Electronic Components

Abstract

To enable reliable, high-speed signal transmission without significantly compromising ease of assembly in a configuration for connecting substrates by a flexible substrate.SOLUTION: An electronic component includes a first substrate, a first flexible substrate for connecting the first substrate and a second substrate, and a first transmission wiring for transmitting a signal from the first substrate to the second substrate. The first transmission wiring is formed on the first substrate, the second substrate, and the first flexible substrate. One end portion of the first flexible substrate is connected to the first substrate by a conductive connecting member. Another end portion of the first flexible substrate is provided with a connector capable of being attached to or detached from the second substrate.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to electronic components, and more particularly to high-speed signal transmission technology in a configuration in which boards are connected by flexible boards. [Background technology]

[0002] In recent years, technology has been gaining attention for imaging devices that capture multiple images in a short period of time and combine them to improve resolution, sensitivity, dynamic range, etc. To capture multiple images in a short period of time and combine them, one of the key technologies is to increase the speed of signal transmission from the imaging element to the image processing circuit. While methods for increasing the signal transmission speed include increasing the signal transmission frequency, PAM (Pulse Amplitude Modulation)4 transmission, which can increase the number of bits that can be transmitted per 1 UI (Unit Interval), has also attracted attention.

[0003] In addition, in recent mirrorless cameras, in order to improve the performance of in-body image stabilization, it has become common to use a flexible board to connect the board on which the image sensor is mounted to the board that processes the signals from the image sensor.

[0004] However, in the past, when boards were connected using flexible boards with connectors and signals were transmitted at high speed, signal reflection, in which part of the signal was reflected due to impedance mismatch at the connector, was a problem. Figure 6(a) shows a configuration in which boards are connected using flexible boards with connectors, and Figure 6(b) shows an example of the impedance profile for the configuration in Figure 6(a). It can be seen that the impedance at the connector part of the transmitting (TX) board and the connector part of the receiving (RX) board is lower than the target value (100 Ω in this case).

[0005] To address this problem, Patent Document 1 discloses that the impedance of the transmission line is intentionally controlled to be low in order to prevent signal reflection caused by impedance mismatch at the connector. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2018-98290 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in the conventional technology disclosed in Patent Document 1, the impedance of the transmission line cannot be matched to 100Ω, and therefore signal reflection due to impedance mismatching may not be tolerated.

[0008] The present invention has been made in consideration of the above problems, and aims to enable highly reliable high-speed signal transmission in a configuration in which boards are connected by a flexible board, without significantly impairing ease of assembly. [Means for solving the problem]

[0009] In order to achieve the above object, the electronic component of the present invention includes a first substrate, a first flexible substrate for connecting the first substrate and a second substrate, and a wiring pattern formed on the first flexible substrate for connecting the first substrate to the second substrate. Differential a first transmission wiring for transmitting a signal, and one end of the first flexible substrate is connected to the first substrate. direct The first flexible substrate is connected to the second substrate, and a connector that can be attached to and detached from the second substrate is provided at another end of the first flexible substrate. [Effects of the Invention]

[0010] According to the present invention, in a configuration in which substrates are connected by a flexible substrate, highly reliable high-speed signal transmission can be achieved without significantly impairing ease of assembly. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a diagram showing a configuration of an electronic component according to a first embodiment of the present invention. [Figure 2] 2A to 2C are diagrams illustrating the configuration and impedance profile of an electronic component according to the first embodiment. [Figure 3] FIG. 4 is a diagram for explaining an improvement in eye pattern in the first embodiment. [Figure 4] FIG. 6 is a diagram showing the configuration of an electronic component according to a second embodiment. [Figure 5] FIG. 10 is a diagram showing the configuration of an electronic component according to a third embodiment. [Figure 6] 1A and 1B are diagrams illustrating a conventional configuration and impedance profile. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0013] First Embodiment FIG. 1 is a diagram showing the configuration of an electronic component according to a first embodiment of the present invention. The image sensor 101 is an image sensor such as a CMOS image sensor, and outputs an image signal in response to incident light. The image sensor 101 is generally divided into a pixel block including a photodiode, a processing circuit block that performs AD conversion to convert analog signals into digital signals, a transmission circuit block that outputs the digitally converted data, and the like.

[0014] An imaging element 101 is mounted on a substrate 102, which will be referred to hereinafter as the "imaging substrate." The imaging substrate 102 is a printed circuit board that, in addition to the imaging element 101, also includes electronic components (not shown), and the high-speed signal transmission wiring 103 and power supply wiring 104 are formed of a metal such as copper. The imaging substrate 102 is preferably a rigid substrate in order to mount the imaging element 101, and is made of, for example, glass epoxy. However, the present invention is not limited to this, and may be an LTCC (low temperature co-fired ceramics) substrate using ceramics and copper wiring, or any other substrate that has a pattern formed with metal wiring such as copper on a specific material and on which components can be mounted.

[0015] The signal processing unit 201 performs image processing and the like on the image signal output from the image sensor 101 , and also performs communication for driving the image sensor 101 and outputs a control signal for the image sensor 101 .

[0016] Signal processing unit 201 is mounted on substrate 202, which will be referred to as the "signal processing substrate" hereinafter. In addition to signal processing unit 201, signal processing substrate 202 is also equipped with connector fitting unit 203 and other electrical components (not shown), and high-speed signal transmission wiring 103 is made of a metal such as copper.

[0017] The flexible substrate 401 is used to connect the imaging substrate 102 and the signal processing substrate 202. The flexible substrate 401 has a flexible base material made of polyimide or the like, a wiring layer made of metal foil or the like, and a coverlay which is an insulating layer. On the flexible substrate 401, the high-speed signal transmission wiring 103, communication wiring (not shown) for driving the imaging element 101, control signal wiring for the imaging element 101, etc. are formed of metal such as copper.

[0018] The high-speed signal transmission wiring 103 is wiring formed on the imaging substrate 102, the flexible substrate 401, and the signal processing substrate 202 for transmitting pixel signals and the like from the imaging element 101 to the signal processing unit 201 at high speed. Generally, high-speed signal transmission wiring often uses two signal lines, flows currents of opposite phases, and transmits signals using the potential difference between the signal lines. By using differential transmission, even if the same noise is applied to the two signal lines, the noise is canceled out, making it less likely to malfunction. The high-speed signal transmission wiring 103 of this embodiment also performs differential transmission in the same way.

[0019] Since the impact of impedance mismatch is greater the closer to the transmitting side than to the receiving side, directly connecting the transmitting side is more effective. Therefore, in this embodiment, the imaging board 102, which is the signal transmitting side, and the flexible board 401 are directly connected by a conductive connecting member at the direct connection portion 402 without using a connector. On the other hand, the flexible board 401 and the signal processing board 202, which is the signal receiving side, are connected via the connector fitting portion 203.

[0020] The direct connection section 402 connects the imaging substrate 102 and the flexible substrate 401. 、 An opening where the metal wiring formed on the imaging substrate 102 is exposed and an opening (one end) where the metal wiring formed on the flexible substrate 401 is exposed are connected by a conductive connecting member. Connect by .

[0021] The connector fitting portion 203 connects the signal processing board 202 to an end (another end) of the flexible board 401 using a board-to-board connector, a flip-lock type connector, etc. The connector fitting portion 203 allows the flexible board 401 to be attached to and detached from the signal processing board 202 as appropriate.

[0022] Although it is possible to directly connect the signal processing board 202 side as well, doing so would significantly impair the ease of assembling the imaging device. Therefore, in light of the above-mentioned effects, in this embodiment, only one output side is directly connected. Figure 2(a) shows the configuration of electronic components in this embodiment, where boards are connected by a flexible board with a connector, and Figure 2(b) shows an example of the impedance profile in the configuration of Figure 2(a). By connecting in this manner, it is possible to reduce impedance mismatch at the connection between the board on the signal output side and the flexible board, compared to the conventional configuration shown in Figure 6.

[0023] Here, we will explain the quality of the signal transmitted via the high-speed signal transmission wiring 103. A common method for evaluating the waveform of a signal is evaluation using an eye pattern. An eye pattern is a visual display of the signal characteristics obtained by sampling many transitions of an actual signal waveform and superimposing them. If multiple waveforms are superimposed at the same position (timing, voltage), the waveform is of good quality, and if the waveform positions (timing, voltage) are shifted, the waveform is of poor quality.

[0024] FIG. 3 is a diagram illustrating the improvement in eye pattern when a high-speed signal transmission line according to the first embodiment is used. The diamonds in FIG. 3 represent the prescribed mask for the eye pattern; if the signal waveform falls within the prescribed mask, there is a possibility that signal transition information will not be transmitted correctly. FIG. 3(a) shows the case where the transmitter is connected via a connector, as in the conventional example, and jitter worsens due to impedance mismatch at the connector on the transmitter. In contrast, FIG. 3(b) shows the case where the transmitter is directly connected, as in this embodiment, and it can be seen that the effects of signal reflections due to impedance mismatch are reduced, increasing the margin for the prescribed mask.

[0025] Returning to FIG. 1, the power supply unit 301 supplies power to the image sensor 101 via a flexible power supply substrate 501 . A power supply unit 301 is mounted on the board 302, which will be referred to as the "power supply board" hereinafter. In addition to the power supply unit 301, the power supply board 302 also has a power supply board connector fitting portion 303 and other electrical components (not shown) mounted thereon.

[0026] The power supply flexible substrate 501 is used to connect the imaging substrate 102 and the power supply substrate 302. The power supply flexible substrate 501 has a flexible base material made of polyimide or the like, a wiring layer made of metal foil or the like, and a coverlay which is an insulating layer, and the power supply wiring 104 is made of a metal such as copper.

[0027] The power supply wiring 104 is a power supply wiring pattern formed of a metal such as copper on the imaging substrate 102, the power supply flexible substrate 501, and the power supply substrate 302, and is wiring for supplying power from the power supply unit 301 to the imaging element 101.

[0028] When high-speed signal transmission wiring is not included, there is no need to consider signal reflection, and therefore it is easier to assemble by connecting connectors on both sides of the flexible board. Therefore, in this embodiment, the power supply board 302 and the power supply flexible board 501 are connected via the power supply board connector fitting portion 303, and the power supply flexible board 501 and the imaging board 102 are connected via the power supply connector fitting portion 105.

[0029] The power supply board connector fitting portion 303 connects the power supply board 302 and the flexible power supply board 501 using a board-to-board connector, a flip-lock type connector, etc. The power supply board connector fitting portion 303 makes it possible to attach and detach the flexible power supply board 501 to and from the power supply board 302 as appropriate.

[0030] Furthermore, the power connector fitting portion 105 connects the imaging board 102 and the power supply flexible board 501 using a board-to-board connector, a flip-lock type connector, etc. The power connector fitting portion 105 allows the power supply flexible board 501 to be attached to and detached from the imaging board 102 as appropriate.

[0031] As described above, according to the first embodiment, it is possible to provide highly reliable high-speed signal transmission between boards using a flexible board while ensuring ease of assembly.

[0032] <Second embodiment> Next, a second embodiment of the present invention will be described. Fig. 4 is a diagram showing the configuration of an electronic component in the second embodiment. In Fig. 4, the same components as those shown in Fig. 1 are given the same reference numerals, and their description will be omitted.

[0033] In the second embodiment, a signal processing unit 201 and a power supply unit 301 are mounted on a substrate 210, which will be referred to as a "signal processing substrate" hereinafter. In the second embodiment, the signal processing unit 201 generates correction data, adjustment data, etc. for the image sensor 101 based on the processed signal. In addition to the signal processing unit 201 and the power supply unit 301, the signal processing substrate 210 is also equipped with a connector fitting unit 203, a direct connection unit 212, and other electrical components (not shown), and high-speed signal transmission wiring 211 is formed of a metal such as copper.

[0034] The flexible substrate 213 is used to connect the imaging substrate 102 and the signal processing substrate 210. The flexible substrate 213 has a flexible base material made of polyimide or the like, a wiring layer made of metal foil or the like, and a coverlay which is an insulating layer, and the high-speed signal transmission wiring 211, power supply wiring 104, etc. are formed of metal such as copper.

[0035] The high-speed signal transmission wiring 211 is wiring formed on the signal processing board 210, the flexible board 213, and the imaging board 102, for transmitting correction data, adjustment data, etc. of the imaging element 101 from the signal processing unit 201 to the imaging element 101.

[0036] As explained in the first embodiment, the effect of impedance mismatch is greater the closer to the transmitting side than to the receiving side, so directly connecting the transmitting side is more effective. Therefore, in this embodiment, the signal processing board 210, which is the signal transmitting side, and the flexible board 213 are directly connected by a conductive connecting member at the direct connection portion 212 without using a connector. On the other hand, the flexible board 213 and the imaging board 102, which is the signal receiving side, are connected via the power connector fitting portion 105.

[0037] The direct connection section 212 connects the signal processing board 210 and the flexible board 213. 、 An opening where the metal wiring formed on the signal processing substrate 210 is exposed and an opening (one end) where the metal wiring formed on the flexible substrate 213 is exposed are connected by a conductive connecting member. Connect by .

[0038] Although it is possible to directly connect the imaging board 102 side as well, direct connection would significantly impair the ease of assembling the imaging device, so only the signal processing board 210 side, which is the output side, is directly connected.

[0039] As described above, according to the second embodiment, it is possible to provide highly reliable bidirectional high-speed signal transmission between boards using a flexible board while ensuring ease of assembly.

[0040] In the above example, the signal processing unit 201 transmits correction data, adjustment data, and the like for the image sensor 101 to the image sensor 101. However, the present invention is not limited to this. For example, the signal processing unit 201 may transmit correction data, adjustment data, and the like for the image sensor 101 to the image sensor 101. to A control unit for controlling the image sensor 101 may be installed.

[0041] <Third embodiment> Next, a third embodiment of the present invention will be described. Fig. 5 is a diagram showing the configuration of an electronic component in the third embodiment. In Fig. 5, the same components as those shown in Fig. 1 are given the same reference numerals, and their description will be omitted.

[0042] The display device 601 is configured with an organic EL or liquid crystal display or the like that can monitor playback images and captured video. The display device 601 is mounted on a substrate 602, which will be referred to as the "display device substrate" hereinafter. In addition to the display device 601, electronic components (not shown) and the like are also mounted on the display device substrate 602, and high-speed signal transmission wiring 702 for the display device is formed of a metal such as copper.

[0043] The flexible substrate 701 for a display device is used to connect the signal processing substrate 202 and the display device substrate 602. The flexible substrate 701 for a display device has a flexible base material made of polyimide or the like, a wiring layer made of metal foil or the like, and a coverlay which is an insulating layer. The flexible substrate 701 for a display device has high-speed signal transmission wiring 702 for a display device, communication wiring (not shown) for driving the display device 601, control signal wiring for the display device 601, etc., which are formed of metal such as copper.

[0044] The high-speed signal transmission wiring 702 for the display device is wiring formed on the signal processing board 202, the flexible board 701 for the display device, and the display device board 602, for transmitting display image data, etc. at high speed from the signal processing unit 201 to the display device 601.

[0045] As explained in the first embodiment, the effect of impedance mismatch is greater the closer to the transmitting side than to the receiving side, so directly connecting the transmitting side is more effective. Therefore, in this embodiment, the signal processing board 202, which is the signal transmitting side, and the flexible substrate 701 for the display device are directly connected at the direct connection portion 703 by a conductive connecting member without using a connector. Meanwhile, the flexible substrate 701 for the display device and the display device substrate 602, which is the signal receiving side, are connected by a board-to-board connector, a flip-lock type connector, or the like, via the display substrate connector fitting portion 603. The display substrate connector fitting portion 603 allows the flexible substrate 701 for the display device to be attached and detached to and from the display device substrate 602 as needed.

[0046] Although it is possible to directly connect the display device board 602 side as well, direct connection would significantly impair the ease of assembling the imaging device, so only the signal processing board 210 side, which is the output side, is directly connected.

[0047] Memory card connector 801 is a connector for connecting to a storage medium such as an SD card or a CF card, and by inserting the storage medium, image data output from signal processing unit 201 can be recorded. Memory card connector 801 is mounted on board 802, which will be referred to as the "memory card board" hereinafter. In addition to memory card connector 801, memory card board 802 is also equipped with electronic components (not shown), and high-speed signal transmission wiring 902 for memory cards is formed from a metal such as copper.

[0048] The memory card flexible substrate 901 is used to connect the signal processing substrate 202 and the memory card substrate 802. The memory card flexible substrate 901 has a flexible base material made of polyimide or the like, a wiring layer made of metal foil or the like, and a coverlay which is an insulating layer. The memory card flexible substrate 901 is provided with high-speed signal transmission wiring 902 for the memory card, and communication wiring and control signal wiring (not shown) for driving the memory card connector 801, which are formed of a metal such as copper.

[0049] The high-speed signal transmission wiring 902 for the memory card is wiring formed on the signal processing board 202, the flexible board 901 for the memory card, and the memory card board 802, for transmitting image data for recording from the signal processing unit 201 to the memory card connector 801.

[0050] As described above, the effect of impedance mismatch is greater the closer to the transmitting side than to the receiving side, so directly connecting the transmitting side is more effective. Therefore, in this embodiment, the signal processing board 202, which is the signal transmitting side, and the memory card flexible board 901 are directly connected at the direct connection portion 903 using a conductive connecting member without using a connector. Meanwhile, the memory card flexible board 901 and the signal receiving side, the memory card board 802, are connected via the memory card board connector fitting portion 803 using a board-to-board connector, a flip-lock type connector, or the like. The memory card board connector fitting portion 803 allows the memory card flexible board 901 to be attached and detached to the memory card board 802 as needed.

[0051] Although it is possible to directly connect the memory card board 802 side as well, direct connection would significantly impair the ease of assembling the imaging device, so only the signal processing board 210 side, which is the output side, is directly connected.

[0052] As described above, according to the third embodiment, it is possible to use a flexible substrate to ensure ease of assembly and to achieve highly reliable high-speed signal transmission between substrates to a display device, memory card, or the like.

[0053] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0054] 101: imaging element, 102: imaging board, 103, 211, 702, 902: high-speed signal transmission wiring, 105, 203, 303, 603, 803: connector fitting portion, 201: signal processing portion, 202: signal processing board, 301: power supply portion, 302: power supply board, 401, 501, 701, 901: flexible board, 402, 212, 703, 903: direct connection portion, 601: display device, 602: display device board, 801: memory card connector, 802: memory card board

Claims

1. a first substrate; a first flexible substrate for connecting the first substrate and the second substrate; a first transmission wiring formed on the first substrate, the second substrate, and the first flexible substrate, for transmitting a differential signal from the first substrate to the second substrate; An electronic component characterized in that one end of the first flexible substrate is directly connected to the first substrate, and another end of the first flexible substrate is provided with a connector that can be attached to and detached from the second substrate.

2. the second substrate; a second flexible substrate for connecting the first substrate and the second substrate; a second transmission wiring formed on the first substrate, the second substrate, and the second flexible substrate, for transmitting a differential signal from the second substrate to the first substrate; 2. The electronic component according to claim 1, wherein one end of the second flexible substrate is directly connected to the second substrate, and another end of the second flexible substrate is provided with a connector that can be attached to and detached from the first substrate.

3. 3. The electronic component according to claim 1, wherein an imaging means is mounted on the first board, a signal processing means is mounted on the second board, and the first transmission wiring transmits an image signal output from the imaging means to the signal processing means.

4. 3. The electronic component according to claim 2, wherein an imaging means is mounted on the first board, a signal processing means is mounted on the second board, and the second transmission wiring transmits correction data and adjustment data for the imaging means output from the signal processing means to the imaging means.

5. 3. The electronic component according to claim 2, wherein an imaging means is mounted on the first board, a control means is mounted on the second board, and the second transmission wiring transmits a signal for controlling the imaging means output from the control means to the imaging means.

6. 2. The electronic component according to claim 1, wherein a signal processing means is mounted on the first substrate, a display means is mounted on the second substrate, and the first transmission wiring transmits image data for display output from the signal processing means to the display means.

7. 2. The electronic component according to claim 1, wherein a signal processing means is mounted on the first board, a memory card connector is mounted on the second board, and the first transmission wiring transmits image data for recording output from the signal processing means to the memory card connector.

8. a third flexible substrate for connecting the first substrate and the third substrate; a third transmission wiring formed on the first substrate, the third substrate, and the third flexible substrate, for transmitting a differential signal from the first substrate to the third substrate; 3. An electronic component according to claim 1, wherein one end of the third flexible substrate is directly connected to the first substrate, and another end of the third flexible substrate is provided with a connector that can be attached to and detached from the third substrate.

9. a signal processing means is mounted on the first substrate, a display means is mounted on the second substrate, and the first transmission wiring transmits image data for display output from the signal processing means to the display means; A memory card connector is mounted on the third substrate, and the third transmission wiring transmits the image data for recording output from the signal processing means to the memory card connector.

9. The electronic component according to claim 8.

Images