Ceramic chip removal device

Abstract

To provide a ceramic debris removal device which can easily remove ceramic debris being a residue of a ceramic green sheet, from a surface of a support film.SOLUTION: A ceramic debris removal device (100) is provided, comprising: a transportation mechanism (20) transporting a film (1) comprised of a support film (3) and ceramic debris (7) being a residue of a ceramic green sheet attached to a surface of the support film (3); and a peeling mechanism (40) peeling off the ceramic debris (7) from the support film (3). The peeling mechanism (40) includes: a medium tank (41) stored with a medium (43); and an ultrasonic element (45) applying ultrasonic waves to the medium (43) and oscillating the medium (43). The film (1) passes through the medium tank (41).SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a ceramic debris removal device. [Background technology]

[0002] A known method for manufacturing electronic components such as multilayer ceramic capacitors involves stacking ceramic green sheets, which are made by forming unfired ceramic material into sheets, press-molding them, and then firing and dividing them into individual pieces, thereby mass-producing small electronic components at once.

[0003] To improve ease of handling, ceramic green sheets are usually formed on the surface of a resin film (also called a support film) that serves as a support, and are peeled off from the surface of the support film when used. When peeling the ceramic green sheet from the support film, part of the ceramic green sheet may remain on the surface of the support film. In order to recycle such a support film, a process of cleaning (removing) the ceramic dust, which is the residue of the ceramic green sheet, is required.

[0004] For example, Patent Document 1 discloses a method for recycling a release film that includes a film cleaning step of bringing a first adhesive roll into contact with a resin film and causing any adhering matter on the resin film to adhere to the first adhesive roll. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-005597 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in recent years, ceramic green sheets have become thinner as electronic components become smaller in size. As the ceramic green sheet becomes thinner, its handling becomes worse. To prevent this, the holding force between the ceramic green sheet and the support film may be increased.

[0007] Therefore, in the method described in Patent Document 1, the holding force between the ceramic green sheet and the support film is strong, and there are cases where the ceramic chips remaining from the ceramic green sheet cannot be completely removed.

[0008] The present invention has been made to solve the above problems, and has an object to provide a ceramic chip removal device that can easily remove ceramic chips, which are residues of ceramic green sheets, from the surface of a support film. [Means for solving the problem]

[0009] The ceramic chip removal device of the present invention comprises a conveying mechanism for conveying a film consisting of a support film and ceramic chips, which are residues of ceramic green sheets adhered to the surface of the support film, and a peeling mechanism for peeling the ceramic chips from the support film, wherein the peeling mechanism has a media tank in which media is stored and an ultrasonic element that applies ultrasonic waves to the media to vibrate the media, and is configured so that the film passes through the media tank. [Effects of the Invention]

[0010] According to the present invention, ceramic chips, which are residues of the ceramic green sheets, can be easily removed from the surface of the support film. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view schematically showing an example of a film from which ceramic chips are removed by the ceramic chip removing device of the present invention. [Figure 2]FIG. 2 is a cross-sectional view schematically showing an example of a ceramic chip removing device according to the present invention. [Figure 3] FIG. 3 is a partially enlarged view of the peeling mechanism and its surroundings in FIG. [Figure 4] FIG. 4 is a cross-sectional view schematically showing another example of the peeling mechanism. DETAILED DESCRIPTION OF THE INVENTION

[0012] The ceramic chip removal device of the present invention will be described below. However, the present invention is not limited to the following configuration, and can be appropriately modified and applied within the scope that does not change the gist of the present invention. Note that a combination of two or more of the individual desirable configurations of the present invention described below also constitutes the present invention.

[0013] In this specification, terms indicating the relationship between elements (e.g., "opposite," "orthogonal," etc.) and terms indicating the shape of elements (e.g., "rectangular," etc.) are not expressions that express only a strict meaning, but are expressions that include a substantially equal range, for example, a difference of a few percent.

[0014] The drawings shown below are schematic diagrams, and the dimensions, aspect ratios, and other scales may differ from those of the actual product.

[0015] [Ceramic chip removal device] The ceramic chip removal device of the present invention comprises a conveying mechanism for conveying a film consisting of a support film and ceramic chips, which are residues of ceramic green sheets adhered to the surface of the support film, and a peeling mechanism for peeling the ceramic chips from the support film, wherein the peeling mechanism has a media tank in which media is stored and an ultrasonic element that applies ultrasonic waves to the media to vibrate the media, and is configured so that the film passes through the media tank.

[0016] FIG. 1 is a perspective view schematically showing an example of a film from which ceramic chips are removed by the ceramic chip removing device of the present invention. The film 1 shown in FIG. 1 is composed of a support film 3 and ceramic scraps 7, which are residues of ceramic green sheets attached to the surface of the support film 3.

[0017] The support film 3 has a sheet shape with an upper surface 3a and a lower surface 3b facing each other, and the ceramic chips 7 are attached to the upper surface 3a of the support film 3.

[0018] The film 1 is in a state after a ceramic green sheet of a predetermined shape has been cut out from a laminated sheet formed by laminating a support film 3 and a ceramic green sheet and peeled off. A portion of the ceramic green sheet laminated on the surface of the support film 3 is cut out for use, and the portion not cut out remains on the surface of the support film. This is the unpeeled ceramic green sheet 5 shown in FIG.

[0019] Furthermore, even when the ceramic green sheet laminated on the surface of the support film 3 is peeled off, the ceramic green sheet may not be completely peeled off. In such cases, small pieces of the ceramic green sheet (pieces that were not peeled off) remain on the surface of the support film after the ceramic green sheet is peeled off. This is the peeled residue 6 of the ceramic green sheet shown in FIG.

[0020] As a result, the ceramic green sheets 5 that were not peeled off and the peeled residues 6 of the ceramic green sheets are attached to the surface 3 a of the film 1 as ceramic chips 7 .

[0021] The ceramic chip removal device of the present invention is a device for removing ceramic chips from the above-mentioned film.

[0022] FIG. 2 is a cross-sectional view schematically showing an example of a ceramic chip removing device according to the present invention. The ceramic chip removing device 100 shown in FIG. 2 includes a conveying mechanism 20 and a peeling mechanism 40.

[0023] The transport mechanism 20 is a mechanism for transporting the film 1. The conveying mechanism 20 includes a conveying roll 21 that conveys the film 1, a dancer roll 23 that adjusts the tension of the film 1 being conveyed, a suction roll 25 that prevents the transmission of tension, and a conveying roll 27 that moves the film 1 within the media tank 41 described below. 2 indicates the direction in which the film 1 is transported, and the thin double-headed arrow indicates that the dancer roll 23 can move up and down.

[0024] Film 1 is unwound from unwinding mechanism 50 relative to transport mechanism 20.

[0025] The peeling mechanism 40 is a mechanism for peeling the ceramic chips from the support film. The peeling mechanism 40 shown in FIG. 2 includes a media tank 41, a media 43 stored in the media tank 41, and an ultrasonic element 45.

[0026] The media 43 is vibrated by ultrasonic waves generated by the ultrasonic elements 45, and the film 1 is passed through the media tank 41 using the transport rolls 27. This allows the ceramic scraps 7 to be peeled off and removed from the surface of the support film 3 that constitutes the film 1.

[0027] The ceramic chips 7 peeled off from the surface of the support film 3 are collected by a dust collecting mechanism 70 .

[0028] The dust collection mechanism 70 comprises a suction nozzle 71 for sucking the peeled ceramic chips 7, a chip reservoir 75 for storing the ceramic chips 7, and a suction hose 73 for connecting the suction nozzle 71 and the chip reservoir 75.

[0029] The film 1 (support film 3) from which the ceramic scraps 7 have been peeled off by the peeling mechanism 40 is taken up by the winding mechanism 60.

[0030] Although not shown, the ceramic chip removal device 100 may have a housing in which the conveying mechanism 20, peeling mechanism 40, unwinding mechanism 50, winding mechanism 60, and dust collection mechanism 70 are arranged.

[0031] Each mechanism constituting the ceramic chip removing device of the present invention will be described below.

[0032] (Transport mechanism) The transport mechanism is a mechanism for transporting the film. The transport mechanism may be, for example, a transport roll that feeds the film by rotation.

[0033] In addition to the transport rolls, the transport mechanism may also include a dancer roll for adjusting the tension of the film during transport, a suction roll for preventing the tension from being transmitted upstream, and a transport roll for moving the film within the media tank.

[0034] The speed at which the film is transported by the transport mechanism (transport speed) is not particularly limited, but is preferably 100 m / min or more.

[0035] The ceramic chip removing device of the present invention may be provided with an unwinding mechanism and a winding mechanism. The unwinding mechanism is a mechanism that unwinds the film from the transport mechanism. The winding mechanism is a mechanism that winds up the film (support film) after the ceramic debris has been removed.

[0036] The unwinding mechanism may be configured to be freely rotatable, in which case the film is transported by the transport mechanism, causing the unwinding mechanism to rotate freely and unwind the film.

[0037] (peeling mechanism) The peeling mechanism is a mechanism for peeling off the ceramic chips that make up the film from the support film. The peeling mechanism includes a medium, a medium tank in which the medium is stored, and an ultrasonic element that applies ultrasonic waves to the medium to vibrate the medium. When the film passes through the media tank, ultrasonic waves are applied, causing the ceramic chips to collide with the vibrating media, resulting in the ceramic chips being peeled off from the surface of the support film.

[0038] An example of the peeling mechanism will be described with reference to FIG. FIG. 3 is a partially enlarged view of the peeling mechanism and its surroundings in FIG. The peeling mechanism 40 shown in FIG. 3 includes a media tank 41 , a medium 43 stored in the media tank 41 , and an ultrasonic element 45 , and the film 1 passes through the media tank 41 .

[0039] Since media 43 are stored in the media tank 41 , when the film 1 passes through the media tank 41 , the ceramic scraps 7 that make up the film 1 come into contact with the media 43 .

[0040] Ultrasonic waves are applied to the medium 43 by an ultrasonic element 45 . The media 43 stored in the media tank 41 is vibrated by ultrasonic waves applied by the ultrasonic element 45.

[0041] 3 shows a schematic diagram of the vibration of the medium 43 to which ultrasonic waves are applied by the ultrasonic elements 45. How the medium actually vibrates at which positions varies depending on the number of ultrasonic elements, their positions, and the state of superposition of the ultrasonic waves.

[0042] When the ceramic scraps 7 collide with the vibrating media 43 , the vibration is transmitted to the ceramic scraps 7 , and the ceramic scraps 7 can be peeled off from the surface of the support film 3 .

[0043] The longer the vibrating media 43 is in contact with the ceramic scraps 7, the stronger the effect of peeling off the ceramic scraps 7. Therefore, the longer the distance (time) traveled within the media tank 41, the longer the time the film 1 is in contact with the vibrating media 43, and the more the ceramic scraps 7 are peeled off. Then, before the support film 3 has finished passing through the media tank 41, the ceramic debris 7 is completely removed from the surface of the support film 3.

[0044] As shown in FIG. 3, it is preferable that the film 1 enters the media tank 41 so that the support film 3 constituting the film 1 is on the upper side and the ceramic scraps 7 are on the lower side. When the orientation of the film 1 is as described above, the transport roll 27 and the support film 3 come into contact, and even while the transport roll 27 and the film 1 are in contact, the ceramic scraps 7 come into contact with the vibrating media 43, which makes it easier for the ceramic scraps 7 to peel off. That is, it is preferable that the surface of the support film 3 that does not come into contact with the transport roll 27 is the surface to which the ceramic chips 7 are attached.

[0045] The ceramic scraps 7 peeled off from the surface of the support film 3 are lighter than the media 43, and so are moved by the vibration from the outside in the width direction of the support film 3 to the surface portion of the media tank 41. The ceramic scraps 7 that have moved to the surface portion of the media tank 41 are then collected by the dust collection mechanism 70.

[0046] The inner width of the media tank 41 (the width of the portion storing the media 43) is preferably larger than the width of the film 1. If the inner width of the media tank 41 is greater than the width of the film 1, a gap will be formed between the widthwise edge of the film 1 and the media tank 41. This gap allows the ceramic chips 7 that have peeled off from the underside of the film 1 to easily move to the surface of the media tank 41, making it easier for the dust collection mechanism 70 to collect the peeled ceramic chips 7.

[0047] The speed at which the film passes through the media tank is preferably 100 m / min or more.

[0048] (media) The media is stored in a media tank.

[0049] The material constituting the medium is not particularly limited, but examples thereof include metal, ceramic, and resin.

[0050] Media made of metal are also called metal media.

[0051] The media is preferably a metal media made of metal.

[0052] An example of the metal constituting the media is tungsten. When the media is made of metal, the density of the media is high, and therefore, even with media of the same size, it is easy to impart to the ceramic scraps the energy required to peel them off.

[0053] When the media contains tungsten, the media may be composed of metallic tungsten or a compound containing tungsten, such as tungsten carbide.

[0054] When the material constituting the media is resin, the media is also called resin media.

[0055] The media is preferably a resin media made of resin.

[0056] The resin constituting the medium is preferably the same type of resin as the resin constituting the support film. In this case, even if part of the media adheres to the support film, it does not become a contaminant.

[0057] Media made of ceramic material are also called ceramic media.

[0058] The media may be ceramic media. If the media is made of ceramic, the media is less likely to wear out, and therefore it is possible to avoid the inclusion of impurities.

[0059] The shape of the media is not particularly limited, but it is preferable that the cross section has an equivalent circle diameter of 0.2 mm to 5 mm. If the equivalent circular diameter of the cross section of the media is less than 0.2 mm, the kinetic energy obtained by the ultrasonic waves is small and the ceramic chips may not be sufficiently peeled off. If the equivalent circular diameter of the cross section of the media is more than 5 mm, the gaps between the media become large and it may be difficult to make the media collide with the ceramic chips.

[0060] The media preferably has a shape with irregular protrusions on its surface. If the media has irregular protrusions on its surface, it is more likely to separate the ceramic chips when it collides with them.

[0061] (Media tank) The media tank is a container for storing media. The media tank may be configured so that the film can pass through the media tank.

[0062] The media tank may have an open top and closed sides and bottom, for example, so that the media stored in the media tank is exposed to the top of the media tank. The part where the media is exposed is also called the surface of the media tank.

[0063] In the case of a media tank having the above shape, the film enters the media tank from the top surface of the media tank, changes its moving direction within the media tank, and then moves out of the media tank again from the top surface of the media tank. As the film moves through the media tank, the ceramic chips collide with the vibrated media, causing the ceramic chips to peel off from the surface of the support film.

[0064] A transport mechanism such as transport rolls may be disposed in the media tank as needed. By disposing a transport mechanism such as transport rolls inside the media tank, the traveling direction of the film can be changed inside the media tank. As shown in Figure 3, the transport rolls arranged inside the media tank allow the film 1 to be moved into the media tank 41 from the top surface of the media tank 41, the direction of movement within the media tank 41 to be changed, and the film 1 to be moved out of the media tank 41 from the top surface of the media tank 41 again.

[0065] A suction nozzle for sucking ceramic chips from inside the media tank is preferably provided near the top surface of the media tank.

[0066] Ceramic chips that have separated from the film in the media tank are moved to the vicinity of the upper surface of the media tank by the vibration. Therefore, by providing a suction nozzle near the upper layer of the media tank, it is possible to collect ceramic chips generated inside the media tank.

[0067] If ceramic chips that have peeled off from the film are present in an excessive amount in the media tank, the ceramic chips that have peeled off may re-adhere to the surface of the support film. The occurrence of the above problem can be prevented by using a suction nozzle to collect ceramic debris from inside the media tank.

[0068] The media tank may be provided with a groove, hole, or the like in which the ultrasonic element can be placed.

[0069] (ultrasonic element) The ultrasonic element is an element that generates ultrasonic waves. The generated ultrasonic waves vibrate the media.

[0070] The vibration frequency of the ultrasonic waves is preferably 20 kHz or more and 40 kHz or less, more preferably 25 kHz or more and 30 kHz or less, and even more preferably 28 kHz.

[0071] The ultrasonic element may be, for example, a bolt-clamped Langevin transducer (BL transducer).

[0072] The ultrasonic element may be disposed either outside or inside the media tank. The ultrasonic element may apply ultrasonic waves to the media via the media tank, or may apply ultrasonic waves directly to the media.

[0073] A horn (ultrasonic horn) may be provided at the tip of the ultrasonic element. If a horn is provided at the tip of the ultrasonic element, the amplitude of the ultrasonic waves can be increased, and the ultrasonic waves can be applied directly to the medium by the horn.

[0074] A plurality of ultrasonic elements may be provided. By arranging multiple ultrasonic elements in the media tank, the ultrasonic waves generated by each of the multiple ultrasonic elements can be superimposed to vibrate only the media at a predetermined position in the media tank.

[0075] In other words, in the ceramic chip removal device of the present invention, it is preferable that multiple ultrasonic elements are arranged in the media tank, and that the ultrasonic waves generated by the multiple ultrasonic elements are superimposed to vibrate only the media at a predetermined position in the media tank.

[0076] An example of a peeling mechanism using multiple ultrasonic elements will be described with reference to FIG. FIG. 4 is a cross-sectional view schematically showing another example of the peeling mechanism.

[0077] The media tank 41 shown in FIG. 4 is made up of a first side surface 41a, a second side surface 41b, a third side surface 41c, a fourth side surface 41d, and a bottom surface 41e. A total of 15 ultrasonic elements 45 are arranged in 3 rows and 5 columns on the first side surface 41a of the media tank 41. Similarly, a total of 9 ultrasonic elements 45 are arranged in 3 rows and 3 columns on the second side surface 41b of the media tank 41.

[0078] For example, when ultrasonic waves are emitted simultaneously from ultrasonic element 45 arranged at position C on first side surface 41a and ultrasonic elements 45 arranged at positions F and H on second side surface 41b, stronger ultrasonic waves than usual are applied to medium 43 in the area where the ultrasonic waves emitted from ultrasonic element 45 arranged at position C and the ultrasonic waves emitted from ultrasonic elements 45 arranged at positions F and H overlap.

[0079] Here, by adjusting the power input to each ultrasonic element 45, the medium 43 does not vibrate with the ultrasonic waves emitted from a single ultrasonic element 45, but the medium 43 can be configured to vibrate in the area where the ultrasonic waves overlap (the area where they resonate). By adopting this configuration, it is possible to vibrate only the media in a specified area by superimposing ultrasonic waves, so that the vibrating media can collide only with a specific area of ​​the film, thereby efficiently removing ceramic debris.

[0080] Furthermore, for example, by generating ultrasonic waves from ultrasonic elements 45 arranged at positions A, B, C, D, and E among the multiple ultrasonic elements arranged on the first side surface 41a in this order with a time lag, it is possible to cause the vibrating media 43 to continuously collide with the "same location" on the film 1 moving inside the media tank 41. This allows for efficient removal of ceramic debris.

[0081] (support film) The support film constituting the film suitable for use in the ceramic chip removal device of the present invention will now be described.

[0082] As the support film constituting the film, a conventionally known film can be suitably used. The support film may be, for example, a multilayer film in which a release layer is formed on one surface of a base film that serves as a base layer, and a backing resin layer is formed on the other surface.

[0083] Examples of resins that can be used to form the substrate layer include polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polysulfone, polyether ether ketone, polyether sulfone, polyphenylene sulfide, polyetherimide, polyimide, polyamide, and acrylic resins. Among these, polyester is preferred from the viewpoints of ease of processing, durability, heat resistance, cost, etc., and polyethylene terephthalate is particularly preferred.

[0084] In addition to the above resin, a filler may be added to the base layer.

[0085] The substrate film constituting the substrate layer may be a non-stretched film, but is preferably a uniaxially or biaxially stretched film.

[0086] The release layer can be formed, for example, by applying a composition for forming a release layer to one surface of the substrate film, and then heating and curing the composition.

[0087] The back resin layer can be formed, for example, by applying a composition for forming a back resin layer to the other main surface of the substrate film, and then heating and curing the composition.

[0088] The width of the support film is not particularly limited, but is preferably, for example, 100 mm or more and 200 mm or less.

[0089] (ceramic scrap) The ceramic chips that make up the film suitable for use in the ceramic chip removal device of the present invention will now be described.

[0090] The ceramic scraps are residues of the ceramic green sheets that were placed on the surface of the support film. The ceramic green sheet is obtained by coating a slurry made by mixing a ceramic material such as barium titanate and an organic binder with a plasticizer and an organic solvent on the surface of a support film and drying the mixture.

[0091] The ceramic green sheet is handled together with a support film, and then a ceramic green sheet of a predetermined shape is cut out from the support film and peeled off, and used to manufacture electronic components. The ceramic green sheet that was not peeled off from the support film and the fine fragments (peeling residue) of the ceramic green sheet that remain on the surface of the support film after peeling become ceramic waste.

[0092] As described above, the ceramic scraps are residues of the ceramic green sheets remaining on the support film, and therefore the composition of the ceramic scraps is the same as that of the ceramic green sheets.

[0093] Examples of ceramic materials include barium titanate.

[0094] A metal paste that will become an internal electrode may be printed on the surface of the ceramic green sheet, so the ceramic waste may contain residue of the metal paste.

[0095] The ceramic chip removal device of the present invention is preferably applied to a film having ceramic chips attached thereto, the thickness of which is 3 μm or less. Ceramic green sheets are becoming thinner as electronic components become smaller, and ceramic green sheets with a thickness of 3 μm or less are sometimes used. When the thickness of a ceramic green sheet is 3 μm or less, it becomes necessary to increase the holding force between the ceramic green sheet and the support film to improve the handleability of the ceramic green sheet. In this case, it may become difficult to peel the ceramic chips from the support film. The ceramic chip removal device of the present invention can improve the peelability of the ceramic chips, and therefore can be suitably applied to films in which ceramic chips with a thickness of 3 μm or less are strongly adhered to the support film.

[0096] This specification describes the following:

[0097] The present disclosure (1) provides a conveying mechanism for conveying a film made of a support film and ceramic chips, which are residues of ceramic green sheets attached to the surface of the support film; a peeling mechanism that peels the ceramic scraps from the support film, The peeling mechanism includes a media tank in which media is stored, and an ultrasonic element that applies ultrasonic waves to the media to vibrate the media, The ceramic debris removal device is characterized in that the film is configured to pass through the media tank.

[0098] The present disclosure (2) is the ceramic chip removal device according to the present disclosure (1), in which a suction nozzle for sucking the ceramic chips in the media tank is provided near the surface of the media tank.

[0099] The present disclosure (3) is the ceramic chip removal device according to the present disclosure (1) or (2), in which the frequency of the ultrasonic waves generated by the ultrasonic element is 20 kHz or more and 40 kHz or less.

[0100] The present disclosure (4) is a method for removing a peeling mechanism, the peeling mechanism having a plurality of the ultrasonic elements, This ceramic chip removal device is configured to vibrate only the media at a predetermined position in the media tank by superimposing ultrasonic waves generated by each of the multiple ultrasonic elements, and is any combination with any of the present disclosures (1) to (3).

[0101] The present disclosure (5) is a ceramic chip removal device in any combination with any of the present disclosures (1) to (4), in which the media is a resin media made of resin.

[0102] The present disclosure (6) is a ceramic chip removal device in any combination with any of the present disclosures (1) to (4), in which the media is a metal media made of metal. [Explanation of symbols]

[0103] 1 film 3 Support film 3a Surface of the support film (top surface) 3b Surface (bottom) of support film 5 Ceramic green sheet that was not peeled off 6. Ceramic green sheet peeling residue 7. Ceramic waste 20 Transport mechanism 21 Transport roll 23 Dancer Roll 25 Suction Roll 27 Transport roll 40 Peeling Mechanism 41 Media tank 41a First side of media tank 41b Second side of media tank 41c Third side of media tank 41d Fourth side of media tank 41e Bottom of media tank 43 Media 45 ultrasonic elements 50 Unwinding mechanism 60 Winding mechanism 70 Dust collection mechanism 71 Suction nozzle 73 Suction hose 75 Garbage Pit 100 Ceramic chip removal device

Claims

1. a conveying mechanism for conveying a film including a support film and ceramic chips, which are residues of the ceramic green sheet, attached to the surface of the support film; a peeling mechanism that peels the ceramic scraps from the support film, The peeling mechanism includes a media tank in which media is stored, and an ultrasonic element that applies ultrasonic waves to the media to vibrate the media, The ceramic debris removal device is characterized in that the film is configured to pass through the media tank.

2. 2. The ceramic chip removal device according to claim 1, further comprising a suction nozzle provided near the surface of said media tank for sucking said ceramic chips from within said media tank.

3. 3. The ceramic chip removing device according to claim 1, wherein the frequency of the ultrasonic waves generated by the ultrasonic element is 20 kHz or more and 40 kHz or less.

4. the peeling mechanism has a plurality of the ultrasonic elements, 3. The ceramic chip removal device according to claim 1, wherein the ultrasonic elements generate ultrasonic waves in a superimposed fashion to vibrate only the media at a predetermined position in the media tank.

5. 3. The ceramic chip removing device according to claim 1, wherein the media is a resin media made of resin.

6. 3. The ceramic chip removing device according to claim 1, wherein the media is a metal media made of a metal.

Images