Wired circuit board and wired circuit board assembly

Abstract

To provide a wiring circuit board and wiring circuit board assembly capable of suppressing defective recognition of dot patterns.SOLUTION: A printed circuit board 3 includes a metal support layer 4, a base insulating layer 5, and a wiring layer 6 . The printed circuit board 3 further includes a plurality of striations 40 arranged in 4SA of the metal support layer 4 in the thickness direction, and a plurality of recesses 8 recessed in the thickness direction of the metal support layer 4. The plurality of recesses 8 form a dot pattern DP. Each of the dots 82 in the dot pattern DP has one concave surface 84. The concave surface 84 has a generally spherical crown shape or a generally conical shape.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a wired circuit board and a wired circuit board assembly, and more particularly to a wired circuit board and a wired circuit board assembly including a plurality of wired circuit boards. [Background technology]

[0002] It is known to provide a two-dimensional code on a wired circuit board to manage the wired circuit board (see, for example, Patent Document 1). The wired circuit board described in Patent Document 1 includes a metal support layer, an insulating layer disposed on the upper surface thereof, and a dot pattern (two-dimensional code) disposed on the upper surface of the metal support layer and distributed two-dimensionally. In the description of Patent Document 1, the dot pattern is formed by etching the upper surface of the metal support layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-127119 Summary of the Invention [Problem to be solved by the invention]

[0004] The upper surface of the metal support layer may have streaky grooves due to the manufacturing process of the metal support layer, which includes rolling a metal sheet. If a dot pattern is formed on the upper surface of the metal support layer 4, the grooves and dots may coexist, which may result in poor recognition of the dot pattern.

[0005] The present invention provides a wired circuit board and a wired circuit board assembly that can suppress poor recognition of dot patterns. [Means for solving the problem]

[0006] The present invention (1) includes a wired circuit board comprising a metal support layer, an insulating layer disposed on one side of the metal support layer in the thickness direction, and a wiring layer disposed on one side of the insulating layer in the thickness direction, and further comprising a plurality of groove portions and a plurality of recesses recessed in the thickness direction of the metal support layer, disposed on one and / or the other side of the metal support layer in the thickness direction, wherein the plurality of recesses form a dot pattern, and each of the plurality of dots in the dot pattern has one concave surface, and the concave surface has an approximately spherical crown shape or an approximately conical shape.

[0007] In this wired circuit board, each of the dots in the dot pattern has a concave surface, and the concave surface has a generally spherical crown shape or a generally conical shape. The concave surface is therefore easier to recognize than a groove portion. Therefore, even if the wired circuit board has a groove portion, poor recognition of the dot pattern can be suppressed.

[0008] The present invention (2) includes the wired circuit board according to (1), wherein the dots are located on the outer peripheral edge of the recess and further have raised surfaces that rise in the thickness direction.

[0009] This wired circuit board further has a raised surface located on the outer peripheral edge of the recess, making the recess even more easily recognizable.

[0010] The present invention (3) includes the wired circuit board according to (1) or (2), wherein the depth D2 of the recess is equal to or greater than the depth D1 of the groove.

[0011] Since the depth D2 of the recess is equal to or greater than the depth D1 of the groove, the recess is even more easily recognized.

[0012] The present invention (4) includes the wired circuit board according to any one of (1) to (3), wherein the diameter of the recess when viewed in the thickness direction is 50 μm or less.

[0013] Since the diameter of the recesses is 50 μm or less, the recess formation area can be made compact, while the amount of information in the dot pattern can be increased.

[0014] The present invention (5) includes the wired circuit board according to any one of (1) and (4), wherein the dot pattern is a two-dimensional code.

[0015] The present invention (6) includes the wired circuit board according to any one of (1) to (5), wherein the recess is a laser mark.

[0016] In this wired circuit board, the recesses are laser marks, so that recognition failures can be reduced compared to recesses formed by etching.

[0017] The present invention (7) includes a wired circuit board assembly comprising a metal frame and a plurality of wired circuit boards according to any one of (1) to (6) arranged inside the metal frame, the metal frame and the metal support layer being included in a common metal support plate, and a plurality of groove portions being formed in the metal support plate.

[0018] This wired circuit board assembly includes the above-described wired circuit board, and therefore, it is possible to suppress poor recognition of the dot pattern. [Effects of the Invention]

[0019] The wired circuit board and wired circuit board assembly of the present invention can suppress poor recognition of dot patterns. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a plan view of one embodiment of a wired circuit board assembly of the present invention. [Figure 2] FIG. 2 is a cross-sectional view taken along line XX shown in FIG. [Figure 3] 2 is a plan view of a recessed portion forming region of the wired circuit board assembly in FIG. 1. FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along line XX in FIG. 3. [Figure 5] FIG. 4 is a cross-sectional view taken along line YY in FIG. [Figure 6]6A to 6D are manufacturing process diagrams for the wired circuit board assembly shown in FIG. 2. FIG. 6A shows a process for preparing a metal support plate. FIG. 6B shows a process for forming a base insulating layer, a wiring layer, and a cover insulating layer. FIG. 6C shows a process for processing the outer shape of the metal support plate. FIG. 6D shows a process for forming a plurality of recesses. [Figure 7] 7A-7C illustrate laser irradiation. FIGS. 7A and 7B show an embodiment in which a pulsed laser is irradiated multiple times along the circumferential direction. FIG. 7A shows the movement of multiple pulses. FIG. 7B shows the irradiation of each pulse. FIG. 7C shows an embodiment in which the direction of pulse movement in the inner portion is opposite to the direction of pulse movement in the outer portion. [Figure 8] In this embodiment, the laser diameter of the pulsed laser is increased each time the number of irradiations increases. Figure 8A shows the first pulse, Figure 8B shows the second pulse, and Figure 8C shows the third pulse. [Figure 9] FIG. 10 is a cross-sectional view of a recessed portion of a modified example. [Figure 10] FIG. 10 is a cross-sectional view of a recess in a conventional example. DETAILED DESCRIPTION OF THE INVENTION

[0021] An embodiment of the wired circuit board and wired circuit board assembly of the present invention will be described with reference to FIGS. 1 to 8C.

[0022] 1. Wired circuit board assembly 1 As shown in Figures 1 and 2, the wired circuit board assembly 1 has a thickness. The wired circuit board assembly 1 extends in a planar direction. The planar direction is perpendicular to the thickness direction. The wired circuit board assembly 1 has a flat plate shape. In this embodiment, the wired circuit board assembly 1 has, for example, a substantially rectangular shape when viewed from one side in the thickness direction. The wired circuit board assembly 1 includes a metal frame 2 and a plurality of wired circuit boards 3.

[0023] 1.1 Metal Frame 2 The metal frame 2 extends in the planar direction. The metal frame 2 includes an outer frame 21 and an inner frame 22. The outer frame 21 has a rectangular frame shape when viewed from one side in the thickness direction. The inner frame 22 has a lattice shape when viewed from one side in the thickness direction. The inner frame 22 is continuous with the inner surface of the outer frame 21.

[0024] The metal frame 2 has a configuration similar to that of the metal support layer 4, excluding recesses 8 described later. Specifically, the metal frame 2 has one surface 4SA and another surface 4SB in the thickness direction. Each of the one surface 4SA and the other surface 4SB includes a flat portion 4P. Examples of materials for the metal frame 2 include metal. Examples of metals include copper, copper alloys, and stainless steel alloys. The thickness of the metal frame 2 is, for example, 10 μm or more, preferably 15 μm or more. The thickness of the metal frame 2 is, for example, 500 μm or less, preferably 250 μm or less. In this embodiment, a plurality of groove portions 40 are formed on each of the one surface 4SA and the other surface 4SB of the metal frame 2. The groove portions 40 are stripe-like grooves. The groove portions 40 are inevitably formed during the manufacture of a metal supporting board 45 (described later). For example, the metal frame 2 is formed into a plate shape by rolling a metal sheet. In such a case, when the metal sheet is rolled, the groove portions 40 are formed as rolling streaks on each of the one surface 4SA and the other surface 4SB of the metal frame 2 in the thickness direction.

[0025] 1.2 Wiring circuit board 3 A plurality of wired circuit boards 3 are arranged inside the metal frame 2. The plurality of wired circuit boards 3 are arranged at intervals from one another in the planar direction. In this embodiment, the wired circuit boards 3 are aligned in both the first direction and the second direction. The first direction is included in the planar direction. The second direction is included in the planar direction and is perpendicular to the first direction. The wired circuit boards 3 are connected to (supported by) the metal frame 2 via joints 20.

[0026] The wired circuit board 3 extends in the planar direction. In this embodiment, the wired circuit board 3 has, for example, a rectangular shape when viewed from one side in the thickness direction. The wired circuit board 3 is flexible. The wired circuit board 3 includes a metal support layer 4, a base insulating layer 5 as an example of an insulating layer, a wiring layer 6, and a cover insulating layer 7.

[0027] 1.2.1 Metal support layer 4 The metal support layer 4 is disposed at the other end of the wired circuit board 3 in the thickness direction. The metal support layer 4 has a thickness. The metal support layer 4 has one side 4SA and the other side 4SB in the thickness direction. The other side 4SB forms the other side of the wired circuit board 3 in the thickness direction. The one side 4SA and the other side 4SB each include a flat portion 4P. The metal support layer 4 forms the outer shape of the wired circuit board 3 when viewed from one side in the thickness direction. The material and thickness of the metal support layer 4 are the same as those of the metal frame 2 described above.

[0028] 1.2.2 Groove 40 In this embodiment, a plurality of grooves 40 are formed on each of the one surface 4SA and the other surface 4SB of the metal support layer 4. That is, the wired circuit board 3 has a plurality of grooves 40.

[0029] The streak groove portion 40 is a streak-like groove. The streak groove portion 40 is inevitably formed in the manufacturing of the metal supporting board 45 (described later). For example, the metal supporting layer 4 is formed into a plate shape by rolling a metal sheet. In such a case, when the metal sheet is rolled, the streak groove portion 40 is formed as a rolled streak on each of one side and the other side of the metal supporting layer 4 in the thickness direction.

[0030] 3, in this embodiment, each of the plurality of grooves 40 extends along a first direction, and the grooves 40 are spaced apart from one another in a second direction.

[0031] 4, the depth D1 of the groove portion 40 is, for example, 0.1 μm or more, or further, 1 μm or more, 1.5 μm or more, 2 μm or more, or 2.5 μm or more. The depth D1 of the groove portion 40 is, for example, 30 μm or less, or further, 10 μm or less, 8 μm or less, 6 μm or less, or 5 μm or less.

[0032] 1.2.3 Base Insulation Layer 5 As shown in FIG. 2, the base insulating layer 5 is disposed on one surface 4SA of the metal support layer 4 in the thickness direction. The base insulating layer 5 has a pattern shape. The pattern shape is a shape excluding a recess formation region 80, which will be described later. The base insulating layer 5 is flexible. Examples of materials for the base insulating layer 5 include insulating resins. Examples of insulating resins include polyimide. The thickness of the base insulating layer 5 is, for example, 1 μm or more, preferably 3 μm or more. The thickness of the base insulating layer 5 is, for example, 35 μm or less.

[0033] 1.2.4 Wiring layer 6 The wiring layer 6 is disposed on one surface of the base insulating layer 5 in the thickness direction. As shown in FIG. 1 , the wiring layer 6 has a plurality of wires 61 and a plurality of terminals 62. In this embodiment, each of the plurality of wires 61 extends in a first direction. The plurality of wires 61 are spaced apart in a second direction. Each of the two terminals 62 is connected to each of both ends of the wire 61 in the first direction. Examples of materials for the wiring layer 6 include conductors. Examples of conductors include copper, copper alloys, and stainless steel. The thickness of the wiring layer 6 is, for example, 1 μm or more, preferably 3 μm or more. The thickness of the wiring layer 6 is, for example, 50 μm or less, preferably 30 μm or less.

[0034] 1.2.5 Cover insulating layer 7 As shown in FIG. 2, the cover insulating layer 7 is disposed on one surface of the base insulating layer 5 in the thickness direction. The cover insulating layer 7 covers the wiring 61 and exposes the terminals 62. The cover insulating layer 7 is flexible. Examples of materials for the cover insulating layer 7 include the insulating resins described above. The thickness of the cover insulating layer 7 is, for example, 2 μm or more, preferably 4 μm or more. The thickness of the cover insulating layer 7 is, for example, 60 μm or less, preferably 40 μm or less.

[0035] 1.2.6 Multiple recesses 8 The wired circuit board 3 further includes a recess-forming region 80. The recess-forming region 80 is provided in the metal support layer 4 within the wired circuit board 3. In this embodiment, the recess-forming region 80 is defined on one surface 4SA of the metal support layer 4 in the thickness direction. The above-mentioned base insulating layer 5, wiring layer 6, and cover insulating layer 7 are not arranged in the recess-forming region 80. That is, in the recess-forming region 80, one surface 4SA of the metal support layer 4 is exposed toward one side in the thickness direction. However, the above-mentioned groove portion 40 is also formed in the recess-forming region 80. A plurality of recesses 8 are provided in the recess-forming region 80. That is, the wired circuit board 3 further includes a plurality of recesses 8.

[0036] 1.2.7 Recess 8 Each of the recesses 8 is recessed toward the other side in the thickness direction on one surface 4SA of the metal support layer 4. As shown in Fig. 3, the recesses 8 are spaced apart from one another in the planar directions (first direction and second direction). The recesses 8 form a dot pattern DP.

[0037] The dot pattern DP is a pattern in which an arbitrary number of dots 82 are randomly arranged in the recess formation region 80. The dot pattern DP forms a two-dimensional code C. That is, the multiple recesses 8 form the two-dimensional code C within the recess formation region 80 by the dot pattern DP.

[0038] The two-dimensional code C is a code that can record, as digital data, information about the wired circuit board 3 and / or the wired circuit board assembly 1. Examples of the information include a serial number, a production lot, detailed product information, and manufacturer information. The information recorded in the two-dimensional code C can be read by a recognition device, which will be described later, based on the number and arrangement of the dots 82. Examples of the two-dimensional code C include QR Code (registered trademark), CP Code, 2 / 4 modulation code, 3 / 16 modulation code, 5 / 9 modulation code, and Data Matrix.

[0039] 4 and 5, each of the plurality of dots 82 has one concave surface 84. Furthermore, each of the plurality of dots 82 also has one raised surface 9.

[0040] 1.2.7.1 Concave 84 In this embodiment, the concave surface 84 has a conical shape. The cone is tapered toward the other side in the thickness direction. More specifically, the cone has a vertex 84V at the other end in the thickness direction. Specifically, the concave surface 84 is made up of the conical surface (generatrix) of the cone. The axis (rotation axis) 84A of the cone is along the thickness direction. The opening area of ​​the concave surface 84 in a cross section cut along the surface direction increases toward one side in the thickness direction. In this embodiment, the vertex 84V of the cone is the deepest part of the recess 8.

[0041] 1.2.7.2 Raised surface 9 The raised surface 9 is located at the outer peripheral end of the recess 8. The raised surface 9 is continuous with the outer peripheral edge of the recess 84. The raised surface 9 rises toward one side in the thickness direction. Specifically, the raised surface 9 rises toward one side in the thickness direction from the flat portion 4P in the recess formation region 80.

[0042] The raised surface 9 has a substantially circular ring shape when viewed from one side in the thickness direction. A center 9C of the ring does not overlap with the raised surface 9 when viewed from one side in the thickness direction, but overlaps (coincides with) an axis 84A of the concave surface 84 in this embodiment.

[0043] 1.2.7.3 Size of recess 8 The depth D2 of the recesses 8 is, for example, equal to or greater than the depth D1 of the groove portion 40. This further reduces the possibility of the dot pattern DP being poorly recognized. Specifically, the depth D2 of the recesses 8 is 0.1 μm or greater, preferably 0.3 μm or greater, more preferably 0.5 μm or greater, even more preferably 1.0 μm or greater, and particularly preferably 1.5 μm or greater. The depth of the recesses 8 is, for example, 100 μm or less, preferably 50 μm or less, more preferably 30 μm or less, even more preferably 15 μm or less, and particularly preferably 10 μm or less. The ratio (D1 / D2) of the depth D1 of the groove portion 40 to the depth D2 of the recesses 8 is, for example, 0.001 or greater, preferably 0.01 or greater, more preferably 0.1 or greater, and for example, 0.5 or less. The depth D2 of the recess 8 is the distance in the thickness direction from the flat portion 4P to the deepest part of the recess 8 (the apex 84V of the cone) in the recess formation region 80.

[0044] When the recess 8 is cut in a cross section along the thickness direction, the angle α formed by the two recesses 84 on the cut surface is, for example, 45 degrees or more, preferably 60 degrees or more, and is, for example, 150 degrees or less, preferably 120 degrees or less.

[0045] The raised height H of the raised surface 9 is, for example, 0.1 μm or more, preferably 0.5 μm or more, and for example, 5.0 μm or less, preferably 3.0 μm or less. The raised height H of the raised surface 9 is the distance in the thickness direction from the flat portion 4P to the highest part of the raised surface 9 in the recess formation region 80. The ratio (H / D2) of the raised height H of the raised surface 9 to the depth D2 of the recess 8 is, for example, 0.05 or more, preferably 0.1 or more, and for example, 0.5 or less, preferably 0.3 or less.

[0046] The diameter of the recesses 8 when viewed from one side in the thickness direction is, for example, 100 μm or less, preferably 50 μm or less, and for example, 5 μm or more, preferably 10 μm or more. If the diameter of the recesses 8 is equal to or less than the above-mentioned upper limit, the amount of information in the two-dimensional code C can be increased while the recess formation region 80 can be made compact. If the diameter of the recesses 8 is equal to or greater than the above-mentioned lower limit, poor recognition of the dot pattern DP can be suppressed.

[0047] 1.8 Manufacturing method As shown in FIGS. 6A to 6D, a method for manufacturing the wired circuit board assembly 1 will be described.

[0048] 1.8.1 Preparation of Metal Support Plate 45 6A, in the manufacturing method, first, a metal supporting plate 45 is prepared. The metal supporting board 45 is prepared by, for example, rolling a metal sheet.

[0049] The metal support plate 45 extends in the planar direction. The metal support plate 45 has one side 4SA and the other side 4SB in the thickness direction. The metal support plate 45 is formed on the metal frame 2 and the metal support layer 4 by the outline processing (see FIG. 6C) described below. The one side 4SA and the other side 4SB of the metal support plate 45 each have the same configuration as the one side 4SA and the other side 4SB of the metal support layer 4 described above. In other words, the one side 4SA and the other side 4SB of the metal support layer 4 have a plurality of groove portions 40. However, at this point, the metal support plate 45 does not yet have a plurality of recesses 8.

[0050] 1.8.2 Formation of the base insulating layer 5, the wiring layer 6, and the cover insulating layer 7 Next, as shown in FIG. 6B, the insulating base layer 5, the wiring layer 6, and the insulating cover layer 7 are formed in this order on one side of the metal support plate 45 in the thickness direction.

[0051] 1.8.3 Outline processing of the metal support plate 45 6C, the metal support plate 45 is then contoured to form the joint 20 (see FIG. 1). This results in the formation of the metal frame 2 and the metal support layer 4. The metal frame 2 and the metal support layer 4 are included in the common metal support plate 45.

[0052] 1.8.4 Formation of recess 8 6D, a plurality of recesses 8 are formed in the recess formation region 80 on the one surface 4SA. The recesses 8 are formed by, for example, laser irradiation.

[0053] In the laser irradiation, for example, a pulsed laser is irradiated multiple times in each circular recess formation region 80 (see dashed lines) of the multiple dots 82. Specifically, as shown in Figures 7A and 7B, the recess formation region 80 is irradiated multiple times intermittently along the circumferential direction in the inner portion, and then the pulsed laser is irradiated multiple times intermittently along the circumferential direction in the outer portion. The circumferential direction in the inner portion and the circumferential direction in the outer portion are the same as shown in Figure 7A, or opposite as shown in Figure 7B.

[0054] Alternatively, the laser diameter of the pulsed laser is varied in accordance with the number of times of irradiation. For example, as shown in FIGS. 8A to 8C, the laser diameter D of the pulsed laser is increased each time the number of times of irradiation increases. Specifically, as shown in FIG. 8A, a first pulsed laser is irradiated. Then, as shown in FIG. 8B, a second pulsed laser is irradiated with a laser diameter D larger than the laser diameter D of the first pulsed laser. As shown in FIG. 8C, a third pulsed laser is irradiated with a laser diameter D larger than the laser diameter D of the second pulsed laser. The centers of both the second and third pulsed lasers overlap with the center of the first pulsed laser.

[0055] 4 and 5, by the above-described laser irradiation, a concave surface 84 is formed on one surface 4SA together with the raised surface 9. When the recessed portion 8 is formed by laser irradiation, the recessed portion 8 is a laser mark.

[0056] It should be noted that forming the recess 8 using chemical etching is not suitable for the present invention. If chemical etching is used, the recess 84 will have a flat surface 88 along the surface direction, as shown in Figure 10, which is likely to cause poor recognition.

[0057] 1.8.5 Recognition of 2D Code C Thereafter, a recognition device (not shown) recognizes the two-dimensional code C. The recognition device is disposed, for example, on one side in the thickness direction of the wired circuit board assembly 1. The recognition device includes a light source and a detection unit.

[0058] First, light is emitted from the light source toward the one surface 4SA, and reflected light is generated at the flat portion 4P, and this reflected light reaches the detection portion.

[0059] In contrast, although reflected light is generated at the dot 82 (concave surface 84), it does not reach the detection unit. This allows the recognition device to recognize the dot 82. The above process is repeated for the multiple dots 82. This allows the recognition device to recognize the two-dimensional code C.

[0060] 2. Effects of one embodiment In the wired circuit board 3, each of the multiple dots 82 in the dot pattern DP has one concave surface 84. The concave surface 84 has a conical shape. Therefore, the concave surface 84 is easier to recognize than the groove portion 40. Therefore, even if the wired circuit board 3 includes the groove portion 40, it is possible to suppress poor recognition of the dot pattern DP.

[0061] 10, when the concave surface 84 has a flat surface 88 along the surface direction, the reflected light is recognized in the same way as the flat portion 4P, which causes the dot pattern DP to be poorly recognized. More specifically, there is weak (or no) contrast between the reflected light generated by the flat surface 88 in the concave portion 8 and the reflected light generated by the flat portion 4P around the concave portion 8, which causes the concave portion 8 to be poorly recognized.

[0062] Furthermore, if the dot 82 has a plurality of conical concave surfaces 84, each of them will be shallow, and therefore they will be easily confused with the groove portions 40, making it impossible to prevent poor recognition of the dot pattern DP.

[0063] This wired circuit board 3 further has a raised surface 9 located at the outer peripheral edge of the recessed surface 84, so that the recessed portion 8 is even more easily recognized.

[0064] If the depth D2 of the recessed surface 84 is equal to or greater than the depth D1 of the groove portion, the recessed portion 8 will be more easily recognized.

[0065] Furthermore, in the wired circuit board 1, if the diameter of the recess 8 is 50 μm or less, the recess formation region 80 can be made compact, while the amount of information in the dot pattern DP can be increased.

[0066] Unlike recesses 8 formed by etching, recesses 8 formed by laser marks can form conical concave surfaces 84. This makes it possible to prevent the dot pattern DP from being poorly recognized.

[0067] Since this wired circuit board assembly 1 includes the above-described wired circuit board 3, it is possible to suppress poor recognition of the dot pattern DP.

[0068] 3. Variations In the modified example, the same components and steps as those in the first embodiment are denoted by the same reference numerals, and detailed descriptions thereof will be omitted. Furthermore, the modified example can achieve the same effects as those in the first embodiment unless otherwise specified. Furthermore, the first embodiment and its modified example can be combined as appropriate.

[0069] As shown by the imaginary lines in FIG. 4 , the dot 82 may include a second concave surface 85. The second concave surface 85 is continuous with the outer peripheral edge of the raised surface 9. When viewed from one side in the thickness direction, the second concave surface 85 is located at the outermost end of the dot 82. When viewed from one side in the thickness direction, the second concave surface 85 is, for example, continuous in the circumferential direction. When viewed from one side in the thickness direction, the second concave surface 85 has an annular shape. The concave surface 85 is inevitably formed depending on the laser irradiation conditions. The depth D3 of the concave surface 85 is, for example, 1.0 μm or less, preferably 0.5 μm or less, and for example, 0.05 μm or more, preferably 0.1 μm or more. The ratio (D3 / D2) of the depth D3 of the recessed surface 85 to the depth D2 of the recessed portion 8 is, for example, 0.4 or less, preferably 0.2 or less, more preferably 0.1 or less, and for example, 0.001 or more.

[0070] In recognizing the two-dimensional code C, one dot 82 is recognized as one dot, although it has a concave surface 84 and a second concave surface 85.

[0071] 9, the concave surface 84 has a spherical crown shape. In this case, a cross section cut along the thickness direction has a substantially arc shape. The radius of the spherical crown (arc) is, for example, 10 μm or more, or preferably 20 μm or more, and for example, 150 μm or less, or preferably 50 μm or less.

[0072] In the present invention, the concave surface 84 may have a substantially spherical crown shape or a substantially conical shape, and is not strictly limited to a conical or spherical crown shape. For example, although not shown, the concave surface 84 may have a half spindle shape (a substantially elliptical cross section). The half spindle shape is a part of a spindle cut in a direction perpendicular to the major axis, and is also a part of an elliptical body of revolution.

[0073] Although not shown, the recesses 8 are provided on both the one surface 4SA and the other surface 4SB of the metal support layer 4.

[0074] As shown by the imaginary lines in FIG. 1, the recesses 8 can be provided in either the metal support layer 4 of the wired circuit board 3 or the outer frame 21 of the metal frame 2. [Explanation of symbols]

[0075] 1 Wired circuit board assembly 2 Metal Frame 3 Wiring circuit board 4 Metal support layer 4SA One side 4SB Other side 6 wiring layer 8 recess 9 Raised surface 10 recess 40 groove 45 Metal support plate 61 Wiring 82 dots 84 Concave 85 Concave C 2D code DP Dot Pattern

Claims

1. a metal support layer; an insulating layer disposed on one surface of the metal support layer in the thickness direction; a wiring layer disposed on one surface of the insulating layer in the thickness direction, The metal support layer further includes a plurality of grooves disposed on one surface and / or the other surface of the metal support layer in the thickness direction, and a plurality of recesses recessed in the thickness direction of the metal support layer, the plurality of recesses form a dot pattern; each of the plurality of dots in the dot pattern has one concave surface; The concave surface has a substantially spherical crown shape or a substantially conical shape.

2. The printed circuit board according to claim 1 , wherein the dots are located on the outer peripheral edge of the recessed portion and further have raised surfaces that rise in the thickness direction.

3. 3. The printed circuit board according to claim 1, wherein a depth D2 of said recess is equal to or greater than a depth D1 of said groove portion.

4. 4. The wired circuit board according to claim 1, wherein the recess has a diameter of 50 [mu]m or less when viewed in the thickness direction.

5. The printed circuit board according to claim 1 , wherein the dot pattern is a two-dimensional code.

6. The printed circuit board according to claim 1 , wherein the recess is a laser mark.

7. A metal frame and a plurality of the wired circuit boards according to any one of claims 1 to 6 arranged inside the metal frame; the metal frame and the metal support layer are included in a common metal support plate; A wired circuit board assembly, wherein a plurality of grooves are formed in the metal support plate.

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