Processing condition calculation device, processing condition calculation method, and laser processing device

Abstract

The processing condition calculation device (10) includes a processing condition calculation unit (13) that calculates second laser processing conditions to be used in second laser processing of the workpiece (W) after first laser processing has been performed on the workpiece (W) under first laser processing conditions, and a memory unit (12) that stores correspondence information in which processing information, which is information on the first laser processing conditions and the second laser processing, is associated with the second laser processing conditions, and the processing condition calculation unit (13) calculates second laser processing conditions corresponding to the first laser processing and the second laser processing based on the processing information corresponding to the first laser processing and the second laser processing and the correspondence information.

Description

[Technical Field]

[0001] The present disclosure relates to a processing condition calculation device, a processing condition calculation method, and a laser processing device that calculate processing conditions used when processing an object with a laser beam. [Background technology]

[0002] A laser processing device performs laser drilling or laser cutting of a workpiece by irradiating a laser beam onto the top surface of a plate-shaped workpiece or the side surface of a tubular workpiece. For example, when forming a screw hole in a workpiece, it may be necessary to perform countersinking, which cuts the periphery of the edge of the screw hole to a size larger than the screw head. Also, it may be necessary to perform chamfering to smooth out right-angled edges formed by laser cutting of the workpiece.

[0003] The laser processing device described in Patent Document 1 performs laser processing on the workpiece, then moves the processing head to a position slightly shifted from the edge portion of the workpiece formed by the laser processing, and irradiates the workpiece with a laser beam that is not strong enough to cut the workpiece, thereby chamfering the edge portion. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 8-108287 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the technology of Patent Document 1, chamfering is performed without knowing the appropriate laser beam parameters for chamfering. Therefore, to achieve high-quality processing, it is necessary to recalculate the laser beam parameters based on the evaluation results of the chamfered workpiece. The laser processing device of Patent Document 1 then performs laser processing on a new workpiece, and then chamfers the edge using the recalculated laser beam parameters. Therefore, the laser processing device of Patent Document 1 has a problem in that it takes an increased takt time to achieve high-quality processing.

[0006] The present disclosure has been made in view of the above, and aims to provide a machining condition calculation device that can calculate machining conditions that can reduce takt time while realizing high-quality machining. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, the processing condition calculation device of the present disclosure includes a processing condition calculation unit that calculates second laser processing conditions to be used in second laser processing of a workpiece after first laser processing of the workpiece has been performed under first laser processing conditions, and a storage unit that stores correspondence information that corresponds the first laser processing conditions and processing information that is information on the second laser processing, and the second laser processing conditions. The first laser processing is laser cutting, the second laser processing is chamfering, and the second laser processing information includes a chamfering angle in the chamfering. degree The processing condition calculation unit calculates second laser processing conditions corresponding to the first laser processing and the second laser processing based on the processing information corresponding to the first laser processing and the second laser processing and the correspondence relationship information. Furthermore, if the value of the chamfer angle is not included in the correspondence relationship information, the processing condition calculation unit calculates the second laser processing conditions corresponding to the chamfer angle by linear approximation. [Effects of the Invention]

[0008] The machining condition calculation device according to the present disclosure has an effect of being able to calculate machining conditions that can reduce takt time while realizing high-quality machining. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing a configuration of a laser processing device equipped with a processing condition calculation device according to an embodiment. [Figure 2] FIG. 1 is a top view showing the external configuration of a laser processing apparatus according to an embodiment; [Figure 3] FIG. 1 is a front view showing an external configuration of a laser processing apparatus according to an embodiment; [Figure 4] FIG. 1 is a side view showing an external configuration of a laser processing apparatus according to an embodiment; [Figure 5] FIG. 1 is a diagram for explaining laser cutting processing performed by a laser processing apparatus according to an embodiment. [Figure 6] FIG. 1 is a diagram for explaining chamfering performed by a laser processing apparatus according to an embodiment. [Figure 7] FIG. 10 is a diagram for explaining the chamfering angle of the chamfering process performed by the laser processing device according to the embodiment. [Figure 8] FIG. 10 is a diagram for explaining a countersink angle of the countersink processing performed by the laser processing device according to the embodiment. [Figure 9] FIG. 10 is a diagram for explaining a Y-shaped countersink formed by the laser processing apparatus according to the embodiment; [Figure 10] FIG. 10 is a diagram for explaining a V-shaped countersink formed by the laser processing apparatus according to the embodiment. [Figure 11] FIG. 1 is a diagram for explaining a process executed by a machining condition calculation device according to an embodiment. [Figure 12] FIG. 1 is a diagram showing a configuration of correspondence relationship information used by a processing condition calculation device according to an embodiment; [Figure 13] 1 is a flowchart showing a processing procedure of a process executed by a laser processing apparatus according to an embodiment; [Figure 14] 10 is a flowchart showing the processing procedure executed by the laser processing device of the comparative example. [Figure 15] FIG. 1 is a diagram illustrating a configuration example of a processing circuit when the processing circuit included in the machining condition calculation device according to the embodiment is realized by a processor and a memory. [Figure 16] FIG. 1 is a diagram illustrating an example of the configuration of a processing circuit included in a machining condition calculation device according to an embodiment when the processing circuit is configured with dedicated hardware. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a processing condition calculation device, a processing condition calculation method, and a laser processing device according to embodiments of the present disclosure will be described in detail with reference to the drawings.

[0011] Embodiment 1 is a diagram showing the configuration of a laser processing apparatus equipped with a processing condition calculation device according to an embodiment. The laser processing apparatus 1 is an apparatus that laser processes a processing object (workpiece) W by irradiating the workpiece W with a laser beam. The laser processing apparatus 1 performs laser cutting or laser drilling on the processing object W, and chamfering or countersinking on the processing object W.

[0012] The laser processing device 1 includes a laser oscillator 2, a control device 3, a processing gas supply unit 21, an axial movement control unit 22, a gas pipe 23, a processing head 24, and a work table 26.

[0013] The control device 3 controls the laser oscillator 2, the processing gas supply unit (processing gas supply source) 21, and the axis movement control unit 22. The laser oscillator 2 outputs a laser beam in accordance with commands from the control device 3 and sends it to the processing head 24. The laser beam output by the laser oscillator 2 is a continuous wave or a pulse wave.

[0014] The processing gas supply unit 21 is a valve that supplies processing gas to the processing head 24. The processing gas supply unit 21 supplies the processing gas used during laser processing to the processing head 24 via the gas piping 23 in accordance with instructions from the control device 3. The processing gas supply unit 21 is capable of delivering multiple types of assist gas (processing gas), and delivers the type of assist gas in accordance with instructions from the control device 3.

[0015] The axis movement control unit 22 includes a servo amplifier, a servo motor, a rack, a pinion, and a ball screw. The axis movement control unit 22 controls the axial movement of the machining head 24 in accordance with commands from the control device 3. The axis movement control unit 22 moves the machining head 24, for example, in the X-axis direction, the Y-axis direction, and the Z-axis direction. The X-axis, the Y-axis, and the Z-axis are three axes that are perpendicular to each other. The X-axis and the Y-axis are, for example, axes parallel to the horizontal direction. The Z-axis is, for example, an axis parallel to the vertical direction. The axis movement control unit 22 moves the machining head 24 to a position where the workpiece W is irradiated with the laser beam.

[0016] The workpiece W is placed on the work table 26. The upper surface of the work table 26 is shaped like a pinholder, and the workpiece W is supported by multiple points of the pinholder. The workpiece W is plate-shaped or tubular. The workpiece W is, for example, a steel plate or a steel pipe. A processing nozzle 25 is disposed at the tip of the processing head 24. The processing head 24 moves over the workpiece W in accordance with commands from the axis movement control unit 22. The processing nozzle 25 irradiates the laser beam sent from the laser oscillator 2 onto the processing point of the workpiece W, and also injects processing gas sent from the processing gas supply unit 21 onto the processing point of the workpiece W. In this way, the workpiece W is laser processed.

[0017] When the workpiece W is plate-shaped, the laser processing device 1 cuts or laser drills the workpiece W. When the workpiece W is tubular, the laser processing device 1 cuts or laser drills the side surface of the workpiece W.

[0018] When laser cutting the workpiece W, the laser processing device 1 separates the workpiece W into a workpiece (product) and scrap material. Note that when laser cutting the workpiece W, the laser processing device 1 may separate the workpiece W into a plurality of workpieces.

[0019] When the workpiece W is plate-shaped, the laser drilling process penetrates the top and bottom surfaces of the workpiece W. When the workpiece W is tubular, the laser drilling process penetrates the outer and inner wall surfaces of the workpiece W.

[0020] The laser processing apparatus 1 also performs chamfering on the workpiece W that has been cut, and performs countersinking on the workpiece W that has been laser drilled. The laser processing apparatus 1 performs chamfering to smooth out right-angled edges formed by the laser cutting of the workpiece W or to remove burrs. The laser processing apparatus 1 also performs countersinking on screw holes formed by laser drilling in the workpiece W to form a space to accommodate the head of the screw. The laser processing apparatus 1 performs countersinking by cutting the periphery of the edge of the screw hole to a size larger than the size of the screw head.

[0021] Hereinafter, laser cutting and laser drilling may be referred to as pre-processing. Chamfering and countersinking may be referred to as post-processing. The pre-processing is the first laser processing, and the post-processing is the second laser processing.

[0022] When the laser processing device 1 performs laser cutting in the pre-processing stage, it performs chamfering in the post-processing stage. When the laser processing device 1 performs laser drilling in the pre-processing stage, it performs countersinking in the post-processing stage.

[0023] The control device 3 includes a processing condition calculation device 10 and a control unit 15. The processing condition calculation device 10 is a computer that calculates processing conditions. The processing condition calculation device 10 calculates processing conditions (hereinafter referred to as subsequent processing conditions) to be applied to chamfering or countersinking based on processing information including the processing conditions used in the previous processing (laser cutting or laser drilling) and information on the subsequent processing. The processing conditions for the previous processing are first laser processing conditions, and the subsequent processing conditions are second laser processing conditions.

[0024] The information on the subsequent processing in the processing information includes the shape of the subsequent processing and the shape formed by the subsequent processing (processing shape). The processing condition calculation device 10 calculates the subsequent processing conditions corresponding to the processing information based on correspondence relationship information indicating the correspondence relationship between the processing information and the subsequent processing conditions.

[0025] The machining condition calculation device 10 has an input unit 11, a storage unit 12, and a machining condition calculation unit 13. The input unit 11 receives machining information from the outside and transmits it to the machining condition calculation unit 13. The input unit 11 automatically inputs machining information from a control unit 15, an external device (not shown) of the control device 3 (for example, a product design device), etc. Note that the input unit 11 may also be input with machining information by a user.

[0026] The processing information includes, for example, material, plate thickness, gas type, chamfering angle, chamfer shape, countersink angle, countersink shape, etc. Of the processing information, the material, plate thickness, and gas type are processing conditions used in the first-stage processing, and the chamfering angle, chamfer shape, countersink angle, and countersink shape are information for the second-stage processing. The processing information includes at least one processing condition used in the first-stage processing. The processing information also includes at least one piece of information for the second-stage processing.

[0027] The material is the material of the workpiece W. An example of the material is SS (Structural Steel) 400. The plate thickness is the plate thickness of the workpiece W. The gas type is the type of processing gas delivered from the processing gas supply unit 21.

[0028] The chamfering angle is the angle between the chamfered surface (chamfered surface) and the cut surface in the laser cutting process. The chamfering shape is the type of chamfering. Chamfering shapes include C-chamfering and light chamfering (deburring). The chamfering shape may include information about the dimensions of the chamfered surface. For example, in the case of C-chamfering, the dimensions of the chamfering shape are expressed as the dimensions from the tip of the chamfered edge.

[0029] The countersink angle is the angle between the opposing countersinking surfaces across the hole axis after countersinking. A countersink is conical, and the angle between the opposing generatrix lines of the cone is the countersink angle. The countersink shape is a type of countersinking. The cross-sectional shapes of countersinks include Y-shapes and V-shapes. The countersink shape may also include information on the dimensions of the surfaces after countersinking. For example, the dimensions of a countersink shape are expressed as the maximum diameter of the countersink, the depth of the countersink, etc.

[0030] The storage unit 12 stores correspondence information indicating the correspondence between the processing information and the subsequent processing conditions in advance. The correspondence information associates the processing information with the subsequent processing conditions that can achieve stable, high-quality processing for the processing information. The storage unit 12 may be located outside the processing condition calculation device 10.

[0031] The machining condition calculation unit 13 calculates subsequent-stage machining conditions corresponding to the machining information based on the correspondence information and the machining information. The machining condition calculation unit 13 may calculate the subsequent-stage machining conditions at any timing as long as it is before subsequent-stage machining. For example, the machining condition calculation unit 13 may calculate the subsequent-stage machining conditions before subsequent-stage machining, or may calculate the subsequent-stage machining conditions during subsequent-stage machining. Furthermore, the machining condition calculation unit 13 may calculate the subsequent-stage machining conditions after subsequent-stage machining.

[0032] The post-processing conditions include at least one of the output value, frequency, duty, processing speed, focus, beam condensed diameter, nozzle height, Z-axis elevation distance, and path offset amount (beam offset amount).

[0033] The output value is the output value of the laser beam, the frequency is the output frequency of the laser beam, and the duty is the ratio of the on time to the off time of a pulse in a pulse wave of a laser beam that continues at a specific period.

[0034] The processing speed is the speed at which the workpiece W is processed. The processing speed is the distance processed per unit time. The unit of processing speed is mm / min. The focal point is the focus of the laser beam and is indicated by the distance in the Z-axis direction from the processing surface (processing position) on the workpiece W. The positive direction of the focal point is the upper side of the workpiece W (the processing head 24 side). For example, when performing countersink processing, a positive focal point is used, and processing is performed with a thicker laser beam diameter. The beam focus diameter is the beam diameter of the laser beam when the focus is 0 mm (reference position).

[0035] The nozzle height is the nozzle height of the processing nozzle 25 and is indicated by the distance between the surface of the work table 26 and the tip of the processing nozzle 25. The Z-axis lift distance is the lift distance in a direction parallel to the Z-axis direction (processing depth direction) along which the processing nozzle 25 moves during processing.

[0036] The path offset amount is the offset amount of the processing path. Specifically, the path offset amount is the amount of deviation between the processing path in the first-stage processing (the path in the XY plane along which the laser beam is irradiated) and the processing path in the second-stage processing. The laser processing device 1 performs the second-stage processing using the corrected processing path that is corrected using the path offset amount for the processing path in the first-stage processing.

[0037] The machining condition calculation unit 13 outputs the calculated post-stage machining conditions to the control unit 15. The control unit 15 stores a machining program in advance. The machining program may be stored outside the control unit 15.

[0038] The control unit 15 executes control processing using the processing program and processing conditions for the previous processing during the previous processing stage (laser cutting or laser drilling), and executes control processing using the processing program and the calculated processing conditions for the next processing stage during the next processing stage (chamfering or countersinking).

[0039] Fig. 2 is a top view showing the external configuration of the laser processing apparatus according to the embodiment, Fig. 3 is a front view showing the external configuration of the laser processing apparatus according to the embodiment, and Fig. 4 is a side view showing the external configuration of the laser processing apparatus according to the embodiment.

[0040] 2 to 4 show the laser processing apparatus 1 in which the X-axis and Y-axis are parallel to the horizontal direction and the Z-axis is parallel to the vertical direction. The laser processing apparatus 1 is equipped with an X-axis driving device 30X, a Y-axis driving device 30Y, and a Z-axis driving device 30Z that drive the processing head 24.

[0041] The machining head 24 is attached to a Z-axis drive unit 30Z, which drives the machining head 24 in the Z-axis direction. The Z-axis drive unit 30Z is attached to a Y-axis drive unit 30Y, which drives the Z-axis drive unit 30Z in the Y-axis direction. As a result, the Y-axis drive unit 30Y drives the machining head 24 attached to the Z-axis drive unit 30Z in the Y-axis direction.

[0042] The Y-axis drive device 30Y is attached to the X-axis drive device 30X, and the X-axis drive device 30X drives the Y-axis drive device 30Y in the X-axis direction. As a result, the X-axis drive device 30X drives the Z-axis drive device 30Z attached to the Y-axis drive device 30Y in the X-axis direction, and drives the machining head 24 attached to the Z-axis drive device 30Z in the X-axis direction.

[0043] In this way, the machining head 24 is driven in the X-axis direction by the X-axis driving device 30X, in the Y-axis direction by the Y-axis driving device 30Y, and in the Z-axis direction by the Z-axis driving device 30Z.

[0044] Fig. 5 is a diagram for explaining the laser cutting process performed by the laser processing apparatus according to the embodiment. Fig. 5 shows a processing path 41 in the laser cutting process when the workpiece W is viewed from above. That is, Fig. 5 shows the processing path 41 when viewed from the Z-axis direction.

[0045] The laser processing apparatus 1 laser cuts the workpiece W along a processing path 41 indicated by an arrow. In FIG. 5, the inner area surrounded by the processing path 41 is the area that will become the product Px. The processing path 41 is a path that starts from the piercing position, which is located outside the area that will become the product Px, and proceeds in a manner that surrounds the area that will become the product Px. The laser processing apparatus 1 laser cuts the workpiece W using the processing path 41, which is provided with a joint J1 so that the part that will become the product Px is not separated from the workpiece W. The area outside the area that will become the product Px may or may not become a product.

[0046] Fig. 6 is a diagram for explaining the chamfering process performed by the laser processing apparatus according to the embodiment. Fig. 6 is a cross-sectional view of the workpiece W shown in Fig. 5 taken along line VI-VI, showing the product P1 after laser cutting and chamfering. Fig. 6 shows cross-sectional views of the processing nozzle 25 and the laser beam L, along with the cross-sectional view of the product P1.

[0047] The laser processing device 1 performs laser cutting on the workpiece W along the processing path 41 described in Fig. 5, and then chamfers the processed edge portion so that it has the shape shown in Fig. 6. Fig. 6 shows the shape of the product P1 after the chamfered portion C1 of the product P1 has been chamfered.

[0048] The laser processing apparatus 1 performs chamfering using the same processing path as the processing path 41 of the laser cutting processing, which is the previous processing stage. In this case, the laser processing apparatus 1 performs chamfering along a processing path (hereinafter, sometimes referred to as a subsequent processing path) in which a path offset amount R1 is set with respect to the position in the XY plane of the processing path 41. In other words, the laser processing apparatus 1 performs chamfering by moving the processing head 24 to a position shifted by the path offset amount R1 from the edge portion of the processed shape formed by the laser cutting processing.

[0049] The laser processing apparatus 1 performs chamfering along a subsequent processing path in which a path offset amount R1 is set to be more inward than the processing path 41 shown in Fig. 5. The path offset amount R1 here is the amount of deviation between the path of the laser cutting processing, which is the previous processing, and the path of the chamfering processing, which is the subsequent processing.

[0050] The laser processing apparatus 1 performs chamfering along the post-processing path for which the path offset amount R1 is set, thereby chamfering the edge portion (chamfered portion C1) formed by laser processing along the processing path 41.

[0051] 6 shows a case where the right side of the product P1 also becomes the product P0. That is, FIG. 6 shows a case where the right side of the product P1 is also chamfered. If the right side of the product P1 does not become a product, there is no need to chamfer the workpiece W on the right side.

[0052] In this way, the laser processing apparatus 1 performs chamfering to form a chamfered portion C1 as shown in FIG. 6, in addition to laser cutting to separate a normal workpiece (product P1) from scrap material. When performing this chamfering, the laser processing apparatus 1 performs the chamfering process in the subsequent process (subsequent process) by irradiating a laser beam L having a power density equal to or different from that of the previous process after the laser cutting process, which is the previous process (pre-processing). When the previous process of drilling is performed with low power (in the case of small diameter drilling), if the chamfering angle in the subsequent process is large, the laser processing apparatus 1 increases the offset amount in the Z-axis direction during chamfering. Therefore, the power density of the chamfering process may be higher than the power density of the drilling process. Furthermore, when the previous process of drilling is performed with high power (in the case of large diameter drilling), the power density of the chamfering process may be lower than the power density of the drilling process.

[0053] The power density in the pre-process is a power density that can cut the workpiece W in one laser cutting process, and the power density in the post-process is a power density that cannot cut the workpiece W in one laser cutting process. The control unit 15 calculates the power density of the laser beam L in the post-processing based on the output value, frequency, duty, processing speed, focus, beam condensing diameter, nozzle height, Z-axis elevation distance, and path offset amount R1 included in the post-processing.

[0054] 7 is a diagram for explaining the chamfering angle of the chamfering process performed by the laser processing apparatus according to the embodiment. Fig. 7 shows a cross-sectional view of the product P2 formed from the workpiece W when the product P2 is cut along a plane parallel to the XZ plane.

[0055] The chamfering angle CA1 in the chamfering process is the angle between the depth direction (Z-axis direction) of the slit (cutting allowance) SL formed by the laser cutting process and the surface formed by the chamfering (chamfered surface F1). Figure 7 shows the case where the chamfering angle CA1 is the angle between the Z-axis direction and the chamfered surface F1 when the product P2 is cut along a plane parallel to the XZ plane.

[0056] 8 is a diagram for explaining the countersink angle of the countersink hole machining performed by the laser machining apparatus according to the embodiment. Fig. 8 shows a cross-sectional view of the product P3 formed from the workpiece W when the product P3 is cut along a plane parallel to the XZ plane.

[0057] The countersink angle HA1 in countersinking is the angle formed by the generatrix lines B1 and B2 that face each other across the hole H. The hole H is a hole formed by drilling, and the generatrix lines B1 and B2 are the generatrix lines of a cone formed by countersinking. Figure 8 shows the case where the countersink angle HA1 is the angle formed by the generatrix lines B1 and B2 when the product P3 is cut on a plane parallel to the XZ plane.

[0058] Fig. 9 is a diagram illustrating a Y-shaped countersink formed by the laser processing apparatus according to the embodiment. Fig. 9 shows a cross-sectional view of a product P4 formed from a workpiece W when the product P4 is cut along a plane parallel to the XZ plane. The Y-shape shown in Fig. 9 can also be formed by chamfering. Therefore, the Y-shape shown in Fig. 9 may be a countersink shape or a chamfered shape.

[0059] If the Y-shape shown in FIG. 9 is a countersink shape, the countersink shape is expressed by the maximum diameter D1 of the countersink, the depth D2 of the countersink, etc. The maximum diameter D1 is the diameter of the top surface of the countersink (the base of the cone). In other words, the maximum diameter D1 is the largest diameter of the conical countersink. If the Y-shape shown in FIG. 9 is a chamfered shape, the chamfered shape is expressed by the dimension D3 from the edge tip E of the chamfered portion, etc. The edge tip E is a right-angled portion formed by laser cutting. In the chamfering process, the chamfered portion including the edge tip E is removed by laser processing.

[0060] FIG. 10 is a diagram illustrating a V-shaped countersink formed by the laser processing apparatus according to the embodiment. FIG. 10 shows a cross-sectional view of a product P5 formed from a workpiece W when the product P5 is cut along a plane parallel to the XZ plane. The countersink shape shown in FIG. 10 is represented by a maximum diameter D4 of the countersink, a depth D5 of the countersink, and the like. The maximum diameter D4, like the maximum diameter D1, is the diameter of the top surface of the countersink.

[0061] 11 is a diagram for explaining the processing executed by the machining condition calculation device according to the embodiment. Machining information is input to the machining condition calculation device 10. The machining information includes at least one of material, plate thickness, and gas type, and at least one of chamfering angle, chamfering shape, countersink angle, and countersink shape. The machining condition calculation device 10 stores correspondence relationship information in advance.

[0062] The machining condition calculation device 10 calculates subsequent-stage machining conditions corresponding to the machining information based on the correspondence relationship information and the machining information. The subsequent-stage machining conditions include at least one of the output value, frequency, duty, machining speed, focus, beam condensing diameter, nozzle height, Z-axis elevation distance, and path offset amount R1. The machining condition calculation device 10 outputs the calculated subsequent-stage machining conditions to the control unit 15.

[0063] The control unit 15 controls the first-stage processing (laser cutting or laser drilling) using the processing program and processing conditions for the first-stage processing. The control unit 15 controls the second-stage processing using the processing program and processing conditions for the second-stage processing.

[0064] When the value of the input processing information is not included in the correspondence information, the processing condition calculation unit 13 performs linear approximation to calculate subsequent processing conditions corresponding to the input processing information. In this case, the processing condition calculation unit 13 extracts processing information before and after the value of the input processing information from the correspondence information. Then, the processing condition calculation unit 13 linearly approximates the subsequent processing conditions corresponding to the extracted processing information to calculate subsequent processing conditions corresponding to the input processing information.

[0065] For example, if the input chamfer angle (hereinafter sometimes referred to as the input chamfer angle) is not found in the correspondence information, the machining condition calculation unit 13 extracts the chamfer angles before and after the value of the input chamfer angle from the chamfer angles included in the correspondence information. That is, the machining condition calculation unit 13 extracts the chamfer angle closest to the input chamfer angle from among the chamfer angles larger than the input chamfer angle. The machining condition calculation unit 13 also extracts the chamfer angle closest to the input chamfer angle from among the chamfer angles smaller than the input chamfer angle. Then, the machining condition calculation unit 13 linearly approximates the subsequent machining conditions corresponding to the two extracted chamfer angles to calculate the subsequent machining conditions corresponding to the input chamfer angle.

[0066] Similarly, if the input countersink angle (hereinafter sometimes referred to as the input countersink angle) is not found in the correspondence information, the machining condition calculation unit 13 extracts the chamfering angles before and after the value of the input countersink angle from the countersink angles included in the correspondence information. Then, the machining condition calculation unit 13 linearly approximates the subsequent machining conditions corresponding to the extracted two countersink angles to calculate the subsequent machining conditions corresponding to the input countersink angle.

[0067] Note that, when the value of the input processing information is not included in the correspondence relationship information, the processing condition calculation unit 13 may extract any value of the processing information from the correspondence relationship information. Furthermore, when the value of the input processing information is not included in the correspondence relationship information, the processing condition calculation unit 13 may extract three or more values ​​of the processing information from the correspondence relationship information. In these cases, too, the processing condition calculation unit 13 linearly approximates the subsequent processing conditions corresponding to the extracted processing information to calculate the subsequent processing conditions corresponding to the input processing information.

[0068] The machining condition calculation unit 13 calculates the output value, frequency, duty, machining speed, focus, beam condensing diameter, nozzle height, Z-axis elevation distance, and path offset amount R1 corresponding to the input chamfering angle, for example, by performing linear approximation. Furthermore, the machining condition calculation unit 13 calculates the power density based on the calculated output value, frequency, duty, machining speed, focus, beam condensing diameter, nozzle height, Z-axis elevation distance, and path offset amount R1.

[0069] 12 is a diagram showing the configuration of correspondence information used by the processing condition calculation device according to the embodiment. The correspondence information, which is a table of processing conditions, is information showing an example of the correspondence between processing information 61 and subsequent processing conditions 62. That is, the correspondence information includes subsequent processing conditions 62 corresponding to the processing information 61. In the correspondence information, the processing information 61 and subsequent processing conditions 62 in a series of processing processes including previous processing and subsequent processing are shown in a matrix table for each processing process.

[0070] The processing information 61 here includes the material, plate thickness, gas type, chamfering angle, chamfering shape, countersink angle, and countersink shape.

[0071] The post-processing conditions 62 here include the output value, frequency, duty, processing speed, gas pressure, focus, beam condensed diameter, nozzle height, Z-axis elevation distance, and path offset amount R1 of the processing path.

[0072] 13 is a flowchart showing the processing procedure of processing executed by the laser processing apparatus according to the embodiment. The laser processing apparatus 1 executes pre-processing using the processing conditions of the pre-processing (step S1). That is, the laser processing apparatus 1 executes laser drilling or laser cutting using the processing conditions of the pre-processing.

[0073] The processing condition calculation device 10 of the laser processing apparatus 1 calculates subsequent-stage processing conditions corresponding to the processing information based on the processing information and the correspondence information (step S2). Specifically, the processing condition calculation unit 13 calculates subsequent-stage processing conditions corresponding to the processing information based on the correspondence information read from the storage unit 12 and the processing information received from the input unit 11 from the outside. The processing condition calculation device 10 calculates a laser power density to be applied to the subsequent-stage processing based on the subsequent-stage processing conditions (step S3). The processing condition calculation device 10 here calculates a laser power density that will not cause the processed item (product) to separate from the original work-piece W. In other words, the processing condition calculation device 10 calculates a laser power density that is lower than the laser power density during the previous-stage processing. The processing condition calculation unit 13 transmits the subsequent-stage processing conditions and the calculated laser power density to the control unit 15.

[0074] The laser processing apparatus 1 performs the subsequent processing using the subsequent processing conditions and the laser power density (step S4). That is, the laser processing apparatus 1 performs countersinking or chamfering using the subsequent processing conditions and the laser power density. If the laser processing apparatus 1 performs drilling in the previous processing stage, it performs countersinking in the subsequent processing stage. Also, if the laser processing apparatus 1 performs laser cutting in the previous processing stage, it performs chamfering in the subsequent processing stage.

[0075] Here, the processing procedure of the processing executed by the laser processing device of the comparative example will be described. Fig. 14 is a flowchart showing the processing procedure of the processing executed by the laser processing device of the comparative example. Here, the processing procedure when the laser processing device of the comparative example executes laser cutting processing will be described. Note that part of the processing shown in Fig. 14 includes processing (step S15) executed by the user of the laser processing device of the comparative example.

[0076] The laser processing device of the comparative example sets laser beam parameters in accordance with instructions from a user (step S11). The laser beam parameters are the same information as the post-processing conditions. The laser processing device of the comparative example performs laser cutting processing using the laser beam parameters (step S12).

[0077] The laser processing device of the comparative example calculates (step S13) a laser power density that will prevent the processed item (product) from separating from the original work-piece W. The laser processing device of the comparative example performs chamfering at the calculated laser power density (step S14).

[0078] The user of the laser processing device of the comparative example determines whether the product after chamfering has the desired shape (step S15). If the product after chamfering does not have the desired shape (step S15, No), the laser processing device of the comparative example resets the laser beam parameters according to instructions from the user (step S16). Thereafter, the processes of steps S12 to S15 are repeated. The processes of step S16 and steps S12 to S15 are repeated until the user determines that the product after chamfering has the desired shape. If the user determines that the product after chamfering has the desired shape (step S15, Yes), the laser processing device of the comparative example ends the laser processing.

[0079] When the laser processing device of the comparative example performs laser drilling, it performs laser drilling instead of laser cutting in step S11, and performs countersinking instead of chamfering in step S13.

[0080] The processing condition calculation device 10 of the embodiment calculates the subsequent processing conditions based on the processing information and the correspondence information, so there is no need for the process of determining whether the product after chamfering has the desired shape or not, and the process of resetting the laser beam parameters, as in the laser processing device of the comparative example.

[0081] Next, we will explain the hardware configuration of the machining condition calculation device 10. The machining condition calculation device 10 is realized by a processing circuit. The processing circuit may be a processor and memory that executes a program stored in a memory, or may be dedicated hardware.

[0082] FIG. 15 is a diagram illustrating an example of the configuration of a processing circuit included in the machining condition calculation device according to the embodiment, when the processing circuit is realized by a processor and a memory. The processing circuit 90 illustrated in FIG. 15 includes a processor 91 and a memory 92. When the processing circuit 90 includes the processor 91 and the memory 92, each function of the processing circuit 90 is realized by software, firmware, or a combination of software and firmware. The software or firmware is written as a machining condition calculation program that calculates machining conditions and is stored in the memory 92. The processing circuit 90 realizes each function by having the processor 91 read and execute the machining condition calculation program stored in the memory 92. That is, the processing circuit 90 includes the memory 92 for storing the machining condition calculation program that results in the processing of the machining condition calculation device 10. The machining condition calculation program can also be considered a program that causes the machining condition calculation device 10 to execute each function realized by the processing circuit 90. The machining condition calculation program may be provided by a computer-readable recording medium on which the machining condition calculation program is recorded, or by other means such as a communication medium.

[0083] The machining condition calculation program can also be said to be a program that causes the machining condition calculation device 10 to execute the processes of steps S2 and S3 in Fig. 13. Here, the processor 91 is, for example, a CPU (Central Processing Unit), a processing device, an arithmetic device, a microprocessor, a microcomputer, or a DSP (Digital Signal Processor). Also, the memory 92 is, for example, a non-volatile or volatile semiconductor memory such as RAM (Random Access Memory), ROM (Read Only Memory), flash memory, EPROM (Erasable Programmable ROM), or EEPROM (Electrically EPROM), a magnetic disk, a flexible disk, an optical disk, a compact disk, a minidisk, or a DVD (Digital Versatile Disc).

[0084] FIG. 16 is a diagram illustrating an example of the configuration of a processing circuit included in the machining condition calculation device according to the embodiment, where the processing circuit is configured with dedicated hardware. The processing circuit 93 illustrated in FIG. 16 corresponds to, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or a combination thereof. The processing circuit 93 may be partially implemented with dedicated hardware and partially implemented with software or firmware. In this manner, the processing circuit 93 can realize the above-described functions by dedicated hardware, software, firmware, or a combination thereof. The control device 3 may also be realized with a processing circuit similar to that of the machining condition calculation device 10.

[0085] According to this embodiment, the machining condition calculation device 10 calculates the subsequent machining conditions based on the machining information and the correspondence information, eliminating the time required to adjust the machining conditions for chamfering and countersinking. Furthermore, since the machining condition calculation device 10 can calculate appropriate subsequent machining conditions, laser machining using appropriate subsequent machining conditions stabilizes the countersink angle and chamfering angle, enabling stable, high-quality machining without dross or other machining defects. In this way, the machining condition calculation device 10 can calculate machining conditions that can reduce takt time while achieving high-quality machining.

[0086] The configurations shown in the above embodiments are merely examples, and may be combined with other known technologies, and parts of the configurations may be omitted or modified without departing from the spirit of the invention. [Explanation of symbols]

[0087] 1 laser processing device, 2 laser oscillator, 3 control device, 10 processing condition calculation device, 11 input unit, 12 memory unit, 13 processing condition calculation unit, 15 control unit, 21 processing gas supply unit, 22 axis movement control unit, 23 gas piping, 24 processing head, 25 processing nozzle, 26 work table, 30X X-axis drive unit, 30Y Y-axis drive unit, 30Z Z-axis drive unit, 41 processing path, 61 processing information, 62 subsequent processing conditions, 90, 93 processing circuit, 91 processor, 92 memory, B1, B2 bus, C1 chamfered portion, CA1 chamfer angle, D1, D4 maximum diameter, D3 dimension, E edge tip, F1 chamfered surface, H hole, HA1 countersink angle, J1 joint, L laser beam, P1 to P5, Px product, R1 path offset amount, W processing object.

Claims

1. a processing condition calculation unit that calculates second laser processing conditions to be used in second laser processing of the object after first laser processing of the object has been performed under first laser processing conditions; a storage unit that stores correspondence relationship information in which processing information, which is information on the first laser processing conditions and the second laser processing, is associated with the second laser processing conditions; Equipped with the first laser processing is laser cutting processing, the second laser processing is chamfering, the second laser processing information includes a chamfering angle in the chamfering processing, the processing condition calculation unit calculates second laser processing conditions corresponding to the first laser processing and the second laser processing based on processing information corresponding to the first laser processing and the second laser processing and the correspondence relationship information, and when the value of the chamfer angle is not included in the correspondence relationship information, calculates the second laser processing conditions corresponding to the chamfer angle by linear approximation; A machining condition calculation device characterized by:

2. a processing condition calculation unit that calculates second laser processing conditions to be used in second laser processing of the object after first laser processing of the object has been performed under first laser processing conditions; a storage unit that stores correspondence relationship information in which processing information, which is information on the first laser processing conditions and the second laser processing, is associated with the second laser processing conditions; Equipped with the first laser processing is laser drilling; the second laser processing is countersinking; the second laser processing information includes a countersink angle in the countersink processing; the processing condition calculation unit calculates second laser processing conditions corresponding to the first laser processing and the second laser processing based on processing information corresponding to the first laser processing and the second laser processing and the correspondence relationship information, and when a value of the countersink angle is not included in the correspondence relationship information, calculates second laser processing conditions corresponding to the countersink angle by linear approximation; A machining condition calculation device characterized by:

3. The first laser processing conditions include at least one of the material of the workpiece, the thickness of the workpiece, and the type of assist gas injected onto the workpiece from a processing nozzle provided in a processing head during the first laser processing.

3. The machining condition calculation device according to claim 1 or 2.

4. The second laser processing conditions include at least one of an output value of the laser beam in the second laser processing, an output frequency of the laser beam, a duty of the laser beam, a processing speed of the workpiece, a focus of the laser beam, a beam condensing diameter of the laser beam, a nozzle height of the processing nozzle, an upward distance in a direction parallel to the processing depth direction along which the processing nozzle moves during processing, and a path offset amount which is a deviation amount between the processing path in the first laser processing and the processing path in the second laser processing.

4. The machining condition calculation device according to claim 3.

5. the processing condition calculation unit calculates the power density of the laser beam based on the second laser processing conditions when the second laser processing conditions include the output frequency, the duty, the processing speed, the focus, and the beam condensed diameter; 5. The machining condition calculation device according to claim 4.

6. The information of the second laser processing includes the chamfering angle and the chamfering shape in the chamfering processing.

2. The machining condition calculation device according to claim 1.

7. The chamfered shape has a Y-shaped cross section.

7. The machining condition calculation device according to claim 6.

8. The second laser processing information includes the countersink angle and the countersink shape in the countersink processing.

3. The machining condition calculation device according to claim 2.

9. The countersink shape has a Y-shaped or V-shaped cross section.

9. The machining condition calculation device according to claim 8.

10. a storage step in which the processing condition calculation device stores correspondence relationship information in which first laser processing conditions used in a first laser processing of the object to be processed and processing information which is information on a second laser processing of the object to be processed after the first laser processing has been performed are associated with second laser processing conditions used in the second laser processing; a processing condition calculation step in which the processing condition calculation device calculates second laser processing conditions corresponding to the first laser processing and the second laser processing based on processing information corresponding to the first laser processing and the second laser processing and the correspondence relationship information; Including, the first laser processing is laser cutting processing, the second laser processing is chamfering, the second laser processing information includes a chamfering angle in the chamfering processing, In the processing condition calculation step, if the value of the chamfer angle is not included in the correspondence relationship information, the processing condition calculation device calculates second laser processing conditions corresponding to the chamfer angle by linear approximation. A machining condition calculation method characterized by:

11. a storage step in which the processing condition calculation device stores correspondence relationship information in which first laser processing conditions used in a first laser processing of the object to be processed and processing information which is information on a second laser processing of the object to be processed after the first laser processing has been performed are associated with second laser processing conditions used in the second laser processing; a processing condition calculation step in which the processing condition calculation device calculates second laser processing conditions corresponding to the first laser processing and the second laser processing based on processing information corresponding to the first laser processing and the second laser processing and the correspondence relationship information; Including, the first laser processing is laser drilling; the second laser processing is countersinking; the second laser processing information includes a countersink angle in the countersink processing; In the machining condition calculation step, if the value of the countersink angle is not included in the correspondence relationship information, the machining condition calculation device calculates a second laser machining condition corresponding to the countersink angle by linear approximation. A machining condition calculation method characterized by:

12. a laser oscillator that outputs a laser beam; a processing head that irradiates the laser beam onto an object to be processed; a processing condition calculation device that calculates processing conditions when laser processing the object using the laser beam; and The processing condition calculation device a processing condition calculation unit that calculates second laser processing conditions to be used in second laser processing of the object after first laser processing of the object has been performed under first laser processing conditions; a storage unit that stores correspondence relationship information in which processing information, which is information on the first laser processing conditions and the second laser processing, is associated with the second laser processing conditions; Equipped with the first laser processing is laser cutting processing, the second laser processing is chamfering, the second laser processing information includes a chamfering angle in the chamfering processing, the processing condition calculation unit calculates second laser processing conditions corresponding to the first laser processing and the second laser processing based on processing information corresponding to the first laser processing and the second laser processing and the correspondence relationship information, and when the value of the chamfer angle is not included in the correspondence relationship information, calculates second laser processing conditions corresponding to the chamfer angle by linear approximation; The second laser processing is automatically performed using the second laser processing conditions. A laser processing device characterized by:

13. a laser oscillator that outputs a laser beam; a processing head that irradiates the laser beam onto an object to be processed; a processing condition calculation device that calculates processing conditions when laser processing the object using the laser beam; and The processing condition calculation device a processing condition calculation unit that calculates second laser processing conditions to be used in second laser processing of the object after first laser processing of the object has been performed under first laser processing conditions; a storage unit that stores correspondence relationship information in which processing information, which is information on the first laser processing conditions and the second laser processing, is associated with the second laser processing conditions; Equipped with the first laser processing is laser drilling; the second laser processing is countersinking; the second laser processing information includes a countersink angle in the countersink processing; The processing condition calculation unit calculates second laser processing conditions corresponding to the first laser processing and the second laser processing based on processing information corresponding to the first laser processing and the second laser processing and the correspondence relationship information, and when the value of the countersink angle is not included in the correspondence relationship information, calculates second laser processing conditions corresponding to the countersink angle by linear approximation; The second laser processing is automatically performed using the second laser processing conditions. A laser processing device characterized by:

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