Package structure and manufacturing method thereof

Abstract

To provide a packaging structure and a manufacturing method of them.SOLUTION: A manufacturing method of a packaging structure, comprises: a step of providing a lead frame; a step of making a first mask layer, the lead frame, and a second mask layer to be a lamination structure together by forming the first mask layer onto an upper surface of the lead frame, and the second mask layer onto a lower surface of the lead frame; a step of projecting at least one of penetration holes to the lamination structure by performing a patterning process against the lamination structure; a step of performing a sand blast process to the penetration hole, and forming a rough structure surface in the penetration hole; and a step of removing the first and second mask layers after the performing of the sand blast of the layer structure, and exposing an upper surface and a lower surface of the lead frame.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a package structure and a method for manufacturing the same. [Background technology]

[0002] Generally, in the manufacturing process of a light-emitting diode device, when a light-emitting chip is placed on a lead frame, a packaging material (e.g., epoxy resin) is injected into the area of ​​the lead frame where the light-emitting chip is placed, so that the hardened packaging material adheres stably to the lead frame and effectively covers the light-emitting chip.

[0003] However, uncured packaging material often seeps into narrow gaps in the lead frame and quickly spills out the other side of the lead frame, preventing the packaging material from stably adhering to the lead frame and reducing package reliability.

[0004] From this, it can be seen that the above technology still has obvious inconveniences and deficiencies and there is room for further improvement. Therefore, how to effectively solve the above inconveniences and deficiencies is one of the current important research and development issues, and is also a goal that needs to be improved urgently in the current related fields. Summary of the Invention [Means for solving the problem]

[0005] SUMMARY OF THE INVENTION An object of the present invention is to provide a package structure and a manufacturing method thereof to solve the problems mentioned in the prior art.

[0006] According to one embodiment of the present invention, a method for manufacturing a package structure includes the steps of providing a lead frame; forming a first mask layer on an upper surface of the lead frame and a second mask layer on a lower surface of the lead frame, so that the first mask layer, the lead frame and the second mask layer together form a laminated structure; performing a patterning process on the laminated structure to drill at least one through hole in the laminated structure; performing a sandblasting process on the through hole and forming a rough structure surface in the through hole; and after sandblasting the laminated structure, removing the first mask layer and the second mask layer to expose the upper and lower surfaces of the lead frame.

[0007] According to one or more embodiments of the present invention, in the manufacturing method of the package structure, the step of performing a sandblasting process on the through-holes further includes the steps of: moving the laminated structure into the processing range of a dry blaster; using the dry blaster to spray a plurality of abrasive grains onto the first mask layer of the laminated structure and the through-holes, causing them to collide with the first mask layer and the inner walls of the through-holes, thereby forming the rough structure surface; and spraying dry air onto the laminated structure and removing the abrasive grains from the first mask layer of the laminated structure and the through-holes.

[0008] According to one or more embodiments of the present invention, in the manufacturing method of the packaging structure, the vibration frequency of the nozzle head of the dry blaster is 5 Hz to 100 Hz, and the sandblasting pressure of the dry blaster is 0.005 MPa to 0.5 MPa.

[0009] According to one or more embodiments of the present invention, in the method for manufacturing the package structure, the abrasive grains include one of alumina, silica, titanium oxide, and stainless steel.

[0010] According to one or more embodiments of the present invention, the manufacturing method of the packaging structure further includes the steps of detecting the coordinates of the through holes of the laminated structure before ejecting abrasive grains into the through holes, and linearly aligning the nozzle head of the dry blaster with the through holes of the laminated structure based on the coordinates of the through holes.

[0011] According to one or more embodiments of the present invention, in the method for manufacturing the packaging structure, the roughness of the rough structure surface is 0.2 micrometers to 10 micrometers.

[0012] According to one or more embodiments of the present invention, in the method for manufacturing the package structure, the patterning process further includes a step of etching localized areas of the laminated structure so that through holes penetrate the first mask layer, the lead frame, and the second mask layer.

[0013] According to one or more embodiments of the present invention, the manufacturing method of the package structure further includes the steps of: after removing the first mask layer and the second mask layer, press-molding the lead frame to cause a polymer material to adhere to the top surface of the lead frame and fill into the through holes, and solidifying with the rough structure surface in the through holes after hardening.

[0014] According to one or more embodiments of the present invention, the manufacturing method of the package structure further includes a step of performing a pre-plating process on the lead frame between the step of removing the first mask layer and the second mask layer and the step of press-forming the lead frame.

[0015] According to one embodiment of the present invention, in a method for manufacturing a package structure, the package structure comprises a lead frame having two opposing surfaces, each of which is a smooth surface; at least one through hole drilled in the lead frame and connected to the surfaces, the through hole having a rough structured surface on its inner wall; and a package located on the lead frame and fixed to the rough structured surface in the through hole. [Effects of the Invention]

[0016] As described above, by using the above-described structures of the embodiments, the manufacturing method of the package structure of the present invention can strengthen the bonding strength between the package material and the lead frame, improve the problem of package material leaking into the lead frame, improve the package reliability, and maintain smooth brightness on the front and back surfaces of the lead frame.

[0017] The above is merely intended to explain the problems that the present invention aims to solve, the technical means for solving the problems, and the effects that the present invention achieves. Specific details of the present invention will be described in detail in the following embodiments and related drawings. [Brief explanation of the drawings]

[0018] To make the above and other objects, features, advantages and embodiments of the present invention more clearly comprehensible, reference is made to the accompanying drawings as follows: [Figure 1] 2 is a flowchart of a method for manufacturing a package structure according to an embodiment of the present invention. [Figure 2A] FIG. 2 is a schematic diagram of the continuous operations of steps 11 to 16 in FIG. [Figure 2B] FIG. 2 is a schematic diagram of the continuous operations of steps 11 to 16 in FIG. [Figure 2C] FIG. 2 is a schematic diagram of the continuous operations of steps 11 to 16 in FIG. [Figure 2D] FIG. 2 is a schematic diagram of the continuous operations of steps 11 to 16 in FIG. [Figure 2E] FIG. 2 is a schematic diagram of the continuous operations of steps 11 to 16 in FIG. [Figure 2F] FIG. 2 is a schematic diagram of the continuous operations of steps 11 to 16 in FIG. [Figure 3A] 2A and 2B are schematic diagrams of successive operations of step 14 in FIG. 1 in one embodiment. [Figure 3B] 2A and 2B are schematic diagrams of successive operations of step 14 in FIG. 1 in one embodiment. [Figure 3C] 2A and 2B are schematic diagrams of successive operations of step 14 in FIG. 1 in one embodiment. [Figure 4] FIG. 2 is a schematic diagram illustrating the operation of step 14 in FIG. 1 in one embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, several embodiments of the present invention are disclosed in the drawings, and for the sake of clarity, many practical details are set forth in the following description. However, it should be understood that these practical details are not intended to limit the present invention. That is, practical details are not required in each embodiment of the present invention. In addition, in order to simplify the drawings, some commonly used structures and elements are simply and schematically shown in the drawings.

[0020] FIG. 1 is a flowchart of a method for manufacturing a package structure according to an embodiment of the present invention. As shown in FIG. 1, the method for manufacturing a package structure includes the following steps 11 to 18. In step 11, a lead frame is provided. In step 12, mask layers are formed on two opposing surfaces of the lead frame, respectively, and these mask layers and the lead frame form a laminate structure. In step 13, a patterning process is performed on the laminate structure to drill one or more through holes in the laminate structure. In step 14, a sandblasting process is performed on the through holes to form rough structured surfaces in the through holes. In step 15, the mask layers are removed to expose the two opposing surfaces of the lead frame. In step 16, the lead frame is press-molded to attach a polymer material to the lead frame and fill the through holes, which is then cured and solidified with the rough structured surfaces. In step 17, an adhesive removal process is performed on the cured polymer material. In step 18, a plating process (referred to as post-plating) is performed on the lead frame.

[0021] 2A to 2F are schematic diagrams showing the successive operations of steps 11 to 16 in Fig. 1. More specifically, in step 11, as shown in Fig. 2A, lead frame 110 has upper and lower surfaces 111 and 112 facing each other, and each of upper and lower surfaces 111 and 112 of lead frame 110 is a smooth surface. For example, lead frame 110 is a metal substrate or a ceramic substrate.

[0022] 2A, in step 12, more specifically, a first mask layer 120 is formed and attached to the upper surface 111 of the lead frame 110, and a second mask layer 130 is formed and attached to the lower surface 112 of the lead frame 110, so that the first mask layer 120, the lead frame 110, and the second mask layer 130 together form the laminated structure 100. For example, the first mask layer 120 and the second mask layer 130 are each a protective layer such as a dry film or a photoresist.

[0023] 2B , in step 13, more specifically, the first mask layer 120 of the laminated structure 100 is exposed and developed, and local regions of the laminated structure 100 are etched according to an etching pattern, and after the etching reaction, the etching pattern is formed thereon. The etching pattern has the through holes 140, each of which penetrates the first mask layer 120, the lead frame 110, and the second mask layer 130, respectively, and is connected to the upper surface 111 and the lower surface 112 of the lead frame 110, respectively, and the axial direction 140A of the through holes 140 is perpendicular to the longitudinal direction 110A of the lead frame 110.

[0024] 2C and 2D , in step 14, more specifically, a dry sandblasting process is performed on the first mask layer 120 of the laminated structure 100 and the through holes 140 to form a rough structured surface 150 on the first mask layer 120 and the inner wall 141 of each through hole 140. For example, the roughness of the rough structured surface 150 is 0.2 micrometers (μm) to 10 micrometers (μm), 0.2 micrometers (μm) to 1 micrometer (μm), or 1.5 micrometers (μm) to 10 micrometers (μm), but the present invention is not limited thereto.

[0025] 2E, in step 15, more specifically, the first mask layer 120 and the second mask layer 130 of the laminated structure 100 are removed, respectively, to expose the upper surface 111 and the lower surface 112 of the lead frame 110. The method for removing the first mask layer 120 and the second mask layer 130 is not limited to a physical method or a chemical method. The method for removing the first mask layer 120 and the second mask layer 130 is well known, and therefore a detailed description thereof will be omitted here.

[0026] 2F , in step 16, the lead frame 110 is press-molded to attach a polymer material to the top surface 111 of the lead frame 110 and fill the through-holes 140, and the polymer material undergoes a curing process to form a package 200 on the lead frame 110. A portion of the package 200 covers the top surface 111 of the lead frame 110, and the remaining portions are respectively fixed to the rough structure surfaces 150 in each through-hole 140, thereby initially forming a package structure 210. The package structure 210 is, for example, a light-emitting diode package structure, and the polymer material is, for example, epoxy resin or silica gel.

[0027] However, the present invention is not limited to this, and in other embodiments, a step of performing a pre-plating process on the lead frame 110 may be added between steps 15 and 16. The pre-plating process is a method of depositing a metal plating layer on the lead frame 110 in a specific solution or under specific conditions to improve the bonding strength between the subsequent metal plating layer and the lead frame 110, and this step is not limited to pre-plating only one or multiple layers on the lead frame 110. Furthermore, performing a post-plating process on the lead frame in step 18 is not limited to forming only one or multiple plating layers on the lead frame 110, and conversely, in other embodiments, step 18 may be omitted.

[0028] 3A to 3C are schematic diagrams illustrating the sequential operations of step 14 in FIG. 1 according to one embodiment. As shown in FIGS. 3A and 3B, in this embodiment, more specifically, the roughening device 300 includes a conveyor belt device 310, a carrier plate 320, and a dry blaster 330. The carrier plate 320 is used to place the laminated structure 100, and the laminated structure 100 is placed on the carrier plate 320 via the second mask layer 130. The conveyor belt device 310 is used to horizontally move the carrier plate 320, for example, to move the laminated structure 100 into a processing range 331 of the dry blaster 330. The dry blaster 330 is located above the conveyor belt device 310, and a nozzle head 332 of the dry blaster 330 is used to spray a large amount of high-pressure abrasive grains D toward the first mask layer 120 of the laminated structure 100. 3C, the roughening device 300 further includes a compressed air nozzle 340. The compressed air nozzle 340 is disposed outside the processing range 331 of the dry blaster 330 and is used to output high-pressure dry air A onto the carrier plate 320.

[0029] Thus, in this embodiment, the step of performing the sandblasting process on the through-hole 140 in step 14 includes the following steps: First, as shown in Figures 3A and 3B, the laminated structure 100 is moved to the processing range 331 of the dry blaster 330. More specifically, the conveyor belt device 310 moves the carrier plate 320 and the laminated structure 100 thereon into the processing range 331 of the dry blaster 330.

[0030] 3B, the nozzle head 332 ejects a plurality of abrasive grains D onto the first mask layer 120 and the through holes 140 of the laminated structure 100, and the abrasive grains D collide with the first mask layer 120 and the inner walls 141 of the through holes 140, forming a rough structured surface 150 (see FIG. 2D). More specifically, the nozzle head 332 of the dry blaster 330 is repeatedly oscillated, and the abrasive grains D are repeatedly collided with the first mask layer 120 of the laminated structure 100 and the inner walls 141 of all the through holes 140 (see FIG. 2C), thereby forming the rough structured surface 150 on the inner walls 141 of each of the through holes 140.

[0031] 3C, dry air A is sprayed onto the first mask layer 120 and the through holes 140 of the laminated structure 100, and foreign matter in the first mask layer 120 and the through holes 140 of the laminated structure 100 is removed. More specifically, high-pressure dry air A is output to the laminated structure 100 via a compressed air nozzle 340 to remove foreign matter (e.g., abrasive grains D) in the laminated structure 100.

[0032] Additionally, after the dry sandblasting process, the laminate structure 100 may optionally be subjected to a cleaning process, such as using deionized water (DI water) or other suitable cleaning fluid to remove abrasive grains D or other materials in the laminate structure 100.

[0033] More specifically, in one embodiment, regarding the jetting speed of the abrasive grains D of the dry blaster 330, the vibration frequency of the nozzle head 332 is 5 to 100 hertz (Hz), the sandblasting pressure of the dry blaster 330 is 0.005 to 0.5 megapascals (Mpa), and the conveyor belt speed of the conveyor belt device 310 is 5 to 120 centimeters per minute (cm / min). However, the present invention is not limited thereto.

[0034] In one embodiment, the abrasive grains D are granular, bead-like, spherical, or irregular, but the present invention is not limited thereto. In one embodiment, the material of the abrasive grains D can include alumina, silica, titanium oxide, or stainless steel. In one embodiment, the abrasive grains D include brown alumina #180, brown alumina #280, glass sand #120, round steel #120, and / or black alumina #180, but the present invention is not limited thereto. The abrasive grain size of brown alumina #280 is 40 to 70 micrometers (μm), the abrasive grain size of brown alumina #180 is 63 to 75 micrometers (μm), the abrasive grain size of black alumina #180 is 63 to 75 micrometers (μm), the abrasive grain size of glass sand #120 is 105 to 150 micrometers (μm), and the abrasive grain size of round steel #120 is 1000 to 1410 micrometers (μm).

[0035] 4 is a schematic diagram of the operation of step 14 in FIG. 1 in one embodiment. As shown in FIG. 4, the roughening device 301 of this embodiment is substantially the same as that described above, except that the nozzle head 332 of the dry blaster 330 is movable. More specifically, the roughening device 301 further includes a transport device 350 and a position detection device 360. The nozzle head 332 of the dry blaster 330 is fixed to the transport device 350, and the position detection device 360 ​​is fixed to the transport device 350. The position detection device 360 ​​is, for example, a combination of an imaging device and its processing circuit.

[0036] In this embodiment, the following steps are performed before spraying abrasive particles D into the through holes 140. First, the coordinates of the through holes 140 in the laminated structure 100 are detected. More specifically, the position detection device 360 ​​detects the coordinates of all of the through holes 140. Next, based on the coordinates of each through hole 140, the nozzle head 332 of the dry blaster 330 is linearly aligned with each through hole 140 in the laminated structure 100 in sequence. More specifically, in the roughening device 301, the conveying device 350 moves the nozzle head 332 along the rail 351 in sequence to directly above each through hole 140 in the laminated structure 100 based on the coordinates of each through hole 140, so that the nozzle head 332 can spray abrasive particles D onto the inner wall 141 of the through hole 140. In one embodiment, the major axis direction 332A of the nozzle head 332 is coaxial with the axial direction 140A of the through hole 140 or has an included angle of 5° to 45°.

[0037] As described above, by using the above-described structures of the embodiments, the manufacturing method of the package structure of the present invention can strengthen the bonding strength between the package material and the lead frame, improve the problem of package material leaking into the lead frame, improve the package reliability, and maintain smooth brightness on the front and back surfaces of the lead frame.

[0038] Finally, the above-disclosed embodiments are not intended to limit the present invention, and any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, all of which can be protected by the present invention. Therefore, the scope of protection of the present invention should be limited by the scope of the patent application attached. [Explanation of symbols]

[0039] 11~18: Step 100: Laminated structure 110: Lead frame 111:Top surface 112: Bottom surface 110A: Long axis direction 120: First mask layer 130: Second mask layer 140:Through hole 141:Inner wall 140A: Axial direction 150: Rough structured surface 200:Package 210: Package structure 300, 301: Roughening equipment 310: Conveyor belt device 320: Carrier plate 330: Dry Blaster 331: Processing range 332: Nozzle head 332A: Long axis direction 340: Compressed air nozzle 350:Transportation device 351: Rail 360: Position detection device A: Air D: Abrasive grain

Claims

1. providing a lead frame; forming a first mask layer on an upper surface of the lead frame and a second mask layer on a lower surface of the lead frame, so that the first mask layer, the lead frame, and the second mask layer form a laminated structure; performing a patterning process on the laminate structure to drill at least one through hole in the laminate structure; detecting coordinates of the through holes in the laminate structure; performing a sandblasting process on the through-hole and forming a rough structured surface in the through-hole; The sandblasting process further includes the steps of: moving the laminated structure into a processing range of a dry blaster; linearly aligning a nozzle head of the dry blaster with the through-hole of the laminated structure based on the coordinates of the through-hole, so that the dry blaster ejects a plurality of abrasive grains into the first mask layer and the through-hole of the laminated structure, and the abrasive grains impinge on the first mask layer and the inner walls of the through-hole to form the rough structured surface; and ejecting dry air onto the laminated structure and removing the abrasive grains in the first mask layer and the through-hole of the laminated structure. removing the first mask layer and the second mask layer after sandblasting the laminated structure to expose the top surface and the bottom surface of the lead frame; A method for manufacturing a package structure, wherein when the dry blaster sprays the abrasive grains to collide with the laminated structure, the nozzle head of the dry blaster is repeatedly oscillated, so that the abrasive grains repeatedly collide with the first mask layer of the laminated structure and the inner wall of the at least one through hole.

2. 2. The manufacturing method of claim 1, wherein the vibration frequency of the nozzle head of the dry blaster is 5 Hz to 100 Hz, and the sandblasting pressure of the dry blaster is 0.005 MPa to 0.5 MPa.

3. The method for manufacturing a package structure according to claim 1 , wherein the abrasive grains include one of alumina, silica, titanium oxide, and stainless steel.

4. 2. The method for manufacturing a package structure as claimed in claim 1, wherein the roughness of the rough structure surface is 0.2 micrometers to 10 micrometers.

5. The patterning process comprises: The method for manufacturing a package structure according to claim 1 , further comprising the step of etching a localized area of ​​the laminated structure so that the through hole penetrates the first mask layer, the lead frame, and the second mask layer.

6. 2. The method for manufacturing a package structure according to claim 1, further comprising the step of: after removing the first mask layer and the second mask layer, press-molding the lead frame to cause a polymer material to adhere to the top surface of the lead frame and fill into the through holes, and after hardening, solidify with the rough structure surface in the through holes.

7. between the step of removing the first mask layer and the second mask layer and the step of press-forming the lead frame, The method for manufacturing a package structure according to claim 6 , further comprising the step of performing a pre-plating process on the lead frame.

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