Enclosure System Shelf

Abstract

A set of one or more shelves is configured to be disposed within an enclosure system of a substrate processing system, the set of one or more shelves including a first upper surface disposed substantially in a first plane, carrier alignment features configured to align a carrier on the first upper surface, a second upper surface disposed substantially in a second plane above the first plane, and a process kit ring alignment feature configured to align a process kit ring on the carrier above the second upper surface.

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure relate to shelves, such as shelves used in connection with wafer processing systems, and more particularly to enclosure system shelves configured to support process kit rings and / or carriers for process kit rings.

[0002] Semiconductor processing and other electronic processing often employ platforms that use robotic arms to transport objects (e.g., wafers) between processing chambers, from storage areas (e.g., Front Opening Unified Pods (FOUPs)) to processing chambers, from processing chambers to storage spaces, etc. A processing system (e.g., a wafer processing system, etc.) has one or more processing chambers for processing wafers. Gases are used to etch the wafers in the processing chambers (e.g., wafers are etched while electrostatically clamped in place in an etching chamber). The robotic arm picks up objects from specific locations and transports the objects to specific other locations. Overview

[0003] The following is a simplified summary of the disclosure to provide a basic understanding of some aspects of the disclosure. This summary is not an extensive overview of the disclosure and is not intended to identify key or critical elements of the disclosure, nor to delineate the scope of particular implementations or claims of the disclosure. Its sole purpose is to present some concepts of the disclosure in a simplified form as a prelude to the more detailed description that is presented later.

[0004] In one aspect of the present disclosure, a set of one or more shelves is configured to be disposed within an enclosure system of a substrate processing system, the set of one or more shelves including a first upper surface disposed substantially in a first plane, carrier alignment features configured to align a carrier on the first upper surface, a second upper surface disposed substantially in a second plane above the first plane, and a process kit ring alignment feature configured to align a process kit ring with the carrier above the second upper surface.

[0005] In another aspect of the present disclosure, an enclosure system is for a substrate processing system, the enclosure system including a plurality of surfaces at least partially enclosing an interior volume of the enclosure system and a set of one or more shelves at least partially disposed within the interior volume of the enclosure system, the set of one or more shelves including a plurality of carrier alignment features configured to align carriers on the set of one or more shelves in a first plane and a plurality of process kit ring alignment features configured to align a process kit ring on the carrier in a second plane above the second plane.

[0006] In another aspect of the present disclosure, a method includes transporting a carrier supporting a process kit ring to a position above a set of one or more shelves disposed within an enclosure system of a substrate processing system, and aligning the carrier on the set of one or more shelves via a plurality of carrier alignment features of the set of one or more shelves in response to lowering the carrier supporting the process kit ring. [Brief explanation of the drawings]

[0007] The present disclosure is illustrated by way of example, and not limitation, in the figures of the accompanying drawings in which like references indicate like elements. It should be noted that different references to "a" or "one" embodiment in the present disclosure are not necessarily to the same embodiment, but that such references mean at least one. [Figure 1] 1 illustrates a processing system in accordance with certain embodiments. [Figure 2] 1 illustrates a front view of an enclosure system in accordance with certain embodiments. [Figure 3A] ~ [Figure 3J] 1 illustrates one or more shelves of an enclosure system in accordance with certain embodiments. [Figure 4A] ~ [Figure 4E] 1 shows a shelf with a holding device according to certain embodiments; [Figure 5] 1 illustrates a method of using one or more shelves of an enclosure system according to certain embodiments. [Figure 6A] ~ [Figure 6H] 1 illustrates a shelf of an enclosure system in accordance with certain embodiments. Detailed Description of the Embodiments

[0008] The embodiments described herein relate to an enclosure system shelf.

[0009] A wafer processing system includes a factory interface and a transfer chamber. An enclosure system (e.g., a FOUP) is attached to the factory interface, and a processing chamber is attached to the transfer chamber. A process kit ring is placed within the processing chamber to protect the processing chamber components. Over time, the process kit ring wears and needs to be replaced.

[0010] A robotic arm is used to transport contents within a wafer processing system. The robotic arm is used to transport wafers from an enclosure system to one or more processing chambers where they are to be processed and back to the enclosure system. The robotic arm is used to transport used process kit rings from processing chambers to the enclosure system and to transport new process kit rings from the enclosure system to processing chambers. In some cases, the robotic arm uses a carrier (such as an adapter) to transport the process kit ring. For example, the carrier is placed on the robotic arm and other contents are placed on the carrier.

[0011] The content is placed at a specific location by a robotic arm and picked up from a specific location by the robotic arm. In an embodiment, the enclosure system secures the content (e.g., carriers and / or process kit rings) at a specific location. In an embodiment, securing the content at a specific location improves the ability of the robotic arm to pick up the content from a source location and also improves the ability of the robotic arm to subsequently place the content at a specific target location.

[0012] Content placement errors occur. Such errors can occur due to robot errors, misalignment of chambers relative to one another, improper placement of content within a storage location (e.g., a container), and / or movement of content within a storage location. For example, one or more of a local center finding (LCF) device, alignment device, robot arm, etc., introduce errors into the placement of content (e.g., a carrier supporting a process kit ring) within an enclosure system. In some cases, misplaced content is not substantially horizontal within the enclosure system (e.g., resting on the edge of a support structure). In some cases, the enclosure system fails to secure the misplaced content during transfer, causing misplacement of the content, damage to the content, and / or damage to the enclosure system. In some cases, the robot arm fails to retrieve the misplaced content from the enclosure system. In some cases, misplaced content within the enclosure system is transferred (e.g., via the robot arm) in an incorrect orientation, causing damage to the content, damage to the wafer processing system, misalignment of the content, and / or incorrect processing of the content.

[0013] The devices, systems, and methods disclosed herein provide one or more shelves configured to be disposed within an enclosure system (e.g., a FOUP) of a processing system (e.g., a wafer processing system, a substrate processing system, a semiconductor processing system). In some embodiments, a single shelf is configured to support contents (e.g., a carrier, a process kit ring disposed on the carrier, a placement verification wafer, etc.). The shelf includes a first portion and a second portion. The first portion includes a first upper surface within a first plane, a second upper surface within a second plane above the first plane, a first carrier alignment feature, and a first process kit ring alignment feature. The second portion includes a third upper surface within the first plane, a fourth upper surface within the second plane, a second carrier alignment feature, and a second process kit ring alignment feature. The first and second carrier alignment features are configured to align (e.g., contact, or dispose above) the carrier to the first and third upper surfaces. The first and second process kit ring alignment features are configured to align (eg, contact, position above) the process kit ring with the second and fourth top surfaces.

[0014] In some embodiments, the first and second portions include mounting features (eg, openings for receiving fasteners, fasteners, etc.) configured to mount the shelf to an enclosure system.

[0015] In some embodiments, the shelf further includes a third portion disposed between the first portion and the second portion, the third portion including a third process kit ring alignment feature configured to align the process kit ring to the shelf above the carrier. In some embodiments, the first, second, and third portions of the shelf form a "U" shape, with the first portion being a first side, the second portion being a second side, and the third portion being a back portion disposed between the first and second sides. In some embodiments, the first, second, and third portions of the shelf are integral with one another. In some embodiments, the first, second, and third portions of the shelf are attached to one another.

[0016] One or more of the carrier and / or process kit ring alignment features include corresponding sidewalls. In some embodiments, the sidewalls include a lower portion that is angled at about 100° to 110° from the first plane and an upper portion that is angled at about 130° to 140° from the first plane.

[0017] In some embodiments, the first and second carrier alignment features include a first sidewall configured to prevent x-direction and yaw movement of the carrier. In some embodiments, the first and second carrier alignment features include a second sidewall configured to prevent y-direction movement of the carrier. In some embodiments, the first and third top surfaces are configured to prevent z-direction, pitch, and roll movement of the carrier.

[0018] In some embodiments, the process kit ring alignment feature includes a sidewall configured to prevent yaw motion of the process kit ring. In some embodiments, the sidewall is angled from the first plane by about 100° to 110°. In some embodiments, the carrier is configured to prevent x-, y-, z-, pitch, and roll motion of the process kit ring.

[0019] In some embodiments, the shelf further includes one or more carrier holding devices configured to secure the carrier to the shelf and one or more process kit ring holding devices configured to secure the process kit ring to the shelf.

[0020] In some embodiments, a carrier supporting a process kit ring is transported (e.g., via a robotic arm) to a position above a shelf disposed within an enclosure system (e.g., a FOUP). In response to lowering (e.g., via a robotic arm) of the carrier supporting the process kit ring, the process kit ring is aligned on the shelf via the shelf's process kit ring alignment features, and the carrier is aligned on the shelf via the shelf's carrier alignment features. In some embodiments, in response to lowering of the carrier supporting the process kit ring, the process kit ring is secured to the shelf via one or more first retention devices, and the carrier is secured to the shelf via one or more second retention devices.

[0021] In some embodiments, instead of a single shelf having a first portion supporting a first distal end of the content (e.g., a carrier, etc.) and a second portion supporting a second distal end of the content (e.g., a carrier, etc.), a first shelf is used to support the first distal end of the content and a second shelf (e.g., coplanar with the first shelf) is used to support the second distal end of the content.

[0022] The devices, systems, and methods disclosed herein have advantages over conventional solutions. The shelf aligns misplaced contents in the enclosure system. In some embodiments, the shelf aligns both the carrier and the process kit ring within the enclosure system. Aligning the contents (e.g., the carrier and / or the process kit ring) with the shelf prevents damage to the contents, prevents damage to the enclosure system, prevents the contents from being transported in the wrong orientation, prevents damage to the wafer processing system, prevents the contents from being misprocessed. The shelf retains the contents placed on the shelf, prevents damage to the contents and the enclosure system, prevents misalignment of the contents on the shelf, etc.

[0023] Although portions of this specification refer to process kit rings and carriers, this specification may be applicable to different types of content. Although portions of this description refer to substrate processing systems, this description may be applicable to other types of systems.

[0024] Although some portions of this specification refer to a shelf including different portions supporting different portions of contents (e.g., process kit rings, carriers, etc.), in some embodiments, the different portions of the shelf may be separate components connected to one another. In some examples, a first portion of the shelf configured to support a first distal end of a carrier and a second portion of the shelf configured to support a second distal end of the carrier are two separate components (e.g., two separate components of a set of coplanar shelves).

[0025] While portions of this specification refer to sidewalls of a particular range of slope, in some embodiments, curved sidewalls may be used (e.g., having an average change in rise over run that approximates a slope from a particular range of slope) and / or multiple slopes may be used on the same sidewall (e.g., the entire sidewall has an average change in rise over run that approximates a slope from a particular range of slope).

[0026] FIG. 1 illustrates a processing system 100 (e.g., a wafer processing system, a substrate processing system, a semiconductor processing system) in accordance with certain embodiments. The processing system 100 includes a factory interface 101 and load ports 128 (e.g., load ports 128A-D). In some embodiments, the load ports 128A-D are directly attached (e.g., sealed) to the factory interface 101. An enclosure system 130 (e.g., a cassette, FOUP, process kit enclosure system, etc.) is configured to removably couple (e.g., dock) to the load ports 128A-D. Referring to FIG. 1, enclosure system 130A is coupled to load port 128A, enclosure system 130B is coupled to load port 128B, enclosure system 130C is coupled to load port 128C, and enclosure system 130D is coupled to load port 128D. In some embodiments, one or more enclosure systems 130 are coupled to the load ports 128 to transport wafers and / or other substrates to and from the processing system 100. Each of the enclosure systems 130 seals to its respective load port 128. In some embodiments, a first enclosure system 130A is docked to the load port 128A (e.g., to replace a used process kit ring). Once such one or more operations are performed, the first enclosure system 130A is removed from the load port 128A, and then a second enclosure system 130 (e.g., a FOUP containing wafers) is docked to the same load port 128A. In some embodiments, the enclosure system 130 (e.g., enclosure system 130A) is an enclosure system with a shelf for aligning carriers and / or process kit rings.

[0027] In some embodiments, the load port 128 includes a front interface that forms a vertical opening (or a substantially vertical opening). Additionally, the load port 128 includes a horizontal surface for supporting an enclosure system 130 (e.g., a cassette, a process kit enclosure system). Each enclosure system 130 (e.g., a wafer FOUP, a process kit enclosure system) has a front interface that forms a vertical opening. The front interface of the enclosure system 130 is sized to interface (e.g., seal) with the front interface of the load port 128 (e.g., the vertical opening of the enclosure system 130 is approximately the same size as the vertical opening of the load port 128). The enclosure system 130 is positioned on the horizontal surface of the load port 128, and the vertical opening of the enclosure system 130 is aligned with the vertical opening of the load port 128. The front interface of the enclosure system 130 interconnects (e.g., clamps, secures, seals) with the front interface of the load port 128. The bottom (e.g., base plate) of the enclosure system 130 has features (e.g., load features, such as recesses or receptacles that engage load port kinematic (dynamic) pin features, load port features for pin clearance, and / or enclosure system docking tray latch clamp features) that engage the horizontal surface of the load port 128. The same load port 128 can be used for different types of enclosure systems (e.g., process kit enclosure systems, cassettes containing wafers, etc.).

[0028] In some embodiments, enclosure system 130 includes one or more or one or more sets of one or more shelves for aligning carriers and / or process kit rings. In some embodiments, enclosure system 130 includes one set of one or more shelves for aligning carriers and / or contents disposed on the carriers (e.g., process kit rings, processing chamber components, etc.). In some embodiments, enclosure system 130 includes three sets of one or more shelves for aligning carriers and / or process kit rings. In some embodiments, enclosure system 130 includes six sets of one or more shelves for aligning carriers and / or process kit rings. In some embodiments, enclosure system 130 includes eight sets of one or more shelves for aligning carriers and / or process kit rings.

[0029] In some embodiments, enclosure system 130 (e.g., process kit enclosure system) contains one or more items of content 110 (e.g., one or more of process kit rings, empty process kit ring carriers, process kit rings positioned on process kit ring carriers, placement verification wafers, etc.). In some examples, enclosure system 130 is coupled to factory interface 101 (e.g., via load port 128) to enable automated transfer of process kit rings on process kit ring carriers to process system 100 for replacement of used process kits.

[0030] In some embodiments, the processing system 100 also includes first vacuum ports 103a, 103b coupling the factory interface 101 to each of the degassing chambers 104a, 104b. Second vacuum ports 105a, 105b are coupled to each of the degassing chambers 104a, 104b and are disposed between the degassing chambers 104a, 104b and the transfer chamber 106 to facilitate transfer of wafers and contents 110 (e.g., process kit rings) to the transfer chamber 106. In some embodiments, the processing system 100 includes and / or uses one or more degassing chambers 104 and a corresponding number of vacuum ports 103, 105 (e.g., the processing system 100 includes a single degassing chamber 104, a single first vacuum port 103, and a single second vacuum port 105). The transfer chamber 106 includes multiple processing chambers 107 (e.g., four processing chambers 107, six processing chambers 107, etc.) disposed around and coupled thereto. The processing chambers 107 are coupled to the transfer chamber 106 via respective ports 108 (e.g., slit valves, etc.). In some embodiments, the factory interface 101 is at high pressure (e.g., atmospheric pressure) and the transfer chamber 106 is at low pressure (e.g., vacuum). Each degassing chamber 104 (e.g., load lock, pressure chamber) has a first door (e.g., first vacuum port 103) to seal the degassing chamber 104 from the factory interface 101 and a second door (e.g., second vacuum port 105) to seal the degassing chamber 104 from the transfer chamber 106. Contents are transferred from the factory interface 101 to the degassing chamber 104 while the first door is open and the second door is closed; while the first door is closed, the pressure of the degassing chamber is reduced to match that of the transfer chamber 106; and while the second door is open, contents are transferred from the degassing chamber 104. A local center finding (LCF) device is used to align the contents within the transfer chamber 106 (eg, before entering the processing chamber 107, after exiting the processing chamber 107).

[0031] In some embodiments, the processing chamber 107 includes one or more of an etch chamber, a deposition chamber (including atomic layer deposition, chemical vapor deposition, physical vapor deposition, or plasma-enhanced versions thereof), an anneal chamber, or the like.

[0032] The factory interface 101 includes a factory interface robot 111. The factory interface robot 111 includes a robot arm, such as a Selective Compliance Assembly Robot Arm (SCARA) robot. Examples of SCARA robots include a two-link SCARA robot, a three-link SCARA robot, a four-link SCARA robot, etc. The factory interface robot 111 includes an end effector at the end of the robot arm. The end effector is configured to lift and handle specific objects (e.g., wafers, etc.). Alternatively or additionally, the end effector is configured to handle objects such as carriers and / or process kit rings (edge ​​rings). The robot arm has one or more links or members (e.g., wrist members, upper arm members, forearm members, etc.) configured to move to move the end effector to different positions in different orientations.

[0033] The factory interface robot 111 is configured to transport objects between the enclosure system 130 (e.g., cassettes, FOUPs) and the degassing chambers 104a, 104b (or load ports). While conventional systems involve misaligning the contents or opening (e.g., disassembling, breaking seals, contaminating) the processing system 100 (e.g., factory interface 101) to align the misaligned contents, the processing system 100 is configured to facilitate alignment of the contents (e.g., via one or more sets of shelves in the enclosure system 130) without an operator having to open (e.g., disassembling, breaking seals, contaminating) the processing system 100. Thus, in embodiments, a sealed environment including the interior volumes of the enclosure system 130 and the factory interface 101 is maintained during alignment of the contents (e.g., via one or more sets of shelves in the enclosure system 130).

[0034] The transfer chamber 106 includes a transfer chamber robot 112. The transfer chamber robot 112 includes a robot arm with an end effector at the end of the robot arm. The end effector is configured to handle a particular object (e.g., a wafer, etc.). In some embodiments, the transfer chamber robot 112 is a SCARA robot, but in some embodiments, has fewer links and / or fewer degrees of freedom than the factory interface robot 111.

[0035] Controller 109 controls various aspects of processing system 100. Controller 109 is and / or includes a computing device (e.g., a personal computer, a server computer, a programmable logic controller (PLC), a microcontroller, etc.). Controller 109 includes one or more processing devices, which in some embodiments are general-purpose processing devices (e.g., a microprocessor, a central processing unit, etc.). More specifically, in some embodiments, the processing device is a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor that executes other instruction sets or combinations of instruction sets. In some embodiments, the processing device is one or more special-purpose processing devices (e.g., an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc.). In some embodiments, controller 109 includes data storage (e.g., one or more disk drives and / or solid-state drives), main memory, static memory, a network interface, and / or other components. In some embodiments, the controller 109 executes instructions to perform any one or more of the methods or processes described herein. The instructions are stored on a computer-readable storage medium, which may include one or more of a main memory, a static memory, a secondary storage device, and / or a processing unit (during execution of the instructions). In some embodiments, the controller 109 receives signals from and sends controls to the factory interface robot 111 and the wafer transfer chamber robot 112.

[0036] FIG. 1 schematically illustrates the transfer of contents 110 (e.g., a process kit ring coupled to a process kit ring carrier) to a processing chamber 107. According to one aspect of the present disclosure, the contents 110 are removed from the enclosure system 130 via a factory interface robot 111 in a factory interface 101. The factory interface robot 111 transfers the contents 110 into each of the evacuation chambers 104a and 104b via one of the first vacuum ports 103a and 103b. A transfer chamber robot 112 disposed in a transfer chamber 106 removes the contents 110 from one of the evacuation chambers 104a and 104b via a second vacuum port 105a or 105b. The transfer chamber robot 112 moves the contents 110 into the transfer chamber 106, where the contents 110 are transferred to a processing chamber 107 via a respective port 108. Although not shown in FIG. 1, the transfer of contents 110 may include the transfer of process kit rings arranged on process kit ring carriers, the transfer of empty process kit ring carriers, the transfer of placement verification wafers, and the like.

[0037] While FIG. 1 illustrates one example of the transfer of contents 110, other examples are contemplated. In some examples, it is contemplated that the enclosure system 130 is coupled to the transfer chamber 106 (e.g., via a load port attached to the transfer chamber 106). The contents 110 are loaded from the transfer chamber 106 into the processing chamber 107 by the transfer chamber robot 112. Furthermore, in some embodiments, the contents 110 are loaded onto a substrate support pedestal (SSP). In some embodiments, an additional SSP is positioned in communication with the factory interface 101 opposite the illustrated SSP. Processed contents 110 (e.g., used process kit rings) are removed from the processing system 100 in a manner reverse to that described herein. In some embodiments, when multiple enclosure systems 130 or a combination of enclosure systems 130 and SSPs are utilized, one SSP or enclosure system 130 is used for unprocessed contents 110 (e.g., new process kit rings) and another SSP or enclosure system 130 is used to receive processed contents 110 (e.g., used process kit rings). Prior to transferring the contents 110 via the robotic arm and / or prior to transferring the enclosure system 130, the enclosure system 130 is used to align the contents 110 (e.g., via one or more sets of shelves within the enclosure system 130). Aligning the content 110 with one or more sets of shelves allows the robotic arm to correctly remove the content 110 from a particular location in the enclosure system 130, allows the content 110 to be properly secured within the enclosure system 130 (e.g., allows the content 110 to be secured using one or more sets of shelves), and allows the enclosure system 130 to properly transport the content 110.

[0038] The processing system 100 includes a factory interface 101 (e.g., an Equipment Front End Module (EFEM)) and chambers adjacent to the factory interface 101 (e.g., a load port 128, an enclosure system 130, an SSP, an evacuation chamber 104 of a load lock, etc.). One or more chambers are sealed (e.g., each chamber is sealed). Adjacent chambers are sealed to the factory interface 101. In some embodiments, an inert gas (e.g., one or more of nitrogen, argon, neon, helium, krypton, or xenon) is provided to one or more chambers (e.g., the factory interface 101 and / or adjacent chambers) to provide one or more inert environments. In some examples, the factory interface 101 is an inert EFEM that maintains an inert environment (e.g., an inert EFEM mini-environment) within the factory interface 101, thereby eliminating the need for a user to enter the factory interface 101 (e.g., the processing system 100 is configured such that there is no manual access within the factory interface 101).

[0039] In some embodiments, a gas flow (e.g., inert gas, nitrogen) is provided to one or more chambers (e.g., factory interface 101) of processing system 100. In some embodiments, the gas flow is greater than a leak in one or more chambers, maintaining a positive pressure in the one or more chambers. In some embodiments, the inert gas in factory interface 101 is recirculated. In some embodiments, a portion of the inert gas is exhausted. In some embodiments, the gas flow of non-recirculated gas into factory interface 101 is greater than the exhaust gas flow and the gas leak, maintaining a positive pressure of inert gas in factory interface 101.

[0040] In some embodiments, the factory interface 101 is coupled to one or more valves and / or pumps to provide gas flow to and from the factory interface 101. A processing unit (e.g., controller 09) controls the gas flow to and from the factory interface. In some embodiments, the processing unit receives sensor data from one or more sensors (e.g., oxygen sensors, moisture sensors, motion sensors, door operation sensors, temperature sensors, pressure sensors, etc.) and determines a flow rate for the inert gas flow to and / or from the factory interface 101 based on the sensor data.

[0041] The enclosure system 130 allows for alignment of the contents 110 (e.g., carriers, process kit rings, etc.) without opening the sealed environment in the factory interface 101 and adjacent chambers. The enclosure system 130 seals the load port 128 in response to docking to the load port 128. The enclosure system 130 provides access to a purge port, which allows the interior of the enclosure system 130 to be purged before opening the enclosure system 130, minimizing disturbance of the inert environment within the factory interface 101.

[0042] FIG. 2 illustrates a front perspective view of an enclosure system 200 (e.g., enclosure system 130 of FIG. 1 ) according to certain embodiments. The enclosure system 200 includes one or more shelves 230 configured to align contents (e.g., carriers and / or process kit rings, etc.). As shown in FIG. 2 , in some embodiments, the shelf 230 can have a left portion supporting a first distal end of the contents, a right portion supporting a second distal end of the contents, and a middle portion connecting the left and right portions. In some embodiments, the shelf 230 can be two or more separate components (e.g., separate from each other, not connected to each other, not integrated with each other, etc.), such as a left shelf and a right shelf that are not connected to each other.

[0043] Enclosure system 200 includes surfaces (e.g., walls, sidewalls, substantially planar structures, etc.) that at least partially enclose (e.g., form a cavity or chamber) interior volume 202. In some embodiments, interior volume 202 is a mini-environment (e.g., a sealed environment). In some embodiments, interior volume 202 is kept substantially particle-free (e.g., substantially uncontaminated). In some embodiments, enclosure system 200 includes a fan (e.g., on a top surface) that suppresses particles within interior volume 202. In some embodiments, the interior volume is substantially free (or completely free) of one or more of moisture, oxygen, particles (e.g., dust), etc.

[0044] The surfaces include sidewall surfaces 210A-B (e.g., sidewalls), a bottom surface 212 (e.g., bottom wall), a top surface 214 (e.g., top wall), and a rear surface 216 (e.g., rear wall). In some embodiments, the surfaces form clampable tabs. One or more of the surfaces (e.g., sidewall surfaces 210A-B, bottom surface 212, top surface 214, etc.) form a front interface. The front interface is configured to interface (e.g., seal) with a door for transport (e.g., to provide a sealed environment) of the enclosure system 200. The front interface is configured to interface (e.g., seal) with a substantially vertical portion of a load port of a wafer processing system. In response to the front interface being sealed to the door or load port, the enclosure system 200 forms a sealed environment (e.g., gases and / or particles do not enter or exit the enclosure system 200 from the ambient environment outside the wafer processing system).

[0045] In some embodiments, the enclosure system 200 includes a base plate 220 (e.g., an adapter plate) coupled to the bottom surface 212. The base plate 220 is configured to interface with a horizontal portion of a load port. The base plate 220 has features (e.g., recesses, receptacles, kinematic interfaces) that receive kinematic devices (e.g., kinematic pins, precision positioning pins) of the horizontal portion of the load port. In some embodiments, the base plate 220 is secured to the bottom surface 212 before the enclosure system 200 interfaces with the load port. In some embodiments, the base plate 220 is secured to the load port, and then the bottom surface 212 is secured to the base plate 220. In some embodiments, the enclosure system 200 includes a seal (e.g., a crushable seal, a gasket) that seals one or more of the openings in the bottom surface 212.

[0046] In some embodiments, one or more of the overhead transfer flange 222 or at least one handle 224 are coupled to one or more surfaces of the enclosure system 200 for transport (e.g., automated transport, manual transport, etc.) of the enclosure system 200. In some embodiments, an overhead transfer (OHT) flange 222 is coupled to the top surface 214. In some embodiments, a first handle 224A is disposed on the first sidewall surface 210A and a second handle 224B is disposed on the first sidewall surface 210B.

[0047] In some embodiments, one or more purge adapters are disposed on the bottom surface 212 (e.g., inserted into openings formed in the bottom surface 212). The purge adapters are used to one or more of fill the enclosure system 200 with a gas (e.g., nitrogen (N)), remove a gas from the enclosure system, pass a gas through the enclosure system 200, etc. The purge adapters extend through the base plate 220 and are fluidly coupled to one or more gas or vacuum lines (e.g., to purge the enclosure system 200, create a vacuum within the enclosure system 200, fill the enclosure system 200 with a gas, etc.). Each of the purge adapters provides a seal to a corresponding opening in the bottom surface 212 (e.g., to provide a sealed environment). In some embodiments, the enclosure system 200 seals the load port in response to being docked to the load port. The interior volume of the enclosure system 200 is configured to be purged via the one or more purge adapters before opening the enclosure system 200.

[0048] In some embodiments, one or more shelves 230 are at least partially disposed within interior volume 202. In some embodiments, one or more shelves 230 are completely disposed within interior volume 202. In some embodiments, one or more shelves 230 are attached to sidewall surfaces 210A-B. In some embodiments, one or more shelves 230 are attached to one or more support structures (e.g., posts, etc.) attached to enclosure system 200 (e.g., sidewall surfaces 210A-B, bottom surface 212, base plate 220, etc.).

[0049] The set of one or more shelves 230 is configured to receive contents (e.g., carriers 232 and / or process kit rings 234, etc.). In some embodiments, the carriers 232 are positioned on the set of one or more shelves 230, and the process kit rings are positioned above (e.g., touching, non-touching) the carriers on the shelves. In some embodiments, the carriers 232 are positioned on the set of one or more shelves 230, and the process kit rings are positioned on the carriers above (e.g., not touching) the set of one or more shelves.

[0050] The set of one or more shelves 230 has alignment features and / or surfaces configured to align content on the set of one or more shelves 230. If the robotic arm aligns content in an incorrect position on the set of one or more shelves 230, the alignment features and / or surfaces align the content in the correct position. In some embodiments, the set of one or more shelves 230 has one or more holding devices configured to secure content to at least one shelf 230 of the set of one or more shelves 230.

[0051] 3A-J illustrate a shelf 300 (e.g., a set of one or more shelves or a single shelf) of an enclosure system (e.g., a FOUP of a wafer processing system) according to certain embodiments. In some embodiments, shelf 300 corresponds to shelf 230 of FIG. 2. FIG. 3A illustrates a perspective view of shelf 300 according to certain embodiments. FIG. 3B illustrates a front view of shelf 300 according to certain embodiments. FIG. 3C illustrates a rear view of shelf 300 according to certain embodiments. FIG. 3D illustrates a left side view of shelf 300 according to certain embodiments. FIG. 3E illustrates a right side view of shelf 300 according to certain embodiments. FIG. 3F illustrates a top view of shelf 300 according to certain embodiments. FIG. 3G illustrates a bottom view of shelf 300 according to certain embodiments. FIG. 3H illustrates a top view of shelf 300 supporting carrier 330 and process kit ring 340 according to certain embodiments. 3I-J show cross-sectional side views of a shelf 300 supporting a carrier 330 and a process kit ring 340, according to certain embodiments.

[0052] Shelf 300 includes first portion 310A and second portion 310B. In some embodiments, first portion 310A and second portion 310B are mirror images of each other. In some embodiments, first portion 310A and second portion 310B are joined by third portion 310C. In some embodiments, first, second, and third portions 310A-C of carrier form a "U" shape, with first portion 310A being a first side, second portion 310B being a second side, and third portion 310C being a back side disposed between the first and second sides. In some embodiments, first, second, and third portions 310A-C of shelf 300 are integral with each other. In some embodiments, two or more of first, second, and third portions 310A-C of shelf 300 are attached to each other (e.g., via one or more fasteners, adhesive, soldering, welding, etc.). In some embodiments, two or more of the first, second, and third portions 310A-C of shelf 300 are separate from one another (e.g., unattached, unconnected, etc.). In some embodiments, first portion 310A is the first shelf and second portion 310B is the second shelf, and the first and second shelves are coplanar and unconnected to one another (e.g., third portion 310C is absent).

[0053] The first portion 310A and the second portion 310B include a first top surface 312A in a first plane, a second top surface 312B in a second plane above the first plane, a first carrier alignment feature 314A, and a process kit ring alignment feature 316A. Further, in some embodiments, the first portion 310A and the second portion 310B include a second carrier alignment feature 314B. Further, in some embodiments, the first portion 310A and the second portion include mounting features 318 (e.g., openings for receiving fasteners, etc.) configured to mount the shelf 300 to an enclosure system.

[0054] Additionally, in some embodiments, the shelf includes a third portion disposed between the first portion 310A and the second portion 310B. The third portion 310C includes a process kit ring alignment feature 316B.

[0055] The carrier alignment feature 314 is configured to align (e.g., contact, place on) the carrier on the first top surface 312A. The process kit ring alignment feature 316 is configured to align the process kit ring on the carrier, and the process kit ring is placed on the second top surface 312B. In some embodiments, the carrier is supported by the first portion 310A and the second portion 310B, and the process kit ring is placed on the carrier without contacting the first portion 310A and the second portion 310B (e.g., without contacting one or more shelves 300). In some embodiments, the process kit ring contacts the first portion 310A and / or the second portion 310B in response to movement (e.g., jostling, shaking, impact, rapid movement, etc.), and the process kit alignment feature 316 realigns the process kit ring on the carrier.

[0056] One or more of the carrier alignment feature 314 and / or process kit ring alignment feature 316 include corresponding sidewalls. In some embodiments, the sidewalls of the carrier alignment feature 314 and / or process kit ring alignment feature 316 are angled at about 100° to 110° from the first plane. In some embodiments, the sidewalls of the carrier alignment feature 314 and / or process kit ring alignment feature 316 include a lower portion that is angled at about 100° to 110° from the first plane and an upper portion that is angled at about 130° to 140° from the first plane.

[0057] In some embodiments, carrier alignment feature 314A includes a first sidewall configured to prevent x-direction and yaw movement of the carrier. In some embodiments, carrier alignment feature 314B initially includes a second sidewall configured to prevent y-direction movement of the carrier. In some embodiments, first top surface 312A is configured to prevent z-direction, pitch, and roll movement of the carrier.

[0058] In some embodiments, the process kit ring alignment feature 316A includes a sidewall configured to prevent yaw motion of the process kit ring. In some embodiments, the sidewall is angled at about 100°-110° from the first plane. In some embodiments, the carrier is configured to prevent x-, y-, z-, pitch, and roll motion of the process kit ring (e.g., without the process kit ring contacting the first portion 310A or the second portion 310B).

[0059] 3H, the shelf 300 is configured to support a carrier 330 and / or a process kit ring 340. The carrier 330 includes a rigid body 332 defining openings, fasteners 336 configured to be removably attached to the rigid body 332 through the openings, and fingers 334 configured to be removably attached to the rigid body through the fasteners 336 and the openings. The fingers 334 are configured to support the contents (e.g., the process kit ring 340) during transport of the carrier 330 within the substrate processing system. In some embodiments, when the process kit ring 340 is positioned on the carrier 330, the process kit ring 340 contacts the carrier 330. In some embodiments, when the process kit ring 340 is positioned on the carrier 330 and the carrier is positioned on the shelf 300, the process kit ring 340 is positioned above the shelf 300 without contacting the shelf 300.

[0060] 3I , shelf 300 (e.g., a set of one or more shelves or a single shelf) is configured to support carrier 330 and / or process kit ring 340. Process kit ring alignment feature 316B is configured to align process kit ring 340 on carrier 330 (e.g., above the shelf or set of shelves). Fingers 334 are attached to rigid body 332 of carrier 330 via fasteners 336. In some embodiments, fingers 334 support process kit ring 340 while carrier 330 (e.g., supporting process kit ring 340) is positioned on shelf 300.

[0061] 3J, shelf 300 is configured to align carrier 330 and / or process kit ring 340 on shelf 300. The shelf includes carrier alignment feature 314 and process kit ring alignment feature 316. Carrier alignment feature 314 includes one or more sidewalls, and process kit ring alignment feature 316 includes one or more sidewalls.

[0062] In some embodiments, the sidewall of the shelf 300 (e.g., of the carrier alignment feature 314A) has one or more facets or is curved. In some embodiments, the sidewall of the shelf 300 (e.g., of the carrier alignment feature 314A) is angled at about 100°-150°, about 120°-150°, or about 130°-140° from the first top surface 312A. In some embodiments, the sidewall (e.g., of the carrier alignment feature 314A) includes a lower portion that is angled at about 100°-110° from the first top surface 312A (e.g., about 15° from perpendicular) and an upper portion that is angled at about 130°-140° from the first top surface 312A (e.g., about 45° from perpendicular, about 30° more than the lower portion).

[0063] In some embodiments, the sidewall (e.g., of the process kit ring alignment feature 316A) is at an angle of about 90° to 150°, 100° to 150°, or 100° to 110° (e.g., about 15° from perpendicular) from the second top surface 312B.

[0064] In some embodiments, the sidewalls of the carrier alignment feature 314 and / or the process kit ring alignment feature 316 provide capture ramps to allow misaligned process kit rings and / or carriers returning from a substrate processing system (e.g., from a tool) to be aligned and lowered onto the shelf 300 and captured. Proper alignment of the process kit ring to the carrier is used to properly orient and position the process kit ring within a processing chamber. Traditionally, systems have experienced improper alignment of the process kit relative to the carrier, resulting in misplacement or dislodgement of the carrier and process kit ring within the tool. In some instances, a process kit ring removed from a processing chamber may return to the enclosure system misaligned (e.g., due to errors in a robot arm, LCF device, aligner device, etc.). The shelf 300 aligns process kit rings and carriers returning from a substrate processing system misaligned. In some embodiments, the shelf 300 captures process kit rings and / or carriers for transport (eg, in an OHT via tool automation).

[0065] In some embodiments, all alignment features (e.g., carrier alignment feature 314 and / or process kit ring alignment feature 316) are fabricated from a single piece of material and are misaligned using a capture ramp (e.g., the sidewall of the alignment feature) to align the returning contents. In some embodiments, self-actuating hooks (e.g., holding devices) are used to secure the contents and are locked by tool automation. In some embodiments, shelf 300 provides separation of the process kit ring from the carrier, allowing realignment of both by automation.

[0066] In some embodiments, shelf 300 is fabricated from the plastic polyethylene terephthalate (PET). In some embodiments, shelf 300 is a single comb spanning one station (e.g., a single shelf supporting process kit rings and carriers from the left side of the enclosure system and the right side of the enclosure system) rather than separate combs for each side. Using a single shelf 300 to support process kit rings and carriers on two sides reduces stacking tolerances.

[0067] In some embodiments, the material from which shelf 300 is formed is fixed (e.g., fixed with four screw holes) and machined while fixed. In some embodiments, windows (e.g., openings) are cut into shelf 300 to reduce weight (see, e.g., carrier 430 in FIG. 4B).

[0068] In some embodiments, process kit ring alignment feature 316B is used to align the process kit ring, second top surface 312B is used to center the process kit ring, and a process kit ring holding device (see, e.g., FIGS. 4A-E) is used to capture the process kit ring. In some embodiments, carrier alignment features 314A-B are used to align the carrier, and a carrier holding device (see, e.g., FIGS. 4A-E) is used to capture the carrier.

[0069] In some embodiments, six degrees of freedom of the carrier 330 and the process kit ring 340 are controlled by a robot arm. When transferring the carrier 330 and the process kit ring 340 to the shelf 300, the robot arm transfers six degrees of freedom of control to the shelf 300. In some instances, when six degrees of freedom are transferred, each degree of freedom is not transferred simultaneously, which traditionally causes misalignment of the carrier 330 and the process kit ring 340. Alignment features (e.g., carrier alignment feature 314 and process kit ring alignment feature 316) align a misaligned carrier 330 and process kit ring 340.

[0070] 4A-E show a shelf 400 having a holding device (e.g., shelf 230 of FIG. 2, shelf 300 of FIGS. 3A-J) according to certain embodiments. In some embodiments, features in FIGS. 4A-E have similar or identical functions as features with similar reference numbers in FIGS. 3A-J.

[0071] The shelf 400 includes a first portion 410A (e.g., first portion 310A in FIGS. 3A-J), a second portion 410B (e.g., second portion 310B in FIGS. 3A-J), and a third portion 410C (e.g., third portion 310B in FIGS. 3A-J). First portion 410A and / or second portion 410B include a first top surface 412A (e.g., first top surface 312A in FIGS. 3A-J), a second top surface 412B (e.g., second top surface 312B in FIGS. 3A-J), one or more carrier alignment features 414A (e.g., carrier alignment feature 314A in FIGS. 3A-J), one or more carrier alignment features 414B (e.g., carrier alignment feature 314B in FIGS. 3A-J), one or more process kit ring alignment features 416A (e.g., first process kit ring alignment feature 316A in FIGS. 3A-J), and process kit ring alignment feature 416B (e.g., process kit ring alignment feature 316B in FIGS. 3A-J). In some embodiments, shelf 400 is a set of one or more shelves. In some embodiments, the first portion 410A is a first shelf, the second portion 410B is a second shelf, and the first shelf and the second shelf are separate from each other (e.g., not connected to each other, not attached to each other, etc.).

[0072] In some embodiments, shelf 400 includes one or more carrier retaining devices 460 (e.g., self-actuating hooks for securing carrier 430) and / or process kit ring retaining devices 450 (e.g., self-actuating hooks for securing process kit ring 440). When carrier 430 (e.g., carrier 330 of FIGS. 3H-J) supporting process kit ring 440 (e.g., process kit ring 340 of FIGS. 3H-J) is lowered (e.g., via robot arm 470), process kit ring 440 engages (e.g., presses down on) a first end of process kit ring retaining device 450 and retains process kit ring 440 at a second end of process kit ring retaining device 450. In some examples, when the process kit ring 440 is lowered onto the first end of the process kit ring holding device 450, the process kit ring holding device is rotated so that the first end is pressed into the shelf 400 (e.g., substantially parallel to the second upper surface 412B) and the second end is rotated to a position above at least a portion of the process kit ring 440.

[0073] As carrier 430 is lowered onto first top surface 312A, carrier 430 engages (e.g., pushes down on) a first end of carrier holding device 460, causing a second end of carrier holding device 460 to hold carrier 430. In some examples, as carrier 430 is lowered onto the first end of carrier holding device 460, carrier holding device 460 rotates, causing the first end to be pushed into shelf 400 (e.g., substantially parallel with first top surface 412A) and the second end to be rotated to a position above at least a portion of carrier 430.

[0074] 4C, a robot arm 470 is positioned above the shelf 300. A carrier 430 supporting a process kit ring 440 is positioned on the robot arm 470.

[0075] Referring to FIG. 4D , the robot arm 470 lowers the carrier 430 supporting the process kit ring 440, which causes the process kit ring 440 to actuate a first distal end of the process kit ring retaining device 450 (e.g., a self-actuating hook), and a second distal end of the process kit ring retaining device 450 is positioned above the process kit ring 440 to retain the process kit ring 440 on the shelf 400.

[0076] Referring to FIG. 4E, the robotic arm 470 lowers the carrier 430, which activates a first distal end of the carrier holding device 460 (e.g., an automatically operated hook) to position a second distal end of the carrier holding device 460 above the carrier 430 and hold the carrier 430 on the shelf 400.

[0077] 4A-E, in some embodiments, shelf 400 further includes locking device 480. In some embodiments, locking device 480 locks carrier holding device 460 and / or process kit ring holding device 450 in a fixed position. In some embodiments, closing a door of the enclosure system (e.g., closing a door of a FOUP) activates locking device 480 to lock carrier holding device 460 and process kit ring holding device 450 in a fixed position (e.g., for transport of the enclosure system).

[0078] In some embodiments, the first portion 410A includes one or more of the carrier holding device 460, the process kit ring holding device 450, and / or the locking device 480. In some embodiments, the second portion 410B includes one or more of the carrier holding device 460, the process kit ring holding device 450, and / or the locking device 480. In some embodiments, both the first portion 410A and the second portion 410B include the carrier holding device 460, the process kit ring holding device 450, and / or the locking device 480.

[0079] FIG. 5 illustrates a method 500 for using one or more shelves of an enclosure system, according to certain embodiments. In some embodiments, one or more of the operations of method 500 are performed by a robotic arm (e.g., the robotic arm of factory interface 111 in FIG. 1 , robotic arm 470 in FIGS. 4B-E ) and / or a controller (e.g., controller 109 in FIG. 1 ). Although shown in a particular order or sequence, the order of processes can be changed unless otherwise specified. Therefore, the illustrated embodiment should be understood as an example only, and the illustrated processes can be performed in a different order, and some processes can be performed in parallel. Furthermore, in various embodiments, one or more processes can be omitted. Thus, not all processes are required in all embodiments.

[0080] Referring to method 500 of FIG. 5, at block 502, a carrier supporting a process kit ring is transported (eg, by a robotic arm) to a position above a set of one or more shelves disposed within an enclosure system.

[0081] At block 504, the carrier supporting the process kit ring is lowered (eg, by a robotic arm).

[0082] In some embodiments, in block 506, the process kit ring is aligned on the one or more sets of shelves and / or the carrier via the process kit ring alignment feature in response to lowering the carrier. In some embodiments, the process kit ring alignment feature includes a sloped sidewall that guides the process kit ring into an aligned orientation.

[0083] In some embodiments, in block 508, the process kit ring is secured to a set of one or more shelves via a process kit ring retention device in response to the lowering of the carrier. As the material (e.g., carrier and process kit ring) moves down, the weight of the process kit ring activates the process kit ring retention device (e.g., process kit (PK) catch).

[0084] At block 510, the carrier is aligned on a set of one or more shelves via the carrier alignment features in response to lowering of the carrier. In some embodiments, the carrier alignment features include sloped sidewalls that guide the carrier into the aligned orientation.

[0085] At block 512, the carrier is secured to a set of one or more shelves via a carrier retention device in response to the lowering of the carrier. Once the carrier is in place, the weight of the carrier activates the carrier retention device (e.g., carrier catch).

[0086] At block 514, the carrier holding device and / or the process kit ring holding device are locked (e.g., in response to closing an enclosure system door, which activates a locking device). In some embodiments, the FOUP door activates the locking device to lock both the PK capture and the carrier capture. In some embodiments, as the process kit ring and carrier are lowered, the process kit ring and carrier are separated by one or more sets of shelves. This allows for capture and alignment of both the carrier and the process kit ring from misalignment caused by automation during process kit ring removal. In some embodiments, as the process kit ring and carrier (e.g., the process kit ring disposed on the carrier) are lowered, the carrier contacts one or more sets of shelves, and the process kit ring does not contact one or more sets of shelves.

[0087] In some embodiments, each of the operations of method 500 is performed while maintaining a sealed environment (eg, without opening a factory interface, without opening an enclosure system).

[0088] 6A-H show diagrams of an enclosure system 600 according to certain embodiments. FIG. 6A shows a front perspective view of the enclosure system 600 according to certain embodiments. FIG. 6B shows a front cross-sectional view of the enclosure system 600 according to certain embodiments. FIG. 6C shows a side cross-sectional view of the enclosure system 600 according to certain embodiments. FIG. 6D shows a top cross-sectional view of the enclosure system 600 according to certain embodiments. FIGS. 6E-F show front cross-sectional views of a portion of the enclosure system 600 according to certain embodiments. FIGS. 6G-H show top cross-sectional views of a portion of the enclosure system 600 according to certain embodiments. In some embodiments, features having similar reference numbers to those in other figures include similar features and / or actions as those described in the other figures. In some examples, one or more of the enclosure systems 600 of FIGS. 6A-H have similar features and / or actions as the enclosure system 130 of FIG. 1 and / or the enclosure system 200 of FIG. 2.

[0089] 6A, enclosure system 600 includes side walls 610 (e.g., side walls 610A-B), one or more rear walls, and a bottom wall 620. Enclosure system 600 includes an enclosure lid 630 (e.g., a removable top wall, a non-removable top wall, etc.) that couples (e.g., top-mounted, perimeter-mounted) to one or more walls (e.g., one or more side walls 610 and / or one or more rear walls) to at least partially enclose an interior volume of enclosure system 600. In some embodiments, enclosure lid 630 is configured to removably attach to one or more walls.

[0090] In some embodiments, enclosure lid 630 is attached to overhead transport component 632. In some embodiments, the enclosure system has one or more windows (e.g., observation windows). In some embodiments, enclosure lid 630 includes a top window 634 (e.g., a top observation window). In some embodiments, at least one of the rear walls of the enclosure system includes a rear window 636 (e.g., a rear observation window).

[0091] Posts 640 are coupled to the bottom wall 620 (e.g., via base connectors 642). Shelves 644 are disposed within the interior volume of the enclosure system 600. Each of the shelves 644 can be configured to support a corresponding object (e.g., content 110 in FIG. 1 ). In some embodiments, each shelf 644 is connected to at least one post 640.

[0092] In some embodiments, a first set of posts 640 (e.g., a first pair of posts 640, two posts 640) are coupled (e.g., via the same base connector 642) to the bottom wall 620 adjacent to the side wall 610A, and a second set of posts 640 (e.g., a second pair of posts 640, two additional posts 640) are coupled (e.g., via different base connectors 642) to the bottom wall 620 adjacent to the side wall 610B. A set of shelves 644 (e.g., a pair of shelves 644, two shelves 644, a first shelf 644 and a second shelf 644, coplanar shelves 644) can be used to support an object (e.g., content 110). The first shelf 644 can be attached to the first set of posts 640, and the second shelf 644 can be attached to the second set of posts 640. The first set of shelves 644 and the second set of shelves 644 are oriented opposite one another within the interior volume (eg, at locations that are mirror images of one another).

[0093] The objects supported by the shelf 644 may include a carrier 650, one or more process kit rings 652 disposed on the carrier 650, a placement verification wafer 654, a substrate, etc. In some embodiments, the carrier 650 is disposed on a first shelf 644 and a second shelf 644, and one or more process kit rings 652 are disposed on the carrier 650 without contacting the shelves 644. Each shelf 644 may form a recess that guides the process kit ring 652 into the correct position on the carrier 650 in response to the enclosure system 600 being moved (e.g., crushed, moved rapidly).

[0094] In some embodiments, the top window 634 is configured for orientation (e.g., automatic or manual orientation) of an object placed within the interior volume, and in some embodiments, the rear window 636 is removable for orientation adjustment (e.g., manual or automatic orientation) of one or more objects.

[0095] In some embodiments, each of the process kit rings 652 has a corresponding flat portion (e.g., a flat interior portion) that can be viewed through the top window 634. In some embodiments, each of the process kit rings 652 includes a feature (e.g., a notch, a peripheral notch, a recess, a marking, a top peripheral notch, etc.) on the top surface (or bottom surface) of the process kit ring 652 that can be viewed through the top window 634. In some embodiments, the flat portion and / or features (e.g., on the top surface) of each of the process kit rings can be viewed at one time (e.g., simultaneously) through the top window 634. In some embodiments, each of the carriers 650 has carrier features that can be viewed simultaneously through the top window 634. In some embodiments, the carrier features of each carrier 650, the features on the top surface of each of the process kit rings 652, and the flat portion of each of the process kit rings 652 can be viewed simultaneously through the top window 634. In response to the flat portion of the process kit ring 652 not being in the correct position or the carrier features not being in the correct position, the rear window 636 can be removed to adjust the orientation of the process kit ring 652 and / or the carrier 650. In response to the features on the top of the process kit ring 652 not being observable through the top window 634 (e.g., not facing up, upside down), the enclosure lid 630 and / or the enclosure door is removed to turn the process kit ring 652 over.

[0096] A corresponding upper surface of each of the posts 640 can be configured to removably interface with a corresponding component of the enclosure lid 630. In some embodiments, the corresponding upper surface of each of the posts 640 forms a tapered recess configured to receive a tapered protrusion (e.g., a fastener) coupled to the enclosure lid 630, aligning each of the posts 640 with the enclosure lid 630.

[0097] Each of the shelves 644 can be configured to align objects (e.g., contents 110 in FIG. 1 ), such as carriers 650 and / or process kit rings 652. In some embodiments, each shelf 644 has alignment features and / or surfaces configured to align the object on the shelf. If the robotic arm places the object in an improper position on the shelf 644 and / or if the object is displaced by transport in the enclosure system 600, the alignment features and / or surfaces align the object in the correct position. In some embodiments, the shelf 644 has a holding device configured to secure the object to the shelf 644.

[0098] In some embodiments, the interior volume of enclosure system 600 is a mini-environment (e.g., a sealed environment). In some embodiments, the interior volume of enclosure system 600 is kept substantially particle-free (e.g., substantially uncontaminated). In some embodiments, enclosure system 600 includes a fan (e.g., on the top surface) that suppresses particles within the interior volume. In some embodiments, the interior volume is substantially free (or completely free) of one or more of moisture, oxygen, particles (e.g., dust), etc.

[0099] One or more of the walls of the enclosure system 600 may form or be coupled to a front interface. The front interface is configured to interface (e.g., seal) with a door for transport of the enclosure system 600 (e.g., and to provide a sealed environment). The front interface is configured to interface (e.g., seal) with a substantially vertical portion of a load port of a substrate processing system. In response to the front interface being sealed to the door or load port, the enclosure system 600 creates a sealed environment (e.g., gases and / or particles do not enter or exit the enclosure system 600 from the ambient environment outside the substrate processing system).

[0100] In some embodiments, the bottom wall 620 includes or is coupled to a base plate (e.g., an adapter plate). The base plate is configured to interface with a horizontal portion of the load port. The base plate has features (e.g., recesses, receptacles, kinematic interfaces) for receiving kinematic devices (e.g., kinematic pins, precision positioning pins) of the horizontal portion of the load port. In some embodiments, the base plate is secured to the bottom wall 620 before the enclosure system 600 interfaces with the load port. In some embodiments, the base plate is secured to the load port, and then the bottom wall 620 is secured to the base plate. In some embodiments, the enclosure system 600 has a seal (e.g., a crushable seal, a gasket) for sealing one or more openings in the bottom wall 620.

[0101] In some embodiments, one or more of the overhead transport components 632 (e.g., overhead transport flanges) or at least one handle 612 are coupled to one or more surfaces of the enclosure system 600 for transport (e.g., automated transport, manual transport, etc.) of the enclosure system 600. In some embodiments, the overhead transport (OHT) component 632 is coupled (e.g., attached) to the enclosure lid 630. In some embodiments, a handle 612A is located on side wall 610A and a second handle is located on side wall 610B.

[0102] In some embodiments, one or more purge adapters are disposed in the bottom wall 620 (e.g., inserted into openings formed in the bottom wall 620). The purge adapters are used to one or more of fill the enclosure system 600 with a gas (e.g., nitrogen (N)), remove a gas from the enclosure system, pass a gas through the enclosure system 600, etc. The purge adapters extend through the base plate and are fluidly coupled to one or more gas or vacuum lines (e.g., to purge the enclosure system 600, to create a vacuum within the enclosure system 600, to fill the enclosure system 600 with a gas, etc.). Each of the purge adapters provides a seal with a corresponding opening in the bottom wall 620 (e.g., to provide a sealed environment). In some embodiments, the enclosure system 600 seals the load port in response to docking to the load port. The interior volume of the enclosure system 600 is configured to be purged via the one or more purge adapters prior to opening the enclosure system 600.

[0103] 6B , the enclosure system 600 includes walls including one or more of side walls 610A-B, rear walls 614A-C, and / or a bottom wall 620. An enclosure lid 630 is configured to couple to one or more of the walls of the enclosure system 600 (e.g., via one or more fasteners 674, such as button head screws). The enclosure lid 630 includes a top window. One or more of the rear walls 614 include a rear window 636. One or more of the rear windows 636 are removable to adjust the orientation of one or more of the carrier 650, the process kit ring 652, and / or the placement verification wafer 654. An overhead transport component 632 can be coupled to the enclosure lid 630.

[0104] The posts 640 are coupled to the bottom wall 620 (e.g., via base connectors 642 and one or more fasteners 674). The posts 640 removably interface with the enclosure lid 630. In some embodiments, the top surface of each post 640 forms a recess 672, and a component 670 (e.g., a fastener 674, a protrusion, a pilot pin, etc.) of the enclosure lid 630 interfaces with the recess 672 (e.g., a sleeve, a plastic sleeve, a nylon sleeve, etc.). In some embodiments, the recess 672 is a tapered recess and the component 670 is a tapered protrusion, aligning the enclosure lid 630 with the posts 640. The shelves 644 are coupled to the posts 640 (e.g., via fasteners 674). The carrier 650 is placed on the two shelves 644. The placement verification wafer 654 is placed on the two shelves. One or more process kit rings are positioned on the carrier 650 (eg, one or more process kit rings 652 without contacting the shelf 644).

[0105] In some embodiments, shelf 644 includes a sloped surface 680A to align carrier 650 on shelf 644. In some embodiments, shelf 644 includes a recess 682 (e.g., a pocket in deep pocket shelf 644) formed by sloped surfaces 680B-C to align process kit ring 652 on carrier 650 in response to movement (e.g., jostling, rapid movement, etc.) of enclosure system 600.

[0106] 6C , each shelf 644 can be coupled (e.g., fastened, attached, etc.) to two posts 640 via fasteners 674. The two posts 640 are coupled to the bottom wall 620 via the same base connector 642. In some embodiments, the enclosure door 690 is configured to removably couple (e.g., attach, clamp, seal, etc.) to one or more walls and / or the enclosure lid 630 of the enclosure system 600.

[0107] Referring to FIG. 6D , the process kit rings 652 each have a flat surface 660 (e.g., a flat inner surface, etc.) and / or top surface features 662 (e.g., a notch, marking, recess, etc.) that can be viewed through a top window. In response to the flat surface 660 being out of position when viewed through the top window, the orientation of the process kit ring 652 is adjusted (e.g., rotated to position it correctly). In response to the top surface features 662 not being visible, the process kit ring 652 is flipped over (e.g., so that the top surface features 662 are facing up instead of down). In some embodiments, the carrier has carrier features 664 (e.g., recesses, notches) positioned proximate the flat surface 660 of the process kit ring 652. The carrier features 664 can be viewed through a top window in the enclosure lid to determine whether the carrier 650 is correctly oriented. In some embodiments, the carrier 650 includes fingers 692 that support the process kit ring 652.

[0108] 6E-F, a carrier 650 supporting one or more process kit rings 652 (e.g., process kit rings 652A-B) is lowered onto a shelf 644. The shelf is connected to a post 640 via fasteners 674. In some embodiments, a component 676 further connects the shelf 644 to the post 640. In some examples, the shelf is connected to the post 640 via one or more components 676 (e.g., pilot pins, etc.), and then the fasteners 674 secure the shelf 644 to the post 640.

[0109] In some embodiments, a set of process kit rings 652 stacked on top of each other is supported by the carrier 650. In some embodiments, the shelf 644 includes a sloped surface 680A (e.g., a carrier alignment feature) to align the carrier 650 on the shelf 644. In some embodiments, the shelf 644 includes a recess 682 (e.g., a pocket in a deep pocket shelf 644) formed by sloped surfaces 680B-C (e.g., a process kit ring alignment feature) to align the process kit ring 652 on the carrier 650 in response to movement (e.g., jostling, rapid movement, etc.) of the enclosure system 600. In some embodiments, the process kit ring 652 is positioned above or within the recess 682 without contacting the shelf 644.

[0110] In some embodiments, shelf 644 includes a carrier holding device 694 (e.g., carrier holding device 460 of FIGS. 4A-E, a self-activating hook for securing carrier 650). When carrier 650 is lowered onto shelf 644 (e.g., inclined surface 680A) (e.g., supported by a robotic arm and lowered with a process kit ring 652), carrier 650 engages (e.g., presses down on) a first end of carrier holding device 694, causing a second end of carrier holding device 694 to hold the carrier. Carrier holding device 694 can rotate about axis 696 from an unlocked position to a locked position. In some examples, lowering the carrier 650 onto the first end of the carrier holding device 694 causes the carrier holding device 694 to rotate (e.g., about axis 696) such that the first end is pushed into the shelf 644 (e.g., substantially parallel with a first top surface of the shelf 644) and the second end is rotated to a position above at least a portion of the carrier 650. In some embodiments, a locking device ( FIGS. 4A-E ) is inserted into the recess 698 (e.g., in response to the door 690 being secured to the enclosure system 600) and configured to lock the carrier holding device 694 in an unlocked or secured position. By placing the carrier 650 on the shelf 644, rotating the carrier holding device 694 from an unlocked position (e.g., FIG. 6E) to a locked position (e.g., FIG. 6F), locking the door 690 to the enclosure system 600, and inserting the locking device into the recess 698, the carrier is secured by the carrier holding device 694 until the door 690 is removed from the enclosure system 600.

[0111] 6G-H, carrier retention device 694 (e.g., latch, PET latch) can be pivoted about axis 696 (e.g., pin). Locking device 622 can include rod 624 (e.g., stainless steel rod), cap 626 (e.g., an ultra-high molecular weight (UHMW) polyethylene cap, etc., for contacting door 690), guide component 628 (e.g., a guide, connector nut, UHMW polyethylene guide, etc.), and / or spring 629. In the unlocked position (e.g., when door 690 is not secured to enclosure system 600), spring 629 expands and removes rod 624 from recess 698, thereby allowing carrier retention device 694 to move between the secured and unlocked positions. In the locked position (e.g., with door 690 secured to enclosure system 600), spring 629 is compressed and rod 624 is within recess 698, preventing carrier retention device 694 from moving between the secured and unlocked positions (e.g., locking carrier 650 to shelf 644).

[0112] In some embodiments, each shelf 644 includes a carrier retaining device 694 and / or a locking device 622. In some embodiments, two shelves 644 that are coplanar (e.g., both support the same carrier 650) both include a carrier retaining device 694 and / or a locking device 622. In some embodiments, at least one of two shelves 644 that are coplanar (e.g., both support the same carrier 650) includes a carrier retaining device 694 and / or a locking device 622.

[0113] Unless otherwise specified, terms such as "transport," "move," "lower," "cause," "fix," "remove," "place," "locate," "dispose," "activate," "position," "close," "lock," and the like refer to actions and processes performed or implemented by a computer system. The computer system manipulates and transforms data represented as physical (electronic) quantities in computer system registers and memory into other data similarly represented as physical quantities in the computer system memory or registers, or other such information storage, transmission, or display devices. Additionally, terms such as "first," "second," "third," "fourth," and the like, as used herein, are intended as labels to distinguish between different elements and do not have an ordinal meaning due to their numerical designations.

[0114] Examples described herein also relate to apparatus for performing the methods described herein. In some embodiments, this apparatus is specially constructed to perform the methods described herein, or comprises a general-purpose computer system selectively programmed by a computer program stored on the computer system. In some embodiments, such a computer program is stored on a computer-readable tangible storage medium.

[0115] The methods and illustrative examples described herein are not inherently related to any particular computer or other apparatus. Various general-purpose systems may be used in accordance with the teachings described herein, or more specialized apparatus may be constructed to perform the methods described herein and / or each of their individual features, routines, subroutines, or operations. Examples of configurations for various of these systems are provided above.

[0116] The foregoing description sets forth numerous specific details, such as examples of particular systems, components, methods, etc., to provide a thorough understanding of some embodiments of the present disclosure. However, it will be apparent to one of ordinary skill in the art that at least some embodiments of the present disclosure can be practiced without these specific details. In other instances, well-known components or methods are not described in detail or are presented in simple block diagram form to avoid unnecessarily obscuring the present disclosure. Thus, the specific details described are merely exemplary. Particular implementations can vary from these example details and still be considered within the scope of the present disclosure.

[0117] References throughout this specification to "an embodiment" or "one embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in an embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or." When the term "about" or "approximately" is used herein, it is intended to mean that the stated nominal value is accurate to within ±10%.

[0118] Although the operations of the methods herein are shown and described in a particular order, the order of the operations of each method may be changed, certain operations may be performed in reverse order, and certain operations may be performed at least in part concurrently with other operations. In other embodiments, instructions or sub-operations of separate operations may be intermittent and / or interleaved.

[0119] It is understood that the above description is intended to be illustrative, and not limiting. Many other embodiments will become apparent to those skilled in the art upon reading and understanding the above description. The scope of the disclosure should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.

Claims

1. A set of one or more shelves configured to be disposed within an enclosure system of a substrate processing system, comprising: a plurality of first top surfaces disposed substantially in a first plane; a plurality of carrier alignment features configured to align the carrier on the plurality of first top surfaces; a plurality of second upper surfaces disposed substantially in a second plane above the first plane; A set of one or more shelves including a plurality of process kit ring alignment features configured to align process kit rings on the carrier above the plurality of second upper surfaces.

2. the set of one or more shelves includes a first shelf and a second shelf that are coplanar; the plurality of first upper surfaces include a first upper surface of the first shelf and a third upper surface of the second shelf; the plurality of second upper surfaces include a second upper surface and a fourth upper surface of the second shelf; the plurality of carrier alignment features include one or more first carrier alignment features on the first shelf and one or more second carrier alignment features on the second shelf; 2. The set of one or more shelves of claim 1, wherein the plurality of process kit ring alignment features includes one or more first process kit ring alignment features on a first shelf and one or more second process kit ring alignment features on a second shelf.

3. the first shelf comprises one or more first mounting features configured to mount the first shelf to one or more first components of the enclosure system; 3. The set of one or more shelves of claim 2, wherein the second shelf comprises one or more second mounting features configured to mount the second shelf to one or more second components of the enclosure system.

4. the one or more first carrier alignment features include a first sidewall; the one or more second carrier alignment features include a second sidewall; The set of one or more shelves of claim 2 , wherein the first sidewall and the second sidewall are configured to prevent x-direction and yaw movement of the carrier.

5. the first sidewall is at an angle of about 120-150 degrees from the first top surface; 5. The set of one or more shelves of claim 4, wherein the second sidewall is at an angle of about 120 to 150 degrees from the third top surface.

6. the one or more first carrier alignment features include a third sidewall; the one or more second carrier alignment features include a fourth sidewall; The set of one or more shelves of claim 4 , wherein the third sidewall and the fourth sidewall are configured to prevent movement of the carrier in the y-direction.

7. 7. The set of one or more shelves of claim 6, wherein the first top surface and the third top surface are configured to prevent z-direction, pitch, and roll motion of the carrier.

8. the one or more first process kit ring alignment features include a fifth sidewall; the one or more second process kit ring alignment features include a sixth sidewall; The set of one or more shelves of claim 3 , wherein the fifth sidewall and the sixth sidewall are configured to align a process kit ring on the carrier.

9. the fifth sidewall is at an angle of about 100° to 110° from the first top surface; 9. The set of one or more shelves of claim 8, wherein the sixth sidewall is at an angle of about 100° to 110° from the third top surface.

10. The set of one or more shelves of claim 1 , comprising one or more carrier retention devices configured to secure the carrier to the set of one or more shelves.

11. 1. An enclosure system for a substrate processing system, comprising: a plurality of surfaces at least partially enclosing an interior volume of the enclosure system; a set of one or more shelves disposed at least partially within an interior volume of the enclosure system, the set of one or more shelves comprising: a plurality of carrier alignment features configured to align a carrier on a set of one or more shelves in a first plane; An enclosure system including a plurality of process kit ring alignment features configured to align a process kit ring on the carrier in a second plane above the first plane.

12. 12. The enclosure system of claim 11, wherein the set of one or more shelves comprises a first shelf and a second shelf that are coplanar.

13. 12. The enclosure system of claim 11, wherein the plurality of carrier alignment features include a first sidewall and a second sidewall, the first sidewall and the second sidewall configured to prevent x-direction and yaw movement of the carrier.

14. 14. The enclosure system of claim 13, wherein the plurality of carrier alignment features comprise a third sidewall and a fourth sidewall, the third sidewall and the fourth sidewall configured to prevent movement of the carrier in the y-direction.

15. 15. The enclosure system of claim 14, wherein the set of one or more shelves comprises first and third upper surfaces that lie in a first plane and are configured to prevent z-direction, pitch, and roll movement of the carrier.

16. The enclosure system of claim 11 , wherein the plurality of process kit ring alignment features comprises a plurality of sidewalls configured to align the process kit ring on the carrier.

17. 17. The enclosure system of claim 16, wherein the carrier is configured to prevent x-, y-, z-, pitch, and roll motion of the process kit ring.

18. 17. The enclosure system of claim 16, comprising a plurality of sets of one or more shelves, each set of the plurality of sets configured to support one or more of a corresponding carrier, a corresponding process kit ring, a corresponding placement verification wafer, or a component of a substrate processing system.

19. transporting a carrier supporting a process kit ring to a position above a set of one or more shelves disposed within an enclosure system of a substrate processing system; In response to a carrier supporting a process kit ring being lowered, the method includes aligning the carrier on the set of one or more shelves via a plurality of carrier alignment features of the set of one or more shelves, and aligning the process kit ring on the set of one or more shelves via a plurality of process kit ring alignment features of the set of one or more shelves.

20. 20. The method of claim 19, further comprising securing the carrier to a shelf of the set of one or more shelves via one or more retention devices on the shelf in response to the carrier supporting the process kit ring being lowered.

Images