Component mounter and component storage tape position recognition method

Abstract

To execute recognition of the position of a component storage tape under an appropriate recognition condition according to the type of the component storage tape.SOLUTION: An arithmetic processing unit 110 determines the type of a component storage tape 6 attached to a tape feeder 5 (step S101). Then, recognition processing is executed using a recognition condition C corresponding to the type of the component storage tape 6 determined by the arithmetic processing unit 110 (tape type determination unit) among the plurality of recognition conditions C (steps S109, S111, S114, S116). Therefore, it is possible to recognize the position of the component storage tape 6 under an appropriate recognition condition according to the type of the component storage tape 6.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a technology for supplying components by conveying a component storage tape having pockets for storing components to be mounted on a board using a tape feeder, and more particularly to a technology for recognizing the position of the component storage tape. [Background technology]

[0002] There is known a component mounter that uses a component storage tape containing components arranged in a line to supply components, and then uses a mounting head to pick up and mount the components on a board. Such a component mounter uses a tape feeder that intermittently transports the component storage tape to sequentially supply the components to predetermined component supply positions. The position of the component storage tape transported by the tape feeder is recognized, and the position at which the mounting head picks up the components is adjusted based on this recognized position. In particular, in Patent Documents 1 to 3, the position of the component storage tape is recognized based on an image of the component storage tape captured by a camera. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-126609 [Patent Document 2] Japanese Patent Application Laid-Open No. 2011-44591 [Patent Document 3] Japanese Patent Application Laid-Open No. 2011-171419 Summary of the Invention [Problem to be solved by the invention]

[0004] To accurately recognize the position of the component storage tape as described above, it is necessary to use recognition conditions appropriate for the component storage tape. However, the type of component storage tape used in a component mounter is not limited to one. Therefore, there have been cases where the position of the component storage tape could not be accurately recognized because recognition of the component storage tape position was performed using recognition conditions inappropriate for the type of component storage tape.

[0005] SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has as its object to make it possible to recognize the position of a component storage tape under appropriate recognition conditions according to the type of component storage tape. [Means for solving the problem]

[0006] The component mounting machine of the present invention comprises a tape feeder that supplies components to a predetermined component supply position by transporting a component storage tape having pockets for storing components, an imaging unit that images the component storage tape attached to the tape feeder, a memory unit that stores a plurality of recognition conditions corresponding to different types of component storage tape, a tape type discrimination unit that discriminates the type of component storage tape attached to the tape feeder, and a recognition control unit that executes a recognition process that causes the imaging unit to image the component storage tape, obtains the image, and acquires information regarding the position of the component storage tape from the image, and the recognition control unit executes the recognition process using a recognition condition from the plurality of recognition conditions that corresponds to the type of component storage tape discriminated by the tape type discrimination unit.

[0007] The component storage tape position recognition method of the present invention includes a step of determining the type of component storage tape attached to a tape feeder that supplies components to a predetermined component supply position by transporting a component storage tape having pockets for storing components, and a step of performing a recognition process that captures an image of the component storage tape and obtains information regarding the position of the component storage tape from the image, and the recognition process is performed using a recognition condition that corresponds to the determined type of component storage tape from among a plurality of recognition conditions that correspond to different types of component storage tape.

[0008] In the present invention (component mounter and component storage tape position recognition method) configured as described above, the type of component storage tape attached to the tape feeder is identified. Then, the recognition process is performed using a recognition condition, out of multiple recognition conditions, that corresponds to the type of component storage tape identified by the tape type identification unit. Therefore, it is possible to recognize the position of the component storage tape using an appropriate recognition condition according to the type of component storage tape.

[0009] The mounter may also be configured so that the tape type determination unit determines the type of component storage tape attached to the tape feeder based on board data that indicates information about components supplied to the component supply position by the tape feeder. With this configuration, the type of component storage tape can be accurately determined based on the board data. As a result, the position of the component storage tape can be recognized under appropriate recognition conditions according to the type of component storage tape.

[0010] The component mounter may also be configured so that the recognition control unit executes the recognition process multiple times while changing the recognition conditions from among a plurality of recognition conditions, and the tape type determination unit determines the type of component storage tape attached to the tape feeder based on the relationship between the result of the recognition process and the recognition conditions used in the recognition process. With this configuration, the type of component storage tape can be accurately determined based on the result of executing the recognition process while changing the recognition conditions. As a result, the position of the component storage tape can be recognized under appropriate recognition conditions according to the type of component storage tape.

[0011] The component mounter may also be configured such that the storage unit stores a first priority recognition condition and a second priority recognition condition that are different from each other as recognition conditions corresponding to the same type of component storage tape, and the recognition control unit executes the recognition process under the first priority recognition condition that corresponds to the type of component storage tape identified by the tape type identification unit, and if the recognition process under the first priority recognition condition fails, executes the recognition process under the second priority recognition condition that corresponds to the type of component storage tape identified by the tape type identification unit. In this configuration, multiple different recognition conditions (the first priority recognition condition and the second priority recognition condition) are provided for the same type of component storage tape. If the recognition process under the first priority recognition condition fails, the recognition process is executed under the second priority recognition condition. Therefore, even if the recognition process under the first priority recognition condition fails due to, for example, the influence of external disturbances, the recognition process does not immediately end in failure, but can be successfully executed by using the second priority recognition condition. [Effects of the Invention]

[0012] As described above, according to the present invention, it is possible to recognize the position of a component storage tape under appropriate recognition conditions according to the type of component storage tape. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a partial plan view schematically showing a component mounter according to the present invention. [Figure 2] FIG. 2 is a block diagram showing an electrical configuration of the component mounter of FIG. 1. [Figure 3] FIG. 2 is a side view schematically showing the configuration of the tape feeder. [Figure 4A] FIG. 2 is a plan view schematically showing the configuration of a component storage tape. [Figure 4B] FIG. 2 is a cross-sectional view schematically showing the configuration of a component storage tape. [Figure 5] FIG. 4 is a diagram showing, in table form, each recognition condition stored in a storage unit. [Figure 6] 10 is a flowchart showing an example of tape position recognition executed by the component mounter. [Figure 7]10 is a flowchart showing a modified example of the tape type determination. DETAILED DESCRIPTION OF THE INVENTION

[0014] Fig. 1 is a partial plan view showing a component mounter according to the present invention, and Fig. 2 is a block diagram showing the electrical configuration of the component mounter of Fig. 1. In Fig. 1 and the following figures, the X direction, which is the horizontal direction, the Y direction, which is the horizontal direction perpendicular to the X direction, and the Z direction, which is the vertical direction, are shown as appropriate.

[0015] 2, the mounter 1 includes a main control unit 100 that controls the entire device, and the main control unit 100 includes an arithmetic processing unit 110, a drive control unit 120, a storage unit 130, an imaging control unit 140, and a feeder communication unit 150. The arithmetic processing unit 110 is a processor configured with a CPU (Central Processing Unit), RAM (Random Access Memory), etc., and controls the drive control unit 120, the imaging control unit 140, and the feeder communication unit 150 based on programs and data stored in the storage unit 130, thereby controlling each operation described below. The mounter 1 is also provided with a user interface 160 configured, for example, by a touch panel display, and the arithmetic processing unit 110 executes control in response to input from the user interface 160 and displays information on the display of the user interface 160.

[0016] As shown in FIG. 1, the mounter 1 includes a pair of conveyors 12, 12 provided on a base 11. Each conveyor 12 is configured as a belt conveyor arranged parallel to the X direction. The mounter 1 controls the conveyors 12 using a drive control unit 120 to transport the board B. That is, the mounter 1 mounts components E (FIGS. 4A and 4B) on the board B that has been transported by the conveyor 12 from the upstream side in the X direction (board transport direction) to a work position (the position of the board B in FIG. 1), and then transports the board B, on which component mounting has been completed, from the work position to the downstream side in the X direction by the conveyor 12.

[0017] Two component supply units 25 are lined up in the X direction on each side of the pair of conveyors 12, 12 in the Y direction, and multiple tape feeders 5 are lined up in the X direction in each component supply unit 25. A component supply reel is provided for each tape feeder 5, around which a component storage tape 6 (FIGS. 4A and 4B) is wound. The component storage tape 6 stores small pieces of components E, such as integrated circuits, transistors, and capacitors, at a predetermined pitch. Each tape feeder 5 supplies components E to a component supply position Ls at the leading end of the component storage tape 6 by intermittently feeding out the component storage tape 6 pulled out from the component supply reel. The calculation processing unit 110 controls the operation of the tape feeder 5 by issuing commands to the feeder control unit 50 of the tape feeder 5 via the feeder communication unit 150.

[0018] Between two component supply units 25 aligned in the X direction, a component recognition camera 7 is attached to the base 11 facing upward. This component recognition camera 7 captures an image of a component E from below before it is mounted on the board B, and transmits the acquired component image to the imaging control unit 140. The imaging control unit 140 recognizes the position of the component E based on the component image received from the component recognition camera 7.

[0019] The component mounter 1 is also provided with a pair of Y-axis rails 21, 21 extending in the Y direction, a Y-axis ball screw 22 extending in the Y direction, and a Y-axis motor My that rotates and drives the Y-axis ball screw 22, and an X-axis rail 23 is supported on the pair of Y-axis rails 21, 21 so as to be movable in the Y direction and is fixed to the nut of the Y-axis ball screw 22. An X-axis ball screw 24 extending in the X direction and an X-axis motor Mx that rotates and drives the X-axis ball screw 24 are attached to the X-axis rail 23, and the head unit 3 is supported on the X-axis rail 23 so as to be movable in the X direction and is fixed to the nut of the X-axis ball screw 24. Therefore, the drive control unit 120 can rotate the Y-axis ball screw 22 using the Y-axis motor My to move the head unit 3 in the Y direction, or can rotate the X-axis ball screw 24 using the X-axis motor Mx to move the head unit 3 in the X direction.

[0020] The head unit 3 has multiple (six) mounting heads 31 lined up in the X direction. Furthermore, the head unit 3 has a Z-axis motor Mz for each mounting head 31 that raises and lowers the mounting head 31. Each mounting head 31 has an elongated shape that extends in the Z direction (vertical direction), and has a detachable nozzle at its bottom end for suctioning components E. Then, component mounting is performed by the mounting head 31 as follows.

[0021] That is, the drive control unit 120 controls the X-axis motor Mx and the Y-axis motor My to position the nozzle of the mounting head 31 facing the component supply position Ls from above. Next, the drive control unit 120 controls the Z-axis motor Mz to lower the mounting head 31, bringing the nozzle into contact with the component E supplied to the component supply position Ls by the tape feeder 5. Then, when the mounting head 31 adsorbs the component E to the nozzle by applying negative pressure to the nozzle, the drive control unit 120 raises the mounting head 31. When the mounting head 31 has completed picking up the component E from the component supply position Ls in this manner, the drive control unit 120 controls the X-axis motor Mx and the Y-axis motor My to move the mounting head 31 above the board B. Then, the drive control unit 120 controls the Z-axis motor Mz to lower the mounting head 31, bringing the component E adsorbed by the nozzle of the mounting head 31 into contact with the top surface of the board B. Next, the component E is released from adsorption, and the component E is mounted on the board B.

[0022] The storage unit 130 stores board data D indicating the procedure for mounting predetermined components E on the board B. This board data D indicates the mounting positions (lands) provided on the board B, the types of components E to be mounted at those mounting positions, the tape feeders 5 that supply each type of component E, and the order in which the components E are to be mounted at each mounting position. In response to this, the arithmetic processing unit 110 causes the drive control unit 120 to execute control based on the board data D, thereby performing the above-mentioned component mounting according to the procedure indicated in the board data D.

[0023] Furthermore, a board recognition camera 8 is attached to the head unit 3 facing downward, and the board recognition camera 8 moves in the X and Y directions along with the head unit 3. This board recognition camera 8 is used to capture an image of a fiducial mark attached to the board B, and the image capture control unit 140 recognizes the position of the board B based on the image of the fiducial mark captured by the board recognition camera 8. The drive control unit 120 then controls the position of the mounting head 31 based on the position of the board B, thereby enabling the component E to be mounted accurately at the mounting position on the board B. Furthermore, as will be described later, the board recognition camera 8 is also used to capture an image of the component storage tape 6 attached to the tape feeder 5.

[0024] 3 is a side view showing a schematic configuration of the tape feeder. In the figure, the feed direction Df (parallel to the Y direction) in which the tape feeder 5 feeds the component storage tape 6 is shown, and the side indicated by the arrow in the feed direction Df is treated as the "front" of the feed direction Df, and the side opposite the arrow in the feed direction Df is treated as the "rear" of the feed direction Df.

[0025] The tape feeder 5 includes a mechanically configured feeder main body 51, feeder motors Mf and Mb that drive the component storage tape 6, and a feeder control unit 50 that controls the feeder motors Mf and Mb in response to commands received from a feeder communication unit 150. The feeder main body 51 includes a flat case 52 that is thin in the X direction and long in the feed direction Df. The case 52 houses the feeder control unit 50. A tape insertion opening 53a extending in the Z direction opens at the rear end of the case 52 in the feed direction Df, and a component supply position Ls is provided on the top surface of the front end portion of the case 52 in the feed direction Df. A tape transport path 53b extending from the tape insertion opening 53a to the component supply position Ls is provided within the feeder main body 51. The feeder main body 51 feeds the component storage tape 6 inserted into the tape transport path 53b from the tape insertion port 53a in the feed direction Df by the driving force of the feeder motors Mf and Mb, thereby supplying the components to the component supply position Ls.

[0026] The feeder main body 51 has, in its case 52, a sprocket 54 disposed below the tape transport path 53b and adjacent to the tape insertion opening 53a, and a gear 55 that transmits the driving force of the feeder motor Mb to the sprocket 54. The sprocket 54 rotates due to the driving force generated by the feeder motor Mb. Therefore, by rotating in the forward direction (forward rotation), the feeder motor Mb can transport the component storage tape 6 engaged with the sprocket 54 in the feed direction Df.

[0027] The feeder main body 51 also includes, in its case 52, two sprockets 57d, 57u located at its front end and adjacent to the tape transport path 53b from below, and two gears 58d, 58u that transmit the driving force of the feeder motor Mf to the sprockets 57d, 57u, respectively. The sprockets 57d, 57u are rotated by the driving force generated by the feeder motor Mf. Therefore, by rotating in the forward direction (forward rotation), the feeder motor Mf can transport the component storage tape 6 engaged with the sprockets 57d, 57u in the feed direction Df.

[0028] In this configuration, the component storage tape 6 inserted into the tape feed path 53b from the tape insertion opening 53a engages with the sprockets 54, 57u, and 57d, thereby attaching the component storage tape 6 to the tape feeder 5. The feeder control unit 50 then controls the rotation of the sprockets 54, 57u, and 57d by the feeder motors Mf and Mb, thereby intermittently feeding the component storage tape 6 in the feed direction Df. This allows the multiple components E stored on the component storage tape 6 to be supplied in order to the component supply position Ls.

[0029] The tape feeder 5 also has a cutter 59 that opens the component storage tape 6 at an opening position Le near the upstream side of the component supply position Ls in the feed direction Df. The cutter 59 comes into contact with the component storage tape 6 at the opening position Le and cuts and opens the component storage tape 6 that passes through the opening position Le in the feed direction Df, thereby exposing the components E at the component supply position Ls. Note that the method for exposing the components E is not limited to this example, and the component E may also be exposed by peeling off the cover tape of the component storage tape 6.

[0030] FIG. 4A is a plan view schematically illustrating the configuration of the component storage tape, and FIG. 4B is a cross-sectional view schematically illustrating the configuration of the component storage tape. FIG. 4B also illustrates a board recognition camera 8 that captures images of the component storage tape 6. As shown in these figures, the component storage tape 6 has a plurality of pockets 61 arranged at a predetermined pitch in the feed direction Df, and components E are stored in each pocket 61. The component storage tape 6 also has a plurality of engagement holes 62 arranged in the feed direction Df. The sprockets 54, 57d, and 57u of the tape feeder 5 rotate while engaging with the engagement holes 62, thereby transporting the component storage tape 6 in the feed direction Df. As shown in FIG. 4B, the board recognition camera 8 has an illumination unit 81 that irradiates the component storage tape 6 with light, and an imaging unit 83 that captures images of the component storage tape 6 while facing the component storage tape 6 from above. The illumination unit 81 has a plurality of point light sources arranged in a circular ring shape centered on the optical axis of the imaging unit 83, which is parallel to the Z direction, and each light source emits light downward. For example, an LED (Light Emitting Diode) can be used as the point light source. The imaging unit 83 has a lens 831 and a solid-state imaging element 832. The lens 831 has an optical axis parallel to the Z direction and faces the component storage tape 6 from above, forming an image of light reflected by the component storage tape 6 on the solid-state imaging element 832. The solid-state imaging element 832 then captures the light imaged by the lens 831 to obtain a tape image It showing the component storage tape 6.

[0031] The tape image It captured by the solid-state image sensor 832 of the board recognition camera 8 is transmitted to the imaging control unit 140, which then recognizes the position of the component storage tape 6 in the feed direction Df based on the tape image It. Specifically, the imaging control unit 140 detects the edges of the engagement holes 62 from the tape image It by template matching using a template that indicates the shape of the engagement holes 62, and recognizes the position of the component storage tape 6 from the positions of the edges. This allows the position of the mounting head 31 to be adjusted based on the position of the component storage tape 6 when picking up the components E supplied to the component supply position Ls, so that the mounting head 31 can reliably pick up the components E.

[0032] In template matching, a portion of an edge image obtained by binarizing the tape image It, whose similarity to the template is equal to or greater than a predetermined threshold, is detected as the edge of the engagement hole 62. The similarity can be calculated by appropriately using a known technique for calculating the similarity of images.

[0033] In this way, the imaging control unit 140 performs a recognition process in which the board recognition camera 8 captures an image of the component storage tape 6, acquires a tape image It, and acquires information about the position of the component storage tape 6 (the positions of the engagement holes 62) from the tape image It. At this time, the imaging control unit 140 performs the recognition process based on the recognition condition C stored in the storage unit 130. This recognition condition C indicates a combination of the brightness of the light irradiated from the lighting unit 81 onto the component storage tape 6 and a threshold value for detecting the edges of the engagement holes 62 from the tape image It by template matching. In other words, the imaging control unit 140 detects the edges of the engagement holes 62 from the tape image It captured while the lighting unit 81 irradiates the component storage tape 6 with light having a brightness indicated by the recognition condition C, based on the threshold value indicated by the recognition condition C.

[0034] The component mounter 1 uses a plurality of different types of component storage tapes 6. Here, a case will be described in which a component storage tape 6 called "paper tape" and a component storage tape 6 called "embossed tape" are used. Paper tape is made of paper and is white, while embossed tape is made of resin and is black. Thus, paper tape and embossed tape differ from each other in material and color. To accurately perform the recognition process while dealing with these different types of component storage tapes 6, recognition conditions C corresponding to the types of component storage tapes 6 are prepared in the storage unit 130. Furthermore, the recognition conditions C are prepared in the storage unit 130 so that the recognition process can be performed while changing the recognition condition C even for component storage tapes 6 of the same type.

[0035] 5 is a table showing the recognition conditions stored in the storage unit 130. As shown in the figure, high-precision recognition conditions for paper Cph and robust recognition conditions for paper Cpr are provided for the paper tape 6p, and high-precision recognition conditions for embossing Ceh and robust recognition conditions for embossing Cer are provided for the embossed tape 6e.

[0036] The high-precision recognition condition for paper Cph is created, for example, as follows: The imaging control unit 140 detects the position of the engagement hole 62 by executing a recognition process on the paper tape 6p loaded in the tape feeder 5 while changing the recognition condition C (a combination of illumination brightness and a threshold value). This results in obtaining multiple detection positions that respectively indicate the positions of the engagement hole 62 detected under different recognition conditions C. Then, of these detection positions, the recognition condition C used to obtain the detection position closest to the actual position of the engagement hole 62 is set as the high-precision recognition condition for paper Cph.

[0037] The robust recognition conditions for paper Cpr are created by changing at least one of the brightness of the illumination and the threshold value indicated by the high-precision recognition conditions for paper Cph. When changing the brightness of the illumination, the brightness of the illumination indicated by the robust recognition conditions for paper Cpr is set to be brighter than the brightness of the illumination indicated by the high-precision recognition conditions for paper Cph. When changing the threshold value, the threshold value indicated by the robust recognition conditions for paper Cpr is set to be lower than the threshold value indicated by the high-precision recognition conditions for paper Cph.

[0038] According to the high-precision paper recognition conditions Cph, the position of the engagement hole 62 in the paper tape 6p can be detected with high accuracy, but there is a high possibility that the detection of the position of the engagement hole 62 will fail due to the influence of disturbances. In contrast, according to the robust paper recognition conditions Cpr, there is a high possibility that the position of the engagement hole 62 in the paper tape 6p will be successfully detected regardless of the influence of disturbances, but there is a risk that the detection accuracy of the position of the engagement hole 62 will be low. Here, failure to detect the position of the engagement hole 62 means that the edge of the engagement hole 62 cannot be detected from the tape image It.

[0039] Furthermore, the high-precision recognition condition for embossing Ceh can be created by performing the same operations as those for the paper tape 6p described above on the embossed tape 6e loaded on the tape feeder 5. Furthermore, the robust recognition condition for embossing Cer can be created by changing at least one of the illumination brightness and threshold value indicated by the high-precision recognition condition for embossing Ceh in the same manner as described above. According to the high-precision recognition condition for embossing Ceh, the position of the engagement hole 62 of the embossed tape 6e can be detected with high precision, but there is a high possibility that detection of the position of the engagement hole 62 will fail due to the influence of disturbances. In contrast, according to the robust recognition condition for embossing Cer, there is a high possibility that detection of the position of the engagement hole 62 of the embossed tape 6e will be successful regardless of the influence of disturbances, but there is a risk that detection accuracy of the position of the engagement hole 62 will be low.

[0040] The component mounter 1 recognizes the position of the component storage tape 6 by performing a recognition process on the component storage tape 6 attached to the tape feeder 5 using these recognition conditions C (FIG. 6). FIG. 6 is a flowchart showing an example of tape position recognition performed by the component mounter. This tape position recognition is performed under the control of the arithmetic processing unit 110. Note that the tape position recognition in FIG. 6 can be performed commonly for each tape feeder 5 of the component mounter 1. However, here, an example will be described in which tape position recognition is performed for one target tape feeder 5 (i.e., the tape feeder 5 that the mounting head 31 faces from above to pick up components).

[0041] In step S101, the type of component storage tape 6 attached to the target tape feeder 5 is determined. In this example, the type of component storage tape 6 is determined by referring to the board data D. That is, the type of component storage tape 6 (paper / embossed) to be attached to each tape feeder 5 can be set for the board data D. Setting of the type of component storage tape 6 for the board data D can be executed by the calculation processing unit 110, for example, based on an input operation by an operator to the user interface 160.

[0042] If the type of component storage tape 6 attached to the tape feeder 5 is not set in the board data D ("NO" in step S102), steps S103 to S107 are executed. In step S103, a recognition process is executed using the robust recognition conditions Cpr for paper, and in step S104, the success or failure of the recognition process is confirmed. If the recognition process using the robust recognition conditions Cpr for paper is successful ("YES" in step S104), the tape position recognition in FIG. 6 is completed. Then, the position at which the mounting head 31 picks up the component E is controlled based on the position of the engagement hole 62 recognized in step S103.

[0043] If the recognition process using the robust recognition conditions for paper Cpr fails ("NO" in step S104), the recognition process using the robust recognition conditions for embossing Cer is executed (step S105), and the success or failure of the recognition process is confirmed (step S106). If the recognition process using the robust recognition conditions for embossing Cer is successful ("YES" in step S106), the tape position recognition in FIG. 6 ends. Then, the position at which the mounting head 31 picks up the component E is controlled based on the position of the engagement hole 62 recognized in step S105. Note that the order of execution of steps S103 to S106 is not limited to this example, and steps S103 and S104 may be executed after steps S105 and S106.

[0044] On the other hand, if the recognition process using the robust recognition condition Cer for embossing fails ("NO" in step S106), an error notification is issued in step S107, and then the tape position recognition in Fig. 6 ends. In this error notification, a message that recognition of the position of the component storage tape 6 has failed is displayed on the display of the user interface 160.

[0045] If the type of component storage tape 6 attached to the tape feeder 5 is set in the board data D ("YES" in step S102) and the type is paper ("PAPER" in step S108), steps S109 to S113 are executed. In step S109, a recognition process is executed using the high-precision recognition conditions for paper Cph, and in step S110, the success or failure of the recognition process is confirmed. If the recognition process using the high-precision recognition conditions for paper Cph is successful ("YES" in step S110), the tape position recognition in FIG. 6 is completed. Then, the position at which the mounting head 31 picks up the component E is controlled based on the position of the engagement hole 62 recognized in step S109.

[0046] If the recognition process using the high-precision recognition conditions for paper Cph fails ("NO" in step S110), the recognition process using the robust recognition conditions for paper Cpr is executed (step S111), and the success or failure of the recognition process is confirmed (step S112). If the recognition process using the robust recognition conditions for paper Cpr is successful ("YES" in step S112), the tape position recognition in FIG. 6 ends. Then, the position at which the mounting head 31 picks up the component E is controlled based on the position of the engagement hole 62 recognized in step S111. On the other hand, if the recognition process using the robust recognition conditions for paper Cpr fails ("NO" in step S112), an error notification is issued in the same manner as above (step S113), and then the tape position recognition in FIG. 6 ends.

[0047] If the type of component storage tape 6 attached to the tape feeder 5 is set in the board data D ("YES" in step S102) and the type is embossed ("embossed" in step S108), steps S114 to S118 are executed. In step S114, a recognition process is executed using the high-precision recognition conditions Ceh for embossing, and in step S115, the success or failure of the recognition process is confirmed. If the recognition process using the high-precision recognition conditions Ceh for embossing is successful ("YES" in step S115), the tape position recognition in FIG. 6 is completed. Then, the position at which the mounting head 31 picks up the component E is controlled based on the position of the engagement hole 62 recognized in step S114.

[0048] If the recognition process using the embossing high-precision recognition conditions Ceh fails (step S115: NO), recognition process using the embossing robust recognition conditions Cer is executed (step S116), and the success or failure of the recognition process is confirmed (step S117). If the recognition process using the embossing robust recognition conditions Cer is successful (step S117: YES), the tape position recognition in FIG. 6 ends. Then, the position at which the mounting head 31 picks up the component E is controlled based on the position of the engagement hole 62 recognized in step S116. On the other hand, if the recognition process using the embossing robust recognition conditions Cer fails (step S117: NO), an error notification is issued in the same manner as above (step S118), and then the tape position recognition in FIG. 6 ends.

[0049] In the embodiment described above, the arithmetic processing unit 110 determines the type of component storage tape 6 attached to the tape feeder 5 (step S101). Then, the recognition process is executed using the recognition condition C corresponding to the type of component storage tape 6 determined by the arithmetic processing unit 110 (tape type determination unit) from among the multiple recognition conditions C (steps S109, S111, S114, S116). Therefore, it is possible to recognize the position of the component storage tape 6 under an appropriate recognition condition according to the type of the component storage tape 6.

[0050] Furthermore, the arithmetic processing unit 110 determines the type of component storage tape 6 attached to the tape feeder 5 based on the board data D that indicates information about the components E supplied to the component supply position Ls by the tape feeder 5 (step S101). Specifically, the type of component storage tape 6 attached to the tape feeder 5 so that the tape feeder 5 can supply the components E is set in the board data D, and the arithmetic processing unit 110 checks the type of component storage tape 6 set in the board data D. With this configuration, the type of component storage tape 6 can be accurately determined based on the board data D. As a result, the position of the component storage tape 6 can be recognized under appropriate recognition conditions C according to the type of component storage tape 6.

[0051] The storage unit 130 also stores, as the recognition conditions C (recognition conditions corresponding to the same type of component storage tape) corresponding to the paper tape 6p, different high-precision paper recognition conditions Cph (first priority recognition conditions) and robust paper recognition conditions Cpr (second priority recognition conditions). When the calculation processing unit 110 determines that the type of component storage tape 6 attached to the tape feeder 5 is the paper tape 6p, the imaging control unit 140 (recognition control unit) executes the recognition process using the high-precision paper recognition conditions Cph (step S109). If the recognition process using the high-precision paper recognition conditions Cph fails, the imaging control unit 140 executes the recognition process using the robust paper recognition conditions Cpr (step S111). That is, different high-precision paper recognition conditions Cph and robust paper recognition conditions Cpr are provided for the paper tape 6p (the same type of component storage tape), and if the recognition process using the high-precision paper recognition conditions Cph fails, the recognition process is executed using the robust paper recognition conditions Cpr. Therefore, even if the recognition process fails to be executed under the high-precision paper recognition conditions Cph due to, for example, the influence of external disturbances, the recognition process will not immediately end in failure, but rather the recognition process can be successfully executed by using the robust paper recognition conditions Cpr.

[0052] The storage unit 130 also stores, as the recognition conditions C (recognition conditions corresponding to the same type of component storage tape) corresponding to the embossed tape 6e, mutually different high-precision recognition conditions for embossing Ceh (first priority recognition conditions) and robust recognition conditions for embossing Cer (second priority recognition conditions). When the calculation processing unit 110 determines that the type of component storage tape 6 loaded in the tape feeder 5 is the embossed tape 6e, the imaging control unit 140 (recognition control unit) executes the recognition process using the high-precision recognition conditions for embossing Ceh (step S114). If the recognition process using the high-precision recognition conditions for embossing Ceh fails, the imaging control unit 140 executes the recognition process using the robust recognition conditions for embossing Cer (step S116). In other words, the mutually different high-precision recognition conditions for embossing Ceh and robust recognition conditions for embossing Cer are provided for the embossed tape 6e (the same type of component storage tape), and if the recognition process using the high-precision recognition conditions for embossing Ceh fails, the recognition process is executed using the robust recognition conditions for embossing Cer. Therefore, even if the recognition process fails to be executed under the high-precision embossing recognition conditions Ceh due to the influence of external disturbances, the recognition process will not immediately end in failure, but rather the recognition process can be successfully executed by using the robust embossing recognition conditions Cer.

[0053] As described above, in this embodiment, the component mounter 1 corresponds to an example of a "component mounter" of the present invention, the arithmetic processing unit 110 corresponds to an example of a "tape type determination unit" of the present invention, the memory unit 130 corresponds to an example of a "memory unit" of the present invention, the imaging control unit 140 corresponds to an example of a "recognition control unit" of the present invention, the component storage tape 6 corresponds to an example of a "component storage tape" of the present invention, the pocket 61 corresponds to an example of a "pocket" of the present invention, the tape feeder 5 corresponds to an example of a "tape feeder" of the present invention, the board recognition camera 8 corresponds to an example of an "imaging unit" of the present invention, and the recognition Condition C corresponds to an example of the "recognition condition" of the present invention, high-precision recognition condition for paper Cph corresponds to an example of the "first priority recognition condition" of the present invention, robust recognition condition for paper Cpr corresponds to an example of the "second priority recognition condition" of the present invention, high-precision recognition condition for embossing Ceh corresponds to an example of the "first priority recognition condition" of the present invention, robust recognition condition for embossing Cer corresponds to an example of the "second priority recognition condition" of the present invention, board data D corresponds to an example of the "board data" of the present invention, component E corresponds to an example of the "component" of the present invention, and tape image It corresponds to an example of the "image" of the present invention, The component supply position Ls corresponds to an example of the "component supply position" of the present invention.

[0054] The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described embodiment without departing from the spirit of the present invention. For example, the specific method for determining the type of component storage tape 6 attached to the tape feeder 5 in the tape type determination in step S101 of Fig. 6 is not limited to the above example, and can be modified as appropriate. Therefore, the tape type determination may be performed using the method shown in Fig. 7.

[0055] 7 is a flowchart showing a modified example of the tape type determination. This tape type determination is performed under the control of the calculation processing unit 110. In step S201, a recognition process is performed using the high-precision recognition conditions for paper Cph, and in step S202, the success or failure result of the recognition process in step S201 is stored in the storage unit 130. In step S203, a recognition process is performed using the high-precision recognition conditions for embossing Ceh, and in step S204, the success or failure result of the recognition process in step S203 is stored in the storage unit 130. Note that the order of performing steps S201 to S204 is not limited to this example, and steps S201 and S202 may be performed after steps S203 and S204.

[0056] Steps S201 to S204 are then repeated until they are executed a predetermined number of times (two or more times, for example, 10 times) ("YES" in step S205). In this way, the success / failure results of the recognition process executed a predetermined number of times under the high-precision recognition conditions for paper Cph and the success / failure results of the recognition process executed a predetermined number of times under the high-precision recognition conditions for emboss Ceh are obtained.

[0057] In step S206, the type of component storage tape 6 attached to the tape feeder 5 is determined based on these success / failure results. For example, the number of times the recognition process was successful under the high-precision recognition conditions for paper Cph (the number of successes for paper) is compared with the number of times the recognition process was successful under the high-precision recognition conditions for embossing Ceh (the number of successes for embossing). If the number of successes for paper is greater than the number of successes for embossing, the type of component storage tape 6 attached to the tape feeder 5 is determined to be paper tape 6p, and if the number of successes for embossing is greater than the number of successes for paper, the type of component storage tape 6 attached to the tape feeder 5 is determined to be embossed tape 6e.

[0058] If the component storage tape 6 is determined to be the paper tape 6p, steps S109 to S113 are executed in the tape position recognition of Fig. 6. On the other hand, if the component storage tape 6 is determined to be the embossed tape 6e, steps S114 to S118 are executed in the tape position recognition of Fig. 6.

[0059] In this modification, the imaging control unit 140 (recognition control unit) executes the recognition process multiple times while changing the recognition condition C among the high-precision recognition condition for paper Cph and the high-precision recognition condition for embossing Ceh (multiple recognition conditions) (steps S201 to S205). Then, the calculation processing unit 110 determines the type of component storage tape 6 attached to the tape feeder 5 based on the relationship between the result of the recognition process and the recognition condition C used in the recognition process (step S206). With this configuration, the type of component storage tape 6 can be accurately determined based on the result of executing the recognition process while changing the recognition condition C. As a result, the position of the component storage tape 6 can be recognized under the appropriate recognition condition C according to the type of component storage tape 6.

[0060] Furthermore, it is also possible to change the specific configuration of the recognition condition C. Specifically, the recognition condition C may be configured to include only one of the brightness of the illumination emitted by the illumination unit 81 and the threshold value used in pattern matching, but not the other.

[0061] Also, it is not necessary to prepare all of the recognition conditions C shown in Fig. 5. Therefore, only the high-precision recognition conditions for paper Cph and the high-precision recognition conditions for embossing Ceh may be stored in the storage unit 130. In this case, the tape position recognition in Fig. 6 can be changed as follows.

[0062] If the type setting of the component storage tape 6 cannot be confirmed in step S102 (if "NO"), step S107 is executed (i.e., steps S103 to S106 are deleted). Also, steps S111 and S112 are deleted, and if "NO" is returned in step S110, step S113 is executed. Furthermore, steps S116 and S117 are deleted, and if "NO" is returned in step S115, step S118 is executed.

[0063] Furthermore, the object to be detected to recognize the position of the component storage tape 6 is not limited to the engagement holes 62 of the component storage tape 6, but may also be the pockets 61.

[0064] Furthermore, the variations in the type of component storage tape 6 are not limited to paper and embossed, but may include other types. [Explanation of symbols]

[0065] 1...Component mounting machine 110...Calculation processing unit (tape type determination unit) 130...Storage section 140...imaging control unit (recognition control unit) 6...Parts storage tape 61...Pocket 5...Tape feeder 8...Board recognition camera (imaging unit) C…Recognition condition Cph…High precision recognition condition for paper (first priority recognition condition) Cpr: Robust recognition condition for paper (second priority recognition condition) Ceh...High-precision recognition conditions for embossing (first priority recognition conditions) Cer: Robust recognition condition for embossing (second priority recognition condition) D...Board data E...Parts It... Tape image (image) Ls…Parts supply position

Claims

1. a tape feeder that feeds a component storage tape having pockets for storing components to a predetermined component supply position; an imaging unit that images the component storage tape attached to the tape feeder; a storage unit that stores a plurality of recognition conditions corresponding to different types of component storage tapes; a tape type discrimination unit that discriminates the type of the component storage tape attached to the tape feeder; a recognition control unit that executes a recognition process in which the imaging unit captures an image of the component storage tape and acquires information about the position of the component storage tape from the image; Equipped with the recognition control unit executes the recognition process by using a recognition condition corresponding to the type of the component storage tape determined by the tape type determination unit, among the plurality of recognition conditions; the storage unit stores a first priority recognition condition and a second priority recognition condition that are different from each other as the recognition conditions corresponding to the component storage tape of the same type; the recognition control unit executes the recognition process under the first priority recognition condition corresponding to the type of component storage tape determined by the tape type determination unit, and if the recognition process under the first priority recognition condition fails, executes the recognition process under the second priority recognition condition corresponding to the type of component storage tape determined by the tape type determination unit.

2. 2. The component mounter according to claim 1, wherein the tape type determination unit determines the type of the component storage tape attached to the tape feeder based on board data indicating information about the components supplied to the component supply position by the tape feeder.

3. the recognition control unit executes the recognition process a plurality of times while changing the recognition condition among the plurality of recognition conditions; 2. The component mounter according to claim 1, wherein the tape type determination unit determines the type of the component storage tape attached to the tape feeder based on the relationship between the result of the recognition process and the recognition conditions used in the recognition process.

4. A tape feeder that feeds components to a predetermined component supply position by conveying a component storage tape having pockets for storing the components; an imaging unit that images the component storage tape attached to the tape feeder; a storage unit that stores a plurality of recognition conditions corresponding to different types of component storage tapes; a tape type discrimination unit that discriminates the type of the component storage tape attached to the tape feeder; a recognition control unit that executes a recognition process in which the imaging unit captures an image of the component storage tape and acquires information about the position of the component storage tape from the image; Equipped with the recognition control unit executes the recognition process by using a recognition condition corresponding to the type of the component storage tape determined by the tape type determination unit, among the plurality of recognition conditions; The tape type discrimination unit is a component mounter that discriminates the type of component storage tape attached to the tape feeder based on board data that indicates information about the components supplied to the component supply position by the tape feeder.

5. a step of determining, by a tape type determination unit, the type of component storage tape attached to a tape feeder that feeds components to a predetermined component supply position by conveying the component storage tape having pockets for storing the components; a step of executing a recognition process by a recognition control unit to capture an image of the component storage tape and acquire information about the position of the component storage tape from the image; Equipped with performing the recognition process using a recognition condition corresponding to the determined type of the component storage tape from among a plurality of recognition conditions stored in a storage unit, the recognition conditions corresponding to different types of the component storage tape; the storage unit stores a first priority recognition condition and a second priority recognition condition that are different from each other as the recognition conditions corresponding to the component storage tape of the same type; the recognition control unit executes the recognition process under the first priority recognition condition corresponding to the type of component storage tape determined by the tape type determination unit, and if the recognition process under the first priority recognition condition fails, executes the recognition process under the second priority recognition condition corresponding to the type of component storage tape determined by the tape type determination unit.

Images