Manufacturing apparatus and method for electronic components

Abstract

To provide an electronic component manufacturing device with which pores hardly occur in a paste adhered to a component when the component is immersed in the paste.SOLUTION: A manufacturing device 1 comprises: a holding tool 3 which has an open hole 15 the inner surface of which is coated with an elastically deformable resin, and into which a component is inserted; a pin 4 having a tip surface that contacts the component; pin drive means 6 for moving the pin 4 so that the tip surface of the pin 4 touches the component and pushing the component out of the open hole 15 to protrude by the pin 4; a container 7 in which a paste 18 to be adhered to the component is stored; and drive means 8 capable of moving one or both of the holding tool 3 and the container 7 in a direction in which the component inserted into the open hole 15 of the holding tool 3 approaches or separates from the liquid surface of the paste 18 in the container 7. The tip surface of the pin 4 is inclined with respect to the axial direction of the pin 4.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an apparatus and method for manufacturing electronic components. [Background technology]

[0002] Conventionally, when manufacturing electronic components such as multilayer ceramic capacitors, there is a step of immersing components without external electrodes in a paste. For example, Patent Document 1 below discloses a manufacturing method including a first dipping step in which a dielectric element body held by an elastic holder is immersed in a conductive paste layer held on a dipping device. In the first dipping step, the elastic holder holding the dielectric element body is lowered, thereby immersing the dielectric element body in the conductive paste layer on the dipping device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-69827 Summary of the Invention [Problem to be solved by the invention]

[0004] In the manufacturing method described in Patent Document 1, components without external electrodes are immersed in the paste by being lowered, which can introduce air bubbles into the liquid paste during immersion. If air bubbles are present in the paste attached to the component, they can form tiny pores in the external electrodes when the component with the paste attached is fired. If pores are formed in the external electrodes, this can have a negative impact on the reliability of the electronic component, and the pores can burst due to the heat of flow or reflow soldering during solder mounting, causing the solder to scatter around.

[0005] The present invention has been made in consideration of these problems, and aims to provide an apparatus and method for manufacturing electronic components that are less likely to produce pores in the paste attached to the components when the components are immersed in the paste. [Means for solving the problem]

[0006] The electronic component manufacturing apparatus of the present invention comprises a holder having a through hole whose inner surface is coated with an elastically deformable resin and into which a component is inserted; a pin having a tip surface that contacts the component; a pin driving means that moves the pin so that the tip surface of the pin contacts the component, causing the pin to push and protrude the component from the through hole; a container that stores paste to be attached to the component; and a driving means that can move one or both of the holder and the container in a direction that moves the component inserted into the through hole of the holder toward or away from the liquid surface of the paste in the container, wherein the tip surface of the pin is an inclined surface that is inclined with respect to the axial direction of the pin.

[0007] The method for manufacturing an electronic component of the present invention includes an insertion step of inserting a component into a through hole of a holder having a through hole whose inner surface is coated with an elastically deformable resin and causing the component to protrude from the through hole using a pin, and an immersion step of immersing the portion of the component inserted into the through hole in a state protruding from the through hole in paste stored in a container, wherein the pin has a tip surface that contacts the component, and the tip surface is an inclined surface that is inclined with respect to the axial direction of the pin. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an apparatus and method for manufacturing electronic components that are less likely to produce pores in the paste attached to the components when the components are immersed in the paste. [Brief explanation of the drawings]

[0009] [Figure 1]1 is a perspective view showing a schematic configuration of an electronic component manufacturing apparatus according to an embodiment of the present invention; [Figure 2] 1 is a partially enlarged vertical cross-sectional view showing the state in which an electronic component manufacturing apparatus according to an embodiment of the present invention is in use, showing a state in which a component is held by a transfer tool. [Figure 3] 1 is a partially enlarged vertical cross-sectional view showing a state in which an electronic component manufacturing apparatus according to an embodiment of the present invention is in use, showing a state in which components are inserted into a holder. [Figure 4] 1 is a partially enlarged vertical cross-sectional view showing a state in which an electronic component manufacturing apparatus according to an embodiment of the present invention is in use, illustrating a state in which a component is immersed in paste. [Figure 5] 1 is a partially enlarged vertical cross-sectional view showing a state in which an electronic component manufacturing apparatus according to an embodiment of the present invention is in use, showing a state in which paste has been applied to a component. [Figure 6] 1 is a partially enlarged vertical cross-sectional view showing a state in which an electronic component manufacturing apparatus according to an embodiment of the present invention is in use, illustrating a state in which a component is transferred from one holding unit to another holding unit. [Figure 7] 10 is a partially enlarged vertical cross-sectional view showing the electronic component manufacturing apparatus according to an embodiment of the present invention in use, with a component held in another holding section. FIG. [Figure 8] 1 is a partially enlarged vertical cross-sectional view showing the electronic component manufacturing apparatus according to an embodiment of the present invention in use, illustrating a state in which a component held in another holder is immersed in paste. FIG. [Figure 9] 1 is a partially enlarged vertical cross-sectional view showing the state in which the electronic component manufacturing apparatus according to one embodiment of the present invention is in use, showing the state in which paste is applied to a component held in another holding section. [Figure 10] 10 is a partially enlarged vertical cross-sectional view showing another state of use of the electronic component manufacturing apparatus according to one embodiment of the present invention, showing a state in which a component is held by the transfer tool. FIG. [Figure 11] 1 is a flowchart showing a typical example of a method for manufacturing an electronic component according to an embodiment of the present invention. [Figure 12] FIG. 1 is a schematic perspective view of an electronic component. [Figure 13]13 is a cross-sectional view taken along the line AA in FIG. 12. [Figure 14] 6 is a partially enlarged vertical cross-sectional view showing another state of use of the electronic component manufacturing apparatus according to one embodiment of the present invention, in which the holding unit is rotated from the state shown in FIG. 5. [Figure 15] 15 is a partially enlarged vertical cross-sectional view showing another state of use of the electronic component manufacturing apparatus according to one embodiment of the present invention, in which the component is protruded from the state shown in FIG. 14. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

[0011] FIG. 1 is a perspective view showing a schematic configuration of an electronic component manufacturing apparatus according to one embodiment of the present invention. FIGS. 2 to 9 are partially enlarged vertical cross-sectional views showing the use state of an electronic component manufacturing apparatus according to one embodiment of the present invention in chronological order. An electronic component manufactured by electronic component manufacturing apparatus 1 of this embodiment is, for example, a multilayer ceramic capacitor. Electronic component manufacturing apparatus 1 of this embodiment includes a transfer tool 2, a holder 3, pins 4, a pin holding unit 5, pin drive means 6, a container 7, and drive means 8. These will be described in order below.

[0012] The transfer tool 2 is a roughly rectangular plate-like object when viewed from above, and is positioned with the plate surface facing up and down. The transfer tool 2 has a through hole 9 that penetrates in the thickness direction. The through hole 9 is a stepped hole, with a large diameter hole 10 located at the top and a small diameter hole 11 located at the bottom. Typically, the large diameter hole 10 and the small diameter hole 11 are circular when viewed from above. In this embodiment, the transfer tool 2 has multiple through holes 9. In the illustrated example, the transfer tool 2 has multiple groups of multiple through holes 9 arranged along the longitudinal direction. In other words, the multiple through holes 9 are arranged in a lattice pattern.

[0013] A component 12 is accommodated in the large-diameter hole 10 of the transfer tool 2. To accommodate the component 12 in the large-diameter hole 10, multiple components 12 are placed on the top surface of the transfer tool 2, and the transfer tool 2 is vibrated or tilted. If the electronic component to be manufactured is a multilayer ceramic capacitor, the component 12 accommodated in the large-diameter hole 10 is an electronic component without external electrodes formed thereon. The component 12 is rectangular. The diameter of the opening of the large-diameter hole 10 is smaller than the longitudinal dimension of the component 12. Therefore, when the component 12 is accommodated in the large-diameter hole 10, the longitudinal direction of the component 12 is aligned with the axial direction of the large-diameter hole 10. Furthermore, it is preferable that the depth of the large-diameter hole 10 be greater than the longitudinal dimension of the component 12.

[0014] In the illustrated example, the large diameter hole 10 has a circular shape when viewed from above, but this is not limited thereto and may have, for example, a generally rectangular shape when viewed from above. Although not illustrated, the inner circumferential surface of the upper end of the large diameter hole 10 may have a tapered shape that increases in diameter as it goes upward. This makes it easier to insert the component 12 into the large diameter hole 10. In this embodiment, the component 12 is inserted into the large diameter hole 10 by moving the transfer tool 2, but the component 12 may also be inserted into the large diameter hole 10 by vacuum suction through the small diameter hole 11.

[0015] The holder 3 has a plate-shaped base 13 and a resin 14 covering the base 13. The base 13 is a metal plate having a generally rectangular shape when viewed from above, and is positioned with the plate surfaces facing up and down. The base 13 is not limited to being made of metal. The base 13 has a through hole 15 penetrating in the thickness direction. Typically, the through hole 15 has a generally rectangular shape when viewed from above. In this embodiment, the base 13 has a plurality of through holes 15. In the illustrated example, the base 13 has a plurality of groups in which a plurality of through holes 15 are arranged along the longitudinal direction. That is, the plurality of through holes 15 are arranged in a lattice pattern. The resin 14 is provided on the base 13 so as to cover the outer surface of the base 13 and the inner surfaces of the through holes 15. Note that the resin 14 may cover only the inner surfaces of the through holes 15. The resin 14 is elastically deformable. The resin 14 is, for example, a silicone resin. As described above, the holder 3 has a through hole 15 whose inner surface is coated with elastically deformable resin 14. The component 12 is inserted into the through hole 15 from the transfer tool 2. In this embodiment, since the base 13 has a plurality of through holes 15, the holder 3 has a plurality of through holes 15 into which each of the plurality of components 12 is inserted.

[0016] The pin 4 pushes the component 12 out of the through-hole 15 of the holder 3, causing it to protrude. Typically, the pin 4 is rod-shaped. The pin 4 is a round bar with a circular cross section. The pin 4 has a tip surface 16 that comes into contact with the component 12 when the component 12 is protruded from the through-hole 15 of the holder 3. The tip surface 16 of the pin 4 is located at one end side in the axial direction of the pin 4. The tip surface 16 of the pin 4 is an inclined surface that is inclined with respect to the axial direction of the pin 4. As shown in FIG. 2 , the angle α formed between the tip surface 16 of the pin 4 and a surface 17 perpendicular to the axial direction, which is the direction in which the pin 4 extends, is 0.3° to 10°. Note that the angle α is not limited to 0.3° to 10°.

[0017] In this embodiment, the manufacturing apparatus 1 includes a plurality of pins 4. The plurality of pins 4 are held in the pin holding portion 5 in an upright state with their axial directions aligned in the vertical direction. The other axial end of each pin 4 is held in the pin holding portion 5. In the illustrated example, the pin holding portion 5 is provided with a plurality of groups of pins 4 arranged along the longitudinal direction of the pin holding portion 5. That is, the plurality of pins 4 are arranged in the pin holding portion 5 in a lattice pattern.

[0018] Each pin 4 is preferably in a so-called free state, in which it can rotate around its axis while held by the pin holding unit 5 without the application of an active force. The pins 4 can rotate when a force is applied indirectly. Each pin 4 can rotate independently. In this case, the pin holding unit 5 has multiple pins 4 whose tip surfaces 16 face in different directions as the pins 4 rotate. For example, as shown in FIG. 10 , the tip surfaces 16 of adjacent pins 4 face in different directions in the pin holding unit 5. The pins 4 can be rotated by minute vibrations of the equipment, which can randomly change the directions of the tip surfaces 16 of the multiple pins 4 held by the pin holding unit 5. Note that the pins 4 may also be rotated by actively applying a force to them. That is, the pins 4 can be rotated by directly applying a force to them.

[0019] The pin driving means 6 is a means for moving the pins 4 in a direction in which the pins 4 approach or move away from the component 12 held by the transfer tool 2. Typically, the pin driving means 6 is a motor. In this embodiment, multiple pins 4 are held by the pin holding unit 5, and therefore the pin driving means 6 is connected to the pin holding unit 5. As a result, by moving the pin holding unit 5, the pin driving means 6 can move the pins 4 in a direction in which the pins 4 approach the component 12 held by the transfer tool 2, thereby pressing the pins 4 against the component 12, or move the pins 4 in a direction in which the pins 4 move away from the component 12 held by the transfer tool 2. Therefore, the pin driving means 6 can move the pins 4 relative to the component 12 held by the transfer tool 2 so as to transfer the component 12 to the holder 3 by the pins 4.

[0020] In this embodiment, the electronic component manufactured by the manufacturing apparatus 1 is a multilayer ceramic capacitor. When the electronic component is a multilayer ceramic capacitor, the electronic component has external electrodes and internal electrodes. The external electrodes have a three-layer structure including a base electrode layer, a conductive resin layer covering the base electrode layer, and a plating layer covering the conductive resin layer. The external electrodes are provided at both longitudinal ends of the component 12. The internal electrodes are located inside the component 12. Details of the electronic component, which is a multilayer ceramic capacitor, will be described later.

[0021] The container 7 stores the paste 18 to be applied to the component 12. In the illustrated example, the container 7 is a box-like shape that is generally rectangular when viewed from above and opens upward. Therefore, the liquid surface of the paste 18 stored in the container 7 is exposed to the outside. The paste 18 stored in the container 7 has a given viscosity. The paste 18 stored in the container 7 forms, for example, a base electrode layer of an external electrode. In this case, the paste 18 is a conductive paste containing glass and a conductive metal. The glass in the conductive paste contains, for example, Si. The conductive metal in the conductive paste contains at least one selected from Cu, Ni, Ag, Pd, an Ag-Pd alloy, Au, etc.

[0022] In this way, the base electrode layer of the external electrode is formed by the paste 18 stored in the container 7. The conductive resin layer of the external electrode may contain conductive particles and a thermosetting resin. The plating layer of the external electrode is made of at least one metal selected from Cu, Ni, Ag, Pd, an Ag-Pd alloy, Au, etc. The base electrode layer and the conductive resin layer may be composed of multiple layers. The plating layer may be composed of multiple layers. Preferably, the plating layer has a two-layer structure including a Ni plating layer and a Sn plating layer. The Ni plating layer can prevent the base electrode layer from being eroded by solder when mounting electronic components. The Sn plating layer improves the wettability of solder when mounting electronic components, making it easier to mount electronic components.

[0023] The external electrodes configured as described above are fired together with the component 12 after the internal electrodes have been fired. Note that after the external electrodes are formed on the component 12, the component 12 and the external electrodes may be fired simultaneously with the internal electrodes.

[0024] The driving means 8 is a means for moving the holder 3 in a direction in which the component 12 inserted in the through hole 15 of the holder 3 approaches or moves away from the liquid surface of the paste 18 in the container 7. For this reason, the driving means 8 is connected to the holder 3. The driving means 8 may be a means for moving the container 7 in a direction in which the component 12 inserted in the through hole 15 of the holder 3 approaches or moves away from the liquid surface of the paste 18 in the container 7. In this case, the driving means 8 is connected to the container 7. The driving means 8 may be a means for moving both the holder 3 and the container 7 in a direction in which the component 12 inserted in the through hole 15 of the holder 3 approaches or moves away from the liquid surface of the paste 18 in the container 7. In this case, the driving means 8 may be connected to each of the holder 3 and the container 7, or a common driving means 8 may be connected to the holder 3 and the container 7. Therefore, the driving means 8 can move the component 12 in a direction approaching the liquid surface of the paste 18, thereby immersing the component 12 in the paste 18, or move the component 12 in a direction away from the liquid surface of the paste 18. The driving means 8 is, for example, a servo motor or a stepping motor.

[0025] Next, a method for manufacturing an electronic component according to this embodiment will be described. FIGS. 2 to 9 are diagrams showing a time series of a method for manufacturing an electronic component according to one embodiment of the present invention. FIG. 11 is a flowchart showing a typical example of a method for manufacturing an electronic component according to one embodiment of the present invention. This manufacturing method is used, for example, when manufacturing an electronic component such as a multilayer ceramic capacitor. FIGS. 12 and 13 are diagrams showing a multilayer ceramic capacitor as an electronic component, with FIG. 12 being a schematic perspective view and FIG. 13 being a cross-sectional view taken along line AA in FIG. 12. The multilayer ceramic capacitor 19 has internal electrodes 21 and 22 arranged within a ceramic laminate 20 such that adjacent internal electrodes 21 and 22 partially face each other via a ceramic layer. An external electrode 23 connected to the internal electrode 21 is formed on one end surface of the ceramic laminate 20. An external electrode 24 connected to the internal electrode 22 is formed on the other end surface of the ceramic laminate 20.

[0026] The manufacturing method of this embodiment is used when forming the external electrodes of the multilayer ceramic capacitor 19 having such a configuration. The manufacturing method of this embodiment uses the above-described manufacturing apparatus 1. The ceramic laminate 20 of the multilayer ceramic capacitor 19 is formed by a conventionally known method.

[0027] The ceramic laminate 20 has layers made of a dielectric material. The dielectric material is a dielectric ceramic containing components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. The dielectric material may be made by adding a secondary component such as a Mn compound, an Fe compound, a Cr compound, a Co compound, or an Ni compound to these main components. The secondary component is contained in a smaller amount than the main component. Internal electrodes are provided inside the ceramic laminate 20. The internal electrodes contain metals such as Cu, Ni, Ag, Pd, Ag-Pd alloy, or Au. The internal electrodes may contain dielectric particles of the same composition as the ceramic contained in the layers made of the dielectric material.

[0028] As shown in FIG. 11 , in the manufacturing method of this embodiment, a transfer step S1, an insertion step S2, a dipping step S3, a first drying step S4, a transfer step S5, a reverse-side dipping step S6, and a second drying step S7 are performed in this order. Note that before the transfer step S1, a component 12 is formed. The component 12 is in a state before external electrodes are formed, and is therefore formed by a conventionally known method. The component 12 is a ceramic laminate 20. The component 12 has a rectangular parallelepiped shape. The length of the component 12 is 1.6 mm to 3.2 mm, the width of the component 12 is 0.8 mm to 2.5 mm, and the thickness of the component 12 is 0.8 mm to 2.5 mm. Note that the size of the component 12 is not limited thereto. The component 12 may be in a fired state or a pre-fired state.

[0029] The transfer step S1 is a step of placing components 12 inside the transfer tool 2. Specifically, the transfer step S1 is a step of placing components 12 in the large diameter hole 10 of the transfer tool 2. In the transfer step S1, with a plurality of components 12 placed on the upper surface of the transfer tool 2, the transfer tool 2 is vibrated or tilted, thereby placing the components 12 in the large diameter hole 10 of the transfer tool 2. In this case, a means for vibrating the transfer tool 2 and a means for tilting the transfer tool 2 are connected to the transfer tool 2. In the transfer step S1, the components 12 may be placed in the large diameter hole 10 by vacuum suction through the small diameter hole 11 of the transfer tool 2. In this case, a vacuum suction means such as a vacuum pump is connected to the transfer tool 2.

[0030] The insertion step S2 is a step of inserting the component 12 accommodated in the large diameter hole 10 in the transfer step S1 into the through hole 15 of the holder 3 and protruding the component 12 from the through hole 15. In the insertion step S2, as shown in FIG. 2, the holder 3 is placed on top of the transfer tool 2. To place the holder 3 on the transfer tool 2, the drive means 8 is used to move the holder 3 up to the transfer tool 2. When the holder 3 is placed on top of the transfer tool 2, the through hole 15 of the holder 3 and the large diameter hole 10 of the transfer tool 2 are vertically overlapping.

[0031] With the holder 3 placed over the transfer tool 2, as shown in FIG. 2, the pin 4 is moved upward through the small-diameter hole 11. The pin 4 is moved by moving the pin holder 5 with the pin drive means 6. As a result, the pin 4 is moved upward with its tip surface 16 in contact with the component 12, so that the component 12 housed in the large-diameter hole 10 is pushed and inserted into the through-hole 15 of the holder 3. As shown in FIG. 3, after the component 12 is inserted into the through-hole 15, the pin 4 can be further moved upward to cause the component 12 to protrude from the upper opening of the through-hole 15. As a result, one longitudinal end of the component 12 protrudes from the through-hole 15. In this way, the pin drive means 6 moves the pin 4 so that its tip surface 16 contacts the component 12, causing the pin 4 to push and protrude the component 12 from the through-hole 15. In the insertion step S2, for example, the component 12 is inserted into the through-hole 15 and protrudes from the through-hole 15 by continuously moving the pin 4.

[0032] As described above, the manufacturing method of this embodiment uses manufacturing apparatus 1. Accordingly, in insertion step S2, pin 4 is used to insert component 12 into through hole 15 of holder 3, which has a through hole 15 whose inner surface is coated with elastically deformable resin 14, and pin 4 is used to protrude component 12 from through hole 15. Because the inner surface of through hole 15 is coated with elastically deformable resin 14, when component 12 is pushed up by pin 4, whose tip end surface 16 is an inclined surface, component 12 protruding from through hole 15 is inclined with respect to the axial direction of through hole 15.

[0033] The manufacturing method of this embodiment uses a manufacturing apparatus 1. Accordingly, a holder 3 has a plurality of through holes 15 into which a plurality of components 12 are respectively inserted. A plurality of pins 4 are held in an upright position in a pin holder 5. In this case, as shown in FIG. 10 , the pin holder 5 has a plurality of pins 4 whose tip surfaces 16 face in different directions when rotated. When components 12 are pushed up by the pins 4 attached to the pin holder 5 in this manner, the components 12 protruding from the through holes 15 each have a different tilt direction when tilted relative to the axial direction of the through holes 15. With this configuration, each time the holder 3 is used, the tilt direction of the components 12 inserted into each through hole 15 can be changed by rotating the pins 4. Therefore, the portion of the resin 14 that contacts the tilted components 12 can be changed, thereby suppressing one-sided wear of the resin 14.

[0034] The immersion step S3 is a step of applying paste 18 to component 12. Specifically, in the immersion step S3, the portion of component 12 protruding from through hole 15, of component 12 inserted into through hole 15 in a state protruding from through hole 15, is immersed in paste 18 stored in container 7. In the immersion step S3, holder 3 is moved above container 7 by drive means 8. Then, as shown in FIG. 4 , holder 3 is rotated upside down. As a result, component 12 inserted into through hole 15 of holder 3 is brought into a state of protruding downward from through hole 15. From this state, drive means 8 moves holder 3 downward so that component 12 is immersed in the liquid surface of paste 18 in container 7. As a result, one longitudinal end of component 12 is immersed in paste 18 in container 7. The immersion of component 12 in paste 18 may be performed multiple times.

[0035] In the immersion step S3, the holder 3 may be rotated upside down and then moved above the container 7. In the immersion step S3, if the drive means 8 is connected to the container 7, the container 7 may be moved below the holder 3. In this case, after rotating the holder 3 upside down, the drive means 8 moves the container 7 upward so that the component 12 is immersed in the liquid surface of the paste 18 in the container 7. As a result, one longitudinal end of the component 12 is immersed in the paste 18 in the container 7. In the immersion step S3, if both the holder 3 and the container 7 are connected to the drive means 8, the component 12 may be immersed in the paste 18 in the container 7 by moving both the holder 3 and the container 7. In the immersion step S3, the holder 3 may be positioned above the container 7, and then the component 12 may be protruded from the through-hole 15 by the pin 4.

[0036] In the insertion step S2, when inserting the component 12 from the transfer tool 2 into the through-hole 15 of the holder 3, the amount by which the pin 4 presses the component 12 may be reduced, causing the component 12 to protrude downward from the through-hole 15. In this case, in the immersion step S3, it is not necessary to rotate the holder 3 upside down.

[0037] As shown in FIG. 5 , after immersing the component 12 in the paste 18 in the container 7, the holder 3 is moved upward so that the component 12 is spaced apart from the liquid surface of the paste 18 in the container 7. This results in the paste 18 adhering to one longitudinal end of the component 12. When the component 12 is immersed in the paste 18 in the container 7, the component 12 may be pressed against the bottom 27 of the container 7. This releases the inclined state of the component 12, so that when the holder 3 is moved upward, the component 12 is aligned in the axial direction of the through-hole 15. Note that if the drive means 8 is connected to the container 7, the container 7 is moved downward. If both the holder 3 and the container 7 are connected to the drive means 8, one or both of the holder 3 and the container 7 are moved so that the component 12 is spaced apart from the liquid surface of the paste 18 in the container 7.

[0038] The first drying step S4 is a step of drying the paste 18 attached to one longitudinal end of the component 12. In the first drying step S4, the paste 18 may be dried by hot air or by irradiating it with far infrared rays.

[0039] In the transferring step S5, after the first drying step S4, the component 12 inserted in the holder 3 is transferred to another holder 25. The other holder 25 has the same configuration as the holder 3. In the transferring step S5, as shown in FIG. 6, the holder 3 is rotated upside down. That is, the holder 3 is rotated so that the portion of the component 12 to which the paste 18 is attached faces upward. The holder 3 is then moved by the driving means 8 to a position below the other holder 25. After this movement, as shown in FIG. 7, the component 12 is inserted from the through hole 15 of the holder 3 into the through hole 26 of the other holder 25 by the pin 4 of the pin holding unit 5. Specifically, the pin 4 is moved upward with the tip surface 16 of the pin 4 in contact with the other longitudinal end of the component 12. At this time, the component 12 protrudes downward from the through hole 26 of the other holder 25.

[0040] In the transfer step S5, the inner surface of through-hole 26 of another holder 25 is coated with elastically deformable resin 14, so when component 12 is pushed up by pin 4 with inclined tip surface 16, component 12 protruding from through-hole 26 is inclined with respect to the axial direction of through-hole 26. In the transfer step S5, after holder 3 with component 12 inserted therein is moved above another holder 25, component 12 may be inserted into through-hole 26 of another holder 25 by pushing component 12 from above with pin 4. At this time, component 12 is in a state of protruding downward from through-hole 26 of another holder 25.

[0041] The reverse-side immersion step S6 is a step in which the other longitudinal end of the component 12 is immersed in the paste 18. In the reverse-side immersion step S6, the other holder 25 is moved above the container 7 by the driving means 8. Then, as shown in FIG. 8 , the driving means 8 moves the other holder 25 downward so that the component 12 is immersed relative to the liquid surface of the paste 18 in the container 7. As a result, the other longitudinal end of the component 12 is immersed in the paste 18 in the container 7. In the reverse-side immersion step S6, when the other longitudinal end of the component 12 is immersed in the paste 18, the container 7 may be moved, or both the container 7 and the other holder 25 may be moved. The container 7 used in the reverse-side immersion step S6 may be the container 7 used in the immersion step S3, or it may be a different container in which the paste 18 is stored.

[0042] As shown in Figure 9, after the other holder 25 has immersed the component 12 in the paste 18 in the container 7, it is moved upward so that the component 12 is spaced apart from the liquid surface of the paste 18 in the container 7. This results in the paste 18 adhering to the other longitudinal end of the component 12. If the driving means 8 is connected to the container 7, the container 7 is moved downward. If both the other holder 25 and the container 7 are connected to the driving means 8, one or both of the other holder 25 and the container 7 are moved so that the component 12 is spaced apart from the liquid surface of the paste 18 in the container 7.

[0043] The second drying step S7 is a step of drying the paste 18 attached to the other longitudinal end of the component 12. In the second drying step S7, the paste 18 may be dried by hot air or by irradiating it with far infrared rays. After the second drying step S7, the component 12 is removed from the separate holder 25.

[0044] In this embodiment, the tip surface 16 of the pin 4 that presses the component 12 into the through hole 15 is an inclined surface that is inclined with respect to the axial direction of the pin 4. Therefore, the component 12 is inclined when inserted into the through hole 15 of the holder 3. When the component 12 is immersed in the paste 18 in an inclined state, an escape route for air is secured along the inclined surface, making it difficult for pores to form in the paste 18 that has adhered to the component 12.

[0045] In this embodiment, the holder 3 is used repeatedly. The pins 4 can freely rotate around their axes. Therefore, the orientation of the tip surfaces 16 of the pins 4 can be randomly changed due to minute vibrations of the equipment or movement of the pin holder 5. Therefore, in this embodiment, the pin holder 5 has multiple pins 4 with tip surfaces 16 facing in different directions. Therefore, according to this embodiment, the tilt direction of the component 12 inserted into the through hole 15 of the holder 3 can be randomly changed. The resin 14 of the holder 3 is gradually worn away by the component 12 when the component 12 is inserted into the through hole 15. Specifically, the portion of the resin 14 that comes into contact with the tilted component 12 is easily worn away. However, according to this embodiment, the tilt direction of the component 12 inserted into the through hole 15 of the holder 3 can be changed each time the holder 3 is used, preventing wear in only specific areas. This improves the life of the holder 3.

[0046] The present invention is not limited to the above-described embodiment, and includes modifications and improvements within the scope of achieving the object of the present invention.

[0047] 14 and 15 are time-sequential diagrams illustrating a method for manufacturing an electronic component according to another embodiment of the present invention. In this modification, after applying paste 18 to one longitudinal end of component 12, holder 3 is rotated upside down. That is, holder 3 is rotated so that the portion of component 12 to which paste 18 is applied faces upward. Then, component 12 inserted into through hole 15 of holder 3 is pushed downward by pin 4 held by pin holder 5. This causes component 12 to protrude downward from through hole 15 of holder 3. That is, the other longitudinal end of component 12 protrudes. By causing component 12 to protrude downward by pin 4, the other longitudinal end of component 12 is immersed in paste 18 in container 7. The pin 4 used here may be the pin 4 used when component 12 is inserted into through hole 15 of holder 3, or it may be a separately prepared pin. In addition, after the component 12 is in a state where it protrudes downward from the through hole 15 of the holder 3, the holder 3 may be moved downward so that the other longitudinal end of the component 12 is immersed in the paste 18 in the container 7.

[0048] In the above embodiment, by reducing the thickness of holder 3, both longitudinal ends of component 12 can protrude from through hole 15 when component 12 is inserted into through hole 15. In this case, when applying paste 18 to one longitudinal end of component 12, it is not necessary to rotate holder 3 upside down.

[0049] In the above embodiment, the pins 4 are rotatable, but they may be non-rotatable. That is, the pins 4 may be non-rotatably attached to the pin holder 5. In this case, the pin holder 5 preferably has multiple pins 4 with tip surfaces 16 facing in different directions. If the pins 4 are non-rotatable, it is preferable to prepare multiple types of pin holders 5 with tip surfaces 16 facing in different directions. This allows the tilt direction of the components 12 inserted into each through hole 15 to be changed by using a pin holder 5 selected from the multiple types of pin holders 5 each time the holder 3 is used repeatedly. Therefore, the portion of the resin 14 that contacts the tilted components 12 can be changed, thereby suppressing one-sided wear of the resin 14. [Explanation of symbols]

[0050] 1. Electronic component manufacturing equipment 3 Holder 4-pin 5 Pin holder 7 Container 8. Driving means 12 parts 14 Resin 15 through holes 16 Tip surface 18 Paste

Claims

1. a holder having a through hole whose inner surface is coated with an elastically deformable resin, and into which a component is inserted; a pin having a tip surface that contacts the component; a pin driving means for moving the pin so that the tip end surface of the pin comes into contact with the component, thereby causing the pin to push the component out of the through hole; a container for storing a paste to be applied to the component; a driving means for moving one or both of the holder and the container in a direction in which the component inserted into the through hole of the holder approaches or moves away from the liquid surface of the paste in the container, The electronic component manufacturing apparatus, wherein the tip surface of the pin is an inclined surface inclined with respect to the axial direction of the pin.

2. 2. The electronic component manufacturing apparatus according to claim 1, wherein the pin is rotatable about its axis.

3. a pin holding portion that holds the plurality of pins in an upright state, the holder has a plurality of through holes into which the plurality of components are respectively inserted, 3. The electronic component manufacturing apparatus according to claim 2, wherein the pin holding section has a plurality of the pins, the tip surfaces of which face in different directions.

4. 4. The electronic component manufacturing apparatus according to claim 1, wherein an angle formed between a plane perpendicular to the axial direction and the tip surface of the pin is 0.3° to 10°.

5. an insertion step of inserting a component into a through hole of a holder having an inner surface coated with an elastically deformable resin, and protruding the component from the through hole by a pin; a dipping step of dipping a portion of the component, which is inserted into the through hole in a state where the portion protrudes from the through hole, into paste stored in a container, The pin has a tip surface that contacts the component, and the tip surface is an inclined surface that is inclined with respect to the axial direction of the pin.

6. the holder has a plurality of through holes into which the plurality of components are respectively inserted, The pins are plural, The plurality of pins are held in an upright state by a pin holding portion, The method for manufacturing an electronic component according to claim 5 , wherein the pin holding portion has a plurality of the pins, the tip surfaces of which face in different directions.

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