Component Mounting Equipment

Abstract

This component mounting device (100) comprises a first imaging unit (6), a raising unit (8), a first movement mechanism (7), a second movement mechanism (9), and a control unit (10). The control unit uses the first imaging unit to perform imaging of the raising unit, acquires a first thermal elongation correction amount (D1) that incorporates the thermal elongation of the first movement mechanism and the thermal elongation of the second movement mechanism on the basis of the results of the imaging of the raising unit by the first imaging unit, and performs thermal elongation correction on the basis of the acquired first thermal elongation correction amount.

Description

[Technical Field]

[0001] The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus that removes components from a diced wafer and mounts them on a substrate. [Background technology]

[0002] BACKGROUND ART Conventionally, component mounting apparatuses that remove components from a diced wafer and mount them on a substrate are known, such as those disclosed in Japanese Patent Laid-Open Publication No. 2005-277273.

[0003] The aforementioned Japanese Patent Application Laid-Open Publication No. 2005-277273 discloses an electronic component mounting apparatus (component mounting apparatus) that removes semiconductor chips from a diced wafer and mounts them on a substrate. This electronic component mounting apparatus includes a supply unit imaging camera that captures images of the semiconductor chips on the wafer from above, a supply unit imaging camera moving mechanism that moves the supply unit imaging camera, an ejector that pushes the semiconductor chips on the wafer from below, and an ejector XY table that moves the ejector. In this electronic component mounting apparatus, movement of the supply unit imaging camera increases the temperature of the supply unit imaging camera moving mechanism, causing thermal expansion of the supply unit imaging camera moving mechanism. For this reason, this electronic component mounting apparatus is provided with an identification mark used to correct the thermal expansion of the supply unit imaging camera moving mechanism. In this electronic component mounting apparatus, the identification mark is captured by the supply unit imaging camera, thereby correcting the thermal expansion of the supply unit imaging camera moving mechanism. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-277273 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the electronic component mounting device described in the above-mentioned JP 2005-277273 A, while the thermal expansion of the supply unit imaging camera movement mechanism is corrected, the thermal expansion of the ejector XY table is not corrected. Because the ejector XY table also undergoes thermal expansion, if the thermal expansion of the ejector XY table is not corrected, the ejector cannot move to the appropriate push-up position due to the thermal expansion of the ejector XY table. This poses a problem in that it is not possible to ensure stable precision in pushing up the semiconductor chip (component).

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a component mounting device that can ensure stable component push-up accuracy. [Means for solving the problem]

[0007] A component mounting device according to a first aspect of the present invention is a component mounting device that removes components from a diced wafer and mounts them on a substrate, and includes: a first imaging unit that images the components on the wafer from above; a push-up unit that pushes up the components on the wafer from below; a first moving mechanism that moves the first imaging unit; a second moving mechanism that moves the push-up unit; and a control unit that images the push-up unit with the first imaging unit, acquires a first thermal expansion correction amount including thermal expansion of the first moving mechanism and thermal expansion of the second moving mechanism based on the image of the push-up unit captured by the first imaging unit, and performs thermal expansion correction based on the acquired first thermal expansion correction amount. a head unit including a head that picks up components from a wafer from above, a second imaging unit provided in the head unit, and a third movement mechanism that moves the head unit; Equipped with The control unit is configured to image the push-up unit with the second imaging unit, obtain a second thermal expansion correction amount including the thermal expansion of the third moving mechanism and the thermal expansion of the second moving mechanism based on the imaging result of the push-up unit by the second imaging unit, and perform thermal expansion correction based on the first thermal expansion correction amount and the second thermal expansion correction amount; the control unit is configured to image the component with the first imaging unit, obtain a deviation amount from the position of the push-up unit including the thermal expansion of the second moving mechanism to the position of the component based on the imaging result of the component by the first imaging unit, and obtain a component removal position by the head based on the deviation amount and the second thermal expansion correction amount. do. A component mounting device according to a second aspect of the present invention is a component mounting device that removes components from a diced wafer and mounts them on a substrate, and includes a first imaging unit that images the components on the wafer from above, a push-up unit that pushes the components on the wafer from below, a first moving mechanism that moves the first imaging unit, a second moving mechanism that moves the push-up unit, and a control unit that images the push-up unit with the first imaging unit, acquires a first thermal expansion correction amount including the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism based on the image of the push-up unit by the first imaging unit, and performs thermal expansion correction based on the acquired first thermal expansion correction amount, and is configured to image the component with the first imaging unit, acquire the amount of deviation from the position of the push-up unit including the thermal expansion of the second moving mechanism to the position of the component based on the image of the component by the first imaging unit, and acquire the push-up position of the component by the push-up unit based on the amount of deviation.

[0008] The first aspect of this invention and the secondIn the component mounting device according to this aspect, as described above, a control unit is provided that captures an image of the push-up portion using the first imaging unit, acquires a first thermal expansion correction amount including the thermal expansion of the first moving mechanism that moves the first imaging unit and the thermal expansion of the second moving mechanism that moves the push-up portion based on the image capture result of the first imaging unit, and performs thermal expansion correction based on the acquired first thermal expansion correction amount. This allows for correction of the thermal expansion of the second moving mechanism that moves the push-up portion, thereby preventing the push-up portion from being unable to move to an appropriate push-up position due to the thermal expansion of the second moving mechanism. In other words, the second moving mechanism can move the push-up portion to an appropriate push-up position, allowing the push-up portion to appropriately push up components. This ensures stable component push-up accuracy. Furthermore, this ensures stable component push-up accuracy, thereby ensuring stable component removal accuracy.

[0009] In order to correct the thermal expansion of the first moving mechanism and the second moving mechanism, it is also possible to configure the component mounting device as follows. That is, it is possible to provide the component mounting device with an identification mark used for thermal expansion correction, correct the thermal expansion of the first moving mechanism by capturing an image of the identification mark with the first imaging unit, and correct the thermal expansion of the second moving mechanism by capturing an image of the push-up unit with the first imaging unit after the thermal expansion of the first moving mechanism has been corrected. However, in this case, the identification mark and the push-up unit must be captured separately, which increases the time required for thermal expansion correction. In contrast, as described above, the first imaging unit captures an image of the push-up unit, and based on the image of the push-up unit captured by the first imaging unit, a first thermal expansion correction amount including the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism is obtained, and thermal expansion correction is performed based on the obtained first thermal expansion correction amount. In this way, the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism can be corrected simultaneously just by capturing an image of the push-up unit, thereby suppressing an increase in the time required for thermal expansion correction. 。

[0010] the above No. 1In the component mounting device according to this aspect, the control unit is preferably configured to acquire an imaging position of the component by the first imaging unit based on the first thermal expansion correction amount, image the component with the first imaging unit while moved to the acquired imaging position, acquire an amount of deviation from the position of the push-up unit, including thermal expansion of the second moving mechanism, to the position of the component based on the imaging result of the component by the first imaging unit, and acquire a push-up position of the component by the push-up unit based on the amount of deviation. With this configuration, the push-up position of the component by the push-up unit can be accurately corrected based on the first thermal expansion correction amount, and stable precision in component push-up can be easily ensured.

[0012] In this case, the control unit is preferably configured to acquire the component imaging position by the first imaging unit based on the first thermal expansion correction amount, image the component with the first imaging unit while moved to the acquired imaging position, acquire the amount of deviation from the position of the push-up unit, including the thermal expansion of the second moving mechanism, to the position of the component based on the result of imaging of the component by the first imaging unit, acquire the component push-up position by the push-up unit based on the amount of deviation, and acquire the component removal position by the head based on the amount of deviation and the second thermal expansion correction amount. With this configuration, the component push-up position by the push-up unit and the component removal position by the head can be accurately corrected based on the first thermal expansion correction amount and the second thermal expansion correction amount, thereby easily ensuring more stable component push-up accuracy and more stable component removal accuracy.

[0013] In the above-described component mounting apparatus including a third movement mechanism, preferably, the first movement mechanism is configured to move the first imaging unit in a first direction and a second direction that are substantially perpendicular to each other in a horizontal plane, the second movement mechanism is configured to move the push-up unit in the first direction and the second direction, and the third movement mechanism is configured to move the head unit in the first direction and the second direction. With this configuration, the first movement mechanism, the second movement mechanism, and the third movement mechanism can easily move the first imaging unit, the push-up unit, and the head unit in the first direction and the second direction, respectively. Furthermore, when the influence of thermal expansion caused by moving the first imaging unit, the push-up unit, and the head unit in the first direction and the second direction is complex, the thermal expansion of the first movement mechanism, the second movement mechanism, and the third movement mechanism can be corrected.

[0014] In the above-described configuration in which the component mounting device includes a second imaging unit, the control unit is preferably configured to image the push-up unit with the first imaging unit while the first imaging unit and the push-up unit are moved to the same first target position, and to image the push-up unit with the second imaging unit while the second imaging unit and the push-up unit are moved to a second target position that is the same as the first target position. With this configuration, the thermal expansion of the second movement mechanism included in the first thermal expansion correction amount can be matched with the thermal expansion of the second movement mechanism included in the second thermal expansion correction amount, thereby enabling accurate thermal expansion correction based on the first thermal expansion correction amount and the second thermal expansion correction amount.

[0015] Above No. 1 and the secondIn the component mounting device according to the above aspect, the control unit is preferably configured to update the thermal expansion correction at a predetermined time interval, and the control unit is configured to acquire an area from which components are removed from the wafer within the predetermined time interval, capture an image of the push-up portion with the first imaging unit at a position corresponding to the acquired area, and update the thermal expansion correction. With this configuration, by updating the thermal expansion correction at a predetermined time interval, it is possible to appropriately reflect thermal expansion that changes over time in the thermal expansion correction. Furthermore, it is also possible to acquire an area from which components are removed from the wafer within the predetermined time interval, capture an image of the push-up portion with the first imaging unit at a position corresponding to the acquired area, and update the thermal expansion correction. This allows the first imaging unit to capture an image of the push-up portion at an effective position close to the component, and update the thermal expansion correction, thereby effectively improving the accuracy of the thermal expansion correction.

[0016] Furthermore, because thermal expansion is often not linear, capturing images of the thrust portion using the first imaging unit at multiple positions and performing thermal expansion correction is preferable from the perspective of increasing the accuracy of thermal expansion correction. However, capturing images of the thrust portion using the first imaging unit at multiple positions increases the time required for thermal expansion correction. In contrast, the above configuration can effectively increase the accuracy of thermal expansion correction, so that thermal expansion correction can be performed accurately even if the number of positions at which the first imaging unit captures images of the thrust portion is reduced. This allows for accurate thermal expansion correction while suppressing an increase in the time required for thermal expansion correction.

[0017] In this case, the control unit is preferably configured to acquire the number of components to be removed from the wafer within a predetermined time interval based on the cycle time of the board, and to acquire the area based on the acquired number of components. With this configuration, it is possible to easily acquire the area from which components are to be removed from the wafer within the predetermined time interval based on the number of components to be removed from the wafer within the predetermined time interval.

[0018] Above No. 1 and the secondIn the component mounting device according to the above aspect, the push-up unit is preferably configured not to have an imaging unit. With this configuration, since the push-up unit does not have an imaging unit, it is possible to suppress an increase in the number of components and a complicated structure compared to when the push-up unit has an imaging unit. Furthermore, even if the push-up unit does not have an imaging unit, it is possible to effectively use the first imaging unit to correct thermal expansion of the second movement mechanism. As a result, it is possible to correct thermal expansion of the second movement mechanism while suppressing an increase in the number of components and a complicated structure. The first aspect of this invention 3 The component mounting device according to this aspect is a component mounting device that removes components from a diced wafer and mounts them on a substrate, and includes a first imaging unit that images the components on the wafer from above, a push-up unit that pushes up the components on the wafer from below, a first moving mechanism that moves the first imaging unit, a second moving mechanism that moves the push-up unit, and a control unit that images the push-up unit with the first imaging unit, acquires a first thermal expansion correction amount including the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism based on the image capture result of the push-up unit by the first imaging unit, and performs thermal expansion correction based on the acquired first thermal expansion correction amount, and the control unit is configured to acquire the imaging position of the component by the first imaging unit based on the first thermal expansion correction amount, and image the component with the first imaging unit while moving it to the acquired imaging position. [Effects of the Invention]

[0019] According to the present invention, as described above, it is possible to provide a component mounting apparatus that can ensure stable component push-up accuracy. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 1 is a schematic plan view showing a component mounting apparatus according to a first embodiment. [Figure 2] FIG. 2 is a schematic perspective view showing a wafer imaging unit, a push-up unit, and a head according to the first embodiment. [Figure 3] 4A to 4C are diagrams for explaining pushing up of a component by a push-up portion according to the first embodiment. [Figure 4] FIG. 1 is a diagram (1) for explaining thermal elongation correction according to the first embodiment. [Figure 5] FIG. 10 is a diagram (2) for explaining thermal elongation correction according to the first embodiment. [Figure 6] FIG. 10 is a diagram (3) for explaining thermal elongation correction according to the first embodiment. [Figure 7] FIG. 4 is a diagram for explaining an imaging position for thermal expansion correction according to the first embodiment. [Figure 8] 1 is a flowchart (1) for explaining a control process related to thermal expansion correction according to the first embodiment. [Figure 9] 10 is a flowchart (2) illustrating a control process related to thermal expansion correction according to the first embodiment. [Figure 10] FIG. 10 is a diagram for explaining an imaging position for thermal expansion correction according to the second embodiment. [Figure 11] 10 is a flowchart illustrating a control process related to thermal expansion correction according to a second embodiment. [Figure 12] 12 is a continuation of the flowchart in FIG. 11. DETAILED DESCRIPTION OF THE INVENTION

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings.

[0022] [First embodiment] (Configuration of component mounting equipment) The configuration of a component mounting apparatus 100 according to an embodiment of the present invention will be described with reference to FIG.

[0023] The component mounting apparatus 100 is an apparatus for removing components C as semiconductor chips from a diced wafer W and mounting the components C on a substrate B.

[0024] As shown in Figures 1 and 2, the component mounting apparatus 100 includes a base 1, a conveyor 2, a head unit 3, a head unit moving mechanism 4, a component supply unit 5, a wafer imaging unit 6, a wafer imaging unit moving mechanism 7, a push-up unit 8, a push-up unit moving mechanism 9, and a control unit 10. The head unit moving mechanism 4 is an example of a "third moving mechanism" in the claims. The wafer imaging unit 6 is an example of a "first imaging unit" in the claims. The wafer imaging unit moving mechanism 7 is an example of a "first moving mechanism" in the claims. The push-up unit moving mechanism 9 is an example of a "second moving mechanism" in the claims.

[0025] The conveyor 2 is configured to carry the board B into the mounting work position and carry the board B out from the mounting work position. The conveyor 2 also includes a pair of conveyor rails extending in the X direction and a positioning mechanism (not shown) that positions the board B at the mounting work position. As a result, the conveyor 2 transports the board B in the X direction and positions and fixes the board B at the mounting work position.

[0026] The head unit 3 is a head unit for mounting components. The head unit 3 is supported by a head unit movement mechanism 4 so as to be movable in the horizontal direction (X and Y directions) above the wafer W and conveyor 2 (substrate B). The head unit 3 includes a plurality of heads 31 arranged along the X direction. The heads 31 are mounting heads that pick up components C from the wafer W from above and mount the picked-up components C on the substrate B. The heads 31 have suction nozzles 31a at their tips for suctioning the components C. The heads 31 are configured to pick up the components C from the wafer W by suction nozzles 31a. The heads 31 are configured to mount the components C picked up by the suction nozzles 31a on the substrate B.

[0027] The head unit moving mechanism 4 is configured to move the head unit 3. Specifically, the head unit moving mechanism 4 is configured to move the head unit 3 in an X direction and a Y direction that are approximately perpendicular to each other in a horizontal plane. The head unit moving mechanism 4 includes an X-axis head unit moving mechanism 41 for moving the head unit 3 in the X direction, and a Y-axis head unit moving mechanism 42 for moving the X-axis head unit moving mechanism 41 in the Y direction. The X direction and the Y direction are examples of the "first direction" and "second direction" in the claims, respectively.

[0028] The X-axis head unit moving mechanism 41 is a linear motion mechanism having a ball screw shaft 41a and a drive motor 41b that drives the ball screw shaft 41a. The X-axis head unit moving mechanism 41 moves the head unit 3 attached to the ball screw shaft 41a via a ball nut in the X direction by rotating the ball screw shaft 41a using the drive motor 41b.

[0029] The Y-axis head unit moving mechanism 42 is a linear motion mechanism having a ball screw shaft 42a and a drive motor 42b that drives the ball screw shaft 42a. The Y-axis head unit moving mechanism 42 moves the X-axis head unit moving mechanism 41 attached to the ball screw shaft 42a via a ball nut in the Y direction by rotating the ball screw shaft 42a with the drive motor 42b. The X-axis head unit moving mechanism 41 and the Y-axis head unit moving mechanism 42 move the head unit 3 horizontally (in the X and Y directions) above the wafer W and conveyor 2 (substrate B).

[0030] The head unit 3 is also provided with a board imaging section 32 and a component imaging section 33. The board imaging section 32 is a board camera that captures an image of a position recognition mark (fiducial mark) provided on the board B from above before the head 31 mounts the component C on the board B. Based on the image of the position recognition mark captured by the board imaging section 32, the control section 10 is configured to correct the mounting position of the component C by the head 31. The board imaging section 32 is an example of a "second imaging section" in the claims.

[0031] The component imaging unit 33 is a component camera that captures an image of the component C picked up by the suction nozzle 31a of the head 31 from the side before the head 31 mounts the component C on the board B. Based on the image of the component C captured by the component imaging unit 33, the control unit 10 is configured to recognize the state of the component C picked up by the suction nozzle 31a of the head 31. Note that the component imaging unit 33 is not shown in FIG. 2.

[0032] Furthermore, the board imaging unit 32 and the component imaging unit 33 are provided on a frame common to the head unit 3. Therefore, the board imaging unit 32 and the component imaging unit 33 can be moved together with the head unit 3 in the horizontal direction (XY direction) above the wafer W and conveyor 2 (board B) by the head unit moving mechanism 4.

[0033] The component supply unit 5 is configured to move a wafer W stored in the wafer storage unit 11 to a supply position PF and supply components C on the wafer W. The wafer storage unit 11 stores a plurality of diced wafers W. Specifically, the wafer storage unit 11 stores a plurality of diced wafers W attached to an adhesive wafer sheet WS (see FIG. 3) attached to a ring frame. The component supply unit 5 includes a wafer holding table 51 that is movable in the Y direction between the wafer storage unit 11 and the supply position PF. The wafer holding table 51 is movable in the Y direction between the wafer storage unit 11 and the supply position PF while holding the wafer W via the ring frame.

[0034] The wafer imaging unit 6 is a wafer camera that captures an image of the component C on the wafer W held on the wafer holding table 51 at the supply position PF from above, prior to the head 31 removing the component C from the wafer W. Based on the image of the component C captured by the wafer imaging unit 6, the control unit 10 is configured to correct the removal position (suction position) of the component C by the head 31. The wafer imaging unit 6 is supported by a wafer imaging unit moving mechanism 7 so as to be movable in the horizontal direction (X and Y directions) above the wafer W.

[0035] The wafer imaging unit moving mechanism 7 is configured to move the wafer imaging unit 6. Specifically, the wafer imaging unit moving mechanism 7 is configured to move the wafer imaging unit 6 in X and Y directions that are approximately perpendicular to each other in a horizontal plane. The wafer imaging unit moving mechanism 7 includes an X-axis wafer imaging unit moving mechanism 71 for moving the wafer imaging unit 6 in the X direction, and a Y-axis wafer imaging unit moving mechanism 72 for moving the X-axis wafer imaging unit moving mechanism 71 in the Y direction.

[0036] The X-axis wafer imaging unit moving mechanism 71 is a linear motion mechanism having a ball screw shaft 71a and a drive motor 71b that drives the ball screw shaft 71a. The X-axis wafer imaging unit moving mechanism 71 moves the wafer imaging unit 6 attached to the ball screw shaft 71a via a ball nut in the X direction by rotating the ball screw shaft 71a using the drive motor 71b.

[0037] The Y-axis wafer imaging unit moving mechanism 72 is a linear motion mechanism having a ball screw shaft 72a and a drive motor 72b that drives the ball screw shaft 72a. The Y-axis wafer imaging unit moving mechanism 72 moves the X-axis wafer imaging unit moving mechanism 71 attached to the ball screw shaft 72a via a ball nut in the Y direction by rotating the ball screw shaft 72a with the drive motor 72b. The X-axis wafer imaging unit moving mechanism 71 and the Y-axis wafer imaging unit moving mechanism 72 move the wafer imaging unit 6 horizontally (in the X and Y directions) above the wafer W.

[0038] As shown in FIGS. 2 and 3, the push-up unit 8 is a push-up head that pushes up from below the component C on the wafer W held on the wafer holding table 51 at the supply position PF when removing the component C from the wafer W. The head 31 is configured to remove the component C from the wafer W while it is held on the wafer holding table 51 at the supply position PF and pushed up by the push-up unit 8. The push-up unit 8 includes push-up pins 81 that are raised and lowered by a lifting mechanism (not shown). The push-up pins 81 are configured to be raised by the lifting mechanism to push up the component C from below and peel the component C from the wafer sheet WS. Note that the push-up unit 8 does not have an imaging unit.

[0039] The thrust-up unit moving mechanism 9 is configured to move the thrust-up unit 8. Specifically, the thrust-up unit moving mechanism 9 is configured to move the thrust-up unit 8 in the X direction and the Y direction that are approximately perpendicular to each other in a horizontal plane. The thrust-up unit moving mechanism 9 includes an X-axis thrust-up unit moving mechanism 91 for moving the head unit 3 in the X direction, and a Y-axis thrust-up unit moving mechanism 92 for moving the X-axis thrust-up unit moving mechanism 91 in the Y direction.

[0040] The X-axis thrust-up portion moving mechanism 91 is a linear motion mechanism having a ball screw shaft 91a and a drive motor 91b that drives the ball screw shaft 91a. The X-axis thrust-up portion moving mechanism 91 rotates the ball screw shaft 91a using the drive motor 91b, thereby moving the thrust-up portion 8 attached to the ball screw shaft 91a via a ball nut in the X direction.

[0041] The Y-axis thrust-up unit moving mechanism 92 is a linear motion mechanism having a ball screw shaft 92a and a drive motor 92b that drives the ball screw shaft 92a. The Y-axis thrust-up unit moving mechanism 92 moves the X-axis thrust-up unit moving mechanism 91, which is attached to the ball screw shaft 92a via a ball nut, in the Y direction by rotating the ball screw shaft 92a with the drive motor 92b. The X-axis thrust-up unit moving mechanism 91 and the Y-axis thrust-up unit moving mechanism 92 move the thrust-up unit 8 horizontally (in the X and Y directions) below the wafer W.

[0042] As shown in FIG. 1, the control unit 10 is configured to control the operation of each unit of the component mounting apparatus 100. Specifically, the control unit 10 is configured to control the operation of the conveyor 2, head unit 3, head unit moving mechanism 4, board imaging unit 32, component imaging unit 33, component supply unit 5, wafer imaging unit 6, wafer imaging unit moving mechanism 7, push-up unit 8, and push-up unit moving mechanism 9. The control unit 10 controls the operation of each unit based on output signals from position detection means such as encoders built into the drive motors of each of the above units. The control unit 10 also has the function of controlling the imaging of the various imaging units (board imaging unit 32, component imaging unit 33, and wafer imaging unit 6) and performing image recognition. The control unit 10 includes a processor such as a CPU (central processing unit) and a memory.

[0043] (Thermal expansion correction) Here, in each of the moving mechanisms, the head unit moving mechanism 4, the wafer imaging section moving mechanism 7, and the push-up section moving mechanism 9, a temperature rise occurs as each moving object, the head unit 3 (head 31), the wafer imaging section 6, and the push-up section 8, moves. Then, in each moving mechanism, thermal expansion occurs due to the temperature rise. In this case, the thermal expansion of each moving mechanism causes a deviation between the theoretical moving position and the actual moving position, and the positioning accuracy of each moving object decreases. Therefore, the component mounting device 100 performs thermal expansion correction.

[0044] 4 to 6, in the first embodiment, the control unit 10 is configured to image the push-up unit 8 using the wafer imaging unit 6, acquire a first thermal expansion correction amount D1 (see FIG. 4) including the thermal expansion of the wafer imaging unit moving mechanism 7 and the thermal expansion of the push-up unit moving mechanism 9 based on the image of the push-up unit 8 by the wafer imaging unit 6, and perform thermal expansion correction based on the acquired first thermal expansion correction amount D1. For convenience, in FIGS. 4 to 6, the head 31, the substrate imaging unit 32, the wafer imaging unit 6, and the push-up unit 8 are schematically illustrated as marks representing each component.

[0045] In addition, in the first embodiment, the control unit 10 is configured to image the push-up portion 8 using the substrate imaging unit 32, and based on the imaging results of the push-up portion 8 by the substrate imaging unit 32, obtain a second thermal expansion correction amount D2 (see Figure 5) including the thermal expansion of the head unit moving mechanism 4 and the thermal expansion of the push-up portion moving mechanism 9, and perform thermal expansion correction based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2.

[0046] Specifically, the control unit 10 is configured to acquire the imaging position of the component C by the wafer imaging unit 6 based on the first thermal expansion correction amount D1, image the component C with the wafer imaging unit 6 while moved to the acquired imaging position, acquire the deviation amount D3 (see FIG. 6) from the position of the push-up unit 8, including the thermal expansion of the push-up unit moving mechanism 9, to the position of the component C based on the imaging result of the component C by the wafer imaging unit 6, and acquire the push-up position of the component C by the push-up unit 8 based on the deviation amount D3. The control unit 10 is also configured to acquire the pick-up position of the component C by the head 31 based on the deviation amount D3 and the second thermal expansion correction amount D2.

[0047] Furthermore, in the first embodiment, the control unit 10 is configured to image the push-up portion 8 by the wafer imaging unit 6 in a state in which the wafer imaging unit 6 and the push-up portion 8 have been moved to the same first target position (theoretical position P1), and to image the push-up portion 8 by the substrate imaging unit 32 in a state in which the substrate imaging unit 32 and the push-up portion 8 have been moved to a second target position (theoretical position P1) that is the same as the first target position. Note that when the wafer imaging unit 6 and the substrate imaging unit 32 image the push-up portion 8, the wafer W is moved by the wafer holding table 51 so as to retreat from the supply position PF. Therefore, the push-up portion 8 is exposed upward at the supply position PF, and the wafer imaging unit 6 and the substrate imaging unit 32 can image the push-up portion 8 from above at the supply position PF.

[0048] An example of thermal expansion correction will be described with reference to FIGS.

[0049] Acquisition of the first thermal expansion correction amount D1 will be described with reference to Figure 4. As shown in Figure 4, when the wafer W is not placed at the supply position PF, the wafer imaging unit moving mechanism 7 moves the wafer imaging unit 6 to a theoretical position P1 as its target position, and the push-up unit moving mechanism 9 moves the push-up unit 8 to a theoretical position P1 as its target position. After the movements, the wafer imaging unit 6 is positioned at a position shifted by a thermal expansion deviation amount D11 from the theoretical position P1 due to the thermal expansion of the wafer imaging unit moving mechanism 7. Furthermore, the push-up unit 8 is positioned at a position shifted by a thermal expansion deviation amount D12 from the theoretical position P1 due to the thermal expansion of the push-up unit moving mechanism 9.

[0050] Then, with the wafer imaging unit 6 and the push-up portion 8 positioned at a position offset by the thermal expansion deviation amount from the theoretical position P1, the wafer imaging unit 6 images the push-up portion 8 from above. The imaging result includes information on the thermal expansion deviation amount D11 of the wafer imaging unit 6 and the thermal expansion deviation amount D12 of the push-up portion 8. Then, based on the imaging result of the push-up portion 8 by the wafer imaging unit 6, a first thermal expansion correction amount D1 is acquired, which includes the thermal expansion deviation amount D11 of the wafer imaging unit 6 and the thermal expansion deviation amount D12 of the push-up portion 8. The first thermal expansion correction amount D1 represents the deviation amount of the push-up portion 8 relative to the wafer imaging unit 6 in a thermally expanded state. In other words, the first thermal expansion correction amount D1 represents the relative thermal expansion deviation amount of the wafer imaging unit 6, including the thermal expansion deviation amount D12 of the push-up portion 8.

[0051] Then, by correcting the target position of the wafer imaging unit 6 by adding the first thermal expansion correction amount D1 to the target position of the wafer imaging unit 6, it is possible to move the wafer imaging unit 6 so that the center of the wafer imaging unit 6 and the center of the push-up unit 8 approximately coincide with each other. In other words, it is possible to move the wafer imaging unit 6 to the position of the push-up unit 8 including the thermal expansion of the push-up unit moving mechanism 9.

[0052] Acquisition of the second thermal expansion correction amount D2 will be described with reference to FIG. 5. As shown in FIG. 5, when the wafer W is not placed at the supply position PF, the head unit moving mechanism 4 moves the substrate imaging unit 32 to the theoretical position P1 as its target position, and the push-up unit moving mechanism 9 moves the push-up unit 8 to the theoretical position P1 as its target position. Note that if the wafer imaging unit 6 has already imaged the push-up unit 8, the push-up unit 8 has already moved, so the push-up unit 8 maintains its already moved position and is not moved. In the moved state, due to the thermal expansion of the head unit moving mechanism 4, the substrate imaging unit 32 is positioned at a position shifted by the thermal expansion deviation amount D21 from the theoretical position P1. Furthermore, due to the thermal expansion of the push-up unit moving mechanism 9, the push-up unit 8 is positioned at a position shifted by the thermal expansion deviation amount D12 from the theoretical position P1.

[0053] Then, with the board imaging unit 32 and the push-up portion 8 positioned at a position shifted by the thermal expansion deviation amount from the theoretical position P1, the board imaging unit 32 images the push-up portion 8 from above. The imaging result includes information on the thermal expansion deviation amount D21 of the board imaging unit 32 and the thermal expansion deviation amount D12 of the push-up portion 8. Then, based on the imaging result of the push-up portion 8 by the board imaging unit 32, a second thermal expansion correction amount D2 is acquired, which includes the thermal expansion deviation amount D21 of the board imaging unit 32 and the thermal expansion deviation amount D12 of the push-up portion 8. Furthermore, because the thermal expansion deviation amount of the board imaging unit 32 and the thermal expansion deviation amount of the head 31 can be considered to be approximately the same, the thermal expansion deviation amount D21 can also be considered to be the thermal expansion deviation amount of the head 31. Therefore, the second thermal expansion correction amount D2 can also be considered to include the thermal expansion deviation amount D21 of the head 31 and the thermal expansion deviation amount D12 of the push-up portion 8. The second thermal expansion correction amount D2 represents the amount of deviation of the push-up portion 8 relative to the head 31 (substrate imaging unit 32) in a thermally expanded state. That is, the second thermal expansion correction amount D2 represents the relative amount of deviation of the head 31 (substrate imaging unit 32) from the thermal expansion of the push-up portion 8, including the thermal expansion deviation amount D12.

[0054] Then, by correcting the target position of the head 31 by adding the second thermal expansion correction amount D2 to the target position of the head 31, it is possible to move the head 31 so that the center of the head 31 and the center of the thrust-up portion 8 approximately coincide with each other. In other words, it is possible to move the head 31 to the position of the thrust-up portion 8 including the thermal expansion of the thrust-up portion moving mechanism 9.

[0055] Referring to FIG. 6, the acquisition of the push-up position and the removal position based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 will be described. As shown in FIG. 6, when a wafer W is placed at the supply position PF, a component C on the wafer W is positioned at a position displaced from its theoretical position P2 due to a positioning error of the wafer support table 51 or the like. In FIG. 6, the center of the component C is displaced from the theoretical position P2 by a displacement amount Dx in the X direction and a displacement amount Dy in the Y direction. Therefore, the component C must be imaged by the wafer imaging unit 6, and the push-up position of the component C by the push-up unit 8 and the removal position (suction position) of the component C by the head 31 must be corrected by the amount of the displacement from the theoretical position P2 of the component C. In addition to correcting the displacement of the component C from the theoretical position P2, the positional displacement of each movement mechanism due to thermal expansion must also be corrected.

[0056] First, the target position (theoretical position P2) of the wafer imaging unit 6 is corrected so as to add the first thermal expansion correction amount D1 to the target position (theoretical position P2) of the wafer imaging unit 6, and the imaging position of the component C by the wafer imaging unit 6 is acquired as the corrected target position. Since the imaging position is acquired including the thermal expansion of the push-up unit moving mechanism 9, when the wafer imaging unit 6 is moved to the imaging position by the wafer imaging unit moving mechanism 7, the wafer imaging unit 6 is moved to the position of the push-up unit 8 including the thermal expansion of the push-up unit moving mechanism 9. In other words, the wafer imaging unit 6 is moved to a position shifted by the thermal expansion deviation amount D12 from the theoretical position P2.

[0057] Then, with component C moved to a position shifted by thermal expansion deviation amount D12 from theoretical position P2, wafer imaging unit 6 images component C from above. The imaging result includes information on deviation amount D3 from the position of push-up unit 8, including thermal expansion of push-up unit moving mechanism 9, to the center position of component C. Then, based on the imaging result of component C by wafer imaging unit 6, deviation amount D3 from the position of push-up unit 8, including thermal expansion of push-up unit moving mechanism 9, to the center position of component C is acquired.

[0058] Then, by correcting the target position (theoretical position P2) of the push-up unit 8 so as to add the deviation amount D3 to it, the push-up position of the component C by the push-up unit 8 is acquired as the corrected target position. Then, by moving the push-up unit 8 to the acquired push-up position using the push-up unit moving mechanism 9, it is possible to move the push-up unit 8 so that the center of the component C and the center of the push-up unit 8 approximately coincide with each other.

[0059] Furthermore, by correcting the target position (theoretical position P2) of the head 31 by adding the deviation amount D3 and the second thermal elongation correction amount D2 to the target position (theoretical position P2) of the head 31, the pick-up position of the component C by the head 31 is acquired as the corrected target position. Then, by moving the head 31 to the acquired pick-up position using the head unit moving mechanism 4, it is possible to move the head 31 so that the center of the component C and the center of the head 31 approximately coincide with each other.

[0060] As shown in FIG. 7, the wafer imaging unit 6 and the substrate imaging unit 32 may each capture an image of the push-up portion 8 at one point, or at multiple points such as two or four points.

[0061] For example, in the wafer suction area WA, which is the area of ​​the supply position PF where the wafer W is placed and the component C is suctioned, if the amount of thermal expansion of each moving object of each moving mechanism can be considered to be approximately constant regardless of the position of the component C, it is possible for each imaging unit to image the push-up portion 8 at only one point within the wafer suction area WA. In this case, each imaging unit images the push-up portion 8 at point P11, which is the center position of the wafer suction area WA. Then, based on the image of the push-up portion 8 at point P11, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 at point P11 are acquired. The acquired first thermal expansion correction amount D1 and second thermal expansion correction amount D2 are then used as is when correcting the push-up position and the removal position, as described with reference to FIGS. 4 to 6. That is, the same first thermal expansion correction amount D1 and second thermal expansion correction amount D2 are used regardless of the position of the component C on the wafer W when removing the component C.

[0062] Furthermore, for example, if the amount of thermal expansion of each moving object of each moving mechanism within the wafer suction area WA differs depending on the position of the component C, it is possible for each imaging unit to capture images of the push-up portion 8 at multiple points, such as any two or four points within the wafer suction area WA.

[0063] For example, when imaging of the push-up portion 8 at two arbitrary points, each imaging unit images the push-up portion 8 at predetermined points P21 and P22 within the wafer suction area WA. Then, based on the imaging results of the push-up portion 8 at each of points P21 and P22, a first thermal expansion correction amount D1 and a second thermal expansion correction amount D2 for each position of the component C on the wafer W are acquired using a coordinate transformation method such as affine transformation. The acquired first thermal expansion correction amount D1 and second thermal expansion correction amount D2 for each position of the component C on the wafer W are then used when correcting the push-up position and the removal position. In other words, different first thermal expansion correction amounts D1 and second thermal expansion correction amounts D2 are used depending on the position of the component C on the wafer W.

[0064] Furthermore, for example, when the push-up portions 8 are imaged at four arbitrary points, the push-up portions 8 are imaged by each imaging unit at predetermined points P31 to P34 within the wafer suction area WA. Then, based on the image capture results of the push-up portions 8 at each of points P31 to P34, a first thermal expansion correction amount D1 and a second thermal expansion correction amount D2 for each position of the component C on the wafer W are acquired using a coordinate transformation method such as projective transformation. The acquired first thermal expansion correction amount D1 and second thermal expansion correction amount D2 for each position of the component C on the wafer W are then used when correcting the push-up position and the removal position. In other words, different first thermal expansion correction amounts D1 and second thermal expansion correction amounts D2 are used depending on the position of the component C on the wafer W.

[0065] (Control process for thermal expansion correction) 8 and 9, a control process relating to thermal expansion correction by the component mounting apparatus 100 of the first embodiment will be described based on a flowchart. Each process in the flowchart is executed by the control unit 10.

[0066] 8, the control process for obtaining the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 will be described. As shown in FIG. 8, first, in step S101, it is determined whether or not the wafer W is present at the supply position PF. If it is determined that the wafer W is not present at the supply position PF, the process proceeds to step S103. If it is determined that the wafer W is present at the supply position PF, the process proceeds to step S102.

[0067] Then, in step S102, the wafer W is returned to the wafer storage unit 11 by the wafer support table 51.

[0068] Then, in step S103, the wafer is moved to the imaging position (theoretical position P1) by the wafer imaging unit moving mechanism 7, and the push-up unit 8 is moved to the imaging position (theoretical position P1) by the push-up unit moving mechanism 9.

[0069] Then, in step S104, the wafer imaging unit 6 images the push-up portion 8.

[0070] Then, in step S105, it is determined whether or not imaging of the push-up portion 8 by the wafer imaging unit 6 has been completed at all imaging points. If it is determined that imaging of the push-up portion 8 by the wafer imaging unit 6 has not been completed at all imaging points, the process proceeds to step S103, where imaging of the push-up portion 8 by the wafer imaging unit 6 is performed at the next imaging point. If it is determined that imaging of the push-up portion 8 by the wafer imaging unit 6 has been completed at all imaging points, the process proceeds to step S106. Note that if there is only one imaging point, the process of step S105 is not performed.

[0071] Then, in step S106, based on the imaging result of the push-up portion 8 by the wafer imaging unit 6, the first thermal expansion correction amount D1 is acquired.

[0072] Then, in step S107, the substrate imaging section 32 is moved to the imaging position (theoretical position P1) by the head unit moving mechanism 4, and the push-up section 8 is moved to the imaging position (theoretical position P1) by the push-up section moving mechanism 9. Note that the push-up section 8 maintains the position to which it was moved in the processing of step S103.

[0073] Then, in step S108, the substrate imaging unit 32 images the push-up portion 8.

[0074] Then, in step S109, it is determined whether or not imaging of the push-up portions 8 by the board imaging unit 32 has been completed at all imaging points. If it is determined that imaging of the push-up portions 8 by the board imaging unit 32 has not been completed at all imaging points, the process proceeds to step S107, where imaging of the push-up portions 8 by the board imaging unit 32 is performed at the next imaging point. If it is determined that imaging of the push-up portions 8 by the board imaging unit 32 has been completed at all imaging points, the process proceeds to step S110. Note that if there is only one imaging point, the process of step S109 is not performed.

[0075] Then, in step S110, the second thermal expansion correction amount D2 is acquired based on the image of the push-up unit 8 captured by the board imaging unit 32. Then, the control process ends. Note that because the thermal expansion amount of each moving mechanism changes over time, the control process shown in FIG. 8 is performed at predetermined time intervals (e.g., every 3 minutes). Therefore, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 are updated at predetermined time intervals, and the latest thermal expansion state is reflected in the thermal expansion correction.

[0076] 9, a control process for obtaining the push-up position and the removal position based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 will be described. The wafer W is placed at the supply position PF. As shown in FIG. 9, first, in step S111, the imaging position of the component C by the wafer imaging unit 6 is obtained based on the first thermal expansion correction amount D1.

[0077] Then, in step S112, the wafer imaging unit moving mechanism 7 moves the wafer imaging unit 6 to the imaging position.

[0078] Then, in step S113, the wafer imaging unit 6 captures an image of the component C.

[0079] Then, in step S114, based on the imaging result of the component C by the wafer imaging unit 6, the deviation amount D3 is acquired.

[0080] Then, in step S115, the push-up position of the component C by the push-up unit 8 is acquired based on the deviation amount D3.

[0081] Then, in step S116, the push-up portion moving mechanism 9 moves the push-up portion 8 to the push-up position.

[0082] In step S117, the pick-up position of the component C by the head 31 is acquired based on the deviation amount D3 and the second thermal elongation correction amount D2.

[0083] Then, in step S118, the head unit moving mechanism 4 moves the head 31 to the removal position.

[0084] Then, in step S119, the component C is pushed up by the push-up unit 8 and the component C is removed by the head 31. Then, the control process ends. The control process shown in Fig. 9 is repeated until the production of the board B is completed.

[0085] (Effects of the first embodiment) In the first embodiment, the following effects can be obtained.

[0086] In the first embodiment, as described above, the wafer imaging unit 6 images the push-up unit 8, and based on the imaging result of the push-up unit 8 by the wafer imaging unit 6, a first thermal expansion correction amount D1 is acquired, which includes the thermal expansion of the wafer imaging unit moving mechanism 7 that moves the wafer imaging unit 6 and the thermal expansion of the push-up unit moving mechanism 9 that moves the push-up unit 8. The controller 10 performs thermal expansion correction based on the acquired first thermal expansion correction amount D1. This allows correction of the thermal expansion of the push-up unit moving mechanism 9 that moves the push-up unit 8, thereby preventing the push-up unit 8 from being unable to move to an appropriate push-up position due to the thermal expansion of the push-up unit moving mechanism 9. In other words, the push-up unit moving mechanism 9 can move the push-up unit 8 to an appropriate push-up position, allowing the push-up unit 8 to appropriately push up the component C. This ensures stable precision in pushing up the component C. Furthermore, stable precision in pushing up the component C can be ensured, thereby ensuring stable precision in removing the component C.

[0087] In order to correct the thermal expansion of the wafer imaging unit moving mechanism 7 and the push-up unit moving mechanism 9, the component mounting apparatus 100 may be configured as follows. That is, the component mounting apparatus 100 may be provided with a recognition mark used for thermal expansion correction, and the wafer imaging unit 6 may capture an image of the recognition mark to correct the thermal expansion of the wafer imaging unit moving mechanism 7. After the thermal expansion of the wafer imaging unit moving mechanism 7 has been corrected, the wafer imaging unit 6 may capture an image of the push-up unit 8 to correct the thermal expansion of the push-up unit moving mechanism 9. However, in this case, the recognition mark and the push-up unit 8 must be captured separately, which increases the time required for thermal expansion correction. In contrast, as described above, the wafer imaging unit 6 may capture an image of the push-up unit 8, and based on the image of the push-up unit 8 captured by the wafer imaging unit 6, a first thermal expansion correction amount D1 including the thermal expansion of the wafer imaging unit moving mechanism 7 and the thermal expansion of the push-up unit moving mechanism 9 may be acquired. Then, thermal expansion correction may be performed based on the acquired first thermal expansion correction amount D1. This allows the thermal expansion of the wafer imaging unit moving mechanism 7 and the thermal expansion of the push-up unit moving mechanism 9 to be corrected simultaneously simply by taking an image of the push-up unit 8, thereby preventing an increase in the time required for thermal expansion correction.

[0088] Furthermore, in the first embodiment, as described above, the control unit 10 is configured to acquire the imaging position of the component C by the wafer imaging unit 6 based on the first thermal expansion correction amount D1, image the component C with the wafer imaging unit 6 while moved to the acquired imaging position, acquire the deviation amount D3 from the position of the push-up unit 8, including the thermal expansion of the push-up unit moving mechanism 9, to the position of the component C based on the imaging result of the component C by the wafer imaging unit 6, and acquire the push-up position of the component C by the push-up unit 8 based on the deviation amount D3. This allows the push-up position of the component C by the push-up unit 8 to be accurately corrected based on the first thermal expansion correction amount D1, making it easy to ensure stable precision in the push-up of the component C.

[0089] Furthermore, in the first embodiment, as described above, the component mounting apparatus 100 includes the head unit 3 that removes components C from the wafer from above, the board imaging unit 32 provided in the head unit 3, and the head unit moving mechanism 4 that moves the head unit 3. The control unit 10 is configured to image the push-up unit 8 using the board imaging unit 32, acquire a second thermal expansion correction amount D2 that includes the thermal expansion of the head unit moving mechanism 4 and the thermal expansion of the push-up unit moving mechanism 9 based on the imaging result of the push-up unit 8 by the board imaging unit 32, and perform thermal expansion correction based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2. This allows the thermal expansion of the head unit moving mechanism 4 to be corrected in accordance with the correction of the thermal expansion of the wafer imaging unit moving mechanism 7 and the push-up unit moving mechanism 9, and allows the head unit moving mechanism 4 to move the head 31 to an appropriate removal position. As a result, the head 31 can appropriately remove components C, ensuring more stable removal accuracy of the components C.

[0090] Furthermore, in the first embodiment, as described above, the control unit 10 is configured to acquire the imaging position of the component C by the wafer imaging unit 6 based on the first thermal expansion correction amount D1, image the component C with the wafer imaging unit 6 while moving it to the acquired imaging position, acquire the deviation amount D3 from the position of the push-up unit 8, including the thermal expansion of the push-up unit moving mechanism 9, to the position of the component C based on the imaging result of the component C by the wafer imaging unit 6, acquire the push-up position of the component C by the push-up unit 8 based on the deviation amount D3, and acquire the removal position of the component C by the head 31 based on the deviation amount D3 and the second thermal expansion correction amount D2. This allows the push-up position of the component C by the push-up unit 8 and the removal position of the component C by the head 31 to be accurately corrected based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2, thereby easily ensuring more stable push-up accuracy of the component C and more stable removal accuracy of the component C.

[0091] Furthermore, in the first embodiment, as described above, the wafer imaging unit moving mechanism 7 is configured to move the wafer imaging unit 6 in the X and Y directions, which are substantially perpendicular to each other in a horizontal plane. The push-up unit moving mechanism 9 is configured to move the push-up unit 8 in the X and Y directions. The head unit moving mechanism 4 is configured to move the head unit 3 in the X and Y directions. This allows the wafer imaging unit moving mechanism 7, the push-up unit moving mechanism 9, and the head unit moving mechanism 4 to easily move the wafer imaging unit 6, the push-up unit 8, and the head unit 3 in the X and Y directions, respectively. Furthermore, when the effects of thermal expansion caused by moving the wafer imaging unit 6, the push-up unit 8, and the head unit 3 in the X and Y directions are complex, the thermal expansion of the wafer imaging unit moving mechanism 7, the push-up unit moving mechanism 9, and the head unit moving mechanism 4 can be corrected.

[0092] Furthermore, in the first embodiment, as described above, the control unit 10 is configured to image the push-up unit 8 using the wafer imaging unit 6 with the wafer imaging unit 6 and the push-up unit 8 moved to the same first target position, and to image the push-up unit 8 with the substrate imaging unit 32 with the push-up unit 8 moved to a second target position that is the same as the first target position. This makes it possible to match the thermal expansion of the push-up unit moving mechanism 9 included in the first thermal expansion correction amount D1 with the thermal expansion of the push-up unit moving mechanism 9 included in the second thermal expansion correction amount D2, thereby enabling accurate thermal expansion correction based on the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2.

[0093] Furthermore, in the first embodiment, as described above, the push-up unit 8 is configured not to have an imaging unit. As a result, since the push-up unit 8 does not have an imaging unit, it is possible to suppress an increase in the number of parts and a complicated structure compared to when the push-up unit 8 has an imaging unit. Furthermore, even if the push-up unit 8 does not have an imaging unit, it is possible to effectively use the wafer imaging unit 6 to correct thermal expansion of the push-up unit moving mechanism 9. As a result, it is possible to correct thermal expansion of the push-up unit moving mechanism 9 while suppressing an increase in the number of parts and a complicated structure.

[0094] [Second embodiment] Next, a second embodiment will be described with reference to Figures 10 to 12. Unlike the first embodiment, this second embodiment will describe an example in which an area from which components are removed from a wafer within a predetermined time interval is acquired, and an image of a push-up portion is captured by a wafer imaging unit at a position corresponding to the acquired area. Note that the same components as those in the first embodiment are denoted by the same reference numerals in the figures, and their description will be omitted.

[0095] (Configuration of component mounting equipment) 10, a component mounting apparatus 200 according to the second embodiment of the present invention differs from the component mounting apparatus 100 according to the first embodiment in that it includes a control unit 110. The control unit 110 is configured to update the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 for the thermal expansion correction at predetermined time intervals (e.g., every 3 minutes).

[0096] In the second embodiment, the control unit 110 is configured to acquire an area 111 in which components C are removed from the wafer W within a predetermined time interval, image the push-up portion 8 using the wafer imaging unit 6 at a position P101 corresponding to the acquired area 111, and update the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 for the thermal expansion correction. Also, in the second embodiment, the control unit 110 is configured to acquire the number of components C to be removed from the wafer W within a predetermined time interval based on the cycle time of the board B, and acquire the area 111 based on the acquired number of components C. Note that while FIG. 10 illustrates an example in which two imaging points are used, the number of imaging points may be one or more than two.

[0097] (Control process for thermal expansion correction) 11 and 12, a control process relating to thermal expansion correction by the component mounting apparatus 200 of the second embodiment will be described based on a flowchart. Each process in the flowchart is executed by the control unit 110.

[0098] 11, first, the cycle time is initialized in step S201. In step S201, the previous cycle time is set based on the previous production history.

[0099] Then, in step S202, the conveyor 2 replaces the board B. In step S202, the conveyor 2 carries out the board B on which the component C has been mounted, and carries in the board B on which the component C is to be mounted.

[0100] Then, in step S203, it is determined whether the timing is the timing to update the thermal expansion correction. If it is determined that the timing is not the timing to update the thermal expansion correction, the process proceeds to step S207. If it is determined that the timing is the timing to update the thermal expansion correction, the process proceeds to step S204.

[0101] Then, in step S204, the number of components C to be removed from the wafer W by the next thermal expansion correction update timing is obtained based on the cycle time of the substrate B, and based on the obtained number of components C, an area 111 from which the components C will be removed from the wafer W by the next thermal expansion correction update timing is obtained.

[0102] Then, in step S205, the push-up portion 8 is imaged by the wafer imaging unit 6 and the substrate imaging unit 32.

[0103] Then, in step S206, the first thermal expansion correction amount D1 and the second thermal expansion correction amount D2 are acquired based on the image capturing result of the push-up portion 8. In steps S205 and S206, specifically, the processes of steps S103 to S110 shown in FIG. 8 are performed.

[0104] Then, in step S207, the wafer imaging unit 6 captures an image of the component C.

[0105] Then, in step S208, the component C is pushed up by the push-up unit 8 and removed by the head 31. In steps S207 and S208, the processes of steps S111 to S119 shown in FIG. 8 are performed in detail.

[0106] Then, in step S209, the component C picked up by the suction nozzle 31a of the head 31 is imaged by the component imaging unit 33.

[0107] Then, in step S210, the component C is mounted on the board B by the head 31 based on the image of the component C captured by the component imaging unit 33.

[0108] 12, the cycle time is updated in step S211. The cycle time may be updated for each suction group of the head 31, or may be updated for each production of one substrate B.

[0109] Then, in step S212, it is determined whether component C has been mounted at all of the mounting positions on board B. If it is determined that component C has not been mounted at all of the mounting positions on board B, the process proceeds to step S203, where component C is mounted at the remaining mounting positions. If it is determined that component C has been mounted at all of the mounting positions on board B, the process proceeds to step S213.

[0110] Then, in step S213, it is determined whether or not to terminate the production of board B. If it is determined not to terminate the production of board B, the process proceeds to step S202, where component C is mounted on the next board B. If it is determined to terminate the production of board B, the process proceeds to step S214.

[0111] Then, in step S214, the conveyor 2 carries out the substrate B.

[0112] Then, in step S215, the cycle time is saved, and the control process is then terminated.

[0113] The other configurations of the second embodiment are the same as those of the first embodiment.

[0114] (Effects of the second embodiment) In the second embodiment, the following effects can be obtained.

[0115] In the second embodiment, as described above, the control unit 110 is configured to update the thermal expansion correction at predetermined time intervals. The control unit 110 is configured to acquire the area 111 where the component C is to be removed from the wafer W within the predetermined time interval, image the push-up portion 8 using the wafer imaging unit 6 at the position P101 corresponding to the acquired area 111, and update the thermal expansion correction. By updating the thermal expansion correction at predetermined time intervals, it is possible to appropriately reflect thermal expansion that changes over time in the thermal expansion correction. Furthermore, it is also possible to acquire the area 111 where the component C is to be removed from the wafer W within the predetermined time interval, image the push-up portion 8 using the wafer imaging unit 6 at the position P101 corresponding to the acquired area 111, and update the thermal expansion correction. This allows the wafer imaging unit 6 to image the push-up portion 8 at an effective position close to the component C and update the thermal expansion correction, thereby effectively improving the accuracy of the thermal expansion correction.

[0116] Furthermore, because thermal expansion is often not linear, it is preferable to image the push-up portion 8 at multiple positions using the wafer imaging unit 6 and perform thermal expansion correction from the perspective of improving the accuracy of thermal expansion correction. However, when the push-up portion 8 is imaged at multiple positions using the wafer imaging unit 6, the time required for thermal expansion correction increases. In contrast, the above configuration can effectively improve the accuracy of thermal expansion correction, so that thermal expansion correction can be performed with high accuracy even if the number of positions at which the wafer imaging unit 6 images the push-up portion 8 is reduced. This makes it possible to perform thermal expansion correction with high accuracy while suppressing an increase in the time required for thermal expansion correction.

[0117] Furthermore, in the second embodiment, as described above, the control unit 110 is configured to acquire the number of components C to be removed from the wafer W within a predetermined time interval based on the cycle time of the board B, and acquire the area 111 based on the acquired number of components C. This makes it possible to easily acquire the area 111 for removing the components C from the wafer W within the predetermined time interval based on the number of components C to be removed from the wafer W within the predetermined time interval.

[0118] The other effects of the second embodiment are the same as those of the first embodiment.

[0119] (Variation) The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not by the description of the above embodiments, and further includes all modifications (variations) within the meaning and scope of the claims.

[0120] For example, in the first and second embodiments, the head is a mounting head, but the present invention is not limited to this. In the present invention, the head may be a take-out head that takes components off a wafer and transfers the taken-out components to the mounting head.

[0121] In the first and second embodiments, the substrate imaging unit is provided as the second imaging unit, but the present invention is not limited to this. In the present invention, an imaging unit other than the substrate imaging unit may be provided as the second imaging unit.

[0122] In the first and second embodiments, an example was shown in which the thrust-up portion moving mechanism (second moving mechanism) moved the thrust-up portion in the X direction (first direction) and the Y direction (second direction), but the present invention is not limited to this. In the present invention, the second moving mechanism may move the thrust-up portion in only one of the first direction and the second direction.

[0123] In the first and second embodiments, the control unit acquires both the first and second thermal expansion correction amounts, but the present invention is not limited to this. In the present invention, the control unit may acquire only the first thermal expansion correction amount.

[0124] Furthermore, in the above embodiment, for convenience of explanation, the control processing is described using a flow-driven flow in which processing is performed sequentially according to a processing flow, but the present invention is not limited to this. In the present invention, the control processing may be performed by an event-driven processing in which processing is performed on an event-by-event basis. In this case, the control processing may be performed completely event-driven, or may be performed by combining event-driven and flow-driven processing. [Explanation of symbols]

[0125] 3 Head Unit 4. Head unit movement mechanism (third movement mechanism) 6 Wafer imaging unit (first imaging unit) 7 Wafer imaging unit moving mechanism (first moving mechanism) 8 Push-up section 9 Push-up section movement mechanism (second movement mechanism) 10, 110 control unit 31 head 32 Board imaging unit (second imaging unit) 100, 200 Component Mounting Equipment 111 areas B board C parts D1 First thermal expansion correction amount D2 Second thermal expansion correction amount D3 Deviation amount Position corresponding to P101 area X direction (first direction) Y direction (second direction) W wafer

Claims

1. A component mounting device that removes components from a diced wafer and mounts them on a substrate, a first imaging unit that images the component on the wafer from above; a push-up portion that pushes up the component on the wafer from below; a first moving mechanism that moves the first imaging unit; a second moving mechanism that moves the push-up portion; a control unit that captures an image of the push-up portion using the first imaging unit, acquires a first thermal expansion correction amount including the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism based on the image of the push-up portion captured by the first imaging unit, and performs thermal expansion correction based on the acquired first thermal expansion correction amount; a head unit including a head that removes the components from the wafer from above; a second imaging unit provided in the head unit; a third movement mechanism that moves the head unit, The control unit is configured to image the push-up portion using the second imaging unit, acquire a second thermal expansion correction amount including the thermal expansion of the third movement mechanism and the thermal expansion of the second movement mechanism based on the imaging result of the push-up portion by the second imaging unit, and perform thermal expansion correction based on the first thermal expansion correction amount and the second thermal expansion correction amount, the control unit is configured to image the component using the first imaging unit, obtain the amount of deviation from the position of the push-up unit, including thermal expansion of the second moving mechanism, to the position of the component based on the imaging result of the component by the first imaging unit, and obtain the position at which the head will remove the component based on the amount of deviation and the second thermal expansion correction amount.

2. A component mounting device that removes components from a diced wafer and mounts them on a substrate, a first imaging unit that images the component on the wafer from above; a push-up portion that pushes up the component on the wafer from below; a first moving mechanism that moves the first imaging unit; a second moving mechanism that moves the push-up portion; A control unit that images the push-up portion using the first imaging unit, acquires a first thermal expansion correction amount including the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism based on the image of the push-up portion by the first imaging unit, and performs thermal expansion correction based on the acquired first thermal expansion correction amount, the control unit is configured to image the component using the first imaging unit, obtain the amount of deviation from the position of the push-up unit, including thermal elongation of the second moving mechanism, to the position of the component based on the imaging result of the component by the first imaging unit, and obtain the push-up position of the component by the push-up unit based on the amount of deviation.

3. 2. The component mounting device according to claim 1, wherein the control unit is configured to acquire an imaging position of the component by the first imaging unit based on the first thermal expansion correction amount, image the component by the first imaging unit while moving it to the acquired imaging position, acquire the amount of deviation from the position of the push-up unit, including the thermal expansion of the second moving mechanism, to the position of the component based on the imaging result of the component by the first imaging unit, and acquire the push-up position of the component by the push-up unit based on the amount of deviation.

4. 2. The component mounting device according to claim 1, wherein the control unit is configured to acquire an imaging position of the component by the first imaging unit based on the first thermal expansion correction amount, image the component by the first imaging unit while moved to the acquired imaging position, acquire the amount of deviation from the position of the push-up unit, including the thermal expansion of the second moving mechanism, to the position of the component based on the imaging result of the component by the first imaging unit, acquire the push-up position of the component by the push-up unit based on the amount of deviation, and acquire the removal position of the component by the head based on the amount of deviation and the second thermal expansion correction amount.

5. the first moving mechanism is configured to move the first imaging unit in a first direction and a second direction that are substantially perpendicular to each other in a horizontal plane, the second moving mechanism is configured to move the push-up portion in the first direction and the second direction, The component mounting device according to claim 1 , wherein the third movement mechanism is configured to move the head unit in the first direction and the second direction.

6. The component mounting device according to any one of claims 1 and 3 to 5, wherein the control unit is configured to image the push-up portion using the first imaging unit while the first imaging unit and the push-up portion are moved to the same first target position, and to image the push-up portion using the second imaging unit while the second imaging unit and the push-up portion are moved to a second target position that is the same as the first target position.

7. The control unit is configured to update the thermal expansion correction at predetermined time intervals, The component mounting device according to any one of claims 1 to 6, wherein the control unit is configured to acquire an area from which the components are removed from the wafer within the specified time interval, image the push-up portion using the first imaging unit at a position corresponding to the acquired area, and update thermal expansion correction.

8. 8. The component mounting device according to claim 7, wherein the control unit is configured to acquire the number of components to be removed from the wafer within the predetermined time interval based on a cycle time of the substrate, and to acquire the area based on the acquired number of components.

9. 9. The component mounting device according to claim 1, wherein the push-up unit is configured not to have an imaging unit.

10. A component mounting device that removes components from a diced wafer and mounts them on a substrate, a first imaging unit that images the component on the wafer from above; a push-up portion that pushes up the component on the wafer from below; a first moving mechanism that moves the first imaging unit; a second moving mechanism that moves the push-up portion; A control unit that images the push-up portion using the first imaging unit, acquires a first thermal expansion correction amount including the thermal expansion of the first moving mechanism and the thermal expansion of the second moving mechanism based on the image of the push-up portion by the first imaging unit, and performs thermal expansion correction based on the acquired first thermal expansion correction amount, the control unit is configured to acquire an imaging position of the component by the first imaging unit based on the first thermal expansion correction amount, and to image the component by the first imaging unit while moving the component to the acquired imaging position.

Images