Production equipment and data management method

Abstract

To provide a production device capable of reducing storage capacity.SOLUTION: A production device (a component mounting device M3) for producing a substrate, on which components are mounted, comprises: a storage unit 120 which stores therein log data related to operations for producing the substrate; a reception unit 114 which receives an inspection result of the substrate; a deletion unit 115 by which, in a case where it is indicated that the inspection result received by the reception unit 114 is satisfactory, log data corresponding to the inspection result are deleted from the storage unit 120; and a transfer unit 116 which transfers the log data stored in the storage unit 120 to an external device.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a production device and a data management method for producing boards on which components are mounted. [Background technology]

[0002] Patent Document 1 discloses a component mounting information collection device that can collect component mounting information that occurs during the process of mounting components onto a board in order to analyze problems that occur during the process of mounting components onto a board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-165127 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the component mounting information collection device disclosed in Patent Document 1 collects a huge amount of data, requiring a large-capacity storage device. Furthermore, when the collected data is transferred to an external device, the external device requires a large-capacity storage device.

[0005] Therefore, the present disclosure provides a production device and the like that allows for a reduction in storage capacity. [Means for solving the problem]

[0006] A production device according to one aspect of the present disclosure is a production device for producing a board having components mounted thereon, and includes: a memory unit that stores log data related to operations for producing the board; a receiving unit that receives inspection results of the board; a deletion unit that, if the inspection results received by the receiving unit indicate that the results are good, deletes the log data corresponding to the inspection results from the memory unit; and a transfer unit that transfers the log data stored in the memory unit to an external device.

[0007] These comprehensive or specific aspects may be realized by a system, an apparatus, a method, a recording medium, or a computer program, or may be realized by any combination of a system, an apparatus, a method, a recording medium, and a computer program. [Effects of the Invention]

[0008] According to the production device and the like according to the present disclosure, it is possible to reduce the storage capacity. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a side view of a component mounting system according to an embodiment; [Figure 2] 1 is a top view of a component mounting device according to an embodiment; [Figure 3] 1 is a side view of a component mounting device according to an embodiment; [Figure 4] 1 is a block diagram showing a configuration of a component mounting device according to an embodiment; [Figure 5] 10 is a flowchart showing an operation when data is collected by the component mounting device according to the embodiment. [Figure 6] 10 is a timing chart showing data collection in the component mounting devices according to the embodiment and the comparative example; [Figure 7] 10 is a flowchart showing an operation when data of the component mounting device according to the embodiment is stored in association with a board. [Figure 8] 10 is a flowchart showing an operation when data is transferred from the component mounting device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] The production apparatus disclosed herein is a production apparatus for producing a board having components mounted thereon, and includes a memory unit that stores log data related to operations for producing the board, a receiving unit that receives inspection results of the board, a deletion unit that deletes the log data corresponding to the inspection results from the memory unit if the inspection results received by the receiving unit indicate that the results are good, and a transfer unit that transfers the log data stored in the memory unit to an external device.

[0011] If the inspection results of the board are good, there is no need to analyze the log data corresponding to the inspection results, and in many cases there is no problem in deleting it. Therefore, by deleting the log data corresponding to good inspection results, it is possible to reduce the storage capacity.

[0012] For example, the receiving unit may receive the inspection results of the board from an inspection machine that inspects the board, or may receive the inspection results of the board from an external device.

[0013] For example, the inspection of the substrate may be performed using multiple types of inspection devices, and the production device may further include a selection unit that selects one of the multiple types of inspection devices, and the deletion unit may delete the log data corresponding to the inspection result from the memory unit when the inspection result received by the receiving unit by the inspection device selected by the selection unit indicates that the inspection result is good.

[0014] This allows the user to select the inspection result of one of a plurality of types of inspection devices to be used to determine whether or not to delete the log data.

[0015] For example, the production device may further include a switching unit that switches whether or not the log data is to be deleted from the storage unit by the deletion unit.

[0016] This allows the user to switch whether or not the function for deleting log data is enabled.

[0017] The data management method disclosed herein is a data management method executed by a production device for producing a board having components mounted thereon, the production device having a memory for storing log data related to operations for producing the board, and the data management method includes a process of receiving an inspection result of the board, and if the received inspection result indicates that the inspection result is good, deleting the log data corresponding to the inspection result from the memory unit, and transferring the log data stored in the memory unit to an external device.

[0018] The embodiments described below are all comprehensive or specific examples, and the numerical values, shapes, materials, components, arrangement and connection of the components, steps, and order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure.

[0019] (Embodiment) Hereinafter, the embodiment will be described with reference to FIGS.

[0020] FIG. 1 is a side view of a component mounting system according to an embodiment.

[0021] The component mounting system has a function of producing a mounted board by mounting and attaching components such as electronic components to a board using solder bonding or the like. Note that a mounted board may also be produced by bonding and attaching components to a board using adhesive or the like. In order to produce boards on which components are mounted, the component mounting system includes a production line configured to connect various production devices and various inspection devices, and a management device 3 connected to the production line via a network 2.

[0022] The component mounting system includes a board supply device M1, a screen printing device M2, component mounting devices M3 to M6, a reflow device M7, a board removal device M8, a board visual inspection device M9, and a board shipping inspection device M10. The screen printing device M2, the component mounting devices M3 to M6, and the reflow device M7 are examples of production devices. The board visual inspection device M9 and the board shipping inspection device M10 are examples of inspection devices. The board supply device M1, the screen printing device M2, the component mounting devices M3 to M6, the reflow device M7, the board removal device M8, the board visual inspection device M9, and the board shipping inspection device M10 form a production line. The production line is connected to a management device 3 via a network 2, and the management device 3 controls production management for the production line. The management device 3 is an example of an external device. The network 2 is, for example, a wired network, but may also be a wireless network. The production devices and inspection devices in the production line may be connected to an external device, such as an external server, via a wired or wireless network. The production line is equipped with a transport conveyor, which transports substrates and other materials from upstream (the left side of Figure 1) to downstream (the right side of Figure 1).

[0023] The board supply device M1 has a storage section such as a rack that stores multiple boards, and performs a board supply operation by removing boards from the storage section and supplying them to downstream equipment. The screen printing device M2 performs a solder printing operation by printing solder on boards brought in from upstream through a screen mask attached to the printing operation section. The production line may also include a solder application device that applies solder to boards using a dispenser, installed alongside the screen printing device M2 or instead of the screen printing device M2. The screen printing device M2 and the solder application device are printing devices that deposit solder on boards.

[0024] The component mounting devices M3 to M6 perform a component mounting operation in which components are mounted on a board on which solder has been deposited using a mounting head. Note that the production line is not limited to a configuration in which the number of component mounting devices M3 to M6 is four, and may include one to three, or five or more component mounting devices M3 to M6. The reflow device M7 performs a board heating operation in which the board carried into the device is heated using a board heating unit to harden the solder on the board and bond the electrode parts of the board to the components. The board removal device M8 has a storage unit such as a rack for storing multiple boards, and performs a board removal operation in which it receives boards carried out by an upstream device and removes them in the storage unit.

[0025] The board appearance inspection device M9 and the board shipping inspection device M10 inspect boards on which components are mounted. The board appearance inspection device M9 inspects the appearance of the board. Specifically, the board appearance inspection device M9 uses a camera or the like to inspect for the presence of solder bridges and the presence of dust on the board. The board shipping inspection device M10 inspects the continuity of the board.

[0026] Next, the configuration of component mounting devices M3 to M6 will be described with reference to Figures 2 and 3. Note that the following description focuses on component mounting device M3, and the description of component mounting devices M4 to M6 will be omitted as they basically have the same configuration as component mounting device M3.

[0027] FIG. 2 is a top view of the component mounting apparatus M3 according to the embodiment.

[0028] FIG. 3 is a side view of the component mounting apparatus M3 according to the embodiment.

[0029] Component mounting device M3 has the function of mounting components D on board B. In FIG. 2, board transport mechanism 7 is installed in the X direction at the center of base 6. Board transport mechanism 7 transports board B carried in from the upstream side in the X direction, and positions and holds it at a mounting operation position by mounting head 12, which will be described below. In addition, board transport mechanism 7 carries board B downstream after component mounting operation has been completed. Component supply units 8 are installed on both sides of board transport mechanism 7.

[0030] Component supply unit 8 is fitted with carriages 5 on which a plurality of feeders (tape feeders) 9 are mounted in parallel in the X direction. Feeder 9 pitch-feeds a carrier tape, on which pockets for storing components D are formed, in a direction (tape feed direction) from the outside of component supply unit 8 towards board transport mechanism 7, to supply components D to a component removal position where mounting head 12 picks up the components D. Note that the feeder that supplies components D may be feeder 9 (tape feeder), or may be a tray feeder that supplies components D placed on a tray, or a stick feeder that supplies components D aligned and held on a hollow stick. Feeder 9 is an example of a unit for mounting components on a board.

[0031] In FIG. 2, a Y-axis table 10 equipped with a linear drive mechanism is disposed on both ends in the X direction of the upper surface of base 6. A beam 11 similarly equipped with a linear drive mechanism is coupled to Y-axis table 10 so as to be freely movable in the Y direction. A mounting head 12 is attached to beam 11 so as to be freely movable in the X direction. Mounting head 12 is equipped with a plurality of nozzle units 12a (eight in this example). For example, mounting head 12 has two rows of four nozzle units 12a. For example, multiple types of mounting heads 12 are prepared, each differing in the number of nozzle units 12a, etc. Mounting head 12 is an example of a unit for mounting components on a board.

[0032] 3, a suction nozzle 12b that vacuum-sucks and holds a component D is attached to the lower end of each nozzle unit 12a. A variety of suction nozzles 12b with different nozzle shapes are prepared to correspond to the size, shape, and other characteristics of the component D to be sucked.

[0033] 2, Y-axis table 10 and beam 11 constitute mounting head moving mechanism 13, which moves mounting head 12 horizontally (X direction, Y direction). Mounting head moving mechanism 13 is an example of a unit for mounting components on a board. Mounting head moving mechanism 13 and mounting head 12 pick up component D by suction with suction nozzle 12b from the component removal position of feeder 9 attached to component supply unit 8. Then, mounting head moving mechanism 13 performs component mounting work by transporting mounting head 12 to a mounting position on board B held by board transport mechanism 7 and mounting the component.

[0034] The time it takes for the mounting head 12 to pick up components D from the feeder 9 and mount them on the board B depends on the position of the feeder 9 on the carriage 5 (the configuration of the component mounting device). For example, by positioning the feeder 9 that supplies components D, which are mounted in large numbers on the board B, near the center of the carriage 5, the movement distance of the mounting head 12 can be reduced, thereby shortening the mounting time.

[0035] 2 and 3, the beam 11 is fitted with a head camera 14 that is positioned on the underside of the beam 11 and moves integrally with the mounting head 12. As the mounting head 12 moves, the head camera 14 moves above the board B that has been positioned at the mounting operation position of the board transport mechanism 7, and captures an image of a board mark (not shown) provided on the board B to recognize the position of the board B.

[0036] A component recognition camera 15 is installed between the component supply unit 8 and the board transport mechanism 7. When the mounting head 12 moves upward after picking up a component D from the component supply unit 8, the component recognition camera 15 captures an image of the component D held by the suction nozzle 12b and recognizes the holding position, etc. When the mounting head 12 mounts the component D on the board B, the mounting position is corrected taking into account the recognition result of the board B by the head camera 14 and the recognition result of the component D by the component recognition camera 15.

[0037] 3, a reel 17 around which a carrier tape 16 storing components D is wound is held on the front side of the carriage 5. The feeder 9 transports the carrier tape 16 stored on the reel 17 in the tape feed direction to supply the components D to a component pick-up position by the mounting head 12. A number of types of feeders 9 are prepared, each with different widths corresponding to the width of the carrier tape 16 to be transported.

[0038] Next, the configuration of the control system of the component mounting device M3 will be described with reference to FIG.

[0039] FIG. 4 is a block diagram showing the configuration of a component mounting device M3 according to an embodiment.

[0040] The component mounting device M3 includes a main controller 100. FIG. 4 also shows a mounting head 12, a mounting head moving mechanism 13, and a feeder 9, which are units for mounting components on a board, as well as a component recognition camera 15 and a board transport mechanism 7, all of which are controlled by the main controller 100. Multiple feeders 9 are also shown here. For example, each unit is controlled based on a communication command issued by the main controller 100. The main controller 100 includes a control unit 110 and a memory unit 120. The control unit 110 controls the units (such as the mounting head 12, the mounting head moving mechanism 13, and the feeder 9). The control unit 110 is a CPU device, and controls components such as a collection unit 111, a selection unit 112, a switching unit 113, a receiving unit 114, a deletion unit 115, and a transfer unit 116, which will be described below, based on various programs and data stored in the memory unit 120.

[0041] The mounting head 12 has a memory 131 that stores log data related to the operation of the mounting head 12. The log data related to the operation of the mounting head 12 stored in the memory 131 includes, for example, data on the air flow rate when the suction nozzle 12b sucks in and blows out air, and data on the responsiveness of a valve that switches between sucking in and blowing out air.

[0042] The mounting head moving mechanism 13 has a memory 132 that stores log data related to the operation of the mounting head moving mechanism 13. The log data related to the operation of the mounting head moving mechanism 13 stored in the memory 132 includes torque data of the servo motor, data on the difference between the command value for movement and the current value, and data on motor vibration.

[0043] The feeder 9 has a memory 133 that stores log data relating to the operation of the feeder 9. The log data relating to the operation of the feeder 9 stored in the memory 133 includes torque data when components are fed out, and the like.

[0044] The collection unit 111 collects the log data stored in the memories 131, 132, and 133. Specifically, the collection unit 111 collects the log data at a time that does not affect the operation of the component mounting device M3 to mount components on a board.

[0045] The selection unit 112 selects one of a plurality of types of inspection devices. In Fig. 1, a board appearance inspection device M9 and a board shipping inspection device M10 are shown as the plurality of types of inspection devices, and for example, inspection of a board is performed by the board appearance inspection device M9 and the board shipping inspection device M10, and the selection unit 112 selects one of the board appearance inspection device M9 and the board shipping inspection device M10.

[0046] The switching unit 113 switches whether or not the log data is to be deleted from the storage unit 120 by the deleting unit 115. The switching unit 113 can switch whether or not the function for deleting log data is enabled.

[0047] The receiving unit 114 receives the inspection results of the board. The receiving unit 114 may receive the inspection results of the board from an inspection machine that inspects the board (for example, a board visual inspection device M9 or a board shipping inspection device M10), or may receive the inspection results of the board from an external device. When receiving the inspection results of the board from an external device, the external device acquires the inspection results of the board from the board visual inspection device M9 or the board shipping inspection device M10, etc.

[0048] When the inspection results received by the receiving unit 114 indicate that the inspection results are good, the deletion unit 115 deletes the log data corresponding to the inspection results from the storage unit 120. For example, when the inspection results received by the receiving unit 114 by the inspection device selected by the selection unit 112 indicate that the inspection results are good, the deletion unit 115 deletes the log data corresponding to the inspection results from the storage unit 120. For example, when the board visual inspection device M9 is selected and the inspection results by the board visual inspection device M9 indicate that the inspection results are good, the deletion unit 115 deletes the log data corresponding to the good inspection results by the board visual inspection device M9 from the storage unit 120. Furthermore, when the board shipping inspection device M10 is selected and the inspection results by the board shipping inspection device M10 indicate that the inspection results are good, the deletion unit 115 deletes the log data corresponding to the good inspection results by the board shipping inspection device M10 from the storage unit 120.

[0049] The transfer unit 116 transfers the log data stored in the storage unit 120 to an external device (for example, the management device 3 or an external server).

[0050] The storage unit 120 stores mounting data 121, component data 122, log data 123, and inspection result data 124. The mounting data 121 is data referenced during the operation of mounting components onto a board, and includes data on the board type to be mounted, data on the suction nozzle 12b used for mounting, and data on the component mounting position. The component data 122 includes data on the type and size of the component to be mounted at each mounting position. The log data 123 is log data collected by the collection unit 111. The deletion unit 115 deletes log data corresponding to good inspection results, and the transfer unit 116 transfers the log data that has not been deleted (i.e., log data corresponding to bad inspection results) to an external device. The inspection result data 124 is inspection results received by the reception unit 114. Each inspection result is associated with the inspected board.

[0051] Next, the operation of the component mounting device M3 will be described in detail with reference to FIGS.

[0052] FIG. 5 is a flowchart showing the operation of the component mounting apparatus M3 according to the embodiment when collecting data.

[0053] First, the control unit 110 moves the mounting head 12 so that the first row of four suction nozzles 12b on the mounting head 12 is positioned above the component removal position of the feeder 9, and the four first row of four suction nozzles 12b pick up the four components supplied from the feeder 9 (step S11).

[0054] Next, the control unit 110 moves the mounting head 12 so that the four suction nozzles 12b in the second row of the mounting head 12 are positioned above the component pick-up position of the feeder 9 (step S12).

[0055] Next, the control unit 110 causes the four suction nozzles 12b in the second row to pick up the four components supplied from the feeder 9 (step S13).

[0056] Next, the control unit 110 moves the mounting head 12 above the component recognition camera 15 (step S14).

[0057] The control unit 110 performs component recognition by having the component recognition camera 15 photograph the component picked up by the suction nozzle 12b of the mounting head 12 located above the component recognition camera 15, thereby determining whether the component has been picked up correctly (specifically, whether the component has been picked up and in the correct orientation, etc.) (step S15). For example, if the component has not been picked up correctly, an error may be reported.

[0058] The control unit 110 sets the variable i to 1 (step S16). The variable i is a variable that is incremented each time a component picked up by one suction nozzle 12b is placed on the board. If there are eight suction nozzles 12b and eight components to be placed on the board, the variable i is incremented up to 8, which is the number of suction nozzles 12b of the mounting head 12 (in other words, the number of components to be placed on the board from the mounting head 12).

[0059] Next, the control unit 110 moves the mounting head 12 so that the suction nozzle 12b that has adsorbed the component is positioned above the position where the component should be mounted on the board transported from upstream in the production line (here, the screen printing device M2) (step S17).

[0060] The control unit 110 places the component picked up by the suction nozzle 12b located above the position on the board where the component is to be placed (step S18). At this time, the mounting head 12 stores log data relating to the operation of the mounting head 12 in the memory 131 (step S19).

[0061] The control unit 110 determines whether the variable i is 8 (step S20). If the variable i is not 8 (No in step S20), the control unit 110 increments the variable i (step S21) and performs the process from step S17 for any of the eight suction nozzles 12b that are still suctioning components. As a result, the eight suction nozzles 12b mount the picked-up components and store the log data.

[0062] If the variable i is 8 (Yes in step S20), the control unit 110 moves the mounting head 12 to the feeder 9 to supply the next component to the suction nozzle 12b of the mounting head 12, while the collection unit 111 collects the log data stored in the memory 131 of the mounting head 12 (step S22). In this way, the collection unit 111 collects the log data while the mounting head 12 is moving, specifically, while the mounting head 12 is moving to a predetermined location (e.g., feeder 9) after placing a component on the board. As will be described in detail later with reference to FIG. 6, by collecting the log data while the mounting head 12 is moving to the feeder 9 after placing a component on the board, it is possible to collect data while minimizing the impact on the takt time.

[0063] Then, the control unit 110 determines whether there is a next turn (step S23). For example, there may be many components to be mounted on one board, and one mounting head 12 may be used to repeatedly pick up components from the feeder 9 and mount the components on the board. Here, one example of the operation of picking up components from the feeder 9, moving them to the board, mounting the components on the board, and then moving them back to the feeder 9 is called one turn. If there is a next turn (Yes in step S23), that is, if there are still components to be mounted on the board, the processing continues from step S11. If there is no next turn (No in step S23), that is, if there are no components to be mounted on the board, the processing ends.

[0064] Next, using FIG. 6, we will explain how data collection can be performed while minimizing the impact on takt time by collecting log data while the mounting head 12 is moving to the feeder 9 after placing components on the board.

[0065] FIG. 6 is a timing chart showing data collection for the component mounting device M3 according to the embodiment and the comparative example. (a) of FIG. 6 is a timing chart showing data collection for the component mounting device M3 according to the comparative example, and (b) of FIG. 6 is a timing chart showing data collection for the component mounting device M3 according to the embodiment. In FIG. 6, the "pickup" section indicates the time when the suction nozzle 12b picks up a component from the feeder 9, the "place" section indicates the time when the suction nozzle 12b places a component on the board, the dotted hatched section indicates the time when the mounting head 12 is moving, and the diagonal hatched section indicates the time when log data is being collected. Note that if there are eight suction nozzles 12b, there would be eight placement times per turn in FIG. 6; however, this is omitted here and only three placement times per turn are shown.

[0066] In the comparative example, the mounting head 12 does not have a memory 131. In the comparative example, the mounting head 12 does not have a memory 131 and is unable to store log data. Therefore, as shown in FIG. 6(a), log data for mounting components, which change from moment to moment, must be collected each time a component is placed. As a result, when a component is placed, time is required to collect the log data, and a wait time for data collection occurs before starting to move to the location where the next component is to be placed. Therefore, as shown in FIG. 6(a), a delay occurs, which may affect the takt time.

[0067] On the other hand, in the embodiment, because the mounting head 12 has memory 131, as shown in FIG. 6(b), log data for component placement, which changes from moment to moment, does not need to be collected each time a component is placed, but can be stored in memory 131. Then, after the mounting head 12 has placed all of the components to be placed in one turn onto the board, the collection unit 111 collects the log data from memory 131 while the mounting head 12 is moving to feeder 9 to pick up the components to be placed in the next turn. This time does not affect the operation of component placement device M3 to place components onto the board, so by collecting log data during this time, data collection can be performed while minimizing the impact on takt time. It can be seen that the delay that occurred in the comparative example of FIG. 6(a) does not occur in the embodiment of FIG. 6(b).

[0068] In this way, because the mounting head 12 for mounting components on the board has the memory 131 in which log data related to the operation of the mounting head 12 is stored, the log data stored in the memory 131 can be collected at any time. In other words, the log data can be collected at a time when there is little or no impact on the takt time. Therefore, data can be collected while minimizing the impact on the takt time.

[0069] Incidentally, when collecting log data from memory 132 of mounting head moving mechanism 13, collection unit 111 collects the log data at a time that does not affect the operation of component mounting device M3 to mount components on the board. Specifically, collection unit 111 collects the log data during the waiting time until the board is transported to the position where the components are to be mounted on the board.

[0070] For example, if the mounting head moving mechanism 13 does not have the memory 132, it will not be able to store log data, and therefore the mounting head moving mechanism 13 will need to move the mounting head 12 in the X direction, then collect log data (such as torque data) about the movement in the X direction, and then move the mounting head 12 in the Y direction, and then collect log data about the movement in the Y direction. This means that time is required to collect log data every time the direction of movement of the mounting head 12 is changed, and a wait time for data collection occurs before starting movement in the next direction. This can cause delays and affect the takt time.

[0071] On the other hand, if the mounting head moving mechanism 13 has memory 132, it is not necessary to collect log data when moving the mounting head 12 each time the direction of movement of the mounting head 12 is changed, and the data can be stored in memory 132. Then, for example, the log data is collected from memory 132 during the waiting time until the board is transported to the position where the components are to be mounted on the board. This time does not affect the operation of component mounting device M3 to mount components on the board, so by collecting the log data during this time, data collection can be performed while minimizing the impact on the takt time.

[0072] Furthermore, when collecting log data from the memory 133 of the feeder 9, the collection unit 111 collects the log data at a time that does not affect the operation of the component mounting device M3 to mount components on the board. Specifically, the collection unit 111 collects the log data after the feeder 9 has completed supplying components to all of the suction nozzles 12b of the mounting head 12.

[0073] For example, if the feeder 9 does not have the memory 133, it cannot store log data, so after a part is fed, it is necessary to collect log data (such as torque data) about that feeding, and then after the next part is fed, it is necessary to collect log data about that feeding. Therefore, it takes time to collect log data every time a part is fed, and there is a wait time for data collection before starting to feed the next part. This causes a delay, which may affect the takt time.

[0074] On the other hand, if the feeder 9 has the memory 133, it is not necessary to collect the log data when a component is fed out each time a component is fed out, and the log data can be stored in the memory 133. Then, for example, the log data is collected from the memory 133 after the feeder 9 has completed supplying components to all of the suction nozzles 12b of the mounting head 12. This time does not affect the operation of the component mounting device M3 to mount components on the board, so by collecting the log data at this time, it is possible to collect data while minimizing the impact on the takt time.

[0075] FIG. 7 is a flowchart showing the operation when data of the component mounting apparatus M3 according to the embodiment is stored in association with a board.

[0076] The control unit 110 mounts the component on the board (step S31). Step S31 is the process from step S11 to step S23 shown in FIG.

[0077] Next, control unit 110 stores log data obtained when components were mounted on the board in step S31 in association with the board (step S32).

[0078] Next, the control unit 110 determines whether or not there is a next board (step S33). If there is a next board (Yes in step S33), the process from step S31 is performed for the next board. As a result, log data for each board is stored in association with each board. If there is no next board (No in step S33), the process ends.

[0079] FIG. 8 is a flowchart showing the operation of the component mounting apparatus M3 according to the embodiment when data is transferred.

[0080] The receiving unit 114 determines whether or not the inspection results have been received (step S41). For example, the receiving unit 114 determines whether or not the inspection results of an inspection device selected from among the multiple types of inspection devices by the selecting unit 112 have been received. The selecting unit 112 can select which of the multiple types of inspection devices the inspection results of which will be used to determine whether or not to delete the log data. If the inspection results have not been received (No in step S41), the processing in step S41 is performed again. That is, in step S41, the reception of the inspection results is waited for.

[0081] When the receiving unit 114 receives the test result (Yes in step S41), the deleting unit 115 determines whether the test result received by the receiving unit 114 indicates that the test result is good (step S42).

[0082] If the inspection result indicates a good result (Yes in step S42), the deletion unit 115 deletes the log data corresponding to the inspection result from the storage unit 120 (step S43). For example, if the inspection result indicates a good result for a board inspected by the board visual inspection device M9 or the board shipping inspection device M10, the deletion unit 115 deletes the log data stored in association with the board inspected by the board visual inspection device M9 or the board shipping inspection device M10 from the storage unit 120. The log data is log data related to the operation of the production device (such as the screen printing device M2, the component mounting device M3, or the reflow device M7) used to produce the inspected board. If the inspection result for the board is good, analysis of the log data corresponding to the inspection result is unnecessary, and there is often no problem in deleting it. In this way, the log data corresponding to a good inspection result is deleted from the log data stored in the storage unit 120, thereby reducing the storage capacity of the storage unit 120.

[0083] If the inspection result indicates that the inspection is not good (No in step S42), the process in step S43 is not performed. In other words, the log data corresponding to the inspection result that indicates that the inspection is not good is not deleted from the storage unit 120. If the inspection result of the board is not good, it is often necessary to analyze the log data corresponding to the inspection result, so the log data corresponding to the inspection result that is not good is not deleted.

[0084] Next, the transfer unit 116 determines whether a predetermined condition is met (step S44). The predetermined condition is met, for example, when the amount of log data stored in the storage unit 120 reaches a predetermined amount, when a transfer request is received, or when a predetermined timing occurs. If the predetermined condition is not met (No in step S44), the processes from step S41 to step S43 are repeated until the predetermined condition is met.

[0085] If the predetermined condition is met (Yes in step S44), the transfer unit 116 transfers the log data stored in the storage unit 120 to the external device (step S45). As described above, the log data corresponding to good test results is deleted from the log data stored in the storage unit 120, so the amount of log data transferred to the external device is reduced, making it possible to reduce the storage capacity of the external device.

[0086] Note that the process from step S41 may not be performed if switching unit 113 has switched so that the log data is not deleted from storage unit 120. That is, in this case, even if the test result indicates that the test is good, the log data corresponding to the test result may not be deleted.

[0087] As explained above, if the inspection results of a board are good, there is no need to analyze the log data corresponding to the inspection results, and there are many cases where deleting the log data does not pose a problem. Therefore, by deleting the log data corresponding to good inspection results, it is possible to reduce the storage capacity.

[0088] (Other embodiments) The production apparatuses (component mounting apparatus M3, screen printing apparatus M2, reflow apparatus M7, etc.) of the present disclosure have been described above based on the embodiments, but the present disclosure is not limited to the above-described embodiments. As long as they do not deviate from the spirit of the present disclosure, various modifications that a person skilled in the art can make to the present embodiments, and configurations constructed by combining components of different embodiments, are also included within the scope of the present disclosure.

[0089] For example, in the above embodiment, an example has been described in which control unit 110 includes selection unit 112, but control unit 110 may not include selection unit 112. For example, the test results used to determine whether or not to delete log data do not need to be selected, and may be test results of a predetermined test device.

[0090] For example, in the above embodiment, an example has been described in which control unit 110 includes switching unit 113, but control unit 110 may not include switching unit 113. For example, deletion unit 115 may not be able to switch whether or not to delete log data from storage unit 120.

[0091] For example, the present disclosure can be realized not only as a production device, but also as a data management method including steps (processing) performed by each component of the production device.

[0092] The data management method is executed by a production device for producing a board having components mounted thereon, the production device having a memory unit that stores log data related to operations for producing the board, and the data management method includes, as shown in FIG. 8, a process of receiving inspection results for the board (Yes in step S41), and if the received inspection results indicate that the inspection results are good (Yes in step S42), deleting the log data corresponding to the inspection results from the memory unit (step S43), and transferring the log data stored in the memory unit to an external device (step S45).

[0093] For example, the steps in the data management method may be executed by a computer (computer system). The present disclosure can be realized as a program for causing a computer to execute the steps included in the data management method. Furthermore, the present disclosure can be realized as a non-transitory computer-readable recording medium, such as a CD-ROM, on which the program is recorded.

[0094] For example, when the present disclosure is realized as a program (software), each step is performed by running the program using hardware resources such as a computer's CPU, memory, input / output circuits, etc. In other words, each step is performed by the CPU acquiring data from memory or input / output circuits, etc., performing calculations, and outputting the calculation results to memory or input / output circuits, etc.

[0095] Furthermore, each of the components included in the production device of the above embodiment may be realized as a dedicated or general-purpose circuit.

[0096] Furthermore, each of the components included in the production device of the above-described embodiment may be realized as an LSI (Large Scale Integration) which is an integrated circuit (IC).

[0097] Furthermore, the integrated circuit is not limited to an LSI, but may be realized by a dedicated circuit or a general-purpose processor. A programmable FPGA (Field Programmable Gate Array) or a reconfigurable processor in which the connections and settings of circuit cells within the LSI can be reconfigured may also be used.

[0098] Furthermore, if an integrated circuit technology that can replace LSI emerges due to advances in semiconductor technology or other derivative technologies, that technology may naturally be used to integrate each component included in the production equipment.

[0099] In addition, this disclosure also includes forms obtained by making various modifications to the embodiments that a person skilled in the art would think of, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope of the present disclosure. [Industrial Applicability]

[0100] The present disclosure is useful in fields where production devices such as component mounting devices are used to produce boards and the like on which components are mounted. [Explanation of symbols]

[0101] 2 Network 3 Management device 5 carts 6 Base 7. Substrate transport mechanism 8 Parts Supply Department 9 Feeder 10 Y-axis table 11 Beam 12 Mounting head 12a Nozzle unit 12b Suction nozzle 13 Mounting head movement mechanism 14 Head Camera 15 Parts Recognition Camera 16 Carrier tape 17 reels 100 Main Controller 110 control section 111 Collection Department 112 Selection section 113 Switching section 114 Receiving unit 115 Deleted section 116 Transfer Department 120 Storage section 121 Implementation Data 122 parts data 123 Log Data 124 Test result data 131, 132, 133 Memory M1 board supply device M2 Screen Printing Machine M3, M4, M5, M6 parts mounting device M7 Reflow Machine M8 PCB collection device M9 PCB visual inspection device M10 PCB shipping inspection device

Claims

1. A production apparatus for producing a board on which components are mounted, a storage unit that stores log data related to operations for producing the substrate; a receiving unit that receives the inspection results of the substrate; a deletion unit that deletes log data corresponding to the inspection result from the storage unit when the inspection result received by the receiving unit indicates that the inspection result is good; a transfer unit that transfers the log data stored in the storage unit to an external device. Production equipment.

2. the receiving unit receives inspection results of the substrate from an inspection machine that inspects the substrate; The production device according to claim 1 .

3. the receiving unit receives the inspection result of the substrate from an external device. The production device according to claim 1 .

4. The inspection of the substrate is performed by a plurality of types of inspection devices, the production device further includes a selection unit for selecting one of the plurality of types of inspection devices; the deletion unit, when the inspection result received by the receiving unit and obtained by the inspection device selected by the selecting unit indicates a good result, deletes the log data corresponding to the inspection result from the storage unit; The production device according to any one of claims 1 to 3.

5. The production device further includes a switching unit that switches whether or not the deletion unit deletes the log data from the storage unit. The production device according to any one of claims 1 to 4.

6. 1. A data management method executed by a production device for producing a board on which components are mounted, comprising: the production device includes a storage unit that stores log data related to operations for producing the substrate; The data management method includes: receiving an inspection result of the substrate; If the received test result indicates a good result, delete the log data corresponding to the test result from the storage unit; transferring the log data stored in the storage unit to an external device; Data management methods.

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