Resin sealing metal type

Abstract

To provide a resin seal mold capable of suppressing manufacturing cost of a resin seal molding.SOLUTION: A resin seal mold resin seals a molding product including a heat sink positioned in a cavity formed between a first mold and a second mold. The first mold has a first cavity block with a cavity surface forming the cavity. A space between the heat sink and the cavity surface becomes narrower during resin sealing of the molding product.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The disclosed embodiments relate to a resin-sealed mold. [Background technology]

[0002] Conventionally, there is known a technique for exposing electrodes, heat sinks, etc. by scraping a resin-sealed molded product obtained by resin-sealing a molded product. For example, Patent Document 1 discloses a technique for exposing electrodes by scraping the resin formed on the surface of a semiconductor wafer after the semiconductor wafer, which is a molded product, is resin-sealed with a resin-sealing mold. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-045906 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in a resin-sealed molded product manufactured using the resin-sealed mold described in Patent Document 1, the resin that is removed when exposing the electrodes is thick. Therefore, when the resin-sealed mold described in Patent Document 1 is applied to the manufacture of a resin-sealed molded product in which the exposed target is a heat sink, there is a problem in that the processing cost of the resin-sealed molded product becomes high.

[0005] One aspect of the embodiment has been made in view of the above, and aims to provide a resin-sealing mold that can reduce the manufacturing costs of resin-sealed molded products. [Means for solving the problem]

[0006] A resin-sealing mold according to one aspect of the present invention is a resin-sealing mold for resin-sealing a molded product including a heat sink disposed in a cavity formed between a first mold and a second mold, wherein the first mold has a first cavity block having a cavity surface that forms the cavity, and the distance between the heat sink and the cavity surface narrows during resin-sealing of the molded product. [Effects of the Invention]

[0007] According to one aspect of the embodiment, it is possible to provide a resin sealing mold that can reduce the manufacturing cost of a resin-sealed molded product. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a partial cross-sectional view showing an example of a resin-sealed mold according to the first embodiment. [Figure 2] FIG. 2 is a diagram for explaining the function of the resin sealing mold according to the first embodiment. [Figure 3] FIG. 3 is a diagram showing an example of a process for scraping off the resin of the resin-sealed molded product molded by the resin-sealing mold according to the first embodiment. [Figure 4] FIG. 4 is a diagram showing an example of a manufacturing process of a resin-sealed molded product using a resin-sealed mold without a cavity block, and an example of the resin-sealed molded product. [Figure 5] FIG. 5 is a perspective view showing an example of a resin sealing apparatus according to the first embodiment. [Figure 6] FIG. 6 is a diagram (part 1) for explaining the resin sealing process by the resin sealing apparatus according to the first embodiment. [Figure 7] FIG. 7 is a diagram (part 2) for explaining the resin sealing process by the resin sealing apparatus according to the first embodiment. [Figure 8] FIG. 8 is a diagram (part 3) for explaining the resin sealing process by the resin sealing apparatus according to the first embodiment. [Figure 9] FIG. 9 is a diagram (part 4) for explaining the resin sealing process by the resin sealing apparatus according to the first embodiment. [Figure 10] FIG. 10 is a diagram (part 5) for explaining the resin sealing process by the resin sealing apparatus according to the first embodiment. [Figure 11] FIG. 11 is a diagram (part 6) for explaining the resin sealing process by the resin sealing apparatus according to the first embodiment. [Figure 12] FIG. 12 is a partially enlarged view showing an example of the resin-sealing mold according to the first embodiment. [Figure 13] FIG. 13 is a partially enlarged view showing another example of the resin-sealing mold according to the first embodiment. [Figure 14] FIG. 14 is a partial cross-sectional view showing an example of a resin-sealing mold according to the second embodiment. [Figure 15] FIG. 15 is a diagram for explaining the function of the resin sealing mold according to the second embodiment. [Figure 16] FIG. 16 is a perspective view showing an example of a resin sealing apparatus according to the second embodiment. [Figure 17] FIG. 17 is a diagram (part 1) for explaining the resin sealing step performed by the resin sealing apparatus according to the second embodiment. [Figure 18] FIG. 18 is a diagram (part 2) for explaining the resin sealing step by the resin sealing apparatus according to the second embodiment. [Figure 19] FIG. 19 is a diagram (part 3) for explaining the resin sealing process by the resin sealing apparatus according to the second embodiment. [Figure 20] FIG. 20 is a diagram (part 4) for explaining the resin sealing process by the resin sealing apparatus according to the second embodiment. [Figure 21] FIG. 21 is a diagram (part 5) for explaining the resin sealing process by the resin sealing apparatus according to the second embodiment. [Figure 22] FIG. 22 is a diagram (part 6) for explaining the resin sealing step by the resin sealing apparatus according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the resin-sealed mold disclosed in the present application will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments.

[0010] <1. First embodiment> <1.1. Structure of resin sealing mold> 1, the resin-sealing mold 1 according to the first embodiment includes an upper mold 2 and a lower mold 3. The upper mold 2 is an example of a first mold, and the lower mold 3 is an example of a second mold.

[0011] The upper mold 2 and the lower mold 3 have cavity surfaces that form a cavity 70, and when the upper mold 2 and the lower mold 3 are in a clamped state in which they abut against each other as shown in Fig. 1, the cavity 70 is formed by the upper mold 2 and the lower mold 3. A molded article 80 is placed in the cavity 70, and the molded article 80 is sealed in the cavity 70 with resin.

[0012] 1 includes leads 81, bonding wires 82, an IC (Integrated Circuit) chip 83, heat sinks 84 and 85, and a spacer 86. The leads 81 and the heat sinks 84 and 85 are made of metal such as copper. The spacer 86 is made of metal or ceramic. The workpiece 80 is, for example, a power IC, but is not limited to the configuration shown in FIG. 1 as long as it is a workpiece having a heat sink.

[0013] The upper mold 2 includes an upper mold body 11 and an upper cavity block 12. The upper cavity block 12 is an example of a first cavity block. A through hole 11a is formed in the upper mold body 11, and the upper cavity block 12 is movably disposed within the through hole 11a.

[0014] The upper mold body 11 forms a part of the cavity top surface 71, which is the top surface of the cavity 70, and parts of the cavity side surfaces 73 and 74, which are the side surfaces of the cavity 70, and the upper cavity block 12 forms the remaining part of the cavity top surface 71. The lower mold 3 forms the cavity bottom surface 72, which is the bottom surface of the cavity 70, and the remaining parts of the cavity side surfaces 73 and 74.

[0015] In the resin sealing mold 1, when the upper mold 2 and the lower mold 3 are in a clamped state as shown in Fig. 2(a), resin 60 is sent into the cavity 70. Then, in the resin sealing mold 1, the resin 60 is filled between the cavity surface 12a of the upper cavity block 12 of the upper mold 2 and the heat sink 85 of the molded product 80 as shown in Fig. 2(b).

[0016] Thereafter, in the resin sealing mold 1, the lower mold 3 and the upper mold body 11 move upward in Fig. 2(b) while the position of the upper cavity block 12 in the upper mold 2 is fixed, thereby narrowing the gap between the cavity surface 12a of the upper cavity block 12 and the heat sink 85 of the molded product 80, as shown in Fig. 2(c). Therefore, as shown in Fig. 3(a), in the resin-sealed molded product 90 formed by resin-sealing the molded product 80 with the resin sealing mold 1, the thickness of the resin 60 on the heat sink 85 can be made thinner.

[0017] Here, a case will be described in which the upper mold does not include the upper cavity block 12 shown in Fig. 1. When the upper cavity block 12 shown in Fig. 2 is not provided, as in the upper mold 2A shown in Fig. 4(a), if the gap between the cavity top surface 71 formed by the upper mold 2A and the heat sink 85 of the molded product 80 is narrow, it may not be possible to fill the gap between the cavity top surface 71 and the heat sink 85.

[0018] Therefore, as shown in Figure 4(a), the distance between the cavity top surface 71 and the heat sink 85 needs to be larger than in the state shown in Figure 2(c), and as shown in Figure 4(b), the thickness of the resin 60 on the heat sink 85 of the resin-sealed molded product 90 is thicker than in Figure 3(a).

[0019] 1, the resin 60 is filled between the cavity top surface 71 and the heat sink 85 in a state where the resin 60 can be filled accurately between the cavity top surface 71 and the heat sink 85. Then, in the resin sealing mold 1, the lower mold 3 and the upper mold body 11 are moved to narrow the gap between the cavity surface 12a of the upper cavity block 12 that constitutes the cavity top surface 71 and the heat sink 85, thereby reducing the thickness of the resin 60 on the heat sink 85.

[0020] This allows the thickness of the resin 60 to be removed from the resin 60 of the resin-sealed molded product 90 to be reduced in the resin-sealed mold 1. Therefore, as shown in Fig. 3(b), in the operation of exposing the heat sink 85 of the resin-sealed molded product 90, i.e., in the operation of removing the resin 60 of the resin-sealed molded product 90, the time required to remove the resin 60 can be shortened, and the deterioration rate of the material from which the resin 60 is removed can also be slowed. Note that, if the entire heat sink 84 is not exposed in the resin-sealed molded product 90, a step of removing the resin 60 to expose the entire heat sink 84 is also performed.

[0021] The method for narrowing the gap between the cavity surface 12a and the heat sink 85 is not limited to the above example. For example, the resin sealing mold 1 may be configured so that the gap between the cavity surface 12a and the heat sink 85 is narrowed by moving the upper cavity block 12 downward in Fig. 2(b) instead of moving the lower mold 3 and the upper mold body 11 upward in Fig. 2(b).

[0022] <1.2. Structure of the resin sealing equipment> As shown in FIG. 5, the resin sealing apparatus 100 according to the first embodiment includes a resin sealing mold 1, a plurality of dies 4, a fixed platen 5, a movable platen 6, and a transfer unit .

[0023] The multiple diving bars 4 are parallel to one another and extend in the vertical direction, and are supported on a base (not shown). A fixed platen 5 is fixed to the upper end of each diving bar 4, and a movable platen 6 is attached to the lower end of each diving bar 4 so as to be movable in the vertical direction.

[0024] The resin sealing mold 1 comprises an upper mold 2 and a lower mold 3. The upper mold 2 has an upper mold body 11 movably attached to a fixed platen 5, and the lower mold 3 is attached to a movable platen 6. The movable platen 6 is driven by a drive mechanism (not shown) to move up and down. The upper mold 2 comprises an upper chess piece 10 having a cavity surface, and an upper die set 20 that supports the upper chess piece 10. The lower mold 3 comprises a lower chess piece 30 having a cavity surface, and a lower die set 40 that supports the lower chess piece 30.

[0025] In the resin sealing apparatus 100, the movable platen 6 moves upward, causing the lower mold 3 to come into contact with the upper mold 2, thereby clamping the upper mold 2 and the lower mold 3. In the example shown in Fig. 5, the resin sealing apparatus 100 is configured so that the lower mold 3 moves upward, but it may also be configured so that the upper mold 2 moves downward.

[0026] 5, six molded articles 80 can be simultaneously resin-sealed, but the present invention is not limited to this example, and the number of molded articles 80 that can be simultaneously resin-sealed may be five or less, or seven or more. Furthermore, in the resin sealing apparatus 100 shown in FIG. 5, six resin tablets 61 are used to resin-seal six molded articles 80, but the present invention is not limited to this example, and the number of resin tablets 61 may be five or less, or seven or more.

[0027] Next, the resin sealing process of the resin sealing apparatus 100 shown in Fig. 5 will be specifically described with reference to Fig. 6 to Fig. 11. In Fig. 6 to Fig. 11, two of the six molded articles 80 are shown, and one of the plurality of resin tablets 61 is shown. Note that in Fig. 5 to Fig. 11, the molded article 80 shown in Fig. 1 etc. is shown in a simplified form.

[0028] As shown in Fig. 6, a molding workpiece 80 and a resin tablet 61 are transported by a transport device (not shown) to a resin sealing mold 1 of a resin sealing apparatus 100. Then, as shown in Fig. 7, the molding workpiece 80 is placed on the lower die chest 30 of the lower die 3, and the resin tablet 61 is placed in a pot 77 formed in the lower die 3.

[0029] Next, as shown in FIG. 8, in the resin sealing device 100, the movable platen 6 (see FIG. 5) is moved upward by a drive mechanism not shown, causing the lower mold 3 to abut against the upper mold 2, thereby clamping the upper mold 2 and the lower mold 3 together.

[0030] As shown in Fig. 8, by clamping the upper mold 2 and the lower mold 3, a cull portion 75, a runner portion 76, and a cavity 70 are formed. The resin tablet 61 is melted by a heater (not shown). A plurality of cavities 70 are formed between the upper mold 2 and the lower mold 3 for each molded article 80. The upper mold 2 is provided with an upper cavity block 12 for each molded article 80.

[0031] 9, in the resin sealing apparatus 100, the plunger 8 provided in the transfer unit 7 (see FIG. 5) moves upward, and the molten resin tablet 61 is extruded as resin 60 into the cavity 70 via the cull portion 75 (see FIG. 8) and the runner portion 76 (see FIG. 8). As a result, the resin 60 fills the gap between the cavity top surface 71 and the heat sink 85 of the molded product 80 inside the cavity 70.

[0032] Next, in the resin sealing apparatus 100, a drive mechanism (not shown) moves the movable platen 6 (see FIG. 5) upward, whereby the movable platen 6 presses the lower mold 3 upward in FIG. 9, causing the lower mold 3 to move upward in FIG. 9. Therefore, in the resin sealing apparatus 100, as shown in FIG. 10, the lower mold 3 and the upper mold body 11 move upward in FIG. 10 while the position of the upper cavity block 12 in the upper mold 2 is fixed. This narrows the gap between the cavity surface 12a of the upper cavity block 12 and the heat sink 85 (see FIG. 8) of the molded product 80 (see FIG. 8). Therefore, as shown in FIG. 10, the thickness of the resin 60 on the heat sink 85 becomes thinner.

[0033] In this way, the resin sealing apparatus 100 moves the movable platen 6 upward to bring the heat sink 85 closer to the cavity surface 12a, thereby narrowing the gap between the cavity surface 12a and the heat sink 85. Therefore, the resin sealing apparatus 100 can narrow the gap between the cavity surface 12a and the heat sink 85 without providing a mechanism or drive unit that moves the upper cavity block 12 downward in FIG.

[0034] In addition, the resin sealing apparatus 100 may be configured to narrow the gap between the cavity surface 12a and the heat sink 85 by moving the upper cavity block 12 downward in FIG. 9 instead of moving the movable platen 6 upward from the state shown in FIG. 9.

[0035] Thereafter, as shown in FIG. 11, in the resin sealing apparatus 100, the movable platen 6 (see FIG. 5) moves downward, thereby separating the lower mold 3 from the upper mold 2, and the resin-sealed molded product 90 is removed from the resin-sealed mold 1 by a conveying device not shown.

[0036] In this way, the resin sealing apparatus 100 according to the first embodiment can reduce the thickness of the resin 60 to be removed from the resin 60 of the resin-sealed molded product 90. Therefore, in the operation of exposing the heat sink 85 of the resin-sealed molded product 90, the time required to remove the resin 60 can be shortened, and the deterioration rate of the member from which the resin 60 is removed can also be slowed down.

[0037] Furthermore, in the resin sealing apparatus 100, the through hole 11a has a diameter large enough to cover the entire heat sink 85, and is formed at a position facing the heat sink 85. Then, after the resin 60 is filled between the cavity surface 12a of the upper cavity block 12 arranged in the through hole 11a and the upper surface of the heat sink 85, the lower mold 3 and the upper mold body 11 or the upper cavity block 12 moves, thereby moving the upper cavity block 12 within the through hole 11a. Therefore, the resin sealing apparatus 100 can appropriately thin the thickness of the resin 60 on the heat sink 85 in the resin-sealed molded product 90.

[0038] The upper cavity block 12 is attached to a moving mechanism (not shown) driven by a driving source (not shown), and moves through the through hole 11 a by driving the moving mechanism (not shown). The driving source (not shown) is, for example, a servo motor controlled by a control unit (not shown), but is not limited to such an example.

[0039] 12, the through hole 11a has a diameter larger than the size of the upper surface of the heat sink 85 and smaller than the cavity top surface. The cavity top surface is formed by the upper surface of the upper mold body 11 and the cavity surface 12a of the upper cavity block 12. This allows the thickness of the resin 60 in the region of the upper surface of the resin-sealed molded product 90 other than the region corresponding to the through hole 11a to be thin, as shown in FIG.

[0040] This reduces the amount of resin 60 that is scraped off from the resin 60 of the resin-sealed molded product 90, shortening the time required to scrape off the resin 60 and slowing down the deterioration rate of the components from which the resin 60 is scraped off.

[0041] In the above example, the cavity surface 12a of the upper cavity block 12, which forms part of the top surface of the cavity 70, is flat, but the cavity surface 12a of the upper cavity block 12 is not limited to a flat surface. For example, as shown in Fig. 13, the cavity surface 12a may have a recess 12b formed by a depression large enough to cover the heat sink 85.

[0042] 13, the recess 12b of the upper cavity block 12 is formed in the cavity surface 12a facing the heat sink 85, and is large enough to cover the entire heat sink 85. After the resin 60 is filled between the recess 12b of the upper cavity block 12 and the upper surface of the heat sink 85, the lower mold 3 and the upper mold body 11 move upward in FIG. 13. As a result, the upper cavity block 12 moves within the through hole 11a, and the cavity surface 12a of the upper cavity block 12 approaches the heat sink 85.

[0043] Since the opening of the recess 12b has a smaller area than the opening of the through hole 11a, the resin sealing mold 1 shown in Fig. 13 can reduce the protruding area on the top surface of the resin sealed molded product 90 compared to the resin sealing mold 1 shown in Fig. 12. Therefore, with the resin sealing mold 1 shown in Fig. 13, the amount of resin 60 that is scraped off in the operation of exposing the heat sink 85 of the resin sealed molded product 90 can be further reduced.

[0044] In the resin sealing mold 1 shown in Figure 13, even if the molded product 80 has a different area of ​​the upper surface of the heat sink 85, the amount of resin 60 can be easily reduced by replacing it with an upper cavity block 12 having a recess 12b with an opening that corresponds to the area of ​​the upper surface of the heat sink 85, without replacing the entire upper mold 2.

[0045] In the above example, the upper cavity block 12 is provided in the upper mold 2, but the resin sealing mold 1 may be configured such that a through hole corresponding to the through hole 11a and a cavity block corresponding to the upper cavity block 12 that faces the heat sink 85 of the molded product 80 and moves through the through hole 11a are provided in the lower mold 3 instead of the upper mold 2. In this case, the cavity surface of the cavity block that corresponds to the cavity surface 12a of the upper cavity block 12 forms at least a part of the cavity bottom surface 72, and the molded product 80 is placed in the cavity 70 in a state that is upside down from the state shown in FIG.

[0046] In the above example, the cavity surface 12a of the upper cavity block 12 forms part of the cavity top surface 71 or part of the cavity bottom surface 72, but is not limited to such an example. For example, the cavity surface 12a of the upper cavity block 12 may be a cavity surface that forms the entire cavity top surface 71 or the entire cavity bottom surface 72.

[0047] Furthermore, in the resin sealing mold 1 described above, the thickness of the resin 60 on the heat sink 85 is reduced by narrowing the gap between the cavity surface 12a of the upper cavity block 12 and the heat sink 85, but this is not a limiting example. For example, the resin sealing mold 1 can bring the cavity surface 12a of the upper cavity block 12 into contact with the heat sink 85 from the state shown in FIG. 9 in which the molded product 80 is being resin-sealed. This allows the resin sealing mold 1 to prevent the resin 60 from being formed on the heat sink 85.

[0048] As described above, the resin-sealing mold 1 according to the first embodiment is a resin-sealing mold for resin-sealing a molded product 80 including a heat sink 85 disposed in a cavity 70 formed between an upper mold 2 and a lower mold 3. The upper mold 2 has an upper cavity block 12 having a cavity surface 12a that forms the cavity 70. The upper mold 2 is an example of a first mold, and the upper cavity block 12 is an example of a first cavity block. In the resin-sealing mold 1, the distance between the heat sink 85 and the cavity surface 12a is narrowed during resin-sealing of the molded product 80. This allows the resin-sealing mold 1 to manufacture a resin-sealed molded product 90 in which the thickness of the resin 60 on the heat sink 85 is thin, or a resin-sealed molded product 90 in which no resin 60 is formed on the heat sink 85. Therefore, the resin-sealing mold 1 can reduce the manufacturing cost of the resin-sealed molded product 90.

[0049] Furthermore, multiple cavities 70 are formed between the upper mold 2 and the lower mold 3 for each molded article 80, and the upper mold 2 is provided with an upper cavity block 12 for each molded article 80. This allows the resin sealing mold 1 to accurately manufacture, for example, a resin sealing molded article 90 in which the thickness of the resin 60 on the heat sink 85 is thin.

[0050] Furthermore, the cavity surface of the upper mold 2 forms at least a part of the cavity top surface 71 or the cavity bottom surface 72, and the upper cavity block 12 has a recess 12b on the cavity surface that is large enough to cover the heat sink 85. This allows the resin-sealing mold 1 to further reduce the amount of resin 60 that is removed from the resin 60 of the resin-sealed molded product 90.

[0051] 2. Second embodiment <2.1. Structure of resin sealing mold> The resin-sealed mold according to the second embodiment differs from the resin-sealed mold 1 according to the first embodiment in that the lower mold includes a lower mold body and a cavity block. In the following, components having the same functions as those in the first embodiment are denoted by the same reference numerals and explanations thereof are omitted, and the explanation will focus on the differences from the resin-sealed mold 1 of the first embodiment.

[0052] As shown in Fig. 14, a resin-sealing mold 1A according to the second embodiment includes an upper mold 2 and a lower mold 3A. The lower mold 3A is another example of a second mold. The upper mold 2 and the lower mold 3A have cavity surfaces that form a cavity 70, and when the upper mold 2 and the lower mold 3A are in a clamped state in which they abut against each other as shown in Fig. 14, the cavity 70 is formed by the upper mold 2 and the lower mold 3A.

[0053] The lower mold 3A includes a lower mold body 31 and a lower cavity block 32. The lower cavity block 32 is an example of a second cavity block. A through hole 31a is formed in the lower mold body 31, and the lower cavity block 32 is arranged to be movable within the through hole 31a by hydraulic pressure. The direction in which the lower cavity block 32 can move is the direction in which the upper cavity block 12 of the upper mold 2 presses the heat sink 85 via the resin 60, or the direction in which the upper cavity block 12 presses the heat sink 85 directly.

[0054] The through hole 31a has a diameter large enough to cover the entire heat sink 84, and is formed at a position facing the heat sink 84. When the upper mold 2 and the lower mold 3A are in a clamped state in which they abut against each other, the cavity surface 32a of the lower cavity block 32 arranged in the through hole 31a abuts against the lower surface of the heat sink 84. Note that in the clamped state, there may be a gap between the cavity surface 32a of the lower cavity block 32 and the lower surface of the heat sink 84.

[0055] The lower mold body 31 forms a part of the cavity bottom surface 72 and parts of the cavity side surfaces 73 and 74 , and the cavity surface 32 a of the lower cavity block 32 forms the remaining part of the cavity bottom surface 72 .

[0056] In the resin sealing mold 1A, as shown in Figure 15(a), resin 60 is sent into the cavity 70, and within the cavity 70, the resin 60 fills the space between the cavity surface 12a of the upper cavity block 12 and the heat sink 85 of the molded product 80.

[0057] Thereafter, in the resin sealing mold 1A, the lower mold 3A and the upper mold body 11 move upward in Fig. 15(a), and the heat sink 85 approaches the upper cavity block 12 of the upper mold 2. When the heat sink 85 approaches the upper cavity block 12, if the upper cavity block 12 comes into contact with the molded product 80 as shown in Fig. 15(b), the molded product 80 may be damaged, such as being broken or deformed.

[0058] Therefore, as described above, the resin sealing mold 1A is provided with the lower cavity block 32 that moves within the through hole 31a by hydraulic pressure. When the workpiece 80 is pressed by the upper cavity block 12, the hydraulic pressure biasing the lower cavity block 32 overcomes the pressing force of the upper cavity block 12, and the lower cavity block 32 moves downward.

[0059] The amount of downward movement of the lower cavity block 32 increases as the pressing force of the upper cavity block 12 on the molded product 80 increases. Therefore, compared to the resin sealing mold 1, the resin sealing mold 1A can prevent the molded product 80 from being damaged by the pressing force of the upper cavity block 12 on the molded product 80.

[0060] The pressing of the workpiece 80 by the upper cavity block 12 occurs, for example, when the heat sink 85 of the workpiece 80 is tilted or when the vertical dimension of the workpiece 80 is larger than the design value. The tilt of the heat sink 85 occurs, for example, when the workpiece 80 is transported to the resin sealing mold 1A or when the resin 60 is filled into the cavity 70, but is not limited to such examples.

[0061] In this way, with the resin sealing mold 1A, the thickness of the resin 60 that is removed from the resin 60 of the resin sealing molded product 90 can be made thinner, and even if the upper cavity block 12 comes into contact with the molded product 80, the lower cavity block 32 moves, thereby preventing the molded product 80 from being damaged.

[0062] <2.2. Resin sealing equipment configuration> 16, the resin sealing apparatus 100A according to the second embodiment differs from the resin sealing apparatus 100 according to the first embodiment in that it includes a resin sealing mold 1A and a hydraulic pump 9 instead of the resin sealing mold 1. In the following, components having the same functions as those in the first embodiment are denoted by the same reference numerals and their description will be omitted, and the description will focus on the differences from the resin sealing apparatus 100 of the first embodiment.

[0063] In the resin sealing apparatus 100A, the lower mold 3A includes a lower mold chess 30A having a cavity surface and a lower die set 40 that supports the lower mold chess 30A. The lower mold chess 30A includes the above-mentioned lower mold body 31 and lower cavity block 32. The resin sealing apparatus 100A shown in FIG. 16 is configured so that the lower mold 3A moves upward, but it may also be configured so that the upper mold 2 moves downward.

[0064] Next, the resin sealing operation of the resin sealing apparatus 100A shown in Fig. 16 for sealing the molded article 80 will be specifically described with reference to Figs. 17 to 22. As shown in Fig. 17, the molded article 80 and the resin tablet 61 are transported to the resin sealing die 1A of the resin sealing apparatus 100A by a transport device (not shown). In the example shown in Figs. 16 to 22, the molded article 80 shown in Fig. 14 etc. is shown in a simplified form.

[0065] In the state shown in Fig. 17, the lower cavity block 32 of the lower mold 3A is moved upward by hydraulic pressure from the hydraulic pump 9 and is maintained in the position shown in Fig. 17. Also, as shown in Fig. 18, a molded product 80 is placed on the lower mold chest 30A of the lower mold 3A, and a resin tablet 61 is placed in a pot 77 formed in the lower mold 3A.

[0066] Next, as shown in Fig. 19, in the resin sealing apparatus 100A, the movable platen 6 (see Fig. 16) moves upward, causing the lower mold 3A to come into contact with the upper mold 2, thereby clamping the upper mold 2 and the lower mold 3A together. A plurality of cavities 70 are formed between the upper mold 2 and the lower mold 3A for each molded article 80. The upper mold 2 has an upper cavity block 12 for each molded article 80, and the lower mold 3A has a lower cavity block 32 for each molded article 80.

[0067] 20, in the resin sealing apparatus 100A, the plunger 8 moves upward, and the resin tablet 61 melted by the transfer unit 7 (see FIG. 16) is extruded as resin 60 into the cavity 70 via the cull portion 75 (see FIG. 19) and the runner portion 76 (see FIG. 19). As a result, the resin 60 fills the gap between the cavity surface 12a of the upper cavity block 12 and the heat sink 85 of the molded product 80 in the cavity 70.

[0068] Next, in the resin sealing apparatus 100A, a drive mechanism (not shown) moves the movable platen 6 (see FIG. 16) upward, whereby the movable platen 6 presses the lower mold 3A upward in FIG. 20, causing the lower mold 3A to move upward in FIG. 20. Therefore, in the resin sealing apparatus 100A, as shown in FIG. 21, the lower mold 3A and the upper mold body 11 move upward in FIG. 21 while the position of the upper cavity block 12 in the upper mold 2 is fixed. This narrows the gap between the cavity surface 12a of the upper cavity block 12 and the heat sink 85 of the molded product 80. Therefore, in the resin sealing apparatus 100A, a resin-sealed molded product 90 is formed in which the thickness of the resin 60 on the heat sink 85 is thin.

[0069] In addition, the resin sealing apparatus 100A may be configured to narrow the gap between the cavity surface 12a and the heat sink 85 by moving the upper cavity block 12 downward in FIG. 20 instead of moving the movable platen 6 upward from the state shown in FIG. 20.

[0070] Thereafter, as shown in FIG. 22, in the resin sealing apparatus 100A, the movable platen 6 (see FIG. 16) moves downward, thereby separating the lower mold 3A from the upper mold 2, and the resin-sealed molded product 90 is removed from the resin-sealed mold 1A by a conveying device not shown.

[0071] During resin sealing of the molded product 80, if the upper cavity block 12 of the upper mold 2 does not come into contact with the molded product 80, the lower cavity block 32 of the lower mold 3A is biased in a direction approaching the molded product 80 against the downward force applied to the molded product 80, and the state shown in Fig. 21 is maintained. This allows the resin sealing apparatus 100A to manufacture the resin-sealed molded product 90 with high precision.

[0072] Furthermore, if a downward force greater than the hydraulic pressure from the hydraulic pump 9 is applied to the lower cavity block 32 of the lower mold 3A during resin sealing of the molded product 80, the hydraulic pressure from the hydraulic pump 9 will be defeated by the downward force, and the lower cavity block 32 will move downward.

[0073] Therefore, during resin sealing of the molded product 80, if the upper cavity block 12 presses the molded product 80 downward and a downward force greater than the hydraulic pressure from the hydraulic pump 9 is applied to the lower cavity block 32, the lower cavity block 32 will move downward. This makes it possible for the resin sealing apparatus 100A to prevent the molded product 80 from being damaged by the pressure applied to the molded product 80 by the upper cavity block 12.

[0074] In the resin sealing apparatus 100A, the through hole 31a has a diameter large enough to cover the entire heat sink 84, and is formed at a position facing the heat sink 84. When the upper mold 2 and the lower mold 3A are clamped together, the cavity surface 32a of the lower cavity block 32 arranged in the through hole 31a comes into contact with the lower surface of the heat sink 84.

[0075] Therefore, in the resin sealing apparatus 100A, even when the lower cavity block 32 moves downward, the amount of resin 60 that penetrates into the through hole 31a can be reduced compared to when the cavity surface 32a of the lower cavity block 32 is the entire cavity bottom surface 72.

[0076] The lower cavity block 32 is hydraulically biased, but is not limited to this example. For example, the lower cavity block 32 may be configured to be movable within the through-hole 31 a by a drive source such as a servo motor.

[0077] In this case, for example, a pressure sensor that detects the pressure applied to the lower cavity block 32 may be attached to the resin sealing mold 1A, and when the pressure detected by the pressure sensor is above a threshold value, the lower cavity block 32 may be moved downward by controlling the drive source by a control unit not shown.

[0078] Furthermore, when the pressure detected by the pressure sensor is equal to or greater than a threshold value, the higher the pressure detected by the pressure sensor, the greater the downward movement of the lower cavity block 32 can be made.

[0079] In the above-described example, in the resin-sealing mold 1A, the upper cavity block 12 is provided in the upper mold 2, and the lower cavity block 32 is provided in the lower mold 3A. However, this is not limiting. For example, the resin-sealing mold 1A may be configured such that the lower mold 3A, instead of the upper mold 2, is provided with a cavity block corresponding to the through hole 11a and the through hole corresponding to the upper cavity block 12, and the upper mold 2, instead of the lower mold 3A, is provided with a cavity block corresponding to the through hole 31a and the through hole corresponding to the lower cavity block 32. In this case, the cavity surface of the cavity block corresponding to the cavity surface 12a of the upper cavity block 12 forms at least a part of the cavity bottom surface 72, and the cavity surface of the cavity block corresponding to the cavity surface 32a of the lower cavity block 32 forms at least a part of the cavity top surface 71. The molded product 80 is then placed in the cavity 70 in a state that is upside down from the state shown in FIG. 14 .

[0080] Furthermore, in the resin sealing mold 1A described above, the thickness of the resin 60 on the heat sink 85 is reduced by narrowing the gap between the cavity surface 12a of the upper cavity block 12 and the heat sink 85, but this is not a limiting example. For example, the resin sealing mold 1A can bring the cavity surface 12a of the upper cavity block 12 into contact with the heat sink 85 from the state shown in FIG. 20 in which the workpiece 80 is being resin-sealed. This allows the resin sealing mold 1A to prevent the resin 60 from being formed on the heat sink 85.

[0081] As described above, the resin-sealing mold 1A according to the second embodiment is a resin-sealing mold for resin-sealing a molded product 80 including a heat sink 85 disposed in a cavity 70 formed between an upper mold 2 and a lower mold 3A. The upper mold 2 has an upper cavity block 12 having a cavity surface 12a that forms the cavity 70. The upper mold 2 is an example of a first mold, and the upper cavity block 12 is an example of a first cavity block. During resin-sealing of the molded product 80, the gap between the heat sink 85 and the cavity surface 12a narrows. This allows the resin-sealing mold 1A to produce, for example, a resin-sealed molded product 90 in which the thickness of the resin 60 on the heat sink 85 is thin, or a resin-sealed molded product 90 in which no resin 60 is formed on the heat sink 85. Therefore, the resin-sealing mold 1A can reduce the manufacturing cost of the resin-sealed molded product 90.

[0082] The lower mold 3A also includes a lower cavity block 32 that is movable in a direction in which the heat sink 85 is pressed by the cavity surface 12a of the upper cavity block 12 during resin sealing of the molded product 80. The lower mold 3A is an example of a second mold, and the lower cavity block 32 is an example of a second cavity block. This allows the resin sealing mold 1A to prevent damage to the molded product 80 when the molded product 80 is pressed by the upper cavity block 12.

[0083] Furthermore, the lower cavity block 32 of the lower mold 3A is urged by hydraulic pressure in a direction approaching the molded product 80 during resin sealing of the molded product 80. As a result, in the resin sealing mold 1A, when a downward force greater than the hydraulic pressure from the hydraulic pump 9 is applied to the lower cavity block 32 of the lower mold 3A, the hydraulic pressure from the hydraulic pump 9 overcomes the downward force, and the lower cavity block 32 moves downward. Therefore, in the resin sealing mold 1A, the lower cavity block 32 can be moved downward without controlling the movement of the lower cavity block 32 with a servo motor or the like, thereby avoiding a complicated configuration.

[0084] Further advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. [Explanation of symbols]

[0085] 1,1A resin sealing mold 2 Upper mold (an example of the first mold) 2A upper mold 3, 3A Lower mold (an example of the second mold) 9. Hydraulic pump 11 Upper mold body 11a Through hole 12 Upper cavity block (an example of a first cavity block) 12a Cavity surface 12b Recess 31 Lower mold body 31a Through hole 32 Lower cavity block (an example of a second cavity block) 60 Resin 70 cavity 71 Cavity top 72 Cavity bottom 80 Molded product 84,85 Heat sink 90 Resin-sealed molded products 100,100A resin sealing machine

Claims

1. A resin sealing mold for resin-sealing a molded product including a heat sink disposed in a cavity formed between a first mold and a second mold, The molded article is the resin on the heat sink is scraped off after the resin sealing to expose the heat sink, The first mold comprises: a first cavity block having a cavity surface that forms the cavity; During the resin sealing of the molded product, the distance between the heat sink and the cavity surface is narrowed while resin is present between the heat sink and the cavity surface so that the thickness of the resin on the heat sink after the resin sealing is thin. A resin sealing mold characterized by:

2. The cavity is A plurality of the molded articles are formed between the first mold and the second mold, The first mold comprises: The first cavity block is provided for each of the molding pieces.

2. The resin-sealing mold according to claim 1.

3. The cavity surface is forming at least a part of the top or bottom surface of the cavity; The first cavity block comprises: The cavity surface has a recess formed by a depression large enough to cover the heat sink.

3. The resin-sealing mold according to claim 1 or 2.

4. The second mold comprises: a second cavity block that is movable in a direction in which the heat sink is pressed by the cavity surface during the resin sealing of the molded product; 4. The resin-sealing mold according to claim 1, wherein the resin-sealing mold is a mold for molding a resin.

5. The second cavity block comprises: During the resin sealing of the molded product, the pressure is applied by hydraulic pressure in a direction approaching the molded product.

5. The resin-sealing mold according to claim 4.

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