soldering equipment

Abstract

To provide soldering equipment including a jet nozzle that can efficiently eject debris and reduce soldering time.SOLUTION: Provided is soldering equipment soldering a plurality of lead terminals 2 for an electronic component to a circuit board 3. The soldering equipment includes: a solder bath containing molten solder 7 therein; a circulation mechanism circulating the molten solder; and a jet nozzle 6 to which the molten solder is supplied from the circulation mechanism and which jets the molten solder to form a jet. The jet nozzle has a plurality of side walls defining an opening through which the molten solder is jetted. The circuit board on which the electronic component is mounted is arranged above the opening so that the plurality of lead terminals penetrate through at least one side wall among the plurality of side walls. The jet nozzle has at least one notch 4 having a notch width and a notch length larger than a lead terminal width and a lead terminal length, in a position where the plurality of lead terminals face at least one side wall while the plurality of lead terminals are inserted into the opening.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a soldering apparatus, and more particularly to the structure of a jet nozzle provided in a soldering apparatus. [Background technology]

[0002] In partial soldering for soldering electronic components to a circuit board, for example, as disclosed in FIG. 1 of Patent Document 1, a jet nozzle is provided at a position higher than the liquid surface of the solder bath, and molten solder is ejected from the opening at the tip of the jet nozzle, soldering the circuit board and the lead terminals of the electronic components together. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-120031 Summary of the Invention [Problem to be solved by the invention]

[0004] The jet nozzle disclosed in Patent Document 1 has a large opening area, making it impossible to control the solder flow rate for each lead terminal, resulting in temperature variations and unstable soldering for each lead terminal.In addition, the jet nozzle has an opening across the entire longitudinal length, and because the opening area is large, the solder flow rate is insufficient, which can cause debris (solder residue) on the surface of the molten solder to stagnate.

[0005] The present disclosure has been made to solve the above-mentioned problems, and aims to provide a jet nozzle for partial soldering that efficiently discharges debris and shortens soldering time. [Means for solving the problem]

[0006] A soldering apparatus according to the present disclosure is a soldering apparatus for soldering a plurality of lead terminals of an electronic component to a circuit board, and comprises: a solder bath for storing molten solder; a circulation mechanism for circulating the molten solder; and a jet nozzle that receives the molten solder from the circulation mechanism and ejects the molten solder into a jet, the jet nozzle having a plurality of side walls that define an opening from which the molten solder is ejected, and at least one of the side walls has at least one notch whose width and length are greater than the width and length of the lead terminals at a position where the lead terminals face the at least one side wall when the lead terminals are inserted into the opening. The opening has a rectangular shape in a plan view, and the plurality of side walls include a first side wall and a second side wall in a longitudinal direction of the opening, and a third side wall and a fourth side wall in a lateral direction of the opening. The jet nozzle has a plurality of first notches provided in the longitudinal direction on the first side wall among the plurality of side walls, a third notch and a fourth notch provided in the lateral direction on the third side wall and a fourth notch provided in the lateral direction, respectively, and a plurality of second notches provided in the longitudinal direction on the second side wall. the plurality of first notches provided in the first side wall of the jet nozzle include a central notch and two small notches provided on both sides of the central notch, each of the plurality of second notches has the same opening area as each of the two small notches, the central notch is set to have a larger notch width and a smaller notch length than each of the two small notches and each of the plurality of second notches, and the opening area of ​​the central notch is set to be the same as the opening area of ​​each of the plurality of second notches at a position facing the central notch; do. [Effects of the Invention]

[0007] According to the soldering apparatus of the present disclosure, by providing at least one notch at a position where the plurality of lead terminals face at least one sidewall, the solder flow can be brought into direct contact with the lead terminals, and by locally increasing the solder flow speed, the temperature of the lead terminals can be easily increased.Furthermore, by locally increasing the solder flow speed, debris stagnating on the surface of the jet nozzle can be moved and the debris can be efficiently expelled outside the jet nozzle. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a cross-sectional view showing the configuration of a soldering apparatus according to the present disclosure. [Figure 2] 1 is a perspective view showing the positional relationship between a circuit board and the jet nozzle of the first embodiment during partial soldering. FIG. [Figure 3] 4 is a diagram showing the positional relationship between the circuit board and the jet nozzle of the first embodiment during partial soldering. FIG. [Figure 4] 1 is a perspective view showing the configuration of a jet nozzle according to a first embodiment. [Figure 5]FIG. 10 is a perspective view showing the configuration of a jet nozzle according to a second embodiment. [Figure 6] FIG. 11 is a perspective view showing the configuration of a jet nozzle according to a third embodiment. [Figure 7] FIG. 11 is a plan view showing the positional relationship between the jet nozzle and the lead terminal according to the third embodiment. [Figure 8] FIG. 10 is a perspective view showing the configuration of a jet nozzle according to a fourth embodiment. [Figure 9] FIG. 10 is a plan view showing the positional relationship between the jet nozzle and the lead terminal according to the fourth embodiment. [Figure 10] 10 is a diagram showing the configuration of a jet nozzle according to a fifth embodiment and the positional relationship with a circuit board. FIG. [Figure 11] FIG. 11 is a plan view showing the positional relationship between the jet nozzle and the lead terminal according to the fifth embodiment. [Figure 12] FIG. 13 is a plan view showing the positional relationship between the jet nozzle and the lead terminal according to the sixth embodiment. [Figure 13] 13 is a diagram showing the configuration of a jet nozzle according to a seventh embodiment and the positional relationship with a circuit board. FIG. [Figure 14] 13 is a diagram showing the configuration of a jet nozzle according to an eighth embodiment and the positional relationship with a circuit board. FIG. [Figure 15] FIG. 13 is a side view of the soldering apparatus of the ninth embodiment during partial soldering. DETAILED DESCRIPTION OF THE INVENTION

[0009] <First Embodiment> Fig. 1 is a cross-sectional view showing the configuration of a soldering apparatus 100 according to the present disclosure. As shown in Fig. 1, the soldering apparatus 100 includes a solder bath 200 that contains molten solder 7, a heater 201 that houses the solder bath 200 and heats the molten solder 7 in the solder bath 200, a pump 203 that is disposed in the molten solder 7 in the solder bath 200 and sends the molten solder 7 into a duct 204, a motor 205 that is disposed at a position higher than the liquid surface of the molten solder 7 and applies a rotational force to the pump 203, and a transmission mechanism 206 that transmits the rotation of the motor 205 to the pump 203.

[0010] A shielding plate 2041 that blocks the molten solder 7 is provided at the tip opening of duct 204, which is located higher than the liquid surface of molten solder 7, and a jet nozzle 6 is provided on shielding plate 2041. Jet nozzle 6 is attached to an opening that penetrates shielding plate 2041, and molten solder 7 stored in solder tank 200 is jetted from jet nozzle 6 to form a solder jet.

[0011] The temperature of the solder bath 200 is maintained above the melting point of the solder by a heater 201. Molten solder 7 stored in the solder bath 200 is ejected from the jet nozzle 6 and supplied to electronic components on a circuit board (not shown) placed above the opening of the jet nozzle 6.

[0012] Pump 203 is connected to motor 205, and begins operating as motor 205 rotates. Pump 203 and motor 205 form a circulation mechanism for molten solder 7. When pump 203 operates while solder bath 200 is filled with molten solder 7, circulation of molten solder 7 begins inside solder bath 200, and molten solder 7 is ejected from jet nozzle 6 through duct 204. Molten solder 7 that is not used in soldering flows along the wall surface of jet nozzle 6 and the surface of shield plate 2041 and returns to solder bath 200. When motor 205 stops rotating, the jet of molten solder 7 from jet nozzle 6 stops.

[0013] Next, partial soldering using the jet nozzle according to embodiment 1 will be described with reference to Figures 2, 3, and 4. Figure 2 is a perspective view showing the positional relationship between the circuit board 3 and the jet nozzle 6 during partial soldering, Figure 3 is a diagram showing the positional relationship between the circuit board 3 and the jet nozzle 6 during partial soldering, and Figure 4 is a perspective view of the jet nozzle 6.

[0014] 2, the jet nozzle 6 collectively solders the lead terminals 2 to the circuit board 3. The jet nozzle 6 has a longitudinal direction parallel to the arrangement direction of the lead terminals 2 and a lateral direction perpendicular to the longitudinal direction, and has a rectangular shape in a plan view seen from the circuit board 3 side.

[0015] 2, in partial soldering, lead terminals 2 protruding from the side of a modularized electronic component (hereinafter referred to as module 1) and bent toward a circuit board 3 are inserted into through holes 8 in the circuit board 3, and the circuit board 3 is then placed over the opening of a jet nozzle 6. For simplicity, the mechanism for placing the circuit board 3 over the opening of the jet nozzle 6 is not shown.

[0016] The circuit board 3 is placed above the jet nozzle 6 so as not to come into contact with the opening of the jet nozzle 6, and the tips of the lead terminals 2 inserted into the through holes 8 protrude from the back surface of the circuit board 3. On the front and back surfaces of the circuit board 3, copper patterns 9 are formed around the through holes 8 and on the inner walls of the through holes 8.

[0017] When molten solder 7 is ejected from the jet nozzle 6, the solder flows into the through-holes 8, and solder fillets are formed between the lead terminals 2 and the copper patterns 9 on the front and back surfaces of the circuit board 3, thereby soldering the lead terminals 2 to the circuit board 3.

[0018] 4, one side wall (first side wall) along the longitudinal direction of the jet nozzle 6 has a plurality of notches 4 (first notches) along the longitudinal direction, but the other side wall (second side wall) along the longitudinal direction does not have any notches 4. Furthermore, one side wall (third side wall) along the lateral direction and the other side wall (fourth side wall) along the lateral direction do not have any notches.

[0019] 3, the longitudinal notches 4 are provided at positions corresponding to the lead terminals 2, and each notch 4 faces one lead terminal 2 in a one-to-one relationship, so that the surface of the lead terminal 2 comes into direct contact with the solder flow. As shown in FIG. 3, the notch width A11 and notch length A12 of the notch 4 are formed slightly larger than the width and length of the lead terminal 2 protruding from the circuit board 3.

[0020] In this way, by providing a notch 4 with a small opening area similar to the shape of the lead terminal 2, the solder flow rate increases locally, the temperature of the lead terminal 2 and the circuit board 3 rises quickly, and the soldering time can be adjusted.

[0021] In general, during selective soldering, debris circulating in the solder bath floats out of the jet nozzle and accumulates on the solder surface. Also, when a soldering device is used for a long period of time, an oxide film may form on the solder surface over time. Although the amount of oxidation of this oxide film is less than that of the debris, if soldering is performed in this state, the debris contained in the jet solder will adhere to the lead terminals. Furthermore, the presence of the oxide film can act as an inclusion between the lead terminals and the solder, preventing direct contact between the lead terminals and the solder, reducing the solder's wetting and spreading properties and resulting in poor soldering. However, by providing a notch 4 with a small opening area along the longitudinal direction of the jet nozzle 6, the solder flow rate can be increased locally, moving and efficiently removing debris and other debris that has accumulated on the surface of the jet nozzle 6.

[0022] Here, the notch width A11 of the notch 4 of the jet nozzle 6 is formed larger than the width of the lead terminal 2. For example, for a lead terminal width of 0.3 mm to 5.0 mm, a clearance of 1 mm to 3 mm on one side can be provided. If the notch width A11 is smaller than the width of the lead terminal 2, the solder flow does not hit the entire surface of the lead terminal 2, making it difficult for the temperature of the lead terminal 2 to rise. On the other hand, if the notch width A11 is too large, the solder flow rate decreases, making it difficult for debris to move, and the debris cannot be discharged to the outside of the jet nozzle 6.

[0023] The notch length A12 of the notch 4 of the jet nozzle 6 is formed so that the bottom of the notch is deeper than the bottom of the lead terminal 2 protruding from the circuit board 3. For example, if the length of the lead terminal 2 is 1.0 mm to 3.0 mm, a clearance of 1.0 mm to 6.0 mm can be provided from the bottom of the lead terminal 2. If the notch length A12 is shorter than the length of the lead terminal 2, the solder flow will not hit the entire surface of the lead terminal 2, making it difficult for the temperature of the lead terminal 2 to rise. On the other hand, if the notch length A12 is too large, the solder flow rate will increase, and molten solder 7 will splash from the periphery of the jet nozzle 6, possibly adhering to components near the jet nozzle 6 on the back surface of the circuit board 3.

[0024] 4, the jet nozzle width A13, which is defined by the short-side length of the opening OP of the jet nozzle 6, can be set to 5.0 mm to 10.0 mm. The closer the width is to the notch 4, the faster the solder flow rate. That is, if the jet nozzle width A13 is greater than 10 mm, the solder flow rate decreases, making it difficult to remove debris from the lead terminal 2 located near the center of the jet nozzle 6. This results in the debris adhering to the lead terminal 2 and making it difficult to increase the temperature. On the other hand, if the jet nozzle width A13 is less than 5 mm, the pressure loss increases, making it difficult to eject the molten solder 7 from the jet nozzle 6, which may result in the molten solder 7 hardening within the jet nozzle 6.

[0025] Furthermore, because the molten solder 7 has a high surface tension, it tends to bulge from the inner wall of the jet nozzle 6 toward the center. Therefore, the solder height is large at the center of the jet nozzle 6 and small at the ends of the jet nozzle 6. Therefore, if the distance A10 between the circuit board 3 and the jet nozzle 6 is large, the molten solder 7 contacts the circuit board 3 at the center of the jet nozzle 6, but the contact between the molten solder 7 and the circuit board 3 is small at the longitudinal ends of the jet nozzle 6, which may result in poor soldering. On the other hand, if the distance A10 between the circuit board 3 and the jet nozzle 6 is small, the gap for debris becomes small, making it difficult to remove the debris and allowing it to stagnate. Therefore, the distance A10 between the circuit board 3 and the jet nozzle 6 is experimentally set to 2 mm to 6 mm. Furthermore, by providing notches 4 corresponding to each lead terminal 2, the solder flow rate of each can be controlled to adjust the temperature rise, reducing the temperature variation of the lead terminals 2 and reducing soldering defects when soldering all at once.

[0026] The jet nozzle 6 is made of stainless steel (SUS), which is difficult for solder to adhere to, and the solder is made of Sn3Ag0.5Cu, which contains tin (Sn), 3% silver (Ag), and 0.5% copper (Cu). Phosphorus (P) may also be added to the molten solder 7 to make it less susceptible to oxidation.

[0027] As described above, according to the configuration of the jet nozzle 6 of the first embodiment, a plurality of notches 4 are provided along the longitudinal direction of the jet nozzle 6 at positions of the jet nozzle 6 corresponding to the lead terminals 2, allowing the solder flow to come into direct contact with the lead terminals 2, facilitating a rise in the temperature of the lead terminals 2. Furthermore, by reducing the opening area of ​​the notches 4, the solder flow speed is locally increased, and debris and the like that has accumulated on the surface of the jet nozzle 6 can be moved and efficiently discharged.

[0028] Furthermore, by providing a notch 4 for each lead terminal 2, the solder flow rate can be controlled for each lead terminal 2, and the temperature rise can be adjusted individually, reducing temperature variations for each lead terminal 2 and reducing soldering defects when soldering all at once.

[0029] Furthermore, although the above explanation gives an example of soldering the lead terminals 2 of the module 1, the same effect can be obtained when soldering components with lead terminals of different widths and lengths, such as capacitors and connector components.

[0030] 4, the jet nozzle 6 has a rectangular shape in plan view, but is not limited to this and may have a circular, U-shaped, L-shaped, or other shape in plan view. A circular shape can accommodate batch soldering of the lead terminals on each side of a module, just like a rectangular shape, a U-shaped shape can accommodate batch soldering of the lead terminals on both mating side surfaces of a module, and an L-shaped shape can accommodate batch soldering of the lead terminals on each of two orthogonal side surfaces of a module.

[0031] <Embodiment 2> FIG. 5 is a perspective view showing the configuration of a jet nozzle 6A according to a second embodiment. The difference from the jet nozzle 6 of the first embodiment shown in FIG. 4 is that notches 5 are provided in two side walls parallel to the short side, namely, the third and fourth side walls. At the center of the jet nozzle 6, the molten solder 7 is ejected from the entire nozzle, resulting in a large contact area between the molten solder 7 and the circuit board 3, making it easy for the temperature to rise. At the nozzle ends, however, the contact area between the molten solder 7 ejected from the jet nozzle 6 and the circuit board 3 is small, making it difficult for the temperature to rise. Furthermore, at the nozzle ends, the molten solder 7 stagnates due to the lack of a flow path. Therefore, the temperatures of the circuit board 3 and lead terminals 2 tend to be lower at the nozzle ends than at the center.

[0032] In contrast, the jet nozzle 6A has longitudinal notches 4 and lateral notches 5, which allow the solder to flow in two directions, and the notches with small opening areas increase the solder flow rate, making it easier to raise the temperatures of the circuit board 3 and lead terminals 2 and shortening the soldering time. In addition, the lateral notches 5 allow debris that has accumulated at the end of the jet nozzle 6A to be expelled to the outside of the jet nozzle 6A.

[0033] Here, the notch width of notch 5 of jet nozzle 6A can be set to the same as the notch width of notch 4 of jet nozzle 6, for example, a clearance of 1 mm to 3 mm on one side for a lead terminal width of 0.3 mm to 5.0 mm. Also, the notch length of notch 5 can be set to the same as the notch length of notch 4 of jet nozzle 6, for example, a clearance of 1.0 mm to 6.0 mm from the bottom surface of lead terminal 2 for a lead terminal length of 1.0 mm to 3.0 mm.

[0034] In this way, in the jet nozzle 6A of embodiment 2, by providing a notch 5 at the nozzle end, the temperatures of the circuit board 3 and the lead terminals 2 are more likely to rise, the soldering time can be shortened, and debris can be more easily discharged.

[0035] <Third Embodiment> FIG. 6 is a perspective view showing the configuration of a jet nozzle 6B according to the third embodiment, and FIG. 7 is a plan view showing the positional relationship between the jet nozzle 6B and the lead terminal 2. As shown in FIG.

[0036] The difference from the jet nozzle 6 of embodiment 1 shown in Figure 4 is that one side wall along the longitudinal direction of the jet nozzle 6B has multiple notches 41 (first notches) along the longitudinal direction, and the other side wall has notches 42 (second notches), and one side wall along the short direction has notches 5 (third notches), and the other side wall along the short direction has notches 5 (fourth notches).

[0037] 7, the lead terminal 2 is positioned at the center in the width direction of the jet nozzle 6B, and is also positioned at the center in the width direction of the notch 41 on one side and the notch 42 on the other side that face each other. The notch width and length of the notch 41 and the notch 42 are the same as the notch 4 of the jet nozzle 6 of the first embodiment shown in FIG. 4, and the notch width and length of the notch 5 are the same as the notch 5 of the jet nozzle 6A of the second embodiment shown in FIG.

[0038] By providing notches 41 and 42 as in jet nozzle 6B, molten solder can be ejected from both side walls of the jet nozzle. This allows solder flows in two directions from notches 41 and 42 provided on both side walls of jet nozzle 6B to come into contact with the surface of lead terminal 2, and notches with small opening areas can create localized solder flow rates in two directions, further shortening the soldering time between lead terminal 2 and circuit board 3. In addition, creating localized solder flow rates in two directions makes it easier to move debris that stagnates on the surface of molten solder 7, making it easier to expel it outside jet nozzle 6B.

[0039] Furthermore, the notch 5 provided in the lateral direction allows debris that has accumulated at the end of the jet nozzle 6B to be discharged to the outside of the jet nozzle 6A.

[0040] In this way, in the jet nozzle 6B of the third embodiment, by providing multiple notches 41 and 42 on one side wall and the other side wall along the longitudinal direction of the jet nozzle 6B, respectively, the solder flow can be brought into contact with the surface of the lead terminal 2 in two directions, making it easier to increase the temperature of the lead terminal 2 and the circuit board 3, and further shortening the time required to solder the lead terminal 2 and the circuit board 3. In addition, the notches with small opening areas can create local solder flow speeds in two directions, moving debris stagnating on the surface of the molten solder 7 and more efficiently discharging it outside the jet nozzle 6B. In addition, the notches 5 can discharge debris stagnating at the end of the jet nozzle 6B outside the jet nozzle 6A.

[0041] <Fourth Embodiment> FIG. 8 is a perspective view showing the configuration of a jet nozzle 6C according to the fourth embodiment, and FIG. 9 is a plan view showing the positional relationship between the jet nozzle 6C and the lead terminal 2. As shown in FIG.

[0042] The difference from the jet nozzle 6 of embodiment 1 shown in Figure 4 is that one side wall along the longitudinal direction of the jet nozzle 6C has multiple notches along the longitudinal direction, including a central notch 43 in the center of the longitudinal direction and notches 41 on both sides of it, and the other side wall has multiple notches 42, and notches 5 are also provided on the two side walls parallel to the short side direction.

[0043] The central notch 43 provided in one side wall of the jet nozzle 6C is wider and shorter than the notches 41 provided on both sides thereof and the notch 42 provided in the other side wall. For this reason, the notches 41 and 42 are sometimes referred to as small notches.

[0044] 9, the lead terminal 2 is disposed so as to be positioned at the center in the width direction of a notch 42 provided in the other side wall of the jet nozzle 6C. The central notch 43 and notch 41 provided in one side wall of the jet nozzle 6C are provided so as to roughly correspond to the area between adjacent lead terminals 2, and are provided so as to cover the space between the notches 42 provided in the other side wall of the jet nozzle 6C. As a result, the notch 42 provided in the other side wall of the jet nozzle 6C is used for soldering the lead terminal 2 and the circuit board 3, and the central notch 43 provided in one side wall of the jet nozzle 6C is used for ejecting debris.

[0045] In particular, debris tends to occur in large quantities near the center where solder is ejected from the jet nozzle 6C, and large debris may form. For this reason, by increasing the width of the central notch 43 in the longitudinal center of the jet nozzle 6C, it is possible to eject large debris.

[0046] Here, the width of central notch 43 is made large and the length is made small, giving it the same opening area as two of the notches 42 provided on the other side wall of jet nozzle 6C. This makes the solder flow rate from central notch 43 the same as the solder flow rate from the two notches 42, achieving a balance in flow rates on both side walls of jet nozzle 6C and enabling both soldering and debris removal. Note that the opening area of ​​central notch 43 is not limited to two notches 42, and the same effect can be achieved by making the opening area of ​​central notch 43 the same for multiple notches 42.

[0047] In this way, in the jet nozzle 6C of embodiment 4, one side wall is provided with a central notch 43 with a large opening area, and the other side wall is provided with multiple notches 42 with small opening areas, and by making the opening area of ​​the central notch 43 the same as that of the multiple small notches 42, the solder flow rate from the central notch 43 and the solder flow rate from the multiple notches 42 are made the same, and the flow rates are balanced on both side walls of the jet nozzle 6C, making it possible to achieve both soldering and debris discharge. Also, larger debris can be discharged from the central notch 43 to the outside of the jet nozzle.

[0048] <Fifth Embodiment> FIG. 10 is a diagram showing the configuration of a jet nozzle 6D according to the fifth embodiment and its positional relationship with the circuit board 3, and FIG. 11 is a plan view showing the positional relationship between the jet nozzle 6D and the lead terminal 2. As shown in FIG.

[0049] 11, the difference from the jet nozzle 6 of embodiment 1 shown in Fig. 4 is that one side wall along the longitudinal direction of the jet nozzle 6D has a plurality of notches 45 along the longitudinal direction, and the other side wall has a plurality of notches 46, and notches 5 are also provided on the two side walls parallel to the lateral direction. Also, the lead terminals 2 are not arranged in a line at the center of the width direction of the jet nozzle 6D, but are arranged in a staggered pattern, alternately positioned off-center.

[0050] As shown in FIG. 11, the plurality of notches 45 and the plurality of notches 46 are located at different positions and are formed in a staggered arrangement when viewed from the circuit board 3 side.

[0051] The lead terminals 2 of the module 1 may be arranged in a staggered pattern to ensure an insulating distance between the terminals. The lead terminals 2 arranged in this staggered pattern are positioned away from the center of the jet nozzle 6D in the width direction, and are therefore closer to the side wall of the jet nozzle 6D. By providing a notch 45 or a notch 46 in the side wall of the jet nozzle 6D closer to the lead terminals 2, the solder flowing from the notch 45 or the notch 46 can come into contact with the surface of the lead terminals 2.

[0052] Furthermore, since the lead terminal 2 is close to the notch 45 or the notch 46, the solder comes into contact with the lead terminal at a high flow rate, thereby shortening the soldering time. Furthermore, by providing the notches 45 and the notches 46 in a staggered arrangement, it is possible to generate a solder flow oblique to the side wall of the jet nozzle 6D, eliminating stagnation in the flow and facilitating the movement of debris.

[0053] In this way, in the jet nozzle 6D of the fifth embodiment, by forming the notches 45 and 46 in a staggered arrangement to match the staggered arrangement of the lead terminals 2, the solder can contact the lead terminals 2 at a high flow rate, thereby shortening the soldering time. Also, by arranging the notches 45 and 46 in a staggered arrangement, the solder also flows in oblique directions relative to the side wall of the jet nozzle 6D, making it easier for debris to move.

[0054] <Sixth Embodiment> FIG. 12 is a plan view showing the positional relationship between a jet nozzle 6E and a lead terminal 2 according to the sixth embodiment.

[0055] As shown in FIG. 12, the jet nozzle 6E has one side wall (first side wall) along the longitudinal direction of the jet nozzle 6E and the other side wall (second side wall) that have different shapes. One side wall has multiple recesses 14 recessed in the lateral direction. The portion of the jet nozzle sandwiched between the recesses 14 is convex in plan view, and the side wall of the convex portion has notches 51 extending in the lateral direction. Note that the portion of one side wall along the longitudinal direction, i.e., the portion not forming the notches 14, has multiple notches 44 extending in the longitudinal direction. In other words, one side wall along the longitudinal direction of the jet nozzle 6E has multiple notches 44 and multiple notches 51 extending along the contour of the side wall. Furthermore, the other side wall has multiple notches 44 extending in the longitudinal direction. Furthermore, notches 5 are provided in two side walls (third side wall and fourth side wall) parallel to the short side direction of the jet nozzle 6D.

[0056] Furthermore, lead terminals 21 and 22 are arranged in a row at the center of the width of the jet nozzle 6E, with lead terminal 21 being arranged on the convex portion and lead terminal 22 being arranged in an area where the jet nozzle recess 14 is not provided and at the nozzle end separated by the jet nozzle recess 14.

[0057] Generally, a conductor pattern is formed inside the module 1, and lead terminals connected to the conductor pattern protrude to the outside of the module. Heat-generating components such as chip components are mounted on this conductor pattern, and the heat generated by the components is transferred and cooled by the conductor pattern. Therefore, even within the same module, the width of the conductor pattern may vary depending on the amount of heat generated. Therefore, even if the width of the lead terminal is the same, if the width of the connected conductor pattern is large, the heat capacity is large and the temperature of the lead terminal is less likely to rise during soldering. On the other hand, if the width of the conductor pattern is small, the heat capacity is small and the temperature of the lead terminal is more likely to rise during soldering.

[0058] 12 is a terminal having a large width of a conductor pattern to be connected, and lead terminal 22 is a terminal having a small width of a conductor pattern to be connected. Therefore, if lead terminal 21 and lead terminal 22 are soldered for a soldering time that is matched to lead terminal 21, which is less likely to heat up, lead terminal 22 will be exposed to a higher temperature than necessary, causing the copper pattern of circuit board 3 to melt and resulting in poor soldering. On the other hand, if the soldering time is the same as that for lead terminal 22, which is more likely to heat up, lead terminal 21, which is less likely to heat up, will not heat up enough, resulting in poor soldering.

[0059] On the other hand, in the jet nozzle 6E of embodiment 6, the circuit board 3 is positioned so that the lead terminal 21 connected to the conductor pattern with a large heat capacity is placed in the convex portion defined by the depression 14 of the jet nozzle, so that in the convex portion, the lead terminal 21 faces not only the two-way notch 44 but also the two-way notch 51.

[0060] This allows the solder to flow from four directions and come into contact with the surface of the lead terminal 21. Furthermore, the local solder flow speed from four directions can be increased, which increases the temperature of the lead terminal 21 and the temperature of the circuit board 3, shortening the soldering time.

[0061] Therefore, the temperature rise of the lead terminal 21 connected to the conductor pattern with a large heat capacity and the temperature rise of the lead terminal 22 connected to the conductor pattern with a small heat capacity can be adjusted to the same level, and good soldering can be performed all at once even for lead terminals connected to patterns with different heat capacities.

[0062] Furthermore, in this embodiment, a configuration in which notches are provided in four directions around the lead terminal 21 is shown, but in the case of a lead terminal connected to a conductor pattern whose heat capacity is smaller than that of the conductor pattern connected to the lead terminal 21 and larger than that of the conductor pattern connected to the lead terminal 21, the same effect can be obtained by arranging it in a portion with notches in three directions, as in the nozzle end of the jet nozzle 6E shown in Figure 12.

[0063] Furthermore, the lead terminal can be positioned at the center in the width direction of the jet nozzle 6E, where the solder flow becomes uniform.

[0064] <Seventh Embodiment> FIG. 13 is a diagram showing the configuration of a jet nozzle 6F according to the seventh embodiment and the positional relationship with the circuit board 3. As shown in FIG.

[0065] As shown in Figure 13, the jet nozzle 6F has notches 47 and 48 on one side wall along the longitudinal direction of the jet nozzle 6F, the notches having widths corresponding to the terminal widths of the lead terminals protruding from the module 1.

[0066] Generally, the width of the lead terminals of a module is determined by the current that flows through them. In the example of Figure 13, module 1 has lead terminal 2A with a small current flowing through it, lead terminal 2B with a large current flowing through it, and lead terminal 2C with a current flowing through it that is intermediate between lead terminals 2A and 2C, with lead terminal 2A having the smallest width, lead terminal 2B having the largest width, and lead terminal 2C having a width that is approximately intermediate between lead terminals 2A and 2B.

[0067] Lead terminal 2A, which has the smallest terminal width, has a small heat capacity, so no notch is provided in the corresponding position of jet nozzle 6F. On the other hand, lead terminal 2B, which has the largest terminal width, has a large heat capacity, so notch 47, which has the largest notch width, is provided in the corresponding position of jet nozzle 6F. Furthermore, lead terminal 2C has a smaller terminal width than lead terminal 2B, so notch 48, which is smaller in width than lead terminal 2B, is provided in the corresponding position of jet nozzle 6F. This makes it possible to adjust the temperature rise of lead terminals with different heat capacities to the same level, allowing for good batch soldering.

[0068] Similarly, notches 47 and 48 can be provided on the other side wall along the longitudinal direction of the jet nozzle 6E.

[0069] In this way, in the jet nozzle 6F of embodiment 7, by providing notches with notch widths corresponding to the terminal widths of multiple types of lead terminals, even if the heat capacities of the lead terminals differ due to differences in the terminal widths of the lead terminals of module 1, the temperature rise of the lead terminals can be adjusted to the same level, making it possible to perform good soldering on lead terminals with different heat capacities all at once.

[0070] <Embodiment 8> FIG. 14 is a diagram showing the configuration of a jet nozzle 6G according to the seventh embodiment and the positional relationship with the circuit board 3. In FIG.

[0071] As shown in Figure 14, the jet nozzle 6G has multiple notches 49 in an inverted trapezoidal shape in a planar view, on one side wall along the longitudinal direction of the jet nozzle 6G, with the notch width on the upper side facing the circuit board 3 being larger and the notch width on the lower side being smaller.

[0072] The notch length, upper notch width, and lower notch width are set so that notch 49 has the same opening area as rectangular notch 4 in plan view, for example, as shown in Fig. 4. In this way, notch 49 has the same opening area as a rectangular notch in plan view, so the solder flow rate is the same and the upper opening can be made larger, making it possible to discharge large debris to the outside of jet nozzle 6G.

[0073] The planar shape of the notch 49 can also be semicircular or elliptical. If the planar shape is an inverted trapezoid, the notch 49 is formed by cutting using a laser or the like, but if the shape is semicircular or elliptical, punching can also be used, simplifying the manufacturing process.

[0074] Similarly, the notch provided in the shorter direction of the jet nozzle 6G can also be formed to have an inverted trapezoidal, semicircular or elliptical shape in plan view to obtain the same effect.

[0075] In this way, in the jet nozzle 6G of embodiment 8, by changing the planar shape of the notch 49 to have the same opening area as a rectangular notch but with a larger notch width on the upper side, it is possible to discharge large debris with the same solder flow rate.

[0076] <Ninth Embodiment> Fig. 15 is a side view of the soldering apparatus according to embodiment 9 during partial soldering. In the soldering apparatus shown in Fig. 15, a lower end enlarged portion 20 is provided at the lower end of the jet nozzle 6A on the side opposite to the circuit board 3.

[0077] The bottom flared section 20 is provided to enlarge the opening at the bottom of the jet nozzle 6A, and has a flared shape with a flared angle of 45 to 60 degrees. The provision of the bottom flared section 20 allows for a larger cross-sectional area than would be possible with just the straight jet nozzle 6A, reducing pressure loss when supplying solder from the solder bath 200 and ensuring a sufficient height for the solder to be jetted even if the jet nozzle 6A has a low solder jetting capacity. In addition, the bottom flared section 20 contacts the solder dropping from the longitudinal notch 4 and the lateral notch 5 of the jet nozzle 6A and diagonally deflects the solder, preventing solder from splashing and reducing solder adhesion to the circuit board 3.

[0078] In this way, in the soldering apparatus of embodiment 9, by providing bottom enlarged portion 20 at the bottom end of jet nozzle 6A, pressure loss during solder supply is reduced and the solder can be jetted to a sufficient height even if the solder jetting capacity of jet nozzle 6A is small. Furthermore, the solder dropping from the notch comes into contact with bottom enlarged portion 20 and is deflected at an angle, preventing solder from splashing and reducing solder adhesion to circuit board 3. [Explanation of symbols]

[0079] 2, 2A, 2B, 2C lead terminals, 3 circuit board, 4, 5, 41 to 49, 51 notches, 6, 6A to 6G jet nozzle, 7 molten solder, 14 recess, 20 lower end enlarged portion, 200 solder bath.

Claims

1. A soldering device for soldering a plurality of lead terminals of an electronic component to a circuit board, comprising: a solder bath containing molten solder; a circulation mechanism for circulating the molten solder; a jet nozzle that receives the molten solder from the circulation mechanism and ejects the molten solder into a jet, The jet nozzle is a plurality of side walls defining an opening through which the molten solder is ejected; the circuit board, on which the electronic component is mounted so that the lead terminals pass through, is placed above the opening, and at least one of the side walls among the plurality of side walls has at least one notch, the notch width and notch length of which are greater than the lead terminal width and length, at a position where the lead terminals face the at least one side wall when the lead terminals are inserted into the opening; The opening has a rectangular shape in a plan view, The plurality of side walls are first and second longitudinal sidewalls of the opening; a third side wall and a fourth side wall in a lateral direction of the opening, The jet nozzle is Among the plurality of side walls, The first side wall has a plurality of first notches provided along the longitudinal direction, the third side wall and the fourth side wall have a third notch and a fourth notch respectively provided along the short-side direction; the second side wall has a plurality of second notches provided along the longitudinal direction; The plurality of first notches provided in the first side wall of the jet nozzle include: a central notch and two small notches provided on both sides of the central notch; each of the plurality of second notches has the same opening area as each of the two small notches; A soldering device in which the central notch has a larger notch width and a smaller notch length than each of the two small notches and each of the plurality of second notches, and its opening area is the same as the opening area of ​​the plurality of second notches at a position facing the central notch.

2. A soldering device for soldering a plurality of lead terminals of an electronic component to a circuit board, comprising: a solder bath containing molten solder; a circulation mechanism for circulating the molten solder; a jet nozzle that receives the molten solder from the circulation mechanism and ejects the molten solder into a jet, The jet nozzle is a plurality of side walls defining an opening through which the molten solder is ejected; the circuit board, on which the electronic component is mounted so that the lead terminals pass through, is placed above the opening, and at least one of the side walls among the plurality of side walls has at least one notch, the notch width and notch length of which are greater than the lead terminal width and length, at a position where the lead terminals face the at least one side wall when the lead terminals are inserted into the opening; The opening has a rectangular shape in a plan view, The plurality of side walls are first and second longitudinal sidewalls of the opening; a third side wall and a fourth side wall in a lateral direction of the opening, The jet nozzle is Among the plurality of side walls, The first side wall has a plurality of first notches provided along the longitudinal direction, The plurality of lead terminals are It has multiple types of lead terminals with different terminal widths, the plurality of first notches provided on at least the first side wall of the jet nozzle have notch widths that match terminal widths of the plurality of types of lead terminals.

3. The jet nozzle is 3. The soldering device according to claim 1, wherein each of the plurality of first notches provided on at least the first side wall has a notch shape in which the notch width is larger on the upper side facing the circuit board and smaller on the lower side.

4. a lower end enlarged portion provided at a lower end of the jet nozzle opposite to the circuit board and enlarging an opening at the lower end; 3. The soldering apparatus according to claim 1, wherein the bottom enlarged portion has a shape that flares out at an angle of 45 degrees to 60 degrees.

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