Capacitor component and method of manufacturing the capacitor component

Abstract

To provide a capacitor component capable of improving the connectivity of an internal electrode layer, the capacitance, and the moisture resistance reliability.SOLUTION: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. The internal electrode layer includes zirconium (Zr) and germanium (Ge). The ratio of the sum of contents (at.%) of zirconium (Zr) and germanium (Ge) contained in the internal electrode layer to an entirety of the internal electrode layer is from 3.3 to 3.7 inclusive.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a capacitor component and a method for manufacturing a capacitor component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of capacitor component, are important chip components used in industries such as communications, computers, home appliances, and automobiles due to their small size, high capacitance, and ease of mounting. In particular, they are key passive elements used in various electrical, electronic, and information and communication devices such as mobile phones, computers, and digital TVs.

[0003] Generally, MLCCs are manufactured by screen-printing a conductive paste for forming internal electrode layers onto a dielectric green sheet, stacking multiple dielectric green sheets with the printed conductive paste, and then sintering them. The conductive paste is generally made by mixing conductive powder such as nickel (Ni), ceramic powder, binder, and solvent. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2014-145117 Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE INVENTION An object of the present invention is to provide a capacitor component that can improve the connectivity of internal electrode layers.

[0006] Another object of one embodiment of the present invention is to provide a capacitor component that can improve capacitance.

[0007] Another object of the present invention is to provide a capacitor component that can improve the moisture resistance reliability. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided a capacitor component including: a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on the body and connected to the internal electrode layer, wherein the internal electrode layers each include zirconium (Zr) and germanium (Ge), and a ratio (at%) of the total content of zirconium (Zr) and germanium (Ge) contained in the internal electrode layer to the entire internal electrode layer is 3.3 to 3.7. [Effects of the Invention]

[0009] A capacitor component according to one aspect of the present invention can improve the connectivity of internal electrode layers.

[0010] A capacitor component according to another aspect of the present invention can improve capacitance.

[0011] A capacitor component according to another aspect of the present invention can improve moisture resistance reliability. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a schematic perspective view of a capacitor component according to an embodiment of the present invention; [Figure 2] 2 is a diagram schematically illustrating a cross-sectional view taken along line II' of FIG. 1. [Figure 3] 3 is an enlarged view of A in FIG. 2. [Figure 4] 1 is a diagram schematically illustrating one of the internal electrode layers. [Figure 5] 1 is an SEM image of a cross section of Experimental Example 1. [Figure 6] 1 is an SEM image of a cross section of Experimental Example 2. [Figure 7] 10 is a diagram showing the results of moisture resistance reliability evaluation for Experimental Example 1. [Figure 8] 10 is a diagram showing the results of moisture resistance reliability evaluation for Experimental Example 2. DETAILED DESCRIPTION OF THE INVENTION

[0013] The terms used in this application are merely used to describe particular embodiments and are not intended to limit the present invention. The singular expressions include the plural expressions unless the context clearly dictates otherwise. In this application, terms such as "comprise" or "have" are intended to specify the presence of a feature, numeral, step, operation, component, part, or combination thereof described in the specification, but should be understood as not precluding the presence or possibility of addition of one or more other features, numerals, steps, operations, components, parts, or combinations thereof. Furthermore, throughout the specification, the term "on" means located above or below a target part, and does not necessarily mean located on the upper side relative to the direction of gravity.

[0014] Furthermore, the term "bonding" does not only refer to direct physical contact between components in the contact relationship between them, but also encompasses cases where other components are interposed between the components and the components are in contact with each other.

[0015] The size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation, and the present invention is not necessarily limited to those shown.

[0016] In the drawings, the first direction can be defined as the Z direction or thickness direction, the second direction as the X direction or length direction, and the third direction as the Y direction or width direction.

[0017] Hereinafter, a capacitor component and a method for manufacturing a capacitor component according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same or corresponding components will be given the same drawing numbers, and duplicate descriptions thereof will be omitted.

[0018] FIG. 1 is a diagram schematically illustrating a perspective view of a capacitor component according to one embodiment of the present invention, FIG. 2 is a diagram schematically illustrating a cross-sectional view taken along line II' in FIG. 1, FIG. 3 is a diagram illustrating an enlarged view of A in FIG. 2, and FIG. 4 is a diagram schematically illustrating one of the internal electrode layers.

[0019] 1 to 4, a capacitor component 1000 according to this embodiment includes a body 100 and external electrodes 210 and 220. The body 100 includes a dielectric layer 110 and internal electrode layers 121 and 122.

[0020] The main body 100 forms the exterior of the capacitor component 1000 according to the present embodiment. There is no particular limitation on the specific shape of the main body 100, but as shown in the figure, the main body 100 may have a hexahedral shape or a similar shape. Due to shrinkage of the ceramic powder contained in the main body 100 during the sintering process, the main body 100 may have a substantially hexahedral shape, although not a hexahedral shape with perfectly straight lines.

[0021] 1 and 2, the main body 100 includes a first surface 101 and a second surface 102 facing each other in a thickness direction Z, a third surface 103 and a fourth surface 104 facing each other in a length direction X, and a fifth surface 105 and a sixth surface 106 facing each other in a width direction Y. The third to sixth surfaces 103, 104, 105, and 106 of the main body 100 correspond to wall surfaces of the main body 100 connecting the first surface 101 and the second surface 102 of the main body 100. Hereinafter, both end surfaces (one end surface and the other end surface) of the main body 100 may refer to the third surface 103 and the fourth surface 104 of the main body, and both side surfaces (one side surface and the other side surface) of the main body 100 may refer to the fifth surface 105 and the sixth surface 106 of the main body. Furthermore, the one surface and the other surface of the main body 100 may refer to the first surface 101 and the second surface 102 of the main body 100, respectively. One surface 101 of the main body 100 can be used as a mounting surface when mounting the capacitor component 1000 according to this embodiment on a mounting board such as a printed circuit board.

[0022] The main body 100 includes a dielectric layer 110 and first and second internal electrode layers 121 and 122 that are alternately arranged with the dielectric layer 110 sandwiched therebetween. Each of the dielectric layer 110, the first internal electrode layer 121, and the second internal electrode layer 122 is formed of a plurality of layers. Hereinafter, the first and second internal electrode layers 121 and 122 will be referred to as internal electrode layers 121 and 122 unless a distinction between them is necessary. Therefore, the description of the portions commonly referred to as internal electrode layers 121 and 122 can be applied commonly to the first and second internal electrode layers 121 and 122.

[0023] The multiple dielectric layers 110 forming the body 100 are in a sintered state, and the boundaries between adjacent dielectric layers 110 can be integrated to the extent that they are difficult to see without using a scanning electron microscope (SEM).

[0024] The raw material for forming the dielectric layer 110 is not particularly limited as long as it can obtain sufficient capacitance, and may be, for example, barium titanate (BaTiO) powder. The material for forming the dielectric layer 110 may be a powder such as barium titanate (BaTiO) to which various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added according to the purpose of the present invention.

[0025] A cover layer 130 may be disposed on the upper and lower portions of the body 100, i.e., on both ends in the thickness direction (Z direction). The cover layer 130 may play a role in maintaining the reliability of the capacitor component against external impact. The cover layer 130 may be formed using a material for forming the dielectric layer 110 or a material different from the material for forming the dielectric layer 110. For example, in the latter case, the material for forming the dielectric layer 110 and the material for forming the cover layer 110 may differ from each other in at least one of the composition, size, content, and degree of dispersion of ceramic particles within the material, or at least one of the composition, size, content, and degree of dispersion of minor components within the material.

[0026] The internal electrode layers 121, 122 are alternately arranged with the dielectric layer 110 and may include first and second internal electrode layers 121, 122. The first and second internal electrode layers 121, 122 are alternately arranged to face each other with the dielectric layer 110 sandwiched therebetween and may be exposed to the third and fourth surfaces 103, 104 of the body 100, respectively.

[0027] The internal electrode layers 121, 122 may have a shape similar to a plate shape overall. Meanwhile, in Figures 3 and 4, the internal electrode layers 121, 122 are shown as if they are made up of a plurality of electrodes spaced apart from each other, because each of Figures 3 and 4 shows a portion of a cross-section of the main body 100, and the internal electrode layers 121, 122 are an integrated member, with only holes H penetrating the internal electrode layers 121, 122, which will be described later.

[0028] The internal electrode layers 121 and 122 are alternately exposed on the third surface 103 and the fourth surface 104, which are both end surfaces of the body 100 in the longitudinal direction X, and are connected to the first and second external electrodes 210 and 220, respectively. That is, the first internal electrode layer 121 is exposed on the third surface 103 of the body 100 and is connected to the first external electrode 210, and is not exposed on the fourth surface 104 of the body 100 and is not connected to the second external electrode 220. The second internal electrode layer 122 is exposed on the fourth surface 104 of the body 100 and is connected to the second external electrode 220, and is not exposed on the third surface 103 of the body 100 and is not connected to the first external electrode 210. Therefore, the first internal electrode layer 121 is spaced a certain distance from the fourth surface 104 of the body 100, and the second internal electrode layer 122 is spaced a certain distance from the third surface 103 of the body 100. At this time, the internal electrode layers 121 and 122 may be electrically isolated from each other by the dielectric layer 110 disposed therebetween.

[0029] The internal electrode layers 121, 122 may include nickel (Ni), zirconium (Zr), and germanium (Ge). For example, the internal electrode layers 121, 122 may include a nickel (Ni)-zirconium (Zr)-germanium (Ge) alloy. For example, the internal electrode layers 121, 122 may be formed from conductive pastes each including a first powder including one or more of palladium (Pd), silver (Ag), nickel (Ni), and copper (Cu), a second powder including zirconium (Zr), and a third powder including germanium (Ge). For example, in the conductive paste, the second powder containing zirconium (Zr) may be contained in a ratio of 2.5 wt% to 3.5 wt% based on the weight of nickel (Ni) in the first powder, and the third powder containing germanium (Ge) may be contained in a ratio of 2.0 wt% to 3.0 wt% based on the weight of nickel (Ni) in the first powder, but the scope of the present invention is not limited thereto.

[0030] The ratio of the total content (at%) of zirconium (Zr) and germanium (Ge) to the total content of the internal electrode layers 121 and 122 may be 3.3 at% or more and 3.7 at% or less. If the ratio of the total content (at%) of zirconium (Zr) and germanium (Ge) to the total content of the internal electrode layers 121 and 122 is less than 3.3 at% or exceeds 3.7 at%, the effect of improving the connectivity of the internal electrode layers, which will be described later, is slight.

[0031] Zirconium (Zr) may be contained in a proportion of 1.6 at% or more and 1.8 at% or less relative to the total content of the internal electrode layers 121 and 122. If the internal electrode layers 121 and 122 contain zirconium (Zr) less than 1.6 at% or if the internal electrode layers 121 and 122 contain zirconium (Zr) more than 1.8 at%, the effect of improving the connectivity of the internal electrode layers, which will be described later, is slight.

[0032] The germanium (Ge) content (at%) contained in the internal electrode layers 121 and 122 may be higher than the zirconium (Zr) content (at%) contained in the internal electrode layers 121 and 122. However, if the difference between the two is large, the effect of improving the connectivity of the internal electrode layers becomes small, so it is preferable that the difference between the two is around 0.1 at%.

[0033] The ratio of the total content (at%) of zirconium (Zr) and germanium (Ge) contained in the internal electrode layers 121, 122 to the content (at%) of nickel (Ni) contained in the internal electrode layers 121, 122 may be 3.8 or more and 4.3 or less. If the ratio is less than 3.8 or more than 4.3, the effect of improving the connectivity of the internal electrode layers, which will be described later, is slight.

[0034] The presence or absence and amount of nickel (Ni), zirconium (Zr), and germanium (Ge) in the internal electrode layers 121 and 122 can be determined using a transmission electron microscope (TEM). Specifically, as shown in FIG. 3, scanning for nickel (Ni), zirconium (Zr), and germanium (Ge) elements is performed on the region corresponding to the internal electrode layers 121 and 122 in a cross section (X-Z cross-section) taken at the center of the width direction Y in the length direction X-thickness direction Z, and it is found that the region contains nickel (Ni), zirconium (Zr), and germanium (Ge), and the amount of each element can also be determined. Alternatively, the presence or absence and amount of nickel (Ni), zirconium (Zr), and germanium (Ge) in the internal electrode layers 121 and 122 can be determined by ICP analysis. Specifically, after polishing and removing the external electrodes from the capacitor component, the main body including the dielectric layer and the internal electrode layer is pulverized to produce a primary powder, and the internal electrode layer components are extracted from the primary powder using a magnet, and the primary powder extracted with the magnet is subjected to ICP-MS (Inductively Coupled Plasma-Mass Spectroscopy) to confirm this. Note that the fact that the internal electrode layers 121, 122 contain nickel (Ni)-zirconium (Zr)-germanium (Ge) alloy can be determined by X-ray diffraction analysis (XRD).

[0035] Typically, internal electrode layers are formed by printing a conductive paste for forming the internal electrode layers on dielectric green sheets, stacking and cutting the green sheets to form a green chip laminate, and sintering the laminate. Typically, the conductive paste for forming the internal electrode layers and the dielectric green sheets contain metal powder such as nickel (Ni) and dielectric ceramic powder such as barium titanate, as well as organic materials such as dispersants, binders, and solvents. Meanwhile, as component capacity increases, the internal electrode layers need to be thinner. To achieve this, the size of metal powder such as nickel added to the conductive paste for forming the internal electrode layers decreases. This shifts the sintering start temperature of the metal powder toward a lower temperature range, resulting in an increase in the difference between the sintering start temperature of the metal powder for forming the internal electrode layers and the sintering start temperature of the ceramic powder for forming the dielectric layers. This can lead to problems such as reduced connectivity of the internal electrode layers after sintering, resulting in reduced component capacity and reliability.

[0036] In the case of the capacitor component 1000 according to the present invention, the above-mentioned problems are solved by adding not only the first powder of nickel (Ni) but also the second powder containing zirconium (Zr) and the third powder containing germanium (Ge) to the conventional conductive paste for forming internal electrode layers. That is, by adding the second powder containing zirconium (Zr) and the third powder containing germanium (Ge) to the conductive paste for forming internal electrode layers, the sintering start temperature for forming the internal electrode layers can be shifted to a relatively high temperature range in the heat treatment process, such as the sintering process. This improves the connectivity of the internal electrode layers 121 and 122. This improves the capacitance of the capacitor component 1000 according to the present embodiment. This also improves the moisture resistance reliability of the capacitor component 1000 according to the present embodiment.

[0037] The thicknesses T1 and T2 of the internal electrode layers 121 and 122 may be 10 nm or more and 500 nm or less. If the thicknesses T1 and T2 of the internal electrode layers 121 and 122 are less than 10 nm, the connectivity of the internal electrode layers 121 and 122 may be reduced, resulting in a reduced capacitance. If the thicknesses T1 and T2 of the internal electrode layers 121 and 122 are more than 500 nm, the thickness of the dielectric layer 110 is formed to be thin relative to components of the same size, making it difficult to achieve electrical insulation between the internal electrode layers 121 and 122.

[0038] The thicknesses T1 and T2 of the internal electrode layers 121 and 122 can be measured using an optical image or SEM image obtained by scanning an XZ cross-section of the capacitor component cut at the center in the width direction Y. For example, the thickness of the internal electrode layers 121 and 122 can be calculated by selecting one of the internal electrode layers 121 and 122 shown in the image, measuring the dimension of the selected internal electrode layer along the Z direction multiple times along the X direction, and then arithmetically averaging the results. The multiple measurements along the X direction can be performed at equal intervals along the X direction, but are not limited to this. The thickness of the internal electrode layers 121 and 122 can also be calculated by calculating the thickness of each of the internal electrode layers 121 and 122 shown in the image using the method described above and dividing the thickness by the total number of internal electrode layers 121 and 122.

[0039] The internal electrode layers 121 and 122 may further include barium (Ba) and titanium (Ti). For example, ceramic particles C may be disposed within the internal electrode layers 121 and 122. The ceramic particles C may be formed by adding ceramic powder, such as barium titanate (BaTiO3), to the conductive paste for forming the internal electrode layers. The ceramic particles C may be a barium titanate-based material, similar to the dielectric of the dielectric layer 110. In this case, the reliability of the capacitor component according to the present embodiment may be improved. Voids V may be formed within the internal electrode layers 121 and 122. The voids V may be formed by diffusion and recrystallization of the conductive powder contained in the conductive paste during a sintering process, by removal of organic substances, such as a solvent, contained in the conductive paste during the sintering process, or by diffusion of the ceramic powder contained in the conductive paste into the dielectric layer 110 during the sintering process. On the other hand, the voids V and the ceramic particles C differ from holes H and non-conductive portions disposed in the holes H, which will be described later, in that they do not penetrate the internal electrode layers 121 and 122.

[0040] Holes H may be formed in the internal electrode layers 121 and 122, and non-conductive portions may be disposed in the holes H. The holes H are regions where the connection between the internal electrode layers 121 and 122 is cut off and penetrate the internal electrode layers 121 and 122. A non-conductive portion is formed in the holes H. If the non-conductive portion includes a ceramic material having a composition similar to that of the dielectric of the dielectric layer 110 and / or the ceramic particles C in the internal electrode layers 121 and 122, the non-conductive portion may connect two adjacent dielectric layers 110 via one of the internal electrode layers 121 and 122. In this case, the non-conductive portion may improve the reliability of the capacitor component 1000 according to this embodiment. While FIG. 3 illustrates the non-conductive portion formed in the holes H connecting adjacent dielectric layers 110, this is merely an example. As another example, the non-conductive portion formed in the holes H may be a void.

[0041] Referring to FIG. 4, in a cross-section of the main body 100 along the thickness direction Z, the total length L of the internal electrode layers 121 and 122 along the length direction X is T The ratio of the length L1+L2+L3 of the internal electrode layers 121, 122 in the longitudinal direction X excluding the non-conductive portions to the total length L of the internal electrode layers 121, 122 in the longitudinal direction X may be 0.8 or more. T are lengths L1, L2, L3 of the region where the connection between the internal electrode layers 121 and 122 is maintained, and lengths L of the region where the connection between the internal electrode layers 121 and 122 is cut, i.e., the length L of the non-conductive portion. H1 , L H2 The ratio is related to the connectivity of the internal electrode layers 121 and 122, and if the ratio is less than 0.8, the connectivity of the internal electrode layers 121 and 122 may be poor, resulting in a decrease in capacitance.

[0042] Here, the total length L of the internal electrode layers 121 and 122 along the X direction T can be measured using an optical image or an SEM image obtained by scanning an XZ cross-section of the capacitor component cut at the center in the Y direction. For example, the total length L of the internal electrode layers 121 and 122 along the X direction is T may refer to the arithmetic mean of the dimension of the selected internal electrode layer 121, 122 along the X direction measured multiple times along the Z direction. Such multiple measurements along the Z direction may be performed at equal intervals along the Z direction, but are not limited thereto. Alternatively, the total length L of the internal electrode layers 121, 122 along the X direction may be the arithmetic mean of the dimension of the selected internal electrode layer 121, 122 measured multiple times along the Z direction. T may mean the average value obtained by calculating the length of each of the internal electrode layers 121, 122 in the X direction using the method described above for each of the internal electrode layers 121, 122 shown in the image and dividing this value by the total number of the internal electrode layers 121, 122. Meanwhile, the total length L of the internal electrode layers 121, 122 in the X direction TThe measurement method is as follows: the lengths L1, L2, and L3 of the internal electrode layers 121 and 122 excluding the non-conductive portion along the X direction, and the length L of the non-conductive portion along the X direction. H1 , L H2 can be applied to each of the above.

[0043] The external electrodes 210, 220 are disposed on the main body 100 and connected to the internal electrode layers 121, 122. As shown in FIGS. 1 and 2 , the external electrodes 210, 220 may include first and second external electrodes 210, 220 disposed on the third and fourth surfaces 103, 104 of the main body 100, respectively, and connected to the first and second internal electrode layers 121, 122, respectively.

[0044] The first and second external electrodes 210 and 220 may be disposed on the third and fourth surfaces 103 and 104 of the main body 100, respectively, and may include first and second connecting portions connected to the first and second internal electrode layers 121 and 122, and first and second extending portions extending from the first and second connecting portions to the first surface 101 of the main body 100. The first and second extending portions are disposed spaced apart from each other on the first surface 101 of the main body 100. Meanwhile, the first and second extending portions may extend not only to the first surface 101 of the main body 100 but also to the second, fifth, and sixth surfaces 102, 105, and 106 of the main body 100, respectively, but the scope of the present invention is not limited thereto. That is, as shown in FIG. 1, each of the external electrodes 210 and 220 of the present invention may be a normal type formed on five surfaces of the main body 100, but is not limited thereto and may be an L type formed on two surfaces of the main body 100, a C type formed on three surfaces of the main body 100, etc.

[0045] The external electrodes 210, 220 may be formed using any electrically conductive material, such as a metal. The specific material may be determined taking into consideration electrical properties, structural stability, etc., and may further have a multi-layer structure. For example, each of the external electrodes 210, 220 may include a first layer and a second layer. The first layer may be formed by sintering a sinterable conductive paste containing a conductive metal and glass, by hardening a hardening conductive paste containing a conductive metal and a base resin, or by vapor deposition. The second layer may be a nickel (Ni) plating layer and a tin (Sn) plating layer sequentially formed on the first layer by plating.

[0046] On the other hand, in this embodiment, the capacitor component 100 has a structure having two external electrodes 210, 220, but the number and shape of the external electrodes 210, 220 can be changed depending on the shape of the internal electrode layers 121, 122 and other purposes.

[0047] [Experimental Example] A first powder containing nickel (Ni), a second powder containing zirconium (Zr), and a third powder containing germanium (Ge) were prepared.

[0048] A first conductive paste containing only the first powder of the first to third powders was manufactured, a second conductive paste containing all of the first to third powders of the first to third powders was manufactured, a third conductive paste containing only the first and second powders of the first to third powders was manufactured, and a fourth conductive paste containing only the first and third powders of the first to third powders was manufactured.

[0049] In the second conductive paste, the second powder contained 3.0 wt% zirconium (Zr) relative to the first powder (nickel (Ni)), and the third powder contained 2.5 wt% germanium (Ge) relative to the first powder (nickel (Ni)).

[0050] In the third conductive paste, the second powder contained 5.5 wt % of zirconium (Zr) relative to the first powder (nickel (Ni)).

[0051] In the fourth conductive paste, the third powder contained 5.5 wt % germanium (Ge) relative to the first powder (nickel (Ni)).

[0052] The first to fourth conductive pastes were used as the conductive pastes for forming the internal electrode layers to form first to fourth unsintered green bodies, which were then sintered to manufacture the bodies.

[0053] Experimental Example 1 was an example in which the internal electrode layer was formed using the first conductive paste, Experimental Example 2 was an example in which the internal electrode layer was formed using the second conductive paste, Experimental Example 3 was an example in which the internal electrode layer was formed using the third conductive paste, and Experimental Example 4 was an example in which the internal electrode layer was formed using the fourth conductive paste.

[0054] Experimental Examples 1 to 4 differ only in the conductive powder content of the conductive paste for forming the internal electrode layers, and the remaining conditions, for example, i) the composition of the dielectric green sheet, ii) the composition and content of the ceramic powder contained in the conductive paste for forming the internal electrode layers, iii) the size (X x Y x Z) of the green body, iv) sintering conditions such as heating conditions and sintering atmosphere, v) the total number of dielectric layers, vi) the total number of internal electrode layers, vii) the average thickness of the internal electrode layers, viiii) the average thickness of the dielectric layers, ix) the composition and formation conditions of the external electrodes, etc. For example, the average thickness of each internal electrode layer in Experimental Examples 1 to 4 is 480 nm, the average thickness of each dielectric layer is 550 nm, the total number of internal electrode layers is 287, and the size of the green body is X = 785 μm, Y = 440 μm, Z = 430 μm, which are all the same.

[0055] For Experimental Example 2 in which the internal electrode layers were formed using the second conductive paste, the elements contained in the internal electrode layers were analyzed by the above-mentioned ICP analysis method.

[0056] Referring to Table 1, it can be seen that the internal electrode layers of Experimental Example 2 contain all of the materials of the first to third powders, that is, Ni, Zr, and Ge.

[0057] [Table 1]

[0058] Figure 5 is an SEM image of a portion of a cross section (X-Z cross section) of Experimental Example 1 taken along the length-thickness direction at the center of the width direction Y of the body of Experimental Example 1, and Figure 6 is an SEM image of a portion of a cross section (X-Z cross section) of Experimental Example 2 taken along the length-thickness direction at the center of the width direction Y of the body of Experimental Example 2. Using the SEM images, the connectivity of the internal electrode layers in Experimental Example 1 and Experimental Example 2 was calculated. The connectivity of the internal electrode layers in Experimental Example 1 was 74.1%, and the connectivity of the internal electrode layers in Experimental Example 2 was 86.0%. As a result, it was found that the connectivity of the internal electrode layers in Experimental Example 2, which used the second conductive paste containing nickel (Ni) powder, zirconium (Zr) powder, and germanium (Ge) powder, was improved by about 12% ((86.0-74.1) / 74.1×100=16.1%) compared to the connectivity of the internal electrode layers in Experimental Example 1, which used the first conductive paste containing only nickel (Ni) powder as the conductive powder. This is thought to be because zirconium (Zr) and germanium (Ge) are added to nickel (Ni) and help delay the firing shrinkage of nickel (Ni) in a high-temperature atmosphere.

[0059] Table 2 shows the capacitance (unit: nF) of Experimental Examples 1 and 2, which was obtained by changing the sintering temperature (T) when sintering the bodies of Experimental Examples 1 and 2. Meanwhile, the sintering temperature (T) in Table 2 may refer to the maximum temperature in the sintering process.

[0060] As shown in Table 2, Experimental Example 2, which used the second conductive paste containing nickel (Ni) powder, zirconium (Zr) powder, and germanium (Ge) powder, exhibited improved capacitance compared to Experimental Example 1, which was sintered at the same sintering temperature. This is believed to be due to improved connectivity of the internal electrode layers in Experimental Example 2 compared to Experimental Example 1, as shown in Figures 5 and 6.

[0061] [Table 2]

[0062] 7 and 8 show the results of the moisture resistance reliability evaluation (8585 evaluation) for Experimental Example 1 and Experimental Example 2, respectively. The moisture resistance reliability evaluation was carried out for 20 samples for each experiment, measuring the change in insulation resistance (IR) over time (t) under experimental conditions of a temperature of 85°C, a relative humidity of 85%, and an applied voltage of 8V. In the case of Experimental Example 1 shown in FIG. 7, after 30 minutes had passed, the insulation resistance of a total of five samples suddenly decreased (by more than two orders of magnitude (10 2 However, in the case of Experimental Example 2 shown in Figure 8, no sudden change in insulation resistance was observed for all samples over the same period of time. This is believed to be due to the improved connectivity of the internal electrode layers in Experimental Example 2 compared to Experimental Example 1, as shown in Figures 5 and 6.

[0063] Table 3 shows the measured defective rates (short %) for Experimental Examples 1 to 4.

[0064] First, a total of 100 samples were produced for each experimental example, and a measurement voltage of 0.5V and a frequency of 1kHz were applied to these samples. Under these experimental conditions, samples with a capacitance of 3.2μF or less or 4.2μF or more were judged to be defective. Also, samples with a DF (Dissipation Factor) of 0.04 or less or 0.07 or more were judged to be defective.

[0065] The number of samples judged to be defective for each experimental example was expressed as a percentage, which was taken as the defective rate (short%).

[0066] As shown in Table 3, it can be seen that in the case of Experimental Example 2, which used the second conductive paste containing all of the first to third powders, the defect rate was lower than in Experimental Examples 1, 3, and 4, which did not contain at least one of the first to third powders. This is believed to be because the connectivity of the internal electrode layers was improved in Experimental Example 2, as described above.

[0067] [Table 3]

[0068] Although one embodiment of the present invention has been described above, a person having ordinary knowledge in the art can modify and change the present invention in various ways by adding, changing, or deleting components within the scope of the concept of the present invention as set forth in the claims, and this can also be said to fall within the scope of the present invention. [Explanation of symbols]

[0069] 100 units 110 dielectric layer 121, 122 Internal electrode layer 130 Cover Layer 210, 220 external electrode H hole 1000 Capacitor Components

Claims

1. a body having a dielectric layer and an internal electrode layer; an external electrode disposed on the main body and connected to the internal electrode layer; The internal electrode layers each contain zirconium (Zr) and germanium (Ge), A capacitor component, wherein a ratio of a total content (at %) of zirconium (Zr) and germanium (Ge) contained in the internal electrode layers to the entire internal electrode layers is 3.3 or more and 3.7 or less.

2. 2. The capacitor component according to claim 1, wherein a ratio of a content (at %) of zirconium (Zr) contained in said internal electrode layers to the total content of said internal electrode layers is 1.6 or more and 1.8 or less.

3. 3. The capacitor component according to claim 1, wherein a ratio of a germanium (Ge) content (at %) contained in said internal electrode layers to the total content of said internal electrode layers is 1.7 or more and 1.9 or less.

4. The capacitor component according to claim 1 , wherein the internal electrode layers further contain nickel (Ni).

5. a non-conductive portion penetrating the internal electrode layer is formed in the internal electrode layer; In a cross section of the body along a first direction, 5. A capacitor component according to claim 1, wherein the ratio of the length of the internal electrode layer along the second direction excluding the non-conductive portion to the total length of the internal electrode layer along the second direction perpendicular to the first direction is 0.8 or more.

6. a body having a dielectric layer and an internal electrode layer; an external electrode disposed on the main body and connected to the internal electrode layer; the internal electrode layers contain a nickel (Ni)-zirconium (Zr)-germanium (Ge) alloy; A capacitor component, wherein a ratio of a total content (at %) of zirconium (Zr) and germanium (Ge) contained in the internal electrode layers to a content (at %) of nickel (Ni) contained in the internal electrode layers is 3.8 or more and 4.3 or less.

7. 7. The capacitor component according to claim 1, wherein a germanium (Ge) content (at%) contained in the internal electrode layers is greater than a zirconium (Zr) content (at%) contained in the internal electrode layers.

8. The capacitor component according to claim 1 , wherein the internal electrode layers further contain barium (Ba) and titanium (Ti).

9. forming a dielectric green sheet; and applying a conductive paste to the dielectric green sheet, the conductive paste including a first powder including nickel (Ni), a second powder including zirconium (Zr), and a third powder including germanium (Ge).

10. The second and third powders are 10. The method for manufacturing a capacitor component according to claim 9, wherein the ratio of the total weight of zirconium (Zr) and germanium to the total weight of nickel (Ni) in the conductive paste is 4.0 to 4.5 or less.

11. forming a laminate by stacking a plurality of the dielectric green sheets coated with the conductive paste; sintering the laminate to form a body including the dielectric layers and the internal electrode layers.

12. In the step of forming the body, 12. The method for manufacturing a capacitor component according to claim 11, wherein the nickel (Ni), zirconium (Zr) and germanium (Ge) of the first to third powders form a nickel (Ni)-zirconium (Zr)-germanium (Ge) alloy.

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