Electronic component assembly equipment, electronic component structure manufacturing equipment

Abstract

To provide an electronic component structure manufacturing apparatus and the like, capable of manufacturing products having high performance and capable of improving manufacturing efficiency.SOLUTION: An electronic component assembling apparatus for crimping an electronic component constructional member and an anisotropic conductive material 200 comprises: a base stand 802; a transfer mechanism for transferring the base stand 802; a placement stand 13 detachably attached to the base stand 802; a separation support device 600 that is disposed in a crimping region provided on a transfer path for the base stand 802, separates the placement stand 13 from the base stand 802, and supports the separated placement stand 13 from below; and a crimping device 6 that is disposed in the crimping region and, in a state in which with respect to one member of the electronic component constructional member placed on the placement stand 13 supported from below by the separation support device 600 and the isotropic conductive material 200, the other member is positioned, presses the other member downwards.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electronic component assembly apparatus for assembling electronic components, and a manufacturing apparatus for manufacturing an electronic component structure using the electronic component assembly apparatus. [Background technology]

[0002] Flexible printed circuits (FPCs) are a commonly known type of printed circuit board. Because this type of board is extremely thin and highly flexible, it is used in moving parts of electronic devices such as cameras and mobile phones, and in bending parts due to space restrictions on board installation as electronic devices become smaller and thinner.

[0003] Generally, when an electronic component is connected to an FPC, the electronic component and the FPC are electrically connected and integrated via an anisotropic conductive material such as an anisotropic conductive film (ACF).

[0004] Patent Document 1 describes a manufacturing device in which a semiconductor chip, which serves as an electronic component, is electrically connected to a substrate via an anisotropic conductive adhesive. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2013-258294 Summary of the Invention [Problem to be solved by the invention]

[0006] In the pre-assembly process, where an anisotropic conductive material is crimped onto one side of an electronic component or a flexible substrate, and in the final assembly process, where electronic components and a flexible substrate are crimped together with the anisotropic conductive material interposed, a crimping device with a heater is used to apply a desired pressure while heating the anisotropic conductive material. However, if the positioning accuracy of the components is poor during the application of pressure, the pressure balance of the anisotropic conductive material applied by the crimping device will be disrupted, resulting in poor electrical conductivity between the electronic component and the FPC. As a result, the performance and yield of the final product (electronic component structure consisting of electronic components and an FPC connected together) may be reduced.

[0007] Furthermore, the above conventional example explains the issues involved in joining electronic components and flexible substrates. When assembling electronic components by combining multiple components, if the assembly precision between the components deteriorates, the performance of the electronic components often deteriorates.

[0008] Therefore, the present invention provides an electronic component assembly device, etc., that can improve the positioning accuracy of components to be combined when manufacturing an electronic component structure that is formed by assembling and joining multiple components such as substrates, anisotropic conductive materials, and electronic components. [Means for solving the problem]

[0009] An electronic component assembly apparatus according to one aspect of the present invention is an electronic component assembly apparatus that pressure-bonds electronic component components that become electronic components or substrates and anisotropic conductive materials, and includes: a base; a transport mechanism that transports the base; a mounting table that is detachably attached to the base and on which one of the electronic component components and the anisotropic conductive materials (hereinafter, "one member") is mounted; a removal support device that is located in a pressure-bonding area provided on a transfer path of the base and that removes the mounting table from the base and supports the mounting table from below after removal; and a pressure-bonding device that is located in the pressure-bonding area and that, with the other of the electronic component components and the anisotropic conductive materials (hereinafter, "other member") positioned on the one member of the mounting table supported from below by the removal support device, presses the other member downward to pressure-bond the one member and the other member. Furthermore, in the electronic component assembly apparatus, the mounting table may have a mounting table side positioning portion that engages with the detachment support device and determines a relative position in a planar direction with the detachment support device, and the detachment support device may include a support side positioning portion that engages with the mounting table side positioning portion, a support portion that abuts against the bottom side of the mounting table and supports the mounting table so that the mounting surface of the mounting table is perpendicular to the pressing direction by the crimping device, and a lifting mechanism that raises and lowers the support portion and detaches the mounting table upward from the base when raised.

[0010] In the electronic component assembly apparatus, the detachable support device may have a biasing mechanism that engages with the mounting table and biases the mounting table downward.

[0011] In the electronic component assembly apparatus, a plurality of the bases and the mounting tables may be provided in the circumferential direction of a rotary table rotated by the transfer mechanism.

[0012] In addition, in the above-mentioned electronic component assembly apparatus, the crimping area may include an upstream crimping area provided upstream of the transport path of the base, and a downstream crimping area provided downstream of the transport path of the base, and the removal support device and the crimping device may be provided in each of the upstream crimping area and the downstream crimping area.

[0013] An electronic component structure manufacturing apparatus according to one aspect of the present invention is an electronic component structure manufacturing apparatus in which a substrate is connected to an electronic component via an anisotropic conductive material, and includes the first and second electronic component assembly apparatuses described above; a first carry-in unit that carries in and arranges one of the electronic component and the substrate in a first carry-in area upstream of the first crimping area of ​​the first rotary table in the first electronic component assembly apparatus; a first crimping device that crimps the anisotropic conductive material onto a surface of an electrode of the one component in the first crimping area; and a second carry-in area upstream of the second crimping area of ​​the second rotary table in the second electronic component assembly apparatus. a transfer section that transfers the one component provided with the anisotropic conductive material from the transfer area downstream of the first crimping area in the rotation direction of the first turntable to a receiving area on the second turntable; a second crimping device that crimps the electrode surface of the one component provided with the anisotropic conductive material to the electrode surface of the other component in the second crimping area on the second turntable where the one component and the other component are positioned; and a carry-out section that carries out the electronic component structure, which is a set of the one component and the other component that have been crimped, from a carry-out area downstream of the second crimping area on the second turntable. An electronic component assembly apparatus according to one embodiment of the present invention is an electronic component assembly apparatus that assembles electronic components by combining multiple components, and includes: a base; a transport mechanism that transports the base; a mounting table that is detachably attached to the base and on which one of the multiple components (hereinafter referred to as "one component") is placed; a detachment support device that is located in an assembly area provided on the transport path of the base and detaches the mounting table from the base and supports the mounting table from below after detachment; and an assembly device that is located in the assembly area and assembles the other component to the one component of the mounting table supported from below by the detachment support device. [Effects of the Invention]

[0014] According to the above-described assembling device, when assembling an electronic component structure while joining a plurality of components, it is possible to improve the accuracy of positioning of the components to be combined. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is an overall plan view of a manufacturing apparatus according to an embodiment of the present invention; [Figure 2] (A) is a plan view showing an enlarged view of the base and the mounting table of the first rotating table of the manufacturing apparatus, (B) is a cross-sectional view taken along the arrow BB in (A), and (C) is a bottom view showing an enlarged view of the base and the mounting table. [Figure 3] (A) is a plan view of the mounting table, (B) is a front view, (C) is a right side view, (D) is a bottom view, and (E) is a cross-sectional view taken along the arrow EE in (A). [Figure 4] FIG. 1(A) is a front view showing the conductive material placement section of the manufacturing apparatus, as seen from the radially inner side of the first rotary table, and FIG. 1(B) is a bottom view illustrating the ACF tape used in the conductive material placement section. [Figure 5] 1B is a plan view showing a detachment support device disposed on the first rotary table of the manufacturing apparatus, FIG. 1B is a front view of the detachment support device, and FIG. 1C is a cross-sectional view taken along the arrow CC in FIG. 1A. [Figure 6] 1A is a front cross-sectional view showing the detachment support device and the mounting table in a lowered state, and FIG. 1B is a front cross-sectional view showing the detachment support device and the mounting table in an elevated state. [Figure 7] 1A is a front cross-sectional view showing the detachment support device and the mounting table in a lowered state, and FIG. 1B is a front cross-sectional view showing the detachment support device and the mounting table in an elevated state. [Figure 8] 1A is a plan view showing the detachment support device and the mounting table in a lowered state, and FIG. 1B is a plan view showing the detachment support device and the mounting table in an elevated state. [Figure 9] FIG. 4 is a front view showing a first irradiation unit of the manufacturing apparatus, as viewed from the radial direction of the first rotary table. [Figure 10](A) is a front view showing the first alignment adjustment section of the manufacturing apparatus, as viewed from the circumferential direction of the first rotating table, and (B) is a front view showing the second alignment adjustment section of the manufacturing apparatus, as viewed from the circumferential direction of the second rotating table. [Figure 11] (A) is a plan view showing an enlarged view of the base and the vicinity of the mounting table of the second rotating table of the manufacturing apparatus, (B) is a cross-sectional view taken along the arrow BB in (A), and (C) is a bottom view showing an enlarged view of the base and the vicinity of the mounting table. [Figure 12] FIG. 10 is a front view showing the transfer and pressure bonding unit and the second irradiation unit of the manufacturing apparatus, as viewed from the radially inner side of the second rotary table. [Figure 13] FIG. 10 is a front view showing the downstream crimping section of the manufacturing apparatus, as seen from the radially inner side of the second rotary table. [Figure 14] 1A is a front cross-sectional view showing the detachment support device and the mounting table in a lowered state, which are provided on the second rotary table, and FIG. 1B is a front cross-sectional view showing the detachment support device and the mounting table in an elevated state. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. A manufacturing apparatus 1 of this embodiment is an apparatus for manufacturing an electronic component structure P in which a flexible substrate 300 is connected to an electronic component 100 via an anisotropic conductive film (anisotropic conductive material) 200. Hereinafter, the anisotropic conductive film 200 will be referred to as an ACF 200, and the flexible substrate 300 will be referred to as an FPC 300.

[0017] <Overall structure> 1, the manufacturing apparatus 1 of this embodiment includes a first turntable 2, a second turntable 3 provided adjacent to the first turntable 2, a first carry-in section 4, a first alignment adjustment section 5, a conductive material placement section 6, and a first irradiation section 30 arranged on the first turntable 2, and a second carry-in section 7, a second alignment adjustment section 8, a transfer and crimping section (upstream crimping section) 9, a downstream crimping section 10, and a second irradiation section 40 arranged on the second turntable 3. The manufacturing apparatus 1 further includes a transfer section 11 that transfers electronic components 100 between the first turntable 2 and the second turntable 3, and an unloading section 12 arranged on the second turntable 3.

[0018] <First rotary table> The first turntable 2 is, for example, an index-type conveying table (conveying mechanism) and has a circular shape. In other words, the first turntable 2 is a conveying mechanism that conveys a mounting table along a circular movement trajectory, and the rotation direction of the first turntable 2 coincides with the conveying direction of the electronic component 100. A first rotation axis O1, which is the center of rotation of the first turntable 2, extends vertically. An upper surface 2a of the first turntable 2 faces upward. In other words, the table surface direction, which is the direction in which the surface of the first turntable 2 extends, coincides with the horizontal direction. The first turntable 2 rotates in one direction around the first rotation axis O1. The rotation speed, rotation start operation, and rotation stop operation of the first turntable 2 are controlled by a control device (not shown).

[0019] A plurality of mounting tables 13 are arranged at equal intervals in the circumferential direction on the upper surface 2a of the first turntable 2. In this example, a total of four mounting tables 13 are arranged at 90-degree intervals.

[0020] <Placement table> As shown in FIG. 2(A), a plurality of bases 802 are integrally arranged on the first turntable 2 at equal intervals in the circumferential direction. Here, a total of four bases 802 are arranged at 90-degree intervals. The mounting table 13 is detachably attached to the bases 802. As shown in FIG. 3(A), the mounting table 13 is rectangular when viewed from above, and has a plurality of (here, two) accommodating holes 13a formed on its upper surface (hereinafter referred to as the mounting surface) for accommodating and positioning the electronic components 100. Furthermore, as shown in FIG. 3(D), when viewed from the bottom side of the mounting table 13, a part of the bottom surface of the mounting table 13 has a mounting table-side engaging portion 13c that protrudes downward, for example, in a rectangular shape. This mounting table side engaging portion 13c engages with a base side engaging portion 802c of the base 802 in a planar direction (in a radial direction and a circumferential direction when the first turntable 2 is used as a reference, or in the XY plane direction in the figure) (see FIGS. 2B and 2C). More specifically, the peripheral surface of the mounting table side engaging portion 13c forms a planar direction engaging surface 13d that can engage with the base 802 in a planar direction. Furthermore, as shown in FIG. 3D, the bottom side of the mounting table 13 has a receiving surface 13b that can abut against the upper surface of the base 802. The receiving surface 13b is secured in a location on the bottom surface of the mounting table 13 where the mounting table side engaging portion 13c is not formed.

[0021] On the other hand, as shown in FIG. 2(B), a support surface 802b capable of coming into contact with the receiving surface 13b of the mounting table 13 is formed on the upper surface of the base 802. The support surface 802b serves to hold the mounting table 13 from below on the first turntable 2. Furthermore, as shown in FIG. 2(C), a base-side engaging portion 802c is formed on the base 802, and this base-side engaging portion 802c engages with the mounting table-side engaging portion 13c of the mounting table 13 in a planar direction. In detail, the base-side engaging portion 802c is a recess or a through-hole (a through-hole in this embodiment) that accommodates the convex mounting table-side engaging portion 13c, and its inner periphery forms a planar direction engaging surface 802d that can engage with the mounting table 13 in a planar direction. The mounting table-side engaging portion 13c and the base-side engaging portion 802c fit together with some play. That is, a gap S is formed between the mounting table side engaging portion 13c and the base side engaging portion 802c. As will be described in detail later, this gap S serves to absorb errors from the reference position of the detachment support device 600, which will be described later.

[0022] Furthermore, the base 802 has a through-hole 802f for viewing the mounting table 13 from below. In this embodiment, the base-side engaging portion 802c also serves as this through-hole 802f. The through-hole 802f functions as a window when the removal support device 600, which is arranged below the base 802, directly accesses the mounting table 13 from below. Note that, in this embodiment, the mounting table-side engaging portion 13c is convex downward, and the base-side engaging portion 802c is concave to accommodate it, but the concave and convex shapes may be reversed. Also, in the embodiment, the base-side engaging portion 802c also serves as the through-hole 802f, but they may be provided separately.

[0023] <Second rotary table> The second turntable 3, like the first turntable 2, is a circular, index-type conveying table (conveying mechanism). In other words, the second turntable 3 is a conveying mechanism that conveys a mounting table along a circular movement trajectory, and the rotation direction of the second turntable 3 coincides with the conveying direction of the electronic components 100. The second rotation axis O2, which is the rotation center of the second turntable 3, extends vertically. The second rotation axis O2 extends parallel to the first rotation axis O1 of the first turntable 2. Therefore, the second turntable 3 is disposed horizontally alongside the first turntable 2. The upper surface 3a of the second turntable 3 faces upward. In other words, the table surface direction, which is the direction in which the surface of the second turntable 3 extends, coincides with the horizontal direction. The second turntable 3 rotates in one direction around the second rotation axis O2. In this embodiment, the rotation direction of the second turntable 3 coincides with the rotation direction of the first turntable 2. The operation of the second turntable 3 is controlled by a control device (not shown), similar to the first turntable 2.

[0024] A plurality of mounting tables 14 are arranged at equal intervals in the circumferential direction on the upper surface 3a of the second turntable 3. Here, a total of eight mounting tables 14 are arranged at 45-degree intervals. The upper surface (hereinafter referred to as the mounting surface) of each mounting table 14 is formed with a plurality of (four in this case) accommodation holes 14a for accommodating and positioning electronic components 100 onto which ACF 200 has been transferred (see FIG. 4). The plurality of accommodation holes 14a are arranged side by side in the tangential direction of the second turntable 3.

[0025] <Placement table> As shown in FIG. 11(A), a plurality of bases 804 are integrally arranged on the second turntable 3 at equal intervals in the circumferential direction. Here, a total of eight bases 804 are arranged at 45-degree intervals. The mounting table 14 is detachably attached to the bases 804. The mounting table 14 is rectangular when viewed from above, and its upper surface (hereinafter referred to as the mounting surface) is formed with a plurality of (four here) receiving holes 14a for receiving and positioning the electronic components 100. Also, as shown in FIG. 11(C), when viewed from the bottom side of the mounting table 14, a portion of the bottom surface of the mounting table 14 has a mounting table-side engaging portion 14c that protrudes downward, for example, in a rectangular shape. The mounting table-side engaging portion 14c engages with the base-side engaging portion 804c of the base 804 in a planar direction (in the radial and circumferential directions when the second turntable 3 is used as a reference, or in the XY plane direction in the drawing). More specifically, the peripheral surface of the mounting table side engaging portion 14c forms a planar direction engaging surface 14d that can engage with the base 804 in a planar direction. The bottom side of the mounting table 14 has a receiving surface 14b that can come into contact with the upper surface of the base 804. The receiving surface 14b is provided at a location on the bottom surface of the mounting table 14 where the mounting table side engaging portion 14c is not formed.

[0026] Meanwhile, a support surface 804b capable of coming into contact with the receiving surface 14b of the mounting table 14 is formed on the upper surface of the base 804. The support surface 804b serves to hold the mounting table 14 from below on the second turntable 3. Furthermore, a base-side engaging portion 804c is formed on the base 804, and this base-side engaging portion 804c engages with the mounting table-side engaging portion 14c of the mounting table 14 in a planar direction. More specifically, the base-side engaging portion 804c is a recess or a through-hole (a through-hole in this embodiment) that accommodates the convex mounting table-side engaging portion 14c, and its inner periphery forms a planar direction engaging surface 804d that can engage with the mounting table 14 in a planar direction. The mounting table-side engaging portion 14c and the base-side engaging portion 804c fit together with some play. In other words, a gap S is formed between the mounting table-side engaging portion 14c and the base-side engaging portion 804c. Although the details will be described later, this gap S plays a role in absorbing errors from the reference position of the detachment support device 700, which will be described later.

[0027] Furthermore, the base 804 has a through-hole 804f for viewing the mounting table 14 from below. In this embodiment, the base-side engaging portion 804c also serves as this through-hole 804f. The through-hole 804f functions as a window when the removal support device 700, which is arranged below the base 804, directly accesses the mounting table 14 from below. Note that, in this embodiment, the mounting table-side engaging portion 14c is convex downward, and the base-side engaging portion 804c is concave to accommodate it, but the concave and convex shapes may be reversed. Also, in the embodiment, the base-side engaging portion 804c also serves as the through-hole 804f, but they may be provided separately.

[0028] <First Loading Section> The first carry-in section 4 carries in and places the electronic component 100 above the placement surface of the placement table 13 in the first carry-in area A1 of the first turntable 2. The electronic component 100 may be an assembly of components such as a camera module or a communication module, or may be a single component. In this embodiment, multiple electronic components 100 (for example, two at a time) are placed on the first turntable 2. Specifically, the electronic components 100 are supported on the placement surface of the placement table 13. In this embodiment, a portion of the placement table 13 protrudes radially outward from the first turntable 2. The electronic component 100 is arranged on the portion of the placement table 13 that protrudes from the first turntable 2. The electronic components 100 are arranged side by side in the tangential direction of the first turntable 2 along the circumferential direction of the first turntable 2.

[0029] The first carry-in section 4 has a stocker 4a that stocks a plurality of electronic components 100, and a transfer mechanism 4b that transfers the electronic components 100 from the stocker 4a toward the first turntable 2. The transfer mechanism 4b has a chuck (not shown) that holds the electronic components 100 and moves them to the first turntable 2. The chuck may be, for example, a vacuum chuck that supports the electronic components 100 by suction.

[0030] <Conductive material installation section> The conductive material installation section 6 is arranged in the conductive material installation area A2 downstream (forward) of the first carry-in section 4 in the rotation direction of the first turntable 2. In this embodiment, the conductive material installation area A2 includes an upstream installation area A2a and a downstream installation area A2b, which are spaced apart from each other in the rotation direction of the first turntable 2. The upstream installation area A2a and the downstream installation area A2b are arranged at positions offset by 90 degrees in the rotation direction. The upstream installation area A2a is also arranged at a position offset by 90 degrees in the rotation direction of the first turntable 2 from the first carry-in area A1. In other words, the first carry-in area A1, the upstream installation area A2a, and the downstream installation area A2b are arranged at equal angular offsets from each other in the rotation direction. Each of the upstream installation area A2a and the downstream installation area A2b is provided with a conductive material installation section 6.

[0031] As shown in Figure 4, each conductive material installation section 6 has a bonding head 20 arranged above the mounting surface of the mounting table 13 of the first turntable 2, a cushioning material supply section 21 that supplies cushioning material 400 between the bonding head 20 and the mounting surface, and a conductive material supply section 22 that supplies ACF 200 between the cushioning material 400 and the mounting surface.

[0032] The bonding head 20 is moved up and down in the direction of the first rotation axis O1 (see FIG. 1), i.e., in the vertical direction, at a predetermined timing by a control device (not shown). The direction of the up and down movement of the bonding head 20 is, more specifically, parallel to the Z1 axis of the detachment support device 600.

[0033] The cushioning material supply unit 21 continuously supplies a tape-shaped cushioning material (cushioning material tape) 400 below the bonding head 20 using a supply roller 21a, and collects it using a collection roller 21b. The cushioning material 400 comes into contact with the bonding head 20 and is pressed downward when the bonding head 20 descends toward the mounting surface of the mounting table 13. The cushioning material 400 has the function of averaging the pressure from the bonding head 20 in the planar direction (horizontal direction) of the pressure surface of the bonding head 20 and also dissipating heat.

[0034] Conductive material supply unit 22 supplies tape-shaped ACF tape 202 stored on a reel to below buffer material 400 using supply roller 22a, and collects it using collection roller 22b. As shown in FIG. 4(B), ACF tape 202 has a structure in which an anisotropic conductive film (ACF) 200, in which conductive particles are dispersed in an adhesive, is laminated on support film 201, such as a PET material, which serves as a separator. When bonding head 20 descends toward the mounting surface, buffer material 400 contacts ACF tape 202 from above, and ACF tape 202 is pressed downward by bonding head 20. The pressed ACF tape 202 comes into contact with the surface of an electrode of electronic component 100, which has moved from first loading area A1 to conductive material placement area A2 by rotation of first turntable 2 as shown in FIG. 1, and ACF 200 is transferred.

[0035] As will be described in detail later, all (two) electronic components 100 initially placed on the mounting tables 13 in the first carry-in area A1 are transferred to the upstream installation area A2a by rotating the first turntable 2 by 90 degrees. In the upstream installation area A2a, the ACF 200 is transferred to one of the electronic components 100. Meanwhile, two electronic components 100 are placed on mounting tables 13 that are newly transferred to the first carry-in area A1. After completing the transfer of the ACF 200 to one of the electronic components 100 in the upstream installation area A2a, the mounting table 13 is transferred to the downstream installation area A2b by rotating the first turntable 2 by 90 degrees, where the ACF 200 is transferred to the other electronic component 100. At the same time, the mounting table 13 in the first carry-in area A1 is transferred to the upstream installation area A2a, where the ACF 200 is transferred to one of the electronic components 100.

[0036] <Removal support device> 1, a detachment support device 600 is disposed below the mounting table 13 that stops in the conductive material installation area A2 (front-stage installation area A2a, rear-stage installation area A2b). As shown in FIGS. 5 and 6, the detachment support device 600 has a first pedestal 602, a second pedestal 604 fixed above the first pedestal 602, a plate-shaped lifting table 606 disposed above the second pedestal 604, a support section 610 and a support-side positioning section 620 provided on the lifting table 606, an elevating mechanism 630 provided on the second pedestal 604 that raises and lowers the lifting table 606 (support section 610), and a biasing mechanism 640 provided on the first pedestal 602.

[0037] As shown in FIG. 3, the bottom surface of the mounting base 13 is provided with a lifting surface 13h that can come into contact with the support portion 610 of the detachment support device 600, a mounting base side positioning portion 13g that can engage with the support side positioning portion 620 of the detachment support device 600, and a gripped portion 13k that can engage with the biasing mechanism 640 of the detachment support device 600.

[0038] 5 and 6, the support portion 610 is made up of a plurality of protrusions projecting upward from the lifting platform 606, and supports the mounting platform 13 by abutting their tips against the lifting receiving surface 13h on the bottom side of the mounting platform 13. In this embodiment, a total of eight protrusions are provided as the support portion 610, and a single reference plane K1 is defined by connecting the multiple tips. For ease of explanation, the planar direction of this reference plane K1 is defined as the X1-axis-Y1-axis plane, and the direction perpendicular to this X1-axis-Y1-axis plane is defined as the Z1-axis.

[0039] This reference plane K1 is set in advance so as to be perpendicular to the vertical movement axis of the bonding head (compression bonding device) 20 (or parallel to the pressure surface of the bonding head 20). In other words, the vertical movement axis of the bonding head (compression bonding device) 20 is set so as to be parallel to the Z1 axis.

[0040] 6(B), the mounting surface of the mounting table 13 supported by the support portion 610 is parallel to the reference plane K1 defined by the support portion 610. Accordingly, as shown in FIG. 4, the mounting plane of the mounting portion 13 supported by the support portion 610 is parallel to the X1-axis-Y1-axis plane and perpendicular to the pressing direction (Z1-axis) of the bonding head (compression bonding device) 20.

[0041] The support-side positioning portions 620 are protrusions that protrude upward from the lifting platform 606, and are provided at multiple locations (here, two locations) spaced apart in the Y1-axis direction. Each of the support-side positioning portions 620 has a tapered surface 620A that protrudes conically upward. On the other hand, as shown in FIG. 6, the mounting platform side positioning portions 13g are provided at multiple locations facing the support-side positioning portions 620, and each has a tapered surface that concaves conically downward. By abutting and engaging the tapered surface 620A of the support-side positioning portions 620 with the tapered surface of the mounting platform side positioning portion 13g, the position of the mounting platform 13 can be adjusted in the planar direction (direction of the reference plane K1 / direction of the X1-axis-Y1-axis plane) and in the direction around the Z1 axis, using the support-side positioning portion 620 of the removal support device 600 as a reference.

[0042] The biasing mechanism 640 has a chuck 642 and a downward biasing portion 644 that pulls the chuck 642 downward. The chuck 642 engages with (grabs) a gripped portion 13k provided on the back surface of the mounting table 13. The downward biasing portion 644 is, for example, a spring mechanism, and biases the mounting table 13 downward so as to resist the lifting force of the mounting table 13 by the lifting mechanism 630 (described later). The downward biasing portion 644 presses the tapered surface 620A of the support-side positioning portion 620 and the tapered surface of the mounting table-side positioning portion 13g against each other, thereby improving the accuracy of position adjustment of the mounting table 13 in the planar direction. Note that, although the case where the downward biasing portion 644 is biased by a spring mechanism has been exemplified here, it may also be biased by a linear motion mechanism such as various cylinders, solenoids, ball screws, rack and pinions, or other motion mechanisms. Furthermore, while the manufacturing apparatus 1 is in operation, the chuck 642 only needs to constantly grip the gripped portion 13k, but when maintenance or the like is performed, the mounting table 13 can be easily removed by opening the chuck 642.

[0043] The lifting mechanism 630 has a plurality of linear motion mechanisms (two in this example) such as various cylinders, solenoids, ball screws, rack and pinions, and raises and lowers the lifting table 606, thereby indirectly raising and lowering the support part 610 and the support side positioning part 620. As shown in Fig. 6(A) , when the lifting mechanism 630 is in the lowered state, the support part 610 and the support side positioning part 620 are separated from the mounting table 13, and as a result, the first turntable 2 can be rotated to transport the mounting table 13.

[0044] 6(B), when the lifting mechanism 630 is in the raised state, the support portion 610 and the support-side positioning portion 620 abut against the mounting table 13 and further lift the mounting table 13 upward, causing the mounting table 13 to move upward away from the base 802. As a result, the mounting table 13 is released from the first turntable 2, and is positioned in the height direction (Z1-axis direction), planar direction (X1-axis-Y1-axis planar direction), rotational direction (direction around the Z1 axis), and tilt direction relative to the Z1 axis, based on the X1-axis, Y1-axis, and Z1-axis of the release support device 600. In this raised state, the ACF 200 is transferred by the bonding head 20, as shown in FIG.

[0045] The first turntable 2 is often manufactured by machining a metal material, for example, and the machining precision of its outer shape inevitably includes errors. Furthermore, since the temperature of the first turntable 2 changes during operation, thermal expansion can also cause changes in the outer shape. Therefore, when multiple bases 802 are arranged around the circumference of the first turntable 2, it is difficult to make the top surface 2a of the first turntable 2 a completely flat. As a result, when each of the multiple bases 802 is stopped in turn in the conductive material installation area A2, the stopping positions of the multiple bases 802 may be misaligned.

[0046] For example, as shown in FIG. 7A, the base 802 and mounting table 13 stopped in the conductive material placement area A2 may be tilted with respect to the Z1 axis. If an attempt is made to transfer the ACF 200 using the bonding head 20 in this state, the pressure application surface of the bonding head 20 and the top surface of the electronic component 100 will be non-parallel, resulting in unbalanced pressure and heat application, resulting in poor crimping and poor conductivity of the ACF 200. Furthermore, displacement of the first turntable 2 due to the pressure applied by the bonding head 20 can also lead to poor crimping of the ACF 200. Furthermore, repeated external forces acting on the first turntable 2 during the pressure application process by the bonding head 20 can easily place a strain on the rotation axis supporting the first turntable 2, deteriorating the components and adversely affecting other precision.

[0047] 7(B), in this embodiment, the detachment support device 600 is used to detach the electronic component 100 together with the mounting table 13 upward from the base 802 (first turntable 2), and the mounting table 13 is positioned with high precision using the X1-axis, Y1-axis, and Z1-axis references on the detachment support device 600 side. As a result, the mounting surface of the mounting table 13 and the upper surface of the electronic component 100 held thereon become parallel to the reference plane K1, and the position on the reference plane K1 and the angle around the Z1-axis are also adjusted. Moreover, since the detachment support device 600 supports the mounting table 13 from below in the vertical direction, the amount of displacement of the mounting table 13 due to the pressure force of the bonding head 20 can be suppressed.

[0048] 8A, for example, base 802 and mounting table 13 stopped in conductive material placement area A2 may be at an angle around the Z1 axis. If bonding head 20 is used to transfer ACF 200 in this state, the angle between electronic component 100 and ACF 200 around the Z1 axis will be misaligned.

[0049] 8(B), in this embodiment, the angle of mounting table 13 around the Z1 axis is adjusted by using detachment support device 600 to separate electronic component 100 together with mounting table 13 upward from base 802 (first turntable 2). In this state, if ACF 200 is transferred using bonding head 20, the angles of electronic component 100 and ACF 200 around the Z1 axis can be made to match.

[0050] 7(B) and 8(B), once the transfer of the ACD 200 is completed, the mounting table 13 is lowered by the detachment support device 600, and the mounting table 13 is held on the base 800. At this time, a gap S is formed between the mounting table side engaging portion 13c and the base side engaging portion 802c (see FIG. 2), so that the mounting table side engaging portion 13c and the base side engaging portion 802c do not interfere with each other even after the position is adjusted by the detachment support device 600 during lifting. In other words, it is preferable to set the size of the gap S larger than the maximum displacement of the mounting table 13 that can be adjusted by the detachment support device 600, taking into consideration the maximum displacement of the mounting table 13.

[0051] <First irradiation section> 1 , the first irradiation unit 30 irradiates plasma gas G onto the surfaces of the electrodes of the electronic component 100 that have been loaded onto the first turntable 2 by the first loader 4. In this embodiment, for example, one first irradiation unit 30 is provided in each of the conductive material placement units 6 in the front-stage installation area A2a and the rear-stage installation area A2b. The first irradiation unit 30 irradiates plasma gas G onto the surfaces of the electrodes of the electronic component 100 before the ACF 200 is attached to the electronic component 100 in the first plasma irradiation area C1 that is located at the same position as the conductive material placement area A2.

[0052] 9, first irradiating unit 30 generates plasma gas G and irradiates it toward the surface of the electrode of electronic component 100. Here, first irradiating unit 30 generates, for example, atmospheric pressure plasma as plasma gas G. Atmospheric pressure plasma is a plasma gas generated under atmospheric pressure, for example, by using dielectric barrier discharge.

[0053] <First alignment adjustment unit> 1, the first alignment adjustment unit 5 has a front-stage alignment adjustment unit 5X and a rear-stage alignment adjustment unit 5Y. The front-stage alignment adjustment unit 5X is disposed in the front-stage installation area A2a, and is capable of adjusting the relative position (alignment) in a plane direction perpendicular to the Z1 axis (plane direction of the reference plane K1) and / or a direction around the Z1 axis so that the electrode surface of one electronic component 100 and the ACF 200 of the ACF tape 202 are properly overlapped when viewed in the Z1-axis direction before the conductive material installation unit 6 attaches the ACF 200 to one electronic component 100 on the mounting table 13, which is positioned by the removal support device 600. Similarly, the rear-stage alignment adjustment unit 5Y is disposed in the rear-stage installation area A2b, and is capable of adjusting the relative positions (alignment) of the electrode surface of the other electronic component 100 and the ACF 200 of the ACF tape 202 so that they are correctly overlapped when viewed from the Z1-axis direction before the conductive material installation unit 6 attaches the ACF 200 to the other electronic component 100 on the mounting table 13, which is positioned by the detachment support device 600. The alignment adjustment is preferably performed before the irradiation of the plasma gas G, but may also be performed after the irradiation of the plasma gas G.

[0054] As shown in FIG. 10(A), the first alignment adjustment unit 5 (5X, 5Y) has sensors 5a that are provided in the front-stage installation area A2a and the rear-stage installation area A2b shown in FIG. 1, between the electrodes of the electronic component 100 and the ACF 200, and are movable in the radial direction of the first turntable 2. The sensors 5a include cameras using, for example, CCDs (Charge Coupled Devices) on both the top and bottom, and are capable of detecting the relative positions of the electronic component 100 and the ACF 200 by capturing images of the surfaces of the electrodes of the electronic component 100 and the ACF 200 almost simultaneously. The sensors 5a may be photoelectric sensors, laser sensors, or the like, but are not particularly limited. Furthermore, the sensors 5a may be configured to guide (guiduce) upper and lower images to a predetermined location using optical components such as prisms or optical fibers and convert them into digital images using a CCD or the like. A control device (not shown) controls the relative positions of the electrode surfaces of electronic component 100 and ACF 200 until sensor 5a detects that the positions of the surfaces are correctly aligned as viewed from the Z1-axis direction. This positioning may be achieved by moving the entire conductive material installation unit 6 in the horizontal direction (the X-axis-Y plane direction based on detachment support device 600), or by moving only ACF tape 202 in the tape advancement direction and / or tape width direction, or by mounting an XY movement mechanism on detachment support device 600 to move mounting table 13 in the horizontal direction.

[0055] <Second loading section> 1 , the second carry-in section 7 carries the FPC 300 into the second carry-in area B1 of the second turntable 3, above the mounting surface of the mounting table 14 of the second turntable 3. In this embodiment, a plurality of (four in this example) electronic components 100 with ACFs 200 attached thereto are mounted on the mounting table 14, and therefore the FPC 300 is attached to each of the ACFs 200 of the four electronic components 100.

[0056] The second carry-in section 7 includes, for example, a stocker 7a that stocks a plurality of FPCs 300, and a transfer mechanism 7b that transfers the plurality of FPCs 300 in a line from the stocker 7a toward the second turntable 3. Downstream of the transfer mechanism 7b, a transfer and crimping section 9 is disposed that holds the transferred FPCs 300, transfers them to electronic components 100 on the mounting table 14, and pre-crimps them. Therefore, this second carry-in area B1 also serves as an upstream crimping area B3 that crimps the PFCs 300. As will be described in detail later, the second carry-in area B1 (upstream crimping area B3) is disposed at a position shifted by 45 degrees in the rotational direction (45 degrees downstream) from a receiving area B2, which will be described later.

[0057] <Transfer and crimping section (upstream crimping section)> 12, the transfer and crimping unit 9 includes a suction crimping head 9a, a heater 9b provided on the suction crimping head 9a, and a movement mechanism 9c that moves the suction crimping head 9a and the heater 9b together in a horizontal plane, around a vertical axis, and up and down. The heater 9b heats the crimping head 9a so that the temperature of the crimping head 9a reaches a predetermined temperature (e.g., 70°C) when the suction crimping head 9a presses the FPC 300.

[0058] The suction and crimping head 9a also functions as a suction pad and suction-holds the PFC 300. The suction and crimping head 9a, located downstream of the transfer mechanism 7b, suction-holds the surface of the FPC 300 opposite the electrode surface. The suction and crimping head 9a moves above the ACF 200 provided on the surface of the electronic component 100 and then descends to bring the electrode surface of the FPC 300 into close contact with the ACF 200. The head then applies heat and pressure from above the FPC 300. As a result, the electrode surface of the FPC 300 is pre-pressed to the ACF 200. In this embodiment, the pressure is applied with a force of 5 kgf for 0.6 seconds, for example, to pre-press the electronic component 100 and the FPC 300 together.

[0059] The suction and crimping head 9a can be moved by the moving mechanism 9c in the tangential direction of the second turntable 3. As a result, the FPC 300 can be sequentially placed and pre-crimped onto each of the electronic components 100 arranged in parallel in the tangential direction on the mounting table 14 that is stationary in the upstream crimping region B3.

[0060] <Removal support device> 1, a detachment support device 700 is disposed below the mounting table 14 that stops in the upstream crimping area B3. As shown in Fig. 14, the detachment support device 700 has a first pedestal 702, a second pedestal 704 fixed above the first pedestal 702, a plate-shaped lifting table 706 disposed above the second pedestal 704, a support section 710 and a support-side positioning section 720 provided on the lifting table 706, an elevating mechanism 730 installed on the second pedestal 704 to raise and lower the lifting table 706 (support section 710), and a biasing mechanism 740 provided on the first pedestal 702.

[0061] In addition, on the bottom side of the mounting base 14, there are provided a lifting surface 14h that can come into contact with the support portion 710 of the detachment support device 700, a mounting base side positioning portion 14g that can engage with the support side positioning portion 720 of the detachment support device 700, and a gripped portion 14k that can engage with the biasing mechanism 740 of the detachment support device 700.

[0062] The support portion 710 is made up of multiple protrusions projecting upward from the lifting platform 706, and supports the mounting platform 14 by abutting their tips against the lifting receiving surface 14h on the bottom side of the mounting platform 14. In this embodiment, a total of eight protrusions are provided as the support portion 710, and a single reference plane K1 is defined by connecting the multiple tips. For ease of explanation, the planar direction of this reference plane K1 is defined as the X1-axis-Y1-axis plane, and the direction perpendicular to this X1-axis-Y1-axis plane is defined as the Z1-axis.

[0063] This reference plane K1 is set in advance so as to be perpendicular to the vertical movement axis of the suction and crimping head (crimping device) 9a (or parallel to the pressure surface of the suction and crimping head 9a). In other words, the vertical movement axis of the suction and crimping head (crimping device) 9a is set so as to be parallel to the Z1 axis.

[0064] 14(B), the mounting surface of the mounting table 14 supported by the support portion 710 is parallel to the reference plane K1 defined by the support portion 710. Accordingly, the mounting plane of the mounting portion 15 supported by the support portion 710 is parallel to the X1-Y1 axis plane and perpendicular to the pressing direction (Z1 axis) of the suction and pressure bonding head (pressure bonding device) 9a.

[0065] The support-side positioning portions 720 are protrusions that protrude upward from the lifting platform 706, and are provided at multiple locations (here, two locations) spaced apart in the Y1-axis direction. Each of the support-side positioning portions 720 has a tapered surface 720A that protrudes conically upward. Meanwhile, the mounting platform side positioning portions 14g are provided at multiple locations facing the support-side positioning portions 720, and each has a tapered surface that concaves conically downward. By abutting and engaging the tapered surface 720A of the support-side positioning portion 720 with the tapered surface of the mounting platform side positioning portion 14g, the position of the mounting platform 14 can be adjusted in the planar direction (direction of reference plane K1 / X1-axis-Y1-axis planar direction) and in the direction around the Z1 axis, using the support-side positioning portion 720 of the removal support device 700 as a reference.

[0066] The biasing mechanism 740 has a chuck 742 and a downward biasing portion 744 that pulls the chuck 742 downward. The chuck 742 engages with (grabs) a gripped portion 43k provided on the back surface of the mounting table 14. The downward biasing portion 744 is, for example, a spring mechanism, and biases the mounting table 14 downward so as to resist the lifting force of the mounting table 14 by the lifting mechanism 730 (described later). The downward biasing portion 744 presses the tapered surface 720A of the support-side positioning portion 720 and the tapered surface of the mounting table-side positioning portion 14g against each other, thereby improving the accuracy of position adjustment of the mounting table 14 in the planar direction. Note that, although the case where the downward biasing portion 744 is biased by a spring mechanism has been exemplified here, it may also be biased by a linear motion mechanism such as various cylinders, solenoids, ball screws, rack and pinions, or other motion mechanisms.

[0067] The lifting mechanism 730 has a plurality of linear motion mechanisms (two in this example) such as various cylinders, solenoids, ball screws, rack and pinions, and raises and lowers the lifting table 706, thereby indirectly raising and lowering the support part 710 and the support side positioning part 720. As shown in Fig. 14(A) , when the lifting mechanism 730 is in the lowered state, the support part 710 and the support side positioning part 720 are separated from the mounting table 14, and as a result, the second turntable 3 can be rotated to transport the mounting table 14.

[0068] 14(B), when the lifting mechanism 730 is in the raised state, the support portion 710 and the support-side positioning portion 720 abut against the mounting table 14 and further lift the mounting table 14 upward, causing the mounting table 14 to move upward away from the base 804. As a result, the mounting table 14 is released from the second turntable 3, and is positioned in the height direction (Z1-axis direction), planar direction (X1-axis-Y1-axis planar direction), rotational direction (direction around the Z1 axis), and tilt direction relative to the Z1 axis, based on the X1-axis, Y1-axis, and Z1-axis of the release support device 700. In this raised state, the FPC 300 is transferred and pre-press-bonded by the suction and pressure-bonding head (pressing device) 9a, as shown in FIG.

[0069] The detachable support device 700 has substantially the same configuration as the detachable support device 600 already described, and has the same effects and functions, so a description thereof will be omitted here.

[0070] <Delivery department> The transfer unit 11 is disposed between the first turntable 2 and the second turntable 3. The transfer unit 11 transfers the electronic component 100 provided with the ACF 200 from the transfer area A3 of the first turntable 2 to the receiving area B2 of the second turntable 3, and places the electronic component 100 on the placement surface of the placement table 14 of the second turntable 3. The transfer unit 11 also has a buffer table 11e that temporarily stores the electronic component 100 carried out from the transfer area A3.

[0071] The transfer area A3 of the first turntable 2 is located downstream of the conductive material placement area A2 in the rotation direction of the first turntable 2 and upstream of the first carry-in area A1. Specifically, the transfer area A3 is located at a position offset by 90 degrees in the rotation direction from the rear-stage placement area A2b of the conductive material placement area A2. The transfer area A3 is also located at a position offset by 90 degrees in the opposite direction to the rotation direction from the first carry-in area A1.

[0072] Furthermore, the receiving area B2 of the second turntable 3 is disposed at a position offset from the second carry-in area B1 in the rotation direction of the second turntable 3. Specifically, the receiving area B2 is disposed at a position offset by 45 degrees in the opposite direction to the rotation direction from the second carry-in area B1. In other words, the second carry-in area B1 is disposed downstream of the receiving area B2 in the rotation direction of the second turntable 3.

[0073] In this embodiment, the electronic components 100 are placed on the second turntable 3 by the transfer section 11 in groups of multiple electronic components (for example, four components (twice the number transferred at one time from the first turntable 2)). This is because the cycle time per unit of electronic components 100 on the first turntable 2 is shorter than the cycle time per unit of electronic components 100 on the second turntable 3. Specifically, the electronic components 100 are supported on the mounting surface of the mounting table 14. In this embodiment, at least a portion of the mounting table 14 protrudes from the upper surface 3a radially outward from the second turntable 3. The electronic components 100 are arranged on the portion of the mounting table 14 protruding from the second turntable 3. The electronic components 100 are arranged side by side in the tangential direction of the second turntable 3 along the circumferential direction of the second turntable 3.

[0074] The delivery unit 11 has a transfer mechanism 11a that transfers the electronic component 100 from the first turntable 2 to the second turntable 3. The transfer mechanism 11a has a chuck 11b that holds the electronic component 100 and moves it to the second turntable 3. The chuck may be, for example, a mechanical chuck that clamps and holds the electronic component 100. The chuck clamps and supports the electronic component 100 at a position that does not contact the ACF 200 transferred to the electronic component 100.

[0075] When the electronic components 100 placed on the mounting table 14 in the receiving area B2 are placed in the second loading area B1 by rotating the second turntable 3, the transfer and crimping section 9 places and temporarily crimps an FPC 300 on each of the electronic components 100.

[0076] Here, a first inspection camera 16 is installed on the first turntable 2 to monitor the state of the electronic components 100 on the first turntable 2. The first inspection camera 16 is arranged in a first inspection area A4 between the subsequent stage installation area A2b in the conductive material installation area A2 and the transfer area A3 in the rotation direction of the first turntable 2. In this embodiment, the first inspection area A4 is arranged at a position offset by 45 degrees in the rotation direction of the first turntable 2 from the subsequent stage installation area A2b. The first inspection camera 16 monitors for improper attachment of the ACF 200 to the electronic components 100. Poorly attached electronic components 100 are ejected from the first turntable 2 upstream of the transfer area A3 by, for example, an ejection device (not shown) so as not to be transferred to the second turntable 3.

[0077] <Second irradiation section> 1, second irradiation unit 40 irradiates plasma gas G onto the surface of the electrodes of FPC 300 that has been carried into second turntable 3 by second carry-in unit 7. Second irradiation unit 40 is provided, for example, in transfer and pressure-bonding unit 9. Second irradiation unit 40 irradiates plasma gas G onto the surface of the electrodes of FPC 300 before FPC 300 is pressure-bonded to electronic component 100 in second plasma irradiation area C2 that is located at the same position as upstream pressure-bonding area B3.

[0078] As shown in FIG. 15, the second irradiating section 40 generates, for example, atmospheric pressure plasma as the plasma gas G in the same manner as the first irradiating section 30, and irradiates the plasma gas G toward the surface of the electrode of the FPC 300.

[0079] <Downstream crimp section> Returning to FIG. 1 , the downstream crimping unit 10 is disposed in a downstream crimping area B4 on the second turntable 3, downstream of the upstream crimping area B3 (second carry-in area B1) in the rotation direction. In this embodiment, the downstream crimping area B4 includes a front-stage crimping area B4a and a rear-stage crimping area B4b, which are spaced 90 degrees apart in the rotation direction of the second turntable 3. The front-stage crimping area B4a is disposed at a position offset by 90 degrees in the rotation direction of the second turntable 3 from the upstream crimping area B3. That is, the upstream crimping area B3, the front-stage crimping area B4a, and the rear-stage crimping area B4b are disposed at equal angular offsets from one another in the rotation direction. One downstream crimping unit 10 is disposed in each of the front-stage crimping area B4a and the rear-stage crimping area B4b. Therefore, while only one upstream crimping region B3 is disposed, multiple downstream crimping regions B4 are disposed, and there are more downstream crimping regions B4 than upstream crimping regions B3.

[0080] As shown in Fig. 13, each downstream crimping unit 10 has multiple (two in this example) crimping heads 10a arranged above the mounting surface of the mounting table 14 of the second turntable 3, a heater 10b provided on each crimping head 10a, and a cushioning material supply unit 10c that supplies cushioning material 400 between the crimping head 10a and the mounting surface. The crimping heads 10a are configured to be moved up and down vertically at predetermined timings by a control device (not shown). In the downstream crimping region B4, the downstream crimping unit 10 additionally crimps (mainly crimps) the set of electronic component 100 and FPC 300 (hereinafter sometimes referred to as the component set) that has been pre-bonded in the upstream crimping region B3. In this embodiment, for example, a pressure of 10 kgf is applied for 1.5 seconds per crimping operation, and electronic component 100 and FPC 300 (component set) are fully crimped together with ACF 200 interposed therebetween. In other words, downstream crimping unit 10 continues the crimping operation for a longer period of time and at a higher surface pressure than transfer crimping unit 9.

[0081] The downstream crimping unit 10 in the front-stage crimping area B4a crimps half (two) of the four component sets on the mounting table 14. The downstream crimping unit 10 in the rear-stage crimping area B4b crimps the remaining half (two) of the four component sets, consisting of electronic components 100 (ACFs 200) and FPCs 300, on the mounting table 14. In particular, in this embodiment, the downstream crimping unit 10 in the front-stage crimping area B4a crimps unheated (pre-bonded or fully crimped) component sets between the two component sets to be crimped among the four component sets arranged in parallel. This prevents heat from one crimping head 10a from adversely affecting the adjacent crimping head 10a.

[0082] When the compression head 10a presses the FPC 300, the heater 10b heats the compression head 10a so that the temperature of the compression head 10a reaches a predetermined temperature (for example, 120° C.).

[0083] The cushioning material supply unit 10c continuously supplies cushioning material (cushioning material tape) 400 to above the FPC 300 below the crimping head 10a using a supply roller 10d, and collects it using a collection roller 10e. When the crimping head 10a descends toward the mounting surface of the mounting table 14, the cushioning material 400 comes into contact with the crimping head 10a and is pressed downward. In other words, the cushioning material 400 is supplied so as to be able to come into contact with the FPC 300 from above.

[0084] In the downstream crimping area B4 (pre-stage crimping area B4a and post-stage crimping area B4b), a detachment support device 700 is disposed below the mounting table 14. As a result, the electronic component 100 is separated from the second turntable 3 together with the mounting table 14 and lifted upward, and the mounting table 14 is positioned at the reference position (X1-axis, Y1-axis, Z1-axis) of the detachment support device 700. As a result, the downstream crimping unit 10 performs final crimping between the electronic component 100 on the mounting table 14, which is spaced apart from the upper surface 3a of the second turntable 3, and the FPC 300. Note that this detachment support device 700 is the same as the one disposed in the upstream crimping area B3, and therefore a description thereof will be omitted here.

[0085] As will be described in more detail later, the mounting table 14 on which four sets of electronic components 100 and FPCs 300 in a pre-bonded state are placed is transferred from the upstream crimping area B3 to the upstream crimping area B4a by a total of 90 degrees rotation of the second turntable 3. The mounting table 14 temporarily waits in the second inspection area B6 midway (45 degrees rotation phase). A control device (not shown) controls the four sets of electronic components 100 and FPCs 300 in a pre-bonded state that have arrived at the upstream crimping area B4a so that two of the sets are fully crimped.

[0086] Thereafter, by rotating the second turntable 3 90 degrees, the mounting table 14 is transferred from the upstream crimping area B4a to the downstream crimping area B4b, but during this process, the mounting table 14 temporarily waits (at a 45-degree rotation phase). The four sets of electronic components 100 and FPCs 300 that have arrived at the downstream crimping area B4b are controlled by a control device (not shown) so that the remaining two sets in the pre-bonded state are finally crimped. When the remaining two sets are finally crimped in the downstream crimping area B4b, the final crimping of all four sets on the mounting table 14 is completed. Note that during the final crimping in the downstream crimping area B4b, the four new sets of electronic components 100 and FPCs 300 that were pre-bonded in the upstream crimping area B3 are positioned in the upstream crimping area B4a, so two of these sets are finally crimped simultaneously.

[0087] <Second alignment adjustment section> 1, before electronic component 100 and FPC 300 are pre-bonded by transfer and pressure-bonding unit 9, second alignment adjustment unit 8 can adjust the relative positions (alignment) of the electrodes of FPC 300 carried in by transfer and pressure-bonding unit 9 so that the surfaces of the electrodes of electronic component 100 on mounting table 14, which is positioned by release support device 700, are properly aligned when viewed from the Z1-axis direction. This relative position is a position in a plane direction perpendicular to the Z1 axis (plane direction of reference plane K1) and / or in a direction around the Z1 axis.

[0088] As shown in FIG. 10(B), the second alignment adjustment unit 8 has a structure similar to that of the first alignment adjustment unit 5. Specifically, the second alignment adjustment unit 8 has a sensor 8a that is provided between the surface of the electrode of the electronic component 100 (or the ACF 200) and the surface of the electrode of the FPC 300 and is movable in the radial and / or circumferential directions of the second turntable 3. The sensor 8a includes cameras using, for example, CCDs (Charge Coupled Devices) on both the top and bottom, which capture images of the electrode surfaces of the electronic component 100 and the FPC 300, thereby detecting the relative positions of the electronic component 100 and the FPC 300. The sensor 8a may be a photoelectric sensor, a laser sensor, or the like, but is not particularly limited. Furthermore, the sensor 8a may be configured to guide (guiduce) the upper and lower images to a predetermined location using optical components such as a prism or optical fiber, and convert them into digital images using a CCD or the like. A control device (not shown) controls the relative positions of the electrodes of electronic component 100 (or ACF 200) and FPC 300 until sensor 8a detects that the positions of the surfaces of the electrodes are correctly aligned as viewed from the Z1-axis direction. This positioning is achieved by moving the entire transfer and pressure-bonding unit 9 in the horizontal direction (in the X-axis-Y-axis plane with detachment support device 700 as the reference). An XY movement mechanism may be installed in detachment support device 700 to move mounting table 14 in the horizontal direction.

[0089] <Export section> In the carry-out area B5 of the second turntable 3, the carry-out unit 12 carries out the set of electronic component 100 and FPC 300 that has been fully crimped, i.e., the electronic component structure P, out of the second turntable 3. The carry-out area B5 is located at a position shifted by 90 degrees downstream in the rotation direction of the second turntable 3 with respect to the subsequent-stage crimping area B4b in the downstream crimping area B4.

[0090] The unloading section 12 has a transfer mechanism 12a that transfers the electronic component structure P toward the outside of the second turntable 3, and a stocker 12b that stocks the electronic component structure P transferred by the transfer mechanism 12a. The transfer mechanism 12a has a chuck (not shown) that holds the electronic component structure P. For example, a vacuum chuck that supports the electronic component structure P by suction is used as the chuck.

[0091] Here, a second inspection camera 18 is installed on the second turntable 3 to monitor the state of the set of pre-crimped electronic components 100 and FPCs 300 on the second turntable 3. The second inspection camera 18 is disposed in a second inspection area B6 between the upstream crimping area B3 (second carry-in area B1) and the downstream crimping area B4 in the rotation direction of the second turntable 3. In this embodiment, the second inspection area B6 is disposed at a position offset by 45 degrees in the rotation direction of the second turntable 3 from the upstream crimping area B3. The second inspection camera 18 monitors for defective crimping between the electronic components 100 and FPCs 300. It is preferable that defectively crimped sets of electronic components 100 and FPCs 300 are ejected from the second turntable 3 upstream of the downstream crimping area B4, for example, by an ejection device (not shown). This prevents final crimping in the downstream crimping area B4. Furthermore, if the discharge is not performed upstream of the downstream crimping area B4, it is preferable that the downstream crimping section 10 stops the lowering operation of the crimping head 10a in the downstream crimping area B4 only for the set of poorly crimped electronic component 100 and FPC 300.

[0092] <Manufacturing method> Next, we will explain a method for manufacturing the electronic component structure P. In the following explanation, we will explain a method for manufacturing the electronic component structure P using the above-mentioned manufacturing apparatus 1, but it is not necessarily limited to the case where the electronic component structure P is manufactured using the manufacturing apparatus 1.

[0093] First, the first carry-in unit 4 carries two electronic components 100 onto the mounting table 13 in the first carry-in area A1 of the first turntable 2 (first carry-in step). The first carry-in step is performed continuously. Thereafter, the first turntable 2 is rotated 90 degrees to transfer the mounting table 13 and the two electronic components 100 to the upstream installation area A2a in the conductive material installation area A2. At this time, the first turntable 2 may be temporarily stopped at a 45-degree phase midway to ensure time for inspection in the first inspection area A4, which will be described later.

[0094] The first irradiation unit 30 irradiates the surface of one electrode of two electronic components 100 positioned in the front-stage installation area A2a with plasma gas G (first irradiation step). Next, the bonding head 20 of the conductive material installation unit 6 presses and transfers the ACF 200 onto the surface of the one electrode irradiated with plasma gas G in the front-stage installation area A2a (conductive material installation step). The transfer of the ACF 200 is performed with the mounting table 13 detached from the first turntable 2 by the detachment support device 600. After attachment is complete, the heated buffer material 400 is moved, allowing the accumulated heat in the buffer material 400 to escape from the bonding head 20 to the outside.

[0095] Next, the mounting table 13 is returned to the first turntable 2, and the first turntable 2 is rotated 90 degrees to transfer the two electronic components (one of which has the ACF 200 transferred) from the front-stage installation area A2a to the rear-stage installation area A2b. At this time, the process may be temporarily stopped at a 45-degree phase midway to ensure time for inspection in the first inspection area A4, which will be described later.

[0096] The first irradiation unit 30 irradiates the surface of the electrode of the other (remaining) of the two electronic components 100 positioned in the rear-stage installation area A2b with plasma gas G (first irradiation step). Next, the bonding head 20 of the conductive material installation unit 6 presses and transfers the ACF 200 onto the surface of the electrode of the remaining electronic component 100 irradiated with plasma gas G in the rear-stage installation area A2b (conductive material installation step). The transfer of the ACF 200 is performed in a state where the mounting table 13 is removed from the first turntable 2 by the removal support device 600. At this time, two new electronic components have been transferred to the front-stage installation area A2a, so the ACF 200 is pressed and transferred onto the surface of the electrode of one of the electronic components.

[0097] That is, in this embodiment, the conductive material providing step is performed simultaneously in each of the areas A2a and A2b.

[0098] Thereafter, the mounting table 13 is returned to the first turntable 2, and the first turntable 2 is rotated 90 degrees to place the two electronic components 100 in the subsequent stage installation area A2b in the transfer area A3. In the transfer area A3, the electronic components 100 with the ACF 200 attached thereto are transferred to the receiving area B2 of the second turntable 3 using the transfer unit 11 (transfer step).

[0099] The two electronic components 100 pass through a first inspection area A4 on the way from the downstream installation area A2b to the transfer area A3. A first inspection camera 16 in the first inspection area A4 captures an image of the electronic components 100 in an extremely short time to determine whether the ACF 200 has been properly attached to the electronic components 100.

[0100] The above steps are performed successively on the first turntable 2. Therefore, the electronic components 100 are successively loaded onto the first turntable 2 by the first loading unit 4, and while they pass through the front-stage installation area A2a and the rear-stage installation area A2b, the ACF 200 is successively attached to the electronic components 100.

[0101] When the transfer of a total of four electronic components 100 (with ACF 200) to the mounting table 14 waiting in the receiving area B2 is completed, the second turntable 3 is rotated 45 degrees, and these electronic components 100 (with ACF 200) are placed in the second carry-in area B1. At this time, the second irradiator 40 irradiates the electrode surfaces of the FPC 300 carried into the second carry-in area B1 with plasma gas G. Note that the area irradiated with plasma gas G is not limited to the second carry-in area B1. For example, the area irradiated with plasma gas G may be somewhere along the path along which the FPC 300 is transferred from the transfer mechanism 7b to the second carry-in area B1.

[0102] Next, in the second carry-in area B1, the transfer and pressure-bonding unit 9 pre-press-bonds the FPC 300 to the ACF 200 of the electronic component 100 (second carry-in step, second irradiation step, and upstream pressure-bonding step).

[0103] Specifically, in the second carry-in area B1 (upstream crimping area B3), the suction and crimping head 9a of the transfer and crimping unit 9 suction-holds the FPC 300 carried in by the second carry-in unit 7 and transfers it above the electronic component 100. The second irradiation unit 40 irradiates the FPC 300 with plasma gas G, and the suction and crimping head 9a is then lowered to press the FPC 300 and pre-bond the electronic component 100 and the FPC 300 together via the ACF 200 (upstream crimping step). In the upstream crimping area B3, a total of four transfer, cleaning, and crimping operations are repeated to pre-bond the FPC 300 to each of the four electronic components 100 arranged in the upstream crimping area B3 in turn. That is, the second carry-in step and the upstream crimping step are performed consecutively multiple times in the upstream crimping area B3. The pre-press bonding of the FPC 300 is performed in a state where the mounting table 14 is removed from the second turntable 3 by the removal support device 700. During this time, a new electronic component 100 is also placed on the mounting table 14 in the upstream receiving area B2.

[0104] Thereafter, the mounting table 14 is returned to the second turntable 3, and the second turntable 3 is rotated 45 degrees to position the mounting table 14 in the second inspection area B6. The second inspection camera 18 simultaneously captures images of the electronic components 100 and FPC 300 to determine the pre-compression bonded state of both. If a defect is detected in the pre-compression bonded state, the electronic components 100 and FPC 300 are prevented from undergoing full-compression bonding downstream. Even during this inspection, the second carry-in step and upstream-compression bonding step are performed on the next group of electronic components 100 in the upstream second carry-in area B1 (upstream-compression bonding area B3).

[0105] Once the inspection in the second inspection area B6 is complete, the second turntable 3 is rotated 45 degrees, and the mounting table 14 is positioned in the upstream crimping area B4a (downstream crimping area B4). In the upstream crimping area B4a, for two of the four sets of pre-bonded electronic components 100 and FPCs 300, the crimping head 10a of the downstream crimping unit 10 presses the FPCs 300 to finally crimp the FPCs 300 to the electronic components 100 (downstream crimping step). The final crimping of the FPCs 300 is performed with the mounting table 14 detached from the second turntable 3 by the detachment support device 700. After the final crimping, the buffer material 400 is moved to release heat accumulated in and around the crimping head 10a during the downstream crimping step to the outside, thereby resetting the device. During this main pressure bonding process (downstream pressure bonding step / previous stage side), the next four sets of electronic components 100 and FPCs 300 are inspected in the upstream second inspection area B6.

[0106] When final crimping of some sets in the upstream crimping area B4a (downstream crimping area B4) is completed, the mounting table 14 is returned to the second turntable 3, which is then rotated 45 degrees to place the mounting table 14 on standby at an intermediate standby position B7 between the upstream crimping area B4a and the downstream crimping area B4b (standby step). During this standby time, the electronic components 100 and FPCs 300 that have been fully crimped upstream are allowed to dissipate heat, thereby homogenizing the heat throughout the mounting table 14. During this standby time, final crimping of some sets of electronic components 100 and FPCs 300 is performed in the upstream upstream crimping area B4a (downstream crimping area B4) (downstream crimping step).

[0107] After the standby step is completed, the second turntable 3 is rotated 45 degrees, and the mounting table 14 is placed in the subsequent-stage crimping area B4b (downstream crimping area B4). In the subsequent-stage crimping area B4b, for the remaining two sets of four pre-bonded electronic components 100 and FPCs 300 that have not yet been fully crimped, the crimping head 10a of the downstream crimping unit 10 presses the FPCs 300 to fully crimp the FPCs 300 to the electronic components 100 (downstream crimping step). The fully crimping of the FPCs 300 is performed with the mounting table 14 detached from the second turntable 3 by the detachment support device 700. After the fully crimping, the buffer material 400 is moved to release heat accumulated in the crimping head 10a and its surroundings during the downstream crimping step, thereby resetting the electronic components 100. During this final pressure bonding process (downstream pressure bonding step / later stage), electronic component 100 and FPC 300 are waiting at intermediate waiting position B7 on the upstream side.

[0108] As a result, two sets of electronic component 100 and FPC 300 are simultaneously fully crimped in front-stage crimping region B4a and rear-stage crimping region B4b. In the case of a single mounting table 14, the downstream crimping step is performed twice by passing through regions B4a and B4b.

[0109] When the final crimping (downstream crimping step / rear side) in the rear crimping area B4b (downstream crimping area B4) is completed, the mounting table 14 is returned to the second turntable 3, this second turntable 3 is rotated 45 degrees, and after being temporarily placed on standby in the intermediate standby area B8 (standby step), the second turntable 3 is further rotated 45 degrees and the final crimped electronic component structure P is placed in the carry-out area B5. In the carry-out area B5, the electronic component structure P is carried out from the second turntable 3 by the carry-out unit 12.

[0110] The above steps are performed successively on the second turntable 3. Thus, the electronic components 100 and the FPC 300 are continuously pressure-bonded to each other, thereby producing the electronic component structure P. The electronic component structure P carried out by the carrying-out unit 12 is then subjected to an electrical conductivity test and, if necessary, the application and hardening of a reinforcing resin, and then prepared for shipment.

[0111] According to the manufacturing apparatus 1 of the present embodiment described above, in the conductive material setting step, upstream-side crimping step, and downstream-side crimping step included in the assembly process of the electronic component structure P, assembly is performed using the detachment support devices 600, 700 with the mounting tables 13, 14 detached from the first and second turntables 2, 3. As a result, the detachment support devices 600, 700 can be responsible for positioning the electronic component 100 transported by the mounting tables 13, 14, and therefore it is not necessary to rely on the positioning accuracy of the first and second turntables 2, 3. As a result, it is possible to improve the assembly accuracy of the electronic component structure P.

[0112] In particular, in this embodiment, a plurality of mounting tables 13, 14 are arranged around the first and second turntables 2, 3, and components are simultaneously assembled on the plurality of mounting tables 13, 14. Even in this case, since the removal support devices 600, 700 are individually arranged at the respective stop positions of the plurality of mounting tables 13, 14, it is possible to independently adjust the positions of the electronic components on the plurality of mounting tables 13, 14.

[0113] In particular, in this embodiment, in conjunction with the lifting operation of the mounting tables 13, 14 by the detachment and support devices 600, 700, the mounting table-side positioning units 13g, 14g on the mounting tables 13, 14 engage with the support-side positioning units 620, 720 of the detachment and support devices 600, 700 to center the mounting tables 13, 14, thereby minimizing the time required for positioning. As a result, the cycle time for assembling the electronic component structure P can be reduced. Furthermore, because the detachment and support devices 600, 700 support the mounting tables 13, 14 from below, even in an assembly process that includes a pressing step against the electronic component 100, the amount of displacement of the mounting tables 13, 14 due to this external force can be reduced, thereby improving the assembly accuracy of the electronic component structure P. Furthermore, because the external force applied to the electronic component 100 during assembly is not transmitted to the first and second turntables 2, 3, deterioration in accuracy and failure of the first and second turntables 2, 3 can be reduced.

[0114] Furthermore, in this embodiment, plasma gas G is irradiated onto the electrode surfaces of the electronic component 100 placed on the first turntable 2, thereby decomposing and cleaning organic matter and other substances adhering to the electrode surfaces of the electronic component 100 to which the ACF 200 is attached. Furthermore, the irradiation of plasma gas G activates the electrode surfaces by causing molecules on the electrode surfaces to react with ions and electrons in the plasma, thereby improving the adhesion of the electrode surfaces. This improves the adhesion between the electronic component 100 and the ACF 200, preventing electrical conductivity problems. As a result, when manufacturing the final product, the electronic component structure P, a high-performance product can be manufactured, and manufacturing efficiency can be improved by increasing product yield.

[0115] Furthermore, because plasma gas G is irradiated onto the electrode surface of FPC 300 placed on second turntable 3, organic matter adhering to the electrode surface of FPC 300, which is pressure-bonded to the electrode surface of electronic component 100 to which ACF 200 is attached, can be decomposed and cleaned, activating the electrode surface and improving the adhesion of the electrode surface. This improves the adhesion between the electrode surface of electronic component 100 and the electrode surface of FPC 300 via ACF 200, preventing poor electrical conductivity between electronic component 100 and FPC 300. As a result, when manufacturing electronic component structure P as the final product, a high-performance product can be manufactured, and manufacturing efficiency can be further improved by improving product yield.

[0116] Furthermore, electronic component 100 is loaded and placed on first turntable 2, which serves as a conveying table, and FPC 300 is loaded and placed on second turntable 3. In this state, plasma gas G is irradiated onto the surfaces of the electrodes of electronic component 100 and FPC 300. Therefore, while electronic component 100 is being conveyed, plasma gas G can be irradiated during the manufacturing process of electronic component structure P. In particular, when first irradiation unit 30 and second irradiation unit 40 are devices that generate atmospheric pressure plasma as plasma gas G, the device can be made compact, and even if first irradiation unit 30 is placed on first turntable 2 and second irradiation unit 40 is placed on second turntable 3, it is possible to avoid an increase in the size of the entire manufacturing apparatus 1.

[0117] In this embodiment, first irradiating unit 30 is provided in conductive material placing unit 6 and irradiates electronic component 100 with plasma gas G in conductive material placing area A2. Second irradiating unit 40 is provided in transfer and crimping unit 9 and irradiates FPC 300 with plasma gas G in upstream crimping area B3. Therefore, ACF 200 can be attached to electronic component 100 immediately after irradiation with plasma gas G, and FPC 300 and electronic component 100 can be crimped together immediately after irradiation with plasma gas G. This makes it possible to perform the attachment and crimping of ACF 200 while maintaining the adhesiveness of the electrode surfaces of electronic component 100 and FPC 300 improved by plasma gas G, thereby preventing poor electrical conductivity between electronic component 100 and FPC 300.

[0118] Furthermore, the first turntable 2 and the second turntable 3 can be used as conveying tables to attach the ACF 200 to the electronic component 100 and to crimp the electronic component 100 to the FPC 300. This allows the electronic component structure P to be manufactured at a high speed and also allows the manufacturing apparatus 1 to take up less space.

[0119] Furthermore, since the upstream crimping area B3 is located in the same position as the second carry-in area B1 where the FPC 300 is carried in on the second turntable 3, it is possible to achieve further space savings in the manufacturing apparatus 1 compared to when these areas B1 and B3 are located in different positions. Furthermore, since the second carry-in area B1 and the upstream crimping area B3 are located in the same position, pre-crimping is performed at the same time as the carrying-in and positioning of the FPC 300 relative to the electronic component 100 is completed, and therefore it is possible to suppress deviation in the relative positions of the two.

[0120] Furthermore, after the electronic component 100 and the FPC 300 are pre-bonded in the upstream crimping area B3, the final crimping is performed in the downstream crimping area B4. During the pre-bonding process, the FPC 300 must be suction-held by the transfer and crimping unit 9, making it difficult to interpose the buffer material 400 between the suction crimping head 9a and the FPC 300, which can easily trap heat in the suction crimping head 9a. Furthermore, if a set of all electronic components 100 and FPC 300 is to be final-bonded in a single upstream crimping area B3, heat tends to accumulate in the upstream crimping area B3, creating an unstable ambient environment. Therefore, in this embodiment, the pre-bonding and final crimping processes are separated to reduce the amount of heat, pressure, and time applied during the pre-bonding process, thereby avoiding poor electrical conductivity due to the generation of air bubbles between the ACF 200 attached to the electronic component 100 and the FPC 300 during the initial crimping process. Meanwhile, in downstream crimping region B on the downstream side where the temperature and atmospheric environment of the crimping head are optimized, electronic component 100 and FPC 300 can be firmly crimped together by main crimping.

[0121] Furthermore, in the upstream crimping region B3, positioning and pre-bonding of the electronic component 100 and the FPC are performed simultaneously, which requires a certain amount of work time, but the work time can be reduced by the amount that the main crimping is performed downstream (downstream crimping region B4). On the other hand, in the downstream crimping region B4, although work time is required for the main crimping, the work time can be reduced by the amount that the positioning step of the electronic component 100 and the FPC is separated upstream (upstream crimping region B3). In this way, by rationally allocating the work time to the upstream crimping region B3 and the downstream crimping region B4 and performing these processes simultaneously in parallel, it is possible to speed up the manufacture of the electronic component structure P.

[0122] Furthermore, in this embodiment, the downstream crimping region B4 is also divided into multiple regions B4a and B4b, which reduces the number of component sets to be fully crimped in each region B4a and B4b, while also ensuring sufficient distance between the component sets to be fully crimped, thereby reducing the thermal influence between the component sets being fully crimped.

[0123] The first alignment adjustment unit 5 can adjust the positions of the electrode surfaces of the electronic component 100 and the ACF 200 with high precision. Furthermore, by using a CCD camera as the sensor 5a of the first alignment adjustment unit 5, the positions of the electronic component 100 and the ACF 200 can be adjusted with a simple structure.

[0124] Similarly, second alignment adjustment unit 8 can adjust the positions of the electrodes of electronic component 100 and the electrodes of FPC 300 with high precision, preventing poor electrical conduction in electronic component structure P and improving product yield and production efficiency. Furthermore, by using a CCD camera as sensor 8a of second alignment adjustment unit 8, the positions of the electrodes of electronic component 100 and the electrodes of FPC 300 can be reliably adjusted with a simple structure.

[0125] Furthermore, the first turntable 2 is provided with a plurality of conductive material application areas A2 for applying the ACF 200, and the application of the ACF 200 can be carried out simultaneously in a plurality of areas A2a, A2b. This prevents the conductive material application step from becoming a bottleneck, and enables the electronic component structure P to be manufactured at a high speed.

[0126] Although the embodiments of the present invention have been described above in detail with reference to the drawings, the configurations and combinations thereof in the above-described embodiments are merely examples, and additions, omissions, substitutions, and other modifications of the configurations are possible without departing from the spirit of the present invention. Furthermore, the present invention is not limited to the embodiments, but is limited only by the claims.

[0127] For example, only one of first irradiating unit 30 and second irradiating unit 40 may be provided. Furthermore, first irradiating unit 30 may irradiate electronic component 100 with plasma gas G in a region on first turntable 2 that is upstream of conductive material placement region A2 and downstream of first carry-in region A1. Furthermore, second irradiating unit 40 may irradiate FPC 300 with plasma gas G in a region on second turntable 3 that is upstream of upstream crimping region B3 and downstream of receiving region B3.

[0128] For example, instead of ACF 200, an anisotropic conductive adhesive may be applied to the surface of the electrodes of electronic component 100 as the anisotropic conductive material. In this case, it is possible to complete the full-compression bonding by performing only one of the upstream-side pressure-bonding step and the downstream-side pressure-bonding step, without performing both. In other words, the pre-compression bonding step is not necessary.

[0129] Alternatively, the second carry-in area B1 may be located upstream of the receiving area B2 in the rotation direction of the second turntable 3. That is, in the second carry-in area B1, the FPC 300 may first be placed on the mounting table 14, and then the position of the electronic component 100 may be adjusted relative to the FPC 300 in the receiving area B2. In this case, the upstream crimping area B3 may be located at the same position as the receiving area B2. That is, in the receiving area B2, the electronic component 100 may be transferred from the first turntable 2 to the second turntable 3 so that the electrode surfaces of the electronic component 100 and the electrode surfaces of the FPC 300 overlap in the direction of the second rotation axis O2, and the upstream crimping step (pre-crimping) may be performed on the spot.

[0130] In the above embodiment, the case where ACF 200 is attached to electronic component 100 on first turntable 2 has been exemplified, but conversely, FPC 300 may be carried into first turntable 2 by first carry-in unit 4, and ACF 200 may be attached to the surface of the electrodes of FPC 300. In this case, electronic component 100 may be carried into second turntable 3 by second carry-in unit 7, and electronic component 100 may be pressure-bonded to FPC 300.

[0131] Furthermore, in the above embodiment, a structure has been exemplified in which the conductive material placing device including the first carry-in unit 4 and the conductive material placing unit 6 is arranged along a circular movement locus that follows the rotational motion of the first turntable 2, but the present invention is not limited to this, and a structure in which these are arranged along a linear movement locus (including a U-shaped or L-shaped movement locus) is also possible. Also, a structure has been exemplified in which the crimping device including the second carry-in unit 7, the transfer and crimping unit 9, and the downstream crimping unit 10 is arranged along a circular movement locus that follows the rotational motion of the second turntable 3, but the present invention is not limited to this, and a structure in which these are arranged along a linear movement locus (including a U-shaped or L-shaped movement locus).

[0132] Furthermore, in this embodiment, an example has been given of parts being transported using the first rotating table 1 and the second rotating table 2, but the present invention is not limited to this, and the first loading step, conductive material installation step, second loading step, upstream crimping step, downstream crimping step, and carrying-out step may be performed along a single rotating table or a linear movement trajectory (including a U-shaped or L-shaped movement trajectory).

[0133] Alternatively, the electronic component structure P may be manufactured using a single crimping device including the second turntable 3, the second carry-in section 7, the transfer and crimping section 9, and the downstream crimping section 10. In this case, in the single crimping device, the receiving area B2 of the second turntable 3 serves as a first carry-in area into which the electronic component 100 to which the ACF 200 is attached is carried.

[0134] Furthermore, the plasma irradiation device including at least one of the first irradiation section 30 and the second irradiation section 40 may be applied to other manufacturing devices.

[0135] Furthermore, steps such as electrical conductivity testing, application and hardening of reinforcing resin may also be performed on a conveying device using a rotary table, similar to the first rotary table 2 and the second rotary table 3.

[0136] Furthermore, in this embodiment, a flexible substrate in which electrodes are formed on the surface of an insulating layer made of polyimide resin or the like is exemplified, but the substrate of the present invention is not limited to this. It may be a sheet-like silicone substrate in which a silicone resin sheet or the like is used instead of the insulating layer made of polyimide resin and electrodes are formed on the surface thereof, or any other type of substrate.

[0137] Furthermore, at each step of the manufacturing, traceability may be enabled by reading barcodes provided on electronic components 100 and FPCs 300. Furthermore, at the downstream crimping step, downstream crimping unit 10 may record the load, temperature, time, etc., during crimping.

[0138] Furthermore, in the manufacturing apparatus 1 of the above embodiment, the case where the ACF 200 is transferred to the electronic component 100 being transported on the first turntable 2 side has been exemplified, but for example, the ACF 200 side can be transported and the electronic component 100 can be mounted thereon. Also, in the first turntable 3 side, the case where the FPC 300 is pressure-bonded to the ACF 200 on the top surface of the electronic component 100 being transported has been exemplified, but for example, the FPC 300 side can be transported and the electronic component 100 with the ACF 200 mounted thereon can be mounted thereon. Also, in the present manufacturing apparatus, the case where the ACF 200 is transferred to the electronic component 100 has been exemplified, but it is also possible to transfer the ACF 200 to the FPC 300 and then pressure-bond the ACF-equipped FPC 300 to the electronic component 100.

[0139] Furthermore, in the manufacturing apparatus 1 of the above embodiment, a process of assembling the electronic component 100, ACF 200, and FPC 300 as the electronic component structure P in each region was illustrated as an example of a crimping process, but the present invention is not limited thereto. In other words, the present invention can be applied to various processes for assembling multiple components to assemble an electronic component (structure), and the above embodiment illustrates a crimping process as one type of assembly process. For example, the present invention can also be applied to the task of assembling one component with another component using adhesive or the like in a process of assembling multiple components to manufacture an electronic component. In this case, while the above embodiment provided a crimping device in each crimping region, a robot for assembling components can be provided in each assembly region where one component is assembled to another. Like the crimping device, this robot also serves as a type of assembly device for assembling components. [Industrial Applicability]

[0140] According to the manufacturing apparatus and the like of the present invention, when manufacturing an electronic component structure, it is possible to manufacture a high-performance product and also to improve manufacturing efficiency. [Explanation of symbols]

[0141] 1. Manufacturing equipment (for electronic component structures) 2 First rotary table 2 First rotary table 2a Top side 3 Second rotary table 3a Top side 4. First Loading Section 5 First alignment adjustment unit 5a Sensor 6 Conductive material installation section 7 Second loading area 8 Second alignment adjustment unit 9 Transfer and crimping section 10 Downstream crimp section 11 Delivery Department 12 Unloading section 13 Mounting table 14 Mounting table 16 First Inspection Camera 18 Second Inspection Camera 20 Bonding Head 21 Cushioning material supply section 22 Conductive material supply section 30 First irradiation section 40 Second irradiation section 100 Electronic Components 200 Anisotropic Conductive Film (ACF) 300 Flexible Printed Circuit (FPC) 400 Cushioning material 600, 700 Detachment support device 802, 804 base A1 First loading area A2 Conductive material installation area A2a Front stage installation area A2b Rear installation area A3 Delivery area A4 First inspection area B1 Second loading area B2 Receiving area B3 Upstream crimp area B4 Downstream crimp area B4a Front side crimping area B4b Later side crimping area B5 Export area B6 Second Inspection Area C1 First plasma irradiation area C2 Second plasma irradiation region O1 First rotation axis O2 Second rotation axis P Electronic component structure G Plasma gas

Claims

1. An electronic component assembly device that compresses an anisotropic conductive material to an electronic component component member that becomes an electronic component or a substrate, The base and a mounting table that is detachably provided on the base and on which one of the electronic component constituent member and the anisotropic conductive material (hereinafter referred to as "one member") is detachably placed; a transfer mechanism for transferring the base and the mounting table together; a detachment support device that is disposed in a pressure bonding area provided on a transfer path of the base and the mounting table, detaches the mounting table from the base, and supports the mounting table from below after detachment; a crimping device that is disposed in the crimping area, that is detached from the base by the detachment support device, that is placed on the mounting table supported from below, and that presses the other of the electronic component constituent member and the anisotropic conductive material (hereinafter, the other member) downward in a state where the other member is positioned relative to the one member, and that presses the other member downward to crimp the one member and the other member; An electronic component assembly device comprising:

2. the mounting table has a mounting table side positioning portion that engages with the detachment support device and defines a relative position with respect to the detachment support device in a planar direction, The detachment support device is a support-side positioning portion that engages with the mounting-table-side positioning portion; a support portion that abuts against a bottom surface of the mounting table and supports the mounting table so that the mounting surface of the mounting table is perpendicular to the pressing direction of the crimping device; an elevation mechanism that raises and lowers the support portion and, when raised, detaches the mounting table from the base table; 2. The electronic component assembly apparatus according to claim 1, further comprising:

3. The detachment support device is The apparatus is characterized by having a biasing mechanism that engages with the mounting table and biases the mounting table downward.

3. The electronic component assembly apparatus according to claim 2.

4. a plurality of the bases and the mounting tables are provided in a circumferential direction of a rotary table rotated by the transfer mechanism; The electronic component assembly apparatus according to any one of claims 1 to 3.

5. The crimping area includes an upstream crimping area provided on the upstream side of the transfer path of the base, and a downstream crimping area provided on the downstream side of the transfer path of the base. The removal support device and the crimping device are provided in each of the upstream crimping area and the downstream crimping area. The electronic component assembly apparatus according to any one of claims 1 to 4.

6. An apparatus for manufacturing an electronic component structure in which a substrate is connected to an electronic component via an anisotropic conductive material, The first and second electronic component assembly devices according to claim 4; a first loading section configured to load and place one of the electronic component and the substrate into a first loading area upstream of the first crimping area of ​​the first rotary table in the first electronic component assembly device; a first crimping device that crimps the anisotropic conductive material onto a surface of an electrode of the one component in a first crimping region; a second loading section configured to load and place the other of the electronic component and the substrate into a second loading area upstream of the second crimping area of ​​the second rotary table in the second electronic component assembly device; a transfer section that transfers the one component provided with the anisotropic conductive material from the transfer area downstream of the first crimping area in the rotation direction of the first rotary table to a receiving area on the second rotary table; a second crimping device that crimps a surface of an electrode of the one component, on which the anisotropic conductive material is provided, to a surface of an electrode of the other component, in a second crimping area where the one component and the other component are positioned on the second rotary table; a carry-out unit that carries out the electronic component structure, which is a set of the one component and the other component that have been crimped, from a carry-out area downstream of the second crimping area on the second rotary table; An apparatus for manufacturing an electronic component structure comprising:

7. An electronic component assembly device that assembles electronic components by combining a plurality of members, The base and a mounting table that is detachably attached to the base and on which one of the plurality of members (hereinafter referred to as "one member") is detachably placed; a transfer mechanism for transferring the base and the mounting table together; a detachment support device that is disposed in an assembly area provided on a transfer path of the base and the mounting table, detaching the mounting table from the base and supporting the mounting table from below after detachment; an assembling device that is disposed in the assembly area, that assembles one of the members onto the other of the members that is placed on the mounting table that is detached from the base by the detachment support device and supported from below; An electronic component assembly device comprising:

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