Method for processing a substrate

Abstract

To provide a method for processing a substrate including depositing a boron-carbon film, and the boron-carbon film exhibits improved etch selectivity.SOLUTION: A method includes: exposing a substrate positioned in a processing area of a processing chamber to a hydrocarbon-containing gas mixture; exposing the substrate to a boron-containing gas mixture; and generating a radio frequency (RF) plasma in the processing area to deposit a boron-carbon film on the substrate. The hydrocarbon-containing gas mixture and the boron-containing gas mixture are caused to flow into the processing area at a precursor ratio of (boron-containing gas mixture / ((boron-containing gas mixture)+hydrocarbon-containing gas mixture) of about 0.38 to about 0.85. The boron-carbon hard mask film provides high modulus of elasticity, etch selectivity, and stress for high aspect-ratio features (for example, 10:1 or more) and smaller dimension devices (for example, 7 nm node or less).SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate generally to methods, and more particularly, to methods for processing substrates. [Background technology]

[0002]

[0002] The demand for higher integrated circuit density places demands on the process sequences used to manufacture integrated circuit components. For example, in a process sequence using conventional photolithography techniques, a layer of energy-sensitive resist is formed over a stack of material layers disposed on a substrate. The energy-sensitive resist layer is exposed to an image of a pattern to form a photoresist mask. An etching process is then used to transfer the mask pattern into one or more material layers of the stack. The chemical etchant used in the etching process is selected to have a higher etch selectivity for the material layers of the stack than for the energy-sensitive resist mask. The etch selectivity to one or more material layers of the stack over the resist layer prevents the energy-sensitive resist layer from being consumed before the pattern transfer is complete.

[0003]

[0003] As pattern dimensions shrink, the thickness of energy-sensitive resists is correspondingly reduced to control pattern resolution. Such thin resist layers may be insufficient to conceal the underlying material layer during the pattern transfer process due to attack by chemical etchants. To facilitate pattern transfer, an intermediate layer called a hard mask is often used between the energy-sensitive resist layer and the underlying material layer due to the hard mask's high resistance to chemical etchants. As critical dimensions (CDs) shrink, current hard mask materials lack desirable etch selectivity compared to the underlying material.

[0004] Therefore, there is a need for a method for depositing hardmask films with improved etch selectivity. Summary of the Invention

[0005]

[0005] Embodiments included herein include a method of processing a substrate, the method including depositing a boron-carbon film, the boron-carbon film exhibiting improved etch selectivity.

[0006] In one embodiment, a method for processing a substrate is provided. The method includes exposing a substrate positioned in a processing region of a processing chamber to a hydrocarbon-containing gas mixture, exposing the substrate to a boron-containing gas mixture, and generating a radio frequency (RF) plasma in the processing region to deposit a boron-carbon film on the substrate. The hydrocarbon-containing gas mixture and the boron-containing gas mixture are flowed into the processing region in a precursor ratio of (boron-containing gas mixture / ((boron-containing gas mixture) + hydrocarbon-containing gas mixture)) of about 0.38 to about 0.85. The boron-carbon film has about 55 atomic percent to about 95 atomic percent boron.

[0007] In another embodiment, a method for processing a substrate is provided. The method includes exposing a substrate positioned in a processing region of a processing chamber to a hydrocarbon-containing gas mixture, exposing the substrate to a boron-containing gas mixture, and generating a radio frequency (RF) plasma in the processing region to deposit a boron-carbon film on the substrate. The hydrocarbon-containing gas mixture and the boron-containing gas mixture are flowed into the processing region in a precursor ratio of (boron-containing gas mixture / ((boron-containing gas mixture) + hydrocarbon-containing gas mixture)) of about 0.38 to about 0.85. The boron-carbon film has about 35 atomic percent to about 55 atomic percent boron.

[0008] In yet another embodiment, a method for processing a substrate is provided. The method includes exposing a substrate positioned in a processing region of a processing chamber to a hydrocarbon-containing gas mixture, exposing the substrate to a boron-containing gas mixture, and generating a radio frequency (RF) plasma in the processing region to deposit a boron-carbon film on the substrate. The hydrocarbon-containing gas mixture and the boron-containing gas mixture are flowed into the processing region in a precursor ratio of (boron-containing gas mixture / ((boron-containing gas mixture) + hydrocarbon-containing gas mixture)) of about 0.38 to about 0.85. The hydrocarbon-containing gas mixture includes propylene (C3H6). The boron-carbon film has about 55 atomic percent to about 95 atomic percent boron.

[0009]

[0009] In order that the above-described features of the present disclosure may be understood in detail, the above-summarized embodiments will be more particularly described by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings merely illustrate exemplary embodiments of the present disclosure and therefore should not be considered as limiting the scope of the embodiments, as the present disclosure may admit of other equally effective embodiments. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic diagram illustrating a substrate processing system according to an embodiment. [Figure 2] FIG. 1 is a flow diagram of method steps for depositing a boron-carbon film, according to one embodiment. [Figure 3] 1 is a schematic cross-sectional view illustrating a substrate structure according to an embodiment. [Figure 4] 1 is a graph showing the ratio of boron (B) to precursor ratio (PR). DETAILED DESCRIPTION OF THE INVENTION

[0011]

[0014] Embodiments of the present disclosure generally relate to methods for processing substrates. The present disclosure describes techniques for depositing a hard mask (e.g., a boron-carbon film) with high modulus and etch selectivity on a substrate. The method includes fabricating a dense boron-carbon hard mask film with a high concentration of boron and low hydrogen content. Reducing the flow rate of a hydrocarbon-containing gas source increases the boron fraction (B%) in the boron-carbon hard mask film. The boron-carbon hard mask film provides high modulus, etch selectivity, and stress for high aspect ratio (e.g., 10:1 or greater) features and smaller dimension (e.g., 7 nm node and below) devices. The embodiments described herein are compatible with current carbon hard mask process integration schemes. Therefore, the introduction of the method into an existing device manufacturing line does not require substantial modifications to upstream or downstream processing methods or associated equipment. The embodiments disclosed herein may be useful for, but are not limited to, the deposition of boron-carbon hard masks.

[0012]

[0015] As used herein, the term "about" refers to a + / - 10% variation from the nominal value. It should be understood that such a variation can be included in any value provided herein.

[0013]

[0016] The embodiments described herein are described below with respect to plasma enhanced chemical vapor deposition (PECVD) processes, which may be performed using any suitable thin film deposition system. Examples of suitable systems include the CENTURA® system, which may utilize a DxZ™ processing chamber, the PRECISION5000® system, the PRODUCER™ system, the PRODUCER GT™, and the PRODUCER SE™ processing chamber, commercially available from Applied Materials, Inc., Santa Clara, California. Other tools capable of performing PECVD processes may also be adapted to benefit from the embodiments described herein. Furthermore, any system capable of enabling the PECVD processes described herein may be used advantageously. The apparatus descriptions described herein are exemplary and should not be construed or interpreted as limiting the scope of the embodiments described herein.

[0014]

[0017] 1 is a schematic diagram illustrating one embodiment of a substrate processing system 132 configured to perform hard mask layer deposition. As shown, the substrate processing system 132 includes a processing chamber 100 coupled to a gas panel 130 and a controller 110.

[0015]

[0018] The processing chamber 100 is configured to perform various processing methods on a substrate 190 disposed therein. For example, the processing chamber 100 is configured to deposit a hard mask on the substrate 190. As shown, the processing chamber 100 includes a top wall 124, one or more sidewalls 101, and a bottom wall 122 that define an interior processing region 126. A support pedestal 150 for supporting the substrate 190 is disposed in the interior processing region 126 of the processing chamber 100. The support pedestal 150 is supported by a stem 160, and the support pedestal 150 and / or the stem 160 may comprise any other suitable material, such as aluminum, ceramic, and stainless steel. The support pedestal 150 may move vertically within the processing chamber 100 using a displacement mechanism (not shown) (e.g., an actuator that raises and lowers the support pedestal). In some embodiments, the support pedestal 150 includes an electrostatic chuck (ESC). The ESC secures the substrate 190 during processing.

[0016]

[0019] The support pedestal 150 may include a heater element 170 embedded therein. The heater element 170 is configured to control the temperature of a substrate 190 supported on a surface 192 of the support pedestal 150. The support pedestal 150 may be resistively heated by applying a current from a power supply 106 to the heater element 170. The current supplied from the power supply 106 is regulated by a controller 110 to control the heat generated by the heater element 170, thereby maintaining the substrate 190 and the support pedestal 150 at a substantially constant temperature during film deposition. The supplied current is adjusted to selectively control the temperature of the support pedestal 150 between about 400°C and about 700°C.

[0017]

[0020] A temperature sensor 172, such as a thermocouple, can be embedded in the support pedestal 150 to monitor the temperature of the support pedestal 150. The measured temperature is used by the controller 110 to control the power supplied to the embedded heater element 170 to maintain the substrate 190 at a desired temperature.

[0018]

[0021] A vacuum pump 102 is coupled to a port formed in the bottom wall 122 of the processing chamber 100. The vacuum pump 102 is used to maintain a desired gas pressure in the processing chamber 100. The vacuum pump 102 also evacuates post-processing gases and process by-products from the processing chamber 100.

[0019]

[0022] A gas distribution assembly 120 having a plurality of apertures 128 is disposed atop the processing chamber 100 above the support pedestal 150. The gas distribution assembly 120 is configured to flow one or more process gases into the processing chamber 100. The apertures 128 may have different sizes, numbers, distributions, shapes, designs, and diameters to facilitate the flow of various process gases into the processing chamber 100. The gas distribution assembly 120 is connected to a gas panel 130 that supplies various gases to the interior processing region 126 during substrate processing. A plasma may be formed from the process gas mixture exiting the gas distribution assembly 120, facilitating thermal decomposition of the process gases, resulting in the deposition of material on the surface 191 of the substrate 190.

[0020]

[0023] The gas distribution assembly 120 and the support pedestal 150 may form a pair of spaced-apart electrodes in the interior processing region 126. One or more radio frequency (RF) power sources 140 provide a bias potential to the gas distribution assembly 120 through a matching network 138 to facilitate plasma generation between the gas distribution assembly 120 and the support pedestal 150. Alternatively, the RF power sources 140 and the matching network 138 may be coupled to the gas distribution assembly 120, the support pedestal 150, or both the gas distribution assembly 120 and the support pedestal 150, or to an antenna (not shown) located outside the processing chamber 100. In one embodiment, the RF power sources 140 provide a power of about 100 W to about 3000 W at a frequency of about 50 kHz to about 13.6 MHz. In another embodiment, the RF power sources 140 provide a power of about 500 W to about 1800 W at a frequency of about 50 kHz to about 13.6 MHz.

[0021]

[0024] As shown, the controller 110 includes a central processing unit (CPU) 112, memory 116, and support circuits 114 configured to control process sequences and regulate gas flow from the gas panel 130. The CPU 112 may be any form of general-purpose computer processor used in industrial environments. Software routines may be stored in the memory 116, such as random access memory, read-only memory, floppy or hard disk drive, or other form of digital storage. The support circuits 114 are conventionally coupled to the CPU 112 and may include cache, clock circuits, input / output systems, power supplies, etc. Bidirectional communication between the controller 110 and the various components of the substrate processing system 132 is handled through a number of signal cables collectively referred to as a signal bus 118.

[0022] 2 is a flow diagram of the steps of a method 200 for depositing a boron-carbon film, according to one embodiment. While the steps of method 200 are described with reference to FIGS. 2 and 3, one skilled in the art will understand that any system configured to perform the steps of the method in any order is within the scope of the embodiments described herein. Method 200 may be stored on or accessible to controller 110 as a computer-readable medium containing instructions that, when executed by the controller's CPU 112, cause system 132 and / or processing chamber 100 to perform method 200.

[0023]

[0025] The method 200 begins at step 210, where a substrate disposed in a processing region of a processing chamber is exposed to a hydrocarbon-containing gas. The processing chamber can be the processing chamber 100 shown in FIG. 1. FIG. 3 is a schematic cross-sectional view of a substrate structure 300 according to one embodiment. As shown, the substrate structure 300 includes a substrate 190. The substrate 190 can have a substantially planar surface 191 having structures formed thereon or therein at a desired height. Alternatively, the substrate 190 can have a surface with patterned structures, such as trenches, holes, or vias formed therein. While the substrate 190 is shown in FIG. 3 as a single body, it is understood that the substrate 190 can include one or more materials used in the formation of semiconductor devices, such as metal contacts, trench isolation, gates, bit lines, or any other interconnect features. The substrate 190 can include any number or combination of metal, semiconductor, and / or insulating layers thereon.

[0024]

[0026] Substrate 190 may include one or more metal layers, one or more dielectric materials, semiconductor materials, and combinations thereof used to fabricate semiconductor devices. For example, substrate 190 may include oxide materials, nitride materials, polysilicon materials, etc., depending on the application. In one embodiment where a memory application is desired, substrate 190 includes a silicon substrate material, an oxide material, and a nitride material, with or without polysilicon sandwiched between them.

[0025]

[0027] In another embodiment, substrate 190 includes multiple alternating oxide and nitride materials (i.e., oxide-nitride-oxide (ONO)) deposited on surface 191 of substrate 190. In various embodiments, substrate 190 includes multiple alternating oxide and nitride materials, one or more oxide or nitride materials, polysilicon or amorphous silicon materials, oxide alternating with amorphous silicon, oxide alternating with polysilicon, undoped silicon alternating with doped silicon, undoped polysilicon alternating with doped polysilicon, or undoped amorphous silicon alternating with doped amorphous silicon. Substrate 190 can be any substrate or material surface on which film processing can be performed. For example, the substrate 190 may include crystalline silicon, silicon oxide, silicon oxynitride, silicon nitride, strained silicon, silicon germanium, tungsten, titanium nitride, doped or undoped polysilicon, doped or undoped silicon wafers, and patterned or unpatterned wafers, silicon-on-insulator (SOI), carbon-doped silicon oxide, silicon nitride, doped silicon, germanium, gallium arsenide, glass, sapphire, low-k dielectrics, and combinations thereof.

[0026]

[0028] A hydrocarbon-containing gas mixture is flowed from the gas panel 130 through the gas distribution assembly 120 to the internal processing region 126. The gas mixture includes at least one hydrocarbon compound. The gas mixture may further include an inert gas, a diluent gas, or a combination thereof. The hydrocarbon may be any gas or liquid that can be vaporized to simplify the hardware required for metering, controlling, and delivering materials to the chamber. In one embodiment, the hydrocarbon source is a gaseous hydrocarbon, such as a linear hydrocarbon. In one embodiment, the hydrocarbon compound is represented by the general formula C x H y where x ranges from 1 to 20 and y ranges from 1 to 20. In one embodiment, the hydrocarbon compound is an alkane. Suitable hydrocarbon compounds include, for example, methane (CH), ethane (C2H6), propylene (C3H6), propane (C3H8), butane (C4H10 ) and its isomers isobutane, pentane (CH 12 ), hexane (CH 14 ) and its isomers isopentane and neopentane, hexane (CH 14 ), and its isomers 2-methylpentane, 3-methylpentane, 2,3-dimethylbutane, and 2,2-dimethylbutane, or combinations thereof. Additional suitable hydrocarbons include, for example, alkenes such as acetylene, ethylene, propylene, butylene and its isomers, dienes such as pentene and its isomers, butadiene, isoprene, pentadiene, hexadiene, or combinations thereof.

[0027]

[0029] Additional suitable hydrocarbons include halogenated alkenes such as, for example, monofluoroethylene, difluoroethylene, trifluoroethylene, tetrafluoroethylene, monochloroethylene, dichloroethylene, trichloroethylene, tetrachloroethylene, or combinations thereof. Additional suitable hydrocarbons include alkynes such as, for example, acetylene (C2H2), propyne (C3H4), butylene (C4H8), vinylacetylene, or combinations thereof. Additional suitable hydrocarbons include aromatic hydrocarbons such as, for example, benzene, styrene, toluene, xylene, ethylbenzene, acetophenone, methyl benzoate, phenyl acetate, phenol, cresol, furan, alpha-terpinene, cymene, 1,1,3,3-tetramethylbutylbenzene, t-butyl ether, t-butylethylene, methyl methacrylate, and t-butylfurfuryl ether, compounds having the formula C3H2 and C5H4, halogenated aromatic compounds including monofluorobenzene, difluorobenzene, tetrafluorobenzene, hexafluorobenzene, or combinations thereof. In some instances, C3H6 has been found to be advantageous due to the formation of more stable intermediate species that result in higher surface mobility.

[0028]

[0030] The flow rate of the hydrocarbon-containing gas mixture can be from about 2000 sccm to about 4500 sccm, for example, from about 2200 sccm to about 4000 sccm. In one embodiment in which C3H6 is used as the hydrocarbon-containing gas source, the flow rate of the hydrocarbon-containing gas mixture is from about 2250 sccm to about 3000 sccm, for example, from about 2300 sccm to about 2800 sccm.

[0029]

[0031] Suitable diluent gases, such as helium (He), argon (Ar), hydrogen gas (H), nitrogen gas (N), ammonia (NH), or combinations thereof, among others, can be added to the gas mixture as needed. Ar, He, and N are used to control the density and deposition rate of the amorphous carbon layer. Alternatively, no diluent gas is used during deposition.

[0030]

[0032] In some cases, a nitrogen-containing gas is supplied to the process chamber 100 along with the hydrocarbon-containing gas mixture to control the hydrogen ratio of the amorphous carbon layer. Suitable nitrogen-containing compounds include, for example, nitrogen gas, ammonia, pyridine, aliphatic amines, amines, nitriles, and similar compounds.

[0031]

[0033] An inert gas, such as argon (Ar) and / or helium (He), may be supplied to the process chamber 100 along with the hydrocarbon-containing gas mixture. Other inert gases, such as nitrogen gas (N), may also be used to control the density and deposition rate of the amorphous carbon layer. Additionally, various other process gases can be added to the gas mixture to modify the properties of the amorphous carbon material. In one embodiment, the process gas includes a reactive gas, such as hydrogen gas (H), ammonia (NH), a mixture of hydrogen gas (H) and nitrogen gas (N) (also known as forming gas), or a combination thereof. The addition of H and / or NH is used to control the hydrogen ratio (e.g., carbon-to-hydrogen ratio) of the deposited amorphous carbon layer. The hydrogen ratio present in the amorphous carbon film provides control over layer properties, such as reflectivity.

[0032]

[0034] In step 220, the substrate 190 is exposed to a boron-containing gas mixture. The boron-containing gas mixture is flowed from the gas panel 130 through the gas distribution assembly 120 to the interior processing region 126. In one embodiment, the boron-containing gas mixture includes a boron-containing compound and a diluent gas. Examples of boron-containing compounds include diborane (B2H6), trimethylborane [TMB] (B(CH3)3), triethylborane [TEB] (B(C2H5)3), methylborane, dimethylborane, ethylborane, diethylborane, ortho-carborane (CB 10 H 12 ), and similar compounds. Suitable diluent gases may be included, such as hydrogen gas (H), helium (He), argon (Ar), nitrogen gas (N), ammonia (NH), or combinations thereof, among others. In one example, the boron-containing gas mixture includes BH and H.

[0033]

[0035] In one embodiment, the proportion of the boron-containing compound in the total boron-containing gas mixture is about 1 weight percent (wt%) to about 20 wt%, e.g., about 2 wt% to about 18 wt%, e.g., about 5 wt% to about 12 wt%, e.g., about 7 wt% to about 12 wt%. Exemplary boron-containing gas mixtures include, for example, 6 wt% B2H6 / 94 wt% H2, 7 wt% B2H6 / 93 wt% H2, 8 wt% B2H6 / 92 wt% H2, 9 wt% B2H6 / 91 wt% H2, 10 wt% B2H6 / 90 wt% H2, 11 wt% B2H6 / 89 wt% H2, or 12 wt% B2H6 / 88 wt% H2. The hydrogen gas in these illustrative examples can be replaced with He, Ar, or N2. It is believed that if different concentrations of boron-containing gas mixtures are used, the flow rates required to achieve particular film properties may vary accordingly.

[0034]

[0036] In various embodiments in which C3H6 is used as the hydrocarbon-containing gas source and 9 wt% B2H6 diluted with H2 is used as the boron-containing gas source, the ratio of the flow rates of the hydrocarbon-containing gas source to the boron-containing gas source (hereinafter, ratio) is from about 0.05:1 to about 0.13:1, for example, from about 0.07:1 to about 0.12:1, for example, about 0.0 It may range from 9:1 to about 0.11:1.

[0035]

[0037] In one embodiment where 9 wt% diborane diluted with H2 is used as the boron-containing gas source, the flow rate of the boron-containing gas mixture varies from about 1000 sccm to about 10,000 sccm, e.g., from about 1800 sccm to about 3500 sccm, e.g., about 2300 sccm. In another embodiment where 6% diborane diluted with H2 is used as the boron-containing gas source, the flow rate of the boron-containing gas mixture is from about 5,000 sccm to about 15,000 sccm, e.g., about 13,000 sccm. In yet another embodiment where 12% diborane diluted with H2 is used as the boron-containing gas source, the flow rate of the boron-containing gas mixture is from about 2,000 sccm to about 8,000 sccm, e.g., from about 2,200 sccm to about 7,500 sccm.

[0036]

[0038] The hydrocarbon-containing gas mixture may be introduced into the internal processing region 126 for about 3 seconds to about 30 seconds, e.g., about 15 seconds, depending on the size of the substrate. Flowing the hydrocarbon-containing gas mixture before the introduction of the boron-containing gas may allow for continued thermal and pressure stabilization of the internal processing region 126. The boron-containing gas mixture is then flowed into the internal processing region 126 for about 0.5 seconds to about 5 seconds, e.g., about 1 second to about 2 seconds (the flow time can be varied as long as the flow is long enough so that the boron-containing gas mixture begins to reach the internal processing region 126 before the RF plasma strikes). It is contemplated that step 210 may be performed simultaneously with, before, after, or partially overlapping the process of step 220.

[0037]

[0039] In step 230, an RF plasma is generated in the internal processing region 126 to deposit a boron-carbon film 304 on the substrate 190. The plasma can be formed by capacitive or inductive means and can be excited by coupling RF power to the precursor gas mixture. The RF power can be dual-frequency RF power using a frequency ranging from about 0.4 MHz to about 300 MHz. For example, the RF power is dual-frequency RF power having high-frequency and low-frequency components. The RF power is typically applied at a power level of about 50 W to about 2500 W, which can be all high-frequency RF power, e.g., at a frequency of about 13.56 MHz, or a mixture of high-frequency and low-frequency power, e.g., a high frequency of about 13.56 MHz and a low frequency of about 0.35 kHz.

[0038]

[0040] It has been observed that increasing boron doping in boron-carbon films can increase etch selectivity and film transparency while reducing the stress of the boron-carbon film. Increasing the flow of a boron-containing gas mixture (e.g., B2H6) during deposition can increase the amount of boron in the boron-carbon film, but it also inevitably increases the hydrogen content in the resulting boron-carbon film. Due to the presence of a large amount of hydrogen in the boron-carbon film, the mechanical strength and etch selectivity of the film can be affected. Surprisingly, however, it has been discovered that decreasing the hydrocarbon-containing gas mixture during deposition can increase the boron content and decrease the hydrogen content of the boron-carbon film 304 compared to conventionally deposited amorphous carbon layers (e.g., APF™ hard masks).

[0039]

[0041] Table 1 below shows various flow combinations of hydrocarbon-containing and boron-containing gas sources used to form an amorphous carbon film reference (baseline) and boron-carbon films (Cases 1-4). Case 1 is an example where only the hydrocarbon-containing gas source is reduced compared to the baseline. Case 2 is an example where the hydrocarbon-containing gas source is reduced and the boron-containing gas source is increased compared to the baseline. Case 3 is an example where only the boron-containing gas source is increased compared to the baseline. Case 4 is an example where the hydrocarbon-containing gas source is reduced and the boron-containing gas source is increased compared to the baseline. Table 2 below shows the boron-carbon film properties of the amorphous carbon film reference and boron-carbon films (Cases 1-4) formed according to the flow combinations shown in Table 1. The percentage boron content of the boron-carbon film is calculated as follows: ((B / (B+C)%)%.

[0040]

[0042] [Table 1]

[0041]

[0043] [Table 2]

[0042]

[0044] As can be seen from Table 2, the boron content increased under three different conditions: (a) only a decrease in CH only (e.g., Case 1); (b) only an increase in BH / H only (e.g., Case 3); and (c) a combination of (1) and (2) (e.g., Cases 2 and 4). Further decreasing the flow rate of the hydrocarbon-containing gas source (e.g., Case 2) correspondingly increased the boron content in the final boron-carbon film. However, significantly increasing the flow rate of the boron-containing gas source (e.g., Case 3) instead decreased the boron content in the final boron-carbon film. In particular, the decrease in refractive index and the increase in film stress suggest that a high hydrogen content may etch or consume boron, resulting in an inefficient increase in boron content in the final boron-carbon film.

[0043]

[0045] FIG. 4 is a graph 400 illustrating the percentage of boron (B) versus precursor ratio (PR). Graph 400 is based on an example where CH is used as the hydrocarbon-containing gas source and 9 wt. % BH diluted with H is used as the boron-containing gas source. The PR in FIG. 4 is calculated as follows: PR = (9 wt. % BH in H / ((9 wt. % BH in H) + CH). As can be seen, the PR increases as the flow rate of the hydrocarbon-containing gas source decreases (e.g., Cases 1 and 2), resulting in increased boron doping (B%) in the boron-carbon film. The precursor ratios described herein are believed to be equally applicable to other hydrocarbon-containing and boron-containing gas mixtures mentioned in this disclosure. Furthermore, the PR can be varied from 0.3 to 0.55. Although shown to increase the PR, lower or higher PRs are contemplated depending on the desired boron content in the final boron-carbon film. In various examples, the PR may range from 0.38 to 0.85, e.g., from about 0.45 to about 0.75. It is proposed that as the PR of the plasma increases, the generated RF plasma becomes more uniform. The uniformity of the RF plasma corresponds to the uniformity of the deposited film. Thus, unexpectedly, increasing the B% of the RF plasma results in a more uniform deposited film.

[0044]

[0046] Since boron content is directly related to PR, any amount / percentage of boron in the as-deposited boron-carbon film 304 can be achieved by adjusting PR. In either case, the atomic percent of boron incorporation into the film can be calculated as follows: ((B / (B+C)%). In various embodiments of the present disclosure, the boron-carbon film 304 comprises at least 50, 55, 60, 65, 70, 75, 80, 85, or 90 atomic percent boron. In one embodiment, the boron-carbon film 304 comprises from about 45 to about 95 atomic percent boron. In another embodiment, the boron-carbon film comprises from about 55 to about 90 atomic percent boron. In yet another embodiment, the boron-carbon film comprises from about 60 to about 85 atomic percent boron. Similarly, the source of carbon incorporation into the film can be calculated as follows: ((B / (B+C)%) ... comprises from about 45 to about 95 atomic percent boron. In another embodiment, the boron-carbon film comprises from about 55 to about 90 atomic percent boron. In yet another embodiment, the boron-carbon film comprises from about 60 to about 85 atomic percent boron. The hydrogen percentage may be calculated as follows: ((C / (B+C)%). In various embodiments of the present disclosure, the boron-carbon film 304 comprises at least 10, 15, 20, 25, 30, 35, 40, 45, or 50 atomic percent carbon. In one embodiment, the boron-carbon film 304 comprises from about 15 to about 55 atomic percent carbon. In another embodiment, the boron-carbon film 304 comprises from about 25 to about 45 atomic percent carbon. In various embodiments, the boron-carbon film 304 comprises less than about 10, 15, or 20 atomic percent hydrogen. The boron-carbon film 304 may be crystalline or amorphous.

[0045]

[0047] In step 240, a determination is made regarding whether the deposited boron-carbon film 304 has reached a target thickness. The boron-carbon film 304 may have a target thickness corresponding to the subsequent etching requirements of the substrate 190. Flowing a hydrocarbon-containing gas mixture into the processing region (step 210), flowing a boron-containing gas mixture into the processing region (step 220), and generating an RF plasma in the processing region to deposit a boron-carbon film (step 230) may be repeated until the target thickness is achieved. In one embodiment, the boron-carbon film is deposited to a thickness of about 100 Å to about 30,000 Å (e.g., about 1,000 Å to about 18,000 Å; about 100 Å to about 20,000 Å; about 300 Å to about 5,000 Å; or about 1,000 Å to about 2,000 Å).

[0046]

[0048] In optional step 250, additional processing is performed on the substrate structure 300. For example, a patterned photoresist (not shown) may be formed on the boron-carbon film 304. The boron-carbon film 304 may be etched in a pattern corresponding to the patterned photoresist layer, followed by etching of the substrate 190 in the pattern. Material may be deposited on the etched portions of the boron-carbon film 304. The boron-carbon film 304 may be removed using a solution containing hydrogen peroxide and sulfuric acid, or any etching chemistry containing oxygen and a halogen (e.g., fluorine or chlorine). The boron-carbon film 304 may be removed by a chemical-mechanical polishing (CMP) process.

[0047]

[0049] B doping is generally used to induce sp 3 Reduces carbon-hydrogen (CH) bonds. B dopants form at interstitial sites. Adjacent H atoms bond to form hydrogen gas (H2), which leaves the film. The remaining C and B atoms then form C-B bonds. sp 3 It is theorized that C-H bonds cause lattice relaxation, resulting in tensile stress. B doping generally increases the C=C and C≡C bonds in boron-carbon films, increasing the C / H ratio. 3 The CH bonds also decrease, creating compressive stress. The increased flow of B2H6 requires more sp 3 C—H bonds may be included, resulting in a high H content. To prevent the formation of C—C polymer chains in the film, shorter chain C molecules are preferred.

[0048]

[0050] Current low-temperature boron-containing carbon hardmasks achieve better etch selectivity, mechanical strength, and transparency compared to previous amorphous carbon hardmask films. However, the amorphous nature, higher hydrogen content, and lower elastic modulus (∼100 GPa) of low-temperature boron-containing hardmask films limit the fabrication of high-aspect-ratio features and smaller-dimension devices. To enable next-generation integrated circuit chipsets, embodiments of the present disclosure provide for the fabrication of dense boron-carbon hardmask films with high boron concentrations and low hydrogen content at higher temperatures (e.g., 400°C or higher).

[0049]

[0051] As deposited, boron-carbon films have a strongly bonded boron-carbon (BC) network that protects the boron carbide film from etchants. Therefore, boron carbide films exhibit high selectivity toward substrates (either oxide or nitride substrates) for further etching processes. The BC bonds are shorter than carbon-carbon (C-C) bonds, shifting the stress of the boron-carbon film to tensile stress. Boron-carbon films have lower stress, resulting in less substrate warpage. Because boron-carbon films have a high elastic modulus and hardness, they are mechanically robust. Furthermore, the BC bonds increase the bandgap of the film. Therefore, boron-carbon films are transparent to at least some of the frequencies of light used in photolithography. Furthermore, reducing the boron-containing gas mixture reduces the need for boron-containing gases (e.g., diborane) without degrading the film's desired properties, thereby reducing cost of ownership.

[0050]

[0052] Generally, the following exemplary deposition process parameters are used to form a boron-containing amorphous carbon layer. The process parameters can range from about 400°C to about 700°C (e.g., about 450°C to about 650°C) substrate temperature. The chamber pressure can range from about 1 Torr to about 20 Torr (e.g., about 2 Torr to about 10 Torr). The flow rate of the hydrocarbon-containing gas (e.g., CH) can be from about 150 sccm to about 400 sccm, e.g., about 160 sccm to about 260 sccm. The flow rates of the dilution gases (e.g., He) can individually range from about 0 sccm to about 3000 sccm (e.g., about 1200 sccm to about 2000 sccm). The flow rates of the inert gases (e.g., Ar) can individually range from about 0 sccm to about 10000 sccm (e.g., about 2500 sccm to about 4000 sccm). The flow rate of the boron-containing gas mixture (e.g., about 6 wt% to about 10 wt% B2H6 diluted with H2) can be about 1000 sccm to about 3500 sccm, for example, about 1500 sccm to about 2300 sccm. The high-frequency RF power can be 1000 W to 3000 W, for example, about 2000 W. The low-frequency RF power can be about 0 W to about 1500 W, for example, about 800 W. The spacing between the surface 191 (e.g., top surface) of the substrate 190 and the gas distribution assembly 120 can be about 100 mm to about 600 mm (e.g., about 150 mm to about 400 mm). The power supply voltage of the ESC can be about 0 V to about 1000 V, for example, about 600 V to about 750 V. The boron-carbon film may be deposited to a thickness of about 100 Å to about 30,000 Å, for example, about 1,000 Å to about 18,000 Å. The above process parameters provide a typical deposition rate of the boron-containing amorphous carbon layer in the range of about 100 Å / min to about 10,000 Å / min and may be implemented on a 300 mm substrate in a deposition chamber commercially available from Applied Materials, Inc. of Santa Clara, California.

[0051]

[0053] The as-deposited boron-carbon film 304 may have a refractive index (n) greater than about 2, e.g., about 2.34, at a 633 nm wavelength. The as-deposited boron-carbon film 304 may have an extinction coefficient (k) less than about 0.1, e.g., 0.04 or less, at a 633 nm wavelength. The as-deposited boron-carbon film 304 may have an elastic modulus of about 150 MPa to about 400 MPa. The as-deposited boron-carbon film 304 may have a stress of about -200 MPa to about 200 MPa (e.g., about -50 MPa to about 100 MPa). The as-deposited boron-carbon film 304 may have a density greater than 1.5 g / cc, e.g., about 1.85 g / cc.

[0052]

[0054] As described above, a method for processing a substrate is provided, which includes producing a dense boron-carbon hardmask film having a high concentration of boron and a low hydrogen content. Reducing the flow rate of the hydrocarbon-containing gas source increases the B% of the boron-carbon hardmask film.

[0053]

[0055] Boron-carbon hardmask films provide high modulus, etch selectivity, and stress for high aspect ratio (e.g., 10:1 or greater) features and smaller dimension (e.g., 7 nm node and below) devices. The embodiments described herein are compatible with current carbon hardmask process integration schemes. Thus, the introduction of the present methods into existing device manufacturing lines does not require substantial modifications to upstream or downstream processing methods or associated equipment.

[0054]

[0056] While the forgoing is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, which scope is determined by the following claims.

Claims

1. 1. A method of processing a substrate, comprising: exposing the substrate positioned in a processing region of a processing chamber to a hydrocarbon-containing gas mixture; exposing the substrate to a boron-containing gas mixture, wherein the hydrocarbon-containing gas mixture and the boron-containing gas mixture are flowed into the processing region at a precursor ratio of (boron-containing gas mixture / ((boron-containing gas mixture)+hydrocarbon-containing gas mixture)) of about 0.38 to about 0.85; generating a radio frequency (RF) plasma in the processing region to deposit a boron-carbon film on the substrate, the boron-carbon film having about 55 atomic percent to about 75 atomic percent boron and less than 10 atomic percent hydrogen; A method comprising:

2. The method of claim 1 , wherein the hydrocarbon-containing gas mixture comprises an alkane.

3. The hydrocarbon-containing gas mixture is propylene (C ３ H ６ 3. The method of claim 2, comprising:

4. The boron-containing gas mixture may comprise hydrogen gas (H ２ About 9 weight percent (wt%) diborane (B ２ H ６ 10. The method of claim 1, comprising:

5. 10. The method of claim 1, wherein the ratio of the hydrocarbon-containing gas mixture to the boron-containing gas mixture ranges from about 0.07:1 to about 0.12:

1.

6. 10. The method of claim 1, wherein generating the RF plasma comprises applying a high frequency of about 12 MHz to about 14 MHz and a low frequency of about 0.1 kHz to about 1 kHz.

7. 7. The method of claim 6, wherein the high and low frequencies are applied at a power level of about 50 W to about 2500 W.

8. 1. A method of processing a substrate, comprising: exposing the substrate positioned in a processing region of a processing chamber to a hydrocarbon-containing gas mixture; exposing the substrate to a boron-containing gas mixture, wherein the hydrocarbon-containing gas mixture and the boron-containing gas mixture are flowed into the processing region at a precursor ratio of (boron-containing gas mixture / ((boron-containing gas mixture)+hydrocarbon-containing gas mixture)) of about 0.38 to about 0.85; generating a radio frequency (RF) plasma in the processing region to deposit a boron-carbon film on the substrate, the boron-carbon film having about 35 atomic percent to about 55 atomic percent boron and less than 10 atomic percent hydrogen; A method comprising:

9. 10. The method of claim 8, wherein generating the RF plasma comprises applying a high frequency of about 12 MHz to about 14 MHz and a low frequency of about 0.1 kHz to about 1 kHz.

10. 10. The method of claim 9, wherein the high and low frequencies are applied at a power level of about 50 W to about 2500 W.

11. The method of claim 8 , wherein the substrate is affixed to an electrostatic chuck (ESC).

12. 1. A non-transitory computer-readable medium, comprising: exposing a substrate positioned in a processing region of a processing chamber to a hydrocarbon-containing gas mixture; exposing the substrate to a boron-containing gas mixture, wherein the hydrocarbon-containing gas mixture and the boron-containing gas mixture are flowed into the processing region at a precursor ratio of (boron-containing gas mixture / ((boron-containing gas mixture)+hydrocarbon-containing gas mixture)) of about 0.38 to about 0.85; generating a radio frequency (RF) plasma in the processing region to deposit a boron-carbon film on the substrate, the boron-carbon film having about 55 atomic percent to about 95 atomic percent boron and less than 10 atomic percent hydrogen; A non-transitory computer-readable medium comprising program instructions for causing a computer to perform a method comprising:

13. 13. The non-transitory computer-readable medium of claim 12, wherein the hydrocarbon-containing gas mixture comprises an alkane.

14. The boron-containing gas mixture may comprise hydrogen gas (H ２ About 9 weight percent (wt%) diborane (B ２ H ６ 13. The non-transitory computer-readable medium of claim 12, comprising:

15. 13. The non-transitory computer-readable medium of claim 12, wherein the ratio of the hydrocarbon-containing gas mixture to the boron-containing gas mixture is in a range from about 0.07:1 to about 0.12:

1.

16. 10. The method of claim 1, wherein the pressure in the processing region is between 2 Torr and 10 Torr.

17. The method of claim 1 , wherein the substrate is maintained at a temperature of from about 450° C. to about 650° C.

18. The boron-containing gas mixture may comprise hydrogen gas (H ２ About 9 weight percent (wt%) diborane (B ２ H ６ 9. The method of claim 8, comprising:

19. 9. The method of claim 8, wherein the ratio of the hydrocarbon-containing gas mixture to the boron-containing gas mixture ranges from about 0.07:1 to about 0.12:

1.

20. The hydrocarbon-containing gas mixture is propylene (C ３ H ６ 13. The non-transitory computer-readable medium of claim 12, comprising:

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