Exposure apparatus and manufacturing method

Abstract

To reduce the size (narrowing of footprint) of a device.SOLUTION: An exposure device includes an optical system for irradiating a substrate with light, a stage device moving while holding the substrate, a holding part for holding the substrate, a chamber for storing the optical system, the stage device, and the holding part, and a control device for moving the stage device, wherein the stage device includes a holding device, the holding part is positioned at a position capable of holding the substrate in a state where the substrate is positioned in an opening of the chamber, and the control device makes the holding device hold a part not overlapping an exposure region in the substrate held by the holding part, in a state where the stage device is positioned below the holding part, moves the stage device to become far from the holding part, in a state of making the holding device hold a part of the substrate so as to make the stage device receive the substrate from the holding part, and makes the optical system irradiate the substrate with light while moving the stage device holding the substrate with respect to the optical system.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to an exposure apparatus and a manufacturing method. [Background technology]

[0002] In the lithography process for manufacturing electronic devices such as liquid crystal display elements and semiconductor elements, an exposure apparatus is used to transfer a pattern formed on a mask (or reticle) onto a substrate (such as a substrate made of glass or plastic, or a semiconductor wafer) using an energy beam.

[0003] In this type of exposure apparatus, a substrate transport device is used to transport an exposed substrate out of a stage device that holds the substrate, and to transport a new substrate onto the stage device. As a substrate transport method, for example, the method described in Patent Document 1 is known. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2013 / 150787 Summary of the Invention [Means for solving the problem]

[0005] The exposure apparatus includes an optical system that irradiates a substrate, a stage device that moves while holding the substrate, a holding unit that holds the substrate, a chamber that houses the optical system, the stage device, and the holding unit, and a control device that moves the stage device, wherein the stage device includes a holding unit that is positioned at a position where it can hold the substrate while the substrate is positioned within the opening of the chamber, and the control device, while the stage device is positioned below the holding unit, causes the holding unit to hold a portion of the substrate held by the holding unit that does not overlap with the exposure area, and while the holding unit holds this portion of the substrate so that the stage device receives the substrate from the holding unit, moves the stage device away from the holding unit, and causes the optical system to irradiate the substrate while moving the stage device that is holding the substrate relative to the optical system.

[0006] The configurations of the embodiments described below may be modified as appropriate, and at least a portion of the configuration may be replaced with other components. Furthermore, components that are not particularly limited in terms of their placement may be placed in any position that can achieve their function, not limited to the placement disclosed in the embodiments. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1(a) is a diagram that shows a schematic view of an exposure apparatus according to a first embodiment, and FIG. 1(b) is a cross-sectional view taken along line AA in FIG. 1(a). [Figure 2] FIG. 1(b) is a cross-sectional view of FIG. [Figure 3] FIG. 3(a) is a diagram showing the substrate loading / unloading unit of FIG. 1(a) taken out, and FIG. 3(b) is a diagram showing the substrate loading / unloading unit of FIG. 3(a) as viewed from the +X side. [Figure 4] 4(a) and 4(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1(a), and are diagrams (part 1) for explaining the substrate exchange operation of the first embodiment. [Figure 5]5(a) and 5(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1(a), and are diagrams (part 2) for explaining the substrate exchange operation of the first embodiment. [Figure 6] 6(a) and 6(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1(a), respectively, and are diagrams (part 3) for explaining the substrate exchange operation of the first embodiment. [Figure 7] 7(a) and 7(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1(a), respectively, and are diagrams (part 4) for explaining the substrate exchange operation of the first embodiment. [Figure 8] 8(a) and 8(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1(a), and are diagrams (part 5) for explaining the substrate exchange operation of the first embodiment. [Figure 9] 9(a) and 9(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1(a), and are diagrams (part 6) for explaining the substrate exchange operation of the first embodiment. [Figure 10] 10(a) and 10(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1(a), and are diagrams (part 7) for explaining the substrate exchange operation of the first embodiment. [Figure 11] 11(a) and 11(b) are a plan view of the vicinity of the stage device and a cross-sectional view taken along line AA in FIG. 1(a), and are diagrams (part 8) for explaining the substrate exchange operation of the first embodiment. [Figure 12] FIG. 1 is a diagram (part 1) showing an exposure apparatus according to a second embodiment. [Figure 13] FIG. 10 is a diagram (part 2) showing the exposure apparatus according to the second embodiment. [Figure 14] FIG. 10 is a cross-sectional view of an exposure apparatus according to a third embodiment. [Figure 15] 15(a) and 15(b) are a plan view and a longitudinal sectional view of the vicinity of the stage device, and are diagrams (part 1) for explaining the substrate exchange operation of the third embodiment. [Figure 16]16(a) and 16(b) are a plan view and a longitudinal sectional view of the vicinity of the stage device, and are diagrams (part 2) for explaining the substrate exchange operation of the third embodiment. [Figure 17] 17(a) and 17(b) are a plan view and a longitudinal sectional view of the vicinity of the stage device, and are views (part 3) for explaining the substrate exchange operation of the third embodiment. [Figure 18] 18(a) and 18(b) are a plan view and a longitudinal sectional view of the vicinity of the stage device, and are diagrams (part 4) for explaining the substrate exchange operation of the third embodiment. [Figure 19] 19(a) and 19(b) are a plan view and a longitudinal cross-sectional view of the vicinity of the stage device of the exposure apparatus according to the fourth embodiment, and are views (part 1) for explaining the substrate replacement operation. [Figure 20] 20(a) and 20(b) are a plan view and a longitudinal cross-sectional view of the vicinity of the stage device of the exposure apparatus according to the fourth embodiment, and are views (part 2) for explaining the substrate replacement operation. [Figure 21] 21(a) and 21(b) are diagrams for explaining a substrate carry-in / out unit according to the fifth embodiment. [Figure 22] 22(a) and 22(b) are a horizontal cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to a sixth embodiment, and are views (part 1) for explaining the substrate replacement operation. [Figure 23] 23(a) and 23(b) are a cross-sectional view and a longitudinal-sectional view of an exposure apparatus according to a sixth embodiment, and are views (part 2) for explaining the substrate replacement operation. [Figure 24] FIG. 13 is a longitudinal cross-sectional view of the exposure apparatus according to the sixth embodiment, and is a view (part 3) for explaining the substrate replacement operation. [Figure 25] FIG. 13 is a vertical cross-sectional view of an exposure apparatus according to a seventh embodiment. [Figure 26] 26(a) and 26(b) are a horizontal cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to an eighth embodiment, and are views (part 1) for explaining the substrate replacement operation. [Figure 27]27(a) and 27(b) are diagrams (part 2) for explaining the substrate replacement operation of the eighth embodiment. [Figure 28] 28(a) and 28(b) are diagrams (part 3) for explaining the substrate replacement operation of the eighth embodiment. [Figure 29] 29(a) and 29(b) are diagrams (part 4) for explaining the substrate replacement operation of the eighth embodiment. [Figure 30] 30(a) and 30(b) are diagrams (part 5) for explaining the substrate replacement operation of the eighth embodiment. [Figure 31] 31(a) and 31(b) are a horizontal cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to a ninth embodiment, and are views (part 1) for explaining the substrate exchange operation. [Figure 32] 32(a) and 32(b) are views (part 2) for explaining the substrate exchange operation in the exposure apparatus according to the ninth embodiment. [Figure 33] 33(a) and 33(b) are cross-sectional views of the exposure apparatus according to the tenth embodiment, and are views (part 1) for explaining the substrate replacement operation. [Figure 34] 34(a) and 34(b) are cross-sectional views of the exposure apparatus according to the tenth embodiment, and are views (part 2) for explaining the substrate replacement operation. [Figure 35] 35(a) and 35(b) are a horizontal cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to an eleventh embodiment, and are views (part 1) for explaining the substrate replacement operation. [Figure 36] 36(a) and 36(b) are a cross-sectional view and a longitudinal-sectional view of an exposure apparatus according to an eleventh embodiment, and are views (part 2) for explaining the substrate exchange operation. [Figure 37] 37(a) and 37(b) are a cross-sectional view and a longitudinal-sectional view of an exposure apparatus according to an eleventh embodiment, and are views (part 3) for explaining the substrate replacement operation. [Figure 38] 38(a) to 38(c) are vertical cross-sectional views of the exposure apparatus according to the eleventh embodiment, and are views (part 4) for explaining the substrate replacement operation. [Figure 39] FIG. 39(a) is a vertical cross-sectional view of the vicinity of the partition member according to the twelfth embodiment, and FIG. 39(b) is a cross-sectional view taken along line BB in FIG. 39(a). [Figure 40] 40(a) and 40(b) are diagrams (part 1) for explaining the substrate replacement operation in the twelfth embodiment. [Figure 41] 41(a) to 41(c) are diagrams (part 2) for explaining the substrate replacement operation in the twelfth embodiment. [Figure 42] FIG. 10 is a diagram for explaining a modified example (part 1) of the board feeder. [Figure 43] 43(a) and 43(b) are diagrams for explaining a modified example (part 2) of the board feeder. DETAILED DESCRIPTION OF THE INVENTION

[0008] First Embodiment A first embodiment of the present invention will be described below with reference to FIGS.

[0009] Fig. 1(a) is a longitudinal cross-sectional view that schematically shows the configuration of an exposure apparatus 100 according to the first embodiment. Fig. 1(b) shows a cross-sectional view taken along line AA in Fig. 1(a), and Fig. 2 shows a transverse cross-sectional view of Fig. 1(a). For convenience, a chamber 200 and an illumination system 12 are omitted from Fig. 1(b).

[0010] 1(a), exposure apparatus 100 includes a chamber 200, and an exposure apparatus main body 10, a substrate carry-in / out unit 150, and a substrate slide hand 140 housed in chamber 200. An external transfer robot 300 is provided outside chamber 200 of exposure apparatus 100, and the external transfer robot 300 transports substrates P from an external device (not shown) to exposure apparatus 100 and transports substrates P from exposure apparatus 100 to the external device.

[0011] (Chamber 200) The chamber 200 forms a space in which the internal environment (at least one of temperature, humidity, pressure, and cleanliness) is adjusted, and an opening 200a used for loading and unloading the substrate P is formed in part of the chamber.

[0012] (Exposure device body 10) The exposure apparatus main body 10 is a step-and-scan projection exposure apparatus, or so-called scanner, that uses a rectangular (square) glass substrate P (hereinafter simply referred to as substrate P) used in, for example, a liquid crystal display device (flat panel display) as an exposure object.

[0013] The exposure apparatus main body 10 includes an illumination system 12, a mask stage 14 that holds a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, a stage device 20 that holds a substrate P whose surface (the surface facing the +Z side in FIG. 1(a)) is coated with a resist (sensitizer), and control systems for these components. Hereinafter, as shown in FIG. 1(a), an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other are set for the exposure apparatus main body 10, and during exposure, the mask M and the substrate P are scanned relative to the projection optical system 16 along the X-axis, with the Y-axis set within a horizontal plane. The rotation (tilt) directions about the X-axis, Y-axis, and Z-axis are referred to as the θx, θy, and θz directions, respectively. Positions in the X-axis, Y-axis, and Z-axis directions are referred to as the X-position, Y-position, and Z-position, respectively.

[0014] Illumination system 12 is configured similarly to the illumination system disclosed in, for example, U.S. Pat. No. 5,729,331, and irradiates exposure illumination light (illumination light) IL onto mask M. The illumination light IL is light that includes at least one wavelength selected from the i-line (wavelength 365 nm), g-line (wavelength 436 nm), and h-line (wavelength 405 nm). The light source used in illumination system 12 and the wavelength of the illumination light IL emitted from the light source are not particularly limited, and may be, for example, ultraviolet light such as ArF excimer laser light (wavelength 193 nm) or KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F2 laser light (wavelength 157 nm).

[0015] The mask stage 14 holds a transmissive mask M. The mask stage 14 is mounted in a non-contact state on a pair of mask stage guides 218 fixed on a lens barrel base 216. The pair of mask stage guides 218 are rectangular column-shaped members with their longitudinal direction along the X-axis and are arranged at a predetermined interval along the Y-axis, as shown in FIG. 1(b). The mask stage 14 is driven by a mask stage drive system (not shown) including, for example, a linear motor, at a predetermined stroke in the scanning direction (X-axis direction). The mask stage 14 is also driven by a fine-motion drive system that moves its X and Y positions by a stroke to adjust its relative position with respect to at least one of the illumination system 12, the stage device 20, and the projection optical system 16. Position information of the mask stage 14 is obtained by a mask stage position measurement system (not shown) including, for example, a linear encoder system and an interferometer system.

[0016] The projection optical system 16 is supported by a barrel base 216 below (on the -Z side of) the mask stage 14. The projection optical system 16 is a so-called multi-lens type projection optical system having a configuration similar to that of the projection optical system disclosed in, for example, U.S. Pat. No. 6,552,775, and includes, for example, multiple bilaterally telecentric optical systems that form erect, normal images. Note that the projection optical system 16 does not have to be a multi-lens type. It may also be configured with a single projection optical system, such as that used in semiconductor exposure apparatuses.

[0017] In the exposure apparatus main body 10, when the mask M located within a predetermined illumination area is illuminated by the illumination light IL from the illumination system 12, a projected image (a partial pattern image) of the pattern of the mask M within the illumination area is formed in the exposure area by the projection optical system 16. Then, the mask M moves relative to the illumination area (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure area in the scanning direction, thereby performing scanning exposure on the substrate P and transferring the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M).

[0018] The stage device 20 includes a base 22, a substrate table 24, a support device 26, and a substrate holder 28.

[0019] The surface plate 22 is provided on a pair of stage pedestals 212 supported from below by vibration isolation devices 210 installed on the floor F. The pair of stage pedestals 212 support a pair of side columns 214, which in turn support a lens barrel surface plate 216. The surface plate 22 is made of a plate-like member that is rectangular in plan view (seen from the +Z side) and is arranged so that its upper surface (+Z surface) is parallel to the XY plane, for example.

[0020] The support device 26 is placed on the surface plate 22 in a non-contact manner and supports the substrate table 24 from below in a non-contact manner. The substrate holder 28 is placed on the substrate table 24, and the substrate table 24 and the substrate holder 28 are driven together by a stage drive system (not shown) provided in the stage device 20. The stage drive system includes a coarse movement system, for example, including a linear motor, that can drive the substrate table 24 in the X-axis and Y-axis directions (along the upper surface of the surface plate 22) at a predetermined stroke, and a fine movement system, for example, including a voice coil motor, that finely moves the substrate table 24 in six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz). The stage device 20 also includes a stage measurement system, for example, including an optical interferometer system and an encoder system, that determines position information of the substrate table 24 in the six degrees of freedom directions. 1(b) and 2 show Y interferometer 32Y, which is included in the stage measurement system, and Y movable mirror (bar mirror) 34Y, which has a reflecting surface perpendicular to the Y axis. Y movable mirror 34Y is fixed to substrate table 24.

[0021] The substrate holder 28 has an upper surface 28u (the surface on the +Z side) that is rectangular in plan view, and the substrate P is placed on the upper surface 28u. As shown in FIG. 2, the aspect ratio of the upper surface 28u of the substrate holder 28 is approximately the same as that of the substrate P. As an example, the lengths of the long and short sides of the upper surface 28u are set to be slightly shorter than the lengths of the long and short sides of the substrate P, respectively.

[0022] The upper surface 28u of the substrate holder 28 is finished flat across its entire surface. The upper surface 28u of the substrate holder 28 is also formed with a plurality of minute holes (not shown) for air blowing and a plurality of minute holes (not shown) for vacuum suction. A common hole may be used as both the minute holes for air blowing and the minute holes for vacuum suction. The substrate holder 28 uses a vacuum suction force supplied from a vacuum device (not shown) to suck air between the upper surface 28u and the substrate P through the plurality of holes, thereby adsorbing (correcting the flatness of) the substrate P to the upper surface 28u. The substrate holder 28 is a so-called pin chuck-type holder, and has a plurality of pins (very small, e.g., about 1 mm in diameter) arranged at approximately equal intervals. By providing these pins, the substrate holder 28 can reduce the possibility of dust or foreign matter being trapped on the backside of the substrate P while supporting it, thereby reducing the possibility of deformation of the substrate P due to the trapped foreign matter. The substrate P is held (supported) on the upper surfaces of the multiple pins. The XY plane formed by the upper surfaces of the multiple pins is the upper surface of the substrate holder 28. The substrate holder 28 can supply (supply) pressurized gas (e.g., air) from a pressurized gas supply device (not shown) between the upper surface 28u and the substrate P through the holes, thereby separating the back surface of the substrate P attracted to the substrate holder 28 from the upper surface 28u (floating the substrate P). The grounding state of the substrate P can be controlled (e.g., to prevent air pockets from forming between the back surface of the substrate P and the upper surface 28u of the substrate holder 28) by varying the timing at which the pressurized gas is supplied to each of the multiple holes formed in the substrate holder 28, appropriately switching the locations of the holes for vacuum suction and the holes for supplying the pressurized gas, or appropriately changing the air pressure between suction and air supply.

[0023] The substrate holder 28 may perform flatness correction on the substrate P in a state in which the substrate P is supported in a floating state, rather than being adsorbed to the upper surface 28u. In this case, the substrate holder 28 supplies (introduces) pressurized gas (e.g., air) from a pressurized gas supply device (not shown) to the back surface of the substrate P through the holes, thereby interposing gas between the lower surface of the substrate P and the upper surface 28u of the substrate holder 28 (i.e., forming a gas film). The substrate holder 28 also uses a vacuum suction device to suck gas between the substrate holder 28 and the substrate P through the vacuum suction holes, and applies a downward force (preload) in the direction of gravity to the substrate P, thereby imparting rigidity in the direction of gravity to the gas film. Substrate holder 28 may levitate substrate P in the Z-axis direction via a small clearance and hold (support) it in a non-contact manner by balancing the pressure and flow rate of the pressurized gas with the vacuum suction force, while exerting a force on substrate P to control its flatness (for example, a force to correct or correct flatness). Note that the holes may be formed by processing substrate holder 28, or substrate holder 28 may be formed from a porous material so that air can be supplied or sucked. Furthermore, upper surface 28u of substrate holder 28, which levitates and supports substrate P, is not the surface on which the holes are formed, but a virtual surface located above that surface by the above-mentioned clearance, i.e., the upper surface of the substrate whose flatness has been corrected, is referred to as upper surface 28u.

[0024] As shown in FIGS. 1(a) and 2, two notches 28a are formed at the end of the upper surface 28u of the substrate holder 28 on the -X side, spaced apart in the Y-axis direction. A substrate carry-in bearer device 25 is provided near the two notches 28a. The substrate carry-in bearer device 25 includes a suction pad 27 that suction-holds the lower surface of the substrate P by vacuum suction force supplied from a vacuum device (not shown), a Z drive mechanism 23Z that drives the suction pad 27 along the Z-axis direction, and a Y drive mechanism 23Y that drives the Z drive mechanism 23Z (and the suction pad 27) along the Y-axis direction. When the suction pad 27 is positioned furthest on the -Z side, it is positioned within the notch 28a formed in the substrate holder 28. When the suction pad 27 is positioned furthest on the +Z side, it is positioned above the substrate holder 28.

[0025] In the exposure apparatus main body 10, under the control of a main control device (not shown), a mask loader (not shown) loads a mask M onto the mask stage 14, and a substrate P is loaded onto the substrate holder 28 by a substrate load / unload unit 150 and a substrate slide hand 140 (described later). The main control device then performs alignment measurement using an alignment detection system (not shown). After the alignment measurement is completed, step-and-scan exposure operations are sequentially performed on multiple shot areas set on the substrate P. This exposure operation is similar to the conventional step-and-scan exposure operation, and the X direction is the scan direction. A detailed description of the step-and-scan exposure operation will be omitted. The substrate P for which the exposure process has been completed is then unloaded from the substrate holder 28 by the substrate slide hand 140 or the like, and another substrate P to be exposed next is loaded into the substrate holder 28, thereby replacing the substrate P on the substrate holder 28, and a series of exposure operations for multiple substrates P are performed consecutively.

[0026] (Substrate loading / unloading unit 150) As shown in Fig. 1(a), the substrate loading / unloading unit 150 is provided near the opening 200a of the chamber 200. Fig. 3(a) shows the substrate loading / unloading unit 150 removed from Fig. 1(a), and Fig. 3(b) shows the substrate loading / unloading unit 150 of Fig. 3(a) as viewed from the +X side.

[0027] As shown in Figure 3(a), the substrate loading / unloading unit 150 comprises a partition member 152 having an inverted L-shaped XZ cross section, an inlet shutter 154 and an outlet shutter 156 provided on the partition member 152, and a substrate feeder 160 fixed to the partition member 152.

[0028] As shown in Figures 3(a) and 3(b), the partition member 152 has a rectangular shape when viewed from the X-axis direction, and has an inlet 152U and an outlet 152L that penetrate in the X-axis direction. The inlet 152U and the outlet 152L are small enough to allow the substrate P to pass through, making it difficult for dust to enter the chamber 200 through the inlet 152U and the outlet 152L. A inlet shutter 154 that slides up and down (in the Z-axis direction) to open and close the inlet 152U is provided near the inlet 152U. In addition, a outlet shutter 156 that rotates around a rotation axis 156a extending in the Y-axis direction to open and close the outlet 152L is provided near the outlet 152L.

[0029] Board feeder 160 is cantilevered by partition member 152 at a predetermined height from floor F. Here, "predetermined height" refers to a height position at which stage device 20 can be positioned below board feeder 160 when stage device 20 moves to the substrate exchange position (see FIG. 8(b)). Board feeder 160 includes a plate-like member whose XZ cross section is a substantially right-angled triangle, and the top surface of board feeder 160 is inclined with respect to the XY plane. Note that in the example of FIG. 3(a), the +X side end of the top surface of board feeder 160 is parallel to the XY plane. Although not shown, a plurality of minute holes (not shown) for blowing air are formed in the top surface of board feeder 160. In the substrate feeder 160, pressurized gas (e.g., air) supplied from a pressurized gas supply device (not shown) is supplied (air is supplied) to the backside of the substrate P placed on the upper surface of the substrate feeder 160 through holes, thereby separating the backside of the substrate P from the upper surface of the substrate feeder 160 (floating the substrate P). The substrate feeder 160 also has holes for suction-holding the underside of the substrate P by vacuum suction force supplied from a vacuum device (not shown). Note that the holes for supplying pressurized gas and the holes for vacuum suction may be the same hole. As shown in FIG. 2, the substrate feeder 160 is provided above the corners on the +X and +Y sides of the surface plate 22. As shown in FIG. 1(a), the -X side end of the substrate feeder 160 extends below the barrel surface plate 216, and a notch 216a is formed in part of the barrel surface plate 216 to avoid contact with the substrate P held by the substrate feeder 160.

[0030] (Board slide hand 140) As shown in Fig. 2, the substrate slide hand 140 is provided on the +Y side of the substrate feeder 160. The substrate slide hand 140 has a suction pad 142 and a vertical movement mechanism 144 that moves the suction pad 142 up and down (by driving it back and forth along the Z-axis direction). The vertical movement mechanism 144 is movable in the X-axis direction along rails 146 that are laid at a predetermined height from the floor F along the X-axis direction. In other words, the suction pad 142 is movable in the X-axis direction and the Z-axis direction. The suction pad 142 is capable of suction-holding the lower surface of the substrate P by vacuum suction force supplied by a vacuum device (not shown).

[0031] The substrate slide hand 140 sucks and holds by suction a portion of the lower surface of the substrate P transported by the external transport robot 300 and moves in the -X direction, thereby drawing the substrate P from the outside into the chamber 200. Furthermore, the substrate slide hand 140 moves along the upper surface of the substrate feeder 160 while holding the substrate P that has been pulled into the chamber 200, thereby transferring the substrate P onto the substrate feeder 160. Furthermore, the substrate slide hand 140 sucks and holds by suction a portion of the lower surface of the exposed substrate P placed on the substrate holder 28 and moves in the +X direction, thereby sending the substrate P from the inside of the chamber 200 to the outside.

[0032] The external transfer robot 300 transfers the substrate P between the exposure apparatus 100 (chamber 200) and an external device (not shown), such as a coater / developer, that is provided outside the exposure apparatus 100. The external transfer robot 300 has a flat robot hand 300F, as shown in FIGS. 1(a) and 2. A plurality of minute holes (not shown) for blowing air are formed on the upper surface of the robot hand 300F. The robot hand 300F supplies (supplies) pressurized gas (e.g., air) from a pressurized gas supply device (not shown) to the backside of the substrate P placed on the upper surface of the robot hand 300F through the holes, thereby separating the backside of the substrate P from the upper surface of the robot hand 300F (floating the substrate P). The robot hand 300F also has holes for suction-holding the underside of the substrate P by vacuum suction force from a vacuum device (not shown). The hole for supplying pressurized gas and the hole for vacuum suction may be a common hole.

[0033] (Board replacement operation) The operation of replacing the substrate P on the substrate holder 28 in the exposure apparatus 100 will be described in detail below with reference to FIGS. 1(a) to 2 and 4(a) to 11(b). The following substrate replacement operation is controlled by a main control device (not shown). In each of FIGS. 4(a) to 11(b), which are used to explain the substrate replacement operation, the direction of movement of the components is indicated by outlined arrows for ease of understanding. Furthermore, the state of gas suction or supply (intake) is indicated by solid arrows or dashed arrows. FIGS. 4(a) and 4(b) show a plan view and a cross-sectional view along line AA in FIG. 1(a) of the vicinity of the stage device 20 at the same timing. FIGS. 5(a) and 5(b), 6(a) and 6(b), ... 11(a) and 11(b) also show plan views and cross-sectional views along line AA of the vicinity of the stage device at the same timing. 4(a) to 11(b), illustration of components of exposure apparatus 100 that are not necessary for explanation is omitted.

[0034] Furthermore, as a premise for explaining the substrate replacement operation, it is assumed that substrate P1 has already been placed on substrate holder 28 of stage device 20. Furthermore, it is assumed that the substrate replacement operation involves the operation of unloading exposed substrate P1 and the operation of loading (placing) substrate P2 (different from substrate P1) to be newly exposed onto substrate holder 28. Note that substrate P2 may be an unexposed substrate (one that has never been exposed) or may be a substrate that is to be exposed for the second or subsequent time.

[0035] 1(a) and 2, while exposure is being performed on substrate P1 in exposure apparatus main body 10, the main controller drives external transfer robot 300, which holds unexposed substrate P2, to the vicinity of chamber 200 (the vicinity of loading entrance 152U). Note that robot hand 300F of external transfer robot 300 is in contact with most of the underside (-Z surface) of substrate P2, but is not in contact with the underside of the end on the -X side of substrate P2.

[0036] (Operations in Figure 4(a) and Figure 4(b)) From this state, the main control device opens the loading entrance 152U by sliding the loading entrance shutter 154 in the +Z direction (see arrow A1 in FIG. 4(b)). Next, the main control device drives the external transfer robot 300 in the -X direction (see arrow A2 in FIGS. 4(a) and 4(b)), causing the -X side end of the substrate P2 to enter the chamber 200. As a result, the -X side end of the substrate P2 is positioned above the substrate feeder 160. Note that in this first embodiment, the external transfer robot 300 does not enter the chamber 200. This makes it possible to minimize the intrusion of dust into the chamber 200.

[0037] Next, the main control device drives the substrate slide hand 140 to move the suction pad 142 in the +X direction (the direction of arrow A3 in FIG. 4(b)) and the +Z direction (the direction of arrow A4), thereby bringing the suction pad 142 into contact with a portion of the underside of the substrate P2 (the end on the -X side and the +Y side). The main control device also starts suction holding of a portion of the underside (-Z surface) of the substrate P2 by the suction pad 142 (see the black arrow A5 in FIG. 4(b)).

[0038] (Operations in Figure 5(a) and Figure 5(b)) Next, the main control device starts supplying (gas inlet) pressurized gas from the upper surface of the robot hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 160 (see arrows B1 and B2 in FIG. 5(b)). This causes the substrate P2 to float from the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160, and friction between the lower surface of the substrate P2 and the upper surfaces of the robot hand 300F and the substrate feeder 160 becomes negligible (low friction state). From this state, the main control device drives the suction pad 142 of the substrate slide hand 140 in the -X direction (arrow B2 direction in FIG. 5(b)) and the -Z direction (arrow B3 direction). That is, the suction pad 142 is moved in a direction along the upper surface of the substrate feeder 160 (the direction of arrow B5 in FIG. 5(a) and FIG. 5(b), which is a direction inclined to the X-axis and Z-axis within the XZ plane). As a result, the substrate P2 is transported into the chamber 200 along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160. The substrate P2 is moved by the substrate slide hand 140 while being supported by the upper surface of the robot hand 300F and the upper surface of the substrate feeder 160.

[0039] (Operations in Figures 6(a) and 6(b)) As described above, when substrate P2 is transported along the upper surface of robot hand 300F and the upper surface of substrate feeder 160 and reaches the position shown in FIGS. 6(a) and 6(b), the main controller slides entrance shutter 154 in the -Z direction to close entrance 152U (see arrow C1 in FIG. 6(b)). This prevents dust from entering the chamber 200 from the outside through entrance 152U. The main controller drives external transport robot 300 in the -X direction (see arrow C2 in FIGS. 6(a) and 6(b)). Note that in exposure apparatus main body 10, exposure of substrate P1 continues.

[0040] (Operations in Figures 7(a) and 7(b)) Next, the main controller drives a vacuum device (not shown) of the substrate feeder 160 to suck and hold the substrate P2 by vacuum suction. The main controller then releases the suction hold by the suction pads 142 of the substrate slide hand 140 and drives the suction pads 142 downward in the −Z direction (see arrow D1 in FIG. 7(b)). The main controller also drives the external transfer robot 300 in the −Z direction (see arrow D2) and in the −X direction (see arrow D3) to bring the −X end of the robot hand 300F closer to the unloading port 152L. Furthermore, the main controller rotates the unloading port shutter 156 counterclockwise (in the direction of arrow D4) to open the unloading port 152L. This completes preparations for replacing the substrate on the substrate holder 28. At this stage, the exposure operation for the substrate P1 on the substrate holder 28 is considered to be complete.

[0041] (Operations in Figures 8(a) and 8(b)) After the exposure operation is completed, the main controller drives stage device 20 to the substrate exchange position (below substrate feeder 160) (see arrow E1 in FIGS. 8(a) and 8(b)). Next, the main controller slightly raises suction pad 27 of substrate carry-in bearer device 25 (see arrow E2) and causes suction pad 27 to suction-hold the underside of substrate P1 (see arrow E3). The main controller also starts the supply of pressurized gas (air supply) from upper surface 28u of substrate holder 28 (see arrow E4), thereby slightly lifting substrate P1 relative to upper surface 28u of substrate holder 28. Furthermore, the main controller moves suction pad 27, which suction-holds substrate P1, in the +Y direction (see arrow E5), thereby slightly offsetting substrate P1 from substrate holder 28 in the +Y direction. This offset allows suction pad 142 of substrate slide hand 140 to hold the corners on the -X and +Y sides of the underside of substrate P1.

[0042] With the substrate P1 offset from the substrate holder 28, the main controller drives the suction pad 142 of the substrate slide hand 140 to rise (see arrow E6), causing the suction pad 142 to suck and hold the underside of the substrate P1. It is assumed that the main controller has already started supplying (air supplying) pressurized gas from the upper surface of the robot hand 300F of the external transfer robot 300 at the stages of FIGS. 8(a) and 8(b) (see arrow E7). It is noted that, although the main controller opens the unloading port 152L by rotating the unloading port shutter 156 counterclockwise (in the direction of arrow D4) at the stage of FIG. 7(b), it may also be configured to open the unloading port 152L at the stage of FIG. 8(b).

[0043] (Operations in Figures 9(a) and 9(b)) Next, the main control device drives the suction pad 142 of the substrate slide hand 140 in the +X direction (see arrow F1 in Figures 9(a) and 9(b)), and slides and transports the substrate P1 from the substrate holder 28 onto the robot hand 300F. This allows the exposed substrate P1 to be transferred onto the robot hand 300F. In other words, the substrate P1 is moved by the substrate slide hand 140 while being supported by the upper surface of the substrate holder 28 and the upper surface of the robot hand 300F. At the timing when the robot hand 300F receives the substrate P1, the main control device stops the supply (suction) of pressurized gas from the robot hand 300F and drives a vacuum device (not shown) to adsorb and hold the substrate P1 on the robot hand 300F by vacuum suction force.

[0044] The main control device also drives the suction pad 27 of the substrate loading bearer device 25 to rise (see arrow F2), bringing it into contact with the -X end of the underside of the substrate P2 held by the substrate feeder 160, and begins suction holding of the substrate P2 by the suction pad 27 (see arrow F3).

[0045] (Operations in Figures 10(a) and 10(b)) Next, the main control device drives stage device 20 in the -X direction (see arrow G1) with substrate P2 being sucked and held by suction pad 27 of substrate carry-in bearer device 25. In this case, as stage device 20 moves away from substrate feeder 160, the area of ​​substrate P2 held by substrate feeder 160 gradually decreases, and the area of ​​substrate P2 supported by substrate holder 28 gradually increases. As a result, substrate P2 is transferred from substrate feeder 160 onto substrate holder 28, as shown in FIG. 10(a).

[0046] After transferring the substrate P1 to the robot hand 300F, the main controller drives the suction pad 142 downward (see arrow G2) and rotates the unloading port shutter 156 clockwise (see arrow G3) to close the unloading port 152L. This prevents dust from entering the chamber 200 from the outside to the inside through the unloading port 152L. The main controller drives the external transfer robot 300 holding the substrate P1 in the +X direction (see arrow G4) to transfer the substrate P1 to an external device.

[0047] (Operations in Figures 11(a) and 11(b)) When the main controller completes the transfer of substrate P2 from substrate feeder 160 onto substrate holder 28, it stops the supply (air supply) of pressurized gas from the upper surface of substrate feeder 160. The main controller also slightly drives suction pad 27 to align (adjust the position) substrate P2 (see arrow H1). Thereafter, the main controller drives suction pad 27 downward (see arrow H2), causing substrate holder 28 to begin suction-holding substrate P2, and begins exposure of substrate P2 newly placed on substrate holder 28.

[0048] Thereafter, the processes of FIGS. 4(a), 4(b) to 11(a), and 11(b) are repeatedly executed, so that exposure of a plurality of substrates P is repeatedly performed.

[0049] As explained in detail above, according to the first embodiment, exposure apparatus 100 comprises exposure apparatus main body 10, chamber 200 that houses exposure apparatus main body 10, substrate feeder 160 that receives and holds substrate P transported by external transport robot 300 outside chamber 200, and substrate slide hand 140 and substrate carry-in bearer device 25 that transfer substrate P from external transport robot 300 to substrate feeder 160, transfer substrate P from substrate feeder 160 onto substrate holder 28 of exposure apparatus main body 10, and transfer substrate P from substrate holder 28 to external transport robot 300. This eliminates the need for a substrate transfer port section that was previously provided to transfer substrate P from external transport robot 300 to substrate feeder 160 (for example, Japanese Patent Laid-Open No. 2001-332600). Because the substrate transfer port is provided at a position between the exposure apparatus main body 10 and the external transfer robot 300, an exposure apparatus 100 that does not have a substrate transfer port can be made smaller (have a smaller footprint) by the amount of the substrate transfer port. Furthermore, omitting the substrate transfer port can also reduce the cost of the exposure apparatus 100. Furthermore, in an exposure apparatus that has a substrate transfer port, the substrate P undergoes two transfer operations: from the external transfer robot 300 to the substrate transfer port, and from the substrate transfer port to the substrate holder 28. Each time a substrate is transferred, extra stress is applied to the substrate P, which could result in deformation or damage to the substrate P. Therefore, if the substrate transfer operation occurs only once between the exposure apparatus main body 10 and the external transfer robot 300, as in the first embodiment, there is the effect that the substrate P is less likely to be deformed or damaged.

[0050] Furthermore, in the first embodiment, the substrate slide hand 140, while holding a portion of the substrate P, moves in a direction including the X-axis direction in which the substrate feeder 160 and the substrate holder 28 are aligned when transferring the substrate P from the substrate feeder 160 to the substrate holder 28. This allows the substrate P to be transferred from the substrate feeder 160 onto the substrate holder 28 as the substrate slide hand 140 moves.

[0051] Furthermore, in the first embodiment, the upper surface (substrate support surface) of substrate feeder 160 is inclined with respect to the upper surface of substrate holder 28, and substrate P is transferred from substrate feeder 160 onto substrate holder 28 by stage device 20 moving in the −X direction while substrate carry-in bearer device 25 is holding a portion of substrate P. This allows substrate P to be transferred to substrate holder 28 while sliding along the upper surface of substrate feeder 160, thereby preventing bending of substrate P when transferring substrate P to substrate holder 28.

[0052] Furthermore, in the first embodiment, the external transfer robot 300 does not enter the chamber 200 of the exposure apparatus 100, so dust adhering to the external transfer robot 300 can be prevented from entering the chamber 200. Furthermore, the volume of the chamber 200 can be reduced, making it easier to control the temperature inside the chamber 200. Furthermore, because the external transfer robot 300 does not enter the chamber 200, contact between the external transfer robot 300 and each part of the exposure apparatus 100 can be minimized. Furthermore, the only openings connecting the inside of the chamber 200 to the outside of the chamber 200 are the inlet 152U and the outlet 152L, which are large enough to move the substrate P through, so dust can be prevented from entering the chamber.

[0053] In addition, in the first embodiment, the +X side end of the upper surface of the substrate feeder 160 is parallel to the XY plane, which allows the substrate slide hand 140 to easily receive the substrate P transported by the external transport robot 300.

[0054] Furthermore, in the first embodiment, with the substrate P held on the upper surface of the substrate feeder 160, the substrate P on the substrate holder 28 is transferred to the external transport robot 300, and immediately thereafter, the substrate P held by the substrate feeder 160 is transferred onto the substrate holder 28. This allows the substrate on the substrate holder 28 to be quickly replaced even without a substrate transfer port section.

[0055] Furthermore, in this first embodiment, the loading entrance 152U and the unloading exit 152L of the partition member 152 are provided separately, so that the loading entrance 152U and the unloading exit 152L are not opened simultaneously during the substrate replacement operation, but are opened and closed individually, thereby making it possible to prevent dust from entering.

[0056] In the first embodiment, the suction pad 27 of the substrate carry-in bearer device 25 is movable in the Y-axis direction, but the present invention is not limited to this. For example, if the suction pad 142 of the substrate slide hand 140 can suck and hold the lower surface of the substrate P without moving (offsetting) the substrate P on the substrate holder 28 in the Y-axis direction, the suction pad 27 does not have to be movable in the Y-axis direction.

[0057] In the first embodiment described above, the robot hand 300F of the external transfer robot 300 is described as a flat plate-shaped member capable of air-floating the substrate P on its upper surface, but this is not limited to this. For example, the robot hand 300F may be a fork-shaped member or the like as long as it can slide the substrate P without generating dust. The robot hand 300F may also have rotating rollers that feed the substrate P in the X-axis direction by rolling contact. Providing rotating rollers on the robot hand 300F reduces friction when the substrate P comes into contact with the robot hand 300F, making it possible to suppress the generation of dust.

[0058] In the first embodiment, a mechanism for applying a levitation force to substrate P by supplying (air supplying) pressurized gas may be provided near loading / unloading entrance 152U or unloading exit 152L of substrate loading / unloading unit 150. Furthermore, near loading / unloading entrance 152U or unloading exit 152L of substrate loading / unloading unit 150, rotating rollers may be provided that feed substrate P in the X-axis direction by rolling contact.

[0059] In the first embodiment, the case where board feeder 160 is fixed to partition member 152 of board carry-in / out unit 150 has been described, but the present invention is not limited to this. Board feeder 160 may be fixed to a member different from partition member 152.

[0060] In the first embodiment, the substrate feeder 160 is provided above the corners on the +X and +Y sides of the surface plate 22, but the present invention is not limited to this. As long as it does not interfere with the exposure operation, the substrate feeder 160 may be provided, for example, above the end of the +X side of the surface plate 22 and the center in the Y-axis direction.

[0061] In the first embodiment, the loading entrance shutter 154 and the unloading exit shutter 156 are provided on the partition member 152 of the substrate loading / unloading unit 150, but the present invention is not limited to this. That is, at least one of the loading entrance shutter 154 and the unloading exit shutter 156 may be provided in the chamber 200.

[0062] Second Embodiment Next, an exposure apparatus according to a second embodiment will be described using Figures 12 and 13. The configuration of exposure apparatus 100A according to the second embodiment is the same as that of the first embodiment, except for differences in the configuration and operation of part of the substrate feeder, so only the differences will be described below, and elements that have the same configuration and function as those in the first embodiment will be assigned the same reference numerals as those in the first embodiment, and their description will be omitted.

[0063] FIG. 12 is a diagram showing an exposure apparatus 100A according to the second embodiment (a diagram corresponding to FIG. 1(a) of the first embodiment).

[0064] In the first embodiment, the substrate feeder 160 was fixed to the partition member 152 of the substrate loading / unloading unit 150, but in the substrate loading / unloading unit 150A of this second embodiment, as shown in Figure 12, the substrate feeder 161 is attached to a rotating shaft 162 provided on the partition member 152.

[0065] The shape and function of board feeder 161 are similar to board feeder 160 of the first embodiment, but board feeder 161 is attached to a rotation shaft 162 extending in the Y-axis direction, and is therefore able to rotate freely around rotation shaft 162. Although not shown in Figures 12 and 13, board feeder 161 is rotated by a drive mechanism (including a motor, etc.) not shown.

[0066] In addition, in this second embodiment, since the substrate feeder 161 is rotatable, the notch 216b formed in the lens barrel base 216 is set larger than the notch 216a in the first embodiment to avoid mechanical interference with the substrate feeder 161 and the substrate slide hand 140.

[0067] The substrate feeder 161 transitions between a state in which the upper surface (substrate support surface) is parallel to the XY plane, as shown in FIG. 12, and a state in which the substrate support surface is inclined relative to the XY plane, as shown in FIG. 13 (a state similar to that of the first embodiment).

[0068] (Board replacement operation) In the second embodiment, when the substrate P (P2) is carried in from outside the chamber 200 by the substrate slide hand 140, the main control device controls the drive mechanism to keep the substrate support surface (upper surface) parallel to the XY plane, as shown in FIG. 12. Furthermore, when the substrate slide hand 140 draws the substrate P (P2) onto the substrate feeder 161, the main control device supplies (intakes) pressurized gas from the upper surface of the external transfer robot 300 and the substrate support surface of the substrate feeder 161. This allows the substrate support surface (upper surface) of the substrate feeder 161 and the support surface of the external transfer robot to be flush (within the same plane). In this state, the main control device moves the substrate P2 by the substrate slide hand 140, thereby preventing deformation or damage to the substrate P2 due to excess stress being applied thereto.

[0069] 12, when substrate P (P2) is transferred onto substrate feeder 161, the main control device starts suction and holding of substrate P (P2) by substrate feeder 161. The main control device also controls the drive mechanism to rotate substrate feeder 161 counterclockwise as shown in FIG. 13, tilting the substrate support surface of substrate feeder 161 with respect to the XY plane, and then replacing the substrate on substrate holder 28 as in the first embodiment.

[0070] As described above, according to the second embodiment, the substrate feeder 161 is able to transition between a state in which the substrate support surface is parallel to the XY plane and a state in which it is tilted, and therefore can be set to an appropriate state (posture) when receiving the substrate P from the external transfer robot 300 or when transferring it to the substrate holder 28. This reduces the possibility of the substrate P coming into contact with the loading entrance 152U or the substrate feeder 161.

[0071] Furthermore, when the substrate slide hand 140 transports the substrate P (P2) from the external transport robot 300 into the chamber 200, the height position (position in the Z-axis direction) of the suction pad 142 does not need to be changed, which simplifies the control of the suction pad 142.

[0072] Furthermore, in this second embodiment, when replacing a substrate, the substrate support surface of the substrate feeder 161 can be tilted so that the -X end of the substrate P (P2) to be newly placed on the substrate holder 28 can be brought close to the upper surface of the substrate holder 28, thereby shortening (or setting to zero) the Z-direction stroke of the suction pad 142 of the substrate loading bearer device 25 and enabling the transfer of the substrate P (P2) to the substrate holder 28 to be carried out smoothly and without impact.

[0073] In the second embodiment described above, the case where the rotation shaft 162 is located at the +X end of the substrate feeder 161 has been described, but this is not limited to this, and the rotation shaft 162 may be located, for example, in the middle of the X-axis direction of the substrate feeder 161.

[0074] Third Embodiment Next, an exposure apparatus according to a third embodiment will be described with reference to Figures 14 to 18. Figure 14 shows a cross-sectional view of exposure apparatus 100B according to the third embodiment (a view corresponding to Figure 2 of the first embodiment).

[0075] The exposure apparatus 100 of the first embodiment described above was equipped with a substrate slide hand 140, but the exposure apparatus 100B of the third embodiment is equipped with a first slide hand 240 and a second slide hand 340 instead of the substrate slide hand 140.

[0076] The first slide hand 240 is provided on the upper surface (substrate support surface) of the substrate feeder 163. The substrate feeder 163 has the same configuration and function as the substrate feeder 160 of the first embodiment. The first slide hand 240 has a rail 246 provided on the substrate support surface of the substrate feeder 163 and a suction pad 242 that moves along the rail 246. The rail 246 is embedded in the substrate feeder 163, and there is no step between the upper surface of the rail 246 and the upper surface (substrate support surface) of the substrate feeder 163. The first slide hand 240 can suck and hold a portion of the substrate P transported by the external transport robot 300 and move in the -X direction to draw the substrate P into the chamber 200 (on the substrate feeder 163).

[0077] The second slide hand 340 is provided on the +X side surface of the stage device 20 (substrate table 24). The second slide hand 340 has a configuration similar to that of the substrate slide hand 140 of the first embodiment, and includes a rail 346 extending in the X-axis direction, a Z drive mechanism 344 that moves in the X-axis direction along the rail 346, and a suction pad 342 that is driven in the Z-axis direction by the Z drive mechanism 344. The second slide hand 340 can transfer the substrate P from the substrate holder 28 to the external transfer robot 300 by suction-holding a portion of the substrate P placed on the substrate holder 28 and moving in the +X direction.

[0078] That is, in the third embodiment, the same function as that of the substrate slide hand 140 in the first embodiment is realized by the first slide hand 240 and the second slide hand 340.

[0079] The other configuration of exposure apparatus 100B is similar to exposure apparatus 100 of the first embodiment.

[0080] (Board replacement operation) The operation of replacing substrate P on substrate holder 28 in exposure apparatus 100B will be described in detail below with reference to Figures 14 to 18(b). Figures 15(a) and 15(b) show a plan view and a vertical cross-sectional view of the vicinity of stage apparatus 20 at the same timing, and Figures 16(a) and 16(b), 17(a) and 17(b), and 18(a) and 18(b) also show plan views and vertical cross-sectional views of the vicinity of the stage apparatus at the same timing. In Figures 15(a) to 18(b), configurations of exposure apparatus 100B that are not necessary for explanation are omitted.

[0081] In the substrate exchange operation, an operation of unloading the exposed substrate P1 and an operation of loading (placing) a new substrate P2 (different from substrate P1) to be exposed onto the substrate holder 28 are performed. While exposure is being performed on substrate P1 on the substrate holder 28 in the exposure apparatus main body 10, the main controller drives the external transfer robot 300 holding the unexposed substrate P2 to the vicinity of the chamber 200 (the vicinity of the loading entrance 152U), as shown in FIG. At this stage, the suction pad 242 of the first slide hand 240 is positioned at the +X end of the rail 246.

[0082] (Operations in Figures 15(a) and 15(b)) From this state, the main controller opens the loading entrance 152U by sliding the loading entrance shutter 154 in the +Z direction (see arrow J1 in FIG. 15(b)). Next, the main controller drives the external transfer robot 300 in the -X direction (see arrow J2 in FIGS. 15(a) and 15(b)), causing the -X side end of the substrate P2 to enter the chamber 200. This brings the -X side end of the underside of the substrate P2 into proximity with or into contact with the suction pad 242. The main controller also starts suction holding of a portion of the underside of the substrate P2 by the suction pad 242 (see arrow J3 in FIG. 15(b)).

[0083] (Operations in Figures 16(a) and 16(b)) Next, the main control device starts the supply (air supply) of pressurized gas from the upper surface of the robot hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 163, and drives the suction pad 242 of the first slide hand 240 along the rail 246 toward the -X side (the direction of arrow K1 in Figures 16(a) and 16(b)). As a result, the substrate P2 is transported into the chamber 200 along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 163. After transporting the substrate P2 onto the substrate feeder 163, the main control device stops the supply of pressurized gas from the substrate feeder 163 and the robot hand 300F, and starts suction and holding of the substrate P2 by the substrate feeder 163. Then, the main control device closes the entrance shutter 154 and opens the exit shutter 156. Furthermore, when exposure of substrate P1 on stage device 20 is completed, the main controller drives stage device 20 to the position (substrate exchange position) shown in FIGS. 16(a) and 16(b) (see arrow K2).

[0084] When stage device 20 moves to the vicinity of the substrate exchange position, the main controller starts supplying pressurized gas from upper surface 28u of substrate holder 28, and drives suction pads 27 of substrate carry-in bearer device 25 in the +Z and +Y directions to offset substrate P1 from substrate holder 28 to the +Y side (see arrow K3 in FIG. 16(a)). In addition, the main controller drives external transfer robot 300 in the +X direction (see arrow K4).

[0085] (Operations in Figures 17(a) and 17(b)) The main control device drives the external transfer robot 300 in the -Z direction and the -X direction (see arrows L1 and L2 in FIG. 17(b)), thereby bringing the -X end of the robot hand 300F closer to the carry-out port 152L. Then, the main control device starts supplying (air supplying) pressurized gas from the upper surface of the robot hand 300F.

[0086] The main controller also drives the suction pad 342 of the second slide hand 340 to rise, causing the suction pad 342 to suck and hold the underside of the substrate P1. The main controller then drives the suction pad 342 in the +X direction along the rail 346 (see arrow L3), and slides and transports the substrate P1 from on the substrate holder 28 onto the robot hand 300F. After the substrate P1 has been slid and transported onto the robot hand 300F, the main controller drives the robot hand 300F in the +X direction, retracts the substrate P1 to the outside of the chamber 200, and closes the unloading port shutter 156.

[0087] The main control device also drives suction pad 27 of substrate carry-in bearer device 25 to rise (see arrow L4), and starts suction holding of the -X end of substrate P2 by suction pad 27 (see arrow L5). Furthermore, the main control device starts supplying pressurized gas from the upper surface of substrate feeder 163.

[0088] (Operations in Figures 18(a) and 18(b)) The main control device drives stage device 20 in the -X direction (see arrow N1) while suction pads 27 of substrate carry-in bearer device 25 suction-hold substrate P2. This causes substrate P2 to be transferred from substrate feeder 163 onto substrate holder 28. Note that while substrate P2 is being transferred from substrate feeder 163 onto substrate holder 28, pressurized gas is being supplied from the upper surface of substrate holder 28.

[0089] Meanwhile, when the entire substrate P2 has been transferred from the substrate feeder 163 onto the substrate holder 28, the main controller stops the supply of pressurized gas from the upper surface of the substrate feeder 163. The main controller also finely drives the suction pad 27 to align (adjust the position) the substrate P2. Thereafter, the main controller drives the suction pad 27 downward (see arrow N2) and starts exposure of the substrate P2 newly placed on the substrate holder 28.

[0090] Furthermore, the main control device drives the external transfer robot 300 in the +X direction (see arrow N3) to transfer the substrate P1 to the external device.

[0091] Thereafter, the processes of FIGS. 15(a), 15(b) to 18(a), and 18(b) are repeatedly executed, so that exposure of a plurality of substrates P is repeated.

[0092] As described above in detail, the third embodiment is provided with the first slide hand 240 that draws the substrate P from outside the chamber 200 into the chamber 200, and the second slide hand 340 that carries the substrate P from inside the chamber 200 to outside the chamber 200. This increases the degree of freedom in design, so that, for example, the substrate exchange position of the stage device 20 can be located at the end of the +X side of the surface plate 22 and near the center in the Y axis direction.

[0093] Furthermore, in the third embodiment, the first slide hand 240 is provided in the center of the board feeder 163 in the Y-axis direction, so that space is created on the +Y side and -Y side of the board feeder 163. This makes it possible to make design changes, such as holding the board feeder 163 from the Y-axis direction.

[0094] Furthermore, in the third embodiment, since the second slide hand 340 is provided on the stage device 20, it is also possible to start the substrate unloading operation before the stage device 20 arrives at the substrate exchange position.

[0095] Furthermore, in the third embodiment, the rails 246 of the first slide hand 240 are provided along the upper surface (substrate support surface) of the substrate feeder 163, which simplifies control compared to the first embodiment, in which control is performed in two axial directions, the X axis and the Z axis, when driving the suction pad 242. Furthermore, there is no need to provide the rails 146 as in the first and second embodiments, which allows for a reduction in the number of parts.

[0096] Furthermore, in the third embodiment, since the second slide hand 340 is provided on the stage device 20, it is also possible to start the substrate unloading operation before the stage device 20 arrives at the substrate exchange position.

[0097] In the third embodiment, the attitude of the board feeder 163 (the inclination of the board support surface) may be made changeable as in the second embodiment.

[0098] Fourth Embodiment Next, exposure apparatus 100C of the fourth embodiment will be described using Figures 19 and 20. As shown in Figures 19(a) and 19(b), exposure apparatus 100C of the fourth embodiment has almost the same configuration as exposure apparatus 100 of the first embodiment, but differs in that substrate feeder 160 has the function of holding substrate P in a non-contact suspending manner from its underside.

[0099] For example, holes for exhausting pressurized gas are formed in the lower surface of substrate feeder 160, and by exhausting air in the manner of a known Bernoulli chuck, negative pressure can be generated between the upper surface of substrate P and the lower surface of substrate feeder 160. Therefore, in the fourth embodiment, substrate P can be held in a non-contact suspended state by the negative pressure generated between the upper surface of substrate P and the lower surface of substrate feeder 160 (i.e., the upper surface of substrate P is held in a non-contact state on the lower surface of substrate feeder 160). However, this is not limiting, and substrate P can also be held in a non-contact suspended state by providing holes for vacuum suction and holes for exhausting pressurized gas in the lower surface of substrate feeder 160, and achieving a balance between vacuum suction and air exhaust using these holes.

[0100] (Board replacement operation) 19(a) and 19(b) show views corresponding to FIGS. 8(a) and 8(b) of the first embodiment. In the states shown in FIGS. 19(a) and 19(b), unexposed substrate P2 is held on the upper surface of substrate feeder 160, and stage device 20 and exposed substrate P1 are positioned opposite the lower surface of substrate feeder 160. In this state, substrate P1 is slightly offset in the +Y direction relative to substrate holder 28, and pressurized gas is supplied from upper surface 28u of substrate holder 28, resulting in a non-contact state between the lower surface of substrate P1 and the upper surface of substrate holder 28. In addition, suction pad 142 of substrate slide hand 140 is in a state of suction-holding a portion of the lower surface of substrate P1.

[0101] From this state, the main control device exhausts the pressurized gas from the bottom surface of the substrate feeder 160, thereby suspending and holding the substrate P1 in a non-contact manner on the bottom surface of the substrate feeder 160 according to the principle of a Bernoulli chuck.

[0102] Next, the main control device causes the suction pads 27 of the substrate carry-in bearer device 25 to suction-hold a portion of the substrate P2 on the substrate feeder 160, and starts supplying pressurized gas from the upper surface of the substrate feeder 160. Then, as shown in FIGS. 20(a) and 20(b), the main control device starts transferring the substrate P1 to the external transfer robot 300 by moving the suction pads 142 of the substrate slide hand 140 in the +X direction (see arrow Q1), and transfers the substrate P2 from the substrate feeder 160 onto the substrate holder 28 by driving the stage device 20 in the -X direction (see arrow Q2). Note that, because negative pressure is generated on the lower surface of the substrate feeder 160 and the substrate P1 is held in a non-contact suspended state as described above, when the substrate P1 is slidably transported by the substrate carry-in bearer device 25, as shown in FIG. 20(b), the substrate P1 can be smoothly slidably transported to the external transfer robot 300 even if the substrate holder 28 is not present below the substrate P1.

[0103] As described above, according to the fourth embodiment, the substrate P1 to be transported to the outside is held in a non-contact suspended state on the underside of the substrate feeder 160, so that the stage device 20 does not need to wait at the substrate exchange position until the substrate P1 is transferred from the substrate holder 28 to the external transport robot 300. This makes it possible to start the operation of placing a new substrate P2 on the substrate holder 28 at a stage before the substrate P1 is transferred to the external transport robot 300, as shown in FIG. 20(b). Therefore, according to the fourth embodiment, it is possible to shorten the time required for substrate exchange. Furthermore, after the substrate P2 is placed on the substrate holder 28 and the stage device 20 is moved in the -X direction, the substrate P1 held in a non-contact state on the underside of the substrate feeder 160 may be transferred to the external transport robot 300. This allows the exit shutter 156 to be closed when the stage device 20 is located near the exit 152L, and even if dust enters the chamber 200 through the exit 152L, there is little risk of the dust adhering to the stage device 20.

[0104] As in the second embodiment, the board feeder 160 of the fourth embodiment may be rotatably mounted on the partition member 152. That is, the top surface of the board feeder 160 may be configured to transition between a state parallel to the XY plane and a state inclined thereto.

[0105] In the fourth embodiment, similarly to the third embodiment, the substrate slide hand 140 may be replaced with a first slide hand 240 and a second slide hand 340.

[0106] Fifth Embodiment Next, a fifth embodiment will be described with reference to Figure 21. Figure 21(a) shows a substrate carry-in / out unit 150' according to the fifth embodiment. Substrate carry-in / out unit 150' has a substrate feeder 165 instead of substrate feeder 160 of substrate carry-in / out unit 150 of the first embodiment, and has an unloading port shutter 156' instead of unloading port shutter 156.

[0107] The substrate feeder 165 has a first portion 165a fixed to the surface on the -X side of the partition member 152 and a second portion 165b that is slidable relative to the first portion 165a. The sliding direction of the second portion 165b is the same as the inclination direction (the direction inclined relative to the X-axis and Z-axis in the XZ plane) of the upper surface (substrate support surface) of the second portion 165b. As shown in FIG. 21(b), a drive mechanism 165c, for example, of a feed screw type, is provided between the first portion 165a and the second portion 165b. The drive mechanism 165c drives the second portion 165b so as to change the distance between the second portion 165b and the first portion 165a. Note that the drive mechanism 165c is not limited to a feed screw type, and may be another type of drive mechanism, such as a drive mechanism including a linear motor.

[0108] In the fifth embodiment, by adopting the above-described configuration for the substrate feeder 165, the first portion 165a and the second portion 165b are brought closer together as shown in FIG. 21(a) except during substrate replacement. This prevents the substrate feeder 165 from interfering with work such as exposure operations and maintenance. Furthermore, during substrate replacement, the second portion 165b of the substrate feeder 165 is moved as shown in FIG. 21(b), allowing the substrate replacement position to be set closer to the -X side. This shortens the stroke in the X-axis direction when the stage device 20 moves to the substrate replacement position.

[0109] In the fifth embodiment, by employing the substrate feeder 165 as described above, the substrate exchange position is set closer to the -X side than in the first embodiment and the like, which may increase the distance between the substrate holder 28 and the external transfer robot 300 during substrate exchange. Therefore, in the fifth embodiment, as shown in FIG. 21(b), the length of the unloading port shutter 156' in the X-axis direction when the unloading port 152L is open is set longer than that of the unloading port shutter 156 shown in FIG. 1(b) and the like, and the unloading port shutter 156' is provided with a levitation force imparting mechanism that supplies pressurized gas upward from the +Z side surface in the state shown in FIG. 21(b). Furthermore, when opening or closing the unloading port 152L, the unloading port shutter 156' moves in the opposite direction to the unloading port shutter 156 (it moves clockwise when opening the unloading port 152L and moves counterclockwise when closing it). This allows the unloading port shutter 156' to act as a bridge for the substrate P between the substrate holder 28 and the external transfer robot 300. Therefore, according to the fifth embodiment, the substrate P can be transferred from the substrate holder 28 to the external transfer robot 300 without bending the substrate.

[0110] Furthermore, in the fifth embodiment, when the unloading port shutter 156' opens the unloading port 152L (FIG. 21(b)), the +X end of the unloading port shutter 156' is positioned at substantially the same position as the +X end of the unloading port 152L. This allows the external transfer robot 300 to receive the substrate from the substrate holder 28 at a position on the +X side of the unloading port 152L, thereby minimizing the intrusion of dust into the chamber 200.

[0111] In the fifth embodiment, the exit shutter 156' may be replaced with the exit shutter 156 similar to those in the first to fourth embodiments.

[0112] In addition, like the unloading port shutter 156' of the fifth embodiment, the unloading port shutter 156 described in the first to fourth embodiments may be provided with a function to supply pressurized gas from the upper surface while the unloading port 152L is open.

[0113] In the fifth embodiment, the board feeder 165 may be provided rotatably, as in the second embodiment.

[0114] Sixth Embodiment Next, a sixth embodiment will be described with reference to FIGS. 22 to 24. FIGS. 22(a) and 22(b) show a horizontal cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to the sixth embodiment. This sixth embodiment is a modification of the third embodiment (FIGS. 14 to 18). As shown in FIG. 22(a), the width of the substrate feeder 166 in the Y-axis direction is set wider than the width of the substrate feeder 163 in FIG. 14. As shown in FIG. 22(b), the substrate feeder 166 is rotatably supported near its +X end by a rotation shaft 176 extending in the Y-axis direction. The substrate feeder 166 is suspended and supported at two locations near both ends in the Y-axis direction by suspension mechanisms 186 provided on the partition member 152. Unlike the partition members 152 of the first to fifth embodiments, the partition member 152 of the sixth embodiment is provided with a holder 155 that holds the suspension mechanism 186.

[0115] Hanging mechanism 186 has two ropes 196 that suspend and support board feeder 166, and the tilt of the upper surface (board support surface) of board feeder 166 is adjusted by winding and unwinding two ropes 196 to adjust their lengths. In the sixth embodiment, by employing the above-described configuration for board feeder 166, even when the rigidity of board feeder 166 near rotation axis 176 is low, the small force of hanging mechanism 186 can accurately control the attitude of board feeder 166 while suppressing bending of board feeder 166.

[0116] (Board replacement operation) In the sixth embodiment, when performing a substrate replacement operation, the main controller controls the hanging mechanism 186 to maintain the upper surface (substrate support surface) of the substrate feeder 166 horizontal, as shown in Figure 22(b). Then, the main controller slides the entrance shutter 154 in the +Z direction to open the entrance 152U (see arrow R1), and moves the external transfer robot 300 closer to the entrance 152U (see arrow R2), thereby positioning the -X end of the substrate P2 near the +X end of the substrate support surface of the substrate feeder 166. It is assumed that at this stage, the suction pad 242 of the first slide hand 240 is located at the +X end of the rail 246.

[0117] Next, the main control device starts suction holding of a part of the lower surface of substrate P2 by suction pad 242 (see arrow R3 in FIG. 22(b)).

[0118] Next, the main control device starts the supply (air supply) of pressurized gas from the upper surface of the robot hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 166, and drives the suction pad 242 of the first slide hand 240 along the rail 246 to the -X side (see arrow R4), as shown in Figures 23(a) and 23(b). As a result, the substrate P2 is drawn into the chamber 200 along the upper surface of the robot hand 300F and the upper surface of the substrate feeder 166. After transporting the substrate P2 onto the substrate feeder 166, the main control device stops the supply of pressurized gas from the substrate feeder 166 and the robot hand 300F, and starts suction holding of the substrate P2 by the substrate feeder 166.

[0119] Next, the main controller closes the loading entrance shutter 154 and opens the unloading exit shutter 156. Furthermore, when exposure of substrate P1 in stage device 20 is completed, the main controller drives stage device 20 to the position (substrate exchange position) shown in FIG. 24 (see arrow R5).

[0120] Next, as shown in Fig. 24, the main control device controls hanging mechanism 186 to adjust the length of rope 196 (see arrow R6), thereby tilting the substrate support surface of substrate feeder 166. The main control device also starts the supply of pressurized gas from upper surface 28u of substrate holder 28, and drives suction pads 27 of substrate carry-in bearer device 25 in the +Z direction and +Y direction to offset substrate P1 to the +Y side from substrate holder 28. The main control device also positions external transport robot 300 at a position near carry-out port 152L shown in Fig. 24, and starts the supply (air supply) of pressurized gas from the upper surface of robot hand 300F.

[0121] The main controller also drives the suction pad 342 of the second slide hand 340 to rise, causing the suction pad 342 to suction-hold the underside of the substrate P1. The main controller then drives the suction pad 342 in the +X direction along the rail 346, causing the substrate P1 to be slidably transported from the substrate holder 28 onto the robot hand 300F. After the substrate P1 has been slidably transported to the robot hand 300F, the main controller drives the robot hand 300F in the +X direction, retracts the substrate P1 to the outside of the chamber 200, and closes the unloading port shutter 156. The main controller drives the external transport robot 300 in the +X direction, causing the substrate P1 to be transported to an external device.

[0122] The main control device also drives suction pad 27 of substrate carry-in bearer device 25 to rise (see arrow R7), and starts suction holding of the -X end of substrate P2 by suction pad 27 (see arrow R8). Furthermore, the main control device starts supplying pressurized gas from the upper surface of substrate feeder 166.

[0123] The main control device then drives stage device 20 in the -X direction while suction pads 27 of substrate carry-in bearer device 25 are holding substrate P2 by suction. As a result, substrate P2 is transferred from substrate feeder 166 onto substrate holder 28, as in Fig. 18(b). Note that while substrate P2 is being transferred from substrate feeder 166 onto substrate holder 28, pressurized gas is being supplied from the upper surface of substrate holder 28.

[0124] Meanwhile, when substrate P2 is transferred from substrate feeder 166 onto substrate holder 28, the main controller stops the supply of pressurized gas from the upper surface of substrate feeder 166. After aligning (adjusting the position) substrate P2, the main controller drives suction pad 27 downward and starts exposure of substrate P2 newly placed on substrate holder 28.

[0125] Thereafter, the above-described process is repeatedly executed, so that exposure of a plurality of substrates P is repeated.

[0126] In the sixth embodiment, board feeder 166 is suspended and supported by a pair of ropes 196, but this is not limiting. For example, board feeder 166 may be suspended and supported by a non-flexible mechanism. For example, board feeder 166 may be suspended and supported by an air cylinder or the like.

[0127] The substrate feeder 166 may have a first portion and a second portion, as in the fifth embodiment (see FIG. 21(a)).

[0128] Seventh Embodiment Next, the seventh embodiment will be described with reference to Figure 25. Figure 25 shows a state in which stage device 20 is positioned at the substrate exchange position in an exposure apparatus according to the seventh embodiment.

[0129] In the seventh embodiment, substrate feeder 167 is supported on its upper surface by support frame 78 provided on the +Y side of substrate feeder 167. Furthermore, substrate feeder 167 is characterized in that substrate P (P2) newly loaded onto substrate holder 28 is held in a non-contact suspended state on its lower surface. The mechanism for non-contact suspended holding is the same as in the fourth embodiment. Note that in the seventh embodiment, there is no partition member 152 present in the first to sixth embodiments, and chamber 200 is provided with opening / closing doors 198a and 198b for opening and closing opening 200a.

[0130] In the seventh embodiment, as described above, the partition member 152 is omitted, which makes it possible to reduce the footprint of the entire exposure apparatus. Furthermore, since the substrate feeder 167 is supported on the upper surface side, it is possible to prevent the substrate feeder 167 from bending compared to when the substrate feeder 167 is supported in a cantilevered manner.

[0131] (Board replacement operation) While stage device 20 is performing an exposure operation, main controller opens doors 198a and 198b (see arrow S1), and controls external transfer robot 300 to position the -X end of newly loaded substrate P2 below the +X end of the undersurface of substrate feeder 167. Then, main controller begins non-contact suspending and holding substrate P2 on the undersurface of substrate feeder 167, and uses substrate slide hand 140 to transfer substrate P2 to the position shown in FIG.

[0132] Furthermore, as in the previous embodiments, the main control device causes the substrate slide hand 140 to hold the substrate P1 on the substrate holder 28 and drives it in the +X direction, thereby sliding the exposed substrate P1 from the substrate holder 28 onto the robot hand 300F of the external transport robot 300 (see arrow S2).

[0133] The main control device then causes the suction pads 27 of the substrate carry-in bearer device 25 to suction-hold the substrate P2, and drives the stage device 20 in the -X direction, thereby transferring the substrate P2 from the substrate feeder 167 onto the substrate holder 28.

[0134] The subsequent operations are the same as those in the third embodiment.

[0135] Eighth Embodiment Next, the eighth embodiment will be described in detail with reference to Figures 26 to 30. Figures 26(a) and 26(b) show a horizontal cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to the eighth embodiment. For convenience, the chamber 200 is not shown in Figures 26 to 30.

[0136] In the eighth embodiment, a robot hand 300F' of an external transfer robot 300' has a flat plate-like member whose end on the -X side is processed into a comb-like shape. However, similar to the previous embodiments, the robot hand 300F' is capable of supporting the substrate P in an air-floating manner by supplying pressurized gas from above, and is also capable of vacuum-adsorbing the substrate P.

[0137] In the eighth embodiment, a partition member 172 is used instead of the partition member 152 described in the first embodiment and the like. The partition member 172 has a box-shaped portion that forms a space 173, and a substrate feeder 168 is provided on the upper surface of the upper wall (the wall on the +Z side) of the box-shaped portion. An unloading port 172L is provided on the +X side wall of the box-shaped portion, and a substrate passing opening 172M is provided on the -X side wall of the box-shaped portion. An inlet 172U is provided above the unloading port 172L of the partition member 172. An unloading port shutter 156 is provided near the unloading port 172L, and an inlet shutter 154 is provided near the inlet 172U. Note that, although not shown in the figure because FIG. 26(b) is a cross-sectional view, the +Y side and the -Y side of the box-shaped portion are closed by walls.

[0138] Board feeder 168 is capable of reciprocating movement in the X-axis direction along a pair of rails 174 laid along the X-axis direction on the upper surface of the upper wall of the box-shaped portion of partition member 172. The range of movement of board feeder 168 in the X-axis direction is approximately half the length of board P in the X-axis direction.

[0139] In the eighth embodiment, a plurality of rod-shaped air floating members 29 (four in FIG. 26(a)) are provided at predetermined intervals in the Y-axis direction on the end surface on the +X side of the substrate holder 28. An opening (not shown) is provided on the top surface (+Z surface) of the air floating member 29, and pressurized gas is supplied from this opening.

[0140] (Board replacement operation) Next, the substrate exchange operation in the eighth embodiment will be explained using Figures 26 to 30. Figures 26(a) and 26(b), 27(a) and 27(b), and 28(a) and 28(b) show horizontal and vertical cross-sectional views of the vicinity of the stage device at the same timing. Figures 26(a) to 30(b) omit illustration of components of the exposure apparatus that are not necessary for explanation.

[0141] (Operations in Figures 26(a) and 26(b)) In the states shown in FIGS. 26(a) and 26(b), exposure is being performed on substrate P1 in stage device 20. Meanwhile, the main controller slides entrance shutter 154 in the +Z direction to open entrance 152U in order to receive substrate P2, which will be exposed next, into chamber 200 (see arrow T1 in FIG. 26(b)). Next, the main controller drives external transfer robot 300′ in the −X direction (see arrow T2 in FIGS. 26(a) and 26(b)), causing the −X side end of substrate P2 to enter chamber 200. As a result, the −X side end of substrate P2 is positioned above the +X end of substrate feeder 168. Then, the main controller brings suction pad 142 of substrate slide hand 140 into contact with a portion of the underside of substrate P2 to begin suction and holding. The main controller also begins supplying pressurized gas from the upper surface of robot hand 300F′ of external transfer robot 300′ and the upper surface of substrate feeder 168.

[0142] (Operations in Figures 27(a) and 27(b)) The main controller drives the suction pad 142 to move the substrate P2 along the substrate support surface (upper surface) of the substrate feeder 168 (see arrow T3).

[0143] (Operations in Figures 28(a) and 28(b)) 28(a) and 28(b) due to the movement of the suction pad 142, the main controller drives the external transfer robot 300' downward (in the -Z direction) (see arrow T4) and positions it near the unloading port 172L. The main controller also slides the loading port shutter 154 in the -Z direction to close the loading port 172U (see arrow T5).

[0144] (Operation in Figure 29(a)) Thereafter, when exposure of substrate P1 on stage device 20 is completed, the main controller moves stage device 20 to the substrate exchange position (see arrow T6). When stage device 20 is positioned at the substrate exchange position, air floating member 29 enters space 173 through substrate passage opening 172M, as shown in FIG. 29(a). The main controller also starts suction-holding of substrate P2 by substrate feeder 168, and drives substrate feeder 168 in the -X direction along rails 174 (see arrow T7). Note that suction pad 142 holding substrate P2 may be moved in the -X direction in synchronization with the movement of substrate feeder 168, or, when substrate feeder 168 moves, suction-holding of substrate P2 by suction pad 142 may be released and suction pad 142 may be moved in the -X direction in advance.

[0145] The main control device also opens the unloading port 172L by sliding the unloading port shutter 156 in the -Z direction (see arrow T8). The main control device also drives the external transfer robot 300' in the -X direction, causing the external transfer robot 300 to enter the space 173 formed by the partition member 172 (see arrow T9). In this state, the heights of the substrate holder 28 and air levitation member 29 and the upper surface of the robot hand 300F' of the external transfer robot 300' are approximately the same. Furthermore, the comb-like portions of the air levitation member 29 and the robot hand 300F' are nested, thereby avoiding mechanical interference (contact).

[0146] (Operation in Figure 29(b)) Next, the main control device slightly raises suction pad 27 of substrate carry-in bearer device 25 and causes suction pad 27 to suction-hold the underside of substrate P1. The main control device also starts the supply (air supply) of pressurized gas from the upper surface of substrate holder 28, and moves suction pad 27, which is suction-holding substrate P1, in the +Y direction, thereby slightly offsetting substrate P1 in the +Y direction from substrate holder 28. This offset allows suction pad 142 of substrate slide hand 140 to hold the corners on the -X and +Y sides of the underside of substrate P1.

[0147] Next, the main control device causes the suction pads 142 of the substrate slide hand 140 to suction-hold a portion of the lower surface of the substrate P1. It is assumed that the main control device has already started supplying (air supplying) pressurized gas from the air floating member 29 and the upper surface of the robot hand 300F' at the stage of Figure 29(b).

[0148] Next, the main control device starts moving suction pad 142 of substrate slide hand 140 in the +X direction (see arrow T10). Also, at the timing when substrate P1 has moved a predetermined distance in the -X direction, the main control device drives suction pad 27 of substrate carry-in bearer device 25 in the +Z direction (see arrow T11), and suction pad 27 starts to suck and hold the -X end of substrate P2 on substrate feeder 168.

[0149] (Operation in Figure 30(a)) Next, the main control device begins supplying (air inlet) pressurized gas from the top surface of substrate feeder 168. Then, with substrate P2 held by suction on suction pad 27 of substrate carry-in bearer device 25, the main control device drives stage device 20 in the −X direction (see arrow T12). While driving stage device 20 in the −X direction, the main control device also moves substrate feeder 168 in the +X direction. As a result, as shown in FIG. 10( a), substrate P2 is transferred from substrate feeder 168 onto substrate holder 28. By driving stage device 20 and substrate feeder 168 in directions away from each other in the X direction, substrate P2 can be loaded onto substrate holder 28 more quickly than by simply driving stage device 20 in the −X direction. This is possible because space 173 is provided within chamber 200, allowing the device configuration to drive substrate feeder 168 in the +X direction. The timing for driving stage device 20 in the -X direction may be different from the timing for moving substrate feeder 168 in the +X direction. The main control device may also move substrate feeder 168 in the +X direction after transferring substrate P2 to substrate holder 28.

[0150] (Operation in Figure 30(b)) The main controller continues to move the suction pads 142 in the +X direction, thereby transferring the substrate P1 onto the robot hand 300F' of the external transfer robot 300', as shown in FIG. 30(b). When this transfer is complete, the main controller stops the suction pads 142 from suction-holding the substrate P1. The main controller also drives the external transfer robot 300' holding the substrate P1 in the +X direction (see arrow T13), causing the substrate P1 to be transferred to the external device. The main controller also closes the transfer port 172L by sliding the transfer port shutter 156 in the +Z direction (see arrow T14).

[0151] The subsequent operations are the same as those in the first embodiment.

[0152] As described in detail above, according to the eighth embodiment, the operation of loading substrate P2 into substrate holder 28 and the operation of unloading substrate P1 from substrate holder 28 can be performed in parallel, thereby reducing the time required for the substrate replacement operation.

[0153] Furthermore, in the eighth embodiment, air floating members 29 are provided on the +X side of substrate holder 28, and the -X side end of robot hand 300F' of external transfer robot 300' is comb-shaped. This allows air floating members 29 and robot hand 300F' to be nested within each other, making it possible to suppress bending of substrate P when substrate P is transferred.

[0154] In the eighth embodiment, the substrate (substrate to be carried out) may be supported in a non-contact manner on the lower surface of the substrate feeder 168, as in the fourth embodiment.

[0155] In the eighth embodiment, a shutter may be provided to open and close the substrate passage opening 172M. Also, a shutter may be provided to open and close the substrate passage opening 172M, and the unloading exit shutter 156 may be omitted.

[0156] In the eighth embodiment, the rails 146 of the substrate slide hand 140 may be provided on the substrate feeder 168. In this case, since the substrate feeder 168 is movable in the X-axis direction, the length of the rails 146, i.e., the X-stroke of the suction pad 142, can be shortened.

[0157] Ninth Embodiment Next, a ninth embodiment will be described with reference to Figures 31 and 32. Figures 31(a) and 31(b) show a horizontal cross-sectional view and a vertical cross-sectional view of an exposure apparatus according to the ninth embodiment.

[0158] The exposure apparatus of the ninth embodiment is characterized in that it employs a substrate feeder 169 instead of the substrate feeder 168 of the eighth embodiment described above. A plurality of grooves 169a (three in FIG. 31(a)) are formed on the +X side of the top surface of the substrate feeder 169. The dimensions and spacing of the grooves 169a are set so that even when the robot hand 300F' of the external transfer robot 300' enters through the carry-in opening 172U, the substrate feeder 169 and the robot hand 300F' do not come into contact with each other. The other configurations are the same as those of the eighth embodiment.

[0159] (Board replacement operation) Next, the substrate exchange operation in the ninth embodiment will be described with reference to Figures 31 and 32. Figures 31(a) and 31(b), and Figures 32(a) and 32(b) show horizontal and vertical cross-sectional views of the vicinity of the stage device at the same timing. Figures 31(a) to 32(b) omit illustration of components of the exposure apparatus that are not necessary for the explanation.

[0160] 31(a) and 31(b), exposure is being performed on substrate P1 placed on substrate holder 28 in stage device 20. In this state, the main controller slides entrance shutter 154 in the +Z direction to open entrance 172U (see arrow U1 in FIG. 31(b)) in order to receive substrate P2, which will be exposed next, into chamber 200. Next, the main controller drives external transfer robot 300′ in the −X direction (see arrow U2 in FIG. 31(a) and 31(b)). This operation of external transfer robot 300′ positions approximately the −X half of robot hand 300F′ and approximately the −X half of substrate P2 above substrate feeder 169, as shown in FIG. 32(a) and 32(b).

[0161] Next, the main control device drives the robot hand 300F′ downward to transfer a portion of the substrate P2 to the substrate feeder 169.

[0162] Then, the main control device starts supplying pressurized gas from the substrate support surface (upper surface) of substrate feeder 169 and the upper surface of robot hand 300F'. The main control device also drives suction pad 142 to suck and hold the end of substrate P2 on the +Y side and -X side to suction pad 142.

[0163] Thereafter, the main control device performs the same operation as in the eighth embodiment to replace the substrate on the substrate holder .

[0164] As described above, according to the ninth embodiment, the external transfer robot 300′ enters the chamber 200 and delivers approximately the −X side half of the substrate P2 to the substrate feeder 169, thereby shortening the movement range (stroke) in the X direction and the movement range in the Z direction of the substrate slide hand 140 (suction pad 142) that pulls the substrate P2 into the chamber 200. Accordingly, the movement time of the suction pad 142 can be shortened.

[0165] Furthermore, when the substrate is transferred from the external transport robot 300' to the substrate feeder 169, it is transferred from above, which reduces the possibility of the substrate coming into contact with the substrate feeder 169 due to bending (sagging) of the tip of the substrate compared to when the substrate is transferred by sliding it.

[0166] Tenth Embodiment Next, a tenth embodiment will be described with reference to Figures 33 and 34. Figures 33(a) to 34(b) show cross-sectional views of an exposure apparatus according to the tenth embodiment. As shown in Figure 33(a), the exposure apparatus of the tenth embodiment is characterized in that, unlike the ninth embodiment described above, the rails 146 of the substrate slide hand 140 are fixed to a substrate feeder 169. The rest of the configuration is the same as in the ninth embodiment.

[0167] (Board replacement operation) The substrate exchange operation in the exposure apparatus of the tenth embodiment will be explained below with reference to FIGS. 33(a) to 34(b).

[0168] 33(a), exposure is being performed on substrate P1 placed on substrate holder 28 in stage device 20. In this state, the main controller opens loading entrance 172U by sliding loading entrance shutter 154 in the +Z direction to receive substrate P2, which will be exposed next, into chamber 200. Next, the main controller drives external transfer robot 300' in the -X direction (see arrow V1). This operation of external transfer robot 300' positions approximately the -X half of robot hand 300F' and approximately the -X half of substrate P2 above substrate feeder 169, as shown in FIG. 33(b).

[0169] Next, the main control device drives robot hand 300F' downward to a height where the upper surface of robot hand 300F' is approximately flush with the upper surface of substrate feeder 169, thereby transferring a portion of substrate P2 to substrate feeder 169. Next, the main control device starts supplying pressurized gas from the substrate support surface (upper surface) of substrate feeder 169 and the upper surface of robot hand 300F'. The main control device also drives suction pad 142 to suction-hold the +Y side and -X side ends of substrate P2 onto suction pad 142.

[0170] Next, as shown in Figure 34(a), the main controller drives the suction pad 142 in the -X direction, thereby moving substrate P2 along the substrate support surface of substrate feeder 169 (see arrow V2). Thereafter, when exposure of substrate P1 in stage device 20 is completed, the main controller drives substrate feeder 169 in the -X direction (see arrow V3), and drives external transfer robot 300' in the +X direction to retract from chamber 200 (see arrow V4), as shown in Figure 34(b). Thereafter, the main controller replaces the substrate on substrate holder 28 by executing operations similar to those of the eighth embodiment described above (operations in Figures 29(a) to 30).

[0171] As described above, according to the tenth embodiment, the external transfer robot 300′ enters the chamber 200 and delivers approximately the −X side half of the substrate P2 to the substrate feeder 169, thereby shortening the movement range (stroke) in the X direction and the movement range in the Z direction of the substrate slide hand 140 (suction pad 142) that pulls the substrate P2 into the chamber 200. Accordingly, the movement time of the suction pad 142 can be shortened.

[0172] Furthermore, when the substrate is transferred from the external transport robot 300' to the substrate feeder 169, it is transferred from above, which reduces the possibility of the substrate coming into contact with the substrate feeder 169 due to bending (sagging) of the tip of the substrate compared to when the substrate is transferred by sliding it.

[0173] In addition, in the tenth embodiment, the rail 146 of the substrate slide hand 140 is provided on the substrate feeder 169, so that the movement range (stroke) of the substrate slide hand 140 in the X-axis direction can be made shorter than in the ninth embodiment.

[0174] Eleventh Embodiment Next, an exposure apparatus according to an eleventh embodiment will be described with reference to FIGS.

[0175] Figures 35(a) and 35(b) show a cross-sectional view and a longitudinal cross-sectional view of the exposure apparatus according to the eleventh embodiment. For convenience, the chamber 200 is not shown in Figures 35(a), 35(b), etc.

[0176] 35(a) and 35(b), in the eleventh embodiment, an external transfer robot 301 is used instead of the external transfer robot 300′ of the ninth embodiment. In addition, the partition member 172 is provided with a surrounding member 182 that forms a space 171 that covers the substrate feeder 169.

[0177] 35(a), the external transfer robot 301 has a plurality of (for example, five) fingers 301F, but unlike the external transfer robots 300 and 300', it does not have the function of air-floating the substrate P. Furthermore, to match the finger portions 301F of the external transfer robot 301, the length in the X-axis direction of the grooves 169a of the substrate feeders 169 is set longer than in the ninth embodiment. Note that an uneven member such as a substrate support pad may be present on the upper surface of the finger portions 301F of the external transfer robot 301.

[0178] An opening 172N is formed in the surrounding member 182 provided on the partition member 172. In the eleventh embodiment, the finger 301F of the external transfer robot 301 enters the chamber 200, but the range of entry is limited to the spaces 171 and 173. In the eleventh embodiment, an air exhaust device 183 that exhausts air in the +Z direction is provided in the space 173. High-pressure air may be supplied to the air exhaust device 183 from a compressor commonly used in factory equipment. The air exhaust device 183 may also use a fan, such as that disclosed in Japanese Patent Application Laid-Open No. 2009-073660.

[0179] The other configurations are the same as those of the ninth embodiment.

[0180] (Board replacement operation) Next, the substrate exchange operation in the eleventh embodiment will be described in detail using Figures 35(a) to 38(c). Figures 35(a) and 35(b), 36(a) and 36(b), and 37(a) and 37(b) show horizontal and vertical cross-sectional views of the vicinity of the stage device at the same timing. Figures 35(a) to 38(c) omit illustrations of components of the exposure apparatus that are not necessary for the explanation.

[0181] (Operations in Figures 35(a) and 35(b)) 35(a) and 35(b), exposure is being performed on substrate P1 in stage device 20. Meanwhile, the main control device opens load port 152U by sliding load port shutter 154 in the +Z direction (see arrow α1 in FIG. 35(b)) to receive substrate P2, which will be exposed next, into chamber 200 (inside space 171).

[0182] (Operations in Figures 36(a) and 36(b)) Next, the main controller drives the external transfer robot 301 in the -X direction (see arrow α2 in Figures 36(a) and 36(b)). This movement of the external transfer robot 301 positions approximately the -X side half of the fingers 301F of the external transfer robot 301 and approximately the -X side half of the substrate P2 above the substrate feeder 169, as shown in Figures 36(a) and 36(b). In this state, the main controller drives the external transfer robot 301 downward to transfer a portion of the substrate P2 to the substrate feeder 169. Then, the main controller starts the supply of pressurized gas from the substrate feeder 169. The main controller also drives the suction pad 142 to suction-hold the end of the substrate P2 on the +Y side and the -X side.

[0183] (Operations in Figures 37(a) and 37(b)) Next, the main controller moves substrate P2 to the position shown in FIGS. 37(a) and 37(b) by driving suction pad 142 in a direction intersecting the X-axis and Z-axis within the XZ plane (the tilt direction of the substrate support surface of substrate feeder 169) (see arrow α3). The main controller also drives external transfer robot 301 in the +X direction to move finger 301F out of space 171. When the +X end of substrate P2 is positioned on the -X side of load entrance shutter 154 and the -X end of finger 301F of external transfer robot 301 is positioned on the +X side of load entrance shutter 154, the main controller slides load entrance shutter 154 in the -Z direction to close load entrance 172U (see arrow α4). The main controller also drives external transfer robot 301 in the -Z direction to position the -X end of finger 301F near load exit 172L (see arrow α5).

[0184] (Operation in Figure 38(a)) Next, the main controller starts suction-holding of substrate P2 by substrate feeder 169 and drives substrate feeder 169 in the -X direction (see arrow α6). Note that suction pad 142 holding substrate P2 may be moved in the -X direction in synchronization with the movement of substrate feeder 169, or suction-holding of substrate P2 by suction pad 142 may be released and suction pad 142 may be moved in the -X direction beforehand when substrate feeder 169 moves. The main controller also slides unloading port shutter 156 in the -Z direction to open unloading port 172L (see arrow α7). Furthermore, the main controller drives external transfer robot 301 in the -X direction (see arrow α8) to cause finger 301F to penetrate unloading port 172L and substrate passage port 172M.

[0185] (Operation in Figure 38(b)) Thereafter, when exposure of substrate P1 on stage device 20 is completed, the main controller moves stage device 20 to the substrate exchange position below substrate feeder 169 (see arrow α9). At this time, air floating member 29 provided on substrate holder 28 and finger portion 301F of external transfer robot 301 become nested.

[0186] The main controller also controls air exhaust device 183 to begin exhausting high-pressure air upward (see dashed arrow α10). The main controller also begins supplying pressurized gas from the upper surface of substrate holder 28 and the upper surface of air floating member 29. The main controller also uses substrate carry-in bearer device 25 to offset substrate P1 in the +Y direction, causes suction pad 27 to suction-hold a portion of substrate P2, and drives suction pad 27 in the +X direction (see arrow α11 in Figure 38(c)).

[0187] The main control device then drives suction pad 27 of substrate carry-in bearer device 25 upward, causing suction pad 27 to suction-hold the -X end of substrate P2. The main control device also starts supplying (air supplying) pressurized gas from the top surface of substrate feeder 169. With suction pad 27 of substrate carry-in bearer device 25 suction-holding substrate P2, the main control device then drives stage device 20 in the -X direction (see arrow α12) and simultaneously moves substrate feeder 169 in the +X direction (see arrow α13). As a result, as shown in FIG. 38(c), substrate P2 is transferred from substrate feeder 169 onto substrate holder 28. By driving stage device 20 and substrate feeder 169 in directions away from each other in the X direction, substrate P2 can be loaded onto substrate holder 28 more quickly than by simply driving stage device 20 in the -X direction. This is possible because the device is configured such that the substrate feeder 169 can be driven in the +X direction by providing space 173 within chamber 200. The timing for driving stage device 20 in the -X direction and the timing for moving substrate feeder 168 in the +X direction may be different. The main controller may move substrate feeder 169 in the +X direction after transferring substrate P2 to substrate holder 28. The main controller may also finely drive suction pad 27 to align (adjust the position) substrate P2. Thereafter, the main controller drives suction pad 27 downward, causing substrate holder 28 to begin suction-holding substrate P2, and begins exposure of substrate P2 newly placed on substrate holder 28. The main controller may also move substrate feeder 169 in the +X direction after transferring substrate P2 to substrate holder 28 (see arrow α13).

[0188] Furthermore, the main controller continues to drive the suction pad 142 in the +X direction (see arrow α11), whereby the substrate P1 is transferred from the substrate holder 28 and air floating member 29 to the external transfer robot 301. Note that during this transfer of the substrate P1, high-pressure air is ejected upward from the air exhaust device 183, so that contact between the fingers 301F of the external transfer robot 301 and the substrate P1 can be prevented even if the external transfer robot 301 does not have the function of supplying pressurized gas. Thereafter, the main controller stops the air exhaust device 183 and starts suction-holding the substrate P1 with the fingers 301F. The main controller then drives the external transfer robot 301 in the +X direction to transfer the substrate P1 out of the chamber 200, and closes the transfer port shutter 156.

[0189] This completes the substrate replacement operation.

[0190] As described above, in addition to obtaining the same effects as in the ninth embodiment, by using the air exhaust device 183, it is possible to prevent contact between the fingers 301F and the substrate P1 even if the external transfer robot 301 does not have a mechanism for supplying pressurized gas. Furthermore, since the partition member 172 has the spaces 171, 173, it is possible to prevent dust from entering the vicinity of the exposure apparatus main body 10.

[0191] In the eleventh embodiment, a shutter may be provided at the substrate passage opening 172M and the opening 172N. This makes it possible to prevent dust from entering the chamber 200.

[0192] Twelfth Embodiment Next, the twelfth embodiment will be described in detail with reference to Figures 39 to 41. Figure 39(a) shows a vertical cross-sectional view of the vicinity of a partition member 172 according to the twelfth embodiment, and Figure 39(b) shows a cross-sectional view taken along line BB in Figure 39(a).

[0193] The twelfth embodiment is characterized in that, in addition to the configuration of the eleventh embodiment described above, an air exhaust device 183 provided in the space 173 is provided with a belt reeling mechanism 40 .

[0194] Belt reeling mechanism 40 includes a pair of rails 41 provided on air exhaust device 183 and having a longitudinal direction in the X-axis direction, a pair of movable bodies 43 movable in the X-axis direction along rails 41, and moving members 42 connected to each of movable bodies 43 and having a longitudinal direction in the Y-axis direction. Moving members 42 have multiple (e.g., four) protrusions protruding in the Z direction and provided at predetermined intervals in the Y-axis direction. Belt reeling mechanism 40 also includes multiple (e.g., four) belts 45, one end of which is fixed to each of the protrusions of moving members 42, and weight members 47 fixed to the other end of each belt 45. Each belt 45 is hung on a pulley 48 fixed to a shaft member provided on air exhaust device 183 and extending in the Y-axis direction.

[0195] In belt reeling mechanism 40, when no driving force in the −X direction is applied to movable body 43, weight member 47 abuts on the bottom surface of space 173 as shown in Fig. 39(a), so that the state shown in Fig. 39(a) is maintained. On the other hand, when a driving force in the −X direction is applied to movable body 43, moving member 42 moves in the −X direction, so that the length of the portion of belt 45 extending in the X-axis direction increases.

[0196] (Board replacement operation) Next, the substrate exchange operation in the exposure apparatus of the twelfth embodiment will be described in detail based on Figures 40(a) to 41(c).

[0197] 40(a) shows a state in which exposure of substrate P1 has been completed in stage device 20, and substrate P2 has been transported onto substrate feeder 169 by external transport robot 301, as in the eleventh embodiment described above, and substrate feeder 169 has moved in the -X direction. In this case, weight member 47 of belt payout mechanism 40 is in contact with the bottom surface of space 173.

[0198] In FIG. 40(a), the main control device opens the unloading port 172L by sliding the unloading port shutter 156 in the -Z direction (see arrow β1 in FIG. 40(a)). Then, as shown in FIG. 40(b), the main control device causes the finger 301F of the external transfer robot 301 to enter through the unloading port 172L (see arrow β2), and drives the stage device 20 to the substrate exchange position (below the substrate feeder 169) (see arrow β3). In this case, as shown in FIG. 41(a), each of the air floating members 29 provided on the substrate holder 28 is aligned in the same straight line as each belt 45. Furthermore, because the finger 301F of the external transfer robot 301 is nested within the belt 45 and the air floating member 29, the finger 301F does not come into contact with the belt 45 or the air floating member 29. Belt 45 has many small holes formed therein, and when high-pressure air is supplied from air exhaust device 183, some of the high-pressure air passes through the holes. Therefore, belt 45 can be given the same function as air floating member 29. This allows substrate P1 to slide while floating or semi-floating relative to belt 45.

[0199] That is, in the state of Figure 41(a), by sliding the substrate P1 placed on the substrate holder 28 in the +X direction using the substrate slide hand 140, the substrate P1 can be moved above the finger portion 301F of the external transport robot 301 without bending the substrate P1, even if the finger portion 301F of the external transport robot 301 does not have the function for air levitation.

[0200] Thereafter, as in the eleventh embodiment, substrate P2 is transferred from substrate feeder 169 onto substrate holder 28, and substrate P1 is transferred from substrate holder 28 to external transfer robot 300. In this operation, the main control device drives stage device 20 in the -X direction, and moves movable member 42 in the -X direction to follow the driving of stage device 20 in the -X direction. This makes it possible to maintain a state in which air floating member 29 or belt 45 is arranged with almost no gap between fingers 301F of external transfer robot 301, as shown in Figure 41(b).

[0201] 41(c) shows a state in which substrate P2 is placed on substrate holder 28 and substrate P1 is positioned above finger portions 301F of external transfer robot 301. From this state, the main control device drives external transfer robot 301 upward, thereby transferring substrate P1 to external transfer robot 301. Thereafter, the main control device stops air exhaust device 183 and starts suction and holding of substrate P1 by finger portions 301F. Then, the main control device drives external transfer robot 301 in the +X direction to retract it from space 173, and slides transfer port shutter 156 in the +Z direction to close transfer port 172L.

[0202] In the above description, the case has been described where the external transfer robot 301 has entered the space 173 and the substrate P1 is slid into the space 173, but this is not limiting. For example, the external transfer robot 301 may enter the space 173 after the substrate P1 has been slid into the space 173.

[0203] (Variation) In the above embodiments, the case where an unloading outlet shutter and an inlet shutter are provided near the unloading outlet and inlet of the partition members 152, 172 has been described, but this is not limited to this, and the unloading outlet shutter and the inlet shutter may also be provided in the chamber 200.

[0204] The board feeder of each of the above embodiments may be a board feeder 264 as shown in Fig. 42, and the top surface of board feeder 264 may be covered by fixing cover 199 to a pair of block-shaped members 265 provided on the +Y side and -Y side surfaces of board feeder 264. In addition, in the case of a board feeder having a groove formed on the top surface, cover 199 may be provided so as to cover all but the area above the groove.

[0205] Cover 199 has an inverted U-shaped YZ cross section, and a substrate can be slid in from the +X side between cover 199 and substrate feeder 264, and can be slid out from the -X side. Note that while Figure 42 shows a case where cover 199 is transparent, cover 199 does not have to be transparent. In this modified example, by providing cover 199, it is possible to prevent dust from adhering to substrate P and to maintain a constant temperature of substrate P.

[0206] In the sixth embodiment (FIGS. 22(a), 22(b), etc.), when board feeder 264 of FIG. 42 is employed, the upper surface of cover 199 may be suspended and supported by suspension mechanism 186. In the seventh embodiment (FIG. 25), when board feeder 264 of FIG. 42 is employed, cover 199 may be provided on the underside of the board feeder.

[0207] Furthermore, a substrate feeder 364 as shown in Figure 43(a) may be used as the substrate feeder in each of the above embodiments. The top surface of substrate feeder 364 is curved. By curving the top surface (substrate support surface) of substrate feeder 364 in this way, the section modulus of the substrate can be increased. In other words, the bending of the substrate can have the same effect as if the thickness of the substrate were several to several hundred times larger than its actual thickness.

[0208] 43(b), it is possible to prevent bending (sagging) of the -X end of substrate P. Furthermore, because bending (sagging) of substrate P is prevented, when substrate P is brought into contact with substrate holder 28, substrate P can be brought into contact from the center of the -X side in the Y-axis direction, making it possible to prevent wrinkles from occurring at the -X end of substrate P.

[0209] An ionizer may be installed near the substrate feeder, which can eliminate static electricity from the substrates before they are placed on the substrate holder 28.

[0210] The above-described embodiment is a preferred example of the present invention, but the present invention is not limited to this and can be modified in various ways without departing from the spirit of the present invention. [Explanation of symbols]

[0211] 10 Exposure device body 100 Exposure device 200 Chambers 300 External transport robot 28 PCB holder 160 PCB Feeder

Claims

1. an optical system for illuminating the substrate; a stage device that moves while holding the substrate; a holder for holding the substrate; a chamber that accommodates the optical system, the stage device, and the holder; a control device that moves the stage device, the stage device includes a holding device; the holder is located at a position where the substrate can be held while the substrate is positioned within the opening of the chamber; The control device With the stage device positioned below the holding unit, a portion of the substrate held by the holding unit that does not overlap with an exposure region is held by the holding device; moving the stage device away from the holder while the portion of the substrate is held by the holder so that the stage device receives the substrate from the holder; and causing the optical system to irradiate the substrate while moving the stage device holding the substrate relative to the optical system; Exposure device.

2. The exposure apparatus according to claim 1 , wherein the holding section holds the substrate so that the substrate is inclined relative to an upper surface of the stage device.

3. the holder changes the attitude of the substrate held by the holder so that the substrate moves from a state inclined with respect to the upper surface of the stage device to a state approaching parallel to the upper surface of the stage device.

2. The exposure apparatus according to claim 1.

4. The control device With the stage device positioned below the holding unit, the part held in a non-contact manner by the holding unit is brought into contact with the holding device and held thereon; moving the stage device away from the holder while the portion of the substrate is held in contact with the holder so that the stage device holds the substrate in a non-contact manner; and the holding device that is in contact with and holding the portion of the substrate is lowered, and the substrate is brought into contact with and held by the stage device; The exposure apparatus according to any one of claims 1 to 3.

5. the stage device includes a hole for supplying gas to the rear surface of the substrate; The control device the gas is supplied to the rear surface of the substrate through the hole, thereby causing the stage device to hold the substrate in a non-contact manner.

5. The exposure apparatus according to claim 4.

6. 2. The exposure apparatus according to claim 1, wherein the control device moves the stage device away from the holder while the portion of the substrate is held by the holder so that the substrate slides on the holder and the stage device receives the substrate from the holder.

7. 2. The exposure apparatus according to claim 1, wherein the holding device is provided at an end of the stage device in the direction in which the stage device moves.

8. The exposure apparatus according to claim 1 , wherein the holding portion is located between the opening and the optical system.

9. the stage device moves in a scanning direction relative to the optical system while holding the substrate; the holding portion is located between the opening and the optical system in the scanning direction.

2. The exposure apparatus according to claim 1.

10. 2. The exposure apparatus according to claim 1, wherein the control device moves the stage device closer to the optical system and away from the holder while the portion of the substrate is held by the holder so that the stage device receives the substrate from the holder.

11. a base supporting the optical system; The exposure apparatus according to claim 1 , wherein the surface plate has a notch for avoiding contact with the substrate held by the holder.

12. The exposure apparatus according to claim 1 , wherein the opening is openable and closable.

13. a vibration isolation device installed on a first area of ​​the floor and supporting the optical system; 2. The exposure apparatus according to claim 1, further comprising: a support member that is installed on the second area of ​​the floor and that supports the holder.

14. The exposure apparatus according to claim 1 , wherein the holding part holds the substrate in a non-contact manner below the holding part.

15. 2. The exposure apparatus according to claim 1, wherein the control device moves the stage device away from the holder, and moves the holder in a direction opposite to the direction of movement of the stage device.

16. exposing a substrate using the exposure apparatus according to any one of claims 1 to 3 and 6 to 15; and developing the exposed substrate.

Images