Grinding device

Abstract

The present invention improves uniformity of a supply range of a polishing liquid when supplying the polishing liquid while moving, over a polishing pad, a polishing liquid supply head having a plurality of polishing liquid supply ports.　A polishing device 1 includes: a polishing table for supporting a polishing pad 100; a polishing head 30 for holding an object; and a polishing liquid supply device 40 for supplying a polishing liquid between the polishing pad 100 and the object. The polishing liquid supply device 40 includes: a polishing liquid supply head 41 having a plurality of polishing liquid supply ports 414; a link mechanism 60 configured to move the polishing liquid supply head 41 along a polishing surface of the polishing pad 100; and a drive mechanism 90 configured to drive the link mechanism 60. The drive mechanism 90 is configured to drive the link mechanism 60 so that the plurality of polishing liquid supply ports 414 are aligned along the radial direction of the polishing pad 100 in a first state 450 in which the polishing liquid supply head 41 is disposed close to the center of the polishing pad 100, and that the plurality of polishing liquid supply ports 414 are aligned along the radial direction of the polishing pad 100 in a second state 460 in which the polishing liquid supply head 41 is disposed closer to the outer edge of the polishing pad 100 than in the first state 450.

Description

[Technical Field]

[0001] The present application relates to a polishing apparatus. [Background technology]

[0002] In the manufacturing process of semiconductor devices, technology for planarizing the surface of semiconductor devices is becoming increasingly important. One known planarization technology is chemical mechanical polishing (CMP). This chemical mechanical polishing uses a polishing device to polish a substrate such as a semiconductor wafer by sliding it against a polishing pad while supplying a polishing liquid (slurry) containing abrasive grains such as silica (SiO2) and / or ceria (CeO2) to the polishing pad.

[0003] A polishing apparatus for performing the CMP process includes a polishing table for supporting a polishing pad, a polishing head for holding an object such as a substrate, and a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the substrate. This polishing apparatus supplies a polishing liquid from the polishing liquid supply device to the polishing pad, presses the substrate against the surface (polishing surface) of the polishing pad with a predetermined pressure, and rotates the polishing table and polishing head to polish the surface of the substrate to a flat surface.

[0004] Patent Document 1 discloses a polishing liquid supplying device for supplying a polishing liquid to a polishing pad. This polishing liquid supplying device has multiple arms connected by multiple hinged joints and is configured to supply a polishing liquid through nozzles provided at the ends of the arms. Because the multiple arms connected by the hinged joints can each be moved with a desired degree of freedom, this polishing liquid supplying device can supply a polishing liquid to a desired area on the polishing pad.

[0005] Patent Document 2 discloses a polishing liquid supplying device for supplying a polishing liquid to a polishing pad. This polishing liquid supplying device can supply polishing liquid to a larger area of ​​the polishing pad by linearly driving a dispenser arm having multiple nozzles arranged along the radial direction of the polishing pad. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Special Publication No. 2011-530422 [Patent Document 2] Special Publication No. 2011-530422 Summary of the Invention [Problem to be solved by the invention]

[0007] However, conventional technologies such as Patent Document 1 do not take into consideration improving the uniformity of the polishing liquid supply range when polishing liquid is supplied while a polishing liquid supply head having multiple polishing liquid supply ports is moved over a polishing pad.

[0008] In other words, a typical polishing liquid supply device rotates an arm holding the polishing liquid supply head above the polishing table, moving the polishing liquid supply head over the polishing pad while supplying the polishing liquid. In this case, for example, near the center of the polishing pad, the polishing liquid supply range is wide because the polishing liquid supply ports of the polishing liquid supply head are arranged in the radial direction of the polishing pad. In contrast, if the arm is rotated to move the polishing liquid supply head toward the outer edge of the polishing pad, the arrangement direction of the polishing liquid supply ports shifts from the radial direction to the circumferential direction of the polishing pad, narrowing the polishing liquid supply range.

[0009] In this regard, the polishing liquid supply device disclosed in Patent Document 1 moves multiple arms connected by multiple hinge joints with a desired degree of freedom, but does not consider improving the uniformity of the polishing liquid supply range.

[0010] Therefore, one object of the present invention is to improve the uniformity of the polishing liquid supply range when a polishing liquid is supplied while a polishing liquid supply head having multiple polishing liquid supply ports is moved over a polishing pad.

[0011] Furthermore, conventional technologies such as Patent Document 2 have room for improvement in terms of improving the uniformity of the supply range of polishing liquid to the polishing pad and suppressing the occurrence of defects on the substrate due to polishing liquid bouncing off the polishing pad.

[0012] That is, a typical polishing liquid supply device holds a polishing liquid supply head with multiple polishing liquid supply ports on an arm, and rotates the arm above the polishing table to move the polishing liquid supply head over the polishing pad while supplying the polishing liquid. In this case, for example, near the center of the polishing pad, the multiple polishing liquid supply ports of the polishing liquid supply head are arranged in the radial direction of the polishing pad, so the polishing liquid supply range is wide. In contrast, if the arm is rotated to move the polishing liquid supply head toward the outer edge of the polishing pad, the arrangement direction of the multiple polishing liquid supply ports shifts from the radial direction to the circumferential direction of the polishing pad, narrowing the polishing liquid supply range.

[0013] In this regard, the technology described in Patent Document 2 drives the polishing liquid supply head linearly in the radial direction of the polishing pad, but does not take into consideration the rebound of the polishing liquid from the polishing pad. In other words, in the technology described in Patent Document 2, the polishing liquid supply head and the arm are positioned at the same height, so the polishing liquid supplied from the polishing liquid supply head collides with the polishing surface of the polishing pad and splashes onto the polishing pad, easily adhering to the arm. If the polishing liquid adheres to the arm, the polishing liquid may dry into dust and then fall onto the polishing pad, potentially causing scratches or other defects on the substrate.

[0014] Therefore, one object of the present invention is to improve the uniformity of the supply range of polishing liquid to the polishing pad and to suppress the occurrence of defects on the substrate due to polishing liquid bouncing off the polishing pad. [Means for solving the problem]

[0015] According to one embodiment, a polishing apparatus is disclosed that includes a table for supporting a polishing pad, a polishing head for holding an object, and a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the object, and polishes the object by contacting the polishing pad and the object in the presence of a polishing liquid and rotating them relative to each other. The polishing liquid supply device includes a polishing liquid supply head having a plurality of polishing liquid supply ports, a link mechanism configured to move the polishing liquid supply head along the polishing surface of the polishing pad, and a drive mechanism configured to drive the link mechanism. The drive mechanism is configured to drive the link mechanism so that in a first state in which the polishing liquid supply head is positioned opposite the center of the polishing pad, the plurality of polishing liquid supply ports are arranged along the radial direction of the polishing pad, and in a second state in which the polishing liquid supply head is positioned opposite the outer edge of the polishing pad more than in the first state, the plurality of polishing liquid supply ports are arranged along the radial direction of the polishing pad.

[0016] According to one embodiment, a polishing apparatus is disclosed that includes a table for supporting a polishing pad, a polishing head for holding an object, and a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the object, and polishes the object by contacting the polishing pad and the object in the presence of a polishing liquid and rotating them relative to each other, wherein the polishing liquid supply device includes a polishing liquid supply head having a plurality of polishing liquid supply ports, an arm that extends along the polishing surface of the polishing pad at a position higher than the polishing liquid supply head and is configured to hold the polishing liquid supply head, and a linear drive mechanism configured to linearly move the polishing liquid supply head along the radial direction of the polishing pad between the center side and the outer edge side of the polishing pad with the plurality of polishing liquid supply ports facing the polishing pad and arranged along the radial direction of the polishing pad. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view showing a schematic configuration of a polishing apparatus according to one embodiment. [Figure 2] FIG. 2 is a cross-sectional view schematically showing the configuration of the polishing liquid supply head. [Figure 3] FIG. 3 is a top view showing a schematic configuration of a polishing apparatus according to an embodiment. [Figure 4] FIG. 4 is a top view showing a schematic configuration of a polishing apparatus according to a comparative example. [Figure 5A] FIG. 5A is a side view showing a schematic configuration of an atomizer according to one embodiment, illustrating the state of the atomizer when supplying a cleaning fluid. [Figure 5B] FIG. 5B is a side view showing a schematic configuration of an atomizer according to one embodiment, illustrating the state of the atomizer when no cleaning fluid is supplied. [Figure 6A] FIG. 6A is a bottom view showing a schematic configuration of an atomizer according to one embodiment. [Figure 6B] FIG. 6B is a cross-sectional view of the atomizer of FIG. 6A taken along line BB. [Figure 7A] FIG. 7A is a cross-sectional view showing a schematic configuration of an atomizer according to a modified example. [Figure 7B] FIG. 7B is a cross-sectional view showing a schematic configuration of an atomizer according to a modified example. [Figure 8] FIG. 8 is a perspective view showing a schematic configuration of a polishing apparatus according to one embodiment. [Figure 9A] FIG. 9A is a perspective view showing a schematic configuration of a polishing liquid supplying apparatus according to one embodiment, showing a state in which the arm is extended. [Figure 9B] FIG. 9B is a side view showing a schematic configuration of the polishing liquid supplying apparatus according to one embodiment, with the arm extended. [Figure 9C] FIG. 9C is a perspective view showing a schematic configuration of the polishing liquid supply apparatus according to one embodiment, showing a state in which the arm is retracted. [Figure 9D]FIG. 9D is a side view showing a schematic configuration of the polishing liquid supply apparatus according to one embodiment, in which the arm is retracted. [Figure 10A] FIG. 10A is a top view showing a schematic configuration of a polishing apparatus according to one embodiment, in which a polishing liquid supply head is disposed on the central side of a polishing pad. [Figure 10B] FIG. 10B is a top view showing a schematic configuration of a polishing apparatus according to one embodiment, in which the polishing liquid supply head is disposed on the outer edge side of the polishing pad. [Figure 10C] FIG. 10C is a top view showing a schematic configuration of a polishing apparatus according to an embodiment, in which a polishing liquid supply head is disposed outside a polishing table. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the accompanying drawings, identical or similar elements are designated by identical or similar reference numerals, and duplicate descriptions of identical or similar elements may be omitted in the description of each embodiment. Furthermore, features shown in each embodiment may also be applied to other embodiments as long as they are not mutually inconsistent.

[0019] In this specification, the term "substrate" includes not only semiconductor substrates, glass substrates, liquid crystal substrates, and printed circuit boards, but also magnetic recording media, magnetic recording sensors, mirrors, optical elements, micromechanical elements, partially fabricated integrated circuits, and any other object to be processed. Substrates include those of any shape, including polygonal and circular. Furthermore, terms such as "front," "rear," "forward," "rearward," "upward," "downward," "left," "right," "vertical," and "horizontal" may be used in this specification. However, for the sake of convenience, these terms indicate positions and directions on the paper of the illustrative drawings, and may differ in actual placement when the device is in use, etc.

[0020] (General configuration of polishing device) FIG. 1 is a perspective view showing the schematic configuration of a polishing apparatus according to one embodiment. The polishing apparatus 1 of this embodiment is configured to use a polishing pad 100 having a polishing surface 102 to polish a disc-shaped substrate WF, such as a semiconductor wafer, as a polishing target. As shown in the figure, the polishing apparatus 1 includes a polishing table 20 for supporting the disc-shaped polishing pad 100 and a polishing head 30 for holding the substrate WF and pressing it against the polishing surface 102 of the polishing pad 100. The polishing apparatus 1 also includes a polishing liquid supply device 40 for supplying a polishing liquid (slurry) between the polishing pad 100 and the substrate WF, a cleaning mechanism 300 for supplying a cleaning liquid to the polishing liquid supply device 40, which is rotated outside the polishing pad 100, and an atomizer 50 for spraying a cleaning fluid (liquid such as pure water and / or gas such as nitrogen) onto the polishing surface 102 to wash away used polishing liquid, polishing residue, and the like. The polishing liquid supply device 40 is located upstream of the rotation of the polishing pad 100 relative to the substrate WF. 1 shows an example in which the cleaning mechanism 300 is disposed above the polishing liquid supply apparatus 40, but the present invention is not limited to this. For example, the cleaning mechanisms 300 may be disposed above and below the polishing liquid supply apparatus 40, so that the polishing liquid supply apparatus 40 can be cleaned from above and below. In this specification, the terms "upstream" and "downstream" refer to the upstream and downstream directions when the polishing table 20 (polishing pad 100) rotates clockwise when viewed from above in FIG.

[0021] (Polishing table) The polishing table 20 is formed in a disk shape and is rotatable around its central axis. A polishing pad 100 is attached to the polishing table 20 by adhesive or the like. The surface of the polishing pad 100 forms a polishing surface 102. The polishing pad 100 rotates integrally with the polishing table 20 as the polishing table 20 is rotated by a motor (not shown).

[0022] (Polishing head) The polishing head 30 holds the substrate WF on its underside by vacuum suction or the like. The polishing head 30 is configured to rotate together with the substrate by power from a motor (not shown). The upper part of the polishing head 30 is connected to a support arm 34 via a shaft 31. The polishing head 30 can move up and down by motor drive via an air cylinder or ball screw (not shown), and the distance from the polishing table 20 can be adjusted. This allows the polishing head 30 to press the substrate WF it holds against the polishing surface 102. The polishing head 30 also has an internal air bag divided into multiple regions (not shown), and pressure is applied to each air bag region by supplying air or other fluid pressure to pressurize the substrate WF from the backside. The support arm 34 is also configured to be rotatable by a motor (not shown), moving the polishing head 30 in a direction parallel to the polishing surface 102. In this embodiment, the polishing head 30 is configured to be movable between a substrate receiving position (not shown) and a position above the polishing pad 100, and is also configured to be able to change the pressing position of the substrate WF against the polishing pad 100.

[0023] (polishing liquid supply device) The polishing liquid supply device 40 includes a polishing liquid supply head 41 for supplying a polishing liquid to the polishing pad 100. FIG. 2 is a cross-sectional view showing a schematic configuration of the polishing liquid supply head. As shown in FIG. 2, the polishing liquid supply head 41 includes a supply member main body 410 and a cover member 430 connected to the supply member main body 410 via a packing 440. The supply member main body 410 is formed in the shape of a rectangular plate and has a recess in the center. A plurality of polishing liquid supply ports 414 are formed in the recessed portion of the supply member main body 410 and are arranged along the longitudinal direction.

[0024] The shape of polishing liquid supply port 414 is formed as a hole in supply member body 410, but is not limited to this, and may be a nozzle protruding from the lower surface of supply member body 410. It is more desirable that the nozzle serving as polishing liquid supply port 414 has a conical shape with an acute angle at the tip.

[0025] The cover member 430 is connected to the polishing liquid supply line 120. A buffer space 420 is formed between the cover member 430 and the supply member main body 410. A flow rate adjustment mechanism 125 for adjusting the flow rate of the polishing liquid supplied from the polishing liquid supply device 40 is connected to the base end of the polishing liquid supply line 120. The tip end of the polishing liquid supply line 120 is connected to the buffer space 420. The buffer space 420 temporarily stores the polishing liquid supplied from the polishing liquid supply line 120, thereby equalizing the back pressure of the polishing liquid supplied to the multiple polishing liquid supply ports 414. As a result, the polishing liquid supplied from the polishing liquid supply line 120 is stored in the buffer space 420 and then dripped onto the polishing pad 100 from the multiple polishing liquid supply ports 414. The polishing liquid dripped onto the polishing pad 100 is supplied to the polished surface of the substrate WF by the rotation of the polishing table 20.

[0026] 1 and 3, a polishing liquid supplying device 40 includes a polishing liquid supplying head 41, a link mechanism 60 configured to move the polishing liquid supplying head 41 along the polishing surface 102 of the polishing pad 100, and a drive mechanism 90 configured to drive the link mechanism 60.

[0027] The link mechanism 60 includes a first arm 60-1 configured to hold the polishing liquid supply head 41 via a connecting member 61 extending vertically from the polishing liquid supply head 41, and a second arm 60-2 connected to the first arm 60-1. The first arm 60-1 and the second arm 60-2 extend horizontally. The polishing liquid supply device 40 is disposed adjacent to the polishing table 20 and includes a shaft 92 extending vertically. The link mechanism 60 includes a first connecting member (first joint) 60-3 that rotatably connects the first arm 60-1 to the second arm 60-2, and a second connecting member (second joint) 60-4 that rotatably connects the second arm 60-2 to the shaft 92. Both the first connecting member 60-3 and the second connecting member 60-4 are disposed outside the polishing table 20. The polishing liquid supply device 40 includes an elevating mechanism 80 configured to raise and lower the polishing liquid supply head 41, the link mechanism 60, and the drive mechanism 90 together. The elevating mechanism 80 can be realized by a known mechanism such as a motor. In this embodiment, the link mechanism 60 includes two arms and two connecting members, but is not limited to this. Various link mechanisms that can move the polishing liquid supply head 41 along the polishing surface 102 of the polishing pad 100 can be used.

[0028] The drive mechanism 90 includes a first rotation mechanism 90-1 for rotating the first arm 60-1 around the first connecting member 60-3 so as to pivot the polishing liquid supply head 41 along the polishing surface 102 of the polishing pad 100. The drive mechanism 90 also includes a second rotation mechanism 90-2 for rotating the second arm 60-2 around the second connecting member 60-4 so as to pivot the first arm 60-1. The first rotation mechanism 90-1 and the second rotation mechanism 90-2 can be realized by known mechanisms such as motors. The first rotation mechanism 90-1 and the second rotation mechanism 90-2 are configured to rotate the first arm 60-1 and the second arm 60-2 so as to move the polishing liquid supply head 41 horizontally along the polishing surface 102 of the polishing pad 100. The first rotation mechanism 90-1 and the second rotation mechanism 90-2 place the polishing liquid supply head 41 on the polishing pad 100 when performing the polishing process, and retract the polishing liquid supply head 41 to the outside of the polishing table 20 when the polishing process is completed.

[0029] In this embodiment, the first rotation mechanism 90-1 and the second rotation mechanism 90-2 are configured to rotate the first arm 60-1 and the second arm 60-2 so that the multiple polishing liquid supply ports 414 of the polishing liquid supply head 41 are always arranged along the radial direction of the polishing pad 100 while the polishing liquid is being supplied to the polishing pad 100. In this specification, the radial direction of the polishing pad 100 does not strictly refer to only the radial direction of the polishing pad 100, but also includes angles within a range of ±10°.

[0030] 3, the first rotation mechanism 90-1 and the second rotation mechanism 90-2 are configured to rotate the first arm 60-1 and the second arm 60-2 to move between a first state 450 in which the polishing liquid supply head 41 is disposed facing the center of the polishing pad 100, a second state 460 in which the polishing liquid supply head 41 is disposed facing the outer edge of the polishing pad 100 closer to the outer edge than in the first state 450, and a third state 470 in which the polishing liquid supply head 41 is disposed outside the polishing table 20. As shown in FIG. 3, the drive mechanism 90 is configured to rotate the first arm 60-1 and the second arm 60-2 in the first state 450 so that the multiple polishing liquid supply ports 414 are arranged along the radial direction of the polishing pad 100. Furthermore, even in the second state 460, the drive mechanism 90 is configured to rotate the first arm 60-1 and the second arm 60-2 so that the plurality of polishing liquid supply ports 414 are arranged along the radial direction of the polishing pad 100. Therefore, according to this embodiment, when the polishing liquid is supplied while the polishing liquid supply head 41 is moving over the polishing pad 100, the uniformity of the supply range of the polishing liquid can be improved. This point will be described below.

[0031] FIG. 4 is a top view showing a schematic configuration of a polishing apparatus according to a comparative example. The polishing apparatus according to the comparative example includes a polishing liquid supply head 1041 similar to that of the present embodiment, an arm 1060 that holds the polishing liquid supply head 1041, a shaft 1092 that rotatably holds the arm 1060, and a rotation mechanism (not shown) for rotating the arm 1060 about the shaft 1092. In this polishing apparatus according to the comparative example, in a state 1100 in which the polishing liquid supply head 1041 is positioned toward the center of the polishing pad 1000, the polishing liquid supply ports 1414 are arranged along the radial direction of the polishing pad 1000. Therefore, the polishing liquid supply range 1112 is wide in the radial direction of the polishing pad. On the other hand, in a state 1200 in which the arm 1060 is rotated about the shaft 1092 and the polishing liquid supply head 1041 is positioned toward the outer edge of the polishing pad 1000, the arrangement direction of the polishing liquid supply ports 1414 is shifted circumferentially from the radial direction of the polishing pad 1000. Therefore, the radial width of the polishing pad in the polishing liquid supply range 1110 is narrower than the supply range 1112. As a result, the amount of slurry supplied for a given radial width of the substrate WF differs, making it difficult to uniformly supply the polishing liquid to the substrate WF, and therefore making it difficult to polish the substrate WF uniformly and efficiently.

[0032] In contrast, according to the polishing apparatus 1 of this embodiment, in either the first state 450 in which the polishing liquid supply head 41 is above the polishing pad 100 or the second state 460, the multiple polishing liquid supply ports 414 are arranged along the radial direction of the polishing pad 100. Therefore, the radial width of the polishing pad of the polishing liquid supply range in the first state 450 is approximately equal to the radial width of the polishing pad of the polishing liquid supply range in the second state 460, so that the polishing liquid can be supplied uniformly to the substrate WF, and as a result, the substrate WF can be polished uniformly and efficiently.

[0033] 3, it is desirable that in the first state 450, the slurry dropping position of at least one of the plurality of polishing liquid supply ports 414 (i.e., the innermost polishing liquid supply port) coincides with the inner edge of the area on the polishing pad with which the substrate WF comes into contact. Also, it is desirable that in the second state 460, the slurry dropping position of at least one of the plurality of polishing liquid supply ports 414 (i.e., the outermost polishing liquid supply port) coincides with the outer edge of the area on the polishing pad with which the substrate WF comes into contact, as shown by dashed line 480 in FIG.

[0034] Furthermore, the polishing apparatus 1 of this embodiment can prevent the polished surface of the substrate WF from being damaged by dust generated by the polishing liquid supply device 40. Specifically, in a portion where two different members (the first arm 60-1 and the second arm 60-2, or the second arm 60-2 and the shaft 92) are connected, such as the first connecting member 60-3 or the second connecting member 60-4, there is a risk of dust, such as wear powder, being generated by sliding between the members. If the dust falls onto the polishing pad 100, the dust may get between the substrate WF and the polishing pad 100 due to the rotation of the polishing table 20, potentially damaging the polished surface of the substrate WF. In contrast, the first connecting member 60-3 and the second connecting member 60-4 of this embodiment are disposed outside the polishing table 20. Therefore, even if dust is generated due to sliding between the first connecting member 60-3 or the second connecting member 60-4, it can be prevented from falling onto the polishing pad 100, and as a result, damage to the polished surface of the substrate WF can be prevented.

[0035] (atomizer) Next, the atomizer 50 of the polishing apparatus 1 of this embodiment will be described. Fig. 5A is a side view showing the schematic configuration of the atomizer according to one embodiment, illustrating the state of the atomizer when a cleaning fluid is being supplied. Fig. 5B is a side view showing the schematic configuration of the atomizer according to one embodiment, illustrating the state of the atomizer when a cleaning fluid is not being supplied.

[0036] As shown in FIGS. 5A and 5B, the atomizer 50 includes an atomizer body 52 configured to supply a cleaning fluid to the polishing pad 100. The cleaning fluid is, for example, a mixed fluid of pure water and a gas (e.g., N2). The atomizer body 52 is a rectangular plate-shaped member disposed opposite the polishing pad 100. The atomizer body 52 is formed with a flow path 52d extending from the base end 52-2 of the atomizer body 52 to near the tip end 52-1. The atomizer 50 includes a fluid source 55 for supplying the cleaning fluid to the atomizer body 52. ​​The fluid source 55 is connected to the flow path 52d. The atomizer body 52 is formed with a plurality of holes 52b that communicate between the bottom surface 52a of the atomizer body 52 and the flow path 52d. The plurality of holes 52b are formed at predetermined intervals along the longitudinal direction of the atomizer body 52. The atomizer body 52 is configured to supply cleaning fluid to the polishing pad 100 via the flow passage 52d and the plurality of holes 52b.

[0037] The atomizer 50 includes a tilting mechanism 59 for tilting the atomizer body 52 so that the tip 52-1 of the atomizer body 52 is higher than the base end 52-2. The tilting mechanism 59 includes a link mechanism 51 connected to the atomizer body 52, and a drive mechanism 53 for driving the link mechanism 51 to tilt the atomizer body 52.

[0038] Specifically, the link mechanism 51 includes a first link member 54-1, a second link member 54-2 connected to the first link member 54-1, and a third link member 54-3 connected to the second link member 54-2. The first link member 54-1 is a rod-shaped member having a bent portion. The bent portion of the first link member 54-1 is supported by a first rotation shaft 56-1 extending in a direction horizontally perpendicular to the longitudinal direction of the atomizer body 52. ​​The first rotation shaft 56-1 is supported by a bearing (not shown) and its position is fixed. This allows the first link member 54-1 to rotate around the first rotation shaft 56-1. A first end of the first link member 54-1 is connected to the base end 52-2 of the atomizer body 52, and a second end on the opposite side of the first rotating shaft 56-1 is connected to the second link member 54-2 via the second rotating shaft 56-2.

[0039] The second link member 54-2 has a first end connected to the first link member 54-1 via a second rotation shaft 56-2 and a second end connected to the third link member 54-3 via a third rotation shaft 56-3. The third link member 54-3 is a rod-shaped member extending vertically, and has a first end connected to the second link member 54-2 via the third rotation shaft 56-3 and a second end connected to the drive mechanism 53.

[0040] The drive mechanism 53 is configured to raise and lower the third link member 54-3. The drive mechanism 53 can be realized by a known mechanism such as a motor or a cylinder. As shown in FIG. 5A, when supplying cleaning fluid to the polishing pad 100, the atomizer body 52 extends horizontally. In other words, when supplying cleaning fluid to the polishing pad 100, the tip 52-1 and the base 52-2 of the atomizer body 52 are at approximately the same height. Here, when the atomizer 50 is in the state shown in FIG. 5A, if the polishing liquid supply head 41 is moved above the polishing pad 100, the atomizer body 52 and the polishing liquid supply head 41 may come into contact with each other. For this reason, as shown in FIG. 5B, when not supplying cleaning fluid to the polishing pad 100, the atomizer 50 of this embodiment is tilted by raising the tip 52-1 of the atomizer body 52 so that the tip 52-1 is higher than the base 52-2.

[0041] That is, when the supply of the cleaning fluid is completed, the drive mechanism 53 lowers the third link member 54-3 as shown in FIG. 5B. Accordingly, the second link member 54-2 lowers, and the second end of the first link member 54-1 is pushed down. As a result, the first link member 54-1 rotates around the first rotation shaft 56-1, and the first end of the first link member 54-1 rises, and the tip 52-1 of the atomizer body 52 is lifted. This creates a space below the tip 52-1 of the atomizer body 52 for disposing the polishing liquid supply head 41, preventing contact between the atomizer body 52 and the polishing liquid supply head 41.

[0042] When the atomizer body 52 is placed on the polishing pad 100 as shown in FIG. 5B when no cleaning process using a cleaning fluid is being performed, it is undesirable for the cleaning fluid to fall from the atomizer body 52 onto the polishing pad 100 and mix with the polishing liquid during a subsequent polishing process. Therefore, the atomizer 50 of this embodiment includes a gas supply source 57 for injecting gas (e.g., N2) into the flow path 52d and the multiple holes 52b of the atomizer body 52 to purge them. The gas supply source 57 is configured to inject gas into the flow path 52d and the multiple holes 52b to purge them after the cleaning process using the cleaning fluid is completed and before the tip 52-1 of the atomizer body 52 is lifted. This prevents the cleaning fluid from falling onto the polishing pad 100 and mixing with the polishing liquid during the polishing process.

[0043] In addition, the atomizer 50 of this embodiment employs a structure that makes it difficult for the cleaning fluid to fall from the atomizer body 52. ​​Fig. 6A is a bottom view showing a schematic configuration of an atomizer according to one embodiment. Fig. 6B is a cross-sectional view of the atomizer of Fig. 6A taken along line BB. As shown in Figs. 6A and 6B, a groove 52c is formed in the bottom surface 52a of the atomizer body 52, connecting the multiple holes 52b to each other and also to the base end 52-2 of the atomizer body 52.

[0044] When the tip 52-1 of the atomizer body 52 is raised, the groove 52c guides the cleaning fluid remaining in the holes 52b to the base end 52-2 of the atomizer body 52, allowing it to fall outside the polishing table 20. Therefore, the atomizer 50 of this embodiment can prevent the cleaning fluid from falling onto the polishing pad 100 and mixing with the polishing liquid during the polishing process.

[0045] In the above embodiment, the atomizer body 52 has the plurality of holes 52b formed perpendicular to the bottom surface 52a. However, the present invention is not limited to this. FIG. 7A is a cross-sectional view showing a schematic configuration of an atomizer according to a modified example. FIG. 7B is a cross-sectional view showing a schematic configuration of an atomizer according to a modified example. FIGS. 7A and 7B show the same cross section as FIG. 6B. As shown in FIGS. 7A and 7B, the plurality of holes 52b are formed to communicate between the bottom surface 52a of the atomizer body 52 and a flow path 52d formed inside the atomizer body 52. ​​Here, the plurality of holes 52b are formed at an angle such that the opening 52b-2 of the flow path 52d is located closer to the base end 52-2 than the opening 52b-1 of the bottom surface 52a. The plurality of holes 52b are also formed to linearly connect the opening 52b-1 of the bottom surface 52a and the opening 52b-2 of the flow path 52d.

[0046] 7B, in the atomizer 50 of this modification, when the tip 52-1 of the atomizer body 52 is raised, the holes 52b extend substantially horizontally. Therefore, the cleaning fluid remaining in the holes 52b is less likely to fall, and the cleaning fluid is prevented from falling onto the polishing pad 100 and being mixed into the polishing liquid during the polishing process.

[0047] In the above-described embodiment, the link mechanism 60 includes two arms and two connecting members, but this is not intended to be limiting. For example, the link mechanism 60 may include three or more arms and three or more connecting members. This allows for fine adjustment of the position and angle of the polishing liquid supply head 41. In addition, in the above-described embodiment, the polishing liquid supply head 41 is moved in a plane along the polishing surface 102 of the polishing pad 100. However, this is not intended to be limiting. The link mechanism 60 may be configured to move the polishing liquid supply head 41 three-dimensionally. This allows the polishing liquid supply head 41 to avoid interference with other components of the polishing apparatus 1 or to move around to supply the polishing liquid to a desired location while avoiding interference with other components of the polishing apparatus 1.

[0048] (General configuration of polishing device) Next, another embodiment of the polishing apparatus will be described. FIG. 8 is a perspective view showing the schematic configuration of a polishing apparatus according to one embodiment. The polishing apparatus 1 of this embodiment is configured to use a polishing pad 100 having a polishing surface 102 to polish a disc-shaped substrate WF, such as a semiconductor wafer, as a polishing target. As shown in the figure, the polishing apparatus 1 includes a polishing table 20 for supporting the disc-shaped polishing pad 100 and a polishing head 30 for holding the substrate WF and pressing it against the polishing surface 102 of the polishing pad 100. The polishing apparatus 1 also includes a polishing liquid supply device 40 for supplying a polishing liquid (slurry) between the polishing pad 100 and the substrate WF, a cleaning mechanism 300 for supplying a cleaning liquid to the polishing liquid supply device 40 rotated outside the polishing pad 100, and an atomizer 50 for spraying a cleaning fluid (liquid such as pure water and / or gas such as nitrogen) onto the polishing surface 102 to wash away used polishing liquid, polishing residue, and the like. The polishing liquid supply device 40 is disposed upstream of the rotation of the polishing pad 100 relative to the substrate WF. While the embodiment in Fig. 8 shows an example in which the cleaning mechanism 300 is disposed above the polishing liquid supply device 40, the present invention is not limited to this. For example, the cleaning mechanisms 300 may be disposed above and below the polishing liquid supply device 40, so that the polishing liquid supply device 40 can be cleaned from above and below. In this specification, the terms "upstream" and "downstream" refer to the upstream and downstream directions when the polishing table 20 (polishing pad 100) rotates clockwise when viewed from above in Fig. 8.

[0049] The polishing table 20, polishing head 30, and atomizer 50 in the polishing apparatus 1 of this embodiment are the same as those in the above-described embodiment explained with reference to FIGS. 1 to 7, and therefore a duplicated explanation will be omitted.

[0050] (polishing liquid supply device) The polishing liquid supplying device 40 includes a polishing liquid supplying head 41 for supplying a polishing liquid to the polishing pad 100. The polishing liquid supplying head 41 in the polishing apparatus 1 of this embodiment is the same as that in the embodiment described above with reference to FIG. 2, and therefore a duplicated description will be omitted.

[0051] 9A is a perspective view showing a schematic configuration of a polishing liquid supply apparatus according to one embodiment, with the arm extended; FIG. 9B is a side view showing a schematic configuration of a polishing liquid supply apparatus according to one embodiment, with the arm extended; FIG. 9C is a perspective view showing a schematic configuration of a polishing liquid supply apparatus according to one embodiment, with the arm retracted; and FIG. 9D is a side view showing a schematic configuration of a polishing liquid supply apparatus according to one embodiment, with the arm retracted.

[0052] As shown in FIGS. 9A to 9D, the polishing liquid supply device 40 includes an arm 160 configured to hold the polishing liquid supply head 41. The arm 160 is disposed adjacent to the polishing table 20 and is supported by a shaft 192 extending vertically so as to be rotatable about the shaft 192. The arm 160 includes an arm main body 161 configured to extend along the polishing surface 102 of the polishing pad 100, and a connecting member 163 configured to connect the upper surface of the polishing liquid supply head 41 to the arm main body 161. The arm main body 161 extends along the polishing surface 102 of the polishing pad 100 at a position higher than the polishing liquid supply head 41. Specifically, the bottom surface of the arm main body 161 is disposed at a position higher than the bottom surface of the polishing liquid supply head 41.

[0053] The polishing liquid supplying device 40 includes a rotation mechanism 190 configured to rotate the arm 160 around a shaft 192. The rotation mechanism 190 can be realized by a known mechanism such as a motor. The polishing liquid supplying device 40 also includes an elevation mechanism 180 configured to raise and lower the polishing liquid supplying head 41, the arm 160, the rotation mechanism 190, and a linear drive mechanism 70 (described later) together. The elevation mechanism 180 can be realized by a known mechanism such as a cylinder or a motor.

[0054] The polishing liquid supply device 40 includes a linear motion drive mechanism 70 configured to linearly move the polishing liquid supply head 41 along the radial direction of the polishing pad 100. Specifically, a groove 162 is formed on the side of the arm body 161 along the extension direction of the arm body 161, and a connecting member 163 is held by the arm body 161 so as to be movable along the groove 162. The linear motion drive mechanism 70 is configured to linearly move the polishing liquid supply head 41 along the radial direction of the polishing pad 100 by moving the connecting member 163 along the groove 162 of the arm body 161. The linear motion drive mechanism 70 can be realized by a known mechanism such as a cylinder or a motor.

[0055] In this embodiment, the linear motion drive mechanism 70 is configured to linearly move the polishing liquid supply head 41 so that the multiple polishing liquid supply ports 414 of the polishing liquid supply head 41 are aligned along the radial direction of the polishing pad 100 whenever the polishing liquid is being supplied to the polishing pad 100. In other words, the linear motion drive mechanism 70 linearly moves the polishing liquid supply head 41 along the radial direction of the polishing pad 100 between the center and outer edge of the polishing pad 100, with the multiple polishing liquid supply ports 414 aligned along the radial direction of the polishing pad 100 facing the polishing pad 100. Note that in this specification, the radial direction of the polishing pad 100 does not strictly refer only to the radial direction of the polishing pad 100, but also includes angles within a range of ±10°.

[0056] Fig. 10A is a top view showing a schematic configuration of a polishing apparatus according to an embodiment, in which a polishing liquid supply head is disposed on the center side of a polishing pad. Fig. 10B is a top view showing a schematic configuration of a polishing apparatus according to an embodiment, in which a polishing liquid supply head is disposed on the outer edge side of a polishing pad. Fig. 10C is a top view showing a schematic configuration of a polishing apparatus according to an embodiment, in which a polishing liquid supply head is disposed on the outer side of a polishing table.

[0057] 10A and 10B, the linear motion drive mechanism 70 linearly moves the polishing liquid supply head 41 along the radial direction of the polishing pad 100 between a first state 450 in which the polishing liquid supply head 41 is positioned facing the center of the polishing pad 100 and a second state 460 in which the polishing liquid supply head 41 is positioned facing closer to the outer edge of the polishing pad 100 than in the first state 450. In the first state 450, the polishing liquid supply ports 414 are arranged along the radial direction of the polishing pad 100, and in the second state 460, the polishing liquid supply ports 414 are also arranged along the radial direction of the polishing pad 100. Therefore, according to this embodiment, when the polishing liquid supply head 41 is moved over the polishing pad 100 while supplying the polishing liquid, the uniformity of the supply range of the polishing liquid to the polishing pad 100 can be improved. This point will be described below.

[0058] In the polishing apparatus of the comparative example shown in FIG. 4 described above, in a state 1100 in which the polishing liquid supply head 1041 is positioned toward the center of the polishing pad 1000, the multiple polishing liquid supply ports 1414 are arranged along the radial direction of the polishing pad 1000. Therefore, the radial width of the polishing liquid supply range 1112 of the polishing pad is wide. On the other hand, in a state 1200 in which the arm 1060 is rotated around the shaft 1092 and the polishing liquid supply head 1041 is positioned toward the outer edge of the polishing pad 1000, the arrangement direction of the multiple polishing liquid supply ports 1414 is shifted circumferentially from the radial direction of the polishing pad 1000. Therefore, the radial width of the polishing liquid supply range 1110 of the polishing pad is narrower than the supply range 1112. As a result, the amount of slurry supplied for a given radial width of the substrate WF varies, making it difficult to uniformly supply the polishing liquid to the substrate WF, and therefore making it difficult to uniformly and efficiently polish the substrate WF.

[0059] In contrast, according to the polishing apparatus 1 of this embodiment, in either the first state 450 in which the polishing liquid supply head 41 is above the polishing pad 100 or the second state 460, the multiple polishing liquid supply ports 414 are arranged along the radial direction of the polishing pad 100. Therefore, the radial width of the polishing pad of the polishing liquid supply range in the first state 450 is approximately equal to the radial width of the polishing pad of the polishing liquid supply range in the second state 460, so that the polishing liquid can be supplied uniformly to the substrate WF, and as a result, the substrate WF can be polished uniformly and efficiently.

[0060] 10A, it is desirable that in the first state 450, the slurry dropping position of at least one of the plurality of polishing liquid supply ports 414 (i.e., the innermost polishing liquid supply port) coincides with the inner edge of the area on the polishing pad with which the substrate WF comes into contact. Also, it is desirable that in the second state 460, the slurry dropping position of at least one of the plurality of polishing liquid supply ports 414 (i.e., the outermost polishing liquid supply port) coincides with the outer edge of the area on the polishing pad with which the substrate WF comes into contact, as shown by dashed line 480 in FIG. 10B.

[0061] 10A, the linear drive mechanism 70 linearly moves the polishing liquid supply head 41 in the first state 450 so that the tip of the polishing liquid supply head 41 is positioned farther from the shaft 192 than the tip of the arm body 161. Therefore, even if the arm body 161 is short, the polishing liquid can be supplied to the center of the polishing pad 100. In addition, as shown in FIG. 10C, the rotation mechanism 190 rotates the arm 160 in the second state 460 in which the polishing liquid supply head 41 is positioned on the outer edge of the polishing pad 100, thereby retracting the polishing liquid supply head 41 to the outside of the polishing table 20. By rotating the arm 160 with the polishing liquid supply head 41 moved to a position close to the shaft 192, it is possible to prevent the polishing liquid supply head 41 from colliding with structures on or around the polishing table 20, such as the atomizer 50, when the polishing liquid supply head 41 is retracted to the outside of the polishing table 20. Furthermore, as shown in Figures 10A to 10C, the arm body 161 has a bent portion, so that the arm 160 and the polishing liquid supply head 41 can be rotated with a small rotation radius, and as a result, the arm 160 and the polishing liquid supply head 41 can be prevented from colliding with surrounding parts such as the atomizer 50.

[0062] Furthermore, in this embodiment, the arm body 161 is positioned higher than the polishing liquid supply head 41. Therefore, even if the polishing liquid supplied from the polishing liquid supply head 41 to the polishing pad 100 collides with the polishing surface 102 and splashes onto the polishing pad 100, it is unlikely to adhere to the arm body 161. If the polishing liquid adheres to the arm body 161, the polishing liquid may fall from the arm body 161 to an unintended position on the polishing pad 100, or the polishing liquid adhered to the arm body 161 may dry and turn into dust, which may then fall onto the polishing pad 100. This may result in an uneven polishing profile of the substrate WF or defects. In contrast, this embodiment can prevent the polishing liquid rebounding from the polishing pad 100 from adhering to the arm body 161, thereby preventing the polishing profile of the substrate WF from becoming uneven or defects from occurring on the substrate WF due to the polishing liquid rebounding from the polishing pad 100.

[0063] 9A to 9D, the polishing liquid supply device 40 includes a cover member 42 for covering the upper surface of the polishing liquid supply head 41 and the arm body 161. The cover member 42 includes a front wall 42a extending upward from the tip of the polishing liquid supply head 41, side walls 42b extending upward from both sides of the polishing liquid supply head 41, and a top wall 42c connecting the tops of the front wall 42a and the side walls 42b. The upper surface of the polishing liquid supply head 41 and the arm body 161 are covered by the front wall 42a, the side walls 42b, and the top wall 42c.

[0064] The cover member 42 is attached to the polishing liquid supply head 41. Therefore, the cover member 42 is configured to be movable along the arm body 161 in accordance with the linear movement of the polishing liquid supply head 41. As shown in FIGS. 9A and 9B, when the polishing liquid supply head 41 is positioned toward the center of the polishing pad 100, the cover member 42 covers the upper surface of the polishing liquid supply head 41 and a first portion 161-1 including the tip of the arm body 161. On the other hand, as shown in FIGS. 9C and 9D, when the polishing liquid supply head 41 is positioned toward the outer edge of the polishing pad 100, the cover member 42 is configured to cover the upper surface of the polishing liquid supply head 41, the first portion 161-1 of the arm body 161, and a second portion 161-2 that is closer to the base end than the first portion 161-1 of the arm body 161.

[0065] Therefore, according to the polishing apparatus 1 of this embodiment, the upper surface of the polishing liquid supply head 41, which is located directly above the multiple polishing liquid supply ports 414 and is prone to splattering of the polishing liquid, and the arm body 161 are covered by the cover member 42, thereby preventing the polishing liquid from bouncing off the polishing pad 100 from adhering to them. If the polishing liquid adheres to the upper surface of the polishing liquid supply head 41 and the arm body 161, the adhering polishing liquid may dry into dust and fall onto the polishing pad 100, potentially causing an uneven polishing profile for the substrate WF or defects. In this regard, if the polishing liquid adheres to the upper surface of the polishing liquid supply head 41 and the arm body 161, it is possible to consider cleaning the polishing liquid supply head 41 and the arm body 161 using the cleaning mechanism 300 while the polishing liquid supply head 41 is retracted to the outside of the polishing table 20, as shown in FIG. 10C . However, the polishing liquid supply head 41 and the arm body 161 have recessed parts arranged therein, and gaps are formed at the connection points of the multiple parts, so that polishing liquid that has entered the recesses or gaps may not be able to be sufficiently cleaned away. In contrast, the surface of the cover member 42 is flat and smooth, so if polishing liquid adheres to the cover member 42, the polishing liquid adhering to the cover member 42 can be washed away by performing a cleaning process with the polishing liquid supply head 41 retracted to the outside of the polishing table 20.

[0066] 1 to 10, the polishing apparatus 1 moves the polishing liquid supply head 41 within a fixed range between the dashed lines 480 and 490 to supply the polishing liquid to the entire surface of the substrate Wf, but this is not limiting. The polishing apparatus 1 can move the polishing liquid supply head 41 within any range. For example, when it is desired to supply the polishing liquid intensively to a predetermined region of the substrate Wf near the center of the polishing pad 100, the polishing apparatus 1 can move the polishing liquid supply head 41 within a range near the dashed line 480. In this way, the polishing apparatus 1 can supply the polishing liquid with a desired distribution depending on the type of substrate Wf and polishing liquid, etc.

[0067] 1 to 10, the polishing apparatus 1 moves the polishing liquid supply head 41 at a constant speed, but this is not limiting. For example, the polishing apparatus 1 can divide the movement range of the polishing liquid supply head 41 into multiple areas and vary the movement speed of the polishing liquid supply head 41 for each area. The polishing apparatus 1 can supply the polishing liquid with a desired distribution, for example, by increasing the movement speed of the polishing liquid supply head 41 toward the center of the polishing pad 100 to reduce the amount of polishing liquid supplied, and decreasing the movement speed of the polishing liquid supply head 41 toward the outer edge of the polishing pad 100 to increase the amount of polishing liquid supplied.

[0068] Although several embodiments of the present invention have been described above, the above-described embodiments of the present invention are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. Furthermore, any combination or omission of the components described in the claims and specification is possible within the scope of solving at least part of the above-described problems or achieving at least part of the effects.

[0069] In one embodiment, the present application discloses a polishing apparatus including a table for supporting a polishing pad, a polishing head for holding an object, and a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the object, which polishes the object by contacting the polishing pad and the object in the presence of a polishing liquid and rotating them relative to each other, wherein the polishing liquid supply device includes a polishing liquid supply head having a plurality of polishing liquid supply ports, a link mechanism configured to move the polishing liquid supply head along the polishing surface of the polishing pad, and a drive mechanism configured to drive the link mechanism, wherein the drive mechanism is configured to drive the link mechanism so that in a first state in which the polishing liquid supply head is positioned facing the center of the polishing pad, the plurality of polishing liquid supply ports are arranged along the radial direction of the polishing pad, and so that in a second state in which the polishing liquid supply head is positioned facing the outer edge of the polishing pad closer to the first state, the plurality of polishing liquid supply ports are arranged along the radial direction of the polishing pad.

[0070] Furthermore, the present application discloses, as one embodiment, a polishing apparatus in which the link mechanism includes a first arm configured to hold the polishing liquid supply head and a second arm connected to the first arm, the drive mechanism includes a first rotation mechanism for rotating the first arm so as to pivot the polishing liquid supply head along the polishing surface of the polishing pad, and a second rotation mechanism for rotating the second arm so as to pivot the first arm, and the first rotation mechanism and the second rotation mechanism are configured to rotate the first arm and the second arm so that in the first state, the multiple polishing liquid supply ports are arranged along the radial direction of the polishing pad, and in the second state, the multiple polishing liquid supply ports are arranged along the radial direction of the polishing pad.

[0071] Furthermore, the present application discloses, as one embodiment, a polishing apparatus further including a shaft arranged adjacent to the table and extending vertically, the link mechanism further including a first connecting member rotatably connecting the first arm to the second arm, and a second connecting member rotatably connecting the second arm to the shaft, the first connecting member and the second connecting member being arranged outside the table.

[0072] Furthermore, as one embodiment, the present application discloses a polishing apparatus, wherein the drive mechanism is configured to drive the link mechanism so that the polishing liquid supply head moves between the first state, the second state, and a third state in which the polishing liquid supply head is positioned outside the table.

[0073] The present application also discloses, as one embodiment, a polishing apparatus including a table for supporting a polishing pad, a polishing head for holding an object, and a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the object, and polishing the object by bringing the polishing pad and the object into contact with each other in the presence of a polishing liquid and causing them to rotate relative to each other, wherein the polishing liquid supply device includes a polishing liquid supply head having a plurality of polishing liquid supply ports, an arm that extends along the polishing surface of the polishing pad at a position higher than the polishing liquid supply head and is configured to hold the polishing liquid supply head, and a linear drive mechanism configured to linearly move the polishing liquid supply head along the radial direction of the polishing pad between the center side and the outer edge side of the polishing pad with the plurality of polishing liquid supply ports facing the polishing pad and arranged along the radial direction of the polishing pad.

[0074] The present application also discloses, as one embodiment, a polishing apparatus in which the arm includes an arm body extending along the polishing surface of the polishing pad and a connecting member configured to connect the upper surface of the polishing liquid supply head and the arm body, the linear driving mechanism is configured to linearly move the polishing liquid supply head along the radial direction of the polishing pad by moving the connecting member along the arm body, and the bottom surface of the arm body is positioned at a higher position than the bottom surface of the polishing liquid supply head.

[0075] The present application also discloses, as one embodiment, a polishing apparatus in which the polishing liquid supply device further includes a shaft arranged adjacent to the table and extending vertically, and a rotation mechanism configured to rotate the arm around the shaft, and the linear drive mechanism linearly moves the polishing liquid supply head so that, when the polishing liquid supply head is positioned toward the center of the polishing pad, the tip of the polishing liquid supply head is positioned farther from the shaft than the tip of the arm.

[0076] The present application also discloses, as one embodiment, a polishing apparatus in which the polishing liquid supply device further includes a cover member for covering an upper surface of the polishing liquid supply head and the arm body, the cover member being attached to the polishing liquid supply head and configured to be movable along the arm body in accordance with linear movement of the polishing liquid supply head, and configured to cover the upper surface of the polishing liquid supply head and a first portion including the tip of the arm body when the polishing liquid supply head is positioned toward the center of the polishing pad, and to cover the upper surface of the polishing liquid supply head, the first portion of the arm body, and a second portion of the arm body that is base-end-side relative to the first portion when the polishing liquid supply head is positioned toward the outer edge of the polishing pad.

[0077] The present application also discloses, as one embodiment, a polishing apparatus further including an atomizer configured to supply a cleaning fluid to the polishing pad, the atomizer including an atomizer body positioned opposite the polishing pad, and a tilting mechanism for tilting the atomizer body so that a tip end of the atomizer body is higher than a base end.

[0078] The present application also discloses, as one embodiment, a grinding device in which the tilting mechanism includes a link mechanism connected to the atomizer body and a drive mechanism for tilting the atomizer body by driving the link mechanism.

[0079] Furthermore, the present application discloses, as one embodiment, a polishing device in which the atomizer body is formed with a flow path extending from the base end of the atomizer body to near the tip end, and a plurality of holes connecting the bottom surface of the atomizer body with the flow path, and the bottom surface of the atomizer body is formed with a groove connecting the plurality of holes with each other and also connecting with the base end of the atomizer body. [Explanation of symbols]

[0080] 1 Polishing equipment 20 Polishing table 30 Polishing Head 40 Polishing liquid supply device 41 Polishing liquid supply head 42 Cover member 51 Link mechanism 52 Atomizer body 52-1 Tip 52-2 Proximal end 52a bottom 52b hole 52c groove 52d Flow path 53 Drive mechanism 59 Tilt mechanism 60 Link mechanism 60-1 First Arm 60-2 Second Arm 60-3 First connecting member 60-4 Second connecting member 61 Connecting member 80 Lifting mechanism 90 Drive mechanism 90-1 First rotation mechanism 90-2 Second Rotation Mechanism 92 Shaft 100 polishing pads 160 Arm 161 Arm body 161-1 First Part 161-2 Second Part 162 Groove 163 Connecting member 410 Supply member body 414 Polishing liquid supply port 450 First State 460 Second State 470 Third State WF board

Claims

1. a table for supporting the polishing pad; a polishing head for holding an object; a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the object; Including, A polishing apparatus that polishes an object by contacting the polishing pad and the object in the presence of a polishing liquid and rotating the polishing pad and the object relative to each other, the polishing liquid supply device includes: a polishing liquid supply head having a plurality of polishing liquid supply ports; a link mechanism configured to move the polishing liquid supply head along the polishing surface of the polishing pad; and a drive mechanism configured to drive the link mechanism; the drive mechanism is configured to drive the link mechanism so that in a first state in which the polishing liquid supply head is disposed facing the center side of the polishing pad, the plurality of polishing liquid supply ports are arranged along the radial direction of the polishing pad, and in a second state in which the polishing liquid supply head is disposed facing the outer edge side of the polishing pad further than in the first state, the plurality of polishing liquid supply ports are arranged along the radial direction of the polishing pad; the link mechanism includes a first arm configured to hold the polishing liquid supply head and a second arm connected to the first arm; the drive mechanism includes a first rotation mechanism for rotating the first arm so as to rotate the polishing liquid supply head along the polishing surface of the polishing pad, and a second rotation mechanism for rotating the second arm so as to rotate the first arm; the first rotation mechanism and the second rotation mechanism are configured to rotate the first arm and the second arm so that the plurality of polishing liquid supply ports are arranged along a radial direction of the polishing pad in the first state, and so that the plurality of polishing liquid supply ports are arranged along the radial direction of the polishing pad in the second state; the polishing apparatus further includes a shaft disposed adjacent to the table and extending vertically; The link mechanism rotatably connects the first arm to the second arm. a first connecting member and a second connecting member rotatably connecting the second arm to the shaft; the first connecting member and the second connecting member are disposed outside the table; the drive mechanism is configured to drive the link mechanism so that the polishing liquid supply head moves among the first state, the second state, and a third state in which the polishing liquid supply head is disposed outside the table. Polishing equipment.

2. A table for supporting a polishing pad; a polishing head for holding an object; a polishing liquid supply device for supplying a polishing liquid between the polishing pad and the object; Including, A polishing apparatus that polishes an object by contacting the polishing pad and the object in the presence of a polishing liquid and rotating the polishing pad and the object relative to each other, the polishing liquid supply device includes: a polishing liquid supply head having a plurality of polishing liquid supply ports; a link mechanism configured to move the polishing liquid supply head along the polishing surface of the polishing pad; and a drive mechanism configured to drive the link mechanism; the drive mechanism is configured to drive the link mechanism so that in a first state in which the polishing liquid supply head is disposed facing the center side of the polishing pad, the plurality of polishing liquid supply ports are arranged along the radial direction of the polishing pad, and in a second state in which the polishing liquid supply head is disposed facing the outer edge side of the polishing pad further than in the first state, the plurality of polishing liquid supply ports are arranged along the radial direction of the polishing pad; the link mechanism includes a first arm configured to hold the polishing liquid supply head and a second arm connected to the first arm; the drive mechanism includes a first rotation mechanism for rotating the first arm so as to rotate the polishing liquid supply head along the polishing surface of the polishing pad, and a second rotation mechanism for rotating the second arm so as to rotate the first arm; the first rotation mechanism and the second rotation mechanism are configured to rotate the first arm and the second arm so that the plurality of polishing liquid supply ports are arranged along a radial direction of the polishing pad in the first state, and so that the plurality of polishing liquid supply ports are arranged along the radial direction of the polishing pad in the second state; the polishing apparatus further includes an atomizer configured to supply a cleaning fluid to the polishing pad; The atomizer includes an atomizer body disposed opposite the polishing pad, and a tilting mechanism for tilting the atomizer body so that a tip end of the atomizer body is higher than a base end of the atomizer body. Polishing equipment.

3. The tilting mechanism includes a link mechanism connected to the atomizer body, and a drive mechanism for driving the link mechanism to tilt the atomizer body. The polishing apparatus according to claim 2 .

4. The atomizer body is formed with a flow path extending from the base end of the atomizer body to the vicinity of the tip end, and a plurality of holes communicating the bottom surface of the atomizer body with the flow path, a groove is formed on the bottom surface of the atomizer body, the groove connecting the plurality of holes to one another and connecting to the base end of the atomizer body; The polishing apparatus according to claim 3 .

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