Processing equipment

Abstract

To provide a processing device for facilitating collection of a workpiece after processing.SOLUTION: A processing device for processing a workpiece has a holding table for holding the workpiece, a processing unit for processing the workpiece held by the holding table, a loading table for temporarily placing the workpiece before processing, an unloading table for temporarily placing the workpiece after processing, a carrier unit for carrying the workpiece to the holding table from the loading table and carrying the workpiece to the unloading table from the holding table, an openable-closable cover for covering the unloading table arranged in a temporary placing position, a determination part for determining whether the unloading table is arranged in the temporarily placing position and a control part for performing control for opening the cover when the determination part determines that the unloading table is arranged in the temporary placing position.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device for processing a workpiece. [Background technology]

[0002] A wafer on which multiple devices are formed is divided and singulated to manufacture device chips each including a device. Furthermore, a package substrate is obtained by mounting multiple device chips on a predetermined substrate and sealing the mounted device chips with a resin layer (mold resin). Package devices each including multiple packaged device chips are manufactured by dividing and singulating this package substrate. Device chips and package devices are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] Processing devices such as cutting devices and laser processing devices are used to divide workpieces such as wafers and package substrates. A cutting device includes a chuck table that holds the workpiece and a processing unit (cutting unit) to which an annular cutting blade is attached. The workpiece is cut by rotating the cutting blade to cut into the workpiece. A laser processing device includes a chuck table that holds the workpiece and a processing unit (laser irradiation unit) that irradiates the workpiece with a laser beam. The laser irradiation unit irradiates the workpiece with a laser beam, thereby performing a predetermined laser processing on the workpiece.

[0004] When processing small workpieces, a method of holding multiple workpieces on a chuck table at once and processing them continuously is sometimes used to improve processing efficiency. For example, Patent Document 1 discloses a cutting device and a laser processing device that holds multiple semiconductor wafers on a chuck table using an auxiliary jig for attaching an adhesive sheet and processes multiple semiconductor wafers in a single processing feed. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-74657 Summary of the Invention [Problem to be solved by the invention]

[0006] Processing equipment such as cutting machines and laser processing machines automatically transport, process, and clean multiple workpieces stored in cassettes one by one. However, there are also types of processing equipment in which workpieces are manually set one by one by an operator. This type of processing equipment is inexpensive and small in size, making it suitable for operations such as installing multiple processing equipment in a factory and operating them simultaneously. This makes it possible to process a large number of workpieces simultaneously using multiple processing equipment.

[0007] The processing device in which the workpiece is manually set by the operator as described above includes a load table on which the workpiece is set before processing, a holding table that holds the workpiece during processing, and an unload table that stores the processed workpiece. The operator manually places the workpiece before processing on the load table and retrieves the processed workpiece from the unload table at the appropriate time.

[0008] The workpiece set on the load table is transported to the holding table and processed by the processing unit in the processing chamber. During this time, the unload table is on standby near the processing chamber. Note that the unload table is covered with an openable cover to prevent particles (dust, etc.) and processing debris from adhering to the waiting unload table.

[0009] Once the workpiece is finished being processed, it is transported to the unload table, which is then placed in a designated temporary storage position. The operator then manually opens the cover, retrieves the workpiece, and then manually closes the cover again. This means that the operator must manually open and close the cover, which makes the workpiece retrieval process cumbersome.

[0010] Furthermore, particularly when one operator is managing multiple processing devices, the operator must quickly load and retrieve workpieces from each device to prevent a decrease in the operating efficiency of the devices. In this case, if the processed workpieces are stored on the unload table covered, the operator must open and close the cover every time they need to retrieve the workpieces, making it difficult to efficiently retrieve the processed workpieces from multiple processing devices.

[0011] The present invention has been made in view of the above problems, and has as its object to provide a processing device that makes it easy to recover a workpiece after processing. [Means for solving the problem]

[0012] According to one aspect of the present invention, there is provided a processing device for processing a workpiece, comprising: a holding table for holding the workpiece; a processing unit for processing the workpiece held by the holding table; a load table on which the workpiece is temporarily placed before processing; an unload table on which the workpiece is temporarily placed after processing; a transport unit for transporting the workpiece from the load table to the holding table and from the holding table to the unload table; an openable and closable cover for covering the unload table placed at a temporary placement position; a determination unit for determining whether the unload table is placed at the temporary placement position; and a control unit for controlling the opening of the cover when the determination unit determines that the unload table is placed at the temporary placement position.

[0013] Preferably, the processing device further includes a time determination unit that determines whether the elapsed time since the unload table was placed at the temporary placement position has reached a predetermined reference value, and the control unit controls the cover to close when the time determination unit determines that the elapsed time has reached the reference value.

[0014] Preferably, the workpiece is supported by a support member having a workpiece area on which the workpiece is placed and an outer peripheral area surrounding the workpiece area, and the transport unit is provided with a holding mechanism that holds the outer peripheral area of ​​the support member and includes a storage section that stores the workpiece supported in the workpiece area, and the holding mechanism is provided with a movement prevention section that prevents movement of the workpiece stored in the storage section.

[0015] Furthermore, preferably, the processing device further includes a temporary placement determination unit that determines whether the workpiece has been temporarily placed on the load table, and a cover state determination unit that determines whether the open / closed state of the cover satisfies a predetermined condition set as a trigger for starting processing of the workpiece, and when the temporary placement determination unit determines that the workpiece has been temporarily placed on the load table and the cover state determination unit determines that the open / closed state of the cover satisfies the condition, the control unit controls the transport unit to transport the workpiece temporarily placed on the load table to the holding table and to process it in the processing unit. [Effects of the Invention]

[0016] In the processing device according to one aspect of the present invention, when it is determined that the unload table has been placed in the temporary placement position, the cover covering the unload table is automatically opened, thereby enabling the processed workpiece to be quickly removed from the unload table. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. [Figure 2] FIG. [Figure 3]FIG. 4 is a cross-sectional view showing a load table. [Figure 4] FIG. 4(A) is a perspective view showing the top side of the holding mechanism, and FIG. 4(B) is a perspective view showing the bottom side of the holding mechanism. [Figure 5] FIG. 4 is a partial cross-sectional side view showing the unload unit. [Figure 6] FIG. 6(A) is a front view showing the unload unit with the cover closed, and FIG. 6(B) is a front view showing the unload unit with the cover open. [Figure 7] FIG. 7A is a cross-sectional view showing a holding mechanism that transfers a work set from a load table, and FIG. 7B is a cross-sectional view showing a holding mechanism that transfers a work set to an unload table. [Figure 8] FIG. 2 is a block diagram showing a control unit. [Figure 9] FIG. 10 is a perspective view showing a modified example of the work set. DETAILED DESCRIPTION OF THE INVENTION

[0018] An embodiment according to one aspect of the present invention will be described below with reference to the accompanying drawings. First, a configuration example of a processing device according to this embodiment will be described. FIG. 1 is a perspective view showing a cutting device 2. In FIG. 1, the X-axis direction (processing feed direction, first horizontal direction, front-rear direction) and the Y-axis direction (indexing feed direction, second horizontal direction, left-right direction) are perpendicular to each other. Furthermore, the Z-axis direction (vertical direction, height direction, up-down direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0019] The cutting device 2 includes a base 4 that supports or houses each of the components that make up the cutting device 2. A load table (first temporary placement table) 6 is provided at the side end on the upper surface side of the base 4, on which a workpiece (work) 11 before machining is temporarily placed.

[0020] FIG. 2 is a perspective view showing a work set (workpiece unit) 23. For example, the workpiece 11 is a plate-shaped member made of resin, glass, semiconductor (Si, GaAs, InP, GaN, SiC, etc.), metal, ceramics, etc. FIG. 2 shows, as an example, the workpiece 11 formed in a rectangular shape in a plan view. For example, the workpiece 11 is cut along streets (planned cutting lines) by the cutting device 2 (see FIG. 1), thereby dividing the workpiece 11 into a plurality of chips.

[0021] However, there are no limitations on the type, material, shape, structure, size, etc. of the workpiece 11. For example, the workpiece 11 may be a package substrate. The package substrate includes a substrate on which multiple device chips (not shown) including devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are mounted, and a resin layer (mold resin) that covers and seals the device chips mounted on the substrate. By dividing the package substrate, package devices including multiple packaged device chips are manufactured.

[0022] When the workpieces 11 are processed by the cutting device 2, the workpieces 11 are supported by support members 17. For example, the support members 17 are plate-shaped members made of resin, glass, metal, ceramics, or the like, and have a front surface 17a and a back surface 17b that are generally parallel to each other. Note that although FIG. 2 illustrates the support member 17 that is rectangular in plan view, there are no limitations on the shape of the support member 17.

[0023] Surface 17a of support member 17 includes a rectangular workpiece area 19A on which multiple workpieces 11 are placed, and a frame-shaped (annular) outer peripheral area 19B surrounding workpiece area 19A. Outer peripheral area 19B corresponds to a strip-shaped area having a predetermined width that includes the outer periphery of surface 17a, and no workpieces 11 are placed in outer peripheral area 19B.

[0024] The workpiece area 19A includes a plurality of placement portions 21. Each placement portion 21 has a rectangular marker 21a attached to the surface 17a of the support member 17. The shape of the marker 21a roughly matches the outline of the workpiece 11, and the marker 21a functions as a guide for aligning the workpiece 11 when placing it on the placement portion 21. However, there are no limitations on the form of the marker 21a as long as it is possible to align the workpiece 11. For example, the marker 21a may be formed as a shallow groove (recess) into which the workpiece 11 is fitted.

[0025] A linear suction groove 21b that sucks the workpiece 11 is provided inside the marker 21a. The suction groove 21b is formed along the surface 17a of the support member 17 and is exposed on the surface 17a. For example, the suction groove 21b is configured by connecting a rectangular groove and a cross-shaped groove formed inside the rectangular groove. However, there are no restrictions on the shape of the suction groove 21b.

[0026] The plurality of workpieces 11 are placed on the placement portion 21 so as to cover the entire suction groove 21b. This forms a work set 23 including the plurality of workpieces 11 and the support member 17. When processing the workpieces 11, the work set 23 is set on the load table 6 (see FIG. 1).

[0027] FIG. 3 is a cross-sectional view of the load table 6. The upper surface of the load table 6 is a flat surface roughly parallel to the horizontal plane (XY plane) and constitutes a rectangular holding surface 6a that holds the workpiece 11. A suction groove 6b exposed at the holding surface 6a is provided in the center of the load table 6 on the holding surface 6a side. The suction groove 6b is connected to a suction source 10 such as an ejector via a suction passage 6c formed inside the load table 6 and a valve 8. A sensor (pressure gauge) 12 that measures the pressure in the suction passage 6c is connected to the suction passage 6c. The pressure in the suction passage 6c is constantly monitored by the sensor 12.

[0028] The workpiece 11 is placed on the load table 6 via a support member 17. A plurality of suction paths 21c are provided inside the support member 17. Furthermore, suction grooves 17c exposed on the back surface 17b are provided on the back surface 17b side of the support member 17. The upper ends of the plurality of suction paths 21c are connected to the suction grooves 21b, and the lower ends of the plurality of suction paths 21c are connected to the suction grooves 17c. That is, the suction grooves 21b are connected to the suction grooves 17c via the suction paths 21c.

[0029] When processing the workpieces 11, the workpieces 11 are placed on the respective mounting portions 21, and the support member 17 is placed on the holding surface 6a of the load table 6. At this time, the support member 17 is positioned so that its back surface 17b covers the suction groove 6b of the load table 6. This connects the suction groove 6b of the load table 6 and the suction groove 17c of the support member 17, sealing the suction grooves 6b and 17c.

[0030] With the work set 23 placed on the load table 6, when the valve 8 is opened and the suction force (negative pressure) of the suction source 10 is applied to the suction grooves 6b, the suction grooves 6b and 17c are depressurized, and the back surface 17b side of the support member 17 is suction-held by the holding surface 6a of the load table 6. The suction force of the suction source 10 also acts on the multiple suction grooves 21b via the multiple suction paths 21c. As a result, the multiple workpieces 11 are each suction-held by the front surface 17a of the support member 17. In this manner, the work set 23 is held by the load table 6.

[0031] 1, a rectangular opening 4a, the longitudinal direction of which is aligned with the X-axis direction, is provided on the side of the load table 6. A holding table (chuck table) 14 for holding a workpiece 11 is provided inside the opening 4a.

[0032] The upper surface of the holding table 14 is a flat surface that is roughly parallel to the horizontal plane (XY plane) and constitutes a rectangular holding surface 14a that holds the workpiece 11 (work set 23). For example, a suction groove is formed on the holding surface 14a side of the holding table 14, and the holding surface 14a is connected to a suction source (not shown) such as an ejector via the suction groove and a valve (not shown).

[0033] A moving mechanism 16 is connected to the holding table 14. For example, the moving mechanism 16 is a ball screw type moving mechanism and includes an X-axis ball screw (not shown) arranged along the X-axis direction, and an X-axis pulse motor (not shown) that rotates the X-axis ball screw. The moving mechanism 16 also includes a table cover 16a that surrounds the holding table 14, and accordion-shaped dust-proof and drip-proof covers 18 that are extendable and contractible along the X-axis direction are provided in front and behind the table cover 16a. The table cover 16a and the dust-proof and drip-proof cover 18 cover the components of the moving mechanism 16 (X-axis ball screw, X-axis pulse motor, etc.) that are arranged inside the opening 4a.

[0034] The moving mechanism 16 moves the holding table 14 together with the table cover 16a along the X-axis direction. This allows the holding table 14 to be positioned at a transfer position A where the workpiece 11 is loaded and unloaded, and at a processing position B where the workpiece 11 is processed. In addition, the holding table 14 is connected to a rotation drive source (not shown), such as a motor, that rotates the holding table 14 around a rotation axis that is approximately parallel to the Z-axis direction.

[0035] A cleaning nozzle 20 that supplies a cleaning liquid for cleaning the workpiece 11 is provided above the movement path of the holding table 14 between the transfer position A and the processing position B. A drying nozzle 22 that supplies a gas for drying the workpiece 11 is provided above the front end of the opening 4a. The cleaning nozzle 20 and the drying nozzle 22 are formed in a pipe shape and are installed so as to straddle the opening 4a in the width direction. The cleaning nozzle 20 and the drying nozzle 22 are arranged so as to sandwich the transfer position A in the X-axis direction in a plan view.

[0036] A liquid supply source (not shown) that supplies liquid such as pure water is connected to the cleaning nozzle 20. In addition, a jet nozzle (not shown) that opens downward is provided at the lower end of the cleaning nozzle 20. When the holding table 14 holding the workpiece 11 moves between the transfer position A and the processing position B, liquid such as pure water is supplied from the cleaning nozzle 20 toward the workpiece 11, and the workpiece 11 is cleaned.

[0037] A gas supply source (not shown) that supplies a gas such as air is connected to the drying nozzle 22. In addition, a jet nozzle (not shown) that opens downward is provided at the lower end of the drying nozzle 22. When the holding table 14 holding the workpiece 11 moves between the transfer position A and a temporary placement position C described below, a gas such as air is jetted from the drying nozzle 22 toward the workpiece 11, thereby drying the workpiece 11.

[0038] A support structure 24 is provided at a position adjacent to the opening 4a of the base 4. The upper part of the support structure 24 is disposed along the Y-axis direction so as to overlap with the opening 4a. A movement mechanism 26 is provided on the front side of the upper part of the support structure 24. For example, the movement mechanism 26 is a ball screw type movement mechanism.

[0039] Specifically, the movement mechanism 26 includes a pair of Y-axis guide rails 28 fixed to the front side of the support structure 24. The pair of Y-axis guide rails 28 are arranged generally parallel to each other along the Y-axis direction. A flat Y-axis movement plate 30 is slidably mounted on the pair of Y-axis guide rails 28.

[0040] A nut portion (not shown) is provided on the back surface (rear surface) of the Y-axis moving plate 30. A Y-axis ball screw 32, which is disposed along the Y-axis direction between a pair of Y-axis guide rails 28, is threadedly engaged with this nut portion. A Y-axis pulse motor 34, which rotates the Y-axis ball screw 32, is connected to the end of the Y-axis ball screw 32. When the Y-axis pulse motor 34 rotates the Y-axis ball screw 32, the Y-axis moving plate 30 moves in the Y-axis direction along the Y-axis guide rails 28.

[0041] A pair of Z-axis guide rails 36 are arranged generally parallel to each other along the Z-axis direction on the surface side (front side) of the Y-axis moving plate 30. A flat Z-axis moving plate 38 is slidably mounted on the pair of Z-axis guide rails 36.

[0042] A nut portion (not shown) is provided on the back surface (rear surface) of the Z-axis moving plate 38. A Z-axis ball screw 40, which is disposed along the Z-axis direction between a pair of Z-axis guide rails 36, is threadedly engaged with this nut portion. A Z-axis pulse motor 42 that rotates the Z-axis ball screw 40 is connected to an end of the Z-axis ball screw 40. When the Z-axis pulse motor 42 rotates the Z-axis ball screw 40, the Z-axis moving plate 38 moves in the Z-axis direction along the Z-axis guide rails 36.

[0043] A processing unit (cutting unit) 44 that performs cutting on the workpiece 11 is connected to the moving mechanism 26. For example, the processing unit 44 is fixed to the lower end of the Z-axis moving plate 38.

[0044] The processing unit 44 incorporates a cylindrical spindle (not shown) arranged along the Y-axis direction. An annular cutting blade 46 is attached to the tip of the spindle. The processing unit 44 cuts the workpiece 11 by rotating the cutting blade 46 and causing it to cut into the workpiece 11.

[0045] For example, a hub-type cutting blade (hub blade) is used as cutting blade 46. The hub blade has an annular hub base made of metal or the like and an annular cutting edge formed along the outer periphery of the hub base. The cutting edge of the hub blade is formed by an electroformed grinding stone containing abrasive grains made of diamond or the like and a binder such as a nickel-plated layer that fixes the abrasive grains.

[0046] However, a washer-type cutting blade (washer blade) can also be used as the cutting blade 46. A washer blade is composed only of an annular cutting edge containing abrasive grains and a binder that secures the abrasive grains. For example, diamond is used as the abrasive grains, and a resin bond, metal bond, or vitrified bond is used as the binder.

[0047] By moving the processing unit 44 along the Y-axis direction using the movement mechanism 26, the position of the cutting blade 46 in the indexing feed direction is adjusted, and the cutting position of the cutting blade 46 into the workpiece 11 is controlled. In addition, by moving the processing unit 44 along the Z-axis direction using the movement mechanism 26, the height position of the cutting blade 46 is adjusted, and the cutting depth of the cutting blade 46 into the workpiece 11 is controlled.

[0048] A transport unit 48 that transports the workpiece 11 is also connected to the moving mechanism 26. The transport unit 48 has a support arm 50 fixed to the surface side (front side) of the Z-axis moving plate 38. The support arm 50 has a first connection portion 50a that protrudes forward from the Z-axis moving plate 38, a second connection portion 50b that protrudes downward from the front end of the first connection portion 50a, and a support portion 50c that protrudes rearward (toward the Z-axis moving plate 38) from the lower end of the second connection portion 50b.

[0049] A suction passage 50d is formed inside the support arm 50. One end of the suction passage 50d opens at the upper surface of the support portion 50c, and the other end of the suction passage 50d is connected via a valve 52 to a suction source 54 such as an ejector.

[0050] The transport unit 48 also includes a holding mechanism 56 that holds the workpiece 11. The holding mechanism 56 is moved along the Y-axis direction and the Z-axis direction by the moving mechanism 26 while being supported by the support portion 50c of the support arm 50.

[0051] 4(A) is a perspective view showing the top side of the holding mechanism 56, and FIG. 4(B) is a perspective view showing the bottom side of the holding mechanism 56. The holding mechanism 56 includes a connecting portion (hook) 58 that is connected to the support arm 50 (see FIG. 1), and a holding portion (holding member) 60 that holds the workpiece 11.

[0052] The connecting portion 58 is U-shaped in side view and includes a plate-like upper wall 58a, a columnar side wall 58b protruding downward from the rear end of the upper wall 58a, and a plate-like bottom wall 58c protruding forward from the lower end of the side wall 58b. The upper wall 58a and the bottom wall 58c are disposed generally parallel to each other, and the side wall 58b is disposed generally perpendicular to the upper wall 58a and the bottom wall 58c. A suction path 58d is formed inside the connecting portion 58. One end of the suction path 58d opens at the lower surface of the upper wall 58a, and the other end of the suction path 58d opens at the side surface of the bottom wall 58c.

[0053] The holding part 60 is fixed to the lower surface side of the bottom wall 58c of the connecting part 58. The holding part 60 is a rectangular parallelepiped member made of metal, resin, glass, ceramics, or the like, and has a first surface (upper surface) 60a and a second surface (lower surface) 60b that are generally parallel to each other. The first surface 60a corresponds to the connecting surface that is fixed to the connecting part 58, and the second surface 60b corresponds to the holding surface that holds the workpiece 11.

[0054] Four suction paths 60c are provided near the four corners of the holding portion 60, penetrating the holding portion 60 in the thickness direction. The upper ends of the suction paths 60c open at the outer periphery of the first surface 60a, and the lower ends of the suction paths 60c open at the outer periphery of the second surface 60b. The upper ends of the suction paths 60c are each connected to suction paths 58d of the connecting portion 58 via piping (not shown), such as tubes or hoses.

[0055] A frame-shaped (annular) suction groove 60d is provided on the second surface 60b side of the holding part 60. The suction groove 60d is formed, for example, in a rectangular shape along the outer periphery of the holding part 60, and is connected to the lower ends of the multiple suction paths 60c. That is, the suction groove 60d is connected to the suction path 58d (see FIG. 4(A)) of the connecting part 58 via the multiple suction paths 60c.

[0056] As shown in Fig. 4(B), a storage section 60e for storing the workpieces 11 is provided on the second surface 60b side of the holding section 60. The storage section 60e corresponds to a recess (space) provided inside the suction groove 60d, and is formed, for example, in a rectangular parallelepiped shape. The dimensions of the storage section 60e are appropriately set so that all of the workpieces 11 supported by the support member 17 can be stored in the storage section 60e (see Figs. 7(A) and 7(B)).

[0057] A movement prevention portion 60f that prevents movement of the workpiece 11 contained in the storage portion 60e is provided at the bottom of the storage portion 60e. The movement prevention portion 60f is a member made of a flexible elastic body such as rubber, sponge, or resin, and presses the workpiece 11 contained in the storage portion 60e from above (see FIGS. 7(A) and 7(B)). This prevents the workpiece 11 from shifting position during transport.

[0058] 1, a standby table 62 for holding the holding mechanism 56 of the transport unit 48 is provided near the transport position A. When the workpiece 11 is not being transported, the holding mechanism 56 is separated from the support arm 50 and temporarily placed on the standby table 62 for storage.

[0059] When the transport unit 48 transports the workpiece 11, the support portion 50c of the support arm 50 supports the upper wall 58a (see FIG. 4(A)) of the connecting portion 58 of the holding mechanism 56 from below, and the support arm 50 and the connecting portion 58 are connected. This makes it possible to move the holding mechanism 56 along the Y-axis direction and the Z-axis direction by the moving mechanism 26. Furthermore, in the contact area between the support arm 50 and the holding mechanism 56, the suction path 50d of the support arm 50 and the suction path 58d of the connecting portion 58 (see FIG. 4(A)) are connected.

[0060] An unloading unit (temporary storage unit) 64 for storing the processed workpiece 11 is provided in front of the opening 4a of the base 4. The unloading unit 64 stores the processed workpiece 11 at a temporary storage position C in front of the transfer position A.

[0061] 5 is a partial cross-sectional side view showing the unload unit 64. The unload unit 64 includes an unload table (second temporary placement table) 66 on which the workpiece 11 after processing is temporarily placed. The configuration and function of the unload table 66 are similar to those of the load table 6 (see FIG. 3).

[0062] Specifically, the upper surface of the unload table 66 is a flat surface that is roughly parallel to the horizontal plane (XY plane) and forms a rectangular holding surface 66a that holds the workpiece 11. A suction groove 66b exposed at the holding surface 66a is provided in the center of the holding surface 66a side of the unload table 66. The suction groove 66b is connected to a suction source (not shown) such as an ejector via a suction passage 66c formed inside the unload table 66 and a valve (not shown).

[0063] The unload unit 64 also includes a movement mechanism 68 connected to the unload table 66. The movement mechanism 68 is, for example, a ball screw type movement mechanism, and moves the unload table 66 along the X-axis direction.

[0064] Specifically, the movement mechanism 68 includes an X-axis ball screw 70 arranged along the X-axis direction. The X-axis ball screw 70 is threadedly engaged with a nut (not shown) connected to the unload table 66. An X-axis pulse motor 72 that rotates the X-axis ball screw 70 is connected to one end of the X-axis ball screw 70. When the X-axis pulse motor 72 rotates the X-axis ball screw 70, the unload table 66 moves along the X-axis direction. This allows the unload table 66 to be positioned at the transfer position A and the temporary storage position C.

[0065] Furthermore, the unload unit 64 includes an openable and closable cover 74 that covers the unload table 66 placed at the temporary placement position C. For example, the cover 74 is a box-shaped member made of a transparent material such as glass or plastic, and is formed in a rectangular parallelepiped shape (see FIG. 1). A rectangular parallelepiped storage section 74a that stores the unload table 66 is provided inside the cover 74.

[0066] Fig. 6(A) is a front view showing the unload unit 64 with the cover 74 closed, and Fig. 6(B) is a front view showing the unload unit 64 with the cover 74 open. A support shaft (hinge) 76 arranged along the X-axis direction is fixed to a side end of the cover 74. An actuator 78 such as a motor that rotates the support shaft 76 around its central axis is connected to the support shaft 76. When the actuator 78 rotates the support shaft 76, the cover 74 rotates around the rotation axis of the support shaft 76.

[0067] 6(A), when the cover 74 is placed in a lying position (approximately parallel to the holding surface 66a of the unload table 66), the unload table 66 is covered by the cover 74 and is housed in the housing portion 74a (see FIG. 5). This prevents particles (dust, etc.) and processing chips from adhering to the holding surface 66a of the unload table 66.

[0068] 6(B), when the cover 74 is placed in an upright position (approximately perpendicular to the holding surface 66a of the unload table 66), the holding surface 66a of the unload table 66 is exposed. This allows the workpiece 11 to be removed (recovered) from the unload table 66.

[0069] As shown in FIG. 1, the cutting device 2 is equipped with a display unit (display device) 80 that displays various types of information related to the cutting device 2. For example, a touch panel display is used as the display unit 80. In this case, an operation screen for inputting information into the cutting device 2 is displayed on the display unit 80, and the operator can input information into the cutting device 2 by touching the display unit 80. In other words, the display unit 80 also functions as an input unit (input device) for inputting various types of information into the cutting device 2, and is used as a user interface. However, the input unit may be an input device such as a mouse or keyboard that is provided separately and independently from the display unit 80.

[0070] Furthermore, the cutting device 2 includes a control unit (control device) 82 that controls the cutting device 2. The control unit 82 is connected to each of the components that make up the cutting device 2 (the load table 6, the holding table 14, the moving mechanism 16, the moving mechanism 26, the processing unit 44, the transport unit 48, the unloading unit 64, the display unit 80, etc.). The control unit 82 operates the cutting device 2 by generating and outputting control signals that control the operation of each of the components of the cutting device 2.

[0071] For example, the control unit 82 is configured by a computer. Specifically, the control unit 82 includes a processing unit that performs processing such as calculations required for the operation of the cutting device 2, and a storage unit that stores various information (data, programs, etc.) used for the operation of the cutting device 2. The processing unit is configured to include a processor such as a CPU (Central Processing Unit). In addition, the storage unit is configured to include memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0072] Next, the operation of the cutting device 2 shown in Fig. 1 will be described. When cutting workpieces 11 with the cutting device 2, first, a plurality of workpieces 11 are placed on the support member 17 to form a work set 23. Then, the operator places the work set 23 on the load table 6 and the load table 6 holds the work set 23 by suction. When the cutting device 2 starts to process the workpieces 11, the cover 74 of the unload unit 64 is closed (see Fig. 6(A)).

[0073] Next, the transport unit 48 transports the workpiece 11 from the load table 6 to the holding table 14. Specifically, first, the holding mechanism 56 stored on the standby table 62 is connected to the support arm 50. This makes it possible to move the holding mechanism 56 by the moving mechanism 26. Thereafter, the holding mechanism 56 is lowered while positioned directly above the load table 6, and comes into contact with the work set 23.

[0074] 7(A) is a cross-sectional view showing the holding mechanism 56 transporting the work set 23 from the load table 6. When the holding mechanism 56 positioned directly above the load table 6 descends, the second surface 60b of the holding portion 60 comes into contact with the surface 17a (outer peripheral region 19B) of the support member 17. Furthermore, multiple workpieces 11 are accommodated in the accommodation portion 60e of the holding portion 60. At this time, the movement inhibiting portion 60f comes into contact with the upper surface side of the workpieces 11 and holds them down. This prevents the workpieces 11 from shifting position during transportation.

[0075] Next, the suction hold of the work set 23 by the load table 6 is released, and a suction force is applied to the suction groove 60d of the holder 60. Specifically, the valve 52 (see FIG. 1) is opened, and the suction groove 60d is connected to the suction source 54 via the multiple suction paths 60c (see FIGS. 4(A) and 4(B)), the suction path 58d (see FIG. 4(A)), and the suction path 50d (see FIG. 1). As a result, the suction force of the suction source 54 acts on the suction groove 60d, and the outer peripheral region 19B of the support member 17 is suction-held by the second surface 60b of the holder 60. Thereafter, the holding mechanism 56 rises to a predetermined position, and the work set 23 is lifted from the load table 6.

[0076] It is preferable to clean the holding table 14 after the holding mechanism 56 held by the standby table 62 (see FIG. 1) starts to move, while the holding mechanism 56 is lifting up to a predetermined position while suction-holding the work set 23. Specifically, the holding table 14 is cleaned by reciprocating the holding table 14 between the transfer position A and the processing position B and passing it under the cleaning nozzle 20 (see FIG. 1) while supplying a cleaning liquid from the cleaning nozzle 20.

[0077] Next, the holding mechanism 56 holding the work set 23 is positioned directly above the holding table 14 arranged at the transfer position A. Then, the holding mechanism 56 descends, and the work set 23 is placed on the holding surface 14a of the holding table 14. Thereafter, the suction hold of the work set 23 by the holding mechanism 56 is released, and a suction force is applied to the holding surface 14a of the holding table 14. As a result, the work set 23 is suction-held by the holding table 14.

[0078] When the work set 23 is held by the holding table 14, the holding mechanism 56 rises and moves away from the work set 23, and is temporarily placed on the waiting table 62. Thereafter, the cutting blade 46 attached to the processing unit 44 cuts into the plurality of workpieces 11 in sequence, cutting the workpieces 11. For example, the cutting blade 46 cuts the workpiece 11 to divide it into a plurality of chips.

[0079] When cutting of the workpiece 11 is completed, a cleaning liquid is supplied from the cleaning nozzle 20, and the holding table 14 moves back and forth between the transfer position A and the processing position B, passing under the cleaning nozzle 20. In this way, the processed workpiece 11 is cleaned.

[0080] Next, the transport unit 48 transports the workpiece 11 from the holding table 14 to the unload table 66. Specifically, first, the holding mechanism 56 stored on the standby table 62 is connected to the support arm 50. Then, the holding mechanism 56, positioned directly above the holding table 14, descends and contacts the work set 23.

[0081] Thereafter, the suction hold of the work set 23 by the holding table 14 is released, and the holding mechanism 56 rises while holding the work set 23 by suction. As a result, the work set 23 is lifted from the holding table 14. The manner in which the holding mechanism 56 holds the work set 23 is the same as when the work set 23 is transported from the load table 6 (see FIG. 7(A)).

[0082] Next, the unload table 66 (see FIG. 5) moves along the X-axis direction and is positioned at the transfer position A. This causes the unload table 66 to enter between the holding table 14 and the holding mechanism 56 that holds the work set 23. Thereafter, the holding mechanism 56 descends, and the work set 23 is placed on the unload table 66.

[0083] 7(B) is a cross-sectional view showing the holding mechanism 56 transporting the work set 23 to the unload table 66. When the holding mechanism 56 descends, the work set 23 is placed on the holding surface 66a of the unload table 66. Thereafter, the suction hold of the work set 23 by the holding mechanism 56 is released, and the suction force of the suction source is applied to the suction groove 66b of the unload table 66. As a result, the work set 23 is suction-held by the unload table 66. Note that the manner in which the work set 23 is held by the unload table 66 is the same as when the work set 23 is held by the load table 66 (see FIG. 3).

[0084] When the work set 23 is held by the unload table 66, gas is sprayed from the drying nozzle 22 (see FIG. 1), and the unload table 66 moves back and forth between the transfer position A and the temporary storage position C, passing under the drying nozzle 22. This dries the workpiece 11 after processing and cleaning. Thereafter, the unload table 66 moves along the X-axis direction and is placed at the temporary storage position C, and the processed workpiece 11 is stored at the temporary storage position C.

[0085] Here, in the cutting device 2 according to this embodiment, when the unload table 66 holding the processed workpiece 11 is placed at the temporary placement position C, the cover 74 covering the unload table 66 and the workpiece 11 automatically opens (see FIG. 6(B)). This allows the operator to quickly retrieve the workpiece 11 on the unload table 66 without manually opening and closing the cover 74.

[0086] Fig. 8 is a block diagram showing the control unit 82. Fig. 8 also shows a block diagram showing the functional configuration of the control unit 82 and some of the components of the unload unit 64. The opening and closing of the cover 74 is controlled by the control unit 82.

[0087] The control unit 82 includes a processing unit 100 and a storage unit 130. The processing unit 100 processes information (signals, data, etc.) input from the outside, and generates and outputs various types of information (signals, data, etc.) to the outside. The storage unit 130 stores various types of information (data, programs, etc.) used in processing by the processing unit 100.

[0088] The processing unit 100 includes a determination unit 110 that determines whether the unload table 66 is placed at the temporary placement position C, and a control unit 120 that controls the open / close state of the cover 74. For example, the determination unit 110 determines whether the unload table 66 is placed at the temporary placement position C by comparing information indicating the position of the unload table 66 (table position information) with information indicating the temporary placement position C (temporary placement position information). In addition, the control unit 120 outputs a control signal to the actuator 78 to control the opening and closing of the cover 74.

[0089] Specifically, the control unit 82 adjusts the position of the unload table 66 by outputting a control signal to the X-axis pulse motor 72 to rotate the X-axis ball screw 70, and also monitors the coordinates (table position coordinates) of the unload table 66. The control unit 82 then sequentially inputs the table position coordinates to the determination unit 110. The memory unit 130 also stores the coordinates (temporary placement position coordinates) of the unload table 66 when the unload table 66 is placed at temporary placement position C.

[0090] When the determination unit 110 makes a determination, the temporary placement position coordinates are read from the storage unit 130 and input to the determination unit 110. Then, the determination unit 110 determines the position of the unload table 66 by comparing the table position coordinates with the temporary placement position coordinates. Specifically, if the table position coordinates reach the temporary placement position coordinates, the determination unit 110 determines that the unload table 66 is placed at temporary placement position C. On the other hand, if the table position coordinates do not reach the temporary placement position coordinates, the determination unit 110 determines that the unload table 66 is not placed at temporary placement position C.

[0091] However, there is no limitation on the method of determination by the determination unit 110. For example, as shown in Fig. 8, the unload unit 64 may be provided with a sensor 84 that detects that the unload table 66 has been placed at the temporary placement position C. For example, the sensor 84 may be an optical sensor or a switch such as a touch switch or a push button that is installed at or near the temporary placement position C.

[0092] When the unload table 66 is positioned at the temporary placement position C, the unload table 66 approaches or comes into contact with the sensor 84 and is detected by the sensor 84. Then, when a signal (detection signal) indicating that the unload table 66 has been detected is input from the sensor 84 to the determination unit 110, the determination unit 110 determines that the unload table 66 has been placed at the temporary placement position C.

[0093] When the determination unit 110 determines that the unload table 66 has been placed at the temporary placement position C, the suction of the work set 23 by the unload table 66 is released. In addition, the determination unit 110 outputs a signal corresponding to an instruction to open the cover 74 to the control unit 120. The control unit 120 then outputs a control signal to the actuator 78, thereby controlling the opening of the cover 74. As a result, when the unload table 66 is placed at the temporary placement position C, the cover 74 opens automatically, and the operator can quickly retrieve the processed workpiece 11 from the unload table 66.

[0094] The processing unit 100 also includes a time measurement unit (timer) 112 that measures the time that has elapsed since the unload table 66 was placed at the temporary placement position C, and a time determination unit 114 that determines whether the elapsed time has reached a predetermined reference value. The memory unit 130 stores a reference value (elapsed time reference value) of the time that has elapsed since the unload table 66 was placed at the temporary placement position C.

[0095] When the determination unit 110 determines that the unload table 66 has been placed at the temporary placement position C, the determination unit 110 outputs a signal corresponding to a measurement instruction to the time measurement unit 112. As a result, the time measurement unit 112 starts measuring time.

[0096] The time determination unit 114 receives the elapsed time measured by the time measurement unit 112 and the elapsed time reference value read from the memory unit 130. The time determination unit 114 then compares the elapsed time input from the time measurement unit 112 with the elapsed time reference value, and determines whether the time elapsed since the unload table 66 was placed at the temporary placement position C has reached the elapsed time reference value.

[0097] When the time determination unit 114 determines that the elapsed time since the unload table was placed at temporary placement position C has reached the elapsed time reference value, the time determination unit 114 outputs a signal corresponding to an instruction to close the cover 74 to the control unit 120. The control unit 120 then outputs a control signal to the actuator 78 to perform control to close the cover 74. This makes it possible to prevent the workpiece 11 temporarily placed on the unload table 66 from being left with the cover 74 open for a long period of time, and prevents foreign matter from adhering to the workpiece 11.

[0098] Furthermore, if the size or weight of the workpiece 11 to be machined by the cutting device 2 is large, the operator must hold the workpiece 11 with both hands and handle it carefully. If the cover 74 remains open even after the workpiece 11 is retrieved from the unload table 66, the operator must retrieve the processed workpiece 11 with both hands, carefully temporarily place the workpiece in another location, and manually close the cover 74. On the other hand, in this embodiment, the cover 74 is automatically closed after a certain period of time has passed, so the operator can retrieve the workpiece 11 from the unload table 66 with both hands and then move on to the workpiece 11 transport task.

[0099] The control unit 82 may also display on the display unit 80 (see FIG. 1) the time that has elapsed since the unload table 66 was placed at the temporary placement position C and the time remaining until that elapsed time reaches the reference elapsed time value. This allows the operator to instantly check the time that the machined workpiece 11 has been temporarily placed on the unload table 66 with the cover 74 open.

[0100] Furthermore, the processing unit 100 includes a temporary placement determination unit 116 that determines whether the workpiece 11 is temporarily placed on the load table 6 (see FIG. 1, etc.), and a cover state determination unit 118 that determines whether the cover 74 is open or closed. Then, based on the determination results by the temporary placement determination unit 116 and the cover state determination unit 118, processing of the workpiece 11 is automatically started.

[0101] For example, the temporary placement determination unit 116 determines, based on information detected by a sensor, whether or not the workpiece 11 has been temporarily placed on the load table 6. Specifically, the temporary placement determination unit 116 can determine whether or not the workpiece 11 is present, based on the pressure in the suction path 6c of the load table 6 measured by the sensor 12 shown in FIG.

[0102] When the work set 23 is placed on the load table 6, the suction groove 6b is sealed, and therefore the pressure in the suction path 6c is likely to decrease when the suction force of the suction source 10 is applied. On the other hand, when the work set 23 is not placed on the load table 6, the suction groove 6b is exposed and open, and therefore the pressure in the suction path 6c is unlikely to decrease when the suction force of the suction source 10 is applied. In other words, the pressure P in the suction path 6c when the work set 23 is present on the load table 6 is a is the pressure P in the suction passage 6c when the workpiece set 23 is not present on the load table 6. b becomes smaller than (P a <P b ).

[0103] Therefore, by checking the pressure value of the suction path 6c of the load table 6, it is possible to determine whether or not the work set 23 has been placed on the load table 6. Specifically, the pressure of the suction path 6c measured by the sensor 12 is input sequentially to the temporary placement determination unit 116. In addition, the memory unit 130 stores a preset pressure threshold P th (P a <P th <P b ) is stored. The temporary placement determination unit 116 then calculates the pressure value input from the sensor 12 and the threshold value Pth By comparing the above, it is determined whether or not the work set 23 has been placed on the load table 6.

[0104] However, there is no limitation on the method for determining the presence or absence of the work set 23. For example, an optical sensor for detecting the work set 23 may be provided on or near the load table 6. In this case, the temporary placement determination unit 116 can determine the presence or absence of the work set 23 based on whether or not the work set 23 is detected by the optical sensor.

[0105] The cover state determination unit 118 determines whether the open / closed state of the cover 74 satisfies a predetermined condition, for example, based on the angle of the cover 74. Specifically, the control unit 82 adjusts the angle of the cover 74 as needed by outputting a control signal to the actuator 78. The control unit 82 then inputs the angle (open / closed degree) of the cover 74 to the cover state determination unit 118.

[0106] The storage unit 130 also stores information indicating a predetermined open / closed state of the cover 74 (trigger condition), which is set as a trigger for starting processing of the workpiece 11. Specifically, the storage unit 130 stores, as the trigger condition, that the cover 74 is maintained in a state between the open state and the closed state (half-open state) for a predetermined period of time. For example, the trigger condition is set to that the angle of the cover 74 is maintained at an angle of 30° to 60° with respect to the holding surface 66a (horizontal plane) of the unload table 66 for 10 seconds or more. However, there is no limitation on the content of the trigger condition. For example, the trigger condition may be set to that the cover 74 is repeatedly opened and closed a predetermined number of times or more within a predetermined period of time.

[0107] When the cover state determination unit 118 makes a determination, the trigger condition is read from the storage unit 130 and input to the determination unit 110. Then, the cover state determination unit 118 compares the angle of the cover 74 with the trigger condition to determine whether the open / closed state of the cover 74 satisfies the trigger condition.

[0108] The determination results of the temporary placement determination unit 116 and the cover state determination unit 118 are input to the control unit 120. Then, when the temporary placement determination unit 116 determines that the workpiece 11 is temporarily placed on the load table 6 and the cover state determination unit 118 determines that the open / closed state of the cover 74 satisfies a predetermined condition (trigger condition), processing of the workpiece 11 is automatically started. Specifically, the control unit 120 outputs a control signal to each component of the cutting device 2, and controls the transport unit 48 (see FIG. 1) to transport the workpiece 11 temporarily placed on the load table 6 to the holding table 14, and the processing unit 44 (see FIG. 1) to process the workpiece 11.

[0109] As described above, by using the open / closed state of a predetermined cover 74 as a trigger for processing, it becomes possible to instruct the cutting device 2 to start processing the workpiece 11 by opening or closing the cover 74. This allows the operator to quickly instruct the cutting device 2 to process the next workpiece 11 after retrieving the processed workpiece 11 from the unload table 66, without operating the display unit 80 (touch panel, see FIG. 1).

[0110] The storage section 130 (memory) of the control unit 82 stores a program describing a series of operations by the processing section 100 (processing by the determination section 110, time measurement section 112, time determination section 114, temporary placement determination section 116, cover state determination section 118, and control section 120). When the cutting device 2 processes the workpiece 11, the control unit 82 reads out the program from the memory, executes it, and sequentially outputs control signals to each component of the cutting device 2. This causes the cutting device 2 to operate according to the procedure according to this embodiment.

[0111] As described above, in the cutting device 2 according to this embodiment, when it is determined that the unload table 66 of the unload unit 64 has been placed in the temporary placement position C, the cover 74 covering the unload table 66 is automatically opened. This makes it possible to quickly retrieve the workpiece 11 from the unload table 66 after machining.

[0112] The configuration and functions of the cutting device 2 can be changed as appropriate within the scope of being able to automatically open the cover 74. For example, the determination unit 110 (see FIG. 8) can set the conditions for opening the cover 74 as being that the unload table 66 is placed at the temporary placement position C and that the workpiece 11 (work set 23) is being held by the unload table 66.

[0113] Specifically, a sensor (pressure gauge) that measures the pressure in the suction path 66c may be connected to the suction path 66c of the unload table 66. In this case, the pressure in the suction path 66c measured by the sensor is input to the determination unit 110. Then, when the pressure in the suction path 66c is less than a predetermined threshold, the determination unit 110 determines that the workpiece 11 (work set 23) is being held by the unload table 66. Note that the processing content by the determination unit 110 at this time is similar to the processing by the temporary placement determination unit 116 described above.

[0114] Then, when it is determined that the unload table 66 is placed at the temporary placement position C and that the workpiece 11 is being held by the unload table 66, the determination unit 110 outputs a signal to the control unit 120 corresponding to an instruction to open the cover 74. As a result, the cover 74 is opened only when the workpiece 11 is being held by the unload table 66.

[0115] In the above embodiment, the workpiece 11 (see FIG. 2) supported by the support member 17 is described as the object to be machined by the cutting device 2. However, there is no limitation on the workpiece to be machined by the cutting device 2.

[0116] 9 is a perspective view showing a work set (workpiece unit) 41 which corresponds to a modified example of the work set 23. The work set 41 is configured by supporting the workpiece (workpiece) 31 by an annular frame 37.

[0117] The workpiece 31 is a disk-shaped wafer made of a semiconductor material such as single crystal silicon, and has a front surface 31a and a back surface 31b that are generally parallel to each other. The workpiece 31 is divided into a plurality of rectangular regions by a plurality of streets (planned division lines) 33 that are arranged in a grid pattern so as to intersect with each other. Furthermore, devices 35 such as ICs, LSIs, LEDs (Light Emitting Diodes), and MEMS (Micro Electro Mechanical Systems) devices are formed on the front surface 31a side of each of the plurality of regions divided by the streets 33.

[0118] A workpiece 31 is cut by a cutting device 2 (see FIG. 1) and divided along streets 33, thereby producing a plurality of device chips each having a device 35. However, there are no limitations on the type, material, shape, structure, size, etc. of the workpiece 31. For example, the workpiece 31 may be a substrate (wafer) made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), sapphire, glass, ceramics, resin, metal, etc. Furthermore, there are no limitations on the type, number, shape, structure, size, arrangement, etc. of the devices 35.

[0119] When the workpiece 31 is machined by the cutting device 2 (see FIG. 1), the workpiece 31 is supported by an annular frame 37 for ease of handling (transporting, holding, etc.) the workpiece 31. The frame 37 is made of a metal such as SUS (stainless steel), and has a circular opening 37a at the center thereof that penetrates the frame 37 in the thickness direction. The diameter of the opening 37a is larger than the diameter of the workpiece 31.

[0120] A circular sheet 39 is fixed to the workpiece 31 and the frame 37. For example, the sheet 39 may be a tape including a circular film-like substrate and an adhesive layer (glue layer) provided on the substrate. The substrate is made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate. The adhesive layer is made of an epoxy-based, acrylic-based, or rubber-based adhesive. The adhesive layer may be made of an ultraviolet-curable resin.

[0121] With the workpiece 31 placed inside the opening 37a of the frame 37, the center of the sheet 39 is attached to the back surface 31b of the workpiece 31, and the outer periphery of the sheet 39 is attached to the frame 37. As a result, the workpiece 31 is supported by the frame 37 via the sheet 39, and a work set 41 including the workpiece 31, the frame 37, and the sheet 39 is obtained.

[0122] When processing the workpiece 31 using the cutting device 2, the shapes of the components used to transport and hold the workpiece 31 (load table 6, holding table 14, holding mechanism 56, unload table 66, cover 74, etc.) are changed appropriately depending on the shape of the workpiece 31.

[0123] In the above embodiment, the cutting device 2 has been described as an example of a processing device, but there is no limitation on the type of processing device. For example, the present invention can be applied to processing devices such as grinding devices, polishing devices, and laser processing devices.

[0124] The grinding device is equipped with a processing unit (cutting unit) that grinds the workpiece. The grinding unit has a spindle, and an annular grinding wheel with multiple grinding stones is attached to the tip of the spindle. The workpiece is ground by rotating the grinding wheel and bringing the grinding stones into contact with the workpiece.

[0125] The polishing device is equipped with a processing unit (polishing unit) that polishes the workpiece. The polishing unit has a spindle, and a disc-shaped polishing pad is attached to the tip of the spindle. The workpiece is polished by rotating the polishing pad and bringing it into contact with the workpiece.

[0126] A laser processing device includes a processing unit (laser irradiation unit) that irradiates a workpiece with a laser beam. The laser irradiation unit includes a laser oscillator that emits a laser with a predetermined wavelength, and an optical system that guides the laser beam emitted from the laser oscillator to the workpiece. Laser processing is performed on the workpiece by irradiating the workpiece with the laser beam from the laser irradiation unit.

[0127] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0128] 11 Workpiece 17 Support member 17a surface 17b Back side 17c Suction groove 19A Workpiece area 19B Outer area 21 Placement section 21a Marker 21b Suction groove 21c Suction channel 23 Work set (workpiece unit) 31 Workpiece 31a surface 31b back side 33rd Street (Planned division line) 35 devices 37 frames 37a aperture 39 seats 41 Work set (workpiece unit) 2 Cutting equipment 4 Foundation 4a aperture 6 Load table (first temporary table) 6a Holding surface 6b Suction groove 6c suction path 8 valves 10 Suction source 12 Sensor (pressure gauge) 14 Holding table (chuck table) 14a Holding surface 16 Moving mechanism 16a Table cover 18 Dustproof and water-resistant cover 20 Cleaning nozzle 22 Drying nozzle 24 Support structure 26 Moving mechanism 28 Y-axis guide rail 30 Y-axis moving plate 32 Y-axis ball screw 34 Y-axis pulse motor 36 Z-axis guide rail 38 Z-axis moving plate 40 Z-axis ball screw 42 Z-axis pulse motor 44 Processing unit (cutting unit) 46 Cutting Blade 48 Transport Unit 50 support arm 50a First connection part 50b Second connection part 50c support part 50d suction path 52 Valve 54 Suction source 56 Retention mechanism 58 Connection part (hook) 58a Upper wall 58b side wall 58c bottom wall 58d Suction channel 60 holding portion (holding member) 60a 1st side (top side) 60b 2nd side (bottom side) 60c suction path 60d suction groove 60e storage section 60f Movement restraint part 62 Waiting Table 64 Unload unit (temporary unit) 66 Unload table (second temporary storage table) 66a Holding surface 66b Suction groove 66c Suction channel 68 Moving mechanism 70 X-axis ball screw 72 X-axis pulse motor 74 Cover 74a Storage section 76 Support shaft (hinge) 78 Actuator 80 Display unit (display device) 82 Control unit (control device) 84 sensors 100 Processing section 110 Judgment section 112 Time measurement unit (timer) 114 Time determination unit 116 Provisional Placement Judgment Section 118 Cover status determination unit 120 control section 130 Storage section

Claims

1. A processing device for processing a workpiece, a holding table for holding the workpiece; a processing unit that processes the workpiece held by the holding table; a load table on which the workpiece is temporarily placed before being processed; an unload table on which the workpiece is temporarily placed after being processed; a transport unit that transports the workpiece from the load table to the holding table and from the holding table to the unload table; an openable and closable cover for covering the unload table disposed at the temporary placement position; a determination unit that determines whether the unload table is placed at the temporary placement position; a control unit that performs control to open the cover when the determination unit determines that the unload table has been placed at the temporary placement position.

2. a time determination unit that determines whether or not the elapsed time since the unload table was placed at the temporary placement position has reached a predetermined reference value; 2. The processing apparatus according to claim 1, wherein the control unit performs control to close the cover when the time determination unit determines that the elapsed time has reached the reference value.

3. The workpiece is supported by a support member having a workpiece area on which the workpiece is placed and an outer peripheral area surrounding the workpiece area; the transport unit includes a holding mechanism that holds the outer peripheral region of the support member and includes a storage section that stores the workpiece supported in the workpiece region; 3. The processing apparatus according to claim 1, wherein the holding mechanism includes a movement restraining portion that restrains movement of the workpiece accommodated in the accommodation portion.

4. a temporary placement determination unit that determines whether the workpiece is temporarily placed on the load table; a cover state determination unit that determines whether the open / closed state of the cover satisfies a predetermined condition set as a trigger for starting processing of the workpiece, The processing device described in claim 1 or 2, characterized in that when the temporary placement determination unit determines that the workpiece is temporarily placed on the load table and the cover state determination unit determines that the open / closed state of the cover satisfies the condition, the control unit controls the transport unit to transport the workpiece temporarily placed on the load table to the holding table and process it in the processing unit.

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