Light emitting device and method for manufacturing the same

Abstract

To contribute to miniaturization of a light emitting device.SOLUTION: A light emitting device includes: a base member having a mounting surface; a frame member that is fixed to the base member, has one or more inner surfaces and one or more outer surfaces, and includes a first part containing a wavelength conversion material and constituting a part of the one or more inner surfaces and a part of the one or more outer surfaces, and a second part constituting another part of the one or more inner surfaces and another part of the one or more outer surfaces and connected with the first part; and a light emitting element having a light emitting surface, disposed on the mounting surface, and emitting light incident on the inner surface of the first part from the light emitting surface.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a light emitting device and a method for manufacturing a light emitting device. [Background technology]

[0002] Patent Document 1 discloses a light source device that includes a base member, a light-transmitting member that surrounds a semiconductor laser element placed on the base member, and a wavelength conversion member that is placed on the side of the semiconductor laser element, and extracts light from the side. The light-transmitting member has a through-hole in which the semiconductor laser element is placed and another through-hole in which the wavelength conversion member is placed, separate from the through-hole. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2019-67842 Summary of the Invention [Problem to be solved by the invention]

[0004] In the light source device of Patent Document 1, a light-transmitting member is present between the semiconductor laser element and the wavelength conversion member, and therefore the size of the light source device increases accordingly. [Means for solving the problem]

[0005] The light emitting device disclosed in the embodiment comprises: a base member having a mounting surface; one or more inner surfaces and one or more outer surfaces, a first portion containing a wavelength converting material and constituting a portion of the one or more inner surfaces and a portion of the one or more outer surfaces; a second portion constituting another portion of the one or more inner surfaces and another portion of the one or more outer surfaces and connecting to the first portion, and a frame member fixed to the base member; and a light emitting element having a light emitting surface, arranged on the mounting surface, and emitting light incident on the inner surface of the first portion from the light emitting surface.

[0006] The manufacturing method of the light emitting device disclosed in the embodiment includes the steps of preparing a second base material containing a wavelength conversion material and having a plurality of through holes formed therein that penetrate from the top surface to the bottom surface, preparing a first base material having a mounting surface, arranging a plurality of light emitting elements on the mounting surface, joining the second base material to the first base material so that the light emitting elements fit into each of the plurality of through holes when viewed from above, and cutting the second base material and the first base material joined to the second base material into individual light emitting devices.

[0007] In at least one of the one or more inventions disclosed in the embodiments, the effect of miniaturizing the light emitting device is expected. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of the light emitting device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view of the light emitting device with a lid member removed, for explaining the internal configuration of the package of the light emitting device according to the first embodiment. [Figure 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] FIG. 4 is a bottom view of the light emitting device according to each embodiment. [Figure 5A] FIG. 5A is a diagram illustrating one step in the method for manufacturing the light emitting device according to each embodiment. [Figure 5B] FIG. 5B is a diagram for explaining another step in the manufacturing method of the light emitting device according to each embodiment. [Figure 5C] FIG. 5C is a view for explaining one step in the method for producing a second base material according to the first embodiment. [Figure 5D] FIG. 5D is a view for explaining another step in the method for manufacturing a second base material according to the first embodiment. [Figure 5E] FIG. 5E is a view for explaining another step in the method for manufacturing a second base material according to the first embodiment. [Figure 5F]FIG. 5F is a view for explaining another step in the method for manufacturing the light emitting device according to the first embodiment. [Figure 5G] FIG. 5G is a view for explaining another step in the manufacturing method of the light emitting device according to each embodiment. [Figure 5H] FIG. 5H is a view for explaining another step in the manufacturing method of the light emitting device according to each embodiment. [Figure 6] FIG. 6 is a perspective view of the light emitting device according to the second embodiment. [Figure 7] FIG. 7 is a perspective view of the light emitting device with the lid member removed, for explaining the internal configuration of the package of the light emitting device according to the second embodiment. [Figure 8] FIG. 8 is a cross-sectional view taken along the line VIII-VIII in FIG. [Figure 9A] FIG. 9A is a diagram illustrating one step in the method for producing a second base material according to the second embodiment. [Figure 9B] FIG. 9B is a view for explaining another step in the method for producing a second base material according to the second embodiment. [Figure 9C] FIG. 9C is a view for explaining another step in the method for manufacturing a second base material according to the second embodiment. [Figure 9D] FIG. 9D is a view for explaining another step in the method for manufacturing a second base material according to the second embodiment. [Figure 9E] FIG. 9E is a view for explaining another step in the method for manufacturing the light emitting device according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] In this specification and claims, polygons such as triangles and quadrilaterals are referred to as polygons, including shapes in which the corners of the polygons have been rounded, chamfered, corner-cut, rounded, etc. Furthermore, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle portions of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygonal base are included in the interpretation of "polygon" described in this specification and claims.

[0010] The same applies to words that describe specific shapes, such as trapezoids, circles, and irregularities, not just polygons. The same also applies when dealing with the sides that form the shape. In other words, even if the corners or middle part of a side are processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0011] Furthermore, in this specification or claims, descriptions such as up and down, left and right, front and back, front and back, front and back, etc. merely describe relationships such as relative positions, orientations, directions, etc., and do not necessarily correspond to the relationships during use.

[0012] In addition, directions such as the X direction, Y direction, and Z direction may be indicated using arrows in the drawings, and the directions of these arrows are consistent among multiple drawings relating to the same embodiment.

[0013] Furthermore, in this specification, the terms "component" and "part" may be used when describing components, for example. A "component" refers to an object that is physically handled as a single unit. An object that is physically handled as a single unit can also be said to be an object that is handled as a single part in the manufacturing process. On the other hand, a "part" refers to an object that does not need to be physically handled as a single unit. For example, the term "part" is used when referring to a portion of a component.

[0014] The distinction between "component" and "part" above does not indicate a conscious intention to limit the scope of rights in the interpretation of the doctrine of equivalents. In other words, even if a component is described as a "component" in the claims, this does not mean that the applicant recognizes that treating this component as a single physical unit is essential for the application of the present invention.

[0015] Furthermore, in this specification or claims, when there are multiple elements of a certain type and they need to be distinguished from one another, the elements may be prefixed with "first" or "second." Furthermore, the objects distinguished between the specification and the claims may differ. Therefore, even if the claims describe elements with the same prefixes as the specification, the objects identified by these elements may not be the same between the specification and the claims.

[0016] For example, if there are elements in this specification that are distinguished by the notation "first," "second," and "third," and the elements marked "first" and "third" in this specification are described in the claims, the elements may be distinguished by the notation "first" and "second" in the claims for clarity. In this case, the elements marked "first" and "second" in the claims refer to the elements marked "first" and "third" in this specification, respectively. Note that this rule is not limited to elements, and can be applied rationally and flexibly to other objects as well.

[0017] Hereinafter, embodiments for carrying out the present invention will be described. Furthermore, specific embodiments for carrying out the present invention will be described with reference to the drawings. Note that the embodiments for carrying out the present invention are not limited to these specific embodiments. In other words, the illustrated embodiments are not the only embodiments in which the present invention can be realized. Note that the sizes and positional relationships of components shown in each drawing may be exaggerated for ease of understanding.

[0018] First Embodiment A light emitting device 1 according to a first embodiment will be described. FIGS. 1 to 5H are drawings for explaining an exemplary embodiment of the light emitting device 1. FIG. 1 is a perspective view of the light emitting device 1. FIG. 2 is a perspective view of the light emitting device 1 with the lid member 13 removed to explain the internal configuration of the package 10A of the light emitting device 1. FIG. 3 is a cross-sectional view taken along the III-III cross-sectional line in FIG. 1. In the cross-sectional view of FIG. 3, the positions of the first via wiring 105 and the second via wiring 106, which are not visible in the cross section, are indicated by dashed lines. FIG. 4 is a bottom view of the light emitting device 1. FIGS. 5A to 5H are drawings for explaining a method for manufacturing the light emitting device 1.

[0019] The light emitting device 1 includes a plurality of components, including a package 10A, one or more light emitting elements 20, one or more submounts 30, one or more protection elements 40, and a plurality of wirings 50. The package 10A also includes a plurality of components, including a base member 11, a frame member 12A, and a lid member 13.

[0020] The light emitting device 1 may include other components. For example, the light emitting device 1 may include further light emitting elements in addition to the plurality of light emitting elements 20. Furthermore, the light emitting device 1 may not include some of the plurality of components listed here.

[0021] First, each component will be described.

[0022] (Package 10A) Package 10A has a base 14, a frame 15A, and a lid 16. Base 14 has a mounting surface 17 on which other components are mounted. Frame 15A surrounds mounting surface 17 in a plan view seen from a normal direction perpendicular to mounting surface 17 (hereinafter referred to as a first plan view). The upper end of frame 15A is located above mounting surface 17. Lid 16 has a first surface facing mounting surface 17 and a second surface located opposite the first surface. The second surface is top surface 101 of package 10A.

[0023] Frame portion 15A has one or more inner surfaces 102 and one or more outer surfaces 103. Frame portion 15A exists between a plane including mounting surface 17 and a plane including the first surface. In the first plan view, mounting surface 17 is surrounded by one or more inner surfaces 102 of frame portion 15A. In the first plan view, one or more inner surfaces 102 of frame portion 15A are surrounded by one or more outer surfaces 103 of frame portion 15A.

[0024] The frame portion 15A has a first portion 18 containing a wavelength converting material and a second portion 19 different from the first portion 18. The second portion 19 may contain the wavelength converting material. The second portion 19 may contain the same wavelength converting material as the wavelength converting material contained in the first portion 18. The mounting surface 17 is surrounded by the combined area of ​​the first portion 18 and the second portion 19 in a first plan view.

[0025] In the illustrated frame portion 15A, the first portion 18 and the second portion 19 contain the same wavelength converting material. Furthermore, the first portion 18 and the second portion 19 are parts of the frame member 12A that are integrally formed using the same material. In other words, the boundary between the first portion 18 and the second portion 19 is not visible from the outside.

[0026] The first portion 18 constitutes a portion of one or more inner surfaces 102 and a portion of one or more outer surfaces 103 of the frame portion 15A. The second portion 19 constitutes another portion of the one or more inner surfaces 102 and another portion of the one or more outer surfaces 103 of the frame portion 15A, and is connected to the first portion 18. The volume of the second portion 19 is larger than the volume of the first portion 18.

[0027] In the first plan view, the length of the portion of the one or more inner surfaces 102 that constitute frame portion 15A that constitutes first portion 18 is ¼ or less of the length of the entire periphery of one or more inner surfaces 102 that surround mounting surface 17. In the first plan view, it can be said that the length of the inner surfaces 102 included in first portion 18 is ¼ or less of the entire length of the frame defined by one or more inner surfaces 102.

[0028] The inner edge shape of the frame portion 15A in the first plan view is rectangular. In the first plan view, the shape of the frame defined by one or more inner surfaces 102 is rectangular. In other words, the frame portion 15A can be composed of four inner surfaces 102. This rectangle can have long sides and short sides. The outer edge shape of the frame portion 15A in the first plan view is rectangular. In other words, the frame portion 15A can be composed of four outer surfaces 103. This rectangle can have long sides and short sides. The first portion 18 includes the inner surface 102 and the outer surface 103 that have one of the two short sides of the rectangle. The second portion 19 includes the inner surface 102 and the outer surface 103 that have the other short side.

[0029] In the illustrated frame portion 15A, the long sides of the rectangular inner and outer edge shapes are oriented in the X direction, and the short sides are oriented in the Y direction. Furthermore, the rectangle formed by the multiple inner surfaces 102 of frame portion 15A has more rounded corners than the rectangle formed by the multiple outer surfaces 103 of frame portion 15A. More specifically, the rectangle formed by the outer surfaces 103 does not have rounded corners, while the rectangle formed by the inner surfaces 102 has rounded corners. Note that the inner and outer edge shapes of frame portion 15A do not have to be rectangular when viewed from above.

[0030] A wiring pattern 104 is provided on the mounting surface 17 of the base 14. The wiring pattern 104 is connected to a first via wiring 105 passing through the inside of the base 14, and is electrically connected to another wiring pattern 104 provided on the surface of the base 14. In the illustrated base 14, the wiring pattern 104 is electrically connected to a wiring pattern 104 provided on the underside of the base 14.

[0031] Two wiring patterns 104 are provided on the lower surface of the base 14. One of the two wiring patterns 104 is electrically connected to a first via wiring 105, and the other is connected to a second via wiring 106. Both the first via wiring 105 and the second via wiring 106 are provided in through holes that penetrate the base 14 from the upper surface to the lower surface.

[0032] The base 14 can be formed by a base member 11. The frame 15A can be formed by a frame member 12A. The lid 16 can be formed by a lid member 13. For example, the package 10A can be formed by joining the base member 11 and the frame member 12A together so that the frame member 12A is sandwiched between the flat base member 11 and the flat lid member 13, and then joining the lid member 13 to the frame member 12A. The internal space of the package 10A formed by the base member 11, the frame member 12A, and the lid member 13 can be a sealed space sealed under a vacuum or a predetermined atmosphere.

[0033] The base member 11 can be formed using ceramic as the main material. Examples of ceramic include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide. It is preferable to form the base member 11 using aluminum nitride, which has good heat dissipation properties.

[0034] The base member 11 may be mainly made of a material other than ceramic. For example, the base member 11 may be mainly made of a metal or a composite containing a metal. Examples of metals include copper, aluminum, iron, copper molybdenum, and copper tungsten. Alternatively, examples of composites containing metals include copper-diamond composite materials.

[0035] Here, the term "main material" refers to the material that accounts for the largest proportion of mass or volume in the target structure. Note that when the target structure is formed from a single material, that material is the main material. In other words, when a material is the main material, it means that the proportion of that material can be 100%.

[0036] The frame member 12A can be formed primarily from ceramic. Examples of ceramic include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide. It is preferable to form the frame member 12A using aluminum nitride, which has good heat dissipation properties.

[0037] It should be noted that the frame member 12A may be made of a material other than ceramic. For example, the frame member 12A may be made of glass. It should be noted that the frame member 12A may be made of a material other than ceramic as a main material. For example, the frame member 12A may be made of glass as a main material. Examples of such glass include quartz glass.

[0038] The wavelength conversion material contained in the frame member 12A may be, for example, a phosphor. Examples of such phosphors include cerium-activated yttrium aluminum garnet (YAG), cerium-activated lutetium aluminum garnet (LAG), europium-activated silicate ((Sr,Ba)2SiO4), α-sialon phosphor, and β-sialon phosphor. Among these, garnet-based phosphors such as YAG phosphor and LAG phosphor have good heat resistance.

[0039] The lid member 13 can be formed primarily from ceramic. Examples of ceramic include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide. It is preferable to form the lid member 13 using aluminum nitride, which has good heat dissipation properties.

[0040] The cover member 13 may be primarily made of a material other than ceramic. For example, the cover member 13 may be primarily made of a metal, a composite containing a metal, or glass. Examples of the metal include copper, aluminum, iron, copper molybdenum, and copper tungsten, and examples of composites containing the metal include copper-diamond composite materials. Alternatively, examples of the glass include quartz glass.

[0041] The base member 11 and the frame member 12A may be formed using the same main material. The base member 11 and the lid member 13 may be formed using the same material. The frame member 12A and the lid member 13 may be formed using the same material. For example, the base member 11, the frame member 12A, and the lid member 13 may be made of ceramic.

[0042] (Light emitting element 20) The light emitting element 20 has a light emitting surface 21 from which light is emitted. The light emitting element 20 has an upper surface, a lower surface, and multiple side surfaces. The side surfaces of the light emitting element 20 serve as the light emitting surfaces 21. The light emitting element 20 has one or multiple light emitting surfaces 21.

[0043] The shape of the upper surface of the light-emitting element 20 is a rectangle having long sides and short sides. However, the shape of the upper surface of the light-emitting element 20 does not have to be rectangular. A semiconductor laser element can be used as the light-emitting element 20. However, the light-emitting element 20 is not limited to a semiconductor laser element, and a light-emitting diode or the like may also be used.

[0044] For example, a light emitting element that emits blue light, a light emitting element that emits green light, or a light emitting element that emits red light can be used as the light emitting element 20. Note that a light emitting element that emits light of another color may also be used as the light emitting element 20.

[0045] Here, blue light refers to light whose peak emission wavelength is in the range of 420 nm to 494 nm, green light refers to light whose peak emission wavelength is in the range of 495 nm to 570 nm, and red light refers to light whose peak emission wavelength is in the range of 605 nm to 750 nm.

[0046] Here, a semiconductor laser element, which is an example of the light-emitting element 20, will be described. When viewed from above, the semiconductor laser element has a rectangular outer shape with one opposite side as the long side and the other opposite side as the short side. Light (laser light) emitted from the semiconductor laser element has a divergence. Furthermore, divergent light is emitted from the emitting end face of the semiconductor laser element. The emitting end face of the semiconductor laser element can be referred to as the light emitting surface 21 of the light-emitting element 20.

[0047] Light emitted from a semiconductor laser element forms an elliptical far-field pattern (FFP) in a plane parallel to the light-emitting end facet. FFP is the shape and light intensity distribution of the emitted light at a position away from the light-emitting end facet.

[0048] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with peak intensity in the light intensity distribution of the FFP, is referred to as the light traveling along the optical axis or the light passing through the optical axis. Also, in the light intensity distribution of the FFP, the light with peak intensity is referred to as the light traveling along the optical axis or the light passing through the optical axis. 2 The light having the above intensity is called the main part of the light.

[0049] The shape of the FFP of light emitted from a semiconductor laser element is an ellipse in a plane parallel to the light emitting end face, with the stacking direction being longer than the direction perpendicular to the stacking direction. The stacking direction is the direction in which multiple semiconductor layers including the active layer are stacked in the semiconductor laser element. The direction perpendicular to the stacking direction can also be called the in-plane direction of the semiconductor layers. The long axis direction of the elliptical shape of the FFP can also be called the fast axis direction of the semiconductor laser element, and the short axis direction can also be called the slow axis direction of the semiconductor laser element.

[0050] Based on the light intensity distribution of FFP, 1 / e of the peak light intensity 2 The angle at which light with this light intensity spreads is defined as the light spread angle of the semiconductor laser element. The light spread angle is 1 / e of the peak light intensity. 2 In the explanation of this specification, when simply referring to the "angle of light", it is assumed that the angle is 1 / e of the peak light intensity. 2 The divergence angle of light at a light intensity of 1000 nm is defined as the divergence angle of light in the fast axis direction.

[0051] Examples of semiconductor laser elements that emit blue light or green light include semiconductor laser elements that contain nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. Examples of semiconductor laser elements that emit red light include those that contain InAlGaP-based, GaInP-based, GaAs-based, and AlGaAs-based semiconductors.

[0052] (Submount 30) The submount 30 is configured in the shape of a rectangular parallelepiped. The top surface of the submount 30 is rectangular. The top surface of the submount 30 can be rectangular with short sides and long sides. Note that the shape of the submount 30 is not limited to a rectangular parallelepiped.

[0053] The submount 30 can be formed, for example, using a metal as the main material or a composite containing a metal. The submount 30 is formed from a conductive material from the top surface to the bottom surface. Examples of metals include copper, aluminum, iron, copper molybdenum, Copper tungsten, etc. Alternatively, for example, the submount 30 can be formed using a copper sheet.

[0054] The submount 30 can be formed to a thickness of 200 μm or more and 1000 μm or less. If the thickness is within this range, it is easy to form the submount 30 using a copper sheet.

[0055] (protective element 40) The protective element 40 is intended to prevent a specific element (for example, the light emitting element 20) from being destroyed by an excessive current flowing through it. An example of the protective element 40 is a Zener diode. The Zener diode may be made of Si.

[0056] (Wiring 50) The wiring 50 is a linear conductive material with joints at both ends. The joints at both ends become joints with other components. The wiring 50 is, for example, a metal wire. Examples of metals that can be used include gold, aluminum, silver, and copper.

[0057] (Light-emitting device 1) Next, a method for manufacturing the light emitting device 1 having the above-mentioned components will be described. The light emitting device 1 can be manufactured by a manufacturing method including the steps of preparing a first base material 91 having a mounting surface (hereinafter referred to as the first step), arranging one or more light emitting elements 20 on the mounting surface (hereinafter referred to as the second step), preparing a second base material 92A containing a wavelength conversion material (hereinafter referred to as the third step), and joining the second base material 92A to the first base material 91 (hereinafter referred to as the fourth step).

[0058] The manufacturing method of the light emitting device 1 may also include a step of arranging one or more submounts 30 on the mounting surface (hereinafter referred to as step 5). The manufacturing method of the light emitting device 1 may also include a step of arranging one or more protection elements 40 on the mounting surface (hereinafter referred to as step 6). The manufacturing method of the light emitting device 1 may also include a step of forming one or more through holes in the second base material 92A, penetrating from the top surface to the bottom surface (hereinafter referred to as step 7). The manufacturing method of the light emitting device 1 may also include a step of bonding a third base material 93 to the second base material 92A (hereinafter referred to as step 8). The manufacturing method of the light emitting device 1 may also include a step of cutting the second base material 92A and the first base material 91 bonded to the second base material 92A to form the outer shape of the light emitting device 1 (hereinafter referred to as step 9). The step of forming the outer shape of the light emitting device 1 may be a step of singulating the light emitting device 1 into a plurality of light emitting devices 1.

[0059] Below, each of the steps from step 1 to step 9 will be explained. Note that the method for manufacturing the light emitting device 1 does not necessarily require steps 1 to 9, but for the sake of convenience, the method will be explained here in the order of the manufacturing steps when steps 1 to 9 are included (step 1 → step 5 → step 2 → step 6 → step 3 including step 7 → step 4 → step 8 → step 9). Note that the order of the manufacturing steps may be changed as appropriate.

[0060] In the first step, a first base material 91 having a mounting surface is prepared. The first base material 91 is flat. However, it does not have to be flat. The first base material 91 includes a portion that will become the base 14 of the light emitting device 1. Furthermore, the mounting surface of the first base material 91 includes the mounting surface 17 of the light emitting device 1. The first base material 91 corresponds to the base member 11 of the light emitting device 1. The first base material 91 can be formed from the material that constitutes the base member 11 described above.

[0061] One or more wiring patterns 104 are provided on the mounting surface of the first base material 91. In a plan view seen from a normal direction perpendicular to the mounting surface of the first base material 91 (hereinafter referred to as a second plan view), the shape of the wiring pattern 104 is a rectangle having short and long sides. In the second plan view, the wiring pattern 104 has an elongated shape. In the wiring pattern 104, the long sides can be five or more times longer than the short sides.

[0062] Two or more wiring patterns 104 are provided on the lower surface of the first base material 91. The lower surface of the first base material 91 is the surface opposite the mounting surface of the first base material 91. One or more bonding patterns 94 are provided on the mounting surface of the first base material 91 in an area where the second base material 92A is to be bonded. The bonding patterns 94 are provided so as to surround the wiring patterns 104.

[0063] The bonding pattern 94 is provided so as to form a rectangular area surrounding the wiring pattern 104 in the second plan view. Hereinafter, this rectangular area will be referred to as the mounting area. The mounting area is an area that will become the mounting surface 17 of the light emitting device 1. The mounting area is a rectangular area having long sides and short sides.

[0064] The long side direction of the mounting area and the long side direction of the wiring pattern 104 are parallel. Here, parallel includes a difference of ±10 degrees. The wiring pattern 104 is provided near the long side of the mounting area. The length of the long side of the wiring pattern 104 can be 50% or more of the length of the long side of the mounting area. Note that the length of the long side of the wiring pattern 104 is shorter than the length of the long side of the mounting area.

[0065] A plurality of wiring patterns 104 of the same shape may be provided on the mounting surface of the first base material 91. A bonding pattern 94 that surrounds the wiring pattern 104 is provided for each of the plurality of wiring patterns 104. The wiring patterns 104 are provided in the same relative position with respect to the mounting area.

[0066] In the next step, step 5, one or more submounts 30 are placed on the mounting surface of the first base material 91. FIG. 5A shows the state after step 5 is completed. The submount 30 is electrically connected to the second via wiring 106. In the second plan view, the second via wiring 106 is encompassed by the submount 30. A metal sheet can be attached to the first base material 91, and this sheet can serve as the submount 30. The thickness of the metal sheet is 200 μm or more and 1000 μm or less. A metal sheet made of copper can be used.

[0067] A submount 30 is disposed in each mounting area of ​​the first base material 91. The long side direction of the mounting area is parallel to the long side direction on the top surface of the submount 30. Here, "parallel" includes a difference of ±10 degrees. An imaginary line (hereinafter referred to as the first imaginary line) that passes through the midpoint of the short side of the mounting area and is parallel to the long side direction of the mounting area passes through the submount 30. In the second plan view, the wiring pattern 104 is located between the opposing long side of the submount 30 and the long side of the mounting area.

[0068] The length of the long side of the submount 30 is greater than the length of the long side of the wiring pattern 104. The rectangular mounting area has rounded corners. The long sides of the submount 30 and the long sides of the mounting area are in a relationship such that when the long sides of the submount 30 are aligned with the long sides of the mounting area and the submount 30 is placed in the mounting area, a portion of the submount 30 overlaps the bonding pattern 94. The above-described relationship between the arrangement and shape of the submount 30, wiring pattern 104, and bonding pattern 94 can contribute to miniaturization of the light emitting device 1.

[0069] In the next second step, one or more light-emitting elements 20 are arranged on the mounting surface of the first base material 91. The one or more light-emitting elements 20 are bonded to the submount 30. The light-emitting elements 20 are arranged on the mounting surface of the first base material 91 via the submount 30. One light-emitting element 20 is arranged in one mounting area. Note that multiple light-emitting elements 20 may be arranged in one mounting area.

[0070] In the second plan view, the light emitting surface 21 of the light emitting element 20 faces the short side of the mounting area. The light emitting element 20 is disposed at a position where the first virtual line passes. In the second plan view, the light emitting element 20 is disposed at a position where a virtual line (hereinafter referred to as the second virtual line) that passes through the midpoint of the short side of the submount 30 and is parallel to the long side direction of the submount 30 passes.

[0071] After one or more light-emitting elements 20 are arranged on the mounting surface of the first base material 91, wiring 50 is bonded to electrically connect the light-emitting elements 20 and the wiring pattern 104. The wiring 50 is bonded to the upper surface of the light-emitting element 20 and the wiring pattern 104. A first electrode of the light-emitting element 20 passes through the wiring 50 and a first via wiring 105 and is electrically connected to one of the wiring patterns 104 provided on the lower surface of the first base material 91, and a second electrode of the light-emitting element 20 passes through the submount 30 and a second via wiring 106 and is electrically connected to the other wiring pattern 104 provided on the lower surface of the first base material 91.

[0072] In the next sixth step, one or more protection elements 40 are placed on the mounting surface of the first base material 91. FIG. 5B shows the state after the sixth step is completed. One or more protection elements 40 are bonded to the submount 30. The protection elements 40 are placed on the mounting surface of the first base material 91 via the submount 30.

[0073] In the second plan view, the protective element 40 is disposed between a straight line passing through the side surface of the light emitting element 20 opposite the light emission surface 21 and a straight line passing through the short side of the mounting area facing this side surface. In the second plan view, the protective element 40 is disposed at a position where the first virtual line passes. In the second plan view, the protective element 40 is disposed at a position where the second virtual line passes.

[0074] After the protection element 40 is placed on the mounting surface of the first base material 91, wiring 50 is bonded to electrically connect the protection element 40 and the wiring pattern 104. The wiring 50 is bonded to the upper surface of the protection element 40 and the wiring pattern 104. A first electrode of the protection element 40 passes through the wiring 50 and a first via wiring 105 and is electrically connected to one of the wiring patterns 104 provided on the lower surface of the first base material 91, and a second electrode of the protection element 40 passes through the submount 30 and a second via wiring 106 and is electrically connected to the other wiring pattern 104 provided on the lower surface of the first base material 91.

[0075] When viewed from a second plane, when the mounting area is divided in two by a virtual line passing through the midpoint of the long side of the mounting area and parallel to the short side, the light emitting surface 21 of the light emitting element 20 is included in one area, and the side surface opposite the light emitting surface 21 of the light emitting element 20 and the protective element 40 are included in the other area.

[0076] In the next third step, a second base material 92A containing a wavelength converting material is prepared. The second base material 92A is prepared with one or more through holes formed therein, penetrating from the top surface to the bottom surface. After preparing the flat second base material 92A, a seventh step is performed in which one or more through holes are formed in the second base material 92A, penetrating from the top surface to the bottom surface. Alternatively, the second base material 92A may be obtained with one or more through holes formed therein.

[0077] For example, a flat second base material 92A as shown in Fig. 5C is prepared, and one or more through holes are formed through this second base material 92A from the top surface to the bottom surface. Fig. 5D shows the state after multiple through holes have been formed. Furthermore, as shown in Fig. 5E, a bonding pattern may be provided on the top surface.

[0078] The second base material 92A includes a portion that will become the frame portion 15A of the light emitting device 1. The inner surface that defines the through hole becomes the inner surface 102 of the frame portion 15A. The second base material 92A corresponds to the frame member 12A of the light emitting device 1. The second base material 92A can be formed from the material that constitutes the frame member 12A described above.

[0079] The second base material 92A containing the wavelength converting material may be, for example, a ceramic sintered body obtained by sintering a phosphor and a translucent material such as aluminum oxide. The phosphor content may be 0.05% by volume to 50% by volume of the total volume of the ceramic. Alternatively, for example, a ceramic consisting essentially of phosphor, obtained by sintering phosphor powder, may be used.

[0080] In the second base material 92A, the entire inner surface forming the through holes serves as a light transmitting surface that transmits light. The wavelength converting material is contained throughout the second base material 92A.

[0081] In the next, fourth step, the second base material 92A is bonded to the first base material 91. FIG. 5F shows the state after the fourth step is completed. The second base material 92A is bonded to the first base material 91 so that a light emitting element 20 fits into each of one or more through holes. The second base material 92A is arranged so that the through holes of the second base material 92A surround the mounting area of ​​the first base material 91 in a top view. The second base material 92A is arranged so that the inner surface that defines the through holes, which becomes the inner surface 102 of the first portion 18 of the frame portion 15A, faces the light emission surface 21 of the light emitting element 20 that is arranged surrounded by the through holes.

[0082] In the next eighth step, a third base material 93 is bonded to the second base material 92A. FIG. 5G shows the state after the eighth step is completed. The third base material 93 is bonded to the second base material 92A on the opposite side of the first base material 91 so as to cover one or more through holes in the second base material 92A. This seals the space in which the light emitting element 20 is disposed. The third base material 93 includes a portion that will become the lid portion 16 of the light emitting device 1. The third base material 93 can be formed from the material that constitutes the lid member 13 described above.

[0083] In the next ninth step, the second base material 92A and the first base material 91 joined to the second base material 92A are cut to form the outer shape of the light emitting device 1. Furthermore, the third base material 93 joined to the second base material 92A can also be cut to form the outer shape of the light emitting device 1. In FIG. 5H, the cutting lines are indicated by dashed lines. If there are multiple mounting areas, the mounting areas are cut so as to be separated from each other, and the light emitting devices 1 are separated. In this case, as shown in FIG. 5H, the ninth step can be said to be a step of separating the multiple light emitting devices 1.

[0084] In this manner, the light emitting device can be manufactured. The light emitting device 1 does not need to include the lid member 13. For example, if a recess is formed in the second base material 92A instead of a through hole, the light emitting element 20 can be sealed without the lid member 13. Furthermore, if the light emitting device 1 is completed without sealing the light emitting element 20, the lid member 13 is not required. Furthermore, instead of covering with the lid member 13, the light emitting element 20 may be sealed by filling the through hole with a resin or the like.

[0085] In the light emitting device 1, a frame member 12A is fixed to a base member 11. A lid member 13 is fixed to the frame member 12A. The light emitting element 20 is disposed in a space surrounded by the base member 11, the frame member 12A, and the lid member 13. This space is sealed, and preferably hermetically sealed under a predetermined atmosphere.

[0086] The light emitting element 20 is disposed on the mounting surface 17 of the base 14. Light emitted from the light emitting surface 21 of the light emitting element 20 is incident on the inner surface 102 of the first portion 18 of the frame 15A. The light emitting element 20 is a semiconductor laser element, and the fast axis direction of the FFP is perpendicular to the mounting surface 17. A central flat area of ​​the inner surface 102 of the first portion 18, excluding the curved areas at the ends, can be irradiated with the light of the main part.

[0087] The slow axis direction of the FFP may be perpendicular to the mounting surface 17. When the inner surface 102 of the first portion 18 has a shape in which the direction parallel to the mounting surface 17 is longer than the direction perpendicular to the mounting surface 17, making the fast axis direction of the FFP parallel to the mounting surface 17 can increase the proportion of the area of ​​the inner surface 102 of the first portion 18 that is irradiated with light.

[0088] Preferably, the thickness of the submount 30 is 200 μm or more and 500 μm or less. By making the thickness 200 μm or more, the main part of the light emitted from the light emitting element 20 can be made incident on the inner surface 102 of the frame portion 15A without hitting the mounting surface 17. By making the thickness 500 μm or less, the light emitting device 1 can be manufactured in a compact size.

[0089] At least a portion of the light incident from the inner surface of first portion 18 is wavelength converted by the wavelength converting material contained in frame portion 15A. The light wavelength converted in frame portion 15A is emitted from outer surface 103 of first portion 18. A portion of the light emitted from light emitting element 20 can also be emitted from outer surface 103 of first portion 18. For example, by combining light emitting element 20 that emits blue light with a wavelength converting material that converts the wavelength of blue light to yellow light, it is possible to emit white light that travels laterally from frame portion 15A.

[0090] Second Embodiment A light emitting device 2 according to a second embodiment will be described. FIGS. 6 to 9E are drawings for explaining an exemplary embodiment of the light emitting device 2. FIG. 6 is a perspective view of the light emitting device 2. FIG. 7 is a perspective view of the light emitting device 2 with the lid member 13 removed to explain the internal configuration of the package 10B of the light emitting device 2. FIG. 8 is a cross-sectional view taken along the VIII-VIII cross-sectional line in FIG. 6. In the cross-sectional view of FIG. 8, the positions of the first via wiring 105 and the second via wiring 106, which do not appear on the cross section, are indicated by dashed lines. FIGS. 4, 5A, 5B, 5G, and 5H also serve as drawings for explaining the light emitting device 2.

[0091] The light emitting device 2 includes a plurality of components, including a package 10B, one or more light emitting elements 20, one or more submounts 30, one or more protection elements 40, and a plurality of wirings 50. The package 10B also includes a plurality of components, including a base member 11, a frame member 12B, and a lid member 13.

[0092] Of the above-described descriptions of the light emitting device 1 and each component of the first embodiment, all of the contents except for those that may be considered inconsistent with the drawings of the light emitting device 2 in Figures 6 to 8, 4, 5A, 5B, 9A to 9E, 5G, and 5H also apply to the description of the light emitting device 2. To avoid redundancy, all non-inconsistent contents will not be described again here. Note that the descriptions of the package 10A, frame member 12A, frame portion 15A, and second base material 92A in the first embodiment also apply to the descriptions of the package 10B, frame member 12B, frame portion 15B, and second base material 92B in the second embodiment, except for those that may be inconsistent with these drawings.

[0093] (Package 10B) The package 10B has a frame 15B. The frame 15B contains a wavelength converting material in a first portion 18 and does not contain a wavelength converting material in a second portion 19. The frame 15B transmits visible light in the first portion 18 and blocks visible light in the second portion 19. "Transmit" here means that the transmittance is 70% or more, and "block" here means that the transmittance is 50% or less.

[0094] In the first plan view, the first portion 18 of the frame portion 15B is included in one of the two portions when the frame portion 15B is divided in half by a virtual line that passes through the midpoint of the X-direction length of the inner edge of the frame portion 15B and is parallel to the Y-direction, but is not included in the other portion.

[0095] In the first plan view, the length in the Y direction of first portion 18 of frame portion 15B is smaller than the length in the Y direction of the outer edge of frame portion 15B. In the first plan view, the length in the Y direction of first portion 18 of frame portion 15B is larger than the length in the Y direction of the inner edge of frame portion 15B.

[0096] In the first plan view, the total length of the inner edge of first portion 18 of frame 15B is 80% to 200% of the length of the short side of the inner edge of frame 15B. This allows light whose wavelength has been converted by the wavelength converting material to be efficiently emitted from outer surface 103 of frame 15B. The inner edge of first portion 18 includes at least a part of the region where the corners of the inner edge of frame 15B are rounded.

[0097] The first portion 18 of the frame portion 15B is exposed in a part of one outer surface 103 extending in the short-side direction of the frame portion 15B, and is not exposed from the other outer surfaces 103. The second portion 19 of the frame portion 15B is exposed in other parts of the first outer surface 103 and from the other outer surfaces 103. In the first plan view, the outer edge of the first portion 18 of the frame portion 15B is surrounded by the second portion 19 of the frame portion 15B, except for the part exposed on the first outer surface 103 of the frame portion 15B. This allows the area on the first outer surface 103 where the first portion 18 is exposed to be used as the light exit surface.

[0098] The first portion 18 of the frame member 12B can be formed primarily using ceramic. Examples of ceramic include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide. It is preferable to form the first portion 18 using aluminum nitride, which has good heat dissipation properties.

[0099] Note that the first portion 18 may be mainly made of a material other than ceramic. For example, the first portion 18 may be mainly made of glass. Alternatively, for example, the first portion 18 may be mainly made of a phosphor, and made of glass containing the phosphor. Examples of such glass include quartz glass. Alternatively, for example, the first portion 18 may be made of a single crystal of the phosphor.

[0100] The second portion 19 of the frame member 12B can be formed mainly from ceramic, such as aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0101] (Light-emitting device 2) Next, a method for manufacturing the light emitting device 2 having the above-mentioned components will be described. In the manufacturing method of light emitting device 1, a second base material 92A including a portion that will become frame portion 15A is prepared in the third step, whereas in the manufacturing method of light emitting device 2, a second base material 92B including a portion that will become frame portion 15B is prepared in the third step. Then, in a fourth step, second base material 92B is bonded to first base material 91.

[0102] 9A to 9D are diagrams illustrating a method for manufacturing a second base material 92B including a portion that will become the frame portion 15B. The second base material 92B can be manufactured by a manufacturing method including the steps of preparing one or more first members 92B1 containing a wavelength converting material (hereinafter referred to as step 10), providing second members 92B2 so as to surround the outer peripheries of the one or more first members 92B1 in a top view to form the second base material 92B (hereinafter referred to as step 11), and forming one or more through holes that penetrate the second base material 92B from the top surface to the bottom surface (hereinafter referred to as step 12). The manufacturing method for the second base material 92B may also include the step of providing a bonding pattern 92B3 on the top surface of the second base material 92B (hereinafter referred to as step 13).

[0103] In a tenth step, one or more first members 92B1 made of the material that constitutes the first portion 18 of the frame 15B are prepared. Also, one or more first members 92B1 are arranged on a main surface of an apparatus for manufacturing the second base material 92B. In Fig. 9A, the multiple first members 92B1 are arranged spaced apart from one another.

[0104] The first member 92B1 has a rectangular shape with short and long sides in top view. The shape of the first member 92B1 can be a rectangular parallelepiped. In FIG. 9A, each of the multiple first members 92B1 has a rectangular shape in top view.

[0105] In the next eleventh step, a second member 92B2 is provided to surround the outer periphery of one or more first members 92B1. A second base material 92B is also created by integrally forming the first members 92B1 and the second members 92B2. The second member 92B2 is made of the same material as that for the second portion 19 of the frame 15B. In FIG. 9B, a second member is provided to fill the spaces between the multiple first members 92B1, forming the second base material 92B including the multiple first members 92B1.

[0106] The second base material 92B can be formed by, for example, arranging the material of the second member 92B2 so as to surround the outer periphery of the first member 92B1 and sintering them together. The second base material 92B can be a ceramic sintered body obtained by sintering the first member 92B1, which is mainly made of ceramic, and the second member 92B2, which is mainly made of ceramic.

[0107] In the next twelfth step, one or more through holes are formed in the second base material 92B, penetrating from the top surface to the bottom surface. The through holes are formed so that the first member 92B1 is partially removed. In Fig. 9C, for each of the multiple through holes, one of the two long sides of the first member 92B1 is partially removed in top view, while the other long side and the two short sides are not removed.

[0108] In the next thirteenth step, one or more bonding patterns 92B3 are provided on the upper surface of the second base material 92B. The bonding patterns 92B3 are provided so as to surround the through holes formed in the second base material 92B in a top view. One bonding pattern 92B3 is provided for each through hole.

[0109] The bonding pattern 92B3 is provided so as not to cover the entire first member 92B1 that contacts the through hole in top view. In top view, the length of the bonding pattern 92B3 in the Y direction is greater than the length of the first member 92B1 in the Y direction.

[0110] 9D, in a top view, the long sides of the first member 92B1 that are not removed by the through holes are not covered by the bonding pattern 92B3. In a top view, the long sides of the first member 92B1 that are partially removed by the through holes are completely covered by the bonding pattern 92B3. In a top view, the two short sides of the first member 92B1 are each partially covered by the bonding pattern 92B3.

[0111] The second base material 92B prepared in this manner is joined to the first base material 91. That is, a step similar to the fourth step described in the first embodiment is performed. The subsequent steps are the same as those in the first embodiment. Fig. 9E shows the state after the fourth step is completed.

[0112] In a ninth step, the second base material 92B and the first base material 91 bonded to the second base material 92B are cut to form the outer shape of the light emitting device 2, and at this time, the second base material 92B is cut so that at least a part of one or more outer surfaces 103 of the light emitting device 2 is formed by the first member 92B1. Such cutting is facilitated by not covering the entire first member 92B1 with the bonding pattern 92B3.

[0113] In the light emitting device 2, the first portion 18 transmits light emitted from the light emitting element 20. The second portion 19 blocks the light emitted from the light emitting element 20. In addition, the second portion 19 blocks light whose wavelength has been converted by the wavelength converting material of the first portion 18.

[0114] In the first plan view, light emission surface 21 of light emitting element 20 is provided within a region surrounded by an imaginary plane that passes through a connection point where first portion 18 and second portion 19 are connected on one or more inner surfaces 102 and is parallel to light emission surface 21, and the inner edge of first portion 18. By forming the inner surface of first portion 18 in this manner using through holes, the thickness of first portion 18 in the traveling direction of light emitted from light emitting element 20 can be reduced, which can contribute to miniaturization of light emitting device 1.

[0115] The length in the X direction of first portion 18 of frame portion 15B is smaller than the length in the X direction of wiring pattern 104 provided on mounting surface 17. The length in the X direction of first portion 18 of frame portion 15B is smaller than the length in the X direction of light emitting element 20 arranged on mounting surface 17. When designing light emitting device 1 to be compact, such a relationship may be satisfied.

[0116] Although the above describes various embodiments of the present invention, the light-emitting device according to the present invention is not strictly limited to the light-emitting device of each embodiment. In other words, the present invention can be realized without being limited to the external shape and structure of the light-emitting device disclosed in each embodiment. The present invention can be applied without necessarily including all necessary and sufficient components. For example, if the claims do not recite some of the components of the light-emitting device disclosed in the embodiments, the claims allow for the design freedom of those components by those skilled in the art, such as substitution, omission, modification of shape, and change of material, and specify that the invention described in the claims applies.

[0117] Through the contents described so far in this specification, the following technical matters are disclosed. (Section 1) a base member having a mounting surface; a frame member having one or more inner surfaces and one or more outer surfaces, containing a wavelength converting material, and having a first portion constituting a part of the one or more inner surfaces and a part of the one or more outer surfaces, and a second portion constituting another part of the one or more inner surfaces and another part of the one or more outer surfaces and connecting to the first portion, the frame member being fixed to the base member; a light-emitting element having a light exit surface, arranged on the mounting surface, and configured to emit light incident on the inner surface of the first portion from the light exit surface; A light emitting device comprising: (Section 2) Item 2. The light-emitting device according to item 1, wherein the second portion contains the wavelength converting material. (Section 3) the first portion transmits light emitted from the light-emitting element; Item 2. The light emitting device according to item 1, wherein the second portion blocks light emitted from the light emitting element. (Section 4) Item 4. The light emitting device according to item 3, wherein, in a planar view from a normal direction perpendicular to the mounting surface, the light emitting surface is provided within an area surrounded by an imaginary plane that passes through a connection point where the first portion and the second portion are connected on the one or more inner surfaces and is parallel to the light emitting surface, and the inner edge of the first portion. (Section 5) Item 5. The light emitting device according to any one of items 1 to 4, wherein the second portion is made of ceramic. (Section 6) Item 6. The light emitting device according to any one of items 1 to 5, wherein the first portion is made of ceramic. (Section 7) a cover member fixed to the frame member; Item 5. The light emitting device according to any one of items 1 to 4, wherein a space in which the light emitting element is disposed is sealed. (Section 8) the base member is ceramic; the first and second portions of the frame member are ceramic; Item 8. The light emitting device according to item 7, wherein the cover member is made of ceramic. (Section 9) Item 9. The light emitting device according to any one of items 1 to 8, wherein the light emitting element is a semiconductor laser element. (Section 10) preparing a first base material having a mounting surface; arranging a plurality of light-emitting elements on the mounting surface; preparing a second base material containing a wavelength converting material and having a plurality of through holes formed therein, the through holes penetrating from the upper surface to the lower surface; bonding the second base material to the first base material so that the light emitting elements are accommodated in the plurality of through holes, respectively, in a top view; cutting the second base material and the first base material joined to the second base material into individual light emitting devices; A method for manufacturing a light emitting device, comprising: (Section 11) The step of preparing a second base material having a plurality of through holes formed therein includes: preparing a flat second base material containing a wavelength converting material; forming a plurality of through holes in the second base material, the through holes penetrating from the upper surface to the lower surface of the second base material; Item 11. A method for producing a light-emitting device according to item 10, comprising: (Section 12) The step of preparing the flat plate-shaped second base material includes: providing a plurality of first members each containing the wavelength converting material; a step of forming the second base material including the plurality of first members by disposing the plurality of first members at a distance from each other and providing a second member so as to fill the spaces between the plurality of first members; Including, The step of forming the plurality of through holes includes: Item 12. The manufacturing method according to item 11, wherein each of the plurality of through holes is formed so that one of the first members is partially removed by one of the through holes. (Section 13) In the second base material prepared in the step of preparing the second base material, the plurality of first members have a rectangular outer shape having short sides and long sides in a top view, The step of forming the plurality of through holes includes: Item 13. The manufacturing method according to item 12, wherein each of the plurality of through holes is formed so that, when viewed from above, one of the two long sides of one of the first members is partially removed by one of the through holes, and the other long side and the two short sides are not removed. (Section 14) The step of singulating into the plurality of light emitting devices includes: Item 14. The manufacturing method according to item 12 or 13, wherein the second base material is cut so that at least a part of one or more outer surfaces of the light emitting device is formed by the first member. (Section 15) The method further includes joining a flat third base material to the second base material on the opposite side of the first base material so as to cover the plurality of through holes, The step of singulating into the plurality of light emitting devices includes: Item 15. The manufacturing method according to any one of items 10 to 14, wherein the second base material and the first base material and the third base material joined to the second base material are cut and separated into a plurality of light-emitting devices. [Industrial Applicability]

[0118] The light emitting device according to each embodiment can be used in vehicle headlights, head-mounted displays, lighting, projectors, displays, and the like. [Explanation of symbols]

[0119] 1, 2 Light-emitting device 10A, 10B packages 11 Base member 12A, 12B Frame members 13 Lid member 14 Base 15A, 15B frame 16 Lid 17 Mounting surface 18 Part 1 19 Part 2 101 Top surface 102 Inner surface 103 External surface 104 Wiring Pattern 105 First via wiring 106 Second via wiring 20 Light-emitting element 21 Light exit surface 30 Submount 40 Protection element 50 Wiring 91 First base material 92A, 92B 2nd base material 92B1 First member 92B2 Second member 92B3 Joint Pattern 93 Third base material 94 Joint Pattern

Claims

1. a base member having a mounting surface; a frame member having one or more inner surfaces and one or more outer surfaces, containing a wavelength converting material, and including a first portion constituting a part of the one or more inner surfaces and a part of the one or more outer surfaces, and a second portion constituting another part of the one or more inner surfaces and another part of the one or more outer surfaces and connecting to the first portion, the frame member being fixed to the base member; a light-emitting element having a light exit surface, arranged on the mounting surface, and configured to emit light incident on the inner surface of the first portion from the light exit surface; A light emitting device comprising:

2. The light emitting device of claim 1 , wherein the second portion contains the wavelength converting material.

3. the first portion transmits light emitted from the light-emitting element; The light emitting device according to claim 1 , wherein the second portion blocks light emitted from the light emitting element.

4. 4. The light emitting device of claim 3, wherein, in a planar view from a normal direction perpendicular to the mounting surface, the light emitting surface is provided within an area surrounded by an imaginary plane that passes through a connection point where the first portion and the second portion are connected on the one or more inner surfaces and is parallel to the light emitting surface, and an inner edge of the first portion.

5. 5. The light emitting device according to claim 1, wherein the second portion is ceramic.

6. The light emitting device of claim 5 , wherein the first portion is ceramic.

7. a cover member fixed to the frame member; The light emitting device according to claim 1 , wherein a space in which the light emitting element is disposed is sealed.

8. the base member is ceramic; the first and second portions of the frame member are ceramic; The light emitting device according to claim 7 , wherein the cover member is made of ceramic.

9. The light emitting device according to claim 1 , wherein the light emitting element is a semiconductor laser element.

10. providing a first base material having a mounting surface; arranging a plurality of light-emitting elements on the mounting surface; preparing a second base material containing a wavelength converting material and having a plurality of through holes formed therein, the through holes penetrating from an upper surface to a lower surface; bonding the second base material to the first base material so that the light emitting elements are accommodated in the plurality of through holes, respectively, in a top view; cutting the second base material and the first base material joined to the second base material into individual light emitting devices; A method for manufacturing a light emitting device, comprising:

11. The step of preparing a second base material having a plurality of through holes formed therein includes: preparing a flat plate-shaped second base material containing a wavelength converting material; forming a plurality of through holes in the second base material, the through holes penetrating from the upper surface to the lower surface of the second base material; The method for manufacturing a light emitting device according to claim 10 , comprising:

12. The step of preparing a flat plate-shaped second base material includes: providing a plurality of first members each containing the wavelength converting material; a step of forming the second base material including the plurality of first members by disposing the plurality of first members at a distance from each other and providing second members so as to fill the spaces between the plurality of first members; Including, The step of forming the plurality of through holes includes: The manufacturing method according to claim 11 , wherein each of the plurality of through holes is formed such that one of the first members is partially removed by one of the through holes.

13. In the second base material prepared in the step of preparing the second base material, the plurality of first members have a rectangular outer shape having short sides and long sides in a top view, The step of forming the plurality of through holes includes: The manufacturing method according to claim 12, wherein each of the plurality of through holes is formed so that, when viewed from above, one of the two long sides of one of the first members is partially removed by one of the through holes, and the other long side and the two short sides are not removed.

14. The step of singulating into the plurality of light emitting devices includes: The manufacturing method according to claim 13 , further comprising cutting the second base material so that at least a portion of one or more outer surfaces of the light emitting device is formed by the first member.

15. The method further includes joining a flat third base material to the second base material on the opposite side of the first base material so as to cover the plurality of through holes, The step of singulating into the plurality of light emitting devices includes: The manufacturing method according to claim 10 , further comprising cutting the second base material and the first base material and the third base material joined to the second base material into individual light emitting devices.