Processing equipment

Abstract

To provide a processing device which enables a chuck table to be recognized while inhibiting increase of a price of the processing device.SOLUTION: A height of an upper surface of a chuck table is measured by using a height measuring instrument 61 used for measuring a height of a plate-like workpiece 200 during griding and a type of the chuck table is recognized based on a measurement result. In other words, in order to recognize the type of the chuck table, the height measuring instrument 61, which is an existing structure used in processing, is used and a special structure is not needed. Therefore, the type of the chuck table can be easily determined without increasing the costs and size of a grinding device 1.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device. [Background technology]

[0002] In a grinding device that grinds a workpiece, the chuck table that holds the workpiece is changed depending on the size of the workpiece. In the processing devices disclosed in Patent Documents 1 and 2, the size of the spinner table or temporary table is recognized by a robot hand attached to the robot. However, the size of the chuck table is not recognized. Therefore, the technology disclosed in Patent Document 3 uses a camera to recognize the size of the chuck table and determine whether it corresponds to the size of the workpiece. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-140450 A [Patent Document 2] Japanese Patent Application Laid-Open No. 2006-222132 [Patent Document 3] Japanese Patent Publication No. 2020-183004 Summary of the Invention [Problem to be solved by the invention]

[0004] However, arranging the cameras as described above increases the cost of the device. Therefore, an object of the present invention is to enable recognition of the chuck table while suppressing an increase in the price of the processing device. [Means for solving the problem]

[0005] A first processing device (first processing device) of the present invention is a processing device that processes a workpiece while measuring the height of the top surface of the workpiece held on the holding surface of a chuck table, and includes: the chuck table that holds the workpiece by the holding surface; a processing mechanism that processes the workpiece held on the holding surface; a height measuring device that measures the height of the top surface of the workpiece held on the holding surface or the height of the holding surface from above the holding surface; a horizontal movement mechanism that moves the chuck table in a direction parallel to the holding surface; a horizontal position recognition unit that recognizes the position of the chuck table moved by the horizontal movement mechanism; a first recognition unit that measures the height of the top surface of the chuck table moved by the horizontal movement mechanism with the height measuring device and recognizes the chuck table; and a first judgment unit that judges whether the chuck table recognized by the first recognition unit matches a predetermined chuck table. In the first processing device, the holding surface may be rectangular, and a second judgment unit may be provided that measures the height of the top surface of the chuck table moved by the horizontal movement mechanism with the height measuring device and judges whether one side of the holding surface is perpendicular to the direction of movement of the chuck table by the horizontal movement mechanism. In the first processing device, the chuck table may have a plurality of holding surfaces in a linear direction passing through the center, and may include a third judgment unit that measures the height of the top surface of the chuck table, which is moved by the horizontal movement mechanism, with the height measuring device and judges whether the plurality of holding surfaces are aligned parallel to the movement direction of the chuck table by the horizontal movement mechanism. [Effects of the Invention]

[0006] In the first processing device, the height of the top surface of the chuck table is measured using a height measuring device that is used to measure the height of the workpiece during processing, and the chuck table is recognized based on the measurement results. In other words, to recognize the chuck table, a height measuring device with an existing configuration used in processing is used, and no special configuration is required. Therefore, it is possible to easily recognize the chuck table without increasing the cost and size of the processing device. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a perspective view showing the configuration of a grinding device. [Figure 2] FIG. 2 is a top view showing the configuration of a first chuck table. [Figure 3] FIG. 3 is a cross-sectional view showing the configuration of a first chuck table. [Figure 4] FIG. 4 is a top view showing the configuration of a second chuck table. [Figure 5] FIG. 4 is a cross-sectional view showing the configuration of a second chuck table. [Figure 6] 10 is a graph showing the results of measuring the height of the top surface of the first chuck table. [Figure 7] 10 is a graph showing the results of measuring the height of the upper surface of the second chuck table. [Figure 8] FIG. 10 is a top view showing the configuration of a third chuck table. [Figure 9] FIG. 4 is a cross-sectional view showing the configuration of a third chuck table. [Figure 10] 10 is a graph showing the results of measuring the height of the top surface of the third chuck table. [Figure 11] FIG. 10 is a top view showing the configuration of a fourth chuck table. [Figure 12] FIG. 4 is a cross-sectional view showing the configuration of a fourth chuck table. [Figure 13] 10 is a graph showing the results of measuring the height of the top surface of the fourth chuck table. [Figure 14] FIG. 10 is a top view showing the fourth chuck table in a misaligned orientation. [Figure 15] Figure 15(a) is an enlarged top view of a portion of the fourth chuck table shown in Figure 14, Figure 15(b) is a cross-sectional view of the same, and Figure 15(c) is a graph showing some of the measurement results of the top surface height of the fourth chuck table shown in Figure 14. [Figure 16] FIG. 10 is a top view showing a third chuck table having a groove-type holding surface. [Figure 17] FIG. 2 is a top view showing a first chuck table holding a plate-shaped workpiece. [Figure 18]FIG. 4 is a cross-sectional view showing a first chuck table holding a plate-shaped workpiece. [Figure 19] FIG. 2 is a top view showing a second chuck table holding a plate-shaped workpiece. [Figure 20] FIG. 4 is a cross-sectional view showing a second chuck table holding a plate-shaped workpiece. [Figure 21] 10 is a graph showing the results of measuring the thickness of a plate-shaped workpiece held on the first chuck table. [Figure 22] 10 is a graph showing the results of measuring the thickness of a plate-shaped workpiece held on the second chuck table. [Figure 23] FIG. 10 is a top view showing a fourth chuck table holding a plate-shaped workpiece. [Figure 24] FIG. 10 is a cross-sectional view showing a fourth chuck table holding a plate-shaped workpiece. [Figure 25] 10 is a graph showing the results of measuring the thickness of a plate-shaped workpiece held on the fourth chuck table. [Figure 26] FIG. 10 is a top view showing a third chuck table holding a plate-shaped workpiece. [Figure 27] FIG. 10 is a cross-sectional view showing a third chuck table holding a plate-shaped workpiece. [Figure 28] 10 is a graph showing the results of measuring the thickness of a plate-shaped workpiece held on the third chuck table. DETAILED DESCRIPTION OF THE INVENTION

[0009] 1 is an example of a processing device that processes a workpiece while measuring the height of the top surface of the workpiece held on the holding surface of a chuck table, and is a creep feed grinding device that creep feed grinds a plate-shaped workpiece 200 as the workpiece. The plate-shaped workpiece 200 is, for example, circular, and includes a front surface 201 and a back surface 202 that is the surface to be ground.

[0010] As shown in FIG. 1, the grinding device 1 includes a rectangular parallelepiped base 2, a column 3 extending upward, and a control unit 7 that controls each member of the grinding device 1.

[0011] An opening 5 is provided on the upper surface side of the base 2. A workpiece holding mechanism 30 is disposed within the opening 5. The workpiece holding mechanism 30 includes a first chuck table 20 that holds a plate-shaped workpiece 200 by a holding surface 22, a table base 31 that supports the first chuck table 20, an inclination adjustment mechanism 32 that adjusts the inclination of the first chuck table 20, and a table rotation mechanism 33.

[0012] 2 and 3, the first chuck table 20 is formed in a circular shape in a plan view and includes a disk-shaped porous member 21 and a frame 23 that houses the porous member 21 so that the upper surface of the porous member 21 is exposed. The upper surface of the porous member 21 is a holding surface 22 that holds the plate-shaped workpiece 200 by suction.

[0013] The holding surface 22 is connected to a suction source (not shown) to hold the plate-shaped workpiece 200 by suction. That is, the first chuck table 20 holds the plate-shaped workpiece 200 by means of the holding surface 22. In addition, a ring-shaped frame surface 24, which is the upper surface of the frame 23, surrounds the holding surface 22 and is formed to be on the same plane (flush) as the holding surface 22. The frame surface 24 can be used as a measurement surface for measuring the height of the holding surface 22.

[0014] Furthermore, a relatively low pedestal portion 25 is provided on the outer side of the frame surface 24 of the frame 23. This pedestal portion 25 is provided with a plurality of through holes 26 for fixing the first chuck table 20 to a table base 31 (see FIG. 1). That is, the through holes 26 are provided in the frame 23 so as to correspond to a plurality of screw holes (not shown) provided in the table base 31. The first chuck table 20 can be fixed to the table base 31 by fastening screws inserted into the through holes 26 to the screw holes in the table base 31.

[0015] The table rotation mechanism 33 of the work holding mechanism 30 shown in Figure 1 includes a motor 34, a drive pulley 35 attached to the motor 34, a driven pulley 36 connected to the table base 31, an endless belt 37 connected to the drive pulley 35 and the driven pulley 36, and an encoder 38 that reads the rotation angle of the motor. In the table rotation mechanism 33, by driving a motor 34, it is possible to rotate the table base 31 and the first chuck table 20 about the axis of the center of the holding surface 22 via a drive pulley 35, a driven pulley 36, and an endless belt 37. In addition, an encoder 38 can recognize the rotation angle of the first chuck table 20 based on the rotation angle of the motor 34.

[0016] A cover plate 39 that moves along the Y-axis direction together with the first chuck table 20 is provided around the first chuck table 20. A bellows cover 4 that expands and contracts in the Y-axis direction is connected to the cover plate 39. A Y-axis direction moving mechanism 40 is disposed below the workpiece holding mechanism 30.

[0017] The Y-axis direction moving mechanism 40 moves the workpiece holding mechanism 30 and the grinding mechanism 70 relatively in the Y-axis direction, which is a direction parallel to the holding surface 22. In this embodiment, the Y-axis direction moving mechanism 40 is configured to move the workpiece holding mechanism 30, including the first chuck table 20, in the Y-axis direction relative to the grinding mechanism 70. In other words, the Y-axis direction moving mechanism 40 is an example of a horizontal movement mechanism that moves the first chuck table 20 in a direction parallel to the holding surface 22.

[0018] The Y-axis direction movement mechanism 40 includes a pair of Y-axis guide rails 42 parallel to the Y-axis direction, a Y-axis movement table 45 that slides on these Y-axis guide rails 42, a Y-axis ball screw 43 parallel to the Y-axis guide rails 42, a Y-axis motor 44 connected to the Y-axis ball screw 43, a Y-axis encoder 46 for detecting the rotation angle of the Y-axis ball screw 43, and a holding base 41 that holds these.

[0019] The Y-axis moving table 45 is slidably installed on the Y-axis guide rail 42. A nut portion (not shown) is fixed to the underside of the Y-axis moving table 45. A Y-axis ball screw 43 is threadedly engaged with this nut portion. The Y-axis motor 44 is connected to one end of the Y-axis ball screw 43.

[0020] In the Y-axis direction moving mechanism 40, the Y-axis motor 44 rotates the Y-axis ball screw 43, causing the Y-axis moving table 45 to move in the Y-axis direction along the Y-axis guide rail 42. The workpiece holding mechanism 30 is placed on the Y-axis moving table 45. Therefore, as the Y-axis moving table 45 moves in the Y-axis direction, the workpiece holding mechanism 30 including the first chuck table 20 moves in the Y-axis direction.

[0021] Furthermore, the Y-axis encoder 46 can detect the rotation angle of the Y-axis ball screw 43 rotated by the Y-axis motor 44. Then, based on the detection result, the Y-axis encoder 46 can recognize the position in the Y-axis direction of the first chuck table 20 moved in the Y-axis direction by the Y-axis direction moving mechanism 40. In other words, the Y-axis encoder 46 is an example of a horizontal position recognition unit that recognizes the position of the first chuck table 20 moved by the Y-axis direction moving mechanism 40.

[0022] In this embodiment, the work holding mechanism 30 is moved along the Y-axis direction by the Y-axis direction moving mechanism 40 between a work placing area on the -Y direction side for placing the plate-shaped workpiece 200 on the holding surface 22 and a grinding area on the +Y direction side where the plate-shaped workpiece 200 is ground.

[0023] 1, a column 3 is erected on the +Y direction side of the base 2. A grinding mechanism 70 for grinding the plate-shaped workpiece 200 and a grinding feed mechanism 50 are provided in front of the column 3.

[0024] The grinding feed mechanism 50 moves the workpiece holding mechanism 30 including the first chuck table 20 and the grinding mechanism 70 relatively in the Z-axis direction (grinding feed direction), which is a direction perpendicular to the holding surface 22. In this embodiment, the grinding feed mechanism 50 is configured to move the grinding mechanism 70 in the Z-axis direction relative to the first chuck table 20.

[0025] The grinding feed mechanism 50 includes a pair of Z-axis guide rails 51 parallel to the Z-axis direction, a Z-axis moving table 53 that slides on the Z-axis guide rails 51, a Z-axis ball screw 52 parallel to the Z-axis guide rails 51, a Z-axis motor 54, a Z-axis encoder 55, and a holder 56 attached to the Z-axis moving table 53. The holder 56 holds a grinding mechanism 70.

[0026] Z-axis moving table 53 is slidably installed on Z-axis guide rail 51. A nut portion (not shown) is fixed to Z-axis moving table 53, and Z-axis ball screw 52 is threadedly engaged with this nut portion. Z-axis motor 54 is connected to one end of Z-axis ball screw 52.

[0027] In the grinding feed mechanism 50, the Z-axis motor 54 rotates the Z-axis ball screw 52, ​​causing the Z-axis moving table 53 to move in the Z-axis direction along the Z-axis guide rail 51. As a result, the holder 56 attached to the Z-axis moving table 53 and the grinding mechanism 70 held by the holder 56 move in the Z-axis direction together with the Z-axis moving table 53.

[0028] Z-axis encoder 55 can recognize the rotation angle of Z-axis ball screw 52 rotated by Z-axis motor 54. Based on the recognition result, Z-axis encoder 55 can detect the height position of grinding wheel 77 of grinding mechanism 70 moved in the Z-axis direction.

[0029] The grinding mechanism 70 is an example of a processing mechanism that processes the plate-shaped workpiece 200 held on the holding surface 22 of the first chuck table 20. The grinding mechanism 70 includes a spindle housing 71 fixed to the holder 56, a spindle 72 rotatably held in the spindle housing 71, a spindle motor 73 that rotates and drives the spindle 72, a wheel mount 74 attached to the lower end of the spindle 72, and a grinding wheel 75 supported by the wheel mount 74.

[0030] The spindle housing 71 is held by the holder 56. The spindle 72 extends along the Z-axis direction and is supported by the spindle housing 71 so as to be rotatable about an axis along the extension direction. The spindle motor 73 is connected to the upper end of the spindle 72 and rotates the spindle 72 .

[0031] The wheel mount 74 is formed in a disk shape and is fixed to the lower end (tip) of the spindle 72. The wheel mount 74 supports the grinding wheel 75.

[0032] The grinding wheel 75 is formed so that its outer diameter is approximately the same as the outer diameter of the wheel mount 74. The grinding wheel 75 includes an annular wheel base (annular base) 76 made of, for example, a metal material.

[0033] An annular grinding wheel 77, which is made up of a plurality of grinding wheels arranged in a ring shape, is fixed to the underside of the wheel base 76. The annular grinding wheel 77 has an inner diameter that causes it to protrude horizontally from the holding surface 22 when placed on the holding surface 22 of the first chuck table 20, for example.

[0034] This annular grinding wheel 77 is formed on the wheel base 76 so that the extension direction of the spindle 72 passes through its center. Therefore, the grinding wheel 77 is rotated by the spindle motor 73 via the spindle 72, wheel mount 74, and wheel base 76 about a rotation axis passing through its center, and grinds the plate-shaped workpiece 200 held on the first chuck table 20 arranged in the grinding area.

[0035] The grinding mechanism 70 having such a configuration rotates the annular grinding wheel 77 to creep feed grind the back surface 202 of the plate-shaped workpiece 200 held on the holding surface 22 of the first chuck table 20 in the workpiece holding mechanism 30 arranged in the grinding area.

[0036] A non-contact height measurement mechanism 60 is disposed on the side of the opening 5 in the base 2. The height measurement mechanism 60 includes a laser height measurement device 61 and an arm 62 that supports the height measurement device 61.

[0037] The height measuring device 61 irradiates a laser beam onto a structure located below it (for example, the holding surface 22, or the back surface 202 of the plate-shaped workpiece 200 held on the holding surface 22), and measures the height of each structure based on the reflected light. Furthermore, the measurement point of the height measuring device 61 is disposed so as to be able to measure the center of rotation of the first chuck table 20. That is, the scanning line 120 (see FIG. 2) of the height measuring device 61 of the height measuring mechanism 60 is set so as to pass through the center of rotation of the first chuck table 20.

[0038] That is, the height measuring device 61 is used to measure the height of the back surface 202, which is the upper surface (grinding surface) of the plate-shaped workpiece 200 held on the holding surface 22, during grinding of the plate-shaped workpiece 200 by the grinding device 1. Furthermore, when the plate-shaped workpiece 200 is not held on the holding surface 22, the height measuring device 61 can measure the height of the holding surface 22.

[0039] In this way, the height measuring device 61 functions as a height measuring device that measures the height of the back surface 202 of the plate-like workpiece 200 held on the holding surface 22 from above the holding surface 22 or the height of the holding surface 22. The height measuring device 61 may be configured to measure the height by emitting and receiving sound waves. The height measuring device 61 may also be a contact-type height measuring device.

[0040] The chuck table provided in the grinding apparatus 1 is not limited to the first chuck table 20 shown in FIGS. 2 and 3, but may be, for example, a second chuck table 80 as shown in FIGS.

[0041] The second chuck table 80, like the first chuck table 20, is formed in a circular shape when viewed in a plane, and is equipped with a disk-shaped porous member 81 and a frame body 83 that houses the porous member 81 so that the top surface of the porous member 81 is exposed.

[0042] The upper surface of the porous member 81 is a holding surface 82 that is connected to a suction source (not shown) to suction and hold the plate-shaped workpiece 200. The frame 83 has a ring-shaped frame surface 84 that is formed to be flush with the holding surface 82.

[0043] In addition, a base portion 85 on the outer side of the frame surface 84 of the frame body 83 is provided with a through hole 86, similar to the through hole 26 of the first chuck table 20, for inserting a screw to fix the second chuck table 80 to the table base 31 (see Figure 1).

[0044] The porous member 81 of the second chuck table 80 is formed to be smaller than the porous member 21 of the first chuck table 20 shown in Fig. 2. Therefore, the holding surface 82 of the second chuck table 80 is smaller than the holding surface 22 of the first chuck table 20. For this reason, a recessed portion 87, which is a portion lower than the holding surface 82 and the frame surface 84, is formed on the upper surface of the frame body 83 of the second chuck table 80 between the holding surface 82 and the frame body surface 84.

[0045] 1 includes a CPU that performs arithmetic processing according to a control program, and a storage medium such as a memory. The control unit 7 controls the above-mentioned members of the grinding apparatus 1 to comprehensively control the components of the grinding apparatus 1. For example, the control unit 7 controls the above-mentioned members of the grinding apparatus 1 to perform a grinding process on the plate-shaped workpiece 200.

[0046] The control unit 7 also has a first recognition unit 11, a second recognition unit 12, a first judgment unit 13, a second judgment unit 14, a third judgment unit 15, a fourth judgment unit 16, a fifth judgment unit 17, and a sixth judgment unit 18, and performs a chuck table confirmation process using these units. In this chuck table confirmation process, the chuck table provided in the workpiece holding mechanism 30 of the grinding device 1 is identified, and the suitability of the identified chuck table is determined.

[0047] The chuck table confirmation process will be described below. First, the control unit 7 controls the Y-axis direction moving mechanism 40 shown in FIG. 1 to move the chuck table (the first chuck table 20 or the second chuck table 80) to the placement area on the −Y direction side.

[0048] Thereafter, the first recognition unit 11 of the control unit 7 controls the Y-axis direction moving mechanism 40 to move the chuck table in the +Y direction along the horizontal direction (Y-axis direction) parallel to the holding surface while performing height measurement using the height measuring device 61. This allows the first recognition unit 11 to measure the height of the upper surface of the chuck table using the height measuring device 61.

[0049] For example, if the workpiece holding mechanism 30 of the grinding apparatus 1 is equipped with the first chuck table 20 shown in Figures 2 and 3, the first recognition unit 11 can obtain the graph shown in Figure 6 as the measurement result from the height measuring device 61. The graph shown in Figure 6 shows the relationship between the measured height (H) and the position (Y) in the Y-axis direction of the measurement point on the top surface of the chuck table. This position in the Y-axis direction is acquired by the Y-axis encoder 46 of the Y-axis direction moving mechanism 40.

[0050] 6, in the graph obtained in this case, a high first region R1 is formed over a relatively long range in the center in accordance with the relatively large holding surface 22 and frame surface 24 of the first chuck table 20. In addition, low second regions R2 are formed at both ends of the graph in accordance with the pedestal portion 25 and the through hole 26.

[0051] On the other hand, when the workpiece holding mechanism 30 of the grinding device 1 is equipped with the second chuck table 80 shown in Figures 4 and 5, the first recognition unit 11 can obtain the graph shown in Figure 7 as the measurement result by the height measuring device 61.

[0052] As shown in FIG. 7, in the graph obtained in this case, similar to the graph shown in FIG. 6, low second regions R2 corresponding to the pedestal portion 85 and the through-hole 86 are formed at both ends.

[0053] 7, the range of the high first region R1 formed in the center is relatively short because the second chuck table 80 has a relatively small holding surface 82. Also, low third regions R3 corresponding to the recessed portions 87 are formed on both sides of the first region R1, and further, high fourth regions R4 corresponding to the frame surface 84 of the frame 83 are formed outside the third region R3.

[0054] The first recognition unit 11 recognizes the chuck table based on the measurement results of the height of the upper surface of the chuck table as shown in Figures 6 and 7. That is, in this embodiment, the first recognition unit 11 determines the size of the holding surface of the chuck table provided in the workpiece holding mechanism 30, for example, based on the length of the first region R1 corresponding to the size of the holding surface. Then, the first recognition unit 11 recognizes the type of chuck table provided in the workpiece holding mechanism 30, i.e., whether the first chuck table 20 or the second chuck table 80 is provided in the workpiece holding mechanism 30, based on the determined size of the holding surface. Alternatively, the first recognition unit 11 may recognize the type of chuck table provided in the workpiece holding mechanism 30 based on the presence or absence of a lower third region R3 corresponding to the recessed portion 87.

[0055] In this way, the first recognition unit 11 of the control unit 7 measures the height of the top surface of the chuck table moved by the Y-axis direction movement mechanism 40 using the height measuring device 61, and recognizes the chuck table. Furthermore, for example, when the length of the first region R1 in FIG. 6 does not match a predetermined length, it may be determined that the rotation center of the chuck table and the center of the holding surface do not match.

[0056] Next, the first determination unit 13 of the control unit 7 determines whether or not the chuck table recognized by the first recognition unit 11 matches a preset chuck table. That is, before starting processing, the operator sets in advance the type of chuck table to be used for processing in the grinding device 1 using an input / output panel (not shown). Then, the first determination unit 13 determines whether the type of chuck table recognized by the first recognition unit 11 matches the type of chuck table previously set by the operator.

[0057] Then, the control unit 7 displays the determination result of the first determination unit 13 to the operator using, for example, an input / output panel. This allows the operator to easily check whether the chuck table provided in the workpiece holding mechanism 30 of the grinding device 1 matches the set chuck table, that is, whether the chuck table is compatible with the plate-shaped workpiece 200 to be machined (for example, the size of the plate-shaped workpiece 200).

[0058] As described above, in this embodiment, the height of the upper surface of the chuck table is measured using the height measuring device 61 used to measure the height of the plate-shaped workpiece 200 during grinding, and the type of chuck table is recognized based on the measurement results. In other words, to recognize the type of chuck table, the height measuring device 61, which is an existing configuration used in processing, is used, and no special configuration is required. Therefore, it is possible to easily recognize the type of chuck table without increasing the cost and size of the grinding apparatus 1.

[0059] In this embodiment, the first recognition unit 11 recognizes the type of chuck table based on the size of the holding surface of the chuck table provided in the workpiece holding mechanism 30. In this regard, the first recognition unit 11 may also recognize the type of chuck table based on the number of holding surfaces of the chuck table provided in the workpiece holding mechanism 30.

[0060] For example, the chuck table provided in the grinding apparatus 1 may be a third chuck table 90 as shown in FIGS.

[0061] The third chuck table 90 is formed in a circular shape in a plan view, and includes five porous members 91 and a frame 93 that houses the porous members 91 so that the upper surfaces of the porous members 91 are exposed. The upper surfaces of the porous members 91 are holding surfaces 92 that are connected to a suction source (not shown) and that hold a plate-shaped workpiece by suction.

[0062] In the third chuck table 90, the holding surfaces 92 are quadrilateral (e.g., square) and hold, for example, a quadrilateral plate-shaped workpiece. One holding surface 92 is located at the center of the upper surface of the third chuck table 90, and two other holding surfaces 92 are located on either side of the central holding surface 92 in the Y-axis direction, and two more holding surfaces 92 are located on either side of the central holding surface 92 in the X-axis direction. The five holding surfaces 92 are arranged so that the opposing sides of adjacent holding surfaces 92 are parallel to each other. In this way, the third chuck table 90 has multiple (three) holding surfaces 92 arranged in a linear direction passing through the center.

[0063] An annular pedestal portion 95 is formed on the outer edge of the frame body 93. This pedestal portion 95 is provided with a through hole 96, similar to the through hole 26 of the first chuck table 20, for inserting a screw for fixing the third chuck table 90 to the table base 31 (see FIG. 1).

[0064] Furthermore, recessed portions 97, which are portions that are lower than the holding surfaces 92 and higher than the pedestal portions 95, are formed on the upper surface of the frame 93 between the holding surfaces 92 and between the holding surfaces 92 and the pedestal portions 95. Furthermore, a cylindrical measuring portion 98 is formed between one of the holding surfaces 92 and the pedestal portions 95. The upper surface of the measuring portion 98 is a measuring surface 94 that is formed to be flush with the holding surfaces 92. In this embodiment, the measuring portion 98 is disposed on a line that passes through the center of the third chuck table 90 and the centers of the three holding surfaces 92, so as to be sandwiched between one through-hole 96 and one holding surface 92.

[0065] When the workpiece holding mechanism 30 of the grinding device 1 is equipped with such a third chuck table 90, the first recognition unit 11 can obtain the graph shown in FIG. 10 as the measurement result by the height measuring device 61.

[0066] As shown in FIG. 10, in the graph obtained in this case, similar to the graph shown in FIG. 6, low second regions R2 corresponding to the pedestal portion 25 and the through-hole 26 are formed at both ends.

[0067] The third chuck table 90 also has three holding surfaces 92 on the scanning line 120 of the height measuring device 61 that passes through the center of the table. Therefore, three high first regions R1 corresponding to the holding surfaces 92 are formed, sandwiching a low third region R3 corresponding to the recessed portion 97. Furthermore, a high fourth region R4 corresponding to the measurement surface 94 is formed outside the left third region R3.

[0068] The first recognition unit 11 determines the number of holding surfaces on the scanning line 120 of the height measuring device 61, for example, based on the number of first regions R1 in the measurement results. Then, based on the determined number of holding surfaces, the first recognition unit 11 can recognize the type of chuck table provided in the workpiece holding mechanism 30, for example, whether the workpiece holding mechanism 30 is provided with a second chuck table 80 (see FIG. 4) having one holding surface 82 or a third chuck table 90 having multiple holding surfaces 92.

[0069] In the third chuck table 90, a measurement surface 94 for measuring the height of the holding surface 22 is formed on the upper surface of a cylindrical measurement portion 98. In this case, compared to the case where a ring-shaped frame surface 84 is provided as shown in Fig. 4, machining water can be more efficiently discharged from the upper surface of the third chuck table 90 to the outside during grinding.

[0070] In the chuck table checking process according to this embodiment, the orientation of the chuck table may be checked instead of the type of the chuck table.

[0071] The process of checking the orientation of the chuck table is carried out, for example, when the workpiece holding mechanism 30 of the grinding device 1 is provided with the fourth chuck table 100 shown in FIGS.

[0072] The fourth chuck table 100 is formed in a circular shape in a plan view, and includes a porous member 101 and a frame 103 that houses the porous member 101 so that the upper surface of the porous member 101 is exposed.

[0073] The upper surface of the porous member 101 is a holding surface 102 that is connected to a suction source (not shown) to hold a plate-shaped workpiece by suction. In the fourth chuck table 100, the holding surface 102 is quadrilateral (for example, square) and holds, for example, a quadrilateral plate-shaped workpiece.

[0074] An annular pedestal portion 105 is formed on the outer edge of the frame body 103. This pedestal portion 105 is provided with a through hole 106, similar to the through hole 26 of the first chuck table 20, for inserting a screw for fixing the fourth chuck table 100 to the table base 31 (see FIG. 1).

[0075] Furthermore, a recessed portion 107, which is a portion lower than the holding surface 102 and higher than the base portion 105, is formed on the upper surface of the frame 103 between the holding surface 102 and the base portion 105. Furthermore, a cylindrical measuring portion 108 is formed at the end of the recessed portion 107. The upper surface of the measuring portion 108 is a measuring surface 104 formed to be flush with the holding surface 102. In this embodiment, the measuring portion 108 is disposed adjacent to one of the through holes 106 on a straight line passing through the center of the fourth chuck table 100 and the centers of the two through holes 106.

[0076] The chuck table orientation confirmation process is used to determine whether one side of the holding surface 102 is perpendicular to the movement direction (Y-axis direction) of the fourth chuck table 100 by the Y-axis direction movement mechanism 40 when such a third chuck table 90 is provided in the work holding mechanism 30.

[0077] In this case, first, before starting processing, the operator sets in the grinding device 1 using an input / output panel (not shown) that the workpiece holding mechanism 30 is equipped with the fourth chuck table 100 and the size (length of each side) of the holding surface 102 of the fourth chuck table 100.

[0078] Then, the control unit 7 controls the Y-axis direction moving mechanism 40 shown in FIG. 1 to move the fourth chuck table 100 to the placement area on the −Y direction side.

[0079] Thereafter, the second judgment unit 14 of the control unit 7 controls the Y-axis direction moving mechanism 40 while performing height measurement using the height measuring device 61 to move the fourth chuck table 100 in the +Y direction along the horizontal direction (Y-axis direction) parallel to the holding surface 102.

[0080] This allows the second determination unit 14 to measure the height of the upper surface of the fourth chuck table 100 moved by the Y-axis direction moving mechanism 40 using the height measuring device 61. Then, based on the measurement result, the second determination unit 14 determines whether or not one side of the holding surface 102 is perpendicular to the movement direction (Y-axis direction) of the fourth chuck table 100 by the Y-axis direction moving mechanism 40.

[0081] That is, when measuring the height of the upper surface of the fourth chuck table 100, a graph such as that shown in FIG. 13 can be obtained as the measurement result. As shown in FIG. 13, in the graph obtained in this case, similar to the graph shown in FIG. 10, low second regions R2 corresponding to the pedestal portion 105 and the through-hole 106 are formed at both ends.

[0082] Also, a high first region R1 corresponding to the holding surface 102 is formed to be sandwiched between a low third region R3 corresponding to the recessed portion 107. Furthermore, a high fourth region R4 corresponding to the measurement surface 104 is formed outside the left third region R3.

[0083] When the orientation of the fourth chuck table 100 is in a predetermined direction, a first edge 110 (see FIG. 11 ) along the X-axis direction on the holding surface 102 is perpendicular to the Y-axis direction, which is the direction of movement of the fourth chuck table 100 by the Y-axis direction movement mechanism 40 (the direction in which the scanning line 120 extends). Furthermore, a second edge 111 (an edge along the Y-axis direction) perpendicular to the first edge 110 is parallel to the Y-axis direction. Therefore, the length of the first region R1, which is the length of the scanning line 120 on the holding surface 102, is a length corresponding to the length of this second edge 111 (hereinafter referred to as a predetermined length). This predetermined length is, for example, set in advance in the grinding apparatus 1 by an operator.

[0084] 14, if the orientation of the fourth chuck table 100 deviates from the predetermined orientation, the first side 110 of the holding surface 102 will not be perpendicular to the Y-axis direction, which is the movement direction of the fourth chuck table 100. Note that this figure also shows a straight line 130 that passes through the center of the fourth chuck table 100 and is perpendicular to the first side 110.

[0085] Such a deviation in the orientation of the fourth chuck table 100 occurs, for example, when the fourth chuck table 100 is fastened to the table base 31 (see FIG. 1) with a screw, as a result of the screw being misaligned within the through-hole 106. In this case, as shown in FIG. 14, the second side 111 is not parallel to the Y-axis direction, which is the direction in which the scanning line 120 extends, and therefore the length of the first region R1 becomes longer than the predetermined length.

[0086] Therefore, the second determination unit 14 obtains the length of the first region R1 in the measurement result and determines whether the obtained length is a predetermined length or longer. If the second determination unit 14 determines that the length of the first region R1 is the predetermined length, it determines that the orientation of the fourth chuck table 100 is the predetermined orientation and that the first edge 110 of the holding surface 102 is perpendicular to the Y-axis direction, which is the direction in which the Y-axis direction moving mechanism 40 moves the fourth chuck table 100.

[0087] On the other hand, if the second judgment unit 14 determines that the length of the first region R1 is longer than the predetermined length, it determines that the orientation of the fourth chuck table 100 is not the predetermined orientation and that the first side 110 of the holding surface 102 is not perpendicular to the Y-axis direction. Then, the second judgment unit 14 detects the amount of deviation of the orientation of the fourth chuck table 100 (the amount of deviation (angle) from the predetermined orientation) from the difference between the measured length of the first region R1 and the predetermined length.

[0088] Then, the control unit 7 controls the table rotation mechanism 33 of the workpiece holding mechanism 30 shown in FIG. 1 to rotate the fourth chuck table 100 so as to eliminate the detected misalignment of the fourth chuck table 100. This causes the orientation of the fourth chuck table 100 to be aligned in a predetermined direction, and the first side 110 of the holding surface 102 can be positioned so as to be perpendicular to the Y-axis direction. In this manner, with this configuration, it is possible to easily determine whether the orientation of the fourth chuck table 100 is appropriate using the height measuring device 61, which is an existing configuration.

[0089] In the above-mentioned processing, the second judgment unit 14 judges whether the first side 110 of the holding surface 102 is perpendicular to the Y-axis direction, using as a judgment criterion whether the length of the first region R1 in the measurement result is a predetermined length.

[0090] In this regard, the second judgment unit 14 may use other judgment criteria. Fig. 15(a) is an enlarged top view of the range A1 in Fig. 14, and Fig. 15(b) is a cross-sectional view of this portion along the scanning line 120. As shown in these figures, if the orientation of the fourth chuck table 100 is deviated from the predetermined orientation, a part of the recessed portion 107 will be between the pedestal portion 105 and the measurement surface 104 on the scanning line 120 of the height measuring device 61, which is parallel to the Y-axis direction, as indicated by the arrow 500. Furthermore, when the orientation of the fourth chuck table 100 is in a predetermined direction, the scanning line 120 coincides with a straight line 130 that passes through the center of the fourth chuck table 100 and is perpendicular to the first edge 110, so that no part of the recess 107 gets between the base portion 105 and the measurement surface 104 on the scanning line 120.

[0091] Therefore, as shown in Figure 15(c), when the orientation of the fourth chuck table 100 is deviated from the specified orientation, in the graph showing the measurement results of the top surface height of the fourth chuck table 100, a third region R3 corresponding to the recessed portion 107 is formed between a low second region R2 corresponding to the base portion 105 and the through hole 106 and a high fourth region R4 corresponding to the measurement surface 104.

[0092] Therefore, the second determination unit 14 determines whether or not the third region R3 is formed between the second region R2 and the fourth region R4 in the measurement result, and if the third region R3 is not formed, it can determine that the orientation of the fourth chuck table 100 is in a predetermined orientation and the first side 110 of the holding surface 102 is perpendicular to the Y-axis direction. On the other hand, if the third region R3 is formed between the second region R2 and the fourth region R4, the second determination unit 14 can determine that the orientation of the fourth chuck table 100 is deviated from the predetermined orientation and the first side 110 of the holding surface 102 is not perpendicular to the Y-axis direction.

[0093] In this way, the second judgment unit 14 can determine whether the first edge 110 of the holding surface 102 is perpendicular to the Y-axis direction, using as a judgment criterion whether the third region R3 is formed between the second region R2 and the fourth region R4. In this case, the second judgment unit 14 can detect the amount of misalignment in the orientation of the fourth chuck table 100 based on the length of the third region R3 formed between the second region R2 and the fourth region R4. Then, the control unit 7 can eliminate the misalignment of the fourth chuck table 100 using the table rotation mechanism 33 of the workpiece holding mechanism 30 shown in FIG.

[0094] In addition, the process of confirming the orientation of the chuck table is also used, for example, when the workpiece holding mechanism 30 of the grinding device 1 is equipped with the third chuck table 90 shown in Figures 8 and 9, to determine whether the multiple holding surfaces 92 are aligned parallel to the movement direction of the third chuck table 90 by the Y-axis movement mechanism 40.

[0095] In this case, before starting processing, the operator first sets in the grinding device 1 using an input / output panel (not shown) that the workpiece holding mechanism 30 is equipped with a third chuck table 90, and the number and size (length of each side) of the holding surfaces 92 of the third chuck table 90, etc.

[0096] Then, the control unit 7 controls the Y-axis direction moving mechanism 40 shown in FIG. 1 to move the third chuck table 90 to the placement area on the −Y direction side.

[0097] Thereafter, the third judgment unit 15 of the control unit 7 controls the Y-axis direction moving mechanism 40 while performing height measurement using the height measuring device 61 to move the third chuck table 90 in the +Y direction along the horizontal direction (Y-axis direction) parallel to the holding surface 92.

[0098] This allows the third determination unit 15 to measure the height of the upper surface of the third chuck table 90 moved by the Y-axis direction moving mechanism 40 using the height measuring device 61. Then, based on the measurement result, the third determination unit 15 determines whether or not the multiple holding surfaces 92 are aligned parallel to the direction of movement of the third chuck table 90 by the Y-axis direction moving mechanism 40 (the Y-axis direction).

[0099] That is, as described above, when measuring the height of the upper surface of the third chuck table 90, the graph shown in FIG. 10 can be obtained as the measurement results. 10, in this graph, three high first regions R1 are formed with a low third region R3 in between that corresponds to the recessed portion 97. The high first regions R1 correspond to the three holding surfaces 92 that are aligned on a scanning line 120 of the height measuring device 61 that is parallel to the Y-axis direction and passes through the center of the third chuck table 90.

[0100] When the third chuck table 90 is oriented in a predetermined direction, these three holding surfaces 92 are aligned parallel to the Y-axis direction, which is the movement direction of the third chuck table 90 by the Y-axis direction movement mechanism 40 (the direction in which the scanning line 120 extends). In this case, one side 921 (see FIG. 8) of the rectangular holding surface 92 along the Y-axis direction is parallel to the Y-axis direction. Therefore, the length of each first region R1 is a length corresponding to the length of this side 921 (hereinafter referred to as a predetermined length).

[0101] On the other hand, if the orientation of the third chuck table 90 is deviated from the predetermined orientation, the three holding surfaces 92 will not be aligned parallel to the Y-axis direction. In this case, the sides 921 of the holding surfaces 92 will not be parallel to the Y-axis direction. As a result, the length of each first region R1 will be longer than the predetermined length.

[0102] Therefore, the third determination unit 15 obtains the length of the first region R1 in the measurement result and determines whether the obtained length is a predetermined length or longer. If the third determination unit 15 determines that the length of the first region R1 is the predetermined length, it determines that the orientation of the third chuck table 90 is the predetermined orientation and that the three holding surfaces 92 aligned on the scanning line 120 are aligned parallel to the Y-axis direction, which is the direction of movement of the third chuck table 90 by the Y-axis direction movement mechanism 40.

[0103] On the other hand, if the third determination unit 15 determines that the length of the first region R1 is longer than the predetermined length, it determines that the orientation of the third chuck table 90 is not the predetermined orientation and that the three holding surfaces 92 are not aligned parallel to the Y-axis direction. Then, the third determination unit 15 detects the amount of deviation in the orientation of the third chuck table 90 (the amount of deviation (angle) from the predetermined orientation) from the difference between the measured length of the first region R1 and the predetermined length.

[0104] Then, the control unit 7 controls the table rotation mechanism 33 of the workpiece holding mechanism 30 shown in FIG. 1 to rotate the third chuck table 90 so as to eliminate the detected misalignment of the third chuck table 90. This causes the orientation of the third chuck table 90 to be aligned in a predetermined direction, and the three holding surfaces 92 aligned on the scanning line 120 can be arranged parallel to the Y-axis direction. In this way, even with this configuration, it is possible to easily determine whether the orientation of the third chuck table 90 is appropriate using the height measuring device 61, which is an existing configuration. The predetermined length may be set in advance in the grinding device 1 by, for example, an operator.

[0105] Furthermore, the control unit 7 or the third determination unit 15 may detect the orientation of the third chuck table 90 when the measured length of the first region R1 is shortest. That is, in this case, the measurement of the length of the first region R1 along the scanning line 120 and the change of the angle of the third chuck table 90 by the table rotation mechanism 33 are repeatedly performed. Then, depending on whether the shortest measured length of the first region R1 matches a predetermined length, it is determined whether the third chuck table 90 provided in the grinding apparatus 1 is the preset chuck table.

[0106] Furthermore, the holding surface 92 of the third chuck table 90 may be a groove-type holding surface as shown in Fig. 16. The holding surface 92 shown in this figure is made of, for example, solid wood and has suction grooves 99. The suction grooves 99 are connected to a suction source (not shown), so that the holding surface 92 can suction-hold, for example, a rectangular plate-shaped workpiece. Even if the holding surfaces 92 are groove-type holding surfaces, it is possible to determine whether the multiple holding surfaces 92 are aligned parallel to the axial direction by the above-described process of checking the orientation of the chuck table.

[0107] In addition, in this embodiment, the grinding apparatus 1 is shown as a creep feed grinding apparatus as an example of a processing apparatus. In this regard, the processing apparatus according to this embodiment may be an in-feed grinding apparatus or a polishing apparatus having a polishing mechanism as a processing mechanism.

[0108] In the above-described embodiment, the second determination unit 14 or the third determination unit 15 determines whether the orientation of the chuck table is a predetermined orientation. In this regard, the first recognition unit 11 may be configured to recognize the orientation of the chuck table (appropriateness of the orientation) in addition to or instead of the type of the chuck table (size of the holding surface, number of holding surfaces). That is, the first recognition unit 11 may be configured to recognize the type and / or orientation of the chuck table. In this case, the first determination unit 13 may be configured to determine whether the type and / or orientation of the chuck table recognized by the first recognition unit 11 matches a preset type and / or orientation of the chuck table.

[0109] Furthermore, the first recognition unit 11 may be configured to recognize any of the attributes of the chuck table, such as the type and orientation of the chuck table, determined from the result of measuring the height of the top surface of the chuck table by the height measuring device 61. The first determination unit 13 may be configured to determine whether or not the attribute of the chuck table recognized by the first recognition unit 11 matches a preset attribute of the chuck table.

[0110] 2 and 3 or the second chuck table 80 shown in Figures 4 and 5, the system recognizes which of the first chuck table 20 shown in Figures 2 and 3 and the second chuck table 80 shown in Figures 4 and 5 is provided in the workpiece holding mechanism 30, and determines whether the recognized chuck table matches the chuck table previously set by the operator. In this regard, this processing may be performed in a state in which a plate-shaped workpiece 200 is held at a predetermined position on the holding surface 22 of the first chuck table 20 as shown in Figures 17 and 18, and a plate-shaped workpiece 220 is held at a predetermined position on the holding surface 82 of the second chuck table 80 as shown in Figures 19 and 20.

[0111] 17 and 18 has the same circular shape as the holding surface 22 of the first chuck table 20 in a plan view, and has the same diameter as the holding surface 22. Therefore, the plate-shaped workpiece 200 is held on the holding surface 22 so that the center of the holding surface 22 coincides with the center of the plate-shaped workpiece 200, that is, is held at a predetermined position on the holding surface 22, and can cover the entire holding surface 22 without protruding from the holding surface 22. 19 and 20 has the same circular shape as the holding surface 82 of the second chuck table 80 in a plan view, and has the same diameter as the holding surface 82. Therefore, the plate-shaped workpiece 220 is held on the holding surface 82 so that the center of the holding surface 82 coincides with the center of the plate-shaped workpiece 220, that is, is held at a predetermined position on the holding surface 82, and can cover the entire holding surface 82 without protruding from the holding surface 82.

[0112] In this case, the height measuring mechanism 60 of the grinding device 1 is provided with a thickness measuring device 63 (see FIG. 1) that measures the thickness of the plate-shaped workpiece, instead of or in addition to the height measuring device 61. That is, in this case, the grinding device 1 functions as a processing device that processes the workpiece while measuring the thickness of the workpiece held on the holding surface of the chuck table.

[0113] The thickness measuring device 63 measures the thickness of a plate-shaped workpiece held on a holding surface of a chuck table such as the first chuck table 20 provided in the workpiece holding mechanism 30 of the grinding apparatus 1 from above the holding surface in a non-contact manner. The thickness measuring device 63 may be configured, for example, to irradiate the plate-shaped workpiece with a laser beam having a wavelength that penetrates the plate-shaped workpiece, receive reflected light from the bottom surface of the plate-shaped workpiece and reflected light from the top surface of the plate-shaped workpiece, and measure the thickness of the plate-shaped workpiece based on the optical path difference between the reflected light. Alternatively, the thickness measuring device 63 may be a spectroscopic interference wafer thickness gauge that measures the thickness of the plate-shaped workpiece by analyzing the interference light between the reflected light from the bottom surface of the plate-shaped workpiece and the reflected light from the top surface of the plate-shaped workpiece. The thickness measuring device 63 may also include an SLD (Super Luminescent Diode) as a light source for emitting measurement light.

[0114] The measurement point of the thickness measuring device 63 is disposed so as to pass through the rotation center of the chuck table. That is, the scanning line 140 (see FIGS. 17 and 19) of the thickness measuring device 63 is set so as to pass through the rotation centers of the first chuck table 20 and the second chuck table 80.

[0115] In this process, the control unit 7 first controls the Y-axis direction moving mechanism 40 shown in Fig. 1 to move the chuck table (first chuck table 20 or second chuck table 80) to the placement area on the -Y direction side. Then, a plate-shaped workpiece (plate-shaped workpiece 200 or 220) having the same shape as the holding surface in a plan view is held on the holding surface so that it coincides with the holding surface. In other words, the plate-shaped workpiece is held at a predetermined position on the holding surface.

[0116] Thereafter, the second recognition unit 12 of the control unit 7 controls the Y-axis direction moving mechanism 40 to move the chuck table in the +Y direction along the horizontal direction (Y-axis direction) parallel to the holding surface while measuring the thickness of the plate-shaped workpiece held on the holding surface using the thickness measuring device 63. This allows the second recognition unit 12 to use the thickness measuring device 63 to measure the thickness of the plate-shaped workpiece held on the holding surface of the chuck table.

[0117] For example, if the workpiece holding mechanism 30 of the grinding machine 1 is equipped with the first chuck table 20, the second recognition unit 12 can obtain the graph shown in Fig. 21 as the measurement result from the thickness measuring device 63. The graph shown in Fig. 21 shows the relationship between the measured thickness (T) and the position (Y) of the measurement point in the Y-axis direction. This position in the Y-axis direction is acquired by the Y-axis encoder 46 of the Y-axis direction moving mechanism 40.

[0118] In this case, a plate-shaped workpiece 200 having the same shape as the holding surface 22 in a planar view is held on the relatively large holding surface 22 of the first chuck table 20, and therefore, as shown in Figure 21, a high fifth region R5 is formed in the center over a relatively long range depending on the thickness of the plate-shaped workpiece 220.

[0119] On the other hand, when the workpiece holding mechanism 30 of the grinding device 1 is provided with the second chuck table 80, the second recognition unit 12 can obtain the graph shown in FIG. 22 as the measurement result by the thickness measuring device 63.

[0120] In this case, a plate-shaped workpiece 220 having the same shape as the holding surface 82 in a planar view is held on the relatively small holding surface 82 of the second chuck table 80, and therefore, as shown in Figure 22, the range of the high fifth region R5 formed in the center according to the thickness of the plate-shaped workpiece 220 is relatively short.

[0121] The second recognition unit 12 then recognizes the chuck table based on the measurement results of the thickness of the plate-shaped workpiece as shown in Figures 21 and 22. That is, the second recognition unit 12 determines the size of the holding surface of the chuck table provided in the workpiece holding mechanism 30, for example, based on the length of the fifth region R5 corresponding to the size of a plate-shaped workpiece having the same shape as the holding surface in a plan view. Then, based on the determined size of the holding surface, the second recognition unit 12 recognizes the type of chuck table provided in the workpiece holding mechanism 30, i.e., whether the first chuck table 20 or the second chuck table 80 is provided in the workpiece holding mechanism 30.

[0122] In this way, the second recognition unit 12 of the control unit 7 measures the thickness of a plate-shaped workpiece having a shape corresponding to the holding surface held at a predetermined position on the holding surface of the chuck table moved by the Y-axis direction movement mechanism 40 using the thickness measuring device 63, and recognizes the chuck table. Furthermore, for example, when the length of the fifth region R5 in FIG. 21 does not match a predetermined length, it may be determined that the rotation center of the chuck table and the center of the holding surface do not match.

[0123] Next, the fourth determination unit 16 of the control unit 7 determines whether or not the chuck table recognized by the second recognition unit 12 matches a preset chuck table. That is, before starting processing, the operator sets in advance the type of chuck table to be used for processing in the grinding device 1 using an input / output panel (not shown). Then, the fourth determination unit 16 determines whether or not the type of chuck table recognized by the second recognition unit 12 matches the type of chuck table previously set by the operator.

[0124] Then, the control unit 7 displays the determination result of the fourth determination unit 16 to the operator using, for example, an input / output panel, which allows the operator to easily check whether the chuck table provided in the workpiece holding mechanism 30 of the grinding device 1 matches the set chuck table.

[0125] As described above, in this embodiment, the thickness of the plate-shaped workpiece held on the chuck table is measured using the thickness gauge 63 used to measure the thickness of the plate-shaped workpiece during grinding, and the type of chuck table is recognized based on the measurement results. In other words, the type of chuck table is recognized by using the thickness gauge 63, which is an existing configuration used in processing, and no special configuration is required. Therefore, it is possible to easily recognize the type of chuck table without increasing the cost and size of the grinding apparatus 1.

[0126] In the above-described embodiment, the plate-shaped workpiece 200 has the same circular shape as the holding surface 22 of the first chuck table 20 in a plan view, and has the same diameter as the holding surface 22. However, this is not limiting, and the plate-shaped workpiece 200 may have any shape that corresponds to the holding surface 22, and for example, may have a circular shape in a plan view and a diameter that is slightly different from that of the holding surface 22. Similarly, the plate-shaped workpiece 220 may have any shape that corresponds to the holding surface 82, for example, a circular shape in a plan view, and may have a diameter slightly different from that of the holding surface 82 of the second chuck table 80.

[0127] That is, there only needs to be a difference in diameter between the plate-shaped workpiece 200 corresponding to the holding surface 22 of the first chuck table 20 and the plate-shaped workpiece 220 corresponding to the holding surface 82 of the second chuck table 80. In this case, the length of the fifth region R5 in the thickness measurement results changes depending on the type of chuck table provided in the grinding device 1. Therefore, the second recognition unit 12 can recognize whether the first chuck table 20 or the second chuck table 80 is provided in the workpiece holding mechanism 30 based on the length of the fifth region R5.

[0128] Similarly to the above-described first recognition unit 11, the second recognition unit 12 may be configured to recognize any of the attributes of the chuck table, such as the type and orientation of the chuck table, determined from the result of the thickness measurement of the plate-like workpiece held on the chuck table by the thickness measuring device 63. The fourth determination unit 16 may be configured to determine whether or not the attribute of the chuck table recognized by the second recognition unit 12 matches a preset attribute of the chuck table.

[0129] Furthermore, if the grinding device 1 is equipped with a thickness measuring device 63, when determining the orientation of the fourth chuck table 100 shown in Figures 11 and 12, the plate-shaped workpiece 250 may be held on the holding surface 102 as shown in Figures 23 and 24. The plate-shaped workpiece 250 has the same rectangular shape as the holding surface 102 in a plan view, and has sides of the same length as the sides of the holding surface 102. Therefore, the plate-shaped workpiece 250 is held on the holding surface 102 so that the center of the holding surface 102 and the center of the plate-shaped workpiece 250 coincide with each other and the sides of the holding surface 102 and the sides of the plate-shaped workpiece 250 are parallel to each other; in other words, by being held at a predetermined position on the holding surface 102, the plate-shaped workpiece 250 does not protrude from the holding surface 102 and can cover the entire holding surface 102.

[0130] In this case, first, before starting processing, the operator sets in the grinding device 1 using an input / output panel (not shown) that the workpiece holding mechanism 30 is equipped with the fourth chuck table 100 and the size (length of each side) of the holding surface 102 of the fourth chuck table 100.

[0131] 1 to move the fourth chuck table 100 to the placement area on the -Y direction side. Then, the control unit 7 controls the Y-axis direction moving mechanism 40 shown in FIG. 1 to hold the plate-shaped workpiece 250, which has the same shape as the holding surface 102 in a plan view, on the holding surface 102 so that it coincides with the holding surface 102. In other words, the plate-shaped workpiece 250 is held at a predetermined position on the holding surface 102.

[0132] Thereafter, the fifth judgment unit 17 of the control unit 7 controls the Y-axis direction moving mechanism 40 to move the fourth chuck table 100 in the +Y direction along the horizontal direction (Y-axis direction) parallel to the holding surface 102, while measuring the thickness of the plate-shaped workpiece 250 held on the holding surface 102 using the thickness measuring device 63.

[0133] This allows the fifth determination unit 17 to use the thickness measuring device 63 to measure the thickness of the plate-shaped workpiece 250 having a shape corresponding to the holding surface 102 held at a predetermined position on the holding surface 102 of the fourth chuck table 100 moved by the Y-axis direction moving mechanism 40. Then, based on the measurement result, the fifth determination unit 17 determines whether or not one side of the holding surface 102 is perpendicular to the movement direction (Y-axis direction) of the fourth chuck table 100 by the Y-axis direction moving mechanism 40.

[0134] That is, when measuring the thickness of the plate-shaped workpiece 250 held on the holding surface 102 of the fourth chuck table 100, a graph such as that shown in FIG. 25 can be obtained as the measurement results. 25, the graph obtained in this case has one high fifth region R5 formed. This high fifth region R5 corresponds to the thickness of the plate-like workpiece 250 held on the holding surface 102.

[0135] When the orientation of the fourth chuck table 100 is in a predetermined direction, a first edge 110 (see FIG. 23 ) of the holding surface 102 extending along the X-axis direction is perpendicular to the Y-axis direction, which is the movement direction of the fourth chuck table 100 by the Y-axis direction movement mechanism 40 (the direction in which the scanning line 140 extends). Furthermore, a second edge 111 (an edge extending along the Y-axis direction) perpendicular to the first edge 110 is parallel to the Y-axis direction. Therefore, for example, when a plate-shaped workpiece 250 having the same shape as the holding surface 102 in a plan view is held at a predetermined position on the holding surface 102, the length of the fifth region R5 is the length of one side of the plate-shaped workpiece 250, i.e., the length corresponding to the length of the second edge 111 of the rectangular holding surface 102 extending along the Y-axis direction (hereinafter referred to as the predetermined length). This predetermined length is, for example, set in advance in the grinding apparatus 1 by an operator.

[0136] On the other hand, as described above using Figure 14, if the orientation of the fourth chuck table 100 is deviated from the specified orientation, the first edge 110 of the holding surface 102 will no longer be perpendicular to the Y-axis direction, which is the movement direction of the fourth chuck table 100, and the second edge 111 will not be parallel to the Y-axis direction, which is the extension direction of the scanning line 140, so the length of the fifth region R5 will be longer than the specified length.

[0137] Therefore, the fifth determination unit 17 obtains the length of the fifth region R5 in the measurement result and determines whether the obtained length is a predetermined length or longer. If the fifth determination unit 17 determines that the length of the fifth region R5 is the predetermined length, it determines that the orientation of the fourth chuck table 100 is the predetermined orientation and that the first edge 110 of the holding surface 102 is perpendicular to the Y-axis direction, which is the direction in which the Y-axis direction moving mechanism 40 moves the fourth chuck table 100.

[0138] On the other hand, if the fifth determination unit 17 determines that the length of the fifth region R5 is longer than the predetermined length, it determines that the orientation of the fourth chuck table 100 is not the predetermined orientation and that the first side 110 of the holding surface 102 is not perpendicular to the Y-axis direction. Then, the fifth determination unit 17 detects the amount of deviation of the orientation of the fourth chuck table 100 (the amount of deviation (angle) from the predetermined orientation) from the difference between the measured length of the fifth region R5 and the predetermined length.

[0139] Then, the control unit 7 controls the table rotation mechanism 33 of the workpiece holding mechanism 30 shown in FIG. 1 to rotate the fourth chuck table 100 so as to eliminate the detected misalignment of the fourth chuck table 100. This causes the orientation of the fourth chuck table 100 to be aligned in a predetermined direction, and the first side 110 of the holding surface 102 can be positioned so as to be perpendicular to the Y-axis direction. In this manner, with this configuration, it is possible to easily determine whether the orientation of the fourth chuck table 100 is appropriate using the thickness measuring device 63, which is an existing configuration.

[0140] In the above-described embodiment, the plate-shaped workpiece 250 has the same rectangular shape as the holding surface 102 of the fourth chuck table 100 in a plan view, and has sides of the same length as the sides of the holding surface 102. However, the present invention is not limited to this, and the plate-shaped workpiece 250 may have any shape that corresponds to the holding surface 102, and may, for example, have a rectangular shape in a plan view, and have sides of slightly different lengths from the sides of the holding surface 102.

[0141] That is, the fifth determination unit 17 only needs to recognize the length (i.e., the predetermined length) of the fifth region R5 in the result of measuring the thickness of the plate-shaped workpiece 250 when the plate-shaped workpiece 250 corresponding to the holding surface 102 is held at a predetermined position on the holding surface 102 of the fourth chuck table 100 and the orientation of the fourth chuck table 100 is the predetermined orientation. The fifth determination unit 17 can determine whether the orientation of the fourth chuck table 100 is the predetermined orientation depending on whether the length of the fifth region R5 in the measurement result is the predetermined length.

[0142] Furthermore, if the grinding device 1 is equipped with a thickness measuring device 63, when determining the orientation of the third chuck table 90 shown in Figures 8 and 9, the plate-shaped workpiece 300 may be held on the holding surface 92 as shown in Figures 26 and 27. The plate-shaped workpiece 300 has the same rectangular shape as the holding surface 92 in a plan view, and has sides of the same length as the sides of the holding surface 92. Therefore, the plate-shaped workpiece 300 is held on the holding surface 92 so that the center of the holding surface 92 and the center of the plate-shaped workpiece 300 coincide with each other and the sides of the holding surface 92 and the sides of the plate-shaped workpiece 300 are parallel to each other; in other words, by being held at a predetermined position on the holding surface 92, the plate-shaped workpiece 300 does not protrude from the holding surface 92 and can cover the entire holding surface 92.

[0143] In this case, before starting processing, the operator first sets in the grinding device 1 using an input / output panel (not shown) that the workpiece holding mechanism 30 is equipped with a third chuck table 90, and the number and size (length of each side) of the holding surfaces 92 of the third chuck table 90, etc.

[0144] Then, the control unit 7 controls the Y-axis direction moving mechanism 40 shown in FIG. 1 to move the third chuck table 90 to the placement area on the −Y direction side. Then, a plate-shaped workpiece 300 having the same shape as the holding surface 92 in a plan view is held on the holding surface 92 so as to coincide with the holding surface 92. In other words, a plurality of (five) plate-shaped workpieces 300 are held at predetermined positions on a plurality of (five) holding surfaces 92.

[0145] Then, the sixth judgment unit 18 of the control unit 7 controls the Y-axis direction moving mechanism 40 to move the third chuck table 90 in the +Y direction along the horizontal direction (Y-axis direction) parallel to the holding surface 92, while measuring the thickness of the plate-shaped workpiece 300 held on the holding surface 92 using the thickness measuring device 63.

[0146] This allows the fourth judgment unit to use the thickness measuring device 63 to measure the thickness of the plate-shaped workpiece 300 having a shape corresponding to the holding surface 92 held at a predetermined position on the holding surface 92 of the third chuck table 90 moved by the Y-axis direction moving mechanism 40. Then, based on the measurement result, the sixth judgment unit 18 judges whether or not the multiple holding surfaces 92 are aligned parallel to the movement direction (Y-axis direction) of the third chuck table 90 by the Y-axis direction moving mechanism 40.

[0147] That is, when measuring the thickness of the plate-shaped workpiece 300 held on the holding surface 92 of the third chuck table 90, the graph shown in FIG. 28 can be obtained as the measurement results. 28, three high fifth regions R5 are formed in this graph. These high fifth regions R5 correspond to the thicknesses of the plate-like workpieces 300 held by the three holding surfaces 92, which are aligned on a scanning line 140 that is parallel to the Y-axis direction and passes through the rotation center of the third chuck table 90.

[0148] When the third chuck table 90 is oriented in a predetermined direction, these three holding surfaces 92 are aligned parallel to the Y-axis direction, which is the movement direction of the third chuck table 90 by the Y-axis direction movement mechanism 40 (the direction in which the scanning line 140 extends). In this case, one side 921 (see FIG. 26 ) of the rectangular holding surface 92 along the Y-axis direction is parallel to the Y-axis direction. Therefore, for example, when a plate-shaped workpiece 300 having the same shape as the holding surface 92 in a plan view is held at a predetermined position on the holding surface 92, the length of each fifth region R5 is the length of one side of the plate-shaped workpiece 300, i.e., the length corresponding to the length of one side 921 of the rectangular holding surface 92 along the Y-axis direction (hereinafter referred to as the predetermined length). This predetermined length is, for example, set in advance in the grinding apparatus 1 by an operator.

[0149] On the other hand, if the orientation of the third chuck table 90 is deviated from the predetermined orientation, the three holding surfaces 92 will not be aligned parallel to the Y-axis direction. In this case, the sides 921 of the holding surfaces 92 will not be parallel to the Y-axis direction. As a result, the length of each fifth region R5 will be longer than the predetermined length.

[0150] Therefore, the sixth determination unit 18 obtains the length of the fifth region R5 in the measurement results and determines whether the obtained length is a predetermined length or longer. If the sixth determination unit 18 determines that the length of the fifth region R5 is the predetermined length, it determines that the orientation of the third chuck table 90 is a predetermined orientation and that the three holding surfaces 92 aligned on the scanning line 140 are aligned parallel to the Y-axis direction, which is the direction of movement of the third chuck table 90 by the Y-axis direction movement mechanism 40.

[0151] On the other hand, if the sixth judgment unit 18 determines that the length of the fifth region R5 is longer than the predetermined length, it determines that the orientation of the third chuck table 90 is not the predetermined orientation and that the three holding surfaces 92 are not aligned parallel to the Y-axis direction. Then, the sixth judgment unit 18 detects the amount of deviation of the orientation of the third chuck table 90 (the amount of deviation (angle) from the predetermined orientation) from the difference between the measured length of the fifth region R5 and the predetermined length.

[0152] Then, the control unit 7 controls the table rotation mechanism 33 of the workpiece holding mechanism 30 shown in FIG. 1 to rotate the third chuck table 90 so as to eliminate the detected misalignment of the third chuck table 90. This causes the orientation of the third chuck table 90 to be aligned in a predetermined direction, and the three holding surfaces 92 aligned on the scanning line 140 can be arranged parallel to the Y-axis direction. In this manner, with this configuration, it is possible to easily determine whether the orientation of the third chuck table 90 is appropriate using the thickness measuring device 63, which is an existing configuration.

[0153] In the above-described embodiment, the plate-shaped workpiece 300 has the same rectangular shape as the holding surface 92 of the third chuck table 90 in a plan view, and has sides of the same length as the sides of the holding surface 92. However, the present invention is not limited to this, and the plate-shaped workpiece 300 may have any shape that corresponds to the holding surface 92, and may, for example, have a rectangular shape in a plan view, and have sides of slightly different lengths from the sides of the holding surface 92.

[0154] That is, the sixth determination unit 18 only needs to recognize the length (i.e., the predetermined length) of each fifth region R5 in the thickness measurement results of the plate-shaped workpiece 300 when the plate-shaped workpiece 300 corresponding to the holding surface 92 is held at a predetermined position on the holding surface 92 of the third chuck table 90 and when the orientation of the third chuck table 90 is in a predetermined orientation. The sixth determination unit 18 can determine whether the orientation of the third chuck table 90 is in the predetermined orientation depending on whether the length of the fifth region R5 in the measurement results is the predetermined length.

[0155] The grinding device 1 may also be equipped with a transport mechanism that transports the plate-shaped workpiece to the chuck table. In this case, the control unit 7 causes the transport mechanism to transport the plate-shaped workpiece to the holding surface and hold it there. Then, the control unit 7 moves the chuck table, with the plate-shaped workpiece held on the holding surface, in the +Y direction, and measures the thickness of the plate-shaped workpiece with the thickness measuring device 63. Based on the measurement result, the length of the plate-shaped workpiece on the scanning line 140 can be recognized.

[0156] If the grinding device 1 is equipped with a third chuck table 90 (or a fourth chuck table 100), the control unit 7 may determine whether the plate-shaped workpiece 300 (250) is held at a predetermined position on the holding surface 92 (102) based on whether the length of the plate-shaped workpiece 300 (250) on the recognized scanning line 140 matches the length of one side of the plate-shaped workpiece 300 (250) that has been set in advance.

[0157] Similarly, if the grinding device 1 is equipped with a first chuck table 20 (or a second chuck table 80), the control unit 7 may determine whether the plate-shaped workpiece 200 (220) is held at a predetermined position on the holding surface 22 (82) based on whether the length of the plate-shaped workpiece 200 (220) on the recognized scanning line 140 matches the predetermined diameter length of the plate-shaped workpiece 200 (220). [Explanation of symbols]

[0158] 1: grinding device, 2: base, 3: column, 4: bellows cover, 5: opening, 7: control unit, 11: first recognition section, 12: second recognition section, 13: first judgment section, 14: second judgment section, 15: Third judgment section, 16: Fourth judgment section, 17: Fifth judgment section, 18: Sixth judgment section, 20: first chuck table, 21: porous member, 22: holding surface, 23: frame body, 24: Frame surface, 25: Base portion, 26: Through hole, 30: workpiece holding mechanism, 31: table base, 32: tilt adjustment mechanism, 33: table rotation mechanism, 34: motor, 35: driving pulley, 36: driven pulley, 37: endless belt, 38: encoder, 39: Cover plate, 40: Y-axis direction moving mechanism, 41: Support table 42: Y-axis guide rail, 43: Y-axis ball screw, 44: Y-axis motor, 45: Y-axis moving table, 46: Y-axis encoder, 50: grinding feed mechanism, 51: Z-axis guide rail, 52: Z-axis ball screw, 53: Z-axis moving table, 54: Z-axis motor, 55: Z-axis encoder, 56: holder, 60: height measurement mechanism, 61: height measuring device, 62: arm, 70: grinding mechanism, 71: spindle housing, 72: Spindle, 73: Spindle motor, 74: Wheel mount, 75: Grinding wheel, 76: Wheel base, 77: Grinding stone, 80: second chuck table, 81: porous member, 82: holding surface, 83: frame body, 84: Frame surface, 85: Base portion, 86: Through hole, 87: Recessed portion, 90: third chuck table, 91: porous member, 92: holding surface, 93: frame body, 94: measurement surface, 95: base portion, 96: through hole, 97: recessed portion, 98: measurement portion, 99: suction groove, 100: fourth chuck table, 101: porous member, 102: holding surface, 103: frame body, 104: measuring surface, 105: base portion, 106: through hole, 107: recessed portion, 108: measurement portion, 110: first side, 111: second side, 120: scanning line, 200: Plate-shaped workpiece, 201: Surface, 202: Backside, 220: Plate-shaped workpiece, 250: Plate-shaped workpiece, 300: Plate-shaped workpiece, 921: Side, R1: 1st area, R2: 2nd area, R3: 3rd area, R4: 4th area

Claims

1. A processing device that processes a workpiece while measuring the height of the upper surface of the workpiece held on a holding surface of a chuck table, the chuck table holding the workpiece by the holding surface; a processing mechanism that processes the workpiece held on the holding surface; a height measuring device for measuring the height of the upper surface of the workpiece held on the holding surface or the height of the holding surface from above the holding surface; a horizontal movement mechanism that moves the chuck table in a direction parallel to the holding surface; a horizontal position recognition unit that recognizes the position of the chuck table moved by the horizontal movement mechanism; a first recognition unit that measures the height of an upper surface of the chuck table moved by the horizontal movement mechanism with the height measuring device and recognizes the chuck table; a first determination unit that determines whether the chuck table recognized by the first recognition unit matches a preset chuck table.

2. The support surface is rectangular, a second determination unit that measures the height of an upper surface of the chuck table moved by the horizontal movement mechanism with the height measuring device and determines whether one side of the holding surface is perpendicular to the direction of movement of the chuck table by the horizontal movement mechanism; The processing device according to claim 1 .

3. the chuck table has a plurality of holding surfaces arranged in a linear direction passing through the center, a third determination unit that measures the height of an upper surface of the chuck table moved by the horizontal movement mechanism with the height measuring device and determines whether the plurality of holding surfaces are aligned parallel to the direction of movement of the chuck table by the horizontal movement mechanism; The processing device according to claim 1 .

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