Manufacturing method of product or component, and position evaluation device

Abstract

To provide a product or member manufacturing method and a location evaluation device that can determine multiple components as non-defectives when the correlation of shifted locations is the same, and combine the components with similar correlations on the basis of the evaluation results of the locations of the components determined to be non-defectives even in a case in which some or all of the components in a group of multiple components are attached to a location shifted from a reference location of an object to be attached.SOLUTION: A method for manufacturing a product or member that combines a first component group and a second component group includes calculating the positional deviation of components of the first component group and the second component group with respect to a reference location, determining the first component group and the second component group to be non-defective products when the locations of the component are included in the dimensional position range and in the relative position range, and assembling a product or member by combining the first component group and the second component group that meet predetermined assemblable conditions.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a product or component in a manufacturing process in which different parts groups are combined to form the product or component, and to a position evaluation device. [Background technology]

[0002] A conventional electronic component mounting method is known, which recognizes multiple fiducial marks provided on a substrate, calculates the position of each fiducial mark, applies adhesive to the center position of each cavity detected based on the relative positional relationship between the calculated positions of the multiple fiducial marks and the center position of each cavity, captures an image of each cavity to which the adhesive has been applied, and then mounts an electronic component at the center position of the adhesive in each cavity determined based on the image. This electronic component mounting method makes it possible to mount an electronic component in each cavity in a normal orientation even if the substrate is deformed (see, for example, Patent Document 1).

[0003] Also known is an automated manufacturing method for micro-components, which comprises carrying an assembly object transported by a transport means into a clean chamber, measuring the relative positional deviation between a micro-component supplied in the clean chamber and the assembly object using a measuring means, aligning and assembling the micro-component with the assembly object based on the measured relative positional deviation using an assembly means provided in the clean chamber and having a sliding section sealed and connected to a suction and exhaust means, and carrying out the micro-component in a fastened state to the assembly object from the clean chamber (see, for example, Patent Document 2). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-225603 [Patent Document 2] Japanese Patent Application Publication No. 06-031550 Summary of the Invention [Problem to be solved by the invention]

[0005] The above-mentioned Patent Documents 1 and 2 describe technologies for measuring the relative positions between electronic components and cavities, and between components and assembled objects, to perform mounting and assembly. With regard to the evaluation of relative positions, if the tolerance range for relative positions is narrow and a component (hereinafter, both the above-mentioned "electronic components" and "components" are collectively referred to simply as "components") is determined to be defective when the relative position is outside the tolerance range, the rate of defective products will increase, i.e., the component yield will decrease, and there is a risk of delays in producing a certain number of products equipped with the components on the production line.

[0006] However, even if a group of multiple parts is attached at a position that is shifted from the reference position of the body to which the parts are attached (corresponding to the above-mentioned "cavity" and "assembly target"), if the direction and magnitude of the shift in the relative position of each of the multiple parts from the reference position are the same, there may be no problem with the quality of the multiple parts, i.e., the multiple parts may be judged to be good products.

[0007] Furthermore, when fitting multiple parts to multiple other parts, if the direction and magnitude of the shift in the relative position of each of the multiple parts from its reference position are similar to the direction and magnitude of the shift in the relative position of each of the other multiple parts from its reference position, it is easy to fit multiple parts to multiple other parts.

[0008] Regarding the evaluation of the relative position of each of the multiple parts with respect to the reference position, Figs. 1A and 1B are used. A more detailed explanation will be given. FIG. 1A is a schematic diagram showing a state in which pins 2-1 to 2-5 and connectors 3-1 to 3-5, which are mounted, as an example of a group of multiple components, for example, in an electronic device or the interior of an automobile, are attached to boards 4-1 and 4-2, which are the mounting targets, without deviation beyond an allowable range relative to the reference positions of the boards 4-1 and 4-2. Here, the dotted circle in FIG. 1A represents a dimensional position range, and the state in which pins 2 and connector 3 are attached to boards 4-1 and 4-2 without deviation beyond an allowable range refers to a state in which pins 2 and connector 3 (hereinafter, when describing pins 2-1 to 2-5 as a group or when describing any one of pins 2-1 to 2-5, the subnumbers will be omitted. The same applies to connector 3 and reference position 5 shown in FIG. 1B) are attached within the dimensional position range. Although the reference position is not shown in FIG. 1A, the reference position is located at the center of the dimensional position range represented by the dotted circle. Furthermore, a state in which the pins 2 and connector 3 are attached on the reference position is better than a state in which the pins 2 and connector 3 are attached outside the reference position but within the dimensional position range. Also, the dotted circle centered on the reference position 5 shown in the following Figure 1B also represents the dimensional position range.

[0009] The pins 2 have a convex shape (a convex shape extending from front to back in the orientation of FIGS. 1A and 1B), and the connector 3 has a concave shape (a concave shape extending from front to back in the orientation of FIGS. 1A and 1B). In a factory production line or the like, as part of the process of producing a product (or component), the pins 2 are mated with the connector 3 to assemble the board 4-1 to the board 4-2. In FIG. 1A, the pins 2 and the connector 3 are attached in a reference position, so that the board 4-1 can be easily assembled to the board 4-2.

[0010] FIG. 1B is a schematic diagram showing a state in which the pins 2 and connectors 3 are attached to the boards 4-1 and 4-2 with a deviation from the reference position 5 compared to FIG. 1A. In FIG. 1B, the pins 2 and connectors 3 are attached outside the dimensional position range. Therefore, in a position evaluation based only on the dimensional position range, the pins 2 and connectors 3 shown in FIG. 1B are determined to be defective. As described above, since the pins 2 are grouped on the board 4-1 and the connectors 3 are grouped on the board 4-2, even if only some of the pins 2 and connectors 3 are determined to be defective, the pins 2 on the board 4-1 and the connectors 3 on the board 4-2 are determined to be defective.

[0011] Here, the direction and magnitude of the relative positional deviation of the pins 2 from their respective reference positions 5 are the same, and the direction and magnitude of the relative positional deviation of the connectors 3 from their respective reference positions 5 are also the same. Note that, hereinafter, the tendency of the direction and magnitude of these relative positional deviations will also be referred to as "correlation." Furthermore, the correlation of the pins 2 from their respective reference positions 5 and the correlation of the connectors 3 from their respective reference positions 5 are similar. As a result, when combining the board 4-1 with the board 4-2, the positions of the pins 2 and the connectors 3 tend to overlap, making it possible to fit the pins 2 into the connectors 3, and thus making it possible to assemble the product.

[0012] From the above description, it can be seen that even if some or all of the pins 2 are attached outside the dimensional position range, the pins 2 may be judged as non-defective as long as the correlation of each pin 2 with respect to the reference position 5 is equivalent. The same applies to the connector 3. Furthermore, if the correlation of each pin 2 with respect to the reference position 5 and the correlation of each connector 3 with respect to the reference position 5 are similar, it will be possible to assemble a product by combining the board 4-1 and the board 4-2.

[0013] The present invention has been made in consideration of the above-mentioned problems, and provides a method for manufacturing a product or component that can determine whether a plurality of components are good, even when some or all of the components are attached to a group in positions that are shifted from a reference position on a mounting surface, as long as the correlations of the shifted positions are similar, and further, based on the evaluation results of the positions of the components that have been determined to be good, it is possible to combine components that have similar correlations, and a method for manufacturing a product or component that can determine whether a plurality of components are good. It is a final object to provide a position evaluation device for use in a manufacturing method. [Means for solving the problem]

[0014] The present disclosure for solving the above problems is as follows: A method for manufacturing a product or component by combining a first group of components made up of a plurality of components with a second group of components, calculating positional deviations of the components of the first component group and the second component group relative to reference positions; using a dimension position range determined based on the reference position and a relative position range between the plurality of components determined based on the deviation of the positions of the plurality of components from the reference position, determining that the first component group and the second component group are non-defective when the positions of the components in the first component group and the second component group are within the dimensional position range and the relative position range; The method includes a method for manufacturing a product or component, characterized in that a product or component is assembled by combining the first group of components and the second group of components that meet predetermined assembly conditions from among the first group of components and the second group of components that have been determined to be non-defective.

[0015] By setting a relatively wide dimensional position range, the conditions for determining whether the first and second component groups are good are relaxed. Furthermore, by setting a relative position range, the tendency of the amount and direction of misalignment of the components in the first and second component groups is likely to be similar, and based on this tendency, it is easier to improve the misalignment of the components in the first and second component groups. An evaluation method using both the dimensional position range and the relative position range improves the accuracy of determining whether the first and second component groups are good or bad. Furthermore, predetermined assembling conditions make it easy to combine the first and second component groups. As a result, this can lead to an improvement in the yield of components, or products or components made by combining components.

[0016] The present disclosure may also provide a method for manufacturing a product or component, wherein the first group of components and the second group of components determined to be non-defective are sorted into a plurality of groups based on the deviation. This makes it easy to combine non-defective components from the first group of components and the second group of components that have similar tendencies in at least one of the amount and direction of deviation, thereby facilitating the assembly of the product or component.

[0017] The present disclosure may also provide a method for manufacturing a product or component, characterized in that a combination of groups that can be assembled with each other is determined in advance from among a plurality of groups into which the first group of components determined to be non-defective is sorted and a plurality of groups into which the second group of components determined to be non-defective is sorted, and the assembling condition is that the first group of components determined to be non-defective and the second group of components determined to be non-defective are each sorted into groups that can be assembled with each other. This makes it easy to determine an appropriate combination of the first group of components and the second group of components.

[0018] The present disclosure may also provide a method for manufacturing a product or component, characterized in that IDs that allow the tendency of the deviation to be identified are added to the first group of components and the second group of components that have been determined to be non-defective. This makes it easy to manage the tendency of at least one of the amount and direction of deviation of the positions of non-defective components from a reference position, and enables efficient sorting of non-defective components.

[0019] In the present disclosure, the assembling condition includes a reference point determined based on the position of the component of the first component group and a reference point determined based on the position of the component of the second component group. The method for manufacturing a product or component may be characterized in that the distance between the determined judgment reference point is equal to or less than a predetermined threshold value, which makes it easy to determine whether the first group of components and the second group of components can be combined.

[0020] Furthermore, the present disclosure may provide a method for manufacturing a product or member, characterized in that, when the first component group or the second component group is determined to be defective, the method for determining this and the calculation result relating to the deviation are provided to a front-end device, and the front-end device can adjust the positions of the components of the first component group and the components of the second component group based on the calculation result. This can improve the accuracy of the operation of the front-end device (e.g., the accuracy of mounting and measurement), contributing to an increase in yield.

[0021] The present disclosure may also provide a method for manufacturing a product or component, characterized in that if the first component group or the second component group is determined to be a non-defective product, this fact and the calculation results related to the deviation are provided to a downstream process device, and the downstream process device assembles the product or component based on the calculation results. This can improve the efficiency of the product or component assembly work and contribute to improving the product or component shipping rate. Specifically, the first component group and the second component group can be assembled so as to correct the deviation.

[0022] The present disclosure also provides: A position evaluation device that evaluates the mounting positions of a component group consisting of a plurality of components and provides the evaluation results, a calculation unit that calculates a positional deviation of a component in the component group relative to a reference position; using a dimension position range determined based on the reference position and a relative position range between the plurality of components determined based on the deviations of the plurality of components from the reference position, a determination unit that determines the group of components as non-defective when the positions of the components in the group of components are within the dimensional position range and the relative positions of the components in the group of components are within the relative position range, The determining unit may include a position evaluation device that adds an ID that enables the tendency of the deviation to be recognized to the group of components that have been determined to be non-defective.

[0023] This will enable improvements in the yield of parts, products or components made up of assembled parts, and by adding an ID that allows for recognition of deviation trends, it will also contribute to making the work of sorting good products more efficient.

[0024] The above means for solving the problems can be used in combination with each other whenever possible. [Effects of the Invention]

[0025] According to the present invention, in the method for manufacturing a product or component and the position evaluation device, the tolerance range for the positions at which multiple parts are grouped together and each of the multiple parts is attached to the object to be attached is widened, and further, it becomes easier to combine parts that have similar correlations, which can ultimately lead to an improvement in the yield of parts or products that combine parts. [Brief explanation of the drawings]

[0026] [Figure 1]1A and 1B are schematic diagrams showing the state in which pins and connectors are attached to a substrate, which is an attachment target, in a conventional embodiment. In Fig. 1B, multiple pins and connectors are attached outside the dimensional position range, so in a position evaluation based only on the dimensional position range, the pins and connectors would be judged as defective, but in a position evaluation that also takes into account the correlation of the pin and connector positions with respect to the reference position, the pins and connectors would be judged as non-defective. [Figure 2] 2A to 2C are conceptual diagrams illustrating a method for evaluating the positions of pins attached to a substrate relative to their respective reference positions according to an embodiment. [Figure 3] FIG. 3 is a conceptual diagram for explaining a method for sorting pins and connectors based on the positions of the judgment reference points calculated from the positions of the pins and connectors relative to the reference positions according to the embodiment. [Figure 4] FIG. 4 is a functional block diagram illustrating an example of a position evaluation device according to an embodiment. [Figure 5] Fig. 5A is a conceptual diagram illustrating a method for calculating a reference point from the position of a pin according to an embodiment, and Fig. 5B is a conceptual diagram illustrating a method for calculating a relative position range from the reference point calculated by the method shown in Fig. 5A. [Figure 6] FIG. 6 is a conceptual diagram for explaining the procedure of a manufacturing method for a product or component using the position evaluation device according to the embodiment. [Figure 7] FIG. 7 is a schematic diagram showing an example in which the position evaluation device according to the embodiment provides the calculation result to a device in a process preceding the process in which the position evaluation device is used in the entire production line. [Figure 8] 8A and 8B are schematic diagrams showing an example in which the position evaluation device according to the embodiment provides the calculation results to an assembly robot, which is a device in a process subsequent to the process in which the position evaluation device is used, in the entire production line. DETAILED DESCRIPTION OF THE INVENTION

[0027] [Application example] An outline of an application example of the present invention will be described below with reference to some of the drawings. The present disclosure can be applied to methods such as those shown in Figures 2A to 2C and the conceptual diagram of Figure 3. The present disclosure can also be applied to a location evaluation device 1 such as that shown in Figure 4. By using the location evaluation device 1, it is possible to execute methods such as those shown in Figures 2A to 2C and the conceptual diagram of Figure 3.

[0028] 2A to 2C are conceptual diagrams illustrating a method for evaluating the position of each pin 2 attached to a substrate 4-1 relative to a reference position 5, to which the present disclosure is applicable. The pins 2 and reference positions 5 (substrate 4-1 is not shown) shown in FIGS. 2A to 2C are the same as those shown in FIGS. 1A and 1B, and therefore are denoted in FIGS. 2A to 2C with the same reference symbols as those shown in FIGS. 1A and 1B. Also in this application example, the pins 2 and connectors 3 are used as an example of a group of multiple components, and the pins 2 correspond to a first component group in the present disclosure, and the connectors 3 correspond to a second component group in the present disclosure. Here, the method for evaluating the position of each pin 2 and connector 3 relative to the reference position 5 is the same for both the pins 2 and connectors 3. Therefore, although the connectors 3 are not shown in FIGS. 2A to 2C, the pins 2 may be replaced with the connectors 3. The same applies to the following FIGS. 5A and B to 8A and B.

[0029] When evaluating the position of each pin 2 relative to the reference position 5 (hereinafter simply referred to as the "position of pin 2"; similarly, the connector 3 will be referred to as the "position of connector 3"), the amount and direction of deviation of the pin 2 position relative to the reference position 5 (hereinafter simply referred to as the "amount of deviation of pin 2" and the "direction of deviation of pin 2"; similarly, the connector 3 will be referred to as the "amount of deviation of connector 3" and the "direction of deviation of connector 3") are calculated, and then the absolute position is determined. Determining the absolute position means determining whether the pin 2 position is normal or abnormal based on whether the pin 2 position is within or on the circumference of a dimensional position range 6, which is a circular range centered on the reference position 5 and is defined for each reference position 5. Since the radii of the reference position 5 and the dimensional position range 6 are both predetermined, it is possible to determine whether the pin 2 position is within or on the circumference of the dimensional position range 6 based solely on the calculation result of the amount of deviation of pin 2, and therefore determine whether the pin 2 position is normal or abnormal. Furthermore, the reference positions 5 are located side by side on a straight line, and the distance between two adjacent reference positions 5 is equal.

[0030] After the absolute position is determined to be normal, the relative position is determined. Relative position determination involves determining whether the position of pin 2 is normal or abnormal based on whether the position of pin 2 is included within or on the periphery of relative position range 7, a rectangular range determined based on correlation. Since correlation is determined by the amount and direction of deviation of pin 2, if the position of pin 2 changes, the position of relative position range 7 also changes. Note that the range within relative position range 7 is assumed to be predetermined. Details of how to calculate relative position range 7 will be explained below in Figures 5A and 5B.

[0031] In this application example, the position of pin 2 is determined to be normal when it is included within both the dimensional position range 6 and the relative position range 7. Furthermore, as described above, since multiple pins 2 are grouped, if the position of at least one pin 2 is determined to be abnormal in both the absolute position determination and the relative position determination, then all pins 2 are considered to be abnormal.

[0032] Based on the above, in Fig. 2A, the position of pin 2 is determined to be normal in the absolute position judgment because it is included within dimensional position range 6, and the position of pin 2 is also determined to be normal in the relative position judgment because it is also included within relative position range 7, and as a result, pin 2 is judged to be a non-defective product. In Fig. 2B, the position of pin 2 is determined to be normal in the absolute position judgment, but the positions of pins 2-1 and 2-5 are included outside relative position range 7, and as a result, pin 2 is judged to be defective. In Fig. 2C, the position of pin 2-3 is included outside dimensional position range 6, and as a result, the position of pin 2 is determined to be abnormal in the absolute position judgment, and pin 2 is judged to be defective without even having to perform a relative position judgment.

[0033] 1A and 1B, in FIGS. 2A to 2C, the dimensional position range 6 is wider, so that it is easier to determine that the position of pin 2 is normal in the absolute position determination (in the conventional embodiment shown in FIGS. 1A and 1B, whether the position of pin 2 is normal or abnormal is determined by a method equivalent to the absolute position determination in this application example, and the dotted circle shown in FIGS. 1A and 1B corresponds to the dimensional position range 6), and by additionally performing a relative position determination, the accuracy of determining that the position of pin 2 is normal is improved.

[0034] Furthermore, in this application example, the fact that the position of pin 2 is determined to be normal in the relative position determination suggests that the correlation of the pin 2 position is equivalent, and by understanding the correlation, it becomes possible to install pin 2 in a position closer to reference position 5. For example, in FIG. 2A , the position of pin 2 is determined to be normal in the relative position determination, and the position of pin 2 is shifted overall to the upper right in the orientation of FIG. 2A with respect to reference position 5. Therefore, by moving the position of pin 2 overall to the lower left in the orientation of FIG. 2A , it becomes possible to install pin 2 in a position closer to reference position 5. Similarly, a correlation is also seen in FIG. 1B , and by moving the positions of pin 2 and connector 3 overall to the lower left in the orientation of FIG. 1B , it becomes possible to install pin 2 and connector 3 in a position closer to reference position 5.

[0035] FIG. 3 is a conceptual diagram for explaining a method for sorting pins 2 and connectors 3 based on the position of a judgment reference point 8 calculated from the positions of the pins 2 and connectors 3 relative to a reference position 5, to which the present disclosure is applicable. The amount and direction of deviation of each pin 2 are calculated, and when the positions of all pins 2 in a group are determined to be normal, the pins 2 that are good are sorted based on the tendency of the deviation direction of the pins 2 that are good (the OK display shown in FIG. 3 indicates that the pins 2 and connectors 3 are good). For example, if the tendency of the deviation direction of the pin 2 is to the upper right in the orientation of FIG. 3 relative to the reference position 5, the pin 2 is sorted into a category of "upper right deviation". Alternatively, the pins 2 that are good may be sorted based on the tendency of the deviation amount of the pins 2 that are good. Here, The deviation amount and deviation direction tendency of a certain pin 2 refer to the deviation amount and deviation direction of the judgment reference point 8 relative to the reference position 5, which can be calculated, for example, by averaging the positions of all pins 2 in the group. For example, a pin 2 whose deviation direction of the judgment reference point 8 calculated from the positions of all pins 2 in the group is upper right relative to the reference position 5 in the orientation shown in Figure 3 indicates that the deviation direction tendency of the pin 2 is upper right in the orientation shown in Figure 3, and is classified as "upper right deviation." Details of the calculation method of the judgment reference point 8 will be explained in Figures 5A and 5B below. The same classification method described above also applies to connectors 3.

[0036] As described above, by sorting each of the pins 2 and connectors 3 based on the amount and direction of deviation of the judgment reference point 8 from the reference position 5 calculated from the positions of the pins 2 and connectors 3 (only an example of the direction of deviation is shown in FIG. 3 ), pins 2 with similar correlations can be easily mated with connectors 3. For example, a pin 2 sorted into the "left-bottom deviation" category and a connector 3 sorted into the "left-bottom deviation" category are components with similar correlations, and these pins 2 and connectors 3 can be combined and easily mated. By combining components with similar correlations, it becomes easier to assemble products in the process after the above-described sorting (corresponding to S104 in FIG. 6 ), which can lead to an improvement in product yield.

[0037] 4 is a functional block diagram showing an example of a position evaluation device 1 to which the present disclosure can be applied. The position evaluation device 1 in this application example is configured to include a camera 10, a calculation unit 11, a determination unit 12, and the like.

[0038] The calculation unit 11 acquires an image captured by the camera 10, and calculates the amount and direction of deviation of the pins 2 and the connector 3 based on the positions of the pins 2 and the connector 3 in the captured image and the reference position 5. The calculation unit 11 also calculates a determination reference point 8 from the positions of the pins 2 and the connector 3, and further calculates a relative position range 7 using the determination reference point 8. Details will be explained below with reference to Figures 5A and 5B.

[0039] Based on the calculation results of the amount and direction of misalignment of the pin 2 and connector 3 calculated by the calculation unit 11, the determination unit 12 determines whether the pin 2 and connector 3 are good or bad by determining both the absolute position and the relative position as described above in FIGS. 2A to 2C (however, if the pin 2 and connector 3 are determined to be bad by the absolute position determination, the determination unit 12 does not perform the relative position determination). The determination unit 12 may also have a function to add an ID to a good pin 2 and connector 3 that allows the tendency of the amount and direction of misalignment of the pin 2 and connector 3 to be recognized. Details will be described in S102 shown in FIG. 6 below.

[0040] Components other than the calculation unit 11 and the determination unit 12 that configure the position evaluation device 1 shown in FIG. 4 will be described in the following examples.

[0041] [Example] Hereinafter, a manufacturing method for a product or a component and a position evaluation device 1 according to an embodiment of the present invention will be described in more detail with reference to drawings (including the drawings that have been explained in the above application examples). Note that the manufacturing method for a product or a component and the position evaluation device 1 according to the embodiment of the present disclosure are not intended to be limited to the following configurations.

[0042] <Device configuration> Now, let us return to the explanation of FIG. 4. The position evaluation device 1 according to the embodiment has the same configuration as the position evaluation device 1 explained in the application example, and therefore, detailed explanation of the contents explained in the application example will be omitted. Also, in this specification, the same components are designated by the same reference numerals. Give an explanation.

[0043] The storage unit 13 is, for example, a RAM disk, and stores the calculation results of the calculation unit 11 relating to the amount and direction of misalignment of the pins 2 and the connector 3, and information relating to the determination results of the determination unit 12. The communication unit 14 transmits the calculation results of the calculation unit 11 relating to the amount and direction of misalignment of the pins 2 and the connector 3, and information relating to the determination results of the determination unit 12, to devices other than the position evaluation device 1. By including the storage unit 13 and the communication unit 14, the position evaluation device 1 can share the calculation results of the amount and direction of misalignment of the pins 2 and the connector 3, and information relating to the determination results of the determination unit 12, with devices other than the position evaluation device 1. Details will be described below with reference to FIG. 7 and FIGS. 8A and 8B.

[0044] The PC 15 is configured with input devices, such as a keyboard and a mouse, for inputting information to a control device (not shown), and a display for displaying the judgment results, acquired from the judgment unit 12, of whether the positions of the pins 2 and connectors 3 are normal or abnormal (including the judgment results of whether the pins 2 and connectors 3 are pass / fail). The PC 15 may be one of the components constituting the position evaluation device 1, or may be a portable external device independent of the position evaluation device 1 and capable of communicating with the judgment unit 12. In addition to the judgment results, the PC 15 can also display the image captured by the camera 10, the amount and direction of misalignment of the pins 2 and connectors 3, etc. For example, while the pins 2 and connectors 3, reference position 5, relative position range 7, and judgment reference point 8 shown in FIG. 3 are merely conceptual diagrams, this conceptual diagram may be geometrically visualized on the PC 15. This facilitates manual sorting of the pins 2 and connectors 3 by an operator.

[0045] The PC 15 may be configured with the storage unit 13 and the communication unit 14, and the PC 15 may include the functions of the storage unit 13 and the communication unit 14. The camera 10 may be independent of the position evaluation device 1, and the calculation unit 11 may have a function of capturing an image from the camera 10 (or a camera other than the camera 10) that is independent of the position evaluation device 1. The processing unit 13 may also be independent of the position evaluation device 1.

[0046] <Product or component manufacturing method> Fig. 5A is a conceptual diagram for explaining a method for calculating a judgment reference point 8 from the position of a pin 2 according to an embodiment. Note that in Figs. 2A to 2C, five reference positions 5 and five dimensional position ranges 6, the same number as the number of pins 2, are illustrated for each pin 2, but when displayed on a PC 15, for example, the five reference positions 5 and five dimensional position ranges 6 may be geometrically displayed as one reference position 5 and one dimensional position range 6, as illustrated in Figs. 5A and 5B.

[0047] In FIG. 5A , the reference point 8 is calculated based on the difference between the position of each pin 2 and the reference position 5. For example, the difference between the position of pin 2-2 and the reference position 5 represents the horizontal vector v1 and the vertical vector v2 between pin 2-2 and the reference position 5 in the orientation of FIG. 5A . In this case, if we apply a Cartesian coordinate system and set the reference position 5 as the origin, the coordinates of the position of pin 2-2 can be expressed as (v1, v2). Although not shown in FIG. 5A , the horizontal and vertical distances between pins 2 other than pin 2-2 and the reference position 5 in the orientation of FIG. 5A are also calculated in a similar manner. In this way, five types of horizontal and vertical vectors in the orientation of FIG. 5A are calculated, and at least one of the average, weighted average, median, mode, and minimum of the five vectors is calculated. The vector obtained in this manner indicates the position of the reference point 8 relative to the reference position 5. This allows the reference point 8 to be uniquely calculated from the position of each pin 2.

[0048] FIG. 5B shows the relative position range 7 calculated from the reference point 8 calculated by the method shown in FIG. 5A. 5A and 5B are conceptual diagrams illustrating a method for calculating the relative position range 7. The relative position range 7 is a rectangular range with the center of gravity at the reference point 8, whose four sides have lengths of a predetermined standard value. Therefore, the relative position range 7 can be uniquely calculated from the reference point 8. As described above, the position of each pin 2 can be evaluated using this relative position range 7. Here, the shape of the relative position range 7 is not limited to a rectangle, and it may be, for example, a circle. Note that, in the connector 3 as well, the relative position range 7 and the reference point 8 can each be uniquely calculated using the method shown in FIGS. 5A and 5B above, as in the case of the pin 2.

[0049] FIG. 6 is a conceptual diagram illustrating the steps of a manufacturing method for a product or component using a position evaluation device 1 according to an embodiment. In FIG. 6, first, a determination unit 12 determines whether the position of pin 2 (illustrated in FIG. 6 but not labeled) is normal or abnormal using the relative position range 7 and the dimensional position range 6 calculated by the calculation method shown in FIGS. 5A and 5B above. If the determination unit 12 determines that the position of pin 2 is normal (S101), the determination unit 12 adds an ID on the board 4-1 that allows identification of the amount of misalignment of pin 2 and the tendency of the misalignment direction (S102). In the embodiment shown in FIG. 6, since the misalignment direction of the determination reference point 8 is to the upper right relative to the reference position 5 in the orientation shown in FIG. 6, the determination unit 12 adds an ID indicating that the tendency of the misalignment direction of pin 2 is to the upper right in the orientation shown in FIG. 6. Examples of the ID include a two-dimensional code, a barcode, a graphic, and printed characters. Next, based on the IDs attached to the board 4-1, the worker sorts the pins 2 based on the positions of the judgment reference points 8 relative to the reference position 5, as described above with reference to FIG. 3 (S103). If the IDs are, for example, two-dimensional codes or barcodes, the worker can read the IDs with a reader to determine the positions of the judgment reference points 8 relative to the reference position 5 and sort the pins 2. If the IDs are, for example, graphics or printed characters, the worker can visually determine the positions of the judgment reference points 8 relative to the reference position 5 and sort the pins 2. The pins 2 may also be sorted by referring to the display content of the PC 15 (e.g., a list linking the IDs with the tendency of the misalignment direction of the pins 2). A magazine rack capable of storing the boards 4-1 may be used as a sorting means. While this embodiment illustrates an example in which the worker performs the sorting manually, automatic sorting may also be performed by a machine. The steps from S101 to S103 can also be applied to the connector 3, as in the case of the pins 2.

[0050] 3, based on the tendency of the amount and direction of misalignment of the sorted pins 2 and connectors 3, pins 2 and connectors 3 with similar correlations are combined, and the pins 2 are fitted into the connectors 3, thereby assembling the product (S104). The assembly may be performed automatically, for example, using an assembly robot 9.

[0051] If the determining unit 12 determines in S101 that the positions of the pins 2 and connectors 3 are abnormal, the mounting positions and dimensions of the pins 2 and connectors 3 on the substrate 4 may be adjusted in an apparatus in a process preceding the process using the position evaluation device 1, as shown in Fig. 7 below. This allows the positions of the subsequent pins 2 and connectors 3 in the production line to be improved so that they become normal.

[0052] FIG. 7 is a schematic diagram showing an example in which the position evaluation device 1 according to the embodiment provides the calculation results to a device in a process preceding the process in which the position evaluation device 1 is used in the entire production line. An example of the preceding process is an assembly process in which the pin 2 and the connector 3 are attached to the board 4 for assembly. The communication unit 14 in the position evaluation device 1 can share information related to the evaluation of the positions of the pin 2 and the connector 3 with the device in the assembly process. To explain this in more detail using pin 2, when the judgment unit 12 judges that the position of pin 2 is abnormal, the communication unit 14 feeds back to the preceding process a message to that effect (for example, a message stating "NG"), the amount and direction of deviation of the position of pin 2 from the judgment reference point 8, or the direction of correction of the position of pin 2 (arrows pointing from pins 2-1 and 2-5 to the judgment reference point 8 in FIG. 7). Based on the feedback result, the above-mentioned Therefore, the mounting process device may adjust the mounting positions and dimensions of the pins 2 and connectors 3 on the board 4. This improves the mounting accuracy in the mounting process, contributing to an increase in yield. The assembly robot 9 shown in FIG. 6 is a device for a process subsequent to the process using the position evaluation device 1. Details will be explained in the following FIGS. 8A and 8B.

[0053] 8A and 8B are schematic diagrams illustrating an example in which a position evaluation device 1 according to an embodiment provides calculation results to an assembly robot 9, which is a device in a process downstream of the process using the position evaluation device 1, in the entire production line. Information related to the evaluation of the positions of the pin 2 and the connector 3 can be shared with the assembly robot 9 by the storage unit 13 and the communication unit 14 in the position evaluation device 1. Specifically, in the embodiment shown in FIG. 8A , when the determination unit 12 determines that the position of the pin 2 is normal, the storage unit 13 acquires a message to that effect (e.g., a display of "OK"), as well as the amount and direction of deviation of the position of the pin 2 from the determination reference point 8, and the assembly robot 9 reads the results stored in the storage unit 13. In the embodiment shown in FIG. 8B , when the determination unit 12 determines that the position of the pin 2 is normal, the communication unit 14 acquires the same information and transmits the information to the assembly robot 9.

[0054] 8A and 8B, after the position evaluation device 1 provides the calculation results to the assembly robot 9, the assembly robot 9 assembles the product by combining the boards 4-1 and 4-2 in accordance with predetermined conditions for assembling. The conditions for assembling mean, for example, that the distance from the reference position 5 of the judgment reference point 8 is equal to or less than a predetermined threshold (i.e., the reference position 5 is located near the judgment reference point 8, and the deviation of the reference position 5 from the judgment reference point 8 is as small as possible). This improves the efficiency of the product assembly work and contributes to improving the product shipping rate.

[0055] <Appendix 1> A method for manufacturing a product or component by combining a first group of parts (2) and a second group of parts (3), which are made up of a plurality of parts, Calculating the positional deviations of the components of the first component group and the second component group relative to a reference position (5); Using a dimension position range (6) determined based on the reference position and a relative position range (7) between the plurality of components determined based on the deviation of the positions of the plurality of components from the reference position, determining that the first component group and the second component group are non-defective when the positions of the components in the first component group and the second component group are within the dimensional position range and the relative position range; A method for manufacturing a product or component, characterized in that a product or component is assembled by combining the first group of components and the second group of components that have been determined to be non-defective and that meet predetermined assembly conditions.

[0056] <Appendix 2> A position evaluation device (1) that evaluates the mounting position of a group of components (2, 3) consisting of a plurality of components and provides the evaluation results, a calculation unit (11) that calculates a positional deviation of a component of the component group relative to a reference position (5); Using a dimension position range (6) determined based on the reference position and a relative position range (7) between the plurality of components determined based on the deviations of the plurality of components from the reference position, The positions of the components in the group of components are included in the dimensional position range, and a determination unit (12) that determines the group of components as non-defective when the relative positions of the components are within the relative position range; The position evaluation device (1) is characterized in that the judgment unit assigns an ID that allows the tendency of the deviation to be recognized to the group of parts that have been judged to be non-defective. [Explanation of symbols]

[0057] 1: Position evaluation device 10: Camera 11: Calculation section 12: Judgment section 13: Storage section 14: Communications Department 15: PC 2: Pin 3: Connector 4: Substrate 5: Reference position 6: Dimension position range 7: Relative position range 8: Judgment reference point 9: Assembly robot

Claims

1. A method for manufacturing a product or component by combining a first group of components made up of a plurality of components with a second group of components, calculating positional deviations of the components of the first component group and the second component group relative to reference positions; using a dimension position range determined based on the reference position and a relative position range between the plurality of components determined based on the deviation of the positions of the plurality of components from the reference position, determining that the first component group and the second component group are non-defective when the positions of the components in the first component group and the second component group are within the dimensional position range and the relative position range; A method for manufacturing a product or component, characterized in that a product or component is assembled by combining the first group of components and the second group of components that have been determined to be non-defective and that meet predetermined assembly conditions.

2. The method for manufacturing a product or component according to claim 1 , wherein the first group of components and the second group of components determined to be non-defective are sorted into a plurality of groups based on the deviation.

3. a combination of groups that can be assembled with each other among a plurality of groups into which the first group of components determined to be non-defective is sorted and a plurality of groups into which the second group of components determined to be non-defective is sorted is determined in advance; 3. The method for manufacturing a product or component according to claim 2, wherein the condition for assembling is that the first group of parts determined to be non-defective and the second group of parts determined to be non-defective are each sorted into groups that can be assembled with each other.

4. 2. The method for manufacturing a product or component according to claim 1, further comprising the step of adding an ID that allows the tendency of the deviation to be recognized to the first group of components and the second group of components that have been determined to be non-defective.

5. 2. The method for manufacturing a product or component as described in claim 1, characterized in that the condition for assembly is that the distance between a judgment reference point determined based on the positions of the parts of the first group of parts and a judgment reference point determined based on the positions of the parts of the second group of parts is equal to or less than a predetermined threshold value.

6. 2. The method for manufacturing a product or component according to claim 1, wherein, when the first group of components or the second group of components is determined to be defective, this fact and the calculation results relating to the deviation are provided to a device in a previous process, and the device in the previous process is capable of adjusting the positions of the components in the first group of components and the components in the second group of components based on the calculation results.

7. 2. The method for manufacturing a product or component according to claim 1, wherein, when the first group of components or the second group of components is determined to be a non-defective product, this fact and the calculation results relating to the deviation are provided to a downstream process device, and the downstream process device assembles the product or component based on the calculation results.

8. A position evaluation device that evaluates the mounting positions of a component group consisting of a plurality of components and provides the evaluation results, a calculation unit that calculates a positional deviation of a component in the component group relative to a reference position; using a dimension position range determined based on the reference position and a relative position range between the plurality of components determined based on the deviations of the plurality of components from the reference position, a determination unit that determines the group of components as non-defective when the positions of the components in the group of components are within the dimensional position range and the relative positions of the components in the group of components are within the relative position range, The position evaluation device is characterized in that the judgment unit assigns an ID that allows the tendency of the deviation to be recognized to the group of parts that have been judged to be non-defective.

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