laser processing machine

Abstract

To automatically set suction force of sucking a workpiece at an appropriate value.SOLUTION: A laser beam machine includes a laser processing unit 10 and a control device 200, wherein the laser processing unit 10 has: a dust collection chamber 60 for collecting dust accompanying laser processing; a dust collection duct 61 for sucking air in the dust collection chamber 60; a table 80 for processing arranged in a predetermined section in a palette 50; a suction table 81 which is provided so as to surround a space below the table 80 for processing; a suction duct 85 for sucking air in the suction table 81; and a switching device 70 for switching a flow of air sucked by the dust collection device 90 between the dust collection duct 61 and the suction duct 85. The control device 200 controls workpiece suction force of sucking a workpiece W placed on the table 80 for processing, on the basis of the suction force determined by a processing condition.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a laser processing machine. [Background technology]

[0002] Laser processing machines, which use a laser beam to perform cutting on plate-shaped workpieces such as sheet metal, are known. Laser processing machines cut the workpiece using thermal energy by irradiating the workpiece with a laser beam. Laser processing machines cut products from the workpiece by moving a processing head that irradiates the laser beam along the workpiece.

[0003] When performing micromachining to cut out minute products from a thin workpiece using a laser processing machine, the gas pressure of the assist gas injected during processing can cause the workpiece to flap, resulting in processing defects. A known method for preventing the workpiece from flapping is to fix the workpiece by sucking air from below the table (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-203244 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when the workpiece is fixed by sucking air from below the table, if the suction force is too weak it is not possible to prevent the workpiece from flapping, and if the suction force is too strong it will leave marks on the workpiece from the table. In other words, poor machining of the workpiece will occur. If the worker adjusts the suction force himself, it can depend on the worker's skill, making it difficult to adjust the suction force appropriately. [Means for solving the problem]

[0006] a suction table provided in a predetermined section of the pallet and on which the workpiece is placed; a suction table provided in a manner surrounding the space below the pallet; a suction duct connected to the suction table and which sucks air into the suction table with the air flow drawn in by the dust collector; and a switching device connected to the dust collection duct and which switches the flow of air drawn in by the dust collector between the dust collection duct and the suction duct, and the control device controls the workpiece suction force used to suck the workpiece placed on the processing table based on the suction force set in the processing conditions.

[0007] According to one aspect of the laser processing machine of the present invention, the air in the dust collection chamber is sucked through the dust collection duct by the air flow drawn in by the dust collection device. The air flow drawn in by the dust collection device can be switched from the dust collection duct to the suction duct by a switching device. By switching the air flow to the suction duct, the air in the suction table can be sucked in. Since the range of the processing table arranged in a predetermined section of the pallet can be limited to suction, the workpiece can be fixed to the processing table. The control device controls the workpiece suction force that sucks in the workpiece placed on the processing table based on the suction force defined in the processing conditions. This automatically sets the workpiece suction force to an appropriate value. [Effects of the Invention]

[0008] According to one aspect of the present invention, the suction force can be adjusted to an appropriate value, and setup work for adjusting the suction force is not required. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram showing a schematic diagram of the main configuration of a laser processing machine according to this embodiment. [Figure 2] FIG. 2 is a perspective view showing the basic structure of the laser processing machine according to this embodiment. [Figure 3] FIG. 3 is a perspective view showing a laser processing machine equipped with a suction table and a processing table. [Figure 4] FIG. 4 is a diagram illustrating the state of a pallet mounted on the laser processing machine shown in FIG. [Figure 5] FIG. 5 is a diagram illustrating the state of a pallet mounted on the laser processing machine shown in FIG. [Figure 6] FIG. 6 is a diagram illustrating the structure of the switching device. [Figure 7] FIG. 7 is a diagram illustrating the structure of the adjustment window. DETAILED DESCRIPTION OF THE INVENTION

[0010] The laser processing machine according to this embodiment will be described below with reference to the drawings: Fig. 1 is a diagram showing a schematic view of the main configuration of the laser processing machine according to this embodiment.

[0011] First, an overview of the laser processing machine will be described with reference to Fig. 1. The laser processing machine includes a laser processing unit 10 that processes a workpiece W using a laser beam, and a control device 200 that controls the laser processing unit 10 in accordance with processing conditions for processing the workpiece W.

[0012] The laser processing unit 10 includes a pallet 50 for placing the workpiece W thereon, a dust collection chamber 60 that surrounds the space below the pallet 50 and collects dust generated during laser processing, a dust collection duct 61 that is connected to the dust collection chamber 60 and sucks in air from within the dust collection chamber 60 using the air flow drawn in by a dust collection device 90, a processing table 80 that is smaller than the pallet 50 and is arranged in a predetermined section within the pallet 50 and on which the workpiece W is placed, a suction table 81 that surrounds the space below the processing table 80, a suction duct 85 that is connected to the suction table 81 and sucks in air from within the suction table 81 using the air flow drawn in by the dust collection device 90, and a switching device 70 that connects the dust collection duct 61 and the suction duct 85 and switches the flow of air drawn in by the dust collection device 90 between the dust collection duct 61 and the suction duct 85.

[0013] The control device 200 controls the workpiece suction force that sucks the workpiece W placed on the processing table 80 based on the suction force defined in the processing conditions.

[0014] Next, the basic structure of the laser processing machine according to this embodiment will be specifically described with reference to Figures 1 and 2. Figure 2 is a perspective view showing the basic structure of the laser processing machine according to this embodiment. In this specification, directions are defined as the left-right direction and the front-rear direction, which are orthogonal to the horizontal direction, and the up-down direction, which is orthogonal to the horizontal direction. The left-right direction and the front-rear direction are parallel to the in-plane direction of the workpiece W placed on the pallet 50, and the up-down direction corresponds to the direction perpendicular to the plane of the workpiece W placed on the pallet 50.

[0015] The laser processing machine is a processing machine that cuts the workpiece W by irradiating the workpiece W with a laser beam using thermal energy. The laser processing machine includes a laser processing unit 10 and a control device 200. The laser processing unit 10 includes a main body 11, a head driving mechanism 15, a processing head 30, a pallet 50, and a laser oscillator 110.

[0016] The main body 11 is formed in a roughly rectangular parallelepiped shape and is placed on an installation surface such as a floor. Side frames 12 extending in the left-right direction are disposed on the front and rear edges of the main body 11. The side frames 12 are disposed parallel to each other.

[0017] The head drive mechanism 15 moves the machining head 30 in the front-rear and left-right directions. The head drive mechanism 15 includes an X-axis carriage 16 and a Y-axis carriage 17. The X-axis carriage 16 has a gate-like shape. The X-axis carriage 16 is supported by a pair of side frames 12 and is configured to be movable along the side frames 12. The X-axis carriage 16 is driven by an X-axis drive unit (not shown) provided on the side frames 12 and moves in the left-right direction. The Y-axis carriage 17 is supported by the X-axis carriage 16 and is configured to be movable along the X-axis carriage 16. The Y-axis carriage 17 is driven by a Y-axis drive unit (not shown) provided on the X-axis carriage 16 and moves in the front-rear direction.

[0018] The processing head 30 irradiates the workpiece W with a laser beam from above to perform laser processing on the workpiece W. A laser beam emitted from a laser oscillator 110 is transmitted to the processing head 30 via a process fiber (not shown). The laser beam is irradiated onto the workpiece W from a nozzle provided at the tip of the processing head 30. The processing head 30 is disposed on a Y-axis carriage 17. The processing head 30 can be moved left and right and forward and backward by driving the X-axis drive unit and the Y-axis drive unit to move the X-axis carriage 16 and the Y-axis carriage 17. The head drive mechanism 15 also includes a Z-axis drive unit (not shown), and the processing head 30 can be moved up and down by being driven by the Z-axis drive unit. The processing head 30 can perform laser processing within a predetermined processing range through left and right movement and forward and backward movement by the head drive mechanism 15. The laser processing machine of this embodiment is a device designed for small-sized workpieces W, and the processing range is set to a range that can process workpieces W up to a maximum size of 4' x 4' (1219mm x 1219mm).

[0019] The pallet 50 is supported horizontally by a pair of side frames 12. A workpiece W is placed on the pallet 50. The pallet 50 has a square shape and can accommodate workpieces W of the same size as the processing area or smaller. The pallet 50 is supported for left-right movement via a guide member (not shown) fixed to the side frames 12. The guide member slidably supports rails provided on the pallet 50, thereby guiding the linear movement of the pallet 50. A handle (not shown) that an operator grasps to move the pallet 50 is provided at the left end of the pallet 50. The operator can move the pallet 50 between the normal position and the extended position by grasping the handle and moving the pallet 50 left-right. When the pallet 50 is in the normal position, the pallet 50 is housed in the main body 11 (as shown in FIG. 2). At this time, almost the entire pallet 50 is included in the processing area of ​​the processing head 30. When the pallet 50 in the normal position is pulled out to the left, the pallet 50 moves to the pulled-out position. When the pallet 50 is in the pulled-out position, a portion of the pallet 50 is pulled out from the main body 11.

[0020] The control device 200 is composed of a box-shaped housing, a circuit board housed inside the housing, and the like. The control device 200 is disposed at the lower right end of the main body 11 and is fixed to the main body 11. The control device 200 is composed of a computer having a hardware processor such as a CPU (Central Processing Unit), memory, and various interfaces. The memory and various interfaces are connected to the hardware processor via a bus. The various functions of the control device 200 are realized by having the hardware processor execute programs stored in the memory.

[0021] As shown in FIG. 1, the control device 200 stores a processing program that defines the operation of the laser processing unit 10 when processing a workpiece W, and a processing condition file that stores processing conditions for the workpiece. The processing program is created by a programming device 300, which is a computer-aided manufacturing (CAM) program. The processing conditions include the laser beam output for a given workpiece W, the focal length of the lens that emits the laser beam, and the injection pressure of the assist gas. In addition, in the case of a workpiece W that is processed using a processing table 80 (described later), the processing conditions for, for example, a thin plate include the optimal suction force for processing the workpiece W. When creating the processing program, the programming device 300 determines the suction force for the workpiece W based on the material and thickness of the workpiece W and the shape of the product to be cut out from the workpiece W, and sets the determined suction force as the processing condition. Therefore, the suction force set as the processing condition varies depending on the material and thickness of the workpiece W and the shape of the product to be cut out from the workpiece W. The shape of the product is classified as simple or complex based on the distance between the laser beams when processing the workpiece W, and the suction force differs depending on whether the product shape is simple or complex. For example, if the distance between the lines is 1 mm or more, the product shape is considered to be simple, and if the distance between the lines is less than 1 mm, the product shape is considered to be complex. The suction force determined by the programming device 300 is stored in the control device 200 as a processing condition in part of the processing program or by being created as a new processing condition file.

[0022] The control device 200 controls the head drive mechanism 15 and the laser oscillator 110 in accordance with the processing program and processing conditions, and performs laser processing on the workpiece W. The control device 200 controls the workpiece suction force that sucks the workpiece W placed on the processing table 80, based on the suction force defined in the processing conditions. The control device 200 starts or stops the operation of the dust collection device 90 in accordance with the operating state of the laser processing machine and instructions from the operator.

[0023] An operation unit 205 is connected to the control device 200. The operation unit 205 is a device through which an operator performs input operations. For example, the operation unit 205 is mainly composed of a display and a touch panel that allows the operator to perform input operations according to information displayed on the display. By operating the operation unit 205, the operator can input various instructions, including operation settings of the laser processing machine, to the laser processing machine. In addition, the operator can grasp various information related to the laser processing machine from the information displayed on the operation unit 205.

[0024] The laser oscillator 110 generates a laser beam and supplies the laser beam to the processing head 30. As shown in Fig. 2, the laser oscillator 110 is composed of a box-shaped housing and electronic and electrical components housed inside the housing. The laser oscillator 110 is disposed at the upper right end of the main body 11 and is fixed to the main body 11.

[0025] The configuration related to the suction of the workpiece W of the laser processing machine will be described in detail below with reference to Figures 1 to 7. Figure 3 is a perspective view showing a laser processing machine equipped with a suction table and a processing table. Figure 4 is a diagram explaining the state of a pallet mounted on the laser processing machine shown in Figure 2. Figure 5 is a diagram explaining the state of a pallet mounted on the laser processing machine shown in Figure 3. Figure 6 is a diagram explaining the structure of a switching device. Figure 7 is a diagram explaining the structure of an adjustment window.

[0026] As shown in FIGS. 2 and 4, the pallet 50 includes a frame 51 and a plurality of skids 52.

[0027] The frame body 51 is a frame member having a square shape when viewed from above the pallet 50. A partition plate 51a extending in the left-right direction is provided at the center of the frame body 51 in the front-rear direction.

[0028] The multiple skids 52 are attached to the frame 51 and are work support members that support the workpieces W. Each skid 52 is a plate-shaped member that extends in the front-to-rear direction, and the multiple skids 52 are arranged at intervals in the left-to-right direction. The multiple skids 52 are respectively arranged in a front region of the pallet 50 located in front of the partition plate 51a, and in a rear region of the pallet 50 located behind the partition plate 51a. Both ends of the skids 52 are supported by the frame members that constitute the frame 51 and the partition plate 51a. Each skid 52 can be attached to and detached from the frame 51.

[0029] The skid 52 is made of a metal material such as steel, for example, mild steel. The skid 52 is arranged in an upright position along the vertical direction. The upper edge of the skid 52 is provided with multiple protrusions, each of which protrudes upward. The multiple protrusions are arranged at intervals in the front-to-rear direction. Each protrusion is formed vertically long in the vertical direction and has a mountain shape that narrows in width as it goes upward. The workpiece W is supported at the upper edge of the skid 52, i.e., at the apex of each protrusion. The multiple skids 52 are arranged with large intervals in the left-to-right direction, so they are mainly used when placing large workpieces W that have a large size to be cut out.

[0030] As shown in FIGS. 3 and 5 , a processing table 80 can be installed on the pallet 50 to perform micromachining on a small workpiece W, such as a thin plate. The processing table 80 is smaller than the pallet 50 and is placed in a predetermined compartment within the pallet 50. For example, a predetermined compartment for installing the processing table 80 can be secured by removing the skid 52 attached to the front region of the pallet 50. The processing table 80 is detachably installed on a suction table 81, which will be described later. The processing table 80 has a constant height in the vertical direction, and the workpiece W can be placed on its upper surface. The processing table 80 has a mesh structure with a spacing smaller than the spacing between the skids 52 arranged on the pallet 50, and each has a plurality of through-holes that penetrate in the vertical direction. The mesh structure can be a honeycomb structure with a hexagonal cross section in the horizontal direction or a lattice structure with a rectangular cross section in the horizontal direction.

[0031] 1, 2, and 3, the laser processing machine further includes a dust collection chamber 60, a dust collection duct 61, a suction table 81, a suction duct 85, a switching device 70, and a dust collection device 90. Note that the dust collection device 90 is not shown in FIGS. 2 and 3.

[0032] The dust collection chamber 60 is provided to surround the space below the pallet 50 when it is in the normal position, and is a space for collecting dust generated around the pallet 50 during laser processing. This dust includes fumes and spatter (molten metal). The dust generated during laser processing is guided into the dust collection chamber 60 by the assist gas sprayed from the processing head 30 and the flow of air drawn into the dust collection duct 61.

[0033] The dust collection duct 61 sucks in air from within the dust collection chamber 60. One end of the dust collection duct 61 is connected to the dust collection chamber 60, and the other end of the dust collection duct 61 is connected to the switching device 70. The dust collection duct 61 sucks in air from within the dust collection chamber 60 by the flow of air drawn in by the dust collection device 90. By sucking in the air from within the dust collection chamber 60, dust generated during laser processing can be collected.

[0034] As shown in Figures 1, 3 and 7, the suction table 81 is a table used when placing the processing table 80 on the pallet 50, and is configured to be detachable from the pallet 50. The suction table 81 is a rectangular box with an open top. The suction table 81 is formed to be the same size as the processing table 80, and the processing table 80 can be detachably placed above the suction table 81. By attaching the processing table 80 to the suction table 81, the two are integrated, and the space below the processing table 80 is surrounded by the suction table 81.

[0035] The suction table 81 has an adjustment window 87 that adjusts the aperture of an opening 86 that connects the inside and outside of the suction table 81 and takes in air. The adjustment window 87 is slidable left and right by a power mechanism such as a motor. The adjustment window 87 is controlled by the control device 200 and slides to one of a plurality of predetermined positions to adjust the aperture of the opening 86. When the opening 86 is opened to a predetermined aperture according to the position of the adjustment window 87, air is drawn in through the opening 86, resulting in a relative decrease in the flow rate of air drawn in from the upper surface of the suction table 81. Therefore, the workpiece suction force can be adjusted by adjusting the aperture of the opening 86 with the adjustment window 87. The adjustment window 87 has a scale above the opening 86 indicating the aperture, and the aperture of the adjustment window can also be adjusted manually. The suction table 81 also has a pressure gauge 91 that measures the pressure inside the suction table 81. The installation position of the pressure gauge 91 within the suction table 81 is not particularly limited, but it is preferable that the pressure detected by the pressure gauge 91 is directly proportional to the workpiece suction force. The pressure gauge 91 outputs information indicating the detected pressure within the suction table to the control device 200.

[0036] The suction duct 85 sucks air from inside the suction table 81. One end of the suction duct 85 is connected to the suction table 81, and the other end of the suction duct 85 is connected to the switching device 70. The suction duct 85 sucks air from inside the suction table 81 by the flow of air drawn in by the dust collector 90. By sucking the air from inside the suction table 81, negative pressure is created on the underside of the processing table 80. The negative pressure causes the workpiece W placed on the upper surface of the processing table 80 to be sucked in, and the workpiece W can be fixed to the processing table 80. In this embodiment, the pressure gauge 91 is installed inside the suction table 81, but it may also be installed inside the suction duct 85.

[0037] The processing table 80 and the suction table 81 can be installed on the pallet 50 by pulling the pallet 50 out from its normal position and then placing it in the pulled-out position. The worker removes the skid 52 located in the front area of ​​the pallet 50 to open the front area of ​​the pallet 50. This allows the processing table 80 and the suction table 81 to be installed on the pallet 50.

[0038] As shown in Figures 3 and 5, the suction duct 85 is composed of a first duct portion 85a and a second duct portion 85b, and can be divided into two elements. A communication portion 53 that communicates between the inside and outside of the frame body 51 is provided in the frame body 51 of the pallet 50. The first duct portion 85a connects the connection joint 83 of the suction table 81 and the communication portion 53. The second duct portion 85b connects the communication portion 53 and the switching device 70. The first duct portion 85a and the second duct portion 85b are connected to each other via the communication portion 53 of the pallet 50.

[0039] Since the peripheral edge of the upper surface of the suction table 81 is the contact surface that comes into contact with the peripheral edge of the lower surface of the processing table 80, a sealing member may be provided to fill the gap between the suction table 81 and the processing table 80. An example of the sealing member is a sponge. Furthermore, a protrusion or a notch may be formed on the peripheral edge of the upper surface of the suction table 81 to position the processing table 80 when it is installed. Furthermore, the processing table 80 and the suction table 81 do not need to be separate bodies, and may be an integrated structure.

[0040] As shown in FIGS. 1 and 6 , the switching device 70 is connected to the dust collection duct 61 and the suction duct 85. The switching device 70 is connected to a collecting duct 75 leading to the dust collector 90. The dust collector 90 is equipped with an exhaust fan that is rotated by a power mechanism such as a motor. When the exhaust fan rotates, negative pressure is created inside the dust collector 90, and air in the collecting duct 75 is drawn into the dust collector 90. The switching device 70 is a rectangular box, and air sucked by the dust collection duct 61 and air sucked by the suction duct 85 flows into the collecting duct 75 via the switching device 70. The switching device 70 can switch the flow of air drawn into the dust collector 90 between the dust collection duct 61 and the suction duct 85.

[0041] 6, the switching device 70 has an opening / closing door 71 that opens and closes the suction duct 85, and a flow rate adjustment valve 74 that adjusts the flow rate of air flowing through the dust collection duct 61. The switching device 70 also has an impact plate 72 and a tray 73. The opening / closing door 71 and the flow rate adjustment valve 74 are controlled by the control device 200.

[0042] The opening / closing door 71 is opened and closed by a power mechanism such as a motor. The opening / closing door 71 has two positions, a fully open position and a fully closed position, and is switched to either of these positions by the control device 200. The fully open position is a state in which the opening / closing door 71 does not appear in the flow path of the suction duct 85, and the fully closed position is a state in which the opening / closing door 71 completely blocks the flow path of the suction duct 85. The opening / closing door 71 can also be opened and closed manually.

[0043] The collision plate 72 is disposed at a position where air flows in from the suction duct 85 so as to intersect with the air flow in the suction duct 85. The collision plate 72 has the function of removing spatter contained in the air that flows in from the suction duct 85 by causing the spatter to collide with the collision plate 72.

[0044] The tray 73 is a drawer-type tray that is disposed at the bottom of the switching device 70. The tray 73 can collect spatters and the like that collide with the collision plate 72 and fall.

[0045] The flow rate control valve 74 is a valve element that adjusts the flow rate of air flowing through the dust collection duct 61. The flow rate control valve 74 opens and closes using a power mechanism such as a motor. The flow rate control valve 74 can linearly adjust its opening between a fully open position and a fully closed position. The fully open position is a position where the flow rate control valve 74 is parallel to the dust collection duct 61, and the fully closed position is a position where the flow rate control valve 74 is perpendicular to the dust collection duct 61. The switching device 70 also includes a position detection mechanism such as a potentiometer to detect the opening rate of the flow rate control valve 74. This allows the control device 200 to perform feedback control based on the opening rate of the flow rate control valve 74 detected by the position detection mechanism so that the opening rate of the flow rate control valve 74 becomes a target opening rate. The switching device 70 also includes a dial (not shown) for adjusting the opening rate of the flow rate control valve 74, and the dial has a scale indicating the opening rate of the flow rate control valve 74. Therefore, the opening rate of the flow rate control valve 74 can also be adjusted manually.

[0046] When the opening / closing door 71 is closed and the flow rate adjustment valve 74 is open, the air drawn into the dust collector 90 flows through the dust collection duct 61 and the collecting duct 75. As a result, air in the dust collection chamber 60 is taken into the dust collector 90 via the dust collection duct 61 and the collecting duct 75. On the other hand, when the opening / closing door 71 is open and the flow rate adjustment valve 74 is closed, the air drawn into the dust collector 90 flows through the suction duct 85 and the collecting duct 75. As a result, air in the suction table 81 is taken into the dust collector 90 via the suction duct 85 and the collecting duct 75. At this time, by adjusting the aperture of the flow rate adjustment valve 74 from the fully closed position toward the fully open position, air also flows into the dust collection duct 61. The flow rate of air flowing through the suction duct 85 changes relatively depending on the flow rate of air flowing through the dust collection duct 61. Therefore, by adjusting the aperture of the flow rate adjustment valve 74, the suction force on the workpiece can be adjusted.

[0047] Below, with reference to Figures 1, 6 and 7, we will explain the method of controlling the workpiece suction force by the control device 200, which is one of the features of this embodiment, using an example of a situation in which a thin workpiece W is being processed on the processing table 80.

[0048] The control device 200 controls the workpiece suction force when machining a thin workpiece W. Specifically, the control device 200 reads the machining conditions, and controls the workpiece suction force by controlling the opening degree of the adjustment window 87, the opening degree of the flow rate adjustment valve 74, or the flow rate of air drawn in by the dust collector 90, based on the suction force determined in the machining conditions.

[0049] The correlation between the suction force determined in the processing conditions and the opening degree of the adjustment window 87, the opening degree of the flow rate adjustment valve 74, or the flow rate of air drawn into the dust collector 90 is input in advance into the program data. The control device 200 can control the workpiece suction force by controlling the opening degree of the adjustment window 87, the opening degree of the flow rate adjustment valve 74, or the flow rate of air drawn into the dust collector 90 based on the program data.

[0050] First, a method for controlling the workpiece suction force by adjusting the opening degree of the adjustment window 87 will be described. With the opening door 71 open and the flow rate adjustment valve 74 in the fully closed position, the control device 200 controls the opening degree of the adjustment window 87 based on the suction force defined in the machining conditions. Specifically, the control device 200 sets the opening door 71 to the fully open position and the flow rate adjustment valve 74 to the fully closed position. This causes air inside the suction table 81 to be drawn into the dust collector 90. The control device 200 then references a program file and reads the opening degree of the adjustment window 87 that will result in the suction force defined in the machining conditions. The control device 200 controls the adjustment window 87 to the opening degree of the adjustment window 87 read from the program file. In this way, the control device 200 can control the workpiece suction force to the suction force defined in the machining conditions by controlling the opening degree of the adjustment window 87.

[0051] Next, a method for controlling the workpiece suction force by adjusting the aperture of the flow rate adjustment valve 74 will be described. With the open door 71 open and the adjustment window 87 in the fully closed position, the control device 200 controls the aperture of the flow rate adjustment valve 74 based on the suction force defined in the machining conditions. Specifically, the control device 200 sets the open door 71 to the fully open position. This causes air inside the suction table 81 to be drawn into the dust collector 90. The control device 200 then references a program file and reads the aperture of the flow rate adjustment valve 74 that will result in the suction force defined in the machining conditions. The control device 200 controls the flow rate adjustment valve 74 to the aperture read from the program file. In this way, the control device 200 can control the workpiece suction force to the suction force defined in the machining conditions by controlling the aperture of the flow rate adjustment valve 74.

[0052] Next, a method for controlling the workpiece suction force by adjusting the flow rate of air drawn into the dust collector 90 will be described. With the open / close door 71 open, the flow rate adjustment valve 74 in the fully closed position, and the adjustment window in the fully closed position, the control device 200 controls the flow rate of air drawn into the dust collector 90 based on the suction force defined in the machining conditions. Specifically, the control device 200 sets the open / close door 71 to the fully open position and the flow rate adjustment valve 74 to the fully closed position. This causes air inside the suction table 81 to be drawn into the dust collector 90. The control device 200 then references a program file and reads the flow rate of air drawn into the dust collector 90 that will result in the suction force defined in the machining conditions. The control device 200 controls the dust collector 90 to the flow rate of air drawn into the dust collector 90 read from the program file. This allows the control device 200 to control the flow rate of air drawn into the dust collector 90 and control the workpiece suction force to the suction force defined in the machining conditions. One method for controlling the flow rate of air drawn into the dust collector 90 is to use an inverter to control the rotation speed of a motor that drives a fan.

[0053] Once control of the workpiece suction force is initiated in this manner, the control device 200 performs feedback control of the workpiece suction force based on the pressure acquired from the pressure gauge 91 and the suction force defined in the machining conditions. Specifically, the correlation between the pressure indicated by the pressure gauge and the workpiece suction force is recorded in the program file. The control device 200 detects a deviation between the suction force defined in the machining conditions and the workpiece suction force based on the correlation. Then, when the control device 200 detects a deviation between the suction force defined in the machining conditions and the workpiece suction force, it performs feedback control of the workpiece suction force so that it becomes the suction force defined in the machining conditions.

[0054] As described above, the laser processing machine can automatically set the workpiece suction force to an appropriate value regardless of the skill of the operator, eliminating the need for setup work to adjust the workpiece suction force.

[0055] In this embodiment, a method of individually controlling the opening degree of the adjustment window 87, the opening degree of the flow rate adjustment valve 74, or the flow rate of air drawn in by the dust collector 90 has been exemplified, but it is also possible to combine all of these controls, or to combine two or more controls, to control the workpiece suction force.

[0056] Furthermore, in this embodiment, the control device 200 performs feedback control of the workpiece suction force. This allows for more accurate control of the workpiece suction force. As cutting of the workpiece W progresses, the contact area between the product cut out from the workpiece W and the processing table 80 changes, causing the workpiece suction force to change. By feedback-controlling the workpiece suction force, the control device 200 can respond to changes in the workpiece suction force and stabilize the workpiece suction force.

[0057] In the above-described embodiment, a method in which the control device 200 automatically adjusts the workpiece suction force has been described. However, the workpiece suction force may also be adjusted manually by an operator. A manual method will be described below. When machining a thin workpiece, setup work is required before machining. Specifically, the operator must install the machining table 80 and suction table 81 and set up the suction duct 85. If the suction force is specified in the machining conditions, the control device 200 displays on the display of the operation unit 205 the opening degree of the adjustment window 87, the opening degree of the flow control valve 74, and the flow rate of air drawn in by the dust collector 90, which will result in the suction force specified in the machining conditions, before the setup work begins. In addition to these indications, the control device 200 also displays on the display that the opening / closing door 71 should be fully opened. This allows the operator to adjust the opening degree of the adjustment window 87, the opening degree of the flow rate adjustment valve 74, or the flow rate of air drawn in by the dust collector 90 so that the opening degree of the adjustment window 87, the opening degree of the flow rate adjustment valve 74, or the flow rate of air drawn in by the dust collector 90 is displayed on the display, making it possible to set an appropriate workpiece suction force. Furthermore, because the operator can adjust the workpiece suction force during setup work, there is no need for work just to adjust the workpiece suction force, and the time required for setup work can be reduced. Furthermore, because the operator can adjust the workpiece suction force using either the adjustment window 87, the flow rate adjustment valve 74, or the dust collector 90, the operator can flexibly set the workpiece suction force to suit the convenience of the setup work.

[0058] The adjustment window 87 may be configured so that a gap is created in the opening 86 when the opening 86 is at its closest position within its movable range. The gap that is created in the opening 86 is, for example, 6 mm when the adjustment window 87 slides. That is, the adjustment window 87 is configured so that the opening 86 is not fully closed. This prevents the laser processing machine from sounding an alarm that indicates an abnormality in the dust collector 90, i.e., a decrease in the flow rate of air drawn into the dust collector 90. The adjustment window 87 may be configured so that the opening 86 can be fully closed, and an intake port that connects the inside and outside of the suction table 81 or the second duct portion 85b of the suction duct 85 to draw in air may be installed. This prevents the alarm that indicates a decrease in the flow rate of air drawn into the dust collector 90 from sounding.

[0059] Although the embodiments of the present invention have been described above, the descriptions and drawings that form part of this disclosure should not be understood to limit the present invention. Various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art from this disclosure.

[0060] In the present embodiment, an example has been shown in which the flow rate of air flowing through the dust collection duct 61 is adjusted using the flow rate adjustment valve 74, but the method of adjusting the flow rate of air flowing through the dust collection duct 61 is not limited to this. For example, a flow rate adjustment shutter may be provided instead of the flow rate adjustment valve 74, and the flow rate of air flowing through the dust collection duct 61 may be adjusted by moving the flow rate adjustment shutter up and down.

[0061] In this embodiment, the optimal suction force when machining the workpiece W on the machining table 80 is determined by the programming device 300, but the device that determines the suction force of the workpiece W is not limited to the programming device 300. For example, the control device 200 may determine the optimal suction force when machining the workpiece W on the machining table 80 based on the material and thickness of the workpiece W input from the operation unit 205, and the shape of the product to be cut out from the workpiece W.

[0062] Alternatively, the dust collector 90 and the suction table 81 may be directly connected by the suction duct 85 without branching the suction duct 85 from the dust collection duct 61. In this case, an air release window may be provided in a separate location to adjust the suction force. [Explanation of symbols]

[0063] 10 Laser processing unit 11 Main body 12 Side frame 15 Head drive mechanism 16 X-axis carriage 17 Y-axis carriage 30 Processing head 50 pallets 51 Frame 51a Partition 52 Skid 53 Communication part 60 Dust collection chamber 61 Dust collection duct 70 Switching Device 71 Opening and closing doors 72 Collision plate 73 Tray 74 Flow control valve 75 Collecting duct 80 Processing table 81 Suction Table 83 Connection joint 85 Suction duct 85a First duct section 85b Second duct section 86 Opening 87 Adjustment window 90 Dust collector 91 Pressure gauge 110 Laser Oscillator 200 control device 205 Operation section 300 Programming Device double work

Claims

1. a laser processing unit that processes a workpiece using a laser beam; a control device that controls the laser processing unit in accordance with processing conditions for processing the workpiece, The laser processing unit includes: a loading section on which the work is placed, the loading section including a plurality of skids that are work support members that support the work; a dust collection chamber that is provided to surround a space below the mounting portion and that collects dust generated by laser processing; a dust collection duct connected to the dust collection chamber and configured to suck air from the dust collection chamber by the airflow drawn in by the dust collection device; a processing table formed to be smaller in size than the mounting section, the processing table being arranged in a predetermined section secured by removing one or more skids of the mounting section, and on which the work is placed; a suction table used when installing the processing table, the suction table being detachable from the placement unit and provided to surround a space below the processing table; a suction duct connected to the suction table, which sucks air from within the suction table by the flow of air drawn in by the dust collecting device; a switching device connected to the dust collection duct and the suction duct, and switching the flow of air drawn by the dust collector between the dust collection duct and the suction duct, The control device A workpiece suction force for sucking the workpiece placed on the processing table is controlled based on the suction force defined in the processing conditions. Laser processing machine.

2. The switching device an opening / closing door for opening and closing the suction duct; a flow rate adjusting valve that adjusts the flow rate of air flowing through the dust collection duct, The control device adjusts the opening degree of the flow rate adjustment valve based on the suction force defined in the processing conditions while the opening / closing door is open, and controls the workpiece suction force.

2. The laser processing machine according to claim 1.

3. the suction table has an adjustment window for adjusting the opening of an opening that connects the inside and outside of the suction table and takes in air, The control device adjusts the adjustment window based on the suction force defined in the processing conditions, and controls the workpiece suction force.

3. The laser processing machine according to claim 1 or 2.

4. When the adjustment window is set to a position where the opening is most closed within the movable range of the adjustment window, a gap is generated at the opening.

4. The laser processing machine according to claim 3.

5. The control device adjusts the flow rate of air drawn in by the dust collector based on the suction force defined in the processing conditions, thereby controlling the workpiece suction force. The laser processing machine according to any one of claims 1 to 4.

6. the laser processing unit further includes a pressure gauge that measures a pressure in the suction table or the suction duct; The control device feedback controls the workpiece suction force based on the pressure acquired from the pressure gauge and the suction force defined in the processing conditions. The laser processing machine according to any one of claims 1 to 5.

7. The suction force determined in the processing conditions varies depending on the material and thickness of the workpiece and the shape of the product cut out from the workpiece. The laser processing machine according to any one of claims 1 to 6.

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