received in each side of the support structure. The base panel and each side panel of the flexible hybrid circuit may be fabricated from a PCB, and each side panel is hingedly connected to the base panel by the flexible hybrid circuit, which provides an electrical and mechanical connection.

[0006] Various aspects of at least one embodiment are described below with reference to the accompanying drawings, which are not intended to be drawn to scale. The drawings are included to provide illustration and a further understanding of various aspects and embodiments, and are incorporated into and constitute a part of this specification, but are not intended to define the limits of the present disclosure. In the drawings, identical or nearly identical components shown in various figures may be represented by like numerals. For clarity, not every component is labeled in every figure. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view of a typical missile and projectile radar system. [Figure 2A] FIG. 1 is a perspective view of a structural support used to fabricate the non-planar array of the present disclosure. [Figure 2B] FIG. 1 is a perspective view of a flexible hybrid circuit used to fabricate non-planar arrays. [Figure 2C] FIG. 1 is a perspective view of a flexible hybrid circuit before being folded around a structural support. [Figure 2D] FIG. 1 is a perspective view of a flexible hybrid circuit being folded around a structural support to create a flexible hybrid circuit assembly. [Figure 3] FIG. 2E is an enlarged cross-sectional view of a portion of the flexible hybrid circuit assembly shown in FIG. 2D. [Figure 4A] FIG. 1 is a perspective view of the flexible hybrid circuit and structural support prior to folding, where the structural support has cavities for supporting internal components of the flexible hybrid circuit. [Figure 4B] FIG. 4B is a perspective view of the flexible hybrid circuit assembly shown in FIG. 4A, where the flexible hybrid circuit is folded around a structural support. [Figure 4C] FIG. 4C is a perspective view of the flexible hybrid circuit assembly shown in FIG. 4B showing details of the assembly. [Figure 5A] FIG. 4B is an enlarged cross-sectional view of a portion of the flexible hybrid circuit and structural support shown in FIG. 4A. [Figure 5B] FIG. 4C is an enlarged cross-sectional view of a portion of the flexible hybrid circuit assembly shown in FIG. 4B. [Figure 6A] FIG. 10 is a perspective view of a flexible hybrid circuit and structural support of another embodiment of the present disclosure, before folding, where the structural support has cavities for supporting internal components. [Figure 6B] FIG. 6B is a perspective view of the flexible hybrid circuit and structural support shown in FIG. 6A, where the flexible hybrid circuit is folded around the structural support to create a flexible hybrid circuit assembly. [Figure 6C] FIG. 6B is a perspective view of the flexible hybrid circuit and structural support shown in FIG. 6A showing details of the structural support. [Figure 7A] FIG. 10 is a perspective view of a flexible hybrid circuit and structural support of another embodiment of the present disclosure, before folding, where the structural support has cavities for supporting internal components. [Figure 7B] FIG. 7B is a perspective view of the flexible hybrid circuit and structural support shown in FIG. 7A, where the flexible hybrid circuit is folded around the structural support to create a flexible hybrid circuit assembly. [Figure 7C] FIG. 7C is a perspective view of the flexible hybrid circuit assembly shown in FIG. 7B showing details of the assembly. [Figure 8A] FIG. 10 is a perspective view of a flexible hybrid circuit and structural support of another embodiment of the present disclosure, before folding, where the structural support has cavities for supporting internal components. [Figure 8B] FIG. 8B is a perspective view of the flexible hybrid circuit and structural support shown in FIG. 8A, where the flexible hybrid circuit is folded around the structural support to create a flexible hybrid circuit assembly. [Figure 8C]FIG. 8C is a perspective view of the flexible hybrid circuit assembly shown in FIG. 8B showing details of the assembly. DETAILED DESCRIPTION OF THE INVENTION

[0008] Embodiments of the present disclosure relate to a bendable, flexible hybrid circuit card assembly (CCA) that combines standard printed circuit board (PCB) and flexible circuit card assembly technology, allowing it to be constructed as a single circuit card, bendable to fit a predetermined three-dimensional structure, such as a triangular pyramid, with integrated waveguides that do not require additional interconnects, and enabling multi-directional transmit and receive capabilities.

[0009] In one embodiment, an integrated waveguide structure provides radio frequency (RF) interconnects, thermal management, and antenna structure. A conformal facet antenna minimizes scattering, and a flexible hybrid circuit provides direct current (DC) power and logic interconnects from the facet antenna to a combiner board. The combination of flexible hybrid and waveguide connections allows for manufacturing without the need for miniaturized connectors, which can be difficult or impossible to assemble into tilted antennas to maintain a wider field of view.

[0010] Any of the above exemplary techniques and / or other techniques may be combined to create various electromagnetic components and / or circuits. Aspects and examples of such techniques are described and illustrated herein with respect to radio frequency interconnects for containing and transmitting electromagnetic signals along a layer of an electromagnetic circuit in one dimension and vertically to other layers of the circuit in another dimension. The techniques described herein may be used to form various electromagnetic components, connectors, circuits, assemblies, and systems.

[0011] It should be understood that embodiments of processes according to the present disclosure are not limited in their application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. The processes may be implemented in other embodiments and may be practiced or carried out in various ways. Examples of specific implementations are provided herein for purposes of illustration only and are not intended to be limiting. Additionally, the phraseology and terminology used herein are for purposes of description and should not be considered limiting. The use of words such as "including," "comprising," "having," "containing," "involving," and variations thereof herein means the inclusion of the items listed thereafter and equivalents thereof, as well as additional items. References to "or" may be construed as inclusive, such that terms described using "or" may refer to either one, more than one, and all described terms. References to front, back, left and right, top and bottom, upper and lower, edge, side, vertical and horizontal, etc., are intended for convenience of description and do not limit the systems and processes or components thereof to any one location or spatial orientation.

[0012] The terms "radio frequency" or "RF," as used herein, are not intended to be limited to a particular frequency, frequency range, band, spectrum, etc., unless expressly stated and / or specifically indicated by context. Similarly, the terms "radio frequency signal" and "electromagnetic signal" are used interchangeably and may refer to signals of various frequencies suitable for propagating information-carrying signals in particular embodiments. Such radio frequency signals may generally be bound at the lower end to frequencies in the kilohertz (kHz) range and at the upper end to frequencies up to hundreds of gigahertz (GHz), and explicitly include signals in the microwave or millimeter-wave range. In general, the processes described herein may be suitable for working with non-ionizing radiation at lower frequencies than those traditionally worked with in the optical field, e.g., lower frequencies than infrared signals.

[0013] Various embodiments of radio frequency circuits may be designed with selected and / or nominally manufactured dimensions to operate at various frequencies. The selection of appropriate dimensions may be guided by general electromagnetic principles, which will not be described in detail herein.

[0014] In some embodiments, the resulting circuit board structure is merely one example and a portion of structures on which electromagnetic circuits may be provided. Further scope of the illustrated substrate may accommodate various circuit components, and various embodiments may provide additional substrates having additional layers for accommodating additional circuit components. Typically, part of the circuit will be located on a particular layer and may include a ground plane above and / or below it, while other parts of the overall circuit (or system) may reside in different areas of the same layer or on other layers.

[0015] Referring to the drawings, and particularly to FIGS. 2A-2D, a non-planar, e.g., three-dimensional, flexible hybrid circuit assembly or array is shown generally at 10 in FIG. 2D. In FIG. 2A, a triangular pyramidal shaped support structure is shown generally at 12. In some embodiments, support structure 12 may be referred to as a support mold. As shown, support structure 12 is a triangular pyramid. However, it will be apparent that the shape and size of support structure 12 can vary and still be within the scope of the present disclosure. Specifically, support structure 12 includes a three-sided base 14 and three three-sided side surfaces 16a, 16b, and 16c that form the shape of a triangular pyramid.

[0016] In FIG. 2B , a flexible hybrid circuit is generally designated 18. As shown, the flexible hybrid circuit 18 is configured to be folded around a support structure. Specifically, the flexible hybrid circuit 18 includes a base panel 20 having three sides sized and shaped to receive the base 14 of the support structure 12, and three side panels 22 a, 22 b, 22 c having three sides sized and shaped to receive respective sides 16 a, 16 b, 16 c of the support structure. In one embodiment, the base panel 20 and side panels 22 a, 22 b, 22 c of the flexible hybrid circuit 18 are fabricated from a PCB, and each side panel is hingedly connected to the base panel by a flexible circuit hinge 24 a, 24 b, 24 c that provides an electrical and mechanical connection between the panels.

[0017] Flexible circuits, also known as "flex circuits," can include a thin insulating polymer film onto which a conductive circuit pattern is applied, typically with a thin polymer coating to protect the conductor circuitry. Circuits can be formed by processes such as etching a metal foil clad (usually copper) from a polymer base, plating metal, or printing conductive ink. The flexible hybrid circuits disclosed herein can be optionally configured to allow electronic components to be attached to the circuit.

[0018] 2C, support structure 12 is placed on flexible hybrid circuit 18, and support structure base 14 is placed on flexible hybrid circuit base panel 20. As shown, base panel 20 of flexible hybrid circuit 18 is sized to approximately correspond to the size of base 14 of support structure 12. Hinges 24a, 24b, and 24c of side panels 22a, 22b, and 22c respectively correspond to the side edges of base 14 of support structure 12.

[0019] 2D , side panels 22 a, 22 b, 22 c of flexible hybrid circuit 18 are folded onto support structure 12 such that the side panels of the flexible hybrid circuit are positioned against sides 16 a, 16 b, 16 c, respectively, of the support structure to create a fully assembled flexible hybrid circuit assembly 10. As shown, side panels 22 a, 22 b, 22 c of flexible hybrid circuit 18 are substantially flush with respective sides 16 a, 16 b, 16 c of support structure 12. Side panels 22 a, 22 b, 22 c of flexible hybrid circuit 18 are folded around respective hinges 24 a, 24 b, 24 c to achieve the resulting structure. In one embodiment, base panel 20 and side panels 24 a, 24 b, 24 c of flexible hybrid circuit assembly 10 can be secured or adhered to respective base 14 and sides 16 a, 16 b, 16 c of support structure 12 to secure the flexible hybrid circuit to the support structure. In some embodiments, the side panels 22 a, 22 b, 22 c and the flexible circuit hinges 24 a, 24 b, 24 c are fabricated as a single piece. Fasteners may be provided to secure the flexible hybrid circuit 18 to the support structure 12. In other embodiments, adhesives including conductive epoxies may be used to secure the flexible hybrid circuit 18 to the support structure 12.

[0020] 3, each flex circuit hinge 24 is flexible for DC and logic and an integrated waveguide for RF, as will be described in more detail below. As shown, the flexible hybrid circuit 18 is folded onto the support structure 12 to form the flex circuit hinge 24.

[0021] 4A-4C, FIG. 4A shows the flexible hybrid circuit and support structure prior to folding. FIG. 4B shows the flexible hybrid circuit folded around the support structure. As shown, the support structure 12 includes a cavity 26 configured to support internal components of the flexible hybrid circuit assembly. In some embodiments, the internal components may include sensors (non-RF sensors), auxiliary components, gyroscopes, heat sinks, or cooling modules, to name a few. The cavity in the support structure can be open or filled with a dielectric material.

[0022] FIG. 4C shows waveguides, designated 28a, 28b, and 28c, which are structures that guide electromagnetic waves with minimal loss or energy by restricting energy transmission to one direction. In some embodiments, the cavities in the support structure 12 that receive the waveguides 28a, 28b, and 28c can be filled with a dielectric material. As shown, three waveguides 28a, 28b, and 28c are provided, one on each side 16a, 16b, and 16c of the flexible hybrid circuit assembly 10, although any number of waveguides may be provided. Referring to FIGS. 5A and 5B, each flexible circuit hinge 24 is flexible for DC and logic and an integrated waveguide for RF. FIG. 5A shows the flexible hybrid circuit before bending. FIG. 5B shows the completed flexible hybrid circuit assembly. Waveguides 28 a , 28 b , 28 c are integral with support structure 12 so that the waveguides bridge portions of flexible hybrid circuit 18 and the support structure on each side of the resulting assembly 10 .

[0023] 6A-6C, a support structure in the shape of a square pyramid is generally indicated at 40. As shown, the support structure 40 includes a base having four sides and four side surfaces each having three sides that form the shape of a square pyramid. A flexible hybrid circuit is generally indicated at 42. As shown, the flexible hybrid circuit 42 is configured to be folded around the support structure. Specifically, the flexible hybrid circuit 42 includes a base panel having four sides sized and shaped to receive the base of the support structure and four side panels having three sides sized and shaped to receive each side of the support structure. The side panels of the flexible hybrid circuit 42 are hingedly connected to one another by flexible circuit hinges, each indicated at 44, that provide electrical and mechanical connections between the base panel and the side panels.

[0024] 6A, support structure 40 is placed on flexible hybrid circuit 42, with the base of the support structure being placed on the base panel of the flexible hybrid circuit. As shown, the base panel of flexible hybrid circuit 42 is sized to approximately correspond to the size of the base of support structure 40. Flexible circuit hinges 44 on the side panels correspond to the side edges of the base of the support structure.

[0025] 6B, the side panels of flexible hybrid circuit 42 are folded over support structure 40, with the side panels of the flexible hybrid circuit positioned against the sides of the support structure to form a fully assembled flexible hybrid circuit assembly, generally designated 46. The side panels of flexible hybrid circuit 42 are folded about their respective hinges around the sides of support structure 40, resulting in structure 46.

[0026] As shown, the flexible hybrid circuit assembly 46 further includes a cavity 48 configured to support the internal components and several waveguides, each indicated at 50. As shown, a waveguide 50 is provided on each side of the support structure 40. Figure 6C illustrates this configuration. In some embodiments, the cavity that receives the waveguides 50 can be filled with a dielectric material.

[0027] 7A-7C, a five-sided support structure is shown generally at 60. As shown, the pentagonal shaped support structure 60 includes a five-sided base and five three-sided side panels that form the pentagonal shape. A flexible hybrid circuit is shown generally at 62. As shown, the flexible hybrid circuit 62 is formed to fold around the support structure 60. Specifically, the flexible circuit 62 includes a five-sided base panel sized and shaped to receive the base of the support structure 60 and five three-sided side panels sized and shaped to receive respective sides of the support structure. The panels of the flexible hybrid circuit 62 are hinged to one another by flexible circuit hinges, each indicated at 64, that provide electrical and mechanical connections between the base panel and the panels of the flexible hybrid circuit.

[0028] In Figure 7A, a support structure 60 is placed on a flexible hybrid circuit 62, with the base of the support structure placed on a base panel of the flexible hybrid circuit. As shown, the base panel of the flexible hybrid circuit is sized to approximately correspond to the size of the base of the support structure. Flexible hybrid circuit hinges 64 on the side panels of the flexible hybrid circuit 62 correspond to the side edges of the base of the support structure 60.

[0029] 7B, the side panels of flexible hybrid circuit 62 are folded over support structure 60, with the side panels of the flexible hybrid circuit positioned against the sides of the support structure to form a fully assembled flexible hybrid circuit assembly, generally designated 66. The side panels are folded around each flexible hybrid circuit hinge 64, resulting in structure 66.

[0030] As shown, the flexible hybrid circuit assembly 66 further includes internal components and a cavity configured to support several waveguides, each indicated at 70. As shown, a waveguide 70 is provided on each side of the support structure 60. Figure 7C illustrates this configuration. In some embodiments, the cavity that receives the waveguides 70 can be filled with a dielectric material.

[0031] 8A-8C, a conical support structure is generally indicated at 80. As shown, the conical support structure 80 includes a circular base. A flexible hybrid circuit is generally indicated at 82. As shown, the flexible hybrid circuit 82 is configured to be folded around the support structure 80. Specifically, the flexible hybrid circuit 82 includes a circular base panel sized and shaped to receive the base of the support structure 80, and a plurality of elongated triangular side panels, e.g., 36, hingedly connected to the base panel. The side panels of the flexible hybrid circuit 82 are each hingedly connected to one another by a flexible hybrid circuit hinge, indicated at 84, providing electrical and mechanical connections between the panels.

[0032] 8A, a support structure 80 is placed on a flexible hybrid circuit 82, with the base of the support structure being placed on the base panel of the flexible hybrid circuit. As shown, the base panel of the flexible hybrid circuit 82 is sized to approximately correspond to the size of the base of the support structure 80. The hinges 84 of the base panel and the side panels of the flexible hybrid circuit correspond to the side edges of the base of the support structure 80.

[0033] 8B, the side panels of flexible hybrid circuit 82 are folded over support structure 80, and the side panels of the flexible hybrid circuit are positioned against the sides of the support structure to form a fully assembled flexible hybrid circuit assembly, generally designated 86. The side panels of flexible hybrid circuit 82 are folded around respective hinges 84, resulting in structure 86.

[0034] As shown, the flexible hybrid circuit assembly 86 further includes a cavity 88 configured to support the internal components and several waveguides, each indicated at 90. As shown, a waveguide 90 is provided on each side of the support structure 80. Figure 8C illustrates this configuration. In some embodiments, the cavity that receives the waveguides 90 can be filled with a dielectric material.

[0035] It should be noted that antenna structures fabricated according to the methods of the presently disclosed embodiments can enable active RF seekers that can simultaneously transmit and receive electromagnetic radiation in multiple directions.

[0036] In some embodiments, the antenna structure can minimize RF scattering, especially in multimode seekers.

[0037] In some embodiments, the antenna structure can enable the fabrication of non-planar arrays without the need for miniature connectors that are difficult or impossible to assemble.

[0038] In some embodiments, the antenna structures can be configured to be tilted to allow for a wider field of view.

[0039] In some embodiments, the antenna structure includes an integrated waveguide to enable a high performance RF interface and provide a thermal and structural load path.

[0040] Having thus described several aspects of at least one embodiment, it should be understood that various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure and are intended to be within the scope of this disclosure. Accordingly, the foregoing description and drawings are by way of example only.

Claims

1. 1. A manufacturing method for manufacturing a printed circuit assembly, comprising: providing a flexible hybrid circuit having a base and at least one side panel, the at least one side panel hingedly connected to the base; placing a support structure on the flexible hybrid circuit, the support structure including a base that is positioned on the base of the flexible hybrid circuit and at least one side surface that corresponds to the at least one side panel of the flexible hybrid circuit; folding the at least one side panel of the flexible hybrid circuit so that the at least one side panel is positioned flush with the at least one side of the support structure to create a printed circuit assembly; the support structure further includes at least one curved waveguide integral to the support structure and extending from the base of the support structure to the side of the support structure. Manufacturing method.

2. The method of claim 1 , wherein the base of the support structure comprises a three-sided base and the at least one side of the support structure comprises three three-sided sides that together form the shape of a triangular pyramid.

3. 3. The method of claim 2, wherein the flexible hybrid circuit includes a base panel having three sides sized and shaped to receive the base of the support structure, and three side panels having three sides sized and shaped to receive respective sides of the support structure.

4. 4. The method of claim 3, wherein the base panel and each side panel of the flexible hybrid circuit are fabricated from a PCB, and each side panel is hingedly connected to the base panel by the flexible hybrid circuit, providing an electrical and mechanical connection.

5. 5. The method of claim 4, wherein each hinge comprises a thin insulating polymer film having a conductive circuit pattern applied thereto, typically followed by a thin polymer coating to protect the conductive circuitry.

6. The method of claim 1 , further comprising securing at least one of the side panels of the flexible hybrid circuit to the at least one side of the support structure with one or more fasteners.

7. The method of claim 1 , wherein the support structure further comprises one of a sensor, ancillary electronics, a gyroscope, or a cooling module.

8. The method of claim 1 , wherein the base of the support structure comprises a base having polygonal sides, and the at least one side of the support structure comprises a side having corresponding polygonal sides that together form the shape of a three-dimensional object.

9. 9. The method of claim 8, wherein the flexible hybrid circuit includes a polygonal-sided base panel sized and shaped to receive the polygonal-sided base of the support structure, and a corresponding number of polygonal-sided side panels sized and shaped to be received on each side of the support structure.

10. 10. The method of claim 9, wherein the base panel and each side panel of the flexible hybrid circuit are fabricated from a PCB, and each side panel is hingedly connected to the base panel by the flexible hybrid circuit providing an electrical and mechanical connection.

11. 1. A printed circuit assembly comprising: a flexible hybrid circuit having a base and at least one side panel, the at least one side panel being hingedly connected to the base; a support structure on the flexible hybrid circuit, the support structure including a base that is disposed on the base of the flexible hybrid circuit when the flexible hybrid circuit and the support structure are assembled, and at least one side surface that corresponds to the at least one side panel of the flexible hybrid circuit; the at least one side panel of the flexible hybrid circuit is configured to be folded such that the at least one side panel is positioned flush with the at least one side of the support structure to create the printed circuit assembly; the support structure further includes at least one curved waveguide integral to the support structure and extending from the base of the support structure to the side of the support structure. Printed circuit assembly.

12. 12. The assembly of claim 11, wherein the base of the support structure comprises a three-sided base and the at least one side of the support structure comprises three three-sided sides that together form the shape of a triangular pyramid.

13. 13. The assembly of claim 12, wherein the flexible hybrid circuit includes a base panel having three sides sized and shaped to receive the base of the support structure, and three side panels having three sides sized and shaped to receive respective sides of the support structure.

14. 14. The assembly of claim 13, wherein the base panel and each side panel of the flexible hybrid circuit are fabricated from a PCB, and each side panel is hingedly connected to the base panel by the flexible hybrid circuit providing an electrical and mechanical connection.

15. 15. The assembly of claim 14, wherein each hinge comprises a thin insulating polymer film having a conductive circuit pattern applied thereto, typically with a thin polymer coating to protect the conductive circuitry.

16. The assembly of claim 11 , wherein the support structure further comprises one or more components.

17. The assembly of claim 16 , wherein the one or more components include one of a sensor, ancillary electronics, a gyroscope, or a cooling module.

18. 12. The assembly of claim 11 , wherein the base of the support structure includes a polygonal-sided base, the at least one side of the support structure includes a side having corresponding polygonal sides that together form the shape of a three-dimensional object, and the flexible hybrid circuit includes a polygonal-sided base panel sized and shaped to receive the polygonal-sided base of the support structure, and side panels having a corresponding number of polygonal sides sized and shaped to be received in each side of the support structure.

19. 20. The assembly of claim 18, wherein the base panel and each side panel of the flexible hybrid circuit are fabricated from a PCB, and each side panel is hingedly connected to the base panel by the flexible hybrid circuit providing an electrical and mechanical connection.

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