Wafer rotation holding device

Abstract

To provide a wafer rotation holding device that can flexibly deal with a change in the size of a wafer, improves workability and reduces facility cost, and allows a cost reduction.SOLUTION: A wafer rotation holding device has: wafer rotation driving means 14 that is attached to a device body 11 and supplies a driving force to horizontally rotate a wafer; at least a pair of attachment units 13 that are replaceably arranged at positions facing each other with a substantial center O of a prescribed position therebetween; and coupling means 21 that detachably couples between the wafer rotation driving means 14 and the attachment units 13. The pair of attachment units 13 include a plurality of rotary tops 24 that are arranged at positions extending in a radiation direction from the substantial center O of the prescribed position and rotatably support the contour part of the wafer, and power transmission mechanisms 23A, 23B that transmit a rotational driving force from a motor for driving 20 to at least one or more rotary tops 24.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a wafer rotation and holding device, and more particularly to a wafer rotation and holding device that can flexibly accommodate changes in wafer size. [Background technology]

[0002] Conventionally, in a semiconductor device manufacturing process, after a semiconductor wafer (hereinafter simply referred to as a "wafer") is ground, the ground surface is cleaned to remove contamination (foreign matter, commonly referred to as "contamination") adhering to the ground surface of the wafer (see, for example, Patent Document 1). Furthermore, wafers with different outer diameters, such as 4 inches, 6 inches, and 8 inches, are now available and in use.

[0003] In addition, in the wafer cleaning process shown in Patent Document 1, a plurality of rotating tops are provided around a specified location where the wafer is placed, which abut against the outer edge of the wafer to hold the wafer horizontally and rotate the wafer horizontally, and the wafer is rotated integrally with the rotating tops with its top and bottom surfaces open, and a fluid mist is sprayed onto both the top and bottom of the rotating wafer to simultaneously clean both the top and bottom of the wafer. The multiple rotating tops are each attached to a rotating shaft connected to a drive motor so that they can rotate integrally, and the attachment position of each rotating top is fixed.

[0004] Furthermore, when cleaning wafers of different outer sizes, the wafer cleaning device shown in Patent Document 1 stops the production line and adjusts the position of the rotating top, etc., to the size of the wafer to be used by shifting the position of the rotating top radially from approximately the center of the specified position where the wafer is placed, or by replacing the cleaning device itself with a device that corresponds to the size of the wafer. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-103704 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in a cleaning apparatus with a fixed mounting position for the rotating top, such as the cleaning apparatus described in Patent Document 1, when the wafer size changes, it is necessary to change the positions and replace various components, such as the upper and lower brush units, the rotating top, and the rotating shaft. As a result, replacing and adjusting these components takes a lot of time (usually about a week), resulting in poor workability.

[0007] Furthermore, when a plurality of devices corresponding to different wafer sizes are prepared, the cost of the equipment becomes high, which is a problem in that costs increase.

[0008] Therefore, a technical problem arises that must be solved in order to realize a wafer rotation and holding device that can flexibly respond to changes in wafer size, improves workability, reduces equipment costs, and enables cost reduction, and the present invention aims to solve this problem. [Means for solving the problem]

[0009] The present invention has been proposed to achieve the above object, and the invention described in claim 1 is a wafer rotation holding device that rotatably holds a wafer at a specified position based on the outer shape of the wafer, the device comprising: a device main body; and a device attached to the device main body that supplies a driving force for horizontally rotating the wafer. A pair of a wafer rotation drive means; at least one pair of attachment units that are interchangeably arranged at positions facing each other across the approximate center of the specified position; A pair of Wafer rotation drive means eachand the attachment unit, each of the pair of attachment units having a plurality of rotating tops that are respectively arranged at positions extending radially from approximately the center of the specified position and that rotatably support the outer portion of the wafer, and a power transmission mechanism that transmits driving force from the wafer rotation drive means to at least one of the rotating tops.

[0010] According to this configuration, attachment units corresponding to wafer sizes are prepared in advance. When changing wafer sizes, the attachment units corresponding to the wafer sizes are detachably connected to the wafer rotation drive means via coupling means. Then, simply by changing the attachment units, the rotation holding device can be changed to one corresponding to the wafer size.

[0011] The invention described in claim 2 provides a wafer rotation holding device in the configuration described in claim 1, wherein the coupling means comprises a first rotating body having a recess, and a second rotating body having a protrusion that is detachably fitted into the recess and rotates integrally with the first rotating body, and the rotation of the wafer rotation driving means is transmitted to the power transmission mechanism via the connection between the first rotating body and the second rotating body.

[0012] According to this configuration, when the recess of the first rotating body and the protrusion of the second rotating body in the coupling means are fitted and engaged with each other, the driving force of the wafer rotation driving means on the device main body side is transmitted to the power transmission mechanism on the attachment unit side via the connection between the first rotating body and the second rotating body, so that the driving force of the wafer rotation driving means can rotate the rotating top, and the frictional force generated between the rotating top and the wafer can rotate the wafer horizontally together with the rotating top.

[0013] The invention as set forth in claim 3 is the configuration as set forth in claim 1 or 2, wherein A pair of Wafer rotation drive means At least one of teeth, The one wafer rotation drive means The attachment unitThe present invention provides a wafer rotation holding device further comprising an orientation adjusting means for adjusting the orientation of the wafer in a direction around the axis.

[0014] According to this configuration, when the orientations of a pair of attachment units positioned directly opposite each other across approximately the center of a specified position are misaligned, the misalignment of the orientations of the pair of attachment units can be easily adjusted by adjusting the orientation of at least one of the attachment units in the direction around the axis.

[0015] The invention as set forth in claim 4 is the configuration as set forth in any one of claims 1 to 3, wherein A pair of Wafer rotation drive means At least one of teeth, The one wafer rotation drive means The attachment unit The wafer rotation holding device further includes height adjusting means for adjusting the height position of the wafer in the vertical direction.

[0016] According to this configuration, when the height positions of a pair of attachment units placed directly opposite each other across approximately the center of the specified position are misaligned, the misalignment in the height positions of the pair of attachment units can be easily adjusted by adjusting the height position of at least one of the attachment units in the vertical direction.

[0017] The invention described in claim 5 is the configuration described in any one of claims 1 to 4, The pair of wafer rotation drive means corresponds to the attachment unit arranged on the side where the wafer is carried in and out to the specified position. The wafer rotation drive means ,before The wafer rotation holding device is provided with a lifting means that can move and retract the attachment unit to a lower position where it does not interfere with the loading and unloading of the wafer.

[0018] According to this configuration, when the wafer is loaded or unloaded to a specified position, the attachment unit is moved and retracted to a lower position where it does not interfere with the loading or unloading of the wafer, thereby enabling the wafer to be loaded or unloaded safely and quickly.

[0019] The invention described in claim 6 provides a wafer rotation and holding device having the configuration described in any one of claims 1 to 5, further comprising position adjustment means that can move and adjust the position of at least one of the plurality of rotating tops of the pair of attachment units to match the diameter of the wafer.

[0020] With this configuration, when a pair of attachment units are attached and there is a misalignment between the rotating top and the outer diameter of the wafer placed at a specified position, the position of the rotating top can be easily aligned with the outer diameter of the wafer by adjusting the position of the rotating top in a radial direction from approximately the center of the specified position using the position adjustment means, thereby improving workability.

[0021] The invention described in claim 7 provides a wafer rotation and holding device having the configuration described in any one of claims 1 to 6, wherein at least one of the plurality of rotating tops of the pair of attachment units is a floating rotating top that is disconnected from the power transmission mechanism, and further comprising a rotation detection sensor that detects the rotation of the floating rotating top.

[0022] The invention described in claim 8 provides a wafer rotation and holding device having the configuration described in any one of claims 1 to 6, further comprising an adjustment jig for adjusting the facing orientation and height position of the pair of attachment units.

[0023] With this configuration, the orientation and height position of a pair of attachment units can be easily determined by using the adjustment jig, and by fixing the pair of attachment units in this state, the pair of attachment units can be installed with the correct orientation and height.

[0024] The invention of claim 9 provides a wafer rotation holding device, wherein in the configuration of any one of claims 1 to 8, the wafer rotation drive means further comprises a rotation labyrinth that seals the processing water for the wafer from entering the interior of the wafer rotation drive means when the wafer rotation drive means rotates, and a swing labyrinth that seals the processing water for the wafer from entering the interior of the wafer rotation drive means when the wafer rotation drive means swings, each arranged around the axis of the wafer rotation drive means.

[0025] According to this configuration, the labyrinth, which is a component that seals around the main rotating shaft that transmits the rotation of the motor to prevent foreign matter from entering the lubricating oil for bearings, gears, etc., or to prevent lubrication leakage, is divided into two components, a rotating labyrinth and an oscillating labyrinth, and each is placed around the main rotating shaft. This allows the labyrinth to be made smaller, contributing to the miniaturization of the entire device. [Effects of the Invention]

[0026] According to the present invention, a plurality of attachment units corresponding to different wafer sizes are prepared, and when changing wafer sizes, an attachment unit corresponding to the wafer size is attached to the wafer rotation drive means via the coupling means, and the rotation holding device can be easily changed to suit the wafer size simply by replacing the attachment unit, which is expected to improve workability. [Brief explanation of the drawings]

[0027] [Figure 1] 1A shows a wafer rotating / holding device as an example of an embodiment of the present invention, in which (A) is a plan view of the rotating / holding device, (B) is a side view showing the state in which the wafer outer shape is placed between opposing rotating tops at a location corresponding to line BB in (A), and (C) is a side view of the rotating top used in the same rotating / holding device. [Figure 2] FIG. 2 is a perspective view showing the rotation holding device in a state before a wafer is carried in. [Figure 3]FIG. 2 is an exploded perspective view of the rotation holding device as viewed from above with a pair of attachment units removed. [Figure 4] FIG. 2 is a perspective view of the rotation holding device as viewed from below before a pair of attachment units are attached. [Figure 5] 4A and 4B show a pair of attachments in the rotation holding device, in which FIG. 4A is a perspective view of a first attachment unit as seen from below, and FIG. 4B is a perspective view of a second attachment unit as seen from below. [Figure 6] 1A and 1B are diagrams illustrating the centering mechanism in the wafer rotation holding device, in which (A) is an oblique view showing the state before centering, (B) is an oblique view showing the state after the first centering jig is attached, (C) is an oblique view showing the state after the second centering jig is attached, (D) is an oblique view showing the height adjustment mechanism, and (E) is an oblique view showing the rotation direction adjustment mechanism. [Figure 7] 1A and 1B are perspective views showing the peripheral structure of a rotation detection sensor in the wafer rotation holding device, in which FIG. 1A is a perspective view showing the rotation detection sensor in an installed state, and FIG. 1B is a perspective view showing the rotation detection sensor in an exploded state. [Figure 8] FIG. 4 is a side view illustrating a labyrinth structure in the rotation holding device. DETAILED DESCRIPTION OF THE INVENTION

[0028] In order to achieve the object of the present invention to provide a wafer rotational holding device that can flexibly accommodate changes in wafer size, improves workability, reduces equipment costs, and enables cost reduction, the present invention provides a wafer rotational holding device that rotatably holds a wafer at a specified position based on the outer shape of the wafer, and includes an apparatus main body, a wafer rotation drive means attached to the apparatus main body and supplying a drive force to rotate the wafer horizontally, at least one pair of attachment units that are interchangeably arranged at positions facing each other across approximately the center of the specified position, and coupling means that detachably connects the wafer rotation drive means and the attachment units in an interchangeable manner, wherein the pair of attachment units each include a plurality of rotating tops that are respectively arranged at positions extending radially from the approximate center of the specified position and rotatably support the outer shape of the wafer, and a power transmission mechanism that transmits the rotational drive force from the wafer rotation drive means to at least one of the rotating tops. [Example]

[0029] An embodiment of the present invention will be described in detail below with reference to the accompanying drawings. In the following embodiment, when the number, value, amount, range, etc. of components is mentioned, the number is not limited to the specific number, and may be more or less than the specific number, unless otherwise specified or when it is clearly limited to a specific number in principle.

[0030] Furthermore, when referring to the shape or positional relationship of components, etc., it includes things that are substantially similar or approximate to those shapes, etc., unless otherwise specified or when it is clearly considered otherwise in principle.

[0031] In addition, the drawings may exaggerate characteristic parts to make the features easier to understand, and the dimensional proportions of the components may not be the same as in reality. In addition, in cross-sectional views, hatching of some components may be omitted to make the cross-sectional structure of the components easier to understand.

[0032] In the following description, expressions indicating directions such as up, down, left, and right are not absolute, but are appropriate when each part of the wafer rotation holding device of the present invention is in the posture depicted, but if the posture changes, they should be interpreted accordingly. Furthermore, the same symbols are used for the same elements throughout the description of the embodiments.

[0033] 1 to 4 show the overall configuration of a wafer rotational holding device 10 (hereinafter simply referred to as "rotational holding device 10") according to the present invention. In FIG. 1A, (A) is a plan view of the rotational holding device 10, (B) is a side view showing a state in which the outer shape of a wafer W is placed between opposing rotational tops 24 at a location corresponding to line BB in (A), and (C) is a side view of the rotational top 24 used in the rotational holding device 10. FIG. 2 is a perspective view showing the rotational holding device 10 before a wafer W is loaded, FIG. 3 is a perspective view of the rotational holding device 10 from above with a pair of attachment units 13 removed, and FIG. 4 is a perspective view of the rotational holding device 10 from below with a pair of attachment units 13 not attached. The wafers W may have diameters of, for example, 4 inches, 6 inches, or 8 inches. The rotational holding device 10 can accommodate wafers W of different diameters by replacing a pair of attachment units 13, which will be described later.

[0034] 1 to 4, a rotational holding device 10 is provided in a loading / unloading section of a semiconductor manufacturing apparatus where a wafer W as an object to be processed is loaded and unloaded by a robot (not shown). The rotational holding device 10 has an apparatus main body 11 fixedly installed in the loading / unloading section. A wafer rotational holding means 14 is attached to the apparatus main body 11.

[0035] As shown in Figures 2 and 4, the wafer rotating and holding means 14 is composed of a first wafer rotating and holding means 14A and a second wafer rotating and holding means 14B, which are disposed at positions directly opposite each other across the center O of a specified position on the apparatus body 11 shown in Figure 1(A) where the wafer W is placed. Unless there is a need to specify their positions, the first wafer rotating and holding means 14A and the second wafer rotating and holding means 14B will be described as a pair of wafer rotating and holding means 14 without distinguishing between the first wafer rotating and holding means 14A and the second wafer rotating and holding means 14B. Therefore, in the following description, when a description is made of a pair of wafer rotating and holding means 14, it should be understood that both the first wafer rotating and holding means 14A and the second wafer rotating and holding means 14B are being described.

[0036] Each of the pair of wafer rotating and holding means 14 has a cylindrical support 15. Each support 15 penetrates the apparatus body 11 from top to bottom and is held vertically by the apparatus body 11. The support 15 on the first wafer rotating and holding means 14A side is attached to the apparatus body 11 via a flange 15A and a fixing bolt 29 serving as an orientation adjustment means. The support 15 on the first wafer rotating and holding means 14A side can be rotated around its own axis by loosening the fixing bolt 29, thereby adjusting the orientation of a unit mounting member 17 (described later). The support 15 on the second wafer rotating and holding means 14B side is attached so that it can be moved vertically, i.e., up and down, relative to the apparatus body 11, via a rack mechanism 16 serving as an elevation means. On the upper side of the apparatus body 11, unit mounting members 17 are fixed to the support 15 at the upper ends of the support 15 of the first wafer rotating and holding means 14A and the second wafer rotating and holding means 14B, respectively. The upper portion of the unit mounting member 17 is bent horizontally to form a pair of unit mounting seats 17A and a pair of unit mounting seats 17B. The pair of unit mounting seats 17A on the first wafer rotating and holding means 14A side and the pair of unit mounting seats 17B on the second wafer rotating and holding means 14B side are positioned approximately symmetrically with respect to the center O of the specified position. Each of the unit mounting seats 17A and 17B is provided with a screw hole 18 for fixing that penetrates vertically.

[0037] Rotating shafts 19 are rotatably disposed within the support columns 15 of the pair of wafer rotating and holding means 14, penetrating the support columns 15. A drive motor 20 serving as a wafer rotation drive means is attached to the lower end of each rotating shaft 19. The drive force of the drive motor 20 is applied to each rotating shaft 19, causing each rotating shaft 19 to rotate at a predetermined speed. A lower coupling member 21A, serving as a first rotating body constituting a coupling means 21 (described later), is attached to the upper end of each rotating shaft 19, positioned approximately in the center of the unit mounting member 17 and protruding vertically upward from the upper surface of the unit mounting member 17. The height of the lower coupling member 21A is set equal to or slightly lower than the height of the pair of unit mounting seat legs 17B. The lower coupling member 21A rotates integrally with the rotating shaft 19. A pair of coupling recesses 21C are formed in the lower coupling member 21A, slit-shaped and extending downward from the upper surface to the outer surface.

[0038] The pair of attachment units 13 consists of a first attachment unit 13A that is detachably and replaceably attached to the upper end of the first wafer rotating and holding means 14A, and a second attachment unit 13B that is detachably and replaceably attached to the upper end of the second wafer rotating and holding means 14B. FIG. 5A shows a perspective view of the first attachment unit 13A, and FIG. 5B shows a perspective view of the second attachment unit 13B, both viewed from the bottom. Unless there is a need to specify their positions, the first attachment unit 13A and the second attachment unit 13B will be referred to as a pair of attachment units 13 without distinction. Therefore, in the following description, when a pair of attachment units 13 is described, it should be understood that both the first attachment unit 13A and the second attachment unit 13B are being described.

[0039] 1 to 4, and also FIG. 5, the configuration of the pair of attachment units 13 will be described, starting with the configuration of the first attachment unit 13A. The first attachment unit 13A has a base plate 22A fixed to the unit mounting seat leg 17A with a fixing bolt 25, and the second attachment unit 13B has a base plate 22B fixed to the unit mounting seat leg 17B with a fixing bolt 25. The base plate 22A has mounting holes (not shown) at positions corresponding to the screw holes 18 of the unit mounting seat legs 17A of the unit mounting member 17, for fixing the base plate 22A to the unit mounting seat legs 17A by screwing fixing bolts 25 into the screw holes 18 from the front (top) side of the base plate 22A, and the base plate 22B has mounting holes (not shown) at positions corresponding to the screw holes 18 of the unit mounting seat legs 17B of the unit mounting member 17, for fixing the base plate 22B to the unit mounting seat legs 17B by screwing fixing bolts 25 into the screw holes 18 from the front side of the base plate 22B.

[0040] A power transmission mechanism 23A having an upper coupling member 21B that is detachably directly connected to the lower coupling member 21A of the first wafer rotating and holding means 14A is provided on the back (lower) side of the base plate 22A, and a power transmission mechanism 23B having an upper coupling member 21B as a second rotating body that is detachably directly connected to the lower coupling member 21A as a first rotating body of the second wafer rotating and holding means 14B is provided on the back (lower) side of the base plate 22B. On the other hand, a plurality of rotating tops 24 (in this embodiment, three rotating tops 24: a first rotating top 24A1, a second rotating top 24A2, and a third rotating top 24A3) are provided on the surface (top) side of the base plate 22A, and a plurality of rotating tops 24 (in this embodiment, three rotating tops 24: a fourth rotating top 24B4, a fifth rotating top 24B5, and a sixth rotating top 24B6) are provided on the surface (top) side of the base plate 22B.

[0041] The power transmission mechanism 23A has a first spur gear 23A1 disposed at a position corresponding to the lower coupling member 21A when the base plate 22A is fixed to the unit mounting seat leg 17A with fixing bolts 25, a second spur gear 23A2 and a third spur gear 23A3 meshed with the first spur gear 23A1, a fourth spur gear 23A4 meshed with the second spur gear 23A2, and a fifth spur gear 23A5 meshed with the third spur gear 23A3. The first spur gear 23A1, second spur gear 23A2, third spur gear 23A3, fourth spur gear 23A4, and fifth spur gear 23A5 are each rotatably attached to the base plate 22A. Additionally, an upper coupling member 21B having a connecting protrusion 21D that can be detachably fitted into the connecting recess 21C of the lower coupling member 21A is provided on the underside of the first spur gear 23A1. When the base plate 22A of the upper coupling member 21B of the first wafer rotation holding means 14A is fixed in a predetermined state to the unit mounting seat leg 17A with the fixing bolt 25, the connecting protrusion 21D is fitted into the connecting recess 21C, thereby establishing a coupling connection by the coupling means 21 and transmitting the rotation of the rotary shaft 19 to the first spur gear 23A1, thereby rotating the first spur gear 23A1.

[0042] The rotation axes of the first spur gear 23A1, the second spur gear 23A2, and the third spur gear 23A3 each penetrate the base plate 22A and protrude to the upper surface side of the base plate 22A. On the upper surface side of the base plate 22A, a first rotating top 24A1 is fixed to the same rotation axis 26A1 as the first spur gear 23A1 so as to be integrally rotatable, and further, a second rotating top 24A2 is fixed to the same rotation axis 26A2 as the second spur gear 23A2, and a third rotating top 24A3 is fixed to the same rotation axis 26A3 as the third spur gear 23A3 so as to be integrally rotatable. Furthermore, when the base plate 22A is fixed to the unit mounting seat legs 17A with the fixing bolts 25, the first rotating top 24A1, the second rotating top 24A2, and the third rotating top 24A3 are disposed in positions that contact the outer periphery of the wafer W when the wafer W is placed at a specified position on the apparatus body 11 shown in FIG. 1A. Among the first rotating top 24A1, the second rotating top 24A2, and the third rotating top 24A3, the middle first rotating top 24A1 can be moved and adjusted in the radial direction from the center O of the specified position on the apparatus body 11 shown in FIG. 1A by temporarily loosening the tightening force of the adjustment screw 28A serving as a position adjustment means. This movement adjustment absorbs manufacturing errors between the wafer W and the rotating top 24.

[0043] Next, the configuration of the second attachment unit 13B will be described. When the base plate 22B is fixed to the unit mounting seat leg 17B with fixing bolts 25, the power transmission mechanism 23B includes a sixth spur gear 23B6 positioned corresponding to the lower coupling member 21A, a seventh spur gear 23B7 meshed with the sixth spur gear 23B6, an eighth spur gear 23B8 meshed with the seventh spur gear 23B7, and a ninth spur gear 23B9, which is a floating spur gear that is not meshed with any gears. The sixth spur gear 23B6, the seventh spur gear 23B7, the eighth spur gear 23B8, and the ninth spur gear 23B9 are each rotatably attached to the base plate 22B. The sixth spur gear 23B6 is provided on its underside with an upper coupling member 21B having a connecting protrusion 21D that can be detachably fitted into the connecting recess 21C of the lower coupling member 21A. When the base plate 22B of the upper coupling member 21B of the second wafer rotating and holding means 14B is fixed in a predetermined state to the unit mounting seat leg 17A with the fixing bolt 25, the connecting protrusion 21D is fitted into and engaged with the connecting recess 21C, thereby establishing a coupling connection by the coupling means 21, and the rotation of the rotating shaft 19 side can be transmitted to the sixth spur gear 23B6, causing the sixth spur gear 23B6 to rotate.

[0044] Additionally, the rotation shafts 26B6, 26B8, and 26B9 of the sixth spur gear 23B6, eighth spur gear 23B8, and ninth spur gear 23B9 each penetrate the base plate 22B and protrude to the upper surface side of the base plate 22B. On the upper surface side of the base plate 22B, a fourth rotating top 24B4 is fixed to the rotation shaft 26B6 that is the same as the sixth spur gear 23B6 so as to be rotatable together, and further, a fifth rotating top 24B5 is fixed to the rotation shaft 26B8 that is the same as the eighth spur gear 23B8, and a sixth rotating top 24B6 is fixed to the rotation shaft 26B9 that is the same as the ninth spur gear 23B9 so as to be rotatable together. Furthermore, the fourth rotating top 24B4, fifth rotating top 24B5, and sixth rotating top 24B6 are disposed at positions that contact the outer periphery of the wafer W when the wafer W is placed at a specified position on the apparatus body 11 shown in Fig. 1A in a state where the base plate 22B is fixed to the unit mounting seat legs 17B with the fixing bolts 25. Of the fourth rotating top 24B4, fifth rotating top 24B5, and sixth rotating top 24B6, the middle fourth rotating top 24B4 can be moved and adjusted in a radial direction relative to the center O of the specified position on the apparatus body 11 shown in Fig. 1A by temporarily loosening the fastening force of an adjusting screw 28B serving as a position adjusting means.

[0045] The first rotating top 24A1, the second rotating top 24A2, the third rotating top 24A3, the fourth rotating top 24B4, the fifth rotating top 24B5, and the sixth rotating top 24B6 are all formed as rotating tops 24 having substantially the same shape and structure. To explain the shape and structure of the rotating tops 24, as shown in FIG. 1C, the rotating tops 24 have a circumferential groove 27 on their outer periphery that has a substantially V-shaped cross section. The outer diameter of a lower groove surface 27A of the circumferential groove 27 is larger than the outer diameter of an upper groove surface 27B. When a wafer W is placed at a predetermined position on the apparatus body 11 as shown in FIG. 1A, the six rotating tops 24 are configured so that the groove surfaces 27A of the circumferential grooves 27 of each rotating top 24 can receive and hold the lower outer peripheral surface of the wafer W, as shown in FIG. 1B. Furthermore, when the rotating top 24 rotates in the same direction, the frictional force between the rotating top 24 and the wafer W causes the rotating top 24 to rotate and feed the wafer W, so that the wafer W rotates horizontally with the center O as approximately the rotation fulcrum.

[0046] The rotational holding device 10 of this embodiment can use not only one type of attachment unit 13, but also three types, for example, an attachment unit 13 for a 4-inch diameter, an attachment unit 13 for a 6-inch diameter, and an attachment unit 13 for an 8-inch diameter, depending on the size of the wafer W. By changing the attachment unit 13 depending on the size of the wafer W, the same rotational holding device 10 can be used. That is, the upper coupling member 21B of each of the attachment units 13 for the 4-inch diameter, the 6-inch diameter, and the 8-inch diameter is matched to the lower coupling member 21A. When the upper coupling member 21B of the attachment unit 13 corresponding to the size to be used is matched to the lower coupling member 21A on the device main body 11 and the coupling protrusion 21D is fitted and engaged with the coupling recess 21C, power is coupled between the rotary shaft 19 rotated by the drive motor 20 and the power transmission mechanisms 23A and 23B on the attachment unit 13 side. The rotation of the rotary shaft 19 can be transmitted to the power transmission mechanisms 23A and 23B, respectively, to rotate the rotary top 24 of the replaced attachment unit 13 at a rotational speed corresponding to the rotation of the rotary shaft 19. After the upper coupling member 21B and the lower coupling member 21A are connected, they are integrated by fixing the unit mounting seat leg 17A and the base plate 22A, and the unit mounting seat leg 17B and the base plate 22B, respectively, with fixing bolts 25.

[0047] On the other hand, the replaced attachment unit 13 is configured such that the positions of the first rotating top 24A1, the second rotating top 24A2, the third rotating top 24A3, the fourth rotating top 24B4, the fifth rotating top 24B5, and the sixth rotating top 24B6 correspond to the diameter of the wafer W. That is, in the case of a 4-inch attachment unit 13, when it is attached via the coupling means 21, the first rotating top 24A1, the second rotating top 24A2, the third rotating top 24A3, the fourth rotating top 24B4, the fifth rotating top 24B5, and the sixth rotating top 24B6 are each disposed at a position corresponding to the outer diameter of the 4-inch wafer W. In the case of the 6-inch attachment unit 13, when it is attached via the coupling means 21, the first rotating top 24A1, the second rotating top 24A2, the third rotating top 24A3, the fourth rotating top 24B4, the fifth rotating top 24B5, and the sixth rotating top 24B6 are each positioned at a position corresponding to the outer diameter of a 6-inch wafer W. In the case of the 8-inch attachment unit 13, when it is attached via the coupling means 21, the first rotating top 24A1, the second rotating top 24A2, the third rotating top 24A3, the fourth rotating top 24B4, the fifth rotating top 24B5, and the sixth rotating top 24B6 are each positioned at a position corresponding to the outer diameter of an 8-inch wafer W. Note that, although the present embodiment has been described with respect to cases where the diameters of the wafers W are 4 inches, 6 inches, and 8 inches, wafers W of other sizes can also be accommodated.

[0048] Therefore, in the rotation holding device 10 of this embodiment, when wafers W of different sizes are to be handled, the coupling means 21 is standardized, so that the same device can be used continuously and work can be performed immediately by replacing the attachment unit 13 with one that matches the size of the wafer W. This improves workability and also contributes to improving productivity.

[0049] In the rotational holding device 10 of this embodiment, before attaching the pair of attachment units 13, the pair of wafer rotational holding means 14 are aligned (centering adjustment) on the device main body 11, that is, the orientation and height adjustment of the unit mounting seat legs 17A of the first wafer rotational holding means 14A and the orientation and height adjustment of the unit mounting seat legs 17B of the second wafer rotational holding means 14B are performed.

[0050] Next, the centering operation will be described with reference to FIG. 6. The centering operation is performed using an adjustment jig consisting of a pair of first jigs 51 shown in FIG. 6C and a second jig 52 arranged across the pair of first jigs 51. During the centering operation, the fastening bolts 29 fastening the flange 15A of the support 15 on the side of the first wafer rotating and holding means 14A shown in FIG. 6E, which is fixed to the back side (lower side) of the apparatus main body 11, are loosened. Then, the support 15 together with the unit mounting member 17 is rotated around the axis of the support 15 to adjust the orientation of the unit mounting member 17. After the adjustment, the fastening bolts 29 are tightened and fixed again, thereby adjusting the orientation of the unit mounting member 17 to which the pair of attachment units 13 are attached. 6A to 6D, to adjust the height position of the unit mounting member 17, the fixing bolts 30 that fix the unit mounting seat legs 17A to the unit mounting member 17 on the first wafer rotating and holding means 14A side are loosened. Then, the height of the unit mounting seat legs 17A relative to the unit mounting member 17, i.e., the height position relative to the unit mounting seat legs 17B, is adjusted, and after adjustment, the fixing bolts 30 are tightened again to fix the unit mounting member 17 in place, thereby adjusting the height.

[0051] Next, the configuration and operation of the first jig 51 and the second jig 52 will be further described. The first jig is composed of a pair of jigs, namely, a first jig 51A that is attached to the unit mounting seat leg 17A and a first jig 51B that is attached to the unit mounting seat leg 17B. The first jig 51A has mounting holes 53 formed therein that correspond to a pair of screw holes 18 in the unit mounting seat leg 17A, and the first jig 51B has mounting holes 53 formed therein that correspond to a pair of screw holes 18 in the unit mounting seat leg 17B. In addition, the first jigs 51A and 51B have step portions 54 formed on their opposing surfaces by cutting out the first jigs 51A and 51B at approximately right angles from the top surface to the side surface. Prior to adjustment, the pair of first jigs 51A and 51B are placed on the unit mounting seat leg 17A with their step portions 54 facing each other and their mounting holes 53 aligned with the screw holes 18. Similarly, first jig 51A is placed on the unit mounting seat leg 17B, and similarly first jig 51B is placed on the unit mounting seat leg 17B. Furthermore, fixing bolts (not shown) are passed through the mounting holes 53 and screwed into the screw holes 18, respectively, to fix first jig 51A to unit mounting seat leg 17A and first jig 51B to unit mounting seat leg 17B. Figure 6(B) shows this state.

[0052] 6(C), the second jig 52 is a plate-like member arranged to straddle the step 54 of the first jig 51A attached to the unit mounting seat leg 17A and the step 54 of the first jig 51B attached to the unit mounting seat leg 17B. In addition, the second jig 52 is provided at both ends with step portions 55 that tightly engage with the step portions 54 of the first jig 51A.

[0053] When performing alignment adjustment, as shown in FIG. 6(C), the second jig 52 is placed between the step 54 of the first jig 51A attached to the unit mounting seat leg 17A and the step 54 of the first jig 51A attached to the unit mounting seat leg 17B, with the step 54 and the step 55 fitted and coupled to each other.

[0054] That is, with first jig 51A attached to unit mounting seat leg 17A and first jig 51B attached to unit mounting seat leg 17B, fixing bolt 29 serving as orientation adjustment means for fixing the rotation of support posts 15 of the first wafer rotating and holding means is loosened, and second jig 52 is placed across first jig 51A and first jig 51B, as shown in Fig. 6(C). Then, if the orientation of support posts 15 of first wafer rotating and holding means 14A is misaligned with the orientation of second wafer rotating and holding means 14B, support posts 15 of first wafer rotating and holding means 14A can be rotated about the axis to align the orientation of first wafer rotating and holding means 14A with the orientation of second wafer rotating and holding means 14B. Furthermore, by loosening fixing bolt 30, which serves as height adjustment means, the height position of unit mounting seat leg 17A of first wafer rotating and holding means 14A can be adjusted so that it becomes the same as the height of unit mounting seat leg 17B of second wafer rotating and holding means 14B. After adjustment, the adjusted state can be fixed by tightening fixing bolt 29 and fixing bolt 30, respectively, shown in FIG. 6. Therefore, by using first jig 51 and second jig 52, the orientations of first wafer rotating and holding means 14A and second wafer rotating and holding means 14B can be adjusted simultaneously, and the heights of unit mounting seat leg 17A of first wafer rotating and holding means 14A and unit mounting seat leg 17B of second wafer rotating and holding means 14B can be easily adjusted. In the above embodiment, only the first wafer rotating and holding means 14A is adjusted to match its orientation and height with the second wafer rotating and holding means 14B, but it goes without saying that the configuration may be such that not only the first wafer rotating and holding means 14A but also the orientation and height of the second wafer rotating and holding means 14B are adjusted simultaneously.

[0055] Furthermore, in the rotational holding device 10 of this embodiment, the first rotating top 24A1 and the fourth rotating top 24B4 can be adjusted by temporarily loosening the tightening force of the adjustment screws 28A and 28B serving as position adjustment means and moving their respective positions in the direction of arrow S in Figure 1(B) in a radial direction relative to the center O of a specified position on the device main body 11 shown in Figure 1(A).Therefore, slight positional misalignment between the outer peripheral edge of the wafer W and the lower groove surface 27A of the circumferential groove 27 on the rotating top 24 can be adjusted by moving the positions of the first rotating top 24A1 and the fourth rotating top 24B4 by a small amount, respectively, relative to the center O.

[0056] Furthermore, in the rotational holding device 10 of this embodiment, the support columns 15 on the second wafer rotational holding means 14B side, which is the side where the wafer W is loaded and unloaded, are configured to be movable up and down by a rack mechanism 16 serving as an elevating means, and are temporarily lowered together with the second attachment unit 13B to a position where they do not interfere with the loading and unloading of the wafer W, and are then raised to a predetermined position after the wafer W is loaded, thereby facilitating the loading and unloading of the wafer W, improving workability and contributing to improved productivity. Note that the elevating means is not limited to the rack mechanism 16, and any other structure, such as an electromagnetic mechanism, may be used as long as it is capable of vertically moving the support columns 15 together with the second attachment unit 13B.

[0057] In the rotational holding device 10 of this embodiment, the ninth spur gear 23B9 of the power transmission mechanism 23B of the second attachment unit 13B in the second wafer rotational holding means 14B is disposed as a floating spur gear that does not mesh with any gears. A sixth rotating top 24B6, which is a floating rotating top separated from the power transmission mechanism 23B, is fixed to a rotating shaft 26B9 of the ninth spur gear 23B9 so as to be rotatable integrally with the ninth spur gear 23B9. Furthermore, as shown in FIG. 7, a rotation detection sensor 32 is provided adjacent to the rotating shaft 26B9 of the sixth rotating top 24B6, in parallel with the rotating shaft 26B9. The rotation detection sensor 32 includes a magnet 32A embedded in a portion of the outer circumferential surface of the ninth spur gear 23B9, which rotates integrally with the sixth rotating top 24B6 and the rotating shaft 26B9, and a magnetic sensor 32B attached to the side of the base plate 22B adjacent to the ninth spur gear 23B9 with a mounting screw 56. The magnet 32A may be provided anywhere that rotates integrally with the sixth rotating top 24B, such as on the outer circumferential surface of the rotating shaft 26B9, instead of on the outer circumferential surface of the ninth spur gear 23B9. The magnetic sensor 32B also includes an antenna device 32C, which can transmit signals detected by the magnetic sensor 32B to an external device. The outer periphery of the magnetic sensor 32B is covered with a heat-shrinkable tube made of fluororesin. This tube is resistant to chemicals, such as cleaning water, in consideration of use in a cleaning process, such as a post-grinding process, for cleaning the ground surface of the wafer W to remove contamination adhering to the ground surface of the wafer W.

[0058] The function of the rotation detection sensor 32 in the rotation holding device 10 of this embodiment will be described. The rotation detection sensor 32 is for detecting whether the wafer W is placed at a predetermined position on the device main body 11. That is, when the wafer W is placed at a predetermined position on the device main body 11 as shown in FIG. 1A, the six rotating tops 24, namely, the first rotating top 24A1, the second rotating top 24A2, the third rotating top 24A3, the fourth rotating top 24B4, the fifth rotating top 24B5, and the sixth rotating top 24B6, support and hold the lower outer peripheral surface of the wafer W with the groove surface 27A of the circumferential groove 27 of each rotating top 24, as shown in FIG. 1B. When the rotating tops 24 rotate in the same direction, the frictional force between the rotating tops 24 and the wafer W causes the rotating tops 24 to rotate and feed the wafer W, and the wafer W rotates horizontally around the center O as a rotation fulcrum. Therefore, when the wafer W is placed at a predetermined position on the apparatus main body 11, the rotation of the rotary shaft 19 rotated by the drive motor 20 and the power transmission mechanisms 23A and 23B on the attachment unit 13 side causes all six rotary tops 24, namely the first rotary top 24A1, the second rotary top 24A2, the third rotary top 24A3, the fourth rotary top 24B4, the fifth rotary top 24B5, and the sixth rotary top 24B6, to rotate. Thus, the sixth rotary top 24B6, which has the magnet 32A embedded in its outer circumferential surface, rotates together with the magnet 32A, and a periodic signal (pulse signal) is obtained from the magnet sensor 32B and sent to the outside via the antenna device 32C. A control unit (not shown) that receives this signal determines that the wafer W is placed at a predetermined position on the apparatus main body 11.

[0059] On the other hand, when the wafer W is not positioned at the specified position on the apparatus main body 11, the rotation of the rotary shaft 19 rotated by the drive motor 20 and the power transmission mechanisms 23A and 23B on the attachment unit 13 side causes the five rotary tops 24 (first rotary top 24A1, second rotary top 24A2, third rotary top 24A3, fourth rotary top 24B4, and fifth rotary top 24B5) to rotate, but the floating sixth rotary top 24B6, which is disconnected from the power transmission mechanism 23B, does not rotate. In other words, because the rotary shaft 26B9 of the sixth rotary top 24B6, which has the magnet 32A embedded in its outer periphery, does not rotate, no periodic signal (pulse signal) is obtained from the magnet sensor 32B, and the control unit can determine that the wafer W is not positioned at the specified position on the apparatus main body 11. Therefore, the control unit stops the specified operation for the wafer W and instructs the necessary processing, thereby preventing unnecessary driving operations, such as spraying of a cleaning liquid, in advance.

[0060] Furthermore, when the rotational holding device 10 of this embodiment is used in a cleaning process or the like for cleaning the ground surface of the wafer W after grinding the wafer W to remove contamination adhering to the ground surface of the wafer W, it is known that a labyrinth is required to seal off the processing water that enters between the support columns 15 and the rotating shaft 19, and conversely, to seal off the processing water that passes between the support columns 15 and the rotating shaft 19 and blows into the rotational holding device 10. Furthermore, the labyrinth in the wafer rotational holding means 14 of the rotational holding device 10 requires an oscillation labyrinth that provides sealing during oscillation, and a rotation labyrinth that provides sealing during rotation. However, in conventional rotational holding devices, both the oscillation labyrinth and the rotation labyrinth are used, providing sealing at one location. However, in the rotation holding device 10 of this embodiment, the rotation labyrinth 41, which prevents treated water from flowing between the support 15 and the rotating shaft 19 when the rotating shaft 19 rotates, and the oscillation labyrinth 42, which prevents treated water from flowing between the support 15 and the rotating shaft 19 when the rotating shaft 19 oscillates, are formed separately and provided at different positions on the support 15 and the rotating shaft 19, thereby enabling the labyrinths to be made smaller. Figure 8(A) shows the positions at which the rotation labyrinth 41 and the oscillation labyrinth 42 are incorporated into the rotation holding device 10, and Figure 8(B) schematically illustrates the arrangement of the rotation labyrinth 41 and the oscillation labyrinth 42. The rotation labyrinth 41 and the oscillation labyrinth 42 are both formed as approximately tubular bodies and are arranged on the outer periphery of the support 15 and the outer periphery of the support 15, respectively, so as to prevent treated water from entering.

[0061] The present invention can be modified in various ways without departing from the spirit of the present invention, and it goes without saying that the present invention also covers such modifications. [Explanation of symbols]

[0062] 10: Rotation holding device 11: Device body 13: Attachment unit 13A: First attachment unit 13B: Second attachment unit 14: Wafer rotation and holding means 14A: First wafer rotating and holding means 14B: Second wafer rotating and holding means 15: Strut 15A: Flange 16: Rack mechanism (lifting means) 17: Unit mounting material 17A: Unit mounting base 17B: Unit mounting base 18: Screw hole 19: Rotation axis 20: Drive motor (wafer rotation drive means) 21: Coupling means 21A: Lower coupling member (first rotating body) 21B: Upper coupling member (second rotating body) 21C: Connection recess 21D: Connection protrusion 22A: Base plate 22B: Base plate 23A: Power transmission mechanism 23A1: 1st spur gear 23A2: 2nd spur gear 23A3: 3rd spur gear 23A4: 4th spur gear 23A5: 5th spur gear 23B: Power transmission mechanism 23B6: 6th spur gear 23B7: 7th spur gear 23B8: 8th spur gear 23B9: 9th spur gear 24: Spinning top 24A1: First rotating top 24A2: Second rotating top 24A3: 3rd rotating top 24B4: 4th spinning top 24B5: 5th spinning top 24B6: 6th spinning top (free-moving spinning top) 25: Fixing bolt 26A1: Rotating shaft 26A2: Rotating shaft 26A3: Rotating shaft 26B6: Rotating shaft 26B8: Rotating shaft 26B9: Rotating shaft 27: Circumferential groove 27A:Groove surface 27B:Groove surface 28A: Adjustment screw (position moving means) 28B: Adjustment screw (position moving means) 29: Fixing bolt (direction adjustment means) 30: Fixing bolt (height adjustment means) 32: Rotation detection sensor 32A: Magnet 32B: Magnet sensor 32C: Antenna device 41: Rotation labyrinth 42: Swing labyrinth 51: First jig (adjustment jig) 51A: First jig (adjustment jig) 51B: First jig 52: Second jig 53: Mounting hole 54 :Double part 55 :Double part O: Center S: Arrow W: Wafer

Claims

1. A wafer rotation holding device that rotatably holds a wafer at a specified position based on an outer shape of the wafer, A device body, a pair of wafer rotation drive means attached to the apparatus body and supplying a drive force for horizontally rotating the wafer; At least one pair of attachment units are interchangeably arranged at positions facing each other across approximately the center of the specified position; a coupling means for detachably connecting each of the pair of wafer rotation drive means and the attachment unit, The pair of attachment units include: a plurality of rotating tops arranged at positions extending radially from approximately the center of the specified position and rotatably supporting the outer portion of the wafer; a power transmission mechanism for transmitting a driving force from the wafer rotation drive means to at least one of the rotating tops, A wafer rotation and holding device characterized by the above.

2. 2. The wafer rotation and holding device according to claim 1, wherein the coupling means comprises a first rotating body having a recess, and a second rotating body having a protrusion that is detachably fitted into the recess and rotates integrally with the first rotating body, and the driving force of the wafer rotation driving means is transmitted to the power transmission mechanism via the connection between the first rotating body and the second rotating body.

3. At least one of the pair of wafer rotation drive means further includes an orientation adjustment means capable of adjusting the orientation of the attachment unit corresponding to the one wafer rotation drive means in a direction around an axis.

3. The wafer rotation and holding device according to claim 1 or 2.

4. At least one of the pair of wafer rotation drive means further includes height adjustment means for adjusting the height position of the attachment unit corresponding to the one wafer rotation drive means in the vertical direction.

4. The wafer rotation and holding device according to claim 1, wherein the wafer rotation and holding device is a wafer holding device.

5. Of the pair of wafer rotation drive means, the wafer rotation drive means corresponding to the attachment unit arranged on the side where the wafer is loaded / unloaded to / from the specified position is provided with a lifting means that can move / retract the attachment unit to a lower position that does not interfere with the loading / unloading of the wafer, 5. The wafer rotation and holding device according to claim 1.

6. a position adjusting means for adjusting the position of at least one of the plurality of rotating tops of the pair of attachment units to match the diameter of the wafer; 6. The wafer rotation and holding device according to claim 1, wherein the wafer rotation and holding device is a wafer holding device.

7. At least one of the rotating tops of the pair of attachment units is a free-floating rotating top separated from the power transmission mechanism, Further provided is a rotation detection sensor that detects the rotation of the floating rotating top.

7. The wafer rotation and holding device according to claim 1.

8. The apparatus further includes an adjustment jig for adjusting the facing direction and height position of the pair of attachment units.

8. The wafer rotation and holding device according to claim 1.

9. The wafer rotation drive means further comprises a rotation labyrinth that seals the processing water for the wafer from entering the interior of the wafer rotation drive means when the wafer rotation drive means rotates, and a swing labyrinth that seals the processing water for the wafer from entering the interior of the wafer rotation drive means when the wafer rotation drive means swings, both of which are arranged around the axis of the wafer rotation drive means.

9. The wafer rotation and holding device according to claim 1.

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