Component Mounting Machine

Abstract

To provide a technique of collecting an electronic component determined to be not mountable appropriately for each type.SOLUTION: A component mounting device mounts a plurality of kinds of electronic components on a substrate. The component mounting device comprises: a nozzle that sucks the electronic component; a determination part that determines whether or not the electronic component sucked by the nozzle can be mounted; and a component collection part that collects the electronic component determined to be noe mountable in the determination part, includes a first collection part that collects an electronic component of a first type and a second collection part that collects an electronic component of a second type different from the electronic component of the first type, and is configured so that the height of a bottom surface of the first collection part and the height of a bottom surface of the second collection part can be changed, respectively.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a component mounter that mounts electronic components on a board. [Background technology]

[0002] Some mounters mount electronic components on circuit boards by adsorbing the components onto a nozzle and moving them to the board. This type of mounter is equipped with a determination unit that determines whether the electronic component adsorbed onto the nozzle is mountable. If the determination unit determines that the electronic component is not mountable because the nozzle is not properly adsorbed, for example, the electronic component is not mounted on the circuit board and is instead collected in a component collection unit. The component collection unit may collect multiple types of electronic components. Depending on their type, some of the electronic components collected in the component collection unit are discarded and others are reused. For example, Patent Document 1 discloses a mounter equipped with a component collection unit. The component collection unit in Patent Document 1 includes a first collection chamber that stores a predetermined type of electronic component and a second collection chamber that stores other types of electronic component. The first collection chamber includes multiple designated storage positions, and the specific types of electronic components are stored in different designated storage positions for each component type. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Application No. 2013-182970 Summary of the Invention [Problem to be solved by the invention]

[0004] In the component mounter of Patent Document 1, electronic components to be reused are sorted by type and collected. However, in Patent Document 1, the multiple designated storage positions provided in the first collection chamber have similar configurations, so some types of electronic components may not be collected properly. For example, if each designated storage position is deep, it may be difficult to remove electronic components with a small number of collections. Furthermore, if each designated storage position is deep, electronic components may be subjected to impact when being placed in the designated storage position, which may result in damage to the electronic components. On the other hand, if each designated storage position is shallow, there is a risk that electronic components with a large number of collections may not be collected sufficiently.

[0005] This specification discloses a technique for appropriately collecting electronic components determined to be unmountable by type. [Means for solving the problem]

[0006] A component mounter disclosed in this specification mounts multiple types of electronic components on a substrate. The component mounter includes a nozzle that picks up electronic components, a determination unit that determines whether the electronic components picked up by the nozzle are mountable, and a component recovery unit that recovers electronic components that are determined by the determination unit to be unmountable, the component recovery unit including a first recovery section that recovers a first type of electronic components and a second recovery section that recovers a second type of electronic components different from the first type of electronic components, and the height of the bottom of the first recovery section and the height of the bottom of the second recovery section are each adjustable.

[0007] In the component mounter, the height of the first collection section for collecting the first type of electronic components can be changed, and the height of the second collection section for collecting the second type of electronic components can be changed. This allows the heights of the component collection sections (specifically, the first and second collection sections) to be changed depending on the type of electronic components to be collected. Therefore, electronic components determined to be unmountable can be collected appropriately according to their type. [Brief explanation of the drawings]

[0008] [Figure 1]FIG. 1 is a diagram showing a schematic configuration of a component mounter according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 4 is a top view showing a schematic configuration of a part collection unit. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3 . [Figure 5] FIG. 2 is a block diagram showing a control system of the component mounter according to the embodiment. [Figure 6] 10 is a flowchart showing an example of a process for storing an electronic component sucked by a nozzle in a component recovery unit 40 when the electronic component cannot be mounted. [Figure 7] FIG. 10 is a top view showing a schematic configuration of a part collection unit according to a modified example. [Figure 8] 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7. DETAILED DESCRIPTION OF THE INVENTION

[0009] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0010] In the mounter disclosed in this specification, the material of the bottom surface of the first collection section and the material of the bottom surface of the second collection section may be changeable. With this configuration, the material of the bottom surface of the first collection section and the material of the bottom surface of the second collection section can be changed to an appropriate material depending on the type of electronic components to be collected.

[0011] In the component mounter disclosed in this specification, the first type of electronic components may be electronic components that are recycled after being collected in the first collection section. The second type of electronic components may be electronic components that are discarded after being collected in the second collection section. The height of the bottom surface of the first collection section may be higher than the height of the bottom surface of the second collection section. With this configuration, by increasing the height of the bottom surface of the first collection section that collects the electronic components to be recycled, it is possible to prevent the electronic components to be recycled from being damaged when they are collected in the first collection section. [Example]

[0012] A component mounter 10 according to an embodiment will be described with reference to the drawings. The component mounter 10 is a device that mounts electronic components 4 on a circuit board 2. The component mounter 10 is also called an electronic component placement device or a chip mounter. Typically, the component mounter 10 is installed alongside other board work machines such as a solder printer and a board inspection machine, forming a continuous mounting line.

[0013] 1 and 2, the component mounter 10 includes a plurality of component feeders 12, a feeder holder 14, a mounting head 16, a head moving device 18, a board conveyor 20, an imaging device 30, a component collection unit 40, a control device 26, and a touch panel 24. A management device 8 configured to be able to communicate with the component mounter 10 is disposed outside the component mounter 10.

[0014] Each component feeder 12 stores a plurality of electronic components 4. The component feeders 12 are detachably attached to the feeder holder 14 and supply the electronic components 4 to the mounting head 16. The specific configuration of the component feeders 12 is not particularly limited. Each component feeder 12 may be, for example, a tape feeder that supplies a plurality of electronic components 4 stored on a tape, a tray feeder that supplies a plurality of electronic components 4 stored on a tray, or a bulk feeder that supplies a plurality of electronic components 4 stored randomly in a container.

[0015] The feeder holding unit 14 has a plurality of slots, each of which can detachably accommodate a component feeder 12. The feeder holding unit 14 may be fixed to the component mounter 10, or may be detachable from the component mounter 10.

[0016] The placement head 16 has a nozzle 6 that picks up the electronic component 4. The nozzle 6 is detachably attached to the placement head 16. The placement head 16 is capable of moving the nozzle 6 in the Z direction (here, the vertical direction) to move the nozzle 6 toward and away from the component feeder 12 and the circuit board 2. The placement head 16 can pick up the electronic component 4 from the component feeder 12 using the nozzle 6, and can also place the electronic component 4 picked up by the nozzle 6 onto the circuit board 2. Note that the placement head 16 is not limited to one having a single nozzle 6, and may be one having multiple nozzles 6.

[0017] The head moving device 18 moves the mounting head 16 between the component feeder 12 and the circuit board 2. As an example, the head moving device 18 in this embodiment is an XY robot that moves a moving base 18a in the X and Y directions, and the mounting head 16 is fixed to the moving base 18a. The head moving device 18 is capable of translating the nozzle 6 in a plane (XY plane) parallel to the surface of the circuit board 2. Note that the mounting head 16 is not limited to being fixed to the moving base 18a, but may be detachably attached to the moving base 18a.

[0018] The board conveyor 20 is a device that carries in, positions, and carries out the circuit board 2. As an example, the board conveyor 20 of this embodiment includes a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below.

[0019] The imaging device 30 is disposed between the component feeder 12 and the board conveyor 20 (more specifically, the board conveyor 20 of the pair of board conveyors 20 that is installed on the component feeder 12 side). The imaging device 30 includes a camera and a light source. The camera is disposed so that its imaging direction faces upward, and captures an image of the nozzle 6 from below while it is holding an electronic component 4. That is, when the nozzle 6 picks up the electronic component 4, the camera captures an image of the bottom surface of the electronic component 4 held by the nozzle 6. For example, a CCD camera is used as the camera. The light source is constituted by an LED, and illuminates the bottom surface (imaging surface) of the electronic component 4 held by the nozzle 6. Image data of the image captured by the imaging device 30 is stored in a memory (not shown) of the control device 26.

[0020] The component recovery unit 40 recovers electronic components 4 supplied from the component feeder 12 that are determined to be incapable of being mounted on the circuit board 2. The determination of whether an electronic component 4 can be mounted on the circuit board 2 is performed by the control device 26. Examples of electronic components 4 determined to be incapable of being mounted on the circuit board 2 include electronic components 4 with defects or chipping (hereinafter also referred to as "defective electronic components 4") and electronic components 4 that were not properly picked up by the nozzle 6 (hereinafter also referred to as "mis-picked electronic components 4"). Mounting a defective electronic component 4 on the circuit board 2 may result in the production of a circuit board 2 that includes a defective electronic component 4. Furthermore, when supplied from the component feeder 12, the electronic component 4 may be picked up at a position that is not appropriate for the nozzle 6. If the electronic component 4 is not properly picked up by the nozzle 6, it cannot be mounted in the appropriate position on the circuit board 2. Electronic components 4 determined to be incapable of being mounted on the circuit board 2 are not mounted on the circuit board 2 and are stored in the component recovery unit 40.

[0021] 2 to 4, the parts recovery section 40 includes a reusable parts storage section 42 and a waste parts storage section 48. The reusable parts storage section 42 and the waste parts storage section 48 are placed on a support base 50 made of a conductive material.

[0022] Both the reusable component storage section 42 and the discarded component storage section 48 have a rectangular box shape when viewed from above. The reusable component storage section 42 and the discarded component storage section 48 store therein electronic components 4 supplied from the component feeder 12 that have been determined not to be mountable on the circuit board 2.

[0023] Whether electronic components 4 determined to be unmountable on a circuit board 2 are stored in the reusable component storage section 42 or the discarded component storage section 48 is determined based on the type of electronic component 4. Specifically, the reusable component storage section 42 stores electronic components 4 that are to be considered for reuse after collection, while the discarded component storage section 48 stores electronic components 4 that are to be discarded after collection. As described above, electronic components 4 determined to be unmountable on a circuit board 2 include not only defective electronic components 4 but also electronic components 4 that have failed to be picked up. Some of the failed electronic components 4 can be reused. However, for inexpensive electronic components 4 or small electronic components 4, for example, using new electronic components 4 can reduce costs rather than considering whether they can be reused after collection. On the other hand, for expensive electronic components 4, even if considering whether they can be reused after collection, finding and reusing reusable electronic components 4 can reduce costs. For each of the multiple types of electronic components 4, a worker or manager decides whether to store them in the reused components storage section 42 (i.e., whether to consider whether to reuse them after collection) or in the discarded components storage section 48 (i.e., whether to discard them after collection). Note that the electronic components 4 for which it is considered whether to reuse them after collection also include those that cannot be reused, but hereinafter, the type of electronic components 4 for which it is considered whether to reuse them after collection will be referred to as "electronic components 4 to be reused." Furthermore, the type of electronic components 4 that are discarded after collection without considering whether to reuse them will be simply referred to as "electronic components 4 to be discarded."

[0024] The reused component storage section 42 is located closer to the component feeder 12 than the discarded component storage section 48. The reused component storage section 42 stores electronic components 4 to be reused, and therefore must be handled in a manner that prevents defects or breakage when the components are removed from the component mounter 10 after collection. By locating the reused component storage section 42 on the component feeder 12 side, it becomes easier for workers to remove the electronic components 4 stored in the reused component storage section 42.

[0025] As shown in FIG. 4 , the reusable component storage section 42 includes a collection section 44 and a support section 46. The collection section 44 is disposed on the upper side of the reusable component storage section 42. The collection section 44 has a rectangular cylindrical shape when viewed from above, and is provided with a space for storing electronic components 4 to be reused. The support section 46 is disposed below the collection section 44. The support section 46 has a cubic shape, and when viewed from above, its outer periphery coincides with the outer periphery of the collection section 44. The outer periphery of the upper surface of the support section 46 is connected to the lower end of the collection section 44, and the other parts are exposed. The support section 46 is formed of a conductive material. When storing electronic components 4 in the reusable component storage section 42, the electronic components 4 are placed on the exposed upper surface of the support section 46.

[0026] The reusable component storage section 42 includes the support portions 46, so that the surface on which the electronic components 4 are placed is positioned at a high position. In other words, the support portions 46 create a raised bottom for the reusable component storage section 42. This reduces the fall distance of the electronic components 4 when the electronic components 4 are placed in the reusable component storage section 42, thereby reducing the risk of the electronic components 4 being subjected to impact. The reusable component storage section 42 stores electronic components 4 to be reused. By elevating the position of the surface of the reusable component storage section 42 on which the electronic components 4 are placed, it is possible to prevent the electronic components 4 to be reused from becoming defective during collection. Furthermore, since the support portions 46 of the reusable component storage section 42 are formed of a conductive material, the surface on which the electronic components 4 are placed is also formed of a conductive material. Furthermore, the support base 50 is also formed of a conductive material. Therefore, static electricity generated when the electronic components 4 are placed in the reusable component storage section 42 can be dissipated to the outside via the support portions 46 and the support base 50, thereby preventing the electronic components 4 to be reused from becoming defective during collection. The reusable parts storage section 42 is not limited to the above configuration and can be implemented in various forms. For example, the reusable parts storage section can be configured with a cylindrical member with open upper and lower ends and a bottom member that is detachably placed inside the cylindrical member. When the bottom member is placed inside the cylindrical member, the bottom surface of the bottom member is in contact with the support base 50. In such a configuration, the height of the bottom surface of the reusable parts storage section 42 can be easily changed by preparing multiple bottom members of different heights.

[0027] The discarded component storage section 48 is disposed closer to the board conveyor 20 than the reusable component storage section 42 (see FIG. 2 ). In this embodiment, the material of the discarded component storage section 48 is not particularly limited. As shown in FIG. 4 , the surface of the discarded component storage section 48 on which the electronic components 4 are placed is lower than the surface of the reusable component storage section 42 on which the electronic components 4 are placed. In other words, the discarded component storage section 48 does not have a portion corresponding to the support section 46 of the reusable component storage section 42 and does not have a raised bottom. This increases the space for storing the electronic components 4 within the discarded component storage section 48, allowing it to store a larger number of electronic components 4. However, since the discarded component storage section 48 stores electronic components 4 to be discarded, there is no problem even if the electronic components 4 are damaged by impact or the like when being stored in the discarded component storage section 48.

[0028] The control device 26 is configured using a computer including a CPU and a storage device. The control device 26 controls the operation of each unit of the component mounter 10 based on a production program transmitted from the management device 8. As shown in FIG. 5 , the control device 26 is connected to the head moving device 18, the board conveyor 20, the touch panel 24, and the imaging device 30, and controls each unit of the head moving device 18, the board conveyor 20, the touch panel 24, and the imaging device 30. The memory (not shown) of the control device 26 pre-stores the types of electronic components 4 to be reused. The types of electronic components 4 to be reused are input into the management device 8 by an operator and transmitted from the management device 8 to the control device 26. The touch panel 24 is a display device that provides the operator with various information about the component mounter 10, and is also an input device that receives instructions and information from the operator.

[0029] Next, a process for storing an electronic component 4 picked up by the nozzle 6 in the component recovery unit 40 when the electronic component 4 cannot be mounted will be described. As shown in FIG. 6 , first, the control device 26 causes the nozzle 6 to pick up an electronic component 4 supplied from the component feeder 12 (S12). Specifically, the control device 26 moves the nozzle 6 to a position above the supply position of the component feeder 12. Next, the control device 26 lowers the nozzle 6. Then, the nozzle 6 picks up the electronic component 4.

[0030] Next, the control device 26 uses the imaging device 30 to capture an image of the electronic component 4 sucked onto the nozzle 6 (S14). Specifically, the control device 26 moves the moving base 18a so that the electronic component 4 sucked onto the nozzle 6 is positioned above the imaging device 30. Then, the control device 26 causes the imaging device 30 to capture an image of the electronic component 4 from below.

[0031] Next, the control device 26 determines whether the electronic component 4 picked up by the nozzle 6 can be mounted based on the captured image taken in step S14 (S16). Information about each electronic component 4, such as the shape and dimensions of each electronic component 4, is stored in a memory (not shown) of the control device 26. If the outer shape of the electronic component 4 in the captured image taken in step S14 does not match the outer shape of the electronic component 4 captured by the imaging device 30 when the electronic component 4 is properly picked up by the nozzle 6, the control device 26 determines that the electronic component 4 cannot be mounted. This applies, for example, to cases where the electronic component 4 has a defect such as a chip, or where the electronic component 4 is picked up by the nozzle 6 in an offset position or rotated horizontally, and the like, and the electronic component 4 is not properly picked up by the nozzle 6. If it is determined that the electronic component 4 picked up by the nozzle 6 can be mounted (YES in step S16), the control device 26 mounts the electronic component 4 picked up by the nozzle 6 on the circuit board 2 (S18).

[0032] On the other hand, if it is determined that the electronic component 4 picked up by the nozzle 6 cannot be mounted (NO in step S16), the control device 26 determines whether the electronic component 4 picked up by the nozzle 6 is an electronic component 4 to be reused (S20). As described above, the type of electronic component 4 to be reused is selected by the worker or manager and is stored in advance in the memory (not shown) of the control device 26.

[0033] If the electronic component 4 sucked by the nozzle 6 is an electronic component 4 to be reused (YES in step S20), the control device 26 places the electronic component 4 sucked by the nozzle 6 in the reusable component storage section 42 (S22). Specifically, the control device 26 moves the nozzle 6 above the reusable component storage section 42 and drops the electronic component 4 above the reusable component storage section 42. As described above, the reusable component storage section 42 has a raised bottom, and the surface of the reusable component storage section 42 on which the electronic component 4 is placed is positioned high. This shortens the falling distance of the electronic component 4, thereby preventing the electronic component 4 from becoming defective due to damage when the electronic component 4 is placed in the reusable component storage section 42. Furthermore, the surface of the reusable component storage section 42 on which the electronic component 4 is placed is made of a conductive material. This allows static electricity to be dissipated to the reusable component storage section 42 (specifically, the support section 46), even if static electricity is generated when the electronic component 4 comes into contact with the surface of the reusable component storage section 42 on which the electronic component 4 is placed. Therefore, when the electronic components 4 are accommodated in the reusable component accommodating section 42, the electronic components 4 can be prevented from becoming defective due to static electricity.

[0034] When the electronic components 4 are accommodated in the reusable component storage section 42, the control device 26 may lower the nozzle 6 above the reusable component storage section 42. This further shortens the falling distance of the electronic components 4, and further reduces the impact on the electronic components 4 when they come into contact with the surface of the reusable component storage section 42 on which the electronic components 4 are placed. This further reduces the possibility that the electronic components 4 will become defective when they are accommodated in the reusable component storage section 42.

[0035] On the other hand, if the electronic component 4 sucked by the nozzle 6 is not an electronic component 4 to be reused (NO in step S20), the control device 26 stores the electronic component 4 sucked by the nozzle 6 in the waste component storage section 48 (S22). Specifically, the control device 26 moves the nozzle 6 above the waste component storage section 48 and drops the electronic component 4 above the waste component storage section 48.

[0036] In this embodiment, the parts recovery section 40 includes two sections, the reusable parts storage section 42 and the discarded parts storage section 48, but is not limited to this configuration. For example, the reusable parts storage section 42 may be configured to be further divisible into multiple sections.

[0037] 7 and 8 illustrate an example in which the reusable component storage section 142 is divided into two sections. As shown in FIGS. 7 and 8, the reusable component storage section 142 includes a first storage section 142a and a second storage section 142b. As shown in FIG. 8, the surface of the first storage section 142a on which the electronic components 4 are placed is higher than the surface of the second storage section 142b on which the electronic components 4 are placed. The reusable component storage section 142 stores two different types of electronic components 4. Of the two types of electronic components 4, the more expensive electronic component 4 is referred to as the first electronic component 4, and the other electronic component 4 is referred to as the second electronic component 4. In this case, the first electronic component 4 is stored in the first storage section 142a, and the second electronic component 4 is stored in the second storage section 142b. By storing two different types of electronic components 4 in different storage sections 142a and 142b, the multiple electronic components 4 to be reused are stored in different locations by type, eliminating the need to separate the multiple electronic components 4 to be reused by type after collection. Furthermore, by storing the more expensive first electronic component 4 of the two types of electronic components 4 in the first storage section 142a, which has a higher surface for placing the electronic components 4, the possibility that the more expensive first electronic component 4 will become defective during collection can be reduced. While the reused component storage section 142 is divided into two sections in the above example, the reused component storage section may be divided into three or more sections. Furthermore, the heights of the surfaces for placing the electronic components 4 may be different or the same in the divided sections.

[0038] In addition, in this embodiment, whether or not the electronic component 4 sucked onto the nozzle 6 can be mounted is determined from an image captured by the imaging device 30 that captures an image of the electronic component 4 sucked onto the nozzle 6 from below, but the present invention is not limited to this configuration. For example, whether or not the electronic component 4 sucked onto the nozzle 6 can be mounted may be determined from an image captured by an imaging device that captures an image of the electronic component 4 sucked onto the nozzle 6 from the side.

[0039] Points to note regarding the component mounting system 1 described in the embodiment will be described below. The control device 26 in the embodiment is an example of a "determination unit," the reuse component storage unit 42 is an example of a "first recovery unit," and the waste component storage unit 48 is an example of a "second recovery unit."

[0040] Although specific examples of the technology disclosed in this specification have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Furthermore, the technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings simultaneously achieves multiple objectives, and achieving one of those objectives itself has technical utility. [Explanation of symbols]

[0041] 2: Circuit board 4: Electronic components 6: Nozzle 10: Component mounter 12: Parts feeder 14: Feeder holder 16: Mounting head 18: Head moving device 20: PCB conveyor 24: Touch panel 26: Control device 30: Imaging device 40: Parts Collection Department 42: Reusable parts storage area 48: Waste parts storage area

Claims

1. A component mounter that mounts multiple types of electronic components on a substrate, a nozzle for suctioning the electronic component; a determination unit that determines whether or not the electronic component sucked by the nozzle can be mounted; a component recovery unit that recovers electronic components that are determined by the determination unit to be unmountable, a first collection section for collecting a first type of electronic component; a second collection section that collects a second type of electronic component that is different from the first type of electronic component; a part collection section configured so that the height of a bottom surface of the first collection section and the height of a bottom surface of the second collection section can be changed; Equipped with the first type of electronic components are electronic components that are recycled after being collected by the first collection section, the second type of electronic components are electronic components that are to be discarded after being collected by the second collection section, A component mounter, wherein the height of the bottom surface of the first collection section is higher than the height of the bottom surface of the second collection section.

2. The mounter according to claim 1 , wherein the material of the bottom surface of the first collection portion and the material of the bottom surface of the second collection portion are each changeable.

Images