Substrate transport mechanism and substrate transport method

Abstract

To enable transfer of a substrate over a wide range while suppressing adhesion of particles to the substrate when the substrate is transferred to stacked processing modules by a substrate transfer mechanism.SOLUTION: A substrate transfer mechanism for processing a substrate and transferring the substrate to each of a plurality of stacked processing modules includes a base portion having a first driving device, an elevating unit for lifting and lowering the base portion, a first arm portion which extends laterally from a lower side of the base portion, and has a tip portion turned about a vertical axis with respect to the base portion by a first driving device, a second arm portion which extends in a lateral direction from the upper side of the tip portion of the first arm portion, and has a tip portion turned about the vertical axis with respect to the first arm portion together with the turning of the first arm portion, and a holding portion for the substrate which is provided above the tip portion of the second arm portion and turns about the vertical axis with respect to the second arm portion.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a substrate transport mechanism and a substrate transport method. [Background technology]

[0002] A substrate processing apparatus used in the manufacture of semiconductor devices is configured to include, for example, a plurality of processing modules for processing semiconductor wafers (hereinafter referred to as wafers), which are substrates. The substrate processing apparatus is also provided with a substrate transfer mechanism for transferring wafers to and from each processing module.

[0003] Patent Document 1 discloses a multi-jointed substrate transport mechanism called a SCARA (Selective Compliance Assembly Robot Arm) type. This substrate transport mechanism includes multiple arms (link bodies) 41a to 41c that are sequentially connected in a direction from the base end to the tip end, and these arms are stacked in the order 41a, 41b, 41c. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-28134 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique that enables substrates to be transported over a wide range while suppressing particle adhesion to the substrates when the substrates are transferred between stacked processing modules by a substrate transport mechanism. [Means for solving the problem]

[0006] The substrate transport mechanism of the present disclosure is a substrate transport mechanism that processes a substrate and transfers the substrate to each of a plurality of stacked processing modules, the substrate transport mechanism comprising: a base including a first drive device; a lifting unit that lifts and lowers the base; a first arm extending laterally from a lower side of the base and having a tip portion pivotable about a vertical axis relative to the base by the first driving device; a second arm extending laterally from above the tip of the first arm and having a tip that rotates about a vertical axis relative to the first arm as the first arm rotates; a holder for the substrate that is provided above the tip of the second arm and that rotates around a vertical axis relative to the second arm; Equipped with 、 a base that rotates around a vertical axis relative to the second arm is provided on an upper side of a tip end of the second arm, the holding portion is provided on the upper side of the base so as to be movable forward and backward relative to the base, the holding portions include a first holding portion and a second holding portion that are arranged vertically relative to each other and each hold the substrate; When the advancing and retreating directions of the first holding unit and the second holding unit are defined as a front-rear direction, a first advancing and retreating mechanism for advancing and retreating the first holding unit and a second advancing and retreating mechanism for advancing and retreating the second holding unit are provided on one side of the left and right of the base and the other side of the base, respectively; A first connection portion that connects the first holding portion to the first advancing / retreating mechanism is provided only on one of the left and right sides of the base, and a second connection portion that connects the second holding portion to the second advancing / retreating mechanism is provided only on the other of the left and right sides of the base. Another substrate transport mechanism of the present disclosure is a substrate transport mechanism that processes a substrate and transfers the substrate to each of a plurality of stacked processing modules, comprising: a base including a first drive device; a lifting unit that lifts and lowers the base; a first arm extending laterally from a lower side of the base and having a tip portion pivotable about a vertical axis relative to the base by the first driving device; a second arm extending laterally from above the tip of the first arm and having a tip that rotates about a vertical axis relative to the first arm as the first arm rotates; a holder for the substrate that is provided above the tip of the second arm and that rotates around a vertical axis relative to the second arm; Equipped with a base that rotates around a vertical axis relative to the second arm is provided on an upper side of a tip end of the second arm, the holding portion is provided on the upper side of the base so as to be movable forward and backward relative to the base, the holding portions include a first holding portion and a second holding portion that are arranged vertically relative to each other and each hold the substrate; The holder has a suction hole for sucking and holding the substrate, and a sensor for detecting the state of an exhaust path connected to the suction hole is provided on the second arm. Still another substrate transport mechanism of the present disclosure is a substrate transport mechanism that processes a substrate and transfers the substrate to each of a plurality of stacked processing modules, the substrate transport mechanism comprising: a base including a first drive device; a lifting unit that lifts and lowers the base; a first arm extending laterally from a lower side of the base and having a tip portion pivotable about a vertical axis relative to the base by the first driving device; a second arm extending laterally from above the tip of the first arm and having a tip that rotates about a vertical axis relative to the first arm as the first arm rotates; a holder for the substrate that is provided above the tip of the second arm and that rotates around a vertical axis relative to the second arm; Equipped with If the side where the base portion is provided with respect to the lifting portion is defined as the front side, The lifting unit includes a plurality of rails aligned laterally and extending vertically; a fourth drive device common to each of the rails for raising and lowering the base along the extending direction of each of the rails; Equipped with. [Effects of the Invention]

[0007] According to the present disclosure, when a substrate is transferred between stacked processing modules by a substrate transfer mechanism, it is possible to transport the substrate over a wide range while suppressing adhesion of particles to the substrate. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view of a substrate processing apparatus including a substrate transfer mechanism according to an embodiment of the present disclosure. [Figure 2] FIG. 2 is a front view of the substrate processing apparatus. [Figure 3] FIG. 2 is a side view of a processing block constituting the substrate processing apparatus. [Figure 4] FIG. 2 is an overall perspective view of the substrate transport mechanism. [Figure 5] FIG. [Figure 6] FIG. 2 is a vertical cross-sectional side view of the substrate transport mechanism. [Figure 7] FIG. 2 is a perspective view of the substrate transport mechanism. [Figure 8] FIG. 2 is a cross-sectional plan view showing a part of the substrate transport mechanism. [Figure 9] FIG. 2 is a schematic vertical sectional front view showing a part of the substrate transport mechanism. [Figure 10] 10A to 10C are explanatory views showing the operation of an arm portion of the substrate transport mechanism. [Figure 11] FIG. 10 is a plan view of a processing block of a substrate processing apparatus according to a second embodiment. [Figure 12] FIG. 4 is a side view of the processing block according to the second embodiment. [Figure 13] FIG. 4 is a cross-sectional plan view of a substrate transport mechanism provided in the apparatus of the second embodiment. [Figure 14] FIG. 2 is a perspective view of the substrate transport mechanism. [Figure 15] FIG. 10 is a cross-sectional plan view showing a modified example of the substrate transport mechanism. DETAILED DESCRIPTION OF THE INVENTION

[0009] [First embodiment] A substrate processing apparatus 1, which is an example of a substrate processing apparatus including an embodiment of a substrate transport mechanism of the present disclosure, will be described with reference to the cross-sectional plan view of Fig. 1 and the longitudinal front view of Fig. 2. The substrate processing apparatus 1 has a carrier block D1, a first processing block D2, and a second processing block D3 arranged in this order in a horizontal linear array. In the following description, the arrangement direction of these blocks D1 to D3 is referred to as the Y direction, with the carrier block D1 side being the +Y side and the second processing block D3 side being the -Y side in this Y direction. The horizontal direction perpendicular to the Y direction is referred to as the X direction, with the carrier block D1 viewed to the left and the second processing block D3 viewed to the right in this X direction being the +X side and the rear side being the -X side.

[0010] The first processing block D2 and the second processing block D3 are each partitioned vertically into two halves. The lower and upper halves of the partitioned first processing block D2 are referred to as the first lower processing block D21 and the first upper processing block D22, respectively. The lower and upper halves of the partitioned second processing block D3 are referred to as the second lower processing block D31 and the second upper processing block D32, respectively. Wafers W are transported in the following order: carrier block D1 → first lower processing block D21 → second lower processing block D31 → second upper processing block D32 → first upper processing block D22 → carrier block D1. By transporting wafers W in this manner, an underlayer film, an intermediate film, and a resist film are sequentially formed and stacked on the wafers W. After each film is formed, the wafers W are heat-treated.

[0011] Each block will be described below. Carrier block D1 is a block that transfers wafers W into and out of carriers C that store wafers W. The +Y side of housing 11 constituting carrier block D1 protrudes toward the +Y side and forms three steps, each of which is configured as support bases 12, 13, and 14 from the bottom. Each of support bases 12 to 14 has four stages for the carriers C, and the four stages are aligned in the X direction. Two stages on the +X side of each of support bases 12 and 13 are configured as stages 15 on which carriers C are placed to transfer wafers W into and out of the apparatus. The other stages are configured as stages for transferring carriers C into and out of substrate processing apparatus 1, or as stages to which carriers C are temporarily retracted when transfer to the transfer destination is not possible, and are indicated as stage 16. A transfer mechanism 17 is provided to transfer carriers C between stages 15 and 16.

[0012] A transfer region 21 for wafers W is formed within housing 11 of carrier block D1. Transfer mechanisms 22 and 23 are provided on the +X side and the -X side of transfer region 21, respectively. Furthermore, in plan view, a module stack T1 is provided between transfer mechanisms 22 and 23. Module stack T1 is configured by vertically stacking a transfer module TRS on which wafers W are temporarily placed and a temperature adjustment module SCPL that adjusts the temperature of the placed wafers W. Furthermore, a hydrophobic treatment module 25 that hydrophobicizes wafers W is provided on the -X side of transfer mechanism 23 in transfer region 21.

[0013] Next, the first processing block D2 will be described. The front side of the first processing block D2 is vertically partitioned to form eight levels, which are numbered E1 to E8 from bottom to top. The lower levels E1 to E4 are included in the first lower processing block D21, and the upper levels E5 to E8 are included in the first upper processing block D22.

[0014] The first upper processing block D22 will be described with reference to the longitudinal side view of Figure 3. The first upper processing block D22 has a rectangular housing 20 that separates the first upper processing block D22 from the other blocks. The housing 20 houses the above-mentioned floors E5 to E8, as well as the processing modules and transport mechanism 4B described below.

[0015] Each of the stories E5 to E8 is provided with a resist film forming module 31 that applies a resist as a chemical solution to form a resist film. Therefore, the resist film forming modules 31 are stacked on top of each other to form a plurality of processing modules. A transfer area 33 for wafers W extending in the Y direction is provided at the rear of the stories E5 to E8. A heating module 34 is provided behind the transfer area 33 as a processing module. Seven heating modules 34 are stacked vertically to form a stack, and two such stacks are arranged side by side in the Y direction. A large number of heating modules 34 arranged in two vertical rows in this manner may be collectively referred to as a heating module group 35.

[0016] The heating module group 35 and the resist film forming modules 31 on stories E5 to E8 face each other across a transfer area 33. A transfer mechanism 4B is provided in the transfer area 33 and delivers wafers W to and from the resist film forming modules 31 and the heating modules 34. Therefore, the transfer mechanism 4B is shared by the stacked processing modules. The detailed configuration of the transfer mechanism 4B will be described later.

[0017] The first lower processing block D21 constituting the first processing block D2 is provided with chemical solution coating modules for coating chemical solutions for forming an underlayer film on stories E1 to E4. Apart from these differences in processing modules, it has the same configuration as the first upper processing block D22. Next, the second processing block D3 (the second upper processing block D32 and the second lower processing block D31) will be described. The second processing block D3 has substantially the same configuration as the first processing block D2, and only the differences will be described below. The second upper processing block D32 is provided with chemical solution coating modules for forming an intermediate film on stories E5 to E8. The second lower processing block D31 does not have chemical solution coating modules on stories E1 to E4, and only a heating module 34 is provided as a processing module, similar to the other processing blocks. In FIG. 2, transport mechanisms equivalent to transport mechanism 4B provided in first lower processing block D21, second lower processing block D31, and second upper processing block D32 are shown as 4A, 4C, and 4D, respectively.

[0018] Additionally, TRS11 and TRS12 are provided at the +Y-side ends of the transfer regions 33 of the second lower processing block D31 and the second upper processing block D32, respectively, and the TRS11 and TRS12 overlap each other in a plan view. Furthermore, an elevation transfer mechanism 36 is provided to raise and lower the +Y-side ends of the transfer regions 33 of each of these blocks and transfer the wafer W between the TRS11 and TRS12. The elevation transfer mechanism 36 includes a support column 37 extending vertically behind the transfer region 33, a horizontal rotation shaft 38 that can be raised and lowered along the support column 37 and extends in the Y-direction, and a holder 39 that extends in a direction perpendicular to the extension direction of the rotation shaft 38 and can suction-hold the backside of the wafer W. For convenience of illustration, in FIG. 2, the rotation shaft 38 is shown extending in the X-direction. By rotating the rotation shaft 38, the tip side of the holder 39 faces upward while moving up and down between the TRS11 and the TRS12, and faces sideways when the wafer W is delivered to each of the TRS11 and the TRS12. Furthermore, the second lower processing block D31 and the second upper processing block D32 are each provided with an SCPL so as to overlap the TRS11 and the TRS12, and these TRS11, TRS12 and the SCPL constitute a module stack T2.

[0019] The substrate processing apparatus 1 also includes a control unit 10 (see FIG. 1). The control unit 10 is configured with a computer and includes a program, a memory, and a CPU. The program incorporates a group of steps that enable a series of operations in the substrate processing apparatus 1, which will be described later, to be performed. The program causes the control unit 10 to output control signals to each part of the substrate processing apparatus 1, thereby controlling the operation of each part. Specifically, the control units control the operation of the transport mechanisms 4A to 4D, the transport of the wafer W by the lifting and transferring mechanism 36, and each processing module, such as the heating module 34. The program is stored on a storage medium, such as a compact disc, a hard disk, or a DVD, and is installed in the control unit 10.

[0020] Next, a description will be given of the transfer path of the wafer W in the substrate processing apparatus 1. The wafer W on the carrier C on the stage 15 is transferred in the following order: transfer mechanism 22 → TRS of the module stack T1 → transfer mechanism 23 → hydrophobization treatment module 25 → SCPL of the module stack T1. The wafer W is then taken into the first lower processing block D21 by the transfer mechanism 4A, transferred to the chemical coating module → heating module 34 in that order, where a lower layer film is formed, and then transferred to the SCPL of the module stack T2. The wafer W is then transferred to the heating module 34 by the transfer mechanism 4C of the second lower processing block D31, where it is subjected to further heating processing, and then transferred to the TRS 11.

[0021] The wafer W is then transferred by the lifting and transferring mechanism 36 to the TRS 12 of the second upper processing block D32, and then transferred by the transfer mechanism 4D through the SCPL of the module stack T2 → the chemical solution coating module → the heating module 34, in that order, where an intermediate film is formed, and then transferred to the SCPL of the module stack T2. The wafer W is then loaded into the first upper processing block D22 by the transfer mechanism 4B, and transferred through the resist film forming module 31 → the heating module 34, in that order, where a resist film is formed, and then transferred to the TRS of the module stack T1. The wafer W is then transferred in the order of the transfer mechanism 23 → the TRS of the module stack T1 → the transfer mechanism 22, and returned to the carrier C.

[0022] Next, transfer mechanisms 4A to 4D, which are substrate transfer mechanisms, will be described, but because the transfer mechanisms 4A to 4D have the same configuration, transfer mechanism 4B in the first upper processing block D22 will be described as a representative with reference to the perspective view in Fig. 4, the front view in Fig. 5, and the cross-sectional side view in Fig. 6. As explained in the explanation of the transfer path of the wafer W, transfer mechanism 4B delivers the wafer W to the TRS of module stack T1, the SCPL of module stack T2, the resist film forming module 31, and the heating module 34, which are arranged on the +Y side, -Y side, +X side, and -X side of the transfer region 33, respectively.

[0023] The transport mechanism 4B includes support columns 41, 42, an upper beam 43, a lower beam 44, a slider 51, a base body 52, a first arm 61, a second arm 62, a base 71, a lower fork 81, and an upper fork 82. The support columns 41, 42, the upper beam 43, and the lower beam 44 form an elevator unit that raises and lowers the slider 51 and the base body 52, which are the bases. The support columns 41, 42 extend longitudinally, more specifically, in the vertical direction, for example, from the end on the -X side of the transport area 33, with support column 41, which is the first support column, being disposed on the +X side of the heating module group 35, and support column 42, which is the second support column, being disposed on the -X side of the heating module group 35.

[0024] The upper beam 43 and the lower beam 44 extend laterally, more specifically, for example, horizontally, and are configured as elongated flat plates in the X direction, for example. One end and the other end of the upper beam 43 are connected to the upper ends of the support columns 41 and 42, respectively, and one end and the other end of the lower beam 44 are connected to the lower ends of the support columns 41 and 42, respectively. The upper beam 43 is located above the movement area of ​​the slider 51 that moves up and down, as will be described later, and the lower beam 44 is located behind this movement area so as not to interfere with the movement area.

[0025] In this way, the upper and lower sides of the pillars 41, 42 are connected to each other by the upper beam 43 and the lower beam 44, thereby ensuring a relatively high rigidity for the pillars 41, 42. This suppresses deformation and vibration of the pillars 41, 42, allowing the wafer W to be transported to an accurate position in the module. Furthermore, by connecting the pillars 41, 42 to each other in this way, misalignment of the pillars 41, 42 with each other is prevented, which also contributes to improving the positional accuracy when assembling each part of the transport mechanism 4B supported by the pillars 41, 42.

[0026] A frame for mounting modules and the like is provided within the housing 20 constituting the first upper processing block D22, and the frame is fixed to the housing 20. The vertically extending portions of the frame are shown in FIGS. 1 and 3 as vertical extension sections 45, which are located behind the support columns 41 and 42. The support columns 41 and 42 are connected to each vertical extension section 45 at intervals along their length by fasteners 46, such as bolts. The support columns 41 and 42 are fixed to the housing 20 along their length, and this fixation also ensures the relatively high rigidity mentioned above. Within the housing 20, the area behind the support columns 41 and 42 forms a region 47 defined by the transport region 33 and the heating module group 35. Therefore, the region 47 is defined by the processing modules, and the rear side of the vertical extension section 45 faces the region 47. The partitioned area 47 is an area where auxiliary equipment related to the module, such as exhaust ducts connected to the module and electrical equipment for operating the module, is installed.

[0027] Below, we will describe the schematic configuration of the slider 51, base main body 52, first arm 61, second arm 62, and base 71. The slider 51 is provided between support columns 41 and 42 so as to extend laterally, specifically, for example, in the horizontal direction. The slider 51 is configured as a beam-like body supported by support columns 41 and 42, with one end and the other end connected to the support columns 41 and 42, respectively. The mechanism will be explained later, but the support columns 41 and 42 can raise and lower the slider 51 in the longitudinal direction, which is the extension direction of the support columns 41 and 42, more specifically, in the vertical direction.

[0028] A base body 52 is connected to the slider 51, and the base body 52 is provided so as to protrude from the upper end of the center of the slider 51 in the extension direction (Y direction) toward the +X side, i.e., in the direction intersecting the Y direction. A base end of a first arm 61 is connected to the lower side of the base body 52 so as to be rotatable around a vertical axis, more specifically, for example, a vertical axis, and a tip end of the first arm 61 extends in a lateral direction, more specifically, for example, a horizontal direction. Therefore, the tip end of the first arm 61 can pivot around the vertical axis relative to the base body 52.

[0029] The base end of the second arm 62 is connected to the upper side of the tip of the first arm 61 so as to be rotatable around a vertical axis, more specifically, a vertical axis, and the tip of the second arm 62 extends laterally, more specifically, horizontally. Therefore, the tip of the second arm 62 can rotate around a vertical axis relative to the first arm 61. A base 71 is connected to the upper side of the tip of the second arm 62 so as to be rotatable around a vertical axis, more specifically, a vertical axis, relative to the tip. The base 71 is positioned above the second arm 62 and also above the base body 52. ​​Forks 81 and 82 (a lower fork 81 and an upper fork 82), each capable of suctioning and holding a wafer W, are arranged vertically on the base 71. Therefore, the forks 81 and 82, which serve as holders for the wafer W, are rotatably mounted above the tip of the second arm 62. The base 71 allows the lower fork 81, which is a first holding part, and the upper fork 82, which is a second holding part, to advance and retreat relative to the base 71 independently of each other.

[0030] As described above, the transfer mechanism 4B is configured as a SCARA transfer arm by including the first arm 61 and the second arm 62 that rotate independently. This rotational movement moves the base 71 to the vicinity of the module to which the wafer W is to be transferred. The forks 81, 82 then move forward and backward to transfer the wafer W to the module. A motor 53 is provided in the base body 52 as a first driving device, and the driving force of the motor 53 is transmitted to the first arm 61 and the second arm 62 via a power transmission mechanism including a pulley and a belt (to be described later), causing both the first arm 61 and the second arm 62 to rotate. In other words, the motor 53 is shared by both the first arm 61 and the second arm 62, and the second arm 62 rotates in conjunction with the rotation of the first arm 61.

[0031] Various cables for driving the components of the transport mechanism 4B and suction tubes 85A and 85B (hereinafter referred to as cables) are routed through spaces formed inside the second arm 62, the first arm 61, the base body 52, the slider 51, and the support columns 41 and 42. That is, installation spaces for the cables are provided so that they extend from the second arm 62 through the first arm 61, the base body 52, and the slider 51 in this order to the interiors of the support columns 41 and 42. These installation spaces are formed inside the housings (described below) that constitute the second arm 62, the first arm 61, and the base body 52. ​​Gaps connecting to these installation spaces are provided on the surfaces of the housings. These housing gaps are formed, for example, between the wall of each housing and a member that penetrates the wall of each housing, as described below.

[0032] The area of ​​the installation space for the cables, from the second arm 62 to the slider 51, is evacuated by an exhaust mechanism provided in the slider 51, and the gap in the surface of the housing is set to a negative pressure relative to the transport area 33. Therefore, the air in the transport area 33 flows to the exhaust mechanism through the gap in the housing and the installation space for the cables. Therefore, even if particles are generated from the power transmission mechanism including the pulleys and belts provided inside the housing, this exhaust prevents them from scattering into the transport area 33 from the gap in the housing.

[0033] The slider 51 also has a housing (shown as 51A in FIG. 6), and a space 54 within the housing 51A forms an installation space for the cables described above, and the space 54 extends along the length of the slider 51. Openings 55A are provided on the front surface of the slider 51 on the +Y side and the -Y side of the position where the base body 52 is provided, and fans 55, which are the exhaust mechanism described above, are provided so as to overlap each opening 55A. Each fan 55 has a filter, and the air exhausted as described above passes through the filter and is returned to the transfer region 33 via the openings 55A in a purified state (a state in which particles have been removed).

[0034] The base body 52 will be described below with reference to FIG. 7, which is a perspective view showing a cutaway top end of the base body 52. ​​The base body 52 includes a housing 52A, and the motor 53 is provided at a position offset in the -Y direction from the position where the first arm 61 is connected to the lower side of the housing 52A. The housing 52A, which serves as the housing for the base body, includes pulleys 56 and 57 rotatable about vertical axes and spaced apart from each other in the Y direction. An endless belt 58 is looped around the pulleys 56 and 57. The pulley 56 is connected to the motor 53. A through-hole 57A is bored in the center of the pulley 57 along the axial direction of the pulley 57, and the upper side of the through-hole 57A opens into the housing 52A. A communication hole 59 is open in the rear sidewall of the housing 52A, and the communication hole 59 is connected to the space 54 within the slider 51 described above.

[0035] Next, the first arm 61 will be described. The first arm 61 has a housing 61A (see FIG. 6). In the housing 61A, which is the housing for the first arm, pulleys 63 and 64 that can rotate around a vertical axis are provided on the base end side and the tip end side of the first arm 61, and an endless belt 65 is hung around the pulleys 63 and 64. Through holes 63A and 64A are drilled in the centers of the pulleys 63 and 64, respectively, along the axial direction of the pulleys 63 and 64.

[0036] The lower side of the through-hole 63A of the pulley 63 opens into the housing 61A. The pulley 63 is connected to the upper wall of the housing 61A. The edge of the through-hole 63A of the pulley 63 protrudes upward, penetrates the upper part of the housing 61A and the lower part of the housing 52A of the base main body 52, and is connected to the pulley 57. The pulley 63, the connecting portion 63B, and the pulley 57 are generally a single cylindrical body that rotates together, with their respective rotation axes aligned in a plan view. For example, the connecting portion 63B is configured to include a reducer so that the gear ratio (ratio of the number of rotations) between the pulley 63 and the pulley 57 is a predetermined value, but this is not shown. Because the pulley 63 is connected to the housing 61A as described above, the first arm 61 rotates together with the rotation of the pulley 63. The edge of the through-hole 64A of the pulley 64 projects upward so as to penetrate the upper wall of the housing 61A, and is configured as a cylindrical connecting portion 64B.

[0037] Next, the second arm 62 will be described. The second arm 62 includes a housing 62A. The cylindrical connector 64B described above is connected to the underside of the housing 62A, and the interior of the connector 64B is in communication with the interior of the housing 62A. This connection via the connector 64B allows the second arm 62 to rotate with the rotation of the pulley 64. Valves 66A and 66B, which are solenoid valves, and pressure sensors 67A and 67B are provided within the housing 62A, which serves as the second arm housing; these will be described later. A motor 68 is provided below the base end of the housing 62A, and rotates the side of the tip of the first arm 61 as the second arm 62 rotates. The driving force of the motor 68 is transmitted to the base 71 via a power transmission mechanism for the base 71, which is composed of a pulley and a belt, causing the base 71 to rotate. As for the power transmission mechanism for rotating the base 71, only a pulley 69 is shown in FIG.

[0038] The pulleys 56, 57, 63, 64 and belts 58, 65 described above constitute a power transmission mechanism that transmits the driving force of the motor 53 to the first arm 61 and the second arm 62. The power of the motor 53 causes these pulleys 56, 57, 63, 64 to rotate together via the belts 58, 65. As a result, the first arm 61 and the second arm 62 rotate together at a predetermined rotation ratio as described above. The interior of the housing 62A, the through-hole 64A of the pulley 64, the interior of the housing 61A, the through-hole 63A of the pulley 63, the through-hole 57A of the pulley 57, the interior of the housing 52A, the communication hole 59, and the space 54 constitute a space (communication passage) that is exhausted by the fan 55 of the slider 51, which serves as a second exhaust mechanism. Air flows toward the fan 55 in this order to be exhausted. As described above, the space in which the power transmission mechanism consisting of pulleys and belts is installed is vented all at once by the fan 55, so there is no need to install a fan 55 for each housing to vent, and the manufacturing costs of the conveying mechanism 4B are reduced.

[0039] Next, the base 71 will be described with reference to Fig. 8, which is a cross-sectional plan view. The base 71 has a flat, rectangular housing 70 that is configured to have a roughly rectangular shape in a plan view, and the forks 81 and 82 move back and forth in the longitudinal direction of this rectangle, moving between a retracted position where the holding area of ​​the forks for wafer W is located above the base 71 and an advanced position where the forks protrude forward from the base 71. The forks 81 and 82 in the retracted position overlap each other. One of the forks 81 and 82 is used to receive the wafer W from the module, and the other is used to send the wafer W to the module.

[0040] For ease of explanation, the longitudinal direction of the housing 70 will sometimes be referred to as the front-to-rear direction, and the lateral direction as the left-to-right direction. The right and left sides of the base 71 correspond to the right and left sides when viewed from the forward direction of the forks 81 and 82. A drive mechanism 7A for the lower fork 81 and a drive mechanism 7B for the upper fork are provided within the housing 70. The drive mechanism 7A includes a motor 72A, pulleys 73A and 74A, a belt 75A, a guide 76A, and a connector 77A. The drive mechanism 7B includes a motor 72B, pulleys 73B and 74B, a belt 75B, a guide 76B, and a connector 77B. The pulleys 73A, 74A, 73B, and 74B rotate around horizontal rotation axes extending left and right. The belts 75A and 75B are endless belts. The guides 76A and 76B are formed to extend horizontally forward and backward.

[0041] Regarding the drive mechanism 7A, which is the first forward / backward mechanism, a motor 72A is disposed in the rear portion of the housing 70, in the center of the left-right direction. A pulley 73A is disposed to the right of the motor 72A, and a pulley 74A is disposed in front of the pulley 73A. A belt 75A is looped around the pulleys 73A and 74A. A guide 76A is provided to the right of the pulleys 73A and 74A and the belt 75A. The left end of a plate-shaped connecting portion 77A is engaged with the guide 76A and the belt 75A. The right end of the connecting portion 77A protrudes to the right side (one of the left and right sides) of the housing 70 through a slit 71A formed in the right side surface of the housing 70, is bent upward outside the housing 70, and is connected to a lower fork 81. With this configuration, the lower fork 81 is supported on the base 71 via the connecting portion 77A and the guide 76A. Belt 75A is driven by motor 72A, and connecting portion 77A moves along the length direction of guide 76A, whereby lower fork 81 connected to connecting portion 77A moves forward and backward.

[0042] Regarding the drive mechanism 7B, which is the second forward / backward mechanism, a motor 72B is disposed in the front center of the housing 70. A pulley 73B is disposed to the left of the motor 72B, and a pulley 74B is disposed behind the pulley 73B. A belt 75B is looped around the pulleys 73B and 74B. A guide 76B is disposed to the left of the pulleys 73B and 74B and the belt 75B. The right end of a plate-shaped connecting portion 77B is engaged with the guide 76B and the belt 75B. The left end of the connecting portion 77B protrudes to the left side of the housing 70 (the other of the left and right sides) through a slit 71B formed in the left side surface of the housing 70, is bent upward outside the housing 70, and is connected to an upper fork 82. With this configuration, the upper fork 82 is supported on the base 71 via the connecting portion 77B and the guide 76B. Belt 75B is driven by motor 72B, and connecting portion 77B moves along the length direction of guide 76B, thereby moving upper fork 82 connected to connecting portion 77B forward and backward. Note that seal belts are provided to close each of slits 71A, 71B of base 71, but are not shown in the drawings.

[0043] As described above, the pulleys 73A and 74A, belt 75A, guide 76A, and connection portion 77A that constitute drive mechanism 7A are provided on the right side of housing 70. The pulleys 73B and 74B, belt 75B, guide 76B, and connection portion 77B that constitute drive mechanism 7B are provided on the left side of housing 70. A cable (wiring) for supplying power is connected to motors 72A and 72B, which are the third drive devices. The upstream side of this cable is led to housing 62A of second arm 62 via an installation area provided for pulley 69 connected to the lower side of base 71, as described above, and is housed in the communication passage described above. That is, the cable is led from housing 70 through housing 62A, housing 61A, housing 52A, and housing 51A in this order, and then to support column 41 or support column 42.

[0044] The lower fork 81 is plate-shaped, with its tip forked and extending forward, forming a roughly horseshoe shape that surrounds the side periphery of the wafer W. Four claws 83 for supporting the backside of the wafer W are formed at the tip of the lower fork 81 surrounding the wafer W, protruding toward the center of the area where the wafer W is supported. Each claw 83 is provided with a suction hole 84 that applies suction to the backside of the wafer W while the wafer W is supported. The upstream ends of suction pipes 85A are connected to each suction hole 84, and the downstream ends of the suction pipes 85A merge with each other. The above-mentioned connector 77A is connected to the lower right of the base end of the lower fork 81.

[0045] The upper fork 82 is configured similarly to the lower fork 81, and the suction pipe corresponding to the suction pipe 85A is shown as 85B. The connecting part 77B is connected to the lower left of the base end of the upper fork 82.

[0046] The downstream side of the joined suction pipe 85A and the downstream side of the joined suction pipe 85B are routed inside the housing 62A of the second arm 62. A valve 66A and a pressure sensor 67A are disposed in this order toward the downstream side of the suction pipe 85A, and a valve 66B and a pressure sensor 67B are disposed in this order toward the downstream side of the suction pipe 85B. The downstream ends of the suction pipes 85A and 85B are connected to an exhaust source (not shown).

[0047] While the lower fork 81 is supporting the wafer W, valve 66A is opened, causing the wafer W to be sucked through suction holes 84 of the lower fork 81, and the backside of the wafer W is held by the lower fork 81. While the upper fork 82 is supporting the wafer W, valve 66B is opened, causing the wafer W to be sucked through suction holes 84 of the upper fork 82, and the wafer W is held by suction on the upper fork 82. During operation of the substrate processing apparatus 1, pressure sensors 67A and 67B transmit detection signals corresponding to the pressures in suction pipes 85A and 85B to the controller 10, respectively. This allows the controller 10 to determine whether or not an abnormality exists. Furthermore, pressure sensors 67A and 67B each have a screen 68C (see FIG. 5) that displays the detected pressures in suction pipes 85A and 85B, respectively. This screen is exposed on the side of the housing 62A. A user of the substrate processing apparatus 1 can visually check the screen to perform maintenance, etc.

[0048] The base 71 is also provided with a position detection unit 86 for detecting the position of the wafer W relative to the forks held by the lower fork 81 or the upper fork 82, which are positioned in the retracted position. The position detection unit 86 includes a support frame 87 formed in a gate shape when the base 71 is viewed in the front-to-rear direction. The support frame 87 includes a total of four light emitting units 88 that irradiate light toward the peripheral edge of the wafer W below, and a total of four light receiving units 89 located below the light emitting units 88. The control unit 10 detects the position of the wafer W based on the area of ​​light received by each light receiving unit 89. For convenience of illustration, only two light emitting units 88 and two light receiving units 89 are shown in FIG. 5. The position detection unit 86 is not shown in FIGS. 6 to 8.

[0049] Next, pillars 41 and 42 will be described in more detail with reference to FIG. 9, a schematic longitudinal front view. Pillar 41 is formed by housing 40, and motor 91 is provided so as to protrude from the rear of the upper end of housing 40. Motor 91, which is a second driving device, is provided in partitioned area 47 shown in FIG. 1. Pulleys 92 and 93 are provided at the upper and lower ends, respectively, inside housing 40, and pulleys 92 and 93 rotate around horizontal axes extending forward and backward. An endless belt 94 is looped around pulleys 92 and 93. Furthermore, guide 95 is provided on the -Y side of pulleys 92 and 93 inside housing 40. Guide 95 is a guide for raising and lowering slider 51 and extends in the vertical direction. A vertically extending slit 96 is opened in the side surface on the -Y side of housing 40. Through this slit 96, connecting portion 51B, which forms the end portion of slider 51 on the +Y side and is configured to be long in the vertical direction, is provided to enter housing 40 and is supported by being engaged with belt 94 and guide 95. Note that slit 96 is also covered by a seal belt, but this seal belt is not shown. Note that motor 91 may be provided below supports 41 and 42 and configured to rotate pulley 93.

[0050] Fans 97 and 98 are provided near the upper and lower ends of the housing 40, respectively, to exhaust air from the housing 40. More specifically, the fans 97 and 98 provided on the upper and lower sides of the housing 40 suck the air from the transfer region 33 into the housing 40 through the slit 96 and exhaust it to, for example, the partitioned region 47. This exhaust creates a negative pressure in the slit 96 and the housing 40 relative to the transfer region 33, preventing particles from scattering from the housing 40 into the transfer region 33 through the slit 96. If the fans 97 and 98 were not provided, the movement of the end of the slider 51 within the housing 40 would compress the air at the upper and lower ends of the housing 40, which would likely increase the pressure, and particles would likely be scattered from the upper and lower ends through the slit 96. In order to more reliably prevent the scattering of particles, fan 97 is provided near the upper end of the upper side of housing 40, and fan 98 is provided near the lower end of the lower side of housing 40. Note that fans 97 and 98 may be provided with a filter, similar to fan 55 of slider 51, and configured to return the exhausted air to transfer region 33.

[0051] The support column 42 is configured to have a mirror-symmetric structure in the Y direction with respect to the support column 41. The -Y side end of the slider 51 is also configured as a connection portion 51B, and this connection portion 51B enters the housing 40 of the support column 42 through a slit 96 and is engaged with a belt 94 and a guide 95, thereby being supported by the support column 42. The motors 91 of the support columns 41 and 42 rotate the pulleys 92 and 93 of the support column 41 and the pulleys 92 and 93 of the support column 42, driving the belts 94 of the support columns 41 and 42, and the slider 51 moves up and down along the length of the guide 95. Therefore, the pulleys 92 and 93, the belt 94, and the guide 95 constitute an elevation mechanism provided in an internal space (the space within the housing 40) formed along the length of the support column 41.

[0052] 10, the trajectories of movement of the first arm 61 and the second arm 62 on the +Y side from the center in the Y direction of the transfer region 33 when the transfer mechanism 4B delivers the wafer W to each module are shown by a solid line, a dashed line, and a dashed two-dot line, respectively. In the figure, the rotation center of the first arm 61 (i.e., the rotation center of the pulleys 57 and 63) is shown as P1, the rotation center of the second arm 62 (i.e., the rotation center of the pulley 64) is shown as P2, and the rotation center of the base 71 is shown as P3.

[0053] As shown by the two-dot chain line in the figure, when the tip of the first arm 61 faces forward, the tip of the second arm 62 faces backward, and the rotation center P3 is located at the center of the transport area 33 in the Y direction. From this state, as the tip of the first arm 61 moves toward the end on the +Y side, the tip of the second arm 62 faces toward the +Y side (shown by the solid line and the dashed-dotted line). As the first arm 61 and the second arm 62 move in this manner, due to the gear ratio of each pulley, the trajectory of the rotation center P3 moves in a manner that generally coincides with an imaginary straight line L1 at the center of the front and rear of the transport area 33. In FIG. 10, the trajectories of the movement of the first arm 61 and the second arm 62 on the -Y side of the transport area 33 are not shown to avoid complication, but the trajectories of the movement are symmetrical with respect to the center of the transport area 33 in the Y direction. Therefore, the rotation center P3 roughly coincides with the line L1 on the -Y side as well as on the +Y side of the transport area 33. Roughly coinciding with the line L1 means that the distance from the line L1 is 3 mm or less.

[0054] Since the position of the rotation center P3 shifts slightly in front of and behind at each position in the Y direction of the transport area 33, the amount of advancement of the lower fork 81 and the upper fork 82 of the base 71 can be adjusted even if the distance from the base 71 to one processing module facing the transport area 33 shifts from that to another processing module. In other words, by adjusting the amount of advancement, the influence of the positional shift of the rotation center P3 is canceled out.

[0055] The process by which the above-described transfer mechanism 4B transfers a wafer W from the resist film formation module 31 to an arbitrary heating module 34 will now be described. For example, assume that the upper fork 82 holds a wafer W that has been processed in the resist film formation module 31, and that both forks 81 and 82 are in the retracted position. The motor 91 of the support columns 41 and 42 raises and lowers the slider 51, and when the base 71 is positioned at a height corresponding to the heating module 34 to which the wafer W is to be transferred, the motor 53 of the base body 52 rotates the first arm 61 and the second arm 62, and as described in FIG. 10 , the rotation center P3 of the base 71 moves along the transfer area 33, and the base 71 is positioned in front of the heating module 34 to which the wafer W is to be transferred.

[0056] When the motor 68 of the second arm 62 rotates the base 71, and the tips of the forks 81, 82 move toward the heating module 34, the lower fork 81 moves to the advanced position. Subsequently, the slider 51 moves upward, and the wafer W processed in the heating module 34 is transferred to the lower fork 81. When the lower fork 81 returns to the retracted position, the upper fork 82 moves to the advanced position, and the slider 51 moves downward, so that the wafer W held by the upper fork 82 is placed in the heating module 34. As described above, the valves 66A and 66B are opened and closed so that suction is applied through the suction holes 84 of the lower fork 81 while the lower fork 81 is holding the wafer W, and so that suction is applied through the suction holes 84 of the upper fork 82 while the upper fork 82 is holding the wafer W. Furthermore, when the lower fork 81 or the upper fork 82 is positioned at the retracted position while holding the wafer W, the position of the wafer W is detected by the position detector 86, as described above.

[0057] Although the transfer of the wafer W to the heating module 34 has been described as an example, the wafer W is transferred in the same manner when being transferred to another module. Depending on the module to which the wafer W is transferred, the wafer W may be transferred by using lift pins provided on the module instead of lifting and lowering the slider 51. Furthermore, for example, while the substrate processing apparatus 1 is in operation, exhaust is always performed by the fan 55 of the slider 51 and the fans 97 and 98 of the supports 41 and 42, thereby preventing the scattering of particles as described above.

[0058] According to this transfer mechanism 4B, the support columns 41 and 42 are fixed to the transfer region 33, and the movement of the base 71 and the forks 81 and 82 in the Y direction is achieved by the first arm 61 and the second arm 62 supported by the support columns 41 and 42 via the slider 51 and the base body 52. ​​Therefore, compared to a configuration in which the base 71 and the forks 81 and 82 are moved by, for example, the movement of the support columns 41 and 42 in the Y direction, the volume of the structure moving in the transfer region 33 can be kept relatively small, thereby preventing the movement of the structure from disturbing the airflow in the transfer region 33 and causing particles to scatter and adhere to the wafer W. Therefore, according to the transfer mechanism 4B, the rotation of the first arm 61 and the second arm 62 enables the transfer of wafers W over a wide lateral range, while preventing a decrease in the yield of semiconductor devices manufactured from the wafers W.

[0059] According to the transfer mechanism 4B, the base end of the first arm 61 is connected to the underside of the base body 52, the base end of the second arm 62 is connected to the upper side of the tip end of the first arm 61, and the forks 81 and 82 are provided above the second arm 62 via the base 71. Therefore, the thickness (vertical length) of the structure consisting of the base body 52, the first arm 61, and the second arm 62 can be reduced, and the forks 81 and 82 are positioned above the first arm 61 and the second arm 62. Positioning the forks 81 and 82 in this manner prevents particles from adhering to the wafers W, even if they are released and fall from the pulleys or belts included in the first arm 61 and the second arm 62. This more reliably prevents the yield of semiconductor products from decreasing. In this example, the forks 81 and 82 are also positioned above the base body 52, which is preferable because it also prevents particles from adhering to the wafers W from the base body 52. Furthermore, the small thickness of the structure consisting of the base body 52, the first arm 61, and the second arm 62 means that the height of the space below the forks 81, 82 where wafers W cannot be transported is small. That is, since wafers W can be transported over a wide range in the vertical direction, the degree of freedom in the height layout of the modules to which wafers W are transferred by the transport mechanism 4B is increased. Therefore, it is possible to stack the resist film forming modules 31 and heating modules 34 in a relatively large number, as illustrated.

[0060] 5, the height of the upper end of the structure (=the height of the upper surfaces of the housings 52A and 62A) is the same as the height of the upper end of the slider 51. Furthermore, the height of the lower end of the structure (=the height of the lower surface of the housing 61A) is the same as the height of the lower end of the slider 51. Because the lower end of the structure and the lower end of the slider 51 have the above-mentioned height relationship, the structure is prevented from contacting the bottom of the transfer region 33 and interfering with the downward movement of the slider 51. Furthermore, because the upper end of the structure and the upper end of the slider 51 have the above-mentioned height relationship, the heights of the lower fork 81 and the upper fork 82 are prevented from becoming higher than the upper end of the slider 51, and the height of the space below the forks 81 and 82 where wafer W cannot be transferred is reduced.

[0061] Therefore, by setting the height relationship between the upper end of the slider 51 and the upper end of the structure, and the height relationship between the lower end of the slider 51 and the lower end of the structure as described above, the range of heights accessible by each fork 81, 82 is wide. This increases the degree of freedom in the layout of module heights, allowing a greater number of modules to be stacked. Note that, to achieve the effects described here, the height of the upper end of the structure may be lower than the height of the upper end of the slider 51, and the height of the lower end of the structure may be higher than the height of the lower end of the slider 51. In other words, it is sufficient that the height of the upper end of the structure is located at a height equal to or lower than the height of the upper end of the slider 51, and the height of the lower end of the structure is located at a height equal to or higher than the height of the lower end of the slider 51.

[0062] Furthermore, the transfer mechanism 4B is a SCARA type transfer mechanism as described above, but its tip is configured such that the forks 81 and 82 move forward and backward on the base 71. With this configuration, as exemplified by the transfer of the wafer W to the heating module 34, the wafer W can be loaded and unloaded into and from the module by the forward and backward movement of the forks 81 and 82 without moving the base 71 laterally. Therefore, the wafer W can be loaded and unloaded into and from this module quickly, thereby achieving high throughput for the substrate processing apparatus 1. Furthermore, providing the position detection unit 86 on the base 71 has the advantage that the position of the wafer W can be detected for each of the forks 81 and 82.

[0063] Furthermore, drive mechanism 7A is disposed on the right side of housing 70 of base 71, and drive mechanism 7B is disposed on the left side. Belt 75A and guide 76A constituting drive mechanism 7A are connected to lower fork 81 by connection portion 77A protruding from the left side of housing 70, and belt 75B and guide 76B constituting drive mechanism 7B are connected to upper fork 82 by connection portion 77B protruding from the right side of housing 70. In this manner, drive mechanisms 7A and 7B are disposed on the left and right sides of base 71, and lower fork 81 and upper fork 82 are supported only from one side of base 71, thereby making it possible to make base 71 relatively thin. More specifically, it is assumed that one fork is connected to the drive mechanism in housing 70 of base 71 by connection portions provided on the left and right sides of base 71. In this case, the connection portion of the lower fork 81 and the connection portion of the upper fork 82 must be offset in height so that their operations do not interfere with each other, which increases the thickness of the base 71. In contrast, with the present configuration, there is no need to offset the heights of the connection portions 77A and 77B, so the thickness of the base 71 can be reduced as described above. The reduced thickness of the base 71 allows for a wider lifting and lowering range for the forks 81 and 82. This allows for greater flexibility in the layout of the height of the module to which the wafer W is transferred by the transfer mechanism 4B.

[0064] Furthermore, the lower fork 81 is supported only from the right side of the base 71 by the connection portion 77A, and the upper fork 82 is supported only from the left side of the base 71 by the connection portion 77B. Therefore, since the center of gravity of the connection portion 77A is located at the right end, supporting the connection portion 77A at a position close to this center of gravity prevents slight tilting of the lower fork 81 connected to the connection portion 77A, thereby enabling more reliable and stable transport of the wafer W. Similarly, since the center of gravity of the connection portion 77B is located at the left end, supporting the connection portion 77B at a position close to this center of gravity prevents slight tilting of the upper fork 82 connected to the connection portion 77B, thereby enabling more reliable and stable transport of the wafer W. Therefore, as described above, it is preferable that the guide 76A of the drive mechanism 7A be disposed on the right side of the belt 75A, and the guide 76B of the drive mechanism 7B be disposed on the left side of the belt 75B.

[0065] By providing the pressure sensors 67A, 67B interposed in the exhaust pipes 85A, 85B forming the exhaust paths on the second arm 62, the positions of the sensors are relatively close to the suction holes 84 of the forks 81, 82. This allows the detected values ​​to track changes in the amount of suction from the suction holes 84 relatively well, which is preferable because it allows for highly accurate detection of the presence or absence of an abnormality. While an abnormality in the suction of the wafer W can be detected by monitoring the state of the exhaust path, the state of the exhaust path is not limited to pressure and may be, for example, flow rate. Therefore, instead of the pressure sensors 67A, 67B, flow rate sensors, for example, may be provided on the exhaust pipes 85A, 85B to detect the amount of exhaust.

[0066] The heating module 34 is provided with a hot plate on which the wafer W is placed and heated, and in the resist film forming module 31, a solvent is supplied to increase the wettability of the surface of the wafer W before the resist is supplied. As described above, the motor 91 provided on the support columns 41 and 42 is disposed in the partitioned area 47, so that the motor 91 is prevented from being affected by the heat of the hot plate and from being exposed to the solvent atmosphere. This prevents the life of the motor 91 from being shortened.

[0067] In the above-described exemplary configuration, a power transmission mechanism including a belt and pulleys is used to drive the first arm 61 and the second arm 62 via the motor 53. However, a power transmission mechanism including multiple gears may be used to drive the first arm 61 and the second arm 62. In the above-described exemplary configuration, the motor 91 is provided on both of the support columns 41 and 42. However, the motor may be provided on only one of the support columns 41 and 42. The processing modules stacked on top of each other in the substrate processing apparatus 1 and shared by the transfer mechanism 4B for transferring wafers W are not limited to the coating film forming modules such as the resist film forming module 31 and the heating module 34. They may also be modules that supply various liquids, such as a developer, a cleaning liquid, or an adhesive, to the wafers W, or modules that expose the wafers W. Additionally, an inspection module that captures images of the wafers W to detect abnormalities is also included in the processing modules.

[0068] Second Embodiment A substrate processing apparatus 1A according to a second embodiment will be described with reference to the plan view of FIG. 11, focusing on differences from the substrate processing apparatus 1 according to the first embodiment. The substrate processing apparatus 1A is provided with transport mechanisms 40A, 40B, 40C, and 40D instead of transport mechanisms 4A, 4B, 4C, and 4D, respectively, and transport mechanisms 40B and 40D are shown in FIG. 11. The substrate processing apparatus 1A also differs from the substrate processing apparatus 1 in the arrangement of modules on the -X side of the transport region 33 in each processing block (D21, D22, D31, and D32). The transport mechanisms 40A to 40D have the same configuration, and the arrangement of modules on the -X side is the same among the processing blocks D21, D22, D31, and D32.

[0069] Hereinafter, the first upper processing block D22 and the transport mechanism 40B provided in the first upper processing block D22 will be described as representative examples, with reference also to Figure 12, which is a vertical cross-sectional side view viewed in the +Y direction. As with the substrate processing apparatus 1, seven heating modules 34 are stacked vertically on the -X side of the transport region 33, and two of these stacks are lined up in the Y direction. If the stack on the +Y side is designated 35A and the stack on the -Y side is designated 35B, as shown in Figure 11, one stack, stack 35A, and the other stack, stack 35B, are separated from each other in the Y direction, which is different from the arrangement of processing modules in the substrate processing apparatus 1.

[0070] Similar to the substrate processing apparatus 1, compartmentalized areas 47 equipped with the auxiliary equipment of the modules described above are provided on the +Y side of stack 35A and the -Y side of stack 35B. Accordingly, the auxiliary equipment is provided on either side of stacks 35A and 35B in the Y direction in which stacks 35A and 35B are aligned. The auxiliary equipment of each processing module of stack 35A is provided in compartmentalized area 47 on the +Y side of stack 35A, and the auxiliary equipment of each processing module of stack 35B is provided in compartmentalized area 47 on the -Y side of stack 35B.

[0071] Next, the transfer mechanism 40B will be described, focusing on the differences from the transfer mechanism 4B, with reference to the cross-sectional plan view of FIG. 13. As mentioned above, the transfer mechanism 4B is configured to raise and lower the base body 52 to which the arms are connected using two support columns (support columns 41 and 42), while the transfer mechanism 40B raises and lowers the base body 52 using a single support column (support column 101, described below). By using only one support column, malfunctions caused by misalignment due to distortions of the components included in one support column and the components included in the other support columns are prevented. In other words, the transfer mechanism 40B can transfer wafers W to the destination module with higher accuracy.

[0072] The transport mechanism 4B does not have the support columns 41 and 42, the upper beam 43, the lower beam 44, and the slider 51, but instead has a support column 101. The support column 101 extends vertically at a position closer to the +X direction between the stacks 35A and 35B. Therefore, the support column 101 is located between the stacks 35A and 35B in the Y direction, where the stacks 35A and 35B are aligned. A base body 52 is connected to and supported by the +X side of the support column 101, and the base body 52 moves up and down in the transport region 33 along the extension direction of the support column 101. By providing the support column 101 between the stacks 35A and 35B and positioning the support column 101 outside the transport region 33 as described above, an increase in the size of the transport region 33 in the X direction and, consequently, an increase in the size of the substrate processing apparatus 1A are prevented.

[0073] In the transport mechanism 40B, a fan 55 is provided in the housing 52A of the base main body 52 instead of the slider 51, and the inside of the housing 52A, the inside of the housing 61A of the first arm 61, and the inside of the housing 62A of the second arm 62, which are all connected to one another as described above, are suctioned all at once by the fan 55. In addition, a filter 50 is provided in the housing 52A, and the air sucked in by the fan 55 is released through the filter 50 to the outside of the housing 52A, i.e., into the transport area 33.

[0074] Next, the configuration of the support 101 in the transport mechanism 40B will be described with reference to FIG. 14, which is a schematic perspective view of its internal components. The support 101 includes a housing 102, and a partition plate 103 is provided to divide the interior of the housing 102 into two sections in the X direction. Of the spaces divided by the partition plate 103, the +X side is shown as a front space 104, and the -X side is shown as a rear space 105. On the side of the partition plate 103 facing the front space 104, two guide rails 106 are provided spaced apart in the Y direction and extend vertically, i.e., longitudinally. Therefore, if the +X side on which the base main body 52 is provided relative to the support 101 is considered the front side, the guide rails 106 are lined up on the left and right.

[0075] Pulleys 107 and 108 are provided between two guide rails 106 in the Y direction. Pulleys 107 and 108 are located at the upper and lower ends, respectively, of front space 104 and are rotatable around axes extending in the X direction. An endless belt 108 is looped around pulleys 107 and 108. A motor 109, which is a fourth driving device, is provided so as to protrude in the -X direction from the upper end of housing 102. Therefore, motor 109 is also provided sandwiched between stacks 35A and 35B, just like support column 101, and motor 109 is connected to pulley 107.

[0076] A slider 111 is also provided in the front space 104. The slider 111 includes two sliding portions 112 each connected to the guide rails 106 and a main portion 113 forming a recess that opens toward the -X side in a plan view, and the sliding portions 112 are formed so as to extend from the edge of the recess toward the outside of the recess in a plan view. The belt 108 fits into the recess formed by the main portion 113 in a plan view, and the belt 108 and the main portion 113 are connected to each other. With this configuration, the belt 108 is rotated by the motor 109, and the slider 111 moves up and down along the guide rails 106. Note that the slider 111 connected to the two guide rails 106 in this way is moved up and down by a single motor 109, and therefore the motor 109 is a driving device common to the two guide rails 106.

[0077] Two slits 131 that open into the front space 104 are formed in the +X-side side surface of the housing 102 (the side surface facing the conveying area 33), and each slit 131 extends vertically. The two slits 131 are spaced apart in the Y direction and face the guide rails 106. Rollers 132 and 133 are provided at the upper and lower ends of the front space 104, respectively. Two rollers 132 and 133 are provided, spaced apart in the Y direction, so as to be aligned vertically. Each roller 132 and 133 is rotatable around an axis extending in the Y direction. An endless seal belt 134 is provided for each pair of rollers 132 and 133 aligned vertically, and is looped around the pair of rollers 132 and 133 to close the slit 131. A portion of each seal belt 134 is open, and the slider 111 and the base body 52 are connected to each other via a connecting member 135 provided in the opening. Therefore, as the slider 111 moves up and down, the base body 52 moves up and down along the extension direction of the guide rail 106. In this embodiment, the support 101 and the motor 109 correspond to an elevator unit, and the base body 52 corresponds to a base that moves up and down by the elevator unit.

[0078] The base body 52 connected to the slider 111 supports the first arm 61, the second arm 62, and the base 71 described above. To reduce the load on the guide rail 106 resulting from supporting multiple components and to extend the life of the guide rail 106, it is preferable to provide multiple guide rails 106 arranged side by side in the Y direction, as described above. From another perspective, providing multiple guide rails 106 in this manner allows the slider 111 to be raised and lowered even with a single support column, thereby reducing the installation space for the support column. Therefore, providing multiple guide rails 106 contributes to reducing the floor space occupied by the substrate processing apparatus 1A. To achieve this effect, two or more guide rails 106 may be provided.

[0079] 12 and 13, fans 141 and 142 are provided at the upper and lower ends of rear space 105, respectively, and fans 141 and 142 are located on the -Y and +Y sides, respectively, of the position where belt 108 is provided. Partition plate 103 has holes 143 and 144 at positions facing fans 141 and 142, respectively. Fans 141 and 142 allow air in conveying region 33 to flow into front space 104 through the gap between seal belt 134 and the opening edge of slit 131, and then flow through holes 143 and 144 to join in rear space 105. An exhaust path (not shown) connected to rear space 105 is provided in housing 102, and air that has flowed into rear space 105 flows into this exhaust path and is removed.

[0080] As described above, the formation of an airflow from the transfer region 33 toward the rear space 105 prevents particles generated in the components provided in the front space 104 from being released into the transfer region 33 through the gap between the seal belt 134 and the opening edge of the slit 131. In addition to the fans 141 and 142, the rear space 105 also stores various cables for driving the components of the transfer mechanism 4B, as well as members for bundling, protecting, and guiding the cables, but these are not shown. In the substrate processing apparatus 1A, the first upper processing block D22 and transfer mechanism 40B described above are used, and wafers W are transferred and processed along the same transfer path as in the substrate processing apparatus 1.

[0081] In the substrate processing apparatus 1A, because of this transfer path, the wafer W is transferred between adjacent processing blocks in the Y direction, and therefore the wafer W moves between one end and the other end in the Y direction of the transfer region 33 in the first upper processing block D22. However, the substrate processing apparatus does not necessarily have to have the processing blocks adjacent in the Y direction. For example, it is possible to configure the apparatus so that the transfer path is such that the wafer W transferred from the carrier block D1 to the upper processing block D22 is processed in the processing modules forming the stack 35A, 35B, and then returned to the carrier block D1.

[0082] In such an apparatus configuration, the two compartmentalized areas 47, each equipped with ancillary equipment, are arranged to sandwich the stacks 35A and 35B, as described above. Therefore, when transferring a wafer W to a processing module constituting the stacks 35A and 35B, it is not necessary to move the wafer W to the -Y end of the transfer area 33. Furthermore, a transfer path is assumed in which the wafer W is transferred and processed between the processing module constituting the stack 35A and the processing module constituting the stack 35B. In the above layout, only the support columns 101 are interposed between the stacks 35A and 35B, and the stacks 35A and 35B are located close to each other. This shortens the transfer time between the processing module of the stack 35A and the processing module of the stack 35B. For these reasons, the above-described layout of the compartmentalized areas 47 and the stacks 35A and 35B can improve the throughput of the substrate processing apparatus.

[0083] Continuing with FIG. 15, FIG. 15 is a cross-sectional plan view showing a modified example of the support pillar 101 of the transport mechanism 4B. A partition member 150 is provided in the front space 104 of the support pillar 101 and is adjacent to the belt 108 in the X direction. The partition member 150 partitions the front space 104 into three partitioned areas 151, 152, and 153. Areas 151 and 152 are areas outside the circular belt 108 and each include a guide rail 106. Holes 143 and 144 are opened in the partitioned areas 151 and 152, respectively, and therefore, air is exhausted by the fans 141 and 142, respectively. The partitioned area 153 is an area surrounded by the belt 108, and the partition plate 103 is provided with a hole 145 that opens into the partitioned area 153. A fan 146 is provided in the rear space 105 so as to face the hole 145 and exhausts air from the partitioned area 153 through the hole 145 .

[0084] In this manner, in this modified example, fans 141, 142, and 146, which serve as exhaust mechanisms, are provided corresponding to partitioned areas 151, 152, and 153, respectively. Note that fan 146 does not necessarily have to be provided because fans 141 and 142 can also exhaust air from partitioned area 153 through the gap between belt 108 and partition member 150. Even in this case, fans 141 and 142, which serve as exhaust mechanisms, are provided corresponding to partitioned areas 151 and 152, respectively. By configuring the interior of housing 102 to be divided into a plurality of areas and providing exhaust mechanisms corresponding to each of the partitioned areas to perform exhaust, exhaust efficiency in each partitioned area is improved, and the release of particles from inside housing 102 to transport area 33 is more reliably suppressed.

[0085] It should be noted that the embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects, and various omissions, substitutions, modifications, and combinations may be made to the above-described embodiments without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0086] W wafer 34 Heating Module 41, 42 pillars 51 Slider 52 Base body 53 Motor 61 1st arm 62 2nd arm 81, 82 Fork

Claims

1. A substrate transport mechanism that processes a substrate and transfers the substrate to each of a plurality of stacked processing modules, comprising: a base including a first drive device; a lifting unit that lifts and lowers the base; a first arm extending laterally from a lower side of the base, the first arm having a tip end that is rotated about a vertical axis relative to the base by the first driving device; a second arm extending laterally from above the tip of the first arm and having a tip that rotates about a vertical axis relative to the first arm as the first arm rotates; a holder for the substrate provided above a tip end of the second arm and rotatable about a vertical axis relative to the second arm; Equipped with a base that rotates around a vertical axis relative to the second arm is provided on an upper side of a tip end of the second arm, the holding portion is provided on the upper side of the base so as to be movable forward and backward relative to the base, the holding portions include a first holding portion and a second holding portion that are arranged vertically relative to each other and each hold the substrate; When the advancing and retreating directions of the first holding unit and the second holding unit are defined as a front-rear direction, a first advancing and retreating mechanism for advancing and retreating the first holding unit and a second advancing and retreating mechanism for advancing and retreating the second holding unit are provided on one side of the left and right of the base and the other side of the base, respectively; A substrate transport mechanism in which a first connection portion that connects the first holding portion to the first advancing / retreating mechanism is provided only on one of the left and right sides of the base, and a second connection portion that connects the second holding portion to the second advancing / retreating mechanism is provided only on the other of the left and right sides of the base.

2. A substrate transport mechanism that processes a substrate and transfers the substrate to each of a plurality of stacked processing modules, comprising: a base including a first drive device; a lifting unit that lifts and lowers the base; a first arm extending laterally from a lower side of the base, the first arm having a tip end that is rotated about a vertical axis relative to the base by the first driving device; a second arm extending laterally from above the tip of the first arm and having a tip that rotates about a vertical axis relative to the first arm as the first arm rotates; a holder for the substrate provided above a tip end of the second arm and rotatable about a vertical axis relative to the second arm; Equipped with a base that rotates around a vertical axis relative to the second arm is provided on an upper side of a tip end of the second arm, the holding portion is provided on the upper side of the base so as to be movable forward and backward relative to the base, the holding portions include a first holding portion and a second holding portion that are arranged vertically relative to each other and each hold the substrate; The substrate transport mechanism includes a holding portion having a suction hole for holding the substrate by suction, and a sensor for detecting the state of an exhaust path connected to the suction hole is provided on the second arm.

3. A substrate transport mechanism that processes a substrate and transfers the substrate to each of a plurality of stacked processing modules, comprising: a base including a first drive device; a lifting unit that lifts and lowers the base; a first arm extending laterally from a lower side of the base, the first arm having a tip end that is rotated about a vertical axis relative to the base by the first driving device; a second arm extending laterally from above the tip of the first arm and having a tip that rotates about a vertical axis relative to the first arm as the first arm rotates; a holder for the substrate provided above a tip end of the second arm and rotatable about a vertical axis relative to the second arm; Equipped with If the side where the base portion is provided with respect to the lifting portion is defined as the front side, The lifting unit includes a plurality of rails aligned laterally and extending vertically; a fourth driving device common to each of the rails for raising and lowering the base along the extending direction of each of the rails; A substrate transport mechanism comprising:

4. the stack of processing modules includes laterally spaced stacks and other stacks; 4. The substrate transport mechanism according to claim 1, wherein the lifting section is provided between the first stack and the second stack.

5. The stack of processing modules includes one stack and another stack aligned in a horizontal direction, 5. A substrate transport mechanism according to claim 1, wherein ancillary equipment of the processing module is provided to sandwich the one stack and the other stack in the direction in which the one stack and the other stack are aligned.

6. If the side where the base portion is provided with respect to the lifting portion is defined as the front side, The lifting unit includes a plurality of rails aligned laterally and extending vertically; a fourth driving device common to each of the rails for raising and lowering the base along the extending direction of each of the rails; 6. The substrate transport mechanism according to claim 1, further comprising:

7. The base portion is a slider that is supported by the lifting unit and moves up and down; a base body that protrudes laterally from an upper side of the slider and on which the first drive device is provided; 3. The substrate transport mechanism according to claim 1, wherein a base end of the first arm is connected to a lower side of the base body.

8. the lifting unit includes a first support column and a second support column extending in a vertical direction and spaced apart from each other in a horizontal direction; The slider extends laterally, and one end and the other end are connected to the first support column and the second support column, respectively.

8. The substrate transport mechanism according to claim 7, wherein the base body is provided so as to protrude from the slider in a direction intersecting the extension direction of the slider.

9. At least one of the first support column and the second support column is provided with a second driving device for obtaining a driving force for raising and lowering the slider, 9. The substrate transport mechanism according to claim 8, wherein the second driving device is provided in an area separated from an area in which the processing module is provided.

10. an internal space is formed in the first support column and the second support column along the length direction of each support column and equipped with an elevating mechanism for elevating the slider; 10. The substrate transfer mechanism according to claim 8, wherein first exhaust mechanisms for exhausting the internal space are provided at the top and bottom of the internal space.

11. The lifting section includes a first beam connecting an upper end of the first support column and an upper end of the second support column to each other; a second beam connecting a lower end of the first support column and a lower end of the second support column to each other, 11. The substrate transport mechanism according to claim 8, wherein the first support column and the second support column are fixed along a vertical direction to a housing that encloses the processing module and the substrate transport mechanism.

12. a base that rotates about a vertical axis relative to the second arm is provided above a tip end of the second arm, the holding unit is provided above the base so as to be able to advance and retreat relative to the base, and the base includes a third driving device for moving the holding unit forward and backward; the base body, the first arm, and the second arm each include a base body housing, a first arm housing, and a second arm housing, each housing accommodating a cable connected to the third drive device; an upper end of the second arm housing and an upper end of the base main body housing are located at a height equal to or lower than an upper end of the slider; 12. The substrate transport mechanism according to claim 7, wherein a lower end of the first arm housing is positioned at a height equal to or higher than a lower end of the slider.

13. the slider, the base body, the first arm, and the second arm each include a slider housing, a base body housing, a first arm housing, and a second arm housing, a communication passage is provided that communicates the slider housing, the inside of the base main body housing, the inside of the first arm housing, and the inside of the second arm housing; 13. The substrate transport mechanism according to claim 7, wherein the slider is provided with a second exhaust mechanism that exhausts air from the inside of the slider housing, the inside of the base body housing, the inside of the first arm housing, and the inside of the second arm housing through the communication passage.

14. 1. A substrate transport method for processing a substrate and transferring the substrate to each of a plurality of stacked processing modules by a substrate transport mechanism, comprising: a step of lifting and lowering a base unit including a first drive device by a lifting unit; a step of rotating a tip end portion of a first arm portion extending laterally from a lower side of the base portion about a vertical axis relative to the base portion by the first driving device; a step of rotating a tip end of a second arm portion extending laterally from above the tip end of the first arm portion about a vertical axis relative to the first arm portion together with the rotation of the first arm portion; a step of rotating a substrate holder provided on an upper side of a tip end of the second arm portion about a vertical axis relative to the second arm portion; a step of rotating a base provided on an upper side of a tip end portion of the second arm portion about a vertical axis relative to the second arm portion; and moving the holding portion provided on the upper side of the base toward and away from the base, the holding parts are provided with a first holding part and a second holding part that are arranged in a vertical direction relative to each other and each hold the substrate, and when the advancing and retreating directions of the first holding part and the second holding part are defined as a front-rear direction, a step of advancing and retreating the first holding part by a first advancing and retreating mechanism that is provided on one of the left and right sides of the base; and advancing and retracting the second holding part by a second advancing and retracting mechanism provided on the other of the left and right sides of the base, A substrate transport method in which a first connection portion connecting the first holding portion to the first advancing / retreating mechanism is provided only on one of the left and right sides of the base, and a second connection portion connecting the second holding portion to the second advancing / retreating mechanism is provided only on the other of the left and right sides of the base.

15. 1. A substrate transport method for processing a substrate and transferring the substrate to each of a plurality of stacked processing modules by a substrate transport mechanism, comprising: a step of lifting and lowering a base unit including a first drive device by a lifting unit; a step of rotating a tip end portion of a first arm portion extending laterally from a lower side of the base portion about a vertical axis relative to the base portion by the first driving device; a step of rotating a tip end of a second arm portion extending laterally from above the tip end of the first arm portion about a vertical axis relative to the first arm portion together with the rotation of the first arm portion; a step of rotating a substrate holder provided on an upper side of a tip end of the second arm portion about a vertical axis relative to the second arm portion; a step of rotating a base provided on an upper side of a tip end portion of the second arm portion about a vertical axis relative to the second arm portion; a step of moving the holding portion provided on the upper side of the base toward and away from the base; a step of holding the substrate by suction using a suction hole provided in the holder; detecting a state of an exhaust path connected to the suction hole by a sensor provided in the second arm; A substrate transport method comprising:

16. 1. A substrate transport method for processing a substrate and transferring the substrate to each of a plurality of stacked processing modules by a substrate transport mechanism, comprising: a step of lifting and lowering a base unit including a first drive device by a lifting unit; a step of rotating a tip end portion of a first arm portion extending laterally from a lower side of the base portion about a vertical axis relative to the base portion by the first driving device; a step of rotating a tip end of a second arm portion extending laterally from above the tip end of the first arm portion about a vertical axis relative to the first arm portion together with the rotation of the first arm portion; a step of rotating a substrate holder provided on an upper side of a tip end of the second arm portion about a vertical axis relative to the second arm portion; Equipped with When the side of the lifting unit where the base is provided is defined as the front side, the lifting unit includes a plurality of rails that are aligned on the left and right and extend in a vertical direction, A substrate transport method comprising the step of raising and lowering the base along the extension direction of each of the rails by a fourth driving device common to each of the rails.

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