Adhesive resin composition and laminate

A specific adhesive resin composition with modified polyolefin and low-density polyethylene addresses adhesion and resistance issues, ensuring effective adhesion to metals and organics with improved extrusion suitability and environmental stability.

JP7757726B2Active Publication Date: 2025-10-22TOYO INK MFG CO LTD +1
View PDF 5 Cites 0 Cited by

Patent Information

Application Number
JP2021187557
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-11-18
Publication Date
2025-10-22
Estimated Expiration
2041-11-18

AI Technical Summary

Technical Problem

Existing adhesive resin compositions face challenges in achieving excellent adhesion to both metal and organic materials after low-temperature, short-time heat treatment, while maintaining heat resistance and cold resistance, and ensuring suitability for extrusion lamination processes.

Method used

An adhesive resin composition comprising 1 to 50% modified polyolefin, 40 to 98% low-density polyethylene, and 1 to 30% tackifier resin, with the modified polyolefin containing specific ratios of ethylene, propylene, and 1-butene structural units, provides excellent adhesion and resistance properties.

Benefits of technology

The composition exhibits good adhesion to metals and organic materials, maintains adhesion in various environments, and supports smooth extrusion lamination with improved heat and cold resistance.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007757726000001
    Figure 0007757726000001
  • Figure 0007757726000002
    Figure 0007757726000002
  • Figure 0007757726000003
    Figure 0007757726000003
Patent Text Reader

Abstract

To provide an adhesive resin composition which has excellent suitability for extrusion lamination, such as causing little problems of roll-releasability and neck in, and has good adhesiveness to both of a metallic material such as copper and aluminum, and a plastic material such as polyethylene, polyethylene terephthalate, polypropylene and polystyrene even by heat sealing at low temperature and in a short time, and is excellent in heat resistance and cold resistance and is capable of maintaining adhesiveness even in various environments, and to provide a laminate using the adhesive resin composition.SOLUTION: The above problem can be solved by an adhesive resin composition comprising 1 to 50 mass% of a modified polyolefin (A), 40 to 80 mass% of a low density polyethylene (B), and 1 to 10 mass% of a tackifier resin (C), in which the modified polyolefin (A) is obtained by modifying a multi-component polymer comprising 70 to 85 mass% of a structural unit derived from ethylene, 10 to 25 mass% of a structural unit derived from propylene, and 1 to 10 mass% of a structural unit derived from 1-butene, based on the total mass of the polyolefin.SELECTED DRAWING: None
Need to check novelty before this filing date? Find Prior Art

Description

[Technical Field]

[0001] The present invention relates to an adhesive resin composition that exhibits excellent adhesion not only to metal materials such as copper and aluminum but also to organic materials such as polyethylene, polyethylene terephthalate, and polypropylene after low-temperature, short-time heat treatment, and to an adhesive resin composition film having an adhesive layer made of the resin composition. More specifically, the present invention relates to an adhesive resin composition that exhibits adhesion to both metal materials and organic materials, heat resistance, and cold resistance after low-temperature, short-time heat treatment, and that has excellent manufacturability, and to a laminate having an adhesive layer made of the adhesive resin composition. [Background technology]

[0002] In recent years, there has been a demand for adhesive resin compositions that have excellent adhesion to both metal materials such as copper and aluminum and organic materials such as polyethylene, polyethylene terephthalate, and polypropylene after low-temperature, short-time heat treatment.

[0003] Patent Document 1 discloses an adhesive resin composition containing modified polyolefin, low-density polyethylene, and a tackifier resin. However, there are problems with the adhesiveness to polyethylene, polypropylene, and polystyrene, and with the roll release properties in extrusion lamination. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 1-315443 Summary of the Invention [Problem to be solved by the invention]

[0005] Therefore, the problem that the present invention aims to solve is to provide an adhesive resin composition that has excellent suitability for extrusion lamination such as roll release and neck-in, that exhibits good adhesion even when heat-treated at low temperatures for a short period of time to both metal materials such as copper, stainless steel (hereinafter referred to as SUS) and aluminum and organic materials such as polyethylene, polyethylene terephthalate, polypropylene and polystyrene, and that further has excellent heat resistance and cold resistance and can maintain adhesion in a variety of environments, and a laminate made using the adhesive resin composition. [Means for solving the problem]

[0006] As a result of extensive research, the present inventors have found that the above problems can be solved by using a modified polyolefin obtained by modifying a multi-component polymer having a specific composition ratio, and have arrived at the present invention.

[0007] The present invention relates to an adhesive resin composition comprising, based on 100% by mass of the adhesive resin composition, 1 to 50% by mass of a modified polyolefin (A), 40 to 98% by mass of a low-density polyethylene (B), and 1 to 30% by mass of a tackifier resin (C), wherein the modified polyolefin (A) is a multi-component polymer containing, based on the total mass of the polyolefin, 70 to 85% by mass of structural units derived from ethylene, 10 to 25% by mass of structural units derived from propylene, and 1 to 10% by mass of structural units derived from 1-butene.

[0008] The present invention relates to a modified polyolefin (A) having a density of 0.88 to 0.91 g / cm 3 The present invention relates to the adhesive resin composition, wherein the adhesive resin composition is in the range of

[0009] The present invention relates to the adhesive resin composition, wherein the modified polyolefin (A) has one melting peak temperature in the range of 100 to 140°C.

[0010] The present invention relates to the adhesive resin composition described above, wherein the modified polyolefin (A) is an acid-modified polyolefin.

[0011] The present invention relates to the adhesive resin composition, which has a melt mass-flow rate measured in accordance with JIS K 7210-1:2014 at a temperature of 190°C under a load of 2.16 kg in the range of 2 to 10 g / 10 min.

[0012] The present invention relates to a laminate having an adhesive layer formed from the above adhesive resin composition on a substrate. [Effects of the Invention]

[0013] The present invention can provide an adhesive resin composition that has excellent suitability for extrusion lamination, such as roll release and neck-in, and that exhibits good adhesion to both metal materials such as copper, SUS, and aluminum and organic materials such as polyethylene, polyethylene terephthalate, polypropylene, and polystyrene, even after heat treatment at low temperatures and for a short period of time, and that further has excellent heat resistance and cold resistance and can maintain adhesion under various environments, as well as a laminate made using the adhesive resin composition. DETAILED DESCRIPTION OF THE INVENTION

[0014] The following describes in detail the embodiments of the present invention. However, the description of the components described below is an example of an embodiment of the present invention, and the present invention is not limited to these contents as long as it does not exceed the gist of the present invention.

[0015] In this specification, a numerical range specified using "to" is intended to include the numerical values ​​before and after "to" as the range's lower and upper limits. Unless otherwise noted, the various components appearing in this specification may be used independently either alone or in combination of two or more.

[0016] The melt mass flow rate (hereinafter sometimes abbreviated as MFR) in this specification is the amount of melt flowing out in 10 minutes measured at 190°C and a load of 2.16 kg in accordance with JIS K 7210-1:2014. The melting peak temperature in this specification is the temperature at the top of the endothermic peak measured at a heating rate of 10°C / min in accordance with JIS K 7121:1987. Details are described in the Examples section.

[0017] ≪Adhesive resin composition≫ The adhesive resin composition of the present invention comprises, based on 100% by mass of the adhesive resin composition, 1 to 50% by mass of a modified polyolefin (A), 40 to 98% by mass of a low-density polyethylene (B), and 1 to 30% by mass of a tackifier resin (C), and is characterized in that the polyolefin in the modified polyolefin (A) contains, relative to the total mass of the polyolefin, 70 to 85% by mass of structural units derived from ethylene, 10 to 25% by mass of structural units derived from propylene, and 1 to 10% by mass of structural units derived from 1-butene. By using a multi-component polymer having the above-mentioned specific composition ratio, not only is the polymer excellent in suitability for extrusion lamination such as roll release and neck-in, but it also exhibits good adhesion to metal materials such as copper, SUS, and aluminum, and organic materials such as polyethylene, polyethylene terephthalate, polypropylene, and polystyrene, even when heat-treated at low temperatures and for a short time, and furthermore, it has excellent heat resistance and cold resistance, making it possible to maintain adhesion in a variety of environments. In this specification, neck-in refers to a phenomenon in which the width of a film of an adhesive resin composition extruded in the form of a film from a die in an extrusion laminator becomes narrower than the width of the die, and the larger the neck-in, the poorer the suitability for extrusion lamination.

[0018] <Modified polyolefin (A)> The adhesive resin composition of the present invention contains 1 to 50 mass% of a modified polyolefin (A) obtained by modifying a multicomponent polymer (hereinafter also referred to as base polymer) containing, relative to the total mass of polyolefin, 70 to 85 mass% of structural units derived from ethylene, 10 to 25 mass% of structural units derived from propylene, and 1 to 10 mass% of structural units derived from 1-butene. By adjusting the composition ratio of the multicomponent polymer within a predetermined range, an adhesive composition excellent in adhesion, heat resistance, and cold resistance can be obtained.

[0019] The multi-component polymer preferably contains 70 to 80 mass% of an ethylene component, 15 to 25 mass% of a propylene component, and 3 to 7 mass% of a 1-butene component relative to the total mass of the polyolefin, and more preferably contains 75 to 80 mass% of an ethylene component, 15 to 20 mass% of a propylene component, and 3 to 5 mass% of a 1-butene component relative to the total mass of the polyolefin.

[0020] The multi-component polymer may have structural units derived from monomers other than ethylene, propylene, and 1-butene, such as 1-octene, 4-methylpentene-1, (meth)acrylic acid, methyl (meth)acrylate, ethyl (meth)acrylate, isobutyl (meth)acrylate, n-butyl (meth)acrylate, isooctyl (meth)acrylate, glycidyl (meth)acrylate, dimethyl maleate, diethyl maleate, vinyl acetate, vinyl propionate, and tetracyclododecene.

[0021] The modified polyolefin (A) is preferably an acid-modified polyolefin. The method for producing such an acid-modified polyolefin is not particularly limited, and an example thereof is a method described in JP-A-11-335427, in which an α,β-unsaturated carboxylic acid or an anhydride thereof is grafted to a polyolefin base polymer in a molten state in the presence of a radical initiator. These modified polyolefins (A) may be used singly or in combination of two or more.

[0022] The density of the modified polyolefin (A) is preferably 0.88 to 0.91 g / cm 3 More preferably, it is in the range of 0.88 to 0.90 g / cm 3 The range is particularly preferably 0.88 to 0.89 g / cm 3 The range is.

[0023] The melt mass flow rate of the modified polyolefin (A) is preferably in the range of 1 to 100 g / 10 min, more preferably in the range of 2 to 50 g / 10 min, and particularly preferably in the range of 5 to 20 g / 10 min.

[0024] The modified polyolefin (A) preferably has only one melting peak temperature in the range of 100 to 140°C, more preferably in the range of 120 to 130°C, and particularly preferably in the range of 122 to 126°C.

[0025] <Low-density polyethylene (B)> The adhesive resin composition of the present invention contains 40 to 98 mass % of the low-density polyethylene (B) based on 100 mass % of the adhesive resin composition. Low-density polyethylene is a thermoplastic resin with a branched structure in which repeating ethylene units are randomly bonded, and because of the large number of branched structures, it tends to have low crystallinity.

[0026] The density of the low-density polyethylene (B) is preferably 0.910 g / cm 3 More than 0.930g / cm 3 less than 0.915 to 0.925 g / cm 3 The range is particularly preferably 0.917 to 0.922 g / cm 3 The range is. In addition, in the old JIS K6748:1995, low-density polyethylene is defined as a polyethylene with a density of 0.910 g / cm 3 More than 0.930g / cm 3 It is defined as polyethylene of less than

[0027] The melting peak temperature of the low-density polyethylene (B) is preferably in the range of 95 to 120° C., more preferably in the range of 100 to 115° C., and particularly preferably in the range of 105 to 110° C. When the melting peak temperature is in the above range, both heat resistance and compatibility can be achieved.

[0028] The melt mass flow rate of the low-density polyethylene (B) is preferably in the range of 1 to 200 g / 10 min, more preferably in the range of 1 to 50 g / 10 min, even more preferably in the range of 1 to 20 g / 10 min, and particularly preferably in the range of 5 to 20 g / 10 min.

[0029] <Tackifying resin (C)> The adhesive resin composition of the present invention contains 1 to 30% by mass of the tackifier resin (C) based on 100% by mass of the adhesive resin composition.

[0030] The tackifier resin (C) constituting the adhesive resin composition of the present invention can be any known tackifier resin used in the field of sealant adhesion, such as an aliphatic hydrocarbon resin, an alicyclic hydrocarbon resin, an aromatic hydrocarbon resin, a polyterpene resin, or a rosin. Among these, an alicyclic hydrocarbon resin and / or an aromatic hydrocarbon resin is preferred. The above resins may be partially or fully hydrogenated. These tackifier resins (C) can be used alone or in combination of two or more. The tackifier resin (C) preferably has a softening point of 60 to 150°C, more preferably 90 to 135°C, and even more preferably 100 to 130°C. Having a softening point in the range of 60 to 150°C allows for the production of a monolayer or multilayer film while suppressing blocking and achieving high adhesive strength. The softening point is a value measured in accordance with JIS K 2207.

[0031] The tackifier resin (C) is present in an amount of 1 to 30% by mass, preferably 5 to 20% by mass, and more preferably 10 to 15% by mass, based on 100% by mass of the adhesive resin composition. When the tackifier resin is present in an amount of 1% by mass or more, the adhesiveness is improved, and when the amount is present in an amount of 30% by mass or less, the melt tension is less likely to decrease, necking-in and other problems are less likely to occur, and blocking resistance with the substrate is improved. Being within the above preferred range is more preferable in terms of adhesive strength, necking-in, and blocking resistance.

[0032] <Properties of adhesive resin composition> The adhesive resin composition of the present invention preferably has a melt mass flow rate of 1 to 100 g / 10 min, more preferably 1 to 50 g / 10 min, and particularly preferably 2 to 20 g / 10 min. A melt mass flow rate of 1 g / 10 min or more is preferred from the viewpoint of sealability, and a melt mass flow rate of 100 g / 10 min or less is preferred because it is excellent in extrusion lamination suitability and easier to form into a film.

[0033] The adhesive resin composition of the present invention may contain additives such as colorants, antiblocking agents, and antioxidants, as long as the effects of the present invention are not impaired. An example of the colorant is titanium oxide. Examples of the anti-blocking agent include silicone, unsaturated fatty acid amides such as erucic acid amide and oleic acid amide, and saturated fatty acid amides such as stearic acid amide and behenic acid amide. Examples of antioxidants include high molecular weight hindered polyhydric phenols, triazine derivatives, high molecular weight hindered phenols, dialkylphenol sulfides, 2,2-methylene-bis-(4-methyl-6-tert-butylphenol), 4,4-methylene-bis-(2,6-di-tert-butylphenol), 2,6-di-tert-butylphenol-p-cresol, 2,5-di-tert-butylhydroquinone, 2,2,4-trimethyl-1,2-dihydroquinone, 2,2,4-trimethyl-1,2-dihydroquinone, nickel dibutyl dithiocarbamate, 1-oxy-3-methyl-4-isopropylbenzene, 4,4-butylidenebis-(3-methyl-6-tert-butylphenol), and 2-mercaptobenzimidazole.

[0034] <Laminate> The laminate of the present invention has an adhesive layer formed from the adhesive resin composition on a substrate. The method for forming the adhesive layer is not particularly limited, and in most cases, the adhesive layer is applied to the substrate using an extrusion laminator. The adhesive resin composition of the present invention has excellent suitability for extrusion lamination. The surface specifications of the cooling rolls of extrusion laminators vary, including matte, mirror, and intermediate semi-matte and semi-mirror finishes. The adhesive resin composition of the present invention can exhibit good roll release properties with cooling rolls of any surface specification.

[0035] [Base material] Examples of substrates include single-layer films or sheets made of one type of material such as polyethylene terephthalate (hereinafter, PET), polyethylene naphthalate, polybutylene naphthalate, acrylic, polycarbonate, polyimide, urethane, polypropylene, and polystyrene, and multi-layer films or sheets made of two or more types of substrates such as PET / PE, in which PET and polyethylene (hereinafter, PE) are laminated, PET / AL, in which PET and aluminum foil (AL) are laminated, and PET / AL / PE. These substrates may have a vapor-deposited layer of alumina, silica, or the like.

[0036] The thickness of the adhesive layer is preferably 3 to 200 μm, more preferably 5 to 100 μm, still more preferably 10 to 50 μm, and particularly preferably 15 to 30 μm.

[0037] As described above, the laminate of the present invention exhibits good adhesion to both metal materials such as copper, SUS, and aluminum and organic materials such as polyethylene, polyethylene terephthalate, polypropylene, and polystyrene after low-temperature, short-term heat treatment, and further has excellent heat resistance and cold resistance and can maintain adhesion under various environments, making it useful as an adhesive resin composition. [Example]

[0038] The present invention will be described in more detail below with reference to examples, but the scope of the invention is not limited by these examples. Unless otherwise specified, "parts" and "%" in the examples represent "parts by mass" and "% by mass", respectively.

[0039] The MFR, melting peak temperature, and softening point were measured by the following methods.

[0040] [MFR] Measurements were performed in accordance with JIS K 7210-1:2014 at a temperature of 190°C and a load of 2.16 kg.

[0041] [Peak melting temperature] The temperature at the apex of the endothermic peak in a DSC (differential scanning calorimetry) curve measured in accordance with JIS K 7121 was taken as the melting peak temperature.

[0042] [Softening point] The softening point was measured by the ring and ball method in accordance with JIS K 2207.

[0043] The abbreviations of the materials used in the examples and comparative examples are shown below.

[0044] <Modified polyolefin> Modified product-1 (A-1): Acid-modified polyolefin obtained by acid-modifying a base polymer containing 72% by mass of ethylene-derived structural units, 21% by mass of propylene-derived structural units, 6% by mass of 1-butene-derived structural units, and 1% by mass of 1-octene-derived structural units. MFR: 2.5 g / 10 min, melting peak temperature: 128°C, density: 0.890 g / cm 3 Modified product-2 (A-2): Acid-modified polyolefin obtained by acid-modifying a base polymer containing 77% by mass of ethylene-derived structural units, 18% by mass of propylene-derived structural units, 4% by mass of 1-butene-derived structural units, and 1% by mass of 1-octene-derived structural units. MFR: 7 g / 10 min, peak melting temperature: 124°C, density: 0.888 g / cm 3 Modified product-3 (A-3): Acid-modified polyolefin obtained by acid-modifying a base polymer containing 84% by mass of ethylene-derived structural units, 12% by mass of propylene-derived structural units, 3% by mass of 1-butene-derived structural units, and 1% by mass of 1-octene-derived structural units. MFR: 4 g / 10 min, peak melting temperature: 120°C, density: 0.892 g / cm 3 Modified product-4 (X-1): Acid-modified polyolefin obtained by acid-modifying a base polymer containing 16% by mass of ethylene-derived structural units, 80% by mass of propylene-derived structural units, and 4% by mass of 1-butene-derived structural units. MFR: 3 g / 10 min, peak melting temperature: 162°C, density: 0.901 g / cm 3 Modified product-5 (X-2): Acid-modified polyolefin obtained by acid-modifying a base polymer containing 96% by mass of ethylene-derived structural units and 4% by mass of propylene-derived structural units. MFR: 1 g / 10 min, peak melting temperature: 108°C, 122°C, density: 0.895 g / cm 3 Modified product-6 (X-3): Acid-modified polyolefin obtained by acid-modifying a base polymer containing 85% by mass of ethylene-derived structural units, 3% by mass of propylene-derived structural units, 5% by mass of 1-butene-derived structural units, 2% by mass of 1-octene-derived structural units, and 5% by mass of 4-methylpentene-1-derived structural units. MFR: 6 g / 10 min., melting peak temperatures: 105, 119, and 124°C., density: 0.909 g / cm. 3

[0045] A list of modified polyolefins is shown below.

[0046] [Table 1]

[0047] <Low-density polyethylene (B)> B-1: Low-density polyethylene, MFR 2 g / 10 min, melting peak temperature 112 °C, density 0.924 g / cm 3 B-2: Low-density polyethylene, MFR 13 g / 10 min, melting peak temperature 107 °C, density 0.919 g / cm 3 B-3: Low-density polyethylene, MFR 58 g / 10 min, melting peak temperature 101°C, density 0.917 g / cm 3

[0048] <Tackifying resin (C)> C-1: Hydrogenated petroleum resin (acid value 0 mg KOH / g, softening point 125°C) C-2: Aromatic hydrocarbon resin (acid value 0.1 mg KOH / g or less, softening point 95°C) C-3: Rosin resin (acid value 238mgKOH / g, softening point 129℃)

[0049] <Additives> Antioxidant: Hindered phenolic antioxidant Antiblocking agent: erucic acid amide

[0050] <Production of Adhesive Resin Composition> [Example 1] The acid-modified polyolefin (A), low-density polyethylene (B), tackifier resin (C), and additives were melt-kneaded using a twin-screw extruder in the amounts shown in Table 3 to obtain the adhesive resin composition of Example 1. Twin-screw extruder conditions Twin-screw extruder: IKG PMT32-40.5 Cylinder temperature: 100~180℃ Extrusion rate: 10-50 kg / hour

[0051] <Production of laminate> [Example 12] The adhesive resin composition obtained in Example 1 was used to laminate the adhesive resin composition to a thickness of 30 μm on the PE side of a laminated substrate of PET (thickness 12 μm) / PE (thickness 20 μm) using an extrusion laminator under the following conditions, thereby producing a laminate of Example 12. <Extrusion laminator conditions> Extrusion laminator: Musashino Kikai 400M / M Test EXT laminator Resin temperature directly below the die: 200 to 280°C Machining speed: 30m / min T-die width: 400mm Cooling roll surface temperature: 20 to 25°C

[0052] [Examples 2 to 11, Comparative Examples 1 to 8] Adhesive resin compositions of Examples 2 to 11 and Comparative Examples 1 to 8 were produced in the same manner as in Example 1, except that the blending compositions (parts by mass) were changed to those shown in Tables 2 and 3.

[0053] [Examples 13 to 22, Comparative Examples 9 to 16] Using the adhesive resin compositions shown in Tables 2 and 3, laminates of Examples 13 to 22 and Comparative Examples 9 to 16 were produced in the same manner as in Example 12.

[0054] <Evaluation of Adhesive Resin Composition> The resulting laminate was subjected to the following evaluations, and the results are shown in Tables 2 and 3.

[0055] [Roll release] During the production of the laminate, peeling of the laminate from the cooling roll was observed and evaluated according to the following criteria. ○: Easy to peel off (good) △: Peels off from the cooling roll with a peeling sound (usable) ×: The laminated film does not peel off from the cooling roll and wraps around the cooling roll (unusable)

[0056] [Neck-in] The lamination width of the produced laminate was evaluated and evaluated according to the following criteria. ○: Lamination width is 350mm or more (good) △: Lamination width is 300mm or more and less than 350mm (usable) ×: Lamination width is less than 300mm (cannot be used)

[0057] [Adhesive strength] The laminate was cut into 15 mm wide test pieces. The test pieces were heat-sealed to SUS304, aluminum (A1050P), copper (Tough Pitch Copper C1100), HDPE, CPP, or PET sheets at 140°C for 1 second at a pressure of 0.1 MPa to prepare samples for adhesive strength measurement. After leaving the test pieces at 23°C and 65% relative humidity for 24 hours, adhesive strength was measured using a Shimadzu AGX-V autograph at a 180° angle peel speed of 200 mm / min and evaluated according to the following criteria. ○: Adhesion strength is 20N / 15mm or more (good) △: Adhesive strength is 15N / 15mm or more and less than 20N / 15mm (usable) ×: Adhesive strength is less than 15N / 15mm (unusable)

[0058] [Heat resistance] The adhesive strength measurement samples used in the evaluation of adhesive strength were left in an 80°C atmosphere for 1000 hours, and then the adhesive strength was measured using a tensile strength tester (Shimadzu Autograph AGX-V model) under conditions of 180° angle peeling and a peeling speed of 200 mm / min, and evaluated according to the following criteria. ○: Adhesion strength is 20N / 15mm or more (good) △: Adhesive strength is 15N / 15mm or more and less than 20N / 15mm (usable) ×: Adhesive strength is less than 15N / 15mm (unusable)

[0059] [Cold resistance] The adhesive strength measurement samples used in the evaluation of adhesive strength were left in a -30°C atmosphere for 1000 hours, and then the adhesive strength was measured using a tensile strength tester (Shimadzu Autograph AGX-V model) under conditions of 180° angle peeling and a peeling speed of 200 mm / min, and evaluated according to the following criteria. ○: Adhesion strength is 20N / 15mm or more (good) △: Adhesive strength is 15N / 15mm or more and less than 20N / 15mm (usable) ×: Adhesive strength is less than 15N / 15mm (unusable)

[0060] [Table 2]

[0061] [Table 3]

[0062] As shown in Table 2, the adhesive resin composition of the present invention, which contains 1 to 50 mass% of modified polyolefin (A) having a polyolefin base polymer containing 70 to 85 mass% of structural units derived from ethylene, 10 to 25 mass% of structural units derived from propylene, and 1 to 10 mass% of structural units derived from 1-butene, 40 to 98 mass% of low-density polyethylene (B), and 1 to 30 mass% of tackifier resin (C), exhibits not only processability (roll release property, neck-in), but also excellent adhesive strength, heat resistance, and cold resistance, demonstrating its usefulness as an adhesive resin composition.

Claims

1. An adhesive resin composition comprising, based on 100% by mass of the adhesive resin composition, 10 to 50% by mass of a modified polyolefin (A), 40 to 80% by mass of a low-density polyethylene (B), and 10 to 30% by mass of a tackifier resin (C), the modified polyolefin (A) is an acid-modified polyolefin, The softening point of the tackifier resin (C) is 60 to 150°C, The adhesive resin composition is a multi-component polymer containing, relative to the total mass of the polyolefin in the modified polyolefin (A), 70 to 85 mass% of structural units derived from ethylene, 10 to 25 mass% of structural units derived from propylene, and 1 to 10 mass% of structural units derived from 1-butene.

2. The density of the modified polyolefin (A) is 0.88 to 0.91 g / cm 3 The adhesive resin composition according to claim 1, wherein the viscosity is in the range of

3. 3. The adhesive resin composition according to claim 1, wherein the modified polyolefin (A) has one melting peak temperature in the range of 100 to 140°C.

4. The adhesive resin composition according to any one of claims 1 to 3, wherein the melt mass flow rate measured in accordance with JIS K 7210-1:2014 at a temperature of 190 ° C. and a load of 2.16 kg is in the range of 1 to 100 g / 10 min.

5. A laminate having an adhesive layer formed from the adhesive resin composition according to any one of claims 1 to 4 on a substrate.

Citation Information

Patent Citations

  • Hot melt adhesive for lap joint of pre-laid coiled materials and preparation method thereof

    CN112920741A

  • 1-butene polymer and low density polyethylene- containing composition

    JP1989315443A

  • Modified polyolefin composition for adhesion

    JP2004238438A

  • Modified carboxylated polyolefins and their use as adhesion promoters

    JP2005501938A

  • Modified polyolefin having extremely excellent characteristic profile, production method therefor and use thereof

    JP2011012262A