Pickup Stage

Abstract

To provide a pickup stage capable of separating a semiconductor chip from a pressure sensitive adhesive sheet as needed, while fixing the pressure sensitive adhesive sheet and the semiconductor chip.SOLUTION: A pickup stage 101 is used to separate a semiconductor chip 11 from a pressure sensitive adhesive sheet 10. The pickup stage 101 comprises a loading surface 1, an inclined plane 2, and a plurality of upthrust needles 4. The loading surface 1, which is loaded with the semiconductor chip 11 via the pressure sensitive adhesive sheet 10, has a plurality of first adsorption holes 6 capable of adsorbing a plurality of pinholes 5 and the pressure sensitive adhesive sheet 10. The inclined plane 2, which continues from the loading surface 1, is inclined with respect to the loading surface 1, and provided with a plurality of second adsorption holes 7 capable of adsorbing the pressure sensitive adhesive sheet 10. The plurality of upthrust needles 4 can protrude from the loading surface 1 through the plurality of pinholes 5. The plurality of upthrust needles 4 protrude from the loading surface 1 while the plurality of second adsorption holes 7 make the inclined plane 2 adsorb the pressure sensitive adhesive sheet 10.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a semiconductor chip pick-up stage. [Background technology]

[0002] In the assembly process of a semiconductor device, it is necessary to mount a semiconductor chip attached to an adhesive sheet on a stage, perform a predetermined process on the semiconductor chip, and then peel the semiconductor chip off the adhesive sheet and remove it.

[0003] Patent Document 1 describes a pickup device in which a lifting piece holds an adhesive sheet between the semiconductor chips and lifts them up, thereby peeling the semiconductor chips from the adhesive sheet. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 10-256349 Summary of the Invention [Problem to be solved by the invention]

[0005] In the pickup device of Patent Document 1, the push-up top is cylindrical, and the top end surface of the push-up top is formed with a push-up surface that is perpendicular to the cylindrical center and an inclined surface that is inclined relative to the cylindrical center. However, there is a problem in that neither the push-up surface nor the inclined surface has suction holes for fixing the adhesive sheet, making it impossible to fix the adhesive sheet and semiconductor chip.

[0006] The present disclosure has been made to solve the above-mentioned problems, and aims to provide a pickup stage that can fix an adhesive sheet and a semiconductor chip, while being able to peel the semiconductor chip from the adhesive sheet as needed. [Means for solving the problem]

[0007] The present disclosure In one embodiment The pickup stage is for peeling the semiconductor chip from the adhesive sheet. The pickup stage is equipped with a mounting surface on which the semiconductor chip is mounted via the adhesive sheet and which has a plurality of pinholes and a plurality of first suction holes capable of adsorbing the adhesive sheet, an inclined surface continuing from the mounting surface and inclined relative to the mounting surface and which has a plurality of second suction holes capable of adsorbing the adhesive sheet, and a plurality of push-up needles capable of protruding from the mounting surface through the plurality of pinholes. The plurality of second suction holes adsorb the adhesive sheet to the inclined surface, while the plurality of push-up needles protrude from the mounting surface. However, when the plurality of push-up needles protrude from the mounting surface, the plurality of first suction holes do not adsorb the adhesive sheet. . [Effects of the Invention]

[0008] According to the pickup stage of the present disclosure, the semiconductor chip can be fixed by fixing an adhesive sheet to the inclined surface through the plurality of second suction holes. Furthermore, by pushing up the adhesive sheet with the plurality of push-up needles while it is fixed to the inclined surface, the adhesive sheet is peeled off from the edge of the semiconductor chip. This allows the semiconductor chip to be peeled off from the adhesive sheet. [Brief explanation of the drawings]

[0009] [Figure 1] 2A and 2B are a top view and a side view of the pickup stage according to the first embodiment. [Figure 2] 1 is a side view showing a state in which a semiconductor chip is mounted on the pickup stage of the first embodiment. [Figure 3] 10 is a side view showing a state in which the push-up needles slightly protrude from the mounting surface of the pickup stage of the first embodiment and slightly push up the semiconductor chip. FIG. [Figure 4] 10 is a side view showing a state in which the push-up needles protrude largely from the mounting surface of the pickup stage of the first embodiment, pushing up the semiconductor chip largely, and causing the adhesive sheet to peel off from the semiconductor chip. FIG. [Figure 5] 10 is a side view showing a state in which an end portion of the semiconductor chip mounted on the pickup stage according to the first embodiment has been peeled off from the adhesive sheet. FIG. [Figure 6]FIG. 10 is a top view of a pickup stage according to a second embodiment. [Figure 7] 10 is a top view showing a state in which a minimum size semiconductor chip is mounted on a pickup stage according to a second embodiment. FIG. [Figure 8] 10 is a top view showing a state in which a maximum size semiconductor chip is mounted on the pickup stage of the second embodiment. FIG. [Figure 9] FIG. 11 is a cross-sectional view showing a state in which a semiconductor chip is mounted on a pickup stage according to a third embodiment. [Figure 10] 11 is a cross-sectional view showing a state in which the first suction holes are lowered below the mounting surface and adsorb the adhesive sheet in the pickup stage of the third embodiment. FIG. [Figure 11] 11 is a cross-sectional view showing a state in which the push-up needles protrude from the mounting surface and a peeling start point from the suction sheet occurs at an end of the semiconductor chip in the pickup stage of the third embodiment. FIG. [Figure 12] FIG. 10 is a side view showing a state in which the push-up needles and the first suction holes slightly protrude from the mounting surface in the pickup stage of the fourth embodiment. [Figure 13] 13 is a side view showing a state in which the first suction holes are larger than the push-up pins and slightly protrude from the mounting surface in the pickup stage of the fourth embodiment. FIG. [Figure 14] 13 is a side view showing a state in which a peeling start point from an adhesive sheet has occurred at an end of a semiconductor chip in the pickup stage of the fourth embodiment. FIG. [Figure 15] 13 is a side view showing how a cam follower type push-up needle pushes up a semiconductor chip in the pickup stage of the fifth embodiment. FIG. [Figure 16] FIG. 13 is a top view of a pickup stage according to a fifth embodiment. [Figure 17] 13 is a cross-sectional view showing a state in which the cam follower type push-up needles are not pushing up the semiconductor chip in the pickup stage of the fifth embodiment. FIG. [Figure 18] FIG. 13 is a cross-sectional view showing a state in which a cam follower type push-up needle is slightly pushing up a semiconductor chip in the pickup stage of the fifth embodiment. [Figure 19] In the pickup stage of Embodiment 5, it is a cross-sectional view showing a state in which a cam follower type push-up pin is greatly pushing up a semiconductor chip.

Embodiments for Carrying Out the Invention

[0010] <A. Embodiment 1> <A-1. Configuration> FIG. 1 is a view of the pickup stage 101 of Embodiment 1 as seen from above and from the side. FIG. 2 is a side view of the pickup stage 101 on which the semiconductor chip 11 is mounted.

[0011] The pickup stage 101 is for fixing the semiconductor chip 11 with the adhesive sheet 10 and picking up the semiconductor chip 11 by peeling it off from the adhesive sheet 10.

[0012] The pickup stage 101 has a mounting surface 1 for mounting the semiconductor chip 11, an inclined surface 2 inclined with respect to the mounting surface 1, a lower surface (not shown) which is the surface opposite to the mounting surface 1, and a side surface 3 connecting the inclined surface 2 and the lower surface, and is in the shape of a frustum of a cone.

[0013] The mounting surface 1 is designed to have a size capable of mounting one semiconductor chip 11. The diameter of the mounting surface 1 is, for example, less than 25 mm. The inclined surface 2 is inclined so as to widen toward the side surface 3, and the angle formed with the mounting surface 1 is, for example, 135° or more.

[0014] A plurality of first suction holes 6 are provided in the mounting surface 1. Inside the pickup stage 1, a plurality of first pipes (not shown) for applying suction force to the plurality of first suction holes 6 are provided. One end of each first pipe is connected to each first suction hole 6, and the other end is connected to a vacuum pump. By operating the vacuum pump to make the inside of each first pipe in a vacuum state, each first suction hole 6 functions to suck the adhesive sheet 10 onto the mounting surface 1.

[0015] The inclined surface 2 is provided with a plurality of second suction holes 7. Inside the pickup stage 101, a plurality of second pipes (not shown) for applying suction force to the plurality of second suction holes 7 are provided. One end of each second pipe is connected to each second suction hole 7, and the other end is connected to a vacuum pump. By operating the vacuum pump to make the inside of each second pipe in a vacuum state, each second suction hole 7 functions to adsorb the adhesive sheet 10 to the inclined surface 2.

[0016] On the mounting surface 1, in addition to the plurality of first suction holes 6, a plurality of pin holes 5 are provided. Inside the pickup stage 101, below each pin hole 5, a push-up pin 4 (see FIG. 3) corresponding to each pin hole 5 one-to-one is provided. Each push-up pin 4 is movable in the vertical direction and can protrude from the mounting surface 1 through the pin hole 5. FIGS. 1 and 2 show a state where the push-up pin 4 is housed inside the pickup stage 101 and does not protrude from the mounting surface 1.

[0017] <A-2. Operation> Next, the operation of the pickup stage 101 will be described. First, turn on the suction function of the first suction holes 6 and the second suction holes 7, and adsorb the adhesive sheet 10 to the mounting surface 1 and the inclined surface 2. Thereby, the position of the semiconductor chip 11 is fixed. A plurality of semiconductor chips 11 are attached to the adhesive sheet 10, and as shown in FIG. 2, one semiconductor chip 11 is arranged on the mounting surface 1 via the adhesive sheet 10.

[0018] Next, while keeping the suction function of the second suction holes 7 on, turn off the suction function of the first suction holes 6. Then, the push-up pin 4 protrudes from the mounting surface 1. Thereby, the semiconductor chip 11 is lifted upward together with the adhesive sheet 10. FIG. 3 shows a state where the adhesive sheet 10 is in a straight line from the inclined surface 2 under the end of the semiconductor chip 11.

[0019] Figure 4 shows a state where the push-up pin 4 further protrudes from the state shown in Figure 3, and the semiconductor chip 11 is further lifted upward together with the adhesive sheet 10. Since the suction function of the second suction hole 7 is ON, the adhesive sheet 10 is adsorbed to the inclined surface 2 while being lifted by the push-up pin 4 above the mounting surface 1. As a result, as shown by the dashed line in Figure 4, the portion of the adhesive sheet 10 that is above the mounting surface 1 and outside the semiconductor chip 11 is inclined upward more than the inclined surface 2. However, the adhesive sheet 10 tries to return to a straight-line shape as shown by the solid line in Figure 4 from the inclined surface 2 to the lower part of the semiconductor chip 11. Therefore, a stress in the direction of the mounting surface 1 is generated in the portion of the adhesive sheet 10 that is above the mounting surface 1 and outside the semiconductor chip 11, as indicated by the arrow in Figure 4.

[0020] As a result, as shown in Figure 5, the adhesive sheet 10 peels off from under the end portion 11b of the semiconductor chip 11. Starting from this portion, the entire semiconductor chip 11 can be easily peeled off from the adhesive sheet 10.

[0021] <A-3. Effect> The pickup stage 101 of Embodiment 1 includes a mounting surface 1, an inclined surface 2, and a plurality of push-up pins 4. The mounting surface 1 mounts the semiconductor chip 11 via the adhesive sheet 10 and has a plurality of pin holes 5 and a plurality of first suction holes 6 capable of sucking the adhesive sheet 10. The inclined surface 2 is continuous from the mounting surface 1, has an inclination with respect to the mounting surface 1, and has a plurality of second suction holes 7 capable of sucking the adhesive sheet 10. The plurality of push-up pins 4 can protrude from the mounting surface 1 through the plurality of pin holes 5. While the plurality of second suction holes 7 suck the adhesive sheet 10 to the inclined surface 2, the plurality of push-up pins 4 protrude from the mounting surface 1.

[0022] With the above configuration, the pickup stage 101 fixes the semiconductor chip 11 by sucking the adhesive sheet 10 to the mounting surface 1 and the inclined surface 2, and by pushing up the adhesive sheet 10 and the semiconductor chip 11 with the plurality of push-up pins 4, the adhesive sheet 10 can be peeled off from the end portion of the semiconductor chip 11.

[0023] <B. Embodiment 2> <B-1. Structure> FIG. 6 is a top view of the pickup stage 102 of Embodiment 2. The pickup stage 102 is different from the pickup stage 101 of Embodiment 1 in that a first suction hole 6A is provided on the mounting surface 1 instead of the first suction hole 6. The first suction hole 6A is triangular, unlike the circular first suction hole 6.

[0024] In FIG. 6, four right-angled isosceles triangle-shaped first suction holes 6 are provided on the outer periphery of the mounting surface 1. Also, each first suction hole 6A is arranged such that the hypotenuse of its three sides faces the center of the mounting surface 1. Each pin hole 5 is arranged inside the mounting surface 1 rather than each first suction hole 6A.

[0025] <B-2. Operation> Next, the operation of the pickup stage 102 will be described. First, the suction functions of the first suction hole 6A and the second suction hole 7 are turned on, and the adhesive sheet 10 is suctioned to the mounting surface 1 and the inclined surface 2. A plurality of semiconductor chips 11 are attached to the adhesive sheet 10, and one of the semiconductor chips 11 is positioned on the mounting surface 1 as shown in FIG. 7. Note that the illustration of the adhesive sheet 10 is omitted in FIG. 7.

[0026] At this time, the semiconductor chip 11 is arranged such that its four corners respectively overlap the four first suction holes 6A. In other words, the four first suction holes 6A are provided at positions overlapping the four corners of the semiconductor chip 11 mounted on the mounting surface 1.

[0027] Next, with the suction functions of the first suction hole 6A and the second suction hole 7 remaining ON, the push-up pin 4 protrudes from the mounting surface 1. As a result, the adhesive sheet 10 is suctioned to the first suction hole 6A directly below the corner of the semiconductor chip 11, but the semiconductor chip 11 is lifted upward. As a result, the four corners of the semiconductor chip 11 become the starting points of peeling from the adhesive sheet 10, and the semiconductor chip 11 can be easily peeled from the adhesive sheet 10.

[0028] In order to obtain the above-described operation, the corner of the semiconductor chip 11 needs to overlap with the first suction hole 6A. By forming the first suction hole 6A in a triangular shape, it is possible to accommodate semiconductor chips 11 of multiple sizes. FIG. 7 shows an example of the smallest semiconductor chip 11 where the corner of the semiconductor chip 11 overlaps with the first suction hole 6A with the minimum area. FIG. 8 shows an example of the largest semiconductor chip 11.

[0029] <B-3. Effect> In the pickup stage 102 of the second embodiment, the plurality of first suction holes 6A are provided at positions overlapping the four corners of the semiconductor chip 11 mounted on the mounting surface 1. Thereby, the semiconductor chip 11 can be peeled off from the adhesive sheet 10 starting from the four corners of the semiconductor chip 11.

[0030] <C. Third Embodiment> <C-1. Configuration> FIG. 9 is a cross-sectional view of the pickup stage 103 of the third embodiment with the semiconductor chip 11 mounted thereon. Similar to the pickup stage 102 of the second embodiment, the pickup stage 103 has triangular first suction holes 6A on the mounting surface 1. Inside the pickup stage 103, a plurality of first pipes 8 for imparting suction force to the plurality of first suction holes 6A are provided. One end of each first pipe 8 is connected to each first suction hole 6A, and the other end is connected to a vacuum pump. When the vacuum pump operates to create a vacuum state inside each first pipe, each first suction hole 6A functions to adsorb the adhesive sheet 10 to the mounting surface 1.

[0031] Also, each first pipe 8 extends in a direction perpendicular to the mounting surface 1 and is movable in its extending direction inside the pickup stage 103. Each first pipe 8 is connected to each first suction hole 6A so as not to protrude from the mounting surface 1 when at the highest raised position. Also, when each first pipe 8 descends from the above position, it separates from each first suction hole 6A at a position where it overlaps with each first suction hole 6A in plan view. <C-2. Operation>

[0032] Next, the operation of the pickup stage 103 will be described. First, with each first pipe 8 connected to the first suction hole 6A, the suction functions of the first suction hole 6A and the second suction hole 7 are turned on, and the adhesive sheet 10 is adsorbed to the mounting surface 1 and the inclined surface 2. A plurality of semiconductor chips 11 are attached to the adhesive sheet 10, and one of the semiconductor chips 11 is located on the mounting surface 1 as shown in FIG. 9.

[0033] Next, as shown in FIG. 10, each first pipe 8 descends. Since the upper end of each first pipe 8 has a suction function, the adhesive sheet 10 is adsorbed to the mounting surface 1 so as to enter each first suction hole 6A.

[0034] Thereafter, as shown in FIG. 11, the push-up pin 4 rises and pushes up the semiconductor chip 11 together with the adhesive sheet 10. Note that at any time shown in FIGS. 10 and 11, the adhesive sheet 10 is adsorbed to the inclined surface 2 by the second suction hole 7. Therefore, with the adhesive sheet 10 adsorbed to the inclined surface 2 and the end of the mounting surface 1, the semiconductor chip 11 is pushed up upward. As a result, a point of application of force is generated at the end 11b of the semiconductor chip 11, and the end 11b becomes a starting point of peeling from the adhesive sheet 10.

[0035] <C-3. Effect> The pickup stage 103 of the third embodiment includes a plurality of first pipes 8. By connecting the upper end of each first pipe 8 to each first suction hole 6A, a suction force is applied to each first suction hole 6A. Each first pipe 8 extends in a direction perpendicular to the mounting surface 1 and is movable in the extending direction. When the plurality of push-up pins 4 protrude from the mounting surface 1, the upper end of each first pipe 8 is separated from the mounting surface 1 and is located below the mounting surface 1. With such a configuration, according to the pickup stage 103, a starting point of peeling with respect to the adhesive sheet 10 can be created at the end 11b of the semiconductor chip 11.

[0036] <D. Embodiment 4> <D-1. Configuration> FIG. 12 is a side view of the pickup stage 104 of Embodiment 4 on which the semiconductor chip 11 is mounted. In FIG. 12, the side surface of the pickup stage 104 is not shown. The pickup stage 104 is different from the pickup stage 103 of Embodiment 3 in that it includes a plurality of first pipes 8A instead of the plurality of first pipes 8.

[0037] The first pipe 8A extends in a direction orthogonal to the mounting surface 1 and is movable in its extending direction inside and outside the pickup stage 103.

[0038] <D-2. Operation> Next, the operation of the pickup stage 104 will be described. First, the suction functions of the first suction hole 6 and the second suction hole 7 are turned on, and the adhesive sheet 10 is suctioned to the mounting surface 1 and the inclined surface 2. Thereby, the position of the semiconductor chip 11 is fixed. A plurality of semiconductor chips 11 are attached to the adhesive sheet 10, and one semiconductor chip 11 is disposed on the mounting surface 1 via the adhesive sheet 10.

[0039] Next, with the suction function of the second suction hole 7 remaining on, the suction function of the first suction hole 6 is turned off. Then, the push-up pin 4 protrudes from the mounting surface 1 and lifts the semiconductor chip 11. At this time, the first pipe 8A also rises together with the push-up pin 4. As a result, the adhesive sheet 10 becomes straight from the inclined surface 2 to the end of the semiconductor chip 11 as shown in FIG. 12. With the first pipe 8A in the raised state, the suction function of the first pipe 8A is turned on, and the adhesive sheet 10 is suctioned to the upper end of the first pipe 8A. [[ID=1,6]]

[0040] Thereafter, the first pipe 8A moves downward while adsorbing the adhesive sheet 10. At the same time, the push-up pin 4 further rises as shown in FIG. 13. As a result, the portion of the adhesive sheet 10 above the mounting surface 1 and outside the semiconductor chip 11 inclines upward more than the inclined surface 2. However, the adhesive sheet 10 tries to return to a straight shape from the inclined surface 2 to the lower part of the semiconductor chip 11. Therefore, as shown in FIG. 14, a peeling start point from the adhesive sheet 10 occurs at the end 11b of the semiconductor chip 11.

[0041] <D - 3. Effect> The pickup stage 104 of Embodiment 4 includes a plurality of first pipes 8A. The upper end of each first pipe 8A is connected to each first suction hole 6A, thereby applying a suction force to each first suction hole 6A. Each first pipe 8A extends in a direction perpendicular to the mounting surface 1 and is movable in the extending direction. When the plurality of push-up pins 4 protrude from the mounting surface 1, the upper ends of each first pipe 8 protrude from the mounting surface 1 through each first suction hole 6. With such a configuration, according to the pickup stage 104, a peeling start point for the adhesive sheet 10 can be created at the end 11b of the semiconductor chip 11.

[0042] <E. Embodiment 5> <E - 1. Configuration> FIG. 15 is a diagram showing the configuration of the push-up pin 4A in the pickup stage 105 of Embodiment 5. FIG. 16 is a top view of the pickup stage 105. The pickup stage 105 includes a push-up pin 4A instead of the push-up pin 4 as compared with the pickup stage 104 according to Embodiment 4. Also, a pin hole 5A is formed in the mounting surface 1 of the pickup stage 105 instead of the pin hole 5 of Embodiment 1. The configuration of the pickup stage 105 other than these is the same as that of the pickup stage 104.

[0043] As shown in FIG. 15, the push-up pin 4A includes a needle portion 4A1 and an elliptical cam 4A2 provided on the needle portion 4A1. The needle portion 4A1 extends in a direction orthogonal to the mounting surface 1.

[0044] The cam 4A2 is rotatable about an axis parallel to the mounting surface 1. The height of the cam 4A2 changes according to its rotational posture. As a result, the cam 4A2 can push up the semiconductor chip 11. In FIG. 15, illustration of the adhesive sheet 10 intervening between the cam 4A2 and the semiconductor chip 11 is omitted.

[0045] Also, as shown in FIG. 15, the push-up pin 4A is movable in the left-right direction. The left-right direction shown in FIG. 15 is a direction parallel to the mounting surface 1.

[0046] As shown in FIG. 16, the pin hole 5A is formed so as to connect two first suction holes 6A diagonally. Four first suction holes 6A are formed in the mounting surface 1. Therefore, there are a pin hole 5A connecting the upper-right and lower-left first suction holes 6A diagonally and a pin hole 5A connecting the upper-left and lower-right first suction holes 6A diagonally in FIG. 16. Push-up pins 4A are provided in each of these two pin holes 5A, and each push-up pin 4A is movable in a direction parallel to the mounting surface 1 along the pin hole 5A.

[0047] <E-2. Operation> Next, the operation of the pickup stage 105 will be described. First, the suction functions of the first suction holes 6A and the second suction holes 7 are turned on, and the adhesive sheet 10 is suctioned to the mounting surface 1 and the inclined surface 2. As a result, as shown in FIG. 17, the position of the semiconductor chip 11 is fixed on the mounting surface 1.

[0048] FIG. 17 is a cross-sectional view of the pickup stage 105 on which the semiconductor chip 11 is mounted. In FIG. 17, the height of the cam 4A2 is low, and the semiconductor chip 11 is not pushed up.

[0049] Next, as shown in FIG. 18, with the cam 4A2 in contact with the adhesive sheet 10, the push-up pin 4A moves in the direction of the center of the mounting surface 1. In FIG. 18, the left push-up pin 4A moves to the right, and the right push-up pin 4A moves to the left. At this time, the cam 4A2 in contact with the adhesive sheet 10 rotates, and its height changes. Therefore, the adhesive sheet 10 and the semiconductor chip 11 are pushed up by the cam 4A2.

[0050] FIG. 19 shows a state in which the push-up pin 4A has moved further in the direction of the center of the mounting surface 1 from FIG. 18. As the cam 4A2 rotates, the adhesive sheet 10 and the semiconductor chip 11 are further pushed up.

[0051] In this way, the semiconductor chip 11 is pushed up as the cam 4A2 rotates. On the other hand, the adhesive sheet 10 is adsorbed to the inclined surface 2 by the second adsorption hole 7. Therefore, the tip of the cam 4A2 in contact with the adhesive sheet 10 becomes the action point of the stress for peeling the semiconductor chip 11 from the adhesive sheet 10. This action point moves in the direction of the center of the semiconductor chip 11 as the push-up pin 4A moves. Therefore, as the push-up pin 4A moves from the end of the semiconductor chip 11 toward the center, the peeling starting point from the adhesive sheet 10 generated at the corner of the semiconductor chip 11 spreads in the direction of the center of the semiconductor chip 11, and the semiconductor chip 11 can be easily peeled from the adhesive sheet 10.

[0052] <E-3. Effect> In the pickup stage 105 of the fifth embodiment, each push-up pin 4A includes a needle portion 4A1 and a rotatable elliptical cam 4A2 provided on the needle portion 4A1, and the plurality of push-up pins 4A can move in a direction parallel to the mounting surface 1. With such a configuration, the peeling starting point of the semiconductor chip 11 from the adhesive sheet 10 can be expanded from the corner of the semiconductor chip 11 toward the center, and the semiconductor chip 11 can be easily peeled from the adhesive sheet 10.

[0053] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above embodiments, and various modifications and substitutions can be made to the above embodiments without departing from the scope of the claims.

[0054] Various aspects of the present disclosure are summarized below as appendices. (Appendix 1) A pickup stage for peeling a semiconductor chip from an adhesive sheet, a mounting surface on which the semiconductor chip is mounted via the adhesive sheet, the mounting surface having a plurality of pinholes and a plurality of first suction holes capable of adsorbing the adhesive sheet; an inclined surface that is continuous with the mounting surface, is inclined relative to the mounting surface, and has a plurality of second suction holes that can adsorb the adhesive sheet; a plurality of push-up needles that can protrude from the mounting surface through the plurality of needle holes, The plurality of second suction holes adsorb the adhesive sheet to the inclined surface, while the plurality of push-up needles protrude from the mounting surface. Pickup stage. (Appendix 2) the mounting surface is circular with a diameter of less than 25 mm; The angle between the mounting surface and the inclined surface is equal to or greater than 135 degrees and less than 180 degrees. Pick-up stage as described in Appendix 1. (Appendix 3) When the plurality of push-up needles protrude from the mounting surface, the plurality of first suction holes do not adsorb the adhesive sheet. A pickup stage as described in Appendix 1 or Appendix 2. (Appendix 4) the plurality of first suction holes are provided at positions overlapping with four corners of the semiconductor chip to be mounted on the mounting surface; A pickup stage as described in Appendix 1 or Appendix 2. (Appendix 5) When the plurality of push-up needles protrude from the mounting surface, the first suction holes adsorb the adhesive sheet. Pick-up stage as described in Appendix 4. (Appendix 6) The first suction hole is a triangle with its hypotenuse facing the center of the mounting surface. A pickup stage as described in Appendix 4 or Appendix 5. (Appendix 7) a plurality of first pipes each having an upper end connected to the plurality of first suction holes to impart suction force to the plurality of first suction holes; Each of the plurality of first pipes extends in a direction perpendicular to the mounting surface and is movable in the extension direction; When the plurality of push-up needles protrude from the mounting surface, the upper ends of the plurality of first pipes are spaced apart from the mounting surface and positioned below the mounting surface. A pickup stage as described in Appendix 1, 2 or 4. (Appendix 8) a plurality of first pipes each having an upper end connected to the plurality of first suction holes to impart suction force to the plurality of first suction holes; the plurality of first pipes extend in a direction perpendicular to the mounting surface and are movable in the extension direction; When the plurality of push-up needles protrude from the mounting surface, the upper ends of the plurality of first pipes protrude from the mounting surface through the plurality of first suction holes, respectively. A pickup stage as described in Appendix 1, 2 or 4. (Appendix 9) Each of the plurality of thrust needles includes a needle portion and a rotatable elliptical cam provided on the needle portion; the plurality of push-up needles are movable in a direction parallel to the mounting surface; A pickup stage as described in Appendix 1 or 2. [Explanation of symbols]

[0055] 1 mounting surface, 2 inclined surface, 3 side surface, 4, 4A push-up needle, 4A1 needle portion, 4A2 cam, 5, 5A needle hole, 6, 6A first suction hole, 7 second suction hole, 8, 8A first pipe, 10 adhesive sheet, 11 semiconductor chip, 11b end portion, 101, 102, 103, 104, 105 pickup stage.

Claims

1. A pickup stage for peeling a semiconductor chip from an adhesive sheet, a mounting surface on which the semiconductor chip is mounted via the adhesive sheet, the mounting surface having a plurality of pinholes and a plurality of first suction holes capable of adsorbing the adhesive sheet; an inclined surface that is continuous with the mounting surface, is inclined relative to the mounting surface, and has a plurality of second suction holes that can adsorb the adhesive sheet; a plurality of push-up needles that can protrude from the mounting surface through the plurality of needle holes, the plurality of second suction holes suction the adhesive sheet to the inclined surface, while the plurality of push-up needles protrude from the mounting surface; When the plurality of push-up needles protrude from the mounting surface, the plurality of first suction holes do not adsorb the adhesive sheet. Pickup stage.

2. the mounting surface is circular with a diameter of less than 25 mm; the angle between the mounting surface and the inclined surface is equal to or greater than 135 degrees and less than 180 degrees; The pickup stage according to claim 1 .

3. the plurality of first suction holes are provided at positions overlapping with four corners of the semiconductor chip to be mounted on the mounting surface; The pickup stage according to claim 1 .

4. When the plurality of push-up needles protrude from the mounting surface, the first suction holes adsorb the adhesive sheet. The pickup stage according to claim 3 .

5. the first suction hole is a triangle with its hypotenuse facing the center of the mounting surface; The pickup stage according to claim 3 .

6. A pickup stage for peeling a semiconductor chip from an adhesive sheet, comprising: a mounting surface on which the semiconductor chip is mounted via the adhesive sheet, the mounting surface having a plurality of pinholes and a plurality of first suction holes capable of adsorbing the adhesive sheet; an inclined surface that is continuous with the mounting surface, is inclined relative to the mounting surface, and has a plurality of second suction holes that can adsorb the adhesive sheet; a plurality of push-up needles that can protrude from the mounting surface through the plurality of needle holes, the plurality of second suction holes suction the adhesive sheet to the inclined surface, while the plurality of push-up needles protrude from the mounting surface; a plurality of first pipes each having an upper end connected to the plurality of first suction holes to impart suction force to the plurality of first suction holes; Each of the plurality of first pipes extends in a direction perpendicular to the mounting surface and is movable in the extension direction; When the plurality of push-up needles protrude from the mounting surface, the upper ends of the plurality of first pipes are spaced apart from the mounting surface and positioned below the mounting surface. Pickup stage.

7. A pickup stage for peeling a semiconductor chip from an adhesive sheet, comprising: a mounting surface on which the semiconductor chip is mounted via the adhesive sheet, the mounting surface having a plurality of pinholes and a plurality of first suction holes capable of adsorbing the adhesive sheet; an inclined surface that is continuous with the mounting surface, is inclined relative to the mounting surface, and has a plurality of second suction holes that can adsorb the adhesive sheet; a plurality of push-up needles that can protrude from the mounting surface through the plurality of needle holes, the plurality of second suction holes suction the adhesive sheet to the inclined surface, while the plurality of push-up needles protrude from the mounting surface; a plurality of first pipes each having an upper end connected to the plurality of first suction holes to impart suction force to the plurality of first suction holes; the plurality of first pipes extend in a direction perpendicular to the mounting surface and are movable in the extension direction; When the plurality of push-up needles protrude from the mounting surface, the upper ends of the plurality of first pipes protrude from the mounting surface through the plurality of first suction holes, respectively. Pickup stage.

8. A pickup stage for peeling a semiconductor chip from an adhesive sheet, comprising: a mounting surface on which the semiconductor chip is mounted via the adhesive sheet, the mounting surface having a plurality of pinholes and a plurality of first suction holes capable of adsorbing the adhesive sheet; an inclined surface that is continuous with the mounting surface, is inclined relative to the mounting surface, and has a plurality of second suction holes that can adsorb the adhesive sheet; a plurality of push-up needles that can protrude from the mounting surface through the plurality of needle holes, the plurality of second suction holes suction the adhesive sheet to the inclined surface, while the plurality of push-up needles protrude from the mounting surface; Each of the plurality of thrust needles includes a needle portion and a rotatable elliptical cam provided on the needle portion; the plurality of push-up needles are movable in a direction parallel to the mounting surface; Pickup stage.

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