Curable compositions, reaction products thereof, and electronic articles containing same

Abstract

The curable composition includes at least one aliphatic carbosilane having m Si—H groups, at least one aliphatic carbosilane having n vinyl groups, and at least one hydrosilylation reaction catalyst, where m is an integer greater than or equal to 2, n is an integer greater than or equal to 2, and m + n is at least 5. Cured reaction products and electronic articles containing the same are also disclosed.

Description

[Technical Field]

[0001] The present disclosure relates generally to curable compositions containing carbosilanes, their cured reaction products, and electronic devices containing them. [Background technology]

[0002] Fifth-generation wireless (5G) is the latest evolution of cellular technology engineered to significantly increase the speed and responsiveness of wireless networks. 5G allows data transmitted over wireless broadband connections to travel at multi-gigabit speeds, with potential peak speeds as high as 20 gigabits per second (Gbps) by some estimates. The increased speed is achieved in part by using higher-frequency radio waves than current cellular networks. However, higher-frequency radio waves have a shorter range than those used by previous networks. To ensure broad coverage, 5G networks operate in up to three frequency bands: low, medium, and high. 5G networks consist of a network of up to three different types of cells, each requiring a different antenna, with each type offering a different tradeoff in download speed versus distance and coverage area. 5G mobile phones and wireless devices connect to the network through the highest-speed antenna within their location.

[0003] Low-band 5G uses the same frequency range as current 4G mobile phones, 600 MHz to 700 MHz, and offers download speeds slightly higher than 4G, at 30 to 250 megabits per second (Mbit / s). Low-band cell towers have similar ranges and coverage areas to current 4G towers. Mid-band 5G uses microwave frequencies between 2.5 GHz and 3.7 GHz, currently enabling speeds of 100 to 900 Mbit / s, with each cell tower providing a radius of up to several miles. High-band 5G uses frequencies near the bottom of the millimeter wave band, between 25 GHz and 39 GHz, to achieve download speeds of 1 to 3 gigabits per second (Gbit / s), comparable to cable internet.

[0004] Many materials used in the communications industry today do not perform well at 5G frequencies. Therefore, the higher frequencies of 5G require the identification and development of materials that can function at those frequencies and do not interfere with the proper function of electronic devices communicating at high bandwidth wavelengths. Summary of the Invention

[0005] Advantageously, curable compositions according to the present disclosure can have low viscosities suitable for dispensing using inkjet printers. Additionally, the curable compositions and their cured reaction products have low dielectric constants and dielectric losses suitable for use in 5G electronic devices such as, for example, mobile phones, telecommunications infrastructure, and tablet computers.

[0006] In one aspect, the present disclosure provides a composition comprising: a) at least one aliphatic carbosilane having m Si—H groups, where m is an integer equal to or greater than 2; b) at least one aliphatic carbosilane having n vinyl (i.e., —CH═CH) groups, where n is an integer equal to or greater than 2 and m+n is at least 5; and c) at least one hydrosilylation reaction catalyst.

[0007] Advantageously, curable compositions according to the present disclosure may have a low viscosity suitable for dispensing using an inkjet printer.

[0008] In another aspect, the present disclosure provides a method for producing a pharmaceutical composition comprising: a) at least one aliphatic carbosilane having m Si—H groups, where m is an integer equal to or greater than 2; b) at least one aliphatic carbosilane having n vinyl groups, where n is an integer equal to or greater than 2 and m+n is at least 5; c) at least one hydrosilylation reaction catalyst; and providing a reaction product of components comprising:

[0009] In yet another aspect, the present disclosure provides an article comprising a substrate having an electronic component bonded to the substrate, the electronic component being in contact with a reaction product according to the present disclosure.

[0010] As used herein, "Aliphatic" means not containing any aromatic groups; "Carbosilane" refers to a compound consisting only of Si, C, and H and having no Si-Si bonds; "Essentially free" means containing less than 1 weight percent (e.g., less than 1 weight percent, less than 0.1 weight percent, or even less than 0.01 weight percent).

[0011] The features and advantages of the present disclosure will be further understood by consideration of the detailed description and appended claims. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a schematic side view of an electronic article 100 according to the present disclosure.

[0013] It is to be understood that numerous other modifications and embodiments can be devised by those skilled in the art which fall within the scope and spirit of the principles of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0014] Various aliphatic carbosilanes having m Si-H groups (where m is an integer equal to or greater than 2) are known in the art and / or commercially available. Preferably, these carbosilanes have 1 to 50 carbon atoms, more preferably 4 to 18 carbon atoms, and more preferably 6 to 12 carbon atoms, although this is not a requirement. Exemplary values ​​of m include 2, 3, 4, 5, 6, 8, and 10, although other values ​​are acceptable. Of these, m=2, 3, or 4 is typically preferred.

[0015] In some embodiments, useful aliphatic carbosilanes having m Si—H groups are represented by the formula: HSi(R 1 )2R 2 Si(R 1 )2H

[0016] Each R 1 independently represent an alkyl group having 1 to 4 carbon atoms (for example, methylethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, or tert-butyl).

[0017] Each R 2are independently an alkylene group or a divalent carbosilane group having up to 50 carbon atoms. Exemplary alkylene (i.e., divalent) groups include methylene, ethylene, propylene, butylene, hexylene, octylene, decylene, hexadecylene, octadecylene, eicosylene, and tricosylene. Of these, ethylene, propylene, and butylene are often preferred. Exemplary divalent carbosilane groups include 3,3-dimethyl-3-silapentane-1,5-diyl and 2,2,4,4-tetramethyl-2,4-disilapentane-1,5-diyl. Other divalent carbosilane groups are also acceptable.

[0018] Hydrosilanes can be synthesized by hydrogenolysis of the corresponding chloro- or alkoxysilanes using reactive metal hydrides such as lithium aluminum hydride (LiAlH), sodium borohydride, and diisobutylaluminum hydride (DIBAL-H), or they can be obtained, for example, from commercial sources.

[0019] Still other useful aliphatic carbosilanes having m Si-H groups can include, for example, dialkyldihydrosilanes such as dimethylsilane, dipropylsilane, and dibutylsilane.

[0020] Aliphatic carbosilanes having at least two vinyl groups (i.e., n≧2) are known in the chemical arts and are available from commercial suppliers. Preferably, these carbosilanes have 1 to 50 carbon atoms, more preferably 4 to 18 carbon atoms, and more preferably 6 to 12 carbon atoms, although this is not a requirement. Exemplary values ​​of n include 2, 3, 4, 5, 6, 8, and 10, although other values ​​are acceptable. Of these, n=2, 3, or 4 is typically preferred.

[0021] Examples include dimethyldivinylsilane, methyltrivinylsilane, tetravinylsilane, tetraallylsilane, and 1,4-divinyl-1,1,4,4-tetramethyl-1,4-disilabutane.

[0022] In some embodiments, the aliphatic carbosilane having at least two vinyl groups has the formula Si(R 1 ) p (R 3 CH=CH2) q where p is 0, 1, or 2, q is 2, 3, or 4, and p+q=4. In this embodiment, R 1 is as previously defined, and R 3 represents a covalent bond or an alkylene group having 1 to 8 carbon atoms.

[0023] To form a cured network, not only must m and n be at least 2, but the sum of m+n must be at least 5, at least 6, at least 7, at least 8, or more.

[0024] Typically, the Si-H:vinyl equivalent ratio of carbosilane component a) to carbosilane component b) ranges from 0.7 to 1.5, preferably 0.8 to 1.3, and more preferably 0.9 to 1.2, although this is not a requirement.

[0025] Hydrosilylation, also known as catalytic hydrosilylation, refers to the addition of a Si-H bond to an unsaturated bond. The hydrosilylation reaction is typically catalyzed by a platinum catalyst and generally involves the application of heat to produce a curing reaction. In this reaction, Si-H is added to a double bond to form new C-H and Si-C bonds. This process is described, for example, in WO 2000 / 068336 (Ko et al.), WO 2004 / 111151 (Nakamura), and WO 2006 / 003853 (Nakamura).

[0026] Useful hydrosilylation catalysts may include thermal catalysts and / or photocatalysts. Among these, photocatalysts may be preferred due to their long-term storage stability and ease of handling. Exemplary thermal catalysts include platinum complexes such as HPtCl (Speiller's catalyst); coordination complexes of platinum with divinylsiloxane (Karstedt's catalyst), and organometallic platinum complexes such as tris(triphenylphosphine)rhodium(I) chloride (Wilkinson's catalyst).

[0027] Useful platinum photocatalysts are disclosed, for example, in U.S. Pat. No. 7,192,795 (Boardman et al.) and the references cited therein. Certain preferred platinum photocatalysts are selected from the group consisting of Pt(II) β-diketonate complexes (such as those disclosed in U.S. Pat. No. 5,145,886 (Oxman et al.)), (η5-cyclopentadienyl)tri(σ-aliphatic)platinum complexes (such as those disclosed in U.S. Pat. No. 4,916,169 (Boardman et al.) and U.S. Pat. No. 4,510,094 (Drahnak)), and C7-20-aromatically substituted (η5-cyclopentadienyl)tri(σ-aliphatic)platinum complexes (such as those disclosed in U.S. Pat. No. 6,150,546 (Butts)). Hydrosilylation photocatalysts are activated, for example, by exposure to actinic radiation, typically ultraviolet light, according to known methods.

[0028] The amount of hydrosilylation catalyst can be any effective amount, in some embodiments, from about 0.5 parts to about 30 parts platinum per million parts of the curable composition, although greater and lesser amounts can be used.

[0029] Advantageously, curable and cured compositions according to the present disclosure have low dielectric constants / dielectric losses at frequencies typically associated with 5G wireless communication protocols. In some embodiments, the curable and / or cured compositions have a dielectric constant of 3 or less in the presence of an external AC electric field of 10 gigahertz. In some preferred embodiments, the tan delta (known in the art as loss tangent or dissipation factor) is less than 0.002 at 10 GHz.

[0030] Additionally, the curable and cured compositions according to the present disclosure may be essentially solvent-free.

[0031] Furthermore, curable compositions according to the present disclosure may have low viscosities suitable for inkjet printing, for example, in some embodiments, shear viscosities (also called absolute or dynamic viscosities) of 50 centipoise or less at temperatures between 21° C. and 50° C., inclusive, as measured according to ASTM test method D7867-13 (Determination of Rotational Viscosity of Paints, Inks, and Related Liquid Materials as a Function of Temperature).

[0032] In many embodiments, it is useful to provide the curable composition according to the present disclosure as a two-part composition that is combined to cure. This can provide improved storage stability. In such cases, the curable composition includes a part A and a part B. In a preferred embodiment, part A includes component a) but not component b), and part B includes components b) and c) but not component a).

[0033] Optional additives may also be present in the curable (and cured) compositions according to the present disclosure. Examples may include flow aids, low dielectric fillers (e.g., glass bubbles), and / or surfactants.

[0034] Curable and cured compositions according to the present disclosure are useful, for example, as encapsulants, sealants, and / or adhesives for electronic components used, for example, in 5G compatible devices.

[0035] The substrate can be, for example, plastic, composite, metal, ceramic, and / or glass. Exemplary substrates include electronic circuit boards and antennas. Examples of suitable electronic components include display components (e.g., OLED displays and LCDs), and particularly electronic components intended for use in the presence of external alternating current electric fields comprising frequencies of at least 1 gigahertz (1 GHz), preferably 25 GHz.

[0036] 1, electronic article 100 comprises a substrate 110 having an electronic display component 120 bonded to the substrate. Electronic display component 120 is contacted by a reaction product 130 according to the present disclosure that forms a seal.

[0037] Selected Embodiments of the Present Disclosure In a first embodiment, the present disclosure provides a composition comprising the following components: a) at least one aliphatic carbosilane having m Si—H groups, where m is an integer equal to or greater than 2; b) at least one aliphatic carbosilane having n vinyl groups, where n is an integer equal to or greater than 2 and m+n is at least 5; c) at least one hydrosilylation reaction catalyst; The present invention provides a curable composition comprising:

[0038] In a second embodiment, the present disclosure provides a curable composition according to the first embodiment, having a dielectric constant of less than or equal to 3 and a tan delta of less than 0.002 in the presence of an external AC electric field of 10 gigahertz.

[0039] In a third embodiment, the present disclosure provides a curable composition according to the first or second embodiment, having a shear viscosity of 50 centipoise or less at temperatures between 21°C and 50°C, inclusive, according to ASTM test method D7867-13 (Measurement of Rotational Viscosity of Paints, Inks and Related Liquid Materials as a Function of Temperature).

[0040] In a fourth embodiment, the present disclosure provides a curable composition according to any one of the first to third embodiments, which is essentially free of solvent.

[0041] In a fifth embodiment, the present disclosure provides the curable composition according to any one of the first to fourth embodiments, wherein m is at least 3.

[0042] In a sixth embodiment, the present disclosure provides the curable composition according to any one of the first to fifth embodiments, wherein n is at least 3.

[0043] In a seventh embodiment, the present disclosure provides a curable composition according to any one of the first to sixth embodiments, wherein at least one hydrosilylation reaction comprises an organometallic platinum complex.

[0044] In an eighth embodiment, the present disclosure provides an aliphatic carbosilane having at least one, m Si—H group, represented by the formula: HSi(R 1 )2R 2 Si(R 1 )2H (In the formula, Each R 1 each independently represents an alkyl group having 1 to 4 carbon atoms, Each R 2 and independently represent an alkylene group or a divalent carbosilane group having up to 50 carbon atoms.

[0045] In a ninth embodiment, the present disclosure provides a method for producing an aliphatic carbosilane having at least one vinyl group, the aliphatic carbosilane having n vinyl groups, having the formula: Si(R 1 ) p (R 3 CH=CH2) q (In the formula, Each R 1 each independently represents an alkyl group having 1 to 4 carbon atoms, Each R 3each independently represents an alkylene group having 1 to 8 carbon atoms or a covalent bond; p represents an integer of 0 to 2; and q represents an integer of 2 to 4, and p+q=4.

[0046] In a tenth embodiment, the present disclosure provides the curable composition according to any one of the first to ninth embodiments, wherein the curable composition comprises a component A and a component B, wherein the component A comprises component a) but does not comprise component b), and the component B comprises component b) and component c), but does not comprise component a).

[0047] In an eleventh embodiment, the present disclosure provides a method for manufacturing a semiconductor device comprising: a) at least one aliphatic carbosilane having m Si—H groups, where m is an integer equal to or greater than 2; b) at least one aliphatic carbosilane having n vinyl groups, where n is an integer equal to or greater than 2 and m+n is at least 5; c) at least one hydrosilylation reaction catalyst; and providing a reaction product of components comprising:

[0048] In a twelfth embodiment, the present disclosure provides the reaction product of the eleventh embodiment, wherein the curable composition has a dielectric constant of 3 or less and a tan delta of less than 0.002 in the presence of an external alternating electric field of 10 gigahertz.

[0049] In a thirteenth embodiment, the present disclosure provides a reaction product according to the eleventh or twelfth embodiment, which is essentially free of solvent.

[0050] In a fourteenth embodiment, the present disclosure provides the reaction product of any one of the eleventh to thirteenth embodiments, wherein m is at least 3.

[0051] In a fifteenth embodiment, the present disclosure provides the reaction product of any one of the eleventh to fourteenth embodiments, wherein n is at least three.

[0052] In a sixteenth embodiment, the present disclosure provides the reaction product of any one of the eleventh to fifteenth embodiments, wherein at least one hydrosilylation reaction comprises an organometallic platinum complex.

[0053] In a seventeenth embodiment, the present disclosure provides an aliphatic carbosilane having at least one, m Si—H group, represented by the formula: HSi(R 1 )2R 2 Si(R 1 )2H (In the formula, Each R 1 each independently represents an alkyl group having 1 to 4 carbon atoms, Each R 2 and independently represent an alkylene group or a divalent carbosilane group having up to 50 carbon atoms.

[0054] In an eighteenth embodiment, the present disclosure provides a method for producing an aliphatic carbosilane having at least one vinyl group, the aliphatic carbosilane having n vinyl groups, having the formula: Si(R 1 ) p (R 3 CH=CH2) q (In the formula, Each R 1 each independently represents an alkyl group having 1 to 4 carbon atoms, Each R 3 each independently represents an alkylene group having 1 to 8 carbon atoms or a covalent bond; p represents an integer of 0 to 2; and q represents an integer from 2 to 4, and p+q=4.

[0055] In a nineteenth embodiment, the present disclosure provides an electronic article comprising a substrate having an electronic component bonded to the substrate, wherein the electronic component is in contact with a reaction product according to any one of the eleventh to eighteenth embodiments.

[0056] In a twentieth embodiment, the present disclosure provides an electronic article according to the nineteenth embodiment, wherein the electronic component is intended for use in the presence of an external alternating electric field comprising a frequency of at least 1 gigahertz.

[0057] In a twenty-first embodiment, the present disclosure provides an electronic article according to the nineteenth or twentieth embodiment, wherein the electronic component is intended for use in the presence of an external alternating electric field comprising a frequency of at least 25 GHz.

[0058] In a twenty-second embodiment, the present disclosure provides an electronic article according to any one of the nineteenth to twenty-first embodiments, wherein the reaction product has a dielectric constant of less than or equal to 3 and a tan delta of less than 0.002 in the presence of an external alternating current electric field of 10 gigahertz.

[0059] In a twenty-third embodiment, the present disclosure provides an electronic article according to any one of the nineteenth to twenty-second embodiments, wherein the reaction product functions as a sealant for the electronic component.

[0060] In a twenty-fourth embodiment, the present disclosure provides an electronic article according to any one of the nineteenth to twenty-third embodiments, wherein the electronic component comprises an electronic display component.

[0061] In a twenty-fifth embodiment, the present disclosure provides the electronic article according to the twenty-fourth embodiment, wherein the electronic display component comprises an organic light-emitting diode.

[0062] In a twenty-sixth embodiment, the present disclosure provides an electronic article according to any one of the nineteenth to twenty-fifth embodiments, wherein the reaction product functions as an adhesive for bonding the electronic component to a substrate.

[0063] Objects and advantages of the present disclosure are further illustrated by the following non-limiting examples, although the specific materials and amounts thereof recited in these examples, as well as other conditions and details, should not be construed to unduly limit the present disclosure. [Example]

[0064] Unless otherwise stated, all parts, percentages, ratios, etc. in the examples and elsewhere in this specification are by weight.

[0065] Table 1 below lists the materials used in the examples. [Table 1]

[0066] Preparation of linear polycarbosilane polymer (LIN-PCS-vinyl) 1,1,4,4-Tetramethyl-1,4-disilabutane (14.8 g, 0.1 mol) was added dropwise to a solution of 1,7-octadiene (12.2 g, 0.11 mol) and platinum divinyltetramethyldisiloxane complex (1 drop, 2.1%-2.4% Pt in xylene) in toluene (40 mL). After an initial exotherm, the reaction mixture was stirred at room temperature for 3 days, and the toluene and excess monomer were removed under reduced pressure to give the product as a viscous liquid.

[0067] Preparation of hyperbranched polycarbosilane (HB-PCS-vinyl) 1,1,4,4-Tetramethyl-1,4-disilabutane (8.81 g, 0.0602 mol) was added dropwise to a solution of tetravinylsilane (12.7 g, 0.093 mol, 3.1 molar excess vinyl) and platinum divinyltetramethyldisiloxane complex (1 drop, 2.1%-2.4% Pt in xylene) in toluene (80 mL). After an initial exotherm, the reaction mixture was stirred at room temperature for 3 days, and the toluene and excess monomer were removed under reduced pressure to give the product as a viscous liquid.

[0068] Dielectric spectroscopy of liquids between 100kHz and 1MHz. Measurements of dielectric properties and liquid conductivity were performed using an Alpha-A High Temperature Broadband Dielectric Spectrometer modular measurement system from Novocontrol Technologies GmbH (Montabaur, Germany). A Keysight Model 16452A liquid dielectric test fixture was used, containing the liquid as a parallel-plate capacitor. The Alpha-A modular measurement system's ZG2 extensional test interface enabled automated impedance measurements of the Keysight Model 16452A liquid dielectric test fixture through Novocontrol software. The dielectric constant was calculated from the ratio of the capacitance of the test cell containing the liquid to the capacitance of the test cell containing air. To measure higher viscosity liquids with the 16452A test cell, the liquid was first heated to 50–55°C and held at this temperature for 15–30 minutes. The liquid was then injected into the liquid test cell with a syringe. After injection, the liquid was allowed to settle for up to 30 minutes to minimize and avoid the formation of air bubbles. After settling for 30 minutes, the sample was tested.

[0069] Solid split-post dielectric resonator measurements at 9.5GHz. Split post dielectric resonator measurements were performed according to standard IEC 61189-2-721 at a frequency of 9.5 GHz. Each thin material or film was inserted between two fixed dielectric resonators. The effect of the specimen on the resonant frequency and quality factor of the posts allows for direct calculation of the complex permittivity (permittivity and dielectric loss). This 9.5 GHz resonator was designed for TE with only azimuthal electric field components. 01δ Because they operate in a δ mode, the electric field remains continuous at the dielectric interface. The split-post dielectric resonators measure the permittivity components in the plane of the specimen. Loop coupling (critically coupled) was used in each of these dielectric resonator measurements. This 9.5 GHz split-post resonator measurement system was coupled with a Keysight VNA (Vector Network Analyzer Model PNA 8364C 10 MHz to 50 GHz). Comparisons were made to determine the complex electric permittivity of each specimen at 9.5 GHz.

[0070] Cylindrical dielectric resonator measurements on liquids at 2.5GHz. ATE 01δ Using a cylindrical dielectric resonator, the complex permittivity of the dielectric was measured at a frequency of 2.45 GHz using the method described in J. Krupka, K. Derzakowski, M.D. Janezic, and J. Baker-Jarvis, “TE01delta dielectric resonator technique for precise measurements of the complex permittivity of lossy liquids at frequencies below 1 GHz,” Conference on Precision Electromagnetic Measurements Digest, pp. 469-470, London, June 27-July 2, 2004.

[0071] Dielectric constant of compounding ingredients The dielectric constants of linear polycarbosilane and hyperbranched polycarbosilane fluids were measured at frequencies of 100 kHz, 1 MHz, and 2.5 GHz at 20°C and compared with silicone fluid, SFilm, and commercial PTFE 5G material. The results are reported in Table 2 below. [Table 2]

[0072] Shear viscosity of compounding ingredients Rheological measurements were performed according to ASTM test method D7867-13 (Determination of Rotational Viscosity of Paints, Inks, and Related Liquid Materials as a Function of Temperature) on an ARES G2 strain-controlled rheometer (TA Instruments, New Castle, DE, USA) using a concave concentric cylinder geometry (25 mm diameter / 32 mm length bob; cup w / 27 mm diameter). Measurements were collected at 25°C and 50°C under a nitrogen atmosphere. Shear viscosity measurements in centipoise (cps) were taken at 10 s. -1 The shear rate was obtained.

[0073] Preparation examples PE1~PE6 The 100% solids / solvent-free formulations (reported in Table 3) were UV cured by platinum-catalyzed hydrosilylation under various conditions to yield hard polycarbosilane coatings. The formulations had a silane component with SiH functionality (TMDSB) and a component with vinyl functionality (TVS or HB-PCS-vinyl). HB-PCS-vinyl had a terminal vinyl content of 8.16 mmol / g, M n = 3100 g / mol, M w = 7100 g / mol, polydispersity 2.3, and T g = -68°C. The SiH groups were in molar excess (0.1 to 4 times) relative to the vinyl groups. [Table 3]

[0074] Examples E1 to E6 PE1–PE3 were cured at room temperature using 0.3 wt% platinum(II) acetylacetonate (Pt acac). Samples were prepared by depositing 0.25 mL of the formulation onto a glass microscope slide via a pipette and then illuminated with a Clearstone CF1000 UV LED system (395 nm, 319 mW / cm). 2 The samples were cured for 1 minute at a distance of 1 cm from the surface using a 0.2 wt% Pt acco solution (100% intensity). The thickness of the cured coating was measured using a digital micrometer to be in the range of 140 microns to 150 microns. PE4 to PE6 were cured for 5 minutes at 395 nm / 100% intensity using 0.2 wt% Pt acco solution.

[0075] Examples E7 to E12 PE1-PE6 were cured by adding platinum divinyltetramethyldisiloxane complex (Karstedt's catalyst) at 0.3 wt %.

[0076] Viscosity of the formulation components To demonstrate that the formulations were potentially inkjet printable, the viscosities of the formulations were measured (Table 4). [Table 4]

[0077] The preceding description is intended to enable one skilled in the art to practice the disclosure as set forth in the claims and should not be construed as limiting the scope of the disclosure, which is defined by the claims and all equivalents thereof.

Claims

1. Ingredients: a) at least one aliphatic carbosilane having m Si—H groups, where m is an integer equal to or greater than 2, having the formula: HSi(R １ ) ２ R ２ Si(R １ ) ２ H (In the formula, Each R １ independently represent an alkyl group having 1 to 4 carbon atoms; Each R ２ independently represent an alkylene group or a divalent carbosilane group having up to 50 carbon atoms. and an aliphatic carbosilane represented by b) at least one aliphatic carbosilane monomer having n vinyl groups, where n is an integer equal to or greater than 2 and m+n is at least 5; c) at least one hydrosilylation reaction catalyst; 1. A curable composition comprising:

2. 10. The curable composition of claim 1, having a shear viscosity of 50 centipoise or less at temperatures from 21° C. to 50° C., inclusive, according to ASTM test method D7867-13 (Measurement of Rotational Viscosity of Paints, Inks, and Related Liquid Materials as a Function of Temperature).

3. a) at least one aliphatic carbosilane having m Si—H groups, where m is an integer equal to or greater than 2, having the formula: HSi(R １ ) ２ R ２ Si(R １ ) ２ H (In the formula, Each R １ independently represent an alkyl group having 1 to 4 carbon atoms; Each R ２ independently represent an alkylene group or a divalent carbosilane group having up to 50 carbon atoms. and an aliphatic carbosilane represented by b) at least one aliphatic carbosilane monomer having n vinyl groups, where n is an integer equal to or greater than 2 and m+n is at least 5; c) at least one hydrosilylation reaction catalyst; A reaction product of components including:

4. An electronic article comprising a substrate having an electronic component bonded to the substrate, said electronic component being in contact with the reaction product of claim 3.

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