Printable liquid encapsulant, chip and method for preparing same

Abstract

The present invention provides a liquid molding gum for printing, chips, and a method for preparing the same. The liquid molding gum for printing contains, by weight, 10 to 20 parts of an epoxy resin, 100 to 200 parts of silicon dioxide, 15 to 25 parts of a curing agent, 1 to 5 parts of a reactive diluent, 0.1 to 0.5 parts of a latent curing agent, 0.1 to 1 part of a coupling agent, and 0.1 to 0.5 parts of a colorant. The epoxy resin contains N-(2-methylphenyl)-N-(1,2-epoxypropyl)-oxiranemethanamine. Due to the synergistic effects of the components in the liquid molding gum for printing, the printing molding gum not only enables the two steps of chip bottom filling and external molding to be completed in one step, but also reduces warpage after curing and improves chip production yield.

Description

[Technical Field]

[0001] The present invention relates to the field of semiconductor chip packaging technology, and in particular to a printing liquid Encapsulating materials , chips and methods for preparing same. [Background technology]

[0002] In recent years, chip packaging technology has been developing towards higher speed, larger size, more pins, and higher power. Bottom filler gum is one of the essential materials required for chip packaging. It is used to fill the gap between the chip and the substrate and harden to form a bottom filler material to protect the chip, substrate, and welding nodes, making the parts more applicable and reliable.

[0003] In the chip preparation process, in addition to filling the bottom of the chip, it is also necessary to coat the outside of the chip and the bottom filling layer with a packaging layer, and the bottom filling layer and the packaging layer have different functions and correspondingly different material components. Currently, two different material components are usually used for the filling layer and the packaging layer, and after the filling layer and the packaging layer are manufactured, an identification layer is further laid on the surface, which makes the chip preparation process complicated and requires consideration of the connection between each preparation layer and the degree of warping after curing.

[0004] Therefore, in order to complete the two steps of chip bottom filling and external molding in one step and reduce the degree of warping after curing, Encapsulating materials Therefore, how to provide the chip and its preparation method is a technical problem that we must urgently solve. Summary of the Invention [Problem to be solved by the invention]

[0005] The object of the present invention is to provide a printing liquid in order to solve at least the above technical problems. Encapsulating materials The present invention provides a chip and a method for preparing the same. [Means for solving the problem]

[0006] In a first aspect of the present invention, in order to achieve the above object, a printing liquid Encapsulating materials The printing liquid Encapsulating materials comprises, by weight, 10 to 20 parts of epoxy resin, 100 to 200 parts of silicon dioxide, 15 to 25 parts of curing agent, 1 to 5 parts of reactive diluent, 0.1 to 0.5 parts of latent curing agent, 0.1 to 1 part of coupling agent, and 0.1 to 0.5 parts of colorant, wherein the epoxy resin comprises N-(2-methylphenyl)-N-(1,2-epoxypropyl)-oxiranemethanamine.

[0007] In a first embodiment, the latent curing agent comprises at least one of 2-ethyl-4-methylimidazole and a microcapsule-modified imidazole epoxy composition.

[0008] In a first embodiment, the curing agent comprises methyl nadic anhydride.

[0009] In a first embodiment, the reactive diluent comprises a DCPDM type epoxy resin having the structural formula: JPEG0007799368000001.jpg1763.

[0010] In a first embodiment, the coupling agent comprises 3-glycidyloxypropyltrimethoxysilane.

[0011] In a first embodiment, the colorant comprises carbon black.

[0012] In a second aspect of the present invention, the printing liquid according to the first aspect is Encapsulating materialsThe method for preparing the epoxy resin composition includes the steps of: stirring and mixing components, in parts by weight, including at least 10 to 20 parts of epoxy resin, 100 to 200 parts of silicon dioxide, 15 to 25 parts of curing agent, 1 to 5 parts of reactive diluent, 0.1 to 0.5 parts of latent curing agent, 0.1 to 1 part of coupling agent, and 0.1 to 0.5 parts of colorant, to obtain a premixed slurry; transferring the premixed slurry to a three-roll mill and grinding it; crushed slurry and obtaining the crushed slurry The mixture is vacuum degassed to form a liquid for printing. Encapsulating materials and obtaining:

[0013] In a third aspect of the present invention, there is provided a method for preparing a chip, the method comprising the steps of obtaining a chip body, providing templates at both ends of the chip body that are higher than the chip body, and applying a printing liquid such as that described in the first aspect to the template at one end. Encapsulating materials and scraping the printing liquid at room temperature using a rubber scraper. Encapsulating materials the steps of: spreading the paste evenly on the templates at both ends; hardening the paste; and removing the templates at both ends after hardening to obtain a chip.

[0014] In a third embodiment, the marking is done directly on the surface of the chip.

[0015] In a fourth aspect of the present invention, there is provided a chip comprising a chip body and a molding layer, the molding layer comprising a printing liquid as described in the first aspect. Encapsulating materials and the molding layer is coated on the chip body. [Effects of the Invention]

[0016] The printing liquid provided by the present invention Encapsulating materialscomprises, by weight, 10 to 20 parts of epoxy resin, 100 to 200 parts of silicon dioxide, 15 to 25 parts of curing agent, 1 to 5 parts of reactive diluent, 0.1 to 0.5 parts of latent curing agent, 0.1 to 1 part of coupling agent, and 0.1 to 0.5 parts of colorant, wherein the epoxy resin comprises N-(2-methylphenyl)-N-(1,2-epoxypropyl)-oxiranemethanamine, and is converted into a printing liquid with the reactive diluent to perform bottom filling and external molding for chips. Encapsulating materials It improves the wettability of the printing liquid during printing. Encapsulating materials The gum solution flows and becomes flat. At the same time, low viscosity N-(2-methylphenyl)-N-(1,2-epoxypropyl)-oxiranemethanamine is used as the epoxy resin base and silicon dioxide is used as the filler, forming an island structure between the two. The coupling agent promotes the compatibility between the epoxy resin base and the filler, resulting in a printing liquid. Encapsulating materials Furthermore, the printing liquid Encapsulating materials It can reduce the degree of warping after curing, and by adding a latent curing agent, it can Encapsulating materials This improves the quality of the printed liquid and also improves the efficiency of chip production. Encapsulating materials The synergistic effect of each component in Encapsulating materials This not only completes the two steps of chip bottom filling and external molding in one step, but also reduces the degree of warpage after curing, improving chip manufacturing yield. [Brief explanation of the drawings]

[0017] In the following, in order to more clearly explain the embodiments of this specification or the technical solutions in the prior art, we will briefly introduce the drawings that need to be used in the embodiments. However, the drawings in the following description are only some embodiments of the present invention, and it is obvious to those skilled in the art that other drawings can be obtained based on these drawings without any creative work. [Figure 1] FIG. 1 is a schematic diagram of the method for preparing the chips provided in the examples of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0018] The present invention will be described in detail below with reference to specific embodiments and examples, which will make the advantages and effects of the present invention more apparent. Those skilled in the art should understand that these specific embodiments and examples are for the purpose of illustrating the present invention and are not intended to limit the present invention.

[0019] Throughout the specification, unless otherwise specified, the terms used herein are understood to have the meanings commonly used in the art. Therefore, unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this invention belongs. In the event of a conflict, the present specification shall prevail.

[0020] Unless otherwise specified, all raw materials, reagents, instruments, and devices used in the present invention can be purchased from the market or obtained by existing methods.

[0021] The printing liquid provided in this application Encapsulating materials comprises, by weight, 10 to 20 parts of epoxy resin, 100 to 200 parts of silicon dioxide, 15 to 25 parts of curing agent, 1 to 5 parts of reactive diluent, 0.1 to 0.5 parts of latent curing agent, 0.1 to 1 part of coupling agent, and 0.1 to 0.5 parts of colorant, wherein the epoxy resin comprises N-(2-methylphenyl)-N-(1,2-epoxypropyl)-oxiranemethanamine.

[0022] Specifically, the printing liquid provided by the present invention Encapsulating materialscomprises, by weight, 10 to 20 parts of epoxy resin, 100 to 200 parts of silicon dioxide, 15 to 25 parts of curing agent, 1 to 5 parts of reactive diluent, 0.1 to 0.5 parts of latent curing agent, 0.1 to 1 part of coupling agent, and 0.1 to 0.5 parts of colorant, wherein the epoxy resin comprises N-(2-methylphenyl)-N-(1,2-epoxypropyl)-oxiranemethanamine, and is converted into a printing liquid with the reactive diluent to perform bottom filling and external molding for chips. Encapsulating materials It improves the wettability of the printing liquid during printing. Encapsulating materials The gum solution flows and becomes flat. At the same time, low viscosity N-(2-methylphenyl)-N-(1,2-epoxypropyl)-oxiranemethanamine is used as the epoxy resin base and silicon dioxide is used as the filler, forming an island structure between the two. The coupling agent promotes the compatibility between the epoxy resin base and the filler, resulting in a printing liquid. Encapsulating materials Furthermore, the printing liquid Encapsulating materials It can reduce the degree of warping after curing, and by adding a latent curing agent, it can Encapsulating materials This improves the quality of the printed liquid and also improves the efficiency of chip production. Encapsulating materials The synergistic effect of each component in Encapsulating materials This not only allows the two steps of chip bottom filling and external molding to be completed in one step, but also reduces the degree of warpage after curing and improves chip manufacturing yield.N-(2-methylphenyl)-N-(1,2-epoxypropyl)-oxiranemethanamine can be obtained by preparation or purchased from the market, for example, ADEKA Corporation's EP-3980S product.

[0023] In some possible embodiments, the latent curing agent includes at least one of 2-ethyl-4-methylimidazole and a microcapsule-modified imidazole epoxy composition.

[0024] The latent curing agent has a certain storage stability when added to the epoxy resin at room temperature, but can release its reactivity under external conditions such as heat, light irradiation, humidity, and pressure, thereby rapidly curing the epoxy resin. In this embodiment, the latent curing agent is an imidazole-based curing agent, and preferably includes at least one of 2-ethyl-4-methylimidazole and a microcapsule-modified imidazole epoxy composition. The microcapsule-modified imidazole epoxy composition can be prepared or purchased from the market, for example, product SC10208E from Shanghai Souke Purification Materials Co., Ltd.

[0025] In some possible embodiments, the curing agent includes methyl nadic anhydride, which is used to harden the epoxy resin. Methyl nadic anhydride can be obtained by preparation or purchased from the market, for example, it can be a product of Nippon Chemiphar Co., Ltd.

[0026] In some possible embodiments, the reactive diluent comprises a DCPDM type epoxy resin having the following structural formula: JPEG0007799368000002.jpg1553.

[0027] DCPDM epoxy resins are used as reactive diluents for epoxy resins, improving wettability and helping the gum solution flow and achieve a smooth surface during printing. They also have a good dilution effect, no air bubbles, and no penetration of the solution, resulting in a high product surface finish and no impact on the basic properties of cured epoxy resins, such as shrinkage, heat distortion temperature, impact strength, and tensile strength. DCPDM epoxy resins (alicyclic epoxy resins derived from epoxidized dicyclopentadiene (DCPD)) can be prepared or purchased commercially, such as ADEKA Corporation's EP-4088L product.

[0028] In some possible embodiments, the coupling agent includes 3-glycidyloxypropyltrimethoxysilane, which is used to promote compatibility between silicon dioxide and the epoxy resin substrate.

[0029] In some possible embodiments, the colorant comprises carbon black and is used for dyeing.

[0030] Based on the general inventive concept, the present application provides a printing liquid Encapsulating materials The present invention further provides a method for preparing the epoxy resin composition of the present invention, which comprises the steps of: stirring and mixing components, in parts by weight, including at least 10 to 20 parts of epoxy resin, 100 to 200 parts of silicon dioxide, 15 to 25 parts of curing agent, 1 to 5 parts of reactive diluent, 0.1 to 0.5 parts of latent curing agent, 0.1 to 1 part of coupling agent, and 0.1 to 0.5 parts of colorant, to obtain a premixed slurry; transferring the premixed slurry to a three-roll mill and grinding it; crushed slurry and obtaining the crushed slurry The mixture is vacuum degassed to form a liquid for printing. Encapsulating materials and obtaining:

[0031] Based on the general inventive concept, the present application further provides a method for preparing a chip, the method comprising the steps of obtaining a chip body, providing a template higher than the chip body on both ends of the chip body, and applying a printing liquid such as that described in the above examples to the template at one end. Encapsulating materials and scraping the printing liquid at room temperature using a rubber scraper. Encapsulating materials the steps of: spreading the paste evenly on the templates at both ends; hardening the paste; and removing the templates at both ends after hardening to obtain a chip.

[0032] The printing liquid provided in this application Encapsulating materials The printing liquid provided in the present application can be printed using a template printing process. Encapsulating materials The two steps of chip bottom filling and external molding can be completed in one step, which reduces costs and simplifies printing liquid Encapsulating materials After hardening, the surface is flat.

[0033] In some possible embodiments, the preparation method further comprises directly marking the surface of the chip.

[0034] Since marking can be done directly on the surface of the chip, the step of applying a backside protective film before marking is eliminated, shortening the chip manufacturing time and improving chip manufacturing efficiency.

[0035] Based on the general inventive concept, the present invention provides a chip comprising a chip body and a molding layer, the components of the molding layer being the printing liquid described in the above examples. Encapsulating materials and the molding layer is coated on the chip body.

[0036] The present application will be further described below with reference to specific examples. It should be understood that these examples are only used to explain the present application and do not limit the scope of the present application. In the following examples, experimental methods without specific conditions are generally measured according to Chinese national standards. If there is no corresponding national standard, they are carried out according to general international standards, conventional conditions, or conditions recommended by the manufacturer.

[0037] For Examples 1 to 3 and Comparative Examples 1 and 2, the printing liquid Encapsulating materials The printing liquid Encapsulating materials The components in parts by weight are as follows: [Table 1]

[0038] The printing liquids provided in Examples 1 to 3 and Comparative Examples 1 and 2 Encapsulating materials The viscosity (rotational viscosity) and warpage of the adhesive are tested, and the specific test process is as follows:

[0039] 1. Rotational viscosity test method: The sample is kept at a constant temperature of 25°C, and the gum solution is placed in the 6R sleeve of the Brookfield viscometer. The SC4-14 rotor is selected, and the rotation speed of the viscometer is adjusted to 20 rpm. After 4 minutes, the viscosity value is read. The gum solution that has been successfully prepared is allowed to stand for 24 hours, and the rotational viscosity for 24 hours is measured according to the above rotational viscosity test method.

[0040] 2. Warpage test method: Apply the gum solution evenly to a glass slide, bake it at 150℃ for 1 hour, and then remove it after cooling naturally. Remove any remaining resin around the glass slide, fix one side of the glass slide, and measure the warpage distance with a ruler. Record this distance as the warpage.

[0041] The test results are shown in the table below. [Table 2]

[0042] As can be seen from the above table, the printing liquids prepared in the proportions of each component provided in Examples 1 to 3 of the present invention Encapsulating materials The printing liquid provided in the present application has a low rotational viscosity, and even after standing for 24 hours, the printing liquid has a low rotational viscosity. Encapsulating materials has a long service life and is a printing liquid Encapsulating materials However, this also explains that the cured resin has a low degree of warpage even after curing.

[0043] As can be seen from the comparison between Example 1 and Comparative Example 1, EP-3980S has lower viscosity and better adhesion than bisphenol F epoxy resin, which is advantageous for implementing the template printing process, and has a low degree of warpage after curing.

[0044] As can be seen from a comparison between Example 2 and Comparative Example 2, the gum solution prepared using an accelerator containing an imidazole-based latent curing agent as an epoxy resin under the same conditions had lower viscosity and less warpage than the gum solution prepared using an accelerator containing an amine-based curing agent as an epoxy resin, and the change in rotational viscosity after 24 hours was not significant, which indicates that the gum solution has a long usable life and is stable.

[0045] Finally, it should be noted that the terms "comprising," "consisting of," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements not only includes those elements, but also includes other elements not expressly listed or inherent in such process, method, article, or apparatus.

[0046] Although preferred embodiments of the present invention have been described, other variations and modifications to these embodiments may be made by those skilled in the art upon learning the basic inventive concept. It is therefore intended that the appended claims be interpreted to include not only the preferred embodiments but also all variations and modifications that fall within the scope of the present invention.

[0047] Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and its equivalents, the present invention also intends to include these modifications and variations. [Explanation of symbols]

[0048] 1. Template, 2. Printing liquid Encapsulating materials , 3···Rubber scraper, 4···Tip body.

Claims

1. The epoxy resin composition comprises, by weight, 10 to 20 parts of an epoxy resin, 100 to 200 parts of silicon dioxide, 15 to 25 parts of a curing agent, 1 to 5 parts of a reactive diluent, 0.1 to 0.5 parts of a latent curing agent, 0.1 to 1 part of a coupling agent, and 0.1 to 0.5 parts of a colorant, wherein the epoxy resin is N-(2-methylphenyl)-N-(1,2-epoxypropyl)-oxiranemethanamine, the latent curing agent comprises at least one of 2-ethyl-4-methylimidazole and a microcapsule-modified imidazole epoxy composition, the curing agent comprises methylnadic anhydride, and the coupling agent comprises 3-glycidyloxypropyltrimethoxysilane; The reactive diluent comprises a DCPDM type epoxy resin having the following structural formula:

2. 2. The liquid encapsulant for printing according to claim 1, wherein the colorant contains carbon black.

3. a step of stirring and mixing components including, by weight, at least 10 to 20 parts of epoxy resin, 100 to 200 parts of silicon dioxide, 15 to 25 parts of curing agent, 1 to 5 parts of reactive diluent, 0.1 to 0.5 parts of latent curing agent, 0.1 to 1 part of coupling agent, and 0.1 to 0.5 parts of colorant to obtain a premixed slurry; transferring the premixed slurry to a three-roll mill for grinding to obtain a milled slurry; and a step of vacuum-degassing the pulverized slurry to obtain the liquid encapsulant for printing.

4. obtaining a chip body; providing a template higher than the chip body on both ends of the chip body; placing the liquid encapsulant for printing according to any one of claims 1 and 2 on the template at one end of the template; scraping the printing liquid encapsulant evenly onto both ends of the template using a rubber scraper at room temperature; a curing step; and after curing is complete, removing the templates at both ends to obtain a chip.

5. further comprising the step of directly marking the surface of the chip; The method for preparing chips according to claim 4.

6. A chip comprising a chip body and a molding layer, wherein the components of the molding layer include the printing liquid encapsulant described in any one of claims 1 and 2, and the chip body is covered by the molding layer.

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