Display device

Abstract

This display device (10) comprises: a substrate (1); an optical element (2) mounted on one surface in the thickness direction of the substrate (1); a second sealing layer (6) for sealing the optical element (2); a second inorganic layer (5) which is interposed between the optical element (2) and the second sealing layer (6) and contains a metal nitride; and a polarization plate (7) disposed on one surface in the thickness direction of the second sealing layer (6). The electricity conductivity of extracted water from the second sealing layer (6) is 100 μm / S or less.

Description

[Technical Field]

[0001] The present invention relates to a display device. [Background technology]

[0002] In recent years, organic electroluminescence (EL) displays have become known as display devices equipped with optical elements. In such display devices, the optical elements are sealed with multiple sealing layers to prevent deterioration of the optical elements due to moisture in the atmosphere.

[0003] The plurality of sealing layers may include, for example, an inorganic sealing layer and an organic sealing layer. In a display device, these sealing layers are alternately stacked. Among these sealing layers, the organic sealing layer is formed by applying a sealing composition by, for example, an inkjet method and then curing the sealing composition by light irradiation.

[0004] As such a sealing composition, a sealant containing an alicyclic epoxy compound, an oxetane compound, and a cationic polymerization initiator has been proposed (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2020 / 031941 Brochure Summary of the Invention [Problem to be solved by the invention]

[0006] On the other hand, a material containing nitrogen is selected as the material for the inorganic sealing layer. When the inorganic sealing layer contains nitrogen (a material containing nitrogen), if water penetrates into such an inorganic sealing layer, the ionic components in the water react with the nitrogen to form NH3 + ions may be generated. And, such NH3 + Ions have the disadvantage of bleaching the polarizing plate.

[0007] The present invention provides a display device that suppresses discoloration of a polarizing plate. [Means for solving the problem]

[0008] The present invention [1] is a display device comprising a substrate, an optical element mounted on one thickness-wise surface of the substrate, a sealing layer that seals the optical element, an inorganic layer containing a metal nitride interposed between the optical element and the sealing layer, and a polarizing plate disposed on at least a portion of one thickness-wise surface of the sealing layer, wherein the electrical conductivity of the extracted water of the sealing layer is 100 μm / S or less.

[0009] The present invention [2] is the display device according to the above [1], wherein the sealing composition contains a cationic polymerizable compound and a cationic polymerization initiator, and the content of the cationic polymerization initiator is 0.2 parts by mass or more and 0.8 parts by mass or less per 100 parts by mass of the cationic polymerizable compound.

[0010] The present invention [3] includes the display device according to the above [2], wherein the cationically polymerizable compound includes an epoxy compound and / or an oxetane compound.

[0011] The present invention [4] includes the display device according to the above [3], wherein the epoxy compound includes an alicyclic epoxy resin and an aliphatic epoxy resin.

[0012] The present invention [5] includes the display device according to the above [3] or [4], in which the oxetane compound includes a bifunctional oxetane compound.

[0013] The present invention [6] includes the display device according to any one of the above [2] to [5], wherein the sealing composition contains a leveling agent.

[0014] The present invention [7] includes the display device according to any one of the above [2] to [6], wherein the sealing composition contains a coupling agent. [Effects of the Invention]

[0015] In the display device of the present invention, the electrical conductivity of the extracted water in the sealing layer is 100 μm / S or less, which can prevent discoloration of the polarizing plate. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 shows a cross-sectional view of one embodiment of a display device of the present invention. [Figure 2] 2A to 2G are schematic diagrams illustrating one embodiment of a method for manufacturing a display device. FIG. 2A shows a first step of preparing a substrate. FIG. 2B shows a second step of mounting optical elements on one thickness-wise surface of the substrate. FIG. 2C shows a third step of arranging a first inorganic layer on the substrate so as to cover the surfaces of the optical elements. FIG. 2D shows a fourth step of arranging a first sealing layer on the first inorganic layer so as to seal the optical elements. FIG. 2E shows a fifth step of arranging a second inorganic layer so as to cover the surface of the first sealing layer. FIG. 2F shows a sixth step of arranging a second sealing layer on the second inorganic layer so as to seal the optical elements. FIG. 2G shows a seventh step of arranging a polarizing plate on one thickness-wise surface of the second sealing layer. DETAILED DESCRIPTION OF THE INVENTION

[0017] The display device of the present invention comprises a substrate, an optical element mounted on one thickness-wise surface of the substrate, a sealing layer that seals the optical element, an inorganic layer containing a metal nitride interposed between the optical element and the sealing layer, and a polarizing plate arranged on at least a portion of one thickness-wise surface of the sealing layer.

[0018] Hereinafter, one embodiment of a display device of the present invention will be described in detail with reference to FIG.

[0019] The display device 10 includes a substrate 1, an optical element 2, a first inorganic layer 3, a first sealing layer 4, a second inorganic layer 5 as an inorganic layer, a second sealing layer 6 as a sealing layer, and a polarizing plate 7.

[0020] Specifically, the display device 10 comprises a substrate 1, an optical element 2 mounted on one thickness-wise surface of the substrate 1, a first inorganic layer 3 arranged on the substrate 1 so as to cover the surface of the optical element 2, a first sealing layer 4 arranged on the first inorganic layer 3 so as to seal the optical element 2, a second inorganic layer 5 covering the surface of the first sealing layer 4, a second sealing layer 6 arranged on the second inorganic layer 5 so as to seal the optical element 2, and a polarizing plate 7 arranged on one thickness-wise surface of the second sealing layer 6.

[0021] <Substrate> The substrate 1 supports the optical element 2. The substrate 1 is the bottom layer of the display device 10.

[0022] Examples of the substrate 1 include a glass substrate and a plastic substrate, and a preferable example of the substrate 1 is a glass substrate.

[0023] The thickness of the substrate 1 is, for example, 0.1 mm or more and, for example, 20 mm or less.

[0024] <Optical elements> An example of the optical element 2 is an organic EL element. The optical element 2 is mounted on the substrate 1. Although not shown, the optical element 2 includes a cathode reflective electrode, an organic EL layer, and an anode transparent electrode.

[0025] <First inorganic layer> The first inorganic layer 3 is an insulating layer for preventing water from penetrating into the optical element 2.

[0026] The first inorganic layer 3 is disposed on the substrate 1 so as to cover the surface of the optical element 2. Specifically, the first inorganic layer 3 covers the top surface (one surface in the thickness direction) and side surfaces of the optical element 2, and also covers the top surface of the substrate 1. In other words, the first inorganic layer 3 is in contact with the substrate 1 and the optical element 2.

[0027] Examples of materials for the first inorganic layer 3 include metal oxides and metal nitrides. That is, the first inorganic layer 3 contains, for example, a metal oxide and / or a metal nitride.

[0028] Metal oxides include, for example, aluminum oxide, silicon oxide, and copper oxide.

[0029] Metal nitrides include, for example, aluminum nitride and silicon nitride.

[0030] As the material of the first inorganic layer 3, a metal nitride is preferably used, from the viewpoint of further suppressing the penetration of water into the optical element 2. As the material of the first inorganic layer 3, silicon nitride is more preferably used.

[0031] The material for the first inorganic layer 3 can be used alone or in combination of two or more kinds.

[0032] The thickness of the first inorganic layer 3 is, for example, 0.1 μm or more and, for example, 2.0 μm or less.

[0033] <First sealing layer> The first sealing layer 4 is an insulating layer for protecting the optical element 2 and for flattening the steps caused by the optical element 2.

[0034] The first sealing layer 4 is disposed on the first inorganic layer 3 so as to seal the optical element 2. That is, the first sealing layer 4 is in contact with the first inorganic layer 3.

[0035] Resin, for example, can be used as the material of first sealing layer 4. That is, first sealing layer 4 includes, for example, resin.

[0036] Examples of the resin include acrylic resin, epoxy resin, polyimide resin, silicone resin, and fluororesin.

[0037] A sealing composition, which will be described later, can also be used as the material for first sealing layer 4. In such a case, first sealing layer 4 contains a cured product of the sealing composition.

[0038] The material for first sealing layer 4 can be used alone or in combination of two or more kinds.

[0039] The thickness of first sealing layer 4 is, for example, 0.2 μm or more and, for example, 30 μm or less.

[0040] <Second inorganic layer> The second inorganic layer 5 is an insulating layer for preventing water from penetrating into the optical element 2.

[0041] The second inorganic layer 5 covers the surfaces (top and side surfaces) of the first sealing layer 4. That is, the second inorganic layer 5 is in contact with the first sealing layer 4. The second inorganic layer 5 is also interposed between the optical element 2 and the second sealing layer 6.

[0042] Materials for the second inorganic layer 5 include metal nitrides (for example, aluminum nitride and silicon nitride) from the viewpoint of suppressing water penetration into the optical element 2. That is, the second inorganic layer 5 contains a metal nitride.

[0043] The second inorganic layer 5 may also contain other materials in addition to the metal nitride, such as metal oxides (for example, aluminum oxide, silicon oxide, and copper oxide).

[0044] The other materials can be used alone or in combination of two or more.

[0045] The second inorganic layer 5 preferably does not contain any other materials and is made of a metal nitride.

[0046] The thickness of the second inorganic layer 5 is, for example, 0.1 μm or more and, for example, 2.0 μm or less.

[0047] <Second sealing layer> The second sealing layer 6 is an insulating layer for protecting the optical element 2 .

[0048] The second sealing layer 6 is disposed on the second inorganic layer 5 so as to seal the optical element 2. More specifically, the second sealing layer 6 covers the surfaces (top and side surfaces) of the second inorganic layer 5 so as to seal the optical element 2. That is, second sealing layer 6 is in contact with second inorganic layer 5 .

[0049] The second sealing layer 6 is made of a cured product of a sealing composition.

[0050] The sealing composition includes a cationically polymerizable compound and a cationic polymerization initiator.

[0051] <<Cationic polymerizable compounds>> Examples of the cationically polymerizable compound include an epoxy compound and an oxetane compound. That is, the cationically polymerizable compound preferably includes an epoxy compound and / or an oxetane compound from the viewpoint of further suppressing discoloration of the polarizing plate 7. More preferably, the cationically polymerizable compound is an epoxy compound or an oxetane compound.

[0052] [Epoxy compounds] Examples of the epoxy compound include alicyclic epoxy resins, aliphatic epoxy resins, and aromatic epoxy resins. The epoxy compound is preferably an alicyclic epoxy resin or an aliphatic epoxy resin. That is, the epoxy compound preferably contains an alicyclic epoxy resin and an aliphatic epoxy resin, from the viewpoint of further suppressing discoloration of the polarizing plate 7.

[0053] (alicyclic epoxy resin) Alicyclic epoxy resins are curable resins (photocurable resins, preferably ultraviolet curable resins) that have epoxy groups and aliphatic rings (alicyclic skeletons) but do not have aromatic rings.

[0054] Examples of alicyclic epoxy resins include glycidyl group-containing alicyclic epoxy resins, glycidyl ether group-containing alicyclic epoxy resins, and epoxycyclo structure-containing epoxy resins.

[0055] ((Glycidyl group-containing alicyclic epoxy resin)) The glycidyl group-containing alicyclic epoxy resin has, for example, a glycidyl group bonded to an aliphatic ring, and is represented, for example, by the following general formula (1):

[0056] [ka] In formula (1), R 1 represents a monovalent organic group, and n represents the degree of polymerization. A substituent such as an alkyl group may be bonded to the carbon atom constituting the cyclohexane ring.

[0057] A specific example of the glycidyl group-containing alicyclic epoxy resin represented by the above general formula (1) is a 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol.

[0058] The glycidyl group-containing alicyclic epoxy resin represented by the general formula (1) may be a commercially available product, such as EHPE3150 (epoxy equivalent: 170 to 190 g / eq., manufactured by Daicel Corporation).

[0059] ((Glycidyl ether group-containing alicyclic epoxy resin)) The glycidyl ether group-containing alicyclic epoxy resin has glycidyl ether units bonded to an aliphatic ring, and is preferably a polyglycidyl ether-containing alicyclic epoxy resin having a plurality of glycidyl ether units bonded to an aliphatic ring.

[0060] Examples of the glycidyl ether-containing alicyclic epoxy resin include bifunctional glycidyl ether-containing alicyclic epoxy resins. Examples of the bifunctional glycidyl ether-containing alicyclic epoxy resin include hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, and hexahydrophthalic acid diglycidyl ether. - Teru is one example.

[0061] ((Epoxy cyclo structure-containing epoxy resin)) The epoxy cyclo structure-containing epoxy resin has an epoxy cyclo structure having an epoxy group composed of two adjacent carbon atoms forming an aliphatic ring and one oxygen atom bonded to those two carbon atoms.

[0062] Examples of epoxy resins containing an epoxycyclo structure include epoxy resins containing an epoxycyclohexane structure (hereinafter referred to as ECH structure-containing epoxy resins).

[0063] Examples of ECH structure-containing epoxy resins include epoxy resins containing one ECH structure represented by the following chemical formula (2), epoxy resins containing one ECH structure represented by the following chemical formula (3), epoxy resins containing two ECH structures represented by the following general formula (4), and modified products thereof.

[0064] [ka]

[0065] [ka]

[0066] [ka]

[0067] In formula (4), X represents a linking group (a divalent group having one or more atoms).2 represents one atom or substituent selected from the group consisting of a hydrogen atom, a fluorine atom, an alkyl group, a fluoroalkyl group, an aryl group, a furyl group, and a thienyl group. 2 may be the same as or different from each other.

[0068] An epoxy resin containing two ECH structures represented by the general formula (4) above (hereinafter referred to as an ECH structure-containing epoxy resin represented by the general formula (4)) has an ECH structure (epoxycyclohexyl group) at both ends of the molecule, and the two epoxycyclohexyl groups are bonded via a linking group. The epoxycyclohexyl group is a functional group containing a cyclohexane ring and an epoxy group composed of two adjacent carbon atoms forming the cyclohexane ring and one oxygen atom bonded to those two carbon atoms.

[0069] In the above general formula (4), R 2 Examples of the alkyl group represented by the formula (I) include linear or branched alkyl groups having 1 to 6 carbon atoms (for example, methyl, ethyl, propyl, butyl, pentyl, and hexyl groups).

[0070] In the above general formula (4), R 2 Examples of the fluoroalkyl group represented by the formula include linear or branched fluoroalkyl groups having 1 to 6 carbon atoms (for example, perfluoromethyl, perfluoroethyl, and perfluoropropyl groups).

[0071] In the above general formula (4), R 2 Examples of the aryl group represented by the formula include aryl groups having 6 to 18 carbon atoms (for example, a phenyl group and a naphthyl group).

[0072] Examples of the linking group represented by X in the above general formula (4) include an oxygen atom, a sulfur atom, a divalent hydrocarbon group, a polyoxyalkylene group, a carbonyl group, an ether group, a thioether group, an ester group, a carbonate group, an amide group, and groups formed by linking these groups.

[0073] Examples of divalent hydrocarbon groups include linear or branched alkylene groups having 1 to 20 carbon atoms (e.g., methylene, methylmethylene, dimethylmethylene, ethylene, propylene, trimethylene, and butylene), and linear or branched unsaturated hydrocarbon groups having 1 to 20 carbon atoms (e.g., propenylene, methylpropenylene, and butenylene).

[0074] Examples of the polyoxyalkylene group include linear or branched polyoxyalkylene groups having 1 to 120 carbon atoms (such as polyoxyethylene groups and polyoxypropylene groups).

[0075] Specific examples of the ECH structure-containing epoxy resin represented by general formula (4) include (3,3',4,4'-diepoxy)bicyclohexyl, bis(3,4-epoxycyclohexylmethyl)ether, 1,2-bis(3,4-epoxycyclohexan-1-yl)ethane, 2,2-bis(3,4-epoxycyclohexan-1-yl)propane, 3',4'-epoxycyclohexylmethyl(3,4-epoxy)cyclohexanecarboxylate, and ε-caprolactone-modified 3',4'-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate. S As the ECH structure-containing epoxy resin represented by general formula (4), preferably, (3,3',4,4'-diepoxy)bicyclohexyl and 3',4'-epoxycyclohexylmethyl(3,4-epoxy)cyclohexanecarboxylate are used. As the ECH structure-containing epoxy resin represented by general formula (4), more preferably, (3,3',4,4'-diepoxy)bicyclohexyl is used, from the viewpoint of further suppressing discoloration of the polarizing plate 7.

[0076] Commercially available ECH structure-containing epoxy resins represented by the general formula (4) can also be used. Examples of commercially available ECH structure-containing epoxy resins represented by the general formula (4) include Celloxide 8010 ((3,3',4,4'-diepoxy)bicyclohexyl) and Celloxide 2021P (3',4'-epoxycyclohexylmethyl(3,4-epoxy)cyclohexanecarboxylate) (both manufactured by Daicel Corporation).

[0077] As the ECH structure-containing epoxy resin, preferably, an ECH structure-containing epoxy resin represented by the above general formula (4) can be used.

[0078] As the alicyclic epoxy resin, preferably, an epoxy cyclo structure-containing epoxy resin is used.

[0079] The weight average molecular weight of the alicyclic epoxy resin is, for example, 200 or more, for example, 1000 or less, or preferably 500 or less. The weight average molecular weight (Mw) can be determined by gel permeation chromatography (GPC) using polystyrene as a standard substance.

[0080] The epoxy equivalent of the alicyclic epoxy resin is, for example, 90 g / eq. or more, preferably 100 g / eq. or more, and for example, 250 g / eq. or less, preferably 190 g / eq. or less. The epoxy equivalent can be measured in accordance with JIS K7236:2001.

[0081] (aliphatic epoxy resin) Examples of the aliphatic epoxy resin include difunctional aliphatic epoxy resins, such as ethylene glycol diglycidyl ether, P Examples of the difunctional aliphatic epoxy resin include propylene glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, and neopentyl glycol diglycidyl ether. As the difunctional aliphatic epoxy resin, preferably, neopentyl glycol diglycidyl ether is used.

[0082] The weight average molecular weight of the aliphatic epoxy resin is, for example, 150 or more and, for example, 400 or less.

[0083] The aliphatic epoxy resin has an epoxy equivalent of, for example, 60 g / eq. or more and, for example, 250 g / eq. or less.

[0084] When the epoxy compound contains an alicyclic epoxy resin and an aliphatic epoxy resin, the content of the alicyclic epoxy resin is, relative to 100 parts by mass of the total amount of the alicyclic epoxy resin and the aliphatic epoxy resin, for example, 10 parts by mass or more, preferably 20 parts by mass or more, and for example, 50 parts by mass or less, preferably 40 parts by mass or less. The content of the alicyclic epoxy resin is, relative to the total amount of the cationically polymerizable compound, for example, 5% by mass or more, preferably 10% by mass or more, and for example, 30% by mass or less, preferably 20% by mass or less.

[0085] When the epoxy compound contains an alicyclic epoxy resin and an aliphatic epoxy resin, the content of the aliphatic epoxy resin is, relative to 100 parts by mass of the total amount of the alicyclic epoxy resin and the aliphatic epoxy resin, for example, 40 parts by mass or more, preferably 50 parts by mass or more, more preferably 60 parts by mass or more, and for example, 90 parts by mass or less, preferably 80 parts by mass or less. The content of the aliphatic epoxy resin is, relative to 100 parts by mass of the total amount of the alicyclic epoxy resin and the aliphatic epoxy resin, for example, 20% by mass or more, preferably 30% by mass or more, and for example, 50% by mass or less, preferably 40% by mass or less.

[0086] The epoxy compounds can be used alone or in combination of two or more. As the epoxy compound, preferably, an alicyclic epoxy resin is used alone, or an alicyclic epoxy resin and an aliphatic epoxy resin are used in combination. of Combination use is also possible.

[0087] The content ratio of the epoxy compound relative to the cationically polymerizable compound is, for example, 30 mass % or more, preferably 40 mass % or more, and for example, 70 mass % or less, preferably 60 mass % or less.

[0088] [Oxetane compounds] The oxetane compound contains, for example, from 1 to 5 oxetane rings.

[0089] Examples of the oxetane compound include monofunctional oxetane compounds having one oxetane ring, bifunctional oxetane compounds having two oxetane rings, and trifunctional or higher oxetane compounds having three or more oxetane rings.

[0090] Examples of the monofunctional oxetane compound include 2-ethylhexyl oxetane, 3-ethyl-3-hydroxymethyl oxetane, 3-(meth)allyloxymethyl-3-ethyl oxetane, (3-ethyl-3-oxetanylmethoxy)methyl benzene, 2-ethylhexyl (3-ethyl-3-oxetanylmethyl) ether, ethyl diethylene glycol (3-ethyl-3-oxetanylmethyl) ether, and 3-cyclohexylmethyl-3-ethyl oxetane. A preferred example of the monofunctional oxetane compound is 2-ethylhexyl oxetane.

[0091] The monofunctional oxetane compound may be a commercially available product, such as Aronoxetane OXT-212 (2-ethylhexyl oxetane, manufactured by Toagosei Chemical Industry Co., Ltd.).

[0092] Examples of bifunctional oxetane compounds include 1,4-bis{[(3-ethyl-3-oxetanyl)methoxy]methyl}benzene, 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane, 1,4-bis[(3-ethyl-3-oxetanyl)methoxy]benzene, 1,3-bis[(3-ethyl-3-oxetanyl)methoxy]benzene, 3,7-bis(3-oxetanyl)-5-oxanona Examples of the difunctional oxetane compound include 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]ethane, 1,2-bis[(3-ethyl-3-oxetanylmethoxy)methyl]propane, ethylene glycol bis(3-ethyl-3-oxetanylmethyl)ether, and dicyclopentenyl bis(3-ethyl-3-oxetanylmethyl)ether. Examples of the difunctional oxetane compound include 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane.

[0093] The bifunctional oxetane compound may be a commercially available product, such as Aronoxetane OXT-221 (3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane, manufactured by Toagosei Chemical Industry Co., Ltd.).

[0094] Examples of trifunctional or higher oxetane compounds include trimethylolpropane tris(3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tris(3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis(3-ethyl-3-oxetanylmethyl) ether, and dipentaerythritol pentakis(3-ethyl-3-oxetanylmethyl) ether.

[0095] The oxetane compound is preferably a monofunctional oxetane compound or a bifunctional oxetane compound. From the viewpoint of further suppressing discoloration of the polarizing plate 7, the oxetane compound is more preferably a bifunctional oxetane compound. That is, from the viewpoint of further suppressing discoloration of the polarizing plate 7, the oxetane compound more preferably includes a bifunctional oxetane compound.

[0096] The oxetane compounds can be used alone or in combination of two or more.

[0097] The content ratio of the oxetane compound relative to the cationically polymerizable compound is, for example, 30 mass % or more, preferably 40 mass % or more, and for example, 70 mass % or less, preferably 60 mass % or less.

[0098] The content of the cationically polymerizable compound relative to the sealing composition is, for example, 80 mass % or more, preferably 90 mass % or more, and for example, 98 mass % or less.

[0099] <<Cationic polymerization initiator>> The cationic polymerization initiator is, for example, a photoacid generator that generates an acid upon irradiation with light.

[0100] The cationic polymerization initiator is not particularly limited, and known cationic polymerization initiators can be used.Specific examples of the cationic polymerization initiator include sulfonium salts, phosphonium salts, quaternary ammonium salts, diazonium salts, and iodonium salts.Preferably, the cationic polymerization initiator is a sulfonium salt.

[0101] Examples of sulfonium salts include triarylsulfonium salts.

[0102] In these cationic polymerization initiators, the counter anion that forms the salt is composed of, for example, a central atom and a ligand coordinated to the central atom.

[0103] Examples of the central atom include P, As, and Sb, and preferably P.

[0104] The ligand may be, for example, F - , Cl - , and (CF2CF3) n F (6-n) - Examples include:

[0105] Specifically, such a counter anion is PF6 - , (CF2CF3) n PF (6-n) - , AsF6 - , SbF6 - , BF4 - , SbCl6 - , FG anion.

[0106] As the cationic polymerization initiator, (CF2CF3) n PF (6-n) - as a counter anion (preferably, triarylsulfonium salts), and sulfonium salts (preferably, triarylsulfonium salts) with FG anion as a counter ion.

[0107] Furthermore, as the cationic polymerization initiator, an acid generator described in JP-A-2022-80366 (specifically, a cationic polymerization initiator in which the central metal of the counter anion is gallium) can also be used.

[0108] Commercially available cationic polymerization initiators can also be used. Examples of commercially available cationic polymerization initiators include CPI-210S ((CF2CF3) n PF (6-n) - as a counter anion (specifically, a triarylsulfonium salt), manufactured by San-Apro Co., Ltd.), and CPI-310FG (a sulfonium salt (specifically, a triarylsulfonium salt) with an FG anion as a counter ion, manufactured by San-Apro Co., Ltd.).

[0109] The cationic polymerization initiators can be used alone or in combination of two or more kinds.

[0110] The content of the cationic polymerization initiator is, for example, 0.2 parts by mass or more, preferably 0.3 parts by mass or more, relative to 100 parts by mass of the cationic polymerizable compound, from the viewpoint of further suppressing discoloration of the polarizing plate 7, and, for example, from the viewpoint of further suppressing discoloration of the polarizing plate 7, is 0.8 parts by mass or less, preferably 0.7 parts by mass or less.

[0111] The content of the cationic polymerization initiator in the sealing composition is, for example, 0.2 mass % or more, preferably 0.3 mass % or more, from the viewpoint of further suppressing discoloration of the polarizing plate 7, and is, for example, 0.8 mass % or less, preferably 0.7 mass % or less, from the viewpoint of further suppressing discoloration of the polarizing plate 7.

[0112] <<Additives>> The sealing composition may contain additives in appropriate proportions, if necessary.

[0113] Examples of the additives include tackifiers, photosensitizers, leveling agents, coupling agents, antioxidants, polymerization initiators, antioxidants, wettability improvers, surfactants, plasticizers, UV absorbers, preservatives, and antibacterial agents. Preferred additives include tackifiers, photosensitizers, leveling agents, and coupling agents.

[0114] [Tackifier] The tackifier is a component for imparting adhesiveness to second sealing layer 6.

[0115] Examples of the tackifier include aliphatic tackifiers, alicyclic tackifiers, aromatic tackifiers, rosin tackifiers, terpene tackifiers, and water additives thereof. Preferred tackifiers include aromatic tackifiers and terpene tackifiers.

[0116] Examples of aromatic tackifiers include styrene oligomers.

[0117] Examples of styrene oligomers include homopolymers of styrene skeleton-containing monomers and copolymers of styrene skeleton-containing monomers with other polymerizable monomers.

[0118] Examples of the styrene skeleton-containing monomer include styrene, α-methylstyrene, vinyltoluene, and isopropenyltoluene. Preferred examples of the styrene skeleton-containing monomer include isopropenyltoluene.

[0119] The styrene skeleton-containing monomers can be used alone or in combination of two or more kinds.

[0120] The other polymerizable monomer is a monomer that can be polymerized with the styrene skeleton-containing monomer, and has, for example, an ethylenically unsaturated double bond.

[0121] Examples of other polymerizable monomers include unsaturated aliphatic monomers having 2 to 10 carbon atoms (e.g., ethylene, propylene, and butene), unsaturated alicyclic monomers having 5 to 20 carbon atoms (e.g., cyclopentadiene and dicyclopentadiene), α,β-unsaturated carboxylic acids (e.g., acrylic acid and methacrylic acid), (meth)acrylic acid alkyl esters, and C5 fractions. C5 fractions are obtained, for example, by petroleum refining and cracking, and specifically, fractions having a boiling point range of −15° C. to +45° C. under atmospheric pressure, including 1-pentene, 2-methyl-1-butene, 3-methyl-1-butene, 2-pentene, isoprene, 1,3-pentadiene, and cyclopentadiene.

[0122] The other polymerizable monomers can be used alone or in combination of two or more kinds.

[0123] The styrene-based oligomer is preferably a homopolymer of a styrene skeleton-containing monomer, and more preferably a homopolymer of isopropenyl toluene.

[0124] Terpene-based tackifiers include, for example, terpene phenol resins.

[0125] The tackifiers can be used alone or in combination of two or more kinds.

[0126] The content ratio of the tackifier relative to 100 parts by mass of the cationically polymerizable compound is, for example, 1 part by mass or more, preferably 3 parts by mass or more, and for example, 20 parts by mass or less, preferably 15 parts by mass or less.

[0127] The content of the tackifier relative to the sealing composition is, for example, 1 mass % or more, preferably 3 mass % or more, and for example, 20 mass % or less, preferably 15 mass % or less.

[0128] [Photosensitizer] The photosensitizer is a component for further accelerating the curing reaction of the sealing composition.

[0129] Examples of photosensitizers include thioxanthone compounds and anthracene compounds.

[0130] An example of the thioxanthone compound is 2,4-diethylthioxanthone.

[0131] Examples of the anthracene compound include 9,10-dibutoxyanthracene, 9,10-diethoxyanthracene, and 9,10-bis(octanoyloxy)anthracene.

[0132] The photosensitizer is preferably an anthracene compound, and more preferably 9,10-dibutoxyanthracene and 9,10-bis(octanoyloxy)anthracene.

[0133] The photosensitizers can be used alone or in combination of two or more.

[0134] The content ratio of the photosensitizer relative to 100 parts by mass of the cationically polymerizable compound is, for example, 0.1 parts by mass or more, preferably 0.3 parts by mass or more, and for example, 5 parts by mass or less, preferably 1 part by mass or less.

[0135] The content of the photosensitizer relative to the sealing composition is, for example, 0.1 mass % or more, preferably 0.3 mass % or more, and for example, 5 mass % or less, preferably 1 mass % or less.

[0136] [Leveling agent] The leveling agent is a component for improving the flatness of second sealing layer 6.

[0137] Examples of the leveling agent include a silicone-based leveling agent, an acrylic-based leveling agent, and a fluorine-based leveling agent. A preferred example of the leveling agent is a silicone-based leveling agent.

[0138] The leveling agents can be used alone or in combination of two or more kinds.

[0139] The content ratio of the leveling agent relative to 100 parts by mass of the cationically polymerizable compound is, for example, 0.1 parts by mass or more, preferably 0.3 parts by mass or more, and for example, 5 parts by mass or less, preferably 1 part by mass or less.

[0140] The content of the leveling agent relative to the sealing composition is, for example, 0.1 mass % or more, preferably 0.3 mass % or more, and for example, 5 mass % or less, preferably 1 mass % or less.

[0141] [Coupling agent] The coupling agent is a component for improving the adhesiveness of second sealing layer 6.

[0142] Examples of the coupling agent include an epoxy group-containing silane coupling agent, an amino group-containing silane coupling agent, and a (meth)acryloyl group-containing silane coupling agent. A preferred example of the coupling agent is an epoxy group-containing silane coupling agent.

[0143] Examples of epoxy group-containing silane coupling agents include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, and 3-glycidoxypropylmethyldiethoxysilane.Preferably, 3-glycidoxypropyltrimethoxysilane is used as the epoxy group-containing silane coupling agent.

[0144] The coupling agents can be used alone or in combination of two or more.

[0145] The content ratio of the coupling agent relative to 100 parts by mass of the cationically polymerizable compound is, for example, 1 part by mass or more, preferably 3 parts by mass or more, and for example, 20 parts by mass or less, preferably 10 parts by mass or less.

[0146] The content of the coupling agent relative to the sealing composition is, for example, 1 mass % or more, preferably 3 mass % or more, and for example, 20 mass % or less, preferably 10 mass % or less.

[0147] [Preparation of sealing composition] To prepare the sealing composition, a cationic polymerizable compound, a cationic polymerization initiator, and additives that are added as needed are mixed together to prepare the sealing composition.

[0148] The sealing composition can also be diluted with a known solvent to form a varnish. In such a case, the solid content of the varnish of the sealing composition is, for example, 10% by mass or more and, for example, 70% by mass or less.

[0149] Then, as will be described in detail later, the sealing composition is cured to form second sealing layer 6.

[0150] The electrical conductivity of the extracted water of the second sealing layer 6 is 100 μm / S or less, preferably 85 μm / S or less, more preferably 75 μm / S or less, even more preferably 50 μm / S or less, particularly preferably 38 μm / S or less, and, for example, 1 μm / S or more.

[0151] If the electrical conductivity is equal to or less than the upper limit, discoloration of the polarizing plate 7 can be suppressed.

[0152] On the other hand, the electrical conductivity is excess If so, the discoloration of the polarizing plate 7 cannot be suppressed.

[0153] The electrical conductivity can be adjusted to fall within the above range, for example, by adjusting the content of the cationic polymerization initiator.

[0154] The method for measuring the electrical conductivity will be described in detail in the Examples below.

[0155] The thickness of second sealing layer 6 is, for example, 0.2 μm or more, and for example, 200 μm or less, preferably 100 μm or less, and more preferably 30 μm or less.

[0156] <Polarizing plate> The polarizing plate 7 is a layer for preventing reflection of external light.

[0157] The polarizing plate 7 is disposed over the entire surface of one thickness direction surface of the second sealing layer 6. More specifically, the polarizing plate 7 is disposed over the entire surface of one thickness direction surface of the second sealing layer 6 via a known optical adhesive tape (described later).

[0158] A known polarizing plate can be used as the polarizing plate 7. For example, the polarizing plate 7 may be a polarizing plate obtained by dyeing a hydrophilic polymer film (e.g., a polyvinyl alcohol film) with iodine and then stretching the film. In other words, the polarizing plate 7 contains iodine.

[0159] The thickness of the polarizing plate 7 is, for example, 50 μm or more and, for example, 200 μm or less.

[0160] <Display Device Manufacturing Method> An embodiment of a method for manufacturing the display device 10 will be described with reference to FIGS. 2A to 2G.

[0161] The manufacturing method of the display device 10 includes a first step of preparing a substrate 1, a second step of mounting an optical element 2 on one thickness-wise surface of the substrate 1, a third step of arranging a first inorganic layer 3 on the substrate 1 so as to cover the surface of the optical element 2, a fourth step of arranging a first sealing layer 4 on the first inorganic layer 3 so as to seal the optical element 2, a fifth step of arranging a second inorganic layer 5 so as to cover the surface of the first sealing layer 4, a sixth step of arranging a second sealing layer 6 on the second inorganic layer 5 so as to seal the optical element 2, and a seventh step of arranging a polarizing plate 7 on one thickness-wise surface of the second sealing layer 6.

[0162] [1st step] In the first step, a substrate 1 is prepared as shown in FIG. 2A.

[0163] [Second process] In the second step, as shown in FIG. 2B, the optical element 2 is mounted on one surface of the substrate 1 in the thickness direction.

[0164] Methods for mounting the optical element 2 include, for example, vapor deposition (vacuum deposition), sputtering, ion plating, and plasma vapor deposition (CVD).

[0165] [3rd step] 2C, the first inorganic layer 3 is disposed on the substrate 1 so as to cover the surface of the optical element 2. Specifically, the first inorganic layer 3 covers the top and side surfaces of the optical element 2 and also covers the top surface of the substrate 1.

[0166] The first inorganic layer 3 may be disposed, for example, by the same method as that used to mount the optical element 2 described above.

[0167] [4th step] In a fourth step, as shown in FIG. 2D, a first sealing layer 4 is disposed on the first inorganic layer 3 so as to seal the optical element 2.

[0168] An example of a method for disposing the first sealing layer 4 is an inkjet method. Specifically, the material for the first sealing layer 4 is applied by the inkjet method, and then the material for the first sealing layer 4 is cured. In this way, the first sealing layer 4 is disposed.

[0169] [5th ​​step] 2E, second inorganic layer 5 is disposed so as to cover the surface of first sealing layer 4. Specifically, second inorganic layer 5 is disposed so as to cover the surfaces (top and side surfaces) of first sealing layer 4.

[0170] The second inorganic layer 5 may be disposed, for example, by the same method as that used to mount the optical element 2 described above.

[0171] [6th step] 2F, in the sixth step, a second sealing layer 6 is disposed on the second inorganic layer 5 so as to seal the optical element 2. Specifically, the surface (top and side surfaces) of the second inorganic layer 5 is covered so as to seal the optical element 2.

[0172] The second sealing layer 6 can be formed by, for example, an inkjet method. Specifically, a sealing composition is applied by the inkjet method, and then the sealing composition is irradiated with light to be cured. In this way, the second sealing layer 6 is formed.

[0173] [Step 7] 2G, a polarizing plate 7 is disposed on one surface in the thickness direction of the second sealing layer 6. Specifically, for example, the polarizing plate 7 is disposed on one surface in the thickness direction of the second sealing layer 6 via a known optical adhesive tape. In this way, the display device 10 is manufactured.

[0174] <Action and effect> In display device 10, the electrical conductivity of the extracted water in second sealing layer 6 is 100 μm / S or less, which can prevent discoloration of polarizing plate 7.

[0175] Specifically, in the display device 10, the second inorganic layer 5 contains a metal nitride. When water penetrates into the second inorganic layer 5, ionic components in the water react with nitrogen to form NH3 + ions may be generated. And, such NH3 + Ions have the disadvantage of bleaching the polarizing plate 7 .

[0176] On the other hand, in the display device 10, the electrical conductivity of the extracted water in the second sealing layer 6 is 100 μm / S or less. Therefore, even if water penetrates into the second inorganic layer 5, the ionic components in the water react with nitrogen to form NH3 + Therefore, in the second inorganic layer 5, water and nitrogen react to form NH3 + This can prevent ions from being generated, thereby preventing the polarizing plate 7 from being discolored.

[0177] Furthermore, in the display device 10, as long as the electrical conductivity of the extracted water in the second sealing layer 6 is 100 μm / S or less, discoloration of the polarizing plate 7 can be suppressed, and the composition and thickness of the second sealing layer 6 are not limited.

[0178] <Modification> In the modified example, the same components and steps as those in the first embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. Furthermore, the modified example can achieve the same effects as those in the first embodiment unless otherwise specified. Furthermore, the first embodiment and the modified example can be combined as appropriate.

[0179] In the above description, display device 10 includes substrate 1, optical element 2, first inorganic layer 3, first sealing layer 4, second inorganic layer 5, second sealing layer 6, and polarizer 7. However, display device 10 does not necessarily include first inorganic layer 3 and first sealing layer 4. In such a case, display device 10 includes substrate 1, optical element 2, second inorganic layer 5, second sealing layer 6, and polarizer 7.

[0180] In the above description, the polarizing plate 7 is arranged over the entire surface of one thickness-wise surface of the second sealing layer 6, but this is not limited to this, and the polarizing plate 7 may be arranged over at least a portion of one thickness-wise surface of the second sealing layer 6. [Example]

[0181] Next, the present invention will be described based on examples and comparative examples, but the present invention is not limited to the following examples. Note that "parts" and "%" are by mass unless otherwise specified. Furthermore, specific numerical values ​​such as blending ratios (content ratios), physical property values, and parameters used in the following description can be substituted with the corresponding upper limit values ​​(numeric values ​​defined as "equal to or less than") or lower limit values ​​(numeric values ​​defined as "equal to or more than" or "exceeding") of the blending ratios (content ratios), physical property values, parameters, etc. described in the above "Form for Carrying Out the Invention."

[0182] <Ingredient details> The trade names and abbreviations of the components used in each example and each comparative example are detailed below. CEL8010: (3,3',4,4'-diepoxy)bicyclohexyl, trade name "Celloxide 8010", manufactured by Daicel Corporation CEL2021P: 3',4'-epoxycyclohexylmethyl (3,4-epoxy) cyclohexane carboxylate, an ECH structure-containing epoxy resin represented by the general formula (4) above, trade name "Celloxide 2021P", molecular weight: 252.3, epoxy equivalent: 128 to 145 g / eq., manufactured by Daicel Corporation NPG(D): Neopentyl glycol diglycidyl ether, manufactured by Sakamoto Pharmaceutical Co., Ltd. OXT221: 3-ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane, trade name "Aron Oxetane OXT-221", manufactured by Toagosei Chemical Co., Ltd. OXT212: 2-ethylhexyl oxetane, trade name "Aron Oxetane OXT-212", manufactured by Toagosei Chemical Co., Ltd. CPI-210S:(CF2CF3) n PF (6-n) - Sulfonium salts (specifically, triarylsulfonium salts) with the counter anion CPI-310FG: sulfonium salt with FG anion as a counter ion (specifically, triarylsulfonium salt), manufactured by San-Apro Co., Ltd. Styrenic oligomers: homopolymers of isopropenyltoluene. K-125: Terpene phenol resin, product name "YS Polyster K-125", manufactured by Yasuhara Chemical Co., Ltd. UVS-1331: 9,10-dibutoxyanthracene UVS-581: 9,10-bis(octanoyloxy)anthracene BYK-378: Silicone leveling agent KBM-403: 3-glycidoxypropyltrimethoxysilane HALS: Sebacic acid Bis(1-octyloxy-2,2,6,6-tetramethyl-4-piperidyl), trade name "Tinuvin 123", manufactured by BASF

[0183] <Display device manufacturing> [Preparation of sealing composition] Examples 1 to 6 and Comparative Examples 1 to 4 Based on the formulation shown in Table 1, the cationically polymerizable compound, the cation polymerization initiator, and the additives were mixed with a magnetic stirrer and dissolved. This prepared a sealing composition. In Table 1, the unit of each component is "parts by mass."

[0184] [Display device manufacturing] The manufacture of the display device will be described with reference to FIGS. 2A to 2G. (1st step) As shown in FIG. 2A, a glass substrate was prepared as a substrate 1.

[0185] (2nd process) 2B, an optical element 2 was mounted by plasma vapor deposition (CVD) on one surface in the thickness direction of the substrate 1. An organic EL element was used as the optical element 2.

[0186] (3rd step) As shown in FIG. 2C, a first inorganic layer 3 was disposed on the substrate 1 so as to cover the surface of the optical element 2. Specifically, the first inorganic layer 3 (thickness: 1.0 μm) was formed by plasma vapor deposition (CVD). Place Moreover, silicon nitride was used as the material for the first inorganic layer 3.

[0187] (4th step) 2D, a first sealing layer 4 was disposed on the first inorganic layer 3 so as to seal the optical element 2. Specifically, the material for the first sealing layer 4 (ultraviolet-curable epoxy resin) was applied by an inkjet method and then cured. In this way, the first sealing layer 4 (thickness: 10 μm) was disposed.

[0188] (5th step) 2E, second inorganic layer 5 was disposed so as to cover the surfaces (top and side surfaces) of first sealing layer 4. Specifically, second inorganic layer 5 (thickness 1.0 μm) was disposed by plasma vapor deposition (CVD). Silicon nitride was used as the material for second inorganic layer 5.

[0189] (6th step) As shown in FIG. 2F, a second sealing layer 6 was disposed on the second inorganic layer 5 so as to seal the optical element 2. Specifically, the sealing compositions of each example and each comparative example were applied by an inkjet method, and then irradiated with ultraviolet light (1 W / cm 2 , 4J / cm 2) was irradiated and cured, thereby forming second sealing layer 6 (thickness: 10 μm).

[0190] (7th step) 2G, a polarizing plate 7 (a polarizing film manufactured by Kenis, an iodine-based polarizing plate, thickness 200 μm) was placed on one surface in the thickness direction of the second sealing layer 6 via an optical adhesive tape (HJ-9150W manufactured by Nitto Denko Corporation). In this way, the display device 10 was manufactured.

[0191] <Evaluation> [Electrical conductivity of extracted water in the second sealing layer] The sealing composition of each Example and Comparative Example was applied to one surface in the thickness direction of a PET film (100 μm) so that the thickness after application was 10 μm to form a coating film of the sealing composition. Next, a PET film (100 μm) was placed on one surface in the thickness direction of the coating film via a frame material.

[0192] Next, the coating film was irradiated with ultraviolet light (1 W / cm 2 , 4J / cm 2 ) to obtain a cured product of the sealing composition. Thereafter, the PET film was peeled off. In this way, a sample for measuring electrical conductivity made of the cured product of the sealing composition was produced.

[0193] The sample for measuring electrical conductivity was cut into a size of 20 mm × 20 mm × 10 μm. Then, 0.5 g of the sample for measuring electrical conductivity was placed in a cleaned PTFE container with a lid.

[0194] Next, 17.5 g of ultrapure water whose electrical conductivity was known in advance was added to the container, and the sample for electrical conductivity measurement was immersed in the ultrapure water and then the container was covered.

[0195] Thereafter, the sample was left in a thermostatic chamber at 85°C and 85% RH for 24 hours, and then cooled to room temperature to obtain an ultrapure water measurement solution.

[0196] The electrical conductivity of the ultrapure water measurement solution was measured using an electrical conductivity meter SC-72 (manufactured by Yokogawa Electric Corporation). The value obtained by subtracting the electrical conductivity of the blank (ultrapure water) was used as the electrical conductivity of the extracted water of the second sealing layer. The results are shown in Table 1.

[0197] If the thickness of second sealing layer 6 (cured product of the sealing composition) is 100 μm or less, the thickness does not affect the electrical conductivity. Furthermore, according to the above test method, the electrical conductivity of a sealing layer with a "thickness of 10 μm" in a display device is of In other words, the same results as those obtained by the above measurement are obtained. Tried According to the experimental method, if a cured product of a sealing composition having a thickness of X μm is prepared and the electrical conductivity is measured, the same results as when the electrical conductivity of a sealing layer having a thickness of X μm in a display device is measured will be obtained.

[0198] [Polarizing plate discoloration test] (Preparation of polarizing plate discoloration test sample) A silicon nitride film was formed as an inorganic layer on one surface of the glass plate in the thickness direction by plasma vapor deposition (CVD).

[0199] Next, the sealing composition of each Example and Comparative Example was applied to one surface of the inorganic layer in the thickness direction using an applicator (to a coating thickness of 10 μm), and then irradiated with ultraviolet light (1 W / cm 2 , 4J / cm 2 ) to obtain a sealing layer (a cured product of the sealing composition).

[0200] Next, a polarizing plate (a polarizing film manufactured by Kenis, an iodine-based polarizing plate) was placed on one surface of the sealing layer in the thickness direction via an optical adhesive tape (HJ-9150W manufactured by Nitto Denko Corporation). In this way, a sample for polarizing plate discoloration test was prepared.

[0201] (Polarizing plate discoloration test) The polarizing plate discoloration test sample was left in a thermostatic chamber at 85° C. and 85% RH for 24 hours, and the change in color of the polarizing plate was visually observed.

[0202] The discoloration of the polarizing plate was evaluated according to the following criteria, and the results are shown in Table 1. {standard} ◯: The color of the polarizing plate did not change. ×: The color of the polarizing plate became lighter.

[0203] [Table 1]

[0204] The above invention is provided as an exemplary embodiment of the present invention, but this is merely an example and should not be interpreted as limiting. Modifications of the present invention that are obvious to those skilled in the art are intended to be included in the scope of the following claims. [Industrial Applicability]

[0205] The display device of the present invention is suitably used, for example, in an organic EL display. [Explanation of symbols]

[0206] 1 board 2. Optical Elements 5 Second inorganic layer 6 Second sealing layer 7 Polarizing Plate 10 Display device

Claims

1. A substrate; an optical element mounted on one surface of the substrate in the thickness direction; a sealing layer that seals the optical element; an inorganic layer interposed between the optical element and the sealing layer and including a metal nitride; a polarizing plate disposed on at least a portion of one surface in a thickness direction of the sealing layer, The electrical conductivity of the extracted water in the sealing layer is 100 μm / S or less, the sealing layer is made of a cured product of a sealing composition, the sealing composition contains a cationically polymerizable compound and a cationic polymerization initiator; The content of the cationic polymerization initiator is 0.2 parts by mass or more and 0.8 parts by mass or less with respect to 100 parts by mass of the cationic polymerizable compound.

2. The display device according to claim 1 , wherein the cationically polymerizable compound includes an epoxy compound and / or an oxetane compound.

3. The display device according to claim 2 , wherein the epoxy compound includes an alicyclic epoxy resin and an aliphatic epoxy resin.

4. The display device according to claim 2 , wherein the oxetane compound includes a bifunctional oxetane compound.

5. The display device according to claim 1 , wherein the sealing composition includes a leveling agent.

6. The display device according to claim 1 , wherein the sealing composition includes a coupling agent.

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