Gas distribution plate with central UV blocker

Abstract

An apparatus for processing a substrate may include a gas distribution plate including an upper plate, a lower plate, and a solid disk between the upper plate and the lower plate. Each of the upper plate and the lower plate has a central region and an outer region surrounding the central region, the central region being solid and the outer region having a plurality of through holes. The upper plate and the lower plate are coaxially aligned along a central axis extending through a center of the central region of the upper plate and a center of the central region of the lower plate. The solid disk is coaxially aligned with the upper plate and the lower plate. The solid disk is configured to block the transmission of ultraviolet light through the solid disk.

Description

Field

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure generally relate to an apparatus for processing a substrate, and more particularly to an apparatus for preventing the transmission of ultraviolet (UV) radiation to a substrate.

[0002] Substrates used in the semiconductor manufacturing industry are often cleaned to remove unwanted materials, such as contaminants and other unwanted particles, that are generated on the substrate during processing. Substrates can include semiconductor wafers, chamber components, photomasks, etc.

[0003] Photoresist is used in semiconductor wafer manufacturing to transfer circuit patterns onto wafers. After the photoresist pattern is applied, the remaining photoresist must be removed from the photomask before it can be used again. Some photoresist removal may occur on the semiconductor wafer. Examples of photoresist removal applications include post-metal etch, post-poly etch, post-dielectric etch, post-implant, and photolithography rework.

[0004] Gas plasma stripping is one method for removing photoresist from semiconductor wafers. However, the present inventors have observed that some gas plasma stripping apparatuses and methods expose the semiconductor wafers to UV radiation emitted as a product of the gas plasma stripping. The UV radiation can be damaging to the semiconductor wafers.

[0005] Accordingly, the inventors have provided an improved apparatus for processing substrates.

[0006] An apparatus for processing a substrate is provided herein. In some embodiments, the apparatus for processing a substrate includes a gas distribution plate including an upper plate, a lower plate, and a solid disk between the upper and lower plates. Each of the upper and lower plates has a central region and an outer region surrounding the central region. The central region is solid, and the outer region includes a plurality of through-holes. The upper and lower plates are coaxially aligned along a central axis extending through the center of the central region of the upper plate and the center of the central region of the lower plate. The solid disk is coaxially aligned with the upper and lower plates. The solid disk is configured to block transmission of ultraviolet light through the solid disk.

[0007] Also, in some embodiments, an apparatus for processing a substrate includes a gas distribution plate including a first plate having a central region and an outer region surrounding the central region, and a solid disk aligned with the central region of the first plate. The central region of the first plate is solid, and the outer region includes a plurality of through-holes. The first plate is configured to allow transmission of ultraviolet light through the central region and the outer region. The solid disk is configured to block transmission of ultraviolet light through the solid disk.

[0008] In some embodiments, an apparatus for processing a substrate includes a substrate processing chamber including a remote plasma source having an exit hole centered on a longitudinal axis, a cleaning chamber in fluid communication with the exit hole, and a support disposed within the cleaning chamber and spaced longitudinally from the exit hole. The support is configured to support a substrate within the cleaning chamber. The substrate processing chamber also includes a gas distribution plate disposed longitudinally between the exit hole and the support and extending transversely to the longitudinal axis across the exit hole and the support. The gas distribution plate includes an upper plate and a lower plate, each having a central region and an outer region surrounding the central region, the central region being solid and including a plurality of through-holes. The upper plate and the lower plate are coaxially aligned along a longitudinal axis extending through the central region of the upper plate and the central region of the lower plate. The gas distribution plate also includes a solid disk disposed between the upper plate and the lower plate. The solid disk is coaxially aligned with the upper plate and the lower plate. The solid disc is configured to block the transmission of ultraviolet light through the solid disc.

[0009] Other and further embodiments of the present disclosure are described below. [Brief explanation of the drawings]

[0010] Embodiments of the present disclosure, briefly summarized above and discussed in more detail below, can be understood by reference to exemplary embodiments thereof as illustrated in the accompanying drawings. However, the accompanying drawings depict only typical embodiments of the present disclosure and therefore should not be construed as limiting the scope, as the present disclosure may include other equally effective embodiments. [Figure 1] 1 shows a partial cross-sectional view of a processing tool having a processing chamber in accordance with at least some embodiments of the present disclosure. [Figure 2] 2 illustrates the arrangement of the gas distribution plate and UV blocking disk connected to the processing tool shown in FIG. 1. [Figure 3]3 shows an exploded view of the gas distribution plate and UV blocking disk arrangement shown in FIG. 2.

[0011] For ease of understanding, the same reference numerals will be used, where possible, to indicate identical elements common to each figure. The drawings are not drawn to scale and may be simplified for ease of understanding. Elements and features of one embodiment may be beneficially incorporated in other embodiments without further elaboration. DETAILED DESCRIPTION

[0012] Embodiments of a processing chamber for processing a substrate are provided herein. In embodiments, the processing chamber is configured to clean the substrate to remove unwanted particles or residue. The substrate may be, for example, a semiconductor wafer, a photomask, etc. In the example of a photomask, photoresist may remain on the substrate. Gas plasma stripping is one method for removing the photoresist. The dissociated residue may then be removed from the interior volume of the processing chamber. One by-product of gas plasma stripping may be UV radiation, which may be damaging to the substrate.

[0013] 1 illustrates a partial cross-sectional view of a processing tool 100 having a processing chamber 102 for accommodating and processing a substrate (not shown) in accordance with at least some embodiments of the present disclosure. The processing chamber 102 defines an interior volume 103 in which a substrate support 104 is disposed. The substrate support 104 is shown in the form of a flat platform (platform 105) supported by the processing chamber 102. The platform 105 is configured to support a substrate (not shown) within the interior volume of the processing chamber 102 in a substantially horizontal position transverse to a longitudinal axis 106. As illustrated in FIG. 1 , the longitudinal axis 106 may extend through a center of the substrate support 104.

[0014] The processing tool 100 also includes a remote plasma source 108 longitudinally spaced from the substrate support 104. The remote plasma source 108 is configured to supply plasma radicals to the interior volume 103 of the processing chamber 102. The remote plasma source 108 has an exit hole 110. The exit hole 110 is coaxial with the longitudinal axis 106 and the substrate support 104. The exit hole 110 is in fluid communication with the processing chamber 102 and the interior volume 103. UV radiation emitted by the remote plasma source 108 may be emitted into the interior volume 103 through the exit hole 110.

[0015] The processing chamber 102 has a flange 112 spaced longitudinally between the outlet hole 110 and the substrate support 104. As described in more detail below, the flange 112 is spaced longitudinally between the outlet hole 110 and the substrate support 104 and is configured to support a gas distribution plate 114 that extends across the outlet hole 110 and the substrate support 104 in a direction substantially transverse (+ / −10 degrees) to the longitudinal axis 106.

[0016] The gas distribution plate 114 may include an upper plate 116 and a lower plate 118. The upper plate 116 has a central (e.g., circular) region 116a and an outer (e.g., annular) region 116b surrounding the central region 116a. The lower plate 118 has a central (e.g., circular) region 118a and an outer (e.g., annular) region 118b surrounding the central region 118a. The central regions 116a, 118a are solid, and the outer regions 116b, 118b each include a plurality of through-holes 116c, 118c for gas transmission. The upper plate 116 and the lower plate 118 are configured to be coaxially aligned along a longitudinal axis 106 extending through the central region 116a of the upper plate 116 and the central region 118a of the lower plate 118. The central regions 116a, 118a have the same size and shape (e.g., circular), the outer regions 116b, 118b have the same size and shape (e.g., annular), and the plurality of through-holes 116c, 118c can have the same size and shape (e.g., circular) and pattern. The through-holes 116c in the upper plate 116 are configured to align with the through-holes 118c in the lower plate 118 to facilitate the flow of gas through the gas distribution plate 114.

[0017] The upper and lower plates 116, 118 can be formed of a UV-transparent material such as quartz (e.g., GE124 fused silica), and such a material, in addition to being UV-transparent, can be selected for its resistance to quenching radicals on the surfaces of the upper and lower plates 116, 118.

[0018] The gas distribution plate 114 may also include a solid disk 122. In the embodiment shown in Figures 1, 2, and 3, the solid disk 122 is disposed between the upper plate 116 and the lower plate 118. The solid disk 122 may be encapsulated between the upper plate 116 and the lower plate 118. If the solid disk 122 is made of a material such as aluminum that may quench radicals, encapsulating the solid disk 122 may prevent the solid disk 122 from quenching the radicals.

[0019] The solid disk 122 can be configured to be coaxially aligned with the upper and lower plates 116, 118 along the longitudinal axis 106. The solid disk 122 is configured to block the transmission of UV radiation through the solid disk 122. For example, the solid disk 122 can be formed of a UV-blocking material such as black quartz (HBQ® 100, a registered trademark of Heraeus Holding GmbH, Hanau, Germany), low resistivity silicon (resistivity less than 0.01 ohm-cm), or aluminum.

[0020] 2, when the gas distribution plate 114 is connected to the flange 112 of the processing chamber 102, the solid disk 122 protrudes above the area of ​​the outlet holes 110 and can be positioned longitudinally between the outlet holes 110 and the substrate, such that UV radiation emitted through the outlet holes 110 toward the substrate support 104 can be blocked by the solid disk 122, protecting the substrate (not shown) supported by the substrate support 104 from exposure to UV radiation.

[0021] The solid disk 122 can have an area equal to or greater than the area of ​​the exit hole 110, such that the area of ​​the solid disk 122 extends completely across or overlaps the area of ​​the exit hole 110. For example, in embodiments, the solid disk 122 and the exit hole 110 can be circular, and the solid disk 122 can have a diameter that is 10% to 15% larger than the diameter of the exit hole 110. Additionally, the solid disk 122 can have an area equal to or greater than the central region 116a of the upper plate 116 and / or the central region 118a of the lower plate 118. The solid disk 122 can be sized such that the solid disk 122 does not cover either the through-hole 116c of the upper plate 116 or the through-hole 118c of the lower plate 118. In some embodiments, the solid disk 122 has a diameter of approximately 2.5 inches and a thickness of approximately 0.03 inches.

[0022] As shown in FIG. 3 , the upper plate 116 can have a planar upper surface 124 and a planar lower surface 126. A central region 116 a and an outer region 116 b of the upper plate 116 can be coplanar and define the lower surface 126. Additionally, the lower plate 118 can have a planar upper surface 128 and a planar lower surface 130. As shown in FIG. 2 , when the upper plate 116 and the lower plate 118 are assembled with the solid disk 122, the lower surface 126 of the upper plate 116 can contact the upper surface 128 of the lower plate 118. A disk-receiving recess 132 can be defined in the central region 118 a of the upper surface 128 of the lower plate 118. The disk-receiving recess 132 is configured to receive and support at least a portion of the solid disk 122. 3, the disk-receiving recess 132 has a sufficient depth so that the upper surface 134 of the solid disk 122 is flush with or recessed from the upper surface 128 of the lower plate 118. In some embodiments, the upper plate 116 defines a recess (not shown) in its lower surface 126 that can fully receive the solid disk 122. Also, in some embodiments, the upper plate 116 can have a recess (not shown) in its lower surface 126 and the lower plate 118 can have a recess (not shown) in its upper surface 126, whereby both recesses together define a single cavity for holding the solid disk 122.

[0023] 3, the top plate 116 has a peripheral flange 136 extending around an outer region 116b of the top plate 116. The peripheral flange 136 has a longitudinal portion 136a and a transverse portion 136b extending from the longitudinal portion 136a, thereby providing the peripheral flange 136 with a generally L-shaped cross-section. The transverse portion 136b of the peripheral flange 136 is configured to be received within the retention groove 113 of the flange 112 of the processing chamber 102, as shown in FIG.

[0024] As shown in FIG. 3 , the longitudinal portion 136a of the peripheral flange 136 has an inner surface 138 that extends longitudinally from the lower surface 126 of the upper plate 116. As shown in FIG. 2 , the inner surface 138 and the lower surface 126 of the upper plate 116 define a plate-receiving recess 140 configured to receive the lower plate 118 in a nested configuration. In some embodiments, as shown in FIG. 2 , when the lower plate 118 is received in the plate-receiving recess 140, the lower surface 142 of the transverse portion 136b of the peripheral flange 136 is configured to be flush with the lower surface 130 of the lower plate 118. The lower plate 118 also has a peripheral edge 144 that extends around the outer region 118b of the lower plate 118. As shown in FIG. 2 , the peripheral edge 144 can engage the inner surface 138 of the longitudinal portion 136a of the peripheral flange 136 when the lower plate 118 is received in the plate-receiving recess 140.

[0025] The gas distribution plate 114 shown in FIG. 2 can be assembled by placing the solid disk 122 into the disk-receiving recess 132 and then placing the upper plate 116 over the lower plate 118 so that the lower plate is received in the plate-receiving recess 140.

[0026] While the above is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof. For example, while gas distribution plate 114 described above includes multiple plates (upper and lower plates), in other embodiments, the gas distribution plate may have only one plate configured to hold a solid UV-blocking disk, such as solid disk 122. Also, in other embodiments, the gas distribution plate is formed entirely from a single plate of UV-blocking material, such as black quartz or low-resistivity silicon.

Claims

1. 1. A gas distribution plate comprising: a first plate having a central region and an outer region surrounding the central region, the first plate being solid and having a plurality of through holes in the outer region, the first plate being configured to allow ultraviolet radiation to be transmitted through the central region and the outer region; a solid disk aligned with a central region of the first plate, the solid disk configured to block transmission of ultraviolet radiation through the solid disk; a second plate having a central region and an outer region surrounding the central region, the central region being solid and the outer region having a plurality of through holes; a solid disk disposed between the first plate and the second plate; The central region of the first plate and the central region of the second plate are aligned with each other and with the solid disk.

2. The gas distribution plate of claim 1 , wherein the solid disk is disposed on an upper or lower surface of the first plate.

3. 10. The gas distribution plate of claim 1, wherein the solid disk extends completely across a central region of the first plate and does not cover an outer region of the first plate.

4. The gas distribution plate of claim 1 , wherein the first plate is formed of quartz.

5. The gas distribution plate of claim 1 , wherein the solid disk is formed of at least one of black quartz, silicon, or aluminum.

6. 1. A gas distribution plate comprising: a first plate having a central region and an outer region surrounding the central region, the first plate being solid and having a plurality of through holes in the outer region, the first plate being configured to allow ultraviolet radiation to be transmitted through the central region and the outer region; a solid disk aligned with a central region of the first plate, the solid disk configured to block transmission of ultraviolet radiation through the solid disk; The solid disk is a gas distribution plate formed from at least one of black quartz, silicon, or aluminum.

7. the first plate is an upper plate and the second plate is a lower plate; The gas distribution plate of claim 1 , wherein the solid disk is encapsulated between the upper plate and the lower plate.

8. 10. The gas distribution plate of claim 1, wherein the first plate is an upper plate and the second plate is a lower plate, a central region of the lower plate defining a recess configured to receive at least a portion of a solid disk.

9. 10. The gas distribution plate of claim 1, wherein the first plate is an upper plate and the second plate is a lower plate, the upper plate having a peripheral flange extending around an outer region of the upper plate, the peripheral flange configured to be received in a retention groove of the cleaning chamber.

10. 10. The gas distribution plate of claim 9, wherein the central region and the outer region of the upper plate are coplanar and define a lower surface, and the peripheral flange extends axially from the lower surface and defines a recess configured to receive the lower plate.

11. 11. The gas distribution plate of claim 10, wherein the lower plate has a peripheral edge extending around an outer region of the lower plate, the peripheral edge configured to engage the peripheral flange when the lower plate is received in the recess.

12. 10. The gas distribution plate of claim 1, wherein the first plate is an upper plate and the second plate is a lower plate, the lower plate being configured to allow transmission of ultraviolet radiation through a central region and an outer region of the lower plate.

13. The gas distribution plate of claim 1 , wherein the second plate is formed of quartz.

14. The gas distribution plate of claim 1 , wherein the plurality of through-holes in the first plate are aligned with the plurality of through-holes in the second plate.

15. 1. A substrate processing chamber comprising: a remote plasma source having an exit hole centered on the longitudinal axis; a cleaning chamber in fluid communication with the exit hole; a support disposed within the cleaning chamber, longitudinally spaced from the exit aperture, the support configured to support the substrate within the cleaning chamber; 7. A substrate processing chamber comprising: a gas distribution plate according to any one of claims 1 to 6, longitudinally spaced between the outlet holes and the support, the gas distribution plate extending transversely to the longitudinal axis across the outlet holes and the support.

16. The substrate processing chamber of claim 15 , wherein the area of ​​the solid disk is equal to or greater than the area of ​​the exit hole.

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