conductive adhesive
JP7754411B2Active Publication Date: 2025-10-15CHUETSU PULP & PAPER +1
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Patent Information
- Application Number
- JP2021152200
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-09-17
- Publication Date
- 2025-10-15
- Estimated Expiration
- 2041-09-17
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Abstract
To provide a conductive adhesive which uses a resin having flexibility as a binder resin, enables a flexible motion required for a flexible device, and can suppress an increase in electric resistivity even when a board is deformed, and a circuit board.SOLUTION: A conductive adhesive contains (A) a conductive filler, (B) a conductive adhesive containing a resin, and (C) CNF. According to the present invention, there are provided a conductive adhesive that can suppress an increase in electric resistivity even when a board is deformed while enabling a flexible motion required for a flexible device, and a circuit board.SELECTED DRAWING: Figure 1
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